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DLP9500

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

DLP9500 DLP^®0.95 1080p 2x LVDS A 型 DMD

1 特性

3 说明

•

0.95 英寸对角线微镜阵列

DLP9500 1080p 芯片组是 DLP^®Discovery™4100 平

1

台的一部分，用于实现高分辨率、高性能的空间照明调

制。DLP9500 是 0.95 1080p 芯片组的基本款数字微

镜器件 (DMD)。DLP Discovery 4100 平台还提供具有

随机行寻址选项的最高级独立微镜控制。除了采用密封

封装外，DLP9500 具有独特的功能和价值，非常适合

支持各种工业、医疗和高级显示应用的需求。

–

1920 × 1080 铝阵列，微米级微镜（1080p 分

辨率）

–

10.8µm 微镜间距

±12°微镜倾斜角（相对于平板状态）

设计用于边缘照明

专用于可见光

（400nm 至 700nm）：

除了 DLP9500 DMD 以外，0.95 1080p 芯片组还包括

专用的 DLPC410 控制器（用于支持 23,148Hz（1 位

二进制）和 2,893Hz（8 位灰度）的）、一个

–

窗透射率 96%（单通，通过两个窗面）

微镜反射率 89%

阵列衍射效率 87%

DLPR410 单元（DLP Discovery 4100 配置 PROM）

和两个 DLPA200 单元（DMD 微镜驱动器）。

阵列填充因子 94%

四条 16 位低压差分信令 (LVDS)、双倍数据速率

(DDR) 输入数据总线

DLP9500 需要与芯片组的其他元件结合使用才能实现

可靠功能和操作。一套专用的芯片组能够使开发人员更

加轻松地访问 DMD 并使用高速而独立的微镜控制。

•

高达 400MHz 的输入数据时钟速率

42.2mm × 42.2mm × 7mm 封装尺寸

气密封装

DLP9500 是一款数控微光机电系统 (MEMS) 空间照明

调制器 (SLM)。当与适当的光系统成对使用

时，DLP9500 可用于调制入射光的振幅、方向和/或相

位。

2 应用

•

工业：

–

数字成像平版印刷

器件信息 ⁽¹⁾

激光打标

器件型号

DLP9500

封装

封装尺寸（标称值）

LCD 和 OLED 修复

计算机直接制版打印机

SLA 3D 打印机

LCCC (355)

42.16mm × 42.16mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

针对机器视觉和工厂自动化的 3D 扫描仪

平板印刷

简化原理图

•

医疗领域：

–

光照治疗器件

眼科学

直接制造

高光谱成像

3D 生物识别

共轭焦显微镜

•

显示：

–

3D 成像显微镜

自适应照明

增强现实和信息覆盖

1

本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确

性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: DLPS025

DLP9500

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

www.ti.com.cn

8.3 Feature Description................................................. 26

8.4 Device Functional Modes........................................ 32

8.5 Window Characteristics and Optics ....................... 34

8.6 Micromirror Array Temperature Calculation............ 35

1

2

3

4

5

6

7

特性.......................................................................... 1

应用.......................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

（说明（续））....................................................... 4

Pin Configuration and Functions......................... 4

Specifications....................................................... 13

7.1 Absolute Maximum Ratings .................................... 13

7.2 Storage Conditions.................................................. 13

7.3 ESD Ratings............................................................ 13

7.4 Recommended Operating Conditions..................... 14

7.5 Thermal Information................................................ 15

7.6 Electrical Characteristics......................................... 15

7.7 LVDS Timing Requirements ................................... 17

7.8 LVDS Waveform Requirements.............................. 18

7.9 Serial Control Bus Timing Requirements................ 19

7.10 Systems Mounting Interface Loads....................... 20

7.11 Micromirror Array Physical Characteristics........... 21

7.12 Micromirror Array Optical Characteristics ............. 22

7.13 Window Characteristics......................................... 23

7.14 Chipset Component Usage Specification ............. 23

Detailed Description ............................................ 23

8.1 Overview ................................................................. 23

8.2 Functional Block Diagram ....................................... 24

8.7 Micromirror Landed-On and Landed-Off Duty

Cycle ........................................................................ 38

9

Application and Implementation ........................ 40

9.1 Application Information............................................ 40

9.2 Typical Application ................................................. 41

10 Power Supply Recommendations ..................... 43

10.1 Power-Up Sequence (Handled by the DLPC410) 43

10.2 DMD Power-Up and Power-Down Procedures..... 43

11 Layout................................................................... 44

11.1 Layout Guidelines ................................................. 44

11.2 Layout Example .................................................... 46

12 器件和文档支持 ..................................................... 47

12.1 器件支持 ............................................................... 47

12.2 文档支持................................................................ 48

12.3 相关链接................................................................ 48

12.4 接收文档更新通知 ................................................. 48

12.5 社区资源................................................................ 48

12.6 商标....................................................................... 48

12.7 静电放电警告......................................................... 48

12.8 术语表 ................................................................... 48

13 机械、封装和可订购信息....................................... 48

8

4 修订历史记录

注：之前版本的页码可能与当前版本有所不同。

Changes from Revision D (March 2017) to Revision E

Page

•

已更改窗透射率 .................................................................................................................................................................... 1

已更改微镜反射率 ................................................................................................................................................................. 1

已更改阵列衍射效率 ............................................................................................................................................................. 1

已更改阵列填充因子 .............................................................................................................................................................. 1

已更改高速图形速率 .............................................................................................................................................................. 1

Changed Recommended Operating Conditions table; split Environmental into 3 wavelength regions; simplified and

reorganized the table footnotes............................................................................................................................................ 14

•

Changed Thermal Metric text ............................................................................................................................................... 15

Changed Micromirror array optical efficiency ...................................................................................................................... 22

Changed Micromirror array fill factor ................................................................................................................................... 22

Changed Micromirror array diffraction efficiency ................................................................................................................. 22

Changed Micromirror surface reflectivity ............................................................................................................................. 22

Changed Window transmission ........................................................................................................................................... 22

Changed Window transmittance, Minimum ......................................................................................................................... 23

Changed Window transmittance, Average .......................................................................................................................... 23

Changed Micromirror Array Temperature Calculation to indicate that it is based on lumens.............................................. 36

Added Micromirror Array Temperature Calculation based on power ................................................................................... 37

已添加接收文档更新通知部分............................................................................................................................................. 48

2

DLP9500

www.ti.com.cn

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

Changes from Revision C (September 2015) to Revision D

Page

•

Removed '692' from Pin Configurations image ...................................................................................................................... 4

Added RH name for relative humidity in Absolute Maximum Ratings.................................................................................. 13

Clarified T_GRADIENTfootnote in Absolute Maximum Ratings.................................................................................................. 13

Changed T_stgto T_DMDin Storage Conditions to conform to current nomenclature............................................................... 13

Changed typical micromirror crossover time to the time required to transition from mirror position to the other in

Micromirror Array Optical Characteristics............................................................................................................................. 22

•

Added typical micromirror switching time - 13 µs in Micromirror Array Optical Characteristics .......................................... 22

Changed "Micromirror switching time" to "Array switching time" for clarity in Micromirror Array Optical Characteristics.... 22

Added clarification to Micromirror switching time at 400 MHz with global reset in Micromirror Array Optical

Characteristics...................................................................................................................................................................... 22

•

更新了图 20 和图 21............................................................................................................................................................. 47

已添加相关链接表............................................................................................................................................................... 48

Changes from Revision B (July 2013) to Revision C

Page

•

添加了 ESD 额定值表、特性说明部分、器件功能模式、应用和实施部分、电源建议部分、布局部分、器件和文档

支持部分以及机械、封装和可订购信息部分 ......................................................................................................................... 1

在特性和说明部分进行了少量措辞更改 .............................................................................................................................. 1

Changed the name of Micromirror clocking pulse reset in Pin Functions ............................................................................ 11

Changed ESD Ratings table to match new standard........................................................................................................... 13

Added Max Recommended DMD Temperature – Derating Curve....................................................................................... 15

Moved Max Recommended DMD Temperature – Derating Curve to ................................................................................. 15

Replaced Figure 4. ............................................................................................................................................................... 19

Changed units from lbs to N................................................................................................................................................. 20

Added explanation for the15 MBRST lines to the DLP9500 from each DLPA200............................................................... 26

Changed Thermal Test Point Location graphic.................................................................................................................... 35

Added program interface to system interface list in Design Requirements.......................................................................... 42

Corrected number of banks of DMD mirrors to 15 in Device Description ............................................................................ 42

删除了 DLP Discovery 4100 芯片组数据表的链接................................................................................................................ 48

添加了社区资源部分 ........................................................................................................................................................... 48

•

Changes from Revision A (September 2012) to Revision B

Page

•

已添加 DLPR4101 增强型 PROM 至芯片组列表中的 DLPR410 ............................................................................................ 1

已添加 DLPR4101 增强型 PROM 至相关文档中的 DLPR410.............................................................................................. 48

Changes from Original (August 2012) to Revision A

Page

•

将器件状态从“产品预览”更改成了“生产” ................................................................................................................................. 1

3

DLP9500

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

www.ti.com.cn

5 （说明（续））

电子方面，DLP9500 由 1 位 CMOS 存储器单元的两维阵列组成，其组织结构为 1920 存储器单元列乘以 1080 存

储器单元行的栅格。CMOS 存储器阵列通过四条 16 位低压差分信令 (LVDS) 双倍数据速率 (DDR) 总线逐行进行寻

址。寻址通过串行控制总线处理。特定的 CMOS 存储器访问协议由 DLPC410 数字控制器处理。

6 Pin Configuration and Functions

FLN Type A Package

355-Pin LCCC

Bottom View

31

29

27

25

23

21

19

17

15

13

11

9

7

5

3

1

30

28

26

24

22

20

18

16

14

12

10

8

6

4

2

A

C

E

G

J

B

D

F

H

K

M

P

T

L

N

R

U

V

W

Y

AA

AB

AC

AD

AE

AF

AG

AH

AJ

AK

AL

4

DLP9500

www.ti.com.cn

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

Pin Functions

(1)

TYPE

(I/O/P)

DATA

INTERNAL

TRACE

(MILS)

SIGNAL

CLOCK

DESCRIPTION

(2)

(3)

RATE

TERM

NAME

NO.

DATA BUS A

Differentially

terminated – 100 Ω

D_AN(0)

D_AN(1)

D_AN(2)

D_AN(3)

D_AN(4)

D_AN(5)

D_AN(6)

D_AN(7)

D_AN(8)

D_AN(9)

D_AN(10)

D_AN(11)

D_AN(12)

D_AN(13)

D_AN(14)

D_AN(15)

D_AP(0)

D_AP(1)

D_AP(2)

D_AP(3)

D_AP(4)

D_AP(5)

D_AP(6)

D_AP(7)

D_AP(8)

D_AP(9)

D_AP(10)

F2

H8

Input

LVCMOS

DDR

DCLK_A

512.01

158.79

471.24

159.33

585.41

551.17

229.41

300.54

346.35

782.27

451.52

74.39

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

E5

Differentially

terminated – 100 Ω

G9

Differentially

terminated – 100 Ω

D2

Differentially

terminated – 100 Ω

G3

Differentially

terminated – 100 Ω

E11

F8

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

C9

Differentially

terminated – 100 Ω

H2

Differentially

terminated – 100 Ω

B10

G15

D14

F14

C17

H16

F4

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

194.26

148.29

244.9

Input data bus A

(2x LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

73.39

Differentially

terminated – 100 Ω

509.63

152.59

464.09

152.39

591.39

532.16

230.78

300.61

338.16

773.17

449.57

Differentially

terminated – 100 Ω

H10

E3

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

G11

D4

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

G5

Differentially

terminated – 100 Ω

E9

Differentially

terminated – 100 Ω

F10

C11

H4

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

B8

(1) The following power supplies are required to operate the DMD: VCC, VCC1, VCC2. VSS must also be connected.

(2) DDR = Double Data Rate. SDR = Single Data Rate. Refer to the LVDS Timing Requirements for specifications and relationships.

(3) Refer to Electrical Characteristics for differential termination specification.

5

DLP9500

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

www.ti.com.cn

Pin Functions (continued)

(1)

TYPE

(I/O/P)

DATA

RATE

INTERNAL

TERM

TRACE

(MILS)

SIGNAL

CLOCK

DESCRIPTION

(2)

(3)

NAME

NO.

Differentially

terminated – 100 Ω

D_AP(11)

H14

Input

LVCMOS

DDR

DCLK_A

71.7

Differentially

terminated – 100 Ω

D_AP(12)

D_AP(13)

D_AP(14)

D16

F16

C15

G17

DDR

198.69

143.72

240.14

74.05

Input data bus A

(2x LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

D_AP(15)

DATA BUS B

D_BN(0)

Differentially

terminated – 100 Ω

AH2

AD8

Input

LVCMOS

DDR

DCLK_B

525.25

190.59

525.25

494.91

222.67

205.45

309.05

285.62

483.58

711.58

462.21

74.39

Differentially

terminated – 100 Ω

D_BN(1)

D_BN(2)

D_BN(3)

D_BN(4)

D_BN(5)

D_BN(6)

D_BN(7)

D_BN(8)

D_BN(9)

D_BN(10)

D_BN(11)

D_BN(12)

D_BN(13)

D_BN(14)

D_BN(15)

D_BP(0)

D_BP(1)

D_BP(2)

D_BP(3)

D_BP(4)

D_BP(5)

D_BP(6)

D_BP(7)

D_BP(8)

Differentially

terminated – 100 Ω

AJ5

Differentially

terminated – 100 Ω

AE3

Differentially

terminated – 100 Ω

AG9

AE11

AH10

AF10

AK8

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

AG5

AL11

AE15

AH14

AF14

AJ17

AD16

AH4

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Input data bus B

(2x LVDS)

Differentially

terminated – 100 Ω

194.26

156

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

247.9

Differentially

terminated – 100 Ω

111.52

525.02

190.61

524.22

476.07

222.8

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

AD10

AJ3

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

AE5

Differentially

terminated – 100 Ω

AG11

AE9

Differentially

terminated – 100 Ω

219.48

306.55

298.04

480.31

Differentially

terminated – 100 Ω

AH8

Differentially

terminated – 100 Ω

AF8

Differentially

terminated – 100 Ω

AK10

6

DLP9500

www.ti.com.cn

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

Pin Functions (continued)

(1)

TYPE

(I/O/P)

DATA

RATE

INTERNAL

TERM

TRACE

(MILS)

SIGNAL

CLOCK

DESCRIPTION

(2)

(3)

NAME

NO.

Differentially

terminated – 100 Ω

D_BP(9)

AG3

Input

LVCMOS

DDR

DCLK_B

727.18

Differentially

terminated – 100 Ω

D_BP(10)

D_BP(11)

D_BP(12)

D_BP(13)

D_BP(14)

AL9

DDR

461.02

71.35

Differentially

terminated – 100 Ω

AD14

AH16

AF16

AJ15

AE17

Input data bus B

(2x LVDS)

Differentially

terminated – 100 Ω

197.69

150.38

243.14

113.36

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

D_BP(15)

DATA BUS C

D_CN(0)

Differentially

terminated – 100 Ω

B14

E15

A17

G21

B20

F20

D22

G23

B26

F28

C29

G27

D26

H28

E29

J29

Input

LVCMOS

DDR

DCLK_C

459.04

342.79

456.22

68.24

Differentially

terminated – 100 Ω

D_CN(1)

D_CN(2)

D_CN(3)

D_CN(4)

D_CN(5)

D_CN(6)

D_CN(7)

D_CN(8)

D_CN(9)

D_CN(10)

D_CN(11)

D_CN(12)

D_CN(13)

D_CN(14)

D_CN(15)

D_CP(0)

D_CP(1)

D_CP(2)

D_CP(3)

D_CP(4)

D_CP(5)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

362.61

163.07

204.16

105.59

450.51

302.04

429.8

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Input data bus C

(2x LVDS)

Differentially

terminated – 100 Ω

317.1

Differentially

terminated – 100 Ω

276.76

186.78

311.3

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

262.62

463.64

347.65

456.45

67.72

Differentially

terminated – 100 Ω

B16

E17

A15

H20

B22

F22

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

362.76

161.69

Differentially

terminated – 100 Ω

7

DLP9500

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

www.ti.com.cn

Pin Functions (continued)

(1)

TYPE

(I/O/P)

DATA

RATE

INTERNAL

TERM

TRACE

(MILS)

SIGNAL

CLOCK

DESCRIPTION

(2)

(3)

NAME

NO.

Differentially

terminated – 100 Ω

D_CP(6)

D20

Input

LVCMOS

DDR

DCLK_C

195.09

104.86

451.41

294.22

429.68

314.98

276.04

186.25

312.07

262.94

Differentially

terminated – 100 Ω

D_CP(7)

D_CP(8)

D_CP(9)

D_CP(10)

D_CP(11)

D_CP(12)

D_CP(13)

D_CP(14)

H22

B28

F26

C27

G29

D28

H26

E27

J27

DDR

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Input data bus C

(2x LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

D_CP(15)

DATA BUS D

D_DN(0)

Differentially

terminated – 100 Ω

AK14

AG15

AL17

AE21

AK20

AF20

AH22

AE23

AK26

AF28

AJ29

AE27

Input

LVCMOS

DDR

DCLK_D

492.53

342.78

491.83

74.24

Differentially

terminated – 100 Ω

D_DN(1)

D_DN(2)

D_DN(3)

D_DN(4)

D_DN(5)

D_DN(6)

D_DN(7)

D_DN(8)

D_DN(9)

D_DN(10)

D_DN(11)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

356.23

163.07

204.16

105.59

450.51

302.04

429.8

Differentially

terminated – 100 Ω

Input data bus D

(2x LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

298.87

8

DLP9500

www.ti.com.cn

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

Pin Functions (continued)

(1)

TYPE

(I/O/P)

DATA

RATE

INTERNAL

TERM

TRACE

(MILS)

SIGNAL

CLOCK

DESCRIPTION

(2)

(3)

NAME

NO.

Differentially

terminated – 100 Ω

D_DN(12)

AH26

Input

LVCMOS

DDR

DCLK_D

276.76

Differentially

terminated – 100 Ω

D_DN(13)

D_DN(14)

D_DN(15)

D_DP(0)

D_DP(1)

D_DP(2)

D_DP(3)

D_DP(4)

D_DP(5)

D_DP(6)

D_DP(7)

D_DP(8)

D_DP(9)

D_DP(10)

D_DP(11)

D_DP(12)

D_DP(13)

D_DP(14)

D_DP(15)

AD28

AG29

AC29

AK16

AG17

AL15

AD20

AK22

AF22

AH20

AD22

AK28

AF26

AJ27

AE29

AH28

AD26

AG27

AC27

DDR

186.78

311.3

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

262.62

495.13

342.47

492.06

67.72

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

356.37

161.98

195.09

102.86

451.41

296.7

Differentially

terminated – 100 Ω

Input data bus D

(2x LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

429.68

302.74

276.04

186.25

312.07

262.94

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

9

DLP9500

ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

www.ti.com.cn

Pin Functions (continued)

(1)

TYPE

(I/O/P)

DATA

RATE

INTERNAL

TERM

TRACE

(MILS)

SIGNAL

CLOCK

DESCRIPTION

(2)

(3)

NAME

NO.

DATA CLOCKS

Differentially

terminated – 100 Ω

DCLK_AN

DCLK_AP

DCLK_BN

DCLK_BP

DCLK_CN

DCLK_CP

DCLK_DN

D10

D8

Input

LVCMOS

—

325.8

319.9

Input data bus A

Clock (2x LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

AJ11

AJ9

318.92

318.74

252.01

241.18

252.01

241.18

Input data bus B

Clock (2x LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

C23

C21

AJ23

AJ21

Input data bus C

Clock (2x LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Input data bus D

Clock (2x LVDS)

Differentially

terminated – 100 Ω

DCLK_DP

DATA CONTROL INPUTS

SCTRL_AN

Differentially

terminated – 100 Ω

J3

J5

Input

LVCMOS

DDR

DCLK_A

DCLK_B

DCLK_C

DCLK_D

608.14

607.45

698.12

703.8

Serial control for

data bus A (2x

LVDS)

Differentially

terminated – 100 Ω

SCTRL_AP

SCTRL_BN

SCTRL_BP

SCTRL_CN

SCTRL_CP

SCTRL_DN

SCTRL_DP

Differentially

terminated – 100 Ω

AF4

AF2

E23

E21

AG23

AG21

Serial control for

data bus B (2x

LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

232.46

235.21

235.53

235.66

Serial control for

data bus C (2x

LVDS)

Differentially

terminated – 100 Ω

Differentially

terminated – 100 Ω

Serial control for

data bus D (2x

LVDS)

Differentially

terminated – 100 Ω

SERIAL COMMUNICATION AND CONFIGURATION

SCPCLK

SCPDO

SCPDI

AE1

AC3

AD2

AD4

B4

Input

Output

Input

LVCMOS

—

pull-down

—

SCP_CLK

—

Serial port clock

Serial port output

Serial port input

Serial port enable

Device reset

324.26

281.38

261.55

184.86

458.78

471.57

521.99

pull-down

SCPEN

PWRDN

MODE_A

MODE_B

J1

—

Data bandwidth

mode select

G1

—

10

DLP9500

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ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

Pin Functions (continued)

(1)

TYPE

(I/O/P)

DATA

RATE

INTERNAL

TERM

TRACE

(MILS)

SIGNAL

CLOCK

DESCRIPTION

(2)

(3)

NAME

NO.

MICROMIRROR CLOCKING PULSE (BIAS RESET)

MBRST(0)

MBRST(1)

MBRST(2)

MBRST(3)

MBRST(4)

MBRST(5)

MBRST(6)

MBRST(7)

MBRST(8)

MBRST(9)

MBRST(10)

MBRST(11)

MBRST(12)

MBRST(13)

MBRST(14)

MBRST(15)

MBRST(16)

MBRST(17)

MBRST(18)

MBRST(19)

MBRST(20)

MBRST(21)

MBRST(22)

MBRST(23)

MBRST(24)

MBRST(25)

MBRST(26)

MBRST(27)

MBRST(28)

MBRST(29)

POWER

L5

M28

P4

Input

Analog

—

898.97

621.98

846.88

784.18

763.34

749.61

878.25

783.83

969.36

621.24

918.43

685.14

812.31

591.89

878.5

P30

L3

P28

P2

T28

M4

L29

T4

N29

N3

Micromirror clocking

pulse reset MBRST

signals clock

micromirrors into

state of LVCMOS

memory cell

L27

R3

V28

V4

660.15

848.64

796.31

715

associated with each

mirror.

R29

Y4

AA27

W3

W27

AA3

W29

U5

604.35

832.39

675.21

861.18

662.66

850.06

726.56

861.48

683.83

878.5

U29

Y2

AA29

U3

Y30

789.2

A3, A5, A7, A9,

A11, A13, A21,

A23, A25, A27,

A29, B2,

C1, C31, E31,

G31, J31, K2,

L31, N31, R31,

U31, W31,

Power for LVCMOS

logic

VCC

Power

Analog

—

AA31, AC1,

AC31, AE31,

AG1, AG31,

AJ31, AK2,

AK30, AL3, AL5,

AL7, AL19, AL21,

AL23, AL25,

AL27

H6, H12, H18,

H24, M6, M26,

P6, P26, T6, T26,

V6, V26,

Power supply for

LVDS Interface

VCCI

Power

Analog

—

Y6, Y26, AD6,

AD12, AD18,

AD24

11

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ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

www.ti.com.cn

Pin Functions (continued)

(1)

TYPE

(I/O/P)

DATA

RATE

INTERNAL

TERM

TRACE

(MILS)

SIGNAL

CLOCK

DESCRIPTION

(2)

(3)

NAME

NO.

L1, N1, R1, U1,

W1, AA1

Power for high

voltage CMOS logic

VCC2

Power

Analog

—

A1, B12, B18,

B24, B30, C7,

C13, C19, C25,

D6, D12,

D18, D24, D30,

E1, E7, E13, E19,

E25, F6, F12,

F18, F24,

F30, G7, G13,

G19, G25, K4,

K6, K26, K28,

K30, M2, M30,

N5, N27, R5, T2,

T30, U27, V2,

V30, W5, Y28,

AB2, AB4,

Common return for

all power inputs

VSS

Power

Analog

—

AB6, AB26,

AB28, AB30,

AD30, AE7,

AE13, AE19,

AE25, AF6,

AF12, AF18,

AF24, AF30,

AG7, AG13,

AG19, AG25,

AH6, AH12,

AH18, AH24,

AH30, AJ1,

AJ7, AJ13, AJ19,

AJ25, AK6, AK12,

AK18, AL29

RESERVED SIGNALS (NOT FOR USE IN SYSTEM)

RESERVED_FC

RESERVED_FD

RESERVED_PFE

RESERVED_STM

RESERVED_AE

J7

Input

LVCMOS

—

pull-down

—

J9

pull-down

Pins should be

connected to VSS

J11

AC7

C3

A19, B6, C5,

H30, J13, J15,

J17, J19, J21,

J23, J25, R27,

No connection (any

connection to these

terminals may result

in undesirable

AA5, AC11,

AC13, AC15,

AC17, AC19,

AC21, AC23,

NO_CONNECT

—

effects)

AC25, AC5, AC9,

AK24, AK4, AL13

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ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted).

(1)

MIN

MAX

UNIT

ELECTRICAL

(2) (3)

V_CC

Voltage applied to V_CC

Voltage applied to V_CCI

–0.5

4

9

V

(2) (3)

V_CCI

V_CC2

(2) (3) (4)

Voltage applied to V_VCC2

Clocking pulse waveform voltage applied to MBRST[29:0] input pins (supplied

by DLPA200s)

V_MBRST

–28

28

V

(4)

|V_CC– V_CCI

|

Supply voltage delta (absolute value)

0.3

V

(2)

Voltage applied to all other input terminals

–0.5

V_CC+ 0.3

Maximum differential voltage, damage can occur to internal termination resistor

if exceeded, see Figure 3

|V_ID

|

700

mV

Current required from a high-level output, V_OH= 2.4 V

Current required from a low-level output, V_OL= 0.4 V

–20

15

mA

ENVIRONMENTAL

(5)

Array temperature – operational

20

70

80

°C

T_ARRAY

(5)

Array temperature – non-operational

–40

Absolute temperature delta between the window test points (TP2, TP3) and the

ceramic test point TP1

T_DELTA

RH

10

95

°C

%

(6)

Relative humidity (non-condensing)

(1) Stresses beyond those listed under may cause permanent damage to the device. These are stress ratings only, which do not imply

functional operation of the device at these or any other conditions beyond those indicated under . Exposure to absolute-maximum-rated

conditions for extended periods may affect device reliability.

(2) All voltages referenced to V_SS(ground).

(3) Voltages V_CC, V_CCI, and V_CC2are required for proper DMD operation.

(4) Exceeding the recommended allowable absolute voltage difference between V_CCand V_CCImay result in excess current draw. The

difference between V_CCand V_CCI, |V_CC– V_CCI|, should be less than the specified limit.

(5) The worst-case temperature of any test point shown in Figure 17, or the active array as calculated by the Micromirror Array Temperature

Calculation - Lumens Based.

(6) As either measured, predicted, or both between any two points - measured on the exterior of the package, or as predicted at any point

inside the micromirror array cavity. Refer to Micromirror Array Temperature Calculation - Lumens Based.

7.2 Storage Conditions

Applicable for the DMD as a component or non-operating in a system

MIN

MAX

80

UNIT

°C

T_DMD

RH

Storage temperature

–40

Storage humidity (non-condensing)

95

%

7.3 ESD Ratings

VALUE

±2000

±250

UNIT

All pins except

MBRST[29:0]

Electrostatic

V_ESD

(1)

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001

V

discharge

MBRST[29:0] pins

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible if necessary precautions are taken.

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7.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

NOM

MAX

UNIT

(2) (3)

ELECTRICAL

V_CC

Supply voltage for LVCMOS core logic

Supply voltage for LVDS receivers

3.0

3.3

8.5

3.6

V

V_CC1

V_CC2

Mirror electrode and HVCMOS supply voltage

8.25

8.75

Clocking Pulse Waveform Voltage applied to MBRST[29:0] Input Pins (supplied by

DLPA200s)

VMBRST

-27

26.5

0.3

V

(4)

|VCCI–VCC|

Supply voltage delta (absolute value)

ENVIRONMENTAL ⁽⁵⁾For Illumination Source Between 420 nm and 700 nm

(6)(7) (8)(9)

(10)

Array temperature, Long–term operational

20

0

25-45

65

T_ARRAY

°C

(6)(7) (11)

Array temperature, Short–term operational

20

T_WINDOW

|T_DELTA

ILL_VIS

Window temperature test points TP2 and TP3, Long-term operational⁽⁹⁾

.

10

70

10

°C

Absolute temperature delta between the window test points (TP2, TP3) and the

ceramic test point TP1.⁽¹²⁾

|

Thermally

limited

Illumination⁽¹³⁾

W/cm²

ENVIRONMENTAL ⁽⁵⁾For Illumination Source Between 400 nm and 420 nm

(6)(7) (8)(9)

T_ARRAY

Array temperature, Long–term operational

20

30

°C

T_WINDOW

Window temperature test points TP2 and TP3, Long-term operational⁽⁹⁾

Absolute temperature delta between the window test points (TP2, TP3) and the

ceramic test point TP1.⁽¹²⁾

|T_DELTA

|

10

°C

W/cm²

W

11

ILL

Illumination⁽¹³⁾

26.6

ENVIRONMENTAL ⁽⁵⁾For Illumination Source <400 nm and >700 nm

(6)(7) (8)(9)

(10)

Array temperature, Long–term operational

20

0

40

T_ARRAY

°C

(6)(7) (11)

Array temperature, Short–term operational

20

70

10

T_WINDOW

ILL

Window temperature test points TP2 and TP3, Long-term operational⁽⁹⁾

Illumination⁽¹³⁾

10

°C

mW/cm²

(1) The functional performance of the device specified in this data sheet is achieved when operating the device within the limits defined by

the Recommended Operating Conditions. No level of performance is implied when operating the device above or below the

Recommended Operating Conditions limits.

(2) Voltages V_CC, V_CC1, and V_CC2are required for proper DMD operation. V_SSmust also be connected.

(3) All voltages are referenced to common ground V_SS

.

(4) Exceeding the recommended allowable absolute voltage difference between V_CCand V_CC1may result in excess current draw. The

difference between VCC and V_CC1, |V_CC– V_CC1|, should be less than the specified limit.

(5) Optimal, long-term performance and optical efficiency of the Digital Micromirror Device (DMD) can be affected by various application

parameters, including illumination spectrum, illumination power density, micromirror landed duty-cycle, ambient temperature (storage

and operating), DMD temperature, ambient humidity (storage and operating), and power on or off duty cycle. TI recommends that

application-specific effects be considered as early as possible in the design cycle.

(6) In some applications, the total DMD heat load can be dominated by the amount of incident light energy absorbed. See Micromirror Array

Temperature Calculation for further details.

(7) The array temperature cannot be measured directly and must be computed analytically from the temperature measured at test point 1

(TP1) shown in Figure 17 and the package thermal resistance in Thermal Information using Micromirror Array Temperature Calculation.

(8) Simultaneous exposure of the DMD to the maximum Recommended Operating Conditions for temperature and UV illumination will

reduce device lifetime.

(9) Long-term is defined as the usable life of the device.

(10) Per Figure 1, the maximum operational array temperature should be derated based on the micromirror landed duty cycle that the DMD

experiences in the end application. Refer to Micromirror Landed-On and Landed-Off Duty Cycle for a definition of micromirror landed

duty cycle.

(11) Array temperatures beyond those specified as long-term are recommended for short-term conditions only (power-up). Short-term is

defined as cumulative time over the usable life of the device and is less than 500 hours.

(12) The temperature delta is the highest difference between the ceramic test point (TP1) and window test points (TP2) and (TP3) in

Figure 17.

(13) Total integrated illumination power density on the array in the indicated wavelength range.

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DLP9500

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ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

Figure 1. Max Recommended DMD Temperature – Derating Curve

7.5 Thermal Information

DLP9500

THERMAL METRIC

FLN (Package)

355 PINS

0.5

UNIT

(1)

Thermal resistance, active area to test point 1 (TP1)

°C/W

(1) The DMD is designed to conduct absorbed and dissipated heat to the back of the package where it can be removed by an appropriate

heat sink. The heat sink and cooling system must be capable of maintaining the package within the Recommended Operating

Conditions. The total heat load on the DMD is largely driven by the incident light absorbed by the active area, although other

contributions include light energy absorbed by the window aperture and electrical power dissipation of the array. Optical systems should

be designed to minimize the light energy falling outside the window clear aperture since any additional thermal load in this area can

significantly degrade the reliability of the device.

7.6 Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

(1)

High-level output voltage

See Figure 11

,

V_OH

V_CC= 3 V, I_OH= –20 mA

2.4

V

(1) Applies to LVCMOS pins only.

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Electrical Characteristics (continued)

Over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

(1)

Low-level output voltage

See Figure 11

,

V_OL

V_CC= 3.6 V, I_OH= 15 mA

0.4

V

Clocking pulse waveform applied to

V_MBRSTMBRST[29:0] input pins (supplied by

–27

26.5

V

DLPA200s)

(1)

I_OZ

I_OH

I_OL

High-impedance output current

V_CC= 3.6 V

10

–20

–15

15

µA

V_OH= 2.4 V, V_CC≥ 3 V

V_OH= 1.7 V, V_CC≥ 2.25 V

V_OL= 0.4 V, V_CC≥ 3 V

V_OL= 0.4 V, V_CC≥ 2.25 V

(1)

High-level output current

mA

(1)

Low-level output current

mA

V

14

V_CC

+

(1)

V_IH

High-level input voltage

1.7

0.3

(1)

V_IL

I_IL

Low-level input voltage

–0.3

0.7

–60

60

V

µA

mA

W

(1)

Low-level input current

V_CC= 3.6 V, V_I= 0 V

V_CC= 3.6 V, V_I= V_CC

V_CC= 3.6 V,

(1)

I_IH

High-level input current

I_CC

I_CCI

I_CC2

P_D

Current into V_CCpin

2990

910

25

(2)

Current into V_OFFSETpin

V_CCI= 3.6 V

Current into V_CC2pin

V_CC2= 8.75 V

Power dissipation

4.4

Z_IN

Z_LINE

C_I

Internal differential impedance

Line differential impedance (PWB, trace)

95

90

105

110

10

Ω

100

Ω

(1)

Input capacitance

ƒ = 1 MHz

pF

(1)

C_O

C_IM

Output capacitance

10

Input capacitance for MBRST[29:0] pins

270

355

(2) Exceeding the maximum allowable absolute voltage difference between V_CCand V_CCImay result in excess current draw (See Absolute

Maximum Ratings for details).

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ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

7.7 LVDS Timing Requirements

over operating free-air temperature range (unless otherwise noted); see Figure 2

MIN

200

2.5

NOM

MAX

UNIT

MHz

ns

ƒ_{DCLK_x}

DCLK_x clock frequency (where x = [A, B, C, or D])

Clock cycle - DLCK_x

400

t_c

t_w

Pulse duration - DLCK_x

1.25

ns

t_s

Setup time - D_x[15:0] and SCTRL_x before DCLK_x

Hold time, D_x[15:0] and SCTRL_x after DCLK_x

Skew between any two buses (A ,B, C, and D)

0.35

ns

t_h

ns

t_skew

–1.25

1.25

ns

DCLK_AN

DCLK_AP

t

s

h

t

c

t

s

h

SCTRL_AN

SCTRL_AP

D_AN(15:0)

D_AP(15:0)

DCLK_BN

DCLK_BP

t

s

h

t

c

t

s

h

SCTRL_BN

SCTRL_BP

D_BN(15:0)

D_BP(15:0)

DCLK_CN

DCLK_CP

t

s

h

t

c

t

s

h

SCTRL_CN

SCTRL_CP

D_CN(15:0)

D_CP(15:0)

DCLK_DN

DCLK_DP

t

s

h

t

c

t

s

h

SCTRL_DN

SCTRL_DP

D_DN(15:0)

D_DP(15:0)

Figure 2. LVDS Timing Waveforms

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7.8 LVDS Waveform Requirements

over operating free-air temperature range (unless otherwise noted); see Figure 3

MIN

NOM

400

MAX

UNIT

mV

ps

|V_ID

|

Input differential voltage (absolute difference)

Common mode voltage

100

600

V_CM

1200

V_LVDS

LVDS voltage

0

100

2000

400

t_r

Rise time (20% to 80%)

Fall time (80% to 20%)

400

ps

V_{LVDS max}= V_{CM max}+ | 1/2 × V_{ID max}

|

t_f

V_ID

V_CM

t_r

V_{LVDS min}= V_{CM min}| 1/2 × V_{ID max}

|

Figure 3. LVDS Waveform Requirements

18

DLP9500

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ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

7.9 Serial Control Bus Timing Requirements

over operating free-air temperature range (unless otherwise noted); see Figure 4 and Figure 5

MIN

NOM

MAX

500

300

960

UNIT

kHz

ns

ƒ_{SCP_CLK}

t_{SCP_SKEW}

t_{SCP_DELAY}

t _{SCP_EN}

t_{_SCP}

SCP clock frequency

50

Time between valid SCP_DI and rising edge of SCP_CLK

Time between valid SCP_DO and rising edge of SCP_CLK

Time between falling edge of SCP_EN and the first rising edge of SCP_CLK

Rise time for SCP signals

–300

ns

30

ns

200

ns

t_{ƒ_SCP}

Fall time for SCP signals

ns

t

f

= 1 / t

clock c

c

SCPCLK

50%

t_{SCP_SKEW}

SCPDI

50%

t_{SCP_DELAY}

SCPD0

50%

Figure 4. Serial Communications Bus Timing Parameters

t_{f_SCP}

t_{r_SCP}

Input Controller V_CC

SCP_CLK,

SCP_DI,

SCP_EN

V_CC/2

0 v

Figure 5. Serial Communications Bus Waveform Requirements

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MAX UNIT

7.10 Systems Mounting Interface Loads

PARAMETER

MIN

NOM

Thermal interface area (see Figure 6)

156

1334

712

N

Maximum system mounting interface

load to be applied to the:

Electrical interface area (see Figure 6)

Datum A Interface area (see Figure 6)

Thermal Interface

Area

Electrical Interface

Area

Other Area

Datum ‘A’ Areas

Figure 6. System Interface Loads

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ZHCSA86E –AUGUST 2012–REVISED AUGUST 2018

7.11 Micromirror Array Physical Characteristics

See 机械、封装和可订购信息 for additional details.

VALUE

1920

1080

10.8

UNIT

micromirrors

µm

(1)

M

N

P

Number of active micromirror columns

(1)

Number of active micromirror rows

(1)

Micromirror (pixel) pitch

(1)

Micromirror active array width

M × P

20.736

11.664

10

mm

(1)

Micromirror active array height

N × P

mm

(1) (2)

Micromirror array border

Pond of micromirrors (POM)

micromirrors/side

(1) See Figure 7.

(2) The structure and qualities of the border around the active array includes a band of partially functional micromirrors called the POM.

These micromirrors are structurally and/or electrically prevented from tilting toward the bright or ON state, but still require an electrical

bias to tilt toward OFF.

0

1

2

3

DMD Active Array

N x P

M x N Micromirrors

N œ 4

N œ 3

N œ 2

N œ 1

M x P

P

Border micromirrors omitted for clarity.

Details omitted for clarity.

P

Not to scale.

P

Refer to the Micromirror Array Physical Characteristics table for M, N, and P specifications.

Figure 7. Micromirror Array Physical Characteristics

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7.12 Micromirror Array Optical Characteristics

TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment optical

performance involves making trade-offs between numerous component and system design parameters. See the related

application reports (listed in 相关文档) for guidelines.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

(1) (2) (3)

DMD parked state

,

0

See Figure 12

a

Micromirror tilt angle

degrees

(1) (4) (5)

DMD landed state

See Figure 12

12

(1) (4) (6) (7) (8)

β

Micromirror tilt angle variation

See Figure 12

–1

56

44

1

degrees

µs

(9)

Micromirror crossover time

3

(10)

Micromirror switching time

13

22

µs

(11)

Array switching time at 400 MHz with global reset

µs

Non-adjacent micromirrors

Adjacent micromirrors

See Figure 12

10

0

(12)

Non-operating micromirrors

micromirrors

degrees

(13)

Orientation of the micromirror axis-of-rotation

45

46

400 to 700 nm, with all

micromirrors in the ON state

(14) (15)

Micromirror array optical efficiency

70%

(1) Measured relative to the plane formed by the overall micromirror array.

(2) Parking the micromirror array returns all of the micromirrors to an essentially flat (0˚) state (as measured relative to the plane formed by

the overall micromirror array).

(3) When the micromirror array is parked, the tilt angle of each individual micromirror is uncontrolled.

(4) Additional variation exists between the micromirror array and the package datums, as shown in 机械、封装和可订购信息.

(5) When the micromirror array is landed, the tilt angle of each individual micromirror is dictated by the binary contents of the CMOS

memory cell associated with each individual micromirror. A binary value of 1 results in a micromirror landing in an nominal angular

position of +12°. A binary value of 0 results in a micromirror landing in an nominal angular position of –12°.

(6) Represents the landed tilt angle variation relative to the nominal landed tilt angle.

(7) Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different

devices.

(8) For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some

system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field

reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in

colorimetry variations and/or system contrast variation.

(9) Micromirror crossover time is the transition time from landed to landed during a crossover transition and primarily a function of the

natural response time of the micromirrors.

(10) Micromirror switching time is the time after a micromirror clocking pulse until the micromirrors can be addressed again. It included the

micromirror settling time.

(11) Array switching is controlled and coordinated by the DLPC410 (DLPS024) and DLPA200 (DLPS015). Nominal switching time depends

on the system implementation and represents the time for the entire micromirror array to be refreshed (array loaded plus reset and

mirror settling time).

(12) Non-operating micromirror is defined as a micromirror that is unable to transition nominally from the –12° position to +12° or vice versa.

(13) Measured relative to the package datums 'B' and 'C', shown in the 机械、封装和可订购信息.

(14) The minimum or maximum DMD optical efficiency observed in a specific application depends on numerous application-specific design

variables, such as:

(a) Illumination wavelength, bandwidth/line-width, degree of coherence

(b) Illumination angle, plus angle tolerance

(c) Illumination and projection aperture size, and location in the system optical path

(d) Illumination overfill of the DMD micromirror array

(e) Aberrations present in the illumination source and/or path

(f) Aberrations present in the projection path

The specified nominal DMD optical efficiency is based on the following use conditions:

(a) Visible illumination (400 to 700 nm)

(b) Input illumination optical axis oriented at 24° relative to the window normal

(c) Projection optical axis oriented at 0° relative to the window normal

(d) ƒ / 3 illumination aperture

(e) ƒ / 2.4 projection aperture

Based on these use conditions, the nominal DMD optical efficiency results from the following four components:

(a) Micromirror array fill factor: nominally 94%

(b) Micromirror array diffraction efficiency: nominally 87%

(c) Micromirror surface reflectivity: nominally 89%

(d) Window transmission: nominally 96% (single pass, through two surface transitions)

(15) Does not account for the effect of micromirror switching duty cycle, which is application dependent. Micromirror switching duty cycle

represents the percentage of time that the micromirror is actually reflecting light from the optical illumination path to the optical projection

path. This duty cycle depends on the illumination aperture size, the projection aperture size, and the micromirror array update rate.

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7.13 Window Characteristics

(1)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Window material designation

Window refractive index

Corning 7056

At wavelength 589 nm

1.487

(2)

Window flatness

Per 25 mm

4

fringes

µm

(3)

Window artifact size

Window aperture

Illumination overfill

Within the Window Aperture

400

(4)

See

Refer to Illumination Overfill

At wavelength 405 nm. Applies to 0° and 24° AOI only.

95%

96%

Minimum within the wavelength range 420 nm to 680 nm.

Applies to all angles 0° to 30° AOI.

Window transmittance, single–pass

(5)

through both surfaces and glass

Average over the wavelength range 420 nm to 680 nm.

Applies to all angles 30° to 45° AOI.

96%

(1) See Window Characteristics and Optics for more information.

(2) At a wavelength of 632.8 nm.

(3) See the 机械、封装和可订购信息 section at the end of this document for details regarding the size and location of the window aperture.

(4) For details regarding the size and location of the window aperture, see the package mechanical characteristics listed in the Mechanical

ICD in the Mechanical, Packaging, and Orderable Information section.

(5) See the TI application report DLPA031, Wavelength Transmittance Considerations for DLP DMD Window.

7.14 Chipset Component Usage Specification

The DLP9500 is a component of one or more DLP chipsets. Reliable function and operation of the DLP9500

requires that it be used in conjunction with the other components of the applicable DLP chipset, including those

components that contain or implement TI DMD control technology. TI DMD control technology is the TI

technology and devices for operating or controlling a DLP DMD.

8 Detailed Description

8.1 Overview

Optically, the DLP9500 consists of 2,073,600 highly reflective, digitally switchable, micrometer-sized mirrors

(micromirrors), organized in a two-dimensional array of 1920 micromirror columns by 1080 micromirror rows ().

Each aluminum micromirror is approximately 10.8 microns in size (see the Micromirror Pitch in ) and is

switchable between two discrete angular positions: –12° and 12°. The angular positions are measured relative to

a 0° flat state, which is parallel to the array plane (see Figure 12). The tilt direction is perpendicular to the hinge-

axis, which is positioned diagonally relative to the overall array. The On State landed position is directed toward

row 0, column 0 (upper left) corner of the device package (see the Micromirror Hinge-Axis Orientation in ). In the

field of visual displays, the 1920 × 1080 pixel resolution is referred to as 1080p.

Each individual micromirror is positioned over a corresponding CMOS memory cell. The angular position of a

specific micromirror is determined by the binary state (logic 0 or 1) of the corresponding CMOS memory cell

contents, after the mirror clocking pulse is applied. The angular position (–12° or +12°) of the individual

micromirrors changes synchronously with a micromirror clocking pulse, rather than being synchronous with the

CMOS memory cell data update. Therefore, writing a logic 1 into a memory cell followed by a mirror clocking

pulse will result in the corresponding micromirror switching to a 12° position. Writing a logic 0 into a memory cell

followed by a mirror clocking pulse will result in the corresponding micromirror switching to a –12° position.

Updating the angular position of the micromirror array consists of two steps. First, updating the contents of the

CMOS memory. Second, application of a micromirror clocking pulse to all or a portion of the micromirror array

(depending upon the configuration of the system). Micromirror clocking pulses are generated externally by two

DLPA200s, with application of the pulses being coordinated by the DLPC410 controller.

Around the perimeter of the 1920 by 1080 array of micromirrors is a uniform band of border micromirrors. The

border micromirrors are not user-addressable. The border micromirrors land in the –12° position once power has

been applied to the device. There are 10 border micromirrors on each side of the 1920 by 1080 active array.

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Overview (continued)

Figure 8 shows a DLPC410 and DLP9500 chipset block diagram. The DLPC410 and DLPA200s control and

coordinate the data loading and micromirror switching for reliable DLP9500 operation. The DLPR410 is the

programmed PROM required to properly configure the DLPC410 controller. For more information on the chipset

components, see Application and Implementation. For a typical system application using the DLP Discovery 4100

chipset including a DLP9500, see Figure 18.

8.2 Functional Block Diagram

Figure 8 shows a simplified system block diagram with the use of the DLPC410 with the following chipset

components:

DLPC410

Xilinx [XC5VLX30] FPGA configured to provide high-speed DMD data and control, and DLPA200

timing and control

DLPR410

DLPA200

DLP9500

[XCF16PFSG48C] serial flash PROM contains startup configuration information (EEPROM)

Two DMD micromirror drivers for the DLP9500 DMD

Spatial light modulator (DMD)

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8.3 Feature Description

Table 1. DMD Overview

SINGLE BLOCK

MODE

(Patterns/s)

GLOBAL RESET

MODE

(Patterns/s)

DATA RATE

(Giga Pixels/s)

DMD

ARRAY

MIRROR PITCH

DLP9500 - 0.95" 1080p

1920 × 1080

23148

17857

48

10.8 μm

8.3.1 DLPC410 - Digital Controller for DLP Discovery 4100 Chipset

The DLPC410 chipset includes the DLPC410 controller which provides a high-speed LVDS data and control

interface for DMD control. This interface is also connected to a second FPGA used to drive applications (not

included in the chipset). The DLPC410 generates DMD and DLPA200 initialization and control signals in

response to the inputs on the control interface.

For more information, see the DLPC410 data sheet (DLPS024).

8.3.2 DLPA200 - DMD Micromirror Drivers

DLPA200 micromirror drivers provide the micromirror clocking pulse driver functions for the DMD. Two drivers

are required for DLP9500.

The DLPA200 is designed to work with multiple DLP chipsets. Although the DLPA200 contains 16 MBSRT output

pins, only 15 lines are used with the DLP9500 chipset. For more information see and the DLPA200 data sheet

(DLPS015).

8.3.3 DLPR410 - PROM for DLP Discovery 4100 Chipset

The DLPC410 controller is configured at startup from the DLPR410 PROM. The contents of this PROM can not

be altered. For more information, see the DLPR410 data sheet (DLPS027) the DLPC410 data sheet (DLPS024).

8.3.4 DLP9500 - DLP 0.95 1080p 2xLVDS Type-A DMD 1080p DMD

8.3.4.1 DLP9500 1080p Chipset Interfaces

This section will describe the interface between the different components included in the chipset. For more

information on component interfacing, see Application and Implementation.

8.3.4.1.1 DLPC410 Interface Description

8.3.4.1.1.1 DLPC410 IO

Table 2 describes the inputs and outputs of the DLPC410 to the user. For more details on these signals, see the

DLPC410 data sheet (DLPS024).

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Table 2. Input/Output Description

PIN NAME

DESCRIPTION

I/O

ARST

Asynchronous active low reset

I

CLKIN_R

Reference clock, 50 MHz

DIN_[A,B,C,D](15:0)

DCLKIN[A,B,C,D]

DVALID[A,B,C,D]

ROWMD(1:0)

ROWAD(10:0)

BLK_AD(3:0)

BLK_MD(1:0)

PWR_FLOAT

DMD_TYPE(3:0)

RST_ACTIVE

INIT_ACTIVE

VLED0

LVDS DDR input for data bus A,B,C,D (15:0)

LVDS inputs for data clock (200 - 400 MHz) on bus A, B, C, and D

LVDS input used to start write sequence for bus A, B, C, and D

DMD row address and row counter control

DMD row address pointer

I

DMD mirror block address pointer

I

DMD mirror block reset and clear command modes

Used to float DMD mirrors before complete loss of power

DMD type in use

I

O

Indicates DMD mirror reset in progress

Initialization in progress.

System “heartbeat” signal

VLED1

Denotes initialization complete

8.3.4.1.1.2 Initialization

The INIT_ACTIVE (Table 2) signal indicates that the DLP9500, DLPA200s, and DLPC410 are in an initialization

state after power is applied. During this initialization period, the DLPC410 is initializing the DLP9500 and

DLPA200s by setting all internal registers to their correct states. When this signal goes low, the system has

completed initialization. System initialization takes approximately 220 ms to complete. Data and command write

cycles should not be asserted during the initialization.

During initialization the user must send a training pattern to the DLPC410 on all data and DVALID lines to

correctly align the data inputs to the data clock. For more information, see the interface training pattern

information in the DLPC410 data sheet.

8.3.4.1.1.3 DMD Device Detection

The DLPC410 automatically detects the DMD type and device ID. DMD_TYPE (Table 2) is an output from the

DLPC410 that contains the DMD information.

8.3.4.1.1.4 Power Down

To ensure long term reliability of the DLP9500, a shutdown procedure must be executed. Prior to power removal,

assert the PWR_FLOAT (Table 2) signal and allow approximately 300 µs for the procedure to complete. This

procedure assures the mirrors are in a flat state.

8.3.4.1.2 DLPC410 to DMD Interface

8.3.4.1.2.1 DLPC410 to DMD IO Description

Table 3 lists the available controls and status pin names and their corresponding signal type, along with a brief

functional description.

Table 3. DLPC410 to DMD I/O Pin Descriptions

PIN NAME

DDC_DOUT_[A,B,C,D](15:0)

DDC_DCLKOUT_[A,B,C,D]

DDC_SCTRL_[A,B,C,D]

DESCRIPTION

I/O

O

LVDS DDR output to DMD data bus A,B,C,D (15:0)

LVDS output to DMD data clock A,B,C,D

LVDS DDR output to DMD data control A,B,C,D

O

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8.3.4.1.2.2 Data Flow

Figure 9 shows the data traffic through the DLPC410. Special considerations are necessary when laying out the

DLPC410 to allow best signal flow.

LVDS BUS D

sDIN_D(15:0)

sDCLK_D

LVDS BUS C

sDIN_C(15:0)

sDCLK_C

sDVALID_C

sDVALID_D

DLPC410

LVDS BUS D

sDOUT_D(15:0)

sDCLKOUT_D

sSCTRL_D

LVDS BUS A

sDOUT_A(15:0)

sDCLKOUT_A

sSCTRL_A

Figure 9. DLPC410 Data Flow

Four LVDS buses transfer the data from the user to the DLPC410. Each bus has its data clock that is input edge

aligned with the data (DCLK). Each bus also has its own validation signal that qualifies the data input to the

DLPC410 (DVALID).

Output LVDS buses transfer data from the DLPC410 to the DMD. Output buses LVDS C and LVDS D are used

in addition to LVDS A and LVDS B with the DLP9500.

8.3.4.1.3 DLPC410 to DLPA200 Interface

8.3.4.1.3.1 DLPA200 Operation

The DLPA200 DMD micromirror driver is a mixed-signal application-specific integrated circuit (ASIC) that

combines the necessary high-voltage power supply generation and micromirror clocking pulse functions for a

family of DMDs. The DLPA200 is programmable and controllable to meet all current and anticipated DMD

requirements.

The DLPA200 operates from a 12-V power supply input. For more detailed information on the DLPA200, see the

DLPA200 data sheet.

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8.3.4.1.3.2 DLPC410 to DLPA200 IO Description

The serial communications port (SCP) is a full duplex, synchronous, character-oriented (byte) port that allows

exchange of commands from the DLPC410 to the DLPA200s.

DLPA200

SCP bus

DLPC410

SCP bus

DLPA200

Figure 10. Serial Port System Configuration

Five signal lines are associated with the SCP bus: SCPEN, SCPCK, SCPDI, SCPDO, and IRQ.

Table 4 lists the available controls and status pin names and their corresponding signal type, along with a brief

functional description.

Table 4. DLPC410 to DLPA200 I/O Pin Descriptions

PIN NAME

A_SCPEN

DESCRIPTION

Active-low chip select for DLPA200 serial bus

DLPA200 control signal strobe

DLPA200 mode control

I/O

O

A_STROBE

A_MODE(1:0)

A_SEL(1:0)

A_ADDR(3:0)

B_SCPEN

DLPA200 select control

DLPA200 address control

Active-low chip select for DLPA200 serial bus (2)

DLPA200 control signal strobe (2)

DLPA200 mode control

B_STROBE

B_MODE(1:0)

B_SEL(1:0)

B_ADDR(3:0)

DLPA200 select control

DLPA200 address control

The DLPA200 provides a variety of output options to the DMD by selecting logic control inputs: MODE[1:0],

SEL[1:0] and reset group address A[3:0] (Table 4). The MODE[1:0] input determines whether a single output, two

outputs, four outputs, or all outputs, will be selected. Output levels (VBIAS, VOFFSET, or VRESET) are selected

by SEL[1:0] pins. Selected outputs are tri-stated on the rising edge of the STROBE signal and latched to the

selected voltage level after a break-before-make delay. Outputs will remain latched at the last micromirror

clocking pulse waveform level until the next micromirror clocking pulse waveform cycle.

8.3.4.1.4 DLPA200 to DLP9500 Interface

8.3.4.1.4.1 DLPA200 to DLP9500 Interface Overview

The DLPA200 generates three voltages: VBIAS, VRESET, and VOFFSET that are supplied to the DMD MBRST

lines in various sequences through the micromirror clocking pulse driver function. VOFFSET is also supplied

directly to the DMD as DMDVCC2. A fourth DMD power supply, DMDVCC, is supplied directly to the DMD by

regulators.

The function of the micromirror clocking pulse driver is to switch selected outputs in patterns between the three

voltage levels (VBIAS, VRESET and VOFFSET) to generate one of several micromirror clocking pulse

waveforms. The order of these micromirror clocking pulse waveform events is controlled externally by the logic

control inputs and timed by the STROBE signal. DLPC410 automatically detects the DMD type and then uses the

DMD type to determine the appropriate micromirror clocking pulse waveform.

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A direct micromirror clocking pulse operation causes a mirror to transition directly from one latched state to the

next. The address must already be set up on the mirror electrodes when the micromirror clocking pulse is

initiated. Where the desired mirror display period does not allow for time to set up the address, a micromirror

clocking pulse with release can be performed. This operation allows the mirror to go to a relaxed state regardless

of the address while a new address is set up, after which the mirror can be driven to a new latched state.

A mirror in the relaxed state typically reflects light into a system collection aperture and can be thought of as off

although the light is likely to be more than a mirror latched in the off state. System designers should carefully

evaluate the impact of relaxed mirror conditions on optical performance.

8.3.5 Measurement Conditions

The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its

transmission line effects must be taken into account. Figure 11 shows an equivalent test load circuit for the

output under test. The load capacitance value stated is only for characterization and measurement of AC timing

signals. This load capacitance value does not indicate the maximum load the device is capable of driving. All rise

and fall transition timing parameters are referenced to V_ILMAX and V_IHMIN for input clocks, V_OLMAX and V_OH

MIN for output clocks.

LOAD CIRCUIT

R

L

From Output

Under Test

Tester

Channel

C

= 50 pF

L

= 5 pF for Disable Time

Figure 11. Test Load Circuit for AC Timing Measurements

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Package Pin

A1 Corner

DLP9500

Two Two

“On-State” “Off-State”

Micromirrors Micromirrors

For Reference

Flat-State

( “parked” )

Micromirror Position

a

b

-a

b

Silicon Substrate

“On-State”

Micromirror

“Off-State”

Micromirror

Figure 12. Micromirror Landed Positions and Light Paths

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8.4 Device Functional Modes

The DLP9500 has only one functional mode; it is set to be highly optimized for low latency and high speed in

generating mirror clocking pulses and timings.

When operated with the DLPC410 controller in conjunction with the DLPA200 drivers, the DLP9500 can be

operated in several display modes. The DLP9500 is loaded as 15 blocks of 72 rows each. The first 64 bits of

pixel data and last 64 bits of pixel data for all rows are not visible. Below is a representation of how the image is

loaded by the different micromirror clocking pulse modes. Figure 13, Figure 14, Figure 15, and Figure 16 show

how the image is loaded by the different micromirror clocking pulse modes.

There are four micromirror clocking pulse modes that determine which blocks are reset when a micromirror

clocking pulse command is issued:

•

Single block mode

Dual block mode

Quad block mode

Global mode

8.4.1 Single Block Mode

In single block mode, a single block can be loaded and reset in any order. After a block is loaded, it can be reset

to transfer the information to the mechanical state of the mirrors.

Figure 13. Single Block Mode

8.4.2 Dual Block Mode

In dual block mode, reset blocks are paired together as follows (0-1), (2-3), (4-5), (6-7), (8-9), (10-11), (12-13),

and (14). These pairs can be reset in any order. After data is loaded a pair can be reset to transfer the

information to the mechanical state of the mirrors.

Figure 14. Dual Block Mode

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Device Functional Modes (continued)

8.4.3 Quad Block Mode

In quad block mode, reset blocks are grouped together in fours as follows (0-3), (4-7), (8-11) and (12-14). Each

quad group can be randomly addressed and reset. After a quad group is loaded, it can be reset to transfer the

information to the mechanical state of the mirrors.

Figure 15. Quad Block Mode

8.4.4 Global Block Mode

In global mode, all reset blocks are grouped into a single group and reset together. The entire DMD must be

loaded with the desired data before issuing a Global Reset to transfer the information to the mechanical state of

the mirrors.

Figure 16. Global Mode

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8.5 Window Characteristics and Optics

NOTE

TI assumes no responsibility for image quality artifacts or DMD failures caused by optical

system operating conditions exceeding limits described previously.

8.5.1 Optical Interface and System Image Quality

TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment

optical performance involves making trade-offs between numerous component and system design parameters.

Optimizing system optical performance and image quality strongly relate to optical system design parameter

trades. Although it is not possible to anticipate every conceivable application, projector image quality and optical

performance is contingent on compliance to the optical system operating conditions described in the following

sections.

8.5.2 Numerical Aperture and Stray Light Control

The angle defined by the numerical aperture of the illumination and projection optics at the DMD optical area

should be the same. This angle should not exceed the nominal device mirror tilt angle unless appropriate

apertures are added in the illumination, projection pupils, or both to block out flat-state and stray light from the

projection lens. The mirror tilt angle defines DMD capability to separate the ON optical path from any other light

path, including undesirable flat-state specular reflections from the DMD window, DMD border structures, or other

system surfaces near the DMD such as prism or lens surfaces. If the numerical aperture exceeds the mirror tilt

angle, or if the projection numerical aperture angle is more than two degrees larger than the illumination

numerical aperture angle, objectionable artifacts in the display’s border and/or active area could occur.

8.5.3 Pupil Match

TI recommends the exit pupil of the illumination is nominally centered within 2° (two degrees) of the entrance

pupil of the projection optics. Misalignment of pupils can create objectionable artifacts in the display’s border

and/or active area, which may require additional system apertures to control, especially if the numerical aperture

of the system exceeds the pixel tilt angle.

8.5.4 Illumination Overfill

The active area of the device is surrounded by an aperture on the inside DMD window surface that masks

structures of the DMD device assembly from normal view. The aperture is sized to anticipate several optical

operating conditions. Overfill light illuminating the window aperture can create artifacts from the edge of the

window aperture opening and other surface anomalies that may be visible on the screen. The illumination optical

system should be designed to limit light flux incident anywhere on the window aperture from exceeding

approximately 10% of the average flux level in the active area. Depending on the optical architecture of a

particular system, overfill light may have to be further reduced below the suggested 10% level to be acceptable.

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8.6 Micromirror Array Temperature Calculation

8.6.1 Thermal Test Points

The temperature of the DMD case can be measured directly. For consistency, thermal test point locations 1, 2,

and 3 are defined as shown in Figure 17.

TP2

27.80

TP3

TP3 (TP2)

TP1

21.08

Figure 17. Thermal Test Points

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Micromirror Array Temperature Calculation (continued)

8.6.2 Micromirror Array Temperature Calculation - Lumens Based

Micromirror array temperature cannot be measured directly; therefore, it must be computed analytically from:

•

the measurement points (Figure 17)

the package thermal resistance

the electrical power

the illumination heat load

The relationship between micromirror array temperature and the reference ceramic temperature (thermal test

point TP1 in Figure 17) is provided by the following equations:

T_ARRAY= T _CERAMIC+ (Q_ARRAY× R_{ARRAY-TO-CERAMIC}

Q_ARRAY= Q_ELECTRICAL+ Q_ILLUMINATION

)

where

•

T_ARRAY= computed array temperature (°C)

T_CERAMIC= measured ceramic temperature (°C) (TP1 location)

R_{ARRAY-TO-CERAMIC}= thermal resistance of DMD package (specified in Thermal Information) from array to

ceramic TP1 (°C/W)

•

Q_ARRAY= total power (electrical + absorbed) on the array (Watts)

Q_ELECTRICAL= nominal electrical power (Watts)

Q_ILLUMINATION= (C_L2W× SL) (Watts)

C_L2W= conversion constant for screen lumens to power on DMD (Watts/lumen)

SL = measured screen lumens

The electrical power dissipation of the DMD is variable and depends on the voltages, data rates, and operating

frequencies. A nominal electrical power dissipation to use when calculating array temperature is 4.4 Watts. The

absorbed power from the illumination source is variable and depends on the operating state of the micromirrors

and the intensity of the light source. The conversion constant C_L2Wis based on the DMD input illumination

characteristics. It assumes a spectral efficiency of 300 lumens/Watt for the projected light and an illumination

distribution of 83.7% on the active array and 16.3% on the array border. The equations shown above are valid for

a system with a total projection efficiency through the projection lens from the DMD to the screen of 87%.

Sample calculation for typical application:

•

T_Ceramic= 55°C (measured)

SL = 2000 lm (measured)

Q_ELECTRICAL= 4.4 Watts

R_{ARRAY-TO-CERAMIC}= 0.5 °C/W

C_L2W= 0.00274 W/lm

Q_ARRAY= 4.4 + (0.00274 W/lm × 2000 lm) = 9.88 W

T_ARRAY= 55°C + (9.88 W x 0.5 °C) = 59.9 °C

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Micromirror Array Temperature Calculation (continued)

8.6.3 Micromirror Array Temperature Calculation - Power Density Based

Micromirror array temperature cannot be measured directly; therefore, it must be computed analytically from:

•

the measurement points (Figure 17)

the package thermal resistance

the electrical power

the illumination heat load

The relationship between array temperature and the reference ceramic temperature (thermal test point TP1 in

Figure 17) is provided by the following equations:

T_ARRAY= T _CERAMIC+ (Q_ARRAY× R_{ARRAY-TO-CERAMIC}

Q_ARRAY= Q_ELECTRICAL+ (0.42 x Q_INCIDENT

)

where

•

T_ARRAY= computed array temperature (°C)

T_CERAMIC= measured ceramic temperature (°C) (TP1 location)

R_{ARRAY-TO-CERAMIC}= thermal resistance of DMD package (specified in Thermal Information) from array to

ceramic TP1 (°C/W)

•

Q_ARRAY= total power (electrical + absorbed) on the array (Watts)

Q_ELECTRICAL= nominal electrical power (Watts)

Q_INCIDENT= total incident optical power on DMD (Watts)

The electrical power dissipation of the DMD is variable and depends on the voltages, data rates, and operating

frequencies. A nominal electrical power dissipation to use when calculating array temperature is 4.4 watts. The

absorbed power from the illumination source is variable and depends on the operating state of the micromirrors

and the intensity of the light source. The equations shown above are valid for each DMD chip in a system. It

assumes an illumination distribution of 83.7% on the active array and 16.3% on the array border.

Sample Calculation for each DMD in a system with a measured illumination power density:

•

T_Ceramic= 20°C (measured)

ILL_DENSITY= 11 Watts per cm²(optical power on DMD per unit area) (measured)

Overfill = 16.3% (optical design)

Q_ELECTRICAL= 4.4 Watts

R_{ARRAY-TO-CERAMIC}= 0.5 °C/W

Area of array = ( 2.0736 cm x 1.1664 cm ) = 2.419 cm²

ILL_AREA= 2.419 cm²/ (83.7%) = 2.89 cm²

Q_INCIDENT=11 W/cm²x 2.89 cm²= 31.79 W

Q_ARRAY= 4.4 W + (0.42 x 31.79 W) = 17.75 W

T_ARRAY= 20°C + (17.75 W x 0.5 °C) = 28.9 °C

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8.7 Micromirror Landed-On and Landed-Off Duty Cycle

8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle

The micromirror landed-on/landed-off duty cycle (landed duty cycle) denotes the amount of time (as a

percentage) that an individual micromirror is landed in the On–state versus the amount of time the same

micromirror is landed in the Off–state.

As an example, a landed duty cycle of 100/0 indicates that the referenced pixel is in the On-state 100% of the

time (and in the Off-state 0% of the time); whereas 0/100 would indicate that the pixel is in the Off-state 100% of

the time. Likewise, 50/50 indicates that the pixel is On 50% of the time and Off 50% of the time.

Note that when assessing landed duty cycle, the time spent switching from one state (ON or OFF) to the other

state (OFF or ON) is considered negligible and is thus ignored.

Because a micromirror can only be landed in one state or the other (on or off), the two numbers (percentages)

always add to 100.

8.7.2 Landed Duty Cycle and Useful Life of the DMD

Knowing the long-term average landed duty cycle (of the end product or application) is important because

subjecting all (or a portion) of the DMD’s micromirror array (also called the active array) to an asymmetric landed

duty cycle for a prolonged period of time can reduce the usable life of the DMD.

Note that it is the symmetry/asymmetry of the landed duty cycle that is of relevance. The symmetry of the landed

duty cycle is determined by how close the two numbers (percentages) are to being equal. For example, a landed

duty cycle of 50/50 is perfectly symmetrical whereas a landed duty cycle of 100/0 or 0/100 is perfectly

asymmetrical.

8.7.3 Landed Duty Cycle and Operational DMD Temperature

Operational DMD temperature and landed duty cycle interact to affect the usable life of the DMD, and this

interaction can be exploited to reduce the impact that an asymmetrical landed duty cycle has on the DMD’s

usable life. This is quantified in the derating curve shown in Figure 1. The importance of this curve is that:

•

All points along this curve represent the same usable life.

All points above this curve represent lower usable life (and the further away from the curve, the lower the

usable life).

•

All points below this curve represent higher usable life (and the further away from the curve, the higher the

usable life).

In practice, this curve specifies the maximum operating DMD temperature that the DMD should be operated at

for a give long-term average landed duty.

8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application

During a given period of time, the landed duty cycle of a given pixel follows from the image content being

displayed by that pixel.

For example, in the simplest case, when displaying pure-white on a given pixel for a given time period, that pixel

will experience a 100/0 landed duty cycle during that time period. Likewise, when displaying pure-black, the pixel

will experience a 0/100 landed duty cycle.

Between the two extremes (ignoring for the moment color and any image processing that may be applied to an

incoming image), the landed duty cycle tracks one-to-one with the gray scale value, as shown in Table 5.

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Table 5. Grayscale Value and Landed Duty Cycle

GRAYSCALE VALUE

LANDED DUTY CYCLE

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

0/100

10/90

20/80

30/70

40/60

50/50

60/40

70/30

80/20

90/10

100/0

Accounting for color rendition (but still ignoring image processing) requires knowing both the color intensity (from

0% to 100%) for each constituent primary color (red, green, and/or blue) for the given pixel as well as the color

cycle time for each primary color, where “color cycle time” is the total percentage of the frame time that a given

primary must be displayed to achieve the desired white point.

During a given period of time, the landed duty cycle of a given pixel can be calculated as follows:

Landed Duty Cycle = (Red_Cycle_% × Red_Scale_Value) + (Green_Cycle_% × Green_Scale_Value) +

(Blue_Cycle_% × Blue_Scale_Value)

where:

Red_Cycle_%, Green_Cycle_%, and Blue_Cycle_%, represent the percentage of the frame time that Red,

Green, and Blue are displayed (respectively) to achieve the desired white point.

For example, assume that the red, green and blue color cycle times are 50%, 20%, and 30% respectively (to

achieve the desired white point), then the landed duty for various combinations of red, green, blue color

intensities would be as shown in Table 6.

Table 6. Example Landed Duty Cycle for Full-Color

RED CYCLE PERCENTAGE

50%

GREEN CYCLE PERCENTAGE

20%

BLUE CYCLE PERCENTAGE

30%

LANDED DUTY CYCLE

RED SCALE VALUE

GREEN SCALE VALUE

BLUE SCALE VALUE

0%

100%

0%

0/100

50/50

20/80

30/70

6/94

100%

0%

100%

0%

12%

0%

35%

0%

7/93

0%

60%

0%

18/82

70/30

50/50

80/20

13/87

25/75

24/76

100/0

100%

0%

100%

0%

100%

0%

100%

12%

0%

35%

0%

60%

100%

12%

100%

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The DLP9500 devices must be coupled with the DLPC410 controller to provide a reliable solution for many

different applications. The DMDs are spatial light modulators which reflect incoming light from an illumination

source to one of two directions, with the primary direction being into a projection collection optic. Each application

is derived primarily from the optical architecture of the system and the format of the data coming into the

DLPC410. Applications of interest include 3D printing, lithography, medical systems, and compressive sensing.

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9.2.1 Design Requirements

All applications using the DLP9500 1080p chipset require both the controller and the DMD components for

operation. The system also requires an external parallel flash memory device loaded with the DLPC410

configuration and support firmware. The chipset has several system interfaces and requires some support

circuitry. The following interfaces and support circuitry are required:

•

DLPC410 system interfaces:

–

Control interface

Trigger interface

Input data interface

Illumination interface

Reference clock

Program interface

•

DLP9500 interfaces:

–

DLPC410 to DLP9500 digital data

DLPC410 to DLP9500 control interface

DLPC410 to DLP9500 micromirror reset control interface

DLPC410 to DLPA200 micromirror driver

DLPA200 to DLP9500 micromirror reset

9.2.1.1 Device Description

The DLP9500 1080p chipset offers developers a convenient way to design a wide variety of industrial, medical,

telecom and advanced display applications by delivering maximum flexibility in formatting data, sequencing data,

and light patterns.

The DLP9500 1080p chipset includes the following four components: DMD digital controller (DLPC410),

EEPROM (DLPR410), DMD micromirror driver (DLPA200), and a DMD (DLP9500).

DLPC410 Digital Controller for DLP Discovery 4100 chipset

•

Provides high speed 2XLVDS data and control interface to the user

Drives mirror clocking pulse and timing information to the DLPA200

Supports random row addressing

Controls illumination

DLPR410 PROM for DLP Discovery 4100 chipset

Contains startup configuration information for the DLPC410

DLPA200 DMD Micromirror Driver

•

Generates micromirror clocking pulse control (sometimes referred to as a reset) of 15 banks of DMD

mirrors. (Two are required for the DLP9500).

DLP9500 DLP 0.95 1080p 2xLVDS Type-A DMD

•

Steers light in two digital positions (+12° and –12°) using 1920 × 1080 micromirror array of aluminum

mirrors.

Table 7. DLP DLP9500 Chipset Configurations

QUANTITY

TI PART

DLP9500

DLPC410

DLPR410

DLPA200

DESCRIPTION

DLP 0.95 1080p 2xLVDS Type-A DMD

Digital Controller for DLP Discovery 4100 chipset

PROM for DLP Discovery 4100 chipset

DMD Micromirror Driver

1

2

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Reliable function and operation of DLP9500 1080p chipsets require the components be used in conjunction with

each other. This document describes the proper integration and use of the DLP9500 1080p chipset components.

The DLP9500 1080p chipset can be combined with a user programmable application FPGA (not included) to

create high performance systems.

9.2.2 Detailed Design Procedure

The DLP9500 DMD is well suited for visible light applications requiring fast, spatially programmable light patterns

using the micromirror array. See the block diagram in Figure 8 to see the connections between the DLP9500

DMD, the DLPC410 digital controller, the DLPR410 EEPROM, and the DLPA200 DMD micromirror drivers. An

example application block diagram can be found in Figure 18. Layout guidelines should be followed for reliability.

10 Power Supply Recommendations

10.1 Power-Up Sequence (Handled by the DLPC410)

The sequence of events for DMD system power-up is:

1. Apply logic supply voltages to the DLPA200 and to the DMD according to DMD specifications.

2. Place DLPA200 drivers into high impedance states.

3. Turn on DLPA200 bias, offset, or reset supplies according to driver specifications.

4. After all supply voltages are assured to be within the limits specified and with all micromirror clocking pulse

operations logically suspended, enable all drivers to either VOFFSET or VBIAS level.

5. Begin micromirror clocking pulse operations.

10.2 DMD Power-Up and Power-Down Procedures

Failure to adhere to the prescribed power-up and power-down procedures may affect device reliability. The

DLP9500 power-up and power-down procedures are defined by the DLPC410 data sheet (DLPS024). These

procedures must be followed to ensure reliable operation of the device.

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11 Layout

11.1 Layout Guidelines

The DLP9500 is part of a chipset that is controlled by the DLPC410 in conjunction with the DLPA200. These

guidelines are targeted at designing a PCB board with these components.

11.1.1 Impedance Requirements

Signals should be routed to have a matched impedance of 50 Ω ±10% except for LVDS differential pairs

(DMD_DAT_Xnn, DMD_DCKL_Xn, and DMD_SCTRL_Xn) which should be matched to 100 Ω ±10% across

each pair.

11.1.2 PCB Signal Routing

When designing a PCB board for the DLP9500 controlled by the DLPC410 in conjunction with the DLPA200s,

the following are recommended:

Signal trace corners should be no sharper than 45°. Adjacent signal layers should have the predominate traces

routed orthogonal to each other. TI recommends that critical signals be hand routed in the following order: DDR2

Memory, DMD (LVDS signals), then DLPA200 signals.

TI does not recommend signal routing on power or ground planes.

TI does not recommend ground plane slots.

High speed signal traces should not cross over slots in adjacent power and/or ground planes.

Table 8. Important Signal Trace Constraints

SIGNAL

CONSTRAINTS

P-to-N data, clock, and SCTRL: <10 mils (0.25 mm); Pair-to-pair <10 mils (0.25 mm); Bundle-to-bundle

<2000 mils (50 mm, for example DMD_DAT_Ann to DMD_DAT_Bnn)

Trace width: 4 mil (0.1 mm)

Trace spacing: In ball field – 4 mil (0.11 mm); PCB etch – 14 mil (0.36 mm)

Maximum recommended trace length <6 inches (150 mm)

LVDS (DMD_DAT_xnn,

DMD_DCKL_xn, and

DMD_SCTRL_xn)

Table 9. Power Trace Widths and Spacing

MINIMUM TRACE

SPACING

SIGNAL NAME

LAYOUT REQUIREMENTS

WIDTH

GND

Maximize

5 mil (0.13 mm)

10 mil (0.25 mm)

15 mil (0.38 mm)

Maximize trace width to connecting pin as a minimum

VCC, VCC2

MBRST[14:0]

20 mil (0.51 mm)

11 mil (0.28 mm)

11.1.3 Fiducials

Fiducials for automatic component insertion should be 0.05-inch copper with a 0.1-inch cutout (antipad). Fiducials

for optical auto insertion are placed on three corners of both sides of the PCB.

11.1.4 PCB Layout Guidelines

A target impedance of 50 Ω for single ended signals and 100 Ω between LVDS signals is specified for all signal

layers.

11.1.4.1 DMD Interface

The digital interface from the DLPC410 to the DMD are LVDS signals that run at clock rates up to 400 MHz. Data

is clocked into the DMD on both the rising and falling edge of the clock, so the data rate is 800 MHz. The LVDS

signals should have 100 Ω differential impedance. The differential signals should be matched but kept as short

as possible. Parallel termination at the LVDS receiver is in the DMD; therefore, on board termination is not

necessary.

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11.1.4.1.1 Trace Length Matching

The DLPC410 DMD data signals require precise length matching. Differential signals should have impedance of

100 Ω (with 5% tolerance). It is important that the propagation delays are matched. The maximum differential pair

uncoupled length is 100 mils with a relative propagation delay of ±25 mil between the p and n. Matching all

signals exactly will maximize the channel margin. The signal path through all boards, flex cables and internal

DMD routing must be considered in this calculation.

11.1.4.2 DLP9500 Decoupling

General decoupling capacitors for the DLP9500 should be distributed around the PCB and placed to minimize

the distance from IC voltage and ground pads. Each decoupling capacitor (0.1 µF recommended) should have

vias directly to the ground and power planes. Via sharing between components (discreet or integrated) is

discouraged. The power and ground pads of the DLP9500 should be tied to the voltage and ground planes with

their own vias.

11.1.4.2.1 Decoupling Capacitors

Decoupling capacitors should be placed to minimize the distance from the decoupling capacitor to the supply and

ground pin of the component. TI recommends that the placement of and routing for the decoupling capacitors

meet the following guidelines:

•

The supply voltage pin of the capacitor should be located close to the device supply voltage pin or pins. The

decoupling capacitor should have vias to ground and voltage planes. The device can be connected directly to

the decoupling capacitor (no via) if the trace length is less than 0.1 inch. Otherwise, the component should be

tied to the voltage or ground plane through separate vias.

•

The trace lengths of the voltage and ground connections for decoupling capacitors and components should

be less than 0.1 inch to minimize inductance.

The trace width of the power and ground connection to decoupling capacitors and components should be as

wide as possible to minimize inductance.

Connecting decoupling capacitors to ground and power planes through multiple vias can reduce inductance

and improve noise performance.

Decoupling performance can be improved by using low ESR and low ESL capacitors.

11.1.4.3 VCC and VCC2

The VCC pins of the DMD should be connected directly to the DMD VCC plane. Decoupling for the VCC should

be distributed around the DMD and placed to minimize the distance from the voltage and ground pads. Each

decoupling capacitor should have vias directly connected to the ground and power planes. The VCC and GND

pads of the DMD should be tied to the VCC and ground planes with their own vias.

The VCC2 voltage can be routed to the DMD as a trace. Decoupling capacitors should be placed to minimize the

distance from the DMD’s VCC2 and ground pads. Using wide etch from the decoupling capacitors to the DMD

connection will reduce inductance and improve decoupling performance.

11.1.4.4 DMD Layout

See the respective sections in this data sheet for package dimensions, timing and pin out information.

11.1.4.5 DLPA200

The DLPA200 generates the micromirror clocking pulses for the DMD. The DMD-drive outputs from the

DLPA200 (MBRST[29:0] should be routed with minimum trace width of 11 mil and a minimum spacing of 15 mil.

The VCC and VCC2 traces from the output capacitors to the DLPA200 should also be routed with a minimum

trace width and spacing of 11 mil and 15 mil, respectively. See the DLPA200 customer data sheet DLPS015 for

mechanical package and layout information.

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11.2 Layout Example

For LVDS (and other differential signal) pairs and groups, it is important to match trace lengths. In the area of the

dashed lines, Figure 19 shows correct matching of signal pair lengths with serpentine sections to maintain the

correct impedance.

Figure 19. Mitering LVDS Traces to Match Lengths

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12 器件和文档支持

12.1 器件支持

12.1.1 器件命名规则

图 20 提供了读取任一 DLP 器件完整器件名称的图例。

图 20. 器件命名规则

12.1.2 器件标记

图 21 显示了器件标记字段。

TI Internal Numbering

DMD Part Number

2-Dimensional Matrix Code

YYYYYYY

(DMD Part Number

and Serial Number)

DLP9500_FLN

GHXXXXX LLLLLLM

LLLLLL

Part 1 of Serial Number

(7 characters)

Part 2 of Serial Number

(7 characters)

TI Internal Numbering

图 21. DLP9500 器件标记

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12.2 文档支持

12.2.1 相关文档

以下文档包含关于使用 DLP9500 器件的更多信息。

•

《适用于 DLP Discovery 4100 芯片组的 DLPC410 数字控制器数据表》

《DLPA200 DMD 微镜驱动器数据表》

《适用于 DLP Discovery 4100 芯片组的 DLPR410 PROM 数据表》

12.3 相关链接

下表列出了快速访问链接。类别包括技术文档、支持与社区资源、工具和软件，以及申请样片或购买产品的快速链

接。

表 10. 相关链接

器件

产品文件夹

请单击此处

样片与购买

请单击此处

技术文档

请单击此处

工具与软件

请单击此处

支持和社区

请单击此处

DLP9500

DLPA200

DLPC410

DLPR410

12.4 接收文档更新通知

要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产

品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

12.5 社区资源

下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，

并且不一定反映 TI 的观点；请参阅 TI 的《使用条款》。

TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在

e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。

设计支持

TI 参考设计支持可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。

12.6 商标

Discovery, E2E are trademarks of Texas Instruments.

DLP is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.7 静电放电警告

这些装置包含有限的内置 ESD 保护。存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损

伤。

12.8 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、缩写和定义。

13 机械、封装和可订购信息

以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且

不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。

48

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

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型号：	DLP9500
厂家：	TEXAS INSTRUMENTS
描述：	DLP® 0.95 1080p 2xLVDS A 型 DMD
文件：	总54页 (文件大小：1536K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DLP9500 [TI]

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