CD74AC244M96G4 [TI]

Octal Non-Inverting Buffers/Line Drivers with 3-State Outputs 20-SOIC -55 to 125;


型号：	CD74AC244M96G4
厂家：	TEXAS INSTRUMENTS
描述：	Octal Non-Inverting Buffers/Line Drivers with 3-State Outputs 20-SOIC -55 to 125 驱动光电二极管输出元件逻辑集成电路
文件：	总17页 (文件大小：798K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Data sheet acquired from Harris Semiconductor

SCHS287B − Revised January 2004

The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the

CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal

buffer/line drivers use the RCA ADVANCED CMOS technology. The

CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output

enables (1OE, 2OE). The CD54/74AC/ACT241 has one active-LOW (1OE)

and one active-HIGH (2OE) output enable.

The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line

plastic packages (E suffix) and 20-lead small-outline packages (M and

M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic

packages (E suffix) and the CD74ACT241 is supplied in 20-lead

dual-in-line plastic packages (E suffix) and 20-lead small-outline

packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied

in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline

packages (M and M96 suffixes), and 20-lead shrink small-outline

packages (SM96 suffix). These package types are operable over the

following temperature ranges: Commerical (0 to 705C); Industrial (−40

to +855C); and Extended Industrial/Military (−55 to + 1255C).

The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241,

and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic

packages (F3A suffix) and are operable over the −55 to +1255C

temperature range.

This data sheet is applicable to the CD54/74AC240, CD54ACT240, and CD54/74ACT241. The CD54/74AC241 were not acquired from

Harris Semiconductor. See SCHS244 for information on the CD74ACT240, CD74AC244, and CD74ACT244.

For T = -40 to +85°C (Package Type E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW

For T = -40 to +70°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mW

For T = +70 to +85°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Derate Linearly at 6 mW/°C to 310 mW

OPERATING-TEMPERATURE RANGE (T ): CD54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55 to +125°C

CD74 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to +85°C

STORAGE TEMPERATURE (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to +150°C

stg

LEAD TEMPERATURE (DURING SOLDERING):

At distance 1/16 1/32 in. (1.59 0.79 mm) from case for 10 s maximum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..+265°C

Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only. . . . . . . . . . . . . . . . . . . . . . . . . . .+300°C

* For up to 4 outputs per device: add 25 mA for each additional output.

LIMITS

CHARACTERISTIC

UNITS

MAX.

MIN.

Supply-Voltage Range, V *:

(For T = Full Package-Temperature Range)

1.5

4.5

5.5

AC Types

ACT Types

DC Input or Output Voltage, V , V

CD54

CD74

-55

-40

+125

+85

Operating Temperature, T

°C

Input Rise and Fall Slew Rate, dt/dv

at 1.5 V to 3 V (AC Types)

ns/V

at 3.6 v to 5.5 V (AC Types)

at 4.5 V to 5.5 V (ACT Types)

* Unless otherwise specified, all voltages are referenced to ground.

PACKAGE OPTION ADDENDUM

www.ti.com

10-Jun-2014

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

CD54AC240F3A

CD54AC244F3A

CD54ACT240F3A

CD54ACT241F3A

CD54ACT244F3A

CD74AC240E

ACTIVE

CDIP

PDIP

TBD

A42

N / A for Pkg Type

-55 to 125

CD54AC240F3A

ACTIVE

CD54AC244F3A

CD54ACT240F3A

CD54ACT241F3A

CD54ACT244F3A

CD74AC240E

A42

Pb-Free

(RoHS)

CU NIPDAU

CD74AC240EE4

CD74AC240M

ACTIVE

PDIP

SOIC

PDIP

SOIC

SSOP

PDIP

SOIC

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

Level-1-260C-UNLIM

N / A for Pkg Type

Level-1-260C-UNLIM

N / A for Pkg Type

Level-1-260C-UNLIM

-55 to 125

CD74AC240E

AC240M

Green (RoHS

& no Sb/Br)

CD74AC240M96

CD74AC244E

2000

Green (RoHS

& no Sb/Br)

AC240M

Pb-Free

(RoHS)

CD74AC244E

AC244M

CD74AC244EE4

CD74AC244M

Pb-Free

(RoHS)

Green (RoHS

& no Sb/Br)

CD74AC244M96

CD74AC244M96G4

CD74AC244SM96

CD74ACT240E

CD74ACT240EE4

CD74ACT240M

2000

Green (RoHS

& no Sb/Br)

AC244M

Green (RoHS

& no Sb/Br)

AC244M

Green (RoHS

& no Sb/Br)

AC244SM

Pb-Free

(RoHS)

CD74ACT240E

ACT240M

Pb-Free

(RoHS)

Green (RoHS

& no Sb/Br)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Jun-2014

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-55 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

CD74ACT240M96

CD74ACT240M96E4

CD74ACT241E

ACTIVE

SOIC

PDIP

SOIC

PDIP

SOIC

SSOP

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

N / A for Pkg Type

ACT240M

ACTIVE

2000

Green (RoHS

& no Sb/Br)

ACT240M

Pb-Free

(RoHS)

CD74ACT241E

ACT241M

CD74ACT241M96

CD74ACT244E

2000

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

N / A for Pkg Type

Pb-Free

(RoHS)

CD74ACT244E

ACT244M

CD74ACT244M

Green (RoHS

& no Sb/Br)

Level-1-260C-UNLIM

CD74ACT244M96

CD74ACT244M96E4

CD74ACT244M96G4

CD74ACT244MG4

CD74ACT244SM96

2000

Green (RoHS

& no Sb/Br)

ACT244M

Green (RoHS

& no Sb/Br)

ACT244M

Green (RoHS

& no Sb/Br)

ACT244M

Green (RoHS

& no Sb/Br)

ACT244M

2000

Green (RoHS

& no Sb/Br)

ACT244SM

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

10-Jun-2014

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD54AC240, CD54AC244, CD54ACT240, CD54ACT241, CD54ACT244, CD74AC240, CD74AC244, CD74ACT240, CD74ACT241,

CD74ACT244 :

Catalog: CD74AC240, CD74AC244, CD74ACT240, CD74ACT241, CD74ACT244

•

Military: CD54AC240, CD54AC244, CD54ACT240, CD54ACT241, CD54ACT244

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Military - QML certified for Military and Defense Applications

•

Addendum-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

CD74AC240M96

CD74AC244M96

CD74AC244SM96

CD74ACT240M96

CD74ACT241M96

CD74ACT244M96

CD74ACT244SM96

SOIC

SSOP

SOIC

SSOP

2000

330.0

24.4

16.4

24.4

16.4

10.8

8.2

13.0

7.5

2.7

2.5

2.7

2.5

12.0

24.0

16.0

24.0

16.0

10.8

8.2

13.0

7.5

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

CD74AC240M96

CD74AC244M96

CD74AC244SM96

CD74ACT240M96

CD74ACT241M96

CD74ACT244M96

CD74ACT244SM96

SOIC

SSOP

SOIC

SSOP

2000

367.0

45.0

38.0

45.0

38.0

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38

0,22

0,65

0,15

0,25

0,09

5,60

5,00

8,20

7,40

Gage Plane

0,25

0°–ā8°

0,95

0,55

Seating Plane

0,10

2,00 MAX

0,05 MIN

PINS **

DIM

6,50

5,90

6,50

5,90

7,50

8,50

7,90

10,50

9,90

10,50 12,90

A MAX

A MIN

6,90

9,90

12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

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CD74AC244M96G4 [TI]

相关型号：

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