CD4011BF3AS2534 [TI]
CMOS NAND GATES;
| 型号： | CD4011BF3AS2534 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS NAND GATES |
| 文件： | 总12页 (文件大小：522K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4011B, CD4012B, and CD4023B types
are supplied in 14-lead hermetic dual-in-line
ceramic packages (F3A suffix), 14-lead
dual-in-line plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and NSR
suffixes), and 14-lead thin shrink small-outline
packages (PWR suffix). The CD4011B and
CD4023Btypes also are supplied in 14-lead thin
shrink small-outline packages (PW suffix).
Copyright 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CFP
CFP
CFP
PDIP
Drawing
89265AKB3T
89266AKB3T
89273AKB3T
CD4011BE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
WR
14
16
14
14
None
None
None
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WR
WR
N
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD4011BF
CD4011BF3A
CD4011BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
14
14
14
1
1
None
None
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
D
50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4011BM96
CD4011BMT
CD4011BNSR
CD4011BPW
CD4011BPWR
CD4012BE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
2500
250
2000
90
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
NS
PW
PW
N
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
TSSOP
PDIP
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-NC-NC-NC
2000
25
Pb-Free
(RoHS)
Pb-Free
(RoHS)
CD4012BF3A
CD4012BM
ACTIVE
ACTIVE
CDIP
SOIC
J
14
14
1
None
Call TI
Level-NC-NC-NC
D
50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4012BM96
CD4012BMT
CD4012BNSR
CD4012BPWR
CD4023BE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SO
D
D
14
14
14
14
14
2500
250
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
NS
PW
N
2000
2000
25
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
PDIP
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD4023BF
CD4023BF3A
CD4023BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
14
14
14
1
1
None
None
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
D
50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4023BM96
CD4023BMT
CD4023BNSR
CD4023BPW
CD4023BPWR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
14
14
14
14
14
2500
250
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
D
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SO
NS
PW
PW
2000
90
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
TSSOP
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Mar-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
Drawing
JM38510/05051BCA
JM38510/05052BCA
JM38510/05053BCA
ACTIVE
ACTIVE
ACTIVE
J
J
J
14
14
14
1
1
1
None
None
None
Call TI
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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