CD4047BMG4 [TI]
CMOS Low-Power Monostable/Astable Multivibrator; CMOS低功耗单稳态/非稳态多谐振荡器型号: | CD4047BMG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | CMOS Low-Power Monostable/Astable Multivibrator |
文件: | 总21页 (文件大小:1494K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
The CD4047B-Series types are supplied in
14-lead hermetic dual-in-line ceramic
packages (F3A suffix), 14-lead dual-in-line
plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and
NSR suffixes), and 14-lead thin shrink
small-outline packages (PW and PWR
suffixes).
gt © 0Ittt
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
8102001CA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
8102001CA
CD4047BF3A
CD4047BD3
CD4047BE
ACTIVE
ACTIVE
CDIP SB
PDIP
JD
N
14
14
1
TBD
POST-PLATE
CU NIPDAU
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
CD4047BD/3
25
Pb-Free
(RoHS)
CD4047BE
CD4047BE
CD4047BF
CD4047BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4047BF
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
CD4047BF3A
TBD
8102001CA
CD4047BF3A
CD4047BM
CD4047BM96
CD4047BM96E4
CD4047BM96G4
CD4047BME4
CD4047BMG4
CD4047BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
50
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD4047BM
CD4047BM
CD4047BM
CD4047BM
CD4047BM
CD4047BM
CD4047BM
CD4047BM
CD4047BM
CD4047B
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
50
Green (RoHS
& no Sb/Br)
D
250
250
250
2000
2000
Green (RoHS
& no Sb/Br)
CD4047BMTE4
CD4047BMTG4
CD4047BNSR
CD4047BNSRE4
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
NS
NS
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
CD4047B
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
CD4047BNSRG4
CD4047BPW
ACTIVE
SO
NS
14
14
14
14
14
14
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
CD4047B
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
90
90
Green (RoHS
& no Sb/Br)
CM047B
CM047B
CM047B
CM047B
CM047B
CM047B
CD4047BPWE4
CD4047BPWG4
CD4047BPWR
CD4047BPWRE4
CD4047BPWRG4
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4047B, CD4047B-MIL :
Catalog: CD4047B
•
Military: CD4047B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4047BM96
CD4047BMT
CD4047BPWR
SOIC
SOIC
D
D
14
14
14
2500
250
330.0
330.0
330.0
16.4
16.4
12.4
6.5
6.5
6.9
9.0
9.0
5.6
2.1
2.1
1.6
8.0
8.0
8.0
16.0
16.0
12.0
Q1
Q1
Q1
TSSOP
PW
2000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4047BM96
CD4047BMT
CD4047BPWR
SOIC
SOIC
D
D
14
14
14
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
35.0
TSSOP
PW
2000
Pack Materials-Page 2
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相关型号:
CD4047BMW
IC 4000/14000/40000 SERIES, MONOSTABLE MULTIVIBRATOR, CDFP14, CERAMIC, FP-14, Prescaler/Multivibrator
TI
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