JM3851030102B2A [TI]

DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLIP-FLOPS WITH PRESET AND CLEAR; 双D型正边沿触发，触发器与预置和清除


型号：	JM3851030102B2A
厂家：	TEXAS INSTRUMENTS
描述：	DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLIP-FLOPS WITH PRESET AND CLEAR 双D型正边沿触发，触发器与预置和清除触发器
文件：	总21页 (文件大小：1263K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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SDLS119 − DECEMBER 1983 − REVISED MARCH 1988

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ꢠ ꢤ ꢡ ꢠꢙ ꢚꢭ ꢜꢛ ꢟ ꢧꢧ ꢥꢟ ꢝ ꢟ ꢞ ꢤ ꢠ ꢤ ꢝ ꢡ ꢈ

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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SDLS119 − DECEMBER 1983 − REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SDLS119 − DECEMBER 1983 − REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SDLS119 − DECEMBER 1983 − REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SDLS119 − DECEMBER 1983 − REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ

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ꢄ

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ꢅ

ꢀ

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SDLS119 − DECEMBER 1983 − REVISED MARCH 1988

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package Qty

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Top-Side Markings

Samples

Drawing

(1)

(2)

(3)

(4)

JM38510/00205BCA

JM38510/00205BDA

JM38510/07101BCA

OBSOLETE

ACTIVE

CDIP

CFP

TBD

Call TI

A42

Call TI

-55 to 125

CDIP

N / A for Pkg Type

-55 to 125 JM38510/

07101BCA

JM38510/07101BDA

JM38510/30102B2A

JM38510/30102BCA

JM38510/30102BDA

JM38510/30102SCA

JM38510/30102SDA

M38510/07101BCA

M38510/07101BDA

M38510/30102B2A

M38510/30102BCA

M38510/30102BDA

M38510/30102SCA

M38510/30102SDA

ACTIVE

CFP

LCCC

CDIP

CFP

TBD

A42

POST-PLATE

A42

N / A for Pkg Type

-55 to 125 JM38510/

07101BDA

-55 to 125 JM38510/

30102B2A

-55 to 125 JM38510/

30102BCA

A42

-55 to 125 JM38510/

30102BDA

CDIP

CFP

A42

-55 to 125 JM38510/30102S

A42

-55 to 125 JM38510/30102S

CDIP

CFP

A42

-55 to 125 JM38510/

07101BCA

A42

-55 to 125 JM38510/

07101BDA

LCCC

CDIP

CFP

POST-PLATE

A42

-55 to 125 JM38510/

30102B2A

-55 to 125 JM38510/

30102BCA

A42

-55 to 125 JM38510/

30102BDA

CDIP

CFP

A42

-55 to 125 JM38510/30102S

A42

-55 to 125 JM38510/30102S

SN5474J

OBSOLETE

ACTIVE

CDIP

TBD

Call TI

A42

Call TI

-55 to 125

SN54LS74AJ

N / A for Pkg Type

-55 to 125 SN54LS74AJ

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

Orderable Device

Status Package Type Package Pins Package Qty

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Top-Side Markings

Samples

Drawing

(1)

(2)

(3)

(4)

SN54S74J

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125 SN54S74J

SN7474DR

SN7474N

OBSOLETE

ACTIVE

SOIC

PDIP

SOIC

TBD

Call TI

0 to 70

SN7474N3

SN74LS74AD

Call TI

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

LS74A

SN74LS74ADBR

SN74LS74ADBRE4

SN74LS74ADBRG4

SN74LS74ADE4

SN74LS74ADG4

SN74LS74ADR

ACTIVE

SSOP

SOIC

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

2500

Green (RoHS

& no Sb/Br)

SN74LS74ADRE4

SN74LS74ADRG4

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

SN74LS74AJ

SN74LS74AN

OBSOLETE

ACTIVE

CDIP

PDIP

TBD

Call TI

0 to 70

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74LS74AN

SN74LS74AN3

SN74LS74ANE4

OBSOLETE

ACTIVE

PDIP

TBD

Call TI

0 to 70

2000

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74LS74AN

74LS74A

S74

SN74LS74ANSR

SN74LS74ANSRG4

SN74S74D

ACTIVE

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

Green (RoHS

& no Sb/Br)

SOIC

Green (RoHS

& no Sb/Br)

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

Orderable Device

Status Package Type Package Pins Package Qty

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Top-Side Markings

Samples

Drawing

(1)

(2)

(3)

(4)

SN74S74DE4

SN74S74DG4

SN74S74N

ACTIVE

SOIC

PDIP

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

N / A for Pkg Type

0 to 70 S74

Green (RoHS

& no Sb/Br)

0 to 70

S74

Pb-Free

(RoHS)

0 to 70

SN74S74N

SN74S74N3

OBSOLETE

ACTIVE

PDIP

TBD

Call TI

0 to 70

SN74S74NE4

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74S74N

74S74

SN74S74NSR

SN74S74NSRE4

SN74S74NSRG4

ACTIVE

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

Green (RoHS

& no Sb/Br)

74S74

Green (RoHS

& no Sb/Br)

74S74

SNJ5474J

SNJ5474W

OBSOLETE

ACTIVE

CDIP

CFP

TBD

Call TI

-55 to 125

SNJ54LS74AFK

LCCC

POST-PLATE

N / A for Pkg Type

-55 to 125 SNJ54LS

74AFK

SNJ54LS74AJ

SNJ54LS74AW

SNJ54S74FK

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125 SNJ54LS74AJ

-55 to 125 SNJ54LS74AW

LCCC

POST-PLATE

-55 to 125 SNJ54S

74FK

SNJ54S74J

SNJ54S74W

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125 SNJ54S74J

-55 to 125 SNJ54S74W

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾Only one of markings shown within the brackets will appear on the physical device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN5474, SN54LS74A, SN54LS74A-SP, SN54S74, SN7474, SN74LS74A, SN74S74 :

Catalog: SN7474, SN74LS74A, SN54LS74A, SN74S74

•

Military: SN5474, SN54LS74A, SN54S74

•

Space: SN54LS74A-SP

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Military - QML certified for Military and Defense Applications

•

Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

•

Addendum-Page 4

PACKAGE MATERIALS INFORMATION

www.ti.com

8-Apr-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

SN74LS74ADBR

SN74LS74ADR

SN74S74NSR

SSOP

SOIC

2000

2500

2000

330.0

16.4

8.2

6.5

8.2

6.6

9.0

2.5

2.1

2.5

12.0

8.0

16.0

10.5

12.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

8-Apr-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

SN74LS74ADBR

SN74LS74ADR

SN74S74NSR

SSOP

SOIC

2000

2500

2000

367.0

38.0

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38

0,22

0,65

0,15

0,25

0,09

5,60

5,00

8,20

7,40

Gage Plane

0,25

0°–ā8°

0,95

0,55

Seating Plane

0,10

2,00 MAX

0,05 MIN

PINS **

DIM

6,50

5,90

6,50

5,90

7,50

8,50

7,90

10,50

9,90

10,50 12,90

A MAX

A MIN

6,90

9,90

12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

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相关型号：

JM3851030102BCA

JM3851030102BDA

JM3851030102SCA

JM3851030102SDA

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JM3851030106BEA

JM3851030106BFA

JM3851030107B2A

JM3851030107BEA

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