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CD4024BF3AS2534 [TI]

CMOS Ripple-Carry Binary Counter / Dividers; CMOS纹波进位二进制计数器/除法器
CD4024BF3AS2534
型号： CD4024BF3AS2534
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

CMOS Ripple-Carry Binary Counter / Dividers
CMOS纹波进位二进制计数器/除法器

计数器 触发器 逻辑集成电路 输出元件
文件： 总23页 (文件大小：1122K)
中文：  中文翻译
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The CD4020B and CD4040B types are supplied  
in 16-lead hermetic dual-in-line ceramic  
packages (F3A suffix), 16-lead dual-in-line  
plastic  
small-outline  
packages  
(E  
suffix),  
16-lead  
packages (NSR suffix), and  
16-lead thin shrink small-outline packages (PW  
and PWR suffixes). The CD4040B type also is  
supplied in 16-lead small-outline packages (M  
and M96 suffixes).  
The CD4024B types are supplied in 14-lead  
hermetic dual-in-line ceramic packages (F3A  
suffix), 14-lead dual-in-line plastic packages (E  
suffix), 14-lead small-outline packages (M, MT,  
M96, and NSR suffixes), and 14-lead thin shrink  
small-outline packages (PW and PWR suffixes).  
Copyright © 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
89271AKB3T  
89274AKB3T  
CD4020BE  
OBSOLETE  
OBSOLETE  
ACTIVE  
CFP  
CFP  
PDIP  
WR  
16  
16  
16  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-55 to 125  
-55 to 125  
-55 to 125  
WR  
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
CD4020BE  
CD4020BEE4  
ACTIVE  
PDIP  
N
16  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
-55 to 125  
CD4020BE  
CD4020BF  
CD4020BF3A  
CD4020BNSR  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SO  
J
J
16  
16  
16  
1
1
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
-55 to 125  
CD4020BF  
CD4020BF3A  
CD4020B  
TBD  
NS  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CD4020BNSRE4  
CD4020BNSRG4  
CD4020BPW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
N
16  
16  
16  
16  
16  
16  
16  
16  
14  
14  
14  
2000  
2000  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
A42  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
CD4020B  
CD4020B  
CM020B  
CM020B  
CM020B  
CM020B  
CM020B  
CM020B  
CD4024BE  
CD4024BE  
CD4024BF  
SO  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
Green (RoHS  
& no Sb/Br)  
CD4020BPWE4  
CD4020BPWG4  
CD4020BPWR  
CD4020BPWRE4  
CD4020BPWRG4  
CD4024BE  
90  
Green (RoHS  
& no Sb/Br)  
90  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Pb-Free  
(RoHS)  
CD4024BEE4  
CD4024BF  
PDIP  
N
25  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
CDIP  
J
1
TBD  
N / A for Pkg Type  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
CD4024BF3A  
ACTIVE  
CDIP  
J
14  
1
TBD  
A42  
N / A for Pkg Type  
-55 to 125  
CD4024BF3A  
CD4024BF3AS2534  
CD4024BM  
OBSOLETE  
ACTIVE  
CDIP  
SOIC  
J
14  
14  
TBD  
Call TI  
Call TI  
D
50  
2500  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
CD4024BM  
CD4024BM  
CD4024BM  
CD4024BM  
CD4024BM  
CD4024BM  
CD4024BM  
CD4024BM  
CD4024BM  
CD4024B  
CD4024B  
CD4024B  
CM024B  
CD4024BM96  
CD4024BM96E4  
CD4024BM96G4  
CD4024BME4  
CD4024BMG4  
CD4024BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
50  
Green (RoHS  
& no Sb/Br)  
D
250  
250  
250  
2000  
2000  
2000  
90  
Green (RoHS  
& no Sb/Br)  
CD4024BMTE4  
CD4024BMTG4  
CD4024BNSR  
CD4024BNSRE4  
CD4024BNSRG4  
CD4024BPW  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
Green (RoHS  
& no Sb/Br)  
CD4024BPWE4  
CD4024BPWG4  
CD4024BPWR  
90  
Green (RoHS  
& no Sb/Br)  
CM024B  
90  
Green (RoHS  
& no Sb/Br)  
CM024B  
2000  
Green (RoHS  
& no Sb/Br)  
CM024B  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
CD4024BPWRE4  
CD4024BPWRG4  
ACTIVE  
TSSOP  
TSSOP  
PW  
14  
14  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
CM024B  
ACTIVE  
PW  
2000  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
-55 to 125  
CM024B  
CD4040B-W  
CD4040BE  
ACTIVE WAFERSALE  
YS  
N
0
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
16  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
CD4040BE  
CD4040BE  
CD4040BEE4  
N
16  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
CD4040BF  
CD4040BF3A  
CD4040BM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
16  
16  
16  
1
1
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
-55 to 125  
CD4040BF  
CD4040BF3A  
CD4040BM  
TBD  
D
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CD4040BM96  
CD4040BM96E4  
CD4040BM96G4  
CD4040BME4  
CD4040BMG4  
CD4040BNSR  
CD4040BNSRE4  
CD4040BNSRG4  
CD4040BPW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
2500  
2500  
2500  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
CD4040BM  
CD4040BM  
CD4040BM  
CD4040BM  
CD4040BM  
CD4040B  
CD4040B  
CD4040B  
CM040B  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
40  
Green (RoHS  
& no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
2000  
2000  
2000  
90  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
Green (RoHS  
& no Sb/Br)  
CD4040BPWE4  
90  
Green (RoHS  
& no Sb/Br)  
CM040B  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
CD4040BPWG4  
CD4040BPWR  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
CDIP  
PW  
16  
16  
16  
16  
16  
14  
16  
14  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
A42  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
CM040B  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PW  
PW  
PW  
J
2000  
2000  
2000  
1
Green (RoHS  
& no Sb/Br)  
CM040B  
CM040B  
CM040B  
CD4040BPWRE4  
CD4040BPWRG4  
JM38510/05653BEA  
JM38510/05655BCA  
M38510/05653BEA  
M38510/05655BCA  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TBD  
TBD  
TBD  
TBD  
JM38510/  
05653BEA  
CDIP  
J
1
A42  
JM38510/  
05655BCA  
CDIP  
J
1
A42  
JM38510/  
05653BEA  
CDIP  
J
1
A42  
JM38510/  
05655BCA  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2013  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF CD4020B, CD4020B-MIL, CD4024B, CD4024B-MIL, CD4040B, CD4040B-MIL :  
Catalog: CD4020B, CD4024B, CD4040B  
•
Military: CD4020B-MIL, CD4024B-MIL, CD4040B-MIL  
•
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
•
Military - QML certified for Military and Defense Applications  
•
Addendum-Page 5  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CD4020BNSR  
CD4020BPWR  
CD4024BM96  
CD4024BMT  
SO  
TSSOP  
SOIC  
SOIC  
SO  
NS  
PW  
D
16  
16  
14  
14  
14  
14  
16  
16  
16  
2000  
2000  
2500  
250  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
16.4  
12.4  
16.4  
16.4  
16.4  
12.4  
16.4  
16.4  
12.4  
8.2  
6.9  
6.5  
6.5  
8.2  
6.9  
6.5  
8.2  
6.9  
10.5  
5.6  
2.5  
1.6  
2.1  
2.1  
2.5  
1.6  
2.1  
2.5  
1.6  
12.0  
8.0  
16.0  
12.0  
16.0  
16.0  
16.0  
12.0  
16.0  
16.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
9.0  
8.0  
D
9.0  
8.0  
CD4024BNSR  
CD4024BPWR  
CD4040BM96  
CD4040BNSR  
CD4040BPWR  
NS  
PW  
D
2000  
2000  
2500  
2000  
2000  
10.5  
5.6  
12.0  
8.0  
TSSOP  
SOIC  
SO  
10.3  
10.5  
5.6  
8.0  
NS  
PW  
12.0  
8.0  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD4020BNSR  
CD4020BPWR  
CD4024BM96  
CD4024BMT  
SO  
TSSOP  
SOIC  
SOIC  
SO  
NS  
PW  
D
16  
16  
14  
14  
14  
14  
16  
16  
16  
2000  
2000  
2500  
250  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
333.2  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
345.9  
367.0  
367.0  
38.0  
35.0  
38.0  
38.0  
38.0  
35.0  
28.6  
38.0  
35.0  
D
CD4024BNSR  
CD4024BPWR  
CD4040BM96  
CD4040BNSR  
CD4040BPWR  
NS  
PW  
D
2000  
2000  
2500  
2000  
2000  
TSSOP  
SOIC  
SO  
NS  
PW  
TSSOP  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
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