DS2003CM [TI]
DS2003 High Current/Voltage Darlington Drivers; DS2003高电流/电压达林顿驱动器
| 型号： | DS2003CM |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DS2003 High Current/Voltage Darlington Drivers |
| 文件： | 总13页 (文件大小：802K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS2003
www.ti.com
SNLS394J –JANUARY 2000–REVISED APRIL 2013
DS2003 High Current/Voltage Darlington Drivers
Check for Samples: DS2003
1
FEATURES
DESCRIPTION
The DS2003 comprises seven high voltage, high
current NPN Darlington transistor pairs. All units
feature a common emitter and open collector outputs.
To maximize their effectiveness, these units contain
suppression diodes for inductive loads and
appropriate emitter base resistors for leakage.
2
•
•
•
•
•
•
Seven High Gain Darlington Pairs
High Output Voltage (VCE = 50V)
High Output Current (IC = 350 mA)
TTL, PMOS, CMOS Compatible
Suppression Diodes for Inductive Loads
Extended Temperature Range
The DS2003 has a series base resistor to each
Darlington pair, thus allowing operation directly with
TTL or CMOS operating at supply voltages of 5.0V.
The DS2003 offers solutions to a great many
interface needs, including solenoids, relays, lamps,
small motors, and LEDs. Applications requiring sink
currents beyond the capability of a single output may
be accommodated by paralleling the outputs.
Connection Diagram
Top View
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
IN A
IN B
IN C
IN D
IN E
IN F
IN G
GND
A
B
C
D
OUT A
OUT B
OUT C
OUT D
OUT E
OUT F
OUT G
COMMON
E
F
G
Figure 1.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
DS2003
SNLS394J –JANUARY 2000–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Storage Temperature Range
Operating Temperature Range, TA
DS2003T
−65°C to +150°C
−40°C to +125°C
−40°C to +85°C
−40°C to +150°C
DS2003C
Junction Temperature Range, TJ
Lead Temperature
Soldering, 10 seconds
ESD Ratings
265°C
Human Body Model
Machine Model
+/-2000V
+/- 200V
Package Thermal Dissipation Ratings
NFG0016E Package θJ-A
D0016A Package θJ-A
Input Voltage
88°C/W
115°C/W
−0.3V to 30V
55V
Output Voltage
Emitter-Base Voltage
Continuous Collector Current
Continuous Base Current
6.0V
500 mA
25 mA
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply
that the devices should be operated at these limits. The Electrical Characteristics provide conditions for actual device operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Electrical Characteristics
TA = 25°C, unless otherwise specified
(1)
Parameter
Test Conditions
TA = 25°C, VCE = 50V (Figure 6)
Min Typ Max Units
ICEX
Output Leakage
Current
20
100
150
1.6
1.3
1.1
μA
TA = 85°C, VCE = 50V (Figure 6)
TA = 125°C, VCE = 50V (Figure 6) for DS2003T
IC = 350mA, IB = 500μA (Figure 8)(2)
IC = 200mA, IB = 350μA (Figure 8)
IC = 100mA, IB = 250μA (Figure 8)
VI = 3.85V (Figure 9)
VCE(Sat)
Collector-Emitter
Saturation Voltage
1.25
1.1
V
0.9
II(ON)
Input Current
0.93 1.35
mA
II(OFF)
Input Current
IC = 500µA (Figure 10)
50
50
25
10
100
100
50
μA
(3)
TA = +25°C
TA = +85°C
TA = +125C for DS2003T
25
VI(ON)
Input Voltage
VCE = 2.0V, IC = 200mA (Figure 11)
VCE = 2.0V, IC = 250mA (Figure 11)
VCE = 2.0V, IC = 300mA (Figure 11)
2.4
2.7
3.0
V
(4)
CI
Input Capacitance
Turn-On Delay
Turn-Off Delay
15
30
1.0
1.0
pF
μs
μs
tPLH
tPHL
0.5 VI to 0.5 VO
0.5 VI to 0.5 VO
(1) All limits apply to the complete Darlington series except as specified for a single device type.
(2) Under normal operating conditions these units will sustain 350 mA per output with VCE (Sat) = 1.6V at 70°C with a pulse width of 20 ms
and a duty cycle of 30%.
(3) The II(OFF) current limit ensured against partial turn-on of the output.
(4) The VI(ON) voltage limit ensures a minimum output sink current per the specified test conditions.
2
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Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS2003
DS2003
www.ti.com
SNLS394J –JANUARY 2000–REVISED APRIL 2013
Electrical Characteristics (continued)
TA = 25°C, unless otherwise specified (1)
Parameter
Test Conditions
Min Typ Max Units
IR
Clamp Diode
Leakage Current
VR = 50V (Figure 12)
TA = 25°C
µA
5
10
50
TA = 85°C
10
20
1.7
TA = 125°C for DS2003T
IF = 350mA (Figure 13)
100
2.0
VF
Clamp Diode
V
Forward Voltage
Copyright © 2000–2013, Texas Instruments Incorporated
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Product Folder Links: DS2003
DS2003
SNLS394J –JANUARY 2000–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics
Collector Current vs
Saturation Voltage
Collector Current vs
Input Current
Figure 2.
Figure 3.
Peak Collector Current vs
Duty Cycle and Number of
Outputs (N16E Package)
Input Current vs
Input Voltage
Figure 4.
Figure 5.
4
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Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS2003
DS2003
www.ti.com
SNLS394J –JANUARY 2000–REVISED APRIL 2013
EQUIVALENT CIRCUITS
Test Circuits
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Copyright © 2000–2013, Texas Instruments Incorporated
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Product Folder Links: DS2003
DS2003
SNLS394J –JANUARY 2000–REVISED APRIL 2013
www.ti.com
Typical Applications
V+
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Input A
Input B
Input C
Input D
Input E
Input F
Input G
GND
LED Test
Figure 14. Typical LED Driver
V
DD
V+
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Figure 15. Typical Relay Driver
6
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Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: DS2003
DS2003
www.ti.com
SNLS394J –JANUARY 2000–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision I (April 2013) to Revision J
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Copyright © 2000–2013, Texas Instruments Incorporated
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7
Product Folder Links: DS2003
PACKAGE OPTION ADDENDUM
www.ti.com
7-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
DS2003CM
ACTIVE
SOIC
SOIC
D
16
16
48
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
DS2003CM
DS2003CM/NOPB
ACTIVE
ACTIVE
D
D
48
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS2003CM
DS2003CM
DS2003CMX/NOPB
SOIC
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
DS2003TM
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
48
48
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
DS2003TM
DS2003TM
DS2003TM/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
DS2003TMX
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
2500
2500
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
DS2003TM
DS2003TM
DS2003TMX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
7-Oct-2013
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS2003CMX/NOPB
DS2003TMX
SOIC
SOIC
SOIC
D
D
D
16
16
16
2500
2500
2500
330.0
330.0
330.0
16.4
16.4
16.4
6.5
6.5
6.5
10.3
10.3
10.3
2.3
2.3
2.3
8.0
8.0
8.0
16.0
16.0
16.0
Q1
Q1
Q1
DS2003TMX/NOPB
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS2003CMX/NOPB
DS2003TMX
SOIC
SOIC
SOIC
D
D
D
16
16
16
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
DS2003TMX/NOPB
Pack Materials-Page 2
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