LF353PE4 [TI]
JFET-INPUT DUAL OPERATIONAL AMPLIFIER; JFET输入双通道运算放大器
| 型号： | LF353PE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | JFET-INPUT DUAL OPERATIONAL AMPLIFIER |
| 文件： | 总9页 (文件大小：525K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LF353
JFET-INPUT
DUAL OPERATIONAL AMPLIFIER
SLOS012B – MARCH 1987 – REVISED AUGUST 1994
D OR P PACKAGE
(TOP VIEW)
Low Input Bias Current . . . 50 pA Typ
Low Input Noise Current
0.01 pA/√Hz Typ
1OUT
1IN–
1IN+
1
2
3
4
8
7
6
5
V
CC+
Low Input Noise Voltage . . . 18 nV/√Hz Typ
2OUT
2IN–
2IN+
Low Supply Current . . . 3.6 mA Typ
V
12
CC–
High Input Impedance . . . 10 Ω Typ
Internally Trimmed Offset Voltage
Gain Bandwidth . . . 3 MHz Typ
High Slew Rate . . . 13 V/µs Typ
description
This device is a low-cost, high-speed, JFET-input operational amplifier with very low input offset voltage. It
requires low supply current yet maintains a large gain-bandwidth product and a fast slew rate. In addition, the
matched high-voltage JFET input provides very low input bias and offset currents.
The LF353 can be used in applications such as high-speed integrators, digital-to-analog converters,
sample-and-hold circuits, and many other circuits.
The LF353 is characterized for operation from 0°C to 70°C.
symbol (each amplifier
–
IN –
OUT
+
IN +
AVAILABLE OPTIONS
PACKAGE
V
IO
max
T
A
SMALL OUTLINE
(D)
PLASTIC DIP
(P)
AT 25°C
0°C to 70°C
10 mV
LF353D
LF353P
The D packages are available taped and reeled. Add the suffix R to the
device type (ie., LF353DR).
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
Supply voltage, V
Differential input voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 V
CC +
CC –
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V
ID
Input voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15 V
I
Duration of output short circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW
Operating temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
NOTE 1: Unless otherwise specified, the absolute maximum negative input voltage is equal to the negative power supply voltage.
Copyright 1994, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LF353
JFET-INPUT
DUAL OPERATIONAL AMPLIFIER
SLOS012B – MARCH 1987 – REVISED AUGUST 1994
recommended operating conditions
MIN
3.5
MAX
18
UNIT
V
Supply voltage, V
Supply voltage, V
CC +
CC –
–3.5
–18
V
electrical characteristics over operating free-air temperature range, V
otherwise specified)
= ±15 V (unless
CC±
†
PARAMETER
TEST CONDITIONS
T
A
MIN
TYP
MAX
10
UNIT
25°C
5
V
IO
Input offset voltage
V
V
V
= 0,
= 0,
= 0
R
R
= 10 kΩ
= 10 kΩ
mV
IC
IC
IC
S
S
Full range
13
Average temperature coefficient of input offset
voltage
α
10
25
µV/°C
VIO
25°C
70°C
25°C
70°C
100
4
pA
nA
pA
nA
‡
I
IO
Input offset current
50
200
8
‡
I
IB
V
IC
= 0
Input bias current
–12
to
15
V
V
Common-mode input voltage range
±11
V
ICR
Maximum peak output voltage swing
Large-signal differential voltage
Input resistance
R
= 10 kΩ
= ±10 V,
±12 ±13.5
V
OM
L
25°C
25
15
100
A
VD
V
O
R
= 2 kΩ
V/mV
L
Full range
12
10
r
i
T = 25°C
J
Ω
CMRR Common-mode rejection ratio
R
≤ 10 kΩ
70
70
100
100
3.6
dB
dB
mA
S
k
Supply-voltage rejection ratio
Supply current
See Note 2
SVR
I
6.5
CC
†
‡
Full range is 0°C to 70°C.
Input bias currents of a FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive. Pulse techniques
must be used that will maintain the junction temperatures as close to the ambient temperature as possible.
NOTE 2: Supply-voltage rejection ratio is measured for both supply magnitudes increasing or decreasing simultaneously.
operating characteristics, V
= ±15 V, T = 25°C
A
CC±
PARAMETER
Crosstalk attentuation
TEST CONDITIONS
f = 1 kHz
MIN
TYP
120
13
MAX
UNIT
dB
V
/V
O1 O2
SR
Slew rate
8
V/µs
B
Unity-gain bandwidth
3
MHz
1
n
V
Equivalent input noise voltage
Equivalent input noise current
f = 1 kHz,
f = 1 kHz
R
= 20 Ω
18
nV/√Hz
pA/√Hz
S
I
n
0.01
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
24-Oct-2006
PACKAGING INFORMATION
Orderable Device
LF353D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LF353DE4
LF353DG4
LF353DR
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
D
P
P
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LF353DRE4
LF353DRG4
LF353P
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
LF353PE4
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LF353DR
LF353DR
SOIC
SOIC
D
D
8
8
2500
2500
330.0
330.0
12.4
12.4
6.4
6.4
5.2
5.2
2.1
2.1
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LF353DR
LF353DR
SOIC
SOIC
D
D
8
8
2500
2500
367.0
340.5
367.0
338.1
35.0
20.6
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明