AMC60704 [TI]
具有四通道电流和电压输出 DAC 以及多通道 ADC 的光学控制器;
| 型号： | AMC60704 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有四通道电流和电压输出 DAC 以及多通道 ADC 的光学控制器 控制器 |
| 文件： | 总7页 (文件大小：871K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AMC60704
ZHCSRE1 –DECEMBER 2022
AMC60704 具有电流和电压输出DAC 和多通道ADC 的
4 通道光学监视器和控制器
1 特性
3 说明
• 四个12 位电流输出DAC (IDAC)
AMC60704 是一款经优化可适用于电吸收调制激光器
(EML) 应用的高度集成、低功耗模拟监视器和控制器。
– 200mA 满量程输出范围
– 低电源余量：300 mV/200 mA
• 四个12 位电压输出DAC (VDAC)
AMC60704 包括四个 12 位电流输出数模转换器
(IDAC) 和四个 12 位电压输出 DAC (VDAC)，具有可
编程输出范围。该器件还包括一个用于内外部信号监测
的 12 位 1MSPS 模数转换器 (ADC)、电源和温度警报
监控器以及一个高精度内部基准。
– 可选的满量程输出范围：
–5V、–2.5V、+2.5V 和+5V
– 高电流驱动能力：±50mA
• 多通道12 位、1MSPS SAR ADC
AMC60704 VDAC 可在正负输出范围内运行，能够拉
出和灌入高达 50mA 的电流，是偏置光学调制器的理
想选择。此外，AMC60704 IDAC 支持 200mA 的满量
程输出范围和超低功率耗散。IDAC 无需使用外部元件
来偏置激光二极管。AMC60704 将四个 VDAC 和四个
IDAC 集于一身，可实现多达四个EML 的精确偏置。
– 四个外部输入：电压范围为2.5V 至5V
– 四个IDAC 电压监测通道
– 四个VDAC 电流监测通道
– 可编程序列发生器
– 可编程超限报警
• 内部2.5V 基准电压
• 电源和温度故障警报
• SPI 和I2C 接口：1.7V 至3.6V 工作电压
AMC60704 还包含四个多路复用到 ADC 的输入引脚，
以及一个低延迟窗口比较器。这些特性使该器件非常适
用于接收信号强度指示器 (RSSI) 和信号丢失 (LOS) 检
测。ADC 还能测量 IDAC 引脚的电压以及由 VDAC 拉
出或灌入的电流，从而能够监控输出。
– SPI：4 线接口
– I2C：四个目标地址
• 额定温度范围：–40°C 至+125°C
AMC60704 的低功耗、高集成度、超小尺寸和宽工作
温度范围特性使其非常适用于光模块一体化控制电路。
2 应用
• 光学模块
• 数据中心内部互联（地铁）
封装信息
封装(1)
封装尺寸（标称值）
器件型号
AMC60704
AMC60704
YBH（DSBGA，
36）
Supply and Temperature Monitors
2.56mm × 2.56mm
IDAC Channels 1–4
IDAC1
IDAC2
IDAC3
IDAC4
(1) 要了解所有可用封装，请参见数据表末尾的封装选项附录。
SPI or I2C
Serial Interface
Voltage
Monitors
IDAC
× 4
VDAC Channels 1–4
VDAC
VDAC1
VDAC2
VDAC3
VDAC4
Interrupt Control
and
Alarm Detector
Current
Monitors
× 4
ADC
ADC1
ADC2
ADC3
ADC4
MUX
Reference
简化原理图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLASF65
AMC60704
ZHCSRE1 –DECEMBER 2022
www.ti.com.cn
4 Device and Documentation Support
4.1 Documentation Support
备注
TI is transitioning to use more inclusive terminology. Some language may be different than what you
would expect to see for certain technology areas.
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改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
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答或提出自己的问题可获得所需的快速设计帮助。
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TI 的《使用条款》。
4.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
4.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
4.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
2
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Product Folder Links: AMC60704
PACKAGE OPTION ADDENDUM
www.ti.com
31-Jan-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AMC60704YBHR
ACTIVE
DSBGA
YBH
36
3000 RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 105
AMC60704
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
YBH0036
DSBGA - 0.4 mm max height
SCALE 7.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.4 MAX
SEATING PLANE
0.05 C
BALL TYP
0.16
0.10
2 TYP
SYMM
F
E
D
C
2
TYP
SYMM
D: Max = 2.585 mm, Min =2.524 mm
E: Max = 2.585 mm, Min =2.524 mm
B
A
0.4 TYP
3
4
1
2
5
6
0.225
0.185
C A B
36X
0.015
0.4 TYP
4225648/A 01/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YBH0036
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.2)
2
4
6
1
5
A
(0.4) TYP
B
C
SYMM
D
E
F
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
(
0.2)
METAL
(
0.2)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4225648/A 01/2020
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YBH0036
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
(R0.05) TYP
36X ( 0.21)
(0.4) TYP
4
6
1
2
5
A
B
C
SYMM
METAL
TYP
D
E
F
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.075 mm THICK STENCIL
SCALE: 30X
4225648/A 01/2020
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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