F931A476MAA [TI]

BOOSTXL-SENSHUB Sensor Hub BoosterPack; BOOSTXL - SENSHUB传感器集线器BoosterPack
F931A476MAA
型号: F931A476MAA
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

BOOSTXL-SENSHUB Sensor Hub BoosterPack
BOOSTXL - SENSHUB传感器集线器BoosterPack

传感器
文件: 总14页 (文件大小:394K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
User Manual  
SPMU290April 2013  
BOOSTXL-SENSHUB Sensor Hub BoosterPack  
The Sensor Hub Booster Pack (BOOSTXL-SENSHUB) is a low-cost extension board for the Tiva™ C  
®
Series TM4C LaunchPad EK-TM4C123GXL evaluation platform for ARM Cortex™-M4F-based  
microcontrollers (MCUs). This extension board, or BoosterPack, is specifically designed to expand the  
functionality of the Tiva TM4C LaunchPad. This user’s manual provides an overview of the Sensor Hub  
BoosterPack software and hardware  
Figure 1 shows a photo of the BOOST-XL-SENSHUB.  
Figure 1. BOOSTXL-SENSHUB BoosterPack Extension Board  
TPS75118  
Voltage Regulator  
RF Expansion  
Connections  
BMP180  
Pressure Sensor  
RF Expansion  
Connections  
User  
LED  
1.6 in  
MPU9150  
9-axis Motion Sensor  
SHT21  
Humidity Sensor  
ISL29023  
Light Sensor  
User  
Button  
TMP006  
Temp Sensor  
User  
Button  
2.0 in  
Contents  
1
2
3
4
Board Overview ............................................................................................................. 2  
Hardware Description ...................................................................................................... 3  
Software Development ..................................................................................................... 5  
References, PCB Layout, and Bill of Materials ......................................................................... 6  
Tiva, Code Composer Studio are trademarks of Texas Instruments.  
TivaWare, Stellaris are registered trademarks of Texas Instruments.  
Cortex, Keil are trademarks of ARM Limited.  
ARM, RealView are registered trademarks of ARM Limited.  
Microsoft, Windows are registered trademarks of Microsoft Corp.  
All other trademarks are the property of their respective owners.  
1
SPMU290April 2013  
BOOSTXL-SENSHUB Sensor Hub BoosterPack  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
 
Board Overview  
www.ti.com  
1
Board Overview  
The Sensor Hub BoosterPack is an extension board for the TI MCU LaunchPad evaluation module eco-  
system. It was designed specifically to extend the functionality of the Tiva TM4C1233 LaunchPad (EK-  
TM4C123GXL). The Sensor Hub enables customers to create and model innovative prototype solutions  
that leverage the processing and floating-point capabilities of the TM4C123GH6PM MCU coupled with  
motion and environmental sensors. The Sensor Hub BoosterPack plugs in to the BoosterPack XL headers  
located on the top of the LaunchPad. The BoosterPack also features a TI-standard extension module  
(EM) connector to further extend customer applications through a variety of wireless extension modules.  
®
This board and the available software also highlight the use of the new TivaWare SensorLib sensor  
driver library, an easy-to-use, extendable foundation of sensor communication software.  
NOTE: The Sensor Hub BoosterPack is fully compatible with both the Tiva™ C Series LaunchPad  
®
(EK-TM4C123GXL) and the Stellaris LM4F120 LaunchPad (EK-LM4F120XL).  
1.1 Kit Features  
The BOOSTXL-SENSHUB BoosterPack offers the following features:  
TMP006 infrared object temperature sensor  
9-axis InvenSense MPU9150 motion sensor:  
3-axis acceleration  
3-axis gyroscope  
3-axis magnetometer  
Bosch BMP180 pressure sensor  
Intersil ISL29023 ambient and infrared light sensor  
Sensirion SHT21 humidity sensor  
Two user pushbuttons  
One user LED  
One power LED  
EM connector for additional wireless expansion  
1.2 Using the Sensor Hub BoosterPack  
Follow these recommended steps to quickly configure your Sensor Hub for proper operation.  
Step 1. Review the BOOSTXL-SENSHUB BoosterPack Getting Started Guide (literature number  
SPMU295, available for download at www.ti.com). This document guides you through  
downloading, installing, and running the associated TivaWare examples that demonstrate the  
Sensor Hub capabilities and functions.  
Step 2. Examine the additional examples that are provided with the downloaded software to  
understand the capabilities and limitations of each on-board sensor.  
Step 3. Create your own application using the Tiva C Series LaunchPad and Sensor Hub  
BoosterPack. Use the TivaWare for C Series Sensor Library to enable your innovative Tiva  
TM4C MCU applications.  
Step 4. Customize and integrate the hardware to suit a specific end application. This user’s manual is  
an important reference for understanding circuit operation and completing hardware  
modifications.  
2
BOOSTXL-SENSHUB Sensor Hub BoosterPack  
SPMU290April 2013  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
www.ti.com  
Hardware Description  
1.3 Specifications  
Table 1 summarizes the specifications for the BOOSTXL-SENSHUB BoosterPack.  
Table 1. Sensor Hub BoosterPack Specifications  
Parameter  
Value  
Board supply voltage  
2.7 V to 5.5 V nominally supplied  
as 3.3 V from the BoosterPack  
interface  
Dimensions  
RoHS status  
2.0 x 1.5 x 0.625 (in)  
5.08 x 3.81 x 1.587 (cm)  
Compliant  
2
Hardware Description  
The Sensor Hub BoosterPack includes five motion and environmental sensors. It also enables RF  
expansion and access to user LEDs and buttons. The hardware is designed to enable innovative  
applications that fuse sensor information and Tiva C Series software processing through the functionality  
of the Tiva C Series LaunchPad.  
Figure 2 shows a block diagram of the Sensor Hub BoosterPack.  
Figure 2. BOOSTXL-SENSHUB BoosterPack Block Diagram  
User  
Buttons  
BoosterPack XL  
Connectors  
LED  
3.3 V  
TPS75118  
MPU9150  
3.3 V  
1.8 V  
BMP180  
SHT21  
RF Expansion  
ISL29023  
TMP006  
BOOSTXL-SENSHUB  
3
SPMU290April 2013  
BOOSTXL-SENSHUB Sensor Hub BoosterPack  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
 
 
Hardware Description  
www.ti.com  
2.1 Functional Description  
This section provides a functional description of the Sensor Hub BoosterPack.  
2.1.1  
BoosterPack XL Connector  
The BoosterPack XL connector attaches the BoosterPack to the Tiva TM4C LaunchPad. This  
BoosterPack is specifically designed to match the pin function with the Tiva TM4C LaunchPad. Basic I2C  
and UART communication to the sensors and RF expansion connectors are also available when the  
Sensor Hub is connected to either the C2000 or MSP430 LaunchPad.  
Table 2 describes the BoosterPack XL interface connections and the respective uses on the Sensor Hub  
BoosterPack. It also shows which pins remain available for additional expansion at the user's discretion.  
Table 2. BoosterPack XL Interface Connections(1)  
Pin  
J1.1  
J1.2  
J1.3  
J1.4  
J1.5  
J1.6  
J1.7  
J1.8  
J1.9  
J1.10  
Function  
Pin  
J2.1  
J2.2  
J2.3  
J2.4  
J2.5  
J2.6  
J2.7  
J2.8  
J2.9  
J2.10  
Function  
Ground  
Pin  
J3.1  
J3.2  
J3.3  
J3.4  
J3.5  
J3.6  
J3.7  
J3.8  
J3.9  
J3.10  
Function  
Pin  
J4.1  
J4.2  
J4.3  
J4.4  
J4.5  
J4.6  
J4.7  
J4.8  
J4.9  
J4.10  
Function  
3.3 V IN  
Interrupt  
Interrupt  
UART RX  
UART TX  
RF GPIO  
UART RTS  
UART CTS  
RF Shutdown  
RF Reset  
USER LED  
User Button  
User Button  
RF GPIO  
Interrupt  
Sensor I2C  
Sensor I2C  
SSI RX  
SSI TX  
RF I2C  
RF I2C  
RF GPIO  
SSI SS  
RF GPIO  
SSI CLK  
(1)  
Shaded cells indicate unused pins that are available for additional expansion.  
2.1.2  
2.1.3  
2.1.4  
TMP006 Temperature Sensor  
The TMP006 provides both direct and indirect temperature measurements. It contains an on-chip  
temperature sensor to directly measure ambient temperature conditions. It also allows contactless infrared  
object temperature measurement.  
InvenSense MPU9150 9-Axis Motion Sensor  
The MPU9150 is a 3-axis accelerometer, 3-axis gyroscope, and 3-axis magnetometer in a single package.  
This device is the primary motion sensor on the Sensor Hub. It is used by the demonstration software as  
the raw motion inputs, which are fused by a direct cosine matrix into roll, pitch, and yaw measurements.  
Intersil ISL29023 Ambient and Infrared Light Sensor  
The ISL29023 provides sensor measurements of light conditions across both the ambient (human-visible)  
spectrum and the infrared spectrum.  
2.1.5  
2.1.6  
Sensirion SHT21 Humidity Sensor  
The SHT21 provides relative humidity measurements.  
Bosch BMP180 Barometric Pressure Sensor  
The BMP180 measures barometric pressure conditions. It can be used to enhance the motion sensor by  
determining relative changes in altitude.  
2.1.7  
Low-Power RF Expansion Connection  
The RF expansion connection provides a wide array of options to the end application.  
4
BOOSTXL-SENSHUB Sensor Hub BoosterPack  
SPMU290April 2013  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
 
www.ti.com  
Software Development  
2.1.8  
TPS75118 Voltage Regulator  
The TPS75118 regulates the 3.3-V supply from the LaunchPad down to 1.8 V for the input to the RF  
expansion connector.  
3
Software Development  
This section provides general information on software development as well as instructions for Flash  
memory programming. Note: This information presumes that the Sensor Hub BoosterPack is connected to  
a Tiva TM4C1233 LaunchPad.  
3.1 Software Description  
The TivaWare software provided with the Tiva C Series LaunchPad includes functional drivers for all of  
the peripheral devices supplied in the design. The TivaWare for C Series Peripheral Driver Library is used  
to configure and operate the on-chip peripherals as part of TivaWare.  
The TivaWare package includes a set of example applications that use the TivaWare Peripheral Driver  
Library. These applications demonstrate the capabilities of the TM4C1233H6 microcontroller, as well as  
provide a starting point for the user to develop the final application for use on the Tiva C Series  
LaunchPad evaluation board and the BOOSTXL-SENSHUB BoosterPack.  
3.2 Source Code  
The complete source code, including the source code installation instructions, are available at  
www.ti.com/tool/boostxl-senshub. The source code and binary files are installed in the TivaWare for C  
Series Peripheral Driver Library tree.  
3.3 Tool Options  
The source code installation includes directories that contain projects and/or makefiles for the following  
tool chains:  
®
Keil™ ARM RealView Microcontroller Development System  
IAR Embedded Workbench for ARM  
Sourcery CodeBench  
Texas Instruments' Code Composer Studio™ IDE  
Download evaluation versions of these tools from www.ti.com/tiva-c. As a result of code size restrictions,  
the evaluation tools may not build all example programs. A full license is necessary to rebuild or debug all  
examples.  
Instructions on installing and using each of the evaluation tools can be found in the Quickstart guides (for  
example, Quickstart-Keil, Quickstart-IAR), which are available for download from the Evaluation Kit section  
of our website at www.ti.com/tiva-c.  
For detailed information on using each tool, see the documentation included with the respective tool chain  
installation or visit the website of the respective tool supplier.  
3.4 Programming the Tiva TM4C LaunchPad Evaluation Board  
The Tiva TM4C LaunchPad software package includes pre-built binaries for each of the example  
applications. If you installed TivaWare for C Series to the default installation path of  
C:\ti\TivaWare_C_Series_<version>, you can find these example applications in  
C:\ti\TivaWare_C_Series_<version>/examples\boards\ek-tm4c123gxl. The onboard ICDI is used with the  
LM Flash Programmer tool to program applications on the Tiva C Series LaunchPad.  
Follow these steps to program example applications into the Tiva C Series LaunchPad evaluation board  
using the ICDI:  
®
®
1. Install the LM Flash Programmer on a PC running Microsoft Windows XP, Windows 7, or later  
Windows OS.  
2. Switch the POWER SELECT switch to the right to use Debug mode.  
5
SPMU290April 2013  
Submit Documentation Feedback  
BOOSTXL-SENSHUB Sensor Hub BoosterPack  
Copyright © 2013, Texas Instruments Incorporated  
References, PCB Layout, and Bill of Materials  
www.ti.com  
3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB  
port on the board.  
4. Verify that the POWER LED D4 on the board is lit.  
5. Run the LM Flash Programmer program.  
6. In the Configuration tab, use the Quick Set control to select the Tiva C Series LaunchPad evaluation  
board.  
7. Move to the Program tab and click the Browse button. Navigate to the example applications directory  
(the default location is C:\ti\TivaWare_C_Series_<version>/examples\boards\ek-tm4c123gxl-senshub\).  
8. Each example application has its own directory. Navigate to the example directory that you want to  
load, then navigate to the directory that contains the binary (*.bin) files. Select the desired binary file  
and click Open.  
9. Set the Erase Method to Erase Necessary Pages. Check the Verify After Program box, and check  
the Reset MCU After Program option.  
10. Click the Program button to start the Erase, Download, and Verify process. Program execution starts  
once the Verify process is complete.  
4
References, PCB Layout, and Bill of Materials  
Complete schematics for the Sensor Hub BoosterPack are appended to this user's guide.  
4.1 References  
In addition to this document, the following references are available for download at www.ti.com:  
BOOSTXL-SENSHUB BoosterPack Getting Started Guide (literature number SPMU295)  
Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376).  
TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl.  
TivaWare for C Series Driver Library User’s Manual (literature number SPMU298).  
TPS75118 Fast Transient Response, 1.5-A, Low-Dropout Regulator Data Sheet (literature number  
SLVS241)  
TMP006 Infrared Thermopile Sensor Data Sheet (literature number SBOS518)  
Texas Instruments’ Code Composer Studio IDE website: www.ti.com/ccs  
Additional support:  
RealView MDK (www.keil.com/arm/rvmdkkit.asp)  
IAR Embedded Workbench (www.iar.com)  
Sourcery CodeBench development tools (www.codesourcery.com/gnu_toolchains/arm)  
InvenSense MPU9150 (www.invensense.com/mems/gyro/mpu9150.html)  
Intersil ISL29023 (www.intersil.com/en/products/optoelectronics/ambient-light-sensors/light-to-digital-  
sensors/ISL29023.html)  
Bosch BMP180 (www.bosch-  
sensortec.com/homepage/products_3/environmental_sensors_1/bmp180_1/bmp180)  
Sensirion SHT21 (www.sensirion.com/en/products/humidity-temperature/humidity-sensor-sht21)  
6
BOOSTXL-SENSHUB Sensor Hub BoosterPack  
SPMU290April 2013  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
www.ti.com  
References, PCB Layout, and Bill of Materials  
4.2 Bill of Materials (BOM)  
Table 3 shows the bill of materials for the BOOSTXL-SENSHUB BoosterPack board.  
Table 3. BOOSTXL-SENSHUB Bill of Materials(1)(2)(3)  
Item  
Ref Des  
Qty  
Value  
Description  
Manufacturer  
Bosch  
Manufacturer Part No  
BMP180  
IC, digital, barometric pressure  
sensor  
1
U2  
1
BMP180  
C1-2, C8-9, C11,  
C13, C15-16  
Capacitor, ceramic, NPO or C0G or  
X5R, 10 V or higher, 0805(4)  
2
3
4
5
6
8
2
1
1
4
100 nF  
100 nF  
10 nF  
2.2 nF  
1 μF  
Murata  
GRM21BR71E104KA01L  
GRM21BR71E104KA01L  
GRM216R71H103KA01D  
C0805C222K5RACTU  
TAJA105M020RNJ  
Capacitor, ceramic, X7R, ±10%,  
10 V or higher, 0805(4)  
C4, C6  
C5  
Murata  
Capacitor, ceramic, X7R, ±10%,  
10 V or higher, 0805(4)  
Murata  
Capacitor, ceramic, X7R, ±10%,  
50 V or higher, 0805(4)  
C3  
Kemet  
C7, C10, C12,  
C14  
Capacitor, tantalum, 10 V or higher,  
Type A  
AVX Corp.  
Nichicon  
Capacitor, tantalum, 10 V or higher,  
Type A  
7
8
C17  
Y1  
1
0
1
1
4
47 μF  
32.768 kHz  
Red  
F931A476MAA  
Do not populate  
BR1112H-TR  
Clock oscillator, 2.5 x 3.2 mm  
Do not populate  
Light emitting diode, 1.7 V forward  
voltage or less, 0805  
D1  
Stanley  
9
D2  
Yellow  
Light emitting diode, 0805  
Knightbright  
Sullins  
APT2012YC  
Header, female, 10-pin, 100-mil  
spacing, 0.100 inch x 10  
10  
J1-4  
PEC10SAAN  
PPTC101LFBN-RC  
TFM-110-02-  
SM-D-A-K-TR  
Header, SMT 10x2 pin, shrouded,  
0.225 x 0.625 inch  
11  
12  
13  
14  
15  
16  
17  
18  
RF_PART1-2  
2
1
1
4
0
1
1
2
1
Samtec  
Intersil  
TFM-110-02-SM-D-A-K-TR  
ISL29023  
IC, integrated digital light sensor with  
interrupt  
U4  
ISL29023  
MPU-9150  
10 kΩ  
IC, nine-axis MEMS motion tracking  
device  
U3  
InvenSense  
Yageo  
MPU-9150  
Surface mount resistor, 1/10 W or  
higher, 0805  
R1, R4, R9-10  
RC0805JR-0710KL  
Do not populate  
Surface mount resistor, 1/10 W or  
higher, 0805  
R2  
10 kΩ  
Do not populate  
Surface mount resistor, 1/10 W or  
higher, 0805  
R6  
5.1 Ω  
Yageo  
Yageo  
Yageo  
Yageo  
Yageo  
RC0805JR-075R1L  
RC0805JR-07100RL  
RC0805JR-070RL  
RC0805FR-07499KL  
Surface mount resistor, 1/10 W or  
higher, 0805  
R7  
100 Ω  
Surface mount resistor, 1/10 W or  
higher, 0805  
R5, R8  
R3  
0 Ω  
Surface mount resistor, 1/10 W or  
higher, 0805  
499 kΩ  
Surface mount resistor, 1/10 W or  
higher, 0805  
19  
20  
21  
22  
23  
R11-12  
U5  
2
1
2
1
1
3.3 kΩ  
SHT21  
7914G  
RC0805JR-073K3L  
SHT21  
IC, humidity and temperature sensor Sensirion AG  
Switch, 1P1T, PB momentary,  
Bourns  
S1-2  
U1  
7914G  
100 mA, SM, 0.19 x 0.18 inch  
TMP006AIYZFT IC, infrared thermopile sensor  
Texas Instruments  
Texas Instruments  
TMP006YZF  
TPS75118QPWP  
TPS75118Q  
PWP  
IC, low dropout voltage regulator,  
1.8 V, 1.5 A  
U6  
(1)  
(2)  
(3)  
(4)  
These assemblies are ESD sensitive. ESD precautions shall be observed.  
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.  
These assemblies must comply with workmanship standards IPC-A-610 Class 2.  
A dielectric with a higher thermal range and/or lower capacitance variation is also permitted (for example, X7R, X9R).  
7
SPMU290April 2013  
BOOSTXL-SENSHUB Sensor Hub BoosterPack  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
 
A
B
C
D
Temperature Sensor  
U1  
Pressure Sensor  
TMP006  
1
2
3
4
1
2
3
4
A1  
B1  
C1  
C3  
B3  
I2C_SDA  
I2C_SCL  
U2  
DGND  
ADR1  
ADR0  
AGND  
SDA  
SCL  
V+  
3.3V  
BMP180  
1
2
6
5
4
9-Axis Motion Sensor  
I2C_SDA  
I2C_SCL  
CSB  
SDA  
SCK  
SDO  
A3  
C2  
3.3V  
ANALOG_PWR  
C1  
U3  
VDD  
A2  
ANALOG_GND  
100nF  
DRDY  
MPU-9150  
3
VDDIO  
R1  
10k  
7
INT_TEMP  
3.3V  
C2  
100nF  
C3  
2.2nF  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
CLKIN  
NC  
GND  
GND  
NC  
3.3V  
VDD  
NC  
GND  
NC  
NC  
3.3V  
RESV  
VDD  
C4  
100nF  
R2  
10k  
(Do Not  
Populate)  
C5  
10nF  
Light Sensor  
U4  
C6  
100nF  
Humidity & Temp. Sensor  
ISL29023  
U5  
SHT21  
3.3V  
1
2
3
6
5
4
I2C_SDA  
VDD  
SDA  
SCL  
INT  
1
2
3
6
5
4
I2C_SCL  
INT_LT  
I2C_SDA  
I2C_SCL  
3.3V  
GND  
SDA  
VSS  
NC  
SCL  
VDD  
NC  
+
C7  
1uF  
R-EXT  
C8  
100nF  
R3  
499k  
C9  
100nF  
R4  
10k  
7
7
3.3V  
Texas Instruments  
Sensor Hub Booster Pack  
Title  
Size  
Number  
Rev  
1
A
AR  
B
Date  
2/20/2013  
Drawn by  
Sheet  
Aneesh Rai  
1
2
of  
Engineer  
Sensor_Hub_Booster_Pack Rev A.sch  
Filename  
B
A
C
D
2/20/2013  
A
B
C
D
RF Headers  
LaunchPad Headers  
RF_PART1  
RF_PART2  
J1  
J2  
1
3
2
1
3
2
3.3V  
1
2
1
2
3
4
5
6
7
8
9
10  
1
2
3
4
1
2
3
4
4
4
U1RTS  
32.768_CLK  
U1TX  
1.8V  
INT_MOTION  
INT_TEMP  
5
6
5
6
U1RX  
U1TX  
3
7
8
7
8
3.3V  
4
9
10  
12  
14  
16  
18  
20  
9
10  
12  
14  
16  
18  
20  
U1RX  
RF_GPIO0  
5
11  
13  
15  
17  
19  
11  
13  
15  
17  
19  
RF_I2C_SDA  
RF_I2C_SCL  
RF_GPIO1  
SSI0FSS  
SSI0CLK  
SSI0TX  
INT_LT  
6
I2C_SDA  
I2C_SCL  
SSI0RX  
RF_GPIO2  
RF_RST  
7
SSI0TX  
RF_I2C_SCL  
RF_I2C_SDA  
8
U1CTS  
9
SSI0FSS  
SSI0CLK  
SSI0RX  
RF_SHUTDN  
RF_GPIO3  
10  
Power Indicator LED  
General Purpose LED  
J3  
J4  
1
2
1
2
3
4
5
6
7
8
9
10  
3
RF_GPIO0  
U1RTS  
ANALOG_PWR  
ANALOG_GND  
4
+
+
R5  
0
C10  
1uF  
C12  
1uF  
LED_GPIO  
PUSH_BUT_GPIO0  
PUSH_BUT_GPIO1  
RF_GPIO1  
5
U1CTS  
C11  
100nF  
C13  
100nF  
R6  
5.1  
R7  
100  
6
RF_SHUTDN  
RF_RST  
7
R8  
0
8
RF_GPIO3  
RF_GPIO2  
9
10  
Regulator  
U6  
TPS75118  
General Purpose  
Push Buttons  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
GND/HTSK GND/HTSK  
2
3
4
NC  
NC  
NC  
3.3V  
IN  
+
R9  
10k  
R10  
10k  
C14  
1uF  
IN  
GND  
NC  
S1  
S2  
5
EN  
6
7
Oscillator  
I2C_SDA  
I2C_SCL  
PUSH_BUT_GPIO0  
PUSH_BUT_GPIO1  
PG  
NC  
PG_1.8V  
R11  
3.3k  
Y1  
FB/SEN  
OUTPUT  
OUTPUT  
NC  
CRYSTAL_ECS-327KE  
3.3V  
C15  
100nF  
C16  
100nF  
4
8
NC  
1
3
1.8V  
9
32.768_CLK  
NC  
+
R12  
3.3k  
C17  
47uF  
10  
GND/HTSK GND/HTSK  
PWRPAD  
2
Size  
Number  
Rev  
Texas Instruments  
1
A
B
Date  
Drawn by  
Sheet  
2/20/2013  
Sensor_Hub_Booster_Pack Rev A.sch  
Filename  
of  
Engineer  
Aneesh Rai  
2
2
B
A
C
D
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS  
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:  
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims  
arising from the handling or use of the goods.  
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from  
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO  
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF  
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH  
ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL  
DAMAGES.  
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This  
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety  
programs, please visit www.ti.com/esh or contact TI.  
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or  
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and  
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,  
software performance, or infringement of patents or services described herein.  
REGULATORY COMPLIANCE INFORMATION  
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal  
Communications Commission (FCC) and Industry Canada (IC) rules.  
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,  
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer  
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing  
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency  
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will  
be required to take whatever measures may be required to correct this interference.  
General Statement for EVMs including a radio  
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and  
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local  
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this  
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and  
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory  
authorities, which is responsibility of user including its acceptable authorization.  
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant  
Caution  
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause  
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.  
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the  
equipment.  
FCC Interference Statement for Class A EVM devices  
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.  
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial  
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the  
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to  
cause harmful interference in which case the user will be required to correct the interference at his own expense.  
FCC Interference Statement for Class B EVM devices  
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.  
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment  
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause  
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If  
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and  
on, the user is encouraged to try to correct the interference by one or more of the following measures:  
Reorient or relocate the receiving antenna.  
Increase the separation between the equipment and receiver.  
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  
Consult the dealer or an experienced radio/TV technician for help.  
For EVMs annotated as IC – INDUSTRY CANADA Compliant  
This Class A or B digital apparatus complies with Canadian ICES-003.  
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the  
equipment.  
Concerning EVMs including radio transmitters  
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this  
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired  
operation of the device.  
Concerning EVMs including detachable antennas  
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain  
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should  
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.  
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum  
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain  
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.  
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.  
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de  
l'utilisateur pour actionner l'équipement.  
Concernant les EVMs avec appareils radio  
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est  
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout  
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.  
Concernant les EVMs avec antennes détachables  
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain  
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à  
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente  
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.  
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel  
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans  
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
Important Notice for Users of this Product in Japan】  
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan  
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:  
1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and  
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of  
Japan,  
2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this  
product, or  
3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with  
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note  
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.  
Texas Instruments Japan Limited  
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan  
http://www.tij.co.jp  
【ご使用にあたっての注】  
本開発キットは技術基準適合証明を受けておりません。  
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。  
1. 電波法施行規則第6条第1項第1号に基づく平成18328日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。  
2. 実験局の免許を取得後ご使用いただく。  
3. 技術基準適合証明を取得後ご使用いただく。  
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。  
ꢀꢀꢀ上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。  
日本テキサス・インスツルメンツ株式会社  
東京都新宿区西新宿6丁目24番1号  
西新宿三井ビル  
http://www.tij.co.jp  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
SPACER  
EVALUATION BOARD/KIT/MODULE (EVM)  
WARNINGS, RESTRICTIONS AND DISCLAIMERS  
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished  
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in  
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks  
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end  
product.  
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:  
1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug  
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,  
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.  
2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable  
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,  
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)  
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to  
minimize the risk of electrical shock hazard.  
3. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even  
if the EVM should fail to perform as described or expected.  
4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.  
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the  
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and  
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact  
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the  
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or  
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the  
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures  
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include  
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the  
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please  
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable  
in electronic measurement and diagnostics normally found in development environments should use these EVMs.  
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives  
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in  
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims  
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.  
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such  
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices  
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate  
Assurance and Indemnity Agreement.  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

相关型号:

F931A476MBA

SOLID TANTALUM ELECTROLYTIC CAPACITORS
NICHICON

F931A476MBA

Tantalum Capacitor, Polarized, Tantalum (dry/solid), 10V, 20% +Tol, 20% -Tol, 47uF, Surface Mount, 1411, CHIP, ROHS COMPLIANT
KYOCERA AVX

F931A476MBAAJ6

Resin-Molded Chip - Automotive Product Range
KYOCERA AVX

F931A476MBE

Tantalum Capacitor, Polarized, Tantalum, 10V, 20% +Tol, 20% -Tol, 47uF, 1411
KYOCERA AVX

F931A476MCC

SOLID TANTALUM ELECTROLYTIC CAPACITORS
NICHICON

F931A476MCC

Tantalum Capacitor, Polarized, Tantalum (dry/solid), 10V, 20% +Tol, 20% -Tol, 47uF, Surface Mount, 2312, CHIP, ROHS COMPLIANT
KYOCERA AVX

F931A476MCCAJ6

Resin-Molded Chip - Automotive Product Range
KYOCERA AVX

F931A476MCG

Tantalum Capacitor, Polarized, Tantalum (dry/solid), 10V, 20% +Tol, 20% -Tol, 47uF, Surface Mount, 2312, CHIP
KYOCERA AVX

F931A476MCG

暂无描述
NICHICON

F931A476MNC

CAPACITOR, TANTALUM, SOLID, POLARIZED, 10 V, 47 uF, SURFACE MOUNT, CHIP
NICHICON

F931A476MNC

Tantalum Capacitor, Polarized, Tantalum (dry/solid), 10V, 20% +Tol, 20% -Tol, 47uF, Surface Mount, CHIP
KYOCERA AVX

F931A476MVC

CAPACITOR, TANTALUM, SOLID, POLARIZED, 10V, 47uF, SURFACE MOUNT, CHIP
KYOCERA AVX