CD74HC4015E [TI]

High Speed CMOS Logic Dual 4-Stage Static Shift Register; 高速CMOS逻辑双路4级静态移位寄存器
CD74HC4015E
型号: CD74HC4015E
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

High Speed CMOS Logic Dual 4-Stage Static Shift Register
高速CMOS逻辑双路4级静态移位寄存器

移位寄存器
文件: 总6页 (文件大小:41K)
中文:  中文翻译
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CD74HC4015  
Data sheet acquired from Harris Semiconductor  
SCHS198  
High Speed CMOS Logic  
Dual 4-Stage Static Shift Register  
November 1997  
Features  
Description  
• Maximum Frequency, Typically 60MHz  
o
The Harris CD74HC4015 consists of two identical,  
independent, 4-stage serial-input/parallel-output registers.  
Each register has independent Clock (CP) and Reset (MR)  
inputs as well as a single serial Data input. “Q” outputs are  
available from each of the four stages on both registers. All  
register stages are D-type, master-slave flip-flops. The logic  
level present at the Data input is transferred into the first  
register stage and shifted over one stage at each positive-  
going clock transition. Resetting of all stages is  
accomplished by a high level on the reset line.  
C = 15pF, V  
= 5V, T = 25 C  
A
L
CC  
[ /Title  
(CD74  
HC401  
5)  
/Sub-  
ject  
• Positive-Edge Clocking  
• Overriding Reset  
• Buffered Inputs and Outputs  
• Fanout (Over Temperature Range)  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads  
(High  
Speed  
CMOS  
Logic  
Dual  
4-  
The device can drive up to 10 low power Schottky equivalent  
loads. The CD74HC4015 is an enhanced version of  
equivalent CMOS types.  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
Ordering Information  
PKG.  
NO.  
• HC Types  
o
PART NUMBER TEMP. RANGE ( C) PACKAGE  
- 2V to 6V Operation  
CD74HC4015E  
NOTES:  
-55 to 125  
20 Ld PDIP  
E16.3  
- High Noise Immunity: N = 30%, N = 30% of V  
IL IH CC  
at V  
= 5V  
CC  
1. When ordering, use the entire part number. Add the suffix 96 to  
obtain the variant in the tape and reel.  
2. Wafer or die for this part number is available which meets all elec-  
trical specifications. Please contact your local sales office or  
Harris customer service for ordering information.  
Pinout  
CD74HC4015  
(PDIP)  
TOP VIEW  
2CP  
1
2
3
4
5
6
7
8
16 V  
CC  
2Q  
1Q  
1Q  
1Q  
15 2D  
3
2
1
0
14 2MR  
13 2Q  
12 2Q  
11 2Q  
10 1Q  
0
1
2
3
1MR  
1D  
9
1CP  
GND  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
File Number 1678.1  
Copyright © Harris Corporation 1997  
1
CD74HC4015  
Functional Diagram  
5
7
1D  
1CP  
1MR  
1Q  
1Q  
1Q  
1Q  
0
1
2
3
4
9
6
3
10  
13  
12  
11  
2
15  
1
2D  
2CP  
2MR  
2Q  
2Q  
2Q  
2Q  
0
1
2
3
14  
GND = 8  
V
= 16  
CC  
TRUTH TABLE  
INPUTS  
OUTPUTS  
CP  
D
l
R
Q
Q
q’  
q’  
q’  
Q
q’  
q’  
q’  
Q
q’  
q’  
q’  
0
1
2
1
1
2
3
2
2
3
L
L
L
0
0
1
h
X
X
H
X
L
q’  
0
H
L
L
L
L
NOTES:  
H = High Voltage Level  
h = High Voltage Level One Set-up Time Prior to the Low to High Clock Transition  
L = Low Voltage Level  
l = Low Voltage Level One Set-up Time Prior to the Low to High Clock Transition  
X = Don’t Care.  
= Low to High Clock Transition  
= High to Low Clock Transition  
q’ = Lower case letters indicate the state of the referenced output one set-up time prior to the Low to High  
n
clock transition.  
2
CD74HC4015  
t6  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V  
Thermal Resistance (Typical, Note 3)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
For V < -0.5V or V > V  
JA  
IK  
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C  
90  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
o
o
DC Output Diode Current, I  
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
DC Output Source or Sink Current per Output Pin, I  
O
(SOIC - Lead Tips Only)  
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
DC V  
or Ground Current, I  
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA  
CC  
CC  
Operating Conditions  
o
o
Temperature Range, T . . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
CC  
I
O
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
3. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
f
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
V
CC  
PARAMETER  
SYMBOL  
V (V)  
I
I
(mA)  
(V)  
MIN  
TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
V
O
High Level Input  
Voltage  
V
-
-
2
1.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
-
1.5  
-
-
IH  
4.5  
6
3.15  
-
-
3.15  
-
-
3.15  
V
4.2  
4.2  
4.2  
-
V
Low Level Input  
Voltage  
V
-
-
2
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
V
IL  
4.5  
6
-
-
-
V
-
-
-
V
High Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
-0.02  
2
1.9  
1.9  
1.9  
V
OH  
-0.02  
-0.02  
-
4.5  
6
4.4  
-
4.4  
-
4.4  
-
V
5.9  
-
5.9  
-
5.9  
-
V
High Level Output  
Voltage  
TTL Loads  
-
-
-
-
-
-
-
V
-4  
4.5  
6
3.98  
-
3.84  
-
3.7  
-
V
-5.2  
0.02  
0.02  
0.02  
-
5.48  
-
5.34  
-
5.2  
-
V
Low Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
2
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
V
OL  
4.5  
6
V
V
Low Level Output  
Voltage  
TTL Loads  
-
V
4
4.5  
6
0.26  
0.26  
±0.1  
0.33  
0.33  
±1  
0.4  
0.4  
±1  
V
5.2  
-
V
Input Leakage  
Current  
I
V
or  
6
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
GND  
or  
0
6
-
-
8
-
80  
-
160  
µA  
CC  
CC  
NOTE: For dual-supply systems theoretical worst case (V = 2.4V, V  
= 5.5V) specification is 1.8mA.  
I
CC  
3
CD74HC4015  
Prerequisite for Switching Specifications  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
Maximum Clock  
SYMBOL  
f
V
(V)  
MIN  
6
MAX  
MIN  
5
MAX  
MIN  
4
MAX  
UNITS  
MHz  
MHz  
MHz  
ns  
CC  
2
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MAX  
Frequency  
4.5  
30  
35  
80  
16  
14  
150  
30  
26  
50  
10  
9
24  
28  
100  
20  
17  
190  
38  
33  
65  
13  
11  
75  
15  
13  
0
20  
24  
120  
24  
20  
225  
45  
38  
75  
15  
13  
90  
18  
15  
0
6
2
Clock Pulse Width  
t
t
W
W
4.5  
6
ns  
ns  
MR Pulse Width  
2
ns  
4.5  
6
ns  
ns  
MR Recovery Time  
t
2
ns  
REC  
4.5  
6
ns  
ns  
Set-up Time,  
Data-In to CP  
t
t
2
60  
12  
10  
0
ns  
SUL, SUH  
4.5  
6
ns  
ns  
Hold Time,  
Data-In to CP  
t
2
ns  
H
4.5  
6
0
0
0
ns  
0
0
0
ns  
Switching Specifications Input t , t = 6ns  
r
f
o
o
o
o
o
25 C  
MIN TYP MAX  
-40 C TO 85 C -55 C TO 125 C  
TEST  
SYMBOL CONDITIONS  
V
CC  
(V)  
PARAMETER  
MIN  
MAX  
220  
44  
-
MIN  
MAX UNITS  
Propagation Delay (Figure 1)  
t
t
t
C = 50pF  
2
4.5  
5
-
-
-
-
-
-
-
-
175  
35  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
270  
54  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
pF  
MHz  
pF  
PLH,  
L
t
PHL  
Clock to Q  
n
C =15pF  
14  
-
L
C = 50pF  
6
30  
275  
55  
-
37  
345  
64  
-
46  
415  
83  
-
L
MR to Q , (Clock High)  
C = 50pF  
2
-
n
PLH,  
L
t
PHL  
4.5  
-
C =15pF  
25  
-
L
C = 50pF  
6
2
-
-
-
47  
325  
65  
-
54  
400  
81  
-
71  
490  
98  
-
L
MR to Q , (Clock Low)  
n
C = 50pF  
-
PLH,  
L
t
PHL  
4.5  
-
C =15pF  
25  
-
L
C = 50pF  
6
2
-
-
-
-
-
-
-
55  
75  
15  
13  
10  
-
69  
95  
19  
16  
10  
-
83  
110  
22  
19  
10  
-
L
Output Transition Time  
(Figure 1)  
t
, t  
C = 50pF  
-
TLH THL  
L
4.5  
6
-
-
Input Capacitance  
C
C = 50pF  
-
-
IN  
L
Maximum Clock Frequency  
f
C =15pF  
5
60  
43  
MAX  
L
Power Dissipation  
Capacitance  
(Notes 4, 5)  
C
C =15pF  
5
-
-
-
PD  
L
NOTES:  
4. C  
is used to determine the dynamic power consumption, per shift register.  
PD  
5. P = V  
2
2
f + C  
V
where f = Input Frequency, C = Output Load Capacitance, V = Supply Voltage.  
CC  
D
CC  
i
L
CC  
i
L
4
CD74HC4015  
Test Circuit and Waveform  
t C  
t C  
f
L
r
L
V
CC  
90%  
10%  
CLOCK  
INPUT  
50%  
GND  
t
t
H(H)  
H(L)  
V
CC  
DATA  
INPUT  
50%  
GND  
t
t
SU(H)  
SU(L)  
t
t
90%  
50%  
TLH  
THL  
90%  
OUTPUT  
10%  
t
t
PHL  
PLH  
t
REM  
V
CC  
SET, RESET  
OR PRESET  
50%  
GND  
IC  
C
L
50pF  
FIGURE 1. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED  
SEQUENTIAL LOGIC CIRCUITS  
5
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1998, Texas Instruments Incorporated  

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