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BQ51013ARHLT [TI]

INTEGRATED WIRELESS POWER SUPPLY RECEIVER; 集成无线电源接收器
BQ51013ARHLT
型号： BQ51013ARHLT
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

INTEGRATED WIRELESS POWER SUPPLY RECEIVER
集成无线电源接收器

无线
文件： 总45页 (文件大小：3852K)
中文：  中文翻译
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bq51013A  
bq51014  
www.ti.com  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
INTEGRATED WIRELESS POWER SUPPLY RECEIVER,  
Qi (WIRELESS POWER CONSORTIUM) COMPLIANT  
Check for Samples: bq51013A, bq51014  
1
FEATURES  
•
Integrated Wireless Power Receiver Solution  
with a 5V Regulated Supply  
DESCRIPTION  
The bq5101x is an advanced, integrated, receiver IC  
for wireless power transfer in portable applications.  
The device provides the AC/DC power conversion  
while integrating the digital control required to comply  
with the Qi v1.0 communication protocol. Together  
with the bq500210 transmitter controller, the bq5101x  
–
–
–
93% Overall Peak AC-DC Efficiency  
Full Synchronous Rectifier  
WPC v1.0 Compliant Communication  
Control  
enables  
a complete contact-less power transfer  
–
–
Output Voltage Conditioning  
system for a wireless power supply solution. By using  
near-field inductive power transfer, the receiver coil  
embedded in the portable device receives the power  
transmitted by the transmitter coil via mutually  
coupled inductors. The AC signal from the receiver  
coil is then rectified and regulated to be used as a  
power supply for down-system electronics. Global  
feedback is established from the secondary to the  
transmitter in order to stabilize the power transfer  
process via back-scatter modulation. This feedback is  
established by using the Qi v1.0 communication  
protocol supporting up to 5 W applications.  
Only IC Required Between RX coil and 5V  
DC Output Voltage  
•
•
•
Dynamic Rectifier Control for Improved Load  
Transient Response  
Dynamic Efficiency Scaling for Optimized  
Performance Over any Range of Output Power  
Adaptive Communication Limit for Robust  
Communication During High Levels of Load  
Current Noise  
•
•
Supports 20-V Maximum Input  
Low-power Dissipative Rectifier Overvoltage  
Clamp (VOVP = 15V)  
The device integrates  
a
low-impedance full  
synchronous rectifier, low-dropout regulator, digital  
control, and accurate voltage and current loops. The  
entire power stage (rectifier and LDO) use low  
resistive NMOS FET’s to ensures high efficiency and  
low power dissipation.  
•
•
Thermal Shutdown  
Multifunction NTC and Control Pin for  
Temperature Monitoring, Done Charging and  
Fault Host Control  
Power  
bq5101x  
•
•
Stand-alone Digital Controller  
Voltage  
Conditioning  
Programmable Termination Pin for Charge  
Status 100% (CS100) Support  
AC to DC  
Drivers  
Rectification  
Load  
Communication  
•
1.9 x 3mm DSBG or 4.5 x 3.5mm QFN Package  
Controller  
V/I  
Sense  
Controller  
APPLICATIONS  
•
•
•
•
•
•
WPC Compliant Receivers  
Cell Phones, Smart Phones  
Headsets  
bq500210  
Transmitter  
Receiver  
Figure 1. Wireless Power Consortium  
(WPC or Qi) Inductive Power System  
Digital Cameras  
Portable Media Players  
Hand-held Devices  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2012, Texas Instruments Incorporated  
bq51013A  
bq51014  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION  
Ordering Number  
Part NO  
Marking  
Function  
Package  
Quantity  
(Tape and Reel)  
bq51013AYFPR  
bq51013AYFPT  
bq51013ARHLR  
bq51013ARHLT  
bq51014YFPR  
bq51014YFPT  
3000  
250  
DSBGA-YFP  
bq51013A  
bq51013A  
5V Regulated Power Supply  
3000  
250  
QFN-RHL  
3000  
250  
bq51014  
bq51014  
5V Regulated Power Supply  
DSBGA-YFP  
AVAILABLE OPTIONS  
Over  
Current  
Shutdown  
WPC  
Version  
Termination Communication  
(CS100)  
Device  
Function  
VRECT-OVP  
VOUT-(REG)  
AD-OVP  
Current Limit(1) (2)  
Tracking + 1s Hold-  
Off  
bq51013A  
bq51014  
5V Power Supply  
5V Power Supply  
v1.0  
v1.0  
15V  
15V  
5V  
5V  
Disabled  
Enabled  
Disabled Disabled  
Tracking + 1s Hold-  
Off  
12.5V  
Enabled  
(1) Enabled if EN2 is low and disabled if EN2 is high  
(2) Communication current limit is disabled for 1 second at startup  
ABSOLUTE MAXIMUM RATINGS(1)(2)  
over operating free-air temperature range (unless otherwise noted)  
VALUES  
PARAMETER  
PIN  
UNITS  
MIN  
MAX  
AC1, AC2, RECT, COM1, COM2, OUT, CHG,  
CLAMP1, CLAMP2  
V
-0.3  
20  
AD, AD-EN  
-0.3  
-0.3  
-0.3  
30  
26  
7
V
Input Voltage  
BOOT1, BOOT2  
V
V
EN1, EN2, TERM, FOD, TS-CTRL, ILIM  
Input Current  
AC1, AC2  
OUT  
2
A(RMS)  
A
Output Current  
1.5  
15  
1
CHG  
mA  
A
Output Sink Current  
COM1, COM2  
Junction temperature, TJ  
-40  
-65  
2
150  
150  
°C  
Storage temperature, TSTG  
ESD Rating (HBM) (100pF, 1.5KΩ)  
°C  
All  
kV  
(1) All voltages are with respect to the VSS terminal, unless otherwise noted.  
(2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
2
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Copyright © 2012, Texas Instruments Incorporated  
Product Folder Link(s): bq51013A bq51014  
bq51013A  
bq51014  
www.ti.com  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
THERMAL INFORMATION  
RHL  
20 PiNS  
37.7  
YFP  
28 PINS  
58.9  
0.2  
THERMAL METRIC(1)  
UNITS  
θJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
θJCtop  
θJB  
35.5  
13.6  
9.1  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
0.5  
1.4  
ψJB  
13.5  
8.9  
θJCbot  
2.7  
n/a  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
Input voltage range, VIN  
PINS  
RECT  
RECT  
OUT  
MIN  
MAX  
10  
UNITS  
V
4
Input current, IIN  
1.5  
1.5  
1
A
Output current, IOUT  
Sink current, IAD-EN  
A
AD-EN  
COMM  
mA  
mA  
ºC  
COMM sink current, ICOMM  
Junction Temperature, TJ  
500  
125  
0
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): bq51013A bq51014  
bq51013A  
bq51014  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
www.ti.com  
TYPICAL APPLICATION SCHEMATICS  
bq5101x  
AD-EN  
AD  
System  
Load  
OUT  
CCOMM1  
CBOOT1  
C4  
COMM1  
BOOT1  
AC1  
D1  
RECT  
C1  
R4  
C3  
HOST  
COIL  
C2  
TS-CTRL  
AC2  
NTC  
BOOT2  
COMM2  
CBOOT2  
CCOMM2  
CCLAMP2  
CCLAMP1  
CHG  
3 - State  
CLAMP2  
CLAMP1  
ILIM  
EN1 or TERM  
EN2  
Bi-State  
Bi-State  
FOD  
PGND  
RTERM  
(bq51014)  
R1  
140Ω  
Figure 2. bq5101x Used as a Wireless Power Receiver and Power Supply for System Loads  
4
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Copyright © 2012, Texas Instruments Incorporated  
Product Folder Link(s): bq51013A bq51014  
 
bq51013A  
bq51014  
www.ti.com  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
System  
Load  
Q1  
USB or  
AC Adapter  
Input  
D2 (bq51014)  
bq5101x  
AD-EN  
AD  
OUT  
CCOMM1  
CBOOT1  
C4  
COMM1  
BOOT1  
AC1  
C5  
D1  
RECT  
C1  
R4  
C3  
COIL  
C2  
TS-CTRL  
AC2  
NTC  
BOOT2  
COMM2  
CBOOT2  
HOST  
CHG  
Tri-State  
CCOMM2  
CCLAMP2  
CCLAMP1  
CLAMP2  
CLAMP1  
ILIM  
EN1 or TERM  
EN2  
Bi-State  
Bi-State  
FOD  
PGND  
RTERM  
(bq51014)  
R1  
140Ω  
Figure 3. bq5101x Used as a Wireless Power Receiver and Power Supply for System Loads With Adapter  
Power-Path Multiplexing  
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): bq51013A bq51014  
 
bq51013A  
bq51014  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
over operating free-air temperature range, 0°C to 125°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VRECT: 0V → 3V  
MIN  
TYP  
2.7  
MAX  
UNIT  
V
UVLO  
VHYS  
Undervoltage lock-out  
Hysteresis on UVLO  
2.6  
2.8  
VRECT: 3V → 2V  
250  
150  
15  
mV  
mV  
V
Hysteresis on OVP  
VRECT: 16V → 5V  
VRECT  
Input overvoltage threshold  
Dynamic VRECT Threshold 1  
VRECT: 5V → 16V  
14.5  
15.5  
ILOAD < 0.1 x IILIM (ILOAD rising)  
7.08  
0.1 x IILIM < ILOAD < 0.2 x IILIM  
(ILOAD rising)  
Dynamic VRECT Threshold 2  
6.28  
VRECT-REG  
V
0.2 x IILIM < ILOAD < 0.4 x IILIM  
(ILOAD rising)  
Dynamic VRECT Threshold 3  
Dynamic VRECT Threshold 4  
5.53  
5.11  
4%  
ILOAD > 0.4 x IILIM (ILOAD rising)  
ILOAD Hysteresis for dynamic VRECT  
thresholds as a % of IILIM  
ILOAD  
ILOAD falling  
Rectifier undervoltage protection, restricts  
IOUT at VRECT-DPM  
VRECT-DPM  
VRECT-REV  
Quiescent Current  
3
3.1  
8
3.2  
9
V
V
Rectifier reverse voltage protection at the  
output  
VRECT-REV = VOUT - VRECT  
VOUT = 10V  
,
ILOAD = 0 mA, 0°C ≤ TJ ≤ 85°C  
8
2
10  
mA  
mA  
Active chip quiescent current consumption  
from RECT  
IRECT  
ILOAD = 300 mA, 0°C ≤ TJ ≤  
85°C  
3.0  
Quiescent current at the output when  
wireless power is disabled (Standby)  
IOUT  
VOUT = 5 V, 0°C ≤ TJ ≤ 85°C  
20  
35  
µA  
ILIM Short Circuit  
Highest value of ILIM resistor considered a  
fault (short). Monitored for IOUT > 100 mA  
RILIM: 200Ω → 50Ω. IOUT  
latches off, cycle power to reset  
RILIM  
120  
Ω
Deglitch time transition from ILIM short to  
IOUT disable  
tDGL  
1
ms  
ILIM-SHORT,OK enables the ILIM short  
comparator when IOUT is greater than this  
value  
ILOAD: 0 → 20 0mA  
ILOAD: 0 → 200 mA  
120  
145  
30  
165  
2.4  
mA  
mA  
A
ILIM_SC  
Hysteresis for ILIM-SHORT,OK comparator  
Maximum ILOAD that will be  
delivered for 1 ms when ILIM is  
shorted  
IOUT  
Maximum output current limit, CL  
OUTPUT  
ILOAD = 1000 mA  
ILOAD = 10 mA  
4.85  
4.95  
4.95  
5
5
VOUT-REG  
Regulated output voltage  
V
5.05  
RLIM = KILIM / IILIM, where IILIM is  
the hardware current limit. IOUT  
= 1 A  
AΩ  
Current programming factor for hardware  
short circuit protection  
KILIM  
280  
300  
320  
IIMAX = KIMAX / RLIM where IMAX  
AΩ  
Current programming factor for the nominal is the maximum normal  
KIMAX  
230  
250  
270  
1500  
420  
operating current  
operating current.  
IOUT = 1 A  
IOUT  
Current limit programming range  
mA  
mA  
mA  
IOUT > 300 mA  
IOUT < 300 mA  
IOUT + 50  
390  
ICOMM  
Current limit during WPC communication  
365  
Hold off time for the communication current  
limit during startup  
tHOLD  
1
s
6
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Copyright © 2012, Texas Instruments Incorporated  
Product Folder Link(s): bq51013A bq51014  
 
bq51013A  
bq51014  
www.ti.com  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
ELECTRICAL CHARACTERISTICS (continued)  
over operating free-air temperature range, 0°C to 125°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
TERMINATION (Charge Status 100%) – bq51014 ONLY  
Programmable termination factor as a  
percentage of IMAX  
KTERM  
RTERM = %IMAX x KTERM  
160  
200  
240  
Ω/%  
High termination current threshold  
calculation  
ITERM-HI = (RTERM / KTERM) x 0.01 x IMAX, where IMAX = KIMAX / RILIM  
25  
ITERM  
Low termination current threshold  
mA  
µA  
Constant current at the TERM pin to bias  
the termination resistor  
VTERM = 0 V  
48  
51  
54  
High termination threshold deglitch  
High termination threshold deglitch  
ITERM-LOW< IOUT < ITERM-HI  
IOUT < ITERM-LOW  
180  
7
sec  
sec  
tTERM  
TS / CTRL  
ITS-Bias < 100 µA (periodically  
driven see tTS-CTRL)  
VTS  
Internal TS Bias Voltage  
2
2.2  
2.4  
V
Rising threshold  
VTS: 50% → 60%  
56.5  
58.7  
1
60.8  
VCOLD  
Falling hysteresis  
VTS: 60% → 50%  
%VTS-Bias  
Falling threshold  
VTS: 20% → 15%  
18.5  
19.6  
1
20.7  
VHOT  
Rising hysteresis  
VTS: 15% → 20%  
CTRL pin threshold for a high  
CTRL pin threshold for a low  
VTS/CTRL: 50 → 150mV  
VTS/CTRL: 150 → 50mV  
80  
50  
100  
80  
130  
100  
mV  
mV  
VCTRL  
Time VTS-Bias is active when TS  
measurements occur  
Synchronous to the  
communication period  
tTS-CTRL  
tTS  
24  
10  
20  
ms  
ms  
kΩ  
Deglitch time for all TS comparators  
Pull-up resistor for the NTC network. Pulled  
up to the voltage bias  
RTS  
18  
22  
THERMAL PROTECTION  
Thermal shutdown temperature  
Thermal shutdown hysteresis  
OUTPUT LOGIC LEVELS ON WPG  
155  
20  
°C  
°C  
TJ  
VOL  
Open drain WPG pin  
ISINK = 5 mA  
VCHG = 20 V  
500  
1
mV  
µA  
IOFF  
WPG leakage current when disabled  
COMM PIN  
RDS(ON)  
fCOMM  
COM1 and COM2  
VRECT = 2.6 V  
1.5  
Ω
Signaling frequency on COMM pin  
Comm pin leakage current  
2.00  
Kb/s  
µA  
IOFF  
VCOM1 = 20 V, VCOM2 = 20 V  
1
CLAMP PIN  
RDS(ON)  
Adapter Enable  
Clamp1 and Clamp2  
1
Ω
VAD Rising threshold voltage. EN-UVLO  
VAD-EN hysteresis, EN-HYS  
Input leakage current  
VAD 0 → 5 V  
3.5  
12  
3.6  
3.8  
V
VAD-EN  
IAD  
VAD 5 → 0 V  
400  
mV  
μA  
VRECT = 0V, VAD = 5V  
60  
13  
Adapter mode OVP threshold  
rising edge  
bq51014 VAD 10 → 15 V  
12.5  
0.5  
V
V
VAD-OVP  
VAD-OVP hysteresis  
VAD 15 → 10 V  
Pull-up resistance from AD-EN to OUT  
when adapter mode is disabled and VOUT  
VAD, EN-OUT  
RAD  
>
VAD = 0, VOUT = 5  
200  
4.5  
350  
5
Ω
Voltage difference between VAD and VAD-EN  
when adapter mode is enabled, EN-ON  
VAD  
VAD = 5 V, 0°C ≤ TJ ≤ 85°C  
3
V
Copyright © 2012, Texas Instruments Incorporated  
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Product Folder Link(s): bq51013A bq51014  
bq51013A  
bq51014  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
www.ti.com  
ELECTRICAL CHARACTERISTICS (continued)  
over operating free-air temperature range, 0°C to 125°C (unless otherwise noted)  
PARAMETER  
Synchronous Rectifier  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
IOUT at which the synchronous rectifier  
enters half synchronous mode, SYNC_EN  
ILOAD 200 → 0 mA  
ILOAD 0 → 200 mA  
80  
100  
25  
125  
mA  
mA  
V
IOUT  
Hysteresis for IOUT,RECT-EN (full-  
synchronous mode enabled)  
High-side diode drop when the rectifier is in IAC-VRECT = 250 mA and TJ =  
half synchronous mode  
VHS-DIODE  
0.7  
25°C  
EN1 and EN2  
VIL  
Input low threshold for EN1 and EN2  
Input high threshold for EN1 and EN2  
EN1 and EN2 pull down resistance  
0.4  
V
V
VIH  
RPD  
1.3  
200  
±6  
kΩ  
ADC (WPC Related Measurements and Coefficients)  
Rectified power accuracy as a percentage  
of output power  
PRECT  
0W – 5W of rectified power  
%
8
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Copyright © 2012, Texas Instruments Incorporated  
Product Folder Link(s): bq51013A bq51014  
bq51013A  
bq51014  
www.ti.com  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
DEVICE INFORMATION  
SIMPLIFIED BLOCK DIAGRAM  
M1  
RECT  
I
OUT  
VOUT,FB  
VREF,ILIM  
_
+
_
VILIM  
+
VOUT,REG  
VREF,IABS  
+
_
VIABS,FB  
ILIM  
VIN,FB  
VIN,DPM  
+
_
AD  
+
_
VREFAD,OVP  
BOOT2  
BOOT1  
_
+
VREFAD,UVLO  
AD-EN  
AC1  
AC2  
Sync  
Rectifier  
Control  
VREF,TS-BIAS  
VFOD  
+
_
FOD  
COMM1  
COMM2  
+
_
TS_COLD  
TS_HOT  
VBG,REF  
VIN,FB  
VOUT,FB  
+
_
DATA_  
OUT  
VILIM  
VIABS,FB  
ADC  
TS-CTRL  
CLAMP1  
CLAMP2  
VIABS,REF  
VIC,TEMP  
VFOD  
+
_
TS_DETECT  
VREF_100MV  
Digital Control  
50uA  
+
_
ILIM  
CHG  
EN1 or  
TERM  
200kW  
200kW  
VRECT  
VOVP,REF  
+
_
OVP  
EN2  
PGND  
Copyright © 2012, Texas Instruments Incorporated  
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Product Folder Link(s): bq51013A bq51014  
bq51013A  
bq51014  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
www.ti.com  
YFP Package  
(TOP VIEW)  
RHL Package  
(TOP VIEW)  
PGND  
PGND  
20  
1
A1  
A2  
A3  
A4  
AC1  
2
AC2  
19  
PGND  
PGND  
PGND  
PGND  
BOOT1  
3
RECT  
18  
B1  
B2  
B3  
B4  
AC2  
AC2  
AC1  
AC1  
OUT  
4
BOOT2  
17  
C1  
C2  
C3  
C4  
BOOT2  
RECT  
RECT  
BOOT1  
CLMP1  
5
CLMP2  
16  
D1  
D2  
D3  
D4  
OUT  
OUT  
OUT  
OUT  
COM1  
6
COM2  
15  
E1  
E2  
E3  
E4  
COM2  
CLMP2 CLMP1  
COM1  
CHG  
7
FOD  
14  
F1  
F2  
F3  
F4  
TS-  
CTRL  
13  
AD-EN  
8
TS-CTRL  
FOD  
/AD-EN  
/CHG  
G3  
EN1 or  
AD  
9
ILIM  
12  
G1  
G2  
G4  
ILIM  
EN2  
AD  
TERM  
EN1or  
TERM  
10  
EN2  
11  
PIN FUNCTIONS  
NAME  
AC1  
YFP  
B3, B4  
B1, B2  
C4  
RHL  
2
I/O  
I
DESCRIPTION  
AC input from receiver coil antenna.  
AC2  
19  
3
I
BOOT1  
BOOT2  
O
O
Bootstrap capacitors for driving the high-side FETs of the synchronous rectifier. Connect a 10  
nF ceramic capacitor from BOOT1 to AC1 and from BOOT2 to AC2.  
C1  
17  
Filter capacitor for the internal synchronous rectifier. Connect a ceramic capacitor to PGND.  
Depending on the power levels, the value may be 4.7 μF to 22 μF.  
RECT  
OUT  
C2, C3  
18  
4
O
O
D1, D2, D3,  
D4  
Output pin, delivers power to the load.  
Open-drain output used to communicate with primary by varying reflected impedance. Connect  
through a capacitor to either AC1 or AC2 for capacitive load modulation (COM2 must be  
connected to the alternate AC1 or AC2 pin). For resistive modulation connect COM1 and  
COM2 to RECT via a single resistor; connect through separate capacitors for capacitive load  
modulation.  
COM1  
COM2  
E4  
E1  
6
O
O
Open-drain output used to communicate with primary by varying reflected impedance. Connect  
through a capacitor to either AC1 or AC2 for capacitive load modulation (COM1 must be  
connected to the alternate AC1 or AC2 pin). For resistive modulation connect COM1 and  
COM2 to RECT via a single resistor; connect through separate capacitors for capacitive load  
modulation.  
15  
CLMP2  
CLMP1  
E2  
E3  
16  
5
O
O
Open drain FETs which are utilized for a non-power dissipative over-voltage AC clamp  
protection. When the RECT voltage goes above 15 V, both switches will be turned on and the  
capacitors will act as a low impedance to protect the IC from damage. If used, Clamp1 is  
required to be connected to AC1, and Clamp2 is required to be connected to AC2 via 0.47µF  
capacitors.  
A1, A2, A3,  
A4  
PGND  
1, 20  
Power ground  
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PIN FUNCTIONS (continued)  
NAME  
YFP  
RHL  
I/O  
DESCRIPTION  
Programming pin for the over current limit. Connect external resistor to VSS. Size RILIM with  
the following equation: RILIM = 250 / IMAX where IMAX is the expected maximum output current  
of the wireless power supply. The hardware current limit (IILIM) will be 20% greater than IMAX  
or 1.2 x 1MAX. If the supply is meant to operate in current limit use  
ILIM  
G1  
12  
I/O  
RILIM = 300 / IILIM  
RILIM = R1 + 140  
Connect this pin to the wired adapter input. When a voltage is applied to this pin wireless  
charging is disabled and AD_EN is driven low. Connect to GND through a 1 µF capacitor. If  
unused, capacitor is not required and should be grounded directly. For the bq51014, there is  
an OVP protection of 12.5 V. If the AD voltage is greater than 12.5 V, wireless charging will  
remain active.  
AD  
G4  
F3  
F1  
9
I
O
I
Push-pull driver for external PFET connecting AD and OUT. This node is pulled to the higher  
of OUT and AD when turning off the external FET. This voltage tracks approximately 4 V below  
AD when voltage is present at AD and provides a regulated VSG bias for the external FET.  
Float this pin if unused.  
AD-EN  
TS-CTRL  
8
Must be connected to ground via a resistor. If an NTC function is not desired connect to GND  
with a 10 kΩ resistor. As a CTRL pin pull to ground to send end power transfer (EPT) fault to  
the transmitter or pull-up to an internal rail (i.e. 1.8 V) to send EPT termination to the  
transmitter. Note that a 3-state driver should be used to interface this pin (see the 3-state  
Driver section for further description)  
13  
EN1  
EN2  
G3  
G2  
10  
11  
I
I
Inputs that allow user to enable/disable wireless and wired charging <EN1 EN2>:  
<00> wireless charging is enabled unless AD voltage > 3.6 V  
<01> Dynamic communication current limit disabled  
<10> AD-EN pulled low, wireless charging disabled  
<11> wired and wireless charging disabled.  
Input that allows allows the upper termination threshold (ITERM-HI) to be programmable. KTERM  
=
200 Ω/%. Set the termination threshold by applying the following equation RTERM = %IMAX  
KTERM where %IMAX is the desired percentage of the maximum output current when  
termination should occur (i.e. 10% of 1 A = 0.1 mA)  
x
TERM  
G3  
10  
I
FOD  
CHG  
F2  
F4  
14  
7
O
O
Input for the rectified power measurement. Connect to GND with a 140 Ω resistor  
Open-drain output – active when output current is being delivered to the load (i.e. when the  
output of the supply is enabled).  
Spacer  
TYPICAL CHARACTERISTICS  
100.0  
100.0  
90.0  
80.0  
70.0  
60.0  
90.0  
Full Sync Mode Enabled  
80.0  
70.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
1.0  
2.0  
3.0  
4.0  
5.0  
Output Power (W)  
Output Power (W)  
Figure 4. Rectifier Efficiency  
Figure 5. IC Efficiency from AC Input to DC Output  
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TYPICAL CHARACTERISTICS (continued)  
Rising  
Falling  
70  
60  
50  
40  
30  
20  
10  
<−−− Dynamic Efficiency Scaling  
7.0  
6.5  
6.0  
5.5  
<−−− Dynamic Rectifier Control  
RILIM=500  
RILIM=220  
1
2
3
4
5
0.2  
0.4  
0.6  
0.8  
1.0  
Output Power (W)  
Output Current (A)  
G000  
G007  
Figure 6. Light Load Efficiency Improvement due to  
Dynamic Efficiency Scaling Feature(1)  
Figure 7. VRECT vs. ILOADat RILIM = 220Ω  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
RILIM=220  
RILIM=500  
RILIM=250  
RILIM=400  
RILIM=700  
RILIM=300  
7.0  
6.5  
6.0  
5.5  
Thermal Shutdown −−−>  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.0  
2.0  
3.0  
4.0  
5.0  
Output Current (A)  
Output Voltage (V)  
G007  
G001  
Figure 8. VRECT vs. ILOAD at RILIM = 220 Ω and 500 Ω  
Figure 9. VOUT Sweep (I-V Curve)(2)  
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TYPICAL CHARACTERISTICS (continued)  
100.0  
90.0  
80.0  
70.0  
60.0  
50.0  
40.0  
30.0  
5.01  
5.00  
4.99  
4.98  
4.97  
4.96  
4.95  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
Load Current (A)  
Load Current (A)  
Figure 10. ILOAD Sweep (I-V Curve)  
Figure 11. Output Ripple vs. ILOAD (COUT = 1µF)  
5.004  
5.002  
5.000  
4.998  
0
20  
40  
60  
80  
100  
120  
Temperature (°C)  
Figure 12. VOUT vs Temperature  
Figure 13. 1A Instantaneous Load Step(3)  
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TYPICAL CHARACTERISTICS (continued)  
VRECT  
VOUT  
Figure 14. 1A Instantaneous Load Dump(3)  
Figure 15. 1A Load Step Full System Response  
VRECT  
VRECT  
VOUT  
VOUT  
Figure 16. 1A Load Dump Full System Response  
Figure 17. Rectifier Overvoltage Clamp (fop = 110kHz)  
VTS/CTRL  
VRECT  
VRECT  
VOUT  
Figure 18. TS Fault  
Figure 19. Adapter Insertion (VAD = 10V)  
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TYPICAL CHARACTERISTICS (continued)  
VAD  
VRECT  
VAD_EN  
VOUT  
VOUT  
Figure 20. Adapter Insertion (VAD = 10V) Illustrating Break-  
Before-Make Operation  
Figure 21. 20V adapter Insertion with AD OVP Enabled  
(bq51014) and Wireless Power not Present  
VAD_EN  
VAD  
VAD  
VOUT  
VRECT  
Figure 22. AD OVP Condition While Wireless Charging is  
Active (bq51014)  
Figure 23. On the Go Enabled (VOTG = 3.5V)(4)  
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TYPICAL CHARACTERISTICS (continued)  
IOUT  
IOUT  
VRECT  
VRECT  
VOUT  
VOUT  
Figure 24. bq5101x Typical Startup with a 1A System Load  
Figure 25. Adaptive Communication Limit Event Where the  
400 mA Current Limit is Enabled (IOUT-DC < 300 mA)  
IOUT  
VRECT  
VOUT  
Figure 26. Adaptive Communication Limit Event Where the  
Current Limit is IOUT + 50 mA (IOUT-DC > 300 mA)  
Figure 27. Rx Communication Packet Structure  
(1) Efficiency measured from DC input to the transmitter to DC output of the receiver. Transmitter was the bq500210 EVM. Measurement  
subject to change if an alternate transmitter is used.  
(2) Curves illustrates the resulting ILIM current by sweeping the output voltage at different RILIM settings. ILIM current collapses due to the  
increasing power dissipation as the voltage at the output is decreased—thermal shutdown is occurring.  
(3) Total droop experienced at the output is dependent on receiver coil design. The output impedance must be low enough at that particular  
operating frequency in order to not collapse the rectifier below 5V.  
(4) On the go mode is enabled by driving EN1 high. In this test the external PMOS is connected between the output of the bq5101x IC and  
the AD pin; therefore, any voltage source on the output is supplied to the AD pin.  
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PRINCIPLE OF OPERATION  
Power  
bq5101x  
Voltage  
Load  
AC to DC  
Drivers  
Rectification  
Conditioning  
Communication  
Controller  
V/I  
Sense  
Controller  
bq500210  
Transmitter  
Receiver  
Figure 28. WPC Wireless Power System Indicating the Functional Integration of the bq5101x  
A Brief Description of the Wireless System:  
A wireless system consists of a charging pad (transmitter or primary) and the secondary-side equipment  
(receiver or secondary). There is a coil in the charging pad and in the secondary equipment which are  
magnetically coupled to each other when the secondary is placed on the primary. Power is then transferred from  
the transmitter to the receiver via coupled inductors (e.g. an air-core transformer). Controlling the amount of  
power transferred is achieved by sending feedback (error signal) communication to the primary (e.g. to increase  
or decrease power).  
The receiver communicates with the transmitter by changing the load seen by the transmitter. This load variation  
results in a change in the transmitter coil current, which is measured and interpreted by a processor in the  
charging pad. The communication is digital - packets are transferred from the receiver to the transmitter.  
Differential Bi-phase encoding is used for the packets. The bit rate is 2-kbps.  
Various types of communication packets have been defined. These include identification and authentication  
packets, error packets, control packets, end power packets, and power usage packets.  
The transmitter coil stays powered off most of the time. It occasionally wakes up to see if a receiver is present.  
When a receiver authenticates itself to the transmitter, the transmiter will remain powered on. The receiver  
maintains full control over the power transfer using communication packets.  
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Using the bq5101x as a Wireless Power Supply: (See Figure 3)  
Figure 3 is the schematic of a system which uses the bq5101x as power supply while power multiplexing the  
wired (adapter) port.  
When the system shown in Figure 3 is placed on the charging pad, the receiver coil is inductively coupled to the  
magnetic flux generated by the coil in the charging pad which consequently induces a voltage in the receiver coil.  
The internal synchronous rectifier feeds this voltage to the RECT pin which has the filter capacitor C3.  
The bq5101x identifies and authenticates itself to the primary using the COM pins by switching on and off the  
COM FETs and hence switching in and out CCOMM. If the authentication is successful, the transmitter will remain  
powered on. The bq5101x measures the voltage at the RECT pin, calculates the difference between the actual  
voltage and the desired voltage VRECT-REG, (threshold 1 at no load) and sends back error packets to the primary.  
This process goes on until the input voltage settles at VRECT-REG. During a load transient, the dynamic rectifier  
algorithm will set the targets specified by VRECT-REG thresholds 1, 2, 3, and 4. This algorithm is termed Dynamic  
Rectifier Control and is used to enhance the transient response of the power supply.  
During power-up, the LDO is held off until the VRECT-REG threshold 1 converges. The voltage control loop ensures  
that the output voltage is maintained at VOUT-REG to power the system. The bq5101x meanwhile continues to  
monitor the input voltage, and maintains sending error packets to the primary every 250ms. If a large transient  
occurs, the feedback to the primary speeds up to every 32ms in order to converge on an operating point in less  
time.  
Details of a Qi Wireless Power System and bq5101x Power Transfer Flow Diagrams  
The bq5101x family integrates a fully compliant WPC v1.0 communication algorithm in order to streamline  
receiver designs (no extra software development required). Other unique algorithms such has Dynamic Rectifier  
Control are also integrated to provide best in class system performance. This section provides a high level  
overview of these features by illustrating the wireless power transfer flow diagram from startup to active  
operation.  
During startup operation, the wireless power receiver must comply with proper handshaking to be granted a  
power contract from the Tx. The Tx will initiate the hand shake by providing an extended digital ping. If an Rx is  
present on the Tx surface, the Rx will then provide the signal strength, configuration and identification packets to  
the Tx (see volume 1 of the WPC specification for details on each packet). These are the first three packets sent  
to the Tx. The only exception is if there is a true shutdown condition on the EN1/EN2, AD, or TS-CTRL pins  
where the Rx will shut down the Tx immediately. See Table 4 for details. Once the Tx has successfully received  
the signal strength, configuration and identification packets, the Rx will be granted a power contract and is then  
allowed to control the operating point of the power transfer. With the use of the bq5101x Dynamic Rectifier  
Control algorithm, the Rx will inform the Tx to adjust the rectifier voltage above 7 V prior to enabling the output  
supply. This method enhances the transient performance during system startup. See Figure 29 for the startup  
flow diagram details.  
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Tx Powered  
without Rx  
Active  
Tx Extended Digital Ping  
Yes  
Send EPT packet with  
reason value  
EN1/EN2/AD/TS-CTRL  
EPT Condition?  
No  
No  
Identification and  
Configuration and SS,  
Received by Tx?  
Yes  
Power Contract  
Established. All  
proceeding control is  
dictated by the Rx.  
Yes  
Send control error packet  
to increase VRECT  
VRECT< 7V?  
No  
Startup operating point  
established. Enable the  
Rx output.  
Rx Active  
Power Transfer  
Stage  
Figure 29. Wireless Power Startup Flow Diagram  
Once the startup procedure has been established, the Rx will enter the active power transfer stage. This is  
considered the “main loop” of operation. The Dynamic Rectifier Control algorithm will determine the rectifier  
voltage target based on a percentage of the maximum output current level setting (set by KIMAX and the ILIM  
resistance to GND). The Rx will send control error packets in order to converge on these targets. As the output  
current changes, the rectifier voltage target will dynamically change. As a note, the feedback loop of the WPC  
system is relatively slow where it can take up to 90 ms to converge on a new rectifier voltage target. It should be  
understood that the instantaneous transient response of the system is open loop and dependent on the Rx coil  
output impedance at that operating point. More details on this will be covered in the section Receiver Coil Load-  
Line Analysis. The “main loop” will also determine if any conditions in Table 4 are true in order to discontinue  
power transfer. See Figure 30 which illustrates the active power transfer loop.  
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Rx Active  
Power Transfer  
Stage  
Rx Shutdown  
conditions per the EPT  
Table?  
Tx Powered  
without Rx  
Active  
Yes  
Send EPT packet with  
reason value  
No  
VRECT target= 7V. Send  
control error packets to  
converge.  
Yes  
IOUT< 10% of IMAX?  
No  
VRECT target= 6.3V.  
Send control error packets  
to converge.  
Yes  
Yes  
IOUT< 20% of IMAX?  
No  
VRECT target= 5.5V.  
Send control error packets  
to converge.  
IOUT< 40% of IMAX?  
No  
VRECT target= 5.1V.  
Send control error packets  
to converge.  
Measure Rectified Power  
and Send Value to Tx  
Yes  
TERM STATE  
(bq51014 only)  
BQ51014?  
No  
Figure 30. Active Power Transfer Flow Diagram  
Another requirement of the WPC v1.0 specification is to send the measured rectifier power. This entitles the Rx  
to determine the rectifier voltage and output current in order to report this to the Tx as a percentage of the  
maximum output power. This is also handled in the active power transfer loop.  
If the device is a bq51014, a special state called the “TERM STATE” is enabled in the active power transfer loop.  
This state is used to determine the level of the output current versus the programmed level of termination current  
(set by the KTERM factor and RTERM resistor). The primary purpose of this feature is to determine if the charge  
status is 100% based on the output current from the Rx. In a condition where the mobile device battery is fully  
charged, a low system current (output current from Rx) signature can be determined. This current level  
(signature) is set by the end system designer and is termed ITERM-HI. In addition to this current level, there is a no-  
load termination current level termed ITERM-LO which is fixed at 40 mA. For the high termination condition to be  
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true, the output current must be between ITERM-HI and ITERM-LO for approximately 180s. Once this condition is true,  
the Rx will send charge status of 100% to the Tx. The Tx can then illustrate that the mobile device has been fully  
charged (100% charged). If the output current remains below ITERM-LO for ~7s then the charge status of 100% is  
immediately sent. This condition can occur if the mobile device is put into a low standby mode after the battery is  
fully charged. See Figure 31 for the flow diagram of the “TERM STATE”.  
TERM STATE  
(bq51014 only)  
Yes  
Yes  
Yes  
Yes  
Send charge status100%  
and reset tTERM-LO timer  
IOUT< 45mA?  
No  
tTERM-LO Expired?  
No  
Send charge status100%  
and reset tTERM-HI timer  
IOUT < ITERM-HI  
?
tTERM-HI Expired?  
No  
No  
Rx Active  
Power Transfer  
Stage  
Figure 31. TERM STATE Flow Diagram for the bq51014 Only  
Dynamic Rectifier Control  
The Dynamic Rectifier Control algorithm offers the end system designer optimal transient response for a given  
max output current setting. This is achieved by providing enough voltage headroom across the internal regulator  
at light loads in order to maintain regulation during a load transient. The WPC system has a relatively slow global  
feedback loop where it can take up to 90 ms to converge on a new rectifier voltage target. Therefore, a transient  
response is dependent on the loosely coupled transformers output impedance profile. The Dynamic Rectifier  
Control allows for a 2 V change in rectified voltage before the transient response will be observed at the output of  
the internal regulator (output of the bq5101x). A 1-A application allows up to a 2 Ω output impedance. The  
Dynamic Rectifier Control behavior is illustrated in Figure 7 where RILIM is set to 220 Ω.  
Dynamic Efficiency Scaling  
The Dynamic Efficiency Scaling feature allows for the loss characteristics of the bq5101x to be scaled based on  
the maximum expected output power in the end application. This effectively optimizes the efficiency for each  
application. This feature is achieved by scaling the loss of the internal LDO based on a percentage of the  
maximum output current. Note that the maximum output current is set by the KIMAX term and the RILIM resistance  
(where RILIM = KIMAX / IMAX). The flow diagram show in Figure 30 illustrates how the rectifier is dynamically  
controlled (Dynamic Rectifier Control) based on a fixed percentage of the IMAX setting. The below table  
summarizes how the rectifier behavior is dynamically adjusted based on two different RILIM settings.  
Table 1.  
Output Current Percentage  
RILIM = 500Ω  
RILIM = 220 Ω  
VRECT  
IMAX = 0.5A  
IMAX = 1.14 A  
0 to 10%  
10 to 20%  
20 to 40%  
>40%  
0 A to 0.05 A  
0.05 A to 0.1A  
0.1 A to 0.2 A  
> 0.2 A  
0 A to 0.114 A  
0.114 A to 0.227 A  
0.227 A to 0.454 A  
> 0.454 A  
7.08 V  
6.28 V  
5.53 V  
5.11 V  
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Figure 8 illustrates the shift in the Dynamic Rectifier Controll behavior based on the two different RILIM settings.  
With the rectifier voltage (VRECT) being the input to the internal LDO, this adjustment in the Dynamic Rectifier  
Control thresholds will dynamically adjust the power dissipation across the LDO where:  
P
= V  
(
- V  
× I  
)
OUT OUT  
DIS  
RECT  
(1)  
Figure 6 illustrates how the system efficiency is improved due to the Dynamic Efficiency Scaling feature. Note  
that this feature balances efficiency with optimal system transient response.  
RILIM Calculations  
The bq5101x includes a means of providing hardware overcurrent protection by means of an analog current  
regulation loop. The hardware current limit provides an extra level of safety by clamping the maximum allowable  
output current (e.g. a current compliance). The RILIM resistor size also set the thresholds for the dynamic rectifier  
levels and thus providing efficiency tuning per each application’s maximum system current. The calculation for  
the total RILIM resistance is as follows:  
250  
RILIM  
=
IMAX  
300  
I
ILIM =1.2´IMAX  
=
RILIM  
R
ILIM = R1 +140  
(2)  
Where IMAX is the expected maximum output current during normal operation and IILIM is the hardware over  
current limit. When referring to the application diagram shown in Figure 2, RILIM is the sum of 140 and the R1  
resistance (e.g. the total resistance from the ILIM pin to GND).  
Termination Calculations (bq51014 only)  
The bq51014 includes a programmable upper termination threshold. This pin can be used to send the charge  
status 100% packet (CS100) to the transmitter in order to indicate a full charge status. The header for this packet  
is 0x05. Note that this packet does not turn off the transmitter and is only used as an informative indication of the  
mobile device’s charge status. The upper termination threshold is calculated using Equation 3:  
R
= 200´%I  
TERM  
MAX  
I
TERM-HI  
%I  
=
=
´100  
MAX  
MAX  
I
MAX  
250  
I
R
ILIM  
(3)  
The 200 constant is specified in the datasheet as KTERM. The upper termination threshold is set as a percentage  
of the IIMAX setting. For example, if the ILIM resistance is set to 250 Ω the IIMAX current will be 1A (250 ÷ 250). If  
the upper termination threshold is desired to be 100 mA, this would be 10% of IIMAX. The RTERM resistor would  
then equal 2kΩ (200 x 10).  
When the output current is in between ITERM-HI and ITERM-LO, the CS100 packet is sent approximately every 3 min.  
When the output current is below ITERM-LO, the CS100 packet is sent approximately every 7 seconds. The output  
current must remain in one of the termination conditions for that specific amount of time for the first CS100  
packet to be sent (deglitch). See Figure 32 for details:  
IOUT  
ITERM-HI  
ITERM-LO  
t
tLO = 7s  
tHI = 180s  
Figure 32. Termination Deglitch Timings for the CS100 Packet  
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Input Overvoltage  
If the input voltage suddenly increases in potential (e.g. a change in position of the equipment on the charging  
pad), the voltage-control loop inside the bq5101x becomes active, and prevents the output from going beyond  
VOUT-REG. The receiver then starts sending back error packets to the transmitter every 30ms until the input  
voltage comes back to the VRECT-REG target, and then maintains the error communication every 250ms.  
If the input voltage increases in potential beyond VOVP, the IC switches off the LDO and communicates to the  
primary to bring the voltage back to VRECT-REG. In addition, a proprietary voltage protection circuit is activated by  
means of CCLAMP1 and CCLAMP2 that protects the IC from voltages beyond the maximum rating of the IC (e.g.  
20V).  
Adapter Enable Functionality and EN1/EN2 Control  
Figure 3 is an example application that shows the bq5101x used as a wireless power receiver that can power  
mutliplex between wired or wireless power for the down-system electronics. In the default operating mode pins  
EN1 and EN2 are low, which activates the adapter enable functionality. In this mode, if an adapter is not present  
the AD pin will be low, and AD-EN pin will be pulled to the higher of the OUT and AD pins so that the PMOS  
between OUT and AD will be turned off. If an adapter is plugged in and the voltage at the AD pin goes above  
3.6V then wireless charging is disabled and the AD-EN pin will be pulled approximately 4V below the AD pin to  
connect AD to the secondary charger. The difference between AD and AD-EN is regulated to a maximum of 7V  
to ensure the VGS of the external PMOS is protected.  
The EN1 and EN2 pins include internal 200kΩ pull-down resistors, so that if these pins are not connected  
bq5101x defaults to AD-EN control mode. However, these pins can be pulled high to enable other operating  
modes as described in Table 2:  
Table 2.  
EN1  
EN2  
Result  
Adapter control enabled. If adapter is present then secondary charger is  
powered by adapter, otherwise wireless charging is enabled when wireless  
power is available. Communication current limit is enabled.  
0
0
0
1
1
0
Disables communication current limit.  
AD-EN is pulled low, whether or not adapter voltage is present. This feature  
can be used, e.g., for USB OTG applications.  
Adapter and wireless charging are disabled, i.e., power will never be  
delivered by the OUT pin in this mode.  
1
1
Table 3.  
Adaptive  
EN1  
EN2  
Wireless Power  
Wired Power  
OTG Mode  
Communication EPT Termination  
Limit  
0
0
1
1
0
1
0
1
Enabled  
Enabled  
Disabled  
Disabled  
Priority(1)  
Priority(1)  
Enabled  
Disabled  
Disabled  
Disabled  
Enabled(2)  
Disabled  
Enabled  
Disabled  
N/A  
Not Sent to Tx  
Not Sent to Tx  
Sent to Tx  
N/A  
Sent to Tx  
(1) If both wired and wireless power are present, wired power is given priority.  
(2) Allows for a boost-back supply to be driven from the output terminal of the Rx to the adapter port via the external back-to-back PMOS  
FET.  
As described in Table 2, pulling EN2 high disables the adapter mode and only allows wireless charging. In this  
mode the adapter voltage will always be blocked from the OUT pin. An application example where this mode is  
useful is when USB power is present at AD, but the USB is in suspend mode so that no power can be taken from  
the USB supply. Pulling EN1 high enables the off-chip PMOS regardless of the presence of a voltage. This  
function can be used in USB OTG mode to allow a charger connected to the OUT pin to power the AD pin.  
Finally, pulling both EN1 and EN2 high disables both wired and wireless charging.  
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NOTE  
It is required to connect a back-to-back PMOS between AD and OUT so that voltage is  
blocked in both directions. Also, when AD mode is enabled no load can be pulled from the  
RECT pin as this could cause an internal device overvoltage in bq5101x.  
End Power Transfer Packet (WPC Header 0x02)  
The WPC allows for a special command for the receiver to terminate power transfer from the trasmitter termed  
End Power Transfer (EPT) packet. Table 4 specifies the v1.0 Reasons columb and their responding data field  
value. The Condition column corresponds to the values sent by the bq5101x for a given reason.  
Table 4.  
Reason  
Unknown  
Value  
0x00  
0x01  
0x02  
0x03  
0x04  
0x05  
0x06  
0x07  
0x08  
Condition  
AD > 3.6V  
Charge Complete  
Internal Fault  
Over Temperature  
Over Voltage  
Over Current  
Battery Failure  
Reconfigure  
TS/CTRL = 1, or EN1 = 1, or <EN1 EN2> = <11>  
TJ > 150°C or RILIM < 100Ω  
TS < VHOT, TS > VCOLD, or TS/CTRL < 100mV  
Not Sent  
IOUT > 90% of ILIM (bq51014 only)  
Not Sent  
Not Sent  
No Response  
VRECT target doesn't converge  
Over Current Shutdown (bq51014)  
The bq51014 includes an over current shutdown feature where the Rx sends an end power transfer packet to the  
Tx when the output current reaches 100% of the IILIM setting or 120% of the IIMAX setting. The Tx will shut down  
as soon as the end power transfer packet is received which discontinues power transfer. This feature disallows  
the Rx from operating in a current limit situation in order to protect from down system shorts or failures.  
Status Outputs  
bq5101x has one status output, CHG. This output is an open-drain NMOS device that is rated to 20V. The open-  
drain FET connected to the CHG pin will be turned on whenever the output of the power supply is enabled.  
Please note, the output of the power supply will not be enabled if the VRECT-REG does not converge at the no-load  
target voltage.  
WPC Communication Scheme  
The WPC communication uses a modulation technique termed “back-scatter modulation” where the receiver coil  
is dynamically loaded in order to provide amplitude modulation of the transmitters coil voltage and current. This  
scheme is possible due to the fundamental behavior between two loosely coupled inductors (e.g. between the Tx  
and Rx coil). This type of modulation can be accomplished by switching in and out a resistor at the output of the  
rectifier, or by switching in and out a capacitor across the AC1/AC2 net. Figure 33 shows how to implement  
resistive modulation.  
CRES1  
AC1  
VRECT  
RMOD  
COIL  
CRES2  
AC2  
GND  
Figure 33. Resistive Modulation  
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Figure 34 Shows how to implement capacitive modulation.  
CRES1  
AC1  
VRECT  
CMOD  
COIL  
CRES2  
AC2  
GND  
Figure 34. Capacitive Modulation  
The amplitude change in Tx coil voltage or current can be detected by the transmitters decoder. The resulting  
signal observed by the Tx is shown in Figure 35.  
Power  
bq5101x  
Voltage  
Conditioning  
AC to DC  
Drivers  
Rectification  
Communication  
Controller  
V/I  
Sense  
Controller  
bq500210  
Transmitter  
Receiver  
1
1
0
0
0
TX COIL VOLTAGE / CURRENT  
Figure 35.  
The WPC protocol uses a differential bi-phase encoding scheme to modulate the data bits onto the Tx coil  
voltage/current. Each data bit is aligned at a full period of 0.5 ms (tCLK) or 2 kHz. An encoded ONE results in two  
transitions during the bit period and an encoded ZERO results in a single transition. See Figure 36 for an  
example of the differential bi-phase encoding.  
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Figure 36. Differential Bi-phase Encoding Scheme (WPC volume 1: Low Power, Part 1 Interface  
Definition)  
The bits are sent LSB first and use an 11-bit asynchronous serial format for each portion of the packet. This  
includes one start bit, n-data bytes, a parity bit, and a single stop bit. The start bit is always ZERO and the parity  
bit is odd. The stop bit is always ONE. Figure 37 shows the details of the asynchronous serial format.  
Figure 37. Asynchronous Serial Formatting (WPC volume 1: Low Power, Part 1 Interface Definition)  
Each packet format is organized as shown in Figure 38.  
Preamble  
Header  
Message  
Checksum  
Figure 38. Packet Format (WPC volume 1: Low Power, Part 1 Interface Definition)  
Figure 27 above shows an example waveform of the receiver sending a rectified power packet (header 0x04).  
Communication Modulator  
bq5101x provides two identical, integrated communication FETs which are connected to the pins COM1 and  
COM2. These FETs are used for modulating the secondary load current which allows bq5101x to communicate  
error control and configuration information to the transmitter. Figure 39 below shows how the COMM pins can be  
used for resistive load modulation. Each COMM pin can handle at most a 24Ω communication resistor.  
Therefore, if a COMM resistor between 12Ω and 24Ω is required COM1 and COM2 pins must be connected in  
parallel. bq5101x does not support a COMM resistor less than 12Ω.  
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RECTIFIER  
24W  
24W  
COMM1  
COMM2  
COMM_DRIVE  
Figure 39. Resistive Load Modulation  
In addition to resistive load modulation, the bq5101x is also capable of capacitive load modulation as shown in  
Figure 40 below. In this case, a capacitor is connected from COM1 to AC1 and from COM2 to AC2. When the  
COMM switches are closed there is effectively a 22 nF capacitor connected between AC1 and AC2. Connecting  
a capacitor in between AC1 and AC2 modulates the impedance seen by the coil, which will be reflected in the  
primary as a change in current.  
Figure 40. Capacitive Load Modulation  
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Adaptive Communication Limit  
The Qi communication channel is established via backscatter modulation as described in the previous sections.  
This type of modulation takes advantage of the loosely coupled inductor relationship between the Rx and Tx coil.  
Essentially the switching in-and-out of the communication capacitor or resistor adds a transient load to the Rx  
coil in order to modulate the Tx coil voltage/current waveform (amplitude modulation). The consequence of this  
technique is that a load transient (load current noise) from the mobile device has the same signature. In order to  
provide noise immunity to the communication channel, the output load transients must be isolated from the Rx  
coil. The proprietary feature Adaptive Communication Limit achieves this by dynamically adjusting the current  
limit of the regulator. When the regulator is put in current limit, any load transients will be offloaded to the battery  
in the system.  
Note that this requires the battery charger IC to have input voltage regulation (weak adapter mode). The output  
of the Rx appears as a weak supply if a transient occurs above the current limit of the regulator.  
The Adaptive Communication Limit feature has two current limit modes and is detailed in the table below:  
Table 5.  
IOUT  
Communication Current Limit  
Fixed 400 mA  
< 300 mA  
> 300 mA  
IOUT + 50 mA  
The first mode is illustrated in Figure 25. In this plot, an output load pulse of 300 mA is periodically introduced on  
a DC current level of 200 mA. Therefore, the 400 mA current limit is enabled. The pulses on VRECT indicate that a  
communication packet event is occurring. When the output load pulse occurs, the regulator limits the pulse to a  
constant 400 mA and; therefore, preserves communication. Note that VOUT drops to 4.5 V instead of GND. A  
charger IC with an input voltage regulation set to 4.5 V allows this to occur by offloading the load transient  
support to the mobile device’s battery  
The second mode is illustrated in Figure 26. In this plot, an output pulse of 200 mA is periodically introduced on a  
DC current level of 400 mA. Therefore, the tracking current mode (IOUT + 50 mA) is enabled. In this mode the  
bq5101x measures the active output current and sets the regulators current limit 50 mA above this  
measurement. When the load pulse occurs during a communication packet event, the output current is regulated  
to 450 mA. As the communication packet event has finished the output load is allowed to increase. Note that  
during the time the regulator is in current limit VOUT is reduced to 4.5 V and 5 V when not in current limit.  
Synchronous Rectification  
The bq5101x provides an integrated, self-driven synchronous rectifier that enables high-efficiency AC to DC  
power conversion. The rectifier consists of an all NMOS H-Bridge driver where the backgates of the diodes are  
configured to be the rectifier when the synchronous rectifier is disabled. During the initial startup of the WPC  
system the synchronous rectifier is not enabled. At this operating point, the DC rectifier voltage is provided by the  
diode rectifier. Once VRECT is greater than UVLO, half synchronous mode will be enabled until the load current  
surpasses 120 mA. Above 120 mA the full synchronous rectifier stays enabled until the load current drops back  
below 100 mA where half synchronous mode is enabled instead.  
Temperature Sense Resistor Network (TS)  
bq5101x includes a ratiometric external temperature sense function. The temperature sense function has two  
ratiometric thresholds which represent a hot and cold condition. An external temperature sensor is recommended  
in order to provide safe operating conditions for the receiver product. This pin is best used for monitoring the  
surface that can be exposed to the end user (e.g. place the NTC resistor closest to the user).  
Figure 41 allows for any NTC resistor to be used with the given VHOT and VCOLD thresholds.  
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VTSB (2.2V)  
20kΩ  
R2  
TS-CTRL  
R1  
R3  
NTC  
Figure 41. NTC Circuit Used for Safe Operation of the Wireless Receiver Power Supply  
The resistors R1 and R3 can be solved by resolving the system of equations at the desired temperature  
thresholds. The two equations are:  
æ
ç
ç
ö
÷
÷
÷
R
R
+ R  
1
TCOLD  
(
)
3
NTC  
R + R  
+ R  
1
ç
(
NTC  
)
3
NTC  
TCOLD  
è
ø
%V  
=
=
´100  
COLD  
æ
ç
ç
ö
R
R
+ R  
1
(
)
÷
÷
÷
3
TCOLD  
+ R2  
R + R  
+ R  
1
ç
(
)
3
NTC  
TCOLD  
è
ø
æ
ö
÷
÷
÷
R
R
+ R  
1
THOT  
(
)
ç
ç
3
NTC  
R + R  
+ R  
ç
(
NTC  
)
3
NTC  
1
THOT  
è
ø
%V  
´100  
HOT  
æ
ç
ç
ö
R
R
+ R  
1
(
)
÷
÷
÷
3
THOT  
+ R2  
R + R  
+ R  
1
ç
(
)
3
NTC  
THOT  
è
ø
(4)  
(5)  
Where:  
ö
÷
÷
çæ 1  
è
1
b
-
ç
TCOLD Toø  
R
= R e  
o
NTC  
TCOLD  
çæ 1  
1
Toø  
ö
÷
÷
b
-
ç
THOT  
è
R
= R e  
o
NTC  
THOT  
where, TCOLD and THOT are the desired temperature thresholds in degrees Kelvin. RO is the nominal resistance  
and β is the temperature coefficient of the NTC resistor. RO is fixed at 20 kΩ. An example solution is provided:  
•
•
R1 = 4.23kΩ  
R3 = 66.8kΩ  
where the chosen parameters are:  
•
•
•
•
•
•
%VHOT = 19.6%  
%VCOLD = 58.7%  
TCOLD = –10°C  
THOT = 100°C  
β = 3380  
RO = 10kΩ  
The plot of the percent VTSB vs. temperature is shown in Figure 42:  
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Figure 42. Example Solution for an NTC resistor with RO = 10KΩ and β = 4500  
Figure 43 illustrates the periodic biasing scheme used for measuring the TS state. The TS_READ signal enables  
the TS bias voltage for 24ms. During this period the TS comparators are read (each comparator has a 10 ms  
deglitch) and appropriate action is taken based on the temperature measurement. After this 24ms period has  
elapsed, the TS_READ signal goes low, which causes the TS-Bias pin to become high impedance. During the  
next 35ms (priority packet period) or 235ms (standard packet period), the TS voltage is monitored and compared  
to 100mV. If the TS voltage is greater than 100mV then a secondary device is driving the TS/CTRL pin and a  
CTRL = ‘1’ is detected.  
Figure 43. Timing Diagram for TS Detection Circuit  
3-state Driver Recommendations for the TS-CTRL Pin  
The TS-CTRL pin offers three functions with one 3-state driver interface  
1. NTC temperature monitoring,  
2. Fault indication,  
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3. Charge done indication  
A 3-state driver can be implemented with the circuit in Figure 44 and the use of two GPIO connections.  
BATT  
TERM  
M3  
TS-CTRL  
FAULT  
M4  
Figure 44. 3-state Driver for TS-CTRL  
Note that the signals “TERM” and “FAULT” are given by two GPIO’s. The truth table for this circuit is found in  
Table 6:  
Table 6.  
TERM  
FAULT  
F (Result)  
1
0
1
0
0
1
Z (Normal Mode)  
Charge Complete  
System Fault  
The default setting is TERM = 1 and FAULT = 0. In this condition, the TS-CTRL net is high impedance (hi-z) and;  
therefore, the NTC is function is allowed to operate. When the TS-CTRL pin is pulled to GND by setting FAULT =  
1, the Rx is shutdown with the indication of a fault. When the TS-CTRL pin is pulled to the battery by setting  
TERM = 1, the Rx is shutdown with the indication of a charge complete condition. Therefore, the host controller  
can indicate whether the Rx is system is turning off due to a fault or due to a charge complete condition.  
Thermal Protection  
The bq5101x includes a thermal shutdown protection. If the die temperature reaches TJ(OFF), the LDO is shut  
off to prevent any further power dissipation.  
Series and Parallel Resonant Capacitor Selection  
Shown in Figure 2, the capacitors C1 (series) and C2 (parallel) make up the dual resonant circuit with the  
receiver coil. These two capacitors must be sized correctly per the WPC v1.0 specification. Figure 45 illustrates  
the equivalent circuit of the dual resonant circuit:  
C1  
Ls’  
C2  
Figure 45. Dual Resonant Circuit with the Receiver Coil  
Section 4.2 (Power Receiver Design Requirements) in volume 1 of the WPC v1.0 specification highlights in detail  
the sizing requirements. To summarize, the receiver designer will be required take inductance measurements  
with a fixed test fixture. The test fixture is shown in Figure 46:  
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Figure 46. WPC v1.0 Receiver Coil Test Fixture for the Inductance Measurement Ls’ (copied from System  
Description Wireless Power Transfer, volume 1: Low Power, Part 1 Interface Definition, Version 1.0.1,  
Figure 4-4)  
The primary shield is to be 50 mm x 50 mm x 1 mm of Ferrite material PC44 from TDK Corp. The gap dZ is to be  
3.4 mm. The receiver coil, as it will be placed in the final system (e.g. the back cover and battery must be  
included if the system calls for this), is to be placed on top of this surface and the inductance is to be measured  
at 1-V RMS and a frequency of 100 kHz. This measurement is termed Ls’. The same measurement is to be  
repeated without the test fixture shown in Figure 11. This measurement is termed Ls or the free-space  
inductance. Each capacitor can then be calculated using Equation 6:  
-1  
é
ê
ù
ú
2
'
S
C = f ×2p ×L  
( )  
1
S
ê
ú
ë
û
-1  
é
ù
ú
2
1
ê
C =  
f ×2p ×L -  
( )  
D
S
C
2
ê
ú
1
ë
û
(6)  
(7)  
Where fS is 100 kHz +5/-10% and fD is 1 MHz ±10%. C1 must be chosen first prior to calculating C2.  
The quality factor must be greater than 77 and can be determined by Equation 7:  
2p× f ×LS  
D
Q =  
R
where R is the DC resistance of the receiver coil. All other constants are defined above.  
Receiver Coil Load-Line Analysis  
When choosing a receiver coil, it is recommend to analyze the transformer characteristics between the primary  
coil and receiver coil via load-line analysis. This will capture two important conditions in the WPC system:  
1. Operating point characteristics in the closed loop of the WPC system.  
2. Instantaneous transient response prior to the convergence of the new operating point.  
An example test configuration for conducting this analysis is shown in Figure 47:  
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CP  
CS  
VIN  
LP  
LS C  
D
CB  
RL  
V
Figure 47. Load-Line Analysis Test Bench  
Where:  
•
•
•
•
•
•
•
VIN is a square-wave power source that should have a peak-to-peak operation of 19V.  
CP is the primary series resonant capacitor (i.e. 100 nF for Type A1 coil).  
LP is the primary coil of interest (i.e. Type A1).  
LS is the secondary coil of interest.  
CS is the series resonant capacitor chosen for the receiver coil under test.  
CD is the parallel resonant capacitor chosen for the receiver coil under test.  
CB is the bulk capacitor of the diode bridge (voltage rating should be at least 25 V and capacitance value of at  
least 10µ F)  
•
•
•
V is a Kelvin connected voltage meter  
A is a series ammeter  
RL is the load of interest  
It is recommended that the diode bridge be constructed of Schottky diodes.  
The test procedure is as follows  
•
•
•
Supply a 19V AC signal to LP starting at a frequency of 210 kHz  
Measure the resulting rectified voltage from no load to the expected full load  
Repeat the above steps for lower frequencies (stopping at 110 kHz)  
An example load-line analysis is shown in Figure 48:  
20  
18  
16  
14  
12  
10  
8
175 kHz  
160 kHz  
150 kHz  
140 kHz  
125 kHz  
115 kHz  
135 kHz  
130 kHz  
6
4
2
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1
LOAD (A)  
Figure 48. Example Load-Line Results  
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What this plot conveys about the operating point is that a specific load and rectifier target condition consequently  
results in a specific operating frequency (for the type A1 TX). For example, at 1 A the dynamic rectifier target is  
5.15 V. Therefore, the operating frequency will be between 150kHz and 160kHz in the above example. This is an  
acceptable operating point. If the operating point ever falls outside the WPC frequency range (110kHz –  
205kHz), the system will never converge and will become unstable.  
In regards to transient analysis, there are two major points of interest:  
1. Rectifier voltage at the ping frequency (175kHz).  
2. Rectifier voltage droop from no load to full load at the constant operating point.  
In this example, the ping voltage will be approximately 5 V. This is above the UVLO of the bq5101x and;  
therefore, startup in the WPC system can be ensured. If the voltage is near or below the UVLO at this frequency,  
then startup in the WPC system may not occur.  
If the max load step is 1 A, the droop in this example will be Approximately1V with a voltage at 1 A of  
Approximately 5.5 V (140 kHz load-line). To analyze the droop locate the load-line that starts at 7 V at no-load.  
Follow this load-line to the max load expected and take the difference between the 7V no-load voltage and the  
full-load voltage at that constant frequency. Ensure that the full-load voltage at this constant frequency is above  
5V. If it descends below 5V, the output of the power supply will also droop to this level. This type of transient  
response analysis is necessary due to the slow feedback response of the WPC system. This simulates the step  
response prior to the WPC system adjusting the operating point.  
NOTE  
Coupling between the primary and secondary coils will worsen with misalignment of the  
secondary coil. Therefore, it is recommended to re-analyze the load-lines at multiple  
misalignments to determine where, in planar space, the receiver will discontinue operation.  
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Recommended Rx coils can be found in Table 7:  
Table 7.  
Manufacturer  
TDK  
Part Number  
WR-483250-15M2-G  
WR-383250-17M2-G  
IWAS-4832FF-50  
312-00012  
Dimensions  
48 x 32mm  
38 x 32mm  
48 x 32mm  
48 x 32mm  
28 x 14mm  
Ls  
Ls’  
Output Current  
Range  
Application  
10.4 μH  
11.1 μH  
10.8 μH  
10.8 μH  
36.5 μH  
12 μH(1)  
12.3 μH(1)  
12.5 μH(1)  
12.9 μH(1)  
45 μH(2)  
50-1000 mA  
50-1000 mA  
50-1000 mA  
50-1000 mA  
General 5V Power  
Supply  
TDK  
Space limited 5V Power  
Supply  
Vishay  
General 5V Power  
Supply  
Mingstar  
Mingstar  
General 5V power  
Supply  
312-00015  
150-1000 mA Space limited 5V Power  
Supply  
(1) Ls’ measurements conducted with a standard battery behind the Rx coil assembly. This measurement is subject to change based on  
different battery sizes, placements, and casing material.  
(2) Battery not present behind the Rx coil assembly. Subject to drop in inductance depending on the placement of the battery.  
It is recommended that all inductance measurements are repeated in the designers specific system as there are  
many influence on the final measurements.  
Package Summary  
YFP Package  
(Top View)  
YFP Package Symbol  
(Top Side Symbol for bq51013A)  
A1  
B1  
C1  
D1  
E1  
F1  
G1  
A2  
B2  
C2  
D2  
E2  
F2  
G2  
A3  
B3  
C3  
D3  
E3  
F3  
G3  
A4  
B4  
C4  
D4  
E4  
F4  
G4  
TI YMLLLLS  
bq51013A  
D
0-Pin A1 Marker, TI-TI Letters, YM- Year Month Date Code,  
LLLL-Lot Trace Code, S-Assembly Site Code  
E
Figure 49. Chip Scale Packaging Dimensions  
•
•
D = 3.0mm ± 0.035mm  
E = 1.88mm ± 0.035mm  
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
35  
Product Folder Link(s): bq51013A bq51014  
 
bq51013A  
bq51014  
SLUSAY6A –MARCH 2012–REVISED JUNE 2012  
www.ti.com  
REVISION HISTORY  
Changes from Original (March 2012) to Revision A  
Page  
•
Deleted VRECT-TRACK from the Electrical Characteristics table ............................................................................................... 6  
36  
Submit Documentation Feedback  
Copyright © 2012, Texas Instruments Incorporated  
Product Folder Link(s): bq51013A bq51014  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
BQ51013ARHLR  
BQ51013ARHLT  
BQ51013AYFPR  
BQ51013AYFPT  
BQ51014YFPR  
BQ51014YFPT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
QFN  
RHL  
RHL  
YFP  
YFP  
YFP  
YFP  
20  
20  
28  
28  
28  
28  
3000  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
QFN  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
SNAGCU Level-1-260C-UNLIM  
SNAGCU Level-1-260C-UNLIM  
SNAGCU Level-1-260C-UNLIM  
SNAGCU Level-1-260C-UNLIM  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
3000  
250  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
3000  
250  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2012  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jun-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
BQ51013ARHLR  
BQ51013ARHLT  
BQ51013AYFPR  
BQ51013AYFPT  
QFN  
QFN  
RHL  
RHL  
YFP  
YFP  
20  
20  
28  
28  
3000  
250  
330.0  
180.0  
180.0  
180.0  
12.4  
12.4  
8.4  
3.8  
3.8  
2.0  
2.0  
4.8  
4.8  
1.6  
1.6  
0.6  
0.6  
8.0  
8.0  
4.0  
4.0  
12.0  
12.0  
8.0  
Q1  
Q1  
Q1  
Q1  
DSBGA  
DSBGA  
3000  
250  
3.13  
3.13  
8.4  
8.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Jun-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
BQ51013ARHLR  
BQ51013ARHLT  
BQ51013AYFPR  
BQ51013AYFPT  
QFN  
QFN  
RHL  
RHL  
YFP  
YFP  
20  
20  
28  
28  
3000  
250  
346.0  
210.0  
210.0  
210.0  
346.0  
185.0  
185.0  
185.0  
29.0  
35.0  
35.0  
35.0  
DSBGA  
DSBGA  
3000  
250  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Audio  
Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Medical  
Logic  
Security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
www.ti.com/video  
OMAP Mobile Processors www.ti.com/omap  
Wireless Connectivity www.ti.com/wirelessconnectivity  
TI E2E Community Home Page  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2012, Texas Instruments Incorporated  

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