DS16EV5110ASQX/NOPB [TI]
Video Equalizer (3D+C) for DVI, HDMI Source/Repeater/Sink Applications 48-WQFN -40 to 85;
| 型号： | DS16EV5110ASQX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Video Equalizer (3D+C) for DVI, HDMI Source/Repeater/Sink Applications 48-WQFN -40 to 85 |
| 文件： | 总24页 (文件大小：3233K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS16EV5110
www.ti.com
SNLS249M –FEBRUARY 2007–REVISED APRIL 2013
DS16EV5110 Video Equalizer (3D+C) for DVI, HDMI Sink-Side Applications
Check for Samples: DS16EV5110
1
FEATURES
APPLICATIONS
2
•
8 Levels of Equalization Settable by 3 Pins or
Through the SMBus Interface
•
•
•
Sink-Side Video Applications
Projectors
•
•
DC-Coupled Inputs and Outputs
High Definition Displays
Optimized for Operation From 250 Mbps to
2.25 Gbps in Support of UXGA, 480 I/P, 720 I/P,
1080 I, and 1080 P With 8, 10, and 12-Bit Color
Depth Resolutions
DESCRIPTION
The DS16EV5110 is
a multi-channel equalizer
optimized for video cable extension sink-side
applications. It operates between 250Mbps and
2.25Gbps with common applications at 1.65Gbps and
2.25Gbps (per data channel). It contains three
Transition-Minimized Differential Signaling (TMDS)
data channels and one clock channel as commonly
found in DVI and HDMI cables. It provides
compensation for skin-effect and dielectric losses, a
common phenomenon when transmitting video on
commercially available high definition video cables.
•
•
Two DS16EV5110 Devices Support DVI/HDMI
Dual Link
DVI 1.0, and HDMI 1.3a Compatible TMDS
Interface
•
•
•
Clock Channel Signal Detect (LOS)
Enable for Power Savings Standby Mode
System Management Bus (SMBus) Provides
Control of Boost, Output Amplitude, Enable,
and Clock Channel Signal Detect Threshold
The inputs conform to DVI and HDMI requirements
and features programmable levels of input
equalization.
equalization provide optimal signal boost and reduces
inter-symbol interference. Eight levels of boost are
selectable via a pin interface or by the optional
System Management Bus.
•
•
Low Power Consumption: 475mW (Typical)
The
programmable
levels
of
0.13 UI Total Jitter at 1.65 Gbps Including
Cable
•
•
Single 3.3V Power Supply
Small 7mm x 7mm, 48-Pin Leadless WQFN
Package
The clock channel is optimized for clock rates of up to
225 MHz and features a signal detect circuit. To
maximize noise immunity, the DS16EV5110 features
a signal detector with programmable thresholds. The
•
•
-40°C to +85°C Operating Temperature Range
Extends TMDS Cable Reach Over:
threshold is adjustable through
Management Bus (SMBus) interface.
a
System
1. > 40 Meters 24 AWG DVI Cable (1.65Gbps)
2. > 20 Meters 28 AWG DVI Cable (1.65Gbps)
The DS16EV5110 also provides support for system
power management via output enable controls.
Additional controls are provided via the SMBus
enabling customization and optimization for specific
applications requirements. These controls include
programmable features such as output amplitude and
boost controls as well as system level diagnostics.
3. > 20 Meters Cat5/Cat5e/Cat6 Cables
(1.65Gbps)
4. > 20 Meters 28 AWG HDMI Cables
(2.25Gbps)
Typical Application
DVI / HDMI Sink
20m 28 AWG DVI / HDMI Cable
DeS / Display
Controller
DVI / HDMI
Source
DS16EV5110
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2013, Texas Instruments Incorporated
DS16EV5110
SNLS249M –FEBRUARY 2007–REVISED APRIL 2013
www.ti.com
PIN DESCRIPTIONS
Pin Name
HIGH SPEED DIFFERENTIAL I/O
Pin Number I/O(1), Type
Description
C_IN−
C_IN+
1
2
I, CML
I, CML
I, CML
I, CML
O, CML
O, CML
O, CML
O, CML
Inverting and non-inverting TMDS Clock inputs to the equalizer. An on-chip 50Ω terminating
resistor connects C_IN+ to VDD and C_IN- to VDD.
D_IN0−
D_IN0+
4
5
Inverting and non-inverting TMDS Data inputs to the equalizer. An on-chip 50Ω terminating
resistor connects D_IN0+ to VDD and D_IN0- to VDD.
D_IN1−
D_IN1+
8
9
Inverting and non-inverting TMDS Data inputs to the equalizer. An on-chip 50Ω terminating
resistor connects D_IN1+ to VDD and D_IN1- to VDD.
D_IN2−
D_IN2+
11
12
Inverting and non-inverting TMDS Data inputs to the equalizer. An on-chip 50Ω terminating
resistor connects D_IN2+ to VDD and D_IN2- to VDD.
C_OUT-
C_OUT+
36
35
Inverting and non-inverting TMDS outputs from the equalizer. Open collector.
Inverting and non-inverting TMDS outputs from the equalizer. Open collector.
Inverting and non-inverting TMDS outputs from the equalizer. Open collector.
Inverting and non-inverting TMDS outputs from the equalizer. Open collector.
D_OUT0−
D_OUT0+
33
32
D_OUT1–
D_OUT1+
29
28
D_OUT2−
D_OUT2+
26
25
Equalization Control
BST_0
BST_1
BST_2
23
14
37
I, LVCMOS BST_0, BST_1, and BST_2 select the equalizer boost level for EQ channels. BST_0, BST_1,
and BST_2 are internally pulled Low. See Table 2.
Device Control
EN
44
21
45
I, LVCMOS Enable Equalizer input. When held High, normal operation is selected. When held Low,
standby mode is selected. EN is internally pulled High. Signal is global to all Data and Clock
channels.
FEB
I, LVCMOS Force External Boost. When held High, the equalizer boost setting is controlled by the
BST_[0:2] pins. When held Low, the equalizer boost level is controlled through the SMBus
(see Table 1) control pins. FEB is internally pulled High.
SD
O, LVCMOS Equalizer Clock Channel Signal Detect Output. Produces a High when signal is detected.
POWER
VDD
3, 6, 7,
10, 13,
15, 46
Power
GND
GND
VDD pins should be tied to the VDD plane through a low inductance path. A 0.1µF bypass
capacitor should be connected between each VDD pin to the GND planes.
GND
22, 24,
27, 30,
31, 34
Ground reference. GND should be tied to a solid ground plane through a low impedance
path.
Exposed Pad
DAP
The exposed pad at the center of the package must be connected to the ground plane.
System Management Bus (SMBus) Interface Control Pins
SDA
SDC
CS
18
17
16
IO, LVCMOS SMBus Data Input / Output. Internally pulled High to 3.3V with High-Z pull up.
I, LVCMOS SMBus Clock Input. Internally pulled High to 3.3V with High-Z pull up.
I, LVCMOS SMBus Chip select. When held High, the equalizer SMBus register is enabled. When held
Low, the equalizer SMBus register is disabled. CS is internally pulled Low. CS is internally
gated with SDC.
Other
Reserv
19, 20, 38,
39, 40,41,
42, 43, 47,
48
Reserved. Do not connect.
(1) Note: I = Input,O = Output, IO =Input/Output,
2
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Connection Diagram
C_IN-
C_IN+
VDD
C_OUT-
C_OUT+
GND
1
2
36
35
34
33
32
31
30
29
28
27
26
25
DAP = GND
3
D_IN0-
D_IN0+
VDD
D_OUT0-
D_OUT0+
GND
4
5
6
DS16EV5110SQ
(Top View)
VDD
GND
7
D_IN1-
D_IN1+
VDD
D_OUT1-
D_OUT1+
GND
8
9
10
11
12
D_IN2-
D_IN2+
D_OUT2-
D_OUT2+
TOP VIEW — Not to Scale
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage (VDD
)
-0.5V to +4.0V
-0.5V + 4.0V
-0.5V to 4.0V
-0.5V to 4.0V
+150°C
LVCMOS Input Voltage
LVCMOS Output Voltage
CML Input/Output Voltage
Junction Temperature
Storage Temperature
-65°C to +150°C
+260°C
Lead Temperature (Soldering, 5 sec.)
HBM, 1.5 kΩ, 100 pF
CML Inputs
>8 kV
ESD Rating
>10 kV
Thermal Resistance
θJA, No Airflow
30°C/W
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. Absolute
Maximum Numbers are ensured for a junction temperature range of –40°C to +125°C. Models are validated to Maximum Operating
Voltages only.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Recommended Operating Conditions(1)(2)
Min
3.0
-40
Typ
3.3
25
Max
3.6
Units
V
Supply Voltage (VDD to GND)
Ambient Temperature
+85
°C
(1) Typical values represent most likely parametric norms at VDD = 3.3V, TA = 25°C, and at the Recommended Operation Conditions at the
time of product characterization and are not ensured.
(2) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes.
Electrical Characteristics
Over recommended operating supply and temperature ranges unless other specified.(1)(2)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
LVCMOS DC SPECIFICATIONS
IIH-PU
IIH-PD
IIL-PU
IIL-PD
High Level Input Leakage Current
LVCMOS pins with internal pull-up
resistors
-10
80
+10
105
-10
μA
μA
μA
μA
High Level Input Leakage Current
Low Level Input Leakage Current
Low Level Input Leakage Current
LVCMOS pins with internal pull-
down resistors
LVCMOS pins with internal pull-up
resistors
-20
-10
LVCMOS pins with internal pull-
down resistors
+10
VIH
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
Low Level Output Voltage
2.0
0
VDD
0.8
V
V
V
V
VIL
VOH
VOL
SD Pin, IOH = -3mA
SD Pin, IOL = 3mA
2.4
0.4
POWER
PD
Power Dissipation
EN = High, Device Enabled
475
700
70
mW
mW
EN = Low, Power Down Mode
(1) Typical values represent most likely parametric norms at VDD = 3.3V, TA = 25°C, and at the Recommended Operation Conditions at the
time of product characterization and are not ensured.
(2) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes.
4
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Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless other specified.(1)(2)
Symbol
Parameter
Conditions
DC to 50MHz
Min
Typ
Max
Units
(3)
N
Supply Noise Tolerance
100
mVP-P
CML INPUTS
VTX
Input Voltage Swing (Launch
Amplitude)
Measured differentially at TPA
(Figure 2)
800
1200
mVP-P
V
VICMDC
VIN
Input Common-Mode Voltage
DC-Coupled Requirement
Measured at TPA (Figure 2)
VDD-0.3
VDD-0.2
Input Voltage Swing
Measured differentially at TPB
(Figure 2)
120
mVP-P
RLI
Differential Input Return Loss
Input Resistance
100 MHz– 825 MHz, with fixture's
effect de-embedded
10
50
dB
RIN
IN+ to VDD and IN− to VDD
45
55
Ω
CML OUTPUTS
VO
Output Voltage Swing
Measured differentially with OUT+
and OUT− terminated by 50Ω to
VDD
800
VDD-0.3
75
1200
VDD-0.2
240
mVP-P
V
VOCM
tR, tF
Output common-mode Voltage
Transition Time
Measured Single-ended
20% to 80% of differential output
voltage, measured within 1" from
output pins.
ps
tCCSK
Inter Pair Channel-to-Channel
Skew (all 4 Channels)
Difference in 50% crossing
between shortest and longest
channels
25
ps
ps
tD
Latency
350
OUTPUT JITTER
TJ1
Total Jitter at 1.65 Gbps
20m 28 AWG STP DVI Cable
Data Paths
0.13
0.2
0.17
UIP-P
EQ Setting 0x04 PRBS7(4) (5) (6)
TJ2
Total Jitter at 2.25 Gbps
20m 28 AWG STP DVI Cable
Data Paths
UIP-P
UIP-P
EQ Setting 0x04 PRBS7(4) (5) (6)
TJ3
TJ4
Total Jitter at 165 MHz
Total Jitter at 225 MHz
Random Jitter
Clock Paths
0.165
Clock Pattern(4) (5) (6)
Clock Paths
0.165
3
UIP-P
psrms
Clock Pattern(4) (5) (6)
(6) (7)
RJ
See
BIT RATE
FCLK
Clock Frequency
Bit Rate
Clock Path(4)
Data Path(4)
25
225
MHz
BR
0.25
2.25
Gbps
(3) Allowed supply noise (mVP-P sine wave) under typical conditions.
(4) Specification is ensured by characterization and is not tested in production.
(5) Deterministic jitter is measured at the differential outputs (TPC of Figure 2), minus the deterministic jitter before the test channel (TPA of
Figure 2). Random jitter is removed through the use of averaging or similar means.
(6) Total Jitter is defined as peak-to-peak deterministic jitter from () + 14.2 times random jitter in psrms
.
(7) Random jitter contributed by the equalizer is defined as sq rt (JOUT2 − JIN2). JOUT is the random jitter at equalizer outputs in psrms, see
TPC of Figure 2; JIN is the random jitter at the input of the equalizer in psrms, see TPA of Figure 2.
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Units
Electrical Characteristics — System Management Bus Interface(1)(2)
Over recommended operating supply and temperature ranges unless other specified.
Symbol
Parameter
Conditions
Min
Typ
Max
System Bus Interface — DC Specifications
VIL
Data, Clock Input Low Voltage
Data, Clock Input High Voltage
0.8
V
V
VIH
2.8
VDD
IPULLUP
Current through pull-up resistor or current
source
VOL = 0.4V
10
mA
VDD
Nominal Bus Voltage
3.0
3.6
V
(3)
ILEAK-Bus
ILEAK-Pin
CI
Input Leakage per bus segment
Input Leakage per device pin
Capacitance for SDA and SDC
Termination Resistance
See
See
—200
+200
µA
µA
pF
Ω
—15
1000
(3) (4)
10
(3) (4) (5)
RTERM
VDD3.3
System Bus Interface Timing Specification
(6)
FSMB
TBUF
Bus Operating Frequency
See
10
100
kHz
µs
Bus Free Time Between Stop and Start
Condition
4.7
THD:STA
Hold Time After (Repeated) Start Condition.
First CLK generated after this period.
At IPULLUP, Max
4.0
µs
TSU:STA
TSU:STO
THD:DAT
TSU:DAT
TTIMEOUT
TLOW
Repeated Start Condition Setup Time
Stop Condition Setup Time
Data Hold Time
4.7
4.0
300
250
25
µs
µs
ns
ns
ms
µs
µs
Data Setup Time
(6)
Detect Clock Low Timeout
Clock Low Period
See
35
4.7
4.0
(6)
THIGH
Clock High Period
See
50
2
(6)
TLOW:SEXT
Cumulative Clock Low Extend Time (Slave
Device)
See
ms
(6)
tF
Clock/Data Fall Time
Clock/Data Rise Time
See
300
ns
ns
(6)
tR
See
1000
(6)
tPOR
Time in which a device must be operational
after power-on reset
See
500
ms
(1) Typical values represent most likely parametric norms at VDD = 3.3V, TA = 25°C, and at the Recommended Operation Conditions at the
time of product characterization and are not ensured.
(2) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes.
(3) Recommended value. Parameter not tested in production.
(4) Recommended maximum capacitance load per bus segment is 400pF.
(5) Maximum termination voltage should be identical to the device supply voltage.
(6) Compliant to SMBus 2.0 physical layer specification. See System Management Bus (SMBus) Specification Version 2.0, section 3.1.1
SMBus common AC specifications for details.
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TIMING DIAGRAMS
CS
t
SU:CS
t
LOW
t
HIGH
t
R
SDC
t
t
t
t
F
HD:STA
HD:DAT
SU:STA
t
BUF
t
SU:STO
t
SU:DAT
SDA
ST
SP
SP
ST
Figure 1. SMBus Timing Diagram
VDD
VDD
RLoad RLoad
RLoad RLoad
SMA
SMA
SMA
SMA
Clk-
Coax
Coax
Coax
Clk+
Coax
VDD
VDD
RLoad RLoad
RLoad RLoad
SMA
SMA
SMA
SMA
Data0-
Data0+
Coax
Coax
Coax
Coax
VDD
VDD
28 AWG
DVI/HDMI
RLoad RLoad
Cable
RLoad RLoad
SMA
SMA
SMA
SMA
Coax
Coax
Coax
Coax
Data1-
Data1+
VDD
VDD
RLoad RLoad
RLoad RLoad
SMA
SMA
SMA
SMA
Data2-
Data2+
Coax
Coax
Coax
Coax
TPA
TPB
TPC
Figure 2. Test Setup Diagram for Jitter Measurement
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SYSTEM MANAGEMENT BUS (SMBUS) AND CONFIGURATION REGISTERS
The System Management Bus interface is compatible to SMBus 2.0 physical layer specification. The use of the
Chip Select signal is required. Holding the CS pin High enables the SMBus port allowing access to the
configuration registers. Holding the CS pin Low disables the device's SMBus allowing communication from the
host to other slave devices on the bus. In the STANDBY state, the System Management Bus remains active.
When communication to other devices on the SMBus is active, the CS signal for the DS16EV5110s must be
driven Low.
The address byte for all DS16EV5110s is AC'h. Based on the SMBus 2.0 specification, the DS16EV5110 has a
7-bit slave address of 1010110'b. The LSB is set to 0'b (for a WRITE), thus the 8-bit value is 1010 1100 'b or
AC'h.
The SDC and SDA pins are 3.3V LVCMOS signaling and include high-Z internal pull up resistors. External low
impedance pull up resistors maybe required depending upon SMBus loading and speed. Note, these pins are not
5V tolerant.
Transfer of Data via the SMBus
During normal operation the data on SDA must be stable during the time when SDC is High.
There are three unique states for the SMBus:
START: A High-to-Low transition on SDA while SDC is High indicates a message START condition.
STOP: A Low-to-High transition on SDA while SDC is High indicates a message STOP condition.
IDLE: If SDC and SDA are both High for a time exceeding tBUF from the last detected STOP condition or if they
are High for a total exceeding the maximum specification for tHIGH then the bus will transfer to the IDLE state.
SMBus Transactions
The device supports WRITE and READ transactions. See Register Description table for register address, type
(Read/Write, Read Only), default value and function information.
Writing a Register
To write a register, the following protocol is used (see SMBus 2.0 specification).
1. The Host (Master) selects the device by driving its SMBus Chip Select (CS) signal High.
2. The Host drives a START condition, the 7-bit SMBus address, and a “0” indicating a WRITE.
3. The Device (Slave) drives the ACK bit (“0”).
4. The Host drives the 8-bit Register Address.
5. The Device drives an ACK bit (“0”).
6. The Host drive the 8-bit data byte.
7. The Device drives an ACK bit (“0”).
8. The Host drives a STOP condition.
9. The Host de-selects the device by driving its SMBus CS signal Low.
The WRITE transaction is completed, the bus goes IDLE and communication with other SMBus devices may
now occur.
Reading a Register
To read a register, the following protocol is used (see SMBus 2.0 specification).
1. The Host (Master) selects the device by driving its SMBus Chip Select (CS) signal High.
2. The Host drives a START condition, the 7-bit SMBus address, and a “0” indicating a WRITE.
3. The Device (Slave) drives the ACK bit (“0”).
4. The Host drives the 8-bit Register Address.
5. The Device drives an ACK bit (“0”).
6. The Host drives a START condition.
7. The Host drives the 7-bit SMBus Address, and a “1” indicating a READ.
8. The Device drives an ACK bit “0”.
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9. The Device drives the 8-bit data value (register contents).
10. The Host drives a NACK bit “1”indicating end of the READ transfer.
11. The Host drives a STOP condition.
12. The Host de-selects the device by driving its SMBus CS signal Low.
The READ transaction is completed, the bus goes IDLE and communication with other SMBus devices may now
occur.
See Table 1 for more information.
Table 1. SMBus Register Descriptions(1)
Name
Status
Status
Status
Address Default
Type Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Reserved Reserved Reserved SD
EN Reserved
Reserved Boost 2
Bit 2
Bit 1
Bit 0
0x00
0x01
0x02
0x03
0x00
0x00
0x00
0x77
RO
RO
RO
RW
ID Revision
Reserved Boost 1
Reserved Boost 3
Internal
Enable/
Individual
Channel
Boost
EN (Int.)
0:Enable
Boost Control
(BC for CH0)
EN (Int.)
0:Enable
1:Disable
(C_IN±)
Reserved
1:Disable 000 (Min Boost)
(D_IN0±) 001
010
Control
for
011
100
C_IN±,
D_IN0±
101
110
111 (Max Boost)
Individual
Channel
Boost
0x04
0x77
RW
EN (Int.)
0:Enable
1:Disable 000 (Min Boost)
Boost Control
(BC for CH2)
EN (Int.)
0:Enable
1:Disable 000 (Min Boost)
Boost Control
(BC for CH1)
Control
for
(D_IN2±) 001
(D_IN1±) 001
010
010
D_IN1±,
D_IN2±
011
100
011
100
101
101
110
110
111 (Max Boost)
111 (Max Boost)
Signal
Detect ON
(SD_ON)
0x05
0x06
0x00
0x00
RW
RW
Reserved
Reserved
Threshold (mV)
00: 70 (Default)
01: 55
10: 90
11: 75
Signal
Threshold (mV)
Detect OFF
(SD_OFF)
00: 40 (Default)
01: 30
10: 55
11: 45
SMBus
orCMOS
Control for
EN
0x07
0x08
0x00
0x78
RW
RW
Reserved
Reserved
SMBus
Enable
0: Disable
1: Enable
Output
Level
Output Level:
Reserved
00: 540 mVp-p
01: 770 mVp-p
10: 1000 mVp-p
11: 1200 mVp-p
(1) Note: RO = Read Only, RW = Read/Write
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DS16EV5110 DEVICE DESCRIPTION
The DS16EV5110 video equalizer comprises three data channels, a clock channel, and a control interface
including a Systeml Management Bus (SMBus) port.
DATA CHANNELS
The DS16EV5110 provides three data channels. Each data channel consists of an equalizer stage, a limiting
amplifier, a DC offset correction block, and a TMDS driver as shown in Figure 3.
EQUALIZER BOOST CONTROL
The data channel equalizers support eight programmable levels of equalization boost. The state of the FEB pin
determines how the boost settings are controlled. If the FEB pin is held High, then the equalizer boost setting is
controlled by the Boost Set pins (BST_[0:2]) in accordance with Table 2. If this programming method is chosen,
then the boost setting selected on the Boost Set pins is applied to all three data channels. When the FEB pin is
held Low, the equalizer boost level is controlled through the SMBus. This programming method is accessed via
the appropriate SMBus registers (see Table 1). Using this approach, equalizer boost settings can be
programmed for each channel individually. FEB is internally pulled High (default setting); therefore if left
unconnected, the boost settings are controlled by the Boost Set pins (BST_[0:2]). The range of boost settings
provided enables the DS16EV5110 to address a wide range of transmission line path loss scenarios, enabling
support for a variety of data rates and formats.
Table 2. EQ Boost Control Table
Control Via SMBus
BC_2, BC_1, BC_0
(FEB = 0)
Control Via Pins
BST_2, BST_1,
BST_0
EQ Boost Setting at
825 MHz (dB)
(TYP)
(FEB = 1)
000
001
010
011
100
101
110
111
000
001
010
011
100
101
110
111
9
14
18
21
24
26
28
30
DEVICE STATE AND ENABLE CONTROL
The DS16EV5110 has an Enable feature which provides the ability to control device power consumption. This
feature can be controlled either via the Enable Pin (EN Pin) or via the Enable Control Bit which is accessed
through the SMBus port (see Table 1 and Table 3). If Enable is activated, the data channels and clock channel
are placed in the ACTIVE state and all device blocks function as described. The DS16EV5110 can also be
placed in STANDBY mode to save power. In this mode only the control interface including the SMBus port as
well as the clock channel signal detection circuit remain active.
Table 3. Enable and Device State Control
Register 07[0]
(SMBus)
EN Pin
(CMOS)
Register 03[3] (EN
Control)
Device State
(SMBus)
0 : Disable
0 : Disable
1 : Enable
1 : Enable
1
0
X
X
0
1
ACTIVE
STANDBY
ACTIVE
X
X
STANDBY
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CLOCK CHANNEL
The clock channel incorporates a limiting amplifier, a DC offset correction, and a TMDS driver as shown in
Figure 4.
CLOCK CHANNEL SIGNAL DETECT
The DS16EV5110 features a signal detect circuit on the clock channel. The status of the clock signal can be
determined by either reading the Signal Detect bit (SD) in the SMBus registers (see Table 1) or by the state of
the SD pin. A logic High indicates the presence of a signal that has exceeded a specified threshold value (called
SD_ON). A logic Low means that the clock signal has fallen below a threshold value (called SD_OFF). These
values are programmed via the SMBus (Table 1). If not programmed via the SMBus, the thresholds take on the
default values for the SD_OFF and SD_ON values as indicated in Table 4. The Signal Detect threshold values
can be changed through the SMBus. All threshold values specified are DC peak-to-peak differential signals
(positive signal minus negative signal) at the input of the device.
Table 4. Clock Channel Signal Detect Threshold
Values
Bit 1
Bit 0
SD_OFF Threshold SD_ON Threshold
Register 06 (mV)
Register 05 (mV)
0
0
1
1
0
1
0
1
40 (Default)
70 (Default)
30
55
45
55
90
75
Data Channel
(0-2)
DC Offset Correction
Limiting
Amplifier
Equalizer
BST
CNTL
Input
Termination
D_IN+
D_IN-
D_OUT+
D_OUT-
EN
EN
EN
EN
BST_0 : BST_2
3
3
3
SMBus Reg.
REG3[7],
REG4[7],
REG4[3]
SMBus Reg.
REG7[0]
Boost Setting
SMBus Register
FEB
Figure 3. DS16EV5110 Data Channel
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Clock
Channel
DC Offset Correction
Limiting
Amplifier
EN
Input
Termination
C_IN+
C_OUT+
C_IN-
C_OUT-
EN
EN
Signal Detect Thresh.
SMBus Register
Signal Detect
SMBus Register
SMBus
REG7[0]
SMBus
REG3[3]
SD
Figure 4. DS16EV5110 Clock Channel
OUTPUT LEVEL CONTROL
The output amplitude of the TMDS drivers for both the data channels and the clock channel can be controlled via
the SMBus (see Table 1). The default output level is 1000mV p-p. The following Table presents the output level
values supported:
Table 5. Output Level Control Settings – REG
0x08[3:2]
Bit 3
Bit 2
Output Level (mV)
0
0
1
1
0
1
0
1
540
770
1000 (default)
1200
AUTOMATIC ENABLE FEATURE
It may be desired for the DS16EV5110 to be configured to automatically enter STANDBY mode if no clock signal
is present. STANDBY mode can be implemented by connecting the Signal Detect (SD) pin to the external
(LVCMOS) Enable (EN) pin. In order for this option to function properly, REG07[0] should be set to a “0” (default
value). If the clock signal applied to the clock channel input swings above the SD_ON threshold specified in the
threshold register via the SMBus, then the SD pin is asserted High. If the SD pin is connected to the EN pin, this
will enable the equalizer, limiting amplifier, and output buffer on the data channels and the limiting amplifier and
output buffer on the clock channel; thus the DS16EV5110 will automatically enter the ACTIVE state. If the clock
signal present falls below SD_OFF threshold specified in the threshold register, then the SD pin will be asserted
Low, causing the aforementioned blocks to be placed in the STANDBY state.
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APPLICATION INFORMATION
The DS16EV5110 is used to recondition DVI/HDMI video signals or differential signals with similar characteristics
after signal loss and degradation due to transmission through a length of shielded or unshielded cable. It is
intended to be used on the Sink-side of the video link. The DS16EV5110A maybe used on the Source or Sink
side of the application. The DS16EV5110 ESD protection circuitry will not support the VOFF specification when
the dowstream device (e.g. DES) is powered ON and the DS16EV5110 is powered OFF. Figure 10 shows the
CML output circuitry and the ESD protection diode (current path). It is also not recommneded to enable the
DS16EV5110 CML outputs without a load attached.
DVI / HDMI Sink
(e.g. HDTV)
20m 28 AWG DVI / HDMI Cable
DeS / Display
Controller
DVI / HDMI Source
DS16EV5110
(e.g. DVD Player)
Figure 5. DS16EV5110 Sink-side application
The DS16EV5110 may also be used in certain Source-side application with certain restrictions. The
DS16EV5110 CML outputs will not meet the VOFF parameter required by the HDMI Compliance Test
Specification (v1.3b) when the DS16EV5110 is powered off and the sink device is powered on. A current path
will be enabled through the ESD protection diode (see Figure 10). If full compliance is not required, the
DS16EV5110 may be used in repeater type application as shown in Figure 6.
DVI/HDMI
DVD
Player
DVI/HDMI
Extender
20m DVI/HDMI
Cable
HDTV
DVI/HDMI Extender
Clock IN +/-
Clock OUT +/-
Data 0 IN +/-
Data 0 OUT +/-
Data 1 OUT +/-
Data 2 OUT +/-
DS16EV5110
Data 1 IN +/-
Data 2 IN +/-
To HDTV
20m DVI/HDMI
Cable
Figure 6. DS16EV5110 Repeater Application with CAT 5 cable
DVI 1.0 AND HDMI V1.2a APPLICATIONS
A single DS16EV5110 can be used to implement cable extension solutions with various resolutions and screen
refresh rates. The range of digital serial rates supported is between 250 Mbps and 1.65 Gbps. For applications
requiring ultra-high resolution for DVI applications (e.g., QXGA and WQXGA), a “dual link” TMDS interface is
required. This is easily configured by using two DS16EV5110 devices as shown in Figure 7.
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Note the recommended connections between LVCMOS control pins. This provides the Automatic Enable feature
for both devices based on the one active clock channel. In many applications the SMBus is not required (device
is pin controlled), for this application simply leave the three SMBus pins open. SDC and SDA are internally pulled
High, and CS is internally pulled Low, thus the SMBus is in the disabled state.
D0
D0
D1
D2
D1
D2
DS16EV5110
CLK
CLK
CS
SD
EN
EN
CS
D3
D4
D5
SD
D3
D4
D5
DS16EV5110
CLK
CLK
Figure 7. Connection in Dual Link Application
HDMI V1.3 APPLICATION
The DS16EV5110 can reliably extend operation to distances greater than 20 meters of 28 AWG HDMI cable at
2.25 Gbps, thereby supporting HDMI v1.3 for 1080p HDTV resolution with 12-bit color depth. Please note that
the Electrical Characteristics specified in this document have not been tested for and are not ensured for 2.25
Gbps operation.
DC COUPLED DATA PATHS AND DVI/HDMI COMPLIANCE
The DS16EV5110 is designed to support TMDS differential pairs with DC coupled transmission lines. It contains
integrated termination resistors (50Ω), pulled up to VDD at the input stage, and open collector outputs for DVI /
HDMI for signal swing.
CABLE SELECTION
At higher frequencies, longer cable lengths produce greater losses due to the skin effect. The quality of the cable
with respect to conductor wire gauge and shielding heavily influences performance. Thicker conductors have
lower signal degradation per unit length. In nearly all applications, the DS16EV5110 equalization can be set to
0x04, and equalize up to 22 dB skin effect loss for all input cable configurations at all data rates, without
degrading signal integrity.
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28 AWG STP DVI / HDMI CABLES RECOMMENDED BOOST SETTINGS
The following table presents the recommended boost control settings for various data rates and cable lengths for
28 AWG DVI/HDMI compliant configurations. Boost setting maybe done via the three BST[2:0] pins or via the
respective register values.
Table 6. Boost Control Setting for STP Cables
Setting
0x04
0x04
0x06
0x06
0x03
0x06
Data Rate
750 Mbps
1.65 Gbps
750 Mbps
1.65 Gbps
2.25 Gbps
2.25 Gbps
28 AWG DVI / HDMI
0–25m
0–20m
25m to greater than 30m
20m to greater than 25m
0–15m
15m to greater than 20m
Figure 8 shows the cable extension and jitter reduction obtained with the use of the equalizer. Table 6 lists the
various gain settings used versus cable length recommendations.
0.5
2.25 Gbps
0.4
0.3
0.2
0.1
0
1.65 Gbps
0.75 Gbps
Unequalized
0.25 Gbps
Equalized
0
5
10
15
20
25
30
35
28 AWG DVI/HDMI CABLE LENGTH (m)
Figure 8. Equalized vs. Unequalized Jitter Performance Over 28 AWG DVI/HDMI Cable
UTP (UNSHIELDED TWIST PAIRS) CABLES
The DS16EV5110 can be used to extend the length of UTP cables, such as Cat5, Cat5e and Cat6 to distances
greater than 20 meters at 1.65 Gbps with < 0.13 UI of jitter. Please note that for non-standard DVI/HDMI cables,
the user must ensure the clock-to-data channel skew requirements are met. Table 7 presents the recommended
boost control settings for various data rates and cable lengths for UTP configurations:
Table 7. Boost Control Setting for UTP Cables
Setting
0x03
Data Rate
750 Mbps
750 Mbps
1.65 Gbps
Cat5 Cable
0–25m
0x06
25–45m
0x03
Greater than 20m
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Figure 9 shows the cable extension and jitter reduction obtained with the use of the equalizer. Table 7 lists the
various gain settings used versus cable length recommendations.
0.5
1.65 Gbps
0.4
1.30 Gbps
0.75 Gbps
0.3
0.2
Unequalized
0.1
0
Equalized
0
5
10
15 20 25 30 35 40
CAT 5 CABLE LENGTH (m)
Figure 9. Equalized vs. Unequalized Jitter Performance Over Cat5 Cable
General Recommendations
The DS16EV5110 is a high performance circuit capable of delivering excellent performance. Careful attention
must be paid to the details associated with high-speed design as well as providing a clean power supply. Refer
to the LVDS Owner’s Manual for more detailed information on high-speed design tips as well as many other
available resources available addressing signal integrity design issues.
PCB LAYOUT CONSIDERATIONS FOR DIFFERENTIAL PAIRS
The TMDS differential inputs and outputs must have a controlled differential impedance of 100Ω. It is preferable
to route TMDS lines exclusively on one layer of the board, particularly for the input traces. The use of vias should
be avoided if possible. If vias must be used, they should be used sparingly and must be placed symmetrically for
each side of a given differential pair. Route the TMDS signals away from other signals and noise sources on the
printed circuit board. All traces of TMDS differential inputs and outputs must be equal in length to minimize intra-
pair skew.
WQFN FOOTPRINT RECOMMENDATIONS
See application note AN-1187 (SNOA401) for additional information on WQFN packages footprint and soldering
information.
POWER SUPPLY BYPASSING
Two approaches are recommended to ensure that the DS16EV5110 is provided with an adequate power supply.
First, the supply (VDD) and ground (GND) pins should be connected to power planes routed on adjacent layers
of the printed circuit board. The layer thickness of the dielectric should be minimized so that the VDD and GND
planes create a low inductance supply with distributed capacitance. Second, careful attention to supply
bypassing through the proper use of bypass capacitors is required. A 0.1µF bypass capacitor should be
connected to each VDD pin such that the capacitor is placed as close as possible to the DS16EV5110. Smaller
body size capacitors can help facilitate proper component placement. Additionally, three capacitors with
capacitance in the range of 2.2µF to 10µF should be incorporated in the power supply bypassing design as well.
These capacitors can be either tantalum or an ultra-low ESR ceramic and should be placed as close as possible
to the DS16EV5110.
EQUIVALENT I/O STRUCTURES
Figure 10 shows the DS16EV5110 CML output structure and ESD protection circuitry.
Figure 11 shows the DS16EV5110 CML input structure and ESD protection circuitry.
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VDD
OUT+
OUT-
Figure 10. Equivalent Output Structure
VDD
50W
50W
IN+
IN-
Figure 11. Equivalent Input Structure
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Typical Performance Characteristics
Figure 12. Un-equalized vs. Equalized Signal after 25m of 28 AWG DVI Cable at 1.65 Gbps (0x06 Setting)
Figure 13. Output Signal after 20m of Cat5 Cable at
1.65 Gbps (0x06 Setting)
Figure 14. Output Signal after 30m of 28 AWG DVI Cable at
750 Mbps (0x06 Setting)
Figure 15. Output Signal after 0.3m of 28 AWG DVI Cable at
1.65 Gbps (0x04 Setting)
Figure 16. Output Signal after 20m of 28 AWG HDMI Cable
at 2.25 Gbps (0x06 Setting)
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REVISION HISTORY
Changes from Revision L (April 2013) to Revision M
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 18
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Apr-2013
PACKAGING INFORMATION
Orderable Device
DS16EV5110SQ/NOPB
DS16EV5110SQX/NOPB
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
WQFN
WQFN
NJU
48
48
250
Green (RoHS
& no Sb/Br)
CU SN
CU SN
Level-3-260C-168 HR
DS16EV511
DS16EV511
ACTIVE
NJU
2500
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DS16EV5110SQ/NOPB WQFN
DS16EV5110SQX/NOPB WQFN
NJU
NJU
48
48
250
178.0
330.0
16.4
16.4
7.3
7.3
7.3
7.3
1.3
1.3
12.0
12.0
16.0
16.0
Q1
Q1
2500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
DS16EV5110SQ/NOPB
DS16EV5110SQX/NOPB
WQFN
WQFN
NJU
NJU
48
48
250
213.0
367.0
191.0
367.0
55.0
38.0
2500
Pack Materials-Page 2
MECHANICAL DATA
NJU0048D
SQA48D (Rev A)
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