LM1117IMP-ADJ/NOPB [TI]
800mA Low-Dropout Linear Regulator; 800毫安低压差线性稳压器
| 型号： | LM1117IMP-ADJ/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 800mA Low-Dropout Linear Regulator |
| 文件： | 总30页 (文件大小：2507K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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LM1117/LM1117I 800mA Low-Dropout Linear Regulator
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1
FEATURES
APPLICATIONS
2
•
Available in 1.8V, 2.5V, 2.85V, 3.3V, 5V, and
Adjustable Versions
•
•
•
•
•
2.85V Model for SCSI-2 Active Termination
Post Regulator for Switching DC/DC Converter
High Efficiency Linear Regulators
Battery Charger
•
•
•
•
•
•
Space Saving SOT-223 and LLP Packages
Current Limiting and Thermal Protection
Output Current 800mA
Battery Powered Instrumentation
Line Regulation 0.2% (Max)
Load Regulation 0.4% (Max)
Temperature Range
–
–
LM1117: 0°C to 125°C
LM1117I: −40°C to 125°C
DESCRIPTION
The LM1117 is a series of low dropout voltage regulators with a dropout of 1.2V at 800mA of load current. It has
the same pin-out as National Semiconductor's industry standard LM317.
The LM1117 is available in an adjustable version, which can set the output voltage from 1.25V to 13.8V with only
two external resistors. In addition, it is also available in five fixed voltages, 1.8V, 2.5V, 2.85V, 3.3V, and 5V.
The LM1117 offers current limiting and thermal shutdown. Its circuit includes a zener trimmed bandgap reference
to assure output voltage accuracy to within ±1%.
The LM1117 series is available in LLP, TO-263, SOT-223, TO-220, and TO-252 D-PAK packages. A minimum of
10µF tantalum capacitor is required at the output to improve the transient response and stability.
TYPICAL APPLICATION
Active Terminator for SCSI-2 Bus
Figure 1. Fixed Output Regulator
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2012, Texas Instruments Incorporated
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Block Diagram
Connection Diagrams
Figure 2. SOT-223 Top View
Figure 3. TO-220 Top View
Figure 4. TO-252 Top View
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Figure 5. TO-263 Top View
Figure 6. Side View
ADJ/GND
NOT CONNECTED
1
8
V
2
3
4
7
6
5
V
IN
OUT
V
OUT
V
V
V
IN
IN
OUT
OUT
V
When using the LLP package
Pins 2, 3 & 4 must be connected together and
Pins 5, 6 & 7 must be connected together
Figure 7. LLP Top View
ABSOLUTE MAXIMUM RATINGS(1)
Maximum Input Voltage (VIN to GND)
Power Dissipation(2)
Junction Temperature (TJ)(2)
Storage Temperature Range
Lead Temperature
20V
Internally Limited
150°C
-65°C to 150°C
TO-220 (T) Package
260°C, 10 sec
260°C, 4 sec
2000V
SOT-223 (IMP) Package
ESD Tolerance(3)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board.
(3) For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
OPERATING RATINGS(1)
Input Voltage (VIN to GND)
Junction Temperature Range (TJ)(2)
LM1117
15V
0°C to 125°C
LM1117I
−40°C to 125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/θJA. All numbers apply for packages soldered directly into a PC board.
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LM1117 ELECTRICAL CHARACTERISTICS
Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire
junction temperature range for operation, 0°C to 125°C.
Symbol
Parameter
Conditions
Min(1)
Typ(2)
Max(1)
Units
VREF
Reference Voltage
LM1117-ADJ
IOUT = 10mA, VIN-VOUT = 2V, TJ = 25°C
10mA ≤ IOUT ≤ 800mA, 1.4V ≤ VIN-VOUT
10V
1.238
1.225
1.250
1.250
1.262
1.270
V
V
≤
VOUT
Output Voltage
LM1117-1.8
IOUT = 10mA, VIN = 3.8V, TJ = 25°C
0 ≤ IOUT ≤ 800mA, 3.2V ≤ VIN ≤ 10V
1.782
1.746
1.800
1.800
1.818
1.854
V
V
LM1117-2.5
IOUT = 10mA, VIN = 4.5V, TJ = 25°C
0 ≤ IOUT ≤ 800mA, 3.9V ≤ VIN ≤ 10V
2.475
2.450
2.500
2.500
2.525
2.550
V
V
LM1117-2.85
IOUT = 10mA, VIN = 4.85V, TJ = 25°C
0 ≤ IOUT ≤ 800mA, 4.25V ≤ VIN ≤ 10V
0 ≤ IOUT ≤ 500mA, VIN = 4.10V
2.820
2.790
2.790
2.850
2.850
2.850
2.880
2.910
2.910
V
V
V
LM1117-3.3
IOUT = 10mA, VIN = 5V TJ = 25°C
0 ≤ IOUT ≤ 800mA, 4.75V≤ VIN ≤ 10V
3.267
3.235
3.300
3.300
3.333
3.365
V
V
LM1117-5.0
IOUT = 10mA, VIN = 7V, TJ = 25°C
0 ≤ IOUT ≤ 800mA, 6.5V ≤ VIN ≤ 12V
4.950
4.900
5.000
5.000
5.050
5.100
V
V
ΔVOUT
Line Regulation(3)
LM1117-ADJ
IOUT = 10mA, 1.5V ≤ VIN-VOUT ≤ 13.75V
0.035
1
0.2
6
%
LM1117-1.8
mV
IOUT = 0mA, 3.2V ≤ VIN ≤ 10V
LM1117-2.5
1
6
mV
IOUT = 0mA, 3.9V ≤ VIN ≤ 10V
LM1117-2.85
IOUT = 0mA, 4.25V ≤ VIN ≤ 10V
1
1
1
6
6
mV
mV
mV
LM1117-3.3
IOUT = 0mA, 4.75V ≤ VIN ≤ 15V
LM1117-5.0
IOUT = 0mA, 6.5V ≤ VIN ≤ 15V
10
ΔVOUT
Load Regulation(3)
LM1117-ADJ
VIN-VOUT = 3V, 10 ≤ IOUT ≤ 800mA
0.2
1
0.4
10
%
LM1117-1.8
mV
VIN = 3.2V, 0 ≤ IOUT ≤ 800mA
LM1117-2.5
1
10
mV
VIN = 3.9V, 0 ≤ IOUT ≤ 800mA
LM1117-2.85
VIN = 4.25V, 0 ≤ IOUT ≤ 800mA
1
1
10
10
mV
mV
LM1117-3.3
VIN = 4.75V, 0 ≤ IOUT ≤ 800mA
LM1117-5.0
VIN = 6.5V, 0 ≤ IOUT ≤ 800mA
1
15
mV
V
VIN-V
Dropout Voltage(4)
Current Limit
IOUT = 100mA
1.10
1.15
1.20
1200
1.20
1.25
1.30
1500
OUT
IOUT = 500mA
V
IOUT = 800mA
V
ILIMIT
VIN-VOUT = 5V, TJ = 25°C
800
mA
Minimum Load
Current(5)
LM1117-ADJ
VIN = 15V
1.7
5
mA
(1) All limits are guaranteed by testing or statistical analysis.
(2) Typical Values represent the most likely parametric norm.
(3) Load and line regulation are measured at constant junction room temperature.
(4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is
measured when the output voltage has dropped 100mV from the nominal value obtained at VIN = VOUT +1.5V.
(5) The minimum output current required to maintain regulation.
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LM1117 ELECTRICAL CHARACTERISTICS (continued)
Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire
junction temperature range for operation, 0°C to 125°C.
Symbol
Parameter
Conditions
Min(1)
Typ(2)
Max(1)
10
Units
Quiescent Current
LM1117-1.8
IN ≤ 15V
5
mA
V
LM1117-2.5
IN ≤ 15V
5
10
mA
V
LM1117-2.85
IN ≤ 10V
V
5
5
10
10
mA
mA
LM1117-3.3
IN ≤ 15V
V
LM1117-5.0
IN ≤ 15V
V
5
10
mA
%/W
dB
Thermal Regulation
Ripple Regulation
TA = 25°C, 30ms Pulse
0.01
75
0.1
fRIPPLE =1 20Hz, VIN-VOUT = 3V VRIPPLE
1VPP
=
60
Adjust Pin Current
60
120
5
μA
Adjust Pin Current
Change
10 ≤ IOUT≤ 800mA,
1.4V ≤ VIN-VOUT ≤ 10V
0.2
0.5
0.3
0.003
15.0
3.0
10
μA
%
Temperature Stability
Long Term Stability
RMS Output Noise
TA = 125°C, 1000Hrs
(% of VOUT), 10Hz ≤ f ≤10kHz
3-Lead SOT-223
%
%
Thermal Resistance
Junction-to-Case
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
3-Lead TO-220
3-Lead TO-252
Thermal Resistance
Junction-to-Ambient
(No air flow)
3-Lead SOT-223 (No heat sink)
3-Lead TO-220 (No heat sink)
3-Lead TO-252(6) (No heat sink)
3-Lead TO-263
136
79
92
55
8-Lead LLP(7)
40
(6) Minimum pad size of 0.038in2
(7) Thermal Performance for the LLP was obtained using JESD51-7 board with six vias and an ambient temperature of 22°C. For
information about improved thermal performance and power dissipation for the LLP, refer to Application Note AN-1187.
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LM1117I ELECTRICAL CHARACTERISTICS
Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire
junction temperature range for operation, −40°C to 125°C.
Symbol
Parameter
Conditions
Min(1)
Typ(2)
Max(1)
Units
VREF
Reference Voltage
LM1117I-ADJ
IOUT = 10mA, VIN-VOUT = 2V, TJ = 25°C
10mA ≤ IOUT ≤ 800mA, 1.4V ≤ VIN-VOUT
10V
1.238
1.200
1.250
1.250
1.262
1.290
V
V
≤
VOUT
Output Voltage
LM1117I-3.3
IOUT = 10mA, VIN = 5V, TJ = 25°C
0 ≤ IOUT ≤ 800mA, 4.75V ≤ VIN ≤ 10V
3.267
3.168
3.300
3.300
3.333
3.432
V
V
LM1117I-5.0
IOUT = 10mA, VIN = 7V, TJ = 25°C
0 ≤ IOUT ≤ 800mA, 6.5V ≤ VIN ≤ 12V
4.950
4.800
5.000
5.000
5.050
5.200
V
V
ΔVOUT
Line Regulation(3)
LM1117I-ADJ
IOUT = 10mA, 1.5V ≤ VIN-VOUT ≤ 13.75V
0.035
0.3
10
15
0.5
15
%
mV
mV
%
LM1117I-3.3
IOUT = 0mA, 4.75V ≤ VIN ≤ 15V
1
1
LM1117I-5.0
IOUT = 0mA, 6.5V ≤ VIN ≤ 15V
ΔVOUT
Load Regulation(3)
LM1117I-ADJ
VIN-VOUT = 3V, 10 ≤ IOUT ≤ 800mA
0.2
1
LM1117I-3.3
VIN = 4.75V, 0 ≤ IOUT ≤ 800mA
mV
LM1117I-5.0
VIN = 6.5V, 0 ≤ IOUT ≤ 800mA
1
20
mV
V
VIN-V
Dropout Voltage(4)
Current Limit
IOUT = 100mA
1.10
1.15
1.20
1200
1.30
1.35
1.40
1500
OUT
IOUT = 500mA
V
IOUT = 800mA
V
ILIMIT
VIN-VOUT = 5V, TJ = 25°C
800
mA
Minimum Load
Current(5)
LM1117I-ADJ
VIN = 15V
1.7
5
5
mA
mA
Quiescent Current
LM1117I-3.3
V
IN ≤ 15V
LM1117I-5.0
IN ≤ 15V
15
V
5
15
mA
%/W
dB
Thermal Regulation
Ripple Regulation
TA = 25°C, 30ms Pulse
0.01
75
0.1
fRIPPLE =1 20Hz, VIN-VOUT = 3V VRIPPLE
1VPP
=
60
Adjust Pin Current
60
120
10
μA
Adjust Pin Current
Change
10 ≤ IOUT≤ 800mA,
1.4V ≤ VIN-VOUT ≤ 10V
0.2
0.5
μA
%
Temperature Stability
Long Term Stability
RMS Output Noise
TA = 125°C, 1000Hrs
(% of VOUT), 10Hz ≤ f ≤10kHz
3-Lead SOT-223
0.3
%
0.003
15.0
10
%
Thermal Resistance
Junction-to-Case
°C/W
°C/W
3-Lead TO-252
(1) All limits are guaranteed by testing or statistical analysis.
(2) Typical Values represent the most likely parametric norm.
(3) Load and line regulation are measured at constant junction room temperature.
(4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is
measured when the output voltage has dropped 100mV from the nominal value obtained at VIN = VOUT +1.5V.
(5) The minimum output current required to maintain regulation.
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LM1117I ELECTRICAL CHARACTERISTICS (continued)
Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire
junction temperature range for operation, −40°C to 125°C.
Symbol
Parameter
Conditions
3-Lead SOT-223 (No heat sink)
3-Lead TO-252 (No heat sink)(6)
8-Lead LLP(7)
Min(1)
Typ(2)
136
92
Max(1)
Units
°C/W
°C/W
°C/W
Thermal Resistance
Junction-to-Ambient
No air flow)
40
(6) Minimum pad size of 0.038in2
(7) Thermal Performance for the LLP was obtained using JESD51-7 board with six vias and an ambient temperature of 22°C. For
information about improved thermal performance and power dissipation for the LLP, refer to Application Note AN-1187.
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TYPICAL PERFORMANCE CHARACTERISTICS
Dropout Voltage (VIN-V
)
Short-Circuit Current
OUT
Load Regulation
LM1117-ADJ Ripple Rejection
LM1117-ADJ Ripple Rejection vs. Current
Temperature Stability
Adjust Pin Current
LM1117-2.85 Load Transient Response
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
LM1117-5.0 Load Transient Response
LM1117-2.85 Line Transient Response
LM1117-5.0 Line Transient Response
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APPLICATION INFORMATION
EXTERNAL CAPACITORS/STABILITY
Input Bypass Capacitor
An input capacitor is recommended. A 10µF tantalum on the input is a suitable input bypassing for almost all
applications.
Adjust Terminal Bypass Capacitor
The adjust terminal can be bypassed to ground with a bypass capacitor (CADJ) to improve ripple rejection. This
bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency,
the impedance of the CADJ should be less than R1 to prevent the ripple from being amplified:
1/(2π*fRIPPLE*CADJ) < R1
The R1 is the resistor between the output and the adjust pin. Its value is normally in the range of 100-200Ω. For
example, with R1 = 124Ω and fRIPPLE = 120Hz, the CADJ should be > 11µF.
Output Capacitor
The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both
minimum amount of capacitance and ESR (Equivalent Series Resistance). The minimum output capacitance
required by the LM1117 is 10µF, if a tantalum capacitor is used. Any increase of the output capacitance will
merely improve the loop stability and transient response. The ESR of the output capacitor should range between
0.3Ω - 22Ω. In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22µf
tantalum) is required.
OUTPUT VOLTAGE
The LM1117 adjustable version develops a 1.25V reference voltage, VREF, between the output and the adjust
terminal. As shown in Figure 8, this voltage is applied across resistor R1 to generate a constant current I1. The
current IADJ from the adjust terminal could introduce error to the output. But since it is very small (60µA)
compared with the I1 and very constant with line and load changes, the error can be ignored. The constant
current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level.
For fixed voltage devices, R1 and R2 are integrated inside the devices.
Figure 8. Basic Adjustable Regulator
LOAD REGULATION
The LM1117 regulates the voltage that appears between its output and ground pins, or between its output and
adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the
best load regulation, a few precautions are needed.
Figure 9, shows a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. It is
obvious that the VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this
case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve
this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground
terminal on the negative side.
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Figure 9. Typical Application using Fixed Output Regulator
When the adjustable regulator is used (Figure 10), the best performance is obtained with the positive side of the
resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops
from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with
0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω x IL.
If R1 (=125Ω) is connected near the load, the effective line resistance will be 0.05Ω (1+R2/R1) or in this case, it
is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to
provide remote ground sensing and improve load regulation.
Figure 10. Best Load Regulation using Adjustable Output Regulator
PROTECTION DIODES
Under normal operation, the LM1117 regulators do not need any protection diode. With the adjustable device,
the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert
the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient
signal of ±25V with respect to the output voltage without damaging the device.
When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor will
discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the
output voltage of the regulator, and rate of decrease of VIN. In the LM1117 regulators, the internal diode between
the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large
output capacitor (≥1000 µF), and with input instantaneously shorted to ground, the regulator could be damaged.
In this case, an external diode is recommended between the output and input pins to protect the regulator, as
shown in Figure 11.
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Figure 11. Regulator with Protection Diode
HEATSINK REQUIREMENTS
When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is
important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is
determined by summing the individual parts consisting of a series of temperature rises from the semiconductor
junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is
demonstrated in Figure 12. The heat generated at the device junction flows through the die to the die attach pad,
through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the
ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a
heatsink.
RθJC (Component Variables)
Leadframe Size & Material
RθCA (Application Variables)
Mounting Pad Size, Material, & Location
No. of Conduction Pins
Die Size
Placement of Mounting Pad
PCB Size & Material
Traces Length & Width
Adjacent Heat Sources
Volume of Air
Die Attach Material
Molding Compound Size and Material
Ambient Temperatue
Shape of Mounting Pad
Note: The case temperature is measured at the point where the leads contact with the mounting pad surface
Figure 12. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board
The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all
possible operating conditions, the junction temperature of the LM1117 must be within the range of 0°C to 125°C.
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD , must be
calculated:
IIN = IL + IG
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PD = (VIN-VOUT)I L + VINIG
Figure 13 shows the voltages and currents which are present in the circuit.
Figure 13. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR(max):
TR(max) = TJ(max)-TA(max)
where TJ(max) is the maximum allowable junction temperature (125°C), and TA(max) is the maximum ambient
temperature which will be encountered in the application.
Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient
thermal resistance (θJA) can be calculated:
θJA = TR(max)/PD
If the maximum allowable value for θJA is found to be ≥136°C/W for SOT-223 package or ≥79°C/W for TO-220
package or ≥92°C/W for TO-252 package, no heatsink is needed since the package alone will dissipate enough
heat to satisfy these requirements. If the calculated value for θJA falls below these limits, a heatsink is required.
As a design aid, Table 1 shows the value of the θJA of SOT-223 and TO-252 for different heatsink area. The
copper patterns that we used to measure these θJAs are shown at the end of APPLICATION INFORMATION.
Figure 14 and Figure 15 reflects the same test results as what are in the Table 1
Figure 16 and Figure 17 shows the maximum allowable power dissipation vs. ambient temperature for the SOT-
223 and TO-252 device. Figure 18 and Figure 19 shows the maximum allowable power dissipation vs. copper
area (in2) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques to be
used with SOT-223 and TO-252 packages.
Application Note AN-1187 discusses improved thermal performance and power dissipation for the LLP.
Table 1. θJA Different Heatsink Area
Layout
Copper Area
Thermal Resistance
Top Side (in2)(1)
Bottom Side (in2)
(θJA,°C/W) SOT-223
(θJA,°C/W) TO-252
1
2
0.0123
0.066
0.3
0
0
136
123
84
103
87
60
54
52
47
84
70
63
57
57
89
72
61
3
0
4
0.53
0.76
1
0
75
5
0
69
6
0
66
7
0
0.2
0.4
0.6
0.8
1
115
98
8
0
9
0
89
10
11
12
13
14
0
82
0
79
0.066
0.175
0.284
0.066
0.175
0.284
125
93
83
(1) Tab of device attached to topside copper
Copyright © 2004–2012, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: LM1117-N
LM1117-N
SNOS412L –MAY 2004–REVISED JULY 2012
www.ti.com
Table 1. θJA Different Heatsink Area (continued)
Layout
15
Copper Area
Thermal Resistance
0.392
0.5
0.392
0.5
75
70
55
53
16
Figure 14. θJA vs. 1oz Copper Area for SOT-223
Figure 15. θJA vs. 2oz Copper Area for TO-252
Figure 16. Maximum Allowable Power Dissipation
vs. Ambient Temperature for SOT-223
Figure 17. Maximum Allowable Power Dissipation
vs. Ambient Temperature for TO-252
Figure 18. Maximum Allowable Power Dissipation
vs. 1oz Copper Area for SOT-223
Figure 19. Maximum Allowable Power Dissipation
vs. 2oz Copper Area for TO-252
14
Submit Documentation Feedback
Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Links: LM1117-N
LM1117-N
www.ti.com
SNOS412L –MAY 2004–REVISED JULY 2012
Figure 20. Top View of the Thermal Test Pattern in Figure 21. Bottom View of the Thermal Test Pattern
Actual Scale
in Actual Scale
TYPICAL APPLICATION CIRCUITS
Figure 22. Adjusting Output of Fixed Regulators
Figure 23. Regulator with Reference
Copyright © 2004–2012, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Links: LM1117-N
LM1117-N
SNOS412L –MAY 2004–REVISED JULY 2012
www.ti.com
Figure 24. 1.25V to 10V Adjustable Regulator with Improved Ripple Rejection
Figure 25. 5V Logic Regulator with Electronic Shutdown*
Figure 26. Battery Backed-Up Regulated Supply
Figure 27. Low Dropout Negative Supply
16
Submit Documentation Feedback
Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Links: LM1117-N
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
LM1117DT-1.8/NOPB
LM1117DT-2.5/NOPB
LM1117DT-3.3/NOPB
LM1117DT-5.0/NOPB
LM1117DT-ADJ/NOPB
LM1117DTX-1.8/NOPB
LM1117DTX-2.5/NOPB
LM1117DTX-3.3/NOPB
LM1117DTX-5.0/NOPB
LM1117DTX-ADJ/NOPB
LM1117IDT-3.3/NOPB
LM1117IDT-5.0/NOPB
LM1117IDT-ADJ/NOPB
LM1117IDTX-3.3/NOPB
LM1117IDTX-5.0/NOPB
LM1117IDTX-ADJ/NOPB
LM1117ILD-ADJ/NOPB
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
ACTIVE
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
WSON
NDP
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
8
75
75
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-3-260C-168 HR
LM1117
DT-1.8
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NGN
Green (RoHS
& no Sb/Br)
LM1117
DT-2.5
75
Green (RoHS
& no Sb/Br)
LM1117
DT-3.3
75
Green (RoHS
& no Sb/Br)
LM1117
DT-5.0
75
Green (RoHS
& no Sb/Br)
LM1117
DT-ADJ
2500
2500
2500
2500
2500
75
Green (RoHS
& no Sb/Br)
LM1117
DT-1.8
Green (RoHS
& no Sb/Br)
LM1117
DT-2.5
Green (RoHS
& no Sb/Br)
LM1117
DT-3.3
Green (RoHS
& no Sb/Br)
LM1117
DT-5.0
Green (RoHS
& no Sb/Br)
LM1117
DT-ADJ
Green (RoHS
& no Sb/Br)
LM1117
IDT-3.3
75
Green (RoHS
& no Sb/Br)
LM1117
IDT-5.0
75
Green (RoHS
& no Sb/Br)
LM1117
IDT-ADJ
2500
2500
2500
1000
Green (RoHS
& no Sb/Br)
LM1117
IDT-3.3
Green (RoHS
& no Sb/Br)
LM1117
IDT-5.0
Green (RoHS
& no Sb/Br)
LM1117
IDT-ADJ
Green (RoHS
& no Sb/Br)
1117IAD
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
LM1117IMP-3.3/NOPB
LM1117IMP-5.0/NOPB
LM1117IMP-ADJ/NOPB
ACTIVE
ACTIVE
ACTIVE
SOT-223
SOT-223
SOT-223
DCY
DCY
DCY
4
4
4
1000
1000
1000
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 125 N05B
Green (RoHS
& no Sb/Br)
0 to 125
N06B
N03B
Green (RoHS
& no Sb/Br)
0 to 125
LM1117IMPX-3.3
ACTIVE
ACTIVE
SOT-223
SOT-223
DCY
DCY
4
4
2000
2000
TBD
CU SNPB
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 125
0 to 125
N05B
N05B
LM1117IMPX-3.3/NOPB
Green (RoHS
& no Sb/Br)
LM1117IMPX-5.0
ACTIVE
ACTIVE
SOT-223
SOT-223
DCY
DCY
4
4
2000
2000
TBD
CU SNPB
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 125
0 to 125
N06B
N06B
LM1117IMPX-5.0/NOPB
Green (RoHS
& no Sb/Br)
LM1117IMPX-ADJ/NOPB
LM1117LD-1.8/NOPB
LM1117LD-2.5/NOPB
LM1117LD-3.3/NOPB
LM1117LD-ADJ/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-223
WSON
WSON
WSON
WSON
DCY
NGN
NGN
NGN
NGN
4
8
8
8
8
2000
1000
1000
1000
1000
Green (RoHS
& no Sb/Br)
CU SN
SN
Level-1-260C-UNLIM
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
N03B
Green (RoHS
& no Sb/Br)
1117-18
1117-25
1117-33
1117ADJ
Green (RoHS
& no Sb/Br)
SN
Green (RoHS
& no Sb/Br)
SN
Green (RoHS
& no Sb/Br)
CU SN
LM1117LDX-1.8
ACTIVE
ACTIVE
WSON
WSON
NGN
NGN
8
8
4500
4500
TBD
SNPB
SN
Level-1-235C-UNLIM
Level-3-260C-168 HR
0 to 125
0 to 125
1117-18
1117-18
LM1117LDX-1.8/NOPB
Green (RoHS
& no Sb/Br)
LM1117LDX-ADJ/NOPB
LM1117MP-1.8/NOPB
LM1117MP-2.5/NOPB
LM1117MP-3.3/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
WSON
SOT-223
SOT-223
SOT-223
NGN
DCY
DCY
DCY
8
4
4
4
4500
1000
1000
1000
Green (RoHS
& no Sb/Br)
SN
Level-3-260C-168 HR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 125
0 to 125
0 to 125
0 to 125
1117ADJ
N12A
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
Green (RoHS
& no Sb/Br)
N13A
Green (RoHS
& no Sb/Br)
N05A
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
LM1117MP-5.0/NOPB
LM1117MP-ADJ/NOPB
LM1117MPX-1.8/NOPB
LM1117MPX-2.5/NOPB
LM1117MPX-3.3/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
DCY
DCY
DCY
DCY
DCY
4
4
4
4
4
1000
1000
2000
2000
2000
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 125 N06A
Green (RoHS
& no Sb/Br)
0 to 125
N03A
N12A
N13A
N05A
Green (RoHS
& no Sb/Br)
0 to 125
Green (RoHS
& no Sb/Br)
0 to 125
Green (RoHS
& no Sb/Br)
0 to 125
LM1117MPX-5.0
ACTIVE
ACTIVE
SOT-223
SOT-223
DCY
DCY
4
4
2000
2000
TBD
CU SNPB
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N06A
N06A
LM1117MPX-5.0/NOPB
Green (RoHS
& no Sb/Br)
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
0 to 125
LM1117MPX-ADJ/NOPB
LM1117S-ADJ/NOPB
LM1117SX-3.3/NOPB
LM1117SX-5.0/NOPB
LM1117SX-ADJ/NOPB
LM1117T-2.5/NOPB
LM1117T-3.3/NOPB
LM1117T-5.0/NOPB
LM1117T-ADJ/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-223
DCY
KTT
KTT
KTT
KTT
NDE
NDE
NDE
NDE
4
3
3
3
3
3
3
3
3
2000
45
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-3-245C-168 HR
Level-3-245C-168 HR
Level-3-245C-168 HR
Level-3-245C-168 HR
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
N03A
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
LM1117S
ADJ
DDPAK/
TO-263
500
500
500
45
Pb-Free (RoHS
Exempt)
LM1117S
3.3
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
LM1117S
5.0
DDPAK/
TO-263
Pb-Free (RoHS
Exempt)
LM1117S
ADJ
TO-220
TO-220
TO-220
TO-220
Green (RoHS
& no Sb/Br)
LM1117T
2.5
45
Green (RoHS
& no Sb/Br)
LM1117T
3.3
45
Green (RoHS
& no Sb/Br)
LM1117T
5.0
45
Green (RoHS
& no Sb/Br)
LM1117T
ADJ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM1117DTX-1.8/NOPB
LM1117DTX-2.5/NOPB
LM1117DTX-3.3/NOPB
LM1117DTX-5.0/NOPB
LM1117DTX-ADJ/NOPB
LM1117IDTX-3.3/NOPB
LM1117IDTX-5.0/NOPB
LM1117IDTX-ADJ/NOPB
LM1117ILD-ADJ/NOPB
PFM
PFM
PFM
PFM
PFM
PFM
PFM
PFM
WSON
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NGN
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
NGN
3
3
3
3
3
3
3
3
8
4
4
4
4
4
4
4
4
8
2500
2500
2500
2500
2500
2500
2500
2500
1000
1000
1000
1000
2000
2000
2000
2000
2000
1000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
178.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
178.0
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
12.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
12.4
6.9
6.9
6.9
6.9
6.9
6.9
6.9
6.9
4.3
7.0
7.0
7.0
7.0
7.0
7.0
7.0
7.0
4.3
10.5
10.5
10.5
10.5
10.5
10.5
10.5
10.5
4.3
2.7
2.7
2.7
2.7
2.7
2.7
2.7
2.7
1.3
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
1.3
8.0
8.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
12.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q1
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
8.0
8.0
8.0
8.0
8.0
8.0
8.0
LM1117IMP-3.3/NOPB SOT-223
LM1117IMP-5.0/NOPB SOT-223
LM1117IMP-ADJ/NOPB SOT-223
7.5
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
8.0
7.5
7.5
LM1117IMPX-3.3
LM1117IMPX-3.3/NOPB SOT-223
LM1117IMPX-5.0 SOT-223
SOT-223
7.5
7.5
7.5
LM1117IMPX-5.0/NOPB SOT-223
LM1117IMPX-ADJ/NOPB SOT-223
7.5
7.5
LM1117LD-1.8/NOPB
WSON
4.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Nov-2012
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM1117LD-2.5/NOPB
LM1117LD-3.3/NOPB
LM1117LD-ADJ/NOPB
LM1117LDX-1.8
WSON
WSON
WSON
WSON
WSON
NGN
NGN
NGN
NGN
NGN
NGN
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
KTT
8
8
8
8
8
8
4
4
4
4
4
4
4
4
4
4
4
3
1000
1000
1000
4500
4500
4500
1000
1000
1000
1000
1000
2000
2000
2000
2000
2000
2000
500
178.0
178.0
178.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
16.4
24.4
4.3
4.3
4.3
4.3
4.3
4.3
7.0
7.0
7.0
7.0
7.0
7.0
7.0
7.0
7.0
7.0
7.0
4.3
4.3
4.3
4.3
4.3
4.3
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
7.5
1.3
1.3
1.3
1.3
1.3
1.3
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
5.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
24.0
Q1
Q1
Q1
Q1
Q1
Q1
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q2
8.0
8.0
LM1117LDX-1.8/NOPB
8.0
LM1117LDX-ADJ/NOPB WSON
LM1117MP-1.8/NOPB SOT-223
LM1117MP-2.5/NOPB SOT-223
LM1117MP-3.3/NOPB SOT-223
LM1117MP-5.0/NOPB SOT-223
LM1117MP-ADJ/NOPB SOT-223
LM1117MPX-1.8/NOPB SOT-223
LM1117MPX-2.5/NOPB SOT-223
LM1117MPX-3.3/NOPB SOT-223
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
LM1117MPX-5.0
SOT-223
LM1117MPX-5.0/NOPB SOT-223
LM1117MPX-ADJ/NOPB SOT-223
LM1117SX-3.3/NOPB
DDPAK/
TO-263
10.75 14.85
10.75 14.85
10.75 14.85
LM1117SX-5.0/NOPB
DDPAK/
TO-263
KTT
KTT
3
3
500
500
330.0
330.0
24.4
24.4
5.0
5.0
16.0
16.0
24.0
24.0
Q2
Q2
LM1117SX-ADJ/NOPB DDPAK/
TO-263
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Nov-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM1117DTX-1.8/NOPB
LM1117DTX-2.5/NOPB
LM1117DTX-3.3/NOPB
LM1117DTX-5.0/NOPB
LM1117DTX-ADJ/NOPB
LM1117IDTX-3.3/NOPB
LM1117IDTX-5.0/NOPB
LM1117IDTX-ADJ/NOPB
LM1117ILD-ADJ/NOPB
LM1117IMP-3.3/NOPB
LM1117IMP-5.0/NOPB
LM1117IMP-ADJ/NOPB
LM1117IMPX-3.3
PFM
PFM
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NDP
NGN
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
NGN
NGN
NGN
3
3
3
3
3
3
3
3
8
4
4
4
4
4
4
4
4
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
1000
1000
1000
1000
2000
2000
2000
2000
2000
1000
1000
1000
358.0
358.0
358.0
358.0
358.0
358.0
358.0
358.0
203.0
349.0
349.0
349.0
354.0
354.0
354.0
354.0
354.0
203.0
203.0
203.0
343.0
343.0
343.0
343.0
343.0
343.0
343.0
343.0
190.0
337.0
337.0
337.0
340.0
340.0
340.0
340.0
340.0
190.0
190.0
190.0
63.0
63.0
63.0
63.0
63.0
63.0
63.0
63.0
41.0
45.0
45.0
45.0
35.0
35.0
35.0
35.0
35.0
41.0
41.0
41.0
PFM
PFM
PFM
PFM
PFM
PFM
WSON
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
WSON
WSON
WSON
LM1117IMPX-3.3/NOPB
LM1117IMPX-5.0
LM1117IMPX-5.0/NOPB
LM1117IMPX-ADJ/NOPB
LM1117LD-1.8/NOPB
LM1117LD-2.5/NOPB
LM1117LD-3.3/NOPB
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Nov-2012
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM1117LD-ADJ/NOPB
LM1117LDX-1.8
WSON
WSON
NGN
NGN
NGN
NGN
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
DCY
KTT
8
8
8
8
4
4
4
4
4
4
4
4
4
4
4
3
3
3
1000
4500
4500
4500
1000
1000
1000
1000
1000
2000
2000
2000
2000
2000
2000
500
203.0
349.0
358.0
358.0
349.0
349.0
349.0
349.0
349.0
354.0
354.0
354.0
354.0
354.0
354.0
358.0
358.0
358.0
190.0
337.0
343.0
343.0
337.0
337.0
337.0
337.0
337.0
340.0
340.0
340.0
340.0
340.0
340.0
343.0
343.0
343.0
41.0
45.0
63.0
63.0
45.0
45.0
45.0
45.0
45.0
35.0
35.0
35.0
35.0
35.0
35.0
63.0
63.0
63.0
LM1117LDX-1.8/NOPB
LM1117LDX-ADJ/NOPB
LM1117MP-1.8/NOPB
LM1117MP-2.5/NOPB
LM1117MP-3.3/NOPB
LM1117MP-5.0/NOPB
LM1117MP-ADJ/NOPB
LM1117MPX-1.8/NOPB
LM1117MPX-2.5/NOPB
LM1117MPX-3.3/NOPB
LM1117MPX-5.0
WSON
WSON
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
LM1117MPX-5.0/NOPB
LM1117MPX-ADJ/NOPB
LM1117SX-3.3/NOPB
LM1117SX-5.0/NOPB
LM1117SX-ADJ/NOPB
SOT-223
SOT-223
DDPAK/TO-263
DDPAK/TO-263
DDPAK/TO-263
KTT
500
KTT
500
Pack Materials-Page 4
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
NDP0003B
TD03B (Rev F)
www.ti.com
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004)
M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
3
0,25 (0.010)
0,84 (0.033)
0,66 (0.026)
0°–10°
2,30 (0.091)
0,10 (0.004)
M
4,60 (0.181)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
1,80 (0.071) MAX
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
NGN0008A
LDC08A (Rev B)
www.ti.com
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相关型号：
LM1117IMPX-3.3/NOPB
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