LM1086-MIL [TI]
1.5A 固定/可调输出线性稳压器;
| 型号： | LM1086-MIL |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1.5A 固定/可调输出线性稳压器 稳压器 |
| 文件： | 总23页 (文件大小：1163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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LM1086-MIL
ZHCSGG4 –JUNE 2017
LM1086-MIL 1.5A 低压降正电压稳压器
1 特性
3 说明
1
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可提供固定的 1.8V、2.5V、3.3V、5V 版本
LM1086-MIL 是一款稳压器，在负载电流为 1.5A 时具
有 1.5V 的最大压降。该器件具有与德州仪器 (TI) 行业
标准 LM317 相同的引脚。
提供可调节版本
电流限制和热保护
2% 输出精度
需要两个电阻来设置 LM1086-MIL 的可调节输出电压
版本的输出电压。固定输出电压版本集成了调节电阻
器。通常，除非器件距离输入滤波电容器超过 6 英
寸，否则不需要输入电容器。输出电容器可以替换为陶
瓷和适当的 ESR。
输出电流 1.5A
线路调节 0.015%（典型值）
负载调节 0.1%（典型值）
高达 29V 的最大输入电压
低至 1.25V 的
最低可调节输出电压
LM1086-MIL 电路包括齐纳微调带隙参考、电流限制和
热关断。由于 LM1086-MIL 稳压器是浮动的并且仅检
测输入到输出差分电压，因此，只要不超过最大输入到
输出差分电压，就可以调节几百伏特的电源电压。超过
最大输入到输出差分电压将导致输出短路。通过在调节
引脚和输出端之间连接固定电阻器，LM1086-MIL 也可
用作精密电流调节器。
•
•
与具有 ESR 的陶瓷输出电容器一起工作时保持稳
定
温度范围：–40°C 至 +125°C
2 应用
•
•
•
•
•
•
•
高效线性稳压器
电池充电器
对于 需要 更大的输出电流的应用，请参阅 LM1084
（对于 5A 版本）和 LM1085（对于 3A 版本）。
开关电源的后置稳压
恒定电流调节器
微处理器电源
音频放大器电源
火警控制
器件信息(1)
器件型号
封装
封装尺寸（标称值）
WSON (8)
4.00mm x 4.00mm
LM1086-MIL
DDPAK/TO-263 (3) 10.18mm × 8.41mm
TO-220 (3) 14.986mm × 10.16mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
典型应用
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNVSAX4
LM1086-MIL
ZHCSGG4 –JUNE 2017
www.ti.com.cn
目录
1
2
3
4
5
6
特性.......................................................................... 1
8
9
Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Applications ................................................ 13
8.3 Other Applications................................................... 14
Power Supply Recommendations...................... 18
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 7
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 11
10 Layout................................................................... 18
10.1 Layout Guidelines ................................................. 18
10.2 Layout Example .................................................... 18
10.3 Thermal Considerations........................................ 19
11 器件和文档支持 ..................................................... 21
11.1 文档支持................................................................ 21
11.2 接收文档更新通知 ................................................. 21
11.3 社区资源................................................................ 21
11.4 商标....................................................................... 21
11.5 静电放电警告......................................................... 21
11.6 Glossary................................................................ 21
12 机械、封装和可订购信息....................................... 21
7
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
日期
修订版本
注意
2017 年 6 月
*
最初发布版本
2
Copyright © 2017, Texas Instruments Incorporated
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ZHCSGG4 –JUNE 2017
5 Pin Configuration and Functions
NGN Package
8-Pin WSON
Top View
V
1
2
3
4
8
7
6
5
OUT
!ꢁW/Dbꢁ
V
V
V
OUT
IN
V
OUT
b/ꢀ
b/ꢀ
OUT
b/ꢀ
NDE Package
3-Pin TO-220
Top View
KTT Package
3-Pin DDPAK/TO-263
Top View
Pin Functions
PIN
NUMBER
I/O
DESCRIPTION
NAME
KTT/NDE
NGN
Adjust pin for the adjustable output voltage version. Ground pin for the fixed
output voltage versions.
ADJ/GND
1
1
––
VIN
3
2
I
Input voltage pin for the regulator.
Output voltage pin for the regulator.
No connection
VOUT
N/C
2, TAB
6, 7, 8, PAD
3, 4, 5
O
––
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)
MIN
MAX
29
UNIT
LM1086-MIL-ADJ
LM1086-MIL-1.8
V
V
V
V
V
27
Maximum input-to-output voltage differential
LM1086-MIL-2.5
LM1086-MIL-3.3
LM1086-MIL-5
27
27
25
Power dissipation(3)
Internally Limited
Junction temperature (TJ)(4)
150
150
°C
°C
Storage temperature, Tstg
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application and Implementation. The
value RθJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For
improved thermal resistance and power dissipation for the WSON package, refer to AN-1187 Leadless Leadframe Package (LLP)
(4) The maximum power dissipation is a function of TJ(MAX) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) – T A) / RθJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
JUNCTION TEMPERATURE RANGE (TJ)(1)
Control section
Output section
Control section
Output section
0
0
125
150
125
150
°C
°C
°C
°C
C grade
I grade
−40
−40
(1) The maximum power dissipation is a function of TJ(MAX) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) – T A) / RθJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal
Considerations.
6.4 Thermal Information
LM1086-MIL
THERMAL METRIC(1)
KTT
3 PINS
40.8
NDE
3 PINS
23.0
16.1
4.5
NGN
8 PINS
35.9
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
42.3
24.2
23.3
13.2
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
10.2
2.4
0.2
ψJB
22.3
2.5
13.3
RθJC(bot)
Junction-to-case (bottom) thermal resistance: control
section/output section
1.5/4
1.5/4
2.9
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2017, Texas Instruments Incorporated
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ZHCSGG4 –JUNE 2017
6.5 Electrical Characteristics
Typicals and limits appearing in normal type apply for TJ = 25°C unless specified otherwise.
TJ over the entire range for
operation (see Recommended
Operating Conditions)
TJ = 25°C
TYP
PARAMETER
TEST CONDITIONS
UNIT
(1)
MIN
MAX
MIN(1)
TYP(2)
MAX
LM1086-MIL-ADJ, IOUT = 10 mA,
Reference
voltage
VIN − VOUT = 3 V, 10 mA ≤ IOUT ≤
VREF
1.238
1.25
1.262
1.225
1.250
1.27
V
IFULL LOAD, 1.5 V ≤ VIN − VOUT
≤
15 V(3)
LM1086-MIL-1.8, IOUT = 0 mA,
VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD
3.3 V ≤ VIN ≤ 18 V
,
,
,
1.782
2.475
3.267
4.950
1.8
2.5
3.3
5
1.818
2.525
3.333
5.05
1.764
2.450
3.235
4.9
1.8
2.5
3.3
5
1.836
2.55
3.365
5.1
V
V
V
V
LM1086-MIL-2.5, IOUT = 0 mA,
VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD
4.0 V ≤ VIN ≤ 18 V
Output
VOUT
voltage(3)
LM1086-MIL-3.3, IOUT = 0 mA,
VIN = 5 V, 0 ≤ IOUT ≤ IFULL LOAD
4.75 V ≤ VIN ≤ 18 V
LM1086-MIL-5, IOUT = 0 mA, VIN
= 8 V, 0 ≤ IOUT ≤ IFULL LOAD, 6.5 V
≤ VIN ≤ 20 V
LM1086-MIL-ADJ, IOUT =10 mA,
1.5 V ≤ (VIN - VOUT) ≤ 15 V
0.015%
0.3
0.2%
6
0.035%
0.2%
6
LM1086-MIL-1.8, IOUT = 0 mA,
3.3 V ≤ VIN ≤ 18 V
0.6
0.6
1
mV
mV
mV
mV
Line
LM1086-MIL-2.5, IOUT = 0 mA,
4.0 V ≤ VIN ≤ 18 V
ΔVOUT
0.3
6
6
regulation(4)
LM1086-MIL-3.3, IOUT = 0 mA,
4.5 V ≤ VIN ≤ 18 V
0.5
10
10
10
10
LM1086-MIL-5, IOUT = 0 mA, 6.5
V ≤ VIN ≤ 20 V
0.5
1
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
(3) IFULL LOAD is defined in the current limit curves. The IFULL LOAD Curve defines current limit as a function of input-to-output voltage. Note
that 15 W power dissipation for the LM1086-MIL is only achievable over a limited range of input-to-output voltage.
(4) Load and line regulation are measured at constant junction temperature, and are specified up to the maximum power dissipation of 15
W. Power dissipation is determined by the input/output differential and the output current. Ensured maximum power dissipation will not
be available over the full input/output range.
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Electrical Characteristics (continued)
Typicals and limits appearing in normal type apply for TJ = 25°C unless specified otherwise.
TJ over the entire range for
operation (see Recommended
Operating Conditions)
TJ = 25°C
PARAMETER
TEST CONDITIONS
UNIT
(1)
MIN
TYP
MAX
MIN(1)
TYP(2)
MAX
LM1086-MIL-ADJ, (VIN-V OUT ) =
3 V, 10 mA ≤ IOUT ≤ IFULL LOAD
0.1%
0.3%
0.2%
0.4%
20
LM1086-MIL-1.8, 2.5, VIN = 5 V, 0
≤ IOUT ≤ IFULL LOAD
3
3
5
12
15
20
6
7
mV
mV
mV
V
Load
ΔVOUT
regulation(4)
LM1086-MIL-3.3, VIN = 5 V, 0 ≤
25
I
OUT ≤ IFULL LOAD
LM1086-MIL-5, VIN = 8 V, 0 ≤
OUT ≤ IFULL LOAD
10
1.3
35
I
Dropout
LM1086-MIL-ADJ, 1.8, 2.5, 3.3, 5,
ΔVREF, ΔVOUT = 1%, IOUT = 1.5 A
1.5
voltage(5)
LM1086-MIL-ADJ, VIN − VOUT = 5
V, VIN − VOUT = 25 V
1.5
2.7
A
0.05
0.15
ILIMIT
Current limit
LM1086-MIL-1.8,2.5, 3.3, VIN = 8
V
1.5
1.5
2.7
2.7
5
A
A
LM1086-MIL-5, VIN = 10 V
Minimum load
current(6)
LM1086-MIL-ADJ, VIN −VOUT =
25 V
10
mA
LM1086-MIL-1.8, 2.5, VIN ≤ 18 V
LM1086-MIL-3.3, VIN ≤ 18 V
LM1086-MIL-5, VIN ≤ 20 V
5
5
5
10
10
10
mA
mA
mA
Quiescent
current
Thermal
regulation
TA = 25°C, 30-ms pulse
0.008
0.04
%/W
fRIPPLE = 120 Hz, COUT = 25 µF
Tantalum, IOUT = 1.5 A
60
75
dB
LM1086-MIL-ADJ, CADJ = 25 µF,
(VIN− VO) = 3 V
Ripple rejection
LM1086-MIL-1.8, 2.5, VIN = 6 V
LM1086-MIL-3.3, VIN= 6.3 V
LM1086-MIL-5 VIN = 8 V
LM1086-MIL
60
60
60
72
72
68
dB
dB
dB
Adjust pin
current
55
120
5
µA
µA
Adjust pin
current change
10 mA ≤ IOUT ≤ IFULL LOAD, 1.5 V
≤ (VIN − VOUT) ≤ 15 V
0.2
Temperature
stability
0.5%
Long-term
stability
TA = 125°C, 1000 Hrs
0.3%
1%
RMS Noise
10 Hz ≤ f≤ 10 kHz
0.003%
(% of VOUT
)
(5) Dropout voltage is specified over the full output current range of the device.
(6) The minimum output current required to maintain regulation.
6
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ZHCSGG4 –JUNE 2017
6.6 Typical Characteristics
Figure 2. Short-Circuit Current vs Input/Output Difference
Figure 1. Dropout Voltage vs Output Current
Figure 4. Percent Change in Output Voltage vs Temperature
Figure 3. Load Regulation vs Temperature
Figure 5. Adjust Pin Current vs Temperature
Figure 6. Maximum Power Dissipation vs Temperature
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Typical Characteristics (continued)
Figure 8. Ripple Rejection vs Output Current
Figure 7. Ripple Rejection vs Frequency
(LM1086-MIL-ADJ)
(LM1086-MIL-ADJ)
Figure 10. Ripple Rejection vs Output Current
(LM1086-MIL-5)
Figure 9. Ripple Rejection vs Frequency
(LM1086-MIL-5)
Figure 11. Line Transient Response
Figure 12. Load Transient Response
8
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7 Detailed Description
7.1 Overview
A basic functional diagram for the LM1086-MIL-ADJ (excluding protection circuitry) is shown in Figure 13. The
topology is basically that of the LM317 except for the pass transistor. Instead of a Darlingtion NPN with its two
diode voltage drop, the LM1086-MIL uses a single NPN. This results in a lower dropout voltage. The structure of
the pass transistor is also known as a quasi LDO. The advantage of a quasi LDO over a PNP LDO is its
inherently lower quiescent current. The LM1086-MIL is specified to provide a minimum dropout voltage of 1.5 V
over temperature, at full load.
Figure 13. Basic Functional Block Diagram
7.2 Functional Block Diagram
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7.3 Feature Description
7.3.1 Ripple Rejection
Ripple rejection is a function of the open loop gain within the feedback loop (refer to Figure 13 and Figure 16).
The LM1086-MIL exhibits 75 dB of ripple rejection (typical). When adjusted for voltages higher than VREF, the
ripple rejection decreases as function of adjustment gain: (1 + R1 / R2) or VO / VREF. Therefore, a 5-V adjustment
decreases ripple rejection by a factor of four (−12 dB); output ripple increases as adjustment voltage increases.
However, the adjustable version allows this degradation of ripple rejection to be compensated. The adjust
terminal can be bypassed to ground with a capacitor (CADJ). The impedance of the CADJ must be equal to or less
than R1 at the desired ripple frequency. This bypass capacitor prevents ripple from being amplified as the output
voltage is increased.
1 / (2π × fRIPPLE × CADJ) ≤ R1
(1)
7.3.2 Load Regulation
The LM1086-MIL regulates the voltage that appears between its output and ground pins, or between its output
and adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain
the best load regulation, a few precautions are needed.
Figure 14 shows a typical application using a fixed output regulator. Rt1 and Rt2 are the line resistances. VLOAD
is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation
seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied
directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side.
Figure 14. Typical Application Using Fixed Output Regulator
When the adjustable regulator is used (Figure 15), the best performance is obtained with the positive side of the
resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops
from appearing effectively in series with the reference and degrading regulation. For example, a 5-V regulator
with 0.05-Ω resistance between the regulator and load has a load regulation due to line resistance of 0.05 Ω × IL.
If R1 (= 125 Ω) is connected near the load the effective line resistance will be 0.05 Ω (1 + R2 / R1) or in this
case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the
load to provide remote ground sensing and improve load regulation.
Figure 15. Best Load Regulation Using Adjustable Output Regulator
10
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Feature Description (continued)
7.3.3 Overload Recovery
Overload recovery refers to the ability of the regulator to recover from a short-circuited output. A key factor in the
recovery process is the current limiting used to protect the output from drawing too much power. The current-
limiting circuit reduces the output current as the input-to-output differential increases. Refer to short-circuit curve
in Typical Characteristics.
During normal start-up, the input-to-output differential is small because the output follows the input. But, if the
output is shorted, then the recovery involves a large input to output differential. Sometimes during this condition
the current limiting circuit is slow in recovering. If the limited current is too low to develop a voltage at the output,
the voltage will stabilize at a lower level. Under these conditions it may be necessary to recycle the power of the
regulator in order to get the smaller differential voltage and thus adequate start up conditions. Refer to Typical
Characteristics for the short circuit current vs input differential voltage.
7.4 Device Functional Modes
7.4.1 Output Voltage
The LM1086-MIL adjustable version develops a 1.25-V reference voltage, (VREF), between the output and the
ADJ pin. As shown in Figure 16, this voltage is applied across resistor R1 to generate a constant current I1. This
constant current then flows through R2. The resulting voltage drop across R2 adds to the reference voltage to
sets the desired output voltage.
The current IADJ from the adjustment terminal introduces an output error . But since it is small (120 µA
maximum), it becomes negligible when R1 is in the 100-Ω range.
For fixed voltage devices, R1 and R2 are integrated inside the devices.
Figure 16. Basic Adjustable Regulator
7.4.2 Stability Consideration
Stability consideration primarily concerns the phase response of the feedback loop. In order for stable operation,
the loop must maintain negative feedback. The LM1086-MIL requires a certain amount series resistance with
capacitive loads. This series resistance introduces a zero within the loop to increase phase margin and thus
increase stability. The equivalent series resistance (ESR) of solid tantalum or aluminum electrolytic capacitors is
used to provide the appropriate zero (approximately 500 kHz).
Aluminum electrolytics are less expensive than tantalum capacitors, but their ESR varies exponentially at cold
temperatures requiring close examination when choosing the desired transient response over temperature.
Tantalums are a convenient choice because their ESR varies less than 2:1 over temperature.
The recommended load/decoupling capacitance is a 10-µF tantalum or a 50-µF aluminum. These values assure
stability for the majority of applications.
The adjustable versions allows an additional capacitor to be used at the ADJ pin to increase ripple rejection. If
this is done increate the output capacitor to 22 µF for tantalum or to 150 µF for aluminum.
Capacitors other than tantalum or aluminum can be used at the adjust pin and the input pin. A 10-µF capacitor is
a reasonable value at the input. See Ripple Rejection regarding the value for the ADJ pin capacitor.
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Device Functional Modes (continued)
Large output capacitance is desirable for applications that entail large changes in load current (microprocessors,
for example). The higher the capacitance, the larger the available charge per demand. It is also desirable to
provide low ESR to reduce the change in output voltage:
ΔV = ΔI × ESR
(2)
It is common practice to use several tantalum and ceramic capacitors in parallel to reduce this change in the
output voltage by reducing the overall ESR.
Output capacitance can be increased indefinitely to improve transient response and stability.
7.4.3 Protection Diodes
Under normal operation, the LM1086-MIL regulator does not need any protection diode. With the adjustable
device, the internal resistance between the adjustment and output terminals limits the current. No diode is
needed to divert the current around the regulator even with a capacitor on the ADJ pin. The ADJ pin can take a
transient signal of ±25 V with respect to the output voltage without damaging the device.
When an output capacitor is connected to a regulator and the input is shorted, the output capacitor discharges
into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage
of the regulator, and rate of decrease of VIN. In the LM1086-MIL regulator, the internal diode between the output
and input pins can withstand microsecond surge currents of 10 A to 20 A. With an extremely large output
capacitor (≥ 1000 µf), and with input instantaneously shorted to ground, the regulator could be damaged. In this
case, an external diode is recommended between the output and input pins to protect the regulator, shown in
Figure 17.
Figure 17. Regulator with Protection Diode
12
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM1086-MIL is versatile in its applications, including uses in programmable output regulation and local on-
card regulation. By connecting a fixed resistor between the ADJ and OUTPUT terminals, the LM1086-MIL can
function as a precision current regulator. An optional output capacitor can be added to improve transient
response. The ADJ pin can be bypassed to achieve very high ripple-rejection ratios, which are difficult to achieve
with standard three-terminal regulators. Note that, in the following applications if ADJ is mentioned, it makes use
of the adjustable version of the part, however, if GND is mentioned, it is the fixed-voltage version of the part.
8.2 Typical Applications
8.2.1 1.2-V to 15-V Adjustable Regulator
This part can be used as a simple low drop out regulator to enable a variety of output voltages needed for
demanding applications. By using an adjustable R2 resistor a variety of output voltages can be made possible as
shown in Figure 18 based on the LM1086-MIL-ADJ.
Figure 18. 1.2-V to 15-V Adjustable Regulator
8.2.1.1 Design Requirements
The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an
output capacitor for load regulation.
8.2.1.2 Detailed Design Procedure
The voltage divider for this part is set based Figure 18, where R1 is the upper feedback resistor R2 is the lower
feedback resistor.
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Typical Applications (continued)
8.2.1.3 Application Curve
8.3 Other Applications
8.3.1 Adjustable at 5 V
The application shown in Figure 19 outlines a simple 5-V output application made possible by the LM1086-MIL-
ADJ. This application can provide 1.5 A at high efficiencies and very low dropout.
Figure 19. Adjustable at 5 V
8.3.2 5-V Regulator with Shutdown
A variation of the 5-V output regulator application with shutdown control is shown in Figure 20 based on the
LM1086-MIL-ADJ. It uses a simple NPN transistor on the ADJ pin to block or sink the current on the ADJ pin. If
the TTL logic is pulled high, the NPN transistor is activated and the device is disabled, outputting approximately
1.25 V. If the TTL logic is pulled low, the NPN transistor is unbiased and the regulator functions normally.
Figure 20. 5-V Regulator with Shutdown
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Other Applications (continued)
8.3.3 Battery Charger
The LM1086-MIL-ADJ can be used as a battery charger to regulate the charging current required by the battery
bank as shown in Figure 21. In this application the LM1086-MIL acts as a constant voltage, constant current part
by sensing the voltage potential across the battery and compensating it to the current voltage. To maintain this
voltage, the regulator delivers the maximum charging current required to charge the battery. As the battery
approaches the fully charged state, the potential drop across the sense resistor, RS reduces and the regulator
throttles back the current to maintain the float voltage of the battery.
Figure 21. Battery Charger
8.3.4 Adjustable Fixed Regulator
A simple adjustable, fixed-range-output regulator can be made possible by placing a variable resistor on the
ground of the device as shown in Figure 22 based on the fixed output voltage LM1086-MIL-5. The GND pin has
a small quiescent current of 5 mA typical. Increasing the resistance on the GND pin increases the voltage
potential across the resistor. This potential is then mirrored on to the output to increase the total output voltage
by the potential drop across the GND resistor.
Figure 22. Adjustable Fixed Regulator
8.3.5 Regulator With Reference
A fixed output voltage version of the LM1086-MIL-5 can be employed to provide an output rail and a reference
rail at the same time as shown in Figure 23. This simple application makes use of a reference diode, the LM136-
5, to regulate the GND voltage to a fixed 5 V based on the quiescent current generated by the GND pin. This
voltage is then added onto the output to generate a total of 10 V out.
Figure 23. Regulator With Reference
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Other Applications (continued)
8.3.6 High-Current Lamp-Driver Protection
A simple constant-current source with protection can be designed by controlling the impedance between the
lamp and ground. The LM1086-MIL-ADJ shown in Figure 24 makes use of an external TTL or CMOS input to
drive the NPN transistor. This pulls the output of the regulator to a few tenths of a volt and puts the part into
current limit. Releasing the logic will reduce the current flow across the lamp into the normal operating current
thereby protecting the lamp during start-up.
Figure 24. High Current Lamp Driver Protection
8.3.7 Battery-Backup-Regulated Supply
A regulated battery-backup supply can be generated by using two fixed output voltage versions of the part as
shown in Figure 25. The top regulator supplies the line voltage during normal operation, however when the input
is not available, the second regulator derives power from the battery backup and regulates it to 5 V based on the
LM1086-MIL-5. The diodes prevent the rails from back feeding into the supply and batteries.
Figure 25. Battery Backup Regulated Supply
16
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Other Applications (continued)
8.3.8 Ripple Rejection Enhancement
A very simple ripple rejection circuit is shown in Figure 26 using the LM1086-MIL-ADJ. The capacitor C1
smooths out the ripple on the output by cleaning up the feedback path and preventing excess noise from feeding
back into the regulator. Please remember XC1 should be approximately equal to R1 at the ripple frequency.
Figure 26. Ripple Rejection Enhancement
8.3.9 Automatic Light Control
A common streetlight control or automatic light control circuit is designed in Figure 27 based on the LM1086-MIL-
ADJ. The photo transistor conducts in the presence of light and grounds the ADJ pin preventing the lamp from
turning on. However, in the absence of light, the LM1086-MIL regulates the voltage to 1.25 V between OUT and
ADJ, ensuring the lamp remains on.
Figure 27. Automatic Light Control
8.3.10 Remote Sensing
Remote sensing is a method of compensating the output voltage to a very precise degree by sensing the output
and feeding it back through the feedback. The circuit implementing this is shown in Figure 28 using the LM1086-
MIL-ADJ. The output of the regulator is fed into a voltage follower to avoid any loading effects and the output of
the op-amp is injected into the top of the feedback resistor network. This has the effect of modulating the voltage
to a precise degree without additional loading on the output.
Figure 28. Remote Sensing
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9 Power Supply Recommendations
The linear regulator input supply must be well regulated and kept at a voltage level such that the maximum input-
to-output voltage differential allowed by the device is not exceeded. The minimum dropout voltage (VIN – VOUT
)
should be met with extra headroom when possible in order to keep the output well regulated. Pace a 10-μF or
higher capacitor at the input to bypass noise.
10 Layout
10.1 Layout Guidelines
For the best overall performance, follow these layout guidelines. Place all circuit components on the same side of
the circuit board and as near as practical to the respective linear regulator pins connections. Keep traces short
and wide to reduce the amount of parasitic elements into the system. The actual width and thickness of traces
depends on the current carrying capability and heat dissipation required by the end system. An array of plated
vias can be placed on the pad area underneath the TAB to conduct heat to any inner plane areas or to a bottom-
side copper plane.
10.2 Layout Example
Figure 29. Layout Example
18
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10.3 Thermal Considerations
ICs heats up when in operation, and power consumption is one factor in how hot it gets. The other factor is how
well the heat is dissipated. Heat dissipation is predictable by knowing the thermal resistance between the IC and
ambient (RθJA). Thermal resistance has units of temperature per power (°C/W). The higher the thermal
resistance, the hotter the IC.
The LM1086-MIL specifies the thermal resistance for each package as junction to case (RθJC). In order to get the
total resistance to ambient (RθJA), two other thermal resistance must be added, one for case to heat-sink (RθCH
and one for heatsink to ambient (RθHA). The junction temperature can be predicted as follows:
)
TJ = TA + PD (θJC + RθCH + RθHA) = TA + PD RθJA
where
•
•
•
TJ is junction temperature
TA is ambient temperature
PD is the power consumption of the device
(3)
Device power consumption is calculated as follows:
IIN = IL + IG
(4)
(5)
PD = (VIN−VOUT) IL + VINIG
Figure 30 shows the voltages and currents which are present in the circuit.
Figure 30. Power Dissipation Diagram
Once the devices power is determined, the maximum allowable (RθJA (max)) is calculated as:
RθJA (max) = TR(max)/PD = TJ(max) − TA(max)/PD
The LM1086-MIL has different temperature specifications for two different sections of the device: the control
section and the output section. The Thermal Information table shows the junction to case thermal resistances for
each of these sections, while the maximum junction temperatures (TJ(max)) for each section is listed in the
Absolute Maximum Ratings section of the data sheet. TJ(max) is 125°C for the control section, while TJ(max) is
150°C for the output section.
Calculate RθJA (max) separately for each section as follows:
R
θJA (maximum, control section) = (125°C – TA(max))/PD
θJA (maximum, output section) = (150°C – TA(max))/PD
(6)
(7)
R
The required heat sink is determined by calculating its required thermal resistance (RθHA (max)).
R
θHA (max) = RθJA (max) − (RJθC + RθCH
)
(8)
(RθHA (max)) should also be calculated twice as follows:
(RθHA (max)) = RθJA (maximum, control section) – (RθJC (CONTROL SECTION) + RθCH
)
(9)
(RθHA (max)) = RJθA(maximum, output section) - (RθJC (OUTPUT SECTION) + RθCH
)
(10)
If thermal compound is used, RθCH can be estimated at 0.2°C/W. If the case is soldered to the heat sink, then a
θCH can be estimated as 0°C/W.
R
After, RθHA (max) is calculated for each section, choose the lower of the two RθHA (max) values to determine the
appropriate heat sink.
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Thermal Considerations (continued)
If PC board copper is going to be used as a heat sink, then Figure 31 can be used to determine the appropriate
area (size) of copper foil required.
Figure 31. Heat Sink Thermal Resistance vs Area
20
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11 器件和文档支持
11.1 文档支持
11.1.1 相关文档
请参阅如下相关文档：
《AN-1187 无引线框架封装 (LLP)》
11.2 接收文档更新通知
要接收文档更新通知，请导航至德州仪器 TI.com.cn 上的器件产品文件夹。请单击右上角的通知我 进行注册，即可
收到任意产品信息更改每周摘要。有关更改的详细信息，请查看任意已修订文档中包含的修订历史记录。
11.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包括机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据发生变化时，我们可能不
会另行通知或修订此文档。如欲获取此产品说明书的浏览器版本，请参阅左侧的导航栏。
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21
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM1086-ADJ MDC
ACTIVE
DIESALE
Y
0
130
RoHS & Green
Call TI
Level-1-NA-UNLIM
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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