CY74FCT16543CTPVCR [TI]
FCT SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, 0.300 INCH, 0.635 MM PITCH, GREEN, PLASTIC, SSOP-56;
| 型号： | CY74FCT16543CTPVCR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | FCT SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, 0.300 INCH, 0.635 MM PITCH, GREEN, PLASTIC, SSOP-56 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总21页 (文件大小：711K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT16543T
CY74FCT162543T
CY74FCT162H543T
SCCS059B - August 1994 - Revised September 2001
16-Bit Latched Transceivers
Features
Functional Description
• Ioff supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
The CY74FCT16543T and CY74FCT162543T are 16-bit,
high-speed, low power latched transceivers that are organized as two
independent 8-bit D-type latched transceivers containing two sets of
eight D-type latches with separate Latch Enable (LEAB, LEAB) and
Output Enable (OEAB, OEAB) controls for each set to permit
independent control of inputting and outputting in either direction of
data flow. For data flow from A to B, for example, the A-to-B input
Enable (CEAB) must be LOW in order to enter data from A or to take
data from B as indicated in the truth table. With CAEB LOW, a LOW
signal on the A-to-B Latch Enable (LEAB) makes the A-to-B latches
transparent; a subsequent LOW-to-HIGH transition of the LEAB
signal puts the A latches in the storage mode and their outputs no
longer change with the A inputs. With CEAB and OEAB both LOW,
the three-state B output buffers are active and reflect the data present
at the output of the A latches. Control of data from B to A is similar,
but uses CEAB, LEAB, and OEAB inputs flow-through pinout and
small shrink packaging and in simplifying board design.
• Industrial temperature range of −40˚C to +85˚C
• VCC = 5V ± 10%
CY74FCT16543T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce) <1.0V at VCC = 5V,
TA = 25˚C
CY74FCT162543T Features:
• Balanced 24 mA output drivers
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
The CY74FCT16543T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
CY74FCT162H543T Features:
• Bus hold retains last active state
The CY74FCT162543T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162543T is ideal for driving transmission lines.
• Eliminates the need for external pull-up or pull-down
resistors
The CY74FCT162H543T is a 24-mA balanced output part that
has “bus hold” on the data inputs. The device retains the
input’s last state whenever the input goes to high impedance.
This eliminates the need for pull-up/down resistors and
prevents floating inputs.
Copyright © 2001, Texas Instruments Incorporated
CY74FCT16543T
CY74FCT162543T
CY74FCT162H543T
Logic Block Diagrams
PinConfiguration
OEBA
1
Top View
SSOP/TSSOP
CEBA
1
LEBA
1
OEAB
OEBA
1
2
56
55
1
1
OEAB
1
LEAB
LEBA
1
1
CEAB
1
CEAB
1
3
4
54
53
CEBA
1
LEAB
1
GND
A
GND
B
C
D
5
6
7
52
51
50
1
1
1
1
2
A
1
1
B
1
1
A
1
B
1
2
V
V
CC
CC
C
D
A
B
1
3
4
5
8
9
49
48
1
3
4
5
A
1
B
1
A
10
11
12
13
14
15
16
17
18
19
20
21
22
23
47
46
45
44
43
42
41
40
39
38
37
36
35
34
B
1
1
GND
A
GND
B
1
6
1
6
TO 7 OTHER CHANNELS
A
1
B
1
7
8
7
8
FCT16543T-1
A
1
B
1
OEBA
2
A
2
B
2
1
1
CEBA
2
A
B
2
B
2
2
2
3
2
3
A
2
LEBA
2
GND
A
GND
B
OEAB
2
2
4
5
2
4
5
A
2
B
2
CEAB
2
A
B
2
6
2
6
LEAB
2
V
V
CC
CC
C
D
A
2
1
A
2
B
2
7
8
7
8
B
2
1
A
2
B
2
24
25
26
27
28
33
32
31
30
29
GND
GND
C
D
CEAB
LEAB
OEAB
CEBA
2
LEBA
2
OEBA
2
2
2
2
FCT16543T-3
FCT16543T-2
TO 7 OTHER CHANNELS
Pin Description
Function Table[1]
Name
Description
Latch
Output
Buffers
Inputs
Status
OEAB A-to-B Output Enable Input (Active LOW)
OEBA B-to-A Output Enable Input (Active LOW)
CEAB A-to-B Enable Input (Active LOW)
CEAB LEAB OEAB
A to B
B
H
X
X
L
X
H
X
L
X
X
H
L
Storing
Storing
X
High Z
X
CEBA B-to-A Enable Input (Active LOW)
High Z
LEAB A-to-B Latch Enable Input (Active LOW)
Transparent
Current A
Inputs
LEBA B-to-A Latch Enable Input (Active LOW)
A
B
A-to-B Data Inputs or B-to-A Three-State Outputs[9]
B-to-A Data Inputs or A-to-B Three-State Outputs[9]
L
H
L
Storing
Previous A
Inputs[2]
Maximum Ratings[3, 4]
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Power Dissipation..........................................................1.0W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Storage Temperature .....................Com’l −55°C to +125°C
Ambient Temperature with
Power Applied.................................Com’l −55°C to +125°C
Operating Range
Ambient
DC Input Voltage .................................................−0.5V to +7.0V
DC Output Voltage..............................................−0.5V to +7.0V
Range
Industrial
Temperature
VCC
−40°C to +85°C
5V ± 10%
DC Output Current
(Maximum Sink Current/Pin) ...........................−60 to +120 mA
2
CY74FCT16543T
CY74FCT162543T
CY74FCT162H543T
Electrical Characteristics Over the Operating Range
Parameter
Description
Input HIGH Voltage
Input LOW Voltage
Input Hysteresis[6]
Test Conditions
Min.
Typ.[5]
Max.
Unit
V
VIH
VIL
VH
VIK
IIH
2.0
0.8
V
100
mV
V
Input Clamp Diode Voltage
Input HIGH Current
Input LOW Current
VCC=Min., IIN=−18 mA
−0.7
−1.2
±1
VCC=Max., VI=VCC
VCC=Max., VI=GND
VCC=Max., VOUT=2.7V
µA
µA
µA
IIL
±1
IOZH
High Impedance Output Cur-
rent (Three-State Output pins)
±1
IOZL
High Impedance Output Cur-
rent (Three-State Output pins)
VCC=Max., VOUT=0.5V
±1
µA
IOS
IO
Short Circuit Current[7]
Output Drive Current[7]
Power-Off Disable
VCC=Max., VOUT=GND
VCC=Max., VOUT=2.5V
VCC=0V, VOUT≤4.5V[8]
−80
−50
−140
−200
−180
±1
mA
mA
µA
IOFF
Notes:
1. A-to-B data flow shown; B-to-A flow control is the same, except using CEBA, LEBA, and OEBA.
2. Data prior to LEAB LOW-to-HIGH Transition
H = HIGH Voltage Level. L = LOW Voltage Level.
X = Don’t Care. Z = High Impedance.
3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature
range.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
5. Typical values are at VCC= 5.0V, TA= +25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
8. Tested at +25˚C.
9. On the 74FCT162H543T, these pins have bus hold.
3
CY74FCT16543T
CY74FCT162543T
CY74FCT162H543T
Output Drive Characteristics for CY74FCT16543T
Parameter
Description
Test Conditions
VCC=Min., IOH=−3 mA
Min.
2.5
Typ.[5]
3.5
Max.
Unit
VOH
Output HIGH Voltage
V
VCC=Min., IOH=−15 mA
VCC=Min., IOH=−32 mA
VCC=Min., IOL=64 mA
2.4
3.5
2.0
3.0
VOL
Output LOW Voltage
0.2
0.55
V
Output Drive Characteristics for CY74FCT162543T, CY74FCT162H543T
Parameter
IODL
Description
Output LOW Current[7]
Output HIGH Current[7]
Output HIGH Voltage
Output LOW Voltage
Test Conditions
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
VCC=Min., IOH=−24 mA
Min.
60
Typ.[5]
115
Max.
150
Unit
mA
mA
V
IODH
−60
2.4
−115
3.3
−150
VOH
VOL
VCC=Min., IOL=24 mA
0.3
0.55
V
Capacitance[6] (TA = +25˚C, f = 1.0 MHz)
Parameter
CIN
Description
Input Capacitance
Output Capacitance
Test Conditions
VIN = 0V
Typ.[5] Max.
Unit
pF
4.5
5.5
6.0
8.0
COUT
VOUT = 0V
pF
Power Supply Characteristics
Parameter
Description
Test Conditions
Typ.[5]
Max.
Unit
ICC
Quiescent Power Supply Current VCC=Max.
V
V
IN≤0.2V,
IN≥VCC−0.2V
5
500
µA
∆ICC
QuiescentPowerSupplyCurrent VCC=Max.
(TTL inputs HIGH)
VIN=3.4V[10]
0.5
60
1.5
mA
ICCD
Dynamic Power Supply
Current[11]
VCC=Max., One Input
Toggling, 50% Duty Cycle,
Outputs Open, OE=GND
VIN=VCC or
VIN=GND
100
µA/MHz
IC
Total Power Supply Current[12]
VCC=Max., f1=10 MHz,
50% Duty Cycle, Outputs
Open, One Bit Toggling,
OE=GND
VIN=VCC or
VIN=GND
0.6
0.9
2.4
6.4
1.5
2.3
mA
mA
mA
mA
VIN=3.4V or
VIN=GND
VCC=Max., f1=2.5 MHz,
50% Duty Cycle, Outputs
Open, Sixteen Bits Toggling,
OE=GND
VIN=VCC or
VIN=GND
4.5[13]
16.5[13]
VIN=3.4V or
VIN=GND
Notes:
10. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
12. IC
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC
ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
Quiescent Current with CMOS input levels
Power Supply Current for a TTL HIGH input
(VIN=3.4V)
IC
ICC
∆ICC
DH
NT
ICCD
=
=
=
Duty Cycle for TTL inputs HIGH
Number of TTL inputs at DH
Dynamic Current caused by an input transition pair
(HLH or LHL)
f0
f1
N1
=
=
=
Clock frequency for registered devices, otherwise zero
Input signal frequency
Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
4
CY74FCT16543T
CY74FCT162543T
CY74FCT162H543T
Switching Characteristics Over the Operating Range[14]
CY74FCT16543T
CY74FCT162543T
CY74FCT16543AT
CY74FCT162543AT
Fig.
Parameter
Description
Propagation Delay
Transparent Mode
A to B or B to A
Min.
Max.
Min.
Max.
Unit
No.[15]
tPLH
tPHL
1.5
8.5
1.5
6.5
ns
1, 3
tPLH
tPHL
Propagation Delay
LEBA to A, LEAB to B
1.5
1.5
12.5
12.0
1.5
1.5
8.0
9.0
ns
ns
1, 5
tPZH
tPZL
Output Enable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
1, 7, 8
tPHZ
tPLZ
Output Disable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
1.5
9.0
1.5
7.5
ns
1, 7, 8
tSU
tH
Set-up Time HIGH or LOW
A or B to LEAB or LEBA
2.0
2.0
—
—
2.0
2.0
—
—
ns
ns
4
4
Hold Time HIGH or LOW
A or B to LEAB or LEBA
tW
LEBA or LEAB Pulse Width LOW
Output Skew[16]
4.0
—
—
4.0
—
—
ns
ns
5
tSK(O)
0.5
0.5
—
CY74FCT16543CT
CY74FCT162543CT
CY74FCT162H543CT
Fig.
Parameter
Description
Min.
Max.
Unit No.[15]
tPLH
tPHL
Propagation Delay
Transparent Mode
A to B or B to A
1.5
5.1
ns
1, 3
tPLH
tPHL
Propagation Delay
LEBA to A, LEAB to B
1.5
1.5
5.6
7.8
ns
ns
1, 5
tPZH
tPZL
Output Enable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
1, 7, 8
tPHZ
tPLZ
Output Disable Time
OEBA or OEAB to A or B
CEBA or CEAB to A or B
1.5
6.5
ns
1, 7, 8
tSU
tH
Set-up Time HIGH or LOW
A or B to LEAB or LEBA
2.0
2.0
—
—
ns
ns
4
4
Hold Time HIGH or LOW
A or B to LEAB or LEBA
tW
LEBA or LEAB Pulse Width LOW
Output Skew[16]
4.0
—
—
ns
ns
5
tSK(O)
0.5
—
Notes:
14. Minimum limits are specified but not tested on Propagation Delays.
15. See “Parameter Measurement Information” in the General Information section.
16. Skew between any two outputs of the same package switching in the same directional. This parameter is ensured by design.
5
CY74FCT16543T
CY74FCT162543T
CY74FCT162H543T
Ordering Information CY74FCT16543
Speed
Package
Name
Operating
Range
(ns)
5.1
6.5
8.5
Ordering Code
CY74FCT16543CTPVC/PVCT
CY74FCT16543ATPACT
Package Type
56-Lead (300-Mil) SSOP
O56
Z56
O56
Industrial
Industrial
Industrial
56-Lead (240-Mil) TSSOP
56-Lead (300-Mil) SSOP
CY74FCT16543TPVC/PVCT
Ordering Information CY74FCT162543
Speed
Package
Name
Operating
Range
(ns)
Ordering Code
74FCT162543CTPACT
CY74FCT162543CTPVC
74FCT162543CTPVCT
74FCT162543ATPACT
CY74FCT162543TPVC/PVCT
Package Type
5.1
Z56
O56
O56
Z56
O56
56-Lead (240-Mil) TSSOP
56-Lead (300-Mil) SSOP
56-Lead (300-Mil) SSOP
56-Lead (240-Mil) TSSOP
56-Lead (300-Mil) SSOP
Industrial
6.5
8.5
Industrial
Industrial
Ordering Information CY74FCT162H543T
Speed
(ns)
Package
Operating
Range
Ordering Code
Name
Package Type
56-Lead (240-Mil) TSSOP
5.1
74FCT162H543CTPACT
Z56
Industrial
6
CY74FCT16543T
CY74FCT162543T
CY74FCT162H543T
Package Diagrams
56-Lead Shrunk Small Outline Package O56
56-Lead Thin Shrunk Small Outline Package Z56
7
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
74FCT162543ATPACT
74FCT162543CTPACT
74FCT162543CTPVCG4
74FCT162543CTPVCT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
56
56
56
56
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
SSOP
SSOP
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74FCT162543ETPACT
74FCT162543ETPVCT
74FCT162543TPVCG4
OBSOLETE TSSOP
DGG
DL
56
56
56
TBD
TBD
Call TI
Call TI
Call TI
Call TI
OBSOLETE
ACTIVE
SSOP
SSOP
DL
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74FCT162543TPVCTG4
74FCT162H543CTPACT
74FCT16543ATPACTE4
74FCT16543ATPACTG4
74FCT16543CTPVCG4
74FCT16543CTPVCTG4
74FCT16543TPVCG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
SSOP
DL
DGG
DGG
DGG
DL
56
56
56
56
56
56
56
56
56
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74FCT16543TPVCTG4
CY74FCT162543CTPVC
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT162543ETPAC
CY74FCT162543ETPVC
CY74FCT162543TPVC
OBSOLETE TSSOP
DGG
DL
56
56
56
TBD
TBD
Call TI
Call TI
Call TI
Call TI
OBSOLETE
ACTIVE
SSOP
SSOP
DL
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT162543TPVCT
CY74FCT16543ATPACT
CY74FCT16543CTPVC
CY74FCT16543CTPVCT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
TSSOP
SSOP
SSOP
DL
DGG
DL
56
56
56
56
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT16543ETPAC
CY74FCT16543ETPACT
CY74FCT16543ETPVC
CY74FCT16543ETPVCT
CY74FCT16543TPVC
OBSOLETE TSSOP
OBSOLETE TSSOP
DGG
DGG
DL
56
56
56
56
56
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
OBSOLETE
OBSOLETE
ACTIVE
SSOP
SSOP
SSOP
DL
DL
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
Orderable Device
CY74FCT16543TPVCT
FCT162543ATPACTE4
FCT162543ATPACTG4
FCT162543CTPACTE4
FCT162543CTPACTG4
FCT162543CTPVCTG4
FCT162H543CTPACTE4
FCT162H543CTPACTG4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DL
56
56
56
56
56
56
56
56
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
DGG
DGG
DGG
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
DGG
DGG
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
74FCT162543ATPACT TSSOP
74FCT162543CTPACT TSSOP
DGG
DGG
DL
56
56
56
56
56
56
56
56
2000
2000
1000
2000
1000
2000
1000
1000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
24.4
24.4
32.4
24.4
32.4
24.4
32.4
32.4
8.6
8.6
15.6
15.6
1.8
1.8
3.1
1.8
3.1
1.8
3.1
3.1
12.0
12.0
16.0
12.0
16.0
12.0
16.0
16.0
24.0
24.0
32.0
24.0
32.0
24.0
32.0
32.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
74FCT162543CTPVCT
SSOP
11.35
8.6
18.67
15.6
74FCT162H543CTPACT TSSOP
CY74FCT162543TPVCT SSOP
CY74FCT16543ATPACT TSSOP
CY74FCT16543CTPVCT SSOP
DGG
DL
11.35
8.6
18.67
15.6
DGG
DL
11.35
11.35
18.67
18.67
CY74FCT16543TPVCT
SSOP
DL
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74FCT162543ATPACT
74FCT162543CTPACT
74FCT162543CTPVCT
74FCT162H543CTPACT
CY74FCT162543TPVCT
CY74FCT16543ATPACT
CY74FCT16543CTPVCT
CY74FCT16543TPVCT
TSSOP
TSSOP
SSOP
DGG
DGG
DL
56
56
56
56
56
56
56
56
2000
2000
1000
2000
1000
2000
1000
1000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
41.0
41.0
49.0
41.0
49.0
41.0
49.0
49.0
TSSOP
SSOP
DGG
DL
TSSOP
SSOP
DGG
DL
SSOP
DL
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
74FCT162543ATPACT
74FCT162543CTPACT
74FCT162543CTPVCG4
74FCT162543CTPVCT
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
TSSOP
TSSOP
SSOP
DGG
56
56
56
56
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
FCT162543A
ACTIVE
ACTIVE
ACTIVE
DGG
DL
2000
20
Green (RoHS
& no Sb/Br)
-40 to 85
FCT162543C
FCT162543C
FCT162543C
Green (RoHS
& no Sb/Br)
-40 to 85
SSOP
DL
1000
Green (RoHS
& no Sb/Br)
-40 to 85
74FCT162543ETPACT
74FCT162543ETPVCT
74FCT162543TPVCG4
OBSOLETE
OBSOLETE
ACTIVE
TSSOP
SSOP
SSOP
DGG
DL
56
56
56
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 85
-40 to 85
-40 to 85
DL
20
1000
2000
2000
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162543
FCT162543
FCT16543A
FCT16543A
FCT16543C
FCT16543C
FCT16543
74FCT162543TPVCTG4
74FCT16543ATPACTE4
74FCT16543ATPACTG4
74FCT16543CTPVCG4
74FCT16543CTPVCTG4
74FCT16543TPVCG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
DL
DGG
DGG
DL
56
56
56
56
56
56
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
DL
1000
20
Green (RoHS
& no Sb/Br)
DL
Green (RoHS
& no Sb/Br)
74FCT16543TPVCTG4
CY74FCT162543CTPVC
OBSOLETE
ACTIVE
SSOP
SSOP
DL
DL
56
56
TBD
Call TI
Call TI
-40 to 85
-40 to 85
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162543C
CY74FCT162543ETPAC
CY74FCT162543ETPVC
CY74FCT162543TPVC
OBSOLETE
OBSOLETE
ACTIVE
TSSOP
SSOP
SSOP
DGG
DL
56
56
56
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 85
-40 to 85
-40 to 85
DL
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162543
FCT162543
CY74FCT162543TPVCT
ACTIVE
SSOP
DL
56
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
CY74FCT16543ATPACT
CY74FCT16543CTPVC
CY74FCT16543CTPVCT
ACTIVE
TSSOP
SSOP
SSOP
DGG
56
56
56
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
FCT16543A
ACTIVE
ACTIVE
DL
DL
20
Green (RoHS
& no Sb/Br)
-40 to 85
FCT16543C
FCT16543C
1000
Green (RoHS
& no Sb/Br)
-40 to 85
CY74FCT16543ETPAC
CY74FCT16543ETPACT
CY74FCT16543ETPVC
CY74FCT16543ETPVCT
CY74FCT16543TPVC
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
TSSOP
TSSOP
SSOP
SSOP
SSOP
DGG
DGG
DL
56
56
56
56
56
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Call TI
Call TI
DL
Call TI
Call TI
DL
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT16543
CY74FCT16543TPVCT
FCT162543ATPACTE4
OBSOLETE
ACTIVE
SSOP
DL
56
56
TBD
Call TI
Call TI
-40 to 85
-40 to 85
FCT16543
TSSOP
DGG
2000
2000
2000
2000
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162543A
FCT162543ATPACTG4
FCT162543CTPACTE4
FCT162543CTPACTG4
FCT162543CTPVCTG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
SSOP
DGG
DGG
DGG
DL
56
56
56
56
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
FCT162543A
FCT162543C
FCT162543C
FCT162543C
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74FCT162543ATPACT TSSOP
74FCT162543CTPACT TSSOP
DGG
DGG
DL
56
56
56
56
56
56
2000
2000
1000
1000
2000
1000
330.0
330.0
330.0
330.0
330.0
330.0
24.4
24.4
32.4
32.4
24.4
32.4
8.6
8.6
15.6
15.6
1.8
1.8
3.1
3.1
1.8
3.1
12.0
12.0
16.0
16.0
12.0
16.0
24.0
24.0
32.0
32.0
24.0
32.0
Q1
Q1
Q1
Q1
Q1
Q1
74FCT162543CTPVCT
SSOP
11.35 18.67
11.35 18.67
CY74FCT162543TPVCT SSOP
CY74FCT16543ATPACT TSSOP
CY74FCT16543CTPVCT SSOP
DL
DGG
DL
8.6
15.6
11.35 18.67
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74FCT162543ATPACT
74FCT162543CTPACT
74FCT162543CTPVCT
CY74FCT162543TPVCT
CY74FCT16543ATPACT
CY74FCT16543CTPVCT
TSSOP
TSSOP
SSOP
DGG
DGG
DL
56
56
56
56
56
56
2000
2000
1000
1000
2000
1000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
45.0
45.0
55.0
55.0
45.0
55.0
SSOP
DL
TSSOP
SSOP
DGG
DL
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
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相关型号：
CY74FCT16543ETPACT
Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, PDSO56, 0.240 INCH, 0.0196 INCH PITCH, TSSOP-56
CYPRESS
CY74FCT16543ETPVCT
Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, PDSO56, 0.300 INCH, 0.025 INCH PITCH, SSOP-56
CYPRESS
CY74FCT16543TPACR
Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, PDSO56, 0.240 INCH, TSSOP-56
CYPRESS
CY74FCT16543TPACT
Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, PDSO56, 0.240 INCH, TSSOP-56
CYPRESS
CY74FCT16543TPVCR
FCT SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, 0.300 INCH, 0.635 MM PITCH, GREEN, PLASTIC, SSOP-56
TI
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