CC430F513X_技术文档

ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

www.ti.com

SLAS554D –MAY 2009–REVISED JULY 2010

MSP430 SoC with RF Core

1

FEATURES

•

True System-on-Chip (SoC) for Low-Power

Wireless Communication Applications

•

High-Performance Sub-1-GHz RF Transceiver

Core

•

Wide Supply Voltage Range: 1.8 V to 3.6 V

Ultralow Power Consumption:

–

Same as in CC1101

Wide Supply Voltage Range: 2.0 V to 3.6 V

–

CPU Active Mode (AM): 160 µA/MHz

Standby Mode (LPM3 RTC Mode):2.0 µA

Off Mode (LPM4 RAM Retention): 1.0 µA

Radio in RX: 15 mA, 250 kbps, 915 MHz

Frequency Bands: 300 MHz to 348 MHz,

389 MHz to 464 MHz, and 779 MHz to

928 MHz

–

Programmable Data Rate From 0.6 kBaud

to 500 kBaud

•

MSP430™ System and Peripherals

High Sensitivity (–117 dBm at 0.6 kBaud,

-111 dBm at 1.2 kBaud, 315 MHz, 1% Packet

Error Rate)

–

16-Bit RISC Architecture, Extended

Memory, up to 20-MHz System Clock

Wake-Up From Standby Mode in Less

Than 6 µs

–

Excellent Receiver Selectivity and Blocking

Performance

Flexible Power Management System with

SVS and Brownout

Programmable Output Power Up to +12

dBm for All Supported Frequencies

–

Unified Clock System with FLL

2-FSK, 2-GFSK, and MSK Supported as well

as OOK and Flexible ASK Shaping

16-Bit Timer TA0, Timer_A with Five

Capture/Compare Registers

Flexible Support for Packet-Oriented

Systems: On-Chip Support for Sync Word

Detection, Address Check, Flexible Packet

Length, and Automatic CRC Handling

–

16-Bit Timer TA1, Timer_A with Three

Capture/Compare Registers

–

Hardware Real-Time Clock

Two Universal Serial Communication

Interfaces

–

Support for Automatic Clear Channel

Assessment (CCA) Before Transmitting (for

Listen-Before-Talk Systems)

–

USCI_A0 supporting UART, IrDA, SPI

USCI_B0 supporting I²C, SPI

–

Digital RSSI Output

Suited for Systems Targeting Compliance

With EN 300 220 (Europe) and

FCC CFR Part 15 (US)

–

12-Bit A/D Converter With Internal

Reference, Sample-and-Hold, and Autoscan

Features (Only CC430F613x and

CC430F513x)

–

Suited for Systems Targeting Compliance

With Wireless M-Bus Standard EN

13757-4:2005

–

Comparator

Integrated LCD Driver With Contrast

Control for up to 96 Segments (Only

CC430F61xx)

Support for Asynchronous and

Synchronous Serial Receive/Transmit Mode

for Backward Compatibility With Existing

Radio Communication Protocols

–

128-bit AES Security Encryption/Decryption

Coprocessor

•

Family Members are Summarized in Table 1.

–

32-Bit Hardware Multiplier

Three-Channel Internal DMA

For Complete Module Descriptions, See the

CC430 Family User's Guide (SLAU259).

Serial Onboard Programming, No External

Programming Voltage Needed

–

Embedded Emulation Module (EEM)

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

DESCRIPTION

The Texas Instruments CC430 family of ultralow-power microcontroller system-on-chip with integrated RF

transceiver cores consists of several devices featuring different sets of peripherals targeted for a wide range of

applications. The architecture, combined with five low-power modes is optimized to achieve extended battery life

in portable measurement applications. The device features the powerful MSP430™ 16-bit RISC CPU, 16-bit

registers, and constant generators that contribute to maximum code efficiency.

The CC430 family provides a tight integration between the microcontroller core, its peripherals, software, and the

RF transceiver, making these true system-on-chip solutions easy to use as well as improving performance.

The CC430F61xx series are microcontroller system-on-chip configurations combining the excellent performance

of the state-of-the-art CC1101 sub-1-GHz RF transceiver with the MSP430 CPUXV2, up to 32 kB of in-system

programmable flash memory, up to 4 kB of RAM, two 16-bit timers, a high-performance 12-bit A/D converter with

eight external inputs plus internal temperature and battery sensors on CC430F613x devices, comparator,

universal serial communication interfaces (USCI), 128-bit AES security accelerator, hardware multiplier, DMA,

real-time clock module with alarm capabilities, LCD driver, and up to 44 I/O pins.

The CC430F513x series are microcontroller system-on-chip configurations combining the excellent performance

of the state-of-the-art CC1101 sub-1-GHz RF transceiver with the MSP430 CPUXV2, up to 32 kB of in-system

programmable flash memory, up to 4 kB of RAM, two 16-bit timers, a high performance 12-bit A/D converter with

six external inputs plus internal temperature and battery sensors, comparator, universal serial communication

interfaces (USCI), 128-bit AES security accelerator, hardware multiplier, DMA, real-time clock module with alarm

capabilities, and up to 30 I/O pins.

Typical applications for these devices include wireless analog and digital sensor systems, heat cost allocators,

thermostats, metering (AMR/AMI), smart grid wireless networks etc.

Family members available are summarized in Table 1.

For complete module descriptions, see the CC430 Family User's Guide, literature number SLAU259.

Table 1. Family Members

USCI

Channel

A:

Channel

B:

Program

(KB)

SRAM

(KB)

Timer_A

ADC12_A

Package

Type

(2)

Device

LCD_B

Comp_B

I/O

(1)

(2)

UART/LIN SPI/ I²C

/IrDA/SPI

8 ext/

4 int ch.

CC430F6137

CC430F6135

32

16

4

2

5, 3

96 seg

1

8 ch.

44

64 RGC

8 ext/

4 int ch.

CC430F6127

CC430F6126

CC430F6125

32

16

4

2

5, 3

96 seg

1

n/a

8 ch.

44

64 RGC

6 ext/

4 int ch.

CC430F5137

CC430F5135

CC430F5133

32

16

8

4

2

5, 3

n/a

1

6 ch.

30

48 RGZ

6 ext/

4 int ch.

6 ext/

4 int ch.

(1) Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM

output generators available. For example, a number sequence of 5, 3 would represent two instantiations of Timer_A, the first

instantiation having 5 and the second instantiation having 3 capture compare registers and PWM output generators, respectively.

(2) n/a: not available.

2

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CC430F613x

CC430F612x

CC430F513x

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SLAS554D –MAY 2009–REVISED JULY 2010

ORDERING INFORMATION⁽¹⁾

PACKAGED DEVICES⁽²⁾

T_A

PLASTIC 64-PIN QFN (RGC)

CC430F6137IRGC

CC430F6135IRGC

CC430F6127IRGC

CC430F6126IRGC

CC430F6125IRGC

PLASTIC 48-PIN QFN (RGZ)

CC430F5137IRGZ

CC430F5135IRGZ

CC430F5133IRGZ

–40°C to 85°C

(1) For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

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ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

CC430F613x Functional Block Diagram

XIN XOUT

(32kHz)

P1.x/P2.x

2x8

P3.x/P4.x

2x8

P5.x

RF_XIN RF_XOUT

(26MHz)

1x8

I/O Ports

P1/P2

2x8 I/Os

I/O Ports

P3/P4

2x8 I/Os

I/O Ports

P5

1x8 I/Os

REF

MCLK

ACLK

Unified

Clock

System

Packet

Handler

Comp_B

ADC12

Voltage

Reference

SMCLK

PA

1x16 I/Os

PB

1x16 I/Os

Digital RSSI

Carrier Sense

PQI / LQI

CCA

DMA

Controller

3 Channel

MAB

MDB

Bus

Cntrl

Logic

MAB

Sub-1GHz

Radio

CPUXV2

incl. 16

Registers

(CC1101)

SYS

MDB

Flash

RAM

Watch-

dog

CPU Interface

MODEM

32kB

16kB

4kB

2kB

CRC16

MPY32

Port

Mapping

Controller

EEM

(S: 3+1)

MDB

MAB

JTAG

Interface

Frequency

Synthesizer

Spy-Bi-

Wire

Power

Mgmt

USCI_A0

(UART,

IrDA, SPI)

LCD_B

AES128

TA0

TA1

96

Segments

1,2,3,4

Mux

RF/ANALOG

TX & RX

RTC_A

Security

En-/De-

cryption

LDO

SVM/SVS

Brownout

5 CC

Registers

3 CC

Registers

USCI_B0

(SPI, I2C)

RF_P RF_N

4

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CC430F612x

CC430F513x

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SLAS554D –MAY 2009–REVISED JULY 2010

RGC PACKAGE

(TOP VIEW)

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

P1.7/PM_UCA0CLK/PM_UCB0STE/R03

1

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

PJ.2/TMS

PJ.1/TDI/TCLK

PJ.0/TDO

GUARD

2

3

P1.6/PM_UCA0TXD/PM_UCA0SIMO/R13/LCDREF

P1.5/PM_UCA0RXD/PM_UCA0SOMI/R23

LCDCAP/R33

4

5

COM0

R_BIAS

6

AVCC_RF

RF_N

P5.7/COM1/S26

7

P5.6/COM2/S25

8

P5.5/COM3/S24

CC430F613x

9

RF_P

P5.4/S23

10

11

12

13

14

15

16

VCORE

AVCC_RF

RF_XOUT

RF_XIN

DVCC

P1.4/PM_UCB0CLK/PM_UCA0STE/S22

P1.3/PM_UCB0SIMO/PM_UCB0SDA/S21

P1.2/PM_UCB0SOMI/PM_UCB0SCL/S20

P1.1/PM_RFGDO2/S19

P1.0/PM_RFGDO0/S18

P5.2/S0

P5.3/S1

P4.0/S2

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

VSS

Exposed die

attached pad

The secondary digital functions on ports P1, P2, and P3 are fully mappable. Pinout above shows only the default

mapping. See Table 7 for details.

CAUTION: the LCDCAP/R33 must be connected to VSS if not used.

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ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

CC430F612x Functional Block Diagram

XIN XOUT

(32kHz)

P1.x/P2.x

2x8

P3.x/P4.x

2x8

P5.x

RF_XIN RF_XOUT

(26MHz)

1x8

I/O Ports

P1/P2

2x8 I/Os

I/O Ports

P3/P4

2x8 I/Os

I/O Ports

P5

1x8 I/Os

REF

MCLK

ACLK

Unified

Clock

System

Packet

Handler

Comp_B

Voltage

Reference

SMCLK

PA

1x16 I/Os

PB

1x16 I/Os

Digital RSSI

Carrier Sense

PQI / LQI

CCA

DMA

Controller

3 Channel

MAB

MDB

Bus

Cntrl

Logic

MAB

Sub-1GHz

Radio

CPUXV2

incl. 16

Registers

(CC1101)

SYS

MDB

Flash

RAM

Watch-

dog

CPU Interface

MODEM

32kB

16kB

4kB

2kB

CRC16

MPY32

Port

Mapping

Controller

EEM

(S: 3+1)

MDB

MAB

JTAG

Interface

Frequency

Synthesizer

Spy-Bi-

Wire

Power

Mgmt

USCI_A0

(UART,

IrDA, SPI)

LCD_B

AES128

TA0

TA1

96

Segments

1,2,3,4

Mux

RF/ANALOG

TX & RX

RTC_A

Security

En-/De-

cryption

LDO

SVM/SVS

Brownout

5 CC

Registers

3 CC

Registers

USCI_B0

(SPI, I2C)

RF_P RF_N

6

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CC430F613x

CC430F612x

CC430F513x

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SLAS554D –MAY 2009–REVISED JULY 2010

RGC PACKAGE

(TOP VIEW)

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

P1.7/PM_UCA0CLK/PM_UCB0STE/R03

1

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

PJ.2/TMS

PJ.1/TDI/TCLK

PJ.0/TDO

GUARD

2

3

P1.6/PM_UCA0TXD/PM_UCA0SIMO/R13/LCDREF

P1.5/PM_UCA0RXD/PM_UCA0SOMI/R23

LCDCAP/R33

4

5

COM0

R_BIAS

6

AVCC_RF

RF_N

P5.7/COM1/S26

7

P5.6/COM2/S25

8

P5.5/COM3/S24

CC430F612x

9

RF_P

P5.4/S23

10

11

12

13

14

15

16

VCORE

AVCC_RF

RF_XOUT

RF_XIN

DVCC

P1.4/PM_UCB0CLK/PM_UCA0STE/S22

P1.3/PM_UCB0SIMO/PM_UCB0SDA/S21

P1.2/PM_UCB0SOMI/PM_UCB0SCL/S20

P1.1/PM_RFGDO2/S19

P1.0/PM_RFGDO0/S18

P5.2/S0

P5.3/S1

P4.0/S2

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

VSS

Exposed die

attached pad

The secondary digital functions on ports P1, P2, and P3 are fully mappable. Pin out above shows only the default

mapping. Refer to Table 7 for details.

CAUTION: the LCDCAP/R33 must be connected to VSS if not used.

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ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

CC430F513x Functional Block Diagram

XIN XOUT

(32kHz)

P1.x/P2.x

2x8

P5.x

RF_XIN RF_XOUT

(26MHz)

P3.x

1x8

1x2

I/O Ports

P1/P2

2x8 I/Os

I/O Ports

P3

1x8 I/Os

I/O Ports

P5

1x2 I/Os

REF

MCLK

ACLK

Unified

Clock

System

Packet

Handler

Comp_B

ADC12

Voltage

Reference

SMCLK

PA

1x16 I/Os

Digital RSSI

Carrier Sense

PQI / LQI

CCA

DMA

Controller

3 Channel

MAB

MDB

Bus

Cntrl

Logic

MAB

Sub-1GHz

Radio

CPUXV2

incl. 16

Registers

(CC1101)

SYS

MDB

Flash

RAM

Watch-

dog

CPU Interface

MODEM

32

kB

16kB

8kB

4kB

2kB

CRC16

MPY32

Port

Mapping

Controller

EEM

(S: 3+1)

MDB

MAB

JTAG

Interface

Frequency

Synthesizer

Spy-Bi-

Wire

Power

Mgmt

USCI_A0

(UART,

IrDA, SPI)

AES128

TA0

TA1

RF/ANALOG

TX & RX

RTC_A

Security

En-/De-

cryption

5 CC

Registers

3 CC

Registers

LDO

SVM/SVS

Brownout

USCI_B0

(SPI, I2C)

RF_P RF_N

8

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ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

www.ti.com

SLAS554D –MAY 2009–REVISED JULY 2010

RGZ PACKAGE

(TOP VIEW)

48 47 46 45 44 43 42 41 40 39 38 37

36

1

PJ.1/TDI/TCLK

PJ.0/TDO

GUARD

P2.2/PM_TA1CCR1A/CB2/A2

P2.1/PM_TA1CCR0A/CB1/A1

2

35

34

33

32

31

30

29

28

27

26

25

3

4

P2.0/PM_CBOUT1/PM_TA1CLK/CB0/A0

P1.7/PM_UCA0CLK/PM_UCB0STE

P1.6/PM_UCA0TXD/PM_UCA0SIMO

P1.5/PM_UCA0RXD/PM_UCA0SOMI

VCORE

R_BIAS

5

AVCC_RF

RF_N

6

CC430F513x

7

8

DVCC

RF_P

9

P1.4/PM_UCB0CLK/PM_UCA0STE

P1.3/PM_UCB0SIMO/PM_UCB0SDA

P1.2/PM_UCB0SOMI/PM_UCB0SCL

P1.1/PM_RFGDO2

AVCC_RF

RF_XOUT

RF_XIN

10

11

12

13 14 15 16 17 18 19 20 21 22 23 24

VSS

Exposed die

attached pad

The secondary digital functions on ports P1, P2, and P3 are fully mappable. Pin out above shows only the default

mapping. Refer to Table 7 for details.

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ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

CC430F613x and CC430F612x Terminal Functions

TERMINAL

NAME

I/O⁽¹⁾

DESCRIPTION

NO.

General-purpose digital I/O with port interrupt and map-able secondary function

I/O Default mapping: USCI_A0 clock input/output / USCI_B0 SPI slave transmit enable

Input/output port of lowest analog LCD voltage (V5)

P1.7/ PM_UCA0CLK/

PM_UCB0STE/ R03

1

General-purpose digital I/O with port interrupt and map-able secondary function

P1.6/ PM_UCA0TXD/

PM_UCB0SIMO/ R13/ LCDREF

Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in master out

Input/output port of third most positive analog LCD voltage (V3 or V4)

External reference voltage input for regulated LCD voltage

2

3

I/O

General-purpose digital I/O with port interrupt and map-able secondary function

I/O Default mapping: USCI_A0 UART receive data; USCI_A0 SPI slave out master in

Input/output port of second most positive analog LCD voltage (V2)

P1.5/ PM_UCA0RXD/

PM_UCB0SOMI/ R23

LCD capacitor connection

LCDCAP/ R33

COM0

4

5

6

I/O Input/output port of most positive analog LCD voltage (V1)

CAUTION: must be connected to VSS if not used.

O

LCD common output COM0 for LCD backplane

General-purpose digital I/O

P5.7/ COM1/ S26

I/O LCD common output COM1 for LCD backplane

LCD segment output S26

General-purpose digital I/O

P5.6/ COM2/ S25

7

I/O LCD common output COM2 for LCD backplane

LCD segment output S25

General-purpose digital I/O

P5.5/ COM3/ S24

P5.4/ S23

8

9

I/O LCD common output COM3 for LCD backplane

LCD segment output S24

General-purpose digital I/O

I/O

LCD segment output S23

VCORE

DVCC

10

11

Regulated core power supply

Digital power supply

General-purpose digital I/O with port interrupt and map-able secondary function

I/O Default mapping: USCI_B0 clock input/output / USCI_A0 SPI slave transmit enable

LCD segment output S22

P1.4/ PM_UCB0CLK/

PM_UCA0STE/ S22

12

13

14

15

16

17

18

19

20

21

General-purpose digital I/O with port interrupt and map-able secondary function

I/O Default mapping: USCI_B0 SPI slave in master out/USCI_B0 I2C data

LCD segment output S21

P1.3/ PM_UCB0SIMO/

PM_UCB0SDA/ S21

General-purpose digital I/O with port interrupt and map-able secondary function

I/O Default mapping: USCI_B0 SPI slave out master in/UCSI_B0 I2C clock

LCD segment output S20

P1.2/ PM_UCB0SOMI/

PM_UCB0SCL/ S20

General-purpose digital I/O with port interrupt and map-able secondary function

I/O Default mapping: Radio GDO2 output

P1.1/ PM_RFGDO2/ S19

P1.0/ PM_RFGDO0/ S18

P3.7/ PM_SMCLK/ S17

LCD segment output S19

General-purpose digital I/O with port interrupt and map-able secondary function

I/O Default mapping: Radio GDO0 output

LCD segment output S18

General-purpose digital I/O with map-able secondary function

I/O Default mapping: SMCLK output

LCD segment output S17

General-purpose digital I/O with map-able secondary function

I/O Default mapping: Radio GDO1 output

LCD segment output S16

P3.6/ PM_RFGDO1/ S16

P3.5/ PM_TA0CCR4A/ S15

P3.4/ PM_TA0CCR3A/ S14

P3.3/ PM_TA0CCR2A/ S13

(1) I = input, O = output

General-purpose digital I/O with map-able secondary function

I/O Default mapping: TA0 CCR4 compare output/capture input

LCD segment output S15

General-purpose digital I/O with map-able secondary function

I/O Default mapping: TA0 CCR3 compare output/capture input

LCD segment output S14

General-purpose digital I/O with map-able secondary function

I/O Default mapping: TA0 CCR2 compare output/capture input

LCD segment output S13

10

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CC430F613x

CC430F612x

CC430F513x

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SLAS554D –MAY 2009–REVISED JULY 2010

CC430F613x and CC430F612x Terminal Functions (continued)

TERMINAL

NAME

I/O⁽¹⁾

DESCRIPTION

NO.

General-purpose digital I/O with map-able secondary function

P3.2/ PM_TA0CCR1A/ S12

P3.1/ PM_TA0CCR0A/ S11

22

I/O Default mapping: TA0 CCR1 compare output/capture input

LCD segment output S12

General-purpose digital I/O with map-able secondary function

I/O Default mapping: TA0 CCR0 compare output/capture input

LCD segment output S11

23

24

General-purpose digital I/O with map-able secondary function

I/O Default mapping: Comparator_B output; TA0 clock input

LCD segment output S10

P3.0/ PM_CBOUT0/ PM_TA0CLK/

S10

DVCC

25

26

Digital power supply

General-purpose digital I/O

I/O

P4.7/ S9

LCD segment output S9

General-purpose digital I/O

I/O

P4.6/ S8

P4.5/ S7

P4.4/ S6

P4.3/ S5

P4.2/ S4

P4.1/ S3

P4.0/ S2

P5.3/ S1

P5.2/ S0

27

28

29

30

31

32

33

34

35

LCD segment output S8

General-purpose digital I/O

I/O

LCD segment output S7

General-purpose digital I/O

I/O

LCD segment output S6

General-purpose digital I/O

I/O

LCD segment output S5

General-purpose digital I/O

I/O

LCD segment output S4

General-purpose digital I/O

I/O

LCD segment output S3

General-purpose digital I/O

I/O

LCD segment output S2

General-purpose digital I/O

I/O

LCD segment output S1

General-purpose digital I/O

I/O

LCD segment output S0

RF_XIN

36

37

38

39

I

Input terminal for RF crystal oscillator, or external clock input

Output terminal for RF crystal oscillator

Radio analog power supply

RF_XOUT

AVCC_RF

O

Radio analog power supply

RF Positive RF input to LNA in receive mode

I/O Positive RF output from PA in transmit mode

RF_P

RF_N

40

41

RF Negative RF input to LNA in receive mode

I/O Negative RF output from PA in transmit mode

AVCC_RF

RBIAS

42

43

44

45

Radio analog power supply

External bias resistor for radio reference current

Power supply connection for digital noise isolation

GUARD

General-purpose digital I/O

I/O

PJ.0/ TDO

46

47

48

49

50

Test data output port

General-purpose digital I/O

I/O

PJ.1/ TDI/ TCLK

PJ.2/ TMS

Test data input or test clock input

General-purpose digital I/O

Test mode select

I/O

General-purpose digital I/O

Test clock

PJ.3/ TCK

I/O

Test mode pin – select digital I/O on JTAG pins

Spy-bi-wire input clock

TEST/ SBWTCK

I

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CC430F613x and CC430F612x Terminal Functions (continued)

TERMINAL

NAME

I/O⁽¹⁾

DESCRIPTION

NO.

Reset input active low

RST/NMI/ SBWTDIO

51

I/O Non-maskable interrupt input

Spy-bi-wire data input/output

DVCC

AVSS

52

53

Digital power supply

Analog ground supply for ADC12

General-purpose digital I/O

I/O

P5.1/ XOUT

54

Output terminal of crystal oscillator XT1

General-purpose digital I/O

Input terminal for crystal oscillator XT1

P5.0/ XIN

AVCC

55

56

I/O

Analog power supply

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: ADC12CLK output; DMA external trigger input

Comparator_B input CB7

P2.7/ PM_ADC12CLK/

PM_DMAE0/ CB7 (/A7)

57

58

I/O

Analog input A7 – 12-bit ADC (only CC430F613x)

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: ACLK output

Comparator_B input CB6

P2.6/ PM_ACLK/ CB6 (/A6)

Analog input A6 – 12-bit ADC (only CC430F613x)

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: SVM output

P2.5/ PM_SVMOUT/ CB5

(/A5/ VREF+/ VeREF+)

Comparator_B input CB5

59

60

I/O

Analog input A5 – 12-bit ADC (only CC430F613x)

Output of reference voltage to the ADC (only CC430F613x)

Input for an external reference voltage to the ADC (only CC430F613x)

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: RTCCLK output

Comparator_B input CB4

P2.4/ PM_RTCCLK/ CB4

(/A4/ VREF-/ VeREF-)

Analog input A4 – 12-bit ADC (only CC430F613x)

Negative terminal for the ADC's reference voltage for both sources, the internal

reference voltage, or an external applied reference voltage (only CC430F613x)

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: TA1 CCR2 compare output/capture input

Comparator_B input CB3

P2.3/ PM_TA1CCR2A/ CB3 (/A3)

P2.2/ PM_TA1CCR1A/ CB2 (/A2)

P2.1/PM_TA1CCR0A/CB1(/A1)

61

62

63

64

I/O

Analog input A3 – 12-bit ADC (only CC430F613x)

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: TA1 CCR1 compare output/capture input

Comparator_B input CB2

Analog input A2 – 12-bit ADC (only CC430F613x)

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: TA1 CCR0 compare output/capture input

Comparator_B input CB1

Analog input A1 – 12-bit ADC (only CC430F613x)

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: Comparator_B output; TA1 clock input

Comparator_B input CB0

P2.0/ PM_CBOUT1/ PM_TA1CLK/

CB0 (/A0)

Analog input A0 – 12-bit ADC (only CC430F613x)

Ground supply

VSS - Exposed die attach pad

The exposed die attach pad must be connected to a solid ground plane as this is

the ground connection for the chip!

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CC430F513x Terminal Functions

TERMINAL

NAME

I/O⁽¹⁾

DESCRIPTION

NO.

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: TA1 CCR1 compare output/capture input

Comparator_B input CB2

P2.2/ PM_TA1CCR1A/ CB2/ A2

P2.1/ PM_TA1CCR0A/ CB1/ A1

1

I/O

Analog input A2 – 12-bit ADC

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: TA1 CCR0 compare output/capture input

Comparator_B input CB1

2

3

I/O

Analog input A1 – 12-bit ADC

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: Comparator_B output; TA1 clock input

Comparator_B input CB0

P2.0/ PM_CBOUT1/ PM_TA1CLK/

CB0/ A0

Analog input A0 – 12-bit ADC

P1.7/ PM_UCA0CLK/

PM_UCB0STE

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: USCI_A0 clock input/output / USCI_B0 SPI slave transmit enable

4

5

6

I/O

P1.6/ PM_UCA0TXD/

PM_UCB0SIMO

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in master out

P1.5/ PM_UCA0RXD/

PM_UCB0SOMI

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: USCI_A0 UART receive data; USCI_A0 SPI slave out master in

VCORE

DVCC

7

8

Regulated core power supply

Digital power supply

P1.4/ PM_UCB0CLK/

PM_UCA0STE

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: USCI_B0 clock input/output / USCI_A0 SPI slave transmit enable

9

I/O

P1.3/ PM_UCB0SIMO/

PM_UCB0SDA

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: USCI_B0 SPI slave in master out/USCI_B0 I2C data

10

11

12

13

14

15

16

17

18

19

20

P1.2/ PM_UCB0SOMI/

PM_UCB0SCL

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: USCI_B0 SPI slave out master in/UCSI_B0 I2C clock

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: Radio GDO2 output

P1.1/ PM_RFGDO2

P1.0/ PM_RFGDO0

P3.7/ PM_SMCLK

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: Radio GDO0 output

General-purpose digital I/O with map-able secondary function

Default mapping: SMCLK output

General-purpose digital I/O with map-able secondary function

Default mapping: Radio GDO1 output

P3.6/ PM_RFGDO1

P3.5/ PM_TA0CCR4A

P3.4/ PM_TA0CCR3A

P3.3/ PM_TA0CCR2A

P3.2/ PM_TA0CCR1A

P3.1/ PM_TA0CCR0A

General-purpose digital I/O with map-able secondary function

Default mapping: TA0 CCR4 compare output/capture input

General-purpose digital I/O with map-able secondary function

Default mapping: TA0 CCR3 compare output/capture input

General-purpose digital I/O with map-able secondary function

Default mapping: TA0 CCR2 compare output/capture input

General-purpose digital I/O with map-able secondary function

Default mapping: TA0 CCR1 compare output/capture input

General-purpose digital I/O with map-able secondary function

Default mapping: TA0 CCR0 compare output/capture input

General-purpose digital I/O with map-able secondary function

Default mapping: Comparator_B output; TA0 clock input

P3.0/ PM_CBOUT0/ PM_TA0CLK

DVCC

21

22

23

Digital power supply

P2.7/ PM_ADC12CLK/

PM_DMAE0

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: ADC12CLK output; DMA external trigger input

I/O

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: ACLK output

P2.6/ PM_ACLK

24

RF_XIN

25

26

27

I

Input terminal for RF crystal oscillator, or external clock input

Output terminal for RF crystal oscillator

Radio analog power supply

RF_XOUT

AVCC_RF

O

(1) I = input, O = output

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CC430F513x Terminal Functions (continued)

TERMINAL

I/O⁽¹⁾

DESCRIPTION

NAME

NO.

AVCC_RF

RF_P

28

Radio analog power supply

RF Positive RF input to LNA in receive mode

I/O Positive RF output from PA in transmit mode

29

RF Negative RF input to LNA in receive mode

I/O Negative RF output from PA in transmit mode

RF_N

30

AVCC_RF

RBIAS

31

32

33

34

Radio analog power supply

External bias resistor for radio reference current

Power supply connection for digital noise isolation

GUARD

General-purpose digital I/O

I/O

PJ.0/ TDO

35

36

37

38

39

Test data output port

General-purpose digital I/O

I/O

PJ.1/ TDI/ TCLK

PJ.2/ TMS

Test data input or test clock input

General-purpose digital I/O

Test mode select

I/O

General-purpose digital I/O

Test clock

PJ.3/ TCK

I/O

Test mode pin – select digital I/O on JTAG pins

Spy-bi-wire input clock

TEST/ SBWTCK

I

Reset input active low

I/O Non-maskable interrupt input

Spy-bi-wire data input/output

RST/NMI/ SBWTDIO

40

DVCC

AVSS

41

42

Digital power supply

Analog ground supply for ADC12

General-purpose digital I/O

I/O

P5.1/ XOUT

43

Output terminal of crystal oscillator XT1

General-purpose digital I/O

I/O

P5.0/ XIN

AVCC

44

45

Input terminal for crystal oscillator XT1

Analog power supply

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: SVM output

P2.5/ PM_SVMOUT/ CB5/

A5/ VREF+/ VeREF+

Comparator_B input CB5

Analog input A5 – 12-bit ADC

46

I/O

Output of reference voltage to the ADC

Input for an external reference voltage to the ADC

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: RTCCLK output

P2.4/ PM_RTCCLK/ CB4/

A4/ VREF-/ VeREF-

Comparator_B input CB4

Analog input A4 – 12-bit ADC

Negative terminal for the ADC's reference voltage for both sources, the internal

reference voltage, or an external applied reference voltage

47

48

I/O

General-purpose digital I/O with port interrupt and map-able secondary function

Default mapping: TA1 CCR2 compare output/capture input

Comparator_B input CB3

P2.3/ PM_TA1CCR2A/ CB3/ A3

VSS - Exposed die attach pad

Analog input A3 – 12-bit ADC

Ground supply

The exposed die attach pad must be connected to a solid ground plane as this is

the ground connection for the chip!

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SHORT-FORM DESCRIPTION

Sub-1 GHz Radio

The implemented sub-1-GHz radio module is based on the industry-leading CC1101, requiring very few external

components. Figure 1 shows a high-level block diagram of the implemented radio.

RADIO CONTROL

ADC

LNA

ADC

RF_P

0

FREQ

SYNTH

RF_N

90

PA

RC OSC

BIAS

XOSC

RBIAS

RF_XIN RF_XOUT

Figure 1. Sub-1 GHz Radio Block Diagram

The radio features a low-IF receiver. The received RF signal is amplified by a low-noise amplifier (LNA) and

down-converted in quadrature to the intermediate frequency (IF). At IF, the I/Q signals are digitized. Automatic

gain control (AGC), fine channel filtering, demodulation bit/packet synchronization are performed digitally.

The transmitter part is based on direct synthesis of the RF frequency. The frequency synthesizer includes a

completely on-chip LC VCO and a 90 degrees phase shifter for generating the I and Q LO signals to the

down-conversion mixers in receive mode.

The 26-MHz crystal oscillator generates the reference frequency for the synthesizer, as well as clocks for the

ADC and the digital part.

A memory mapped register interface is used for data access, configuration and status request by the CPU.

The digital baseband includes support for channel configuration, packet handling and data buffering.

For complete module descriptions, see the CC430 Family User's Guide, literature number SLAU259.

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CPU

The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations,

other than program-flow instructions, are performed as register operations in conjunction with seven addressing

modes for source operand and four addressing modes for destination operand.

The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to-register

operation execution time is one cycle of the CPU clock.

Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and constant

generator, respectively. The remaining registers are general-purpose registers.

Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all

instructions.

The instruction set consists of the original 51 instructions with three formats and seven address modes and

additional instructions for the expanded address range. Each instruction can operate on word and byte data.

Operating Modes

The CC430 has one active mode and five software selectable low-power modes of operation. An interrupt event

can wake up the device from any of the low-power modes, service the request, and restore back to the

low-power mode on return from the interrupt program.

The following six operating modes can be configured by software:

•

Active mode (AM)

All clocks are active

Low-power mode 0 (LPM0)

–

•

–

CPU is disabled

ACLK and SMCLK remain active, MCLK is disabled

FLL loop control remains active

•

Low-power mode 1 (LPM1)

–

CPU is disabled

FLL loop control is disabled

ACLK and SMCLK remain active, MCLK is disabled

Low-power mode 2 (LPM2)

–

CPU is disabled

MCLK and FLL loop control and DCOCLK are disabled

DCO's dc-generator remains enabled

ACLK remains active

•

Low-power mode 3 (LPM3)

–

CPU is disabled

MCLK, FLL loop control, and DCOCLK are disabled

DCO's dc-generator is disabled

ACLK remains active

Low-power mode 4 (LPM4)

–

CPU is disabled

ACLK is disabled

MCLK, FLL loop control, and DCOCLK are disabled

DCO's dc-generator is disabled

Crystal oscillator is stopped

Complete data retention

16

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Interrupt Vector Addresses

The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h. The

vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.

Table 2. Interrupt Sources, Flags, and Vectors

SYSTEM

INTERRUPT

WORD

ADDRESS

INTERRUPT SOURCE

INTERRUPT FLAG

PRIORITY

System Reset

Power-Up

External Reset

Watchdog Timeout, Password

Violation

WDTIFG, KEYV (SYSRSTIV)^{(1) (2)}

Reset

0FFFEh

63, highest

Flash Memory Password Violation

System NMI

PMM

Vacant Memory Access

JTAG Mailbox

SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,

VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG,

JMBOUTIFG (SYSSNIV)^{(1) (3)}

(Non)maskable

0FFFCh

0FFFAh

62

61

User NMI

NMI

Oscillator Fault

NMIIFG, OFIFG, ACCVIFG (SYSUNIV)^{(1) (3)}

Flash Memory Access Violation

Comparator_B

Comparator_B Interrupt Flags (CBIV)⁽¹⁾

WDTIFG

UCA0RXIFG, UCA0TXIFG (UCA0IV)⁽¹⁾

Maskable

0FFF8h

0FFF6h

0FFF4h

60

59

58

Watchdog Interval Timer Mode

USCI_A0 Receive/Transmit

UCB0RXIFG, UCB0TXIFG, I2C Status Interrupt

Flags (UCB0IV)⁽¹⁾

USCI_B0 Receive/Transmit

Maskable

0FFF2h

57

ADC12_A

(Reserved on CC430F612x)

ADC12IFG0 ... ADC12IFG15 (ADC12IV)⁽¹⁾

Maskable

0FFF0h

0FFEEh

0FFECh

56

55

54

TA0

TA0CCR0 CCIFG0

TA0CCR1 CCIFG1 ... TA0CCR4 CCIFG4,

TA0IFG (TA0IV)⁽¹⁾

TA0

Radio Interface Interrupt Flags (RF1AIFIV)

Radio Core Interrupt Flags (RF1AIV)

RF1A CC1101-based Radio

Maskable

0FFEAh

53

DMA

TA1

DMA0IFG, DMA1IFG, DMA2IFG (DMAIV)⁽¹⁾

Maskable

0FFE8h

0FFE6h

52

51

TA1CCR0 CCIFG0

TA1CCR1 CCIFG1 ... TA1CCR2 CCIFG2,

TA1IFG (TA1IV)⁽¹⁾

TA1

Maskable

0FFE4h

50

I/O Port P1

I/O Port P2

P1IFG.0 to P1IFG.7 (P1IV)⁽¹⁾

P2IFG.0 to P2IFG.7 (P2IV)⁽¹⁾

Maskable

0FFE2h

0FFE0h

49

48

LCD_B

(Reserved on CC430F513x)

LCD_B Interrupt Flags (LCDBIV)⁽¹⁾

Maskable

0FFDEh

0FFDCh

47

46

RTCRDYIFG, RTCTEVIFG, RTCAIFG,

RT0PSIFG, RT1PSIFG (RTCIV)⁽¹⁾

RTC_A

AES

Maskable

AESRDYIFG

0FFDAh

0FFD8h

⋮

45

44

Reserved

Reserved⁽⁴⁾

⋮

0FF80h

0, lowest

(1) Multiple source flags

(2) A reset is generated if the CPU tries to fetch instructions from within peripheral space.

(3) (Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.

(4) Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain

compatibility with other devices, it is recommended to reserve these locations.

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Memory Organization

Table 3. Memory Organization

CC430F6137/F6127

CC430F5137⁽¹⁾

CC430F6135/F6125

CC430F6126⁽¹⁾

CC430F5133⁽¹⁾

CC430F5135⁽¹⁾

Main Memory

(flash)

Total

Size

32kB

16kB

8kB

Main: Interrupt

vector

00FFFFh–00FF80h

Main: code

memory

Bank 0

32kB

00FFFFh–008000h

32kB

00FFFFh–008000h

16kB

00FFFFh–00C000h

8kB

00FFFFh–00E000h

Total

Size

4kB

2kB

RAM

Sect 1

2kB

not available

002BFFh–002400h

Sect 0

2kB

0023FFh–001C00h

128 B

001AFFh to 001A80h

Device

Descriptor

128 B

001A7Fh to 001A00h

Info A

Info B

Info C

Info D

BSL 3

BSL 2

BSL 1

BSL 0

128 B

0019FFh to 001980h

128 B

0019FFh to 001980h

128 B

0019FFh to 001980h

128 B

0019FFh to 001980h

128 B

00197Fh to 001900h

128 B

00197Fh to 001900h

128 B

00197Fh to 001900h

128 B

00197Fh to 001900h

Information

memory (flash)

128 B

0018FFh to 001880h

128 B

0018FFh to 001880h

128 B

0018FFh to 001880h

128 B

0018FFh to 001880h

128 B

00187Fh to 001800h

128 B

00187Fh to 001800h

128 B

00187Fh to 001800h

128 B

00187Fh to 001800h

512 B

0017FFh to 001600h

512 B

0017FFh to 001600h

512 B

0017FFh to 001600h

512 B

0017FFh to 001600h

512 B

0015FFh to 001400h

512 B

0015FFh to 001400h

512 B

0015FFh to 001400h

512 B

0015FFh to 001400h

Bootstrap loader

(BSL) memory

(flash)

512 B

0013FFh to 001200h

512 B

0013FFh to 001200h

512 B

0013FFh to 001200h

512 B

0013FFh to 001200h

512 B

0011FFh to 001000h

4 KB

000FFFh to 0h

4 KB

000FFFh to 0h

4 KB

000FFFh to 0h

4 KB

000FFFh to 0h

Peripherals

(1) All not mentioned memory regions are vacant memory and any access to them will cause a Vacant Memory Interrupt.

Bootstrap Loader (BSL)

The BSL enables users to program the flash memory or RAM using various serial interfaces. Access to the

device memory via the BSL is protected by an user-defined password. BSL entry requires a specific entry

sequence on the RST/NMI/SBWTDIO and TEST/SBWTCK pins. For complete description of the features of the

BSL and its implementation, see the MSP430 Memory Programming User's Guide, literature number SLAU265.

Table 4. UART BSL Pin Requirements and Functions

DEVICE SIGNAL

BSL FUNCTION

Entry sequence signal

Data transmit

RST/NMI/SBWTDIO

TEST/SBWTCK

P1.6

P1.5

VCC

VSS

Data receive

Power supply

Ground supply

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JTAG Operation

JTAG Standard Interface

The CC430 family supports the standard JTAG interface which requires four signals for sending and receiving

data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to enable the

JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with MSP430

development tools and device programmers. The JTAG pin requirements are shown in Table 5. For further

details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's

Guide, literature number SLAU278.

Table 5. JTAG Pin Requirements and Functions

DEVICE SIGNAL

PJ.3/TCK

Direction

FUNCTION

JTAG clock input

JTAG state control

JTAG data input/TCLK input

JTAG data output

Enable JTAG pins

External reset

IN

PJ.2/TMS

PJ.1/TDI/TCLK

PJ.0/TDO

IN

OUT

IN

TEST/SBWTCK

RST/NMI/SBWTDIO

VCC

IN

Power supply

VSS

Ground supply

Spy-Bi-Wire Interface

In addition to the standard JTAG interface, the CC430 family supports the two wire Spy-Bi-Wire interface.

Spy-Bi-Wire can be used to interface with MSP430 development tools and device programmers. The Spy-Bi-Wire

interface pin requirements are shown in Table 6. For further details on interfacing to development tools and

device programmers, see the MSP430 Hardware Tools User's Guide, literature number SLAU278.

Table 6. Spy-Bi-Wire Pin Requirements and Functions

DEVICE SIGNAL

TEST/SBWTCK

RST/NMI/SBWTDIO

VCC

Direction

IN

FUNCTION

Spy-Bi-Wire clock input

Spy-Bi-Wire data input/output

Power supply

IN, OUT

VSS

Ground supply

Flash Memory

The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), or in-system by the CPU. The

CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the flash

memory include:

•

Flash memory has n segments of main memory and four segments of information memory (Info A to Info D)

of 128 bytes each. Each segment in main memory is 512 bytes in size.

•

Segments 0 to n may be erased in one step, or each segment may be individually erased.

Segments Info A to Info D can be erased individually, or as a group with the main memory segments.

Segments Info A to Info D are also called information memory.

•

Segment A can be locked separately.

RAM Memory

The RAM memory is made up of n sectors. Each sector can be completely powered down to save leakage,

however all data is lost. Features of the RAM memory include:

•

RAM memory has n sectors of 2k bytes each.

Each sector 0 to n can be complete disabled, however data retention is lost.

Each sector 0 to n automatically enters low power retention mode when possible.

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Peripherals

Peripherals are connected to the CPU through data, address, and control busses and can be handled using all

instructions. For complete module descriptions, see the CC430 Family User's Guide, literature number SLAU259.

Oscillator and System Clock

The Unified Clock System (UCS) module includes support for a 32768-Hz watch crystal oscillator, an internal

very-low-power low-frequency oscillator (VLO), an internal trimmed low-frequency oscillator (REFO), an

integrated internal digitally-controlled oscillator (DCO), and a high-frequency crystal oscillator. The UCS module

is designed to meet the requirements of both low system cost and low-power consumption. The UCS module

features digital frequency locked loop (FLL) hardware that, in conjunction with a digital modulator, stabilizes the

DCO frequency to a programmable multiple of the watch crystal frequency. The internal DCO provides a fast

turn-on clock source and stabilizes in less than 5 µs. The UCS module provides the following clock signals:

•

Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal, a high-frequency crystal, the internal

low-frequency oscillator (VLO), or the trimmed low-frequency oscillator (REFO).

Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made

available to ACLK.

Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by

same sources made available to ACLK.

ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.

Power Management Module (PMM)

The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains

programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor

(SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit is

implemented to provide the proper internal reset signal to the device during power-on and power-off. The

SVS/SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply

voltage supervision (the device is automatically reset) and supply voltage monitoring (SVM, the device is not

automatically reset). SVS and SVM circuitry is available on the primary supply and core supply.

Digital I/O

There are up to five 8-bit I/O ports implemented: ports P1 through P5.

•

All individual I/O bits are independently programmable.

Any combination of input, output, and interrupt conditions is possible.

Programmable pullup or pulldown on all ports.

Programmable drive strength on all ports.

Edge-selectable interrupt input capability for all the eight bits of ports P1 and P2.

Read/write access to port-control registers is supported by all instructions.

Ports can be accessed byte-wise (P1 through P5) or word-wise in pairs (PA and PB).

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Port Mapping Controller

The port mapping controller allows the flexible and re-configurable mapping of digital functions to port pins of

ports P1 through P3.

Table 7. Port Mapping, Mnemonics, and Functions

Value

PxMAPy Mnemonic

Input Pin Function (PxDIR.y=0)

Output Pin Function (PxDIR.y=1)

0

PM_NONE

None

DVSS

Comparator_B output (on TA0 clock

input)

PM_CBOUT0

PM_TA0CLK

PM_CBOUT1

1⁽¹⁾

TA0 clock input

-

Comparator_B output (on TA1 clock

input)

2⁽¹⁾

PM_TA1CLK

PM_ACLK

TA1 clock input

None

-

3

4

5

6

ACLK output

PM_MCLK

None

MCLK output

PM_SMCLK

None

SMCLK output

PM_RTCCLK

PM_ADC12CLK

PM_DMAE0

None

RTCCLK output

-

ADC12CLK output

7⁽¹⁾

DMA external trigger input

None

-

8

PM_SVMOUT

PM_TA0CCR0A

PM_TA0CCR1A

PM_TA0CCR2A

PM_TA0CCR3A

PM_TA0CCR4A

PM_TA1CCR0A

PM_TA1CCR1A

PM_TA1CCR2A

PM_UCA0RXD

PM_UCA0SOMI

PM_UCA0TXD

PM_UCA0SIMO

PM_UCA0CLK

PM_UCB0STE

PM_UCB0SOMI

PM_UCB0SCL

PM_UCB0SIMO

PM_UCB0SDA

PM_UCB0CLK

PM_UCA0STE

PM_RFGDO0

PM_RFGDO1

PM_RFGDO2

Reserved

SVM output

9

TA0 CCR0 capture input CCI0A

TA0 CCR1 capture input CCI1A

TA0 CCR2 capture input CCI2A

TA0 CCR3 capture input CCI3A

TA0 CCR4 capture input CCI4A

TA1 CCR0 capture input CCI0A

TA1 CCR1 capture input CCI1A

TA1 CCR2 capture input CCI2A

TA0 CCR0 compare output Out0

TA0 CCR1 compare output Out1

TA0 CCR2 compare output Out2

TA0 CCR3 compare output Out3

TA0 CCR4 compare output Out4

TA1 CCR0 compare output Out0

TA1 CCR1 compare output Out1

TA1 CCR2 compare output Out2

10

11

12

13

14

15

16

USCI_A0 UART RXD (Direction controlled by USCI - input)

USCI_A0 SPI slave out master in (direction controlled by USCI)

USCI_A0 UART TXD (Direction controlled by USCI - output)

USCI_A0 SPI slave in master out (direction controlled by USCI)

USCI_A0 clock input/output (direction controlled by USCI)

USCI_B0 SPI slave transmit enable (direction controlled by USCI - input)

USCI_B0 SPI slave out master in (direction controlled by USCI)

USCI_B0 I2C clock (open drain and direction controlled by USCI)

USCI_B0 SPI slave in master out (direction controlled by USCI)

USCI_B0 I2C data (open drain and direction controlled by USCI)

USCI_B0 clock input/output (direction controlled by USCI)

USCI_A0 SPI slave transmit enable (direction controlled by USCI - input)

Radio GDO0 (direction controlled by Radio)

17⁽²⁾

18⁽²⁾

19⁽³⁾

20⁽⁴⁾

21⁽⁴⁾

22⁽⁵⁾

23

24

25

26

Radio GDO1 (direction controlled by Radio)

Radio GDO2 (direction controlled by Radio)

None

DVSS

(1) Input or output function is selected by the corresponding setting in the port direction register PxDIR.

(2) UART or SPI functionality is determined by the selected USCI mode.

(3) UCA0CLK function takes precedence over UCB0STE function. If the mapped pin is required as UCA0CLK input or output USCI_B0 will

be forced to 3-wire SPI mode even if 4-wire mode is selected.

(4) SPI or I2C functionality is determined by the selected USCI mode. In case the I2C functionality is selected the output of the mapped pin

drives only the logical 0 to V_SSlevel.

(5) UCB0CLK function takes precedence over UCA0STE function. If the mapped pin is required as UCB0CLK input or output USCI_A0 will

be forced to 3-wire SPI mode even if 4-wire mode is selected.

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Table 7. Port Mapping, Mnemonics, and Functions (continued)

Value

27

PxMAPy Mnemonic

Reserved

Input Pin Function (PxDIR.y=0)

Output Pin Function (PxDIR.y=1)

None

DVSS

28

Reserved

29

Reserved

30

Reserved

Disables the output driver as well as the input Schmitt-trigger to prevent

parasitic cross currents when applying analog signals.

31 (0FFh)⁽⁶⁾

PM_ANALOG

(6) The value of the PMPAP_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are

ignored resulting in a read out value of 31.

Table 8. Default Mapping

PxMAPy Mnemonic

PM_RFGDO0

Input Pin Function (PxDIR.y=0)

Output Pin Function (PxDIR.y=1)

Radio GDO0

P1.0/P1MAP0

P1.1/P1MAP1

None

PM_RFGDO2

Radio GDO2

USCI_B0 SPI slave out master in (direction controlled by USCI)/USCI_B0

I2C clock (open drain and direction controlled by USCI)

P1.2/P1MAP2

P1.3/P1MAP3

P1.4/P1MAP4

P1.5/P1MAP5

P1.6/P1MAP6

P1.7/P1MAP7

PM_UCB0SOMI/PM_UCB0SCL

PM_UCB0SIMO/PM_UCB0SDA

PM_UCB0CLK/PM_UCA0STE

PM_UCA0RXD/PM_UCA0SOMI

PM_UCA0TXD/PM_UCA0SIMO

PM_UCA0CLK/PM_UCB0STE

USCI_B0 SPI slave in master out (direction controlled by USCI)/USCI_B0

I2C data (open drain and direction controlled by USCI)

USCI_B0 clock input/output (direction controlled by USCI)/USCI_A0 SPI

slave transmit enable (direction controlled by USCI - input)

USCI_A0 UART RXD (Direction controlled by USCI - input)/USCI_A0 SPI

slave out master in (direction controlled by USCI)

USCI_A0 UART TXD (Direction controlled by USCI - output)/USCI_A0

SPI slave in master out (direction controlled by USCI)

USCI_A0 clock input/output (direction controlled by USCI)/USCI_B0 SPI

slave transmit enable (direction controlled by USCI - input)

P2.0/P2MAP0

P2.1/P2MAP1

P2.2/P2MAP2

P2.3/P2MAP3

P2.4/P2MAP4

P2.5/P2MAP5

P2.6/P2MAP6

P2.7/P2MAP7

P3.0/P3MAP0

P3.1/P3MAP1

P3.2/P3MAP2

P3.3/P3MAP3

P3.4/P3MAP4

P3.5/P3MAP5

P3.6/P3MAP6

P3.7/P3MAP7

PM_CBOUT1/PM_TA1CLK

PM_TA1CCR0A

PM_TA1CCR1A

PM_TA1CCR2A

PM_RTCCLK

TA1 clock input

TA1 CCR0 capture input CCI0A

TA1 CCR1 capture input CCI1A

TA1 CCR2 capture input CCI2A

None

Comparator_B output

TA1 CCR0 compare output Out0

TA1 CCR1 compare output Out1

TA1 CCR2 compare output Out2

RTCCLK output

PM_SVMOUT

None

SVM output

PM_ACLK

None

ACLK output

PM_ADC12CLK/PM_DMAE0

PM_CBOUT0/PM_TA0CLK

PM_TA0CCR0A

PM_TA0CCR1A

PM_TA0CCR2A

PM_TA0CCR3A

PM_TA0CCR4A

PM_RFGDO1

DMA external trigger input

TA0 clock input

ADC12CLK output

Comparator_B output

TA0 CCR0 capture input CCI0A

TA0 CCR1 capture input CCI1A

TA0 CCR2 capture input CCI2A

TA0 CCR3 capture input CCI3A

TA0 CCR4 capture input CCI4A

None

TA0 CCR0 compare output Out0

TA0 CCR1 compare output Out1

TA0 CCR2 compare output Out2

TA0 CCR3 compare output Out3

TA0 CCR4 compare output Out4

Radio GDO1

PM_SMCLK

None

SMCLK output

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System Module (SYS)

The SYS module handles many of the system functions within the device. These include power on reset and

power up clear handling, NMI source selection and management, reset interrupt vector generators, boot strap

loader entry mechanisms, as well as, configuration management (device descriptors). It also includes a data

exchange mechanism via JTAG called a JTAG mailbox that can be used in the application.

Table 9. System Module Interrupt Vector Registers

INTERRUPT VECTOR REGISTER

SYSRSTIV , System Reset

ADDRESS

INTERRUPT EVENT

No interrupt pending

Brownout (BOR)

RST/NMI (POR)

DoBOR (BOR)

Reserved

VALUE

00h

PRIORITY

019Eh

02h

Highest

04h

06h

08h

Security violation (BOR)

SVSL (POR)

0Ah

0Ch

SVSH (POR)

0Eh

SVML_OVP (POR)

SVMH_OVP (POR)

DoPOR (POR)

WDT timeout (PUC)

WDT password violation (PUC)

KEYV flash password violation (PUC)

FLL unlock (PUC)

Peripheral area fetch (PUC)

PMM password violation (PUC)

Reserved

10h

12h

14h

16h

18h

1Ah

1Ch

1Eh

20h

22h to 3Eh

00h

Lowest

Highest

SYSSNIV , System NMI

019Ch

No interrupt pending

SVMLIFG

02h

SVMHIFG

04h

DLYLIFG

06h

DLYHIFG

08h

VMAIFG

0Ah

JMBINIFG

0Ch

JMBOUTIFG

0Eh

VLRLIFG

10h

VLRHIFG

12h

Reserved

14h to 1Eh

00h

Lowest

Highest

SYSUNIV, User NMI

019Ah

No interrupt pending

NMIFG

02h

OFIFG

04h

ACCVIFG

06h

Reserved

08h to 1Eh

Lowest

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DMA Controller

The DMA controller allows movement of data from one memory address to another without CPU intervention.

Using the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces

system power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move

data to or from a peripheral.

Table 10. DMA Trigger Assignments⁽¹⁾

Channel

Trigger

0

1

2

0

DMAREQ

1

TA0CCR0 CCIFG

TA0CCR2 CCIFG

TA1CCR0 CCIFG

TA1CCR2 CCIFG

Reserved

TA0CCR0 CCIFG

TA0CCR2 CCIFG

TA1CCR0 CCIFG

TA1CCR2 CCIFG

Reserved

TA0CCR0 CCIFG

TA0CCR2 CCIFG

TA1CCR0 CCIFG

TA1CCR2 CCIFG

Reserved

2

3

4

5

6

Reserved

7

Reserved

8

Reserved

9

Reserved

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Reserved

RFRXIFG

RFTXIFG

UCA0RXIFG

UCA0TXIFG

UCB0RXIFG

UCB0TXIFG

Reserved

UCA0RXIFG

UCA0TXIFG

UCB0RXIFG

UCB0TXIFG

Reserved

UCA0RXIFG

UCA0TXIFG

UCB0RXIFG

UCB0TXIFG

Reserved

ADC12IFGx⁽²⁾

Reserved

ADC12IFGx⁽²⁾

Reserved

ADC12IFGx⁽²⁾

Reserved

MPY ready

DMA2IFG

MPY ready

DMA0IFG

MPY ready

DMA1IFG

DMAE0

(1) Reserved DMA triggers may be used by other devices in the family. Reserved DMA triggers will not

cause any DMA trigger event when selected.

(2) Only on CC430F613x and CC430F513x. Reserved on CC430F612x.

Watchdog Timer (WDT_A)

The primary function of the watchdog timer is to perform a controlled system restart after a software problem

occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed

in an application, the timer can be configured as an interval timer and can generate interrupts at selected time

intervals.

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CRC16

The CRC16 module produces a signature based on a sequence of entered data values and can be used for data

checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.

Hardware Multiplier

The multiplication operation is supported by a dedicated peripheral module. The module performs operations with

32-bit, 24-bit, 16-bit, and 8-bit operands. The module is capable of supporting signed and unsigned multiplication

as well as signed and unsigned multiply and accumulate operations.

AES128 Accelerator

The AES accelerator module performs encryption and decryption of 128-bit data with 128-bit keys according to

the Advanced Encryption Standard (AES) (FIPS PUB 197) in hardware.

Universal Serial Communication Interface (USCI)

The USCI module is used for serial data communication. The USCI module supports synchronous

communication protocols such as SPI (3 or 4 pin) and I²C, and asynchronous communication protocols such as

UART, enhanced UART with automatic baudrate detection, and IrDA.

The USCI_An module provides support for SPI (3 or 4 pin), UART, enhanced UART, and IrDA.

The USCI_Bn module provides support for SPI (3 or 4 pin) and I2C.

A USCI_A0 and USCI_B0 module are implemented.

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TA0

TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. TA0 can support multiple

capture/compares, PWM outputs, and interval timing. TA0 also has extensive interrupt capabilities. Interrupts

may be generated from the counter on overflow conditions and from each of the capture/compare registers.

Table 11. TA0 Signal Connections

MODULE OUTPUT

SIGNAL

DEVICE OUTPUT

SIGNAL

DEVICE INPUT SIGNAL

MODULE INPUT NAME

MODULE BLOCK

PM_TA0CLK

ACLK (internal)

SMCLK (internal)

RFCLK/192⁽¹⁾

PM_TA0CCR0A

DV_SS

TACLK

ACLK

SMCLK

INCLK

CCI0A

CCI0B

GND

Timer

NA

PM_TA0CCR0A

PM_TA0CCR1A

CCR0

CCR1

CCR2

CCR3

TA0

DV_SS

DV_CC

V_CC

PM_TA0CCR1A

CCI1A

ADC12 (internal)⁽²⁾

ADC12SHSx = {1}

CBOUT (internal)

CCI1B

TA1

TA2

TA3

DV_SS

DV_CC

GND

V_CC

PM_TA0CCR2A

ACLK (internal)

DV_SS

CCI2A

CCI2B

GND

PM_TA0CCR2A

PM_TA0CCR3A

DV_CC

V_CC

PM_TA0CCR3A

CCI3A

GDO1 from Radio

(internal)

CCI3B

DV_SS

DV_CC

GND

V_CC

PM_TA0CCR4A

CCI4A

PM_TA0CCR4A

GDO2 from Radio

(internal)

CCI4B

CCR4

TA4

DV_SS

DV_CC

GND

V_CC

(1) If a different RFCLK divider setting is selected for a radio GDO output, this divider setting is also used for the Timer_A INCLK.

(2) Only on CC430F613x and CC430F513x

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TA1

TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA1 can support multiple

capture/compares, PWM outputs, and interval timing. TA1 also has extensive interrupt capabilities. Interrupts

may be generated from the counter on overflow conditions and from each of the capture/compare registers.

Table 12. TA1 Signal Connections

DEVICE OUTPUT

MODULE OUTPUT

SIGNAL

PZ

DEVICE INPUT SIGNAL

MODULE INPUT NAME

MODULE BLOCK

SIGNAL

PM_TA1CLK

ACLK (internal)

SMCLK (internal)

RFCLK/192⁽¹⁾

TACLK

ACLK

Timer

NA

SMCLK

INCLK

CCI0A

PM_TA1CCR0A

RF Async. Output

(internal)

CCI0B

RF Async. Input (internal)

CCR0

TA0

DV_SS

DV_CC

GND

V_CC

PM_TA1CCR1A

CBOUT (internal)

DV_SS

CCI1A

CCI1B

GND

V_CC

PM_TA1CCR1A

PM_TA1CCR2A

CCR1

CCR2

TA1

TA2

DV_CC

PM_TA1CCR2A

ACLK (internal)

DV_SS

CCI2A

CCI2B

GND

V_CC

DV_CC

(1) If a different RFCLK divider setting is selected for a radio GDO output, this divider setting is also used for the Timer_A INCLK.

Real-Time Clock (RTC_A)

The RTC_A module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated

real-time clock (RTC) (calendar mode). In counter mode, the RTC_A also includes two independent 8-bit timers

that can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by software. Calendar

mode integrates an internal calendar which compensates for months with less than 31 days and includes leap

year correction. The RTC_A also supports flexible alarm functions and offset-calibration hardware.

REF Voltage Reference

The reference module (REF) is responsible for generation of all critical reference voltages that can be used by

the various analog peripherals in the device. These include the ADC12_A, LCD_B, and COMP_B modules.

LCD_B (Only CC430F613x and CC430F612x)

The LCD_B driver generates the segment and common signals required to drive a Liquid Crystal Display (LCD).

The LCD_B controller has dedicated data memories to hold segment drive information. Common and segment

signals are generated as defined by the mode. Static, 2-mux, 3-mux, and 4-mux LCDs are supported. The

module can provide a LCD voltage independent of the supply voltage with its integrated charge pump. It is

possible to control the level of the LCD voltage and thus contrast by software. The module also provides an

automatic blinking capability for individual segments.

Comparator_B

The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions,

battery voltage supervision, and monitoring of external analog signals.

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ADC12_A (Only CC430F613x and CC430F513x)

The ADC12_A module supports fast, 12-bit analog-to-digital conversions. The module implements a 12-bit SAR

core, sample select control, reference generator and a 16 word conversion-and-control buffer. The

conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored without any

CPU intervention.

Embedded Emulation Module (EEM, S Version)

The Embedded Emulation Module (EEM) supports real-time in-system debugging. The S version of the EEM

implemented on all devices has the following features:

•

Three hardware triggers/breakpoints on memory access

One hardware trigger/breakpoint on CPU register write access

Up to four hardware triggers can be combined to form complex triggers/breakpoints

One cycle counter

Clock control on module level

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Peripheral File Map

Table 13. Peripherals

OFFSET ADDRESS

RANGE

MODULE NAME

BASE ADDRESS

Special Functions (refer to Table 14)

PMM (refer to Table 15)

0100h

0120h

0140h

0150h

0158h

015Ch

0160h

0180h

01B0h

01C0h

01C8h

01D0h

01D8h

0200h

000h - 01Fh

000h - 00Fh

000h - 007h

000h - 001h

000h - 01Fh

000h - 001h

000h - 007h

000h - 01Fh

Flash Control (refer to Table 16)

CRC16 (refer to Table 17)

RAM Control (refer to Table 18)

Watchdog (refer to Table 19)

UCS (refer to Table 20)

SYS (refer to Table 21)

Shared Reference (refer to Table 22)

Port Mapping Control (refer to Table 23)

Port Mapping Port P1 (refer to Table 24)

Port Mapping Port P2 (refer to Table 25)

Port Mapping Port P3 (refer to Table 26)

Port P1/P2 (refer to Table 27)

Port P3/P4 (P4 not available on CC430F513x)

(refer to Table 28)

0220h

000h - 01Fh

Port P5 (refer to Table 29)

Port PJ (refer to Table 30)

0240h

0320h

0340h

0380h

04A0h

04C0h

0500h

0510h

0520h

0530h

05C0h

05E0h

000h - 01Fh

000h - 03Fh

000h - 01Fh

000h - 02Fh

000h - 00Fh

000h - 01Fh

TA0 (refer to Table 31)

TA1 (refer to Table 32)

RTC_A (refer to Table 33)

32-bit Hardware Multiplier (refer to Table 34)

DMA Module Control (refer to Table 35)

DMA Channel 0 (refer to Table 36)

DMA Channel 1 (refer to Table 37)

DMA Channel 2 (refer to Table 38)

USCI_A0 (refer to Table 39)

USCI_B0 (refer to Table 40)

ADC12 (refer to Table 41, only CC430F613x and

CC430F513x)

0700h

000h - 03Fh

Comparator_B (refer to Table 42)

AES Accelerator (refer to Table 43)

08C0h

09C0h

000h - 00Fh

LCD_B (refer to Table 44, only CC430F613x and

CC430F612x)

0A00h

0F00h

000h - 05Fh

000h - 03Fh

Radio Interface (refer to Table 45)

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Table 14. Special Function Registers (Base Address: 0100h)

REGISTER DESCRIPTION

REGISTER

SFRIE1

OFFSET

SFR interrupt enable

SFR interrupt flag

00h

02h

04h

SFRIFG1

SFR reset pin control

SFRRPCR

Table 15. PMM Registers (Base Address: 0120h)

REGISTER DESCRIPTION

REGISTER

PMMCTL0

OFFSET

PMM Control 0

00h

02h

04h

06h

0Ch

0Eh

10h

PMM control 1

PMMCTL1

SVSMHCTL

SVSMLCTL

PMMIFG

SVS high side control

SVS low side control

PMM interrupt flags

PMM interrupt enable

PMM power mode 5 control

PMMIE

PM5CTL0

Table 16. Flash Control Registers (Base Address: 0140h)

REGISTER DESCRIPTION

REGISTER

OFFSET

Flash control 1

Flash control 3

Flash control 4

FCTL1

FCTL3

FCTL4

00h

04h

06h

Table 17. CRC16 Registers (Base Address: 0150h)

REGISTER DESCRIPTION

REGISTER

CRC16DI

OFFSET

CRC data input

00h

02h

04h

06h

CRC data input reverse byte

CRC initialization and result

CRC result reverse byte

CRCDIRB

CRCINIRES

CRCRESR

Table 18. RAM Control Registers (Base Address: 0158h)

REGISTER DESCRIPTION

REGISTER

RCCTL0

OFFSET

RAM control 0

00h

Table 19. Watchdog Registers (Base Address: 015Ch)

REGISTER DESCRIPTION

REGISTER

WDTCTL

Watchdog timer control

Table 20. UCS Registers (Base Address: 0160h)

REGISTER DESCRIPTION

REGISTER

UCSCTL0

UCS control 0

UCS control 1

UCS control 2

UCS control 3

UCS control 4

UCS control 5

UCS control 6

UCS control 7

UCS control 8

00h

02h

04h

06h

08h

0Ah

0Ch

0Eh

10h

UCSCTL1

UCSCTL2

UCSCTL3

UCSCTL4

UCSCTL5

UCSCTL6

UCSCTL7

UCSCTL8

30

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Table 21. SYS Registers (Base Address: 0180h)

REGISTER DESCRIPTION

REGISTER

SYSCTL

OFFSET

System control

00h

02h

06h

08h

0Ah

0Ch

0Eh

18h

1Ah

1Ch

1Eh

Bootstrap loader configuration area

JTAG mailbox control

SYSBSLC

SYSJMBC

SYSJMBI0

SYSJMBI1

SYSJMBO0

SYSJMBO1

SYSBERRIV

SYSUNIV

JTAG mailbox input 0

JTAG mailbox input 1

JTAG mailbox output 0

JTAG mailbox output 1

Bus Error vector generator

User NMI vector generator

System NMI vector generator

Reset vector generator

SYSSNIV

SYSRSTIV

Table 22. Shared Reference Registers (Base Address: 01B0h)

REGISTER DESCRIPTION

REGISTER

REFCTL

OFFSET

Shared reference control

00h

Table 23. Port Mapping Control Registers (Base Address: 01C0h)

REGISTER DESCRIPTION

REGISTER

PMAPKEYID

PMAPCTL

Port mapping key register

00h

02h

Port mapping control register

Table 24. Port Mapping Port P1 Registers (Base Address: 01C8h)

REGISTER DESCRIPTION

REGISTER

P1MAP0

OFFSET

Port P1.0 mapping register

Port P1.1 mapping register

Port P1.2 mapping register

Port P1.3 mapping register

Port P1.4 mapping register

Port P1.5 mapping register

Port P1.6 mapping register

Port P1.7 mapping register

00h

01h

02h

03h

04h

05h

06h

07h

P1MAP1

P1MAP2

P1MAP3

P1MAP4

P1MAP5

P1MAP6

P1MAP7

Table 25. Port Mapping Port P2 Registers (Base Address: 01D0h)

REGISTER DESCRIPTION

REGISTER

P2MAP0

Port P2.0 mapping register

Port P2.1 mapping register

Port P2.2 mapping register

Port P2.3 mapping register

Port P2.4 mapping register

Port P2.5 mapping register

Port P2.6 mapping register

Port P2.7 mapping register

00h

01h

02h

03h

04h

05h

06h

07h

P2MAP2

P2MAP3

P2MAP4

P2MAP5

P2MAP6

P2MAP7

Table 26. Port Mapping Port P3 Registers (Base Address: 01D8h)

REGISTER DESCRIPTION

REGISTER

P3MAP0

P3MAP3

Port P3.0 mapping register

Port P3.1 mapping register

00h

01h

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Table 26. Port Mapping Port P3 Registers (Base Address: 01D8h) (continued)

REGISTER DESCRIPTION

REGISTER

P3MAP2

OFFSET

Port P3.2 mapping register

Port P3.3 mapping register

Port P3.4 mapping register

Port P3.5 mapping register

Port P3.6 mapping register

Port P3.7 mapping register

02h

03h

04h

05h

06h

07h

P3MAP3

P3MAP4

P3MAP5

P3MAP6

P3MAP7

Table 27. Port P1/P2 Registers (Base Address: 0200h)

REGISTER DESCRIPTION

REGISTER

OFFSET

Port P1 input

P1IN

00h

02h

04h

06h

08h

0Ah

0Eh

18h

1Ah

1Ch

01h

03h

05h

07h

09h

0Bh

1Eh

19h

1Bh

1Dh

Port P1 output

Port P1 direction

P1OUT

P1DIR

P1REN

P1DS

P1SEL

P1IV

Port P1 pullup/pulldown enable

Port P1 drive strength

Port P1 selection

Port P1 interrupt vector word

Port P1 interrupt edge select

Port P1 interrupt enable

Port P1 interrupt flag

P1IES

P1IE

P1IFG

P2IN

Port P2 input

Port P2 output

P2OUT

P2DIR

P2REN

P2DS

P2SEL

P2IV

Port P2 direction

Port P2 pullup/pulldown enable

Port P2 drive strength

Port P2 selection

Port P2 interrupt vector word

Port P2 interrupt edge select

Port P2 interrupt enable

Port P2 interrupt flag

P2IES

P2IE

P2IFG

Table 28. Port P3/P4 Registers (Base Address: 0220h)

REGISTER DESCRIPTION

REGISTER

OFFSET

Port P3 input

P3IN

00h

02h

04h

06h

08h

0Ah

01h

03h

05h

07h

09h

0Bh

Port P3 output

P3OUT

P3DIR

P3REN

P3DS

Port P3 direction

Port P3 pullup/pulldown enable

Port P3 drive strength

Port P3 selection

P3SEL

P4IN

Port P4 input

Port P4 output

P4OUT

P4DIR

P4REN

P4DS

Port P4 direction

Port P4 pullup/pulldown enable

Port P4 drive strength

Port P4 selection

P4SEL

32

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Table 29. Port P5 Registers (Base Address: 0240h)

REGISTER DESCRIPTION

REGISTER

OFFSET

Port P5 input

P5IN

00h

02h

04h

06h

08h

0Ah

Port P5 output

Port P5 direction

P5OUT

P5DIR

P5REN

P5DS

Port P5 pullup/pulldown enable

Port P5 drive strength

Port P5 selection

P5SEL

Table 30. Port J Registers (Base Address: 0320h)

REGISTER DESCRIPTION

REGISTER

OFFSET

Port PJ input

PJIN

00h

02h

04h

06h

08h

Port PJ output

PJOUT

PJDIR

PJREN

PJDS

Port PJ direction

Port PJ pullup/pulldown enable

Port PJ drive strength

Table 31. TA0 Registers (Base Address: 0340h)

REGISTER DESCRIPTION

REGISTER

TA0CTL

OFFSET

TA0 control

00h

02h

04h

06h

08h

0Ah

10h

12h

14h

16h

18h

1Ah

20h

2Eh

Capture/compare control 0

Capture/compare control 1

Capture/compare control 2

Capture/compare control 3

Capture/compare control 4

TA0 counter register

TA0CCTL0

TA0CCTL1

TA0CCTL2

TA0CCTL3

TA0CCTL4

TA0R

Capture/compare register 0

Capture/compare register 1

Capture/compare register 2

Capture/compare register 3

Capture/compare register 4

TA0 expansion register 0

TA0 interrupt vector

TA0CCR0

TA0CCR1

TA0CCR2

TA0CCR3

TA0CCR4

TA0EX0

TA0IV

Table 32. TA1 Registers (Base Address: 0380h)

REGISTER DESCRIPTION

REGISTER

TA1CTL

OFFSET

TA1 control

00h

02h

04h

06h

10h

12h

14h

16h

20h

2Eh

Capture/compare control 0

Capture/compare control 1

Capture/compare control 2

TA1 counter register

TA1CCTL0

TA1CCTL1

TA1CCTL2

TA1R

Capture/compare register 0

Capture/compare register 1

Capture/compare register 2

TA1 expansion register 0

TA1 interrupt vector

TA1CCR0

TA1CCR1

TA1CCR2

TA1EX0

TA1IV

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Table 33. Real Time Clock Registers (Base Address: 04A0h)

REGISTER DESCRIPTION

REGISTER

RTCCTL0

OFFSET

RTC control 0

00h

01h

02h

03h

08h

0Ah

0Ch

0Dh

0Eh

10h

11h

12h

13h

14h

15h

16h

17h

18h

19h

1Ah

1Bh

RTC control 1

RTCCTL1

RTC control 2

RTCCTL2

RTC control 3

RTCCTL3

RTC prescaler 0 control

RTC prescaler 1 control

RTC prescaler 0

RTCPS0CTL

RTCPS1CTL

RTCPS0

RTC prescaler 1

RTCPS1

RTC interrupt vector word

RTC seconds/counter register 1

RTC minutes/counter register 2

RTC hours/counter register 3

RTC day of week/counter register 4

RTC days

RTCIV

RTCSEC/RTCNT1

RTCMIN/RTCNT2

RTCHOUR/RTCNT3

RTCDOW/RTCNT4

RTCDAY

RTC month

RTCMON

RTC year low

RTCYEARL

RTCYEARH

RTCAMIN

RTC year high

RTC alarm minutes

RTC alarm hours

RTCAHOUR

RTCADOW

RTCADAY

RTC alarm day of week

RTC alarm days

Table 34. 32-bit Hardware Multiplier Registers (Base Address: 04C0h)

REGISTER DESCRIPTION

REGISTER

OFFSET

16-bit operand 1 – multiply

MPY

00h

02h

04h

06h

08h

0Ah

0Ch

0Eh

10h

12h

14h

16h

18h

1Ah

1Ch

1Eh

20h

22h

24h

26h

28h

2Ah

2Ch

16-bit operand 1 – signed multiply

16-bit operand 1 – multiply accumulate

16-bit operand 1 – signed multiply accumulate

16-bit operand 2

MPYS

MAC

MACS

OP2

16 × 16 result low word

RESLO

RESHI

16 × 16 result high word

16 × 16 sum extension register

SUMEXT

MPY32L

MPY32H

MPYS32L

MPYS32H

MAC32L

MAC32H

MACS32L

MACS32H

OP2L

32-bit operand 1 – multiply low word

32-bit operand 1 – multiply high word

32-bit operand 1 – signed multiply low word

32-bit operand 1 – signed multiply high word

32-bit operand 1 – multiply accumulate low word

32-bit operand 1 – multiply accumulate high word

32-bit operand 1 – signed multiply accumulate low word

32-bit operand 1 – signed multiply accumulate high word

32-bit operand 2 – low word

32-bit operand 2 – high word

OP2H

32 × 32 result 0 – least significant word

32 × 32 result 1

RES0

RES1

32 × 32 result 2

RES2

32 × 32 result 3 – most significant word

MPY32 control register 0

RES3

MPY32CTL0

34

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Table 35. DMA Module Control Registers (Base Address: 0500h)

REGISTER DESCRIPTION

REGISTER

DMACTL0

OFFSET

DMA module control 0

DMA module control 1

DMA module control 2

DMA module control 3

DMA module control 4

DMA interrupt vector

00h

02h

04h

06h

08h

0Ah

DMACTL1

DMACTL2

DMACTL3

DMACTL4

DMAIV

Table 36. DMA Channel 0 Registers (Base Address: 0510h)

REGISTER DESCRIPTION

REGISTER

DMA0CTL

DMA channel 0 control

00h

02h

04h

06h

08h

0Ah

DMA channel 0 source address low

DMA channel 0 source address high

DMA channel 0 destination address low

DMA channel 0 destination address high

DMA channel 0 transfer size

DMA0SAL

DMA0SAH

DMA0DAL

DMA0DAH

DMA0SZ

Table 37. DMA Channel 1 Registers (Base Address: 0520h)

REGISTER DESCRIPTION

REGISTER

DMA1CTL

DMA channel 1 control

00h

02h

04h

06h

08h

0Ah

DMA channel 1 source address low

DMA channel 1 source address high

DMA channel 1 destination address low

DMA channel 1 destination address high

DMA channel 1 transfer size

DMA1SAL

DMA1SAH

DMA1DAL

DMA1DAH

DMA1SZ

Table 38. DMA Channel 2 Registers (Base Address: 0530h)

REGISTER DESCRIPTION

REGISTER

DMA2CTL

DMA channel 2 control

00h

02h

04h

06h

08h

0Ah

DMA channel 2 source address low

DMA channel 2 source address high

DMA channel 2 destination address low

DMA channel 2 destination address high

DMA channel 2 transfer size

DMA2SAL

DMA2SAH

DMA2DAL

DMA2DAH

DMA2SZ

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Table 39. USCI_A0 Registers (Base Address: 05C0h)

REGISTER DESCRIPTION

REGISTER

UCA0CTL0

OFFSET

USCI control 0

00h

01h

06h

07h

08h

0Ah

0Ch

0Eh

10h

12h

13h

1Ch

1Dh

1Eh

USCI control 1

UCA0CTL1

UCA0BR0

USCI baud rate 0

USCI baud rate 1

UCA0BR1

USCI modulation control

USCI status

UCA0MCTL

UCA0STAT

UCA0RXBUF

UCA0TXBUF

UCA0ABCTL

UCA0IRTCTL

UCA0IRRCTL

UCA0IE

USCI receive buffer

USCI transmit buffer

USCI LIN control

USCI IrDA transmit control

USCI IrDA receive control

USCI interrupt enable

USCI interrupt flags

USCI interrupt vector word

UCA0IFG

UCA0IV

Table 40. USCI_B0 Registers (Base Address: 05E0h)

REGISTER DESCRIPTION

REGISTER

UCB0CTL0

OFFSET

USCI synchronous control 0

USCI synchronous control 1

USCI synchronous bit rate 0

USCI synchronous bit rate 1

USCI synchronous status

USCI synchronous receive buffer

USCI synchronous transmit buffer

USCI I2C own address

00h

01h

06h

07h

0Ah

0Ch

0Eh

10h

12h

1Ch

1Dh

1Eh

UCB0CTL1

UCB0BR0

UCB0BR1

UCB0STAT

UCB0RXBUF

UCB0TXBUF

UCB0I2COA

UCB0I2CSA

UCB0IE

USCI I2C slave address

USCI interrupt enable

USCI interrupt flags

UCB0IFG

USCI interrupt vector word

UCB0IV

36

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Table 41. ADC12_A Registers (Base Address: 0700h)

REGISTER DESCRIPTION

REGISTER

ADC12CTL0

OFFSET

Control register 0

00h

02h

04h

0Ah

0Ch

0Eh

10h

11h

12h

13h

14h

15h

16h

17h

18h

19h

1Ah

1Bh

1Ch

1Dh

1Eh

1Fh

20h

22h

24h

26h

28h

2Ah

2Ch

2Eh

30h

32h

34h

36h

38h

3Ah

3Ch

3Eh

Control register 1

ADC12CTL1

Control register 2

ADC12CTL2

Interrupt-flag register

Interrupt-enable register

Interrupt-vector-word register

ADC12IFG

ADC12IE

ADC12IV

ADC memory-control register 0

ADC memory-control register 1

ADC memory-control register 2

ADC memory-control register 3

ADC memory-control register 4

ADC memory-control register 5

ADC memory-control register 6

ADC memory-control register 7

ADC memory-control register 8

ADC memory-control register 9

ADC memory-control register 10

ADC memory-control register 11

ADC memory-control register 12

ADC memory-control register 13

ADC memory-control register 14

ADC memory-control register 15

Conversion memory 0

ADC12MCTL0

ADC12MCTL1

ADC12MCTL2

ADC12MCTL3

ADC12MCTL4

ADC12MCTL5

ADC12MCTL6

ADC12MCTL7

ADC12MCTL8

ADC12MCTL9

ADC12MCTL10

ADC12MCTL11

ADC12MCTL12

ADC12MCTL13

ADC12MCTL14

ADC12MCTL15

ADC12MEM0

ADC12MEM1

ADC12MEM2

ADC12MEM3

ADC12MEM4

ADC12MEM5

ADC12MEM6

ADC12MEM7

ADC12MEM8

ADC12MEM9

ADC12MEM10

ADC12MEM11

ADC12MEM12

ADC12MEM13

ADC12MEM14

ADC12MEM15

Conversion memory 1

Conversion memory 2

Conversion memory 3

Conversion memory 4

Conversion memory 5

Conversion memory 6

Conversion memory 7

Conversion memory 8

Conversion memory 9

Conversion memory 10

Conversion memory 11

Conversion memory 12

Conversion memory 13

Conversion memory 14

Conversion memory 15

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Table 42. Comparator_B Registers (Base Address: 08C0h)

REGISTER DESCRIPTION

REGISTER

CBCTL0

OFFSET

Comp_B control register 0

Comp_B control register 1

Comp_B control register 2

Comp_B control register 3

Comp_B interrupt register

Comp_B interrupt vector word

00h

02h

04h

06h

0Ch

0Eh

CBCTL1

CBCTL2

CBCTL3

CBINT

CBIV

Table 43. AES Accelerator Registers (Base Address: 09C0h)

REGISTER DESCRIPTION

REGISTER

AESACTL0

OFFSET

AES accelerator control register 0

Reserved

00h

02h

AES accelerator status register

AES accelerator key register

AES accelerator data in register

AES accelerator data out register

AESASTAT

AESAKEY

AESADIN

04h

06h

008h

00Ah

AESADOUT

Table 44. LCD_B Registers (Base Address: 0A00h)

REGISTER DESCRIPTION

REGISTER

LCDBCTL0

OFFSET

LCD_B control register 0

LCD_B control register 1

LCD_B blinking control register

LCD_B memory control register

LCD_B voltage control register

LCD_B port control register 0

LCD_B port control register 1

LCD_B charge pump control register

LCD_B interrupt vector word

LCD_B memory 1

000h

002h

004h

006h

008h

00Ah

00Ch

012h

01Eh

020h

021h

LCDBCTL1

LCDBBLKCTL

LCDBMEMCTL

LCDBVCTL

LCDBPCTL0

LCDBPCTL1

LCDBCTL0

LCDBIV

LCDM1

LCD_B memory 2

LCDM2

...

LCD_B memory 14

LCDM14

LCDBM1

LCDBM2

02Dh

040h

041h

LCD_B blinking memory 1

LCD_B blinking memory 2

...

LCD_B blinking memory 14

LCDBM14

04Dh

38

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Table 45. Radio Interface Registers (Base Address: 0F00h)

REGISTER DESCRIPTION

REGISTER

RF1AIFCTL0

OFFSET

Radio interface control register 0

Radio interface control register 1

Radio interface error flag register

Radio interface error vector word

Radio interface interrupt vector word

Radio instruction word register

00h

02h

06h

0Ch

0Eh

10h

12h

14h

16h

20h

22h

24h

28h

2Ah

2Ch

30h

32h

34h

36h

38h

RF1AIFCTL1

RF1AIFERR

RF1AIFERRV

RF1AIFIV

RF1AINSTRW

RF1AINSTR1W

RF1AINSTR2W

RF1ADINW

RF1ASTATW

RF1ASTAT1W

RF1AISTAT2W

RF1ADOUTW

RF1ADOUT1W

RF1ADOUT2W

RF1AIN

Radio instruction word register, 1-byte auto-read

Radio instruction word register, 2-byte auto-read

Radio data in register

Radio status word register

Radio status word register, 1-byte auto-read

Radio status word register, 2-byte auto-read

Radio data out register

Radio data out register, 1-byte auto-read

Radio data out register, 2-byte auto-read

Radio core signal input register

Radio core interrupt flag register

Radio core interrupt edge select register

Radio core interrupt enable register

Radio core interrupt vector word

RF1AIFG

RF1AIES

RF1AIE

RF1AIV

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Absolute Maximum Ratings⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

Voltage applied at DVCC and AVCC pins to V_SS

–0.3 V to 4.1 V

–0.3 V to (V_CC+ 0.3 V),

4.1 V Max

Voltage applied to any pin (excluding VCORE, RF_P, RF_N, and R_BIAS)⁽²⁾

Voltage applied to VCORE, RF_P, RF_N, and R_BIAS⁽²⁾

Input RF level at pins RF_P and RF_N

Diode current at any device terminal

–0.3 V to 2.0 V

10 dBm

±2 mA

Storage temperature range⁽³⁾, T_stg

–55°C to 105°C

95°C

Maximum junction temperature, T_J

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages referenced to V_SS

.

(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow

temperatures not higher than classified on the device label on the shipping boxes or reels.

Thermal Packaging Characteristics CC430F51xx

Low-K board

High-K board

48 QFN (RGZ)

98°C/W

28°C/W

q_JA

Junction to ambient thermal resistance, still air

Thermal Packaging Characteristics CC430F61xx

Low-K board

High-K board

64 QFN (RGC)

83°C/W

26°C/W

q_JA

Junction to ambient thermal resistance, still air

Recommended Operating Conditions

MIN NOM

MAX UNIT

Supply voltage range applied at all DVCC and AVCC

PMMCOREVx = 0 (default

after POR)

1.8

3.6

V

pins⁽¹⁾during program execution and flash programming

with PMM default settings. Radio is not operational with

PMMCOREVx = 0, 1.⁽²⁾

V_CC

PMMCOREVx = 1

PMMCOREVx = 2

PMMCOREVx = 3

2.0

2.2

2.4

3.6

V

Supply voltage range applied at all DVCC and AVCC

pins⁽¹⁾during program execution, flash programming and

radio operation with PMM default settings.⁽²⁾

V_CC

Supply voltage range applied at all DVCC and AVCC

pins⁽¹⁾during program execution, flash programming and PMMCOREVx = 2,

V_CC

radio operation with PMMCOREVx = 2, high-side SVS

level lowered (SVSHRVLx=SVSHRRRLx=1) or high-side

SVS disabled (SVSHE=0).^{(3) (2)}

SVSHRVLx=SVSHRRRLx=1

or SVSHE=0

2.0

3.6

V

Supply voltage applied at the exposed die attach VSS and

AVSS pin

V_SS

0

V

T_A

Operating free-air temperature

Operating junction temperature

Recommended capacitor at VCORE

–40

470

85

°C

nF

T_J

C_VCORE

C_DVCC

C_VCORE

/

Capacitor ratio of capacitor at DVCC to capacitor at

VCORE

10

0

PMMCOREVx = 0

(default condition)

8

MHz

Processor (MCLK) frequency⁽⁴⁾(see Figure 2)

PMMCOREVx = 1

PMMCOREVx = 2

PMMCOREVx = 3

0

12 MHz

16 MHz

20 MHz

f_SYSTEM

(1) It is recommended to power AV_CCand DV_CCfrom the same source. A maximum difference of 0.3 V between AV_CCand DV_CCcan be

tolerated during power up and operation.

(2) Modules may have a different supply voltage range specification. See the specification of the respective module in this data sheet.

(3) Lowering the high-side SVS level or disabling the high-side SVS might cause the LDO to operate out of regulation but the core voltage

will still stay within it's limits and is still supervised by the low-side SVS ensuring reliable operation.

(4) Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.

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Recommended Operating Conditions (continued)

MIN NOM

MAX UNIT

P_INT

P_IO

Internal power dissipation

V_CCx I(DVCC)

W

(V_CC- V_IOH) x I_IOH

V_IOLx I_IOL

+

I/O power dissipation of I/O pins powered by DVCC

Maximum allowed power dissipation, P_MAX> P_IO+ P_INT

W

P_MAX

(T_J- T_A)/q_JA

20

16

12

3

2, 3

2

1, 2

1, 2, 3

1

8

0

0, 1

0, 1, 2

0, 1, 2, 3

0

1.8

2.0

2.2

2.4

3.6

Supply Voltage - V

The numbers within the fields denote the supported PMMCOREVx settings.

Figure 2. Maximum System Frequency

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Electrical Characteristics

Active Mode Supply Current Into V_CCExcluding External Current

(2) (3)

over recommended operating free-air temperature (unless otherwise noted)⁽¹⁾

FREQUENCY (f_DCO= f_MCLK= f_SMCLK

)

EXECUTION

MEMORY

PARAMETER

V_CC

PMMCOREVx

1 MHz

8 MHz 12 MHz 16 MHz

20 MHz

UNIT

TYP MAX TYP MAX TYP MAX TYP MAX TYP MAX

0

1

2

3

0

1

2

3

0.23 0.26 1.35 1.60

0.25 0.28 1.55

0.27 0.30 1.75

0.28 0.32 1.85

0.18 0.20 0.95 1.10

0.20 0.22 1.10

0.21 0.24 1.20

0.22 0.25 1.30

2.30 2.65

2.60

(4)

I_{AM, Flash}

Flash

RAM

3.0 V

mA

3.45 3.90

3.65

2.75

4.55 5.10

3.10 3.60

1.60 1.85

1.80

(5)

I_{AM, RAM}

3.0 V

mA

2.40 2.70

2.50

1.90

(1) All inputs are tied to 0 V or to V_CC. Outputs do not source or sink any current.

(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load

capacitance are chosen to closely match the required 12.5 pF.

(3) Characterized with program executing typical data processing.

f_ACLK= 32786 Hz, f_DCO= f_MCLK= f_SMCLKat specified frequency.

XTS = CPUOFF = SCG0 = SCG1 = OSCOFF= SMCLKOFF = 0.

(4) Active mode supply current when program executes in flash at a nominal supply voltage of 3.0 V.

(5) Active mode supply current when program executes in RAM at a nominal supply voltage of 3.0 V.

Typical Characteristics - Active Mode Supply Currents

Active Mode Supply Current

vs

MCLK Frequency

5

V_CC= 3.0 V

PMMVCOREx=3

4

3

PMMVCOREx=2

2

PMMVCOREx=1

1

PMMVCOREx=0

0

5

10

15

20

MCLK Frequency - MHz

Figure 3.

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Low-Power Mode Supply Currents (Into V_CC) Excluding External Current

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

(2)

Temperature (T_A)

PARAMETER

V_CC

PMMCOREVx

-40°C

TYP MAX

25°C

MAX

100

60°C

MAX

100

85°C

MAX

80 100

UNIT

TYP

80

TYP

80

TYP

2.2 V

3.0 V

2.2 V

3.0 V

0

3

0

3

0

1

2

3

0

1

2

3

0

1

2

3

80

90

100

110

11

(4)

I_LPM0,1MHz

Low-power mode 0⁽³⁾

Low-power mode 2⁽⁵⁾

µA

90

6.5

7.5

2.0

2.1

2.2

1.1

1.2

1.3

1.0

1.1

1.2

110

11

90

6.5

7.5

3.0

3.2

3.4

3.5

2.1

2.3

2.5

2.6

2.0

2.2

2.4

2.5

110

11

90

6.5

7.5

4.4

4.8

5.1

5.3

3.5

3.9

4.2

4.4

3.4

3.8

4.1

4.3

110

11

6.5

7.5

1.8

1.9

2.0

0.9

1.0

1.1

0.8

0.9

1.0

I_LPM2

12

2.6

4.0

5.9

Low-power mode 3, crystal

I_LPM3,XT1LF

I_LPM3,VLO

I_LPM4

3.0 V

µA

(4)

mode⁽⁶⁾

2.9

2.3

4.8

3.7

7.4

5.6

Low-power mode 3,

(4)

VLO mode⁽⁷⁾

2.6

2.2

4.5

3.6

7.1

5.5

Low-power mode 4⁽⁸⁾

(4)

2.5

4.4

7.0

(1) All inputs are tied to 0 V or to V_CC. Outputs do not source or sink any current.

(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load

capacitance are chosen to closely match the required 12.5 pF.

(3) Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).

CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); f_ACLK= 32768 Hz, f_MCLK= 0 MHz, f_SMCLK= f_DCO= 1 MHz

(4) Current for brownout, high side supervisor (SVS_H) normal mode included. Low side supervisor and monitors disabled (SVS_L, SVM_L).

High side monitor disabled (SVM_H). RAM retention enabled.

(5) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).

CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); f_ACLK= 32768 Hz, f_MCLK= 0 MHz, f_SMCLK= f_DCO= 0 MHz; DCO setting = 1

MHz operation, DCO bias generator enabled.

(6) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).

CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); f_ACLK= 32768 Hz, f_MCLK= f_SMCLK= f_DCO= 0 MHz

(7) Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO.

CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); f_ACLK= f_VLO, f_MCLK= f_SMCLK= f_DCO= 0 MHz

(8) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); f_DCO= f_ACLK= f_MCLK= f_SMCLK= 0 MHz

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Typical Characteristics - Low-Power Mode Supply Currents

LPM3 Supply Current

vs

LPM4 Supply Current

vs

Temperature

5

4

3

2

1

0

5

4

3

2

1

0

V_CC= 3.0 V

V_DD= 3.0 V

PMMCOREVx = 3

PMMCOREVx = 0

PMMCOREVx = 3

PMMCOREVx = 0

-40

-20

0

20

40

60

80

-40

-20

0

20

40

60

80

T_A- Free-Air Temperature - °C

Figure 4.

Figure 5.

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Low-Power Mode with LCD Supply Currents (Into V_CC) Excluding External Current

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

(2)

Temperature (T_A)

PARAMETER

V_CC

PMMCOREVx

-40°C

TYP MAX

2.2

25°C

TYP MAX

2.4

60°C

TYP MAX

3.5

85°C

TYP MAX

UNIT

0

1

2

3

0

1

2

3

0

1

2

0

1

2

3

4.9

5.3

5.6

5.8

6.2

6.5

6.7

Low-power mode 3

(LPM3) current, LCD

4-mux mode, external

biasing^{(3) (4)}

I_LPM3

LCD,

ext. bias

2.3

2.4

3.1

3.2

3.3

2.5

2.6

3.3

3.4

3.5

4.0

4.1

4.2

4.3

4.5

3.7

3.9

4.0

4.3

4.5

4.7

4.8

3.0 V

µA

4.0

7.4

Low-power mode 3

(LPM3) current, LCD

4-mux mode, internal

biasing, charge pump

disabled^{(3) (5)}

I_LPM3

LCD,

int. bias

3.0 V

2.2 V

3.0 V

µA

4.3

8.9

Low-power mode 3

(LPM3) current, LCD

4-mux mode, internal

biasing, charge pump

enabled^{(3) (6)}

I_LPM3

LCD,CP

(1) All inputs are tied to 0 V or to V_CC. Outputs do not source or sink any current.

(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load

capacitance are chosen to closely match the required 12.5 pF.

(3) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).

CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); f_ACLK= 32768 Hz, f_MCLK= f_SMCLK= f_DCO= 0 MHz

Current for brownout, high side supervisor (SVS_H) normal mode included. Low side supervisor and monitors disabled (SVS_L, SVM_L).

High side monitor disabled (SVM_H). RAM retention enabled.

(4) LCDMx = 11 (4-mux mode), LCDREXT=1, LCDEXTBIAS=1 (external biasing), LCD2B=0 (1/3 bias), LCDCPEN=0 (charge pump

disabled), LCDSSEL=0, LCDPREx=101, LCDDIVx=00011 (f_LCD= 32768 Hz/32/4 = 256 Hz)

Current through external resistors not included (voltage levels are supplied by test equipment).

Even segments S0, S2,...=0, odd segments S1, S3,...=1. No LCD panel load.

(5) LCDMx = 11 (4-mux mode), LCDREXT=0, LCDEXTBIAS=0 (internal biasing), LCD2B=0 (1/3 bias), LCDCPEN=0 (charge pump

disabled), LCDSSEL=0, LCDPREx=101, LCDDIVx=00011 (f_LCD= 32768 Hz/32/4 = 256 Hz)

Even segments S0, S2,...=0, odd segments S1, S3,...=1. No LCD panel load.

(6) LCDMx = 11 (4-mux mode), LCDREXT=0, LCDEXTBIAS=0 (internal biasing), LCD2B=0 (1/3 bias), LCDCPEN=1 (charge pump

enabled), VLCDx=1000 (V_LCD= 3 V typ.), LCDSSEL=0, LCDPREx=101, LCDDIVx=00011 (f_LCD= 32768 Hz/32/4 = 256 Hz)

Even segments S0, S2,...=0, odd segments S1, S3,...=1. No LCD panel load.

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MAX UNIT

Digital Inputs

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

1.8 V

3 V

MIN

0.80

1.50

0.45

0.75

0.3

TYP

1.40

V

V_IT+

Positive-going input threshold voltage

2.10

1.8 V

3 V

1.00

V

V_IT–

Negative-going input threshold voltage

1.65

1.8 V

3 V

0.8

V

V_hys

R_Pull

Input voltage hysteresis (V_IT+– V_IT–

Pullup/pulldown resistor

)

0.4

1.0

For pullup: V_IN= V_SS

For pulldown: V_IN= V_CC

20

35

5

50

kΩ

C_I

Input capacitance

V_IN= V_SSor V_CC

(1) (2)

pF

nA

I_lkg(Px.x)

High-impedance leakage current

1.8 V/3 V

±50

Ports with interrupt capability

External interrupt timing (External trigger pulse (see block diagram and

t_(int)

20

ns

width to set interrupt flag)⁽³⁾

terminal function

descriptions).

(1) The leakage current is measured with V_SSor V_CCapplied to the corresponding pin(s), unless otherwise noted.

(2) The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is

disabled.

(3) An external signal sets the interrupt flag every time the minimum interrupt pulse width t_(int)is met. It may be set by trigger signals shorter

than t_(int)

.

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Digital Outputs

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

I_(OHmax)= –1 mA, PxDS.y = 0⁽²⁾

I_(OHmax)= –3 mA, PxDS.y = 0⁽³⁾

I_(OHmax)= –2 mA, PxDS.y = 0⁽²⁾

I_(OHmax)= –6 mA, PxDS.y = 0⁽³⁾

I_(OLmax)= 1 mA, PxDS.y = 0⁽²⁾

I_(OLmax)= 3 mA, PxDS.y = 0⁽³⁾

I_(OLmax)= 2 mA, PxDS.y = 0⁽²⁾

I_(OLmax)= 6 mA, PxDS.y = 0⁽³⁾

I_(OHmax)= –3 mA, PxDS.y = 1⁽²⁾

I_(OHmax)= –10 mA, PxDS.y = 1⁽³⁾

I_(OHmax)= –5 mA, PxDS.y = 1⁽²⁾

I_(OHmax)= –15 mA, PxDS.y = 1⁽³⁾

I_(OLmax)= 3 mA, PxDS.y = 1⁽²⁾

I_(OLmax)= 10 mA, PxDS.y = 1⁽³⁾

I_(OLmax)= 5 mA, PxDS.y = 1⁽²⁾

I_(OLmax)= 15 mA, PxDS.y = 1⁽³⁾

V_CC

MIN

V_CC– 0.25

V_CC– 0.60

V_CC– 0.25

V_CC– 0.60

MAX UNIT

V_CC

1.8 V

V_CC

High-level output voltage,

Reduced Drive Strength⁽¹⁾

V_OH

V_OL

V_OH

V_OL

V

V_CC

3.0 V

1.8 V

3.0 V

1.8 V

3 V

V_CC

V_SSV_SS+ 0.25

V_SSV_SS+ 0.60

V_SSV_SS+ 0.25

V_SSV_SS+ 0.60

Low-level output voltage,

Reduced Drive Strength⁽¹⁾

V

V_CC– 0.25

V_CC

V_CC– 0.60

V_CC– 0.25

V_CC– 0.60

High-level output voltage,

Full Drive Strength

V_SSV_SS+ 0.25

V_SSV_SS+ 0.60

V_SSV_SS+ 0.25

V_SSV_SS+ 0.60

1.8 V

3 V

Low-level output voltage,

Full Drive Strength

V_CC= 1.8 V

PMMCOREVx = 0

16

25

16

25

Port output frequency

(with load)

(4) (5)

f_Px.y

C_L= 20 pF, R_L

MHz

V_CC= 3 V

PMMCOREVx = 2

V_CC= 1.8 V

PMMCOREVx = 0

f_{Port_CLK}

Clock output frequency

C_L= 20 pF⁽⁵⁾

V_CC= 3 V

PMMCOREVx = 2

(1) Selecting reduced drive strength may reduce EMI.

(2) The maximum total current, I_(OHmax)and I_(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop

specified.

(3) The maximum total current, I_(OHmax)and I_(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage

drop specified.

(4) A resistive divider with 2 × R1 between V_CCand V_SSis used as load. The output is connected to the center tap of the divider. For full

drive strength, R1 = 550 Ω. For reduced drive strength, R1 = 1.6 kΩ. C_L= 20 pF is connected to the output to V_SS

.

(5) The output voltage reaches at least 10% and 90% V_CCat the specified toggle frequency.

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Typical Characteristics - Outputs, Reduced Drive Strength (PxDS.y = 0)

TYPICAL LOW-LEVEL OUTPUT CURRENT

vs

LOW-LEVEL OUTPUT VOLTAGE

25

20

15

10

5

8

7

6

5

4

3

2

1

0

V_CC= 3.0 V

P4.3

V_CC= 1.8 V

_DD= 5.5 V

T_A= 25°C

V

P4.3

T_A= 25°C

T_A= 85°C

0

0.5

1

1.5

2

2.5

3

3.5

0

0.5

1

1.5

2

V_OL- Low-Level Output Voltage - V

Figure 6.

Figure 7.

TYPICAL HIGH-LEVEL OUTPUT CURRENT

vs

HIGH-LEVEL OUTPUT VOLTAGE

0

V_CC= 3.0 V

P4.3

V_CC= 1.8 V

V_DD= 5.5 V

P4.3

-1

-2

-3

-4

-5

-6

-7

-8

-5

-10

-15

-20

-25

T_A= 85°C

T_A= 25°C

T_A= 85°C

T_A= 25°C

0

0.5

1

1.5

2

2.5

3

3.5

0

0.5

1

1.5

2

V_OH- High-Level Output Voltage - V

Figure 8.

Figure 9.

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Typical Characteristics - Outputs, Full Drive Strength (PxDS.y = 1)

TYPICAL LOW-LEVEL OUTPUT CURRENT

vs

LOW-LEVEL OUTPUT VOLTAGE

60

50

40

30

20

10

0

25

20

15

10

5

V_CC= 3.0 V

P4.3

T_A= 25°C

T_A= 85°C

V_CC= 1.8 V

_DD= 5.5 V

V

P4.3

T_A= 25°C

T_A= 85°C

0

0.5

1

1.5

2

2.5

3

3.5

0

0.5

1

1.5

2

V_OL- Low-Level Output Voltage - V

Figure 10.

Figure 11.

TYPICAL HIGH-LEVEL OUTPUT CURRENT

vs

HIGH-LEVEL OUTPUT VOLTAGE

0

V_CC= 3.0 V

P4.3

V_CC= 1.8 V

V

P4.3_DD

= 5.5 V

-10

-20

-30

-40

-50

-60

-5

-10

-15

-20

-25

T_A= 85°C

T_A= 25°C

T_A= 85°C

T_A= 25°C

1.5

0

0.5

1

2

2.5

3

3.5

0

0.5

1

1.5

2

V_OH- High-Level Output Voltage - V

Figure 12.

Figure 13.

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MAX UNIT

Crystal Oscillator, XT1, Low-Frequency Mode⁽¹⁾

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

f_OSC= 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 1,

T_A= 25°C

0.075

Differential XT1 oscillator crystal

f_OSC= 32768 Hz, XTS = 0,

ΔI_DVCC.LF

current consumption from lowest XT1BYPASS = 0, XT1DRIVEx = 2,

3.0 V

0.170

µA

drive setting, LF mode

T_A= 25°C

f_OSC= 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 3,

T_A= 25°C

0.290

XT1 oscillator crystal frequency,

LF mode

f_XT1,LF0

XTS = 0, XT1BYPASS = 0

32768

Hz

XT1 oscillator logic-level

square-wave input frequency,

LF mode

f_XT1,LF,SW

XTS = 0, XT1BYPASS = 1^{(2) (3)}

10 32.768

210

50 kHz

XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 0,

f_XT1,LF= 32768 Hz, C_L,eff= 6 pF

Oscillation allowance for

LF crystals⁽⁴⁾

OA_LF

kΩ

XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 1,

f_XT1,LF= 32768 Hz, C_L,eff= 12 pF

300

XTS = 0, XCAPx = 0⁽⁶⁾

XTS = 0, XCAPx = 1

XTS = 0, XCAPx = 2

XTS = 0, XCAPx = 3

2

5.5

Integrated effective load

capacitance, LF mode⁽⁵⁾

C_L,eff

pF

8.5

12.0

XTS = 0, Measured at ACLK,

f_XT1,LF= 32768 Hz

Duty cycle LF mode

30

10

70

%

Oscillator fault frequency,

f_Fault,LF

XTS = 0⁽⁸⁾

10000

Hz

LF mode⁽⁷⁾

f_OSC= 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 0,

T_A= 25°C,

1000

500

C_L,eff= 6 pF

t_START,LF

Startup time, LF mode

3.0 V

ms

f_OSC= 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 3,

T_A= 25°C,

C_L,eff= 12 pF

(1) To improve EMI on the XT1 oscillator, the following guidelines should be observed.

(a) Keep the trace between the device and the crystal as short as possible.

(b) Design a good ground plane around the oscillator pins.

(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.

(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.

(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.

(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.

(2) When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in

the Schmitt-trigger Inputs section of this datasheet.

(3) Maximum frequency of operation of the entire device cannot be exceeded.

(4) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the

XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following

guidelines, but should be evaluated based on the actual crystal selected for the application:

(a) For XT1DRIVEx = 0, C_L,eff≤ 6 pF

(b) For XT1DRIVEx = 1, 6 pF ≤ C_L,eff≤ 9 pF

(c) For XT1DRIVEx = 2, 6 pF ≤ C_L,eff≤ 10 pF

(d) For XT1DRIVEx = 3, C_L,eff≥ 6 pF

(5) Includes parasitic bond and package capacitance (approximately 2 pF per pin).

Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a

correct setup, the effective load capacitance should always match the specification of the used crystal.

(6) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.

(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.

Frequencies in between might set the flag.

(8) Measured with logic-level input frequency but also applies to operation with crystals.

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Internal Very-Low-Power Low-Frequency Oscillator (VLO)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

VLO frequency

VLO frequency temperature drift

TEST CONDITIONS

V_CC

MIN

TYP

9.4

0.5

4

MAX UNIT

14 kHz

%/°C

f_VLO

Measured at ACLK

1.8 V to 3.6 V

6

df_VLO/d_T

Measured at ACLK⁽¹⁾

Measured at ACLK⁽²⁾

Measured at ACLK

df_VLO/dV_CCVLO frequency supply voltage drift

Duty cycle

%/V

40

50

60

%

(1) Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))

(2) Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)

Internal Reference, Low-Frequency Oscillator (REFO)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

3

MAX UNIT

I_REFO

f_REFO

REFO oscillator current consumption T_A= 25°C

1.8 V to 3.6 V

3 V

µA

Hz

REFO frequency calibrated

Measured at ACLK

32768

Full temperature range

±3.5

±1.5

%

REFO absolute tolerance calibrated

REFO frequency temperature drift

REFO frequency supply voltage drift Measured at ACLK⁽²⁾

T_A= 25°C

Measured at ACLK⁽¹⁾

df_REFO/d_T

df_REFO/dV_CC

Duty cycle

t_START

1.8 V to 3.6 V

0.01

1.0

50

%/°C

%/V

%

Measured at ACLK

40

60

REFO startup time

40%/60% duty cycle

25

µs

(1) Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C – (–40°C))

(2) Calculated using the box method: (MAX(1.8 to 3.6 V) – MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V – 1.8 V)

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DCO Frequency

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

DCORSELx = 0, DCOx = 0, MODx = 0

DCORSELx = 0, DCOx = 31, MODx = 0

DCORSELx = 1, DCOx = 0, MODx = 0

DCORSELx = 1, DCOx = 31, MODx = 0

DCORSELx = 2, DCOx = 0, MODx = 0

DCORSELx = 2, DCOx = 31, MODx = 0

DCORSELx = 3, DCOx = 0, MODx = 0

DCORSELx = 3, DCOx = 31, MODx = 0

DCORSELx = 4, DCOx = 0, MODx = 0

DCORSELx = 4, DCOx = 31, MODx = 0

DCORSELx = 5, DCOx = 0, MODx = 0

DCORSELx = 5, DCOx = 31, MODx = 0

DCORSELx = 6, DCOx = 0, MODx = 0

DCORSELx = 6, DCOx = 31, MODx = 0

DCORSELx = 7, DCOx = 0, MODx = 0

DCORSELx = 7, DCOx = 31, MODx = 0

MIN

0.07

0.70

0.15

1.47

0.32

3.17

0.64

6.07

1.3

TYP

MAX UNIT

0.20 MHz

1.70 MHz

0.36 MHz

3.45 MHz

0.75 MHz

7.38 MHz

1.51 MHz

14.0 MHz

3.2 MHz

f_DCO(0,0)

f_DCO(0,31)

f_DCO(1,0)

f_DCO(1,31)

f_DCO(2,0)

f_DCO(2,31)

f_DCO(3,0)

f_DCO(3,31)

f_DCO(4,0)

f_DCO(4,31)

f_DCO(5,0)

f_DCO(5,31)

f_DCO(6,0)

f_DCO(6,31)

f_DCO(7,0)

f_DCO(7,31)

DCO frequency (0, 0)

DCO frequency (0, 31)

DCO frequency (1, 0)

DCO frequency (1, 31)

DCO frequency (2, 0)

DCO frequency (2, 31)

DCO frequency (3, 0)

DCO frequency (3, 31)

DCO frequency (4, 0)

DCO frequency (4, 31)

DCO frequency (5, 0)

DCO frequency (5, 31)

DCO frequency (6, 0)

DCO frequency (6, 31)

DCO frequency (7, 0)

DCO frequency (7, 31)

12.3

2.5

28.2 MHz

6.0 MHz

23.7

4.6

54.1 MHz

10.7 MHz

88.0 MHz

19.6 MHz

135 MHz

39.0

8.5

60

Frequency step between range

DCORSEL and DCORSEL + 1

S_DCORSEL

S_DCO

S_RSEL= f_{DCO(DCORSEL+1,DCO)}/f_{DCO(DCORSEL,DCO)}

1.2

2.3 ratio

Frequency step between tap

DCO and DCO + 1

S_DCO= f_{DCO(DCORSEL,DCO+1)}/f_{DCO(DCORSEL,DCO)}

1.02

40

1.12 ratio

Duty cycle

df_DCO/dT

Measured at SMCLK

DCO frequency temperature drift f_DCO= 1 MHz

50

0.1

1.9

60

%

%/°C

%/V

df_DCO/dV_CC

DCO frequency voltage drift

f_DCO= 1 MHz

Typical DCO Frequency, V_CC= 3.0 V,T_A= 25°C

100

10

DCOx = 31

1

DCOx = 0

0.1

0

1

2

3

4

5

6

7

DCORSEL

Figure 14. Typical DCO frequency

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PMM, Brown-Out Reset (BOR)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

| dDV_CC/d_t| < 3 V/s

MIN

TYP

MAX UNIT

BOR_Hon voltage,

DV_CCfalling level

V(DV_CC_BOR_IT–)

V(DV_CC_BOR_IT+)

1.45

V

BOR_Hoff voltage,

DV_CCrising level

0.80

60

1.30

1.50

250

V

V(DV_CC_BOR_hys) BOR_Hhysteresis

Pulse length required at

mV

t_RESET

RST/NMI pin to accept a

reset

2

µs

PMM, Core Voltage

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Core voltage, active

mode, PMMCOREV = 3

V_CORE3(AM)

V_CORE2(AM)

V_CORE1(AM)

V_CORE0(AM)

V_CORE3(LPM)

V_CORE2(LPM)

V_CORE1(LPM)

V_CORE0(LPM)

2.4 V ≤ DV_CC≤ 3.6 V

1.90

V

Core voltage, active

mode, PMMCOREV = 2

2.2 V ≤ DV_CC≤ 3.6 V

2.0 V ≤ DV_CC≤ 3.6 V

1.8 V ≤ DV_CC≤ 3.6 V

2.4 V ≤ DV_CC≤ 3.6 V

2.2 V ≤ DV_CC≤ 3.6 V

2.0 V ≤ DV_CC≤ 3.6 V

1.8 V ≤ DV_CC≤ 3.6 V

1.80

1.60

1.40

1.94

1.84

1.64

1.44

V

Core voltage, active

mode, PMMCOREV = 1

Core voltage, active

mode, PMMCOREV = 0

Core voltage, low-current

mode, PMMCOREV = 3

Core voltage, low-current

mode, PMMCOREV = 2

Core voltage, low-current

mode, PMMCOREV = 1

Core voltage, low-current

mode, PMMCOREV = 0

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PMM, SVS High Side

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

SVSHE = 0, DV_CC= 3.6 V

MIN

TYP

0

MAX UNIT

nA

I_(SVSH)

SVS current consumption

SVSHE = 1, DV_CC= 3.6 V, SVSHFP = 0

SVSHE = 1, DV_CC= 3.6 V, SVSHFP = 1

SVSHE = 1, SVSHRVL = 0

200

1.5

µA

1.53

1.73

1.93

2.03

1.60

1.80

2.00

2.10

2.25

2.52

2.85

1.60

1.80

2.00

2.10

1.70

1.90

2.10

2.20

2.35

2.65

3.00

1.67

SVSHE = 1, SVSHRVL = 1

1.87

V

V_{(SVSH_IT–)}

SVS_Hon voltage level⁽¹⁾

SVSHE = 1, SVSHRVL = 2

2.07

SVSHE = 1, SVSHRVL = 3

2.17

1.80

2.00

2.20

SVSHE = 1, SVSMHRRL = 0

SVSHE = 1, SVSMHRRL = 1

SVSHE = 1, SVSMHRRL = 2

SVSHE = 1, SVSMHRRL = 3

SVSHE = 1, SVSMHRRL = 4

SVSHE = 1, SVSMHRRL = 5

SVSHE = 1, SVSMHRRL = 6

SVSHE = 1, SVSMHRRL = 7

2.30

V

V_{(SVSH_IT+)}

SVS_Hoff voltage level⁽¹⁾

2.50

2.78

3.15

SVSHE = 1, dV_DVCC/dt = 10 mV/µs,

SVSHFP = 1

2.5

20

t_pd(SVSH)

SVS_Hpropagation delay

µs

SVSHE = 1, dV_DVCC/dt = 1 mV/µs,

SVSHFP = 0

SVSHE = 0 → 1, dV_DVCC/dt = 10 mV/µs,

SVSHFP = 1

12.5

100

t_(SVSH)

SVS_Hon/off delay time

DV_CCrise time

SVSHE = 0 → 1, dV_DVCC/dt = 1 mV/µs,

SVSHFP = 0

dV_DVCC/dt

0

1000

V/s

(1) The SVS_Hsettings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage

Supervisor chapter in the CC430 Family User's Guide (SLAU259) on recommended settings and usage.

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PMM, SVM High Side

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

SVMHE = 0, DV_CC= 3.6 V

MIN

TYP

0

MAX UNIT

nA

I_(SVMH)

SVM_Hcurrent consumption

SVMHE= 1, DV_CC= 3.6 V, SVMHFP = 0

SVMHE = 1, DV_CC= 3.6 V, SVMHFP = 1

SVMHE = 1, SVSMHRRL = 0

SVMHE = 1, SVSMHRRL = 1

SVMHE = 1, SVSMHRRL = 2

SVMHE = 1, SVSMHRRL = 3

SVMHE = 1, SVSMHRRL = 4

SVMHE = 1, SVSMHRRL = 5

SVMHE = 1, SVSMHRRL = 6

SVMHE = 1, SVSMHRRL = 7

SVMHE = 1, SVMHOVPE = 1

200

1.5

nA

µA

1.60

1.80

2.00

2.10

2.25

2.52

2.85

1.70

1.90

2.10

2.20

2.35

2.65

3.00

3.75

1.80

2.00

2.20

2.30

V_(SVMH)

SVM_Hon/off voltage level⁽¹⁾

2.50

2.78

3.15

V

SVMHE = 1, dV_DVCC/dt = 10 mV/µs,

SVMHFP = 1

2.5

20

t_pd(SVMH)

SVM_Hpropagation delay

SVM_Hon/off delay time

µs

SVMHE = 1, dV_DVCC/dt = 1 mV/µs,

SVMHFP = 0

SVMHE = 0 → 1, dV_DVCC/dt = 10 mV/µs,

SVMHFP = 1

12.5

100

t_(SVMH)

SVMHE = 0 → 1, dV_DVCC/dt = 1 mV/µs,

SVMHFP = 0

(1) The SVM_Hsettings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage

Supervisor chapter in the CC430 Family User's Guide (SLAU259) on recommended settings and usage.

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PMM, SVS Low Side

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

SVSLE = 0, PMMCOREV = 2

MIN

TYP

0

MAX UNIT

nA

µA

I_(SVSL)

SVS_Lcurrent consumption

SVSLE = 1, PMMCOREV = 2, SVSLFP = 0

SVSLE = 1, PMMCOREV = 2, SVSLFP = 1

200

1.5

SVSLE = 1, dV_CORE/dt = 10 mV/µs,

SVSLFP = 1

2.5

20

t_pd(SVSL)

SVS_Lpropagation delay

SVS_Lon/off delay time

µs

SVSLE = 1, dV_CORE/dt = 1 mV/µs,

SVSLFP = 0

SVSLE = 0 → 1, dV_CORE/dt = 10 mV/µs,

SVSLFP = 1

12.5

100

t_(SVSL)

SVSLE = 0 → 1, dV_CORE/dt = 1 mV/µs,

SVSLFP = 0

PMM, SVM Low Side

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

SVMLE = 0, PMMCOREV = 2

MIN

TYP

0

MAX UNIT

nA

µA

I_(SVML)

SVM_Lcurrent consumption

SVMLE= 1, PMMCOREV = 2, SVMLFP = 0

SVMLE= 1, PMMCOREV = 2, SVMLFP = 1

200

1.5

SVMLE = 1, dV_CORE/dt = 10 mV/µs,

SVMLFP = 1

2.5

20

t_pd(SVML)

SVM_Lpropagation delay

SVM_Lon/off delay time

µs

SVMLE = 1, dV_CORE/dt = 1 mV/µs,

SVMLFP = 0

SVMLE = 0 → 1, dV_CORE/dt = 10 mV/µs,

SVMLFP = 1

12.5

100

t_(SVML)

SVMLE = 0 → 1, dV_CORE/dt = 1 mV/µs,

SVMLFP = 0

Wake-up from Low Power Modes and Reset

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN TYP MAX UNIT

Wake-up time from

LPM2, LPM3, or LPM4

to active mode⁽¹⁾

PMMCOREV = SVSMLRRL = n, where n = 0,

1, 2, or 3

SVSLFP = 1

f

_MCLK≥ 4.0 MHz

5

t_WAKE-UP-

FAST

µs

f_MCLK< 4.0 MHz

6

Wake-up time from

LPM2, LPM3 or LPM4 to

active mode⁽²⁾

t_WAKE-UP-

SLOW

PMMCOREV = SVSMLRRL = n, where n = 0, 1, 2, or 3

SVSLFP = 0

150 165 µs

Wake-up time from RST

or BOR event to active

mode⁽³⁾

t_WAKE-UP-

RESET

2

3

ms

(1) This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance

mode of the low side supervisor (SVS_L) and low side monitor (SVM_L). Fastest wakeup times are possible with SVS_Land SVM_Lin full

performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVS_Land SVM_Lwhile

operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the CC430 Family

User's Guide (SLAU259).

(2) This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance

mode of the low side supervisor (SVS_L) and low side monitor (SVM_L). In this case, the SVS_Land SVM_Lare in normal mode (low current)

mode when operating in AM, LPM0, and LPM1. Various options are available for SVS_Land SVM_Lwhile operating in LPM2, LPM3, and

LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the CC430 Family User's Guide (SLAU259).

(3) This value represents the time from the wakeup event to the reset vector execution.

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Timer_A

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

Internal: SMCLK, ACLK

External: TACLK

Duty cycle = 50% ± 10%

1.8 V/

3.0 V

f_TA

Timer_A input clock frequency

25 MHz

All capture inputs.

Minimum pulse width required for

capture.

1.8 V/

3.0 V

t_TA,cap

Timer_A capture timing

20

ns

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USCI (UART Mode) Recommended Operating Conditions

PARAMETER

CONDITIONS

V_CC

MIN

TYP

MAX UNIT

Internal: SMCLK, ACLK

External: UCLK

f_USCI

USCI input clock frequency

f_SYSTEMMHz

Duty cycle = 50% ± 10%

BITCLK clock frequency

(equals baud rate in MBaud)

f_BITCLK

1

MHz

USCI (UART Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

2.2 V

3 V

MIN

50

TYP

MAX UNIT

600

ns

t_t

UART receive deglitch time⁽¹⁾

50

600

(1) Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are

correctly recognized their width should exceed the maximum specification of the deglitch time.

USCI (SPI Master Mode) Recommended Operating Conditions

PARAMETER

CONDITIONS

V_CC

MIN

TYP

MAX UNIT

Internal: SMCLK, ACLK

Duty cycle = 50% ± 10%

f_USCI

USCI input clock frequency

f_SYSTEMMHz

USCI (SPI Master Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

(see Note ⁽¹⁾, Figure 15 and Figure 16)

PMMCOR

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

EVx

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

55

38

30

25

0

ns

t_SU,MI

SOMI input data setup time

3

0

3

0

3

0

3

ns

0

t_HD,MI

SOMI input data hold time

SIMO output data valid time⁽²⁾

SIMO output data hold time⁽³⁾

0

20

ns

18

UCLK edge to SIMO valid,

C_L= 20 pF

t_VALID,MO

16

ns

15

-10

-8

ns

t_HD,MO

C_L= 20 pF

-10

-8

(1) f_UCxCLK= 1/2t_LO/HIwith t_LO/HI≥ max(t_{VALID,MO(USCI)}+ t_SU,SI(Slave), t_SU,MI(USCI)+ t_{VALID,SO(Slave)}).

For the slave's parameters t_SU,SI(Slave)and t_{VALID,SO(Slave)}see the SPI parameters of the attached slave.

(2) Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams

in Figure 15 and Figure 16.

(3) Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data

on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in

Figure 15 and Figure 16.

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1/f_UCxCLK

CKPL = 0

CKPL = 1

UCLK

t_LO/HI

t_SU,MI

t_HD,MI

SOMI

t_HD,MO

t_VALID,MO

SIMO

Figure 15. SPI Master Mode, CKPH = 0

1/f_UCxCLK

CKPL = 0

CKPL = 1

UCLK

t_LO/HI

t_HD,MI

t_SU,MI

SOMI

t_HD,MO

t_VALID,MO

SIMO

Figure 16. SPI Master Mode, CKPH = 1

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USCI (SPI Slave Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

(see Note ⁽¹⁾, Figure 17 and Figure 18)

PMMCOR

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

EVx

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

1.8 V

3.0 V

2.4 V

3.0 V

11

8

0

ns

t_STE,LEAD

t_STE,LAG

t_STE,ACC

t_STE,DIS

t_SU,SI

STE lead time, STE low to clock

7

3

0

3

0

3

0

3

0

3

0

3

0

3

0

3

6

3

ns

3

STE lag time, Last clock to STE

high

3

66

ns

50

STE access time, STE low to

SOMI data out

36

30

ns

23

STE disable time, STE high to

SOMI high impedance

16

13

5

2

5

ns

SIMO input data setup time

SIMO input data hold time

SOMI output data valid time⁽²⁾

SOMI output data hold time⁽³⁾

t_HD,SI

76

ns

60

UCLK edge to SOMI valid,

C_L= 20 pF

t_VALID,SO

44

ns

40

18

12

10

8

ns

t_HD,SO

C_L= 20 pF

(1) f_UCxCLK= 1/2t_LO/HIwith t_LO/HI≥ max(t_{VALID,MO(Master)}+ t_SU,SI(USCI), t_{SU,MI(Master)}+ t_{VALID,SO(USCI)}).

For the master's parameters t_{SU,MI(Master)}and t_{VALID,MO(Master)}see the SPI parameters of the attached master.

(2) Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams

in Figure 15 and Figure 16.

(3) Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 15

and Figure 16.

60

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t_STE,LEAD

t_STE,LAG

STE

1/f_UCxCLK

CKPL = 0

CKPL = 1

UCLK

t_SU,SI

t_LO/HI

t_HD,SI

SIMO

t_HD,SO

t_VALID,SO

t_STE,ACC

t_STE,DIS

SOMI

Figure 17. SPI Slave Mode, CKPH = 0

t_STE,LEAD

t_STE,LAG

STE

1/f_UCxCLK

CKPL = 0

CKPL = 1

UCLK

t_LO/HI

t_HD,SI

t_SU,SI

SIMO

t_HD,MO

t_VALID,SO

t_STE,ACC

t_STE,DIS

SOMI

Figure 18. SPI Slave Mode, CKPH = 1

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USCI (I2C Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 19)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

Internal: SMCLK, ACLK

External: UCLK

f_USCI

USCI input clock frequency

f_SYSTEMMHz

Duty cycle = 50% ± 10%

f_SCL

SCL clock frequency

2.2 V/3 V

0

4.0

0.6

4.7

0.6

0

400 kHz

µs

f

_SCL≤ 100 kHz

f_SCL> 100 kHz

_SCL≤ 100 kHz

f_SCL> 100 kHz

t_HD,STA

Hold time (repeated) START

f

t_SU,STA

Setup time for a repeated START

2.2 V/3 V

µs

t_HD,DAT

t_SU,DAT

Data hold time

Data setup time

2.2 V/3 V

ns

250

4.0

0.6

50

f_SCL≤ 100 kHz

t_SU,STO

Setup time for STOP

2.2 V/3 V

µs

f_SCL> 100 kHz

2.2 V

3 V

600

ns

t_SP

Pulse width of spikes suppressed by input filter

50

600

t_HD,STA

t_SU,STA

t_HD,STA

t_BUF

SDA

SCL

t_LOW

t_HIGH

t_SP

t_SU,DAT

t_SU,STO

t_HD,DAT

Figure 19. I2C Mode Timing

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LCD_B Recommended Operating Conditions

PARAMETER

Supply voltage range,

charge pump enabled,

_LCD≤3.6V

CONDITIONS

MIN

NOM

MAX

UNIT

LCDCPEN=1, 0000 < VLCDx ≤ 1111 (charge

pump enabled, V_LCD≤3.6V)

V_{CC,LCD_B,CP en,3.6}

V_{CC,LCD_B,CP en,3.3}

V_{CC,LCD_B,int. bias}

V_{CC,LCD_B,ext. bias}

2.2

3.6

V

Supply voltage range,

charge pump enabled,

LCDCPEN=1, 0000 < VLCDx ≤ 1100 (charge

pump enabled, V_LCD≤3.3V)

2.0

2.4

3.6

V

V_LCD≤3.3V

Supply voltage range,

internal biasing,

charge pump disabled

LCDCPEN=0, VLCDEXT=0

Supply voltage range,

external biasing,

charge pump disabled

Supply voltage range,

external LCD voltage,

internal or external

biasing, charge pump

disabled

V_{CC,LCD_B,VLCDEXT}

LCDCPEN=0, VLCDEXT=1

2.0

3.6

V

External LCD voltage

at LCDCAP/R33,

internal or external

biasing, charge pump

disabled

V_LCDCAP/R33

2.4

4.7

Capacitor on LCDCAP

when charge pump

enabled

LCDCPEN=1, VLCDx > 0000 (charge pump

enabled)

C_LCDCAP

4.7

32

10

µF

Hz

LCD frame frequency f_LCD= 2 × mux × f_FRAMEwith mux= 1 (static),

range

f_Frame

0

100

2, 3, 4.

ACLK input frequency

range

f_ACLK,in

C_Panel

V_R33

30

40

10000

kHz

pF

V

Panel capacitance

100Hz frame frequency

Analog input voltage

at R33

LCDCPEN=0, VLCDEXT=1

2.4

V_CC+0.2

V_R03

V_R132/3*(V_R33

-V_R03

+

Analog input voltage

at R23

V_R23,1/3bias

LCDREXT=1, LCDEXTBIAS=1, LCD2B=0

V_R33

V_R23

V_R33

V

)

Analog input voltage

at R13 with 1/3

biasing

V_R03

V_R031/3*(V_R33

-V_R03

+

V_R13,1/3bias

)

Analog input voltage

at R13 with 1/2

biasing

V_R03

V_R031/2*(V_R33

-V_R03

+

V_R13,1/2bias

LCDREXT=1, LCDEXTBIAS=1, LCD2B=1

R0EXT=1

V

)

Analog input voltage

at R03

V_R03

V_SS

Voltage difference

between V_LCDand

R03

V_LCD-V_R03

LCDCPEN=0, R0EXT=1

2.4

V_CC+0.2

1.5

External LCD

reference voltage

applied at

V_LCDREF/R13

VLCDREFx = 01

0.8

1.2

V

LCDREF/R13

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LCD_B Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX

UNIT

V_LCD

LCD voltage

VLCDx=0000, VLCDEXT=0

2.4 V to

3.6 V

V_CC

V

LCDCPEN=1, VLCDx=0001

LCDCPEN=1, VLCDx=0010

LCDCPEN=1, VLCDx=0011

LCDCPEN=1, VLCDx=0100

LCDCPEN=1, VLCDx=0101

LCDCPEN=1, VLCDx=0110

LCDCPEN=1, VLCDx=0111

LCDCPEN=1, VLCDx=1000

LCDCPEN=1, VLCDx=1001

LCDCPEN=1, VLCDx=1010

LCDCPEN=1, VLCDx=1011

LCDCPEN=1, VLCDx=1100

LCDCPEN=1, VLCDx=1101

LCDCPEN=1, VLCDx=1110

LCDCPEN=1, VLCDx=1111

2.0 V to

3.6 V

2.54

2.60

2.66

2.72

2.78

2.84

2.90

2.96

3.02

3.08

3.14

3.20

3.26

3.32

3.38

200

V

2.0 V to

3.6 V

2.0 V to

3.6 V

V

2.0 V to

3.6 V

V

2.0 V to

3.6 V

V

2.0 V to

3.6 V

V

2.0 V to

3.6 V

V

2.0 V to

3.6 V

V

2.0 V to

3.6 V

V

2.0 V to

3.6 V

V

2.0 V to

3.6 V

V

2.0 V to

3.6 V

V

2.2 V to

3.6 V

V

2.2 V to

3.6 V

V

2.2 V to

3.6 V

3.6

V

I_CC,Peak,CPPeak supply currents due to

charge pump activities

2.2V

µA

ms

t_LCD,CP,on

Time to charge C_LCDwhen

discharge

C_LCDCAP=4.7µF, LCDCPEN=0→1,

VLCDx=1111

2.2V

100

500

I_CP,Load

Max. charge pump load current

LCDCPEN=1, VLCDx=1111

2.2V

50

µA

R_LCD,Seg

LCD driver output impedance,

segment lines

LCDCPEN=1, VLCDx=1000,

I_LOAD=±10µA

10

kΩ

R_LCD,COM

LCD driver output impedance,

common lines

LCDCPEN=1, VLCDx=1000,

I_LOAD=±10µA

2.2V

kΩ

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12-Bit ADC, Power Supply and Input Range Conditions

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

V_CC

MIN

2.2

0

TYP

MAX UNIT

AV_CCand DV_CCare connected together,

AV_SSand DV_SSare connected together,

V_(AVSS)= V_(DVSS)= 0 V

Analog supply voltage

Full performance

AV_CC

3.6

V

V_(Ax)

Analog input voltage range⁽²⁾All ADC12 analog input pins Ax

AV_CC

155

f_ADC12CLK= 5.0 MHz, ADC12ON = 1,

Operating supply current into

2.2 V

3 V

125

150

I_{ADC12_A}

REFON = 0, SHT0 = 0, SHT1 = 0,

AV_CCterminal⁽³⁾

µA

220

ADC12DIV = 0

Only one terminal Ax can be selected at one

C_I

R_I

Input capacitance

time

2.2 V

20

25

pF

Input MUX ON resistance

0 V ≤ V_Ax≤ AV_CC

10

200

1900

Ω

(1) The leakage current is specified by the digital I/O input leakage.

(2) The analog input voltage range must be within the selected reference voltage range V_R+to V_R–for valid conversion results. If the

reference voltage is supplied by an external source or if the internal reference voltage is used and REFOUT = 1, then decoupling

capacitors are required. See REF, External Reference and REF, Built-In Reference.

(3) The internal reference supply current is not included in current consumption parameter I_{ADC12_A}

.

12-Bit ADC, Timing Parameters

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

For specified performance of ADC12 linearity

parameters

f_ADC12CLK

f_ADC12OSC

2.2 V/3 V

0.45

4.8

5.4 MHz

Internal ADC12

oscillator⁽¹⁾

ADC12DIV = 0, f_ADC12CLK= f_ADC12OSC

2.2 V/3 V

4.2

2.4

4.8

5.4 MHz

REFON = 0, Internal oscillator,

f_ADC12OSC= 4.2 MHz to 5.4 MHz

3.1

µs

t_CONVERT

Conversion time

External f_ADC12CLKfrom ACLK, MCLK or SMCLK,

(2)

ADC12SSEL ≠ 0

R_S= 400 Ω, R_I= 1000 Ω, C_I= 30 pF,

t = [R_S+ R_I] × C_I

t_Sample

Sampling time

2.2 V/3 V

1000

ns

(3)

(1) The ADC12OSC is sourced directly from MODOSC inside the UCS.

(2) 13 × ADC12DIV × 1/f_ADC12CLK

(3) Approximately ten Tau (t) are needed to get an error of less than ±0.5 LSB:

t_Sample= ln(2ⁿ⁺¹) x (R_S+ R_I) × C_I+ 800 ns, where n = ADC resolution = 12, R_S= external source resistance

12-Bit ADC, Linearity Parameters

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

1.4 V ≤ (V_eREF+– V_REF–/V_eREF–)min ≤ 1.6 V

1.6 V < (V_eREF+– V_REF–/V_eREF–)min ≤ V_AVCC

(V_eREF+– V_REF–/V_eREF–)min ≤ (V_eREF+– V_REF–/V_eREF–),

±2

LSB

±1.7

Integral

linearity error (INL)

E_I

2.2 V/3 V

Differential

E_D

E_O

E_G

E_T

2.2 V/3 V

±1.0 LSB

±2.0 LSB

±3.5 LSB

linearity error (DNL) C_VREF+= 20 pF

(V_eREF+– V_REF–/V_eREF–)min ≤ (V_eREF+– V_REF–/V_eREF–),

Internal impedance of source R_S< 100 Ω, C_VREF+= 20 pF

Offset error

Gain error

±1.0

±1.4

(V_eREF+– V_REF–/V_eREF–)min ≤ (V_eREF+– V_REF–/V_eREF–),

C_VREF+= 20 pF

Total unadjusted

error

(V_eREF+– V_REF–/V_eREF–)min ≤ (V_eREF+– V_REF–/V_eREF–),

C_VREF+= 20 pF

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(1)

12-Bit ADC, Temperature Sensor and Built-In V_MID

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

2.2 V

3 V

MIN

TYP

680

2.25

MAX UNIT

ADC12ON = 1, INCH = 0Ah,

T_A= 0°C

(2) (3)

V_SENSOR

See

mV

2.2 V

3 V

(3)

TC_SENSOR

See

ADC12ON = 1, INCH = 0Ah

mV/°C

2.2 V

3 V

30

Sample time required if

channel 10 is selected⁽⁴⁾

ADC12ON = 1, INCH = 0Ah,

Error of conversion result ≤ 1 LSB

t_{SENSOR(sample)}

µs

AV_CCdivider at channel 11,

V_AVCCfactor

ADC12ON = 1, INCH = 0Bh

0.48

0.5

0.52 V_AVCC

V_MID

2.2 V

3 V

1.06

1.44

1.1

1.5

1.14

V

AV_CCdivider at channel 11

1.56

Sample time required if

channel 11 is selected⁽⁵⁾

ADC12ON = 1, INCH = 0Bh,

Error of conversion result ≤ 1 LSB

t_VMID(sample)

2.2 V/3 V

1000

ns

(1) The temperature sensor is provided by the REF module. See the REF module parametric, I_REF+, regarding the current consumption of

the temperature sensor.

(2) The temperature sensor offset can be as much as ±20°C. A single-point calibration is recommended in order to minimize the offset error

of the built-in temperature sensor.

(3) The device descriptor structure contains calibration values for 30°C ± 3°C and 85°C ± 3°C for each of the available reference voltage

levels. The sensor voltage can be computed as V_SENSE= TC_SENSOR* (Temperature, °C) + V_SENSOR, where TC_SENSORand V_SENSORcan

be computed from the calibration values for higher accuracy.

(4) The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time t_SENSOR(on)

.

(5) The on-time t_VMID(on)is included in the sampling time t_VMID(sample); no additional on time is needed.

1000

950

900

850

800

750

700

650

600

550

500

-40 -30 -20 -10

0 10 20 30 40 50 60 70 80

Ambient Temperature - ˚C

Figure 20. Typical Temperature Sensor Voltage

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REF, External Reference

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

V_CC

MIN

1.4

0

TYP

MAX UNIT

(2)

V_eREF+

Positive external reference voltage input

V_eREF+> V_REF–/V_eREF–

AV_CC

1.2

V

(3)

V_REF–/V_eREF–

Negative external reference voltage input V_eREF+> V_REF–/V_eREF–

(V_eREF+

V_REF–/V_eREF–

–

Differential external reference voltage

V_eREF+> V_REF–/V_eREF–

input

(4)

1.4

AV_CC

V

)

1.4 V ≤ V_eREF+≤ V_AVCC

V_eREF–= 0 V

,

f_ADC12CLK= 5

MHz,ADC12SHTx = 1h,

Conversion rate 200ksps

2.2 V/3 V

±8.5

±26

µA

I_VeREF+

I_{VREF–/VeREF–}

Static input current

1.4 V ≤ V_eREF+≤ V_AVCC

V_eREF–= 0 V

f_ADC12CLK= 5

MHz,ADC12SHTx = 8h,

Conversion rate 20ksps

,

±1

µA

µF

C_VREF+/-

Capacitance at V_REF+/-terminal

⁽⁵⁾10

(1) The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, C_i, is also

the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the

recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.

(2) The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced

accuracy requirements.

(3) The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced

accuracy requirements.

(4) The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with

reduced accuracy requirements.

(5) Two decoupling capacitors, 10µF and 100nF, should be connected to VREF to decouple the dynamic current required for an external

reference source if it is used for the ADC12_A. See also the CC430 Family User's Guide (SLAU259).

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MAX UNIT

REF, Built-In Reference

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

REFVSEL = 2 for 2.5 V

REFON = REFOUT = 1

I_VREF+= 0 A

3 V

2.41 ±1.5%

1.93 ±1.5%

1.45 ±1.5%

REFVSEL = 1 for 2.0 V

REFON = REFOUT = 1

I_VREF+= 0 A

Positive built-in reference

voltage output

V_REF+

3 V

V

REFVSEL = 0 for 1.5 V

REFON = REFOUT = 1

I_VREF+= 0 A

2.2 V/ 3 V

REFVSEL = 0 for 1.5 V, reduced performance

REFVSEL = 0 for 1.5 V

1.8

2.2

2.3

2.8

AV_CCminimum voltage,

Positive built-in reference

active

AV_CC(min)

REFVSEL = 1 for 2.0 V

REFVSEL = 2 for 2.5 V

REFON = 1, REFOUT = 0, REFBURST = 0

REFON = 1, REFOUT = 1, REFBURST = 0

3 V

100

0.9

140

1.5

µA

Operating supply current into

AV_CCterminal^{(2) (3)}

I_REF+

mA

REFVSEL = 0, 1, 2

Load-current regulation,

V_REF+terminal⁽⁴⁾

I_VREF+= +10 µA/–1000 µA

AV_CC= AV_{CC (min)}for each reference level.

REFVSEL = 0, 1, 2; REFON = REFOUT = 1

I_L(VREF+)

2500 µV/mA

Capacitance at VREF+/-

terminals

C_VREF+/-

REFON = REFOUT = 1⁽⁵⁾

20

100

50

pF

I_VREF+= 0 A

REFVSEL = 0, 1, 2;

REFON = 1, REFOUT = 0 or 1

Temperature coefficient of

built-in reference⁽⁶⁾

ppm/

°C

TC_REF+

30

AV_CC= AV_{CC (min)}- AV_CC(max)

T_A= 25 °C

REFVSEL = 0, 1, 2;

Power supply rejection ratio

(DC)

PSRR_DC

PSRR_AC

120

300 µV/V

mV/V

REFON = 1, REFOUT = 0 or 1

AV_CC= AV_{CC (min)}- AV_CC(max)

T_A= 25 °C

f = 1 kHz, ΔVpp = 100 mV

REFVSEL = 0, 1, 2;

Power supply rejection ratio

(AC)

6.4

REFON = 1, REFOUT = 0 or 1

AV_CC= AV_{CC (min)}- AV_CC(max)

REFVSEL = 0, 1, 2;

REFOUT = 0, REFON = 0 → 1

75

Settling time of reference

voltage⁽⁷⁾

t_SETTLE

µs

AV_CC= AV_{CC (min)}- AV_CC(max)

C_VREF= C_VREF(max)

REFVSEL = 0, 1, 2;

REFOUT = 1, REFON = 0 → 1

(1) The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers, one

smaller and one larger for driving the V_REF+terminal. When REFOUT = 1, the reference is available at the V_REF+terminal, as well as,

used as the reference for the conversion and utilizes the larger buffer. When REFOUT = 0, the reference is only used as the reference

for the conversion and utilizes the smaller buffer.

(2) The internal reference current is supplied via terminal AV_CC. Consumption is independent of the ADC12ON control bit, unless a

conversion is active. The REFON bit enables to settle the built-in reference before starting an A/D conversion. REFOUT = 0 represents

the current contribution of the smaller buffer. REFOUT = 1 represents the current contribution of the larger buffer without external load.

(3) The temperature sensor is provided by the REF module. Its current is supplied via terminal AV_CCand is equivalent to I_REF+with REFON

=1 and REFOUT = 0.

(4) Contribution only due to the reference and buffer including package. This does not include resistance due to PCB trace, etc.

(5) Two decoupling capacitors, 10µF and 100nF, should be connected to VREF to decouple the dynamic current required for an external

reference source if it is used for the ADC12_A.

(6) Calculated using the box method: (MAX(-40 to 85°C) – MIN(-40 to 85°C)) / MIN(-40 to 85°C)/(85°C – (–40°C)).

(7) The condition is that the error in a conversion started after t_REFONis less than ±0.5 LSB. The settling time depends on the external

capacitive load when REFOUT = 1.

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Comparator B

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

V_CC

Supply voltage

1.8

3.6

40

50

65

30

0.5

V

1.8 V

2.2 V

CBPWRMD = 00

30

40

Comparator operating supply

current into AV_CC, Excludes

reference resistor ladder

I_{AVCC_COMP}

3.0 V

µA

CBPWRMD = 01

CBPWRMD = 10

2.2/3.0 V

10

0.1

Quiescent current of local

reference voltage amplifier into

AV_CC

I_{AVCC_REF}

CBREFACC = 1, CBREFLx = 01

22

µA

V_IC

Common mode input range

0

V_CC-1

±20

V

CBPWRMD = 00

mV

pF

kΩ

MΩ

ns

V_OFFSET

C_IN

Input offset voltage

CBPWRMD = 01, 10

±10

Input capacitance

5

3

ON - switch closed

4

R_SIN

Series input resistance

OFF - switch opened

CBPWRMD = 00, CBF = 0

30

450

600

50

t_PD

Propagation delay, response time CBPWRMD = 01, CBF = 0

CBPWRMD = 10, CBF = 0

ns

µs

CBPWRMD = 00, CBON = 1,

CBF = 1, CBFDLY = 00

0.35

0.6

1.0

1.8

0.6

1.0

1.8

3.4

1.0

1.8

3.4

6.5

µs

CBPWRMD = 00, CBON = 1,

CBF = 1, CBFDLY = 01

Propagation delay with filter

active

t_PD,filter

CBPWRMD = 00, CBON = 1,

CBF = 1, CBFDLY = 10

CBPWRMD = 00, CBON = 1,

CBF = 1, CBFDLY = 11

Comparator enable time, settling CBON = 0 to CBON = 1,

t_{EN_CMP}

t_{EN_REF}

V_{CB_REF}

1

2

µs

V

time

CBPWRMD = 00, 01, 10

Resistor reference enable time

CBON = 0 to CBON = 1

0.3

1.5

VIN = reference into resistor ladder,

n = 0 to 31

Reference voltage for a given tap

VIN × (n+1) / 32

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MAX UNIT

Flash Memory

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

TEST

CONDITIONS

PARAMETER

MIN

TYP

DV_{CC(PGM/ERASE)}Program and erase supply voltage

1.8

3.6

5

V

mA

I_PGM

Average supply current from DV_CCduring program

3

I_ERASE

Average supply current from DV_CCduring erase

Average supply current from DV_CCduring mass erase or bank erase

Cumulative program time⁽¹⁾

2

mA

I_MERASE, I_BANK

t_CPT

2

mA

16

ms

Program/erase endurance

10⁴

100

64

10⁵

cycles

years

µs

t_Retention

t_Word

Data retention duration

Word or byte program time⁽²⁾

Block program time for first byte or word⁽²⁾

T_J= 25°C

85

65

t_{Block, 0}

49

µs

Block program time for each additional byte or word, except for last

byte or word⁽²⁾

Block program time for last byte or word⁽²⁾

t_{Block, 1–(N–1)}

t_{Block, N}

37

55

23

49

73

32

µs

Erase time for segment erase, mass erase, and bank erase when

available⁽²⁾

t_Erase

ms

MCLK frequency in marginal read mode

(FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1)

f_MCLK,MGR

0

1

MHz

(1) The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming

methods: individual word/byte write and block write modes.

(2) These values are hardwired into the flash controller's state machine.

JTAG and Spy-Bi-Wire Interface

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

TEST

CONDITIONS

PARAMETER

MIN

TYP

MAX UNIT

f_SBW

Spy-Bi-Wire input frequency

2.2 V/3 V

0

20 MHz

t_SBW,Low

Spy-Bi-Wire low clock pulse length

2.2 V/3 V

0.025

15

µs

Spy-Bi-Wire enable time (TEST high to acceptance of first clock

edge)⁽¹⁾

t_{SBW, En}

t_SBW,Rst

2.2 V/3 V

1

µs

Spy-Bi-Wire return to normal operation time

TCK input frequency - 4-wire JTAG⁽²⁾

Internal pull-down resistance on TEST

15

0

100

5

µs

2.2 V

3 V

MHz

f_TCK

0

10 MHz

80 kΩ

R_internal

2.2 V/3 V

45

60

(1) Tools accessing the Spy-Bi-Wire interface need to wait for the minimum t_SBW,Entime after pulling the TEST/SBWTCK pin high before

applying the first SBWTCK clock edge.

(2) f_TCKmay be restricted to meet the timing requirements of the module selected.

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RF1A CC1101-Based Radio Parameters

Recommended Operating Conditions

PARAMETER

TEST CONDITIONS

MIN

2.0

TYP

MAX UNIT

V_CC

Supply voltage range during radio operation

3.6

3

V

PMMCOREVx

Core voltage range, PMMCOREVx setting during radio operation

2

300

389⁽¹⁾

779

0.6

348

RF frequency range

Data rate

464 MHz

928

2-FSK

500

2-GFSK, OOK, and ASK

(Shaped) MSK (also known as differential offset QPSK)⁽²⁾

0.6

250 kBaud

500

26

RF crystal frequency

RF crystal tolerance

26

27 MHz

ppm

Total tolerance including initial tolerance, crystal loading, aging and

temperature dependency.⁽³⁾

±40

RF crystal load capacitance

10

13

20

pF

RF crystal effective series

resistance

100

Ω

(1) If using a 27-MHz crystal, the lower frequency limit for this band is 392 MHz.

(2) If using optional Manchester encoding, the data rate in kbps is half the baud rate.

(3) The acceptable crystal tolerance depends on frequency band, channel bandwidth, and spacing. Also see Design Note DN005 -- CC11xx

Sensitivity versus Frequency Offset and Crystal Accuracy, literature number SWRA122.

RF Crystal Oscillator, XT2

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

PARAMETER

Start-up time⁽²⁾

Duty cycle

TEST CONDITIONS

MIN

TYP

150

50

MAX

810

55

UNIT

µs

45

%

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) The start-up time depends to a very large degree on the used crystal.

Current Consumption, Reduced-Power Modes

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

RF crystal oscillator only (e.g. SLEEP state with MCSM0.OSC_FORCE_ON = 1)

IDLE state (incl. RF crystal oscillator)

MIN

TYP

100

1.7

MAX

UNIT

µA

Current

consumption

mA

FSTXON state (Only the frequency synthesizer is running)⁽²⁾

9.5

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) This current consumption is also representative of other intermediate states when going from IDLE to RX or TX, including the calibration

state.

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Current Consumption, Receive Mode

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

(2)

DATA

RATE

(kBaud)

FREQ

(MHz)

PARAMETER

TEST CONDITIONS

Input at -100 dBm (close to

MIN

TYP

MAX UNIT

17

16

sensitivity limit)

1.2

38.4

250

1.2

Input at -40 dBm (well above

sensitivity limit)

Input at -100 dBm (close to

sensitivity limit)

17

Register settings

optimized for reduced

current

315

Input at -40 dBm (well above

sensitivity limit)

16

Input at -100 dBm (close to

sensitivity limit)

18

Input at -40 dBm (well above

sensitivity limit)

16.5

18

Input at -100 dBm (close to

sensitivity limit)

Input at -40 dBm (well above

sensitivity limit)

17

Input at -100 dBm (close to

sensitivity limit)

18

Current

consumption,

RX

Register settings

optimized for reduced

current

433

38.4

250

1.2

mA

Input at -40 dBm (well above

sensitivity limit)

17

Input at -100 dBm (close to

sensitivity limit)

18.5

17

Input at -40 dBm (well above

sensitivity limit)

Input at -100 dBm (close to

sensitivity limit)

16

Input at -40 dBm (well above

sensitivity limit)

15

Input at -100 dBm (close to

sensitivity limit)

16

Register settings

optimized for reduced

current⁽³⁾

868, 915

38.4

250

Input at -40 dBm (well above

sensitivity limit)

15

Input at -100 dBm (close to

sensitivity limit)

16

Input at -40 dBm (well above

sensitivity limit)

15

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) Reduced current setting (MDMCFG2.DEM_DCFILT_OFF = 1) gives a slightly lower current consumption at the cost of a reduction in

sensitivity. See tables "RF Receive" for additional details on current consumption and sensitivity.

(3) For 868/915 MHz, see Figure 21 for current consumption with register settings optimized for sensitivity.

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19

18

17

16

T_A= 85°C

T_A= 25°C

T_A= -40°C

T_A= 85°C

T_A= 25°C

T_A= -40°C

18

17

16

-100

-80

-60

-40

-20

-100

-80

-60

-40

-20

Input Power [dBm]

1.2 kBaud GFSK

38.4 kBaud GFSK

19

18

17

16

19

18

17

T_A= 85°C

T_A= 25°C

T_A= -40°C

T_A= 25°C

T_A= -40°C

16

-100

-80

-60

-40

-20

-100

-80

-60

-40

-20

Input Power [dBm]

250 kBaud GFSK

500 kBaud MSK

Figure 21. Typical RX Current Consumption Over Temperature and Input Power Level, 868 MHz,

Sensitivity-Optimized Setting

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MAX UNIT

Current Consumption, Transmit Mode

(2)

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

FREQUENCY

[MHz}

PATABLE

Setting

OUTPUT

POWER [dBm]

PARAMETER

MIN

TYP

0xC0

0xC4

0x51

0x29

0xC0

0xC6

0x50

0x2D

0xC0

0xC3

0x8D

0x2D

0xC0

0xC3

0x8D

0x2D

max.

+10

0

26

25

15

33

29

17

36

33

18

35

32

18

mA

315

433

868

915

-6

max.

+10

0

-6

Current consumption, TX

max.

+10

0

-6

max.

+10

0

-6

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) Reduced current setting (MDMCFG2.DEM_DCFILT_OFF = 1) gives a slightly lower current consumption at the cost of a reduction in

sensitivity. See tables "RF Receive" for additional details on current consumption and sensitivity.

74

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Typical TX Current Consumption, 315 MHz

Output V_CC

Power

[dBm]

2.0 V

3.0 V

25°C

3.6 V

PATABLE

Setting

PARAMETER

UNIT

T_A

25°C

0xC0

0xC4

0x51

0x29

max.

+10

0

27.5

25.1

14.4

14.2

26.4

25.2

14.6

14.7

28.1

Current

consumption,

TX

25.3

mA

14.7

-6

15.0

Typical TX Current Consumption, 433 MHz

Output V_CC

Power

[dBm]

2.0 V

3.0 V

25°C

3.6 V

PATABLE

Setting

PARAMETER

UNIT

T_A

25°C

0xC0

0xC6

0x50

0x2D

max.

+10

0

33.1

28.6

16.6

16.8

33.4

28.8

16.8

17.5

33.8

Current

consumption,

TX

28.8

mA

16.9

-6

17.8

Typical TX Current Consumption, 868 MHz

Output V_CC

Power

[dBm]

2.0 V

3.0 V

25°C

3.6 V

UNIT

PATABLE

Setting

PARAMETER

T_A

-40°C

25°C

85°C

-40°C

85°C

-40°C

25°C

85°C

0xC0

0xC3

0x8D

0x2D

max.

+10

0

36.7

34.0

18.0

17.1

35.2

32.8

17.6

17.0

34.2

32.0

17.5

17.2

38.5

34.2

18.3

17.8

35.5

33.0

17.8

34.9

32.5

18.1

18.3

37.1

34.3

18.4

18.2

35.7

33.1

18.0

18.1

34.7

32.2

17.7

18.1

Current

consumption,

TX

mA

-6

Typical TX Current Consumption, 915 MHz

Output V_CC

Power

[dBm]

2.0 V

3.0 V

25°C

3.6 V

25°C

PATABLE

Setting

PARAMETER

UNIT

T_A

-40°C

25°C

85°C

-40°C

85°C

-40°C

85°C

0xC0

0xC3

0x8D

0x2D

max.

+10

0

35.5

33.2

17.8

17.0

33.8

32.0

17.4

16.9

33.2

31.0

17.1

16.9

36.2

33.4

18.1

17.7

34.8

32.1

17.6

33.6

31.2

17.3

17.6

36.3

33.5

18.2

18.1

35.0

32.3

17.8

18.0

33.8

31.3

17.5

18.0

Current

consumption,

TX

mA

-6

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RF Receive, Overall

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Digital channel filter bandwidth⁽²⁾

58

812 kHz

25 MHz to 1 GHz

Spurious emissions^{(3) (4)}

-68

-66

9

-57

dBm

-47

Above 1 GHz

RX latency

Serial operation⁽⁵⁾

bit

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) User programmable. The bandwidth limits are proportional to crystal frequency (given values assume a 26.0 MHz crystal)

(3) Typical radiated spurious emission is -49 dBm measured at the VCO frequency

(4) Maximum figure is the ETSI EN 300 220 limit

(5) Time from start of reception until data is available on the receiver data output pin is equal to 9 bit.

RF Receive, 315 MHz

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

2-FSK, 1% packet error rate, 20-byte packet length, Sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF = 0 (unless

otherwise noted)

DATA RATE

(kBaud)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

0.6

14.3kHz deviation, 58kHz digital channel filter bandwidth

5.2kHz deviation, 58kHz digital channel filter bandwidth⁽²⁾

20kHz deviation, 100kHz digital channel filter bandwidth⁽³⁾

-117

-111

-103

-95

1.2

Receiver sensitivity

38.4

250

dBm

(4)

127kHz deviation, 540kHz digital channel filter bandwidth

MSK, 812kHz digital channel filter bandwidth⁽⁴⁾

500

-86

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then

reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -109dBm.

(3) Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then

reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -102dBm.

(4) MDMCFG2.DEM_DCFILT_OFF=1 can not be used for data rates ≥ 250kBaud.

RF Receive, 433 MHz

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

2-FSK, 1% packet error rate, 20-byte packet length, Sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF = 0 (unless

otherwise noted)

DATA RATE

(kBaud)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

0.6

14.3kHz deviation, 58kHz digital channel filter bandwidth

5.2-kHz deviation, 58-kHz digital channel filter bandwidth⁽²⁾

20-kHz deviation, 100-kHz digital channel filter bandwidth⁽³⁾

-114

-111

-104

1.2

38.4

Receiver sensitivity

dBm

127-kHz deviation, 540-kHz digital channel filter bandwidth

250

500

-93

-85

(4)

MSK, 812kHz digital channel filter bandwidth⁽⁴⁾

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then

reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -109dBm.

(3) Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then

reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -101dBm.

(4) MDMCFG2.DEM_DCFILT_OFF=1 can not be used for data rates ≥ 250kBaud.

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RF Receive, 868/915 MHz

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

1% packet error rate, 20-byte packet length, Sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF = 0 (unless otherwise

noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

0.6-kBaud data rate, 2-FSK, 14.3-kHz deviation, 58-kHz digital channel filter bandwidth (unless otherwise noted)

Receiver sensitivity

-115

dBm

1.2-kBaud data rate, 2-FSK, 5.2-kHz deviation, 58-kHz digital channel filter bandwidth (unless otherwise noted)

-109

Receiver sensitivity⁽²⁾

dBm

2-GFSK modulation by setting MDMCFG2.MOD_FORMAT=2,

Gaussian filter with BT = 0.5

Saturation

FIFOTHR.CLOSE_IN_RX=0⁽³⁾

-28

39

dBm

dB

-100-kHz offset

+100-kHz offset

Adjacent channel

rejection

Desired channel 3 dB above the sensitivity limit,

100 kHz channel spacing⁽⁴⁾

IF frequency 152 kHz, desired channel 3 dB above

the sensitivity limit

Image channel rejection

Blocking

29

dB

±2 MHz offset

±10 MHz offset

-48

-40

dBm

Desired channel 3 dB above the sensitivity limit⁽⁵⁾

38.4-kBaud data rate, 2-FSK, 20-kHz deviation, 100-kHz digital channel filter bandwidth (unless otherwise noted)

Receiver sensitivity⁽⁶⁾

-102

dBm

2-GFSK modulation by setting MDMCFG2.MOD_FORMAT = 2,

Gaussian filter with BT = 0.5

-101

Saturation

FIFOTHR.CLOSE_IN_RX=0⁽³⁾

-19

20

dBm

dB

Adjacent channel

rejection

Desired channel 3 dB above the sensitivity limit,

200 kHz channel spacing⁽⁵⁾

-200-kHz offset

+200-kHz offset

25

Image channel rejection IF frequency 152 kHz, Desired channel 3 dB above the sensitivity limit

23

dB

Blocking

Desired channel 3 dB above the sensitivity limit⁽⁵⁾

±2-MHz offset

±10-MHz offset

-48

-40

dBm

250-kBaud data rate, 2-FSK, 127-kHz deviation, 540-kHz digital channel filter bandwidth (unless otherwise noted)

(7)

Receiver sensitivity

-90

dBm

2-GFSK modulation by setting MDMCFG2.MOD_FORMAT = 2,

Gaussian filter with BT = 0.5

-90

Saturation

FIFOTHR.CLOSE_IN_RX=0⁽³⁾

-19

24

dBm

dB

Adjacent channel

rejection

Desired channel 3 dB above the sensitivity limit,

750-kHz channel spacing⁽⁸⁾

-750-kHz offset

+750-kHz offset

30

Image channel rejection IF frequency 304 kHz, Desired channel 3 dB above the sensitivity limit

18

dB

Blocking

Desired channel 3 dB above the sensitivity limit⁽⁸⁾

±2-MHz offset

±10-MHz offset

-53

-39

dBm

500-kBaud data rate, MSK, 812-kHz digital channel filter bandwidth (unless otherwise noted)

Receiver sensitivity⁽⁷⁾

-84

-2

dBm

dB

Image channel rejection IF frequency 355 kHz, Desired channel 3 dB above the sensitivity limit

Blocking

Desired channel 3 dB above the sensitivity limit⁽⁹⁾

±2-MHz offset

±10-MHz offset

-53

-38

dBm

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then

reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -107dBm

(3) See Design Note DN010 Close-in Reception with CC1101, literature number SWRA147.

(4) See Figure 22 for blocking performance at other offset frequencies.

(5) See Figure 23 for blocking performance at other offset frequencies.

(6) Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then

reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -100dBm.

(7) MDMCFG2.DEM_DCFILT_OFF = 1 cannot be used for data rates ≥ 250kBaud.

(8) See Figure 24 for blocking performance at other offset frequencies.

(9) See Figure 25 for blocking performance at other offset frequencies.

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80

70

60

50

40

30

20

10

0

60

50

40

30

20

10

0

-10

-20

-10

-40 -30

-20 -10

0

10

20

30

40

-1 -0.8 -0.6 -0.4 -0.2

0

0.2 0.4 0.6 0.8

1

Offset [MHz]

NOTE: 868.3 MHz, 2-FSK, 5.2-kHz deviation, IF frequency is 152.3 kHz, digital channel filter bandwidth is 58 kHz

Figure 22. Typical Selectivity at 1.2-kBaud Data Rate

80

70

60

50

40

30

20

10

0

50

40

30

20

10

0

-10

-20

-10

-20

-40 -30

-20 -10

0

10

20

30

40

-1 -0.8 -0.6 -0.4 -0.2

0

0.2 0.4 0.6 0.8

1

Offset [MHz]

NOTE: 868 MHz, 2-FSK, 20 kHz deviation, IF frequency is 152.3 kHz, digital channel filter bandwidth is 100 kHz

Figure 23. Typical Selectivity at 38.4-kBaud Data Rate

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80

70

60

50

40

30

20

10

0

50

40

30

20

10

0

-10

-20

-10

-20

-40 -30

-20 -10

Offset [MHz]

NOTE: 868 MHz, 2-FSK, IF frequency is 304 kHz, digital channel filter bandwidth is 540 kHz

0

10

20

30

40

-3

-2

-1

0

1

2

3

Offset [MHz]

Figure 24. Typical Selectivity at 250-kBaud Data Rate

80

70

60

50

40

30

20

10

0

50

40

30

20

10

0

-10

-20

-10

-20

-40 -30

-20 -10

Offset [MHz]

NOTE: 868 MHz, 2-FSK, IF frequency is 355 kHz, digital channel filter bandwidth is 812 kHz

0

10

20

30

40

-3

-2

-1

0

1

2

3

Offset [MHz]

Figure 25. Typical Selectivity at 500-kBaud Data Rate

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UNIT

Typical Sensitivity, 315 MHz, Sensitivity Optimized Setting

V_CC

2.0 V

3.0 V

3.6 V

PARAMETER

DATA RATE (kBaud)

T_A

-40°C 25°C 85°C -40°C 25°C 85°C -40°C 25°C 85°C

1.2

38.4

250

-112

-105

-95

-112

-105

-95

-110

-104

-92

-112

-105

-94

-111

-103

-95

-109

-102

-92

-112

-105

-95

-111

-104

-94

-108

-102

-91

Sensitivity,

315MHz

dBm

Typical Sensitivity, 433 MHz, Sensitivity Optimized Setting

V_CC

T_A

2.0 V

3.0 V

3.6 V

PARAMETER

DATA RATE (kBaud)

UNIT

-40°C 25°C 85°C -40°C 25°C 85°C -40°C 25°C 85°C

1.2

38.4

250

-111

-104

-93

-110

-104

-94

-108

-101

-91

-111

-104

-93

-111

-104

-93

-108

-101

-90

-111

-104

-93

-110

-103

-93

-107

-101

-90

Sensitivity,

433MHz

dBm

Typical Sensitivity, 868 MHz, Sensitivity Optimized Setting

V_CC

2.0 V

3.0 V

3.6 V

PARAMETER

DATA RATE (kBaud)

UNIT

T_A

-40°C 25°C 85°C -40°C 25°C 85°C -40°C 25°C 85°C

1.2

38.4

250

500

-109

-102

-90

-109

-102

-90

-107

-100

-88

-109

-102

-89

-109

-102

-90

-106

-99

-87

-80

-109

-102

-89

-108

-101

-90

-106

-99

-87

-80

Sensitivity,

868MHz

dBm

-84

-81

-84

Typical Sensitivity, 915 MHz, Sensitivity Optimized Setting

V_CC

2.0 V

3.0 V

3.6 V

PARAMETER

DATA RATE (kBaud)

UNIT

T_A

-40°C 25°C 85°C -40°C 25°C 85°C -40°C 25°C 85°C

1.2

38.4

250

500

-109

-102

-92

-109

-102

-92

-107

-100

-89

-109

-102

-92

-109

-102

-92

-106

-99

-88

-81

-109

-103

-92

-108

-102

-92

-105

-99

-88

-80

Sensitivity,

915MHz

dBm

-87

-86

-81

-86

-85

80

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RF Transmit

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

P_TX= +10 dBm (unless otherwise noted)

FREQUENCY

PARAMETER

(MHz)

TEST CONDITIONS

MIN

TYP

MAX UNIT

315

122 + j31

116 + j41

86.5 + j43

+12

Differential load

433

Ω

impedance⁽²⁾

868/915

315

433

868

915

+13

Output power, highest

setting⁽³⁾

Delivered to a 50Ω single-ended load via CC430

reference design's RF matching network

dBm

+11

Output power, lowest

setting⁽³⁾

Delivered to a 50Ω single-ended load via CC430

reference design's RF matching network

-30

Second harmonic

Third harmonic

-56

-57

433

868

915

315

433

868

915

315

Second harmonic

Third harmonic

-50

Harmonics,

dBm

radiated^(4)(5)(6)

-52

Second harmonic

Third harmonic

-50

-54

Frequencies below 960 MHz

< -38

< -48

-45

+10 dBm CW

Frequencies above 960 MHz

Frequencies below 1 GHz

Frequencies above 1 GHz

Second harmonic

+10 dBm CW

+11 dBm CW⁽⁷⁾

+10 dBm CW

< -48

-59

Harmonics, conducted

dBm

Other harmonics

< -71

-53

Second harmonic

Other harmonics

< -47

< -58

< -53

< -54

Frequencies below 960 MHz

Frequencies above 960 MHz

Frequencies below 1 GHz

Frequencies above 1 GHz

433

+10 dBm CW

Frequencies within 47 to 74, 87.5 to

118, 174 to 230, 470 to 862 MHz

< -63

Spurious emissions,

conducted, harmonics

not included⁽⁸⁾

dBm

Frequencies below 1 GHz

Frequencies above 1 GHz

< -46

< -59

868

915

+10 dBm CW

+11 dBm CW

Frequencies within 47 to 74, 87.5 to

118, 174 to 230, 470 to 862 MHz

< -56

Frequencies below 960 MHz

Frequencies above 960 MHz

< -49

< -63

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) Differential impedance as seen from the RF-port (RF_P and RF_N) towards the antenna. Follow the CC430 reference designs available

from the TI website.

(3) Output power is programmable, and full range is available in all frequency bands. Output power may be restricted by regulatory limits.

See also Application Note AN050 Using the CC1101 in the European 868MHz SRD Band, literature number SWRA146 and Design

Note DN013 Programming Output Power on CC1101, literature number SWRA168, which gives the output power and harmonics when

using multi-layer inductors. The output power is then typically +10 dBm when operating at 868/915 MHz.

(4) The antennas used during the radiated measurements (SMAFF-433 from R.W.Badland and Nearson S331 868/915) play a part in

attenuating the harmonics.

(5) Measured on EM430F6137RF900 with CW, maximum output power

(6) All harmonics are below -41.2 dBm when operating in the 902 – 928 MHz band.

(7) Requirement is -20 dBc under FCC 15.247

(8) All radiated spurious emissions are within the limits of ETSI. Also see Design Note DN017 CC11xx 868/915 MHz RF Matching, literature

number SWRA168.

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RF Transmit (continued)

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

P_TX= +10 dBm (unless otherwise noted)

FREQUENCY

PARAMETER

(MHz)

TEST CONDITIONS

MIN

TYP

MAX UNIT

TX latency⁽⁹⁾

Serial operation

8

bits

(9) Time from sampling the data on the transmitter data input pin until it is observed on the RF output ports

Optimum PATABLE Settings for Various Output Power Levels and Frequency Bands

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

PATABLE Setting

Output Power [dBm]

315 MHz

0x12

433 MHz

0x05

868 MHz

0x03

915 MHz

-30

-12

-6

0x03

0x25

0x2D

0x8D

0xC3

0xC0

0x33

0x26

0x25

0x29

0x2D

0x50

0x2D

0x8D

0xC3

0xC0

0

0x51

10

0xC4

0xC0

0xC4

0xC0

max.

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

82

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Typical Output Power, 315 MHz⁽¹⁾

V_CC

T_A

2.0 V

3.0 V

3.6 V

UNIT

PARAMETER

PATABLE Setting

-40°C 25°C 85°C -40°C 25°C 85°C -40°C 25°C 85°C

0xC0 (max)

11.9

10.3

11.8

10.3

9.3

11.8

10.3

0xC4 (10dBm)

0xC6 (default)

0x51 (0dBm)

0x29 (-6dBm)

Output power,

315MHz

dBm

0.7

0.6

0.7

-6.8

-5.6

-5.3

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

Typical Output Power, 433 MHz⁽¹⁾

V_CC

T_A

2.0 V

3.0 V

3.6 V

PARAMETER

PATABLE Setting

UNIT

-40°C 25°C 85°C -40°C 25°C 85°C -40°C 25°C 85°C

0xC0 (max)

12.6

10.3

12.6

10.2

10.0

0.3

12.6

10.2

0xC4 (10dBm)

0xC6 (default)

0x50 (0dBm)

0x2D (-6dBm)

Output power,

433MHz

dBm

0.3

-6.4

-5.4

-5.1

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

Typical Output Power, 868 MHz⁽¹⁾

V_CC

T_A

2.0 V

3.0 V

3.6 V

PARAMETER

PATABLE Setting

UNIT

-40°C 25°C 85°C -40°C 25°C 85°C -40°C 25°C 85°C

0xC0 (max)

11.9

10.8

11.2

10.1

10.5

9.4

11.9

10.8

11.2

10.1

8.8

10.5

9.4

11.9

10.7

11.2

10.1

10.5

9.4

0xC3 (10dBm)

0xC6 (default)

0x8D (0dBm)

0x2D (-6dBm)

Output power,

868MHz

dBm

1.0

0.3

-0.3

-7.3

1.1

0.3

-0.3

-6.3

1.1

0.3

-0.3

-6.0

-6.5

-6.8

-5.3

-5.8

-4.9

-5.4

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

Typical Output Power, 915 MHz⁽¹⁾

V_CC

T_A

2.0 V

3.0 V

3.6 V

PARAMETER

PATABLE Setting

UNIT

-40°C 25°C 85°C -40°C 25°C 85°C -40°C 25°C 85°C

0xC0 (max)

12.2

11.0

11.4

10.3

10.6

9.5

12.1

11.0

11.4

10.3

8.8

10.7

9.5

12.1

11.0

11.4

10.3

10.7

9.6

0xC3 (10dBm)

0xC6 (default)

0x8D (0dBm)

0x2D (-6dBm)

Output power,

915MHz

dBm

1.9

1.0

0.3

1.9

1.0

0.3

1.9

1.1

0.3

-5.5

-6.0

-6.5

-4.3

-4.8

-5.5

-3.9

-4.4

-5.1

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

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CC430F612x

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Frequency Synthesizer Characteristics

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

MIN figures are given using a 27MHz crystal. TYP and MAX figures are given using a 26MHz crystal.

PARAMETER

Programmed frequency resolution⁽²⁾

Synthesizer frequency tolerance⁽³⁾

TEST CONDITIONS

26 to 27 MHz crystal

MIN

TYP

f_XOSC/2¹⁶

±40

MAX

UNIT

Hz

397

412

ppm

50 kHz offset from carrier

100 kHz offset from carrier

200 kHz offset from carrier

500 kHz offset from carrier

1 MHz offset from carrier

2 MHz offset from carrier

5 MHz offset from carrier

10 MHz offset from carrier

Crystal oscillator running

–95

–94

–98

RF carrier phase noise

dBc/Hz

–107

–112

–118

–129

88.4

PLL turn-on / hop time⁽⁴⁾

PLL RX/TX settling time⁽⁵⁾

PLL TX/RX settling time⁽⁶⁾

PLL calibration time⁽⁷⁾

85.1

9.3

88.4

9.6

µs

9.6

20.7

694

21.5

721

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

(2) The resolution (in Hz) is equal for all frequency bands.

(3) Depends on crystal used. Required accuracy (including temperature and aging) depends on frequency band and channel bandwidth /

spacing.

(4) Time from leaving the IDLE state until arriving in the RX, FSTXON or TX state, when not performing calibration.

(5) Settling time for the 1-IF frequency step from RX to TX

(6) Settling time for the 1-IF frequency step from TX to RX

(7) Calibration can be initiated manually or automatically before entering or after leaving RX/TX

84

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Typical RSSI_offset Values

T_A= 25°C, V_CC= 3 V (unless otherwise noted)⁽¹⁾

RSSI_OFFSET (dB)

DATA RATE (kBaud)

433 MHz

868 MHz

1.2

38.4

250

500

74

(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 46).

0

-20

0

-20

250kBaud

500kBaud

1.2kBaud

38.4kBaud

-40

-60

-80

-100

-120

-100

-80

-60

-40

-20

0

-120

-100

-80

-60

-40

-20

0

Input Power [dBm]

Figure 26. Typical RSSI Value vs Input Power Level for Different Data Rates at 868 MHz

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APPLICATION CIRCUIT

T C K

T E S T / S B W T C K

n R S T / N M I / S B W T D I O

D V C C

V A S S

D V C C

V A C C

For a complete reference design including layout see the CC430 Wireless Development Tools and related

documentation.

Figure 27. Typical Application Circuit CC430F61xx

86

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T M S

T C K

D V C C

T E S T / S B W T C K

n R S T / N M I / S B W T D I O

D V C C

V A S S

V A C C

For a complete reference design including layout see the CC430 Wireless Development Tools and related

documentation.

Figure 28. Typical Application Circuit CC430F51xx

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Table 46. Bill of Materials

Component(s)

C1,3,4,5,7,9,11,13,15

C8,10,12,14

for 315 MHz

for 433 MHz

100 nF

10 µF

for 868/915 MHz

Comment

Decoupling capacitors

V_COREcapacitor

C2,6,16,17,18

C19

2 pF

470 nF

RST decoupling cap

(optimized for SBW)

C20

2.2 nF

27 pF

Load capacitors for

26 MHz crystal⁽¹⁾

C21,22

R1

R2

56 kΩ

47kΩ

R_BIAS (±1% required)

RST pullup

L1,2

L3,4

L5

Capacitors: 220 pF

0.033 µH

dnp⁽²⁾

0.016 µH

0.027 µH

0.047 µH

dnp⁽²⁾

0.012 µH

0.018 µH

0.015 µH

0.0022 µH

0.015 µH

1 pF

L6

L7

0.033 µH

dnp⁽²⁾

0.051 µH

2.7 pF

C23

C24

C25

C26

C27

C28

C29

220 pF

3.9 pF

100 pF

1.5 pF

6.8 pF

3.9 pF

1.5 pF

220 pF

4.7 pF

1.5 pF

10 pF

8.2 pF

220 pF

1.5 pF

(1) The load capacitance C_Lseen by the crystal is C_L= 1/((1/C21)+(1/C22)) + C_parasitic. The parasitic capacitance C_parasiticincludes pin

capacitance and PCB stray capacitance. It can be typically estimated to be around 2.5 pF.

(2) dnp: do not populate.

88

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INPUT/OUTPUT SCHEMATICS

Port P1, P1.0 to P1.4, Input/Output With Schmitt Trigger

S18...S22

(n/a CC430F513x)

LCDS18...LCDS22

Pad Logic

P1REN.x

P1MAP.x = PMAP_ANALOG

DVSS

DVCC

0

1

P1DIR.x

0

1

Direction

0: Input

1: Output

from Port Mapping

P1OUT.x

0

1

from Port Mapping

P1.0/P1MAP0(/S18)

P1.1/P1MAP1(/S19)

P1.2/P1MAP2(/S20)

P1.3/P1MAP3(/S21)

P1.4/P1MAP4(/S22)

P1DS.x

0: Low drive

1: High drive

P1SEL.x

P1IN.x

Bus

Keeper

EN

D

to Port Mapping

P1IRQ.x

P1IE.x

EN

Set

Q

P1IFG.x

P1SEL.x

P1IES.x

Interrupt

Edge

Select

CC430F513x devices don't provide LCD functionality on port P1 pins.

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Table 47. Port P1 (P1.0 to P1.4) Pin Functions

CONTROL BITS/SIGNALS

PIN NAME (P1.x)

x

FUNCTION

LCDS19...

22⁽¹⁾

P1DIR.x

P1SEL.x

P1MAPx

P1.0/P1MAP/S18

0

P1.0 (I/O)

I: 0; O: 1

0; 1⁽²⁾

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

≤ 30⁽²⁾

= 31

X

0

1

0

1

0

1

0

1

0

1

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S18 (not available on CC430F513x)

P1.1 (I/O)

X

P1.1/P1MAP1/S19

P1.2/P1MAP2/S20

P1.3/P1MAP3/S21

P1.4/P1MAP4/S22

1

2

3

4

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S19 (not available on CC430F513x)

P1.2 (I/O)

≤ 30⁽²⁾

= 31

X

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S22 (not available on CC430F513x)

P1.3 (I/O)

≤ 30⁽²⁾

= 31

X

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S21 (not available on CC430F513x)

P1.4 (I/O)

≤ 30⁽²⁾

= 31

X

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S22 (not available on CC430F513x)

≤ 30⁽²⁾

= 31

X

(1) LCDSx not available in CC430F513x.

(2) According to mapped function - see Table 7.

90

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Port P1, P1.5 to P1.7, Input/Output With Schmitt Trigger

to LCD_B

(n/a CC430F513x)

Pad Logic

P1REN.x

P1MAP.x = PMAP_ANALOG

DVSS

DVCC

0

1

P1DIR.x

0

1

Direction

0: Input

1: Output

from Port Mapping

P1OUT.x

0

1

from Port Mapping

P1.5/P1MAP5(/R23)

P1.6/P1MAP6(/R13)

P1.7/P1MAP7(/R03)

P1DS.x

0: Low drive

1: High drive

P1SEL.x

P1IN.x

Bus

Keeper

EN

D

to Port Mapping

P1IRQ.x

P1IE.x

EN

Set

Q

P1IFG.x

P1SEL.x

P1IES.x

Interrupt

Edge

Select

CC430F513x devices don't provide LCD functionality on port P1 pins.

Table 48. Port P1 (P1.5 to P1.7) Pin Functions

CONTROL BITS/SIGNALS

PIN NAME (P1.x)

x

FUNCTION

P1DIR.x

I: 0; O: 1

P1SEL.x

P1MAPx

P1.5/P1MAP5/R23

5

P1.5 (I/O)

0

1

0

1

0

1

X

≤ 30⁽¹⁾

= 31

X

Mapped secondary digital function - see Table 7

R23⁽²⁾(not available on CC430F513x)

P1.6 (I/O)

0; 1⁽¹⁾

X

P1.6/P1MAP6/R13/

LCDREF

6

7

I: 0; O: 1

0; 1⁽¹⁾

X

Mapped secondary digital function - see Table 7

R13/LCDREF⁽²⁾(not available on CC430F513x)

P1.7 (I/O)

≤ 30⁽¹⁾

= 31

X

P1.7/P1MAP7/R03

I: 0; O: 1

0; 1⁽¹⁾

X

Mapped secondary digital function - see Table 7

R03⁽²⁾(not available on CC430F513x)

≤ 30⁽¹⁾

= 31

(1) According to mapped function - see Table 7.

(2) Setting P1SEL.x bit together with P1MAPx = PM_ANALOG disables the output driver as well as the input Schmitt trigger.

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Port P2, P2.0 to P2.3, Input/Output With Schmitt Trigger

Pad Logic

To ADC12

(n/a CC430F612x)

INCHx = x

To Comparator_B

from Comparator_B

CBPD.x

P2REN.x

P2MAP.x = PMAP_ANALOG

DVSS

DVCC

0

1

P2DIR.x

0

1

Direction

0: Input

1: Output

from Port Mapping

P2OUT.x

0

1

from Port Mapping

P2.0/P2MAP0/CB0(/A0)

P2.1/P2MAP2/CB1(/A1)

P2.2/P2MAP2/CB2(/A2)

P2.3/P2MAP3/CB3(/A3)

P2DS.x

0: Low drive

1: High drive

P2SEL.x

P2IN.x

Bus

Keeper

EN

D

to Port Mapping

P2IRQ.x

P2IE.x

EN

Set

Q

P2IFG.x

P2SEL.x

P2IES.x

Interrupt

Edge

Select

92

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CC430F613x

CC430F612x

CC430F513x

www.ti.com

SLAS554D –MAY 2009–REVISED JULY 2010

Port P2, P2.4 to P2.5, Input/Output With Schmitt Trigger

Pad Logic

to/from Reference

(n/a CC430F612x)

To ADC12

(n/a CC430F612x)

INCHx = x

To Comparator_B

from Comparator_B

CBPD.x

P2REN.x

P2MAP.x = PMAP_ANALOG

DVSS

DVCC

0

1

P2DIR.x

0

1

Direction

0: Input

1: Output

from Port Mapping

P2OUT.x

0

1

from Port Mapping

P2.4/P2MAP4/CB4(/A4/VREF-/VeREF-)

P2.5/P2MAP5/CB5(/A5/VREF+/VeRF+)

P2DS.x

0: Low drive

1: High drive

P2SEL.x

P2IN.x

Bus

Keeper

EN

D

to Port Mapping

P2IRQ.x

P2IE.x

EN

Set

Q

P2IFG.x

P2SEL.x

P2IES.x

Interrupt

Edge

Select

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CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

Port P2, P2.6 and P2.7, Input/Output With Schmitt Trigger

Pad Logic

To ADC12

(n/a CC430F513x)

INCHx = x

To Comparator_B

(n/a CC430F513x)

from Comparator_B

CBPD.x

(n/a CC430F513x)

P2REN.x

P2MAP.x = PMAP_ANALOG

DVSS

DVCC

0

1

P2DIR.x

0

1

Direction

0: Input

1: Output

from Port Mapping

P2OUT.x

0

1

from Port Mapping

P2.6/P2MAP6(/CB6/A6)

P2.7/P2MAP7(/CB7/A7)

P2DS.x

0: Low drive

1: High drive

P2SEL.x

P2IN.x

Bus

Keeper

EN

D

to Port Mapping

P2IRQ.x

P2IE.x

EN

Set

Q

P2IFG.x

P2SEL.x

P2IES.x

Interrupt

Edge

Select

CC430F513x devices don't provide analog functionality on port P2.6 and P2.7 pins.

94

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CC430F513x

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SLAS554D –MAY 2009–REVISED JULY 2010

Table 49. Port P2 (P2.0 to P2.7) Pin Functions

CONTROL BITS/SIGNALS

PIN NAME (P2.x)

x

FUNCTION

P2DIR.x

P2SEL.x

P2MAPx

X

CBPD.x

P2.0/P2MAP0/CB0

(/A0)

0

P2.0 (I/O)

Mapped secondary digital function - see Table 7

I: 0; O: 1

0; 1⁽¹⁾

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

0

X

1

0

X

1

0

X

1

0

X

1

0

X

1

0

X

1

0

≤ 30⁽¹⁾

= 31

X

A0 (not available on CC430F612x)⁽²⁾

X

CB0⁽³⁾

X

I: 0; O: 1

0; 1⁽¹⁾

X

P2.1/P2MAP1/CB1

(/A1)

1

2

3

4

5

6

P2.1 (I/O)

X

Mapped secondary digital function - see Table 7

A1 (not available on CC430F612x)⁽²⁾

≤ 30⁽¹⁾

= 31

X

CB1⁽³⁾

X

P2.2/P2MAP2/CB2

(/A2)

P2.2 (I/O)

I: 0; O: 1

0; 1⁽¹⁾

X

Mapped secondary digital function - see Table 7

A2 (not available on CC430F612x)⁽²⁾

≤ 30⁽¹⁾

= 31

X

CB2⁽³⁾

X

P2.3/P2MAP3/CB3

(/A3)

P2.3 (I/O)

I: 0; O: 1

0; 1⁽¹⁾

X

Mapped secondary digital function - see Table 7

A3 (not available on CC430F612x)⁽²⁾

≤ 30⁽¹⁾

= 31

X

CB3⁽³⁾

X

P2.4/P2MAP4/CB4

(/A4/VREF-/VeREF-)

P2.4 (I/O)

I: 0; O: 1

0; 1⁽¹⁾

X

Mapped secondary digital function - see Table 7

A4/VREF-/VeREF- (not available on CC430F612x)⁽²⁾

≤ 30⁽¹⁾

= 31

X

CB4⁽³⁾

X

P2.5/P2MAP5/CB5

(/A5/VREF+/VeREF+)

P2.5 (I/O)

I: 0; O: 1

0; 1⁽¹⁾

X

Mapped secondary digital function - see Table 7

A5/VREF+/VeREF+ (not available on CC430F612x)⁽²⁾

CB5⁽³⁾

≤ 30⁽¹⁾

= 31

X

P2.6/P2MAP6(/CB6)

(/A6)

P2.6 (I/O)

I: 0; O: 1

0; 1⁽¹⁾

X

Mapped secondary digital function - see Table 7

≤ 30⁽¹⁾

A6 (not available on CC430F612x and

CC430F513x)⁽²⁾

X

1

= 31

X

CB6 (not available on CC430F513x)⁽³⁾

X

0

1

X

1

0

P2.7/P2MAP7(/CB7)

(/A7)

7

P2.7 (I/O)

I: 0; O: 1

0; 1⁽¹⁾

Mapped secondary digital function - see Table 7

≤ 30⁽¹⁾

A7 (not available on CC430F612x and

CC430F513x)⁽²⁾

CB7 (not available on CC430F513x)⁽³⁾

X

1

= 31

X

1

X

(1) According to mapped function - see Table 7.

(2) Setting P2SEL.x bit together with P2MAPx = PM_ANALOG disables the output driver as well as the input Schmitt trigger.

(3) Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying

analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input

buffer for that pin, regardless of the state of the associated CBPD.x bit.

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CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger

S10...S17

(n/a CC430F513x)

LCDS10...LCDS17

Pad Logic

P3REN.x

P3MAP.x = PMAP_ANALOG

DVSS

DVCC

0

1

P3DIR.x

0

1

Direction

0: Input

1: Output

from Port Mapping

P3OUT.x

0

1

from Port Mapping

P3.0/P3MAP0(/S10)

P3.1/P3MAP1(/S11)

P3.2/P3MAP2(/S12)

P3.3/P3MAP3(/S13)

P3.4/P3MAP4(/S14)

P3.5/P3MAP5(/S15)

P3.6/P3MAP6(/S16)

P3.7/P3MAP7(/S17)

P3DS.x

0: Low drive

1: High drive

P3SEL.x

P3IN.x

Bus

Keeper

EN

D

to Port Mapping

CC430F513x devices don't provide LCD functionality on port P3 pins.

96

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CC430F513x

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SLAS554D –MAY 2009–REVISED JULY 2010

Table 50. Port P3 (P3.0 to P3.7) Pin Functions

CONTROL BITS/SIGNALS

LCDS10...

PIN NAME (P3.x)

x

FUNCTION

P3DIR.x

P3SEL.x

P3MAPx

17⁽¹⁾

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

P3.0/P3MAP0/S10

P3.1/P3MAP1/S11

P3.2/P3MAP7/S12

P3.3/P3MAP3/S13

P3.4/P3MAP4/S14

P3.5/P3MAP5/S15

P3.6/P3MAP6/S16

P3.7/P3MAP7/S17

0

P3.0 (I/O)

Mapped secondary digital function - see Table 7

I: 0; O: 1

0; 1⁽²⁾

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

≤ 30⁽²⁾

= 31

X

Output driver and input Schmitt trigger disabled

S10 (not available on CC430F513x)

P3.1 (I/O)

X

1

2

3

4

5

6

7

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S11 (not available on CC430F513x)

P3.2 (I/O)

≤ 30⁽²⁾

= 31

X

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S12 (not available on CC430F513x)

P3.3 (I/O)

≤ 30⁽²⁾

= 31

X

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S13 (not available on CC430F513x)

P3.4 (I/O)

≤ 30⁽²⁾

= 31

X

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S14 (not available on CC430F513x)

P3.5 (I/O)

≤ 30⁽²⁾

= 31

X

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S15 (not available on CC430F513x)

P3.6 (I/O)

≤ 30⁽²⁾

= 31

X

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S16 (not available on CC430F513x)

P3.7 (I/O)

≤ 30⁽²⁾

= 31

X

I: 0; O: 1

0; 1⁽²⁾

X

Mapped secondary digital function - see Table 7

Output driver and input Schmitt trigger disabled

S17 (not available on CC430F513x)

≤ 30⁽²⁾

= 31

X

(1) LCDSx not available in CC430F513x.

(2) According to mapped function - see Table 7.

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CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger (CC430F613x and CC430F612x only)

S2...S9

LCDS2...LCDS9

Pad Logic

P4REN.x

DVSS

DVCC

0

1

P4DIR.x

0

1

Direction

0: Input

1: Output

P4OUT.x

DVSS

0

1

P4.0/S2

P4.1/S3

P4.2/S4

P4.3/S5

P4.4/S6

P4.5/S7

P4.6/S8

P4.7/S9

P4DS.x

P4SEL.x

P4IN.x

0: Low drive

1: High drive

Bus

EN

D

Keeper

Not Used

98

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SLAS554D –MAY 2009–REVISED JULY 2010

Table 51. Port P4 (P4.0 to P4.7) Pin Functions (CC430F613x and CC430F612x only)

CONTROL BITS/SIGNALS

PIN NAME (P4.x)

x

FUNCTION

P4DIR.x

P4SEL.x

LCDS2...7

P4.0/P4MAP0/S2

P4.1/P4MAP1/S3

P4.2/P4MAP7/S4

P4.3/P4MAP3/S5

P4.4/P4MAP4/S6

P4.5/P4MAP5/S7

P4.6/P4MAP6/S8

P4.7/P4MAP7/S9

0

P4.0 (I/O)

N/A

I: 0; O: 1

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

DVSS

S2

1

X

1

2

3

4

5

6

7

P4.1 (I/O)

N/A

I: 0; O: 1

0

DVSS

S3

1

X

P4.2 (I/O)

N/A

I: 0; O: 1

0

DVSS

S4

1

X

P4.3 (I/O)

N/A

I: 0; O: 1

0

DVSS

S5

1

X

P4.4 (I/O)

N/A

I: 0; O: 1

0

DVSS

S6

1

X

P4.5 (I/O)

N/A

I: 0; O: 1

0

DVSS

S7

1

X

P4.6 (I/O)

N/A

I: 0; O: 1

0

DVSS

S8

1

X

P4.7 (I/O)

N/A

I: 0; O: 1

0

1

X

DVSS

S9

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CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

Port P5, P5.0, Input/Output With Schmitt Trigger

Pad Logic

to XT1

P5REN.0

DVSS

DVCC

0

1

P5DIR.0

0

1

P5OUT.0

0

1

Module X OUT

P5.0/XIN

P5DS.x

P5SEL.0

P5IN.0

0: Low drive

1: High drive

Bus

EN

D

Keeper

Module X IN

100

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CC430F612x

CC430F513x

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SLAS554D –MAY 2009–REVISED JULY 2010

Port P5, P5.1, Input/Output With Schmitt Trigger

Pad Logic

to XT1

P5REN.1

DVSS

DVCC

0

1

P5DIR.1

0

1

P5OUT.1

0

1

Module X OUT

P5.1/XOUT

P5DS.x

P5SEL.0

0: Low drive

1: High drive

XT1BYPASS

P5IN.1

Bus

EN

D

Keeper

Module X IN

Table 52. Port P5 (P5.0 and P5.1) Pin Functions

CONTROL BITS/SIGNALS⁽¹⁾

PIN NAME (P5.x)

x

FUNCTION

P5DIR.x

P5SEL.0

P5SEL.1

XT1BYPASS

P5.0/XIN

0

P5.0 (I/O)

I: 0; O: 1

0

1

0

1

X

0

1

X

0

1

XIN crystal mode⁽²⁾

XIN bypass mode⁽²⁾

P5.1 (I/O)

XOUT crystal mode⁽³⁾

P5.1 (I/O)⁽³⁾

X

P5.1/XOUT

1

I: 0; O: 1

X

(1) X = Don't care

(2) Setting P5SEL.0 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P5.0 is configured for crystal

mode or bypass mode.

(3) Setting P5SEL.0 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.1 can be used as

general-purpose I/O.

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CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

Port P5, P5.2 to P5.4, Input/Output With Schmitt Trigger (CC430F613x and CC430F612x only)

S0(P5.2)/S1(P5.3)/S23(P5.4)

LCDS0(P5.2)/LCDS1(P5.3)/LCDS23(P5.4)

Pad Logic

P5REN.x

DVSS

DVCC

0

1

P5DIR.x

0

1

P5OUT.x

DVSS

0

1

P5.2/S0

P5.3/S1

P5.4/S23

P5DS.x

P5SEL.x

P5IN.x

0: Low drive

1: High drive

Bus

EN

D

Keeper

Not Used

Table 53. Port P5 (P5.2 to P5.3) Pin Functions (CC430F613x and CC430F612x only)

CONTROL BITS/SIGNALS

PIN NAME (P5.x)

P5.2/S0

x

FUNCTION

P5DIR.x

P5SEL.x

LCDS0...1

2

P5.2 (I/O)

N/A

I: 0; O: 1

0

1

X

0

1

X

0

1

0

1

0

DVSS

S0

1

X

P5.3/S1

3

P5.3 (I/O)

N/A

I: 0; O: 1

0

1

X

DVSS

S1

Table 54. Port P5 (P5.4) Pin Functions (CC430F613x and CC430F612x only)

CONTROL BITS/SIGNALS

PIN NAME (P5.x)

P5.4/S23

x

FUNCTION

P5DIR.x

P5SEL.x

LCDS23

4

P5.4 (I/O)

N/A

I: 0; O: 1

0

1

X

0

1

0

1

X

DVSS

S23

102

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CC430F513x

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SLAS554D –MAY 2009–REVISED JULY 2010

Port P5, P5.5 to P5.7, Input/Output With Schmitt Trigger (CC430F613x and CC430F612x only)

S24(P5.5)/S25(P5.6)/S26(P5.7)

LCDS24(P5.5)/LCDS25(P5.6)/LCDS26(P5.7)

COM3(P5.5)/COM2(P5.6)/COM1(P5.7)

Pad Logic

P5REN.x

DVSS

DVCC

0

1

P5DIR.x

P5OUT.x

P5.5/COM3/S24

P5.6/COM2/S25

P5.7/COM1/S26

P5DS.x

P5SEL.x

P5IN.x

0: Low drive

1: High drive

Bus

Keeper

Table 55. Port P5 (P5.5 to P5.7) Pin Functions (CC430F613x and CC430F612x only)

CONTROL BITS/SIGNALS

PIN NAME (P5.x)

x

FUNCTION

P5DIR.x

P5SEL.x

LCDS24...26

P5.5/COM3/S24

5

P5.5 (I/O)

COM3⁽¹⁾

S24⁽¹⁾

I: 0; O: 1

0

1

0

1

0

1

0

X

1

0

X

1

0

X

1

X

P5.6/COM2/S25

P5.7/COM1/S26

6

7

P5.6 (I/O)

COM2⁽¹⁾

S25⁽¹⁾

I: 0; O: 1

X

P5.7 (I/O)

COM1⁽¹⁾

S26⁽¹⁾

I: 0; O: 1

X

(1) Setting P5SEL.x bit disables the output driver as well as the input Schmitt trigger.

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CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output

Pad Logic

PJREN.0

0

1

DVSS

DVCC

1

PJDIR.0

DVCC

0

1

PJOUT.0

0

1

From JTAG

PJ.0/TDO

PJDS.0

From JTAG

PJIN.0

0: Low drive

1: High drive

Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output

Pad Logic

PJREN.x

0

1

DVSS

DVCC

1

PJDIR.x

DVSS

0

1

PJOUT.x

0

1

From JTAG

PJ.1/TDI/TCLK

PJ.2/TMS

PJDS.x

From JTAG

PJIN.x

0: Low drive

1: High drive

PJ.3/TCK

EN

D

To JTAG

104

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CC430F612x

CC430F513x

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SLAS554D –MAY 2009–REVISED JULY 2010

Table 56. Port PJ (PJ.0 to PJ.3) Pin Functions

CONTROL BITS/

SIGNALS⁽¹⁾

PIN NAME (PJ.x)

x

FUNCTION

PJDIR.x

PJ.0/TDO

0

PJ.0 (I/O)⁽²⁾

I: 0; O: 1

TDO⁽³⁾

X

PJ.1/TDI/TCLK

PJ.2/TMS

1

2

3

PJ.1 (I/O)⁽²⁾

TDI/TCLK^{(3) (4)}

PJ.2 (I/O)⁽²⁾

TMS^{(3) (4)}

PJ.3 (I/O)⁽²⁾

TCK^{(3) (4)}

I: 0; O: 1

X

I: 0; O: 1

X

PJ.3/TCK

I: 0; O: 1

X

(1) X = Don't care

(2) Default condition

(3) The pin direction is controlled by the JTAG module.

(4) In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care.

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CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

Device Descriptor Structures

Table 57 lists the content of the device descriptor tag-length-value (TLV) structure for CC430F613x and

CC430F613x device types.

Table 58 lists the content of the device descriptor tag-length-value (TLV) structure for CC430F612x device types.

Table 57. Device Descriptor Table

'F6137

Value

06h

'F6135

Value

06h

'F5137

Value

06h

'F5135

Value

06h

'F5133

Value

06h

Size

bytes

Description

Address

Info Block

Info length

CRC length

CRC value

Device ID

01A00h

01A01h

01A02h

01A04h

01A05h

1

2

1

4

2

06h

per unit

61h

per unit

61h

per unit

51h

per unit

51h

per unit

51h

37h

35h

37h

35h

33h

Hardware revision 01A06h

Firmware revision 01A07h

10h

Die Record

Die Record Tag

01A08h

08h

Die Record length 01A09h

0Ah

Lot/Wafer ID

Die X position

Die Y position

Test results

01A0Ah

01A0Eh

01A10h

01A12h

per unit

ADC12

Calibration

ADC12 Calibration

Tag

01A14h

01A15h

1

11h

10h

11h

10h

11h

10h

11h

10h

11h

10h

ADC12 Calibration

length

ADC Gain Factor

ADC Offset

01A16h

01A18h

2

per unit

ADC 1.5V

Reference

Temp. Sensor

30°C

01A1Ah

01A1Ch

01A1Eh

01A20h

01A22h

01A24h

2

per unit

ADC 1.5V

Reference

Temp. Sensor

85°C

ADC 2.0V

Reference

Temp. Sensor

30°C

ADC 2.0V

Reference

Temp. Sensor

85°C

ADC 2.5V

Reference

Temp. Sensor

30°C

ADC 2.5V

Reference

Temp. Sensor

85°C

REF

Calibration

REF Calibration

Tag

01A26h

01A27h

1

12h

06h

12h

06h

12h

06h

12h

06h

12h

06h

REF Calibration

length

106

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ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

www.ti.com

SLAS554D –MAY 2009–REVISED JULY 2010

Table 57. Device Descriptor Table (continued)

'F6137

Value

'F6135

Value

'F5137

Value

'F5135

Value

'F5133

Value

Size

bytes

Description

Address

1.5V Reference

Factor

01A28h

01A2Ah

01A2Ch

01A2Eh

01A2Fh

01A30h

2

1

per unit

02h

per unit

02h

per unit

02h

per unit

02h

per unit

02h

2.0V Reference

Factor

2.5V Reference

Factor

Peripheral

Descriptor

(PD)

Peripheral

Descriptor Tag

Peripheral

Descriptor Length

57h

55h

Peripheral

Descriptors

PD

Length

...

Table 58. Device Descriptor Table CC430F612x

'F6127

Value

06h

'F6126

'F6125

Size

bytes

Description

Address

Value

06h

Value

06h

Info Block

Info length

CRC length

01A00h

01A01h

01A02h

01A04h

01A05h

01A06h

01A07h

01A08h

01A09h

01A0Ah

01A0Eh

01A10h

01A12h

01A14h

01A15h

01A16h

01A26h

01A27h

01A28h

01A2Ah

01A2Ch

01A2Eh

1

2

1

4

2

1

16

1

2

1

06h

CRC value

per unit

61h

per unit

61h

per unit

61h

Device ID

27h

26h

25h

Hardware revision

Firmware revision

Die Record Tag

Die Record length

Lot/Wafer ID

Die X position

Die Y position

Test results

10h

Die Record

08h

0Ah

per unit

05h

per unit

05h

per unit

05h

Empty Descriptor

REF Calibration

Empty Tag

Empty Tag Length

10h

undefined

12h

undefined

12h

undefined

12h

REF Calibration Tag

REF Calibration length

1.5V Reference Factor

2.0V Reference Factor

2.5V Reference Factor

Peripheral Descriptor Tag

06h

per unit

02h

per unit

02h

per unit

02h

Peripheral

Descriptor (PD)

Peripheral Descriptor

Length

01A2Fh

01A30h

1

55h

...

55h

...

55h

...

Peripheral Descriptors

PD Length

Submit Documentation Feedback

107

ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

SLAS554D –MAY 2009–REVISED JULY 2010

www.ti.com

REVISION HISTORY

REVISION

SLAS554

DESCRIPTION

Product Preview data sheet release

SLAS554A

SLAS554B

SLAS554C

Product Preview data sheet updated with electrical parameters

Production Data release data sheet for CC430F51xx devices. CC430F61xx devices are Product Preview.

Production Data release data sheet for CC430F61xx devices.

Added correct termination of LCDCAP/R33 if not used.

Corrected unit in Frequency Synthesizer Characteristics from "ms" to "µs".

SLAS554D

108

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型号：	CC430F513X
厂家：	TEXAS INSTRUMENTS
描述：	MSP430 SoC with RF Core MSP430 SoC的射频核心射频
文件：	总118页 (文件大小：1320K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CC430F513X [TI]

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