BQ34210IPWRQ1 [TI]
通过汽车级认证的单节电池系统侧 CEDV 电量监测计 | PW | 14 | -40 to 85;
| 型号： | BQ34210IPWRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 通过汽车级认证的单节电池系统侧 CEDV 电量监测计 | PW | 14 | -40 to 85 电池 光电二极管 |
| 文件： | 总23页 (文件大小：1294K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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bq34210-Q1
ZHCSGI9 –AUGUST 2017
用于极少放电型电池的 bq34210-Q1 汽车 1 芯
系统侧 CEDV 电量监测计
1 特性
3 说明
1
•
•
符合汽车 AEC-Q100 3 级标准
bq34210-Q1 1 芯系统侧 CEDV 电量监测计为 eCall 系
统和电力故障期间的备用不间断电源 (UPS) 等极少放
电型 应用 （其中电池可能在其寿命中的大部分时间一
直连接到充电电源，直到需要时才断开连接）中的 1
芯电池提供电量监测和放电结束 (EOS) 确定功能。
bq34210-Q1 电量监测计支持多种电池化学物质，包括
锂离子、磷酸铁锂和镍氢。
1 芯电池电量监测计支持锂离子、磷酸铁锂和镍氢
电池（3 芯）化学物质
–
–
位于系统板上
由具有集成低压降稳压器 (LDO) 的电池直接供
电
–
支持低值外部感测电阻器 (10mΩ)
•
•
从主机学习负载使能 (LEN)
电量监测功能使用电压、电流和温度数据以及补偿放电
结束电压 (CEDV) 技术来提供荷电状态 (SOC) 和运行
状况 (SOH) 数据。该器件的 EOS 确定功能会在电池
性能下降并在接近其使用寿命终点时发出警报。
超低功耗：正常模式下为 50µA，睡眠模式下为
9µA
•
•
支持替换电池
精准的放电结束 (EOS) 确定功能，适用于极少放电
型应用中的 电池
使用 bq34210-Q1 电量监测计进行电池电量监测时，
只需将其连接至可拆卸电池组或嵌入式电池管理系统的
PACK+ (P+) 和 PACK- (P-)。
•
用于 1 芯电池的 CEDV 电量监测计，可提供：
–
–
–
荷电状态 (SOC)
续航时间 (TTE)
运行状况 (SOH)
器件信息(1)
器件型号
封装
封装尺寸（标称值）
•
•
•
高侧和低侧电流感应选项
bq34210-Q1
PW (14)
5.00mm x 4.40mm x 1.00mm
内部温度传感器或外部热敏电阻器
微控制器外设接口支持：
(1) 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品
附录。
–
–
400kHz I2C™串行接口
简化原理图
针对 SOC、电池电量、温度故障和充电/放电状
态的可配置中断（警报）
PACK+
Learning
Load
LEN
2 应用
ALERT
•
•
•
•
eCall 系统
SDA
SCL
ALERT
NC
2
I C
远程信息处理备用系统
不间断电源 (UPS) 备用系统
应急电池电源模块
VSS
TS
NC
NC
REG18
NC
SRP
SRN
NC
Sense
Resistor
2.2 µF
REGIN
1 µF
–
PACK
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLUSCG1
bq34210-Q1
ZHCSGI9 –AUGUST 2017
www.ti.com.cn
目录
1
2
3
4
5
6
特性.......................................................................... 1
7
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes........................................ 11
Application and Implementation ........................ 12
8.1 Application Information............................................ 12
8.2 Typical Applications ................................................ 12
Power Supply Recommendation........................ 14
9.1 Power Supply Decoupling....................................... 14
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Supply Current .......................................................... 4
6.6 Digital Input and Output DC Characteristics............. 4
8
9
10 Layout................................................................... 15
10.1 Layout Guidelines ................................................. 15
10.2 Layout Example .................................................... 15
11 器件和文档支持 ..................................................... 17
11.1 器件支持................................................................ 17
11.2 文档支持................................................................ 17
11.3 社区资源................................................................ 17
11.4 商标....................................................................... 17
11.5 静电放电警告......................................................... 17
11.6 Glossary................................................................ 17
12 机械、封装和可订购信息....................................... 17
6.7 LDO Regulator, Wake-up, and Auto-Shutdown DC
Characteristics ........................................................... 5
6.8 LDO Regulator, Wake-up, and Auto-Shutdown AC
Characteristics ........................................................... 5
6.9 ADC (Temperature and Cell Measurement)
Characteristics ........................................................... 5
6.10 Integrating ADC (Coulomb Counter) Characteristics
................................................................................... 5
6.11 I2C-Compatible Interface Communication Timing... 6
6.12 SHUTDOWN and WAKE-UP Timing ...................... 7
6.13 Typical Characteristics............................................ 7
4 修订历史记录
日期
修订版本
注意
2017 年 8 月
*
初始发行版
2
Copyright © 2017, Texas Instruments Incorporated
bq34210-Q1
www.ti.com.cn
ZHCSGI9 –AUGUST 2017
5 Pin Configuration and Functions
S !
S(#
1
'
)
"
,
ꢀ
3
1"
1)
1'
11
1/
2
!#$%&
*(
+SS
&S
*(
*(
%$-1.
*(
S%0
S%*
*(
%$-4*
.
*56 65 789:;
Pin Functions
NUMBER
NAME
SDA
TYPE
IO(1)
IO
DESCRIPTION
Open drain slave I2C serial communication data line. Use with a 10-kΩ pullup resistor (typical).
Slave I2C serial communication clock input. Use with a 10-kΩ pullup resistor (typical).
Device ground
1
2
3
5
7
SCL
VSS
P
REG18
REGIN
P
Capacitor required for the 1.8-V integrated LDO. Decouple with 2.2-µF ceramic capacitor to VSS.
Battery voltage input and integrated LDO input. Decouple with 1-µF ceramic capacitor to VSS.
P
Analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between
SRP and SRN where the voltage at SRN will be lower than SRP during a charging event
9
SRN
SRP
AI
AI
Analog input pin connected to the internal coulomb-counter peripheral for integrating a small voltage between
SRP and SRN where the voltage at SRP will be higher than SRN during a charging event
10
Pack thermistor voltage sense (use 103AT-type thermistor). Disable TS with a 10-kΩ resistor to VSS. Do not
leave floating.
12
14
TS
ALERT
NC
AI
IO
Open drain ALERT output, requires a pullup resistor (typical 10 kΩ). Used as an input to exit SHUTDOWN mode
4, 6, 8,
11, 13
NC
No internal connection
(1) IO = Digital input-output, AI = Analog input, P = Power connection, NC = No internal connection
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VREGIN
VSR
REGIN pin input voltage range
–0.3
6
V
VREGIN
0.3
+
SRP and SRN pins input voltage range
–0.3
V
Differential voltage across SRP and SRN. ABS(SRP – SRN)
REG18 LDO output for capacitor only (not a supply pin)
Open-drain IO pins (SDA, SCL)
–0.3
–0.3
–0.3
–0.3
2
2
6
6
V
V
V
V
VREG18
VIOD
VALERT
Open Drain Output / Control Input (ALERT)
REG18 +
0.3
VAI
TA
TS
–0.3
V
Operating free-air temperature range
–40
–65
85
°C
°C
Storage temperature, Tstg
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Copyright © 2017, Texas Instruments Incorporated
3
bq34210-Q1
ZHCSGI9 –AUGUST 2017
www.ti.com.cn
6.2 ESD Ratings
VALUE
±1500
±250
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Electrostatic
V(ESD)
V
discharge
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)
MIN NOM
MAX
UNIT
External input capacitor for internal
LDO between REGIN and VSS
(1)
CREGIN
1
μF
Nominal capacitor values specified. Recommend
a 5% ceramic X5R-type capacitor located close to
the device.
External output capacitor for internal
LDO between REG18 and VSS
(1)
CREG18
2.2
μF
External pullup voltage for open-
drain pins (SDA, SCL, ALERT)
(1)
VPU
1.62
5.5
V
(1) Specified by design. Not production tested.
6.4 Thermal Information
bq34210-Q1
PW (TSSOP)
14 PINS
111.0
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJCtop
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
37.9
54.8
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
3.0
ψJB
54.2
RθJCbot
n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Supply Current
TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
ILOAD > Sleep Current(2)
ILOAD < Sleep Current(2)
MIN
TYP
50
9
MAX
UNIT
μA
(1)
IREGIN
NORMAL mode current
SLEEP mode current
(1)
ISLP
μA
Fuel gauge in host commanded
SHUTDOWN mode.
(1)
ISD
SHUTDOWN mode current
0.6
μA
(LDO regulator output disabled)
(1) Specified by design. Not production tested.
(2) Wake Comparator disabled.
6.6 Digital Input and Output DC Characteristics
TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1)(1)
PARAMETER
Input voltage, high(2)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
VIH(OD)
VIL
External pullup resistor to VPU
VPU × 0.7
Input voltage, low(2)
0.6
0.6
0.5
–3
V
VOL
Output voltage, low(2)
Output source current, high(2)
Output sink current, low(2)
V
IOH
mA
mA
IOL(OD)
(1) Specified by design. Not production tested.
(2) SCL, SDA, ALERT
4
Copyright © 2017, Texas Instruments Incorporated
bq34210-Q1
www.ti.com.cn
ZHCSGI9 –AUGUST 2017
Digital Input and Output DC Characteristics (continued)
TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1)(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
pF
(1)
CIN
Ilkg
Input capacitance(2)(3)
Input Leakage Current(2)(3)
5
1
μA
(3) TS
6.7 LDO Regulator, Wake-up, and Auto-Shutdown DC Characteristics
TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1)(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
VREGIN
VREG18
Battery and regulator input
Regulator output voltage
2.45
4.5
1.85
2
V
VREGIN undervoltage lock-out
LDO wake-up rising threshold
UVLOIT+
UVLOIT–
V
V
VREGIN undervoltage lock-out
LDO auto-shutdown falling threshold
1.95
ALERT (input) LDO Wake-up rising LDO Wake-up from SHUTDOWN
(1)
VWU+
1.2
V
edge threshold(2)
mode
Minimum ALERT high time after
VWU+ to initiate Wake up
tALERT
1
ms
(1) Specified by design. Not production tested.
(2) If the device is commanded to SHUTDOWN via I2C with VREGIN > UVLOIT+, a wake-up rising edge trigger is required on ALERT.
6.8 LDO Regulator, Wake-up, and Auto-Shutdown AC Characteristics
TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Time delay from SHUTDOWN
command to LDO output disable.
(1)
(1)
tSHDN
tSHUP
SHUTDOWN entry time
250
ms
Minimum low time of ALERT (input)
in SHUTDOWN before WAKEUP
SHUTDOWN ALERT low time
Initial REG18 output delay
10
μs
(1)
tREG18
13
8
ms
Time delay from rising edge of
ALERT (input) to nominal REG18
output.
(1)
tWUREG18
Wake-up REG18 output delay
ms
ms
Time delay from rising edge of
tPUCD
Power-up communication delay(2) REGIN to NORMAL mode (includes
firmware initialization time).
250
(1) Specified by design. Not production tested.
(2) tPUCD indicates when communication can begin. Measurements are not valid for up to 1 second after any reset.
6.9 ADC (Temperature and Cell Measurement) Characteristics
TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN(REGIN) REGIN pin voltage measurement
range
2.45
4.5
V
tADC_CONV Conversion time
Effective resolution
125
15
ms
bits
6.10 Integrating ADC (Coulomb Counter) Characteristics
TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VSRCM
Input voltage range of SRN, SRP
pins
VREGIN
100 mV
+
VSS
V
Copyright © 2017, Texas Instruments Incorporated
5
bq34210-Q1
ZHCSGI9 –AUGUST 2017
www.ti.com.cn
Integrating ADC (Coulomb Counter) Characteristics (continued)
TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VSRDM
Input differential voltage range of
VSRP–VSRN
±80
mV
tSR_CONV
Conversion time
Single conversion
Single conversion
1
s
Effective Resolution
16
bits
6.11 I2C-Compatible Interface Communication Timing
TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)(1)
MIN
NOM
MAX
UNIT
Standard Mode (100 kHz)
td(STA) Start to first falling edge of SCL
tw(L)
4
4.7
4
μs
μs
SCL pulse duration (low)
SCL pulse duration (high)
Setup for repeated start
Data setup time
tw(H)
μs
tsu(STA)
tsu(DAT)
th(DAT)
tsu(STOP)
t(BUF)
tf
4.7
250
0
μs
Host drives SDA
Host drives SDA
ns
ns
μs
Data hold time
Setup time for stop
4
Bus free time between stop and start Includes Command Waiting Time
SCL or SDA fall time(1)(2)
66
μs
300
300
100
ns
ns
kHz
tr
SCL or SDA rise time(1)(2)
fSCL
Clock frequency(3)
Fast Mode (400 kHz)
td(STA) Start to first falling edge of SCL
tw(L)
600
1300
600
600
100
0
ns
ns
ns
ns
ns
ns
ns
μs
SCL pulse duration (low)
SCL pulse duration (high)
Setup for repeated start
Data setup time
tw(H)
tsu(STA)
tsu(DAT)
th(DAT)
tsu(STOP)
t(BUF)
tf
Host drives SDA
Host drives SDA
Data hold time
Setup time for stop
600
66
Bus free time between stop and start Includes Command Waiting Time
SCL or SDA fall time(1)(2)
300
300
400
ns
ns
kHz
tr
SCL or SDA rise time(1)(2)
fSCL
Clock frequency(3)
(1) Specified by design. Not production tested.
(2) Bus capacitance and pull-up resistance impact rise and fall times. View the rise and fall times to assist with debugging.
(3) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at
400 kHz. (See I2C Interface and I2C Command Waiting Time.)
t
t
t
t
t
f
t
r
(BUF)
SU(STA)
w(H)
w(L)
SCL
SDA
t
t
t
d(STA)
su(STOP)
f
t
r
t
t
su(DAT)
h(DAT)
REPEATED
START
STOP
START
Figure 1. I2C-Compatible Interface Timing Diagrams
6
Copyright © 2017, Texas Instruments Incorporated
bq34210-Q1
www.ti.com.cn
ZHCSGI9 –AUGUST 2017
6.12 SHUTDOWN and WAKE-UP Timing
tPUCD
tSHUP
tWUREG18
tPUCD
tREG18
tSHDN
REGIN
REG18
2
SHUTDOWN_
ENABLE
I C Bus
SHUTDOWN
*
ALERT
Off
WAKE-UP
Active
SHUTDOWN
WAKE-UP
Active
State
* ALERT is configured as an input for wake-up signaling.
Figure 2. SHUTDOWN and WAKE-UP Timing Diagram
6.13 Typical Characteristics
1
0.5
0
1.5
1
0.5
0
-0.5
-1
-0.5
-1
-1.5
-1.5
2000
2500
3000
3500
4000
4500
5000
5500
-50
-25
0
25
50
75
100
125
150
Applied Voltage (mV)
Actual Temperature (èC)
D001
D002
Figure 3. Impact of Applied (REGIN) Voltage on Voltage
Measurement
Figure 4. Internal Temperature Measurement Error
Copyright © 2017, Texas Instruments Incorporated
7
bq34210-Q1
ZHCSGI9 –AUGUST 2017
www.ti.com.cn
7 Detailed Description
7.1 Overview
The bq34210-Q1 incorporates fuel gauging and an End-of-Service (EOS) Determination function for use in 1-
series cell packs with support for multiple battery chemistries, including Lithium-Ion (Li-Ion), Lithium Iron
Phosphate (LiFePO4), and Nickel Metal Hydride (NiMH). The gas gauging function uses Compensated End-of-
Discharge Voltage (CEDV) technology to accurately predict the battery capacity and other operational
characteristics of the battery, and can be interrogated by a host processor to provide cell information, such as
remaining capacity, full charge capacity, and average current.
See the bq34210-Q1 Technical Reference Manual (TRM, SLUUBE8) for further details.
NOTE
The following formatting conventions are used in this document:
Commands: italics with parentheses() and no breaking spaces, for example, Control().
Data Flash: italics, bold, and breaking spaces, for example, Design Capacity.
Register bits and flags: italics with brackets [ ], for example, [TDA]
Data flash bits: italics, bold, and brackets [ ], for example, [LED1]
Modes and states: ALL CAPITALS, for example, UNSEALED mode.
7.2 Functional Block Diagram
REGIN
SDA
1.8-V LDO
REG18
SCL
CPU
ALERT
Coulomb
Counter
SRP
Instruction
ROM
Data ROM
Factory
Data OTP
Sleep
Comparator
SRAM
SRN
Internal
Temperature
Sensor
Temperature
ADC
TS
VSS
Copyright © 2017, Texas Instruments Incorporated
7.3 Feature Description
Information is accessed through a series of commands called Standard Commands. The Extended Commands
set provides additional capabilities. Both sets of commands, indicated by the general format Command(), are
used to read and write information in the control and status registers, as well as its data locations. Commands
are sent from the system to the gauge via the I2C serial communications engine, and can be executed during
application development, system manufacture, or end-equipment operation.
8
Copyright © 2017, Texas Instruments Incorporated
bq34210-Q1
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ZHCSGI9 –AUGUST 2017
Feature Description (continued)
The integrated End-of-Service (EOS) Determination function is specifically intended for applications where the
battery is rarely discharged, such as in eCall systems, uninterruptible power supplies (UPS), enterprise server
backup systems, and telecommunications backup modules. In such systems, the battery may remain in a fully (or
near-fully) charged state for much of its lifetime, with it rarely or never undergoing a significant discharge. If the
health of the battery in such a system is not monitored regularly, then it may degrade beyond the level required
for a system backup/discharge event, and thus fail precisely at the time when it is needed most.
The EOS Determination function monitors the health of the battery through the use of infrequent learning phases,
which involve a controlled discharge of ~1% capacity, and provides an alert to the system when the battery is
approaching the end of its usable service. By coordinating battery charging with the learning phases, the battery
capacity available to the system can be maintained above a preselected level, which helps to avoid
compromising the battery's ability to support a system discharge event.
NOTE
The following sections offer a brief overview of the content available in the bq34210-Q1
Technical Reference Manual (TRM, SLUUBE8), and should be used only as references to
the respective sections in the TRM for full details.
7.3.1 Device Configuration
The device must select the correct CEDV profile, interrupt functions (enables, levels), and more during its initial
configuration setup. The bq34210-Q1 includes two CEDV profiles (XYZ and ABC), which are stored in ROM. If
neither of these profiles matches the battery used, a new configuration must be stored in RAM using Texas
Instruments tools (see Getting Started for more details). Changing batteries also requires a new initialization of
the configuration settings. This enables the device to be reconfigured for different battery chemistries or
capacities through the host. If another battery is chosen, the parameters must be generated using TI's web-
based tool, Gauge Parameter Calculator for CEDV Gauges (GAUGEPARCAL). The TRM provides further
details.
7.3.2 ALERT Interrupt and SHUTDOWN Wake-up
The interrupt function of the ALERT pin enables the bq34210-Q1 to communicate with the main system.
Even if the host is not using the ALERT functionality, it is recommended that ALERT be connected to a GPIO of
the host so that in cases where the device is in SHUTDOWN, toggling ALERT can wake up the gauge from the
SHUTDOWN state.
7.3.3 Voltage Measurement and Calibration
Voltage measurements and calibration are done automatically. The Battery Management Studio bqStudio tool
aids in setting up this function to match system requirements.
7.3.4 Temperature Measurement
The device can be configured to use an external thermistor (103AT type) to measure temperature or use its
internal temperature sensor.
7.3.5 Charging and Termination
The bq34210-Q1 monitors charging and detects termination. The termination works for Li-Ion, LiFePO4, and
NiMH systems.
7.3.6 Accumulated Charge Measurement
The device measures the accumulated charge and reports the duration over which that charge was accumulated.
The AccumulatedCharge() and AccumulatedChargeTime() registers can be used to send an alert to the host
when a certain threshold is achieved.
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Feature Description (continued)
7.3.7 Gas Gauging
The bq34210-Q1 device features the Compensated End-of-Discharge Voltage (CEDV) gauging algorithm. This
algorithm uses the accumulated measured quantities for charge and discharge in addition to estimating self-
discharge of the battery. Registers including Remaining Capacity, Design Capacity, Full Charge Capacity, and
Discharge Count Register (DCR) are used in this algorithm.
7.3.8 Battery Condition Warnings
Battery status indications are stored in registers and are used by the device to take action and provide warnings.
Examples of indicator parameters are state-of-charge low detection, overtemperature-in-charge, and battery
voltage high/low.
7.3.9 Configuration Update
CONFIG UPDATE mode is used when updating the configuration data of the fuel gauge. Gauging is disabled
during this mode. This is required when a new battery is inserted.
7.3.10 End-Of-Service Determination
The bq34210-Q1 device incorporates the End-of-Service (EOS) Determination function to calculate the end of
useful service of the battery and to provide alerts based on this detection. Learning phases are used to gather
information about the present state of the battery through its cell resistance.
7.3.11 Battery Level Threshold
The Battery Level Threshold (BLT) feature indicates when the SOC of a battery pack has depleted to a certain
value stored in a register. The thresholds can be set for the charge and discharge conditions.
7.3.12 Communications
7.3.12.1 I2C Interface
The slave-only fuel gauge supports the standard I2C read, incremental read, quick read, one-byte write, and
incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address
and is fixed as 1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read,
respectively.
7.3.12.2 I2C Time Out
The I2C engine releases SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge is holding the
lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of the
lines low, the I2C engine enters the low-power SLEEP mode.
7.3.12.3 I2C Command Waiting Time
To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all
packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-
byte write commands for proper data flow control.
7.3.12.4 I2C Clock Stretching
A clock stretch can occur during all modes of fuel gauge operation. In SLEEP mode, a short ≤ 100-µs clock
stretch occurs on all I2C traffic as the device must wake up to process the packet. In the other modes
(INITIALIZATION, NORMAL), a ≤ 4-ms clock stretching period may occur within packets addressed for the fuel
gauge as the I2C interface performs normal data flow control.
7.3.13 Additional Data Memory Parameter Descriptions
The calibration method requires a correction due to offset errors, using a number of samples to get a statistical
average for the golden image.
10
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7.4 Device Functional Modes
To minimize power consumption, the fuel gauge has four power modes:
•
•
•
•
INITIALIZATION
NORMAL
SLEEP
SHUTDOWN
The fuel gauge passes automatically between these modes, depending upon the occurrence of specific events,
though a system processor can initiate some of these modes directly. The bq34210-Q1 Technical Reference
Manual (SLUUBE8) provides more details.
7.4.1 INITIALIZATION Mode
The bq34210-Q1 enters INITIALIZATION mode at power up. This mode prepares the device to enter NORMAL
mode through its internal power-on reset sequence. When the reset sequence is complete, the device
automatically moves to NORMAL mode.
7.4.2 NORMAL Mode
The bq34210 NORMAL mode is entered from INITIALIZATION mode when the power-on reset is complete.
When the charge and discharge currents are above the programmable level, the device will remain in NORMAL
mode. If the measured currents are below the programmable level, SLEEP mode is entered. Once the currents
increase above the threshold, the device will reenter NORMAL mode. The device will enter SHUTDOWN mode
through a command sequence.
7.4.3 SLEEP Mode
SLEEP mode is entered from NORMAL mode if enabled and the current is below a programmable level. Once
the current increases above that level, NORMAL mode is reentered.
7.4.4 SHUTDOWN Mode
The lowest power mode is SHUTDOWN mode. In this mode, the device is completely off. It is entered through an
I2C command. Exiting from SHUTDOWN mode can be done by battery removal and replacement or through the
ALERT pin. Pulling ALERT low for tSHUP and then above VIH(OD) enables the bq34210 device to go through its
standard power-up sequence (into INITIALIZATION mode).
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8 Application and Implementation
NOTE
Information in the following application section is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The bq34210-Q1 fuel gauge is a microcontroller peripheral that provides system-side fuel gauging for 1-series
cell batteries of a variety of chemistries. Battery fuel gauging with the fuel gauge requires connections only to
PACK+ and PACK– for a removable battery pack or embedded battery circuit. To allow for optimal performance
in the end application, special considerations must be taken to ensure minimization of measurement error
through proper printed circuit board (PCB) board layout. Such requirements are detailed in Design Requirements.
8.1.1 Getting Started
To help configure and evaluate a bq34210-Q1 solution, Texas Instruments provides many supporting tools on
the TI.com website, including the following:
•
•
•
Battery Management Studio (bqStudio)
Gauge Parameter Calculator for CEDV Gauges (GAUGEPARCAL)
bqProduction to assist with the manufacturing process
These tools work with a TI EVM and with a self-designed solution. The bq34210-Q1 Technical Reference Manual
(SLUUBE8) provides details on programming the gauge.
8.2 Typical Applications
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SBS 1.1-Compliant Gas Gauge and Protection Enabled With Impedance Track⢠and External Battery Heater Control
TI
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