CC3120MOD_技术文档

CC3120MOD

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适用于MCU 应用的CC3120MOD SimpleLink™ Wi-Fi CERTIFIED™ 网络处理器物

联网模块解决方案

– Ping

1 特性

• 恢复机制- 能够恢复到出厂默认设置

• Wi-Fi TX 功率

• CC3120MOD 是一个的Wi-Fi^®模块，其中包含

CC3120RNMARGK Wi-Fi 网络处理器(NWP)。该

完全集成的工业温度级绿色模块包括所有必需的时

钟、串行外设接口(SPI) 闪存和无源器件。

• FCC、IC、CE、MIC 和SRRC 认证

• Wi-Fi CERTIFIED^™模块，支持Wi-Fi Alliance 成员

申请证书转让

• 采用专用Internet-on-a chip^™Wi-Fi NWP，可充分

减轻应用MCU 的Wi-Fi 和互联网协议负载

• Wi-Fi^®模式

– 1 DSSS 时为17.0dBm

– 54 OFDM 时为13.5dBm

• Wi-Fi RX 灵敏度

– 1 DSSS 时为–95.0dBm

– 54 OFDM 时为–73.5dBm

• 应用吞吐量

– UDP：16Mbps

– TCP：13Mbps

• 电源管理子系统

– 802.11b/g/n 基站

– 802.11b/g/n 接入点(AP) 支持多达4 个基站

– Wi-Fi Direct^®客户端/组所有者

– 集成式直流/直流转换器支持宽电源电压范围：

• V_BAT宽电压模式：2.3V 至3.6V

– 高级低功耗模式

• WPA2 个人版和企业版安全性：WEP、WPA/WPA2

PSK、WPA2 企业版(802.1x)、WPA3 个人版以及

WPA3 企业版

• 关断：1μA

• 休眠：5μA

• 低功耗深度睡眠(LPDS)：115μA

• RX 流量：54 OFDM 时为59mA

• TX 流量：54 OFDM 时为229mA，最大功率

• 空闲连接（MCU 处于LPDS 状态）：DTIM

= 1 时为690μA

• IPv4 和IPv6 TCP/IP 堆栈

– 业界通用BSD 套接字应用编程接口(API)

• 16 个同步TCP 或UDP 套接字

• 6 个同步TLS 和SSL 套接字

• IP 寻址：具有重复地址检测(DAD) 功能的静态

IP、LLA、DHCPv4 和DHCPv6

• 适用于自主和快速Wi-Fi 连接的SimpleLink^™连接

管理器

• 模块上的其它集成组件

– 具有内部振荡器的40.0MHz 晶体

– 32.768kHz 晶体(RTC)

– 32Mbit SPI 串行闪存

– 射频滤波器和无源器件

• 可通过SmartConfig^™技术、AP 模式和WPS2 选

项灵活配置Wi-Fi

• RESTful API 支持（使用内部HTTP 服务器）

• 广泛的安全特性

• 1.27mm 间距、63 引脚、20.5mm × 17.5mm LGA

封装，可实现轻松组装和低成本PCB 设计

• 环境温度范围：–40°C 至+85°C

• 模块支持SimpleLink 开发人员生态系统

– 硬件特性

• 独立执行环境

• 器件身份

– 网络安全

2 应用

• 用于物联网应用(IoT)，例如：

– 云连接

• 个人和企业Wi-Fi 安全性

• 安全套接字（SSLv3、TLS1.0/1.1/TLS1.2）

• HTTPS 服务器

• 受信任根证书目录

• TI 信任根公开密钥

– 互联网网关

– 住宅和楼宇自动化

– 电器

– 门禁

– 安全系统

– 软件IP 保护

• 安全密钥存储

• 文件系统安全性

• 软件篡改检测

• 克隆保护

• 在专用NWP 上运行的嵌入式网络应用

– 具有动态用户回调的HTTP/HTTPS Web 服务器

– mDNS、DNS-SD、DHCP 服务器

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SWRS205

CC3120MOD

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– 智能能源

– 工业控制

– 智能插座和仪表计量

– 无线音频

– IP 网络传感器节点

– 资产跟踪

– 医疗设备

3 说明

向适用于物联网应用的低成本、低功耗 MCU 添加了 Wi-Fi^®。CC3120MOD 是一款 FCC、IC、CE、MIC、SRRC

和Wi-Fi CERTIFIED™ 模块，属于SimpleLink™ Wi-Fi 系列，可极大地简化互联网连接的实施。CC3120MOD 集

成了针对 Wi-Fi 和互联网的所有协议，极大程度降低了对主机 MCU 软件的要求。借助内置安全协议，

CC3120MOD 解决方案可提供稳健且简单的安全体验。此外，CC3120MOD 是一个完整的平台解决方案，包括各

种工具和软件、示例应用、用户和编程指南、参考设计以及 TI E2E^™支持社区。CC3120MOD 采用 LGA 封装，

易于布置所有必需组件，包括串行闪存、射频滤波器、晶体和全集成无源器件。

Wi-Fi 网络处理器子系统具有 Wi-Fi Internet-on-a chip™ 电路，并包含一个额外的专用 Arm^®MCU，可减少主机

MCU 的联网活动。此子系统包含 802.11b/g/n 无线电、基带和具有强大加密引擎的 MAC，采用 256 位加密，可

实现快速、安全的互联网连接。CC3120MOD 模块支持基站、接入点和 Wi-Fi Direct 模式。此模块支持 WPA2 个

人版和企业版安全性、以及 WPA3 个人版和企业版安全性。该子系统包含嵌入式 TCP/IP、TLS/SSL 堆栈、

HTTP 服务器和多个互联网协议。CC3120MOD 模块支持各种 Wi-Fi 配置方法，包括基于 AP 模式的 HTTP、

SmartConfig™ 技术和WPS2.0。

CC3120MOD 模块属于TI 的第二代SimpleLink Wi-Fi 系列，拥有全新特性和增强功能，例如：

• IPv6

• 增强的Wi-Fi 配置

• 优化的低功耗管理

• Wi-Fi AP 可连接多达4 个基站

• 可同时打开更多的BSD 套接字和多达16 个BSD 套接字（其中6 个支持安全型

• HTTPS）

• 支持RESTful API

• 非对称密钥

• 加密库

电源管理子系统包括支持宽电源电压范围的集成式直流/直流转换器。该子系统支持低功耗模式，例如 RTC 休眠

和关断模式，这需要大概的电流。分别需要 5µA 和1µA 的电流。CC3120MOD 模块随附一个占用空间小的用户

友好型主机驱动程序，可简化网络应用的集成和开发。主机驱动程序可轻松移植到大多数平台和操作系统 (OS)。

采用严格的 ANSI-C (C99) 标准编写，只需极小的平台适配层（移植层）。 CC3120MOD 模块可通过 SPI 或

UART 接口连接至任何 8 位、16 位或 32 位 MCU。该器件驱动程序最大程度地减少了主机内存占用要求，TCP

客户端应用只需不到7KB 的代码存储器和700B 的RAM。

CC3120MOD 模块是 SimpleLink™ 微控制器 (MCU) 平台的一部分，该平台包括 Wi-Fi、低功耗蓝牙^®、

Sub-1GHz 和主机MCU，它们共用一个通用、易于使用的开发环境，其中包含单核软件开发套件 (SDK) 和丰富的

工具集。借助一次性集成的 SimpleLink 平台，可以将产品系列中的任何器件组合添加到自己的设计中，从而在设

计要求变更时实现完全的代码重复使用。

CC3120MOD 模块提供易于布局的LGA 封装，作为完整的平台解决方案提供，其中包括各种工具和软件、示例应

用、用户和编程指南、参考设计以及 TI E2E 支持社区。此模块系列还是 SimpleLink MCU 产品组合的一部分，且

支持SimpleLink 开发人员生态系统。有关更多信息，请访问www.ti.com/SimpleLink。

表3-1. 模块信息

封装

器件型号⁽¹⁾

封装尺寸

CC3120MODRNMMOBR

MOB (63)

20.5mm × 17.5mm

(1) 如需更多信息，请参阅节13。

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4 功能方框图

图4-1 显示了CC3120MOD 模块的功能方框图。

CC3x20

40 MHz

RF_ANT1

32.768 kHz

BGN

UART

SPI

WRF

F

nReset

HIB

2.3 V to 3.6 V

VBAT

PM

32-Mbit

SFlash

External SPI Programming

图4-1. CC3120MOD 模块功能方框图

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图4-2 显示了CC3120 硬件概览。

External MCU

Wi-Fi Network Processor

Host Interface

Hardware

1x SPI

1x UART

NETWORK PROCESSOR

POWER

MANAGEMENT

Application

Protocols

Wi-Fi Driver

TCP/IP Stack

Oscillators

DC-DC

RTC

RAM

ROM

ARM Cortex

Synthesizer

图4-2. CC3120 硬件概览

图4-3 显示了CC3120 嵌入式软件概览。

Customer Application

NetApp

BSD Socket

Wi-Fi

SimpleLink Driver APIs

Host Interface

Network Apps

WLAN Security

and Management

TCP/IP Stack

WLAN MAC and PHY

图4-3. CC3120 嵌入式软件概览

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Table of Contents

9.3 Power-Management Subsystem...............................27

9.4 Low-Power Operating Modes................................... 27

9.5 Restoring Factory Default Configuration...................28

9.6 Device Certification and Qualification....................... 28

9.7 Module Markings.......................................................30

9.8 End Product Labeling................................................31

9.9 Manual Information to the End User......................... 31

10 Applications, Implementation, and Layout............... 32

10.1 Application Information........................................... 33

10.2 PCB Layout Guidelines...........................................35

11 Environmental Requirements and Specifications....39

11.1 Temperature............................................................39

11.2 Handling Environment.............................................39

11.3 Storage Condition................................................... 39

11.4 Baking Conditions................................................... 39

11.5 Soldering and Reflow Condition..............................39

12 Device and Documentation Support..........................41

12.1 Device Nomenclature..............................................41

12.2 Development Tools and Software .......................... 41

12.3 Firmware Updates...................................................42

12.4 Documentation Support.......................................... 42

12.5 Trademarks.............................................................44

12.6 Electrostatic Discharge Caution..............................44

12.7 术语表..................................................................... 44

13 Mechanical, Packaging, and Orderable

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 2

4 功能方框图.........................................................................3

5 Revision History.............................................................. 5

6 Device Comparison.........................................................6

6.1 Related Products........................................................ 7

7 Terminal Configuration and Functions..........................8

7.1 CC3120MOD Pin Diagram..........................................8

7.2 Pin Attributes...............................................................9

7.3 Connections for Unused Pins....................................11

8 Specifications................................................................ 12

8.1 Absolute Maximum Ratings...................................... 12

8.2 ESD Ratings............................................................. 12

8.3 Recommended Operating Conditions.......................12

8.4 Current Consumption Summary............................... 13

8.5 TX Power and IBAT versus TX Power Level

Settings....................................................................... 14

8.6 Brownout and Blackout Conditions...........................16

8.7 Electrical Characteristics...........................................17

8.8 WLAN Receiver Characteristics................................18

8.9 WLAN Transmitter Characteristics............................18

8.10 Reset Requirement.................................................18

8.11 Thermal Resistance Characteristics for MOB

Package...................................................................... 19

8.12 Timing and Switching Characteristics..................... 19

8.13 External Interfaces..................................................20

9 Detailed Description......................................................24

9.1 Overview...................................................................24

9.2 Module Features.......................................................24

Information.................................................................... 45

13.1 Mechanical, Land, and Solder Paste Drawings ..... 45

13.2 Package Option Addendum....................................46

13.3 Tape and Reel Information......................................47

5 Revision History

Changes from September 22, 2020 to May 13, 2021 (from Revision D (September 2020) to

Revision E (May 2021))

Page

• 节1 新增了WPA3 个人版和企业版.................................................................................................................... 1

• 更新了整个文档中的表格、图和交叉参考的编号格式.........................................................................................1

• 新增了WPA3 个人版和企业版节3 ................................................................................................................... 2

• Added WPA3 personal and enterprise 节9.1 ..................................................................................................24

• Added WPA3 personal and enterprise 节9.2.1 ...............................................................................................24

• Added WPA3 personal and enterprise to 表9-1 ..............................................................................................24

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6 Device Comparison

表6-1 shows the features supported across different CC3x20 modules.

表6-1. Device Features Comparison

DEVICE

FEATURE

CC3120MOD

CC3220MODS

CC3220S

CC3220MODSF

CC3220SF

No

Onboard Chip

Onboard ANT

sFlash

CC3120

No

32-Mbit

Regulatory Certification

Wi-Fi Alliance Certification

Input Voltage

FCC, IC, CE, MIC, SRRC

Yes

FCC, IC, CE, MIC, SRRC

Yes

2.3 V to 3.6 V

17.5 mm × 20.5 mm LGA

–40° to 85°C

Wi-Fi Network Processor

802.11 b/g/n

2.4 GHz

2.3 V to 3.6 V

17.5 mm × 20.5 mm LGA

–40° to 85°C

Wireless Microcontroller

802.11 b/g/n

2.4 GHz

2.3 V to 3.6 V

Package

17.5 mm × 20.5 mm LGA

–40° to 85°C

Operating Temperature Range

Classification

Wireless Microcontroller

802.11 b/g/n

Standard

Frequency

2.4 GHz

TCP / IP Stack

Sockets

IPv4, IPv6

16

Integrated MCU

On Chip Memory

RAM

-

Arm^®Cortex^®-M4 at 80 MHz

-

256KB

-

256KB

1MB

Flash

Peripherals and Interfaces

Universal Asynchronous

Receiver and Transmitter

(UART)

1

2

Serial Port Interface (SPI)

1

-

1

Multi-Channel Audio Serial Port

(McASP) —I2S or PCM

2-ch

Inter-Integrated Circuit (I²C)

-

1

Analog to Digital Converter

(ADC)

-

4-ch, 12-bit

Parallel Interface (8-bit PI)

General-Purpose Timers

Multimedia Card (MMC / SD)

Security Features

-

1

4

1

4

1

WEP, WPS, WPA / WPA2, PSK WEP, WPS, WPA / WPA2, PSK

WEP, WPS, WPA / WPA2, PSK

WPA2 (802.1x)

Wi-Fi Level of Security

WPA2 (802.1x)

Secure Sockets (SSL v3 or

TLS 1.0 /1.1/ 1.2)

6

Unique Device Identity

Additional Networking Security

Trusted Root-Certificate Catalog Trusted Root-Certificate Catalog

Trusted Root-Certificate Catalog

TI Root-of-Trust Public key

Hardware Crypto Engines

Yes

Hardware Acceleration

Secure Boot

Hardware Crypto Engines

-

Hardware Crypto Engines

Yes

6

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FEATURE

表6-1. Device Features Comparison (continued)

DEVICE

CC3120MOD

CC3220MODS

CC3220MODSF

File system security

Secure key storage

Software tamper detection

Cloning protection

Secure key storage

Software tamper detection

Cloning protection

Enhanced Application Level

Security

-

Initial secure programming

6.1 Related Products

For information about other devices in this family of products or related products see the links below.

SimpleLink™ MCUs

Overview

The broadest portfolio of wired and wireless Arm® MCUs

SimpleLink wireless

network processors

Our SimpleLink™ MCU platform sets a new standard for developers with the broadest

portfolio of wired and wireless Arm® MCUs in a single software development

environment. Delivering flexible hardware, software and tool options for your Internet

of Things applications, the SimpleLink platform enables unprecedented scalability.

Reference designs

Find reference designs leveraging the best in TI technology –from analog and power

management to embedded processors. All designs include a schematic, test data and

design files.

CC3120 SDK Plug-In

The CC3120 SDK plug-in contains drivers, many sample applications for Wi-Fi

features and Internet, and documentation needed to use the CC3120 solution.

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7 Terminal Configuration and Functions

7.1 CC3120MOD Pin Diagram

图7-1 shows the pin diagram for the CC3120MOD module.

GND

FLASH_SPI_CLK

FLASH_SPI_nCS_IN

FLASH_SPI_MISO

NC

GND

NC

GND

RF_BG

GND

NC

CC3120MOD

HOST_INTR

NC

SOP0

nRESET

57

56

55

60

59

58

63

HOST_SPI_nCS

VBAT_RESET

62

61

HOST_SPI_DOUT

HOST_SPI_DIN

HOST_SPI_CLK

VBAT1

GND

NC

nHIB

NC

VBAT2

NC

GND

图7-1 shows the approximate location of pins on the module. For the actual mechanical diagram, refer to 节13.

图7-1. CC3120MOD Pin Diagram Bottom View

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7.2 Pin Attributes

表7-1 lists the pin descriptions of the CC3120MOD module.

Note

If an external device drives a positive voltage to signal pads when the CC3120MOD is not powered,

DC current is drawn from the other device. If the drive strength of the external device is adequate, an

unintentional wake up and boot of the CC3120MOD can occur. To prevent current draw, TI

recommends one of the following:

• All devices interfaced to the CC3120MOD must be powered from the same power rail as the

CC3120MOD.

• Use level-shifters between the CC3120MOD and any external devices fed from other independent

rails.

• The nRESET pin of the CC3120MOD must be held low until the V_BATsupply to the module is

driven and stable.

表7-1. Module Pin Attributes

STATE AT RESET

AND HIBERNATE

I/O

PIN⁽¹⁾

DEFAULT FUNCTION

DESCRIPTION

TYPE⁽²⁾

1

2

GND

N/A

Ground

–

Hibernate signal, active low. Ensure that the nHIB line does not float

at any time.

4

nHIB

Hi-Z

I

5

HOST_SPI_CLK

HOST_SPI_DIN

HOST_SPI_DOUT

HOST_SPI_nCS

HOST_INTR

FLASH_SPI_MISO

FLASH_SPI_nCS_IN

FLASH_SPI_CLK

GND

Hi-Z

N/A

Hi-Z

N/A

Hi-Z

N/A

Hi-Z

I

Host interface SPI clock

6

Host interface SPI data input

7

O

I

Host interface SPI data output

Host interface SPI chip select (active low)

Interrupt output

8

11

13

14

15

16

17

23

24

27

28

30

31

32

34

O

I

External serial Flash interface: SPI data in

External serial Flash interface: SPI chip select (active low)

External serial Flash interface: SPI clock

Ground

O

–

FLASH_SPI_MOSI

SOP2

O

External serial Flash interface: SPI data out

SOP[2:0] used for factory restore. See 节9.5.

Ground

–

SOP1

GND

–

GND

Ground

GND

Ground. Reference for RF signal

2.4-GHz RF input/output

–

RF_BG

I/O

GND

Ground. Reference for RF signal

SOP[2:0] used for factory restore. See 节9.5.

–

SOP0

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表7-1. Module Pin Attributes (continued)

STATE AT RESET

AND HIBERNATE

I/O

PIN⁽¹⁾

DEFAULT FUNCTION

DESCRIPTION

TYPE⁽²⁾

35

nRESET

Hi-Z

I

There is an internal 100 kΩpull-up resistor option from the nRESET

pin to VBAT_RESET. Note: VBAT_RESET is not connected to

VBAT1 or VBAT2 within the module. The following connection

schemes are recommended:

•

Connect nRESET to a GPIO from the host only if nRESET will

be in a defined state under all operating conditions. Leave

VBAT_RESET unconnected to save power.

36

VBAT_RESET

Hi-Z

–

•

If nRESET cannot be in a defined state under all operating

conditions, connect VBAT_RESET to the main module power

supply (VBAT1 and VBAT2). Due to the internal pull-up resistor,

a leakage current of 3.3 V / 100 kΩis expected.

Power supply for the module, must be connected to battery (2.3 V to

3.6 V)

37

38

40

VBAT1

GND

Hi-Z

N/A

Hi-Z

–

Ground

Power supply for the module, must be connected to battery (2.3 V to

3.6 V)

VBAT2

43

44

46

47

50

51

52

55

56

57

58

59

60

61

62

63

GND

N/A

Hi-Z

N/A

Ground

–

O

I

UART1_nRTS

UART1_TX

UART1_RX

TEST_60

UART1_nCTS

TEST_62

GND

UART interface to host (request to send)

UART interface to host (transmit)

UART interface to host (receive)

Connect to external test point.

UART interface to host (clear to send)

Connect to external test point.

Thermal Ground

O

I

O

–

GND

Thermal Ground

GND

Thermal Ground

GND

Thermal Ground

GND

Thermal Ground

GND

Thermal Ground

GND

Thermal Ground

GND

Thermal Ground

GND

Thermal Ground

(1) Using a configuration file stored on Flash, the vendor can optionally block any possibility of bringing up AP using the FORCE_AP pin.

(2) I = Input, O = Output, RF = Radio frequency, I/O = Bidirectional

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7.3 Connections for Unused Pins

All unused pins must be left as no connect (NC) pins. 表7-2 provides a list of NC pins.

表7-2. Connections for Unused Pins

DEFAULT

FUNCTION

STATE AT RESET

AND HIBERNATE

I/O TYPE

DESCRIPTION

Reserved. Do not connect.

3

NC

WLAN analog

–

9

Reserved. Do not connect.

10

12

18

19

20

21

25

26

29

33

39

41

42

45

48

49

53

54

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8 Specifications

All measurements are references of the module pins, unless otherwise indicated. All specifications are over

process and voltage, unless otherwise indicated.

8.1 Absolute Maximum Ratings

These specifications indicate levels where permanent damage to the module can occur. Functional operation is not ensured

under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term

reliability of the module ^{(1) (2)}

.

MIN

–0.5

–40

MAX UNIT

V_BAT

3.8

V

Digital I/O

V_BAT+ 0.5

RF pin

2.1

85

V

Analog pins

V

Operating temperature, T_A

Storage temperature, T_stg

°C

85

(3)

Junction temperature, T_j

120

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to V_SS, unless otherwise noted.

(3) Junction temperature is for the CC3120RNMARGK device that is contained within the module.

8.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS001⁽¹⁾

±2000

Electrostatic discharge (ESD)

performance

V_ESD

V

Charged device model (CDM),

All pins

±500

per JESD22-C101⁽²⁾

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

Function operation is not ensured outside this limit, and operation outside this limit for extended periods can adversely affect

long-term reliability of the module^{(1) (2) (3)}

.

MIN

2.3

TYP

3.3

25

MAX

3.6

85

UNIT

V

V_BAT

Operating temperature

Ambient thermal slew

°C

–40

–20

20

°C/minute

(1) When operating at an ambient temperature of over 75°C, the transmit duty cycle must remain below 50% to avoid the auto-protect

feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60 seconds to restart the

transmission.

(2) To ensure WLAN performance, ripple on the 2.3-V to 3.6-V supply must be less than ±300 mV.

(3) The minimum voltage specified includes the ripple on the supply voltage and all other transient dips. The brownout condition is 2.1 V,

and care must be taken when operating at the minimum specified voltage.

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8.4 Current Consumption Summary

T_A= 25°C, V_BAT= 3.6 V

PARAMETER

TEST CONDITIONS^{(1) (2)}

TX power level = 0

MIN

TYP

272

188

248

179

223

160

53

MAX

UNIT

1 DSSS

TX power level = 4

TX power level = 0

TX power level = 4

TX power level = 0

TX power level = 4

TX

6 OFDM

mA

54 OFDM

1 DSSS

RX⁽³⁾

mA

54 OFDM

53

Idle connected⁽⁴⁾

LPDS

690

115

5

µA

Hibernate

Shutdown

1

V_BAT= 3.6 V

V_BAT= 3.3 V

V_BAT= 2.3 V

420

450

620

Peak calibration current⁽⁵⁾

mA

(1) TX power level = 0 implies maximum power (see 图8-1, 图8-2, and 图8-3). TX power level = 4 implies output power backed off

approximately 4 dB.

(2) The CC3120MOD system is a constant power-source system. The active current numbers scale inversely on the V_BATvoltage

supplied.

(3) The RX current is measured with a 1-Mbps throughput rate.

(4) DTIM = 1

(5) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is

performed sparingly, typically when re-enabling the NWP and when the temperature has changed by more than 20°C. There are two

additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further details, see the

CC3120, CC3220 SimpleLink™ Wi-Fi® and IoT Network Processor Programmer's Guide.

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8.5 TX Power and IBAT versus TX Power Level Settings

图 8-1, 图 8-2, and 图 8-3 show TX Power and IBAT versus TX power level settings for modulations of 1 DSSS,

6 OFDM, and 54 OFDM, respectively.

In 图 8-1, the area enclosed in the circle represents a significant reduction in current during transition from TX

power level 3 to level 4. In the case of lower range requirements (14-dBm output power), TI recommends using

TX power level 4 to reduce the current.

图8-1. TX Power and IBAT vs TX Power Level Settings (1 DSSS)

图8-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM)

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图8-3. TX Power and IBAT vs TX Power Level Settings (54 OFDM)

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8.6 Brownout and Blackout Conditions

The device enters a brownout condition when the input voltage dips below V_BROWNOUT(see 图 8-4 and 图 8-5).

This condition must be considered during design of the power supply routing, especially if operating from a

battery. High-current operations, such as a TX packet or any external activity (not necessarily related directly to

networking) can cause a drop in the supply voltage, potentially triggering a brownout condition. The resistance

includes the internal resistance of the battery, contact resistance of the battery holder (four contacts for a 2× AA

battery), and the wiring and PCB routing resistance.

Note

When the device is in the Hibernate state, brownout is not detected; only blackout is in effect during

the Hibernate state.

图8-4. Brownout and Blackout Levels (1 of 2)

图8-5. Brownout and Blackout Levels (2 of 2)

In the brownout condition, all sections of the CC3120MOD (including the 32-kHz RTC) shut down except for the

Hibernate module, which remains on. The current in this state can reach approximately 400 µA. The blackout

condition is equivalent to a hardware reset event in which all states within the device are lost.

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表8-1 lists the brownout and blackout voltage levels.

表8-1. Brownout and Blackout Voltage Levels

CONDITION

V_brownout

VOLTAGE LEVEL

UNIT

V

2.1

V_blackout

1.67

V

8.7 Electrical Characteristics

T_A= 25°C, V_BAT= 3.3 V

PARAMETER

TEST CONDITIONS⁽²⁾

MIN

NOM

MAX

UNIT

pF

V

C_IN

V_IH

V_IL

I_IH

Pin capacitance

4

High-level input voltage

Low-level input voltage

High-level input current

Low-level input current

0.65 × V_DD

V_DD+ 0.5 V

0.35 × V_DD

V

–0.5

5

nA

I_IL

IL = 2 mA; configured I/O drive

strength = 2 mA;

2.4 V ≤V_DD< 3.6 V

V_DD× 0.8

V_DD× 0.7

V_DD× 0.75

V

IL = 4 mA; configured I/O drive

strength = 4 mA;

2.4 V ≤V_DD< 3.6 V

V_OH

High-level output voltage

IL = 8 mA; configured I/O drive

strength = 8 mA;

2.4 V ≤V_DD< 3.6 V

IL = 2 mA; configured I/O drive

strength = 2 mA;

2.3 V ≤V_DD< 2.4 V

IL = 2 mA; configured I/O drive

strength = 2 mA;

2.4 V ≤V_DD< 3.6 V

V_DD× 0.2

V_DD× 0.25

IL = 4 mA; configured I/O drive

strength = 4 mA;

2.4 V ≤V_DD< 3.6 V

V_OL

Low-level output voltage

IL = 8 mA; configured I/O drive

strength = 8 mA;

2.4 V ≤V_DD< 3.6 V

IL = 2 mA; configured I/O drive

strength = 2 mA;

2.3 V ≤V_DD< 2.4 V

2-mA drive

2

4

High-level

source current

I_OH

4-mA drive

mA

6-mA drive

2-mA drive

6

2

Low-level sink

4-mA drive

current

I_OL

4

mA

V

6-mA drive

6

V_IL

nRESET⁽¹⁾

0.6

(1) The nRESET pin must be held below 0.6 V for the device to register a reset.

(2) TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk

of interference to the WLAN radio and reduces any potential degradation of RF sensitivity and performance. The default drive strength

setting is 6 mA.

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8.8 WLAN Receiver Characteristics

T_A= 25°C, V_BAT= 2.3 to 3.6 V. Parameters measured at module pin on channel 6 (2437 MHz).

PARAMETER

RATE

MIN

TYP

–95.0

–93.0

–87.0

–89.5

–89.0

–85.5

–79.5

–73.5

–69.5

–3.0

MAX

UNIT

1 DSSS

2 DSSS

11 CCK

6 OFDM

9 OFDM

18 OFDM

36 OFDM

54 OFDM

Sensitivity

(8% PER for 11b rates, 10% PER for 11g or 11n rates)

dBm

(10% PER)⁽¹⁾

MCS7 (Mixed Mode)

802.11b

Maximum input level

(10% PER)

dBm

802.11g

–9.0

(1) Sensitivity is 1-dB worse on channel 13 (2472 MHz).

8.9 WLAN Transmitter Characteristics

T_A= 25°C, V_BAT= 2.3 to 3.6 V. Parameters measured at module pin on 6 (2437 MHz)^{(1) (2)}

.

PARAMETER

RATE

MIN

TYP

17.0

17.3

16.3

16.0

15.0

13.5

12

MAX

UNIT

dBm

ppm

1 DSSS

2 DSSS

11 CCK

6 OFDM

9 OFDM

18 OFDM

36 OFDM

54 OFDM

Max RMS Output Power measured at 1 dB

from IEEE spectral mask or EVM

MCS7 (Mixed Mode)

Transmit center frequency accuracy

20

–20

(1) The edge channels (2412 MHz and 2462 MHz) have reduced TX power to meet FCC emission limits.

(2) Power of 802.11b rates are reduced to meet ETSI requirements.

8.10 Reset Requirement

PARAMETER

Operation mode level

MIN

TYP

0.65 × V_BAT

0.6

MAX UNIT

V_IH

V_IL

V

Shutdown mode level⁽¹⁾

0

5

Minimum time for nReset low for resetting the module

Rise and fall times

ms

µs

T_rand T_f

20

(1) The nRESET pin must be held below 0.6 V for the module to register a reset.

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8.11 Thermal Resistance Characteristics for MOB Package

NAME

RΘ_JC

RΘ_JB

RΘ_JA

Psi_JT

DESCRIPTION

°C/W

11.4

8.0

AIR FLOW (m/s)

Junction-to-case

0.00

Junction-to-board

Junction-to-free air

Junction-to-package top

Junction-to-board

18.7

5.3

Psi_JB

7.7

8.12 Timing and Switching Characteristics

8.12.1 Power-Up Sequencing

For proper start-up of the CC3120MOD module, perform the recommended power-up sequencing as follows:

1. Tie V_BAT1(pin 37) and V_BAT2(pin 40) together on the board.

2. Hold the nRESET pin low while the supplies are ramping up.

图8-6 shows the reset timing diagram for the first-time power-up and reset removal.

T1

T2

T3

VBAT

nRESET

nHIB

Device ready to

serve API calls

POWER

OFF

RESET

HW INIT

FW INIT

STATE

32-kHz

XTAL

图8-6. First-Time Power-Up and Reset Removal Timing Diagram

表8-2 describes the timing requirements for the first-time power-up and reset removal.

表8-2. First-Time Power-Up and Reset Removal Timing Requirements

ITEM

NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

ms

s

Depends on application board

power supply, decoupling capacitor,

and so on

T1

Supply settling time

Hardware wake-up time

Initialization time

3

T2

25

Internal 32-kHz XTAL settling plus

firmware initialization time plus

radio calibration

T3

1.35

8.12.2 Power-Down Sequencing

For proper power down of the CC3120MOD module, ensure that the nRESET (pin 35) and nHIB (pin 4) pins

have remained in a known state for a minimum of 200 ms before removing power from the module.

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8.12.3 Device Reset

When a device restart is required, the user may issue a negative pulse on either the nHIB pin (pin 4) or on the

nRESET pin (pin 35), keeping the other pulled high, depending on the configuration of the platform. If the

nRESET pin is used, the user must insure the following:

• A high-to-low reset pulse (on pin 35) of at least 200-ms duration

To ensure a proper reset sequence, the user must call the sl_stop function prior to toggling the reset.

8.12.4 Wakeup From HIBERNATE Mode Timing

图8-7 shows the timing diagram for wakeup from HIBERNATE mode.

T

wake_from_hib

hib_min

VBAT

nRESET

nHIB

ACTIVE

HIBERNATE

HW WAKEUP+FW INIT

ACTIVE

HIBERNATE

32-kHz

XTAL/CXO

图8-7. nHIB Timing Diagram

Note

The internal 32.768-kHz XTAL is kept enabled by default when the chip goes into HIBERNATE mode

in response to nHIB being pulled low.

表8-3 describes the timing requirements for nHIB.

表8-3. nHIB Timing Requirements

ITEM

NAME

DESCRIPTION

MIN

TYP MAX

UNIT

T_{hib_min}

Minimum hibernate time

Minimum pulse width of nHIB being low⁽¹⁾

10

ms

Hardware wakeup time plus

firmware initialization time

T_{wake_from_hib}

See⁽²⁾

50

ms

(1) If temperature changes by more than 20°C, initialization time from HIB can increase by 200 ms due to radio calibration.

(2) Ensure that the nHIB pulse width is kept above the minimum requirement under all conditions (such as power up, MCU reset, and so

on).

8.13 External Interfaces

This section describes the external interfaces supported by the CC3120MOD module, as follows:

• SPI Host

• Host UART

• External Flash

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8.13.1 SPI Host Interface

The device interfaces to an external host using the SPI. The CC3120MOD module can interrupt the host using

the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface can work up to a

speed of 20 MHz.

图8-8 shows the SPI host interface.

CC3120MOD (slave)

MCU

HOST_SPI_CLK

SPI_CLK

HOST_SPI_nCS

HOST_SPI_MISO

HOST_SPI_MOSI

SPI_nCS

SPI_MISO

SPI_MOSI

INTR

HOST_INTR

nHIB

GPIO

图8-8. SPI Host Interface

表8-4 lists the SPI host interface pins.

表8-4. SPI Host Interface

PIN NAME

DESCRIPTION

HOST_SPI_CLK

HOST_SPI_nCS

HOST_SPI_MOSI

HOST_INTR

Clock (up to 20 MHz) from MCU host to CC3120MOD module

CS (active low) signal from MCU host to CC3120MOD module

Data from MCU host to CC3120MOD module

Interrupt from CC3120MOD module to MCU host

HOST_SPI_MISO

nHIB

Data from CC3120MOD module to MCU host

Active-low signal that commands the CC3120MOD module to enter hibernate mode (lowest power state)

图8-9 shows the host SPI timing diagram.

T2

CLK

T6

T7

MISO

MOSI

T9

T8

图8-9. Host SPI Timing

表8-5 lists the host SPI timing parameters.

表8-5. Host SPI Timing Parameters

PARAMETER

NUMBER

DESCRIPTION

MIN

MAX

UNIT

Clock frequency at V_BAT= 3.3 V

Clock frequency at V_BAT= 2.3 V

20

12

T1

F⁽¹⁾

MHz

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UNIT

表8-5. Host SPI Timing Parameters (continued)

PARAMETER

NUMBER

DESCRIPTION

MIN

MAX

(1) (2)

(1)

T2

T3

T4

T5

T6

T7

T8

T9

t_clk

t_LP

t_HT

Clock period

50

ns

Clock low period

Clock high period

Duty cycle

25

(1)

D⁽¹⁾

45%

55%

(1)

t_IS

t_IH

RX data setup time

RX data hold time

TX data output delay

TX data hold time

4

ns

(1)

t_OD

t_OH

20

24

(1) The timing parameter has a maximum load of 20 pf at 3.3 V.

(2) Ensure that nCS (active-low signal) is asserted 10 ns before the clock is toggled. The nCS signal can be deasserted 10 ns after the

clock edge.

8.13.2 Host UART Interface

The SimpleLink™ device requires the UART configuration described in 表8-6.

表8-6. SimpleLink™ UART Configuration

PROPERTY

Baud rate

SUPPORTED CC3120 CONFIGURATION

115200 bps, no auto-baud rate detection, can be changed by the host up to 3 Mbps using a special command

Data bits

8 bits

Flow control

Parity

CTS/RTS

None

Stop bits

1

Bit order

Least significant bit (LSB) first

Active high

Host interrupt polarity

Host interrupt mode

Endianness

Rising edge or level 1

Little-endian only⁽¹⁾

(1) The SimpleLink device does not support automatic detection of the host length while using the UART interface.

8.13.2.1 5-Wire UART Topology

图 8-10 shows the typical 5-wire UART topology comprised of four standard UART lines plus one IRQ line from

the device to the host controller to allow efficient low power mode.

图 8-10 shows the typical and recommended UART topology because it offers the maximum communication

reliability and flexibility between the host and the SimpleLink device.

nRTS

nCTS

TX

nRTS

nCTS

TX

HOST MCU

UART

CC3120MOD

UART

RX

HOST_INTR(IRQ)

图8-10. Typical 5-Wire UART Topology

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8.13.2.2 4-Wire UART Topology

The 4-wire UART topology eliminates the host IRQ line (see 图 8-11). Using this topology requires one of the

following conditions to be met:

• Host is always awake or active.

• Host goes to sleep, but the UART module has receiver start-edge detection for automatic wake up and does

not lose data.

nRTS

nCTS

TX

nRTS

nCTS

TX

HOST MCU

UART

CC3120MOD

UART

RX

H_IRQ

X

图8-11. 4-Wire UART Configuration

8.13.2.3 3-Wire UART Topology

The 3-wire UART topology requires only the following lines (see 图8-12).

• RX

• TX

• nCTS

nRTS

nCTS

TX

nRTS

X

nCTS

TX

HOST MCU

UART

CC3120MOD

UART

RX

H_IRQ

X

图8-12. 3-Wire UART Topology

Using 3-wire topology requires one of the following conditions to be met:

• Host always stays awake or active.

• Host goes to sleep, but the UART module has receiver start-edge detection for auto wake up and does not

lose data.

• Host can always receive any amount of data transmitted by the SimpleLink device because there is no flow

control in this direction.

Because there is no full flow control, the host cannot stop the SimpleLink device to send its data; thus, the

following parameters must be carefully considered:

• Maximum baud rate

• RX character interrupt latency and low-level driver jitter buffer

• Time consumed by the user's application

8.13.3 External Flash Interface

The CC3120MOD module includes the Macronix 32-Mbit serial Flash. The serial Flash can be programmed

directly via the external Flash interface (pins 13, 14, 15, and 17). Note that during normal operation, the external

Flash interface should remain unconnected.

For timing details of the 32-Mbit Macronix serial Flash, see the MX25R3235F data sheet.

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9 Detailed Description

9.1 Overview

The CC3120MOD Wi-Fi module contains a dedicated Arm^®MCU that offloads many of the networking activities

from the host MCU. Including an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for a

fast, secure WLAN and Internet connections with 256-bit encryption. The CC3120MOD module supports station,

AP, and Wi-Fi Direct modes. The module also supports WPA2 personal and enterprise security, WPS 2.0, and

WPA3 personal and enterprise security. The Wi-Fi network processor includes an embedded IPv6 and IPv4

TPC/IP stack.

9.2 Module Features

9.2.1 WLAN

The WLAN features are as follows:

• 802.11 b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station, AP, and

Wi-Fi Direct client and group owner with CCK and OFDM rates in the 2.4-GHz ISM band, channels 1 to 13.

Note

802.11n is supported only in Wi-Fi station, Wi-Fi direct, and P2P client modes.

• Autocalibrated radio with a single-ended 50-Ωinterface enables easy connection to the antenna without

requiring expertise in radio circuit design.

• Advanced connection manager with multiple user-configurable profiles stored in a serial Flash allows

automatic, fast connection to an access point without user or host intervention.

• Supports all common Wi-Fi security modes for personal and enterprise networks, with on-chip security

accelerators, including WEP, WPA/WPA2 PSK, and WPA2 Enterprise (802.1x), WPA3 Personal, and WPA3

Enterprise.

• Smart provisioning options deeply integrated within the device provide a comprehensive end-to-end solution.

Elaborate events notification to the host enable the application to control the provisioning decision flow. The

wide variety of Wi-Fi provisioning methods include:

– Access Point using HTTPS

– SmartConfig Technology: a 1-step, 1-time process to connect a CC3120MOD-enabled module to the

home wireless network, removing dependency on the I/O capabilities of the host MCU; thus, the device is

usable by deeply embedded applications.

• 802.11 transceiver mode transmits and receives proprietary data through a socket without adding MAC or

PHY headers, and provides the option to select the working channel, rate, and transmitted power. The

receiver mode works together with the filtering options.

9.2.2 Network Stack

The network stack features are as follows:

• Integrated IPv4, IPv6, and TCP/IP stack with BSD socket APIs for simple Internet connectivity with any MCU,

microprocessor, or ASIC

Note

Not all APIs are 100% BSD compliant. Not all BSD APIs are supported.

• Support of 16 simultaneous TCP, UDP, or RAW sockets

• Support of 6 simultaneous SSL\TLS sockets

• Built-in network protocols:

– Static IP, LLA, DHCPv4, DHCPv6 (Stateful) with DAD and Stateless auto configuration

– ARP, ICMPv4, IGMP, ICMPv6, MLD, ND

– DNS client for easy connection to the local network and the Internet

• Built-in network application and utilities:

– HTTP/HTTPS

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• Web page content stored on serial Flash

• RESTful APIs for setting and configuring application content

• Dynamic user callbacks

• Service discovery: Multicast DNS service discovery allows a client to advertise its service without a

centralized server. After connecting to the access point, the CC3120 device provides critical information, such

as device name, IP, vendor, and port number.

• DHCP server

• Ping

表9-1 summarizes the NWP features.

表9-1. NWP Features

FEATURES

DESCRIPTION

802.11b/g/n station

Wi-Fi standards

802.11b/g AP supporting up to four stations

Wi-Fi Direct client and group owner

Wi-Fi

Channels 1 to 13

Wi-Fi security

WEP, WPA/WPA2 PSK, WPA2 enterprise (802.1x), WPA3 personal and enterprise

SmartConfig technology, Wi-Fi protected setup (WPS2), AP mode with internal HTTP/HTTPS

web server

Wi-Fi provisioning

IP protocols

IP addressing

Cross layer

IPv4 and IPv6

Static IP, LLA, DHCPv4, DHCPv6 (Stateful) with DAD and stateless auto configuration

ARP, ICMPv4, IGMP, ICMPv6, MLD, NDP

UDP, TCP

Transport

SSLv3.0/TLSv1.0/TLSv1.1/TLSv1.2

RAW IP

Ping

HTTP/HTTPS web server

mDNS

Network applications and utilities

DNS-SD

DHCP server

Host interface

Security

UART/SPI

Secure file system

Unique ID and private key for device authentication

Crypto utilities

Secure content delivery

Power management

Other

Enhanced power policy management uses 802.11 power save and deep sleep power modes

RF Transceiver

Programmable RX Filters with Events trigger mechanism including WoWLAN

Recovery mechanism –Restore to factory default

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9.2.2.1 Security

The SimpleLink Wi-Fi CC3120MOD internet-on-a chip module enhances the security capabilities available for

development of IoT devices, while completely offloading these activities from the MCU to the networking

subsystem. The security capabilities include the following key features:

Wi-Fi and Internet security

• Personal and enterprise Wi-Fi security

– Personal standards

• AES (WPA2-PSK)

• TKIP (WPA-PSK)

• WEP

• Enterprise standards

– EAP Fast

– EAP PEAPv0 MSCHAPv2

– EAP PEAPv0 TLS

– EAP PEAPv1 TLS EAP LS

– EAP TTLS TLS

– EAP TTLS MSCHAPv2

• Secure sockets

– Protocol versions: SSL v3/TLS 1.0/TLS 1.1/TLS 1.2

– On-chip powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES

encryption for TLS and SSL connections

– Ciphers suites

• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA

• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5

• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA

• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA

• SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256

• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA

• SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256

• SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384

• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256

• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256

• SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256

– Server authentication

– Client authentication

– Domain name verification

– Socket upgrade to secure socket –STARTTLS

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• Secure HTTP server (HTTPS)

• The trusted root-certificate catalog verifies that the CA used by the application is trusted and known secure

content delivery.

• The TI root-of-trust public key is a hardware-based mechanism that allows authenticating TI as the genuine

origin of a given content using asymmetric keys.

• Secure content delivery allows file transfer to the system in a secure way on any unsecured tunnel.

• Code and data security

– Secured network information: Network passwords and certificates are encrypted

– Secured and authenticated service pack: SP is signed based on TI certificate

9.2.3 Host Interface and Driver

• Interfaces over a 4-wire SPI with any MCU or a processor at a clock speed of 20 MHz

• Interfaces over UART with any MCU with a baud rate up to 3 Mbps. A low footprint driver is provided for TI

MCUs and is easily ported to any processor or ASIC.

• Simple APIs enable easy integration with any single-threaded or multithreaded application.

9.2.4 System

• Connects directly to a battery

• Ultra-low leakage when disabled (hibernate mode) with a current of less than 5 µA with the RTC running and

1 µA when in shutdown mode.

• Integrated clock sources

9.3 Power-Management Subsystem

The CC3120MOD power-management subsystem contains DC-DC converters to accommodate the differing

voltage or current requirements of the system.

The CC3120MOD is a fully integrated module-based WLAN radio solution used on an embedded system with a

wide-voltage supply range. The internal power management, including DC-DC converters and LDOs, generates

all of the voltages required for the module to operate from a wide variety of input sources. For maximum

flexibility, the module can operate in the modes described in the following sections.

9.3.1 V_BATWide-Voltage Connection

In the wide-voltage battery connection, the module can be directly connected to two AA alkaline batteries. All

other voltages required to operate the device are generated internally by the DC-DC converters. This scheme is

the most common mode for the device because it supports wide-voltage operation from 2.3 to 3.6 V.

9.4 Low-Power Operating Modes

This section describes the low-power modes supported by the module to optimize battery life.

9.4.1 Low-Power Deep Sleep

The low-power deep-sleep (LPDS) mode is an energy-efficient and transparent sleep mode that is entered

automatically during periods of inactivity based on internal power optimization algorithms. The module can wake

up in less than 3 ms from the internal timer or from any incoming host command. Typical battery drain in this

mode is 115 µA. During LPDS mode, the module retains the software state and certain configuration information.

The operation is transparent to the external host; thus, no additional handshake is required to enter or exit this

sleep mode.

9.4.2 Hibernate

The hibernate mode is the lowest power mode in which all of the digital logic is power-gated. Only a small

section of the logic powered directly by the main input supply is retained. The real-time clock (RTC) is kept

running and the module wakes up when the n_HIB line is asserted by the host driver. The typical battery drain in

this mode is 5 µA. The wake-up time is longer than LPDS mode at about 50 ms.

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9.4.3 Shutdown

Shutdown mode is the lowest power-mode system-wise. All device logics are off, including the realtime clock

(RTC). The typical battery drain in this mode is 1 µA. The wake-up time in this mode is longer than hibernate at

approximately 1.1 seconds.

9.5 Restoring Factory Default Configuration

The device has an internal recovery mechanism that allows rolling back the file system to its predefined factory

image or restoring the factory default parameters of the device. The factory image is kept in a separate sector on

the sFLASH in a secure manner and cannot be accessed from the host processor. The following restore modes

are supported:

• None—no factory restore settings

• Enable restore of factory default parameters

• Enable restore of factory image and factory default parameters

The restore process is performed by pulling or forcing SOP[2:0] = 110 pins and toggling the nRESET pin from

low to high.

The process is fail-safe and resumes operation if a power failure occurs before the restore is finished. The

restore process typically takes about 8 seconds, depending on the attributes of the serial Flash vendor.

9.6 Device Certification and Qualification

The TI CC3120MOD module is certified for FCC, IC, ETSI/CE, Japan MIC, and SRRC. Moreover, the module is

also Wi-Fi certified with the ability to request a certificate transfer for Wi-Fi alliance members. TI customers that

build products based on the TI CC3120MOD can save in testing cost and time per product family.

The CC3120MOD module is certified to the standards listed in 表9-2 (with IDs where applicable).

表9-2. CC3120MOD List of Certifications

REGULATORY BODY

FCC (USA)

SPECIFICATION

ID (IF APPLICABLE)

Part 15C + MPE FCC RF Exposure

RSS-102 (MPE) and RSS-247 (Wi-Fi)

EN300328 v2.1.1 (2.4 GHz Wi-Fi)

EN62311:2008 (MPE)

Z64-CC3120MOD

IC (Canada)

451I-CC3120MOD

—

ETSI/CE (Europe)

EN301489-1 v2.1.1 (EMC General)

EN301489-17 v3.1.1 (EMC Wi-Fi)

EN60950-1:2006/A11:2009/A1:2010/

A12:2011/A2:2013

Japan MIC

Article 49-20 of ORRE

EN300328 v1.7.1

201-170387

SRRC (China)

2017DJ2946(M)

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9.6.1 FCC Certification and Statement

CAUTION

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled

environment. End users must follow the specific operating instructions for satisfying RF exposure

limits. This transmitter must not be co-located or operating with any other antenna or transmitter.

The TI CC3120MOD module is certified for FCC as a single-modular transmitter. The module is an FCC-certified

radio module that carries a modular grant.

You are cautioned that changes or modifications not expressly approved by the part responsible for compliance

could void the user’s authority to operate the equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

• This device may not cause harmful interference.

• This device must accept any interference received, including interference that may cause undesired

operation of the device.

9.6.2 Industry Canada (IC) Certification and Statement

CAUTION

IC RF Radiation Exposure Statement:

To comply with IC RF exposure requirements, this device and its antenna must not be co-located or

operating in conjunction with any other antenna or transmitter.

Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son

antenne ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou

transmetteur.

The TI CC3120MOD module is certified for IC as a single-modular transmitter. the TI CC3120MOD module

meets IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC

regarding certified modules in authorized equipment.

This device complies with Industry Canada licence-exempt RSS standards.

Operation is subject to the following two conditions:

• This device may not cause interference.

• This device must accept any interference, including interference that may cause undesired operation of the

device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de

licence.

L'exploitation est autorisée aux deux conditions suivantes:

• L'appareil ne doit pas produire de brouillage

• L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d'en compromettre le fonctionnement.

9.6.3 ETSI/CE Certification

The TI CC3120MOD module is CE certified with certifications to the appropriate EU radio and EMC directives

summarized in the Declaration of Conformity, evidenced by the CE mark. The module is tested against the new

Radio Equipment Directive (RE-D). See the full text of the EU Declaration of Conformity.

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9.6.4 Japan MIC Certification

The TI CC3120MOD module is MIC certified against article 49-20 and the relevant articles of the Ordinance

Regulating Radio Equipment.

Operation is subject to the following condition:

• The HOST system does not contain a wireless wide area network (WWAN) device.

9.6.5 SRRC Certification and Statement

The TI CC3120MOD module complies with the SRRC’s rules and regulations for a limited module approval

(LMA).

Operation is subject to the following condition:

• The host system does not contain a WWAN device.

In addition, the host system using an approved LMA radio requires the following:

• New CMIIT ID

• Requires radiated-related testing only

• The host system’s new SRRC certificate contains the LMA’s CMIIT ID information

• The host system must be affixed with the new MIIT ID (not the LMA’s CMIIT ID), following the SRRC

labeling requirements.

Note

When an LMA radio is embedded into a host system, it does not mean the host system complies with

SRRC rules and regulations. The manufacturer of the host system is responsible for ensuring that the

combined system complies with SRRC rules and regulations.

9.7 Module Markings

图9-1 shows the markings for the SimpleLink CC3120 Module.¹

M/N: CC3120MODRNMMOB

LTC: YMLLLLP SSSS

XXXXXXXXXX-VVSS

FCC ID: Z64-CC3120MOD

IC: 451I-CC3120MOD

CMIIT ID:2017DJ2946(M)

R 201-170387

图9-1. SimpleLink™ CC3120 Module Markings

1

Drawings are representative. Content or placement may vary from what is illustrated.

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表9-3 lists the SimpleLink module markings.

表9-3. Marking Descriptions

MARKING

DESCRIPTION

CC3120MODRNMMOB

Model

LTC (lot trace code):

•

Y = Year

M = Month

YMLLLLP SSSS

LLLL = Assembly lot code

P = Reserved for internal use

SSSS = Serial number

XXXXXXXXXX-VVSS

Z64-CC3120MOD

451I-CC3120MOD

2017DJ2946(M)

TI internal use only

FCC ID: single modular FCC grant ID

IC: single modular IC grant ID

CMIIT: limited modular SRRC grant ID

MIC compliance mark

MIC ID: modular MIC grant ID

CE compliance mark

R 201-170387

CE

9.8 End Product Labeling

This module is designed to comply with the FCC single modular FCC grant, FCC ID: Z64-CC3120MOD. The

host system using this module must display a visible label indicating the following text:

Contains FCC ID: Z64-CC3120MOD

This module is designed to comply with the IC single modular IC grant, IC: 451I-CC3120MOD. The host system

using this module must display a visible label indicating the following text:

Contains IC: 451I-CC3120MOD

This module is designed to comply with the JP statement, 201-170387. The host system using this module must

display a visible label indicating the following text:

Contains transmitter module with certificate number: 201-170387.

9.9 Manual Information to the End User

The OEM integrator must be aware not to provide information to the end user regarding how to install or remove

this RF module in the user’s manual of the end product which integrates this module.

The end user manual must include all required regulatory information/warning as shown in this manual.

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10 Applications, Implementation, and Layout

Note

以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客户应负责确定

器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。

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10.2 PCB Layout Guidelines

This section details the PCB guidelines to speed up the PCB design using the CC3120MOD Module. The

integrator of the CC3120MOD module must comply with the PCB layout recommendations described in the

following subsections to preserve/minimize the risk with regulatory certifications for FCC, IC, CE, MIC, and

SRRC. Moreover, TI recommends customers follow the guidelines described in this section to achieve similar

performance to that obtained with the TI reference design.

10.2.1 General Layout Recommendations

Ensure that the following general layout recommendations are followed:

• Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.

• Do not run signal traces underneath the module on a layer where the module is mounted.

• RF traces must have 50-Ωimpedance.

• RF trace bends must be made with gradual curves, and 90 degree bends must be avoided.

• RF traces must not have sharp corners.

• There must be no traces or ground under the antenna section.

• RF traces must have via stitching on the ground plane beside the RF trace on both sides.

• RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the

PCB product in consideration of the product enclosure material and proximity.

10.2.2 RF Layout Recommendations

The RF section of this wireless device gets top priority in terms of layout. It is very important for the RF section to

be laid out correctly to ensure optimum performance from the device. A poor layout can cause low-output power,

EVM degradation, sensitivity degradation, and mask violations.

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图10-2 shows the RF placement and routing of the CC3120MOD module.

Chip

Antenna

Antenna Matching

U.FL (optional)

RF Trace

CC3120MOD

图10-2. RF Section Layout

For optimal RF performance, ensure the copper cut out on the top layer under the RF-BG pin, (pin 31), is as

shown in 图10-3.

图10-3. Top Layer Copper Pull Back on RF Pads

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10.2.3 Antenna Placement and Routing

The antenna is the element used to convert the guided waves on the PCB traces to the free space

electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data

rates. 表10-2 provides a summary of the recommended antennas to use with the CC3120MOD module.

表10-2. Antenna Guidelines

SR NO.

GUIDELINES

1

Place the antenna on an edge or corner of the PCB.

Ensure that no signals are routed across the antenna elements on all the layers of the

PCB.

2

3

Most antennas, including the chip antenna used on the booster pack, require ground

clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers

as well.

Ensure that there is provision to place matching components for the antenna. These

must be tuned for best return loss when the complete board is assembled. Any plastics

or casing must also be mounted while tuning the antenna because this can impact the

impedance.

4

5

Ensure that the antenna impedance is 50 Ωbecause the device is rated to work only

with a 50-Ωsystem.

In case of printed antenna, ensure that the simulation is performed with the solder mask

in consideration.

6

7

Ensure that the antenna has a near omni-directional pattern.

The feed point of the antenna is required to be grounded. This is only for the antenna

type used on the CC3120MOD BoosterPack. Refer to the specific antenna data sheets

for the recommendations.

8

9

To use the FCC certification of the module, see the CC3120 and CC3220 Radio

Certifications wiki page on CC3120 Radio certification

表10-3 lists the recommended antennas to use with the CC3120MOD module. Other antennas may be available

for use with the CC3120MOD module. See the CC3120 and CC3220 Radio Certifications wiki page.

表10-3. Recommended Components

CHOICE

PART NUMBER

MANUFACTURER

NOTES

Can be placed at the edge of the PCB using the

least amount of PCB area.

1

AH316M245001-T

Taiyo Yuden

10.2.4 Transmission Line Considerations

The RF signal from the device is routed to the antenna using a Coplanar Waveguide with ground (CPW-G)

structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to the RF

lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional

shielding. 图10-4 shows a cross section of the coplanar waveguide with the critical dimensions.

图10-4. Coplanar Waveguide (Cross Section)

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图10-5 shows the top view of the coplanar waveguide with GND and via stitching.

S

W

图10-5. CPW With GND and Via Stitching (Top View)

The recommended values for the PCB are provided for 2-layer boards in 表10-4 and 4-layer boards in 表10-5.

表10-4. Recommended PCB Values for 2-Layer

Board (L1 to L2 = 42.1 mils)

PARAMETER

VALUE

24.5

6.5

UNIT

mils

W

S

H

42.1

4.8

Er (FR-4 substrate)

表10-5. Recommended PCB Values for 4-Layer

Board (L1 to L2 = 16 mils)

PARAMETER

VALUE

UNITS

mils

W

S

21

10

mils

H

16

mils

Er (FR-4 substrate)

4.5

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11 Environmental Requirements and Specifications

11.1 Temperature

11.1.1 PCB Bending

The PCB bending specification will maintain planeness at a thickness of less than 0.1 mm.

11.2 Handling Environment

11.2.1 Terminals

The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do not touch

the LGA portion by hand.

11.2.2 Falling

The mounted components will be damaged if the product falls or is dropped. Such damage may cause the

product to malfunction.

11.3 Storage Condition

11.3.1 Moisture Barrier Bag Before Opened

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The

calculated shelf life for the dry-packed product will be 12 months from the date the bag is sealed.

11.3.2 Moisture Barrier Bag Open

Humidity indicator cards must be blue, < 30%.

11.4 Baking Conditions

Products require baking before mounting if:

• Humidity indicator cards read > 30%

• Temp < 30°C, humidity < 70% RH, over 96 hours

Baking condition: 90°C, 12–24 hours

Baking times: 1 time

11.5 Soldering and Reflow Condition

• Heating method: Conventional convection or IR convection

• Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or

equivalent method

• Solder paste composition: Sn/3.0 Ag/0.5 Cu

• Allowable reflow soldering times: 2 times based on the reflow soldering profile

(see 图11-1)

• Temperature profile: Reflow soldering will be done according to the temperature profile (see

图11-1)

• Peak temp: 245°C

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图11-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder Joint)

Note

TI does not recommend the use of conformal coating or similar material on the SimpleLink module.

This coating can lead to localized stress on the WCSP solder connections inside the module and

impact the device reliability. Use caution during the module assembly process to the final PCB to

avoid the presence of foreign material inside the module.

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12 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed in this section.

12.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the

CC3120MOD and support tools (see 图12-1).

X

CC

3120 MOD

R

NM

MOB

R

PREFIX

X = preproduction device

no prefix = production device

PACKAGING

R = tape/reel

T = small reel

DEVICE FAMILY

CC = wireless connectivity

PACKAGE DESIGNATOR

MOB = LGA

SERIES NUMBER

3 = Wi-Fi^®centric

NM = No Memory

R = ROM

MOD = module

图12-1. CC3120MOD Module Nomenclature

For orderable part numbers of CC3120MOD modules in the MOB package types, see the Package Option

Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

12.2 Development Tools and Software

For the most up-to-date list of development tools and software, visit the CC3120MOD tools and software page.

You can also click on the Alert me button in the top-right corner of the page to stay informed about updates

related to the CC3120MOD.

SimpleLink™ Wi-Fi^®

Starter Pro

The SimpleLink™ Wi-Fi® Starter Pro mobile application is a new mobile app for

SimpleLink provisioning. It goes with the embedded provisioning library and example

that runs on the device side. The new provisioning release is TI's recommendation for

Wi-Fi provisioning using SimpleLink Wi-Fi products. It implements advanced AP

mode provisioning with feedback and fallback options to ensure a successful process

has been accomplished. Customers can use both the embedded library and the

mobile library for integration into their end products.

SimpleLink™ Wi-Fi^®

CC3120 SDK Plugin

The CC3120 SDK contains drivers, many sample applications for Wi-Fi features and

internet, and documentation needed to use the CC3120 Internet-on-a chip solution.

This SDK can be used with TI’s MSP432P401R LaunchPad^™, or SimpleLink Studio,

a PC tool that allows MCU development with the CC3120. You can also use the SDK

as example code for any platform. All sample applications in the SDK are supported

on TI’s MSP432P401R ultra-low-power MCUs with Code Composer Studio^™IDE

and TI RTOS. In addition, many of the applications support IAR.

SimpleLink™ Studio for SimpleLink™ Studio for CC31xx is a Windows®-based software tool used to aid in

CC31xx

the development of embedded networking applications and software for

microcontrollers. Using SimpleLink Studio for CC31xx, embedded software

developers can develop and test applications using any desktop IDE, such as Visual

Studio or Eclipse, and connect their applications to the cloud using the CC31xx

BoosterPack^™. The application can then be easily ported to any microcontroller. With

the SimpleLink Wi-Fi CC31xx solution, customers now have the flexibility to add Wi-Fi

to any microcontroller (MCU). This Internet-on-a chip solution contains all you need to

easily create IoT solutions –security, quick connection, cloud support and more. For

more information on CC31xx devices, visit http://www.ti.com/simplelinkwifi.

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SimpleLink™ Wi-Fi^®

Radio Testing Tool

The SimpleLink™ Wi-Fi® Radio Testing Tool is a Windows-based software tool for RF

evaluation and testing of SimpleLink Wi-Fi CC3120 and CC3220 designs during

development and certification. The tool enables low-level radio testing capabilities by

manually setting the radio into transmit or receive modes. Use of the tool requires

familiarity and knowledge of radio circuit theory and radio test methods.

Uniflash Standalone

Flash Tool for TI

CCS Uniflash is a standalone tool used to program onchip flash memory on TI MCUs

and onboard flash memory for Sitara processors. Uniflash has a GUI, command line,

Microcontrollers (MCU), and scripting interface. CCS Uniflash is available free of charge.

Sitara Processors and

SimpleLink™ Devices

12.3 Firmware Updates

TI updates features in the service pack for this module with no published schedule. Due to the ongoing changes,

TI recommends that users have the latest service pack in their module for production.

To stay informed, sign up with the SDK Alert me button in the top-right corner of the product page or visit here.

12.4 Documentation Support

To receive notification of documentation updates — including silicon errata — go to the CC3120MOD product

folder on ti.com, and click the Alert me button in the upper-right corner. This registers you to receive a weekly

digest of updated product information (if any). For change details, check the revision history of any revised

document. The current documentation which describes the processor, related peripherals, and other technical

collateral follows. The following documents provide support for the CC3120MOD module.

Application Reports

Transfer of TI's Wi-Fi^®Alliance

Certifications to Products Based on derivative certification transfer policy to transfer a WFA certification,

This document explains how to employ the Wi-Fi® Alliance (WFA)

SimpleLink™

already obtained by Texas Instruments, to a system you have developed.

SimpleLink™ CC3x20 Wi-Fi^®

The SimpleLink Wi-Fi CC3120 and CC3220 Internet-on-a chip family of

Internet-on-a chip™ Solution Built- devices from Texas Instruments offers a wide range of built-in security

In Security Features

features to help developers address a variety of security needs, which is

achieved without any processing burden on the main MCU. This document

describes these security-related features and provides recommendations

for leveraging each feature in the context of practical system

implementation.

Using Serial Flash on SimpleLink™ This application note is divided into two parts. The first part provides

CC3x20 Wi-Fi^®and Internet-of-

Things Devices

important guidelines and best practice design techniques to consider when

choosing and embedding a serial flash paired with the CC3120 and

CC3220 (CC3x20) devices. The second part describes the file system,

along with guidelines and considerations for system designers working

with the CC3x20 devices.

SimpleLink™ CC3x20 Wi-Fi^®and This document describes the OTA library for the SimpleLink™ Wi-Fi®

Internet-of-Things Over-the-Air

Update

CC3x20 family of devices from Texas Instruments and explains how to

prepare a new cloud-ready update to be downloaded by the OTA library.

SimpleLink™ CC3x20 Wi-Fi^®

Internet-on-a chip™ Solution

Device Provisioning

This guide describes the provisioning process, which provides the

SimpleLink Wi-Fi device with the information (network name, password,

and so forth) needed to connect to a wireless network.

SimpleLink™ CC3x20 Wi-Fi^®

Internet-on-a chip™ Networking

Subsystem Power Management

This application report describes the best practices for power management

and extended battery life for embedded low-power Wi-Fi devices such as

the SimpleLink Wi-Fi Internet-on-a chip™ solution from Texas Instruments

™.

42

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User's Guides

SimpleLink™ CC3x20 Wi-Fi^®

Embedded Programming

This application note describes in detail additional options that leverage all the

features UniFlash has to offer, but without the necessary connected PC. This

option is referred to as Embedded Programming. To achieve embedded

programming, bootloader protocol implemented over UART is described in

detail.

UniFlash SimpleLink™ CC3x20 This document describes the installation, operation, and usage of the

Wi-Fi^®and IoC™ Solution

ImageCreator and Pro

SimpleLink ImageCreator tool as part of the UniFlash.

SimpleLink™ CC3x20 Wi-Fi^®

This document provides software (SW) programmers with all of the required

and Internet-of-Things Network knowledge for working with the networking subsystem of the SimpleLink Wi-Fi

Processor

devices. This guide provides basic guidelines for writing robust, optimized

networking host applications, and describes the capabilities of the networking

subsystem. The guide contains some example code snapshots, to give users

an idea of how to work with the host driver. More comprehensive code

examples can be found in the formal software development kit (SDK). This

guide does not provide a detailed description of the host driver APIs.

SimpleLink™ CC3x20 Wi-Fi^®

Provisioning for Mobile

Applications

This guide describes TI’s SimpleLink™ Wi-Fi® provisioning solution for

mobile applications, specifically on the usage of the Android™ and iOS®

building blocks for UI requirements, networking, and provisioning APIs

required for building the mobile application.

SimpleLink™ CC3120 Wi-Fi^®

Internet-on-a chip™ Solution

SDK

This guide is intended to help users in the initial setup and demonstration of

the different demos in the CC3120 SDK. The guide lists the software and

hardware components required to get started, and explains how to install the

supported integrated development environment (IDE), SimpleLink CC3120

SDK, and the various other tools required.

SimpleLink™ CC3x20 Wi-Fi^®

and Internet-on-a chip™

Solution Radio Tool

The Radio Tool serves as a control panel for direct access to the radio, and

can be used for both the radio frequency (RF) evaluation and for certification

purposes. This guide describes how to have the tool work seamlessly on

Texas Instruments ™ evaluation platforms such as the BoosterPack™ plus

FTDI emulation board for CC3120 devices, and the LaunchPad™ for CC3220

devices.

SimpleLink™ CC3120 Wi-Fi^®

The SimpleLink Wi-Fi CC3120 wireless network processor from Texas

BoosterPack™ Plug-In Module Instruments™ provides users the flexibility to add Wi-Fi to any MCU. This

and IoT Solution

user's guide explains the various configurations of the CC3120 BoosterPack™

Plug-In Module.

More Literature

RemoTI Manifest

Design Files

SimpleLink™ CC3120MOD WI-Fi® and Internet of Things CC3120 Hardware

SimpleLink™ CC3x20 Wi-Fi® and Internet of Things

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12.5 Trademarks

Wi-Fi CERTIFIED^™is a trademark of Wi-Fi Alliance.

Internet-on-a chip^™, SmartConfig^™, E2E^™, LaunchPad^™, Code Composer Studio^™, and BoosterPack^™are

trademarks of Texas Instruments.

SimpleLink^™is a trademark of TI.

Wi-Fi^®and Wi-Fi Direct^®are registered trademarks of Wi-Fi Alliance.

Arm^®and Cortex^®are registered trademarks of Arm Limited.

蓝牙^®is a registered trademark of Bluetooth SIG Inc.

所有商标均为其各自所有者的财产。

12.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

12.7 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

44

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13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document.

13.1 Mechanical, Land, and Solder Paste Drawings

Note

1. The total height of the module is 2.45 mm.

2. The weight of the module is 0.00175 kg ±3%.

Note

1. All dimensions are in mm.

2. Solder mask should be the same or 5% larger than the dimension of the pad

3. Solder paste must be the same as the pin for all peripheral pads. For ground pins, make the

solder paste 20% smaller than the pad.

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13.3 Tape and Reel Information

Emboss taping specification for MOC 1000 pin.

13.3.1 Tape and Reel Specification

Surface resistance

Vendor No.

Spec

图13-1. Tape Specification

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25

1000

图13-2. Reel Specification

48

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重要声明和免责声明

TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没

有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。

这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可

将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知

识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。

TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI

提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PACKAGE OUTLINE

MOB0063A

QFM - 2.4 mm max height

SCALE 0.650

QUAD FLAT MODULE

17.75

17.25

B

A

PIN 1 INDEX

AREA

20.75

20.25

2X (0.45)

2X (0.38)

C

2.40

2.03

0.1

0.88

0.72

2X 12.7

20X 1.27

(0.3) TYP

30X 1.27

17

27

16

15

28

29

(0.32)

PADS 1,16,28 & 43

(0.3)

TYP

9X

0.05

2

1.5

60

57

56

63

2X

19.05

59

62

61

6X 3

55

58

54X 0.81 0.08

2

1

42

0.15

0.05

C A B

C

44 43

54

PIN 1 ID

(45 X1)

1.5

6X 3

4221462/D 06/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

MOB0063A

QFM - 2.4 mm max height

QUAD FLAT MODULE

PKG

SEE DETAIL

54X ( 0.81)

54

44

1

2

43

42

(

8.1)

9X ( 2)

0.05 MIN TYP

58

(45 X 1)

(

0.2) TYP

VIA

61

62

55

56

METAL UNDER

SOLDER MASK

OPENING

9X

59

PKG

6X (3)

(1.5)

2X (19.1)

63

57

(0.65)

TYP

60

(1.5)

(0.65)

TYP

6X (3)

(1.27) TYP

15

16

29

28

17

27

(R0.05)

ALL PADS

2X (16.1)

LAND PATTERN EXAMPLE

SOLDER MASK DEFINED

SCALE:6X

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SIGNAL PADS DETAIL

4221462/D 06/2019

NOTES: (continued)

3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments

literature number SLUA271 (www.ti.com/lit/slua271).

www.ti.com

EXAMPLE STENCIL DESIGN

MOB0063A

QFM - 2.4 mm max height

QUAD FLAT MODULE

PKG

54X ( 0.81)

54

44

1

2

43

(R0.05)

TYP

42

SOLDER MASK

EDGE, TYP

SOLDER MASK EDGE

SEE DETAILS

58

55

61

62

59

56

57

PKG

(3) TYP

2X (19.1)

(1.5) TYP

63

60

(1.5) TYP

(3) TYP

(1.27) TYP

15

16

29

28

17

27

2X (16.1)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PADS PRINTED SOLDER COVERAGE BY AREA

PAD 55: 77.5 %, PADS 56 - 63: 79%

SCALE:6X

(1.54)

(0.55) TYP

(0.45)

(

0.89) TYP

2X ( 0.89)

(0.55 TYP)

METAL

TYP

(R0.05) TYP

(R0.05)

TYP

PADS 56 - 63 DETAIL

PAD 55 DETAIL

SCALE:10X

4221462/D 06/2019

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265


型号：	CC3120MOD
厂家：	TEXAS INSTRUMENTS
描述：	适用于物联网且具有 6 个 TLS/SSL 插槽的 SimpleLink™ Wi-Fi CERTIFIED™ 网络处理器模块
文件：	总53页 (文件大小：2495K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CC3120MOD [TI]

相关型号：

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CC3120RNMARGKR

CC3120RNMARGKT

CC3130

CC3130A48M020

CC3130RNMRGKR

CC3135

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CC3135MODRNMMOBR

CC3135RNMRGKR

CC3200

CC3200MOD