LM117HVGWRLQMLV [TI]
耐辐射 QMLV、4.2V 至 60V 输入、500mA 可调输出线性稳压器 | NAC | 16 | -55 to 125;
| 型号： | LM117HVGWRLQMLV |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 耐辐射 QMLV、4.2V 至 60V 输入、500mA 可调输出线性稳压器 | NAC | 16 | -55 to 125 CD 输出元件 稳压器 调节器 |
| 文件： | 总38页 (文件大小：3851K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM117, LM317-N
www.ti.com
SNVS774L –MAY 2004–REVISED FEBRUARY 2011
LM117/LM317A/LM317-N 3-Terminal Adjustable Regulator
Check for Samples: LM117, LM317-N
Normally, no capacitors are needed unless the device
1
FEATURES
is situated more than 6 inches from the input filter
capacitors in which case an input bypass is needed.
An optional output capacitor can be added to improve
transient response. The adjustment terminal can be
bypassed to achieve very high ripple rejection ratios
which are difficult to achieve with standard 3-terminal
regulators.
2
•
Specified 1% Output Voltage Tolerance
(LM317A)
•
Specified Max. 0.01%/V Line Regulation
(LM317A)
•
•
•
•
•
•
•
Specified Max. 0.3% Load Regulation (LM117)
Specified 1.5A Output Current
Besides replacing fixed regulators, the LM117 is
useful in a wide variety of other applications. Since
the regulator is “floating” and sees only the input-to-
output differential voltage, supplies of several
hundred volts can be regulated as long as the
maximum input to output differential is not exceeded,
i.e., avoid short-circuiting the output.
Adjustable Output Down to 1.2V
Current Limit Constant With Temperature
P+ Product Enhancement Tested
80 dB Ripple Rejection
Output is Short-Circuit Protected
Also, it makes an especially simple adjustable
switching regulator, a programmable output regulator,
or by connecting a fixed resistor between the
adjustment pin and output, the LM117 can be used
DESCRIPTION
The LM117 series of adjustable 3-terminal positive
voltage regulators is capable of supplying in excess
of 1.5A over a 1.2V to 37V output range. They are
exceptionally easy to use and require only two
external resistors to set the output voltage. Further,
both line and load regulation are better than standard
fixed regulators. Also, the LM117 is packaged in
standard transistor packages which are easily
mounted and handled.
as
a precision current regulator. Supplies with
electronic shutdown can be achieved by clamping the
adjustment terminal to ground which programs the
output to 1.2V where most loads draw little current.
For applications requiring greater output current, see
LM150 series (3A) and LM138 series (5A) data
sheets. For the negative complement, see LM137
series data sheet.
In addition to higher performance than fixed
regulators, the LM117 series offers full overload
protection available only in IC's. Included on the chip
are current limit, thermal overload protection and safe
area protection. All overload protection circuitry
remains fully functional even if the adjustment
terminal is disconnected.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2011, Texas Instruments Incorporated
LM117, LM317-N
SNVS774L –MAY 2004–REVISED FEBRUARY 2011
www.ti.com
Typical Applications
Figure 1. 1.2V–25V Adjustable Regulator
LM117/LM317A/LM317-N Package Options
Output
Current
Part Number
Suffix
Package
LM117, LM317-N
LM317A, LM317-N
LM317-N
NDS
NDE
KTT
DCY
NDT
NAJ
NDP
TO-3
TO-220
TO-263
SOT-223
TO
1.5A
1.5A
1.5A
1.0A
0.5A
0.5A
0.5A
LM317A, LM317-N
LM117, LM317A, LM317-N
LM117
LCCC
PFM
LM317A, LM317-N
Full output current not available at high
input-output voltages
SOT-223 vs. PFM Packages
*Needed if device is more than 6 inches
from filter capacitors.
†Optional—improves transient response.
Output capacitors in the range of 1μF to
1000μF of aluminum or tantalum
electrolytic are commonly used to provide
improved output impedance and rejection
of transients.
Figure 2. Scale 1:1
Connection Diagrams
TO-3 (NDS)
Metal Can Package
Figure 5. TO-263 (KTT)
Surface-Mount Package
Figure 6. Top View
CASE IS OUTPUT
Figure 3. Bottom View
Bottom View
Package Number NDS or K
TO-263 (KTT)
Surface-Mount Package
TO (NDT)
Metal Can Package
Figure 7. Side View
Package Number KTT
CASE IS OUTPUT
Figure 4. Bottom View
Package Number NDT
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
TO-220 (NDE)
Plastic Package
4-Lead SOT-223 (DCY)
Figure 10. Front View
Package Number DCY
PFM (NDP)
Figure 8. Front View
Package Number NDE
Figure 11. Front View
Package Number NDP
Ceramic Leadless Chip Carrier (NAJ)
Figure 9. Top View
Package Number NAJ
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Power Dissipation
Internally Limited
+40V, −0.3V
−65°C to +150°C
300°C
Input-Output Voltage Differential
Storage Temperature
Lead Temperature
Metal Package (Soldering, 10 seconds)
Plastic Package (Soldering, 4 seconds)
260°C
(3)
ESD Tolerance
3 kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Operating Temperature Range
LM117
−55°C ≤ TJ ≤ +150°C
−40°C ≤ TJ ≤ +125°C
0°C ≤ TJ ≤ +125°C
LM317A
LM317-N
Preconditioning
Thermal Limit Burn-In
All Devices 100%
LM117 Electrical Characteristics(1)
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.
(2)
LM117
Parameter
Reference Voltage
Conditions
Min
Typ
Max
1.30
Units
3V ≤ (VIN − VOUT) ≤ 40V,
1.20
1.25
V
(1)
10 mA ≤ IOUT ≤ IMAX
0.01
0.02
0.02
0.05
(3)
Line Regulation
Load Regulation
3V ≤ (VIN − VOUT) ≤ 40V
%/V
%
0.1
0.3
0.3
1
(1) (3)
10 mA ≤ IOUT ≤ IMAX
Thermal Regulation
20 ms Pulse
0.03
0.07
%/W
Adjustment Pin Current
50
100
μA
(1)
10 mA ≤ IOUT ≤ IMAX
Adjustment Pin Current Change
0.2
5
μA
3V ≤ (VIN − VOUT) ≤ 40V
Temperature Stability
Minimum Load Current
T
MIN ≤ TJ ≤ TMAX
1
3.5
%
(VIN − VOUT) = 40V
5
mA
NDS Package
1.5
0.5
2.2
3.4
1.8
(VIN − VOUT) ≤ 15V
A
NDT, NAJ Package
NDS Package
0.8
Current Limit
0.3
0.4
(VIN − VOUT) = 40V
10 Hz ≤ f ≤ 10 kHz
A
NDT, NAJ Package
0.15
0.20
0.003
RMS Output Noise, % of VOUT
%
(1) IMAX = 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0A for the DCY (SOT-223) package. IMAX = 0.5A
for the NDT (TO), MDT (PFM), and NAJ (LCCC) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device
maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any
temperature is : PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
(2) Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.
(3) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
LM117 Electrical Characteristics(1) (continued)
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.
(2)
LM117
Parameter
Conditions
Min
66
Typ
65
80
0.3
2
Max
Units
dB
VOUT = 10V, f = 120 Hz, CADJ = 0 μF
VOUT = 10V, f = 120 Hz, CADJ = 10 μF
TJ = 125°C, 1000 hrs
Ripple Rejection Ratio
Long-Term Stability
dB
1
%
NDS (TO-3) Package
Thermal Resistance, θJC
Junction-to-Case
NDT (TO) Package
21
12
39
186
88
°C/W
°C/W
NAJ (LCCC) Package
NDS (TO-3) Package
Thermal Resistance, θJA
Junction-to-Ambient
(No Heat Sink)
NDT (TO) Package
NAJ (LCCC) Package
LM317A and LM317-N Electrical Characteristics(1)
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.
LM317A
Typ
LM317-N
Typ
Parameter
Conditions
Min
Max
Min
Max
Units
1.238 1.250 1.262
-
1.25
-
V
Reference Voltage
3V ≤ (VIN − VOUT) ≤ 40V,
10 mA ≤ IOUT ≤ IMAX
1.225 1.250 1.270 1.20
1.25
1.30
V
%/V
%
(1)
0.005 0.01
0.01
0.02
0.04
0.07
(2)
Line Regulation
Load Regulation
3V ≤ (VIN − VOUT) ≤ 40V
0.01
0.02
0.1
0.5
0.1
0.3
0.5
1.5
(1) (2)
10 mA ≤ IOUT ≤ IMAX
0.3
1
Thermal Regulation
20 ms Pulse
0.04
0.07
0.04
0.07
%/W
Adjustment Pin Current
50
100
50
100
μA
(1)
Adjustment Pin Current
Change
10 mA ≤ IOUT ≤ IMAX
0.2
5
0.2
5
μA
3V ≤ (VIN − VOUT) ≤ 40V
Temperature Stability
Minimum Load Current
T
MIN ≤ TJ ≤ TMAX
1
3.5
-
1
%
(VIN − VOUT) = 40V
10
-
3.5
2.2
2.2
0.8
0.40
10
3.4
3.4
1.8
mA
NDS, KTT Packages
DCY, NDE Packages
NDT, MDT Packages
NDS, KTT Packages
DCY, NDE Packages
NDT, MDT Packages
-
1.5
1.5
(VIN − VOUT) ≤ 15V
1.5
0.5
-
2.2
0.8
-
3.4
1.8
A
0.5
Current Limit
0.15
(VIN − VOUT) = 40V
10 Hz ≤ f ≤ 10 kHz
0.112 0.30
0.075 0.20
0.112 0.30
0.075 0.20
A
RMS Output Noise, % of
VOUT
0.003
0.003
%
VOUT = 10V, f = 120 Hz, CADJ = 0 μF
VOUT = 10V, f = 120 Hz, CADJ = 10 μF
TJ = 125°C, 1000 hrs
65
65
dB
dB
%
Ripple Rejection Ratio
Long-Term Stability
66
80
66
80
0.3
1
0.3
1
(1) IMAX = 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0A for the DCY (SOT-223) package. IMAX = 0.5A
for the NDT (TO), MDT (PFM), and NAJ (LCCC) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device
maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any
temperature is : PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
(2) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
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LM317A and LM317-N Electrical Characteristics(1) (continued)
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.
LM317A
LM317-N
Typ
2
Parameter
Conditions
Min
Typ
-
Max
Min
Max
Units
NDS (TO-3) Package
NDE (TO-220) Package
KTT (TO-263) Package
DCY (SOT-223) Package
NDT (TO) Package
4
4
-
4
Thermal Resistance, θJC
Junction-to-Case
°C/W
23.5
21
12
-
23.5
21
MDT (PFM) Package
NDS (TO-3) Package
NDE (TO-220) Package
12
39
50
-
50
(3)
Thermal Resistance, θJA
Junction-to-Ambient (No
Heat Sink)
KTT (TO-263) Package
DCY (SOT-223) Package
NDT (TO) Package
50
°C/W
(3)
140
186
103
140
186
103
(3)
MDT (PFM) Package
(3) When surface mount packages are used (TO-263, SOT-223, PFM), the junction to ambient thermal resistance can be reduced by
increasing the PC board copper area that is thermally connected to the package. See the Applications Hints section for heatsink
techniques.
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
Typical Performance Characteristics
Output Capacitor = 0 μF unless otherwise noted
Load Regulation
Current Limit
Figure 12.
Figure 13.
Adjustment Current
Dropout Voltage
Figure 14.
Figure 15.
VOUT vs VIN, VOUT = VREF
VOUT vs VIN, VOUT = 5V
Figure 16.
Figure 17.
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Typical Performance Characteristics (continued)
Output Capacitor = 0 μF unless otherwise noted
Temperature Stability
Minimum Operating Current
Figure 18.
Figure 19.
Ripple Rejection
Ripple Rejection
Figure 20.
Figure 21.
Ripple Rejection
Output Impedance
Figure 22.
Figure 23.
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
Typical Performance Characteristics (continued)
Output Capacitor = 0 μF unless otherwise noted
Line Transient Response
Load Transient Response
Figure 24.
Figure 25.
APPLICATION HINTS
In operation, the LM117 develops a nominal 1.25V reference voltage, VREF, between the output and adjustment
terminal. The reference voltage is impressed across program resistor R1 and, since the voltage is constant, a
constant current I1 then flows through the output set resistor R2, giving an output voltage of
(1)
Since the 100μA current from the adjustment terminal represents an error term, the LM117 was designed to
minimize IADJ and make it very constant with line and load changes. To do this, all quiescent operating current is
returned to the output establishing a minimum load current requirement. If there is insufficient load on the output,
the output will rise.
External Capacitors
An input bypass capacitor is recommended. A 0.1μF disc or 1μF solid tantalum on the input is suitable input
bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when
adjustment or output capacitors are used but the above values will eliminate the possibility of problems.
The adjustment terminal can be bypassed to ground on the LM117 to improve ripple rejection. This bypass
capacitor prevents ripple from being amplified as the output voltage is increased. With a 10 μF bypass capacitor
80dB ripple rejection is obtainable at any output level. Increases over 10 μF do not appreciably improve the
ripple rejection at frequencies above 120Hz. If the bypass capacitor is used, it is sometimes necessary to include
protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the
device.
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In general, the best type of capacitors to use is solid tantalum. Solid tantalum capacitors have low impedance
even at high frequencies. Depending upon capacitor construction, it takes about 25 μF in aluminum electrolytic to
equal 1μF solid tantalum at high frequencies. Ceramic capacitors are also good at high frequencies; but some
types have a large decrease in capacitance at frequencies around 0.5 MHz. For this reason, 0.01 μF disc may
seem to work better than a 0.1 μF disc as a bypass.
Although the LM117 is stable with no output capacitors, like any feedback circuit, certain values of external
capacitance can cause excessive ringing. This occurs with values between 500 pF and 5000 pF. A 1 μF solid
tantalum (or 25 μF aluminum electrolytic) on the output swamps this effect and insures stability. Any increase of
the load capacitance larger than 10 μF will merely improve the loop stability and output impedance.
Load Regulation
The LM117 is capable of providing extremely good load regulation but a few precautions are needed to obtain
maximum performance. The current set resistor connected between the adjustment terminal and the output
terminal (usually 240Ω) should be tied directly to the output (case) of the regulator rather than near the load. This
eliminates line drops from appearing effectively in series with the reference and degrading regulation. For
example, a 15V regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to
line resistance of 0.05Ω × IL. If the set resistor is connected near the load the effective line resistance will be
0.05Ω (1 + R2/R1) or in this case, 11.5 times worse.
Figure 26 shows the effect of resistance between the regulator and 240Ω set resistor.
Figure 26. Regulator with Line Resistance in Output Lead
With the TO-3 package, it is easy to minimize the resistance from the case to the set resistor, by using two
separate leads to the case. However, with the TO package, care should be taken to minimize the wire length of
the output lead. The ground of R2 can be returned near the ground of the load to provide remote ground sensing
and improve load regulation.
Protection Diodes
When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to
prevent the capacitors from discharging through low current points into the regulator. Most 10 μF capacitors have
low enough internal series resistance to deliver 20A spikes when shorted. Although the surge is short, there is
enough energy to damage parts of the IC.
When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge
into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage
of the regulator, and the rate of decrease of VIN. In the LM117, this discharge path is through a large junction that
is able to sustain 15A surge with no problem. This is not true of other types of positive regulators. For output
capacitors of 25 μF or less, there is no need to use diodes.
The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs
when either the input, or the output, is shorted. Internal to the LM117 is a 50Ω resistor which limits the peak
discharge current. No protection is needed for output voltages of 25V or less and 10 μF capacitance. Figure 27
shows an LM117 with protection diodes included for use with outputs greater than 25V and high values of output
capacitance.
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D1 protects against C1
D2 protects against C2
Figure 27. Regulator with Protection Diodes
Heatsink Requirements
The LM317-N regulators have internal thermal shutdown to protect the device from over-heating. Under all
operating conditions, the junction temperature of the LM317-N should not exceed the rated maximum junction
temperature (TJ) of 150°C for the LM117, or 125°C for the LM317A and LM317-N. A heatsink may be required
depending on the maximum device power dissipation and the maximum ambient temperature of the application.
To determine if a heatsink is needed, the power dissipated by the regulator, PD, must be calculated:
PD = ((VIN − VOUT) × IL) + (VIN × IG)
(2)
Figure 28 shows the voltage and currents which are present in the circuit.
The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX)
:
TR(MAX) = TJ(MAX) − TA(MAX)
(3)
where TJ(MAX) is the maximum allowable junction temperature (150°C for the LM117, or 125°C for the
LM317A/LM317-N), and TA(MAX) is the maximum ambient temperature which will be encountered in the
application.
Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal
resistance (θJA) can be calculated:
θJA = (TR(MAX) / PD)
(4)
Figure 28. Power Dissipation Diagram
If the calculated maximum allowable thermal resistance is higher than the actual package rating, then no
additional work is needed. If the calculated maximum allowable thermal resistance is lower than the actual
package rating either the power dissipation (PD) needs to be reduced, the maximum ambient temperature TA(MAX)
needs to be reduced, the thermal resistance (θJA) must be lowered by adding a heatsink, or some combination of
these.
If a heatsink is needed, the value can be calculated from the formula:
θHA ≤ (θJA - (θCH + θJC))
(5)
11
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where (θCH is the thermal resistance of the contact area between the device case and the heatsink surface, and
θJC is thermal resistance from the junction of the die to surface of the package case.
When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is
less than, or equal to, this number.
The θ(H−A) rating is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that
plots temperature rise vs power dissipation for the heatsink.
Heatsinking Surface Mount Packages
The TO-263 (KTT), SOT-223 (DCY) and PFM (MDT) packages use a copper plane on the PCB and the PCB
itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to
the plane.
Heatsinking the SOT-223 Package
Figure 29 and Figure 30 show the information for the SOT-223 package. Figure 30 assumes a θ(J−A) of 74°C/W
for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C. Please see
AN-1028 (literature number SNVA036) for thermal enhancement techniques to be used with SOT-223 and PFM
packages.
Figure 29. θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package
Figure 30. Maximum Power Dissipation vs TAMB for the SOT-223 Package
Heatsinking the TO-263 Package
Figure 31 shows for the TO-263 the measured values of θ(J−A) for different copper area sizes using a typical PCB
with 1 ounce copper and no solder mask over the copper area used for heatsinking.
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As shown in Figure 31, increasing the copper area beyond 1 square inch produces very little improvement. It
should also be observed that the minimum value of θ(J−A) for the TO-263 package mounted to a PCB is 32°C/W.
Figure 31. θ(J−A) vs Copper (1 ounce) Area for the TO-263 Package
As a design aid, Figure 32 shows the maximum allowable power dissipation compared to ambient temperature
for the TO-263 device (assuming θ(J−A) is 35°C/W and the maximum junction temperature is 125°C).
Figure 32. Maximum Power Dissipation vs TAMB for the TO-263 Package
Heatsinking the PFM Package
If the maximum allowable value for θJA is found to be ≥103°C/W (Typical Rated Value) for PFM package, no
heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the
calculated value for θJA falls below these limits, a heatsink is required.
As a design aid, Table 1 shows the value of the θJA of PFM for different heatsink area. The copper patterns that
we used to measure these θJAs are shown in Figure 37. Figure 33 reflects the same test results as what are in
Table 1.
Figure 34 shows the maximum allowable power dissipation vs. ambient temperature for the PFM device.
Figure 35 shows the maximum allowable power dissipation vs. copper area (in2) for the PFM device. Please see
AN-1028 (literature number SNVA036) for thermal enhancement techniques to be used with SOT-223 and PFM
packages.
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
www.ti.com
Table 1. θJA Different Heatsink Area
Layout
Copper Area
Thermal Resistance
Top Side (in2)(1)
0.0123
Bottom Side (in2)
(θJA°C/W) PFM
1
2
0
0
103
87
60
54
52
47
84
70
63
57
57
89
72
61
55
53
0.066
0.3
3
0
4
0.53
0
5
0.76
0
6
1.0
0
7
0.066
0.066
0.066
0.066
0.066
0.066
0.175
0.284
0.392
0.5
0.2
0.4
0.6
0.8
1.0
0.066
0.175
0.284
0.392
0.5
8
9
10
11
12
13
14
15
16
(1) Tab of device attached to topside of copper.
Figure 33. θJA vs 2oz Copper Area for PFM
Figure 34. Maximum Allowable Power Dissipation vs. Ambient Temperature for PFM
14
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LM117, LM317-N
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
Figure 35. Maximum Allowable Power Dissipation vs. 2oz Copper Area for PFM
Figure 36. Top View of the Thermal Test Pattern in Actual Scale
Copyright © 2004–2011, Texas Instruments Incorporated
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Figure 37. Bottom View of the Thermal Test Pattern in Actual Scale
Schematic Diagram
16
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Product Folder Links: LM117 LM317-N
LM117, LM317-N
www.ti.com
SNVS774L –MAY 2004–REVISED FEBRUARY 2011
Typical Applications
Note: Min.
output
≊
1.2V
Figure 38. 5V Logic Regulator with Electronic Shutdown
Figure 39. Slow Turn-On 15V Regulator
Figure 40.
†Solid tantalum
*Discharges C1 if output is shorted to ground
Figure 41. Adjustable Regulator with Improved Ripple Rejection
Copyright © 2004–2011, Texas Instruments Incorporated
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Figure 42. High Stability 10V Regulator
‡Optional—improves ripple rejection
†Solid tantalum
*Minimum load current = 30 mA
Figure 43. High Current Adjustable Regulator
18
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LM117, LM317-N
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
Full output current not available at high input-output voltages
Figure 44. 0 to 30V Regulator
Figure 45. Power Follower
Copyright © 2004–2011, Texas Instruments Incorporated
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
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†Solid tantalum
*Lights in constant current mode
Figure 46. 5A Constant Voltage/Constant Current Regulator
Figure 47. 1A Current Regulator
*Minimum load current ≊ 4 mA
Figure 48. 1.2V–20V Regulator with Minimum Program Current
20
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LM117, LM317-N
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
Figure 49. High Gain Amplifier
†Solid tantalum
*Core—Arnold A-254168-2 60 turns
Figure 50. Low Cost 3A Switching Regulator
Copyright © 2004–2011, Texas Instruments Incorporated
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†Solid tantalum
*Core—Arnold A-254168-2 60 turns
Figure 51. 4A Switching Regulator with Overload Protection
Figure 52. Precision Current Limiter
Figure 53. Tracking Preregulator
22
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LM117, LM317-N
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
(Compared to LM117's higher current limit)
—At 50 mA output only ¾ volt of drop occurs in R3 and R4
Figure 54. Current Limited Voltage Regulator
Note: All outputs within ±100 mV
†Minimum load—10 mA
Figure 55. Adjusting Multiple On-Card Regulators with Single Control
Figure 56. AC Voltage Regulator
Copyright © 2004–2011, Texas Instruments Incorporated
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
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Use of RS allows low charging rates with fully charged battery.
Figure 57. 12V Battery Charger
Figure 58.
Figure 59. 50mA Constant Current Battery Charger
Figure 60. Adjustable 4A Regulator
24
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SNVS774L –MAY 2004–REVISED FEBRUARY 2011
*Sets peak current (0.6A for 1Ω)
**The 1000μF is recommended to filter out input transients
Figure 61. Current Limited 6V Charger
*Sets maximum VOUT
Figure 62. Digitally Selected Outputs
Copyright © 2004–2011, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2013
PACKAGING INFORMATION
Orderable Device
LM117H
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
TO
TO
NDT
3
3
2
2
2
500
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Call TI
LM117HP+
LM117H/NOPB
LM117K
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NDT
NDS
NDS
NDS
500
50
Green (RoHS POST-PLATE
& no Sb/Br)
LM117HP+
TO-3
TO-3
TO-3
TBD
Call TI
LM117K
STEELP+
LM117K STEEL
LM117K STEEL/NOPB
50
TBD
Call TI
Call TI
LM117K
STEELP+
50
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
LM117K
STEELP+
LM317AEMP
ACTIVE
ACTIVE
SOT-223
SOT-223
DCY
DCY
4
4
1000
1000
TBD
Call TI
Call TI
-40 to 125
-40 to 125
N07A
LM317AEMP/NOPB
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
N07A
LM317AEMPX
ACTIVE
ACTIVE
SOT-223
SOT-223
DCY
DCY
4
4
2000
2000
TBD
Call TI
CU SN
Call TI
N07A
N07A
LM317AEMPX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
LM317AH
LM317AH/NOPB
LM317AMDT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TO
NDT
NDT
NDP
NDP
NDP
NDP
3
3
3
3
3
3
500
500
75
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Call TI
LM317AHP+
LM317AHP+
TO
Green (RoHS POST-PLATE
& no Sb/Br)
TO-252
TO-252
TO-252
TO-252
TBD
Call TI
CU SN
Call TI
CU SN
LM317
AMDT
LM317AMDT/NOPB
LM317AMDTX
75
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Call TI
LM317
AMDT
2500
2500
TBD
LM317
AMDT
LM317AMDTX/NOPB
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
LM317
AMDT
LM317AT
ACTIVE
ACTIVE
TO-220
TO-220
NDE
NDE
3
3
45
45
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
LM317AT P+
LM317AT/NOPB
Pb-Free (RoHS
Exempt)
Level-1-NA-UNLIM
LM317AT P+
LM317EMP
ACTIVE
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
0 to 125
N01A
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
LM317EMP/NOPB
LM317EMPX/NOPB
LM317H
ACTIVE
SOT-223
SOT-223
TO
DCY
4
4
3
3
2
2
3
3
3
3
1000
Green (RoHS
& no Sb/Br)
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Call TI
N01A
N01A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DCY
NDT
NDT
NDS
NDS
NDP
NDP
KTT
KTT
2000
500
500
50
Green (RoHS
& no Sb/Br)
Green (RoHS POST-PLATE
& no Sb/Br)
LM317HP+
LM317HP+
LM317H/NOPB
TO
Green (RoHS POST-PLATE
& no Sb/Br)
LM317K STEEL
LM317K STEEL/NOPB
LM317MDT/NOPB
LM317MDTX/NOPB
LM317S/NOPB
TO-3
TBD
Call TI
LM317K
STEELP+
TO-3
50
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-3-245C-168 HR
Level-3-245C-168 HR
LM317K
STEELP+
TO-252
TO-252
75
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
LM317
MDT
2500
45
Green (RoHS
& no Sb/Br)
LM317
MDT
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
LM317S
P+
LM317SX/NOPB
DDPAK/
TO-263
500
Pb-Free (RoHS
Exempt)
LM317S
P+
LM317T
ACTIVE
ACTIVE
TO-220
NDE
NDG
3
3
45
45
TBD
Call TI
CU SN
Call TI
LM317T P+
LM317T/LF01
TO-220
Pb-Free (RoHS
Exempt)
Level-4-260C-72 HR
LM317T P+
LM317T/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 125
LM317T P+
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM317AEMP
LM317AEMP/NOPB
LM317AEMPX
SOT-223
SOT-223
SOT-223
DCY
DCY
DCY
DCY
NDP
NDP
DCY
DCY
DCY
NDP
KTT
4
4
4
4
3
3
4
4
4
3
3
1000
1000
2000
2000
2500
2500
1000
1000
2000
2500
500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
24.4
7.0
7.0
7.0
7.0
6.9
6.9
7.0
7.0
7.0
6.9
7.5
7.5
2.2
2.2
2.2
2.2
2.7
2.7
2.2
2.2
2.2
2.7
5.0
12.0
12.0
12.0
12.0
8.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
24.0
Q3
Q3
Q3
Q3
Q2
Q2
Q3
Q3
Q3
Q2
Q2
7.5
LM317AEMPX/NOPB SOT-223
7.5
LM317AMDTX
LM317AMDTX/NOPB
LM317EMP
TO-252
TO-252
10.5
10.5
7.5
8.0
SOT-223
SOT-223
SOT-223
TO-252
12.0
12.0
12.0
8.0
LM317EMP/NOPB
LM317EMPX/NOPB
LM317MDTX/NOPB
LM317SX/NOPB
7.5
7.5
10.5
DDPAK/
TO-263
10.75 14.85
16.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM317AEMP
LM317AEMP/NOPB
LM317AEMPX
SOT-223
SOT-223
SOT-223
SOT-223
TO-252
DCY
DCY
DCY
DCY
NDP
NDP
DCY
DCY
DCY
NDP
KTT
4
4
4
4
3
3
4
4
4
3
3
1000
1000
2000
2000
2500
2500
1000
1000
2000
2500
500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
38.0
35.0
35.0
35.0
38.0
45.0
LM317AEMPX/NOPB
LM317AMDTX
LM317AMDTX/NOPB
LM317EMP
TO-252
SOT-223
SOT-223
SOT-223
TO-252
LM317EMP/NOPB
LM317EMPX/NOPB
LM317MDTX/NOPB
LM317SX/NOPB
DDPAK/TO-263
Pack Materials-Page 2
MECHANICAL DATA
NDT0003A
H03A (Rev D)
www.ti.com
MECHANICAL DATA
NDS0002A
www.ti.com
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDG0003F
T03F (Rev B)
www.ti.com
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004)
M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
3
0,25 (0.010)
0,84 (0.033)
0,66 (0.026)
0°–10°
2,30 (0.091)
0,10 (0.004)
M
4,60 (0.181)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
1,80 (0.071) MAX
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
www.ti.com
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相关型号：
LM117HVGWRQMLV
IC VREG 1.2 V-57 V ADJUSTABLE POSITIVE REGULATOR, CDSO16, CERAMIC, SOIC-16, Adjustable Positive Single Output Standard Regulator
NSC
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