DS560DF810ALUT [TI]
具有 2x2 交叉点的 56Gbps、八通道重定时器 | ALU | 135 | -40 to 85;
| 型号： | DS560DF810ALUT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 2x2 交叉点的 56Gbps、八通道重定时器 | ALU | 135 | -40 to 85 |
| 文件： | 总12页 (文件大小：968K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS560DF810
ZHCSP21B –DECEMBER 2021 –REVISED JUNE 2023
DS560DF810 具有交叉点的56Gbps 多速率8 通道重定时器
DS560DF810 中的每个通道均可独立锁定 19.6GBd 至
28.9GBd 连续范围内的符号速率（PAM4 和 NRZ），
或任何支持的子速率。集成的 CDR 功能可重置抖动预
算并重定时高速串行数据，是前端口光学模块应用的理
想选择。这些特性可实现独立信道前向纠错 (FEC) 直
通。此外，DS560DF810 还支持 CDR 自动通道速率
切换，可在无需主机干预的情况下锁定多达五种不同的
波特率和调制类型组合。
1 特性
• 具有集成信号调节功能的通道多协议重定时器
• 所有通道均可独立锁定19.6GBd 至28.9GBd 的
PAM4 和NRZ 数据速率（包括1/2 和1/4 子速率）
• 适用于高达CEI-56G、以太网™ (400GbE)、光纤通
道(64GFC)、InfiniBand™ (HDR) 和CPRI/eCPRI
PCB、铜缆和光学应用
• CDR 自动通道速率切换可锁定多达五种不同的波特
率和调制类型组合
DS560DF810 先进的均衡特性包括一个连续自适应时
间线性均衡器(CTLE)、RX 前馈均衡器(FFE)、决策反
馈均衡器 (DFE) 和一个可编程、低抖动、4 抽头TX 前
馈均衡器 (FFE) 滤波器。这些特性可实现有损耗互连
的长度扩展，例如直连铜 (DAC) 缆以及具有多个连接
器且存在串扰的背板。
• 低延迟：26.5625GBd 时小于2000ps（典型值）
• 连续自适应时间线性均衡器(CTLE)、RX 前馈均衡
器(FFE) 和决策反馈均衡器(DFE) 搭配使用，可在
13.28GHz 下支持超过30dB 的通道损耗
• 集成2x2 交叉点开关
封装信息
封装(1)
• 可调节4 抽头TX FFE 滤波器
封装尺寸(2)
器件型号
• 齿轮箱模式支持（NRZ/PAM4 位多路复用器/多路信
号分离器、NRZ/PAM4 串行器/解串器）
• 用于调试的片上眼图张开度监视器(EOM)、PRBS
发生器和PRBS 校验器
• 双电源：1.8V 和1.2V
• 工作温度范围：-40°C 至+85°C
ALU（FCBGA，
135）
DS560DF810
13 mm × 8 mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
(2) 封装尺寸（长× 宽）为标称值，并包括引脚（如适用）。
• 带有集成交流耦合电容器的8.00mm x 13.00mm
TX0P
TX0N
RX0P
RX0N
CDR
CDR
BGA 封装
Aggregator /
De-aggregator
RX1P
RX1N
TX1P
TX1N
2 应用
• 有源电缆(AEC)（QSFP-DD、OSFP）
• 前端口C2M 连接单元接口(AUI) 抖动消除
• 背板(KR) 和中板C2C 连接单元接口(AUI) 范围扩
展
• 通过NRZ 和PAM4 聚合和解聚实现速度加倍（齿
轮箱）
TX6P
TX6N
RX6P
RX6N
CDR
CDR
Aggregator /
De-aggregator
RX7P
RX7N
TX7P
TX7N
VDD_1V8
I2C Target
VDD_1V8 or 3.3V
1 k
mode
EN_SMB
To system
controller
INT_N
READ_EN_N
CAL_CLK_IN
25 MHz
SDA
SDC
To system
I2C
RESET_N
ADDR0
ADDR1
0.1
F
Address straps (pull-up,
pull-down, or float)
3 说明
VDD_1V8
Float for I2C Target mode, or
connect to next device’s
READ_EN_N for I2C
Controller mode
ALL_DONE_N
DS560DF810 是一款具有集成信号调节功能的八通道
多速率重定时器。可扩展有损耗且存在串扰的远距离高
速串行链路的长度并提升其稳定性。
VDD1P8
VDD1P2
1
F
0.1
F
(1x)
(2x)
CAL_CLK_OUT
GND
To next retimer’s
CAL_CLK_IN
VDD_1V2
1
F
0.1
F
(2x)
(4x)
简化版原理图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SNLS709
DS560DF810
ZHCSP21B –DECEMBER 2021 –REVISED JUNE 2023
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 说明（续）.........................................................................3
6 Device and Documentation Support..............................4
6.1 Documentation Support.............................................. 4
6.2 接收文档更新通知....................................................... 4
6.3 支持资源......................................................................4
6.4 Trademarks.................................................................4
6.5 静电放电警告.............................................................. 4
6.6 术语表......................................................................... 4
7 Mechanical, Packaging, and Orderable Information....4
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision A (December 2022) to Revision B (June 2023)
Page
• 在特性 部分添加了 PAM4 串行器或解串器支持..................................................................................................1
• 更新了封装信息 表格式以包含封装引线............................................................................................................. 1
Changes from Revision * (October 2021) to Revision A (December 2022)
Page
• 将数据表的状态从预告信息 更改为“量产数据”..............................................................................................1
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SNLS709
2
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DS560DF810
ZHCSP21B –DECEMBER 2021 –REVISED JUNE 2023
www.ti.com.cn
5 说明（续）
DS560DF810 配有位多路复用器和多路信号分离器齿轮箱，可在主机和模块间轻松实现 NRZ 至 PAM4 或 PAM4
至 NRZ 的转换。该齿轮箱可将一对速率高达 28.9GBd 的 NRZ 输入聚合为一个 28.9GBd PAM4 输出，也可将一
个28.9GBd PAM4 输入解聚为一对28.9GBd NRZ 输出。
DS560DF810 在 CDR 后的每对相邻通道之间都具有一个完整的 2x2 交叉点开关，可支持快速、灵活的通道切换
以实现灵活的 PCB 路由，支持 2 到 1 多路复用和 1 到 2 多路分解以实现故障转移冗余，还支持 1 对 2 扇出以实
现诊断监控。此外，PCB 上集成了物理交流耦合电容器（TX 和 RX），无需使用外部电容器。这些特性可降低
PCB 布线的复杂程度并节省物料清单(BOM) 成本。
诊断功能包括无损PAM4/NRZ 垂直眼高监视器、2D PAM4/NRZ 眼图张开度监视器(EOM)、具有错误注入模块的
PRBS 图形发生器、PRBS 错误校验器和片上温度传感器。这些特性可帮助测量链路裕量，并用于监测系统随时
间推移的运行情况。
DS560DF810 可通过I2C 或外部EEPROM 进行配置。单个EEPROM 最多可由16 个器件共享。
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: DS560DF810
English Data Sheet: SNLS709
DS560DF810
ZHCSP21B –DECEMBER 2021 –REVISED JUNE 2023
www.ti.com.cn
6 Device and Documentation Support
6.1 Documentation Support
6.1.1 Related Documentation
For related documentation, see the following:
• Texas Instruments, DS560DFXX0 Programmer's Guide
• Texas Instruments, DS560DF810EVM User's Guide
• Texas Instruments, Implementation of TI 56Gbps PAM4 Retimers in Direct Attach Copper Cable Applications
6.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
6.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
6.4 Trademarks
以太网™ is a trademark of Fuji Xerox Co., Ltd.
InfiniBand™ is a trademark of InfiniBand Trade Association.
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
6.5 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
6.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SNLS709
4
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Product Folder Links: DS560DF810
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jun-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
DS560DF810ALUR
DS560DF810ALUT
ACTIVE
ACTIVE
FCCSP
FCCSP
ALU
ALU
135
135
1000 RoHS & Green
250 RoHS & Green
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
DS560DF8E0
DS560DF8E0
Samples
Samples
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jun-2023
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS560DF810ALUR
DS560DF810ALUT
FCCSP
FCCSP
ALU
ALU
135
135
1000
250
330.0
330.0
24.4
24.4
8.4
8.4
13.4
13.4
2.45
2.45
12.0
12.0
24.0
24.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS560DF810ALUR
DS560DF810ALUT
FCCSP
FCCSP
ALU
ALU
135
135
1000
250
336.6
336.6
336.6
336.6
41.3
41.3
Pack Materials-Page 2
PACKAGE OUTLINE
ALU0135A
FCBGA - 1.55 mm max height
S
C
A
L
E
1
.
5
0
0
PLASTIC BALL GRID ARRAY
8.15
7.85
B
A
BALL A1
CORNER
13.15
12.85
0.15 C
0.35 C
1.55 MAX
C
SEATING PLANE
0.2 C
(0.58)
0.405
0.325
6.4 TYP
SYMM
(0.8)
(0.9)
15
14
13
12
11
10
9
SYMM
8
11.2 TYP
7
6
5
4
0.51
0.41
135X
0.2
0.08
C A B
C
3
2
1
J
H
G
F
E
D
C
B
A
0.8 TYP
0.8 TYP
4225902/C 03/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
ALU0135A
FCBGA - 1.55 mm max height
PLASTIC BALL GRID ARRAY
(0.8) TYP
135X ( 0.4)
J
H
G
F
E
D
C
B
A
1
(0.8) TYP
2
3
4
5
6
7
8
9
SYMM
10
11
12
13
14
15
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL UNDER
SOLDER MASK
EXPOSED METAL
(
0.4)
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
EXPOSED METAL
METAL EDGE
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4225902/C 03/2022
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99).
www.ti.com
EXAMPLE STENCIL DESIGN
ALU0135A
FCBGA - 1.55 mm max height
PLASTIC BALL GRID ARRAY
(0.8) TYP
135X ( 0.4)
J
H
G
F
E
D
C
B
A
1
(0.8) TYP
2
3
4
5
6
7
8
9
SYMM
10
11
12
13
14
15
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 8X
4225902/C 03/2022
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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