DS8921AM-NOPB [TI]
DS8921/DS8921A/DS8921AT Differential Line Driver and Receiver Pair; DS8921 / DS8921A / DS8921AT差分线路驱动器和接收器对
| 型号： | DS8921AM-NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DS8921/DS8921A/DS8921AT Differential Line Driver and Receiver Pair |
| 文件： | 总15页 (文件大小：938K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS8921, DS8921A, DS8921AT
www.ti.com
SNLS374C –MAY 1998–REVISED APRIL 2013
DS8921/DS8921A/DS8921AT Differential Line Driver and Receiver Pair
Check for Samples: DS8921, DS8921A, DS8921AT
1
FEATURES
DESCRIPTION
The DS8921, DS8921A are Differential Line Driver
2
•
•
•
12 ns Typical Propagation Delay
Output Skew - 0.5 ns Typical
and Receiver pairs designed specifically for
applications meeting the ST506, ST412 and ESDI
Disk Drive Standards. In addition, these devices meet
the requirements of the EIA Standard RS-422.
Meet the Requirements of EIA Standard RS-
422
•
•
Complementary Driver Outputs
The DS8921, DS8921A receivers offer an input
sensitivity of 200 mV over a ±7V common mode
operating range. Hysteresis is incorporated (typically
70 mV) to improve noise margin for slowly changing
input waveforms.
High Differential or Common-Mode Input
Voltage Ranges of ±7V
•
±0.2V Receiver Sensitivity over the Input
Voltage Range
The DS8921, DS8921A drivers are designed to
provide unipolar differential drive to twisted pair or
parallel wire transmission lines. Complementary
outputs are logically ANDed and provide an output
skew of 0.5 ns (typ.) with propagation delays of
12 ns.
•
•
Receiver Input Hysteresis-70 mV Typical
DS8921AT Industrial Temperature Operation:
(−40°C to +85°C)
The DS8921, DS8921A are designed to be
compatible with TTL and CMOS.
Connection Diagram
DS8921/DS8921A/DS8921AT
See Package Number D (R-PDSO-G8) or P (R-PDIP-T8)
Truth Table
Receiver
Driver
Input
VOUT
Input
VOUT
VOUT
V
ID ≥ VTH (MAX)
ID ≤ VTH (MIN)
1
0
1
1
0
1
0
0
1
V
Open
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS8921, DS8921A, DS8921AT
SNLS374C –MAY 1998–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
Supply Voltage
7V
−0.5V to +7V
5.5V
Driver Input Voltage
Output Voltage
Receiver Output Sink Current
Receiver Input Voltage
Differential Input Voltage
Maximum Package Power Dissipation @ +25°C
D Package
50 mA
±10V
±12V
730 mW
1160 mW
P Package
Derate D Package
9.3 mW/°C above +25°C
5.8 mW/°C above +25°C
−65°C to +165°C
+260°C
Derate P Package
Storage Temperature Range
Lead Temperature
(Soldering, 4 sec.)
+260°C
Maximum Junction
Temperature
+150°C
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the device should be operated at these limits. The Table of Electrical Characteristics provides conditions for actual device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instrument Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions
Min
Max
Units
Supply Voltage
Temperature (TA)
DS8921/DS8921A
DS8921AT
4.5
5.5
V
0
70
°C
°C
−40
+85
2
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS8921 DS8921A DS8921AT
DS8921, DS8921A, DS8921AT
www.ti.com
SNLS374C –MAY 1998–REVISED APRIL 2013
(1)(2)(3)
DS8921/DS8921A Electrical Characteristics
Symbol
Conditions
Min
Typ
Max
Units
RECEIVER
VTH
−7V ≤ VCM ≤ +7V
−200
15
±35
70
+200
mV
mV
kΩ
VHYST
RIN
−7V ≤ VCM ≤ +7V
VIN = −7V, +7V
(Other Input = GND)
VIN = 10V
4.0
6.0
IIN
3.25
mA
mA
V
VIN = −10V
−3.25
VOH
IOH = −400 μA
IOL = 8 mA
2.5
−15
2.0
VOL
0.5
V
ISC
VCC = MAX, VOUT = 0V
−100
mA
DRIVER
VIH
V
V
VIL
0.8
−200
20
IIL
VCC = MAX, VIN = 0.4V
VCC = MAX, VIN = 2.7V
VCC = MAX, VIN = 7.0V
VCC = MIN, IIN = −18 mA
VCC = MIN, IOH = −20 mA
VCC = MIN, IOL = +20 mA
VCC = 0V, V OUT = 5.5V
−40
μA
μA
μA
V
IIH
II
100
−1.5
VCL
VOH
2.5
V
VOL
0.5
100
0.4
V
IOFF
μA
V
|VT| – |VT |
VT
2.0
V
|VOS – VOS
ISC
|
0.4
V
VCC = MAX, VOUT = 0V
−30
−150
mA
DRIVER and RECEIVER
ICC
VCC = MAX, VOUT = Logic 0
35
mA
(1) All currents into device pins are shown as positive values; all currents out of the device are shown as negative; all voltages are
referenced to ground unless otherwise specified. All values shown as max or min are classified on absolute value basis.
(2) All typical values are VCC = 5V, TA = 25°C.
(3) Only one output at a time should be shorted.
Receiver Switching Characteristics
Symbol
Conditions
Min
Typ
14
Max
8921A
20
Units
ns
8921
8921AT
TpLH
CL = 30 pF
22.5
20
(Figure 1 and Figure 2 )
CL = 30 pF
TpHL
14
22.5
5
20
20
5
ns
(Figure 1 and Figure 2)
CL = 30 pF
|TpLH–T pHL
|
0.5
3.5
ns
(Figure 1 and Figure 2 )
Driver Switching Characteristics
SINGLE ENDED CHARACTERISTICS
Symbol
Conditions
Min
Typ
Max
8921A
15
Units
ns
8921
8921AT
TpLH
CL = 30 pF
10
10
15
15
(Figure 3 and Figure 4)
CL = 30 pF
TpHL
15
15
15
ns
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DS8921 DS8921A DS8921AT
DS8921, DS8921A, DS8921AT
SNLS374C –MAY 1998–REVISED APRIL 2013
www.ti.com
Units
Driver Switching Characteristics (continued)
SINGLE ENDED CHARACTERISTICS
Symbol
Conditions
Min
Typ
Max
8921
8921A
8921AT
9.5
(Figure 3 and Figure 4)
CL = 30 pF
TTLH
5
5
1
8
8
5
8
8
ns
ns
ns
(Figure 7 and Figure 8)
CL = 30 pF
TTHL
9.5
(Figure 7 and Figure 8)
CL = 30 pF(1)
Skew
3.5
3.5
(Figure 3 and Figure 4)
(1) Difference between complementary outputs at the 50% point.
Driver Switching Characteristics(1)
DIFFERENTIAL CHARACTERISTICS
Symbol
Conditions
Min
Typ
Max
Units
8921
8921A
8921AT
TpLH
CL = 30 pF
10
15
15
6
15
15
ns
(Figure 3, Figure 5, and
Figure 6)
TpHL
CL = 30 pF
10
15
15
ns
ns
(Figure 3, Figure 5, and
Figure 6)
|TpLH–T pHL
|
CL = 30 pF
0.5
2.75
2.75
(Figure 3, Figure 5, and
Figure 6)
(1) Differential Delays are defined as calculated results from single ended rise and fall time measurements. This approach in establishing
AC performance specifications has been taken due to limitations of available Automatic Test Equipment (ATE). The calculated ATE
results assume a linear transition between measurement points and are a result of the following equations:
Tcr = Crossing Point Tra, Trb, Tfa and T fb are time measurements with respect to the input. See Figure 6.
Where:
AC Test Circuits and Switching Diagrams
Figure 1.
4
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS8921 DS8921A DS8921AT
DS8921, DS8921A, DS8921AT
www.ti.com
SNLS374C –MAY 1998–REVISED APRIL 2013
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: DS8921 DS8921A DS8921AT
DS8921, DS8921A, DS8921AT
SNLS374C –MAY 1998–REVISED APRIL 2013
www.ti.com
Figure 8.
TYPICAL APPLICATIONS
Figure 9. ST506 and ST412 Application
6
Submit Documentation Feedback
Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS8921 DS8921A DS8921AT
DS8921, DS8921A, DS8921AT
www.ti.com
SNLS374C –MAY 1998–REVISED APRIL 2013
Figure 10.
Figure 11. ESDI Application
Copyright © 1998–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: DS8921 DS8921A DS8921AT
DS8921, DS8921A, DS8921AT
SNLS374C –MAY 1998–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS8921 DS8921A DS8921AT
PACKAGE OPTION ADDENDUM
www.ti.com
18-Apr-2013
PACKAGING INFORMATION
Orderable Device
DS8921AM
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
8
8
8
8
8
8
8
8
8
8
95
TBD
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
Level-1-260C-UNLIM
Call TI
DS89
21AM
DS8921AM/NOPB
DS8921AMX
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
D
D
D
D
D
D
D
95
2500
2500
95
Green (RoHS
& no Sb/Br)
0 to 70
DS89
21AM
TBD
0 to 70
DS89
21AM
DS8921AMX/NOPB
DS8921ATM
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
0 to 70
DS89
21AM
TBD
-40 to 85
-40 to 85
0 to 70
DS892
1ATM
DS8921ATM/NOPB
DS8921M
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
DS892
1ATM
95
TBD
DS892
1M
DS8921M/NOPB
DS8921MX
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
0 to 70
DS892
1M
2500
2500
TBD
0 to 70
DS892
1M
DS8921MX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
0 to 70
DS892
1M
DS8921N
ACTIVE
ACTIVE
PDIP
PDIP
P
P
8
8
40
40
TBD
Call TI
Call TI
Call TI
0 to 70
0 to 70
DS8921N
DS8921N/NOPB
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
DS8921N
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Apr-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS8921AMX
DS8921AMX/NOPB
DS8921MX
SOIC
SOIC
SOIC
SOIC
D
D
D
D
8
8
8
8
2500
2500
2500
2500
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
6.5
6.5
6.5
6.5
5.4
5.4
5.4
5.4
2.0
2.0
2.0
2.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
DS8921MX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS8921AMX
DS8921AMX/NOPB
DS8921MX
SOIC
SOIC
SOIC
SOIC
D
D
D
D
8
8
8
8
2500
2500
2500
2500
349.0
349.0
349.0
349.0
337.0
337.0
337.0
337.0
45.0
45.0
45.0
45.0
DS8921MX/NOPB
Pack Materials-Page 2
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