AM3894BCYGA120 [TI]
AM389x Sitara ARM Processors; AM389x的Sitara ARM处理器型号: | AM3894BCYGA120 |
厂家: | TEXAS INSTRUMENTS |
描述: | AM389x Sitara ARM Processors |
文件: | 总308页 (文件大小:1754K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AM3894
AM3892
www.ti.com
SPRS681E –OCTOBER 2010–REVISED JULY 2012
AM389x Sitara™
®
ARM Processors
Check for Samples: AM3894, AM3892
1 Device Summary
1.1 Features
1234567891011
• High-Performance Sitara™ ARM® Processors
– Simultaneous SD and HD Analog Output
– Digital HDMI 1.3 transmitter with PHY with
HDCP up to 165-MHz pixel clock
– Advanced Video Processing Features Such
as Scan/Format/Rate Conversion
– ARM® Cortex™-A8 RISC Processor
•
Up to 1.35 GHz
• ARM® Cortex™-A8 Core
– ARMv7 Architecture
– Three Graphics Layers and Compositors
• Dual 32-bit DDR2/3 SDRAM Interfaces
– Supports up to DDR2-800 and DDR3-1600
– Up to Eight x8 Devices Total
•
In-Order, Dual-Issue, Superscalar
Processor Core
•
NEON™ Multimedia Architecture
– Supports Integer and Floating Point (VFPv3-
IEEE754 compliant)
– 2 GB Total Address Space
– Dynamic Memory Manager (DMM)
•
Jazelle® RCT Execution Environment
• ARM® Cortex™-A8 Memory Architecture
– 32K-Byte Instruction and Data Caches
– 256K-Byte L2 Cache
•
Programmable Multi-Zone Memory
Mapping and Interleaving
•
•
Enables Efficient 2D Block Accesses
Supports Tiled Objects in 0°, 90°, 180°, or
270 Orientation and Mirroring
– 64K-Byte RAM, 48K-Byte Boot ROM
• 512K-Bytes On-Chip Memory Controller
(OCMC) RAM
• SGX530 3D Graphics Engine (available only on
the AM3894 device)
•
Optimizes Interlaced Accesses
• One PCI Express® (PCIe®) 2.0 Port With
Integrated PHY
– Single Port With 1 or 2 Lanes at 5.0 GT/s
– Configurable as Root Complex or Endpoint
• Serial ATA (SATA) 3.0 Gbps Controller With
Integrated PHYs
– Delivers up to 30 MTriangles/s
– Universal Scalable Shader Engine
– Direct3D® Mobile, OpenGL® ES 1.1 and 2.0,
OpenVG™ 1.1, OpenMax™ API Support
– Direct Interface for Two Hard Disk Drives
– Hardware-Assisted Native Command
Queuing (NCQ) from up to 32 Entries
– Supports Port Multiplier and Command-
Based Switching
– Advanced Geometry DMA Driven Operation
– Programmable HQ Image Anti-Aliasing
• Endianness
– ARM Instructions/Data – Little Endian
• HD Video Processing Subsystem (HDVPSS)
– Two 165 MHz HD Video Capture Channels
• Two 10/100/1000 Mbps Ethernet MACs (EMAC)
– IEEE 802.3 Compliant (3.3V I/O Only)
– MII and GMII Media Independent I/Fs
– Management Data I/O (MDIO) Module
• Dual USB 2.0 Ports With Integrated PHYs
– USB 2.0 High-/Full-Speed Client
•
•
One 16/24-bit and One 16-bit Channel
Each Channel Splittable Into Dual 8-bit
Capture Channels
– Two 165 MHz HD Video Display Channels
One 16/24/30-Bit and One 16-bit Channel
•
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
4
5
6
7
8
9
Sitara, SmartReflex, Code Composer Studio, DSP/BIOS, XDS are trademarks of Texas Instruments.
Cortex, NEON are trademarks of ARM Ltd or its subsidiaries.
ARM, Jazelle, Thumb are registered trademarks of ARM Ltd or its subsidiaries.
USSE, POWERVR are trademarks of Imagination Technologies Limited.
OpenVG, OpenMax are trademarks of Khronos Group Inc.
Direct3D, Microsoft, Windows are registered trademarks of Microsoft Corporation in the United States and/or other countries.
I2C BUS is a registered trademark of NXP B.V. Corporation Netherlands.
PCI Express, PCIe are registered trademarks of PCI-SIG.
10OpenGL is a registered trademark of Silicon Graphics International Corp. or its subsidiaries in the United States and/or other
countries.
11All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
Copyright © 2010–2012, Texas Instruments Incorporated
AM3894
AM3892
SPRS681E –OCTOBER 2010–REVISED JULY 2012
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– USB 2.0 High-/Full-/Low-Speed Host
– Supports End Points 0-15
• General Purpose Memory Controller (GPMC)
– 8-/16-bit Multiplexed Address/Data Bus
• Three Multichannel Audio Serial Ports
– One Six-Serializer Transmit/Receive Port
– Two Dual-Serializer Transmit/Receive Ports
– DIT-Capable For S/PDIF (All Ports)
– Up to 6 Chip Selects With up to 256M-Byte
Address Space per Chip Select Pin
– Glueless Interface to NOR Flash, NAND
Flash (With BCH and Hamming Error Code
Detection), SRAM and Pseudo-SRAM
– Error Locator Module (ELM) Outside of
GPMC to Provide Up to 16-Bit/512-Bytes
Hardware ECC for NAND
– Flexible Asynchronous Protocol Control for
Interface to FPGA, CPLD, ASICs, etc.
• Multichannel Buffered Serial Port (McBSP)
– Transmit/Receive Clocks up to 48 MHz
– Two Clock Zones and Two Serial Data Pins
– Supports TDM, I2S, and Similar Formats
• Real-Time Clock (RTC)
– One-Time or Periodic Interrupt Generation
• Up to 64 General-Purpose I/O (GPIO) Pins
• On-Chip ARM® ROM Bootloader (RBL)
• Power, Reset, and Clock Management
– SmartReflex™ Technology (Level 2)
– Seven Independent Core Power Domains
• Enhanced Direct-Memory-Access (EDMA)
Controller
– Clock Enable/Disable Control For
Subsystems and Peripherals
• IEEE-1149.1 (JTAG) and IEEE-1149.7 (cJTAG)
Compatible
• 1031-Pin Pb-Free BGA Package (CYG Suffix),
0.65-mm Ball Pitch
• Via Channel™ Technology Enables use of 0.8-
mm Design Rules
– Four Transfer Controllers
– 64/8 Independent DMA/QDMA Channels
• Seven 32-bit General-Purpose Timers
• One System Watchdog Timer
• Three Configurable UART/IrDA/CIR Modules
– UART0 With Modem Control Signals
– Supports up to 3.6864 Mbps UART
– SIR, MIR, FIR (4.0 MBAUD), and CIR
• One 40-MHz Serial Peripheral Interface (SPI)
With Four Chip-Selects
• SD/SDIO serial interface (1-/4-Bit)
• Dual Inter-Integrated Circuit ( I2C BUS®) Ports
• 40-nm CMOS Technology
• 3.3-V Single-Ended LVCMOS I/Os (except for
DDR3 at 1.5 V, DDR2 at 1.8 V, and DEV_CLKIN
at 1.8 V)
2
Device Summary
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1.2 Applications
•
•
•
•
•
Single-Board Computing
Network and Communications Processing
Industrial Automation
Human Machine Interface
Interactive Point-of-Service Kiosks
1.3 Description
The AM389x Sitara™ ARM® Processors are a highly-integrated, programmable platform that leverages
TI's Sitara™ technology to meet the processing needs of the following applications: Single-Board
Computing, Network and Communications Processing, Industrial Automation, Human Machine Interface,
and Interactive Point-of-Service Kiosks.
The device enables OEMs and ODMs to quickly bring to market devices featuring robust operating
systems support, rich user interfaces, and high processing performance through the maximum flexibility of
a fully integrated mixed processor solution. The device combines high-performance ARM® processing with
a highly-integrated peripheral set.
The ARM® Cortex™-A8 32-bit RISC processor with NEON™ floating-point extension includes: 32K bytes
(KB) of instruction cache; 32KB of data cache; 256KB of L2 cache; and 64KB of RAM.
The rich peripheral set provides the ability to control external peripheral devices and communicate with
external processors. For details on each of the peripherals, see the related sections in this document and
the associated peripheral reference guides. The peripheral set includes: HD Video Processing Subsystem
(HDVPSS), which provides output of simultaneous HD and SD analog video and dual HD video inputs; up
to two Gigabit Ethernet MACs (10/100/1000 Mbps) with GMII and MDIO interface; two USB ports with
integrated 2.0 PHY; PCIe® port x2 lanes GEN2 compliant interface, which allows the device to act as a
PCIe® root complex or device endpoint; one 6-channel McASP audio serial port (with DIT mode); two
dual-channel McASP audio serial ports (with DIT mode); one McBSP multichannel buffered serial port;
three UARTs with IrDA and CIR support; SPI serial interface; SD/SDIO serial interface; two I2C
master/slave interfaces; up to 64 General-Purpose I/O (GPIO); seven 32-bit timers; system watchdog
timer; dual DDR2/3 SDRAM interface; flexible 8/16-bit asynchronous memory interface; and up to two
SATA interfaces for external storage on two disk drives, or more with the use of a port multiplier.
The device also includes an SGX530 3D graphics engine (available only on the AM3894 device) to off-
load many video and imaging processing tasks from the core. Additionally, it has a complete set of
development tools for the ARM which include C compilers and a Microsoft ® Windows® debugger interface
for visibility into source code execution.
The device package has been specially engineered with Via Channel™ technology. This technology
allows 0.8-mm pitch PCB feature sizes to be used in this 0.65-mm pitch package, and substantially
reduces PCB costs. It also allows PCB routing in only two signal layers due to the increased layer
efficiency of the Via Channel™ BGA technology.
Copyright © 2010–2012, Texas Instruments Incorporated
Device Summary
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1.4 Functional Block Diagram
Figure 1-1 shows the functional block diagram of the device.
HD Video Processing
Subsystem (HDVPSS)
ARM Subsystem
Cortex™-A8
CPU
NEON
FPU
Video Capture
32KB
32KB
Display Processing
I-Cache
D-Cache
HD OSD
HD VENC
HD DACs
SD OSD
SD VENC
SD DACs
256KB L2 Cache
Boot ROM
48KB
RAM
64KB
ICECrusher™
Software
HDMI Xmt
System Interconnect
Peripherals
Serial Interfaces
System Control
Program/Data Storage
Connectivity
DMA
Real-Time
Clock
DDR3
32-bit
(2)
EMAC
GMII/MII
(2)
PRCM
JTAG
GPMC
and
ELM
McASP
(3)
McBSP
EDMA
MDIO
GP Timer
(7)
I2C
(2)
USB 2.0
Ctrl/PHY
(2)
SPI
SATA
3 Gbps
(2)
PCIe 2.0
(One Port,
x2 Lanes)
SD/SDIO
Watchdog
Timer
UART
(3)
A. SGX530 is available only on the AM3894 device.
Figure 1-1. AM389x Functional Block Diagram
4
Device Summary
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1
Device Summary ........................................ 1
7.3 Clocking ........................................... 137
7.4 Interrupts .......................................... 147
Peripheral Information and Timings ............. 155
8.1 Parameter Information ............................ 155
1.1 Features ............................................. 1
1.2 Applications .......................................... 3
1.3 Description ........................................... 3
1.4 Functional Block Diagram ........................... 4
8
8.2
Recommended Clock and Control Signal Transition
Behavior ........................................... 156
Revision History .............................................. 6
2
8.3 DDR2/3 Memory Controller ....................... 157
8.4 Emulation Features and Capability ............... 193
Device Overview ........................................ 7
2.1 Device Comparison .................................. 7
2.2 Device Characteristics ............................... 8
2.3 ARM Subsystem ..................................... 9
2.4 Media Controller .................................... 11
2.5 Inter-Processor Communication .................... 11
8.5
Enhanced Direct Memory Access (EDMA)
Controller .......................................... 197
8.6
8.7
8.8
Ethernet Media Access Controller (EMAC) ....... 203
General-Purpose Input/Output (GPIO) ............ 212
General-Purpose Memory Controller (GPMC) and
2.6
Power, Reset and Clock Management (PRCM)
Error Locator Module (ELM) ...................... 215
Module .............................................. 12
8.9
High-Definition Multimedia Interface (HDMI) ...... 236
2.7 SGX530 (AM3894 only) ............................ 17
2.8 Memory Map Summary ............................. 18
Device Pins ............................................. 28
3.1 Pin Assignments .................................... 28
3.2 Terminal Functions ................................. 46
Device Configurations .............................. 107
4.1 Control Module .................................... 107
4.2 Debugging Considerations ........................ 110
4.3 Boot Sequence .................................... 111
4.4 Pin Multiplexing Control ........................... 112
4.5 How to Handle Unused Pins ...................... 119
System Interconnect ................................ 120
5.1 L3 Interconnect .................................... 120
5.2 L4 Interconnect .................................... 122
Device Operating Conditions ...................... 124
8.10 High-Definition Video Processing Subsystem
(HDVPSS) ......................................... 245
8.11 Inter-Integrated Circuit (I2C) ...................... 252
8.12 Multichannel Audio Serial Port (McASP) .......... 256
8.13 Multichannel Buffered Serial Port (McBSP) ....... 264
8.14 Peripheral Component Interconnect Express (PCIe)
..................................................... 268
8.15 Real-Time Clock (RTC) ........................... 272
8.16 Secure Digital/Secure Digital Input Output
(SD/SDIO) ......................................... 274
8.17 Serial ATA Controller (SATA) ..................... 277
8.18 Serial Peripheral Interface (SPI) .................. 281
3
4
5
6
8.19 Timers ............................................. 288
8.20 Universal Asynchronous Receiver/Transmitter
(UART) ............................................ 291
8.21 Universal Serial Bus (USB2.0) .................... 295
Device and Documentation Support ............. 302
9.1 Device Support .................................... 302
9.2 Documentation Support ........................... 303
9.3 Community Resources ............................ 303
6.1
Absolute Maximum Ratings (Unless Otherwise
9
Noted) ............................................. 124
6.2 Recommended Operating Conditions ............. 125
6.3
Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating
Temperature (Unless Otherwise Noted) .......... 127
10 Mechanical Packaging and Orderable
Information ............................................ 304
10.1 Thermal Data for CYG ............................ 304
10.2 Packaging Information ............................ 304
7
Power, Reset, Clocking, and Interrupts ......... 129
7.1 Power Supplies .................................... 129
7.2 Reset .............................................. 132
Copyright © 2010–2012, Texas Instruments Incorporated
Contents
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
This revision history highlights the technical changes made to the document in this revision.
AM389x Revisions
SEE
ADDITIONS/MODIFICATIONS/DELETIONS
Section 1.1
Features:
Changed ARM Cortex-A8 processor to 1.35 GHz
Characteristics of the Processor:
Table 2-2
Section 6.2
Table 7-13
Table 7-15
Table 7-16
Figure 9-1
Modified CPU Frequency and Cycle Time
Recommended Operating Conditions:
Modified FSYSCLK MAX value
PLL Clock Frequencies:
Modified Clock2, ARM @ 1.35 GHz
SYSCLK Frequencies:
Modified SYSCLK2 and SYSCLK23 MAX FREQUENCY for DEVICE SPEED RANGE 135
Module Clock Frequencies:
Modified Cortex-A8 and SGX530 MAX FREQUENCY for DEVICE SPEED RANGE 135
Device Nomenclature:
Modified DEVICE SPEED RANGE
6
Contents
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2 Device Overview
2.1 Device Comparison
There are variations in the availability of some functions of the AM389x devices. A comparison of the
devices, highlighting the differences, is shown in Table 2-1. For more detailed information on the
significant device features, see Section 2.2, Device Characteristics.
Table 2-1. Device Comparison
DEVICES
FEATURES
AM3894
AM3892
SGX530
Y
N
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2.2 Device Characteristics
Table 2-2 provides an overview of the significant features of the AM389x devices, including the capacity of
on-chip RAM, peripherals, and the package type with pin count.
Table 2-2. Characteristics of the Processor
HARDWARE FEATURES
AM3894/AM3892
1 16-/24-bit HD Capture Channel or
2 8-bit SD Capture Channels
and
1 16-bit HD Capture Channel or
2 8-bit SD Capture Channels
and
HD Video Processing Subsystem (HDVPSS)
1 16-/24-/32-bit HD Display Channel
and
1 16-bit HD Display Channel
and
3 HD and 4 SD Video DACs
and
1 HDMI 1.3 Transmitter
DDR2/3 Memory Controller
GPMC and ELM
2 (32-bit Bus Widths)
Asynchronous (8-/16-bit bus width) RAM, NOR, NAND
64 Independent Channels
8 QDMA Channels
EDMA
10/100/1000 Ethernet MAC with Management
Data Input/Output (MDIO)
2 (with MII/GMII Interface)
Peripherals
Not all peripherals pins are
available at the same time (for
more detail, see Section 4,
Device Configurations).
2 (Supports High- and Full-Speed as a Device and
High-, Full-, and Low-Speed as a Host)
USB 2.0
PCI Express 2.0
1 Port (2 5.0GT/s lanes)
7 (32-bit General purpose)
and
Timers
UART
1 (Watchdog)
3 (with SIR, MIR, CIR support and RTS/CTS flow
control)
(UART0 Supports Modem Interface)
SPI
1 (Supports 4 slave devices)
1 (1-bit or 4-bit)
SD/SDIO
I2C
2 (Master/Slave)
3 (6/2/2 Serializers, Each with Transmit/Receive and
DIT capability)
McASP
McBSP
1 (2 Data Pins, Transmit/Receive)
Serial ATA (SATA)
RTC
Supports 2 Interfaces
1
GPIO
Up to 64 pins
ARM
32KB I-cache
32KB D-cache
256KB L2 Cache
64KB RAM
On-Chip Memory
Organization
48KB Boot ROM
MEDIA CONTROLLER
32KB Shared L1 Cache
256KB L2 RAM
ADDITIONAL SHARED MEMORY
512KB On-chip RAM
CPU ID + CPU Rev ID
JTAG BSDL_ID
CPU Frequency
Cycle Time
Control Status Register (CSR.[31:16])
0x1003
0x2B81 E02F
Up to 1350 MHz
0.741 ns
JTAGID Register
MHz
ns
8
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Table 2-2. Characteristics of the Processor (continued)
HARDWARE FEATURES
Core Logic (V)
USB Logic (V)
RAM (V)
AM3894/AM3892
1.0 V with Required AVS Capability
0.9 V
Voltage
1.0 V
I/O (V)
1.5 V, 1.8 V, 3.3 V
1031-Pin BGA (CYG)
0.04 µm
Package
25 x 25 mm
µm
Process Technology
Product Preview (PP),
Advance Information (AI),
or Production Data (PD)
Product Status(1)
PD
(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
2.3 ARM Subsystem
The ARM subsystem is designed to give the ARM Cortex-A8 master control of the device. In general, the
ARM Cortex-A8 is responsible for configuration and control of the various subsystem, peripherals, and
external memories.
The ARM subsystem includes the following features:
•
ARM Cortex-A8 RISC processor:
–
–
–
–
–
–
–
ARMv7 ISA plus Thumb®-2, Jazelle-X, and media extensions
NEON floating-point unit
Enhanced memory management unit (MMU)
Little Endian
32KB L1 instruction cache
32KB L1 data cache
256KB L2 cache
•
•
•
•
Foresight embedded trace module (ETM)
ARM Cortex-A8 interrupt controller (AINTC)
64KB internal RAM
48KB internal public ROM.
L3
DMM
System Events
128
DEVOSC
SYSCLK2
64
64 128
Arbiter
128
32
32
64
ARM Cortex™-A8
ARM Cortex-A8
Interrupt Controller
(AINTC)
128
128
32KB L1I$ 32KB L1D$
256KB L2$
48KB ROM
64KB RAM
Trace
ETM
NEON
64
Debug
ICECrusher
Figure 2-1. ARM Cortex-A8 Subsystem Block Diagram
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2.3.1 ARM Cortex-A8 RISC Processor
The ARM Cortex-A8 subsystem integrates the ARM Cortex-A8 processor. The ARM Cortex-A8 processor
is a member of ARM Cortex family of general-purpose processors. This processor is targeted at multi-
tasking applications where full memory management, high performance, low die size, and low power are
all important. The ARM Cortex-A8 processor supports the ARM debug architecture and includes logic to
assist in both hardware and software debug. The ARM Cortex-A8 processor has a Harvard architecture
and provides a complete high-performance subsystem, including:
•
•
•
•
•
•
•
•
•
•
•
•
ARM Cortex-A8 integer core
Superscalar ARMv7 instruction set
Thumb-2 instruction set
Jazelle RCT acceleration
CP14 debug coprocessor
CP15 system control coprocessor
NEON 64-/128-bit hybrid SIMD engine for multimedia
Enhanced memory management unit (MMU)
Separate level-1 instruction and data caches
Integrated level-2 cache
128-bit interconnect to system memories and peripherals
Embedded trace module (ETM).
2.3.2 Embedded Trace Module (ETM)
To support real-time trace, the ARM Cortex-A8 processor provides an interface to enable connection of an
embedded trace module (ETM). The ETM consists of two parts:
•
•
The Trace port provides real-time trace capability for the ARM Cortex-A8.
Triggering facilities provide trigger resources, which include address and data comparators, counter,
and sequencers.
The ARM Cortex-A8 trace port is connected to the system-level embedded trace buffer (ETB). The ETB
has a 32KB buffer memory. ETB enabled debug tools are required to read/interpret the captured trace
data.
For more details on the ETB, see Section 8.4.2.
2.3.3 ARM Cortex-A8 Interrupt Controller (AINTC)
The ARM Cortex-A8 subsystem contains an interrupt controller (AINTC) that prioritizes all service requests
from the system peripherals and generates either IRQ or FIQ to the ARM Cortex-A8 processor. For more
details on the AINTC, see Section 7.4.
2.3.4 System Interconnect
The ARM Cortex-A8 processor in connected through the arbiter to both an L3 interconnect port and a
DMM port. The DMM port is 128-bits wide and provides the ARM Cortex-A8 direct access to the DDR
memories, while the L3 interconnect port is 64-bits wide and provides access to the remaining device
modules.
10
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2.4 Media Controller
The Media Controller has the responsibility of managing the HDVPSS module.
2.5 Inter-Processor Communication
This device is a multi-core device that requires software to efficiently manage and communicate between
the cores. The following are the main features that need to be implemented by such software:
1. Device management of the slave processors from the host processor.
2. Inter-processor communication between the cores for transfer and exchange of information between
them.
For implementing efficient inter-processor communication between the multiple cores on the device, the
following hardware features are provided:
•
•
Mailbox interrupts
Hardware spinlocks
Mailboxes provide a mechanism for one processor to write a value to a register and send an interrupt to
another processor. Spinlocks facilitate access to shared resources in the system.
2.5.1 Mailbox Module
The device Mailbox module facilitates communication between the ARM Cortex-A8 and the Media
Controller. It consists of twelve mailboxes, each supporting communication between two of the above
processors. The sender sends information to the receiver by writing a message to the mailbox registers.
Interrupt signaling is used to notify the receiver that a message has been queued or to notify the sender
about an overflow situation.
The Mailbox module supports the following features (see Figure 2-2):
•
•
•
•
•
12 mailboxes
Four-message FIFO depth for each message queue
32-bit message width
Message reception and queue-not-full notification using interrupts
Three interrupts (one to ARM Cortex-A8, two to Media Controller).
Mailbox Module
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
L4
Interconnect
Interrupt
Interrupt
Interrupt
ARM Cortex-A8
Media Controller
Figure 2-2. Mailbox Module Block Diagram
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2.5.1.1 Mailbox Registers
Table 2-3 lists the Mailboxes available on this device. The register set below is applicable to these
mailboxes. Table 2-4 lists the Mailbox registers.
Table 2-3. Mailboxes
MAILBOX TYPE
USER NUMBER (u)
MAILBOX NUMBER (m)
MESSAGES PER MAILBOX
System Mailbox
0 to 3
0 to 11
4
Table 2-4. Mailbox Registers Summary(1)
HEX ADDRESS
ACRONYM
REGISTER NAME
0x480C 8000
MAILBOX_REVISION
Mailbox Revision
0x480C 8010
MAILBOX_SYSCONFIG
MAILBOX_MESSAGE_m
MAILBOX_FIFOSTATUS_m
MAILBOX_MSGSTATUS_m
Mailbox System Configuration
Mailbox Message
0x480C 8040 + (0x4 * m)
0x480C 8080 + (0x4 * m)
0x480C 80C0 + (0x4 * m)
0x480C 8100 + (0x10 * u)
0x480C 8104 + (0x10 * u)
0x480C 8108 + (0x10 * u)
0x480C 810C + (0x10 * u)
0x480C 8140
Mailbox FIFO Status
Mailbox Message Status
MAILBOX_IRQSTATUS_RAW_u Mailbox IRQ RAW Status
MAILBOX_IRQSTATUS_CLR_u Mailbox IRQ Clear Status
MAILBOX_IRQENABLE_SET_u Mailbox IRQ Enable Set
MAILBOX_IRQENABLE_CLR_u Mailbox IRQ Enable Clear
-
Reserved
(1) For the range of m and u, see Table 2-3.
2.5.2 Spinlock Module
The Spinlock module provides hardware assistance for synchronizing the processes running on multiple
processors in the device:
•
•
ARM Cortex-A8 processor
Media Controller processors.
The Spinlock module implements 64 spinlocks (or hardware semaphores) that provide an efficient way to
perform a lock operation of a device resource using a single read-access, avoiding the need for a read-
modify-write bus transfer of which the programmable cores are not capable.
2.5.2.1 Spinlock Registers
Table 2-5. Spinlock Registers Summary(1)
HEX ADDRESS
0x480C A000
ACRONYM
REGISTER NAME
Revision
SPINLOCK_REV
0x480C A010h
SPINLOCK_SYSCFG
SPINLOCK_SYSSTAT
SPINLOCK_LOCK_REG_i
System Configuration
System Status
Lock
0x480C A014h
0x480C A800 + (0x4*i)
(1) i = 0 to 63
2.6 Power, Reset and Clock Management (PRCM) Module
The PRCM module is the centralized management module for the power, reset, and clock control signals
of the device. It interfaces with all the components on the device for power, clock, and reset management
through power-control signals. It integrates enhanced features to allow the device to adapt energy
consumption dynamically, according to changing application and performance requirements. The
innovative hardware architecture allows a substantial reduction in leakage current.
The PRCM module is composed of two main entities:
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•
Power reset manager (PRM): Handles the power, reset, wake-up management, and system clock
source control (oscillator)
•
Clock manager (CM): Handles the clock generation, distribution, and management.
Table 2-6 lists the physical addresses of the PRM and CM modules. Table 2-7 through Table 2-18 provide
register mapping summaries of the PRM and CM registers.
For more details on the PRCM, see Section 7 of this data sheet, Power, Reset, Clocking and Interrupts,
and the PRCM chapter of the AM389x Sitara ARM Processors Technical Reference Manual (literature
number SPRUGX7).
Table 2-6. PRCM Register Address Summary
ADDRESS OFFSET
0x0000
MODULE NAME
PRM_DEVICE
CM_DEVICE
CM_DPLL
SIZE
SEE
256 Bytes
256 Bytes
256 Bytes
256 Bytes
256 Bytes
256 Bytes
256 Bytes
256 Bytes
256 Bytes
1 KBytes
1 KBytes
Table 2-7
Table 2-8
Table 2-10
Table 2-11
Table 2-12
Table 2-13
Table 2-14
Table 2-15
Table 2-16
Table 2-17
Table 2-18
0x0100
0x0300
0x0400
CM_ACTIVE
CM_DEFAULT
CM_SGX
0x0500
0x0900
0x0A00
PRM_ACTIVE
PRM_DEFAULT
PRM_SGX
0x0B00
0x0F00
0x1400
CM_ALWON
PRM_ALWON
0x1800
Table 2-7. PRM_DEVICE Register Summary
HEX ADDRESS
0x4818 00A0
0x4818 00A4
0x4818 00A8
ACRONYM
PRM_RSTCTRL
PRM_RSTTIME
PRM_RSTST
REGISTER NAME
Global software cold and warm reset control
Reset duration control
Global reset sources log
Table 2-8. CM_DEVICE Register Summary
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4818 0100
CM_CLKOUT_CTRL
SYS_CCCLKOUT output control
Table 2-9. OCP_SOCKET_PRM Register Summary
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4818 0200
REVISION_PRM
PRCM IP revision code
Table 2-10. CM_DPLL Register Summary
HEX ADDRESS
0x4818 0300
0x4818 0304
0x4818 0308
0x4818 030C
0x4818 0310
0x4818 0314
0x4818 0318
0x4818 0324
0x4818 032C
ACRONYM
REGISTER NAME
CM_SYSCLK1_CLKSEL
CM_SYSCLK2_CLKSEL
CM_SYSCLK3_CLKSEL
CM_SYSCLK4_CLKSEL
CM_SYSCLK5_CLKSEL
CM_SYSCLK6_CLKSEL
CM_SYSCLK7_CLKSEL
CM_SYSCLK10_CLKSEL
CM_SYSCLK11_CLKSEL
SYSCLK1 clock divider value select
SYSCLK2 clock divider value select
SYSCLK3 clock divider value select
SYSCLK4 clock divider value select
SYSCLK5 clock divider value select
SYSCLK6 clock divider value select
SYSCLK7 clock divider value select
SYSCLK10 clock divider value select
SYSCLK11 clock divider value select
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Table 2-10. CM_DPLL Register Summary (continued)
HEX ADDRESS
0x4818 0334
0x4818 0338
0x4818 0340
0x4818 0344
0x4818 0348
0x4818 034C
0x4818 0350
0x4818 0354
0x4818 0358
0x4818 035C
0x4818 0370
0x4818 0374
0x4818 0378
0x4818 037C
0x4818 0380
0x4818 0384
0x4818 0388
0x4818 0390
0x4818 0394
0x4818 0398
0x4818 039C
0x4818 03A0
0x4818 03A4
0x4818 03A8
0x4818 03B0
0x4818 03B4
ACRONYM
CM_SYSCLK13_CLKSEL
CM_SYSCLK15_CLKSEL
CM_VPB3_CLKSEL
REGISTER NAME
SYSCLK13 clock divider value select
SYSCLK15 clock divider value select
Video PLL B3 clock divider value select
Video PLL C1 clock divider value select
Video PLL D1 clock divider value select
SYSCLK19 clock divider value select
SYSCLK20 clock divider value select
SYSCLK21 clock divider value select
SYSCLK22 clock divider value select
Audio PLL A clock divider value select
SYSCLK14 clock mux select line
SYSCLK16 clock mux select line
SYSCLK18 clock mux select line
McASP0 audio clock mux select line
McASP1 audio clock mux select line
McASP2 audio clock mux select line
McBSP audio clock mux select line
Timer1 clock mux select line
CM_VPC1_CLKSEL
CM_VPD1_CLKSEL
CM_SYSCLK19_CLKSEL
CM_SYSCLK20_CLKSEL
CM_SYSCLK21_CLKSEL
CM_SYSCLK22_CLKSEL
CM_APA_CLKSEL
CM_SYSCLK14_CLKSEL
CM_SYSCLK16_CLKSEL
CM_SYSCLK18_CLKSEL
CM_AUDIOCLK_MCASP0_CLKSEL
CM_AUDIOCLK_MCASP1_CLKSEL
CM_AUDIOCLK_MCASP2_CLKSEL
CM_AUDIOCLK_MCBSP_CLKSEL
CM_TIMER1_CLKSEL
CM_TIMER2_CLKSEL
Timer2 clock mux select line
CM_TIMER3_CLKSEL
Timer3 clock mux select line
CM_TIMER4_CLKSEL
Timer4 clock mux select line
CM_TIMER5_CLKSEL
Timer5 clock mux select line
CM_TIMER6_CLKSEL
Timer6 clock mux select line
CM_TIMER7_CLKSEL
Timer7 clock mux select line
CM_SYSCLK23_CLKSEL
CM_SYSCLK24_CLKSEL
SYSCLK23 clock divider value select
SYSCLK24 clock divider value select
Table 2-11. CM_ACTIVE Register Summary
HEX ADDRESS
0x4818 0404
0x4818 0408
0x4818 0424
0x4818 0428
ACRONYM
REGISTER NAME
CM_HDDSS_CLKSTCTRL
CM_HDMI_CLKSTCTRL
HDVPSS clock domain power state transition
HDMI clock domain power state transition
CM_ACTIVE_HDDSS_CLKCTRL HDVPSS clock management control
CM_ACTIVE_HDMI_CLKCTRL HDMI clock management control
Table 2-12. CM_DEFAULT Register Summary
HEX ADDRESS
0x4818 0504
0x4818 0508
0x4818 0510
0x4818 0514
0x4818 0520
0x4818 0524
0x4818 0528
0x4818 052C
0x4818 0558
0x4818 0560
0x4818 0578
ACRONYM
REGISTER NAME
CM_DEFAULT_L3_MED_CLKSTCTRL L3 clock domain power state transition
CM_DEFAULT_L3_FAST_CLKSTCTRL L3 clock domain power state transition
CM_DEFAULT_PCI_CLKSTCTRL
PCI clock domain power state transition
CM_DEFAULT_L3_SLOW_CLKSTCTRL L3 clock domain power state transition
CM_DEFAULT_EMIF_0_CLKCTRL
CM_DEFAULT_EMIF_1_CLKCTRL
CM_DEFAULT_DMM_CLKCTRL
CM_DEFAULT_FW_CLKCTRL
CM_DEFAULT_USB_CLKCTRL
CM_DEFAULT_SATA_CLKCTRL
CM_DEFAULT_PCI_CLKCTRL
EMIF0 clock management control
EMIF1 clock management control
DMM clock management control
EMIF FW clock management control
USB clock management control
SATA clock management control
PCI clock management control
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Table 2-13. CM_SGX Register Summary
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4818 0900
0x4818 0920
CM_SGX_CLKSTCTRL
CM_SGX_SGX_CLKCTRL
SGX530 clock domain power state transition
SGX530 clock management control
Table 2-14. PRM_ACTIVE Register Summary
HEX ADDRESS
0x4818 0A00
0x4818 0A04
0x4818 0A10
0x4818 0A14
ACRONYM
REGISTER NAME
PM_ACTIVE_PWRSTCTRL
PM_ACTIVE_PWRSTST
RM_ACTIVE_RSTCTRL
RM_ACTIVE_RSTST
Active power state control
Active power domain state status
Active domain reset control release
Active domain reset source log
Table 2-15. PRM_DEFAULT Register Summary
HEX ADDRESS
0x4818 0B00
0x4818 0B04
0x4818 0B10
0x4818 0B14
ACRONYM
REGISTER NAME
PM_DEFAULT_PWRSTCTRL
PM_DEFAULT_PWRSTST
RM_DEFAULT_RSTCTRL
RM_DEFAULT_RSTST
Default power state
Default power domain state 0 status
Default subsystem reset control release
Default domain reset source log
Table 2-16. PRM_SGX Register Summary
HEX ADDRESS
0x4818 0F00
0x4818 0F04
0x4818 0F10
0x4818 0F14
ACRONYM
REGISTER NAME
PM_SGX_PWRSTCTRL
RM_SGX_RSTCTRL
PM_SGX_PWRSTST
RM_SGX_RSTST
SGX530 power state control
SGX530 domain reset control release
SGX530 power domain state status
SGX530 domain reset source log
Table 2-17. CM_ALWON Register Summary
HEX ADDRESS
0x4818 1400
0x4818 1404
0x4818 1408
0x4818 1414
0x4818 1418
0x4818 141C
0x4818 1420
0x4818 1424
0x4818 1428
0x4818 142C
0x4818 1430
0x4818 1540
0x4818 1544
0x4818 1548
0x4818 154C
0x4818 1550
0x4818 1554
0x4818 1558
0x4818 155C
0x4818 1560
ACRONYM
REGISTER NAME
CM_ALWON_L3_SLOW_CLKSTCTRL L3 clock domain power state transition
CM_ETHERNET_CLKSTCTRL
CM_ALWON_L3_MED_CLKSTCTRL
CM_ALWON_OCMC_0_CLKSTCTRL
CM_ALWON_OCMC_1_CLKSTCTRL
CM_ALWON_MPU_CLKSTCTRL
CM_ALWON_SYSCLK4_CLKSTCTRL
CM_ALWON_SYSCLK5_CLKSTCTRL
CM_ALWON_SYSCLK6_CLKSTCTRL
CM_ALWON_RTC_CLKSTCTRL
CM_ALWON_L3_FAST_CLKSTCTRL
CM_ALWON_MCASP0_CLKCTRL
CM_ALWON_MCASP1_CLKCTRL
CM_ALWON_MCASP2_CLKCTRL
CM_ALWON_MCBSP_CLKCTRL
CM_ALWON_UART_0_CLKCTRL
CM_ALWON_UART_1_CLKCTRL
CM_ALWON_UART_2_CLKCTRL
CM_ALWON_GPIO_0_CLKCTRL
CM_ALWON_GPIO_1_CLKCTRL
EMAC clock domain power state transition
L3 clock domain power state transition
OCMC 0 clock domain power state transition
OCMC 1 clock domain power state transition
Processor clock domain power state transition
SYSCLK4 clock domain power state transition
SYSCLK5 clock domain power state transition
SYSCLK6 clock domain power state transition
RTC clock domain power state transition
L3 clock domain power state transition
McASP 0 clock management control
McASP 1 clock management control
McASP 2 clock management control
McBSP clock management control
UART 0 clock management control
UART 1 clock management control
UART 2 clock management control
GPIO 0 clock management control
GPIO 1 clock management control
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Table 2-17. CM_ALWON Register Summary (continued)
HEX ADDRESS
0x4818 1564
0x4818 1568
0x4818 1570
0x4818 1574
0x4818 1578
0x4818 157C
0x4818 1580
0x4818 1584
0x4818 1588
0x4818 158C
0x4818 1590
0x4818 1594
0x4818 1598
0x4818 15B0
0x4818 15B4
0x4818 15B8
0x4818 15C4
0x4818 15D0
0x4818 15D4
0x4818 15D8
0x4818 15DC
0x4818 15E0
0x4818 15E4
0x4818 15E8
0x4818 15EC
0x4818 15F0
0x4818 15F4
0x4818 15F8
0x4818 15FC
0x4818 1600
0x4818 1604
0x4818 1608
0x4818 160C
0x4818 1628
ACRONYM
REGISTER NAME
CM_ALWON_I2C_0_CLKCTRL
CM_ALWON_I2C_1_CLKCTRL
CM_ALWON_TIMER_1_CLKCTRL
CM_ALWON_TIMER_2_CLKCTRL
CM_ALWON_TIMER_3_CLKCTRL
CM_ALWON_TIMER_4_CLKCTRL
CM_ALWON_TIMER_5_CLKCTRL
CM_ALWON_TIMER_6_CLKCTRL
CM_ALWON_TIMER_7_CLKCTRL
CM_ALWON_WDTIMER_CLKCTRL
CM_ALWON_SPI_CLKCTRL
I2C 0 clock management control
I2C 1 clock management control
Timer1 clock management control
Timer2 clock management control
Timer3 clock management control
Timer4 clock management control
Timer5 clock management control
Timer6 clock management control
Timer7 clock management control
WDTIMER clock management control
SPI clock management control
MAILBOX clock management control
SPINBOX clock management control
SDIO clock management control
OCMC 0 clock management control
OCMC 1 clock management control
Control clock management control
GPMC clock management control
CM_ALWON_MAILBOX_CLKCTRL
CM_ALWON_SPINBOX_CLKCTRL
CM_ALWON_SDIO_CLKCTRL
CM_ALWON_OCMC_0_CLKCTRL
CM_ALWON_OCMC_1_CLKCTRL
CM_ALWON_CONTROL_CLKCTRL
CM_ALWON_GPMC_CLKCTRL
CM_ALWON_ETHERNET_0_CLKCTRL Ethernet 0 clock management control
CM_ALWON_ETHERNET_1_CLKCTRL Ethernet 1 clock management control
CM_ALWON_MPU_CLKCTRL
CM_ALWON_DEBUGSS_CLKCTRL
CM_ALWON_L3_CLKCTRL
Processor clock management control
Debug clock management control
L3 clock management control
CM_ALWON_L4HS_CLKCTRL
CM_ALWON_L4LS_CLKCTRL
CM_ALWON_RTC_CLKCTRL
CM_ALWON_TPCC_CLKCTRL
CM_ALWON_TPTC0_CLKCTRL
CM_ALWON_TPTC1_CLKCTRL
CM_ALWON_TPTC2_CLKCTRL
CM_ALWON_TPTC3_CLKCTRL
CM_ALWON_SR_0_CLKCTRL
CM_ALWON_SR_1_CLKCTRL
L4 high-speed clock management control
L4 standard-speed clock management control
RTC clock management control
TPCC clock management control
TPTC0 clock management control
TPTC1 clock management control
TPTC2 clock management control
TPTC3 clock management control
SmartReflex 0 clock management control
SmartReflex 1 clock management control
CM_ALWON_CUST_EFUSE_CLKCTRL Customer e-Fuse clock management control
Table 2-18. PRM_ALWON Register Summary
HEX ADDRESS
0x4818 1810
0x4818 1814
ACRONYM
REGISTER NAME
RM_ALWON_RSTCTRL
RM_ALWON_RSTST
ALWAYS ON domain resets control
ALWAYS ON reset sources
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2.7 SGX530 (AM3894 only)
The SGX530 is a vector/3D graphics accelerator for vector and 3-dimensional (3D) graphics applications.
The SGX530 graphics accelerator efficiently processes a number of various multimedia data types
concurrently:
•
•
•
Pixel data
Vertex data
Video data.
This is achieved using a multi-threaded architecture using two levels of scheduling and data partitioning
enabling zero overhead task switching.
The SGX530 has the following major features:
•
•
•
Vector graphics and 3D graphics.
Tile-based architecture.
Universal Scalable Shader Engine (USSE™) - multi-threaded engine incorporating pixel and vertex
shader functionality. USSE™
•
•
•
•
•
•
Advanced shader feature set - in excess of Microsoft® VS3.0, PS3.0, and OpenGL 2.0.
Industry standard API support - OpenGL ES 1.1 and 2.0, OpenVG v1.1.
Fine-grained task switching, load balancing, and power management.
Advanced geometry direct memory access (DMA) driven operation for minimum CPU interaction.
Programmable high-quality image anti-aliasing.
POWERVR™ SGX core MMU for address translation from the core virtual address to the external
physical address (up to 4GB address range).
•
•
Fully-virtualized memory addressing for OS operation in a unified memory architecture.
Advanced and standard 2D operations [e.g., vector graphics, block level transfers (BLTs), raster
operations (ROPs)].
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2.8 Memory Map Summary
The device has multiple on-chip memories associated with its processors and various subsystems. To
help simplify software development a unified memory map is used where possible to maintain a consistent
view of device resources across all bus masters.
The device system memory mapping is broken into four 1-GB quadrants for target address spaces
allocation. The four quadrants are labeled Q0, Q1, Q2 and Q3 for a total of 4-GB 32-bit address space.
(HDVPSS includes a thirty-third address bit for an additional 4GB of address range; this is for virtual
addressing and not physical memory addressing.) Inside each quadrant, system targets are mapped on 4-
MB boundary (except EDMA targets which are decreased to 1-MB regions).
2.8.1 L3 Memory Map
The L3 high-performance interconnect is based on a Network-on-Chip (NoC) interconnect infrastructure.
The NoC uses an internal packet-based protocol for forward (read command, write command with data
payload) and backward (read response with data payload, write response) transactions. All exposed
interfaces of this NoC interconnect, both for targets and initiators, comply with the OCPIP2.2 reference
standard.
Table 2-19 shows the general device level-3 (L3) memory map. The table represents the physical
addresses used by the L3 infrastructure. Some processors within the device (such as Cortex™-A8 ARM)
may re-map these targets to different virtual addresses through an internal or external MMU. Processors
without MMUs and other bus masters use these physical addresses to access L3 regions. Note that not all
masters have access to all L3 regions, but only those with defined connectivity, as shown in Table 5-1.
For a list of the specific peripherals attached to each of the Level-4 (L4) peripheral ports see Section 5.2.
The L3 interconnect returns an address-hole error if any initiator attempts to access a target to which it
has no connection.
Table 2-19. L3 Memory Map
START ADDRESS
(HEX)
END ADDRESS
(HEX)
QUAD
BLOCK NAME
SIZE
DESCRIPTION
Q0
Q0
Q0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
GPMC
PCIe Gen2
Reserved
Reserved
L3 OCMC0
Reserved
L3 OCMC1
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
L3 CFG Regs
Reserved
0x0100 0000
0x2000 0000
0x3000 0000
0x4000 0000
0x4030 0000
0x4034 0000
0x4040 0000
0x4044 0000
0x4050 0000
0x4080 0000
0x4084 0000
0x40E0 0000
0x40E0 8000
0x40F0 0000
0x40F0 8000
0x4100 0000
0x4200 0000
0x4400 0000
0x44C0 0000
0x1FFF FFFF
0x2FFF FFFF
0x3FFF FFFF
0x402F FFFF
0x4033 FFFF
0x403F FFFF
0x4043 FFFF
0x404F FFFF
0x407F FFFF
0x4083 FFFF
0x40DF FFFF
0x40E0 7FFF
0x40EF FFFF
0x40F0 7FFF
0x40FF FFFF
0x41FF FFFF
0x43FF FFFF
0x44BF FFFF
0x45FF FFFF
496MB GPMC(1)
256MB PCIe Gen2 Targets
256MB Reserved
3MB
Reserved
256KB OCMC SRAM
768KB Reserved (OCMC RAM0)
256KB OCMC SRAM
768KB Reserved (OCMC RAM1)
3MB
Reserved
256KB Reserved
5888KB Reserved
32KB
992KB Reserved
32KB Reserved
992KB Reserved
Reserved
16MB
32MB
12MB
20MB
Reserved
Reserved
L3 configuration registers
Reserved
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QUAD
SPRS681E –OCTOBER 2010–REVISED JULY 2012
Table 2-19. L3 Memory Map (continued)
START ADDRESS
(HEX)
END ADDRESS
(HEX)
BLOCK NAME
SIZE
DESCRIPTION
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
McASP0
McASP1
0x4600 0000
0x4640 0000
0x4680 0000
0x46C0 0000
0x4700 0000
0x4740 0000
0x4780 0000
0x47C0 0000
0x4800 0000
0x463F FFFF
0x467F FFFF
0x46BF FFFF
0x46FF FFFF
0x473F FFFF
0x477F FFFF
0x47BF FFFF
0x47FF FFFF
0x48FF FFFF
4MB
4MB
4MB
4MB
4MB
4MB
4MB
4MB
16MB
McASP0
McASP1
McASP2
McASP2
HDMI 1.3 Tx
McBSP
HDMI 1.3 Tx
McBSP
USB2.0
USB2.0 Registers / CPPI
Reserved
Reserved
Reserved
Reserved
L4 Standard domain
Standard Peripheral domain (see Table 2-
20)
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
EDMA TPCC
Reserved
0x4900 0000
0x4910 0000
0x4980 0000
0x4990 0000
0x49A0 0000
0x49B0 0000
0x49C0 0000
0x4A00 0000
0x490F FFFF
0x497F FFFF
0x498F FFFF
0x499F FFFF
0x49AF FFFF
0x49BF FFFF
0x49FF FFFF
0x4AFF FFFF
1MB
7MB
1MB
1MB
1MB
1MB
4MB
16MB
EDMA TPCC Registers
Reserved
EDMA TPTC0
EDMA TPTC1
EDMA TPTC2
EDMA TPTC3
Reserved
EDMA TPTC0 Registers
EDMA TPTC1 Registers
EDMA TPTC2 Registers
EDMA TPTC3 Registers
Reserved
L4 High-Speed
Domain
High-Speed Peripheral domain (see Table 2-
21)
Q1
Q1
Instrumentation
0x4B00 0000
0x4C00 0000
0x4BFF FFFF
0x4CFF FFFF
16MB
16MB
EMU Subsystem region
Configuration registers
DDR EMIF0
registers(2)
Q1
Q1
DDR EMIF1
registers(2)
0x4D00 0000
0x4E00 0000
0x4DFF FFFF
0x4FFF FFFF
16MB
32MB
Configuration registers
Configuration registers
DDR DMM
Registers(2)
Q1
Q1
Q1
Q1
Q1
GPMC Registers
PCIe Gen2 Registers
Reserved
0x5000 0000
0x5100 0000
0x5200 0000
0x5500 0000
0x5600 0000
0x50FF FFFF
0x51FF FFFF
0x54FF FFFF
0x55FF FFFF
0x56FF FFFF
16MB
16MB
48MB
16MB
16MB
Configuration registers
Configuration registers
Reserved
Reserved
Reserved
SGX530
SGX530 Slave Port
AM3894 only)
Q1
Reserved
0x5600 0000
0x56FF FFFF
16MB
Reserved
(AM3892 only)
Q1
Q1
Q1
Q1
Q1
Reserved
Reserved
Reserved
Reserved
Tiler
0x5700 0000
0x5800 0000
0x5C00 0000
0x5E00 0000
0x6000 0000
0x57FF FFFF
0x5BFF FFFF
0x5DFF FFFF
0x5FFF FFFF
0x7FFF FFFF
16MB
64MB
32MB
32MB
Reserved
Reserved
Reserved
Reserved
512MB Virtual Tiled Address Space
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Table 2-19. L3 Memory Map (continued)
START ADDRESS
(HEX)
END ADDRESS
(HEX)
QUAD
BLOCK NAME
SIZE
DESCRIPTION
Q
DDR EMIF0/1
SDRAM(3)
0x8000 0000
0xC000 0000
0x1 0000 0000
0xBFFF FFFF
0xFFFF FFFF
0x1 FFFF FFFF
1GB
DDR
Q3
DDR EMIF0/1
SDRAM(3)
1GB
4GB
DDR
Q4-7
DDR DMM
DDR DMM Tiler Extended address map –
Virtual Views (HDVPSS only)
(1) The first section of GPMC memory (0x0 - 0x00FF_FFFF) is reserved for BOOTROM. Accessible memory starts at location
0x0100_0000.
(2) These accesses occur through the DDR DMM Tiler Ports. The DMM will split address ranges internally to address DDR EMIF and DDR
DMM control registers.
(3) DDR EMIF0 and DDR EMIF1 addresses may be contiguous or bank interleaved depending on configuration of the DDR DMM; for more
details, see the DDR DMM documentation.
20
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2.8.2 L4 Memory Map
2.8.2.1 L4 Standard Peripheral
The L4 standard peripheral bus accesses standard peripherals and IP configuration registers. The
memory map is shown in Table 2-20.
Table 2-20. L4 Standard Peripheral Memory Map
START ADDRESS
DEVICE NAME
END ADDRESS (HEX)
SIZE
DESCRIPTION
(HEX)
L4 Standard
Configuration
0x4800 0000
0x4800 0800
0x4800 1000
0x4800 1400
0x4800 1800
0x4800 2000
0x4800 8000
0x4800 9000
0x4800 A000
0x4801 2000
0x4802 0000
0x4802 1000
0x4802 2000
0x4802 3000
0x4802 4000
0x4802 5000
0x4802 6000
0x4802 8000
0x4802 9000
0x4802 A000
0x4802 B000
0x4802 C000
0x4802 E000
0x4802 F000
0x4803 0000
0x4803 1000
0x4803 2000
0x4803 3000
0x4803 4000
0x4803 8000
0x4803 A000
0x4803 B000
0x4803 C000
0x4803 E000
0x4803 F000
0x4804 0000
0x4804 1000
0x4804 2000
0x4804 3000
0x4804 4000
0x4804 5000
0x4800 07FF
0x4800 0FFF
0x4800 13FF
0x4800 17FF
0x4800 1FFF
0x4800 7FFF
0x4800 8FFF
0x4800 9FFF
0x4800 FFFF
0x4801 FFFF
0x4802 0FFF
0x4802 1FFF
0x4802 2FFF
0x4802 3FFF
0x4802 4FFF
0x4802 5FFF
0x4802 7FFF
0x4802 8FFF
0x4802 9FFF
0x4802 AFFF
0x4802 BFFF
0x4802 DFFF
0x4802 EFFF
0x4802 FFFF
0x4803 0FFF
0x4803 1FFF
0x4803 2FFF
0x4803 3FFF
0x4803 7FFF
0x4803 9FFF
0x4803 AFFF
0x4803 BFFF
0x4803 DFFF
0x4803 EFFF
0x4803 FFFF
0x4804 0FFF
0x4804 1FFF
0x4804 2FFF
0x4804 3FFF
0x4804 4FFF
0x4804 5FFF
2KB
2KB
1KB
1KB
2KB
24KB
4KB
4KB
24KB
56KB
4KB
4KB
4KB
4KB
4KB
4KB
8KB
4KB
4KB
4KB
4KB
8KB
4KB
4KB
4KB
4KB
4KB
4KB
16KB
8KB
4KB
4KB
8KB
4KB
4KB
4KB
4KB
4KB
4KB
4KB
4KB
Address/Protection (AP)
Link Agent (LA)
Initiator Port (IP0)
Initiator Port (IP1)
Reserved (IP2 – IP3)
Reserved
Reserved
e-Fuse Controller
Peripheral Registers
Support Registers
Reserved
Reserved
Reserved
UART0
Reserved
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Reserved
UART1
UART2
Reserved
I2C0
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Reserved
I2C1
Reserved
TIMER1
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Reserved
SPIOCP
GPIO0
Reserved
McASP0 CFG
Peripheral Registers
Support Registers
Reserved
Reserved
McASP1 CFG
Peripheral Registers
Support Registers
Reserved
Reserved
TIMER2
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
TIMER3
TIMER4
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Table 2-20. L4 Standard Peripheral Memory Map (continued)
START ADDRESS
(HEX)
DEVICE NAME
END ADDRESS (HEX)
SIZE
DESCRIPTION
TIMER5
0x4804 6000
0x4804 7000
0x4804 8000
0x4804 9000
0x4804 A000
0x4804 B000
0x4804 C000
0x4804 D000
0x4804 E000
0x4805 0000
0x4805 2000
0x4805 3000
0x4806 0000
0x4807 0000
0x4807 1000
0x4808 0000
0x4809 0000
0x4809 1000
0x480C 0000
0x480C 1000
0x480C 2000
0x480C 3000
0x480C 4000
0x480C 8000
0x480C 9000
0x480C A000
0x480C B000
0x480C C000
0x4810 0000
0x4812 0000
0x4812 1000
0x4812 2000
0x4812 3000
0x4812 4000
0x4814 0000
0x4816 0000
0x4816 1000
0x4818 0000
0x4818 3000
0x4818 4000
0x4818 8000
0x4818 9000
0x4818 A000
0x4818 B000
0x4818 C000
0x4818 D000
0x4804 6FFF
0x4804 7FFF
0x4804 8FFF
0x4804 9FFF
0x4804 AFFF
0x4804 BFFF
0x4804 CFFF
0x4804 DFFF
0x4804 FFFF
0x4805 1FFF
0x4805 2FFF
0x4805 FFFF
0x4806 FFFF
0x4807 0FFF
0x4807 FFFF
0x4808 FFFF
0x4809 0FFF
0x480B FFFF
0x480C 0FFF
0x480C 1FFF
0x480C 2FFF
0x480C 3FFF
0x480C 7FFF
0x480C 8FFF
0x480C 9FFF
0x480C AFFF
0x480C BFFF
0x480F FFFF
0x4811 FFFF
0x4812 0FFF
0x4812 1FFF
0x4812 2FFF
0x4812 3FFF
0x4813 FFFF
0x4815 FFFF
0x4816 0FFF
0x4817 FFFF
0x4818 2FFF
0x4818 3FFF
0x4818 7FFF
0x4818 8FFF
0x4818 9FFF
0x4818 AFFF
0x4818 BFFF
0x4818 CFFF
0x4818 DFFF
4KB
4KB
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Reserved
TIMER6
TIMER7
GPIO1
4KB
4KB
4KB
4KB
4KB
4KB
Reserved
8KB
McASP2 CFG
8KB
Peripheral Registers
Support Registers
Reserved
4KB
Reserved
SD/SDIO
52KB
64KB
4KB
Registers
Support Registers
Reserved
Reserved
ELM
60KB
64KB
4KB
Error Location Module
Support Registers
Reserved
Reserved
RTC
188KB
4KB
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Reserved
4KB
WDT1
4KB
4KB
Reserved
Mailbox
16KB
4KB
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Reserved
4KB
Spinlock
4KB
4KB
Reserved
HDVPSS
208KB
128KB
4KB
Peripheral Registers
Support Registers
Reserved
Reserved
4KB
HDMI 1.3 Tx
4KB
Peripheral Registers
Support Registers
Reserved
4KB
Reserved
112KB
128KB
4KB
Control Module
Peripheral Registers
Support Registers
Reserved
Reserved
PRCM
124KB
12KB
4KB
Peripheral Registers
Support Registers
Reserved
Reserved
16KB
4KB
SmartReflex0
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
4KB
SmartReflex1
4KB
4KB
OCP Watchpoint
4KB
4KB
22
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Table 2-20. L4 Standard Peripheral Memory Map (continued)
START ADDRESS
(HEX)
DEVICE NAME
END ADDRESS (HEX)
SIZE
DESCRIPTION
Reserved
Reserved
0x4818 E000
0x4818 F000
0x4819 0000
0x4819 1000
0x4819 2000
0x4819 3000
0x4819 4000
0x4819 5000
0x4819 6000
0x4819 7000
0x4819 8000
0x4819 9000
0x4819 A000
0x4819 B000
0x4819 C000
0x4820 0000
0x4820 1000
0x4824 0000
0x4818 EFFF
0x4818 FFFF
0x4819 0FFF
0x4819 1FFF
0x4819 2FFF
0x4819 3FFF
0x4819 4FFF
0x4819 5FFF
0x4819 6FFF
0x4819 7FFF
0x4819 8FFF
0x4819 9FFF
0x4819 AFFF
0x4819 BFFF
0x481F FFFF
0x4820 0FFF
0x4823 FFFF
0x4824 0FFF
4KB
4KB
4KB
4KB
4KB
4KB
4KB
4KB
4KB
4KB
4KB
4KB
4KB
4KB
400KB
4KB
252KB
4KB
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
DDR0 Phy Ctrl Regs
DDR1 Phy Ctrl Regs
Peripheral Registers
Support Registers
Peripheral Registers
Support Registers
Reserved
Reserved
Interrupt controller(1)
Reserved(1)
Cortex™-A8 Accessible Only
Cortex™-A8 Accessible Only
Cortex™-A8 Accessible Only
MPUSS config
register(1)
Reserved(1)
Reserved(1)
Reserved
0x4824 1000
0x4828 1000
0x4830 0000
0x4827 FFFF
0x482F FFFF
0x48FF FFFF
252KB
508KB
13MB
Cortex™-A8 Accessible Only
Cortex™-A8 Accessible Only
Reserved
(1) These regions (highlighted in yellow) are decoded internally by the Cortex™-A8 Subsystem and are not physically part of the L4
standard. They are included here only for reference when considering the Cortex™-A8 memory map. For masters other than the
Cortex™-A8, these regions are reserved.
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2.8.2.2 L4 High-Speed Peripheral
The L4 high-speed peripheral bus accesses the IP configuration registers of high-speed peripherals in L3.
The memory map is shown in Table 2-21.
Table 2-21. L4 High-Speed Peripheral Memory Map
START ADDRESS
DEVICE NAME
END ADDRESS (HEX)
SIZE
DESCRIPTION
(HEX)
L4 High Speed
configuration
0x4A00 0000
0x4A00 0800
0x4A00 1000
0x4A00 1400
0x4A00 1800
0x4A00 2000
0x4A08 0000
0x4A0A 1000
0x4A10 0000
0x4A10 4000
0x4A10 5000
0x4A12 0000
0x4A12 4000
0x4A12 5000
0x4A14 0000
0x4A15 0000
0x4A15 1000
0x4A18 0000
0x4A1A 0000
0x4A1A 1000
0x4A00 07FF
0x4A00 0FFF
0x4A00 13FF
0x4A00 17FF
0x4A00 1FFF
0x4A07 FFFF
0x4A0A 0FFF
0x4A0F FFFF
0x4A10 3FFF
0x4A10 4FFF
0x4A11 FFFF
0x4A12 3FFF
0x4A12 4FFF
0x4A13 FFFF
0x4A14 FFFF
0x4A15 0FFF
0x4A17 FFFF
0x4A19 FFFF
0x4A1A 0FFF
0x4AFF FFFF
2KB
2KB
Address/Protection (AP)
Link Agent (LA)
Initiator Port (IP0)
Initiator Port (IP1)
Reserved (IP2 – IP3)
Reserved
1KB
1KB
2KB
Reserved
Reserved
Reserved
EMAC0
504KB
132KB
380KB
16KB
4KB
Reserved
Reserved
Peripheral Registers
Support Registers
Reserved
Reserved
EMAC1
108KB
16KB
4KB
Peripheral Registers
Support Registers
Reserved
Reserved
SATA
108KB
64KB
4KB
Peripheral Registers
Support Registers
Reserved
Reserved
Reserved
188KB
128KB
4KB
Reserved
Reserved
Reserved
14716KB Reserved
24
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2.8.3 TILER Extended Addressing Map
The Tiling and Isometric Lightweight Engines for Rotation (TILER) ports are mainly used for optimized 2-D
block accesses. The TILER also supports rotation of the image buffer at 0º, 90º, 180º, and 270º, with
vertical and horizontal mirroring.
The TILER includes an additional 4-GB addressing range to access the frame buffer in these rotated and
mirrored views. This range requires a thirty-third bit of address and is only accessible to peripherals that
require access to the multiple views. On the device, this is limited to the HD Video Processing Subsystem
(HDVPSS). (Other peripherals, based on ConnID, may access any one single view through the 512-MB
TILER window region located in the base 4-GB range.)
The HDVPSS may use the virtual address space of 4GB (0x1:0000:0000 – 0x1:FFFF:FFFF) since various
VPDMA clients of the HDVPSS may need to simultaneously access multiple 2-D images with different
orientations of the image buffers.
The top 4-GB address space is divided into eight sections of 512MB each. These eight sections
correspond to the eight different orientations as shown in Table 2-22.
Table 2-22. TILER Extended Address Memory Map
START ADDRESS
BLOCK NAME
END ADDRESS (HEX)
SIZE
DESCRIPTION
(HEX)
Tiler View 0
Tiler View 1
Tiler View 2
Tiler View 3
Tiler View 4
Tiler View 5
Tiler View 6
Tiler View 7
0x1 0000 0000
0x1 2000 0000
0x1 4000 0000
0x1 6000 0000
0x1 8000 0000
0x1 A000 0000
0x1 C000 0000
0x1 E000 0000
0x1 1FFF FFFF
0x1 3FFF FFFF
0x1 5FFF FFFF
0x1 7FFF FFFF
0x1 9FFF FFFF
0x1 BFFF FFFF
0x1 DFFF FFFF
0x1 FFFF FFFF
512MB
512MB
512MB
512MB
512MB
512MB
512MB
512MB
Natural 0° View
0° with Vertical Mirror View
0° with Horizontal Mirror View
180° View
90° with Vertical Mirror View
270° View
90° View
90° with Horizontal Mirror View
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2.8.4 Cortex™-A8 Memory Map
The Cortex™-A8 includes an memory management unit (MMU) to translate virtual addresses to physical
addresses which are then decoded within the Host ARM Subsystem. The subsystem includes its own
ROM and RAM, as well as configuration registers for its interrupt controller. These addresses are hard-
coded within the subsystem. In addition, the upper 2GB of address space is routed to a special port
(Master 0) intended for low-latency access to DDR memory. All other physical addresses are routed to the
L3 port (Master 1) where they are decoded by the device infrastructure. The Cortex™-A8 memory map is
shown in Table 2-23.
Table 2-23. Cortex™-A8 Memory Map
START ADDRESS
REGION NAME
END ADDRESS (HEX)
SIZE
DESCRIPTION
(HEX)
Boot Space
0x0000 0000
0x0000 0000
0x2000 0000
0x3000 0000
0x4000 0000
0x4002 0000
0x4002 C000
0x4010 0000
0x4020 0000
0x402F 0000
0x4030 0000
0x4034 0000
0x4040 0000
0x4044 0000
0x4050 0000
0x4080 0000
0x4084 0000
0x40E0 0000
0x40E0 8000
0x40F0 0000
0x40F0 8000
0x4100 0000
0x4200 0000
0x4400 0000
0x44C0 0000
0x4600 0000
0x4640 0000
0x4680 0000
0x46C0 0000
0x4700 0000
0x4740 0000
0x4780 0000
0x47C0 0000
0x4800 0000
0x4820 0000
0x000F FFFF
0x1FFF FFFF
0x2FFF FFFF
0x3FFF FFFF
0x4001 FFFF
0x4002 BFFF
0x400F FFFF
0x401F FFFF
0x402E FFFF
0x402F FFFF
0x4033 FFFF
0x403F FFFF
0x4043 FFFF
0x404F FFFF
0x407F FFFF
0x4083 FFFF
0x40DF FFFF
0x40E0 7FFF
0x40EF FFFF
0x40F0 7FFF
0x40FF FFFF
0x41FF FFFF
0x43FF FFFF
0x44BF FFFF
0x45FF FFFF
0x463F FFFF
0x467F FFFF
0x46BF FFFF
0x46FF FFFF
0x473F FFFF
0x477F FFFF
0x47BF FFFF
0x47FF FFFF
0x481F FFFF
0x4820 0FFF
1MB
512MB
256MB
256MB
128KB
48KB
Boot Space
GPMC
L3 Target Space
PCIe Gen2 Targets
Reserved
Reserved
Public
ROM internal(1)
848KB
1MB
Reserved
Reserved
Reserved
Reserved
OCMC SRAM
Reserved
OCMC SRAM
Reserved
Reserved
Reserved
Reserved(1)
Reserved(1)
960KB
64KB
Reserved
L3 Target Space
256KB
768KB
256KB
768KB
3MB
256KB
5888KB Reserved
32KB
992KB
32KB
992KB
16MB
32MB
12MB
20MB
4MB
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
L3 configuration registers
Reserved
McASP0
4MB
McASP1
4MB
McASP2
4MB
HDMI 1.3 Tx
4MB
McBSP
4MB
USB2.0 Registers / CPPI
Reserved
4MB
4MB
Reserved
2MB
Standard Peripheral domain (see Table 2-20)
Cortex™-A8 Interrupt Controller
ARM Subsystem
INTC(1)
4KB
Reserved(1)
Reserved(1)
0x4820 1000
0x4824 1000
0x4823 FFFF
0x4827 FFFF
252KB
252KB
Reserved
Reserved
26
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Table 2-23. Cortex™-A8 Memory Map (continued)
START ADDRESS
(HEX)
REGION NAME
END ADDRESS (HEX)
SIZE
DESCRIPTION
L3 Target Space
0x4830 0000
0x4900 0000
0x4910 0000
0x4980 0000
0x4990 0000
0x49A0 0000
0x49B0 0000
0x49C0 0000
0x4A00 0000
0x4B00 0000
0x4C00 0000
0x4D00 0000
0x4E00 0000
0x5000 0000
0x5100 0000
0x5200 0000
0x5600 0000
0x48FF FFFF
0x490F FFFF
0x497F FFFF
0x498F FFFF
0x499F FFFF
0x49AF FFFF
0x49BF FFFF
0x49FF FFFF
0x4AFF FFFF
0x4BFF FFFF
0x4CFF FFFF
0x4DFF FFFF
0x4FFF FFFF
0x50FF FFFF
0x51FF FFFF
0x55FF FFFF
0x56FF FFFF
13MB
1MB
Standard Peripheral domain (see Table 2-20)
EDMA TPCC Registers
7MB
Reserved
1MB
EDMA TPTC0 Registers
1MB
EDMA TPTC1 Registers
1MB
EDMA TPTC2 Registers
1MB
EDMA TPTC3 Registers
4MB
Reserved
16MB
16MB
16MB
16MB
32MB
16MB
16MB
64MB
16MB
High Speed Peripheral domain (see Table 2-21)
EMU Subsystem region
DDR EMIF0(2) Configuration registers
DDR EMIF1(2) Configuration registers
DDR DMM(2) Configuration registers
GPMC Configuration registers
PCIE Configuration registers
Reserved
SGX530 Slave Port
(AM3894 only)
0x5600 0000
0x56FF FFFF
16MB
Reserved
(AM3892 only)
0x5700 0000
0x5800 0000
0x6000 0000
0x8000 0000
0x57FF FFFF
0x5FFF FFFF
0x7FFF FFFF
0xBFFF FFFF
16MB
128MB
512MB
1GB
Reserved
Reserved
TILER Window
DDR
DDR EMIF0/1
SDRAM(3)(4)
DDR EMIF0/1
SDRAM(3)(4)
0xC000 0000
0xFFFF FFFF
1GB
DDR
(1) These addresses are decoded within the Cortex™-A8 subsystem.
(2) These accesses occur through the DDR DMM TILER ports. The DDR DMM splits address ranges internally to address DDR EMIF and
DDR DMM control registers based on DDR DMM tie-offs.
(3) These addresses are routed to the Master 0 port for direct connection to the DDR DMM ELLA port.
(4) DDR EMIF0 and DDR EMIF1 addresses may be contiguous or bank interleaved, depending on configuration of the DDR DMM.
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3 Device Pins
3.1 Pin Assignments
Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in
the smallest possible package. Pin multiplexing is controlled using a combination of hardware
configuration at device reset and software programmable register settings. For more information on pin
muxing, see Section 4.4, Pin Multiplexing Control.
3.1.1 Pin Map (Bottom View)
Figure 3-1 through Figure 3-19 show the bottom view of the package pin assignments in 15 sections (A,
B, C, D, E, F, G, H, I, J, K, L, M, N, and O).
NOTE
Pin map sections D, E, K, and L show the different pin names for silicon revision 1.x devices
and silicon revision 2.x devices.
28
Device Pins
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
SD_SDWP/
GPMC_A[15]/
GP1[8]
R
P
N
M
L
SPI_SCS[0]
SPI_SCLK
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
SPI_SCS[3]/
GPMC_A[21]/
GP1[22]
SPI_SCS[1]/
GPMC_A[23]
SPI_SCS[2]/
GPMC_A[22]
DVDD_3P3
UART0_TXD
VSS
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
UART0_DSR/
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
UART0_DCD/
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
UART0_DTR/
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
UART1_RXD/
GPMC_A[26]/
GPMC_A[20]
UART1_TXD/
GPMC_A[25]/
GPMC_A[19]
UART0_CTS
GP1[28]
UART1_RTS/
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
UART2_RXD
DVDD_3P3
VSS
UART1_CTS/
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
UART2_TXD
DVDD_3P3
VSS
UART2_CTS/
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
GPMC_A[22]/
GP1[10]
GPMC_A[27]/
GP1[9]
K
J
GPMC_A[15]/
GP0[22]
GPMC_A[16]/
GP0[21]
GPMC_A[24]/
GP1[15]
GPMC_A[23]/
GP1[14]
GPMC_A[26]/
GP1[11]
GPMC_A[25]/
GP1[12]
GP1[13]
TIM6_OUT/
GPMC_A[24]/
GP0[30]
GPMC_A[12]/
GP0[27]
GPMC_A[21]/
GP0[26]
GP0[25]
GPMC_A[14]/
GP0[23]
GPMC_A[13]/
GP0[24]
H
G
F
TIM7_OUT/
GPMC_A[12]/
GP0[31]
GP0[5]/
MCA[2]_AMUTEIN/
GPMC_A[24]
GP0[6]/
MCA[1]_AMUTEIN/
GPMC_A[23]
DDR[0]_D[3]
VSS
VSS
VSS
DDR[0]_D[1]
DDR[0]_D[2]
DDR[0]_D[4]
DDR[0]_DQM[0]
DDR[0]_D[5]
DDR[0]_D[6]
DDR[0]_DQS[0]
DDR[0]_D[20]
DDR[0]_D[27]
DDR[0]_D[21]
DDR[0]_D[16]
DDR[0]_DQS[2]
CLKOUT
DVDD_DDR[0]
DDR[0]_D[23]
DDR[0]_D[9]
E
D
C
B
A
DDR[0]_DQS[0]
DDR[0]_D[11]
DDR[0]_D[10]
DDR[0]_D[13]
VSS
DDR[0]_D[7]
DDR[0]_D[0]
DDR[0]_D[8]
DDR[0]_D[15]
DDR[0]_DQS[1] DDR[0]_DQM[1]
DDR[0]_D[19]
DVDD_DDR[0]
DDR[0]_D[14]
DDR[0]_D[12]
DDR[0]_VTP
DDR[0]_D[17]
DDR[0]_DQS[1]
DDR[0]_DQS[2]
VSS
1
2
3
4
5
6
7
8
Figure 3-1. Pin Map [Section A]
Copyright © 2010–2012, Texas Instruments Incorporated
Device Pins
29
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AM3892
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www.ti.com
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
SD_SDCD/
GPMC_A[16]/
GP1[7]
R
P
N
M
L
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
UART0_RXD
DVDD_3P3
DVDD_3P3
SPI_D[0]
VSS
CVDDC
CVDDC
CVDDC
CVDDC
CVDD
CVDD
SPI_D[1]
CVDDC
UART0_RTS/
GP1[27]
DDR[0]_A[8]
DDR[0]_BA[2]
DDR[0]_A[12]
UART2_RTS/
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
DDR[0]_A[6]
DDR[0]_A[9]
DDR[0]_A[5]
DDR0_A[4]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
VSS
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
VSS
VSS
K
J
DDR[0]_D[30]
DDR0_D[18]
DDR[0]_D[28]
H
G
F
VSS
VSS
VSS
DDR[0]_DQM[2]
DDR0_D[22]
DDR[0]_A[3]
DDR[0]_BA[0]
DDR[0]_WE
DDR[0]_RAS
DDR[0]_CAS
DDR[0]_A[11]
VSS
VSS
VSS
VSS
VSS
DDR[0]_D[24]
DDR[0]_DQM[3]
DDR[0]_D[31]
DDR[0]_DQS[3]
DVDD_DDR[0]
E
D
C
B
A
VSS
DDR[0]_A[2]
RSV20
DDR[0]_D[29]
DDR[0]_D[25]
DDR[0]_A[10]
DDR[0]_BA[1]
VSS
DDR[0]_D[26]
DDR[0]_CLK[0]
DDR[0]_A[13]
DDR[0]_CLK[1]
DVDD_DDR[0]
DDR[0]_A[0]
13
DDR[0]_A[7]
14
DDR[0]_CLK[1] DDR[0]_ODT[1]
DDR[0]_DQS[3]
DDR[0]_CLK[0]
12
VSS
10
9
11
15
16
Figure 3-2. Pin Map [Section B]
30
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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Product Folder Link(s): AM3894 AM3892
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AM3892
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
R
P
CVDD
CVDD
CVDD
CVDD
VSS
CVDD
CVDD
RSV3
CVDD
CVDD
RSV4
CVDD
CVDD
CVDD
CVDD
CVDDC
CVDDC
CVDDC
CVDDC
DDR[0]_A[1]
DDR[1]_A[1]
DDR[1]_A[12]
DDR[1]_BA[2]
DDR[1]_A[8]
N
M
L
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
VSS
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
VSS
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[1]
VSS
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
VSS
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
VSS
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
VSS
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
VSS
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
K
J
H
G
F
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
DDR[0]_CS[1]
DDR[1]_CS[1]
VSS
VSS
VSS
VSS
VSS
DDR[0]_ODT[0] DEVOSC_DVDD18 DDR[1]_ODT[0]
E
D
C
B
A
VSS
DDR[0]_A[14]
DDR[0]_RST
DDR[0]_CKE
VDDA_PLL
DDR[1]_RST
DDR[1]_CKE
VSSA_PLL
DDR[1]_A[14]
DDR[1]_A[2]
RSV8
DEV_MXO
DDR[1]_A[10]
DDR[1]_BA[1]
VSS
VSS
VSS
DEVOSC_VSS
DDR[1]_A[13]
DDR[0]_CS[0]
DDR[1]_CS[0]
DDR[1]_CLK[1]
DEV_MXI/
DEV_CLKIN
VREFSSTL_DDR[0]
VDDA_PLL
18
VSSA_PLL
20
VREFSSTL_DDR[1] DDR[1]_ODT[1] DDR[1]_CLK[1]
DDR[1]_A[7]
24
17
19
21
22
23
Figure 3-3. Pin Map [Section C]
Copyright © 2010–2012, Texas Instruments Incorporated
Device Pins
31
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AM3892
SPRS681E –OCTOBER 2010–REVISED JULY 2012
www.ti.com
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
R
P
N
M
L
VDD_USB0_1P8
DVDD_3P3
DVDD_3P3
VDD_USB_0P9
VSS
DVDD_3P3
DVDD_3P3
RSV10
VDD_USB0_3P3 VDD_USB1_3P3
VSS
VSS
TMS
VSS
DVDD_3P3
RSV11
DVDD_3P3
RSV2
RSV19
I2C[0]_SCL
CVDDC
TDO
DDR[1]_A[6]
DDR[1]_A[9]
DDR[1]_A[5]
DDR[1]_A[4]
DDR[1]_A[3]
DDR[1]_BA[0]
DDR[1]_WE
DDR[1]_RAS
DDR[1]_CAS
DDR[1]_A[11]
GP0[1]
DVDD_3P3
GP0[2]
VSS
GP0[0]
K
J
GP1[30]/
SATA_ACT0_LED
GP0[3]/
TCLKIN
DDR[1]_D[30]
DDR[1]_D[18]
DDR[1]_D[28]
GP0[4]
VSS
H
G
F
VSS
DDR[1]_DQM[2]
DDR[1]_D[22]
DDR[1]_D[24]
DDR[1]_DQM[3]
DDR[1]_D[31]
VSS
VSS
DDR[1]_D[20]
DDR[1]_D[27]
DDR[1]_D[21]
DDR[1]_D[16]
DVDD_DDR[1]
DDR[1]_D[23]
DDR[1]_D[9]
E
D
C
B
A
DDR[1]_D[11]
DDR[1]_D[10]
DDR[1]_D[13]
DDR[1]_D[29]
DDR[1]_D[25]
DDR[1]_CLK[0]
DDR[1]_D[26]
DDR[1]_DQS[3] DDR[1]_DQS[2]
DDR[1]_DQS[3] DDR[1]_DQS[2]
DDR[1]_D[19]
DDR[1]_A[0]
25
DVDD_DDR[1]
DDR[1]_D[17]
31
DDR[1]_VTP
32
DDR[1]_CLK[0]
26
VSS
28
27
29
30
Figure 3-4. Pin Map [Section D] - Silicon Revision 1.x
32
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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Product Folder Link(s): AM3894 AM3892
AM3894
AM3892
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
R
P
N
M
L
VDD_USB0_1P8
DVDD_3P3
DVDD_3P3
VDD_USB_0P9
VSS
DVDD_3P3
DVDD_3P3
RSV10
VDD_USB0_3P3 VDD_USB1_3P3
VSS
VSS
TMS
VSS
DVDD_3P3
RSV11
DVDD_3P3
RSV2
RSV19
I2C[0]_SCL
CVDDC
TDO
DDR[1]_A[6]
DDR[1]_A[9]
DDR[1]_A[5]
DDR[1]_A[4]
DDR[1]_A[3]
DDR[1]_BA[0]
DDR[1]_WE
DDR[1]_RAS
DDR[1]_CAS
DDR[1]_A[11]
GP0[1]
DVDD_3P3
GP0[2]
VSS
GP0[0]
K
J
GP1[30]/
SATA_ACT1_LED
GP0[3]/
TCLKIN
DDR[1]_D[30]
DDR[1]_D[18]
DDR[1]_D[28]
GP0[4]
VSS
H
G
F
VSS
DDR[1]_DQM[2]
DDR[1]_D[22]
DDR[1]_D[24]
DDR[1]_DQM[3]
DDR[1]_D[31]
VSS
VSS
DDR[1]_D[20]
DDR[1]_D[27]
DDR[1]_D[21]
DDR[1]_D[16]
DVDD_DDR[1]
DDR[1]_D[23]
DDR[1]_D[9]
E
D
C
B
A
DDR[1]_D[11]
DDR[1]_D[10]
DDR[1]_D[13]
DDR[1]_D[29]
DDR[1]_D[25]
DDR[1]_CLK[0]
DDR[1]_D[26]
DDR[1]_DQS[3] DDR[1]_DQS[2]
DDR[1]_DQS[3] DDR[1]_DQS[2]
DDR[1]_D[19]
DDR[1]_A[0]
25
DVDD_DDR[1]
DDR[1]_D[17]
31
DDR[1]_VTP
32
DDR[1]_CLK[0]
26
VSS
28
27
29
30
Figure 3-5. Pin Map [Section D] - Silicon Revision 2.x
Copyright © 2010–2012, Texas Instruments Incorporated
Device Pins
33
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Product Folder Link(s): AM3894 AM3892
AM3894
AM3892
SPRS681E –OCTOBER 2010–REVISED JULY 2012
www.ti.com
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
R
USB1_DRVVBUS
USB0_DRVVBUS
I2C[1]_SDA
USB1_DN
USB0_DN
VDD_USB0_VBUS
EMU3
USB1_DP
USB0_DP
USB0_R1
VSS
RSV16
P
N
M
L
RSV18
RSV17
I2C[0]_SDA
I2C[1]_SCL
EMU4
EMU2
DVDD_3P3
VSS
EMU1
K
J
VSS
TRST
RTCK
GP1[31]/
SATA_ACT1_LED
TDI
EMU0
TCLK
TIM4_OUT/
GP0[28]
TIM5_OUT/
GP0[29]
GP0[7]/
MCA[0]_AMUTEIN
WD_OUT
H
G
F
CLKIN32
RSTOUT
POR
DDR[1]_D[3]
RESET
NMI
DDR[1]_DQS[0]
DDR[1]_D[6]
DDR[1]_D[1]
DDR[1]_D[2]
DDR[1]_D[4]
E
D
C
B
A
DDR[1]_DQS[0]
VSS
DVDD_DDR[1]
DDR[1]_D[7]
DDR[1]_D[0]
DDR[1]_D[8]
DDR[1]_DQM[0]
DDR[1]_D[5]
DDR[1]_DQM[1] DDR[1]_DQS[1]
DDR[1]_D[15]
DDR[1]_D[12]
33
DDR[1]_D[14]
35
DVDD_DDR[1]
DDR[1]_DQS[1]
34
VSS
37
36
Figure 3-6. Pin Map [Section E] - Silicon Revision 1.x
34
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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Product Folder Link(s): AM3894 AM3892
AM3894
AM3892
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
R
P
N
M
L
USB1_DRVVBUS
USB0_DRVVBUS
I2C[1]_SDA
USB1_DN
USB0_DN
VDD_USB0_VBUS
EMU3
USB1_DP
USB0_DP
USB0_R1
VSS
RSV16
RSV17
RSV18
I2C[0]_SDA
I2C[1]_SCL
EMU4
EMU2
DVDD_3P3
VSS
EMU1
K
J
VSS
TRST
RTCK
GP1[31]/
SATA_ACT0_LED
TDI
EMU0
TCLK
TIM4_OUT/
GP0[28]
TIM5_OUT/
GP0[29]
GP0[7]/
MCA[0]_AMUTEIN
WD_OUT
H
G
F
CLKIN32
RSTOUT
POR
DDR[1]_D[3]
RESET
NMI
DDR[1]_DQS[0]
DDR[1]_D[6]
DDR[1]_D[1]
DDR[1]_D[2]
DDR[1]_D[4]
E
D
C
B
A
DDR[1]_DQS[0]
VSS
DVDD_DDR[1]
DDR[1]_D[7]
DDR[1]_D[0]
DDR[1]_D[8]
DDR[1]_DQM[0]
DDR[1]_D[5]
DDR[1]_DQM[1] DDR[1]_DQS[1]
DDR[1]_D[15]
DDR[1]_D[12]
33
DDR[1]_D[14]
35
DVDD_DDR[1]
DDR[1]_DQS[1]
34
VSS
37
36
Figure 3-7. Pin Map [Section E] - Silicon Revision 2.x
Copyright © 2010–2012, Texas Instruments Incorporated
Device Pins
35
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Product Folder Link(s): AM3894 AM3892
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AM3892
SPRS681E –OCTOBER 2010–REVISED JULY 2012
www.ti.com
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
VIN[0]A_D[19]/
VIN[1]A_DE/
VOUT[1]_C[9]
VIN[0]A_D[18]/
VIN[1]A_FLD/
VOUT[1]_C[8]
VOUT[1]_C[2]/
VIN[1]A_D[8]
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
RSV31
RSV42
RSV43
RSV45
RSV46
RSV47
VOUT[1]_Y_YC[5]/
VIN[1]A_D[3]
RSV48
RSV49
RSV50
GPMC_CS[1]
GPMC_CS[2]
GPMC_WE
GPMC_OE_RE
GPMC_CS[0]
RSV44
VSS
GPMC_CS[5]/
GPMC_A[12]
GPMC_CS[4]/
GP1[21]
VSS
GPMC_BE1
GPMC_A[4]/
GP0[12]/
BTMODE[3]
GPMC_A[5]/
GP0[13]/
BTMODE[4]
GPMC_A[3]/
GP0[11]/
BTMODE[2]
GPMC_A[2]/
GP0[10]/
BTMODE[1]
GPMC_A[1]/
GP0[9]/
BTMODE[0]
GPMC_A[0]/
GP0[8]
GPMC_DIR/
GP1[20]
GPMC_WAIT
GPMC_A[7]/
GP0[15]/
CS0MUX[1]
GPMC_A[6]/
GP0[14]/
CS0MUX[0]
GPMC_A[9]/
GP0[17]/
CS0WAIT
GPMC_A[8]/
GP0[16]/
CS0BW
GPMC_A[10]/
GP0[18]
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
GPMC_A[11]/
GP0[19]
GPMC_A[27]/
GP0[20]
GPMC_D[0]
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
GPMC_D[2]
GPMC_D[5]
GPMC_D[7]
GPMC_D[12]
GPMC_D[15]
VSS
DVDD_3P3
GPMC_D[9]
GPMC_D[11]
GPMC_D[3]
GPMC_D[4]
GPMC_D[10]
GPMC_D[14]
GPMC_D[1]
VSS
VSS
VSS
GPMC_D[8]
W
GPMC_CLK/
GP1[29]
V
VSS
VSS
VSS
SD_DAT[0]/
GPMC_A[20]/
GP1[3]
SD_CLK/
GPMC_A[13]/
GP1[1]
SD_CMD/
GPMC_A[21]/
GP1_[2]
SD_POW/
GPMC_A[14]/
GP1[0]
U
SD_DAT[1]_SDIRQ/ SD_DAT[2]_SDRW/
GPMC_A[18]/
GP1[5]
GPMC_A[19]/
GP1[4]
T
VSS
6
VSS
7
VSS
8
1
2
3
4
5
Figure 3-8. Pin Map [Section F]
36
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): AM3894 AM3892
AM3894
AM3892
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
VOUT[0]_R_CR[8]/
VOUT[0]_B_CB_C[0]/
VOUT[1]_Y_YC[8]
AK
AJ
VOUT[0]_B_CB_C[5]
VOUT[0]_B_CB_C[6]
VSS
VSS
VSS
VOUT[0]_R_CR[0]/
VOUT[1]_C[8]/
VOUT[1]_CLK
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
VOUT[0]_B_CB_C[8]
AH
VOUT[0]_R_CR[4]/
VOUT[0]_FLD/
VOUT[1]_Y_YC[4]
AG
AF
AE
AD
AC
AB
AA
Y
GPMC_CS[3]
VSS
VSS
VOUT[0]_G_Y_YC[6] VOUT[0]_G_Y_YC[2]
VIN[0]A_D[9]
CVDD
CVDD
CVDD
VSS
GPMC_WP
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
GPMC_ADV_ALE GPMC_BE0_CLE
CVDDC
VOUT[1]_C[7]/
VIN[1]A_D[13]
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
GPMC_D[6]
DVDD_3P3
DVDD_3P3
DVDD_3P3
DVDD_3P3
CVDDC
CVDDC
CVDD
VSS
CVDDC
CVDDC
CVDD
VSS
VOUT[1]_Y_YC[6]/
VIN[1]A_D[4]
RSV51
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
W
VSS
VSS
VSS
VSS
VSS
GPMC_D[13]
DVDD_3P3
V
VSS
VSS
VSS
DVDD_3P3
DVDD_3P3
U
VSS
VSS
VSS
SD_DAT[3]/
GPMC_A[17]/
GP1[6]
DVDD_3P3
DVDD_3P3
10
DVDD_3P3
11
T
CVDD
14
CVDD
15
CVDD
16
9
12
13
Figure 3-9. Pin Map [Section G]
Copyright © 2010–2012, Texas Instruments Incorporated
Device Pins
37
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K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
AK
VSSA_HD
DVDD1P8
VSSA_HD
VSS
VSS
VSS
VSS
RSV57
VSS
VSS
DVDD1P8
RSV15
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
DVDD_3P3
DVDD_3P3
DVDD_3P3
VIN[0]A_D[0]
VDAC_VREF
VDDA_SD_1P8 VDDA_HD_1P8
RSV56
RSV55
RSV54
VIN[0]A_D[2]
VDDA_SD_1P8 VDDA_SD_1P8 VDDA_HD_1P8
VDDA_SD_1P0 VDDA_HD_1P0
RSV53
RSV13
VDAC_RBIAS_HD
CVDD
CVDD
CVDD
VSS
HDMI_HPDET
CVDDC
CVDDC
CVDD
VSS
VSS
CVDD
CVDD
CVDD
VSS
VSS
CVDD
CVDD
CVDD
VSS
VSS
CVDD
CVDD
CVDD
VSS
VSS
CVDD
CVDD
CVDD
VSS
RSV52
CVDD
CVDD
CVDD
VSS
RSV7
CVDDC
CVDDC
CVDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
W
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
V
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSSA_PLL
U
VSS
VSS
VSS
VSS
VSS
VSS
VSS
T
CVDD
17
CVDD
18
CVDD
19
CVDD
20
CVDD
21
CVDD
22
CVDD
23
CVDD
24
Figure 3-10. Pin Map [Section H]
38
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
HDMI_SDA
MCA[0]_ACLKR
MCA[1]_AXR[1]
MCA[0]_AXR[1]
VSS
MCA[0]_AHCLKR
MCA[0]_AFSX
MCA[0]_ACLKX MCA[0]_AHCLKX
VSS
VSS
RSV14
RSV12
EMAC[0]_TXD[4] MCA[0]_AFSR
VSS
VSS
DVDD_3P3
DVDD_3P3
DVDD_3P3
VDDT_PCIE
DVDD_3P3
DVDD_3P3
DVDD_3P3
PCIE_TXN1
DVDD_3P3
DVDD_3P3
DVDD_3P3
VDDT_PCIE
EMAC[0]_TXD[3] EMAC[0]_TXD[2] EMAC[0]_TXD[1]
CVDDC
EMAC[0]_RXD[5]
EMAC[0]_RXD[6]
EMAC[0]_COL
EMAC[0]_CRS
VDDR_PCIE
VSS
VSS
VSS
VSS
VSS
VSS
PCIE_TXN0
PCIE_TXP0
VDDT_PCIE
PCIE_TXP1
VDDT_PCIE
PCIE_RXP0
VDDT_PCIE
VSS
VSS
VDDR_PCIE
W
VDDR_SATA
VDDR_SATA
PCIE_RXN0
PCIE_RXN1
PCIE_RXP1
VDDT_SATA
V
VSS
VSS
U
VDD_USB1_1P8
VDD_USB0_3P3 VDD_USB1_3P3
SATA_TXN0
31
SATA_TXP0
32
T
RSV6
27
RSV5
28
25
26
29
30
Figure 3-11. Pin Map [Section I]
Copyright © 2010–2012, Texas Instruments Incorporated
Device Pins
39
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K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
MCA[1]_AMUTE
MCA[1]_AFSX
MCA[1]_AFSR
MCA[1]_ACLKR MCA[0]_AXR[0]
MCA[0]_AXR[4]/ MCA[0]_AXR[5]/
MCA[0]_AXR[2]/ MCA[0]_AXR[3]/
MCB_FSX MCB_FSR
MCA[0]_AMUTE
MCB_DX
MCB_DR
MDIO_MDIO
MDIO_MCLK
DVDD_3P3
EMAC[0]_TXD[7] EMAC[0]_TXD[6] EMAC[0]_TXEN
EMAC[0]_TXD[5] EMAC[0]_TXCLK
EMAC[0]_TXD[0] EMAC[0]_RXER EMAC[0]_RXDV EMAC[0]_RXD[7] EMAC[0]_RXCLK
EMAC[0]_RXD[3] EMAC[0]_RXD[1] EMAC[0]_RXD[0]
VSS
VSS
VSS
VSS
EMAC[0]_GMTCLK
EMAC[0]_RXD[4] EMAC[0]_RXD[2]
SERDES_CLKN SERDES_CLKP
VSS
RSV1
VSS
VDDT_SATA
VDDT_SATA
VSS
VSS
SATA_RXP1
SATA_RXN1
W
SATA_TXP1
SATA_TXN1
VDDT_SATA
SATA_RXP0
SATA_RXN0
V
U
VDD_USB1_VBUS
USB1_R1
37
T
VSS
33
VSS
34
VSS
35
36
Figure 3-12. Pin Map [Section J]
40
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
VOUT[1]_Y_YC[2]/
VIN[1]A_D[0]
VOUT[1]_Y_YC[4]/
VIN[1]A_D[2]
VIN[0]A_D[21]/
VIN[0]B_FLD
AU
AT
DVDD_3P3
RSV24
VSS
VIN[0]A_HSYNC
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
VOUT[1]_Y_YC[8]/
VIN[1]A_D[6]
VOUT[1]_CLK/
VIN[1]A_CLK
VIN[0]A_D[23]/
VIN[0]B_HSYNC
VOUT[1]_AVID/
VIN[1]B_CLK
VOUT[0]_R_CR[1]
VOUT[0]_AVID
RSV26
RSV27
VIN[0]A_DE
VIN[0]A_D[22]/
VIN[0]B_VSYNC
VOUT[1]_HSYNC/
VIN[1]A_D[15]
VOUT[1]_Y_YC[7]/
VIN[1]A_D[5]
AR
AP
VOUT[1]_Y_YC[9]/
VIN[1]A_D[7]
VOUT[1]_Y_YC[3]/
VIN[1]A_D[1]
VOUT[1]_C[5]/
VIN[1]A_D[11]
RSV23
RSV25
RSV29
RSV28
VOUT[1]_C[4]/
VIN[1]A_D[10]
VOUT[1]_C[6]/
VIN[1]A_D[12]
VIN[0]A_D[20]/
VIN[0]B_DE
DVDD_3P3
AN
AM
AL
VOUT[1]_C[3]/
VIN[1]A_D[9]
VSS
VIN[1]A_D[14]
VIN[0]A_VSYNC
VSS
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
VOUT[1]_VSYNC
VIN[0]A_FLD
VSS
6
VSS
7
RSV32
1
RSV30
2
3
4
5
8
Figure 3-13. Pin Map [Section K] - Silicon Revision 1.x
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
VOUT[1]_Y_YC[2]/
VIN[1]A_D[0]
VOUT[1]_Y_YC[4]/
VIN[1]A_D[2]
VIN[0]A_D[21]/
VIN[0]B_FLD
AU
AT
DVDD_3P3
RSV24
VSS
VIN[0]A_HSYNC
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
VOUT[1]_Y_YC[8]/
VIN[1]A_D[6]
VOUT[1]_CLK/
VIN[1]A_CLK
VIN[0]A_D[23]/
VIN[0]B_HSYNC
VOUT[1]_AVID/
VIN[1]B_CLK
VOUT[0]_R_CR[1]
RSV26
RSV27
VIN[0]A_DE
DAC_VOUT[1]_
HSYNC/
VIN[1]A_D[15]
VIN[0]A_D[22]/
VIN[0]B_VSYNC
VOUT[1]_Y_YC[7]/
VIN[1]A_D[5]
DAC_HSYNC_
VOUT[0]_AVID
AR
AP
AN
AM
AL
VOUT[1]_Y_YC[9]/
VIN[1]A_D[7]
VOUT[1]_Y_YC[3]/
VIN[1]A_D[1]
VOUT[1]_C[5]/
VIN[1]A_D[11]
RSV23
RSV25
RSV29
RSV28
VOUT[1]_C[4]/
VIN[1]A_D[10]
VOUT[1]_C[6]/
VIN[1]A_D[12]
VIN[0]A_D[20]/
VIN[0]B_DE
DVDD_3P3
VOUT[1]_C[3]/
VIN[1]A_D[9]
VSS
VIN[1]A_D[14]
VIN[0]A_VSYNC
VSS
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
DAC_VOUT[1]_
VSYNC
VIN[0]A_FLD
VSS
6
VSS
7
RSV32
1
RSV30
2
3
4
5
8
Figure 3-14. Pin Map [Section K] - Silicon Revision 2.x
Copyright © 2010–2012, Texas Instruments Incorporated
Device Pins
41
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K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
VOUT[0]_R_CR[9]/
VOUT[0]_R_CR[6]/
AU VOUT[0]_B_CB_C[1]/ VOUT[0]_G_Y_YC[0]/
VOUT[0]_G_Y_YC[8]
DVDD_3P3
VIN[0]A_D[15]
VOUT[0]_CLK
VIN[0]A_CLK
VIN[0]A_D[14]
VIN[0]A_D[13]
VSS
VIN[0]A_D[12]
VIN[0]A_D[10]
VSS
VOUT[1]_Y_YC[9]
VOUT[1]_Y_YC[6]
VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_Y_YC[5]
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/ VOUT[0]_B_CB_C[9] VOUT[0]_G_Y_YC[7]
VOUT[1]_Y_YC[2]
VOUT[0]_B_CB_C[1]/
VOUT[1]_HSYNC/
VOUT[1]_AVID
AT
AR
AP
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC/
VOUT[1]_Y_YC[3]
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
VOUT[0]_G_Y_YC[9]
VOUT[0]_G_Y_YC[0]/
VOUT[1]_VSYNC/
VIN[1]B_VSYNC
VOUT[0]_B_CB_C[2] VOUT[0]_G_Y_YC[3]
VSS
VOUT[0]_B_CB_C[4]
VSS
DVDD_3P3
AN VOUT[0]_VSYNC
VSS
VOUT[0]_HSYNC
VOUT[0]_B_CB_C[7] VOUT[0]_G_Y_YC[5]
VOUT[0]_B_CB_C[3] VOUT[0]_G_Y_YC[4]
AM
AL
VSS
VSS
VOUT[0]_R_CR[7]/
VOUT[0]_G_Y_YC[1]/
VOUT[1]_Y_YC[7]
VOUT[0]_FLD
VSS
15
VSS
16
9
10
11
12
13
14
Figure 3-15. Pin Map [Section L] - Silicon Revision 1.x
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
VOUT[0]_R_CR[9]/
VOUT[0]_R_CR[6]/
AU VOUT[0]_B_CB_C[1]/ VOUT[0]_G_Y_YC[0]/
VOUT[0]_G_Y_YC[8]
DVDD_3P3
VIN[0]A_D[15]
VOUT[0]_CLK
VIN[0]A_CLK
VIN[0]A_D[14]
VIN[0]A_D[13]
VSS
VIN[0]A_D[12]
VIN[0]A_D[10]
VSS
VOUT[1]_Y_YC[9]
VOUT[1]_Y_YC[6]
VOUT[0]_B_CB_C[1]/
DAC_VOUT[1]_
HSYNC/
VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_Y_YC[5]
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/ VOUT[0]_B_CB_C[9] VOUT[0]_G_Y_YC[7]
VOUT[1]_Y_YC[2]
AT
AR
AP
VOUT[1]_AVID
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC/
VOUT[1]_Y_YC[3]
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
VOUT[0]_G_Y_YC[9]
VOUT[0]_G_Y_YC[0]/
DAC_VOUT[1]_
VSYNC/
VOUT[0]_B_CB_C[2] VOUT[0]_G_Y_YC[3]
VSS
VIN[1]B_VSYNC
VOUT[0]_B_CB_C[4]
VSS
DVDD_3P3
AN VOUT[0]_VSYNC
VSS
VOUT[0]_HSYNC
VOUT[0]_B_CB_C[7] VOUT[0]_G_Y_YC[5]
VOUT[0]_B_CB_C[3] VOUT[0]_G_Y_YC[4]
AM
AL
VSS
VSS
VOUT[0]_R_CR[7]/
VOUT[0]_G_Y_YC[1]/
VOUT[1]_Y_YC[7]
DAC_VSYNC_
VOUT[0]_FLD
VSS
15
VSS
16
9
10
11
12
13
14
Figure 3-16. Pin Map [Section L] - Silicon Revision 2.x
42
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
AU
AT
HDMI_TMDSCLKN
HDMI_TMDSCLKP
VIN[0]A_D[11]
VIN[0]A_D[5]
VIN[0]A_D[7]
VIN[0]A_D[8]
VIN[0]A_D[1]
VIN[0]A_D[4]
VIN[0]A_D[3]
VIN[0]A_D[6]
RSV21
VSSA_SD
VSSA_REF_1P8
VDDA_REF_1P8
IOUTG
IOUTF
IOUTD
RSV41
IOUTA
IOUTB
IOUTC
RSV61
RSV60
VSS
VSS
IOUTE
VIN[0]B_CLK
VDAC_RBIAS_SD
AR
AP
AN
AM
AL
VSS
VSS
VDDA_HDMI
VDDA_HDMI
VDDA_HDMI
VDDA_HDMI
VSSA_SD
VSSA_SD
RSV22
VSS
VSS
VSS
RSV59
VSS
VSS
VSSA_SD
20
VSSA_HD
21
VSS
17
VSS
18
VSS
19
RSV58
22
VSS
23
VSS
24
Figure 3-17. Pin Map [Section M]
Copyright © 2010–2012, Texas Instruments Incorporated
Device Pins
43
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K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
AU
HDMI_TMDSDN0 HDMI_TMDSDN1 HDMI_TMDSDN2
VSS
DVDD_3P3
RSV39
EMAC[1]_TXEN EMAC[1]_TXD[4] EMAC[1]_TXD[3]
EMAC[1]_TXCLK EMAC[1]_TXD[5] EMAC[1]_TXD[2]
AT HDMI_TMDSDP0 HDMI_TMDSDP1 HDMI_TMDSDP2
RSV40
VDDA_HDMI
AR
AP
AN
AM
AL
VSS
EMAC[1]_COL
EMAC[1]_TXD[1]
RSV38
RSV37
HDMI_CEC
HDMI_EXTSWING
EMAC[1]_TXD[6] EMAC[1]_TXD[0] EMAC1_RXD[7]
EMAC[1]_RXER EMAC[1]_CRS
DVDD_3P3
RSV36
RSV33
EMAC[1]_TXD[7]
VSS
VSS
HDMI_SCL
RSV34
28
RSV35
29
VSS
31
VSS
32
25
26
27
30
Figure 3-18. Pin Map [Section N]
44
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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K
F
A
L
G
B
M
H
C
N
I
O
J
D
E
AU
AT
EMAC[1]_GMTCLK EMAC[1]_RXD[6] EMAC[1]_RXD[4] EMAC[1]_RXD[2]
RSV9
EMAC[1]_RXDV EMAC1_RXD[3] EMAC1_RXD[1] EMAC1_RXD[0] EMAC[1]_RXCLK
MCA[2]_AXR[1]/
MCB_DX
EMAC[1]_RXD[5]
MCA[2]_AXR[0]
MCA[2]_AMUTE
AR
AP
AN
AM
AL
VSS
MCA[2]_AFSX/
MCB_CLKS/
MCB_FSX
MCA[2]_AHCLKX/
MCB_CLKR
DVDD_3P3
MCA[2]_AFSR/
MCB_CLKX/
MCB_FSR
MCA[2]_AHCLKR/
MCB_CLKS
MCA[2]_ACLKX/
MCB_CLKX
MCA[1]_AHCLKX
MCA[2]_ACLKR/
MCB_CLKR/
MCB_DR
MCA[1]_AXR[0]
MCA[1]_ACLKX MCA[1]_AHCLKR
33
34
35
36
37
Figure 3-19. Pin Map [Section O]
Copyright © 2010–2012, Texas Instruments Incorporated
Device Pins
45
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3.2 Terminal Functions
The terminal functions tables identify the external signal names, the associated pin (ball) numbers along
with the mechanical package designator, the pin type, whether the pin has any internal pullup or pulldown
resistors, and a functional pin description. Bolded pin names denote the muxed pin function being
described in each table. For more detailed information on device configurations, peripheral selection,
multiplexed/shared pin, and see Section 4, Device Configurations.
3.2.1 Boot Configuration
Table 3-1. Boot Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
NO.
BOOT
Boot Mode inputs. Select the peripheral over which the Host ARM Cortex™-A8 will boot.
GPMC_A[5]/GP0[13]/
BTMODE[4]
GPMC, GP0
PINCTRL226
AE2
AE1
AE3
AE4
AE5
GPMC_A[4]/GP0[12]/
BTMODE[3]
GPMC, GP0
PINCTRL225
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[3]/GP0[11]/
BTMODE[2]
GPMC, GP0
PINCTRL224
Boot Mode Selection pins. For boot mode information,
see Table 4-5.
I
GPMC_A[2]/GP0[10]/
BTMODE[1]
GPMC, GP0
PINCTRL223
GPMC_A[1]/GP0[9]/
BTMODE[0]
GPMC, GP0
PINCTRL222
DEVICE CONTROL
GPMC CS0 default Data Bus Width input
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[8]/GP0[16]/
CS0BW
GPMC, GP0
PINCTRL229
AD4
AD3
I
I
I
0 = 8-bit data bus
1 = 16-bit data bus
GPMC_A[7]/GP0[15]/
CS0MUX[1]
GPMC, GP0
PINCTRL228
GPMC CS0 default Address/Data multiplexing mode
input
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
00 = Not multiplexed
01 = A/A/D muxed
10 = A/D muxed
11 = Reserved
GPMC_A[6]/GP0[14]/
CS0MUX[0]
GPMC, GP0
PINCTRL227
AD8
AD2
GPMC CS0 default GPMC_Wait enable input
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[9]/GP0[17]/
CS0WAIT
GPMC, GP0
PINCTRL230
0 = Wait disabled
1 = Wait enabled
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
46
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3.2.2 DDR2/3 Memory Controller Signals
Table 3-2. DDR2/3 Memory Controller 0 Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2)
DESCRIPTION
NO.
B12
A12
A15
B15
C18
E13
B17
F18
D13
C13
D9
DDR[0]_CLK[0]
DDR[0]_CLK[0]
DDR[0]_CLK[1]
DDR[0]_CLK[1]
DDR[0]_CKE
O
O
DVDD_DDR[0] DDR[0] Clock 0
DVDD_DDR[0] DDR[0] Negative Clock 0
DVDD_DDR[0] DDR[0] Clock 1
O
O
DVDD_DDR[0] DDR[0] Negative Clock 1
DVDD_DDR[0] DDR[0] Clock Enable
DVDD_DDR[0] DDR[0] Write Enable
DVDD_DDR[0] DDR[0] Chip Select 0
DVDD_DDR[0] DDR[0] Chip Select 1
O
DDR[0]_WE
O
DDR[0]_CS[0]
DDR[0]_CS[1]
DDR[0]_RAS
O
O
O
DVDD_DDR[0] DDR[0] Row Address Strobe output
DVDD_DDR[0] DDR[0] Column Address Strobe output
DDR[0]_CAS
O
DDR[0]_DQM[3]
DDR[0]_DQM[2]
DDR[0]_DQM[1]
DDR[0]_DQM[0]
DDR[0]_DQS[3]
DDR[0]_DQS[2]
DDR[0]_DQS[1]
O
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DDR[0] Data Mask outputs
DDR[0]_DQM[3]: For upper byte data bus DDR[0]_D[31:24]
DDR[0]_DQM[2]: For DDR[0]_D[23:16]
DDR[0]_DQM[1]: For DDR[0]_D[15:8]
G9
O
B5
O
DDR[0]_DQM[0]: For lower byte data bus DDR[0]_D[7:0]
C2
O
B9
I/O
I/O
I/O
DVDD_DDR[0] Data strobe input/outputs for each byte of the 32-bit data bus. They are
outputs to the DDR[0] memory when writing and inputs when reading.
They are used to synchronize the data transfers.
DDR[0]_DQS[3]: For upper byte data bus DDR[0]_D[31:24]
DDR[0]_DQS[2]: For DDR[0]_D[23:16]
DDR[0]_DQS[1]: For DDR[0]_D[15:8]
B8
DVDD_DDR[0]
B4
DVDD_DDR[0]
DVDD_DDR[0]
DDR[0]_DQS[0]
F4
I/O
DDR[0]_DQS[0]: For lower byte data bus DDR[0]_D[7:0]
DDR[0]_DQS[3]
DDR[0]_DQS[2]
DDR[0]_DQS[1]
A9
A8
A4
I/O
I/O
I/O
DVDD_DDR[0] Complimentary data strobe input/outputs for each byte of the 32-bit data
bus. They are outputs to the DDR[0] memory when writing and inputs
when reading. They are used to synchronize the data transfers.
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DDR[0]_DQS[3]: For upper byte data bus DDR[0]_D[31:24]
DDR[0]_DQS[2]: For DDR[0]_D[23:16]
DDR[0]_DQS[1]: For DDR[0]_D[15:8]
DDR[0]_DQS[0]
E3
I/O
DDR[0]_DQS[0]: For lower byte data bus DDR[0]_D[7:0]
DDR[0]_ODT[0]
DDR[0]_ODT[1]
DDR[0]_RST
E18
A16
D18
N15
B14
F13
O
O
O
O
O
O
DVDD_DDR[0] DDR[0] On-Die Termination for Chip Select 0.
DVDD_DDR[0] DDR[0] On-Die Termination for Chip Select 1.
DVDD_DDR[0] DDR[0] Reset output
DVDD_DDR[0]
DDR[0]_BA[2]
DDR[0]_BA[1]
DDR[0]_BA[0]
DVDD_DDR[0] DDR[0] Bank Address outputs
DVDD_DDR[0]
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) Specifies the operating I/O supply voltage for each signal.
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Table 3-2. DDR2/3 Memory Controller 0 Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2)
DESCRIPTION
NO.
D17
B16
N16
B13
C14
K13
N14
A14
L13
J13
H13
G13
D15
N17
A13
C9
DDR[0]_A[14]
DDR[0]_A[13]
DDR[0]_A[12]
DDR[0]_A[11]
DDR[0]_A[10]
DDR[0]_A[9]
DDR[0]_A[8]
DDR[0]_A[7]
DDR[0]_A[6]
DDR[0]_A[5]
DDR[0]_A[4]
DDR[0]_A[3]
DDR[0]_A[2]
DDR[0]_A[1]
DDR[0]_A[0]
DDR[0]_D[31]
DDR[0]_D[30]
DDR[0]_D[29]
DDR[0]_D[28]
DDR[0]_D[27]
DDR[0]_D[26]
DDR[0]_D[25]
DDR[0]_D[24]
DDR[0]_D[23]
DDR[0]_D[22]
DDR[0]_D[21]
DDR[0]_D[20]
DDR[0]_D[19]
DDR[0]_D[18]
DDR[0]_D[17]
DDR[0]_D[16]
O
O
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0] DDR[0] Address Bus
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
O
O
O
O
O
O
O
O
O
O
O
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
J11
C11
G10
E8
B10
B11
E9
DVDD_DDR[0]
DDR[0] Data Bus
DVDD_DDR[0]
E7
F9
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
D8
F8
B7
H10
A7
C8
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Table 3-2. DDR2/3 Memory Controller 0 Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2)
DESCRIPTION
NO.
B3
A3
B6
A5
D6
C6
D7
C5
C1
F3
B2
D2
G4
E2
F2
B1
A6
DDR[0]_D[15]
DDR[0]_D[14]
DDR[0]_D[13]
DDR[0]_D[12]
DDR[0]_D[11]
DDR[0]_D[10]
DDR[0]_D[9]
DDR[0]_D[8]
DDR[0]_D[7]
DDR[0]_D[6]
DDR[0]_D[5]
DDR[0]_D[4]
DDR[0]_D[3]
DDR[0]_D[2]
DDR[0]_D[1]
DDR[0]_D[0]
DDR[0]_VTP
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DDR[0] Data Bus
DVDD_DDR[0] DDR VTP Compensation Resistor Connection
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Table 3-3. DDR2/3 Memory Controller 1 Terminal Functions
SIGNAL
NAME
DDR[1]_CLK[0]
TYPE(1)
OTHER(2)
DESCRIPTION
NO.
B26
A26
A23
B23
C20
E25
B21
F20
D25
C25
D29
G29
B33
C36
B29
B30
B34
O
O
DVDD_DDR[1] DDR[1] Clock 0
DDR[1]_CLK[0]
DDR[1]_CLK[1]
DDR[1]_CLK[1]
DDR[1]_CKE
DVDD_DDR[1] DDR[1] Negative Clock 0
DVDD_DDR[1] DDR[1] Clock 1
O
O
DVDD_DDR[1] DDR[1] Negative Clock 1
DVDD_DDR[1] DDR[1] Clock Enable
DVDD_DDR[1] DDR[1] Write Enable
DVDD_DDR[1] DDR[1] Chip Select 0
DVDD_DDR[1] DDR[1] Chip Select 1
O
DDR[1]_WE
O
DDR[1]_CS[0]
DDR[1]_CS[1]
DDR[1]_RAS
O
O
O
DVDD_DDR[1] DDR[1] Row Address Strobe output
DVDD_DDR[1] DDR[1] Column Address Strobe output
DDR[1]_CAS
O
DDR[1]_DQM[3]
DDR[1]_DQM[2]
DDR[1]_DQM[1]
DDR[1]_DQM[0]
DDR[1]_DQS[3]
DDR[1]_DQS[2]
DDR[1]_DQS[1]
O
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DDR[1] Data Mask outputs
DDR[1]_DQM[3]: For upper byte data bus DDR[1]_D[31:24]
DDR[1]_DQM[2]: For DDR[1]_D[23:16]
DDR[1]_DQM[1]: For DDR[1]_D[15:8]
O
O
DDR[1]_DQM[0]: For lower byte data bus DDR[1]_D[7:0]
O
O
DVDD_DDR[1] Data strobe input/outputs for each byte of the 32-bit data bus. They are
outputs to the DDR[1] memory when writing and inputs when reading.
They are used to synchronize the data transfers.
DDR[1]_DQS[3]: For upper byte data bus DDR[1]_D[31:24]
DDR[1]_DQS[2]: For DDR[1]_D[23:16]
DDR[1]_DQS[1]: For DDR[1]_D[15:8]
I/O
I/O
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DDR[1]_DQS[0]
F34
I/O
DDR[1]_DQS[0]: For lower byte data bus DDR[1]_D[7:0]
DDR[1]_DQS[3]
DDR[1]_DQS[2]
DDR[1]_DQS[1]
A29
A30
A34
I/O
I/O
I/O
DVDD_DDR[1] Complimentary data strobe input/outputs for each byte of the 32-bit
data bus. They are outputs to the DDR[1] memory when writing and
inputs when reading. They are used to synchronize the data transfers.
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DDR[1]_DQS[3]: For upper byte data bus DDR[1]_D[31:24]
DDR[1]_DQS[2]: For DDR[1]_D[23:16]
DDR[1]_DQS[1]: For DDR[1]_D[15:8]
DDR[1]_DQS[0]
E35
I/O
DDR[1]_DQS[0]: For lower byte data bus DDR[1]_D[7:0]
DDR[1]_ODT[0]
DDR[1]_ODT[1]
DDR[1]_RST
E20
A22
D20
N23
B24
F25
O
O
O
O
O
O
DVDD_DDR[1] DDR[1] On-Die Termination for Chip Select 0.
DVDD_DDR[1] DDR[1] On-Die Termination for Chip Select 1.
DVDD_DDR[1] DDR[1] Reset output
DVDD_DDR[1]
DDR[1]_BA[2]
DDR[1]_BA[1]
DDR[1]_BA[0]
DVDD_DDR[1] DDR[1] Bank Address outputs
DVDD_DDR[1]
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) Specifies the operating I/O supply voltage for each signal.
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Table 3-3. DDR2/3 Memory Controller 1 Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2)
DESCRIPTION
NO.
D21
B22
N22
B25
C24
K25
N24
A24
L25
J25
DDR[1]_A[14]
DDR[1]_A[13]
DDR[1]_A[12]
DDR[1]_A[11]
DDR[1]_A[10]
DDR[1]_A[9]
DDR[1]_A[8]
DDR[1]_A[7]
DDR[1]_A[6]
DDR[1]_A[5]
DDR[1]_A[4]
DDR[1]_A[3]
DDR[1]_A[2]
DDR[1]_A[1]
DDR[1]_A[0]
DDR[1]_D[31]
DDR[1]_D[30]
DDR[1]_D[29]
DDR[1]_D[28]
DDR[1]_D[27]
DDR[1]_D[26]
DDR[1]_D[25]
DDR[1]_D[24]
DDR[1]_D[23]
DDR[1]_D[22]
DDR[1]_D[21]
DDR[1]_D[20]
DDR[1]_D[19]
DDR[1]_D[18]
DDR[1]_D[17]
DDR[1]_D[16]
O
O
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1] DDR[1] Address Bus
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
O
O
O
O
O
O
O
O
H25
G25
D23
N21
A25
C29
J27
O
O
O
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
C27
G28
E30
B28
B27
E29
E31
F29
D30
F30
B31
H28
A31
C30
DVDD_DDR[1]
DDR[1] Data Bus
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
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Table 3-3. DDR2/3 Memory Controller 1 Terminal Functions (continued)
SIGNAL
NAME
DDR[1]_D[15]
TYPE(1)
OTHER(2)
DESCRIPTION
NO.
B35
A35
B32
A33
D32
C32
D31
C33
C37
F35
B36
D36
G34
E36
F36
B37
A32
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DDR[1]_D[14]
DDR[1]_D[13]
DDR[1]_D[12]
DDR[1]_D[11]
DDR[1]_D[10]
DDR[1]_D[9]
DDR[1]_D[8]
DDR[1]_D[7]
DDR[1]_D[6]
DDR[1]_D[5]
DDR[1]_D[4]
DDR[1]_D[3]
DDR[1]_D[2]
DDR[1]_D[1]
DDR[1]_D[0]
DDR[1]_VTP
DDR[1] Data Bus
DVDD_DDR[1] DDR VTP Compensation Resistor Connection
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3.2.3 Ethernet Media Access Controller (EMAC) Signals
Table 3-4. EMAC Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
NO.
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
-
MDIO_MCLK
AH37
O
Management Data Serial Clock output
PINCTRL275
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
MDIO_MDIO
AH36
I/O
Management Data I/O
PINCTRL276
EMAC0
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
EMAC[0]_COL
AB25
AA25
AC37
AE37
I
I
[G]MII Collision Detect (Sense) input
[G]MII Carrier Sense input
PINCTRL251
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
EMAC[0]_CRS
PINCTRL252
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
EMAC[0]_GMTCLK
EMAC[0]_RXCLK
O
I
GMII Source Asynchronous Transmit Clock
[G]MII Receive Clock
PINCTRL253
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL254
-
EMAC[0]_RXD[7]
EMAC[0]_RXD[6]
EMAC[0]_RXD[5]
EMAC[0]_RXD[4]
EMAC[0]_RXD[3]
EMAC[0]_RXD[2]
EMAC[0]_RXD[1]
EMAC[0]_RXD[0]
AE36
AC25
AD25
AC35
AD35
AC36
AD36
AD37
PINCTRL262
-
PINCTRL261
-
PINCTRL260
-
[G]MII Receive Data [7:0]. For 1000 EMAC GMII
operation, EMAC[0]_RXD[7:0] are used. For 10/100
EMAC MII operation, only EMAC[0]_RXD[3:0] are
used.
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL259
I
-
PINCTRL258
-
PINCTRL257
-
PINCTRL256
-
PINCTRL255
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
EMAC[0]_RXDV
EMAC[0]_RXER
EMAC[0]_TXCLK
AE35
AE34
AF37
I
I
I
[G]MII Receive Data Valid input
[G]MII Receive Data Error input
[G]MII Transmit Clock input
PINCTRL263
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL264
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL265
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-4. EMAC Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
-
EMAC[0]_TXD[7]
EMAC[0]_TXD[6]
EMAC[0]_TXD[5]
EMAC[0]_TXD[4]
EMAC[0]_TXD[3]
EMAC[0]_TXD[2]
EMAC[0]_TXD[1]
EMAC[0]_TXD[0]
AG35
PINCTRL273
-
AG36
AF36
AG28
AE30
AE31
AE32
AE33
PINCTRL272
-
PINCTRL271
-
[G]MII Transmit Data [7:0]. For 1000 EMAC GMII
operation, EMAC[0]_TXD[7:0] are used. For 10/100
EMAC MII operation, only EMAC[0]_TXD[3:0] are
used.
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL270
O
-
PINCTRL269
-
PINCTRL268
-
PINCTRL267
-
PINCTRL266
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
EMAC[0]_TXEN
AG37
O
[G]MII Transmit Data Enable output
PINCTRL274
EMAC1
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
EMAC[1]_COL
AR30
AN31
AU33
AT37
I
I
[G]MII Collision Detect (Sense) input
[G]MII Carrier Sense input
PINCTRL72
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
EMAC[1]_CRS
PINCTRL73
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
-
EMAC[1]_GMTCLK
EMAC[1]_RXCLK
O
I
GMII Source Asynchronous Transmit Clock
[G]MII Receive Clock
PINCTRL61
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL51
-
EMAC[1]_RXD[7]
EMAC[1]_RXD[6]
EMAC[1]_RXD[5]
EMAC[1]_RXD[4]
EMAC[1]_RXD[3]
EMAC[1]_RXD[2]
EMAC[1]_RXD[1]
EMAC[1]_RXD[0]
AP32
AU34
AR33
AU35
AT34
AU36
AT35
AT36
PINCTRL59
-
PINCTRL58
-
PINCTRL57
-
[G]MII Receive Data [7:0]. For 1000 EMAC GMII
operation, EMAC[1]_RXD[7:0] are used. For 10/100
EMAC MII operation, only EMAC[1]_RXD[3:0] are
used.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL56
I
-
PINCTRL55
-
PINCTRL54
-
PINCTRL53
-
PINCTRL52
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
EMAC[1]_RXDV
EMAC[1]_RXER
AT33
AN30
I
I
[G]MII Receive Data Valid input
[G]MII Receive Data Error input
PINCTRL60
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL74
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Table 3-4. EMAC Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
EMAC[1]_TXCLK
AT30
I
[G]MII Transmit Clock input
PINCTRL71
-
EMAC[1]_TXD[7]
EMAC[1]_TXD[6]
EMAC[1]_TXD[5]
EMAC[1]_TXD[4]
EMAC[1]_TXD[3]
EMAC[1]_TXD[2]
EMAC[1]_TXD[1]
EMAC[1]_TXD[0]
AM30
AP30
AT31
AU31
AU32
AT32
AR32
AP31
PINCTRL69
-
PINCTRL68
-
PINCTRL67
-
[G]MII Transmit Data [7:0]. For 1000 EMAC GMII
operation, EMAC[1]_TXD[7:0] are used. For 10/100
EMAC MII operation, only EMAC[1]_TXD[3:0] are
used.
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
PINCTRL66
O
-
PINCTRL65
-
PINCTRL64
-
PINCTRL63
-
PINCTRL62
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
-
EMAC[1]_TXEN
AU30
O
[G]MII Transmit Data Enable output
PINCTRL70
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3.2.4 General-Purpose Input/Output (GPIO) Signals
Table 3-5. GPIO Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
GPIO0
Note: General-Purpose Input/Output (I/O) pins can also serve as external interrupt inputs.
TIM7_OUT/
GPMC_A[12]/
GP0[31]
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM7, GPMC
PINCTRL206
G1
H1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
General-Purpose Input/Output (I/O) 0 [GP0] pin 31.
General-Purpose Input/Output (I/O) 0 [GP0] pin 30.
General-Purpose Input/Output (I/O) 0 [GP0] pin 29.
General-Purpose Input/Output (I/O) 0 [GP0] pin 28.
General-Purpose Input/Output (I/O) 0 [GP0] pin 27.
General-Purpose Input/Output (I/O) 0 [GP0] pin 26.
General-Purpose Input/Output (I/O) 0 [GP0] pin 25.
General-Purpose Input/Output (I/O) 0 [GP0] pin 24.
General-Purpose Input/Output (I/O) 0 [GP0] pin 23.
General-Purpose Input/Output (I/O) 0 [GP0] pin 22.
General-Purpose Input/Output (I/O) 0 [GP0] pin 21.
General-Purpose Input/Output (I/O) 0 [GP0] pin 20.
General-Purpose Input/Output (I/O) 0 [GP0] pin 19.
General-Purpose Input/Output (I/O) 0 [GP0] pin 18.
TIM6_OUT/
GPMC_A[24]/
GP0[30]
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM6, GPMC
PINCTRL205
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM5_OUT/
GP0[29]
TIM5
PINCTRL204
H34
H33
H2
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM4_OUT/
GP0[28]
TIM4
PINCTRL203
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_A[12]/
GP0[27]
GPMC
PINCTRL202
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_A[21]/
GP0[26]
GPMC
PINCTRL201
H3
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
-
GP0[25]
H4
PINCTRL200
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
GPMC_A[13]/
GP0[24]
GPMC
PINCTRL199
H6
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC_A[14]/
GP0[23]
GPMC
PINCTRL198
H5
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
GPMC_A[15]/
GP0[22]
GPMC
PINCTRL197
J1
PULL: DIS / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC_A[16]/
GP0[21]
GPMC
PINCTRL196
J2
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[27]/
GP0[20]
GPMC
PINCTRL233
AC5
AC2
AD1
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[11]/
GP0[19]
GPMC
PINCTRL232
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[10]/
GP0[18]
GPMC
PINCTRL231
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
Table 3-5. GPIO Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
GPMC_A[9]/
GP0[17]/
CS0WAIT
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL230
AD2
I/O
General-Purpose Input/Output (I/O) 0 [GP0] pin 17.
GPMC_A[8]/
GP0[16]/
CS0BW
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL229
AD4
AD3
AD8
AE2
AE1
AE3
AE4
AE5
AE6
H35
G5
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
General-Purpose Input/Output (I/O) 0 [GP0] pin 16.
General-Purpose Input/Output (I/O) 0 [GP0] pin 15.
General-Purpose Input/Output (I/O) 0 [GP0] pin 14.
General-Purpose Input/Output (I/O) 0 [GP0] pin 13.
General-Purpose Input/Output (I/O) 0 [GP0] pin 12.
General-Purpose Input/Output (I/O) 0 [GP0] pin 11.
General-Purpose Input/Output (I/O) 0 [GP0] pin 10.
General-Purpose Input/Output (I/O) 0 [GP0] pin 9.
General-Purpose Input/Output (I/O) 0 [GP0] pin 8.
General-Purpose Input/Output (I/O) 0 [GP0] pin 7.
General-Purpose Input/Output (I/O) 0 [GP0] pin 6.
General-Purpose Input/Output (I/O) 0 [GP0] pin 5.
General-Purpose Input/Output (I/O) 0 [GP0] pin 4.
General-Purpose Input/Output (I/O) 0 [GP0] pin 3.
General-Purpose Input/Output (I/O) 0 [GP0] pin 2.
General-Purpose Input/Output (I/O) 0 [GP0] pin 1.
General-Purpose Input/Output (I/O) 0 [GP0] pin 0.
GPMC_A[7]/
GP0[15]/
CS0MUX[1]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL228
GPMC_A[6]/
GP0[14]/
CS0MUX[0]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL227
GPMC_A[5]/
GP0[13]/
BTMODE[4]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL226
GPMC_A[4]/
GP0[12]/
BTMODE[3]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL225
GPMC_A[3]/
GP0[11]/
BTMODE[2]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL224
GPMC_A[2]/
GP0[10]/
BTMODE[1]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL223
GPMC_A[1]/
GP0[9]/
BTMODE[0]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL222
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[0]/
GP0[8]
GPMC
PINCTRL221
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0[7]/
MCA[0]_AMUTEIN
MCA[0]
PINCTRL298
GP0[6]/
MCA[1]_AMUTEIN/
GPMC_A[23]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[1], GPMC
PINCTRL297
GP0[5]/
MCA[2]_AMUTEIN/
GPMC_A[24]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], GPMC
PINCTRL296
G2
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
GP0[4]
H32
J31
PINCTRL295
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0[3]/
TCLKIN
Timer CLKIN
PINCTRL294
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
GP0[2]
GP0[1]
GP0[0]
K30
L29
K31
PINCTRL293
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL292
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL291
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Table 3-5. GPIO Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
GPIO1
Note: General-Purpose Input/Output (I/O) pins can also serve as external interrupt inputs.
GP1[31]/
SATA_ACT1_LED
(silicon revision 1.x)
SATA_ACT0_LED
(silicon revision 2.x)
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SATA
PINCTRL300
J33
I/O
General-Purpose Input/Output (I/O) 1 [GP1] pin 31.
GP1[30]/
SATA_ACT0_LED
(silicon revision 1.x)
SATA_ACT1_LED
(silicon revision 2.x)
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SATA
PINCTRL299
J32
I/O
General-Purpose Input/Output (I/O) 1 [GP1] pin 30.
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC_CLK/
GP1[29]
GPMC
PINCTRL250
V1
N7
N9
I/O
I/O
I/O
General-Purpose Input/Output (I/O) 1 [GP1] pin 29.
General-Purpose Input/Output (I/O) 1 [GP1] pin 28.
General-Purpose Input/Output (I/O) 1 [GP1] pin 27.
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0_CTS/
GP1[28]
UART0
PINCTRL176
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART0_RTS/
GP1[27]
UART0
PINCTRL175
UART1_CTS/
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART1, GPMC
PINCTRL184
L3
M2
K7
L9
I/O
I/O
I/O
I/O
General-Purpose Input/Output (I/O) 1 [GP1] pin 26.
General-Purpose Input/Output (I/O) 1 [GP1] pin 25.
General-Purpose Input/Output (I/O) 1 [GP1] pin 24.
General-Purpose Input/Output (I/O) 1 [GP1] pin 23.
UART1_RTS/
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART1, GPMC
PINCTRL183
UART2_CTS/
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART2, GPMC
PINCTRL188
UART2_RTS/
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART2, GPMC
PINCTRL187
SPI_SCS[3]/
GPMC_A[21]/
GP1[22]
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI, GPMC
PINCTRL170
P1
I/O
I/O
I/O
General-Purpose Input/Output (I/O) 1 [GP1] pin 22.
General-Purpose Input/Output (I/O) 1 [GP1] pin 21.
General-Purpose Input/Output (I/O) 1 [GP1] pin 20.
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
GPMC_CS[4]/
GP1[21]
GPMC
PINCTRL211
AG3
AE7
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_DIR/
GP1[20]
GPMC
PINCTRL218
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC
PINCTRL180
N3
N5
N4
I/O
I/O
I/O
General-Purpose Input/Output (I/O) 1 [GP1] pin 19.
General-Purpose Input/Output (I/O) 1 [GP1] pin 18.
General-Purpose Input/Output (I/O) 1 [GP1] pin 17.
UART0_DCD/
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC
PINCTRL179
UART0_DSR/
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC
PINCTRL178
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
Table 3-5. GPIO Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
UART0_DTR/
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART0, GPMC
PINCTRL177
N6
I/O
General-Purpose Input/Output (I/O) 1 [GP1] pin 16.
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_A[24]/
GP1[15]
GPMC
PINCTRL195
J3
J4
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
General-Purpose Input/Output (I/O) 1 [GP1] pin 15.
General-Purpose Input/Output (I/O) 1 [GP1] pin 14.
General-Purpose Input/Output (I/O) 1 [GP1] pin 13.
General-Purpose Input/Output (I/O) 1 [GP1] pin 12.
General-Purpose Input/Output (I/O) 1 [GP1] pin 11.
General-Purpose Input/Output (I/O) 1 [GP1] pin 10.
General-Purpose Input/Output (I/O) 1 [GP1] pin 9.
General-Purpose Input/Output (I/O) 1 [GP1] pin 8.
General-Purpose Input/Output (I/O) 1 [GP1] pin 7.
General-Purpose Input/Output (I/O) 1 [GP1] pin 6.
General-Purpose Input/Output (I/O) 1 [GP1] pin 5.
General-Purpose Input/Output (I/O) 1 [GP1] pin 4.
General-Purpose Input/Output (I/O) 1 [GP1] pin 3.
General-Purpose Input/Output (I/O) 1 [GP1] pin 2.
General-Purpose Input/Output (I/O) 1 [GP1] pin 1.
General-Purpose Input/Output (I/O) 1 [GP1] pin 0.
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_A[23]/
GP1[14]
GPMC
PINCTRL194
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
-
GP1[13]
J5
PINCTRL193
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
GPMC_A[25]/
GP1[12]
GPMC
PINCTRL192
J7
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC_A[26]/
GP1[11]
GPMC
PINCTRL191
J6
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
GPMC_A[22]/
GP1[10]
GPMC
PINCTRL190
K2
K8
R5
R13
T13
T2
T1
U1
U3
U2
U4
PULL: DIS / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC_A[27]/
GP1[9]
GPMC
PINCTRL189
SD_SDWP/
GPMC_A[15]/
GP1[8]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL165
SD_SDCD/
GPMC_A[16]/
GP1[7]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL164
SD_DAT[3]/
GPMC_A[17]/
GP1[6]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL163
SD_DAT[2]_SDRW/
GPMC_A[18]/
GP1[5]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL162
SD_DAT[1]_SDIRQ/
GPMC_A[19]/
GP1[4]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL161
SD_DAT[0]/
GPMC_A[20]/
GP1[3]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL160
SD_CMD/
GPMC_A[21]/
GP1[2]
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL159
SD_CLK/
GPMC_A[13]/
GP1[1]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
SD, GPMC
PINCTRL158
SD_POW/
GPMC_A[14]/
GP1[0]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
SD, GPMC
PINCTRL157
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3.2.5 General-Purpose Memory Controller (GPMC) Signals
Table 3-6. GPMC Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
NO.
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC_CLK/
GP1[29]
V1
O
GP1
GPMC Clock output
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
GPMC_CS[5] /
GPMC_A[12]
GPMC
PINCTRL212
AG1
AG3
AG9
AH2
AH1
AH7
AG2
AF2
O
O
O
O
O
O
O
O
O
O
O
O
O
I
GPMC Chip Select 5
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
GPMC_CS[4] /
GP1[21]
GP1
PINCTRL211
GPMC Chip Select 4
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
-
GPMC_CS[3]
GPMC_CS[2]
GPMC_CS[1]
GPMC_CS[0]
GPMC_WE
GPMC Chip Select 3
PINCTRL210
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
-
GPMC Chip Select 2
PINCTRL209
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
-
GPMC Chip Select 1
PINCTRL208
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
-
GPMC Chip Select 0
PINCTRL207
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
-
GPMC Write Enable output
GPMC Output Enable output
GPMC Upper Byte Enable output
PINCTRL213
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
-
GPMC_OE_RE
GPMC_BE1
PINCTRL214
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
-
AF1
PINCTRL216
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
-
GPMC Lower Byte Enable output or Command Latch
Enable output
GPMC_BE0_CLE
GPMC_ADV_ALE
AE11
AE10
AE7
AE9
AE8
PINCTRL215
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
-
GPMC Address Valid output or Address Latch Enable
output
PINCTRL217
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_DIR/
GP1[20]
GP1
PINCTRL218
GPMC Direction Control for External Transceivers
GPMC Write Protect output
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
-
GPMC_WP
PINCTRL219
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
GPMC_WAIT
GPMC Wait input
PINCTRL220
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
60
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Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[27]/
GP0[20]
GP0
PINCTRL233
AC5
O
GPMC Address 27
PULL: DIS / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC_A[27]/
GP1[9]
GP1
PINCTRL189
K8
N1
O
O
UART1_RXD/
GPMC_A[26]/
GPMC_A[20]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
UART1, GPMC
PINCTRL181
UART2_RTS/
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
PULL: IPU / DIS UART2, GPMC,
L9
O
DRIVE: H / H
DVDD_3P3
GP1
PINCTRL187
GPMC Address 26
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC_A[26]/
GP1[11]
GP1
PINCTRL191
J6
O
O
UART1_TXD/
GPMC_A[25]/
GPMC_A[19]
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
UART1, GPMC
PINCTRL182
N2
UART2_CTS/
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
PULL: IPU / IPU UART2, GPMC,
K7
O
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL188
GPMC Address 25
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
GPMC_A[25]/
GP1[12]
GP1
PINCTRL192
J7
G2
J3
O
O
O
O
GP0[5]/
MCA[2]_AMUTEIN/
GPMC_A[24]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0, MCA[2]
PINCTRL296
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_A[24]/
GP1[15]
GP1
PINCTRL195
GPMC Address 24
TIM6_OUT/
GPMC_A[24]/
GP0[30]
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM6, GP0
PINCTRL205
H1
UART0_DSR/
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
PULL: IPU / IPU UART0, GPMC,
N4
O
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL178
GP0[6]/
MCA[1]_AMUTEIN/
GPMC_A[23]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0, MCA[1]
PINCTRL297
G5
P2
O
O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI_SCS[1]/
GPMC_A[23]
SPI
PINCTRL168
GPMC Address 23
UART0_DCD/
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
PULL: IPU / IPU UART0, GPMC,
N5
J4
O
O
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL179
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_A[23]/
GP1[14]
GP1
PINCTRL194
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Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI_SCS[2]/
GPMC_A[22]
SPI
PINCTRL169
P3
O
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
GPMC_A[22]/
GP1[10]
GP1
PINCTRL190
K2
N3
O
O
GPMC Address 22
GPMC Address 21
GPMC Address 20
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
PULL: IPU / IPU UART0, GPMC,
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL180
SPI_SCS[3]/
GPMC_A[21]/
GP1[22]
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI, GP1
PINCTRL170
P1
U3
H3
U1
O
O
O
O
SD_CMD/
GPMC_A[21]/
GP1[2]
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL159
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_A[21]/
GP0[26]
GP0
PINCTRL201
SD_DAT[0]/
GPMC_A[20]/
GP1[3]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL160
UART0_DTR/
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
PULL: IPU / DIS UART0, GPMC,
DRIVE: H / H
DVDD_3P3
N6
N1
N4
O
O
O
GP1
PINCTRL177
UART1_RXD/
GPMC_A[26]/
GPMC_A[20]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
UART12, GPMC
PINCTRL181
UART0_DSR/
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
PULL: IPU / IPU UART0, GPMC,
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL178
SD_DAT[1]_SDIRQ/
GPMC_A[19]/
GP1[4]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL161
GPMC Address 19
T1
N2
T2
O
O
O
UART1_TXD/
GPMC_A[25]/
GPMC_A[19]
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
UART1, GPMC
PINCTRL182
SD_DAT[2]_SDRW/
GPMC_A[18]/
GP1[5]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL162
UART0_DCD/
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
PULL: IPU / IPU UART0, GPMC,
N5
M2
O
O
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL179
GPMC Address 18
UART1_RTS/
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
PULL: IPU / DIS UART1, GPMC,
DRIVE: H / H
DVDD_3P3
GP1
PINCTRL183
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Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
SD_DAT[3]/
GPMC_A[17]/
GP1[6]
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL163
T13
O
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
PULL: IPU / IPU UART0, GPMC,
N3
O
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL180
GPMC Address 17
UART1_CTS/
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
PULL: IPU / IPU UART1, GPMC,
L3
R13
K7
O
O
O
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL184
SD_SDCD/
GPMC_A[16]/
GP1[7]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL164
UART2_CTS/
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
PULL: IPU / IPU UART2, GPMC,
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL188
GPMC Address 16
GPMC Address 15
GPMC Address 14
GPMC Address 13
PULL: DIS / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC_A[16]/
GP0[21]
GPMC, GP0
PINCTRL196
J2
O
O
SD_SDWP/
GPMC_A[15]/
GP1[8]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL165
R5
UART2_RTS/
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
PULL: IPU / DIS UART2, GPMC,
DRIVE: H / H
DVDD_3P3
L9
O
GP1
PINCTRL187
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
GPMC_A[15]/
GP0[22]
GP0
PINCTRL197
J1
O
O
SD_POW/
GPMC_A[14]/
GP1[0]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
SD, GPMC,
GP1
PINCTRL157
U4
UART1_RTS/
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
PULL: IPU / DIS UART1, GPMC,
DRIVE: H / H
DVDD_3P3
M2
O
GP1
PINCTRL183
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC_A[14]/
GP0[23]
GP0
PINCTRL198
H5
U2
O
O
SD_CLK/
GPMC_A[13] /
GP1[1]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
SD, GP1
PINCTRL158
UART1_CTS/
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
PULL: IPU / IPU UART1, GPMC,
DRIVE: Z / Z
DVDD_3P3
L3
O
O
GP1
PINCTRL184
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
GPMC_A[13]/
GP0[24]
GP0
PINCTRL199
H6
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Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
UART0_DTR/
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
PULL: IPU / DIS UART0, GPMC,
N6
O
DRIVE: H / H
DVDD_3P3
GP1
PINCTRL177
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC_A[12]/
GP0[27]
GP0
PINCTRL202
H2
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
GPMC Address 12
TIM7_OUT/
GPMC_A[12]/
GP0[31]
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM7, GP0
PINCTRL206
G1
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
GPMC_CS[5]/
GPMC_A[12]
GPMC
PINCTRL212
AG1
AC2
AD1
AD2
AD4
AD3
AD8
AE2
AE1
AE3
AE4
AE5
AE6
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[11]/
GP0[19]
GP0
PINCTRL232
GPMC Address 11
GPMC Address 10
GPMC Address 9
GPMC Address 8
GPMC Address 7
GPMC Address 6
GPMC Address 5
GPMC Address 4
GPMC Address 3
GPMC Address 2
GPMC Address 1
GPMC Address 0
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[10]/
GP0[18]
GP0
PINCTRL231
GPMC_A[9]/
GP0[17]/
CS0WAIT
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL230
GPMC_A[8]/
GP0[16]/
CS0BW
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL229
GPMC_A[7]/
GP0[15]/
CS0MUX[1]
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL228
GPMC_A[6]/
GP0[14]/
CS0MUX[0]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL227
GPMC_A[5]/
GP0[13]/
BTMODE[4]
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL226
GPMC_A[4]/
GP0[12]/
BTMODE[3]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL225
GPMC_A[3]/
GP0[11]/
BTMODE[2]
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL224
GPMC_A[2]/
GP0[10]/
BTMODE[1]
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL223
GPMC_A[1]/
GP0[9]/
BTMODE[0]
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL222
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC_A[0]/
GP0[8]
GP0
PINCTRL221
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Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
GPMC_D[15]
GPMC_D[14]
GPMC_D[13]
GPMC_D[12]
GPMC_D[11]
GPMC_D[10]
GPMC_D[9]
GPMC_D[8]
GPMC_D[7]
GPMC_D[6]
GPMC_D[5]
GPMC_D[4]
GPMC_D[3]
GPMC_D[2]
GPMC_D[1]
GPMC_D[0]
V2
I/O
PINCTRL249
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
V3
V10
W2
W1
W3
Y1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
PINCTRL248
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL247
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL246
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL245
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL244
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL243
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
W4
Y2
PINCTRL242
GPMC Data I/Os. Only D[7:0] are used for 8-bit
interfaces
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL241
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
Y10
AA2
Y3
PINCTRL240
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL239
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL238
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
AA3
AB2
AA4
AC1
PINCTRL237
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL236
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL235
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL234
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3.2.6 High-Definition Multimedia Interface (HDMI) Signals
Table 3-7. HDMI Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
NO.
-
HDMI Clock Output.
HDMI_TMDSCLKP
AT24
O
O
O
O
O
O
O
O
-
-
-
-
-
-
-
-
VDDA_HDMI
When the HDMI PHY is powered down, these pins
should be left unconnected.
-
HDMI_TMDSCLKN
HDMI_TMDSDN2
HDMI_TMDSDP2
HDMI_TMDSDN1
HDMI_TMDSDP1
HDMI_TMDSDN0
HDMI_TMDSDP0
AU24
AU27
AT27
AU26
AT26
AU25
AT25
VDDA_HDMI
-
HDMI Data 2 output.
VDDA_HDMI
When the HDMI PHY is powered down, these pins
should be left unconnected.
-
VDDA_HDMI
-
HDMI Data 1 output.
VDDA_HDMI
When the HDMI PHY is powered down, these pins
should be left unconnected.
-
VDDA_HDMI
-
HDMI Data 0 output.
VDDA_HDMI
When the HDMI PHY is powered down, these pins
should be left unconnected.
-
VDDA_HDMI
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
-
HDMI_SCL
HDMI_SDA
HDMI_CEC
HDMI_HPDET
AL25
AK25
AP25
AE24
O
I/O
I/O
I
HDMI I2C Serial Clock Output
HDMI I2C Serial Data I/O
PINCTRL301
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL302
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
-
HDMI Consumer Electronics Control I/O
PINCTRL303
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
HDMI Hot Plug Detect Input. Signals the
connection / removal of an HDMI cable at the
connector.
-
PINCTRL304
HDMI Voltage Reference. When HDMI is used,
this pin must be connected via an external 5.9K-Ω
(±1% tolerance) resistor to VSS
.
HDMI_EXTSWING
AN25
A
-
-
When the HDMI PHY is powered down, this pin
should be left unconnected.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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3.2.7 Inter-Integrated Circuit (I2C) Signals
Table 3-8. I2C Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
I2C0
DESCRIPTION
NO.
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
-
I2C[0]_SCL
N32
N33
I/O
I/O
I2C0 Clock I/O
PINCTRL287
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
-
I2C[0]_SDA
I2C0 Data I/O
PINCTRL288
I2C1
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
-
I2C[1]_SCL
I2C[1]_SDA
N34
N35
I/O
I/O
I2C1 Clock I/O
I2C1 Data I/O
PINCTRL289
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL290
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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3.2.8 Multichannel Audio Serial Port Signals
Table 3-9. McASP0 Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
MCA[0]_ACLKR
MCA[0]_AHCLKR
MCA[0]_AFSR
AK28
I/O
McASP0 Receive Bit Clock I/O
PINCTRL126
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
AJ27
AG29
H35
I/O
I/O
I/O
I/O
I/O
I/O
O
McASP0 Receive High-Frequency Master Clock I/O
McASP0 Receive Frame Sync I/O
McASP0 Mute Input
PINCTRL127
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL128
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0[7]/
MCA[0]_AMUTEIN
GP0
PINCTRL298
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
MCA[0]_ACLKX
MCA[0]_AHCLKX
MCA[0]_AFSX
AH30
AH31
AJ31
AJ35
AJ37
AJ36
AJ34
AJ33
AJ32
AK37
McASP0 Transmit Bit Clock I/O
PINCTRL129
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
McASP0 Transmit High-Frequency Master Clock I/O
McASP0 Transmit Frame Sync I/O
McASP0 Mute Output
PINCTRL130
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL131
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
MCA[0]_AMUTE
PINCTRL132
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[5]/
MCB_DR
MCB
PINCTRL138
I/O
I/O
I/O
I/O
I/O
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[4]/
MCB_DX
MCB
PINCTRL137
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[3]/
MCB_FSR
MCB
PINCTRL136
McASP0 Transmit/Receive Data I/Os
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[2]/
MCB_FSX
MCB
PINCTRL135
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
MCA[0]_AXR[1]
MCA[0]_AXR[0]
PINCTRL134
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL133
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-10. McASP1 Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
MCA[1]_ACLKR
MCA[1]_AHCLKR
MCA[1]_AFSR
AK36
I/O
McASP1 Receive Bit Clock I/O
PINCTRL139
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
AL37
AK35
G5
I/O
I/O
I
McASP1 Receive High-Frequency Master Clock I/O
McASP1 Receive Frame Sync I/O
McASP1 Mute Input
PINCTRL140
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL141
GP0[6]/
MCA[1]_AMUTEIN/
GPMC_A[23]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0, GPMC
PINCTRL297
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
MCA[1]_ACLKX
MCA[1]_AHCLKX
MCA[1]_AFSX
AL36
AM37
AK34
AK33
AK32
AL33
I/O
I/O
I/O
O
McASP1 Transmit Bit Clock I/O
PINCTRL142
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
McASP1 Transmit High-Frequency Master Clock I/O
McASP1 Transmit Frame Sync I/O
McASP1 Mute Output
PINCTRL143
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL144
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
MCA[1]_AMUTE
MCA[1]_AXR[1]
MCA[1]_AXR[0]
PINCTRL145
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
I/O
I/O
PINCTRL147
McASP1 Transmit/Receive Data I/Os
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL146
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-11. McASP2 Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
MCA[2]_ACLKR/
MCB_CLKR/
MCB_DR
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL148
AL34
I/O
McASP2 Receive Bit Clock I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_AHCLKR/
MCB_CLKS
MCB
PINCTRL149
AM34
AM35
G2
I/O
I/O
I
McASP2 Receive High-Frequency Master Clock I/O
McASP2 Receive Frame Sync I/O
McASP2 Mute Input
MCA[2]_AFSR/
MCB_CLKX/
MCB_FSR
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL150
GP0[5]/
MCA[2]_AMUTEIN/
GPMC_A[24]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0, GPMC
PINCTRL296
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_ACLKX/
MCB_CLKX
MCB
PINCTRL151
AM36
AN36
AN35
AP36
AR37
AR36
I/O
I/O
I/O
O
McASP2 Transmit Bit Clock I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_AHCLKX/
MCB_CLKR
MCB
PINCTRL152
McASP2 Transmit High-Frequency Master Clock I/O
McASP2 Transmit Frame Sync I/O
McASP2 Mute Output
MCA[2]_AFSX/
MCB_CLKS/
MCB_FSX
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL153
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
MCA[2]_AMUTE
PINCTRL154
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_AXR[1]/
MCB_DX
MCB
PINCTRL156
I/O
I/O
McASP2 Transmit/Receive Data I/Os
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
MCA[2]_AXR[0]
PINCTRL155
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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3.2.9 Multichannel Buffered Serial Port Signals
Table 3-12. McBSP Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
MCA[2]_ACLKR/
MCB_CLKR/
MCB_DR
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], MCB
PINCTRL148
AL34
I/O
McBSP Receive Clock I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_AHCLKX/
MCB_CLKR
MCA[2]
PINCTRL152
AN36
AJ34
AM35
AJ37
AL34
AM35
AM36
AJ33
AN35
AJ36
AR37
AM34
AN35
I/O
I/O
I/O
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[3]/
MCB_FSR
MCA[0]
PINCTRL136
McBSP Receive Frame Sync I/O
McBSP Receive Data Input
McBSP Transmit Clock I/O
MCA[2]_AFSR/
MCB_CLKX/
MCB_FSR
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], MCB
PINCTRL150
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[5]/
MCB_DR
MCA[0]
PINCTRL138
MCA[2]_ACLKR/
MCB_CLKR/
MCB_DR
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], MCB
PINCTRL148
I
MCA[2]_AFSR/
MCB_CLKX/
MCB_FSR
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], MCB
PINCTRL150
I/O
I/O
I/O
I/O
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_ACLKX/
MCB_CLKX
MCA[2]
PINCTRL151
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[2]/
MCB_FSX
MCA[0]
PINCTRL135
McBSP Transmit Frame Sync I/O
McBSP Transmit Data Output
McBSP Source Clock Input
MCA[2]_AFSX/
MCB_CLKS/
MCB_FSX
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], MCB
PINCTRL153
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[4]/
MCB_DX
MCA[0]
PINCTRL137
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_AXR[1]/
MCB_DX
MCA[2]
PINCTRL156
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_AHCLKR/
MCB_CLKS
MCA[2]
PINCTRL149
I
MCA[2]_AFSX/
MCB_CLKS/
MCB_FSX
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], MCB
PINCTRL153
I
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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3.2.10 Oscillator/Phase-Locked Loop (PLL) Signals
Table 3-13. Oscillator/PLL and Clock Generator Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
CLOCK GENERATOR
PULL: IPU / DIS
DRIVE: L / L
DVDD_3P3
-
Device Clock output. Can be used as a system clock
for other devices
CLKOUT
F1
O
PINCTRL320
OSCILLATOR/PLL
Device Crystal input. Crystal connection to internal
oscillator for system clock. Functions as CLKINDEV
clock input when an external oscillator is used.
DEV_MXI/
DEV_CLKIN
DIS
DEV_DVDD18
A19
C19
E19
B19
H37
I
O
-
Device Crystal output. Crystal connection to internal
oscillator for system clock. When device oscillator is
BYPASSED, leave this pin unconnected.
DIS
DEV_DVDD18
DEV_MXO
-
-
-
1.8 V Power Supply for Device (DEV) Oscillator. If the
internal oscillator is bypassed, DEVOSC_DVDD18
should still be connected to the 1.8-V power supply.
DEVOSC_DVDD18
DEVOSC_VSS
CLKIN32
S
-
-
Supply Ground for DEV Oscillator. If the internal
oscillator is bypassed, DEVOSC_VSS should be
connected to ground (VSS).
GND
I
PULL: IPU / IPD
DRIVE: Z / Z
DVDD_3P3
-
RTC Clock input. Optional 32.768 kHz clock for RTC
reference. If this pin is not used, it should be held low.
PINCTRL321
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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3.2.11 Peripheral Component Interconnect Express (PCIe) Signals
Table 3-14. PCIe Terminal Functions
SIGNAL
TYPE(1)
OTHER(2)
DESCRIPTION
NAME
PCIE_TXP0
NO.
AB31
O
O
I
PCIE Transmit Data Lane 0.
VDDR_PCIE
When the PCIe SERDES are powered down, or if this lane is not used,
these pins should be left unconnected.
PCIE_TXN0
PCIE_RXP0
PCIE_RXN0
PCIE_TXP1
PCIE_TXN1
PCIE_RXP1
PCIE_RXN1
AB30
Y29
PCIE Receive Data Lane 0.
VDDR_PCIE
VDDR_PCIE
VDDR_PCIE
When the PCIe SERDES are powered down, or if this lane is not used,
these pins should be left unconnected.
V29
I
Y27
O
O
I
PCIE Transmit Data Lane 1.
When the PCIe SERDES are powered down, or if this lane is not used,
these pins should be left unconnected.
AB28
V31
PCIE Receive Data Lane 1.
When the PCIe SERDES are powered down, or if this lane is not used,
these pins should be left unconnected.
V30
I
SERDES_CLKP
SERDES_CLKN
AB34
AB33
I
I
VDD_LJCB
VDD_LJCB
PCIE Serdes Reference Clock Inputs. Shared between PCI Express and
Serial ATA. When neither PCI Express nor Serial ATA are used, these
pins should be left unconnected.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) Specifies the operating I/O supply voltage for each signal.
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3.2.12 Reset, Interrupts, and JTAG Interface Signals
Table 3-15. RESET, Interrupts, and JTAG Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
RESET
DESCRIPTION
NO.
PULL: IPD / IPU
DRIVE: Z / Z
DVDD_3P3
-
RESET
POR
G33
F37
G37
I
I
Device Reset input
PINCTRL316
IPU
DVDD_3P3
-
Power-On Reset input
Reset output
For more detailed information on RSTOUT pin
behavior, see Section 7.2.13
PULL: DIS / DIS
DVDD_3P3
-
RSTOUT
O
PINCTRL318
INTERRUPTS
PULL: IPD / IPU
DRIVE: Z / Z
DVDD_3P3
-
NMI
G36
I
External active low maskable interrupt
PINCTRL317
Interrupt-capable general-purpose I/Os
NOTE: All pins are multiplexed with other pin
functions. For muxing and internal
pullup/pulldown/disable details, see Table 3-5, GPIO
Terminal Functions.
see
Table 3-5
GP0[31:3]
I/O
see NOTE
see NOTE
-
-
Interrupt-capable general-purpose I/Os
NOTE: All pins are multiplexed with other pin
functions. For muxing and internal
pullup/pulldown/disable details, see Table 3-5, GPIO
Terminal Functions.
see
Table 3-5
GP1[31:0]
I/O
JTAG
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
-
TCLK
RTCK
TDI
J37
J36
J34
N30
N31
K36
M37
I
O
I
JTAG test clock input
JTAG return clock output
JTAG test data input
PINCTRL305
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
-
PINCTRL306
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
-
PINCTRL307
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
-
TDO
O
I
JTAG test port data output
PINCTRL308
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
JTAG test port mode select input. For proper
operation, do not oppose the IPU on this pin.
TMS
PINCTRL309
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
-
TRST
EMU4
I
JTAG test port reset input
Emulator pin 4
PINCTRL310
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
I/O
PINCTRL315
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
74
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Table 3-15. RESET, Interrupts, and JTAG Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
EMU3
EMU2
EMU1
EMU0
M36
I/O
Emulator pin 3
Emulator pin 2
Emulator pin 1
Emulator pin 0
PINCTRL314
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
L37
L36
J35
I/O
I/O
I/O
PINCTRL313
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL312
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
-
PINCTRL311
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3.2.13 Secure Digital/Secure Digital Input Output (SD/SDIO) Signals
Table 3-16. SD/SDIO Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
SD_CLK/
GPMC_A[13]/
GP1[1]
NO.
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC, GP1
PINCTRL158
U2
O
SD Clock output
SD_CMD/
GPMC_A[21]/
GP1_[2]
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL159
U3
U1
O
I/O
I/O
I/O
I/O
O
SD Command output
SD_DAT[0]/
GPMC_A[20]/
GP1[3]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL160
SD Data0 I/O. Functions as data bit 0 for 4-bit SD
mode and single data bit for 1-bit SD mode.
SD_DAT[1]_SDIRQ/
GPMC_A[19]/
GP1[4]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GMPC, GP1
PINCTRL161
SD Data1 I/O. Functions as data bit 1 for 4-bit SD
mode and as an IRQ input for 1-bit SD mode
T1
SD_DAT[2]_SDRW/
GPMC_A[18]/
GP1[5]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL162
SD Data2 I/O. Functions as data bit 2 for 4-bit SD
mode and as a Read Wait input for 1-bit SD mode.
T2
SD_DAT[3]/
GPMC_A[17]/
GP1[6]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL163
SD Data3 I/O. Functions as data bit 3 for 4-bit SD
mode.
T13
U4
SD_POW/
GPMC_A[14]/
GP1[0]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC, GP1
PINCTRL157
SD Card Power Enable output
SD Card Detect input
SD_SDCD/
GPMC_A[16]/
GP1[7]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL164
R13
R5
I
SD_SDWP/
GPMC_A[15]/
GP1[8]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GMC, GP1
PINCTRL165
I
SD Card Write Protect input
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
76
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3.2.14 Serial ATA Signals
NOTE
Serial ATA pins J32 and J33 have a different naming convention and functionality for silicon
revision 1.x devices and silicon revision 2.x devices. These pins are listed separately in
Table 3-18.
Table 3-17. Serial ATA Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
-
Serial ATA Data Transmit for disk 0.
SATA_TXN0
T31
O
O
O
O
I
-
-
-
-
-
-
-
-
-
-
VDDR_SATA
When the SATA SERDES are powered down, these
pins should be left unconnected.
-
SATA_TXP0
SATA_TXN1
SATA_TXP1
SATA_RXN0
SATA_RXP0
SATA_RXN1
SATA_RXP1
T32
U33
V33
VDDR_SATA
-
Serial ATA Data Transmit for disk 1.
VDDR_SATA
When the SATA SERDES are powered down, these
pins should be left unconnected.
-
VDDR_SATA
-
Serial ATA Data Receive for disk 0.
V37
VDDR_SATA
When the SATA SERDES are powered down, these
pins should be left unconnected.
-
V36
I
VDDR_SATA
-
Serial ATA Data Receive for disk 1.
V35
I
VDDR_SATA
When the SATA SERDES are powered down, these
pins should be left unconnected.
-
W35
AB34
AB33
I
VDDR_SATA
-
SERDES_CLKP
SERDES_CLKN
I
VDD_LJCB
PCIE Serdes Reference Clock Input. Shared between
PCI Express and Serial ATA.
-
I
VDD_LJCB
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-18. Serial ATA [Pins J32, J33] Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
Silicon Revision 1.x
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP1[30]/
SATA_ACT0_LED
GP1
PINCTRL299
J32
J33
O
O
Serial ATA disk 0 Activity LED output
Serial ATA disk 1 Activity LED output
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP1[31]/
SATA_ACT1_LED
GP1
PINCTRL300
Silicon Revision 2.x
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP1[30]/
SATA_ACT1_LED
GP1
PINCTRL299
J32
J33
O
O
Serial ATA disk 1 Activity LED output
Serial ATA disk 0 Activity LED output
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP1[31]/
SATA_ACT0_LED
GP1
PINCTRL300
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
78
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3.2.15 Serial Peripheral Digital Interconnect Format (SPI) Signals
Table 3-19. SPI Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
SPI_SCLK
R2
I/O
SPI Clock I/O
PINCTRL166
SPI_SCS[3] /
GPMC_A[21]/
GP1[22]
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL170
P1
P3
I/O
I/O
I/O
I/O
I/O
I/O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI_SCS[2] /
GPMC_A[22]
GPMC
PINCTRL169
SPI Chip Select I/O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI_SCS[1] /
GPMC_A[23]
GPMC
PINCTRL168
P2
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
-
SPI_SCS[0]
SPI_D[1]
R1
PINCTRL167
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
P13
N11
PINCTRL172
SPI Data I/O. Can be configured as either MISO or
MOSI
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
SPI_D[0]
PINCTRL171
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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3.2.16 Timer Signals
Table 3-20. Timer Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
NO.
General-Purpose Timers7-1 and Watchdog Timer
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0[3]/
TCLKIN
GP0
J31
I
Timer external clock input
PINCTRL294
Timer7
TIM7_OUT/
GPMC_A[12]/
GP0[31]
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
GPMC, GP0
PINCTRL206
G1
H1
I/O
I/O
I/O
I/O
Timer7 capture event input or PWM output
Timer6 capture event input or PWM output
Timer5 capture event input or PWM output
Timer4 capture event input or PWM output
Timer6
TIM6_OUT/
GPMC_A[24]/
GP0[30]
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
GPMC, GP0
PINCTRL205
Timer5
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM5_OUT/
GP0[29]
GP0
PINCTRL204
H34
H33
Timer4
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM4_OUT/
GP0[28]
GP0
PINCTRL203
Timer3-1
There are no external pins on these timers for this device.
Watchdog Timer
PULL: IPU / IPU
DRIVE: H / L
DVDD_3P3
-
WD_OUT
H36
O
Watchdog timer event output
PINCTRL319
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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3.2.17 Universal Asynchronous Receiver/Transmitter (UART) Signals
Table 3-21. UART0 Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
UART0 Receive Data Input. Functions as IrDA
receive input in IrDA modes and CIR receive input in
CIR mode.
-
UART0_RXD
N10
I
PINCTRL173
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
-
UART0 Transmit Data Output. Functions as transmit
output in CIR and IrDA modes.
UART0_TXD
N8
N9
N7
O
O
I
PINCTRL174
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART0 Request to Send Output. Indicates module is
ready to receive data. Functions as SD output in IrDA
mode.
UART0_RTS /
GP1[27]
GP1
PINCTRL175
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0_CTS /
GP1[28]
GP1
PINCTRL176
UART0 Clear to Send Input. Has no function in IrDA
and CIR modes.
UART0_DTR /
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
GPMC, GP1
PINCTRL177
N6
N4
N5
N3
O
I
UART0 Data Terminal Ready Output
UART0 Data Set Ready Input
UART0 Data Carrier Detect Input
UART0 Ring Indicator Input
UART0_DSR /
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL178
UART0_DCD /
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL179
I
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL180
I
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-22. UART1 Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
NO.
UART1_RXD/
GPMC_A[26]/
GPMC_A[20]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
UART1 Receive Data Input. Functions as IrDA
receive input in IrDA modes and CIR receive input in
CIR mode.
GPMC
PINCTRL181
N1
I
UART1_TXD/
GPMC_A[25]/
GPMC_A[19]
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC
PINCTRL182
UART1 Transmit Data Output. Functions as transmit
output in CIR and IrDA modes.
N2
M2
O
UART1_RTS /
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART1 Request to Send Output. Indicates module is
ready to receive data. Functions as SD output in IrDA
mode.
GPMC, GP1
PINCTRL183
O
UART1_CTS /
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL184
UART1 Clear to Send Input. Has no function in IrDA
and CIR modes.
L3
I/O
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-23. UART2 Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
UART2 Receive Data Input. Functions as IrDA
receive input in IrDA modes and CIR receive input in
CIR mode.
-
UART2_RXD
UART2_TXD
M1
I
PINCTRL185
PULL: IPD / IPD
DRIVE: L / H
DVDD_3P3
-
UART2 Transmit Data Output. Functions as transmit
output in CIR and IrDA modes.
L2
L9
O
O
PINCTRL186
UART2_RTS /
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART2 Request to Send Output. Indicates module is
ready to receive data. Functions as SD output in IrDA
mode.
GPMC, GP1
PINCTRL187
UART2_CTS /
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL188
UART2 Clear to Send Input. Has no function in IrDA
and CIR modes.
K7
I/O
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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3.2.18 Universal Serial Bus (USB) Signals
Table 3-24. USB Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
USB0
DESCRIPTION
NO.
USB0_DP
P37
P36
A I/O
A I/O
-
-
-
USB0 bidirectional Data Differential signal pair
[positive/negative].
USB0_DN
-
When the USB0 PHY is powered down, these pins
should be left unconnected.
USB0 current reference output. When the USB0
peripheral is used, this pin must be connected via a
44.2-Ω ±1% resistor to VSS.
USB0_R1
N37
P35
N36
A O
-
-
When the USB0 PHY is powered down, this pin
should be left unconnected.
When this pin is used as USB0_DRVVBUS and the
USB0 Controller is operating as a Host, this signal is
used by the USB0 Controller to enable the external
VBUS charge pump.
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
-
USB0_DRVVBUS
VDD_USB0_VBUS
O
PINCTRL322
When the USB0 PHY is powered down, this pin
should be left unconnected.
USB0 VBUS input (5 V).
The voltage level on this pin is sampled to determine
session status.
I
-
-
When the USB0 PHY is powered down, this pin
should be left unconnected.
USB1
USB1_DP
USB1_DN
R37
R36
A I/O
A I/O
-
-
-
-
USB1 bidirectional Data Differential signal pair
[positive/negative].
When the USB1 PHY is powered down, these pins
should be left unconnected.
USB1 current reference output. When the USB1
peripheral is used, this pin must be connected via a
44.2-Ω ±1% resistor to VSS.
USB1_R1
T37
R35
T36
A O
-
-
When the USB1 PHY is powered down, this pin
should be left unconnected.
When this pin is used as USB1_DRVVBUS and the
USB1 Controller is operating as a Host, this signal is
used by the USB1 Controller to enable the external
VBUS charge pump.
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
-
USB1_DRVVBUS
VDD_USB1_VBUS
O
PINCTRL323
When the USB1 PHY is powered down, this pin
should be left unconnected.
USB1 VBUS input (5 V).
The voltage level on this pin is sampled to determine
session status.
I
-
-
When the USB1 PHY is powered down, this pin
should be left unconnected.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
84
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3.2.19 Video Input Signals
Table 3-25. Video Input 0 Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NAME
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
Video Input 0 Port A Clock input. Input clock for 8-bit,
16-bit, or 24-bit Port A video capture.
VIN[0]A_CLK
AR14
I
PINCTRL83
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
Video Input 0 Port B Clock input. Input clock for 8-bit
Port B video capture. This signal is not used in 16-bit
and 24-bit capture modes.
-
VIN[0]B_CLK
AR19
AT2
AR2
AU4
AN3
AK4
AK5
I
I
I
I
I
I
I
PINCTRL84
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A_D[23]/
VIN[0]B_HSYNC
VIN[0]B
PINCTRL15
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A_D[22]/
VIN[0]B_VSYNC
VIN[0]B
PINCTRL14
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A_D[21]/
VIN[0]B_FLD
VIN[0]B
PINCTRL13
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A_D[20]/
VIN[0]B_DE
VIN[0]B
PINCTRL12
Video Input 0 Port A Data inputs. For 16-bit capture,
D[7:0] are Cb/Cr and [15:8] are Y Port A inputs. For
8-bit capture, D[7:0] are Port A YCbCr data inputs
and D[15:8] are Port B YCbCr data inputs. For RGB
capture, D[23:16] are R, D[15:8] are G, and D[7:0] are
B data inputs.
VIN[0]A_D[19]/
VIN[1]A_DE[0]/
VOUT[1]_C[9]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A,
VOUT[1]
PINCTRL25
VIN[0]A_D[18]/
VIN[1]A_FLD/
VOUT[1]_C[8]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A,
VOUT[1]
PINCTRL24
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
VOUT[1]_VSYNC
(silicon revision 1.x)
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A,
VOUT[1]
PINCTRL23
AL5
AT5
I
I
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A,
VOUT[1]
PINCTRL22
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-25. Video Input 0 Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
VIN[0]A_D[15]
VIN[0]A_D[14]
VIN[0]A_D[13]
VIN[0]A_D[12]
VIN[0]A_D[11]
VIN[0]A_D[10]
VIN[0]A_D[9]
VIN[0]A_D[8]
VIN[0]A_D[7]
VIN[0]A_D[6]
VIN[0]A_D[5]
VIN[0]A_D[4]
VIN[0]A_D[3]
VIN[0]A_D[2]
AU14
I
PINCTRL100
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
AU15
AT15
AU16
AU17
AT16
AE16
AP17
AR17
AP18
AT17
AT18
AR18
AH18
I
I
I
I
I
I
I
I
I
I
I
I
I
PINCTRL99
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL98
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL97
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL96
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL95
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL94
Video Input 0 Port A Data inputs. For 16-bit capture,
D[7:0] are Cb/Cr and [15:8] are Y Port A inputs. For
8-bit capture, D[7:0] are Port A YCbCr data inputs
and D[15:8] are Port B YCbCr data inputs. For RGB
capture, D[23:16] are R, D[15:8] are G, and D[7:0] are
B data inputs.
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL93
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL92
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL91
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL90
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL89
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL88
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
PINCTRL87
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
-
VIN[0]A_D[1]
VIN[0]A_D[0]
AU18
AJ19
I
I
PINCTRL86
IPD
DVDD_3P3
-
PINCTRL85
Video Input 0 Port B Horizontal Sync input. Discrete
horizontal synchronization signal for Port B 8-bit
YCbCr capture without embedded syncs ("BT.601"
modes). Not used in RGB or 16-bit YCbCr capture
modes
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A_D[23]/
VIN[0]B_HSYNC
VIN[0]A
PINCTRL15
AT2
AU5
I
I
Video Input 0 Port A Horizontal Sync input. Discrete
horizontal synchronization signal for Port A RGB
capture mode or YCbCr capture without embedded
syncs ("BT.601" modes).
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
VIN[0]A_HSYNC
PINCTRL32
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Table 3-25. Video Input 0 Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
Video Input 0 Port B Vertical Sync input. Discrete
vertical synchronization signal for Port B 8-bit YCbCr
capture without embedded syncs ("BT.601" modes).
Not used in RGB or 16-bit YCbCr capture modes.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A_D[22]/
VIN[0]B_VSYNC
VIN[0]A
PINCTRL14
AR2
I
Video Input 0 Port A Vertical Sync input. Discrete
vertical synchronization signal for Port A RGB capture
mode or YCbCr capture without embedded syncs
("BT.601" modes).
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
VIN[0]A_VSYNC
AM4
AU4
AL4
I
I
I
PINCTRL33
Video Input 0 Port B Field ID input. Discrete field
identification signal for Port B 8-bit YCbCr capture
without embedded syncs ("BT.601" modes). Not used
in RGB or 16-bit YCbCr capture modes
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A_D[21]/
VIN[0]B_FLD
VIN[0]A
PINCTRL13
Video Input 0 Port A Field ID input. Discrete field
identification signal for Port A RGB capture mode or
YCbCr capture without embedded syncs ("BT.601"
modes).
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
VIN[0]A_FLD
PINCTRL34
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
Video Input 0 Port B Data Enable input. Discrete data
valid signal for Port B RGB capture mode or YCbCr
capture without embedded syncs ("BT.601" modes).
VIN[0]A_D[20]/
VIN[0]B_DE
VIN[0]A
PINCTRL12
AN3
AT3
I
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
Video Input 0 Port A Data Enable input. Discrete data
valid signal for Port A RGB capture mode or YCbCr
capture without embedded syncs ("BT.601" modes).
-
VIN[0]A_DE
PINCTRL35
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Table 3-26. Video Input 1 Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
Video Input 1 Port A Clock input. Input clock for 8-
bit or 16-bit Port A video capture. Input data is
sampled on the CLK0 edge.
VOUT[1]_CLK/
VIN[1]A_CLK
VOUT[1]
PINCTRL46
AT7
I
Video Input 1 Port B Clock input. Input clock for 8-
bit Port B video capture. Input data is sampled on
the CLK1 edge. This signal is not used in 16-bit
capture modes.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_AVID/
VIN[1]B_CLK
VOUT[1]
PINCTRL31
AT4
AR5
I
I
VOUT[1]_HSYNC
(silicon revision 1.x)
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)/
VIN[1]A_D[15]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL21
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
VIN[1]A_D[14]
AM3
AD13
AN8
AP8
AN7
AM8
AK6
I
I
I
I
I
I
I
PINCTRL11
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[7]/
VIN[1]A_D[13]
VOUT[1]
PINCTRL10
Video Input 1 Port A Data inputs. For 16-bit
capture, D[7:0] are Cb/Cr and [15:8] are Y Port A
inputs. For 8-bit capture, D[7:0] are Port A YCbCr
data inputs and D[15:8] are Port B YCbCr data
inputs. For VIN[1], only D[15:0] are available.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[6]
VIN[1]A_D[12]
VOUT[1]
PINCTRL9
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[5]/
VIN[1]A_D[11]
VOUT[1]
PINCTRL8
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[4]/
VIN[1]A_D[10]
VOUT[1]
PINCTRL7
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[3]/
VIN[1]A_D[9]
VOUT[1]
PINCTRL6
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[2]/
VIN[1]A_D[8]
VOUT[1]
PINCTRL20
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-26. Video Input 1 Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[9]/
VIN[1]A_D[7]
VOUT[1]
PINCTRL19
AP6
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[8]/
VIN[1]A_D[6]
VOUT[1]
PINCTRL18
AT6
AR6
AC13
AJ7
I
I
I
I
I
I
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[7]/
VIN[1]A_D[5]
VOUT[1]
PINCTRL17
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[6]/
VIN[1]A_D[4]
VOUT[1]
PINCTRL16
Video Input 1 Port A Data inputs. For 16-bit
capture, D[7:0] are Cb/Cr and [15:8] are Y Port A
inputs. For 8-bit capture, D[7:0] are Port A YCbCr
data inputs and D[15:8] are Port B YCbCr data
inputs. For VIN[1], only D[15:0] are available.
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[5]/
VIN[1]A_D[3]
VOUT[1]
PINCTRL50
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[4]/
VIN[1]A_D[2]
VOUT[1]
PINCTRL49
AU6
AP7
AU7
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[3]/
VIN[1]A_D[1]
VOUT[1]
PINCTRL48
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[2]/
VIN[1]A_D[0]
VOUT[1]
PINCTRL47
Video Input 1 Port B Horizontal Sync or Data Valid
signal input. Discrete horizontal synchronization
signal for Port B 8-bit YCbCr capture without
embedded syncs ("BT.601" modes). Not used in
16-bit YCbCr capture mode.
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL27
AR9
AT5
I
I
Video Input 1 Port A Horizontal Sync input.
Discrete horizontal synchronization signal for Port
A YCbCr capture modes without embedded syncs
("BT.601" modes).
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VOUT[1]
PINCTRL22
VOUT[0]_G_Y_YC[0]/
VOUT[1]_VSYNC
(silicon revision 1.x)
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)/
VIN[1]B_VSYNC
Video Input 1 Port B Vertical Sync input. Discrete
vertical synchronization signal for Port B 8-bit
YCbCr capture without embedded syncs ("BT.601"
modes). Not used in 16-bit YCbCr capture mode.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL29
AP9
AL5
I
I
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
VOUT[1]_VSYNC
(silicon revision 1.x)
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)
Video Input 1 Port A Vertical Sync input. Discrete
vertical synchronization signal for Port A YCbCr
capture modes without embedded syncs ("BT.601"
modes).
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VOUT[1]
PINCTRL23
VIN[0]A_D[19]/
VIN[1]A_DE/
VOUT[1]_C[9]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VOUT[1]
PINCTRL25
Video Input 1 Port A Data Enable input. Discrete
data valid signal for Port A YCbCr capture modes
without embedded syncs ("BT.601" modes).
AK4
AK5
I
I
Video Input 1Port A Field ID input. Discrete field
identification signal for Port A YCbCr capture
modes without embedded syncs ("BT.601"
modes).
VIN[0]A_D[18]/
VIN[1]A_FLD/
VOUT[1]_C[8]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VOUT[1]
PINCTRL24
Video Input 1 Port B Field ID input. Discrete field
identification signal for Port B 8-bit YCbCr capture
without embedded syncs ("BT.601" modes). Not
used in 16-bit YCbCr capture mode.
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL30
AU8
I
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3.2.20 Digital Video Output Signals
NOTE
Video output 0 pins AR8 and AL9 and video output 1 pins AT9, AR5, AP9, and AL5 have a
different naming convention and functionality for silicon revision 1.x devices and silicon
revision 2.x devices. These pins are listed separately in Table 3-28 and Table 3-30.
Table 3-27. Video Output 0 Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
-
VOUT[0]_CLK
AT14
O
Video Output 0 Clock output.
PINCTRL101
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
VOUT[0]_G_Y_YC[9]
VOUT[0]_G_Y_YC[8]
VOUT[0]_G_Y_YC[7]
VOUT[0]_G_Y_YC[6]
VOUT[0]_G_Y_YC[5]
VOUT[0]_G_Y_YC[4]
VOUT[0]_G_Y_YC[3]
VOUT[0]_G_Y_YC[2]
AR13
AU13
AT13
AE14
AM14
AL14
AP14
AE15
AU8
O
O
O
O
O
O
O
O
O
PINCTRL109
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL108
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL107
Video Output 0 Data. These signals represent the
8 MSBs of G/Y/YC video data. For RGB mode
they are green data bits, for YUV444 mode they
are Y data bits, for Y/C mode they are Y (Luma)
data bits and for BT.656 mode they are
multiplexed Y/Cb/Cr (Luma and Chroma) data
bits.
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL106
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL105
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL104
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL103
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL102
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT,[1]
VIN[1]B
PINCTRL30
Video Output 0 Data. These signals represent the
2 LSBs of G/Y/YC video data for 10-bit, 20-bit and
30-bit video modes (VOUT0 only). For RGB mode
they are green data bits, for YUV444 mode they
are Y data bits, for Y/C mode they are Y (Luma)
data bits and for BT.656 mode they are
multiplexed Y/Cb/Cr (Luma and Chroma) data
bits. These signals are not used in 8/16/24-bit
modes
VOUT[0]_G_Y_YC[0]/
VOUT[1]_VSYNC
(silicon revision 1.x)
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)/
VIN[1]B_VSYNC
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1],
VIN[1]B
PINCTRL29
AP9
O
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-27. Video Output 0 Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
VOUT[0]_B_CB_C[9]
VOUT[0]_B_CB_C[8]
VOUT[0]_B_CB_C[7]
VOUT[0]_B_CB_C[6]
VOUT[0]_B_CB_C[5]
VOUT[0]_B_CB_C[4]
VOUT[0]_B_CB_C[3]
VOUT[0]_B_CB_C[2]
AT12
O
PINCTRL117
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
AH13
AM13
AJ13
AK13
AN13
AL13
AP13
O
O
O
O
O
O
O
PINCTRL116
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL115
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
Video Output 0 Data. These signals represent the
8 MSBs of B/CB/C video data. For RGB mode
they are blue data bits, for YUV444 mode they are
Cb (Chroma) data bits, for Y/C mode they are
multiplexed Cb/Cr (Chroma) data bits and for
BT.656 mode they are unused
-
PINCTRL114
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL113
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL112
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL111
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
-
PINCTRL110
VOUT[0]_B_CB_C[1]/
VOUT[1]_HSYNC
(silicon revision 1.x)
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)/
VOUT[1]_AVID
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL28
AT9
O
Video Output 0 Data. These signals represent the
2 LSBs of B/CB/C video data for 20-bit and 30-bit
video modes (VOUT[0] only). For RGB mode they
are blue data bits, for YUV444 mode they are Cb
(Chroma) data bits, for Y/C mode they are
multiplexed Cb/Cr (Chroma) data bits and for
BT.656 mode they are unused. These signals are
not used in 16/24-bit modes.
VOUT[0]_R_CR[9]/
VOUT[0]_B_CB_C[1]/
VOUT[1]_Y_YC[9]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL125
AU9
AR9
O
O
O
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1],
VIN[1]B
PINCTRL27
VOUT[0]_R_CR[8]/
VOUT[0]_B_CB_C[0]/
VOUT[1]_Y_YC[8]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL124
AK10
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Table 3-27. Video Output 0 Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
VOUT[0]_R_CR[9]/
VOUT[0]_B_CB_C[1]/
VOUT[1]_Y_YC[9]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL125
AU9
O
VOUT[0]_R_CR[8]/
VOUT[0]_B_CB_C[0]/
VOUT[1]_Y_YC[8]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL124
AK10
AL10
AU10
AT10
AG13
AR11
AT11
AT8
O
O
O
O
O
O
O
O
VOUT[0]_R_CR[7]/
VOUT[0]_G_Y_YC[1]/
VOUT[1]_Y_YC[7]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL123
VOUT[0]_R_CR[6]/
VOUT[0]_G_Y_YC[0]/
VOUT[1]_Y_YC[6]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL122
Video Output 0 Data. These signals represent the
8 MSBs of R/CR video data. For RGB mode they
are red data bits, for YUV444 mode they are Cr
(Chroma) data bits, for Y/C mode and BT.656
modes they are unused.
VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_Y_YC[5]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL121
VOUT[0]_R_CR[4]/
VOUT[0]_FLD/
VOUT[1]_Y_YC[4]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL120
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC/
VOUT[1]_Y_YC[3]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL119
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/
VOUT[1]_Y_YC[2]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL118
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
Video Output 0 Data. These signals represent the
2 LSBs of R/CR video data for 30-bit video modes
(VOUT[0] only). For RGB mode they are red data
bits, for YUV444 mode they are Cr (Chroma) data
bits, for Y/C mode and BT.656 modes they are
unused. These signals are not used in 24-bit
mode.
-
VOUT[0]_R_CR[1]
PINCTRL40
VOUT[0]_R_CR[0]/
VOUT[1]_C[8]/
VOUT[1]_CLK
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL26
AJ11
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
VOUT[0]_VSYNC
AN9
AR11
AM9
O
O
O
O
O
O
PINCTRL37
Video Output 0 Vertical Sync output. This is the
discrete vertical synchronization output. This
signal is not used for embedded sync modes.
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC/
VOUT[1]_Y_YC[3]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL119
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
-
VOUT[0]_HSYNC
PINCTRL36
Video Output 0 Horizontal Sync output. This is the
discrete horizontal synchronization output. This
signal is not used for embedded sync modes.
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/
VOUT[1]_Y_YC[2]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL118
AT11
AG13
AT10
VOUT[0]_R_CR[4]/
VOUT[0]_FLD/
VOUT[1]_Y_YC[4]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL120
Video Output 0 Field ID output. This is the discrete
field identification output. This signal is not used
for embedded sync modes.
VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_Y_YC[5]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL121
Video Output 0 Active Video output. This is the
discrete active video indicator output. This signal
is not used for embedded sync modes.
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Table 3-28. Video Output 0 [Pins AR8, AL9] Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
Silicon Revision 1.x Devices
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
Video Output 0 Active Video output. This is the
discrete active video indicator output. This signal
is not used for embedded sync modes.
-
HSYNC_VOUT[0]_AVID
AR8
AL9
O
O
PINCTRL39
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
Video Output 0 Field ID output. This is the discrete
field identification output. This signal is not used
for embedded sync modes.
-
VSYNC_VOUT[0]_FLD
PINCTRL38
Silicon Revision 2.x Devices
Pin supports two functions in silicon revision 2.x
devices:
1. Video Output 0 Active Video output. This is
the discrete active video indicator output. This
signal is not used for embedded sync modes.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
DAC_HSYNC_
VOUT[0]_AVID
-
AR8
O
PINCTRL39
2. Discrete Horizontal Sync for HD-DACs.
Functionality is set in SPARE_CTRL0 register as
defined in Section 8.10.
Pin supports two functions in silicon revision 2.x
devices:
1. Video Output 0 Field ID output. This is the
discrete field identification output. This signal
is not used for embedded sync modes.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
DAC_VSYNC_
VOUT[0]_FLD
-
AL9
O
PINCTRL38
2. Discrete Vertical Sync for HD-DACs.
Functionality is set in SPARE_CTRL0 register as
defined in Section 8.10.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-29. Video Output 1 Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
VOUT[0]_R_CR[0]/
VOUT[1]_C[8]/
VOUT[1]_CLK
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL26
AJ11
O
Video Output 1 Clock output
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_CLK/
VIN[1]A_CLK
VIN[1]A
PINCTRL46
AT7
AU9
O
O
O
O
O
O
O
O
O
VOUT[0]_R_CR[9]/
VOUT[0]_B_CB_C[1]/
VOUT[1]_Y_YC[9]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL125
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[9]/
VIN[1]A_D[7]
VIN[1]A
PINCTRL19
AP6
VOUT[0]_R_CR[8]/
VOUT[0]_B_CB_C[0]/
VOUT[1]_Y_YC[8]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL124
AK10
AT6
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[8]/
VIN[1]A_D[6]
VIN[1]A
PINCTRL18
Video Output 1 Data. These signals represent the
8 bits of Y/YC video data. For Y/C mode they are
Y (Luma) data bits and for BT.656 mode they are
multiplexed Y/Cb/Cr (Luma and Chroma) data
bits.
VOUT[0]_R_CR[7]/
VOUT[0]_G_Y_YC[1]/
VOUT[1]_Y_YC[7]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL123
AL10
AR6
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[7]/
VIN[1]A_D[5]
VIN[1]A
PINCTRL17
VOUT[0]_R_CR[6]/
VOUT[0]_G_Y_YC[0]/
VOUT[1]_Y_YC[6]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL122
AU10
AC13
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[6]/
VIN[1]A_D[4]
VIN[1]A
PINCTRL16
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-29. Video Output 1 Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_Y_YC[5]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL121
AT10
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[5]/
VIN[1]A_D[3]
VIN[1]A
PINCTRL50
AJ7
AG13
AU6
AR11
AP7
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
VOUT[0]_R_CR[4]/
VOUT[0]_FLD/
VOUT[1]_Y_YC[4]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL120
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[4]/
VIN[1]A_D[2]
VIN[1]A
PINCTRL49
Video Output 1 Data. These signals represent the
8 bits of Y/YC video data. For Y/C mode they are
Y (Luma) data bits and for BT.656 mode they are
multiplexed Y/Cb/Cr (Luma and Chroma) data
bits.
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC /
VOUT[1]_Y_YC[3]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL119
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[3]
VIN[1]A_D[1]
VIN[1]A
PINCTRL48
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/
VOUT[1]_Y_YC[2]
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL118
AT11
AU7
AR9
AK4
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_Y_YC[2]/
VIN[1]A_D[0]
VIN[1]A
PINCTRL47
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VIN[1]B
PINCTRL27
VIN[0]A_D[19]/
VIN[1]A_DE/
VOUT[1]_C[9]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
VIN[0]A_D[18]/
VIN[1]A_FLD/
VOUT[1]_C[8]
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
PINCTRL24
AK5
VOUT[0]_R_CR[0]/
VOUT[1]_C[8]/
VOUT[1]_CLK
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL26
AJ11
AD13
AN8
AP8
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[7]/
VIN[1]A_D[13]
VIN[1]A
PINCTRL10
Video Output 1 Data. These signals represent the
8 bits of C video data. For Y/C mode they are
multiplexed Cb/Cr (Chroma) data bits, and for
BT.656 mode they are unused.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[6]/
VIN[1]A_D[12]
VIN[1]A
PINCTRL9
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[5]/
VIN[1]A_D[11]
VIN[1]A
PINCTRL8
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[4]/
VIN[1]A_D[10]
VIN[1]A
PINCTRL7
AN7
AM8
AK6
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[3]/
VIN[1]A_D[9]/
VIN[1]A
PINCTRL6
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_C[2]/
VIN[1]A_D[8]
VIN[1]A
PINCTRL20
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Table 3-29. Video Output 1 Terminal Functions (continued)
SIGNAL
NAME
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
PINCTRL22
AT5
O
Video Output 1 Field ID output. This is the discrete
field identification output. This signal is not used
for embedded sync modes.
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VIN[1]B
PINCTRL30
AU8
AT9
AT4
O
O
O
VOUT[0]_B_CB_C[1]/
VOUT[1]_HSYNC
(silicon revision 1.x)
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)/
VOUT[1]_AVID
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL28
Video Output 1 Active Video output. This is the
discrete active video indicator output. This signal
is not used for embedded sync modes.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_AVID/
VIN[1]B_CLK
VIN[1]B
PINCTRL31
Table 3-30. Video Output 1 [Pins AT9, AR5, AP9, AL5] Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
Silicon Revision 1.x Devices
VOUT[0]_B_CB_C[1]/
VOUT[1]_HSYNC/
VOUT[1]_AVID
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL28
AT9
AR5
AP9
AL5
O
O
O
O
Video Output 1 Horizontal Sync output. This is the
discrete horizontal synchronization output. This
signal is not used for embedded sync modes.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]_HSYNC/
VIN[1]A_D[15]
VIN[1]A
PINCTRL21
VOUT[0]_G_Y_YC[0]/
VOUT[1]_VSYNC/
VIN[1]B_VSYNC
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VIN[1]B
PINCTRL29
Video Output 1 Vertical Sync output. This is the
discrete vertical synchronization output. This
signal is not used for embedded sync modes.
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
VOUT[1]_VSYNC
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
PINCTRL23
Silicon Revision 2.x Devices
VOUT[0]_B_CB_C[1]/
DAC_VOUT[1]_HSYNC/
VOUT[1]_AVID
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL28
Pin supports two functions in silicon revision 2.x
devices:
AT9
AR5
O
O
1. Video Output 1 Horizontal Sync output. This is
the discrete horizontal synchronization output.
This signal is not used for embedded sync
modes.
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
DAC_VOUT[1]_HSYNC/
VIN[1]A_D[15]
VIN[1]A
PINCTRL21
2. Discrete Horizontal Sync for HD-DACs.
Functionality is set in SPARE_CTRL0 register as
defined in Section 8.10.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-30. Video Output 1 [Pins AT9, AR5, AP9, AL5] Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
MUXED
DESCRIPTION
NO.
VOUT[0]_G_Y_YC[0]/
DAC_VOUT[1]_VSYNC/
VIN[1]B_VSYNC
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VIN[1]B
PINCTRL29
Pin supports two functions in silicon revision 2.x
devices:
AP9
O
1. Video Output 1 Vertical Sync output. This is
the discrete vertical synchronization output.
This signal is not used for embedded sync
modes.
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
DAC_VOUT[1]_VSYNC
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
PINCTRL23
AL5
O
2. Discrete Vertical Sync for HD-DACs.
Functionality is set in SPARE_CTRL0 register as
defined in Section 8.10.
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3.2.21 Analog Video Output Signals
Table 3-31. Analog Video Output Terminal Functions
SIGNAL
NAME
TYPE(1)
OTHER
DESCRIPTION
NO.
When a specific Video DAC output [IOUTA - IOUTG] is powered down, the corresponding Analog Video Output terminal functions
should be left unconnected.
IOUTA
IOUTB
IOUTC
IOUTD
IOUTE
IOUTF
IOUTG
AT21
AR21
AP21
AR20
AT19
AT20
AU20
O
O
O
O
O
O
O
-
-
-
-
-
-
-
Video DAC A output. Analog HD Video DAC (G/Y)
Video DAC B output. Analog HD Video DAC (B/Pb)
Video DAC C output. Analog HD Video DAC (R/Pr)
Video DAC D output. Analog SD Video DAC
Video DAC E output. Analog SD Video DAC
Video DAC F output. Analog SD Video DAC
Video DAC G output. Analog SD Video DAC
DAC_VOUT[1]_HSYNC,
DAC_HSYNC_
VOUT[0]_AVID
AR5,
AT9,
AR8
O
O
-
-
Analog HD Video DAC Discrete HSYNC Output
DAC_VOUT[1]_VSYNC,
DAC_VSYNC_
VOUT[0]_FLD
AL5,
AP9, AL9
Analog HD Video DAC Discrete VSYNC Output
Video DAC reference voltage (0.5 V).
VDAC_VREF
AH19
AE22
I
-
-
When the video DACs are powered down, this pin should be left
unconnected.
Video DAC HD current bias connection. This pin must be connected
via an external 1.2-kΩ resistor to VSSA_HD.
VDAC_RBIAS_HD
I/O
When the HD DACs are powered down, this pin should be left
unconnected.
Video DAC SD current bias connection. This pin must be connected
via an external 1.2-kΩ resistor to VSSA_SD.
VDAC_RBIAS_SD
AP19
I/O
-
When the SD DACs are powered down, this pin should be left
unconnected.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
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3.2.22 Reserved Pins
Table 3-32. Reserved Terminal Functions
SIGNAL
TYPE(1)
OTHER(2) (3)
DESCRIPTION
NAME
NO.
AB36
P25
RSV1
RSV2
RSV3
RSV4
RSV5
RSV6
RSV7
RSV8
RSV9
RSV10
RSV11
O
O
-
-
-
-
-
-
-
-
-
-
-
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
N19
N20
T28
O
O
I/O
I/O
O
T27
AE23
D24
AU37
N28
N29
O
I
I/O
I/O
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
RSV12
RSV13
RSV14
RSV15
AG25
AG24
AH25
AH24
S
S
S
S
-
-
-
-
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
Reserved. For proper device operation, this pin must be tied directly to
RSV16
RSV17
RSV18
R34
P34
P33
I
-
-
-
VSS
.
O
S
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
Reserved. For proper device operation, this pin must be tied directly to
RSV19
P32
GND
-
VSS
.
RSV20
RSV21
RSV22
D14
O
O
O
-
-
-
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
AN18
AN19
IPD
DVDD_3P3
RSV23
RSV24
RSV25
RSV26
RSV27
RSV28
RSV29
RSV30
AP2
AU3
AN2
AT1
AR1
AP1
AM2
AL2
I
I
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
IPD
DVDD_3P3
IPD
DVDD_3P3
I
IPD
DVDD_3P3
I
IPD
DVDD_3P3
I
DIS
DVDD_3P3
O
O
O
DIS
DVDD_3P3
DIS
DVDD_3P3
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
(2) IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled. This represents the default state of the
internal pull after reset. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown
resistors are required, see Section 4.2.1, Pullup/Pulldown Resistors.
(3) Specifies the operating I/O supply voltage for each signal.
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Table 3-32. Reserved Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
DESCRIPTION
NO.
DIS
DVDD_3P3
RSV31
RSV32
RSV33
RSV34
RSV35
RSV36
RSV37
RSV38
RSV39
AK1
O
O
I
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
DIS
DVDD_3P3
AL1
IPD
DVDD_3P3
AM29
AL28
AL29
AN29
AP29
AR29
AT29
IPD
DVDD_3P3
I
IPD
DVDD_3P3
I
IPD
DVDD_3P3
I
IPD
DVDD_3P3
I
DIS
DVDD_3P3
O
O
DIS
DVDD_3P3
DIS
DVDD_3P3
RSV40
RSV41
RSV42
AT28
AU21
AJ1
O
O
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
-
IPU
DVDD_3P3
I/O
IPU
DVDD_3P3
RSV43
RSV44
RSV45
RSV46
RSV47
RSV48
RSV49
RSV50
RSV51
RSV52
RSV53
RSV54
RSV55
RSV56
RSV57
RSV58
AK2
AH8
AJ2
I/O
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
DIS
DVDD_3P3
O
DIS
DVDD_3P3
O
DIS
DVDD_3P3
AK3
O
DIS
DVDD_3P3
AJ3
O
IPD
DVDD_3P3
AJ4
I
IPD
DVDD_3P3
AJ5
I
IPD
DVDD_3P3
AJ6
I
IPD
DVDD_3P3
AB13
AE21
AG22
AG23
AH23
I
S
Reserved. For proper device operation, this pin should be connected to a
1.0-V power supply.
-
-
-
-
-
-
-
Reserved. For proper device operation, this pin should be connected to a
1.8-V power supply.
S
Reserved. For proper device operation, this pin should be connected to a
1.8-V power supply.
S
Reserved. For proper device operation, this pin should be connected to a
1.8-V power supply.
S
Reserved. For proper device operation, this pin should be connected to a
1.8-V power supply.
AJ23
AK22
S
Reserved. For proper device operation, this pin must be tied directly to
GND
GND
VSS
Reserved. For proper device operation, this pin must be tied directly to
VSS
.
AL22
.
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Table 3-32. Reserved Terminal Functions (continued)
SIGNAL
NAME
TYPE(1)
OTHER(2) (3)
DESCRIPTION
NO.
AM22
Reserved. For proper device operation, this pin must be tied directly to
RSV59
RSV60
RSV61
GND
GND
GND
-
-
-
VSS
Reserved. For proper device operation, this pin must be tied directly to
VSS
Reserved. For proper device operation, this pin must be tied directly to
VSS
.
AM21
AN21
.
.
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3.2.23 Supply Voltages
Table 3-33. Supply Terminal Functions
SIGNAL
TYPE(1)
OTHER
DESCRIPTION
Reference Power Supply DDR[0]:
NAME
NO.
VREFSSTL_DDR[0]
A17
S
-
•
•
0.75-V for DDR3 memory type
0.9-V for DDR2 memory type
Reference Power Supply DDR[1]
VREFSSTL_DDR[1]
A21
S
-
•
•
0.75-V for DDR3 memory type
0.9-V for DDR2 memory type
AD22, AD21,
AD20, AD19,
AD18, AD17,
AD16, AC22,
AC21, AC20,
AC19, AC18,
AC17, AC16,
AB24, AB23,
AB22, AB21,
AB20, AB19,
AB18, AB17,
AB16, AB15,
AB14, T24,
CVDD
S
-
Variable Core Voltage Supply for the Always ON Domain
T23, T22, T21,
T20, T19, T18,
T17, T16, T15,
T14, R22, R21,
R20, R19, R18,
R17, R16, P22,
P21, P20, P19,
P18, P17, P16
AE25, AE13,
AD24, AD23,
AD15, AD14,
AC24, AC23,
AC15, AC14,
R24, R23, R15,
R14, P24, P23,
P15, P14, N25,
N13
CVDDC
S
-
1.0-V Constant Power Supply for Memories and PLLs
0.9-V Power Supply for USB PHYs.
VDD_USB_0P9
VDDT_SATA
N27
S
S
-
-
Note: If the USB is not used, for proper device operation, this pin
must be connected to a power supply (0.9 V or CVDDC).
1.0-V Power Supply for SATA Termination and Analog Front End
Note: If the SATA is not used, for proper device operation, these
pins must be connected to a 1.0-V power supply.
Y34, Y33, V34,
V32
1.0-V Power Supply for PCIe Termination and Analog Front End
Note: If the PCIe is not used, these pins should be connected to
a 1.0-V power supply.
Y30, Y28, AB32,
AB29, AB27
VDDT_PCIE
VDDA_PLL
VDDA_HDMI
S
S
S
-
-
-
B18, A18
1.5-V Analog Power Supply for PLLs
AR27, AP24,
AP23,
AN24, AN23
1.0-V Analog Power Supply for HDMI
Note: If the HDMI is not used, these pins should be connected to
a 1.0-V power supply.
1.0-V Analog Power Supply for VDAC HD DAC
Note: If the HD DAC is not used, this pin should be connected to
a 1.0-V power supply.
VDDA_HD_1P0
VDDA_SD_1P0
AG21
AG20
S
S
-
-
1.0-V Analog Power Supply for VDAC SD DAC
Note: If the SD DAC is not used, this pin should be connected to
a 1.0-V power supply.
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
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Table 3-33. Supply Terminal Functions (continued)
SIGNAL
TYPE(1)
OTHER
DESCRIPTION
NAME
NO.
1.5-V Regulator Power Supply for SATA
VDDR_SATA
VDDR_PCIE
V25, U25
S
-
Note: If the SATA is not used, for proper device operation, these
pins must be connected to a 1.5-V power supply.
1.5-V Regulator Power Supply for PCIe
Note: If the PCIe is not used, for proper device operation, these
pins must be connected to a 1.5-V power supply.
Y25, W25
S
S
-
-
L19, L18, L17,
L16, L15, L14,
K19, K18, K17,
K16, K15, K14,
J18, J17, J16,
J15, J14, E11,
A11, E1, A2
Power Supply for DDR[0] I/Os:
DVDD_DDR[0]
DVDD_DDR[1]
•
•
1.5-V for DDR3 memory type
1.8-V for DDR2 memory type
L24, L23, L22,
L21, L20, K24,
K23, K22, K21,
K20, J24, J23,
J22, J21, J20,
J19, E27, D37,
A36, A27
1.5-V Power Supply for DDR[1] I/Os:
S
-
•
•
1.5-V for DDR3 memory type
1.8-V for DDR2 memory type
1.8-V Power Supply for Device Oscillator
DEVOSC_DVDD18
VDD_USB0_1P8
E19
S
S
-
-
Note: If the oscillator is not used, this pin should be connected to
the 1.8-V power supply (DVDD1P8).
1.8-V Power Supply for USB0
Note: If the USB is not used, for proper device operation, this pin
must be connected to a 1.8-V power supply, or when the USB
PHY is not used, this pin can be optionally connected to CVDDC.
R25
1.8-V Power Supply for USB1
Note: If the USB is not used, for proper device operation, this pin
must be connected to a 1.8-V power supply, or when the USB
PHY is not used, this pin can be optionally connected to CVDDC.
VDD_USB1_1P8
T25
S
-
DVDD1P8
AJ20, AJ24
AT22
S
S
-
-
1.8-V Power Supply
1.8-V Reference Power Supply for VDAC
Note: If the VDAC is not used, these pins should be connected
to a 1.8-V power supply.
VDDA_REF_1P8
1.8-V Analog Power Supply for VDAC HD DAC
Note: If the HD DAC is not used, these pins should be
connected to a 1.8-V power supply.
VDDA_HD_1P8
VDDA_SD_1P8
AJ22, AH22
S
S
-
-
1.8-V Analog Power Supply for VDAC SD DAC
Note: If the SD DAC is not used, these pins should be connected
to a 1.8-V power supply.
AJ21, AH21,
AH20
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Table 3-33. Supply Terminal Functions (continued)
SIGNAL
TYPE(1)
OTHER
DESCRIPTION
NAME
NO.
AU29, AU11,
AU2,
AN37, AN27,
AN11,
AN1, AJ17,
AJ16,
AJ15, AJ14,
AH17,
AH16, AH15,
AH14,
AG33, AG17,
AG16,
AG15, AG14,
AE29,
AE28, AE27,
AD29,
AD28, AD27,
AD11,
AD10, AD9,
AC29,
DVDD_3P3
S
-
3.3-V Power Supply
AC28, AC27,
AC11,
AC10, AC9,
AB11,
AB10, AB9,
AA11,
AA10, AA9,
AA1,
Y9, U11, U10,
U9, T11, T10,
T9, R28, R27,
R11, R10, R9,
P30, P29, P28,
P27, P11, P10,
P9, P8, L35,
L30, L5, L1
VDD_USB0_3P3
VDD_USB1_3P3
T29, R29
T30, R30
S
S
-
-
3.3-V Power Supply for USB0
3.3-V Power Supply for USB1
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3.2.24 Ground Pins (VSS)
Table 3-34. Ground Terminal Functions
SIGNAL
TYPE(1)
OTHER
DESCRIPTION
NAME
NO.
AU28, AU23, AU12,
AU1, AT23, AR25,
AR24, AR23, AR15,
AP37, AP15, AN15,
AN14, AM31, AM25,
AM24, AM23, AM19,
AM18, AM17, AM16,
AM15, AM7, AM1,
AL32, AL31, AL24,
AL23, AL19, AL18,
AL17, AL16, AL15,
AL7, AL6, AK27, AK24,
AK23, AK19, AK18,
AK17, AK16, AK15,
AK11, AJ25, AJ18,
AG30, AG26, AG12,
AG8, AG5, AF27,
AF11, AE20, AE19,
AE18, AE17, AD34,
AD33, AD32, AD31,
AD30, AD7, AD6, AD5,
AC34, AC33, AC32,
AC31, AC30, AC8,
AC7, AC6, AC4, AC3,
AB37, AB35, AB8, AB7,
AB6, AB1, AA24, AA23,
AA22, AA21, AA20,
AA19, AA18, AA17,
AA16, AA15, AA14,
AA13, AA8, AA7, AA6,
AA5, Y37, Y36, Y32,
Y31, Y24, Y23, Y22,
Y21, Y20, Y19, Y18,
Y17, Y16, Y15, Y14,
Y13, Y8, Y7, Y6, Y5,
Y4, W24, W23, W22,
W21, W20, W19, W18,
W17, W16
VSS
GND
-
Ground (GND)
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
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Table 3-34. Ground Terminal Functions (continued)
SIGNAL
TYPE(1)
OTHER
DESCRIPTION
NAME
NO.
W15, W14, W13, W9,
W8, W7, W6, V28, V27,
V24, V23, V22, V21,
V20, V19, V18, V17,
V16, V15, V14, V13,
V9, V8, V7, V6, V5, V4,
U24, U23, U22, U21,
U20, U18, U17, U16,
U15, U14, U13, U8, U7,
U6, U5, T35, T34, T33,
T8, T7, T6, R33, R32,
R31, R8, R7, R6, R4,
R3, P31, P7, P6, P5,
P4, N18, M27, M11,
L33, L26, L12, L8, K37,
K1, H27, H24, H23,
H22, H21, H20, H19,
H18, H17, H16, H15,
H14, H11, G32, G31,
G24, G23, G22, G21,
G20, G18, G17, G16,
G15, G14, G7, G6,
F31, F24, F23, F22,
F21, F17, F16, F15,
F14, F7, E37, E24,
E14, D1, C23, C21,
C17, C15, A37, A28,
A10, A1
VSS
GND
-
Ground (GND)
VSSA_PLL
VSSA_HD
U19, B20, A20
GND
GND
-
-
Analog GND for PLLs
AK21, AK20, AL21
Analog GND for VDAC HD DAC
AU19, AM20, AN20,
AL20
VSSA_SD
GND
-
Analog GND for VDAC SD DAC
VSSA_REF_1P8
DEVOSC_VSS
AU22
B19
GND
GND
-
-
Reference GND for VDAC (1.8 V)
Ground for Device Oscillator
106
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4 Device Configurations
4.1 Control Module
The device control module includes status and control logic not addressed within the peripherals or the
remainder of the device infrastructure. This module is the primary point of control for the following areas of
the device:
•
•
•
•
Functional I/O multiplexing
Device status
Static device configuration
Open-core protocol (OCP) interface for standard and customer programmable e-Fuse bit shift
registers.
The control module primarily implements a bank of registers accessible (read/write) by the software along
with some read-only registers carrying status information. Most register bits are exported as control
signals for other logic blocks on the device. Certain control module registers have default values based
upon the device type as decoded from e-Fuse.
The read/write registers can be divided into the following classes:
•
•
•
Static device configuration registers
Status and configuration registers
Boot registers
Table 4-1 shows the general register groupings and Table 4-2 through Table 4-4 provide register
summaries for each group.
Table 4-1. Control Module Register Map
ADDRESS OFFSET
0x0000 - 0x0020
0x0024 - 0x003C
0x0040 – 0x00FC
0x0300 - 0x03FC
0x0400 - 0x05FC
0x0600 - 0x07FC
0x0800 - 0x0FFC
REGISTER GROUP
OCP Configuration registers
Reserved
SEE
Table 4-2
Device Boot registers
Reserved
Table 4-6
PLL Control registers
Device Configuration registers
PAD Control registers
Table 4-3
Table 4-4
Section 4.4
Table 4-2. OCP Configuration Registers Summary
HEX ADDRESS
0x4814 0000
ACRONYM
REGISTER NAME
CONTROL_REVISION
Control module Revision number
Reserved
0x4814 0004 - 0x4814 000C
0x4814 0010
-
CONTROL_SYSCONFIG
-
Idle mode parameters
Reserved
0x4814 0014 - 0x4814 003C
Table 4-3. PLL Control Registers Summary
HEX ADDRESS
0x4814 0400
0x4814 0404
0x4814 0408
0x4814 040C
0x4814 0410
ACRONYM
REGISTER NAME
MAINPLL_CTRL
MAINPLL_PWD
MAINPLL_FREQ1
MAINPLL_DIV1
MAINPLL_FREQ2
Main PLL base frequency control
Main PLL clock output powerdown
Main Clock 1 fractional divider
Main Clock 1 post divider
Main Clock 2 fractional divider
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Table 4-3. PLL Control Registers Summary (continued)
HEX ADDRESS
0x4814 0414
0x4814 0418
0x4814 041C
0x4814 0420
0x4814 0424
0x4814 0428
0x4814 042C
0x4814 0430
0x4814 0434
0x4814 0438
0x4814 043C
0x4814 0440
0x4814 0444
0x4814 0448
0x4814 044C
0x4814 0450
0x4814 0454
0x4814 0458
0x4814 045C
0x4814 0460
0x4814 0464
0x4814 0468
0x4814 046C
0x4814 0470
0x4814 0474
0x4814 0478
0x4814 047C
0x4814 0480
0x4814 0484
0x4814 0488
0x4814 048C
0x4814 0490 - 0x4814 049C
0x4814 04A0
0x4814 04A4
0x4814 04A8
0x4814 04AC
0x4814 04B0
0x4814 04B4
0x4814 04B8
0x4814 04BC
0x4814 04C0
0x4814 04C4
0x4814 04C8
0x4814 04CC
0x4814 04D0 - 0x4814 05FC
ACRONYM
MAINPLL_DIV2
MAINPLL_FREQ3
MAINPLL_DIV3
MAINPLL_FREQ4
MAINPLL_DIV4
MAINPLL_FREQ5
MAINPLL_DIV5
-
REGISTER NAME
Main Clock 2 post divider
Main Clock 3 fractional divider
Main Clock 3 post divider
Main Clock 4 fractional divider
Main Clock 4 post divider
Main Clock 5 fractional divider
Main Clock 5 post divider
Reserved
MAINPLL_DIV6
-
Main Clock 6 post divider
Reserved
MAINPLL_DIV7
DDRPLL_CTRL
DDRPLL_PWD
-
Main Clock 7 post divider
DDR PLL base frequency control
DDR PLL clock output powerdown
Reserved
DDR_PLL_DIV1
DDRPLL_FREQ2
DDR_PLL_DIV2
DDRPLL_FREQ3
DDR_PLL_DIV3
DDRPLL_FREQ4
DDR_PLL_DIV4
DDRPLL_FREQ5
DDR_PLL_DIV5
VIDEOPLL_CTRL
VIDEOPLL_PWD
VIDEOPLL_FREQ1
VIDEOPLL_DIV1
VIDEOPLL_FREQ2
VIDEOPLL_DIV2
VIDEOPLL_FREQ3
VIDEOPLL_DIV3
-
DDR Clock 1 post divider
DDR Clock 2 fractional divider
DDR Clock 2 post divider
DDR Clock 3 fractional divider
DDR Clock 3 post divider
DDR Clock 4 fractional divider
DDR Clock 4 post divider
DDR Clock 5 fractional divider
DDR Clock 5 post divider
Video PLL base frequency control
Video PLL clock output powerdown
Video Clock 1 fractional divider
Video Clock 1 post divider
Video Clock 2 fractional divider
Video Clock 2 post divider
Video Clock 3 fractional divider
Video Clock 3 post divider
Reserved
AUDIOPLL_CTRL
AUDIOPLL_PWD
-
Audio PLL base frequency control
Audio PLL clock output powerdown
Reserved
-
Reserved
AUDIOPLL_FREQ2
AUDIOPLL_DIV2
AUDIOPLL_FREQ3
AUDIOPLL_DIV3
AUDIOPLL_FREQ4
AUDIOPLL_DIV4
AUDIOPLL_FREQ5
AUDIOPLL_DIV5
-
Audio Clock 2 fractional divider
Audio Clock 2 post divider
Audio Clock 3 fractional divider
Audio Clock 3 post divider
Audio Clock 4 fractional divider
Audio Clock 4 post divider
Audio Clock 5 fractional divider
Audio Clock 5 post divider
Reserved
108
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Table 4-4. Device Configuration Registers Summary
HEX ADDRESS
0x4814 0600
0x4814 0604
0x4814 0608
0x4814 060C
0x4814 0610
0x4814 0614
0x4814 0618
0x4814 061C
0x4814 0620
0x4814 0624
0x4814 0628
0x4814 062C
0x4814 0630
0x4814 0634
0x4814 0638
0x4814 063C
0x4814 0640
0x4814 0644
0x4814 0648
0x4814 064C
0x4814 0650
0x4814 0654
ACRONYM
DEVICE_ID
-
REGISTER NAME
Device Identification
Reserved
INIT_PRESSURE_0
INIT_PRESSURE_1
-
L3 Initiator Pressure
L3 Initiator Pressure
Reserved
TPTC_CFG
DDR_CTRL
-
Transfer Controller Configuration
DDR Interface Control
Reserved
USB_CTRL
USB Control
USBPHY_CTRL0
-
USB0 Phy Control
Reserved
USBPHY_CTRL1
MAC_ID0_LO
MAC_ID0_HI
MAC_ID1_LO
MAC_ID1_HI
PCIE_CFG
USB1 Phy Control
Ethernet MAC Address 0
Ethernet MAC Address 0
Ethernet MAC Address 1
Ethernet MAC Address 1
PCIe Module Configuration
Reserved
-
CLK_CTRL
Input Oscillator Control
Audio Control
AUDIO_CTRL
-
Reserved
OCMEM_SLEEP
-
On-Chip Memory Sleep Mode Configuration
Reserved
0x4814 0658 - 0x4814 065C
0x4814 0660
HD_DAC_CTRL
HD_DACA_CAL
HD_DACB_CAL
HD_DACC_CAL
SD_DAC_CTRL
SD_DACA_CAL
SD_DACB_CAL
SD_DACC_CAL
SD_DACD_CAL
BANDGAP_CTRL
HW_EVT_SEL_GRP1
HW_EVT_SEL_GRP2
HW_EVT_SEL_GRP3
HW_EVT_SEL_GRP4
-
HD DAC Control
0x4814 0664
HD DAC A Calibration
HD DAC B Calibration
HD DAC C Calibration
SD DAC Control
0x4814 0668
0x4814 066C
0x4814 0670
0x4814 0674
SD DAC A Calibration
SD DAC B Calibration
SD DAC C Calibration
SD DAC D Calibration
DAC Band-gap Control
System Trace Hardware Event Select Group 1
System Trace Hardware Event Select Group 2
System Trace Hardware Event Select Group 3
System Trace Hardware Event Select Group 4
Reserved
0x4814 0678
0x4814 067C
0x4814 0680
0x4814 068C
0x4814 0690
0x4814 0694
0x4814 0698
0x4814 069C
0x4814 06A0 - 0x4814 06F4
0x4814 06F8
HDMI_OBSCLK_CTRL
SERDES_CTRL
UCB_CLK_CTL
PLL_OBSCLK_CTRL
-
HDMI Observe Clock Control
Serdes Control
0x4814 06FC
0x4814 0700
USB Clock Control
0x4814 0704
PLL Observe Clock Control
Reserved
0x4814 0708
0x4814 070C
DDR_RCD
RCD Power Enable/Disable
Reserved
0x4814 0710 - 0x4814 07FC
-
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4.2 Debugging Considerations
4.2.1 Pullup/Pulldown Resistors
Proper board design should ensure that input pins to the device always be at a valid logic level and not
floating. This may be achieved via pullup/pulldown resistors. The device features internal pullup (IPU) and
internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for external
pullup/pulldown resistors.
An external pullup/pulldown resistor needs to be used in the following situations:
•
Boot and Configuration Pins: If the pin is both routed out and 3-stated (not driven), an external
pullup/pulldown resistor is strongly recommended, even if the IPU/IPD matches the desired
value/state.
•
Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external
pullup/pulldown resistor to pull the signal to the opposite rail.
For the boot and configuration pins (listed in Table 3-1, Boot Terminal Functions), if they are both routed
out and 3-stated (not driven), it is strongly recommended that an external pullup/pulldown resistor be
implemented. Although, internal pullup/pulldown resistors exist on these pins and they may match the
desired configuration value, providing external connectivity can help ensure that valid logic levels are
latched on these device boot and configuration pins. In addition, applying external pullup/pulldown
resistors on the boot and configuration pins adds convenience to the user in debugging and flexibility in
switching operating modes.
Tips for choosing an external pullup/pulldown resistor:
•
Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure
to include the leakage currents of all the devices connected to the net, as well as any internal pullup or
pulldown resistors.
•
Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of
all inputs connected to the net. For a pullup resistor, this should be above the highest VIH level of all
inputs on the net. A reasonable choice would be to target the VOL or VOH levels for the logic family of
the limiting device; which, by definition, have margin to the VIL and VIH levels.
•
•
Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net
will reach the target pulled value when maximum current from all devices on the net is flowing through
the resistor. The current to be considered includes leakage current plus, any other internal and
external pullup/pulldown resistors on the net.
For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance
value of the external resistor. Verify that the resistance is small enough that the weakest output buffer
can drive the net to the opposite logic level (including margin).
•
•
Remember to include tolerances when selecting the resistor value.
For pullup resistors, also remember to include tolerances on the DVDD rail.
For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria.
Users should confirm this resistor value is correct for their specific application.
For most systems, a 20-kΩ resistor can be used to compliment the IPU/IPD on the boot and configuration
pins while meeting the above criteria. Users should confirm this resistor value is correct for their specific
application.
For most systems, a 20-kΩ resistor can also be used as an external PU/PD on the pins that have
IPUs/IPDs disabled and require an external PU/PD resistor while still meeting the above criteria. Users
should confirm this resistor value is correct for their specific application.
For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH), see
Section 6.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
Temperature.
110
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For the internal pullup/pulldown resistors for all device pins, see the peripheral/system-specific terminal
functions tables in Section 3.2.
4.3 Boot Sequence
The boot sequence is a process by which the device's memory is loaded with program and data sections,
and by which some of the device's internal registers are programmed with predetermined values. The boot
sequence is started automatically after each device-level global reset. For more details on device-level
global resets, see Section 7.2. There are several methods by which the memory and register initialization
can take place. Each of these methods is referred to as a boot mode. The boot mode to be used is
selected at reset. The device is booted through multiple means—primary bootloaders within internal ROM
or EMIF4, and secondary user bootloaders from peripherals or external memories. The maximum size of
the boot image is 255KB (ROM uses 1KB internally). Boot modes, pin configurations, and register
configurations required for booting the device, are described in the following subsections.
The following boot modes are supported:
•
•
•
•
•
•
•
NOR Flash boot (muxed and non-muxed, 8-bit or 16-bit)
NAND Flash boot (SLC and MLC with BCH ECC, 8-bit or 16-bit)
SPI boot (EEPROM or Flash, SPI mode 3, 24-bit)
SD boot (SD cards)
EMAC boot (TFTP client)
UART boot (X-modem client)
PCIe boot (client mode, PCIe 32 and PCIe 64).
The state of the device after boot is determined by sampling the input states of the BTMODE[4:0] pins
when device reset (POR or RESET) is deasserted. The sampled values are latched into the
CONTROL_STATUS register, which is part of the system configuration (SYSCFG) module.
The BTMODE [4:0] values determine the boot mode order according to Table 4-5. The first boot mode
listed for each BTMODE[4:0] configuration is executed as the primary boot mode. If the primary boot
mode fails, the second, third, and fourth boot modes are executed, in that order, until a successful boot is
completed.
Additional boot configuration pins determine the following system boot settings as shown in Table 3-1:
•
•
•
GPMC CS0 Default Bus Width
GPMC Wait Enable
GPMC Address/Data Multiplexing.
The GPMC CS0 default operation is determined by the CS0BW, CS0WAIT, and CS0MUX[1:0] inputs.
For more detailed information on booting the device, see the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7).
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Table 4-5. Boot Mode Order
BTMODE[4] = 1
MEMORY BOOTING PREFERRED
BTMODE[4] = 0
PERIPHERAL BOOTING PREFERRED
BTMODE[3:0]
FIRST
XIP(1)
XIPWAIT(1)
NAND
NAND
NAND
NANDI2C
SPI
SECOND
UART
UART
NANDI2C
NANDI2C
NANDI2C
SD
THIRD
EMAC
EMAC
SPI
FOURTH
SD
FIRST SECOND THIRD FOURTH
RESERVED RESERVED RESERVED RESERVED
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
SD
UART
UART
UART
EMAC
XIPWAIT(1)
SD
SPI
NANDI2C
SD
UART
SPI
NAND
XIP(1)
NAND
SD
UART
SPI
SPI
EMAC
SPI
NANDI2C
EMAC
UART
UART
PCIE_32
PCIE_64
UART
RESERVED RESERVED RESERVED RESERVED
RESERVED RESERVED RESERVED RESERVED
SD
EMAC
SD
SPI
EMAC
EMAC
SD
SPI
XIP(1)
SPI
SD
RESERVED
RESERVED
PCIE_32
PCIE_64
RESERVED RESERVED RESERVED
RESERVED RESERVED RESERVED
SPI
SD
RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED
RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED
RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED
RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED
RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED
GP Fast
EMAC
UART
PCIE_32
GP Fast
UART
EMAC
PCIE_64
External Boot
External Boot
(1) GPMC CS0 eXecute In Place (XIP) and eXecute In Place with Wait Monitoring (XIPWAIT) boot for NOR/OneNAND/ROM. For details,
see the AM389x Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
4.3.1 Boot Mode Registers
For details on the boot mode registers, see the AM389x Sitara ARM Processors Technical Reference
Manual (literature number SPRUGX7).
Table 4-6. Device Boot Registers Summary
HEX ADDRESS
0x4814 0040
ACRONYM
CONTROL_STATUS
BOOTSTAT
-
REGISTER NAME
Device Status
0x4814 0044
Device Boot Status
Reserved
0x4814 0048 - 0x4814 007C
4.4 Pin Multiplexing Control
Device-level pin multiplexing is controlled on a pin-by-pin basis by the MUXMODE bits of the PINCTRL1 -
PINCTRL321 registers in the SYSCFG module. The default state for each multiplexed pin is MUXMODE =
0x000.
Pin multiplexing selects which of several peripheral pin functions control the pin's IO buffer output data
values.
The input from each pin is routed to all of the peripherals that share the pin, regardless of the MUXMODE
setting. For details, see the table below and the MUXED column in the each of the Terminal Functions
tables in Section 3.2.
112
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4.4.1 PINCTRLx Register Descriptions
Table 4-7. PINCTRLx Register Definition
Bit
31:5
4
Field
Value Description
Reserved; Read returns 0
Reserved
PULLTYPESEL
Pad Pullup/Pulldown Type Selection
Pulldown selected
0
1
Pullup selected
3
PULLDIS
Pad Pullup/Pulldown Disable
Pullup/Pulldown enabled
Pullup/Pulldown disabled
Pad Functional Signal Mux Select
0
1
2:0
MUXMODE
Table 4-8. PINCTRLx Registers
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
011
0x4814 0800
0x4814 0804
0x4814 0808
0x4814 080C
0x4814 0810
0x4814 0814
0x4814 0818
0x4814 081C
0x4814 0820
0x4814 0824
0x4814 0828
0x4814 082C
0x4814 0830
0x4814 0834
0x4814 0838
0x4814 083C
0x4814 0840
0x4814 0844
0x4814 0848
0x4814 084C
PINCTRL1
PINCTRL2
PINCTRL3
PINCTRL4
PINCTRL5
PINCTRL6
PINCTRL7
PINCTRL8
PINCTRL9
PINCTRL10
PINCTRL11
PINCTRL12
PINCTRL13
PINCTRL14
PINCTRL15
PINCTRL16
PINCTRL17
PINCTRL18
PINCTRL19
PINCTRL20
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VOUT[1]_C[3]
VOUT[1]_C[4]
VOUT[1]_C[5]
VOUT[1]_C[6]
VOUT[1]_C[7]
VIN[1]A_D[14]
VIN[0]A_D[20]
VIN[0]A_D[21]
VIN[0]A_D[22]
VIN[0]A_D[23]
VOUT[1]_Y_YC[6]
VOUT[1]_Y_YC[7]
VOUT[1]_Y_YC[8]
VOUT[1]_Y_YC[9]
VOUT[1]_C[2]
VIN[1]A_D[9]
VIN[1]A_D[10]
VIN[1]A_D[11]
VIN[1]A_D[12]
VIN[1]A_D[13]
VIN[0]B_DE
VIN[0]B_FLD
VIN[0]B_VSYNC
VIN[0]B_HSYNC
VIN[1]A_D[4]
VIN[1]A_D[5]
VIN[1]A_D[6]
VIN[1]A_D[7]
VIN[1]A_D[8]
VOUT[1]_HSYNC
(silicon revision 1.x)
0x4814 0850
0x4814 0854
0x4814 0858
PINCTRL21
PINCTRL22
PINCTRL23
0
0
0
0
0
0
VIN[1]A_D[15]
VIN[1]A_HSYNC
VIN[1]A_VSYNC
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)
VIN[0]A_D[16]
VOUT[1]_FLD
VOUT[1]_VSYNC
(silicon revision 1.x)
VIN[0]A_D[17]
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)
0x4814 085C
0x4814 0860
0x4814 0864
0x4814 0868
PINCTRL24
PINCTRL25
PINCTRL26
PINCTRL27
0
0
0
0
0
0
0
0
VIN[0]A_D[18]
VIN[0]A_D[19]
VIN[1]A_FLD
VIN[1]A_DE
VOUT[1]_C[8]
VOUT[1]_C[9]
VOUT[0]_R_CR[0]
VOUT[0]_B_CB_C[0]
VOUT[1]_C[8]
VOUT[1]_C[9]
VOUT[1]_CLK
VIN[1]B_HSYNC_DE
VOUT[1]_HSYNC
(silicon revision 1.x)
0x4814 086C
PINCTRL28
0
0
VOUT[0]_B_CB_C[1]
VOUT[1]_AVID
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)
VOUT[1]_VSYNC
(silicon revision 1.x)
0x4814 0870
0x4814 0874
PINCTRL29
PINCTRL30
0
0
0
0
VOUT[0]_G_Y_YC[0]
VOUT[0]_G_Y_YC[1]
VIN[1]B_VSYNC
VIN[1]B_FLD
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)
VOUT[1]_FLD
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Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
011
0x4814 0878
0x4814 087C
0x4814 0880
0x4814 0884
0x4814 0888
0x4814 088C
0x4814 0890
PINCTRL31
PINCTRL32
PINCTRL33
PINCTRL34
PINCTRL35
PINCTRL36
PINCTRL37
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VOUT[1]_AVID
VIN[0]A_HSYNC
VIN[0]A_VSYNC
VIN[0]A_FLD
VIN[1]B_CLK
VIN[0]A_DE
VOUT[0]_HSYNC
VOUT[0]_VSYNC
VOUT[0]_FLD
(silicon revision 1.x)
0x4814 0894
0x4814 0898
PINCTRL38
PINCTRL39
0
0
0
0
DAC_VSYNC_VOUT[0]_
FLD
(silicon revision 2.x)
VOUT[0]_AVID
(silicon revision 1.x)
DAC_HSYNC_VOUT[0]_
AVID
(silicon revision 2.x)
0x4814 089C
0x4814 08A0
0x4814 08A4
0x4814 08A8
0x4814 08AC
0x4814 08B0
0x4814 08B4
0x4814 08B8
0x4814 08BC
0x4814 08C0
0x4814 08C4
0x4814 08C8
0x4814 08CC
0x4814 08D0
0x4814 08D4
0x4814 08D8
0x4814 08DC
0x4814 08E0
0x4814 08E4
0x4814 08E8
0x4814 08EC
0x4814 08F0
0x4814 08F4
0x4814 08F8
0x4814 08FC
0x4814 0900
0x4814 0904
0x4814 0908
0x4814 090C
0x4814 0910
0x4814 0914
0x4814 0918
0x4814 091C
0x4814 0920
0x4814 0924
0x4814 0928
0x4814 092C
0x4814 0930
0x4814 0934
0x4814 0938
PINCTRL40
PINCTRL41
PINCTRL42
PINCTRL43
PINCTRL44
PINCTRL45
PINCTRL46
PINCTRL47
PINCTRL48
PINCTRL49
PINCTRL50
PINCTRL51
PINCTRL52
PINCTRL53
PINCTRL54
PINCTRL55
PINCTRL56
PINCTRL57
PINCTRL58
PINCTRL59
PINCTRL60
PINCTRL61
PINCTRL62
PINCTRL63
PINCTRL64
PINCTRL65
PINCTRL66
PINCTRL67
PINCTRL68
PINCTRL69
PINCTRL70
PINCTRL71
PINCTRL72
PINCTRL73
PINCTRL74
PINCTRL75
PINCTRL76
PINCTRL77
PINCTRL78
PINCTRL79
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
1
0
0
0
0
0
VOUT[0]_R_CR[1]
VOUT[1]_CLK
VOUT[1]_Y_YC[2]
VOUT[1]_Y_YC[3]
VOUT[1]_Y_YC[4]
VOUT[1]_Y_YC[5]
EMAC[1]_RXCLK
EMAC[1]_RXD[0]
EMAC[1]_RXD[1]
EMAC[1]_RXD[2]
EMAC[1]_RXD[3]
EMAC[1]_RXD[4]
EMAC[1]_RXD[5]
EMAC[1]_RXD[6]
EMAC[1]_RXD[7]
EMAC[1]_RXDV
EMAC[1]_GMTCLK
EMAC[1]_TXD[0]
EMAC[1]_TXD[1]
EMAC[1]_TXD[2]
EMAC[1]_TXD[3]
EMAC[1]_TXD[4]
EMAC[1]_TXD[5]
EMAC[1]_TXD[6]
EMAC[1]_TXD[7]
EMAC[1]_TXEN
EMAC[1]_TXCLK
EMAC[1]_COL
VIN[1]A_CLK
VIN[1]A_D[0]
VIN[1]A_D[1]
VIN[1]A_D[2]
VIN[1]A_D[3]
EMAC[1]_CRS
EMAC[1]_RXER
114
Device Configurations
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HEX ADDRESS
SPRS681E –OCTOBER 2010–REVISED JULY 2012
Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
011
0x4814 093C
0x4814 0940
0x4814 0944
0x4814 0948
0x4814 094C
0x4814 0950
0x4814 0954
0x4814 0958
0x4814 095C
0x4814 0960
0x4814 0964
0x4814 0968
0x4814 096C
0x4814 0970
0x4814 0974
0x4814 0978
0x4814 097C
0x4814 0980
0x4814 0984
0x4814 0988
0x4814 098C
0x4814 0990
0x4814 0994
0x4814 0998
0x4814 099C
0x4814 09A0
0x4814 09A4
0x4814 09A8
0x4814 09AC
0x4814 09B0
0x4814 09B4
0x4814 09B8
0x4814 09BC
0x4814 09C0
0x4814 09C4
0x4814 09C8
0x4814 09CC
0x4814 09D0
0x4814 09D4
0x4814 09D8
0x4814 09DC
0x4814 09E0
0x4814 09E4
0x4814 09E8
0x4814 09EC
0x4814 09F0
0x4814 09F4
0x4814 09F8
0x4814 09FC
0x4814 0A00
0x4814 0A04
0x4814 0A08
0x4814 0A0C
0x4814 0A10
0x4814 0A14
PINCTRL80
PINCTRL81
PINCTRL82
PINCTRL83
PINCTRL84
PINCTRL85
PINCTRL86
PINCTRL87
PINCTRL88
PINCTRL89
PINCTRL90
PINCTRL91
PINCTRL92
PINCTRL93
PINCTRL94
PINCTRL95
PINCTRL96
PINCTRL97
PINCTRL98
PINCTRL99
PINCTRL100
PINCTRL101
PINCTRL102
PINCTRL103
PINCTRL104
PINCTRL105
PINCTRL106
PINCTRL107
PINCTRL108
PINCTRL109
PINCTRL110
PINCTRL111
PINCTRL112
PINCTRL113
PINCTRL114
PINCTRL115
PINCTRL116
PINCTRL117
PINCTRL118
PINCTRL119
PINCTRL120
PINCTRL121
PINCTRL122
PINCTRL123
PINCTRL124
PINCTRL125
PINCTRL126
PINCTRL127
PINCTRL128
PINCTRL129
PINCTRL130
PINCTRL131
PINCTRL132
PINCTRL133
PINCTRL134
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
VIN[0]A_CLK
VIN[0]B_CLK
VIN[0]A_D[0]
VIN[0]A_D[1]
VIN[0]A_D[2]
VIN[0]A_D[3]
VIN[0]A_D[4]
VIN[0]A_D[5]
VIN[0]A_D[6]
VIN[0]A_D[7]
VIN[0]A_D[8]
VIN[0]A_D[9]
VIN[0]A_D[10]
VIN[0]A_D[11]
VIN[0]A_D[12]
VIN[0]A_D[13]
VIN[0]A_D[14]
VIN[0]A_D[15]
VOUT[0]_CLK
VOUT[0]_G_Y_YC[2]
VOUT[0]_G_Y_YC[3]
VOUT[0]_G_Y_YC[4]
VOUT[0]_G_Y_YC[5]
VOUT[0]_G_Y_YC[6]
VOUT[0]_G_Y_YC[7]
VOUT[0]_G_Y_YC[8]
VOUT[0]_G_Y_YC[9]
VOUT[0]_B_CB_C[2]
VOUT[0]_B_CB_C[3]
VOUT[0]_B_CB_C[4]
VOUT[0]_B_CB_C[5]
VOUT[0]_B_CB_C[6]
VOUT[0]_B_CB_C[7]
VOUT[0]_B_CB_C[8]
VOUT[0]_B_CB_C[9]
VOUT[0]_R_CR[2]
VOUT[0]_R_CR[3]
VOUT[0]_R_CR[4]
VOUT[0]_R_CR[5]
VOUT[0]_R_CR[6]
VOUT[0]_R_CR[7]
VOUT[0]_R_CR[8]
VOUT[0]_R_CR[9]
MCA[0]_ACLKR
MCA[0]_AHCLKR
MCA[0]_AFSR
VOUT[0]_HSYNC
VOUT[0]_VSYNC
VOUT[0]_FLD
VOUT[1]_Y_YC[2]
VOUT[1]_Y_YC[3]
VOUT[1]_Y_YC[4]
VOUT[1]_Y_YC[5]
VOUT[1]_Y_YC[6]
VOUT[1]_Y_YC[7]
VOUT[1]_Y_YC[8]
VOUT[1]_Y_YC[9]
VOUT[0]_AVID
VOUT[0]_G_Y_YC[0]
VOUT[0]_G_Y_YC[1]
VOUT[0]_B_CB_C[0]
VOUT[0]_B_CB_C[1]
MCA[0]_ACLKX
MCA[0]_ACLKHX
MCA[0]_AFSX
MCA[0]_AMUTE
MCA[0]_AXR[0]
MCA[0]_AXR[1]
Copyright © 2010–2012, Texas Instruments Incorporated
Device Configurations
115
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
www.ti.com
Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
011
0x4814 0A18
0x4814 0A1C
0x4814 0A20
0x4814 0A24
0x4814 0A28
0x4814 0A2C
0x4814 0A30
0x4814 0A34
0x4814 0A38
0x4814 0A3C
0x4814 0A40
0x4814 0A44
0x4814 0A48
0x4814 0A4C
0x4814 0A50
0x4814 0A54
0x4814 0A58
0x4814 0A5C
0x4814 0A60
0x4814 0A64
0x4814 0A68
0x4814 0A6C
0x4814 0A70
0x4814 0A74
0x4814 0A78
0x4814 0A7C
0x4814 0A80
0x4814 0A84
0x4814 0A88
0x4814 0A8C
0x4814 0A90
0x4814 0A94
0x4814 0A98
0x4814 0A9C
0x4814 0AA0
0x4814 0AA4
0x4814 0AA8
0x4814 0AAC
0x4814 0AB0
0x4814 0AB4
0x4814 0AB8
0x4814 0ABC
0x4814 0AC0
0x4814 0AC4
0x4814 0AC8
0x4814 0ACC
0x4814 0AD0
0x4814 0AD4
0x4814 0AD8
0x4814 0ADC
0x4814 0AE0
0x4814 0AE4
0x4814 0AE8
0x4814 0AEC
0x4814 0AF0
PINCTRL135
PINCTRL136
PINCTRL137
PINCTRL138
PINCTRL139
PINCTRL140
PINCTRL141
PINCTRL142
PINCTRL143
PINCTRL144
PINCTRL145
PINCTRL146
PINCTRL147
PINCTRL148
PINCTRL149
PINCTRL150
PINCTRL151
PINCTRL152
PINCTRL153
PINCTRL154
PINCTRL155
PINCTRL156
PINCTRL157
PINCTRL158
PINCTRL159
PINCTRL160
PINCTRL161
PINCTRL162
PINCTRL163
PINCTRL164
PINCTRL165
PINCTRL166
PINCTRL167
PINCTRL168
PINCTRL169
PINCTRL170
PINCTRL171
PINCTRL172
PINCTRL173
PINCTRL174
PINCTRL175
PINCTRL176
PINCTRL177
PINCTRL178
PINCTRL179
PINCTRL180
PINCTRL181
PINCTRL182
PINCTRL183
PINCTRL184
PINCTRL185
PINCTRL186
PINCTRL187
PINCTRL188
PINCTRL189
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
0
0
0
1
1
0
0
0
1
0
0
MCA[0]_AXR[2]
MCA[0]_AXR[3]
MCA[0]_AXR[4]
MCA[0]_AXR[5]
MCA[1]_ACLKR
MCA[1]_AHCLKR
MCA[1]_AFSR
MCA[1]_ACLKX
MCA[1]_ACLKHX
MCA[1]_AFSX
MCA[1]_AMUTE
MCA[1]_AXR[0]
MCA[1]_AXR[1]
MCA[2]_ACLKR
MCA[2]_AHCLKR
MCA[2]_AFSR
MCA[2]_ACLKX
MCA[2]_ACLKHX
MCA[2]_AFSX
MCA[2]_AMUTE
MCA[2]_AXR[0]
MCA[2]_AXR[1]
SD_POW
MCB_FSX
MCB_FSR
MCB_DX
MCB_DR
MCB_CLKR
MCB_CLKS
MCB_CLKX
MCB_CLKX
MCB_CLKR
MCB_CLKS
MCB_DR
MCB_FSR
MCB_FSX
MCB_DX
GPMC_A[14]
GPMC_A[13]
GPMC_A[21]
GPMC_A[20]
GPMC_A[19]
GPMC_A[18]
GPMC_A[17]
GPMC_A[16]
GPMC_A[15]
GP1[0]
GP1[1]
GP1[2]
GP1[3]
GP1[4]
GP1[5]
GP1[6]
GP1[7]
GP1[8]
SD_CLK
SD_CMD
SD_DAT[0]
SD_DAT[1]_SDIRQ
SD_DAT[2]_SDRW
SD_DAT[3]
SD_SDCD
SD_SDWP
SPI_SCLK
SPI_SCS[0]
SPI_SCS[1]
GPMC_A[23]
GPMC_A[22]
GPMC_A[21]
SPI_SCS[2]
SPI_SCS[3]
GP1[22]
SPI_D[0]
SPI_D[1]
UART0_RXD
UART0_TXD
UART0_RTS
UART0_CTS
UART0_DTR
UART0_DSR
UART0_DCD
UART0_RIN
GP1[27]
GP1[28]
GPMC_A[20]
GPMC_A[19]
GPMC_A[18]
GPMC_A[17]
GPMC_A[26]
GPMC_A[25]
GPMC_A[14]
GPMC_A[13]
GPMC_A[12]
GPMC_A[24]
GPMC_A[23]
GPMC_A[22]
GPMC_A[20]
GPMC_A[19]
GPMC_A[18]
GPMC_A[17]
GP1[16]
GP1[17]
GP1[18]
GP1[19]
UART1_RXD
UART1_TXD
UART1_RTS
UART1_CTS
UART2_RXD
UART2_TXD
UART2_RTS
UART2_CTS
GP1[25]
GP1[26]
GPMC_A[15]
GPMC_A[16]
GPMC_A[27]
GPMC_A[26]
GPMC_A[25]
GP1[9]
GP1[23]
GP1[24]
116
Device Configurations
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): AM3894 AM3892
AM3894
AM3892
www.ti.com
HEX ADDRESS
SPRS681E –OCTOBER 2010–REVISED JULY 2012
Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
011
0x4814 0AF4
0x4814 0AF8
0x4814 0AFC
0x4814 0B00
0x4814 0B04
0x4814 0B08
0x4814 0B0C
0x4814 0B10
0x4814 0B14
0x4814 0B18
0x4814 0B1C
0x4814 0B20
0x4814 0B24
0x4814 0B28
0x4814 0B2C
0x4814 0B30
0x4814 0B34
0x4814 0B38
0x4814 0B3C
0x4814 0B40
0x4814 0B44
0x4814 0B48
0x4814 0B4C
0x4814 0B50
0x4814 0B54
0x4814 0B58
0x4814 0B5C
0x4814 0B60
0x4814 0B64
0x4814 0B68
0x4814 0B6C
0x4814 0B70
0x4814 0B74
0x4814 0B78
0x4814 0B7C
0x4814 0B80
0x4814 0B84
0x4814 0B88
0x4814 0B8C
0x4814 0B90
0x4814 0B94
0x4814 0B98
0x4814 0B9C
0x4814 0BA0
0x4814 0BA4
0x4814 0BA8
0x4814 0BAC
0x4814 0BB0
0x4814 0BB4
0x4814 0BB8
0x4814 0BBC
0x4814 0BC0
0x4814 0BC4
0x4814 0BC8
0x4814 0BCC
PINCTRL190
PINCTRL191
PINCTRL192
PINCTRL193
PINCTRL194
PINCTRL195
PINCTRL196
PINCTRL197
PINCTRL198
PINCTRL199
PINCTRL200
PINCTRL201
PINCTRL202
PINCTRL203
PINCTRL204
PINCTRL205
PINCTRL206
PINCTRL207
PINCTRL208
PINCTRL209
PINCTRL210
PINCTRL211
PINCTRL212
PINCTRL213
PINCTRL214
PINCTRL215
PINCTRL216
PINCTRL217
PINCTRL218
PINCTRL219
PINCTRL220
PINCTRL221
PINCTRL222
PINCTRL223
PINCTRL224
PINCTRL225
PINCTRL226
PINCTRL227
PINCTRL228
PINCTRL229
PINCTRL230
PINCTRL231
PINCTRL232
PINCTRL233
PINCTRL234
PINCTRL235
PINCTRL236
PINCTRL237
PINCTRL238
PINCTRL239
PINCTRL240
PINCTRL241
PINCTRL242
PINCTRL243
PINCTRL244
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
1
1
0
1
1
0
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
GPMC_A[22]
GPMC_A[26]
GPMC_A[25]
GP1[13]
GP1[10]
GP1[11]
GP1[12]
GPMC_A[23]
GPMC_A[24]
GPMC_A[16]
GPMC_A[15]
GPMC_A[14]
GPMC_A[13]
GP0[25]
GP1[14]
GP1[15]
GP0[21]
GP0[22]
GP0[23]
GP0[24]
GPMC_A[21]
GPMC_A[12]
GP0[28]
GP0[26]
GP0[27]
TIM4_OUT
TIM5_OUT
GP0[29]
TIM6_OUT
GPMC_A[24]
GPMC_A[12]
GP0[30]
GP0[31]
TIM7_OUT
GPMC_CS[0]
GPMC_CS[1]
GPMC_CS[2]
GPMC_CS[3]
GPMC_CS[4]
GPMC_CS[5]
GPMC_WE
GP1[21]
GPMC_A[12]
GPMC_OE_RE
GPMC_BE0_CLE
GPMC_BE1
GPMC_ADV_ALE
GPMC_DIR
GPMC_WP
GPMC_WAIT
GPMC_A[0]
GPMC_A[1]
GPMC_A[2]
GPMC_A[3]
GPMC_A[4]
GPMC_A[5]
GPMC_A[6]
GPMC_A[7]
GPMC_A[8]
GPMC_A[9]
GPMC_A[10]
GPMC_A[11]
GPMC_A[27]
GPMC_D[0]
GPMC_D[1]
GPMC_D[2]
GPMC_D[3]
GPMC_D[4]
GPMC_D[5]
GPMC_D[6]
GPMC_D[7]
GPMC_D[8]
GPMC_D[9]
GPMC_D[10]
GP1[20]
GP0[8]
GP0[9]
GP0[10]
GP0[11]
GP0[12]
GP0[13]
GP0[14]
GP0[15]
GP0[16]
GP0[17]
GP0[18]
GP0[19]
GP0[20]
Copyright © 2010–2012, Texas Instruments Incorporated
Device Configurations
117
Submit Documentation Feedback
Product Folder Link(s): AM3894 AM3892
AM3894
AM3892
SPRS681E –OCTOBER 2010–REVISED JULY 2012
www.ti.com
Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
011
0x4814 0BD0
0x4814 0BD4
0x4814 0BD8
0x4814 0BDC
0x4814 0BE0
0x4814 0BE4
0x4814 0BE8
0x4814 0BEC
0x4814 0BF0
0x4814 0BF4
0x4814 0BF8
0x4814 0BFC
0x4814 0C00
0x4814 0C04
0x4814 0C08
0x4814 0C0C
0x4814 0C10
0x4814 0C14
0x4814 0C18
0x4814 0C1C
0x4814 0C20
0x4814 0C24
0x4814 0C28
0x4814 0C2C
0x4814 0C30
0x4814 0C34
0x4814 0C38
0x4814 0C3C
0x4814 0C40
0x4814 0C44
0x4814 0C48
0x4814 0C4C
0x4814 0C50
0x4814 0C54
0x4814 0C58
0x4814 0C5C
0x4814 0C60
0x4814 0C64
0x4814 0C68
0x4814 0C6C
0x4814 0C70
0x4814 0C74
0x4814 0C78
0x4814 0C7C
0x4814 0C80
0x4814 0C84
0x4814 0C88
0x4814 0C8C
0x4814 0C90
0x4814 0C94
0x4814 0C98
0x4814 0C9C
0x4814 0CA0
0x4814 0CA4
PINCTRL245
PINCTRL246
PINCTRL247
PINCTRL248
PINCTRL249
PINCTRL250
PINCTRL251
PINCTRL252
PINCTRL253
PINCTRL254
PINCTRL255
PINCTRL256
PINCTRL257
PINCTRL258
PINCTRL259
PINCTRL260
PINCTRL261
PINCTRL262
PINCTRL263
PINCTRL264
PINCTRL265
PINCTRL266
PINCTRL267
PINCTRL268
PINCTRL269
PINCTRL270
PINCTRL271
PINCTRL272
PINCTRL273
PINCTRL274
PINCTRL275
PINCTRL276
PINCTRL277
PINCTRL278
PINCTRL279
PINCTRL280
PINCTRL281
PINCTRL282
PINCTRL283
PINCTRL284
PINCTRL285
PINCTRL286
PINCTRL287
PINCTRL288
PINCTRL289
PINCTRL290
PINCTRL291
PINCTRL292
PINCTRL293
PINCTRL294
PINCTRL295
PINCTRL296
PINCTRL297
PINCTRL298
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
GPMC_D[11]
GPMC_D[12]
GPMC_D[13]
GPMC_D[14]
GPMC_D[15]
GPMC_CLK
GP1[29]
EMAC[0]_COL
EMAC[0]_CRS
EMAC[0]_GMTCLK
EMAC[0]_RXCLK
EMAC[0]_RXD[0]
EMAC[0]_RXD[1]
EMAC[0]_RXD[2]
EMAC[0]_RXD[3]
EMAC[0]_RXD[4]
EMAC[0]_RXD[5]
EMAC[0]_RXD[6]
EMAC[0]_RXD[7]
EMAC[0]_RXDV
EMAC[0]_RXER
EMAC[0]_TXCLK
EMAC[0]_TXD[0]
EMAC[0]_TXD[1]
EMAC[0]_TXD[2]
EMAC[0]_TXD[3]
EMAC[0]_TXD[4]
EMAC[0]_TXD[5]
EMAC[0]_TXD[6]
EMAC[0]_TXD[7]
EMAC[0]_TXEN
MDIO_MCLK
MDIO_MDIO
I2C[0]_SCL
I2C[0]_SDA
I2C[1]_SCL
I2C[1]_SDA
GP0[0]
GP0[1]
GP0[2]
GP0[3]
TCLKIN
GP0[4]
GP0[5]
MCA[2]_AMUTEIN
MCA[1]_AMUTEIN
MCA[0]_AMUTEIN
GPMC_A[24]
GPMC_A[23]
GP0[6]
GP0[7]
118
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Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
011
SATA_ACT0_LED
(silicon revision 1.x)
0x4814 0CA8
PINCTRL299
0
0
GP1[30]
SATA_ACT1_LED
(silicon revision 2.x)
SATA_ACT1_LED
(silicon revision 1.x)
0x4814 0CAC
PINCTRL300
0
0
GP1[31]
SATA_ACT0_LED
(silicon revision 2.x)
0x4814 0CB0
0x4814 0CB4
0x4814 0CB8
0x4814 0CBC
0x4814 0CC0
0x4814 0CC4
0x4814 0CC8
0x4814 0CCC
0x4814 0CD0
0x4814 0CD4
0x4814 0CD8
0x4814 0CDC
0x4814 0CE0
0x4814 0CE4
0x4814 0CE8
0x4814 0CEC
0x4814 0CF0
0x4814 0CF4
0x4814 0CF8
0x4814 0CFC
0x4814 0D00
0x4814 0D04
0x4814 0D08
PINCTRL301
PINCTRL302
PINCTRL303
PINCTRL304
PINCTRL305
PINCTRL306
PINCTRL307
PINCTRL308
PINCTRL309
PINCTRL310
PINCTRL311
PINCTRL312
PINCTRL313
PINCTRL314
PINCTRL315
PINCTRL316
PINCTRL317
PINCTRL318
PINCTRL319
PINCTRL320
PINCTRL321
PINCTRL322
PINCTRL323
0
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
0
0
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
HDMI_SCL
HDMI_SDA
HDMI_CEC
HDMI_HPDET
TCLK
RTCK
TDI
TDO
TMS
TRST
EMU0
EMU1
EMU2
EMU3
EMU4
RESET
NMI
RSTOUT
WD_OUT
CLKOUT
CLKIN32
USB0_DRVVBUS
USB1_DRVVBUS
0x4814 0D0C -
0x4814 0FFF
Reserved
4.5 How to Handle Unused Pins
When device signal pins are unused in the system, they can be left unconnected unless otherwise
instructed in the Terminal Functions tables. For unused input pins, the internal pull resistor should be
enabled, or an external pull resistor should be used, to prevent floating inputs. All supply pins must always
be connected to the correct voltage, even when their associated signal pins are unused, as instructed in
the Terminal Functions tables in Section 3.2.
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5 System Interconnect
The L3 interconnect allows the sharing of resources, such as peripherals and external or on-chip
memories, between all the initiators of the platform. The L4 interconnects control access to the
peripherals.
Transfers between initiators and targets across the platform are physically conditioned by the chip
interconnect.
5.1 L3 Interconnect
The L3 topology is driven by performance requirements, bus types, and clocking structure. Figure 5-1
shows the interconnect of the device and the main modules and subsystems in the platform. Arrows
indicate the master/slave relationship, not data flow. Master/slave connectivity is shown in Table 5-1.
Initiator Ports
Target Ports
L4 Periph
High Speed
USB 2.0
0/1
Debug
DAP
L4 Periph
Standard
SATA
Debug
USB 2.0
EMAC0
EMAC1
HDMI 1.3
Tx
McBSP
McASP0
McASP2
GPMC
PCIe
Gen2
Media
Ctrl
McASP1
SGX530(A)
HDVPSS
OCMC
RAM0
EDMA
4 Channels
OCMC
RAM1
PCIe
Gen2
Media
Ctrl
SGX530(A)
EDMA
Config
Cortex™-
A8
DMM
DDR
A. SGX530 is available only on the AM3894 device.
Figure 5-1. Interconnect Overview
120
System Interconnect
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Table 5-1. L3 Master/Slave Connectivity(1)(2)
SLAVES
MASTERS
ARM Cortex-A8 M1
(128-bit)
X
ARM Cortex-A8 M2
(64-bit)
X
X
X
X
X
X
X
X
X
X
X
X
X
HDVPSS Mstr0
HDVPSS Mstr1
SGX530 BIF
X
X
X
X
X
SATA
X
X
X
X
X
X
X
X
X
EMAC0 Rx/Tx
EMAC1 Rx/Tx
USB2.0 DMA
USB2.0 Queue Mgr
PCIe Gen2
X
X
X
X
X
X
X
X
X
X
X
EDMA TPTC0
EDMA TPTC1
EDMA TPTC2
EDMA TPTC3
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
(1) X = Connection exists.
(2) SGX530 is available only on the AM3894 device.
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5.2 L4 Interconnect
The L4 interconnect is a non-blocking peripheral interconnect that provides low-latency access to a large
number of low-bandwidth, physically-dispersed target cores. The L4 can handle incoming traffic from up to
four initiators and can distribute those communication requests to and collect related responses from up to
63 targets.
The device provides three interfaces with L3 interconnect for high-speed peripheral and standard
peripheral. Figure 5-2 and Table 5-2 show the L4 bus architecture and memory-mapped peripherals.
L3 Interconnect
L4 High Speed
L4 Standard
Spinlock
PRCM
EMAC0
EMAC1
SATA
I2C0
I2C1
SPI
Control
ELM
UART0
UART1
Timer1
Timer2
Timer3
Timer4
Timer5
Timer6
Timer7
GPIO0
HDMIphy
OCPWP
McASP0
McASP1
McASP2
Mailbox
GPIO1
SD/SDIO
WDT
RTC
SmartReflex0
SmartReflex1
DDR_CFG0
DDR_CFG1
250-MHz CLK domain
125-MHz CLK domain
A. SGX530 is available only on the AM3894 device.
Figure 5-2. L4 Architecture
122
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Table 5-2. L4 Peripheral Connectivity(1)
MASTERS
L4 PERIPHERALS
Cortex-A8 M2
(64-bit)
EDMA TPTC0
EDMA TPTC1
EDMA TPTC2
EDMA TPTC3
L4 High-Speed Peripherals Port 0/1
EMAC0
Port0
Port0
Port0
Port1
Port1
Port1
Port0
Port0
Port0
Port1
Port1
Port1
Port0
Port0
Port0
EMAC1
SATA
L4 Standard-Speed Peripherals Port 0/1
I2C0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port1
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
Port0
I2C1
SPI
UART0
UART1
Timer1
Timer2
Timer3
Timer4
Timer5
Timer6
Timer7
GPIO0
GPIO1
SD/SDIO
WDT
RTC
SmartReflex0
SmartReflex1
DDR_CFG0
DDR_CFG1
Spinlock
PRCM
Control/Top Regs
ELM
HDMIphy
OCPWP
McASP0
McASP1
McASP2
Mailbox
Port1
Port1
Port1
Port1
Port0
Port0
Port0
Port0
Port1
Port1
Port1
Port1
Port0
Port0
Port0
Port0
(1) X, Port0, Port1 = Connection exists.
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6 Device Operating Conditions
6.1 Absolute Maximum Ratings (Unless Otherwise Noted)(1)(2)
MIN
-0.3
-0.3
MAX
1.35
1.2
UNIT
V
USB PHYs, 0.9 V (VDD_USB_0P9)
Core (CVDD, CVDDC, VDDT_SATA,
VDDT_PCIE, VDDA_HDMI,
V
VDDA_HD_1P0, VDDA_SD_1P0)
I/O, 1.5 V (VDDA_PLL, VDDR_SATA,
VDDR_PCIE, DVDD_DDR0,
-0.3
-0.3
2.45
2.45
V
V
Steady State Supply voltage
ranges:
DVDD_DDR1)(3)
I/O, 1.8 V (DVDD1P8,
DEVOSC_DVDD18, VDD_USB0_1P8,
VDD_USB1_1P8, VDDA_REF_1P8,
VDDA_HD_1P8, VDDA_SD_1P8,
DVDD_DDR0, DVDD_DDR1)(3)
I/O, 3.3 V (DVDD_3P3,
VDD_USB0_3P3, VDD_USB1_3P3)
0
3.8
V
V
V
V I/O, 1.5-V pins
-0.3
2.45
-0.3 DVDD_DDRx + 0.3(3)
V I/O, 1.8-V pins
-0.3
-0.3
2.45
DVDD1P8 + 0.3
-0.3 DVDD_DDRx + 0.3(3)
Input and Output voltage ranges:
V I/O, 3.3-V pins
(Steady State)
-0.3
-0.3
3.8
V
V
DVDD_3P3 + 0.3
V I/O, 3.3-V pins
(Transient Overshoot/Undershoot)
20% of DVDD_3P3 for up to 20% of the
signal period
(default)
0
95
Operating junction temperature
range, TJ:(4)
°C
extended temperature
-40
-55
105
150
Storage temperature range, Tstg
:
(default)
°C
V
HBM (Human Body Model)(6)
CDM (Charged-Device Model)(7)
±1000
±250
(5)
ESD stress voltage, VESD
:
V
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS.
(3) For supply voltage pins, DVDD_DDRx:
•
•
1.5 V is used for DDR3 SDRAM.
1.8 V is used for DDR2 SDRAM.
(4) A heat dissipation solution is required for proper device operation. Thermal performance of the overall system must be carefully
considered to ensure conformance with the recommended operating conditions. Heat generated by this device must be removed with
the help of heat sinks, heat spreaders, and/or airflow. SmartReflex can significantly lower the power consumption of this device and its
use is required for proper device operation. A thermal model can be provided for thermal simulation to estimate the system thermal
environment. Contact your local TI representative for availability.
(5) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.
(6) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001-2010. JEDEC document JEP155 states that 500 V HBM allows
safe manufacturing with a standard ESD control process, and manufacturing with less than 500 V HBM is possible if necessary
precautions are taken. Pins listed as 1000 V may actually have higher performance.
(7) Level listed above is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe
manufacturing with a standard ESD control process. Pins listed as 250 V may actually have higher performance.
124
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6.2 Recommended Operating Conditions
MIN
NOM
MAX UNIT
Supply voltage, Variable Core, Adaptive Voltage
CVDD
0.8
1.05
V
Scaling (CVDD)(1)
Supply voltage, Constant Core (CVDDC,
CVDDC
VDDT_SATA, VDDT_PCIE, VDDA_HDMI,
VDDA_HD_1P0, VDDA_SD_1P0)
0.95
1
1.05
V
Supply voltage, I/O, 3.3 V (DVDD_3P3,
VDD_USB0_3P3, VDD_USB1_3P3)
(except I2C pins)
3.13
3.13
3.3
3.3
3.47
3.47
V
V
Supply voltage, I/O, I2C (DVDD_3P3)
Supply voltage, I/O, 1.8 V (DVDD1P8,
DEVOSC_DVDD18, VDD_USB0_1P8,
VDD_USB1_1P8, VDDA_REF_1P8,
VDDA_HD_1P8, VDDA_SD_1P8, DVDD_DDR0,
DVDD_DDR1)(2)
DVDD
1.71
1.8
1.89
V
Supply voltage, I/O, 1.5 V (VDDA_PLL,
VDDR_SATA, VDDR_PCIE, DVDD_DDR0,
DVDD_DDR1)(2)
1.43
1.5
1.58
V
Supply voltage, I/O, 0.9 V (VDD_USB_0P9)
0.85
0
0.9
0
0.95
0
V
V
V
Supply ground (VSS, VSSA_PLL, VSSA_HD,
VSSA_SD, VSSA_REF_1P8, DEVOSC_VSS)(3)
DDR2/3 reference voltage(4)
VSS
DDR_VREF
0.48DVDD_DDRx
2
0.5DVDD_DDRx 0.52DVDD_DDRx
High-level input voltage, 3.3 V (except I2C pins)
High-level input voltage, I2C
VIH
0.7DVDD_3P3
0.65DVDD1P8
V
V
High-level input voltage, 1.8 V
Low-level input voltage, 3.3 V (except I2C pins)
Low-level input voltage, I2C
0.8
0.3DVDD_3P3
0.35DVDD1P8
-6
VIL
Low-level input voltage, 1.8 V
High-level output current
6-mA I/O buffers
DDR[0], DDR[1]
buffers @ 50-Ω
impedance setting
IOH
mA
mA
-8
6
Low-level output current
6-mA I/O buffers
DDR[0], DDR[1]
buffers @ 50-Ω
impedance setting
IOL
8
Differential input voltage (SERDES_CLKN/P),
[AC coupled]
0.25
VID
tt
2.0
V
Transition time, 10%-90%, All Inputs (unless
otherwise specified in the electrical data sections)
Lesser of 0.25P or
10(5)
ns
(1) This device supports, and requires the use of, SmartReflex technology with Adaptive Voltage Scaling based on die temperature and
performance. The SmartReflex codes output from the device correspond to up to 32 linear voltage steps within the specified voltage
range, with the option to use fewer steps if desired, with a minimum of eight steps. TI requires that users design a supply that can
handle multiple voltage steps within this range with ± 5% tolerances. Not incorporating a flexible supply may limit the system's ability to
use the power saving capabilities of the SmartReflex technology. TI recommends using a fault-tolerant power supply design to protect
against over-current conditions. For AVS Disable data to aid in design of robust power supplies that may withstand momentary AVS
control failure, see the device Power Estimation Spreadsheet (literature number SPRABK3).
(2) For supply voltage pins, DVDD_DDRx:
•
•
1.5 V is used for DDR3 SDRAM.
1.8 V is used for DDR2 SDRAM.
(3) Oscillator ground (DEVOSC_VSS) must be kept separate from other grounds and connected directly to the crystal load capacitor
ground.
(4) DDR_VREF is expected to equal 0.5DVDD_DDRx of the transmitting device and to track variations in the DVDD_DDRx.
(5) P = the period of the applied signal. Maintaining transition times as fast as possible is recommended to improve noise immunity on input
signals.
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Recommended Operating Conditions (continued)
MIN
0
NOM
MAX UNIT
Operating junction temperature range(6)
95
°C
TJ
Extended operating junction temperature range
-40
20
105
FSYSCLK
ARM Operating Frequency (SYSCLK2)
1.35
GHz
(6) A heat dissipation solution is required for proper device operation. Thermal performance of the overall system must be carefully
considered to ensure conformance with the recommended operating conditions. Heat generated by this device must be removed with
the help of heat sinks, heat spreaders, and/or airflow. SmartReflex can significantly lower the power consumption of this device and its
use is required for proper device operation. A thermal model can be provided for thermal simulation to estimate the system thermal
environment. Contact your local TI representative for availability.
126
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6.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and
Operating Temperature (Unless Otherwise Noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP
MAX
UNIT
Low/full speed: USB_DN and
USB_DP
2.8
VDD_USBx_3P3
V
High speed: USB_DN and
USB_DP
360
2.4
0.0
-10
440
mV
V
VOH
High-level output voltage
(3.3-V I/O)
DVDD_3P3 = MIN, IOH = MAX
Low/full speed: USB_DN and
USB_DP
0.3
10
V
High speed: USB_DN and
USB_DP
mV
V
VOL
Low-level output voltage (3.3- DVDD_3P3 = MIN, IOL = MAX
V I/O except I2C pins)
0.4
0.4
±1
Low-level output voltage
(3.3-V I/O I2C pins)
IO = 3 mA
V
VI = VSS to DVDD_3P3 without
opposing internal resistor
µA
µA
VI = VSS to DVDD_3P3 with
opposing internal pullup
resistor(3)
100
Input current [DC]
(except I2C pins)
II(2)
VI = VSS to DVDD_3P3 with
opposing internal pulldown
resistor(3)
-100
µA
Input current [DC] (I2C)
VI = VSS to DVDD_3P3
±20
±5
µA
µA
VO = DVDD_3P3 or VSS; internal
pull disabled
(4)
IOZ
I/O Off-state output current
VO = DVDD_3P3 or VSS; internal
pull enabled
±100
1093
µA
mA
•
•
Case Temp = 60ºC
Constant Core (CVDDC)
supply current(5)
ARM at 1.2 GHz, 70%
utilization
•
•
•
HDMI display
SGX530 at 150 MHz, 15 fps
ICDD
EMIF0/1 at 200 MHz, 1120
MBps
Variable Core (CVDD) supply
current(5)
4099
19
•
•
USB 1x, EMAC 1x
AVS Variable Core voltage =
0.8 V
mA
•
•
Case Temp = 60ºC
3.3-V I/O (DVDD_3P3,
USB_VDDA3P3) supply
current(5)
ARM at 1.2 GHz, 70%
utilization
•
•
•
HDMI display
1.8-V I/O (DVDD1P8,
DVDD_DDRx) supply
current(5)(6)
SGX530 at 150 MHz, 15 fps
IDDD
11
EMIF0/1 at 200 MHz, 1120
MBps
•
•
USB 1x, EMAC 1x
1.5-V I/O (DVDD_DDRx)
supply current(5)(6)
235
AVS Variable Core voltage =
0.8 V
(1) For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table.
(2) II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II
indicates the input leakage current and off-state (Hi-Z) output leakage current.
(3) Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
(4) IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
(5) The actual current draw varies across manufacturing processes and is highly application-dependent. For use-case specific power
estimates, see the device Power Estimation Spreadsheet (literature number SPRABK3).
(6) For supply voltage pins, DVDD_DDRx:
•
•
1.5 V is used for DDR3 SDRAM.
1.8 V is used for DDR2 SDRAM.
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Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature
(Unless Otherwise Noted) (continued)
PARAMETER
Input capacitance
Output capacitance
TEST CONDITIONS(1)
MIN
TYP
MAX
2.8
UNIT
pF
CI
Co
2.8
pF
128
Device Operating Conditions
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7 Power, Reset, Clocking, and Interrupts
7.1 Power Supplies
7.1.1 Voltage and Power Domains
The device has the following voltage domains:
•
•
•
•
•
•
1-V adaptive voltage scaling (AVS) domain - Main voltage domain for all modules
1-V constant domain - Memories, PLLs, DACs, DDR IOs, HDMI, and USB PHYs
1.8-V constant domain - PLLs, DACs, HDMI, and USB PHYs
3.3-V constant domain - IOs and USB PHY
1.5-V constant domain - DDR IOs, PCIe, and SATA SERDES
0.9-V constant domain - USB PHY
These domains define groups of modules that share the same supply voltage for their core logic. Each
voltage domain is powered by dedicated supply voltage rails. For the mapping between voltage domains
and the supply pins associated with each, see Table 3-33.
Note: A regulated supply voltage must be supplied to each voltage domain at all times, regardless of the
power domain states.
7.1.2 Power Domains
The device's 1-V AVS and 1-V constant voltage domains have seven power domains that supply power to
both the core logic and SRAM within their associated modules. All other voltage domains have only
always-on power domain.
Within the 1-V AVS and 1-V constant voltage domains, each power domain, except for the always-on
domain, has an internal power switch that can completely remove power from that domain. At power-up,
all domains, except always-on, come-up as power gated. Since there is an always-on domain in each
voltage domain, all power supplies are expected to be ON all the time (as long as the device is in use).
For details on powering up/down the device power domains, see the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
Note: All modules within a power domain are unavailable when the domain is powered OFF. For
instructions on powering ON/OFF the domains, see the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7).
7.1.3 1-V AVS and 1-V Constant Power Domains
•
Graphics Domain
This domain contains the SGX530 (available only on the AM8394 device).
•
Active Domain
The active domain has all modules that are only needed when the system is in "active" state. In any of
the standby states, these modules are not needed. This domain contains the HDVPSS peripheral.
•
•
Default Domain
The default domain contains modules that might be required even in standby mode. Having them in a
separate power domain allows customers to power gate these modules when in standby mode. This
domain has the DDR, SATA, PCIe, Media Controller and USB peripherals.
Always-On Domain
The always-on domain contains all modules that are required even when the system goes to standby
mode. This includes the host ARM and modules that generate wake-up interrupts (e.g., UART, RTC,
GPIO, EMAC) as well as other low-power I/Os.
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7.1.4 SmartReflex™
The device contains SmartReflex modules that are required to minimize power consumption on the
voltage domains using external variable-voltage power supplies. Based on the device process,
temperature, and desired performance, the SmartReflex modules advise the host processor to raise or
lower the supply voltage to each domain for minimal power consumption. The communication link between
the host processor and the external regulators is a system-level decision and can be accomplished using
GPIOs or I2C.
The major technique employed by SmartReflex in the device is adaptive voltage scaling (AVS). Based on
the silicon process and temperature, the SmartReflex modules guide software in adjusting the core 1-V
supply voltage within the desired range. This technique is called adaptive voltage scaling (AVS). AVS
occurs continuously and in real time, helping to minimize power consumption in response to changing
operating conditions.
NOTE
Implementation of SmartReflex AVS is required for proper device operation.
7.1.5 Memory Power Management
The device memories offer three different modes to save power when memories are not being used;
Table 7-1 provides the details.
Table 7-1. Memory Power Management Modes
MODE
POWER SAVING
~60%
WAKE-UP LATENCY
MEMORY CONTENTS
Preserved
Light Sleep (LS)
Deep Sleep (DS)
Shut Down (SD)
Low
Medium
High
~75%
Preserved
~95%
Lost
The device provides a feature that allows the software to put the chip-level memories (OCMC RAMs) in
any of the three (LS, DS, and SD) modes. There are control registers in the control module to control the
power-down state of OCMC RAM0 and OCMC RAM1. There are also status registers that can be used
during power-up to check if memories are powered-up. For detailed instructions on entering and exiting
from light sleep and deep sleep modes, see the AM389x Sitara ARM Processors Technical Reference
Manual (literature number SPRUGX7).
Memories inside switchable domains go to the shut down (SD) state whenever the power domain goes to
the OFF state. Memories come back to functional state along with the domain power-up.
In order to reduce SRAM leakage, many SRAM blocks can be switched from active mode to shut-down
mode. When SRAM is put in shut-down mode, the voltage supplied to it is automatically removed and all
data in that SRAM is lost.
All SRAM located in a switchable power domain (all domains except always-on) automatically enters shut-
down mode whenever its assigned associated power domain goes to the OFF state. The SRAM returns to
the active state when the corresponding power domain returns to the ON state.
For detailed instructions on powering up/down the various device SRAM, see the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
7.1.6 I/O Power-Down Modes
The DDR3 I/Os are put into power-down mode automatically when the default power domain is turned
OFF.
The HDMI PHY controller is in the always-on power domain, so software must configure the PHY into
power-down mode.
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There is no power-down mode for the other 3.3-V I/Os.
7.1.7 Supply Sequencing
The device power supplies must be sequenced in the following order:
1. 3.3 V
2. 1-V AVS
3. 1-V Constant
4. 1.8 V
5. 1.5 V
6. 0.9 V
Each supply (represented by VDDB in Figure 7-1) must begin actively ramping between 0 ms and 50 ms
after the previous supply (represented by VDDA in Figure 7-1) in the sequence has reached 80% of its
nominal value, as shown in Figure 7-1.
80%
VDDA
VDDB
td = 0-50 ms
Figure 7-1. Power Sequencing Requirements
NOTE
The device pins are not fail-safe. They should not be externally driven before their
corresponding supply rail has been powered up. The corresponding supply rail for each pin
can be found in Section 3.2, Terminal Functions.
7.1.8 Power-Supply Decoupling
Recommended capacitors for power supply decoupling are all 0.1 µF in the smallest body size that can be
used. Capacitors are more effective in the smallest physical size to limit lead inductance. For example,
0402 sized capacitors are better than 0603 sized capacitors, and so on.
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Table 7-2. Recommended Power-Supply Decoupling
Capacitors
SUPPLY
MINIMUM CAPACITOR NO.
VDDA_PLL
DVDD1P8
VDDT_SATA
VDDT_PCIE
CVDDC
2(1)
2
2(1)
3(1)
20(2)
64(2)
28(2)
DVDD_3p3
CVDD
(1) PLL supplies benefit from filters or ferrite beads to keep the noise
from causing clock jitter. The minimum recommendation is a ferrite
bead with a resonance at 100 MHz along with at least one capacitor
on the device side of the bead. Additional recommendation is to add
one capacitor just before the bead to form a Pi filter. The filter needs
to be as close as possible to the device pin, with the device-side
capacitor being the most important component to be close to the
device pin. PLL pins close together can be combined on the same
supply. PLL pins farther away from each other may need their own
filtered supply.
(2) It is recommended to have one bulk (15 µF or larger) capacitor for
every 10 smaller capacitors placed as closely as possible to the
device.
DDR-related supply capacitor numbers are provided in Section 8.3.
7.2 Reset
7.2.1 System-Level Reset Sources
The device has several types of system-level resets. Table 7-3 lists these reset types, along with the reset
initiator and the effects of each reset on the device.
Table 7-3. System-Level Reset Types
RESETS ALL
MODULES,
EXCLUDING
EMULATION
RESETS
EMULATION
LATCHES BOOT
PINS
ASSERTS
RSTOUT PIN
TYPE
INITIATOR
Power-On Reset (POR)
External Warm Reset
Emulation Warm Reset
POR pin
Yes
Yes
Yes
Yes
No
Yes
Yes
No
Yes
Yes
Yes
RESET pin
On-Chip Emulation
Logic
No
Watchdog Reset
Watchdog Timer
Yes
Yes
Yes
No
Yes
No
No
No
No
Yes
Yes
Yes
Software Global Cold Reset Software
Software Global Warm
Reset
Software
Test Reset
TRST pin
No
Yes
No
No
7.2.2 Power-On Reset (POR pin)
Power-on reset (POR) is initiated by the POR pin and is used to reset the entire chip, including the test
and emulation logic. POR is also referred to as a cold reset since it is required to be asserted when the
devices goes through a power-up cycle. However, a device power-up cycle is not required to initiate a
power-on reset.
The following sequence must be followed during a power-on reset:
1. Wait for the power supplies to reach normal operating conditions while keeping the POR pin asserted.
2. Wait for the input clock sources SERDES_CLKN/P to be stable (if used by the system) while keeping
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the POR pin asserted (low).
3. Once the power supplies and the input clock source are stable, the POR pin must remain asserted
(low) for a minimum of 32 DEV_MXI cycles. Within the low period of the POR pin, the following
happens:
(a) All pins enter a Hi-Z mode.
(b) The PRCM asserts reset to all modules within the device.
(c) The PRCM begins propagating these clocks to the chip with the PLLs in bypass mode.
4. The POR pin may now be deasserted (driven high). When the POR pin is deasserted (high):
(a) The BOOT pins are latched.
(b) Reset to the ARM Cortex-A8 is de-asserted, provided the processor clock is running.
(c) All other domain resets are released, provided the domain clocks are running.
(d) The clock, reset, and power-down state of each peripheral is determined by the default settings of
the PRCM.
(e) The ARM Cortex-A8 begins executing from the default address (Boot ROM).
7.2.3 External Warm Reset (RESET pin)
An external warm reset is activated by driving the RESET pin active-low. This resets everything in the
device, except the ARM Cortex-A8 interrupt controller, test, and emulation. An emulator session stays
alive during warm reset.
The following sequence must be followed during a warm reset:
1. Power supplies and input clock sources should already be stable.
2. The RESET pin must be asserted (low) for a minimum of 32 DEV_MXI cycles. Within the low period of
the RESET pin, the following happens:
(a) All pins, except test and emulation pins, enter a Hi-Z mode.
(b) The PRCM asserts reset to all modules within the device, except for the ARM Cortex-A8 interrupt
controller, test, and emulation.
(c) RSTOUT is asserted.
3. The RESET pin may now be de-asserted (driven high). When the RESET pin is de-asserted (high):
(a) The BOOT pins are latched.
(b) Reset to the ARM Cortex-A8 and modules without a local processor is de-asserted, with the
exception of the ARM Cortex-A8 interrupt controller, test, and emulation.
(c) RSTOUT is de-asserted.
(d) The clock, reset, and power-down state of each peripheral is determined by the default settings of
the PRCM.
(e) The ARM Cortex-A8 begins executing from the default address (Boot ROM).
(f) Since the ARM Cortex-A8 interrupt controller is not impacted by warm reset, application software
needs to explicitly clear all pending interrupts in the ARM Cortex-A8 interrupt controller.
7.2.4 Emulation Warm Reset
An emulation warm reset is activated by the on-chip emulation module. It has the same effect and
requirements as an external warm reset (RESET), with the exception that it does not re-latch the BOOT
pins.
The emulator initiates an emulation warm reset via the ICEPick module. To invoke the emulation warm
reset via the ICEPick module, the user can perform the following from the Code Composer Studio™ IDE
menu:
Debug → Advanced Resets → System Reset.
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7.2.5 Watchdog Reset
A watchdog reset is initiated when the watchdog timer counter reaches zero. It has the same effect and
requirements as an external warm reset (RESET), with the exception that it does not re-latch the BOOT
pins. In addition, a watchdog reset always results in RSTOUT being asserted.
7.2.6 Software Global Cold Reset
A software global cold reset is initiated under software control. It has the same effect and requirements as
a power-on reset (POR), with the exception that it does not re-latch the BOOT pins.
Software initiates a software global cold reset by writing to RST_GLOBAL_COLD_SW in the
PRM_RST_CTRL register.
7.2.7 Software Global Warm Reset
A software global warm reset is initiated under software control. It has the same effect and requirements
as a external warm reset (RESET), with the exception that it does not re-latch the BOOT pins.
Software initiates a software global warm reset by writing to RST_GLOBAL_WARM_SW in the
PRM_RST_CTRL register.
7.2.8 Test Reset (TRST pin)
A test reset is activated by the emulator asserting the TRST pin. The only effect of a test reset is to reset
the emulation logic.
7.2.9 Local Reset
The local reset for various modules within the device is controlled by programming the PRCM and/or the
module's internal registers. Only the associated module is reset when a local reset is asserted, leaving the
rest of the device unaffected.
For details on local reset, see the PRCM chapter of the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7) and individual subsystem and peripheral user's guides.
7.2.10 Reset Priority
If any of the above reset sources occur simultaneously, the device only processes the highest-priority
reset request. The reset request priorities, from high to low, are as follows:
1. Power-on reset (POR)
2. Test reset (TRST)
3. External warm reset (RESET)
4. Emulation warm resets
5. Watchdog reset
6. Software global cold/warm resets.
7.2.11 Reset Status Register
The Reset Status Register (PRM_RSTST) contains information about the last reset that occurred in the
system. For more information on this register, see the PRCM chapter of the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
7.2.12 PCIe Reset Isolation
The device supports reset isolation for the PCI Express (PCIe) module. This means that the PCI Express
subsystem can be reset without resetting the rest of the device.
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When the device is a PCI Express Root Complex (RC), the PCIe subsystem can be reset by software
through the PRCM. Software should ensure that there are no ongoing PCIe transactions before asserting
this reset by first taking the PCIe subsystem into the IDLE state by programming the register
CM_DEFAULT_PCI_CLKCTRL inside the PRCM. After bringing the PCIe subsystem out of reset, bus
enumeration should be performed again and should treat all endpoints (EP) as if they had just been
connected.
When the device is a PCI Express Endpoint (EP), the PCIe subsystem generates an interrupt when an in-
band reset is received. Software should process this interrupt by putting the PCIe subsystem in the IDLE
state and then asserting the PCIe local reset through the PRCM.
All device-level resets mentioned in the previous sections, except Test Reset, also reset the PCIe
subsystem. Therefore, the device should issue a Hot Reset to all downstream devices and re-enumerate
the bus upon coming out of reset.
7.2.13 RSTOUT
The RSTOUT pin on the device reflects device reset status and is de-asserted (high) when the device is
out of reset. In addition, this output is always 3-stated and the internal pull resistor is disabled on this pin
while POR and/or RESET is asserted; therefore, an external pullup/pulldown can be used to set the state
of this pin (high/low) while POR and/or RESET is asserted. For more detailed information on external
pullups/pulldowns, see Section 4.2.1. This output is always asserted low when any of the following resets
occur:
•
•
•
•
•
Power-on reset (POR)
External warm reset
Emulation warm reset (RESET)
Software global cold/warm reset
Watchdog timer reset.
The RSTOUT pin remains asserted until PRCM releases the host ARM Cortex-A8 processor for reset.
7.2.14 Effect of Reset on Emulation and Trace
The device emulation and trace is only reset by the following sources:
•
•
•
Power-on reset (POR)
Software global cold reset
Test reset (TRST).
Other than these three, none of the other resets affect emulation and trace functionality.
7.2.15 Reset During Power Domain Switching
Each power domain has a dedicated warm reset and cold reset. Warm reset for a power domain is
asserted under either of the following two conditions:
1. A power-on reset, external warm reset, emulation warm reset, or software global cold/warm reset
occurs.
2. When that power domain switches from the ON state to the OFF state.
Cold reset for a power domain is asserted under either of the following two conditions:
1. A power-on reset or software global cold reset occurs.
2. When that power domain switches from the ON state to the OFF state.
7.2.16 Pin Behaviors at Reset
When any reset (other than test reset) described in Section 7.2.1 is asserted, all device pins are put into a
Hi-Z state except for:
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•
•
Emulation pins. These pins are only put into a Hi-Z state when POR or global software cold reset is
asserted.
RSTOUT pin.
In addition, the PINCNTL registers, which control pin multiplexing, slew control, enabling the
pullup/pulldown, and enabling the receiver, are reset to their default state. For a description of the
RESET_ISO register, see the AM389x Sitara ARM Processors Technical Reference Manual (literature
number SPRUGX7).
Internal pullup/pulldown (IPU/IPD) resistors are enabled during and immediately after reset as described in
the OTHER column in the tables in Section 3.2, Terminal Functions.
7.2.17 Reset Electrical Data/Timing
NOTE
If a configuration pin must be routed out from the device, the internal pullup/pulldown
(IPU/IPD) resistor should not be relied upon; TI recommends the use of an external
pullup/pulldown resistor.
Table 7-4. Timing Requirements for Reset
(see Figure 7-2 and Figure 7-3)
NO.
1
MIN
12C(1)
12C(1)
MAX
UNIT
ns
tw(RESET)
Pulse duration, POR low or RESET low
2
tsu(CONFIG)
Setup time, boot and configuration pins valid before POR high or RESET
high(2)
ns
3
th(CONFIG)
Hold time, boot and configuration pins valid after POR high or RESET
high(2)
0
ns
(1) C = 1/DEV_MXI clock frequency, in ns. The device clock source must be stable and at a valid frequency prior to meeting the tw(RESET)
requirement.
(2) For the list of boot and configuration pins, see , Boot Terminal Functions.
Table 7-5. Switching Characteristics Over Recommended Operating Conditions During Reset
(see Figure 7-2)
NO.
PARAMETER
Pulse width, RESET low
MIN
10C(1)
MAX
UNIT
ns
tw(RSTL)
4
5
td(RSTL_IORST)
td(RSTL_IOFUNC)
Delay time, RESET falling to all IO entering their reset state
Delay time, RESET rising to IO exiting their reset state
0
0
14
14
ns
ns
(1) C = 1/DEV_CLKIN clock frequency, in ns.
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Power
Supplies
Ramping
Power Supplies Stable
Clock Source Stable
DEV_CLKIN
1
POR
RESET
5
5
2
3
Hi-Z
BTMODE[4:0]
Config
Other I/O Pins(A)
RESET STATE
A. For more detailed information on the reset state of each pin, see Section 7.2.16, Pin Behaviors at Reset. For the
IPU/IPD settings during reset, see Section 3.2, Terminal Functions.
Figure 7-2. Power-Up Timing
Power Supplies Stable
DEV_CLKIN
POR
1
RESET
4
4
5
5
2
3
Hi-Z
BTMODE[4:0]
Config
Other I/O Pins(A)
RESET STATE
A. For more detailed information on the reset state of each pin, see Section 7.2.16, Pin Behaviors at Reset. For the
IPU/IPD settings during reset, see Section 3.2, Terminal Functions.
Figure 7-3. Warm Reset (RESET) Timing
7.3 Clocking
The device clocks are generated from several external reference clocks that are fed to on-chip PLLs and
dividers (both inside and outside of the PRCM Module). Figure 7-4 shows a high-level overview of the
device clocking structure. Note that to reduce complexity, all clocking connections are not shown. For
detailed information on the device clocks, see the Device Clocking and Flying Adder PLL section of the
AM389x Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
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SATA SS
PCIe SS
100-MHz
Differential Clock
To USB
To ARM Cortex-A8
To L3, HDVPSS
To EMAC
Main
PLL
27-MHz
XTAL
OSC 27
DEVCLKIN
Clocks
To SGX530(A)
432 MHz
Audio Clock1
Audio Clock2
Audio
PLL
Audio Clock3
Clocks
To RTC
32.768-kHz
Clock
Video
PLL
HD, SD, TMDS Clocks
Clocks
To DDR PHYs
To CEC, UART, etc.
To L3P, EMIF and DMM
DDR
PLL
Clocks
DDR Clock4 (Spare)
DDR Clock5 (Spare)
A. SGX530 is available only on the AM3894 device.
Figure 7-4. System Clocking Overview
7.3.1 Device Clock Inputs
The device has four on-chip PLLs and one reference clock which are generated by on-chip oscillators. In
addition to the 27-MHz reference clock, a 100-MHz differential clock input is required for SATA and PCIe.
A third clock input is an optional 32.768-kHz clock input (no on-chip oscillator) for the RTC.
The device clock input (DEV_MXI/DEV_CLKIN) is used to generate the majority of the internal reference
clocks. An external square-wave clock can be supplied to DEV_CLKIN instead of using a crystal input.
The device clock should be 27 MHz.
Section 7.3.1.1 provides details on using the on-chip oscillators with external crystals for the 27-MHz
system oscillator.
7.3.1.1 Using the Internal Oscillators
When the internal oscillators are used to generate the device clock, external crystals are required to be
connected across the MXI and MXO pins, along with two load capacitors, as shown in Figure 7-5. The
external crystal load capacitors should also be connected to the associated oscillator ground pin
(DEVOSC_VSS). The capacitors should not be connected to board ground (VSS).
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DEV_MXI/
DEV_CLKIN
DEV_MXO DEVOSC_VSS
DEVOSC_DVDD18
DEVOSC_VSS
Crystal
27 MHz
Rd
(Optional)
C1
C2
1.8 V
Figure 7-5. 27-MHz System Oscillator
The load capacitors, C1 and C2 in Figure 7-5, should be chosen such that the equation below is satisfied.
CL in the equation is the load specified by the crystal manufacturer. Rd is an optional damping resistor. All
discrete components used to implement the oscillator circuit should be placed as close as possible to the
associated oscillator MXI, MXO, and VSS pins.
C1C2
=
CL
(C1 + C2 )
Table 7-6. Input Requirements for Crystal Circuit on the Device Oscillator
PARAMETER
Start-up time (from power up until oscillating at stable frequency of 27 MHz)
Crystal Oscillation frequency
MIN
NOM
MAX
UNIT
ms
4
27
MHz
pF
Parallel Load Capacitance (C1 and C2)
Crystal ESR
12
24
60
5
Ohm
pF
Crystal Shunt Capacitance
Crystal Oscillation Mode
Fundamental Only
Crystal Frequency stability
±50
ppm
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Table 7-7. DEV_CLKIN Clock Source Requirements(1)(2)(3)
(see Figure 7-6)
NO.
MIN
NOM
MAX
UNIT
ns
1
2
3
4
5
tc(DCK)
tw(DCKH)
tw(DCKL)
tt(DCK)
Cycle time, DEV_CLKIN
37.037
Pulse duration, DEV_CLKIN high
Pulse duration, DEV_CLKIN low
Transition time, DEV_CLKIN
0.45C
0.45C
0.55C
0.55C
7
ns
ns
ns
tJ(DCK)
Period jitter, DEV_CLKIN (VDACs not used)
Period jitter, DEV_CLKIN (VDACs used)
Frequency stability, DEV_CLKIN
150
A
ps
s
Sf
±50
ppm
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
(2) C = DEV_CLKIN cycle time in ns.
(3)
-S N R
20
10
B W
(s )
Α = 10 *
*
2 * p * B W
Where SNR is the desired signal-to-noise ratio and BW is the highest DAC signal bandwidth used in the system (SD = 6 MHz,
720p/1080i = 30 MHz, 1080p = 60 MHz).
27 M H z
1
5
4
1
2
DEV_CLKIN
3
4
Figure 7-6. DEV_CLKIN Timing
7.3.2 SERDES_CLKN/P Input Clock
A high-quality, low-jitter differential clock source is required for the PCIe and SATA PHYs. The clock is
required to be AC coupled to the device's SERDES_CLKP and SERDES_CLKN pins according to the
specifications in Table 7-11. Both the clock source and the coupling capacitors should be placed
physically as close as possible to the processor.
When the PCIe interface is used, the SERDES_CLKN/P clock is required to meet the REFCLK AC
specifications outlined in the PCI Express Card Electromechanical Specification (Gen.1 and Gen.2). When
the SATA interface is used, the SERDES_CLKN/P clock is required to meet the specifications in Table 7-
8. When both the PCIe and SATA interfaces are used, both sets of specifications must be met
simultaneously.
Table 7-8. SERDES_CLKN/P Clock Source Requirements for SATA
PARAMETER
MIN
TYP
MAX
UNIT
Clock Frequency
Jitter
100
MHz
50 Ps pk-pk
Duty Cycle
Rise/Fall Time
40
60
%
700
ps
An HCSL differential clock source is required to meet the REFCLK AC specifications outlined in the PCI
Express Card Electromechanical Specification, Rev. 2.0, at the input to the AC coupling capacitors. In
addition, LVDS clock sources that are compliant to the above specification, but with the exceptions shown
in Table 7-9, are also acceptable.
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Table 7-9. Exceptions to REFCLK AC Specification for LVDS Clock Sources
SYMBOL
VIH
PARAMETER
Differential input high voltage (VIH
Differential input high voltage (VIL)
MIN
125
MAX
1000
-125
UNIT
mV
)
VIL
-1000
mV
Table 7-10. SERDES_CLKN/P Routing Specifications
PARAMETER
MIN
TYP
MAX
0
24000(1)
UNIT
Stubs
Mils
Number of stubs allowed on SERDES_CLKN/P traces
SERDES_CLKN/P trace length from oscillator to device
SERDES_CLKN/P pair differential impedance
100
Ohms
Vias
Number of vias on each SERDES_CLKN/P trace(2)
3
SERDES_CLKN/P differential pair to any other trace spacing
2*DS(3)
(1) Keep trace length as short as possible.
(2) Vias must be used in pairs with their distance minimized.
(3) DS is the differential spacing of the SERDES_CLKN/P traces.
AC coupling capacitors are required on the SERDES_CLKN/P pair. Table 7-11 shows the requirements
for these capacitors.
Table 7-11. SERDES_CLKN/P AC Coupling Capacitors Requirements
PARAMETER
SERDES_CLKN/P AC coupling capacitor value
SERDES_CLKN/P AC coupling capacitor package size
MIN
TYP
MAX
100
UNIT
5
nF
0402
10
Mils(1)(2)
(1) LxW, 10 mil units, i.e., a 0402 is a 40x20 mil surface mount capacitor.
(2) The physical size of the capacitor should be as small as possible
7.3.3 CLKIN32 Input Clock
An external 32.768-kHz clock input can optionally be provided at the CLKIN32 pin to serve as a reference
clock in place of the RTCDIVIDER clock for the RTC and Timer modules. If the CLKIN32 pin is not
connected to a 32.768-kHz clock input, this pin should be pulled low. The CLKIN32 source must meet the
timing requirements shown in Table 7-12.
Table 7-12. Timing Requirements for CLKIN32(1)(2)
(see Figure 7-7)
NO.
1
MIN
1/32768
0.45C
NOM
MAX UNIT
tc(CLKIN32)
Cycle time, CLKIN32
s
2
tw(CLKIN32H) Pulse duration, CLKIN32 high
0.55C
0.55C
7
ns
ns
ns
ns
3
tw(CKIN32L)
tt(CLKIN32)
tJ(CLKIN32)
Pulse duration, CLKIN32 low
Transition time, CLKIN32
Period jitter, CLKIN32
0.45C
4
5
0.02C
(1) The reference points for the rise and fall transitions are measured at V IL MAX and V IH MIN.
(2) C = CLKIN32 cycle time, in ns. For example, when CLKIN32 frequency is 32768 Hz, use C = 1/32768 s.
5
1
4
1
2
CLKIN32
3
4
Figure 7-7. CLKIN32 Timing
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7.3.4 PLLs
The device contains four embedded PLLs (Main, Audio, Video and DDR) that provide clocks to different
parts of the system. For a high-level view of the device clock architecture, including the PLL reference
clock sources and connections, see Figure 7-4.
The reference clock for most of the PLLs comes from the DEV_CLKIN input clock. Also, each PLL
supports a bypass mode in which the reference clock can be directly passed to the PLL CLKOUT. All
device PLLs (except the DDR PLL) come-up in bypass mode after reset.
Flying-adder PLLs are used for all the on-chip PLLs. Figure 7-8 shows the basic structure of the flying-
adder PLL.
fs
fo
Flying-Adder
Synthesizer
FREQ
/M
K
fp
fr
fvco
/P
PFD
CP
VCO
/N
Figure 7-8. Flying-Adder PLL
The flying-adder PLL has two main components: a multi-phase PLL and the flying-adder synthesizer. The
multi-phase PLL takes an input reference clock (fr), multiplies it with factor, N, and provides a K-phase
output to the flying-adder synthesizer. The flying-adder synthesizer takes this multi-phase clock input and
produces a variable frequency clock (fs). There can be a post divider on this clock which takes in clock fs
and drives out clock fo. The frequency of the clock driven out is given by:
é
ù
ú
(
)
FREQ * P * M
Ν * Κ
fo =
* fr
ê
(
)
ë
û
There can be multiple flying-adder synthesizers attached to one multi-phase PLL to generate different
frequencies. In this case, FREQ (4 bits of integer and 24 bits of fractional value) and M (1 to 255) values
can be adjusted for each clock separately, based on the frequency needed. A multi-phase PLL used in
this device has a value of K = 8.
For details on programming the device PLLs, see the PLL chapter of the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
7.3.4.1 PLL Programming Limits
When programming the PLLs, the result of the following equation must be greater than the value shown in
the corresponding PLL table (this determines if the chosen PLL frequency is a valid one).
6
æ
ç
ç
è
ö
÷
÷
ø
Floor(M * FREQ) * P * 10
PLL_CLKIN * 8 * N
A * M * FREQ
8
-
- Η
Where:
•
•
•
•
PLL_CLKIN is the input clock frequency (in MHz) to the PLL before the P divider
Floor( ) = round down
M = PLL divider
FREQ = PLL frequency setting
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•
A = 169 for all PLLs with the following exception: A = 218 for the audio PLL when its input is sourced
from the main PLL output
•
•
•
H = 10 if M * FREQ is a multiple of 8; otherwise, H = 0
800 MHz ≤ PLL_CLKIN * N / P ≤ 1600 MHz
10 MHz ≤ PLL_CLKIN / P ≤ 60 MHz
Table 7-13. PLL Clock Frequencies
CLOCK
MIN CYCLE
MAX FREQUENCY
Main PLL
Clock1
985
1389
1000
833
987
720
Clock2, ARM @ 720 MHz
Clock2, ARM @ 1.0 GHz
Clock2, ARM @ 1.2 GHz
Clock2, ARM @ 1.35 GHz
Clock3
1000
1200
1350
532
741
1847
1991
Clock4
494
DDR PLL
Clock 2
18447
2443
54
Clock 3
405
Video PLL
Clock 1
1485
1485
1485
660
660
660
Clock 2
Clock 3
Audio PLL
Clock 2
6290
5041
158
197
100
100
Clock 3
Clock 4
10000
10000
Clock 5
7.3.4.2 PLL Power Supply Filtering
The device PLLs are supplied externally via the VDDA_PLL power-supply pins. External filtering must be
added on the PLL supply pins to ensure that the requirements in Table 7-14 are met.
Table 7-14. Power Supply Requirements
PARAMETER
MIN
MAX
UNIT
Dynamic noise at VDDA_PLL pins
50
mV p-p
7.3.4.3 PLL Locking Sequence
All of the flying-adder PLLs (except the DDR PLL) come-up in bypass mode at reset. All of the registers
(P, N, FREQ, and M) need to be programmed appropriately and then wait approximately 8 µs for
PLL_Audio and 5 µs for the other PLLS to be locked. Verification that the PLL is locked can be checked
by accessing the lock status bit in the PLL control register for each PLL (bit = 1 when the PLL is locked).
Once the PLL is locked, then the FA-PLL can be taken out of bypass mode. Control for bypass mode is
through chip-level registers. For more details on the PLL registers and bypass logic, see the PLL chapter
of the AM389x Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
7.3.4.4 PLL Registers
The PLL control registers reside in the control module and are listed in Table 4-3.
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7.3.5 SYSCLKs
In some cases, the system clock inputs and PLL outputs are sent to the PRCM module for division and
multiplexing before being routed to the various device modules. These clock outputs from the PRCM
module are called SYSCLKs. Table 7-15 lists the main device SYSCLKs along with their maximum
supported clock frequencies. In addition, limits shown in the table may be further restricted by the clock
frequency limitations of the device modules using these clocks. For more details on module clock
frequency limits, see Section 7.3.6.
Table 7-15. SYSCLK Frequencies
DEVICE SPEED
SYSCLK
MAXIMUM FREQUENCY DESTINATION
RANGE
Blank
120
SYSCLK2
1.0 GHz
1.2 GHz
1.35 GHz
~500 MHz
To ARM Cortex-A8
135
SYSCLK4
SYSCLK5
SYSCLK6
L3, OCP clock for HDVPSS, TPTCs, TPCC, DMM, Unicache
clock for Media Controller, EDMA
~250 MHz
~125 MHz
L3, L4_HS, OCP clock for EMAC, SATA, PCIe, Media
Controller, OCMC RAM
L3, L4_STD, UART, I2C, SPI, SD/SDIO, TIMER, GPIO,
PRCM, McASP, McBSP, GPMC, ELM, HDMI, WDT, Mailbox,
RTC, Spinlock, SmartReflex and USB
SYSCLK8
400 MHz
333 MHz
300 MHz
337.5 MHz
125 MHz
DMM, DDR OCP clock
SGX530 OCP clock
GMII clock
SYSCLK23
Blank
120
135
SYSCLK24
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7.3.6 Module Clocks
Device modules receive their clock directly from an external clock input, directly from a PLL, or from a
PRCM SYSCLK output. Table 7-16 lists the clock source options for each module, along with the
maximum frequency that module can accept. The device PLLs and dividers must be programmed not to
exceed the maximum frequencies listed in this table to ensure proper module functionality.
Table 7-16. Module Clock Frequencies
DEVICE SPEED
MODULE
CLOCK SOURCE(S)
MAX. FREQUENCY (MHz)
RANGE
Blank
120
Cortex-A8
PLL_MAIN, SYSCLK2
1000
1200
1350
500
135
DMM
PLL_DDR, SYSCLK4
PLL_DDR, SYSCLK8
SYSCLK4
DMM, DDR OCP clock
400
EDMA
ELM
500
SYSCLK6
125
EMAC
GPIO0/1
SYSCLK5
250
SYSCLK6
125
SYSCLK18
32.768
GPMC
SYSCLK6
125
125
50
HDMI
PLL_VIDEO, SYSCLK6
PLL_AUDIO
HDMI I2S
HDMI CEC
SYSCLK9
48
HDVPSS VPDMA
HDVPSS
PLL_MAIN, SYSCLK4
SYSCLK5
500
250
125
165
165
54
HDVPSS Interface
HDVPSS HD VENCD
HDVPSS HD VENCA
HDVPSS SD VENC
I2C0/1
SYSCLK6
PLL_VIDEO, SYSCLK13
PLL_VIDEO, SYSCLK15
PLL_VIDEO, SYSCLK17
SYSCLK6
SYSCLK10
125
48
L3
PLL_MAIN, SYSCLK4
PLL_MAIN, SYSCLK5
PLL_MAIN, SYSCLK6
PLL_MAIN, SYSCLK5
PLL_MAIN, SYSCLK6
SYSCLK6
500
250
125
250
125
125
125
125
500
250
250
L3
L3
L4 HS
L4 STD
Mailbox
McASP0/1/2
McBSP
Media Controller
OCMC RAM
PCIe
PLL_AUDIO, SYSCLK6
PLL_AUDIO, SYSCLK6
SYSCLK4
SYSCLK5
SYSCLK5
RTC
SYSCLK6
125
SYSCLK18
32.768
SATA
SYSCLK5
250
SD/SDIO
SYSCLK6
SYSCLK10
125
48
SGX530
SYSCLK23
Blank
120
333
300
135
337.5
125
SmartReflex
SYSCLK6
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Table 7-16. Module Clock Frequencies (continued)
DEVICE SPEED
RANGE
MODULE
CLOCK SOURCE(S)
MAX. FREQUENCY (MHz)
SPI
SYSCLK6
SYSCLK10
125
48
Spinlock
SYSCLK6
125
Timers, WDT
SYSCLK6
125
SYSCLK18
32.768
UART0/1/2
USB0/1
SYSCLK6
SYSCLK10
125
48
SYSCLK6
125
7.3.7 Output Clock Select Logic
The device includes one selectable general-purpose clock output (CLKOUT). The source for these output
clocks is controlled by the CLKOUT_MUX register in the control module and shown in Figure 7-9.
Main PLL Clock5
DDR PLL Clock1
Video PLL Clock1
Audio PLL Clock1
0
1
2
3
/n
(n=1...8)
CLKOUT
Figure 7-9. CLKOUT Source Selection Logic
As shown in the figure, there are four possible sources for CLKOUT, one clock from each of the four
PLLs. The selected clock can be further divided by any ratio from 1 to 1/8 before going out on the
CLKOUT pin. The default selection is to select main PLL clock5, divider set to 1/1, and clock disabled.
Table 7-17. Switching Characteristics Over Recommended Operating Conditions for CLKOUT(1)(2)
(see Figure 7-10)
NO
.
PARAMETER
MIN
MAX UNIT
1
2
3
4
tc(CLKOUT) Cycle time, CLKOUT
10
0.45P
0.45P
ns
tw(CLKOUTH) Pulse duration, CLKOUT high
tw(CLKOUTL) Pulse duration, CLKOUT low
0.55P
0.55P
0.05P
ns
ns
ns
tt(CLKOUT)
Transition time, CLKOUT
(1) The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
(2) P = 1/CLKOUT clock frequency in nanoseconds (ns). For example, when CLKOUT frequency is 100 MHz, use P = 10 ns.
2
4
1
CLKOUT
(Divide-by-1)
3
4
Figure 7-10. CLKOUT Timing
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7.4 Interrupts
The device has a large number of interrupts. It also has the ARM Cortex™-A8 master capable of servicing
interrupts. Specific details, such as the processing flow, configuration steps, and interrupt controller
registers, for each of these masters are found in their respective subsystem documentation.
7.4.1 Interrupt Summary List
Table 7-18 lists all the device interrupts by module and indicates the interrupt destination: ARM Cortex™-
A8.
Table 7-18. Interrupts By Module
DESTINATION
MODULE
INTERRUPT
DESCRIPTION
Cortex™-A8
INTRQ
Serial ATA
SATA Module interrupt
INTRQ_PEND_N
X
X
X
X
X
X
X
X
X
X
X
C0_RX_THRESH_INTR_REQ
C0_RX_THRESH_INTR_PEND
C0_RX_INTR_REQ
C0_RX_INTR_PEND
C0_TX_INTR_REQ
Receive threshold (non paced)
Receive pending interrupt (paced)
Transmit pending interrupt (paced)
Stat, Host, MDIO LINKINT or MDIO USERINT
Receive threshold (non paced)
Receive pending interrupt (paced)
Transmit pending interrupt (paced)
Stat, Host, MDIO LINKINT or MDIO USERINT
Queue MGR or CPPI Completion interrupt
EMAC SS0
C0_TX_INTR_PEND
C0_MISC_INTR_REQ
C0_MISC_INTR_PEND
C0_RX_THRESH_INTR_REQ
C0_RX_THRESH_INTR_PEND
C0_RX_INTR_REQ
C0_RX_INTR_PEND
C0_TX_INTR_REQ
EMAC SS1
C0_TX_INTR_PEND
C0_MISC_INTR_REQ
C0_MISC_INTR_PEND
USBSS_INTR_REQ
USBSS_INTR_PEND
USB0_INTR_REQ
USB2.0 SS
USB0_INTR_PEND
USB1_INTR_REQ
RX/TX DMA, Endpoint ready/error, or USB2.0
interrupt
USB1_INTR_PEND
SLV0P_SWAKEUP
X
X
USB wakeup
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Table 7-18. Interrupts By Module (continued)
DESTINATION
Cortex™-A8
MODULE
INTERRUPT
DESCRIPTION
PCIE_INT_I_INTR0
Legacy interrupt (RC mode only)
MSI interrupt (RC mode only)
Error interrupt
PCIE_INT_I_INTR_PEND_N0
PCIE_INT_I_INTR1
X
X
X
X
PCIE_INT_I_INTR_PEND_N1
PCIE_INT_I_INTR2
PCIE_INT_I_INTR_PEND_N2
PCIE_INT_I_INTR3
Power Management interrupt
PCIE_INT_I_INTR_PEND_N3
PCIE_INT_I_INTR4
PCIE_INT_I_INTR_PEND_N4
PCIE_INT_I_INTR5
PCIE_INT_I_INTR_PEND_N5
PCIE_INT_I_INTR6
PCIE_INT_I_INTR_PEND_N6
PCIE_INT_I_INTR7
PCIE_INT_I_INTR_PEND_N7
PCIE_INT_I_INTR8
PCIe Gen2
PCIE_INT_I_INTR_PEND_N8
PCIE_INT_I_INTR9
PCIE_INT_I_INTR_PEND_N9
PCIE_INT_I_INTR10
Reserved
PCIE_INT_I_INTR_PEND_N10
PCIE_INT_I_INTR11
PCIE_INT_I_INTR_PEND_N11
PCIE_INT_I_INTR12
X
X
X
X
PCIE_INT_I_INTR_PEND_N12
PCIE_INT_I_INTR13
PCIE_INT_I_INTR_PEND_N13
PCIE_INT_I_INTR14
PCIE_INT_I_INTR_PEND_N14
PCIE_INT_I_INTR15
PCIE_INT_I_INTR_PEND_N15
SLE_IDLEP_SWAKEPUP
X
X
PCIe wakeup
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Table 7-18. Interrupts By Module (continued)
DESTINATION
Cortex™-A8
INTERRUPT
DESCRIPTION
TPCC_INT_PO[0]
TPCC_INT_PEND_N[0]
TPCC_INT_PO[1]
TPCC_INT_PEND_N[1]
TPCC_INT_PO[2]
TPCC_INT_PEND_N[2]
TPCC_INT_PO[3]
TPCC_INT_PEND_N[3]
TPCC_INT_PO[4]
TPCC_INT_PEND_N[4]
TPCC_INT_PO[5]
TPCC_INT_PEND_N[5]
TPCC_INT_PO[6]
TPCC_INT_PEND_N[6]
TPCC_INT_PO[7]
TPCC_INT_PEND_N[7]
TPCC_MPINT_PO
TPCC_MPINT_PEND_N
TPCC_ERRINT_PO
TPCC_ERRINT_PEND_N
TPCC_INTG_PO
Region 0 DMA completion
Region 1 DMA completion
Region 2 DMA completion
Region 3 DMA completion
Region 4 DMA completion
Region 5 DMA completion
Region 6 DMA completion
Region 7 DMA completion
Memory protection error
TPCC error
X
TPCC
X
X
DMA Global completion
TPTC0 error
TPCC_INTG_PEND_N
TPTC_ERRINT_PO
TPTC_LERRINT_PO
TPTC_INT_PO
X
X
X
X
X
TPTC 0
TPTC 1
TPTC 2
TPTC 3
TPTC0 completion
TPTC1 error
TPTC_LINT_PO
TPTC_ERRINT_PO
TPTC_LERRINT_PO
TPTC_INT_PO
TPTC1 completion
TPTC2 error
TPTC_LINT_PO
TPTC_ERRINT_PO
TPTC_LERRINT_PO
TPTC_INT_PO
TPTC2 completion
TPTC3 error
TPTC_LINT_PO
TPTC_ERRINT_PO
TPTC_LERRINT_PO
TPTC_INT_PO
TPTC3 completion
TPTC_LINT_PO
SYS_ERR_INTR
DDR EMIF4d 0
DDR EMIF4d 1
SYS_ERR_INTR_PEND_N
SYS_ERR_INTR
EMIF error
SYS_ERR_INTR_PEND_N
GPMC_SINTERRUPT
NIRQ
X
X
X
X
X
GPMC
GPMC interrupt
UART 0
UART 1
UART 2
UART/IrDA 0 interrupt
UART/IrDA 1 interrupt
UART/IrDA 2 interrupt
NIRQ
NIRQ
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Table 7-18. Interrupts By Module (continued)
DESTINATION
Cortex™-A8
MODULE
Timer1
Timer2
Timer3
Timer4
Timer5
Timer6
INTERRUPT
DESCRIPTION
POINTR_REQ
32-bit Timer1 interrupt
32-bit Timer2 interrupt
32-bit Timer3 interrupt
32-bit Timer4 interrupt
32-bit Timer5 interrupt
32-bit Timer6 interrupt
POINTR_PEND
X
X
X
X
X
X
POINTR_REQ
POINTR_PEND
POINTR_REQ
POINTR_PEND
POINTR_REQ
POINTR_PEND
POINTR_REQ
POINTR_PEND
POINTR_REQ
POINTR_PEND
POINTR_REQ
Timer7
WDTimer1
I2C0
32-bit Timer7 interrupt
Watchdog Timer
POINTR_PEND
X
X
PO_INT_REQ
POINTRREQ
POINTRPEND
X
I2C Bus interrupt
POINTRREQ
I2C1
POINTRPEND
X
X
X
SPI
SINTERRUPTN
SPI Interrupt
SDIO
IRQOQN
SDIO interrupt
MCASP_X_INTR_REQ
MCASP_X_INTR_PEND
MCASP_R_INTR_REQ
MCASP_R_INTR_PEND
MCASP_X_INTR_REQ
MCASP_X_INTR_PEND
MCASP_R_INTR_REQ
MCASP_R_INTR_PEND
MCASP_X_INTR_REQ
MCASP_X_INTR_PEND
MCASP_R_INTR_REQ
MCASP_R_INTR_PEND
PORRINTERRUPT
PORXINTERRUPT
PORROVFLINTERRUPT
PORCOMMONIRQ
TIMER_INTR_REQ
TIMER_INTR_PEND
ALARM_INTR_REQ
ALARM_INTR_PEND
POINTRREQ1
McASP 0 Transmit interrupt
McASP 0 Receive interrupt
McASP 1 Transmit interrupt
McASP 1 Receive interrupt
McASP 2 Transmit interrupt
McASP 2 Receive interrupt
X
X
X
X
X
X
McASP 0
McASP 1
McASP 2
McBSP
RTC
McBSP Receive Int (legacy mode)
McBSP Transmit Int (legacy mode)
McBSP Receive Overflow Int (legacy mode)
McBSP Common Int
X
X
X
X
X
Timer interrupt
Alarm interrupt
GPIO 0 interrupt 1
GPIO 0 interrupt 2
POINTRPEND1
GPIO 0
POINTRREQ2
POINTRPEND2
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Table 7-18. Interrupts By Module (continued)
DESTINATION
Cortex™-A8
INTERRUPT
DESCRIPTION
POINTRREQ1
POINTRPEND1
POINTRREQ2
POINTRPEND2
GPIO 1 interrupt 1
GPIO 1 interrupt 2
X
X
GPIO 1
PRCM
Reserved
INTR0_INTR
Intr0 pulse version
INTR0_INTR_PEND_N
INTR1_INTR
X
Intr0 level version
Intr1 pulse version
INTR1_INTR_PEND_N
INTR2_INTR
Intr1 level version
HDVPSS
Intr2 pulse version
INTR2_INTR_PEND_N
INTR3_INTR
Intr2 level version
Intr3 pulse version
INTR3_INTR_PEND_N
THALIAIRQ
Intr3 level version
X
Error in the IMG bus
SGX530
(AM3894 only)
TARGETSINTERRUPT
INITMINTERRUPT
INTR0_INTR
Target slave error interrupt
Initiator master error interrupt
Intr0 pulse version
HDMI 1.3
Transmit
INTR0_INTR_PEND_N
INTRREQ
X
X
X
X
Intr0 level version
SVT SmartReflex interrupt pulse version
SVT SmartReflex interrupt level version
HVT SmartReflex interrupt pulse version
HVT SmartReflex interrupt level version
Reserved
SmartReflex0
INTRPEND
INTRREQ
SmartReflex1
PBIST
INTRPEND
MAIL_U0_IRQ
MAIL_U1_IRQ
MAIL_U2_IRQ
MAIL_U3_IRQ
NMI_INT
Mailbox
Mailbox interrupt
NMI
X
X
X
X
X
X
X
X
X
NMI Interrupt
L3 debug error
L3 application error
PAT fault
L3_DBG_IRQ
L3_APP_IRQ
DMM_HIGH_INTRPEND
COMMTX
Infrastructure
DMM
ARM ICECrusher interrupt
COMMRX
Cortex™-A8 SS
BENCH
ARM NPMUIRQ
ELM_IRQ
Error Location process completion
E2ICE interrupt
EMUINT
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7.4.2 Cortex™-A8 Interrupts
The Cortex™-A8 Interrupt Controller (AINTC) takes ARM device interrupts and maps them to either the
interrupt request (IRQ) or fast interrupt request (FIQ) of the ARM with an individual priority level. The
AINTC interrupts must be active low-level interrupts.
The AINTC is responsible for prioritizing all service requests from the system peripherals directed to the
Cortex™-A8 SS and generating either nIRQ or nFIQ to the host. The type of the interrupt (nIRQ or nFIQ)
and the priority of the interrupt inputs are programmable. It has the capability to handle up to 128 requests
which can be steered/prioritized as nFIQ or nIRQ interrupt requests.
The general features of the AINTC are:
•
•
•
•
Up to 128 level-sensitive interrupts inputs
Individual priority for each interrupt input
Each interrupt can be steered to nFIQ or nIRQ
Independent priority sorting for nFIQ and nIRQ.
Table 7-19. Cortex™-A8 Interrupt Controller Connections
INTERRUPT
NUMBER
ACRONYM
SOURCE
0
1
EMUINT
COMMTX
COMMRX
BENCH
Internal
Internal
Internal
Internal
ELM
2
3
4
ELM_IRQ
-
5-6
7
NMI
External Pin
8
-
9
L3DEBUG
L3APPINT
-
L3
L3
10
11
12
13
14
15
16
17
18
19
20-33
34
35
36
37
EDMACOMPINT
EDMAMPERR
EDMAERRINT
-
TPCC
TPCC
TPCC
SATAINT
USBSSINT
USBINT0
USBINT1
-
SATA
USBSS
USBSS
USBSS
USBWAKEUP
PCIeWAKEUP
DSSINT
GFXINT
USBSS
PCIe
HDVPSS
SGX530
(AM8394 only)
38
39
40
41
42
43
HDMIINT
-
HDMI
MACRXTHR0
MACRXINT0
MACTXINT0
MACMISC0
EMAC0
EMAC0
EMAC0
EMAC0
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Table 7-19. Cortex™-A8 Interrupt Controller Connections (continued)
INTERRUPT
NUMBER
ACRONYM
SOURCE
44
45
MACRXTHR1
MACRXINT1
MACTXINT1
MACMISC1
PCIINT0
PCIINT1
PCIINT2
PCIINT3
-
EMAC1
EMAC1
EMAC1
EMAC1
PCIe
46
47
48
49
PCIe
50
PCIe
51
PCIe
52-63
64
SDINT
SD/SDIO
SPI
65
SPIINT
66
-
67
TINT1
Timer1
Timer2
Timer3
I2C0
68
TINT2
69
TINT3
70
I2CINT0
I2CINT1
UARTINT0
UARTINT1
UARTINT2
RTCINT
71
I2C1
72
UART0
UART1
UART2
RTC
73
74
75
76
RTCALARMINT
MBINT
RTC
77
Mailbox
78-79
80
-
MCATXINT0
MCARXINT0
MCATXINT1
MCARXINT1
MCATXINT2
MCARXINT2
MCBSPINT
-
McASP0
McASP0
McASP1
McASP1
McASP2
McASP2
McBSP
81
82
83
84
85
86
87-90
91
WDTINT
TINT4
WDTIMER1
Timer4
92
93
TINT5
Timer5
94
TINT6
Timer6
95
TINT7
Timer7
96
GPIOINT0A
GPIOINT0B
GPIOINT1A
GPIOINT1B
GPMCINT
DDRERR0
DDRERR1
-
GPIO 0
97
GPIO 0
98
GPIO 1
99
GPIO 1
100
101
102
103-111
112
113
GPMC
DDR EMIF0
DDR EMIF1
TCERRINT0
TCERRINT1
TPTC0
TPTC1
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Table 7-19. Cortex™-A8 Interrupt Controller Connections (continued)
INTERRUPT
NUMBER
ACRONYM
SOURCE
114
115
TCERRINT2
TPTC2
TPTC3
TCERRINT3
116-119
120
-
SMRFLX0
SmartReflex0
SmartReflex1
121
SMRFLX1
123
-
124
DMMINT
-
DMM
125-127
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8 Peripheral Information and Timings
8.1 Parameter Information
Tester Pin Electronics
Data Sheet Timing Reference Point
42 Ω
3.5 nH
Output
Under
Test
Transmission Line
Z0 = 50 Ω
(see Note)
Device Pin
(see Note)
4.0 pF
1.85 pF
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be
taken into account.Atransmission line with a delay of 2 ns can be used to produce the desired transmission line effect. The transmission line is
intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Figure 8-1. Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
8.1.1 1.8-V and 3.3-V Signal Transition Levels
All input and output timing parameters are referenced to Vref for both "0" and "1" logic levels. For 3.3-V I/O,
Vref = 1.5 V. For 1.8-V I/O, Vref = 0.9 V.
Vref
Figure 8-2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, VOL
MAX and VOH MIN for output clocks.
Vref = VIH MIN (or VOH MIN)
Vref = VIL MAX (or VOL MAX)
Figure 8-3. Rise and Fall Transition Time Voltage Reference Levels
8.1.2 3.3-V Signal Transition Rates
All timings are tested with an input edge rate of 4 volts per nanosecond (4 V/ns).
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8.1.3 Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data manual do not include delays by board routings. As a
good board design practice, such delays must always be taken into account. Timing values may be
adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer
information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS
models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing
Analysis application report (literature number SPRA839). If needed, external logic hardware such as
buffers may be used to compensate any timing differences.
For the DDR2/3, PCIe, SATA, USB, and HDMI interfaces, IBIS models are not used for timing
specification. TI provides, in this document, a PCB routing rule solution for each interface that describes
the routing rules used to ensure the interface timings are met. Video DAC guidelines (Section 8.10.2) are
also included to discuss important layout considerations.
8.2 Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
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8.3 DDR2/3 Memory Controller
The device has a dedicated interface to DDR3 and DDR2 SDRAM. It supports JEDEC standard-compliant
DDR2 and DDR3 SDRAM devices with the following features:
•
•
•
16-bit or 32-bit data path to external SDRAM memory
Memory device capacity: 64Mb, 128Mb, 256Mb, 512Mb, 1Gb, 2Gb and 4Gb (x16-bit only) devices
Support for two independent chip selects, with their corresponding register sets, and independent page
tracking
•
•
Two interfaces with associated DDR2/3 PHYs
Dynamic memory manager allows for interleaving of data between the two DDR interfaces.
For details on the DDR2/3 Memory Controller, see the DDR2/3 Memory Controller chapter in the AM389x
Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
8.3.1 DDR2 Routing Specifications
CAUTION
The DDR2 Routing Specifications are preliminary and are being verified by design
simulations.
8.3.1.1 Board Designs
TI only supports board designs that follow the specifications outlined in this document. The switching
characteristics and the timing diagram for the DDR2 memory controller are shown in Table 8-1 and
Figure 8-4.
Table 8-1. Switching Characteristics Over Recommended Operating Conditions for DDR2 Memory
Controller
-1G
NO.
PARAMETER
UNIT
MIN
MAX
1
tc(DDR_CLK)
Cycle time, DDR_CLK
2.5
8
ns
1
DDR_CLK
Figure 8-4. DDR2 Memory Controller Clock Timing
8.3.1.2 DDR2 Interface
This section provides the timing specification for the DDR2 interface as a PCB design and manufacturing
specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk,
and signal timing. These rules, when followed, result in a reliable DDR2 memory system without the need
for a complex timing closure process. For more information regarding the guidelines for using this DDR2
specification, see Understanding TI’s PCB Routing Rule-Based DDR2 Timing Specification Application
Report (SPRAAV0).
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8.3.1.2.1 DDR2 Interface Schematic
Figure 8-5 shows the DDR2 interface schematic for a x32 DDR2 memory system. In Figure 8-6 the x16
DDR2 system schematic is identical except that the high-word DDR2 device is deleted.
When not using a DDR2 interface, the proper method of handling the unused pins is to tie off the DQS
pins by pulling the non-inverting DQS pin to the DDR_1V8 supply via a 1k-Ω resistor and pulling the
inverting DQS pin to ground via a 1k-Ω resistor. This needs to be done for each byte not used. Also,
include the 50-Ω pulldown for DDR[x]_VTP. All other DDR interface pins can be left unconnected. Note
that the supported modes for use of the DDR EMIF are 32 bits wide, 16 bits wide, or not used.
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DDR2
DQ0
DDR[x]_D[0]
DDR[x]_D[7]
DQ7
LDM
LDQS
DDR[x]_DQM[0]
DDR[x]_DQS[0]
DDR[x]_DQS[0]
DDR[x]_D[8]
LDQS
DQ8
DDR[x]_D[15]
DDR[x]_DQM[1]
DDR[x]_DQS[1]
DQ15
UDM
UDQS
DDR[x]_DQS[1]
DDR[x]_ODT[0]
UDQS
ODT
T0
DDR2
ODT
DDR_ODT1
DDR_D16
NC
DQ0
DDR[x]_D[23
DDR[x]_DQM[2]
DDR[x]_DQS[2]
DQ7
LDM
LDQS
DDR[x]_DQS[2]
DDR[x]_D[24]
LDQS
DQ8
DDR[x]_D[31]
DDR[x]_DQM[3]
DDR[x]_DQS[3]
DDR[x]_DQS[3]
DQ15
UDM
UDQS
UDQS
DDR[x]_BA[0]
T0
BA0
BA0
DDR[x]_BA[2]
DDR[x]_A[0]
T0
T0
BA2
A0
BA2
A0
DDR[x]_A[14]
DDR[x]_CS[0]
T0
T0
A14
CS
A14
CS
DDR[x]_CS[1]
DDR[x]_CAS
DDR[x]_RAS
NC
CAS
RAS
Vio 1.8(A)
CAS
RAS
T0
T0
T0
T0
T0
T0
DDR[x]_WE
DDR[x]_CKE
WE
WE
CKE
CKE
0.1 µF
0.1 µF
1 K Ω 1%
DDR[x]_CLK[x]
CK
CK
CK
CK
DDR[x]_CLK[x]
VREF VREF
VREF VREF
VREFSSTL_DDR[x]
VREF
0.1 µF(B)
0.1 µF(B)
0.1 µF(B)
1 K Ω 1%
DDR[x]_RST
DDR[x]_VTP
NC
50 Ω ( 2%)
T0
Termination is required. See terminator comments.
A. Vio1.8 is the power supply for the DDR2 memories and the AM389x DDR2 interface.
B. One of these capacitors can be eliminated if the divider and its capacitors are placed near a VREF pin.
Figure 8-5. 32-Bit DDR2 High-Level Schematic
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DDR2
DQ0
DDR[x]_D[0]
DDR[x]_D[7]
DQ7
LDM
LDQS
DDR[x]_DQM[0]
DDR[x]_DQS[0]
DDR[x]_DQS[0]
DDR[x]_D[8]
LDQS
DQ8
DDR[x]_D[15]
DDR[x]_DQM[1]
DDR[x]_DQS[1]
DDR[x]_DQS[1]
DQ15
UDM
UDQS
UDQS
DDR[x]_ODT[0]
DDR[x]_ODT[1]
DDR[x]_D[16]
T0
NC
ODT
NC
Vio 1.8(A)
DDR[x]_D[23]
NC
NC
DDR[x]_DQM[2]
1 KΩ
1 KΩ
DDR[x]_DQS[2]
DDR[x]_DQS[2]
NC
DDR[x]_D[24]
Vio 1.8(A)
DDR[x]_D[31]
DDR[x]_DQM[3]
DDR[x]_DQS[3]
DDR[x]_DQS[3]
NC
NC
1 KΩ
1 KΩ
DDR[x]_BA[0]
T0
BA0
DDR[x]_BA[2]
DDR[x]_A[0]
T0
T0
BA2
A0
DDR[x]_A[14]
DDR[x]_CS[0]
DDR[x]_CS[1]
DDR[x]_CAS
DDR[x]_RAS
DDR[x]_WE
T0
T0
A14
CS
NC
CAS
RAS
T0
T0
T0
T0
T0
T0
Vio 1.8(A)
WE
DDR[x]_CKE
DDR[x]_CLK[x]
CKE
CK
CK
1 K Ω 1%
0.1 µF
0.1 µF
DDR[x]_CLK[x]
VREFSSTL_DDR[x]
VREF VREF
VREF
0.1 µF(B)
0.1 µF(B)
1 K Ω 1%
DDR[x]_RST
DDR[x]_VTP
NC
50 Ω ( 2%)
T0
Termination is required. See terminator comments.
A. Vio1.8 is the power supply for the DDR2 memories and the AM389x DDR2 interface.
B. One of these capacitors can be eliminated if the divider and its capacitors are placed near a VREF pin.
Figure 8-6. 16-Bit DDR2 High-Level Schematic
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8.3.1.2.2 Compatible JEDEC DDR2 Devices
Table 8-2 shows the parameters of the JEDEC DDR2 devices that are compatible with this interface.
Generally, the DDR2 interface is compatible with x16 DDR2-800 speed grade DDR2 devices.
Table 8-2. Compatible JEDEC DDR2 Devices
NO.
1
PARAMETER
MIN
MAX
UNIT
JEDEC DDR2 device speed grade(1)
JEDEC DDR2 device bit width
JEDEC DDR2 device count(2)
JEDEC DDR2 device ball count(3)
DDR2-800
2
x16
1
x16
2
Bits
Devices
Balls
3
4
84
92
(1) Higher DDR2 speed grades are supported due to inherent JEDEC DDR2 backwards compatibility.
(2) One DDR2 device is used for a 16-bit DDR2 memory system. Two DDR2 devices are used for a 32-bit DDR2 memory system.
(3) The 92-ball devices are retained for legacy support. New designs will migrate to 84-ball DDR2 devices. Electrically, the 92- and 84-ball
DDR2 devices are the same.
8.3.1.2.3 PCB Stackup
The minimum stackup required for routing the AM389x device is a six-layer stackup as shown in Table 8-
3. Additional layers may be added to the PCB stackup to accommodate other circuitry or to reduce the
size of the PCB footprint.
Table 8-3. Minimum PCB Stackup
LAYER
TYPE
Signal
Plane
Plane
Signal
Plane
Signal
DESCRIPTION
Top routing mostly horizontal
Ground
1
2
3
4
5
6
Power
Internal routing
Ground
Bottom routing mostly vertical
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Complete stackup specifications are provided in Table 8-4.
Table 8-4. PCB Stackup Specifications
NO.
1
PARAMETER
MIN
TYP
MAX
UNIT
PCB routing/plane layers
Signal routing layers
6
3
2
2
3
Full ground layers under DDR2 routing region
Number of ground plane cuts allowed within DDR routing region
Number of ground reference planes required for each DDR2 routing layer
Number of layers between DDR2 routing layer and reference ground plane
PCB routing feature size
4
0
0
5
1
6
7
4
4
Mils
Mils
Mils
Mils
mm
8
PCB trace width, w
9
PCB BGA escape via pad size(1)
18
10
0.3
20
10 PCB BGA escape via hole size(1)
11 Processor BGA pad size
12 DDR2 device BGA pad size(2)
13 Single-ended impedance, Zo
14 Impedance control(3)
50
75
Ω
Ω
Z-5
Z
Z+5
(1) A 20/10 via may be used if enough power routing resources are available. An 18/10 via allows for more flexible power routing to the
processor.
(2) For the DDR2 device BGA pad size, see the DDR2 device manufacturer documentation.
(3) Z is the nominal singled-ended impedance selected for the PCB specified by item 13.
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8.3.1.2.4 Placement
Figure 8-7 shows the required placement for the processor as well as the DDR2 devices. The dimensions
for this figure are defined in Table 8-5. The placement does not restrict the side of the PCB on which the
devices are mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and
allow for proper routing space. For a 16-bit DDR memory system, the high-word DDR2 device is omitted
from the placement.
Recommended DDR2 Device
Orientation
X
1
X
A1
A1
1
1
X
X
OFFSET OFFSET
Y
Figure 8-7. AM389x Device and DDR2 Device Placement
Table 8-5. Placement Specifications
NO.
1
PARAMETER
MIN
MAX
1660
1280
650
UNIT
Mils
Mils
Mils
X + Y(1)(2)
X'(1)(2)
X' Offset(1)(2) (3)
DDR2 keepout region(4)
2
3
4
5
Clearance from non-DDR2 signal to DDR2 keepout region(5)
4
w
(1) For dimension definitions, see Figure 8-5.
(2) Measurements from center of processor to center of DDR2 device.
(3) For 16-bit memory systems, it is recommended that X' offset be as small as possible.
(4) DDR2 keepout region to encompass entire DDR2 routing area.
(5) Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.
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8.3.1.2.5 DDR2 Keepout Region
The region of the PCB used for the DDR2 circuitry must be isolated from other signals. The DDR2
keepout region is defined for this purpose and is shown in Figure 8-8. The size of this region varies with
the placement and DDR routing. Additional clearances required for the keepout region are shown in
Table 8-5.
A1
A1
DDR2 Device
A1
A1
Figure 8-8. DDR2 Keepout Region
NOTE
The region shown in should encompass all the DDR2 circuitry and varies depending on
placement. Non-DDR2 signals should not be routed on the DDR signal layers within the
DDR2 keepout region. Non-DDR2 signals may be routed in the region, provided t hey are
routed on layers separated from DDR2 signal layers by a ground layer. No breaks should be
allowed in the reference ground layers in this region. In addition, the 1.8V power plane
should cover the entire keepout region. Routes for the two DDR interfaces must be
separated by at least 4x; the more separation, the better.
8.3.1.2.6 Bulk Bypass Capacitors
Bulk bypass capacitors are required for moderate speed bypassing of the DDR2 and other circuitry.
Table 8-6 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note
that this table only covers the bypass needs of the DDR2 interfaces and DDR2 device. Additional bulk
bypass capacitance may be needed for other circuitry.
Table 8-6. Bulk Bypass Capacitors
No. Parameter
Min
6
Max
Unit
Devices
μF
1
2
3
4
5
6
DVDD18 bulk bypass capacitor count(1)
DVDD18 bulk bypass total capacitance
DDR#1 bulk bypass capacitor count(1)
DDR#1 bulk bypass total capacitance(1)
DDR#2 bulk bypass capacitor count(2)
DDR#2 bulk bypass total capacitance(1)(2)
60
1
Devices
μF
10
1
Devices
μF
10
(1) These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed
(HS) bypass capacitors. Use half of these capacitors for DDR[0] and half for DDR[1].
(2) Only used on 32-bit wide DDR2 memory systems.
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8.3.1.2.7 High-Speed Bypass Capacitors
High-speed (HS) bypass capacitors are critical for proper DDR2 interface operation. It is particularly
important to minimize the parasitic series inductance of the HS bypass capacitors, processor/DDR power,
and processor/DDR ground connections. Table 8-7 contains the specification for the HS bypass capacitors
as well as for the power connections on the PCB.
Table 8-7. High-Speed Bypass Capacitors
NO.
1
PARAMETER
MIN
MAX
UNIT
HS bypass capacitor package size(1)
0402 10 Mils
2
Distance from HS bypass capacitor to device being bypassed
Number of connection vias for each HS bypass capacitor(2)
Trace length from bypass capacitor contact to connection via
Number of connection vias for each processor power/ground ball
Trace length from processor power/ground ball to connection via
Number of connection vias for each DDR2 device power/ground ball
Trace length from DDR2 device power/ground ball to connection via
DVDD18 HS bypass capacitor count(3)(4)
250
30
Mils
Vias
Mils
3
2
1
1
4
5
Vias
Mils
6
35
7
1
Vias
Mils
8
35
9
40
2.4
8
Devices
μF
10 DVDD18 HS bypass capacitor total capacitance(5)
11 DDR device HS bypass capacitor count(6)(7)
12 DDR device HS bypass capacitor total capacitance(7)
Devices
μF
0.4
(1) LxW, 10-mil units; for example, a 0402 is a 40x20-mil surface-mount capacitor.
(2) An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board.
(3) These devices should be placed as close as possible to the device being bypassed.
(4) Use half of these capacitors for DDR[0] and half for DDR[1].
(5) Use half of these capacitors for DDR[0] and half for DDR[1].
(6) These devices should be placed as close as possible to the device being bypassed.
(7) Per DDR device.
8.3.1.2.8 Net Classes
Table 8-8 lists the clock net classes for the DDR2 interface. Table 8-9 lists the signal net classes, and
associated clock net classes, for the signals in the DDR2 interface. These net classes are used for the
termination and routing rules that follow.
Table 8-8. Clock Net Class Definitions
CLOCK NET CLASS PROCESSOR PIN NAMES
CK
DDR[x]_CLK[x]/DDR[x]_CLK[x]
DDR[x]_DQS[0]/DDR[x]_DQS[0]
DDR[x]_DQS[1]/DDR[x]_DQS[1]
DDR[x]_DQS[2]/DDR[x]_DQS[2]
DDR[x]_DQS[3]/DDR[x]_DQS[3]
DQS0
DQS1
DQS2(1)
DQS3(1)
(1) Only used on 32-bit wide DDR2 memory systems.
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Table 8-9. Signal Net Class Definitions
ASSOCIATED CLOCK
NET CLASS
SIGNAL NET CLASS
PROCESSOR PIN NAMES
ADDR_CTRL
CK
DDR[x]_BA[2:0], DDR[x]_A[14:0], DDR[x]_CS[x], DDR[x]_CAS, DDR[x]_RAS,
DDR[x]_WE, DDR[x]_CKE, DDR[x]_ODT[x]
DQ0
DQ1
DQ2(1)
DQ3(1)
DQS0
DQS1
DQS2
DQS3
DDR[x]_D[7:0], DDR[x]_DQM[0]
DDR[x]_D[15:8], DDR[x]_DQM[1]
DDR[x]_D[23:16], DDR[x]_DQM[2]
DDR[x]_D[31:24], DDR[x]_DQM[3]
(1) Only used on 32-bit wide DDR2 memory systems.
8.3.1.2.9 DDR2 Signal Termination
Signal terminators are required in CK and ADDR_CTRL net classes. Serial terminators may be used on
data lines to reduce EMI risk; however, serial terminations are the only type permitted. ODT's are
integrated on the data byte net classes. They should be enabled to ensure signal integrity.Table 8-10
shows the specifications for the series terminators.
Table 8-10. DDR2 Signal Terminations
NO. PARAMETER
MIN
0
TYP
MAX UNIT
1
2
3
CK net class(1)(2)
ADDR_CTRL net class(1)(3)(4)(2)
Data byte net classes (DQS0-DQS3, DQ0-DQ3)(5)
10
Zo
0
Ω
Ω
Ω
0
22
0
(1) Only series termination is permitted, parallel or SST specifically disallowed on board.
(2) Only required for EMI reduction.
(3) Terminator values larger than typical only recommended to address EMI issues.
(4) Termination value should be uniform across net class.
(5) No external terminations allowed for data byte net classes. ODT is to be used.
8.3.1.2.10 VREFSSTL_DDR Routing
VREFSSTL_DDR is used as a reference by the input buffers of the DDR2 memories as well as the
processor. VREF is intended to be half the DDR2 power supply voltage and should be created using a
resistive divider as shown in Figure 8-6. Other methods of creating VREF are not recommended. Figure 8-
9 shows the layout guidelines for VREF.
VREF Nominal Max Trace
width is 20 mils
DDR2 Device
VREF Bypass Capacitor
A1
A1
+
+
DDR2 Controller
Neck down to minimum in BGA escape
regions is acceptable. Narrowing to
accomodate via congestion for short
distances is also acceptable. Best
performance is obtained if the width
of VREF is maximized.
Figure 8-9. VREF Routing and Topology
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8.3.1.3 DDR2 CK and ADDR_CTRL Routing
Figure 8-10 shows the topology of the routing for the CK and ADDR_CTRL net classes. The route is a
balanced T as it is intended that the length of segments B and C be equal. In addition, the length of A
(A'+A'') should be maximized.
A1
A1
B
C
A´´
T
A´
A = A´ + A´´
Figure 8-10. CK and ADDR_CTRL Routing and Topology
(1)
Table 8-11. CK and ADDR_CTRL Routing Specification
NO.
1
PARAMETER
MIN
TYP
MAX
2w
UNIT
Center-to-center CK-CK spacing
CK/CK skew(1)
2
25
Mils
Mils
3
CK B-to-C skew length mismatch
25
4
Center-to-center CK to other DDR2 trace spacing(2)
CK/ADDR_CTRL nominal trace length(3)
4w
5
CACLM-50
CACLM
CACLM+50
100
Mils
Mils
Mils
6
ADDR_CTRL-to-CK skew length mismatch
7
ADDR_CTRL-to-ADDR_CTRL skew length mismatch
Center-to-center ADDR_CTRL to other DDR2 trace spacing(2)
Center-to-center ADDR_CTRL to other ADDR_CTRL trace spacing(2)
ADDR_CTRL B-to-C skew length mismatch
100
8
4w
3w
9
10
100
Mils
(1) The length of segment A=A'+A′′ as shown in Figure 8-10.
(2) Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
(3) CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes.
Figure 8-11 shows the topology and routing for the DQS and DQ net classes; the routes are point to point.
Skew matching across bytes is not needed nor recommended.
T
T
T
T
A1
A1
E2
E3
E0
E1
Figure 8-11. DQS and DQ Routing and Toplogy
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Table 8-12. DQS and DQ Routing Specification
NO.
1
PARAMETER
Center-to-center DQS-DQSn spacing in E0|E1|E2|E3
DQS-DQSn skew in E0|E1|E2|E3
MIN
TYP
MAX
2w
UNIT
2
25
Mils
3
Center-to-center DQS to other DDR2 trace spacing(1)
4w
(2)(3)(4)
4
DQS/DQ nominal trace length
DQLM-50
DQLM
DQLM+50
Mils
Mils
Mils
Vias
5
DQ-to-DQS skew length mismatch(2)(3)(4)
DQ-to-DQ skew length mismatch(2)(3)(4)
DQ-to-DQ/DQS via count mismatch(2)(3)(4)
Center-to-center DQ to other DDR2 trace spacing(1)(5)
Center-to-center DQ to other DQ trace spacing(1)(6)(7)
100
100
1
6
7
8
4w
3w
9
10 DQ/DQS E skew length mismatch(2)(3)(4)
100
Mils
(1) Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
(2) A 16-bit DDR memory system has two sets of data net classes; one for data byte 0, and one for data byte 1, each with an associated
DQS (2 DQSs) per DDR EMIF used.
(3) A 32-bit DDR memory system has four sets of data net classes; one each for data bytes 0 through 3, and each associated with a DQS
(4 DQSs) per DDR EMIF used.
(4) There is no need, and it is not recommended, to skew match across data bytes; that is, from DQS0 and data byte 0 to DQS1 and data
byte 1.
(5) DQs from other DQS domains are considered other DDR2 trace.
(6) DQs from other data bytes are considered other DDR2 trace.
(7) DQLM is the longest Manhattan distance of each of the DQS and DQ net classes.
8.3.2 DDR3 Routing Specifications
CAUTION
The DDR3 Routing Specifications are preliminary and are being verified by design
simulations.
8.3.2.1 Board Designs
TI only supports board designs utilizing DDR3 memory that follow the specifications in this document. The
switching characteristics and timing diagram for the DDR3 memory controller are shown in Table 8-13 and
Figure 8-12.
Table 8-13. Switching Characteristics Over Recommended Operating Conditions for DDR3 Memory
Controller
-1G
NO.
PARAMETER
UNIT
MIN
MAX
1
tc(DDR_CLK)
Cycle time, DDR_CLK
1.25
3.3(1)
ns
(1) This is the absolute maximum the clock period can be. Actual maximum clock period may be limited by DDR3 speed grade and
operating frequency (see the DDR3 memory device data sheet).
1
DDR_CLK
Figure 8-12. DDR3 Memory Controller Clock Timing
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8.3.2.1.1 DDR3 versus DDR2
This specification only covers AM389x processor PCB designs that utilize DDR3 memory. Designs using
DDR2 memory should use the PCB design specifications for DDR2 memory in Section 8.3.1. While
similar, the two memory systems have different requirements. It is currently not possible to design one
PCB that covers both DDR2 and DDR3.
8.3.2.2 DDR3 Device Combinations
Since there are several possible combinations of device counts and single- or dual-side mounting,
Table 8-14 summarizes the supported device configurations.
Table 8-14. Supported DDR3 Device Combinations(1)
NUMBER OF DDR3 DEVICES
DDR3 DEVICE WIDTH (BITS)
MIRRORED?
DDR3 EMIF WIDTH (BITS)
1
2
2
2
4
4
16
8
N
Y(2)
N
16
16
32
32
32
32
16
16
8
Y(2)
N
Y(3)
8
(1) This table is per EMIF.
(2) Two DDR3 devices are mirrored when one device is placed on the top of the board and the second device is placed on the bottom of
the board.
(3) This is two mirrored pairs of DDR3 devices.
8.3.2.2.1 DDR3 EMIFs
The processor contains two separate DDR3 EMIFs. This specification covers one of these EMIFs
(DDR[0]) and, thus, needs to be implemented twice, once for each EMIF. The PCB layout generally turns
out to be a semi-mirror with DDR[1] being a flipped version of DDR[0]; the only exception being the DDR3
devices themselves are not flipped unless mounted on opposite sides of the PCB. Requirements are
identical between the two EMIFs.
8.3.2.3 DDR3 Interface Schematic
8.3.2.3.1 32-Bit DDR3 Interface
The DDR3 interface schematic varies, depending upon the width of the DDR3 devices used and the width
of the bus used (16 or 32 bits). General connectivity is straightforward and very similar. 16-bit DDR
devices look like two 8-bit devices. Figure 8-13 and Figure 8-14 show the schematic connections for 32-bit
interfaces using x16 devices.
8.3.2.3.2 16-Bit DDR3 Interface
Note that the 16-bit wide interface schematic is practically identical to the 32-bit interface (see Figure 8-13
and Figure 8-14); only the high-word DDR memories are removed and the unused DQS inputs are tied off.
The processor DDR[x]_DQS[2] and DDR[x]_DQS[3] pins should be pulled to the DDR supply via 1-kΩ
resistors. Similarly, the DDR[x]_DQS[2] and DDR[x]_DQS[3] pins should be pulled to ground via 1-kΩ
resistors.
When not using a DDR interface, the proper method of handling the unused pins is to tie off the DQS pins
by pulling the non-inverting DQS pin to the DDR_1V5 supply via a 1k-Ω resistor and pulling the inverting
DQSn pin to ground via a 1k-Ω resistor. This needs to be done for each byte not used. Also, include the
50-Ω pulldown for DDR[x]_VTP. All other DDR interface pins can be left unconnected. Note that the
supported modes for use of the DDR EMIF are 32 bits wide, 16 bits wide, or not used.
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32-bit DDR3 EMIF
DDR[0] or DDR[1]
DDR[x]_CLK[1]
DDR[x]_CLK[1]
DDR[x]_ODT[1]
DDR[x]_CS[1]
NC
NC
NC
NC
16-Bit DDR3
Devices
DDR[x]_D[31]
DQ15
8
DDR[x]_D[24]
DQ8
DDR[x]_DQM[3]
DDR[x]_DQS[3]
DDR[x]_DQS[3]
UDM
UDQS
UDQS
DDR[x]_D[23]
DQ7
8
DDR[x]_D[16]
D08
DDR[x]_DQM[2]
DDR[x]_DQS[2]
DDR[x]_DQS[2]
LDM
LDQS
LDQS
DDR[x]_D[15]
DQ15
DQ8
8
DDR[x]_D[8]
DDR[x]_DQM[1]
DDR[x]_DQS[1]
DDR[x]_DQS[1]
UDM
UDQS
UDQS
DDR[x]_D[7]
DQ7
8
DDR[x]_D[0]
DQ0
DDR[x]_DQM[0]
DDR[x]_DQS[0]
DDR[x]_DQS[0]
LDM
LDQS
LDQS
0.1 µF
Zo
Zo
DDR[x]_CLK[0]
DDR[x]_CLK[0]
CK
CK
CK
CK
DDR_1V5
DDR[x]_ODT[0]
DDR[x]_CS[0]
DDR[x]_BA[0]
DDR[x]_BA[1]
DDR[x]_BA[2]
ODT
ODT
CS
CS
BA0
BA1
BA2
BA0
BA1
BA2
DDR_VTT
Zo
Zo
DDR[x]_A[0]
A0
A0
15
DDR[x]_A[14]
A14
A14
DDR[x]_CAS
DDR[x]_RAS
DDR[x]_WE
DDR[x]_CKE
DDR[x]_RST
CAS
CAS
RAS
WE
RAS
WE
CKE
CKE
RST
DDR_VREF
RST
ZQ
ZQ
ZQ
ZQ
VREFDQ
VREFCA
VREFDQ
VREFCA
VREFSSTL_DDR[x]
0.1 µF
0.1 µF
0.1 µF
DDR[x]_VTP
50 Ω ( 2%)
Zo
ZQ
Termination is required. See terminator comments.
Value determined according to the DDR memory device data sheet.
Figure 8-13. 32-Bit, One-Bank DDR3 Interface Schematic Using Two 16-Bit DDR3 Devices
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32-bit DDR3 EMIF
DDR[0] or DDR[1]
DDR[x]_CLK[1]
DDR[x]_CLK[1]
DDR[x]_ODT[1]
DDR[x]_CS[1]
NC
NC
NC
NC
8-Bit DDR3
Devices
8-Bit DDR3
Devices
DDR[x]_D[31]
DQ7
8
DDR[x]_D[24]
DQ0
DDR[x]_DQM[3]
DM/TQS
TDQS
DQS
DQS
NC
DDR[x]_DQS[3]
DDR[x]_DQS[3]
DDR[x]_D[23]
DQ7
DQ0
8
DDR[x]_D[16]
DDR[x]_DQM[2]
DM/TQS
TDQS
DQS
NC
DDR[x]_DQS[2]
DDR[x]_DQS[2]
DQS
DDR[x]_D[15]
DQ7
DQ0
8
DDR[x]_D[8]
DDR[x]_DQM[1]
DM/TQS
TDQS
DQS
NC
DDR[x]_DQS[1]
DDR[x]_DQS[1]
DQS
DDR[x]_D[7]
DQ7
DQ0
8
DDR[x]_D[0]
DDR[x]_DQM[0]
DM/TQS
TDQS
DQS
NC
DDR[x]_DQS[0]
DDR[x]_DQS[0]
DQS
0.1 µF
Zo
Zo
DDR[x]_CLK[0]
DDR[x]_CLK[0]
CK
CK
CK
CK
CK
CK
CK
CK
DDR_1V5
DDR[x]_ODT[0]
DDR[x]_CS[0]
DDR[x]_BA[0]
DDR[x]_BA[1]
DDR[x]_BA[2]
ODT
ODT
ODT
ODT
CS
CS
CS
CS
BA0
BA1
BA2
BA0
BA1
BA2
BA0
BA1
BA2
BA0
BA1
BA2
DDR_VTT
Zo
Zo
DDR[x]_A[0]
A0
A0
A0
A0
15
DDR[x]_A[14]
A14
A14
A14
A14
DDR[x]_CAS
DDR[x]_RAS
DDR[x]_WE
DDR[x]_CKE
DDR[x]_RST
CAS
CAS
RAS
WE
CAS
CAS
RAS
WE
RAS
RAS
WE
WE
CKE
CKE
RST
CKE
CKE
RST
RST
RST
DDR_VREF
ZQ
ZQ
ZQ
ZQ
ZQ
ZQ
ZQ
ZQ
VREFDQ
VREFCA
VREFDQ
VREFCA
VREFDQ
VREFCA
VREFDQ
VREFCA
VREFSSTL_DDR[x]
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
DDR[x]_VTP
50 Ω ( 2%)
Zo
ZQ
Termination is required. See terminator comments.
Value determined according to the DDR memory device data sheet.
Figure 8-14. 32-Bit, One-Bank DDR3 Interface Schematic Using Four 8-Bit DDR3 Devices
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8.3.2.4 Compatible JEDEC DDR3 Devices
Table 8-15 shows the parameters of the JEDEC DDR3 devices that are compatible with this interface.
Generally, the DDR3 interface is compatible with DDR3-1600 devices in the x8 or x16 widths.
Table 8-15. Compatible JEDEC DDR3 Devices
NO.
1
PARAMETER
MIN
MAX
UNIT
JEDEC DDR3 device speed grade(1)
JEDEC DDR3 device bit width
JEDEC DDR3 device count(2)
DDR3-800
DDR3-1600
2
x8
2
x16
8
Bits
3
Devices
(1) DDR3 speed grade depends on desired clock rate. Data rate is 2x the clock rate. For DDR3-1600, the clock rate is 800 MHz.
(2) For valid DDR3 device configurations and device counts, see Section 8.3.2.3, Figure 8-13, and Figure 8-14.
8.3.2.5 PCB Stackup
The minimum stackup for routing the DDR3 interface is a four-layer stack up as shown in Table 8-16.
Additional layers may be added to the PCB stackup to accommodate other circuitry, enhance SI/EMI
performance, or to reduce the size of the PCB footprint. A six-layer stackup is shown in Table 8-17.
Complete stackup specifications are provided in Table 8-18.
Table 8-16. Minimum PCB Stackup
LAYER
TYPE
Signal
Plane
Plane
Signal
DESCRIPTION
1
2
3
4
Top routing mostly vertical
Split power plane
Full ground plane
Bottom routing mostly horizontal
Table 8-17. Six-Layer PCB Stackup Suggestion
LAYER
TYPE
Signal
Plane
Plane
Plane
Plane
Signal
DESCRIPTION
1
2
3
4
5
6
Top routing mostly vertical
Ground
Split power plane
Split power plane or Internal routing
Ground
Bottom routing mostly horizontal
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Table 8-18. PCB Stackup Specifications
PARAMETER
MIN
TYP
MAX
UNIT
1
2
3
4
5
6
7
8
9
PCB routing/plane layers
Signal routing layers
4
2
1
1
6
Full ground reference layers under DDR3 routing region(1)
Full 1.5-V power reference layers under the DDR3 routing region(1)
Number of reference plane cuts allowed within DDR routing region(2)
Number of layers between DDR3 routing layer and reference plane(3)
PCB routing feature size
0
0
4
4
Mils
Mils
Mils
Mils
mm
PCB trace width, w
PCB BGA escape via pad size(4)
18
10
0.3
20
10 PCB BGA escape via hole size
11 Processor BGA pad size
12 DDR3 device BGA pad size(5)
13 Single-ended impedance, Zo
14 Impedance control(6)
50
75
Ω
Ω
Z-5
Z
Z+5
(1) Ground reference layers are preferred over power reference layers. Be sure to include bypass caps to accommodate reference layer
return current as the trace routes switch routing layers.
(2) No traces should cross reference plane cuts within the DDR routing region. High-speed signal traces crossing reference plane cuts
create large return current paths which can lead to excessive crosstalk and EMI radiation.
(3) Reference planes are to be directly adjacent to the signal plane to minimize the size of the return current loop.
(4) An 18-mil pad assumes Via Channel is the most economical BGA escape. A 20-mil pad may be used if additional layers are available
for power routing. An 18-mil pad is required for minimum layer count escape.
(5) For the DDR3 device BGA pad size, see the DDR3 device manufacturer documentation.
(6) Z is the nominal singled-ended impedance selected for the PCB specified by item 13.
8.3.2.6 Placement
Figure 8-15 shows the required placement for the processor as well as the DDR3 devices. The
dimensions for this figure are defined in Table 8-19. The placement does not restrict the side of the PCB
on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace
lengths and allow for proper routing space. For a 16-bit DDR memory system, the high-word DDR3
device(s) are omitted from the placement.
X1
X2
X2
X2
DDR3
Controller
Y
Figure 8-15. Placement Specifications
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Table 8-19. Placement Specifications
NO.
PARAMETER
MIN
MAX
1000
600
UNIT
Mils
Mils
Mils
1
2
3
4
5
X1(1)(2)(3)
X2(1)(2)
Y Offset(1)(2)(3)
1500
DDR3 keepout region
Clearance from non-DDR3 signal to DDR3 keepout region(4)(5)(6)
4
w
(1) For dimension definitions, see Figure 8-15.
(2) Measurements from center of processor to center of DDR3 device.
(3) Minimizing X1 and Y improves timing margins.
(4) w is defined as the signal trace width.
(5) Non-DDR3 signals allowed within DDR3 keepout region provided they are separated from DDR3 routing layers by a ground plane.
(6) Note that DDR3 signals from one DDR3 controller are considered non-DDR3 to the other controller. In other words, keep the two DDR3
interfaces separated by this specification.
8.3.2.7 DDR3 Keepout Region
The region of the PCB used for DDR3 circutry must be isolated from other signals. The DDR3 keepout
region is defined for this purpose and is shown in Figure 8-16. The size of this region varies with the
placement and DDR routing. Additional clearances required for the keepout region are shown in Table 8-
19. Non-DDR3 signals should not be routed on the DDR signal layers within the DDR3 keepout region.
Non-DDR3 signals may be routed in the region, provided they are routed on layers separated from the
DDR signal layers by a ground layer. No breaks should be allowed in the reference ground layers in this
region. In addition, the 1.5-V DDR3 power plane should cover the entire keepout region. Also note that the
two DDR3 controller's signals should be separated from each other by the specification in Table 8-19,
item 5.
DDR3 Controllers
DDR[1] Keep Out Region
DDR[0] Keep Out Region
Encompasses Entire DDR[1] Routing Area
Encompasses Entire DDR[0] Routing Area
Figure 8-16. DDR3 Keepout Region
8.3.2.8 Bulk Bypass Capacitors
Bulk bypass capacitors are required for moderate speed bypassing of the DDR3 and other circuitry.
Table 8-20 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note
that this table only covers the bypass needs of the DDR3 controllers and DDR3 device(s). Additional bulk
bypass capacitance may be needed for other circuitry. Also note that Table 8-20 is per DDR3 controller;
thus, systems using both controllers have to meet the needs of Table 8-20 twice, once for each controller.
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Table 8-20. Bulk Bypass Capacitors
PARAMETER
MIN
6
MAX
UNIT
Devices
μF
1
2
DDR_1V5 bulk bypass capacitor count(1)
DDR_1V5 bulk bypass total capacitance
140
(1) These devices should be placed near the devices they are bypassing, but preference should be given to the placement of the high-
speed (HS) bypass capacitors and DDR3 signal routing.
8.3.2.9 High-Speed Bypass Capacitors
High-speed (HS) bypass capacitors are critcal for proper DDR3 interface operation. It is particularly
important to minimize the parasitic series inductance of the HS bypass capacitors, processor/DDR power,
and processor/DDR ground connections. Table 8-21 contains the specification for the HS bypass
capacitors as well as for the power connections on the PCB. Generally speaking, it is good to:
1. Fit as many HS bypass capacitors as possible.
2. Minimize the distance from the bypass cap to the pins/balls being bypassed.
3. Use the smallest physical sized capacitors possible with the highest capacitance readily available.
4. Connect the bypass capacitor pads to their vias using the widest traces possible and using the largest
hole size via possible.
5. Minimize via sharing. Note the limites on via sharing shown in Table 8-21.
Table 8-21. High-Speed Bypass Capacitors
NO.
1
PARAMETER
HS bypass capacitor package size(1)
MIN
TYP
MAX
UNIT
201
402 10 Mils
2
Distance, HS bypass capacitor to processor being bypassed(2)(3)(4)
400
Mils
Devices
μF
3
Processor DDR_1V5 HS bypass capacitor count
70
5
4
Processor DDR_1V5 HS bypass capacitor total capacitance
Number of connection vias for each device power/ground ball(5)
Trace length from device power/ground ball to connection via(2)
Distance, HS bypass capacitor to DDR device being bypassed(6)
DDR3 device HS bypass capacitor count(7)
5
Vias
Mils
6
35
70
7
150
Mils
8
12
0.85
2
Devices
μF
9
DDR3 device HS bypass capacitor total capacitance(7)
10 Number of connection vias for each HS capacitor(8)(9)
Vias
Mils
11 Trace length from bypass capacitor connect to connection via(2)(9)
12 Number of connection vias for each DDR3 device power/ground ball(10)
13 Trace length from DDR3 device power/ground ball to connection via(2)(8)
35
35
100
60
1
Vias
Mils
(1) LxW, 10-mil units, for example, a 0402 is a 40x20-mil surface-mount capacitor.
(2) Closer/shorter is better.
(3) Measured from the nearest processor power/ground ball to the center of the capacitor package.
(4) Three of these capacitors should be located underneath the processor, between the cluster of DDR_1V5 balls and ground balls,
between the DDR interfaces on the package.
(5) See the Via Channel™ escape for the processor package.
(6) Measured from the DDR3 device power/ground ball to the center of the capacitor package.
(7) Per DDR3 device.
(8) An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board. No sharing of
vias is permitted on the same side of the board.
(9) An HS bypass capacitor may share a via with a DDR device mounted on the same side of the PCB. A wide trace should be used for the
connection and the length from the capacitor pad to the DDR device pad should be less than 150 mils.
(10) Up to a total of two pairs of DDR power/ground balls may share a via.
8.3.2.9.1 Return Current Bypass Capacitors
Use additional bypass capacitors if the return current reference plane changes due to DDR3 signals
hopping from one signal layer to another. The bypass capacitor here provides a path for the return current
to hop planes along with the signal. As many of these return current bypass capacitors should be used as
possible. Since these are returns for signal current, the signal via size may be used for these capacitors.
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8.3.2.10 Net Classes
Table 8-22 lists the clock net classes for the DDR3 interface. Table 8-23 lists the signal net classes, and
associated clock net classes, for signals in the DDR3 interface. These net classes are used for the
termination and routing rules that follow.
Table 8-22. Clock Net Class Definitions
CLOCK NET CLASS PROCESSOR PIN NAMES
CK
DDR[x]_CLK[x]/DDR[x]_CLK[x]
DDR[x]_DQS[0]/DDR[x]_DQS[0]
DDR[x]_DQS[1]/DDR[x]_DQS[1]
DDR[x]_DQS[2]/DDR[x]_DQS[2]
DDR[x]_DQS[3]/DDR[x]_DQS[3]
DQS0
DQS1
DQS2(1)
DQS3(1)
(1) Only used on 32-bit wide DDR3 memory systems.
Table 8-23. Signal Net Class Definitions
ASSOCIATED CLOCK
PROCESSOR PIN NAMES
NET CLASS
SIGNAL NET CLASS
ADDR_CTRL
CK
DDR[x]_BA[2:0], DDR[x]_A[14:0], DDR[x]_CS[x], DDR[x]_CAS, DDR[x]_RAS,
DDR[x]_WE, DDR[x]_CKE, DDR[x]_ODT[x]
DQ0
DQ1
DQ2(1)
DQ3(1)
DQS0
DQS1
DQS2
DQS3
DDR[x]_D[7:0], DDR[x]_DQM[0]
DDR[x]_D[15:8], DDR[x]_DQM[1]
DDR[x]_D[23:16], DDR[x]_DQM[2]
DDR[x]_D[31:24], DDR[x]_DQM[3]
(1) Only used on 32-bit wide DDR3 memory systems.
8.3.2.11 DDR3 Signal Termination
Signal terminators are required for the CK and ADDR_CTRL net classes. The data lines are terminated by
ODT and, thus, the PCB traces should be unterminated. Detailed termination specifications are covered in
the routing rules in the following sections.
8.3.2.12 VREFSSTL_DDR Routing
VREFSSTL_DDR (VREF) is used as a reference by the input buffers of the DDR3 memories as well as
the processor. VREF is intended to be half the DDR3 power supply voltage and is typically generated with
the DDR3 1.5-V and VTT power supply. It should be routed as a nominal 20-mil wide trace with 0.1 µF
bypass capacitors near each device connection. Narrowing of VREF is allowed to accommodate routing
congestion.
8.3.2.13 VTT
Like VREF, the nominal value of the VTT supply is half the DDR3 supply voltage. Unlike VREF, VTT is
expected to source and sink current, specifically the termination current for the ADDR_CTRL net class
Thevinen terminators. VTT is needed at the end of the address bus and it should be routed as a power
sub-plane. VTT should be bypassed near the terminator resistors.
8.3.2.14 CK and ADDR_CTRL Topologies and Routing Definition
The CK and ADDR_CTRL net classes are routed similarly and are length matched to minimize skew
between them. CK is a bit more complicated because it runs at a higher transition rate and is differiential.
The following subsections show the topology and routing for various DDR3 configurations for CK and
ADDR_CTRL. The figures in the following subsections define the terms for the routing specification
detailed in Table 8-24.
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8.3.2.14.1 Four DDR3 Devices
Four DDR3 devices are supported on the DDR EMIF consisting of four x8 DDR3 devices arranged as one
bank (CS). These four devices may be mounted on a single side of the PCB, or may be mirrored in two
pairs to save board space at a cost of increased routing complexity and parts on the backside of the PCB.
8.3.2.14.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
Figure 8-17 shows the topology of the CK net classes and Figure 8-18 shows the topology for the
corresponding ADDR_CTRL net classes.
DDR Differential CK Input Buffers
–
–
–
–
+
+
+
+
Clock Parallel
Terminator
DDR_1V5
Rcp
A1
A1
A2
A2
A3
A3
A4
A4
A3
A3
AT
AT
Cac
Processor
Differential Clock
Output Buffer
+
–
0.1 µF
Rcp
Routed as Differential Pair
Figure 8-17. CK Topology for Four x8 DDR3 Devices
DDR Address/Control Input Buffers
Address/Control
Terminator
Rtt
Processor
Address/Control
Output Buffer
A1
A2
A3
A4
A3
AT
Vtt
Figure 8-18. ADDR_CTRL Topology for Four x8 DDR3 Devices
8.3.2.14.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
Figure 8-19 shows the CK routing for four DDR3 devices placed on the same side of the PCB. Figure 8-20
shows the corresponding ADDR_CTRL routing.
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DDR_1V5
Cac
Rcp
Rcp
A2
A2
A3
A3
A4
A4
A3
A3
AT
AT
0.1 µF
=
Figure 8-19. CK Routing for Four Single-Side DDR3 Devices
Rtt
A2
A3
A4
A3
AT
Vtt
=
Figure 8-20. ADDR_CTRL Routing for Four Single-Side DDR3 Devices
To save PCB space, the four DDR3 memories may be mounted as two mirrored pairs at a cost of
increased routing and assembly complexity. Figure 8-21 and Figure 8-22 show the routing for CK and
ADDR_CTRL, respectively, for four DDR3 devices mirrored in a two-pair configuration.
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DDR_1V5
Cac
Rcp
Rcp
A2
A2
A3
A3
A4
A4
A3
A3
AT
AT
0.1 µF
=
Figure 8-21. CK Routing for Four Mirrored DDR3 Devices
Rtt
A2
A3
A4
A3
AT
Vtt
=
Figure 8-22. ADDR_CTRL Routing for Four Mirrored DDR3 Devices
8.3.2.14.2 Two DDR3 Devices
Two DDR3 devices are supported on the DDR EMIF consisting of two x8 DDR3 devices arranged as one
bank (CS), 16 bits wide, or two x16 DDR3 devices arranged as one bank (CS), 32 bits wide. These two
devices may be mounted on a single side of the PCB, or may be mirrored in a pair to save board space at
a cost of increased routing complexity and parts on the backside of the PCB.
8.3.2.14.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
Figure 8-23 shows the topology of the CK net classes and Figure 8-24 shows the topology for the
corresponding ADDR_CTRL net classes.
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DDR Differential CK Input Buffers
–
–
+
+
Clock Parallel
Terminator
DDR_1V5
Rcp
A1
A1
A2
A2
A3
A3
AT
AT
Cac
Processor
Differential Clock
Output Buffer
+
–
0.1 µF
Rcp
Routed as Differential Pair
Figure 8-23. CK Topology for Two DDR3 Devices
DDR Address/Control Input Buffers
Address/Control
Terminator
Rtt
Processor
Address/Control
Output Buffer
A1
A2
A3
AT
Vtt
Figure 8-24. ADDR_CTRL Topology for Two DDR3 Devices
8.3.2.14.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
Figure 8-25 shows the CK routing for two DDR3 devices placed on the same side of the PCB. Figure 8-26
shows the corresponding ADDR_CTRL routing.
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DDR_1V5
Cac
Rcp
Rcp
A2
A2
A3
A3
AT
AT
0.1 µF
=
Figure 8-25. CK Routing for Two Single-Side DDR3 Devices
Rtt
A2
A3
AT
Vtt
=
Figure 8-26. ADDR_CTRL Routing for Two Single-Side DDR3 Devices
To save PCB space, the two DDR3 memories may be mounted as a mirrored pair at a cost of increased
routing and assembly complexity. Figure 8-27 and Figure 8-28 show the routing for CK and ADDR_CTRL,
respectively, for two DDR3 devices mirrored in a single-pair configuration.
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DDR_1V5
Cac
Rcp
Rcp
A2
A2
A3
A3
AT
AT
0.1 µF
=
Figure 8-27. CK Routing for Two Mirrored DDR3 Devices
Rtt
A2
A3
AT
Vtt
=
Figure 8-28. ADDR_CTRL Routing for Two Mirrored DDR3 Devices
8.3.2.14.3 One DDR3 Device
A single DDR3 device is supported on the DDR EMIF consisting of one x16 DDR3 device arranged as
one bank (CS), 16 bits wide.
8.3.2.14.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
Figure 8-29 shows the topology of the CK net classes and Figure 8-30 shows the topology for the
corresponding ADDR_CTRL net classes.
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DDR Differential CK Input Buffer
–
+
Clock Parallel
Terminator
DDR_1V5
Rcp
A1
A1
A2
A2
AT
AT
Cac
Processor
Differential Clock
Output Buffer
+
–
0.1 µF
Rcp
Routed as Differential Pair
Figure 8-29. CK Topology for One DDR3 Device
DDR Address/Control Input Buffers
Address/Control
Terminator
Rtt
Processor
Address/Control
Output Buffer
A1
A2
AT
Vtt
Figure 8-30. ADDR_CTRL Topology for One DDR3 Device
8.3.2.14.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
Figure 8-31 shows the CK routing for one DDR3 device placed on the same side of the PCB. Figure 8-32
shows the corresponding ADDR_CTRL routing.
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DDR_1V5
Cac
Rcp
Rcp
A2
A2
AT
AT
0.1 µF
=
Figure 8-31. CK Routing for One DDR3 Device
Rtt
A2
AT
Vtt
=
Figure 8-32. ADDR_CTRL Routing for One DDR3 Device
8.3.2.15 Data Topologies and Routing Definition
No matter the number of DDR3 devices used, the data line topology is always point to point, so its
definition is simple.
8.3.2.15.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
DQS lines are point-to-point differential, and DQ/DM lines are point-to-point singled ended. Figure 8-33
and Figure 8-34 show these topologies.
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Processor
DQS
DDR
DQSn+
DQSn-
DQS
I/O Buffer
I/O Buffer
Routed Differentially
n = 0, 1, 2, 3
Figure 8-33. DQS Topology
Processor
DQ/DM
DDR
Dn
DQ/DM
I/O Buffer
I/O Buffer
n = 0, 1, 2, 3
Figure 8-34. DQ/DM Topology
8.3.2.15.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
Figure 8-35 and Figure 8-36 show the DQS and DQ/DM routing.
DQS
DQSn+
DQSn-
Routed Differentially
n = 0, 1, 2, 3
Figure 8-35. DQS Routing With Any Number of Allowed DDR3 Devices
DQ/DM
Dn
n = 0, 1, 2, 3
Figure 8-36. DQ/DM Routing With Any Number of Allowed DDR3 Devices
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8.3.2.16 Routing Specification
8.3.2.16.1 CK and ADDR_CTRL Routing Specification
Skew within the CK and ADDR_CTRL net classes directly reduces setup and hold margin and, thus, this
skew must be controlled. The only way to practically match lengths on a PCB is to lengthen the shorter
traces up to the length of the longest net in the net class and its associated clock. A metric to establish
this maximum length is Manhattan distance. The Manhattan distance between two points on a PCB is the
length between the points when connecting them only with horizontal or vertical segments. A reasonable
trace route length is to within a percentage of its Manhattan distance. CACLM is defined as Clock Address
Control Longest Manhattan distance.
Given the clock and address pin locations on the processor and the DDR3 memories, the maximum
possible Manhattan distance can be determined given the placement. Figure 8-37 and Figure 8-38 show
this distance for four loads and two loads, respectively. It is from this distance that the specifications on
the lengths of the transmission lines for the address bus are determined. CACLM is determined similarly
for other address bus configurations; that is, it is based on the longest net of the CK/ADDR_CTRL net
class. For CK and ADDR_CTRL routing, these specifications are contained in Table 8-24.
A8(A)
CACLMY
CACLMX
A8(A)
A8(A)
A8(A)
A8(A)
Rtt
A2
A3
A4
A3
AT
Vtt
=
A. It is very likely that the longest CK/ADDR_CTRL Manhattan distance will be for Address Input 8 (A8) on the DDR3
memories. CACLM is based on the longest Manhattan distance due to the device placement. Verify the net class that
satisfies this criteria and use as the baseline for CK/ADDR_CTRL skew matching and length control.
The length of shorter CK/ADDR_CTRL stubs as well as the length of the terminator stub are not included in this
length caculation. Non-included lengths are grayed out in the figure.
Assuming A8 is the longest, CALM = CACLMY + CACLMX + 300 mils.
The extra 300 mils allows for routing down lower than the DDR3 memories and returning up to reach A8.
Figure 8-37. CACLM for Four Address Loads on One Side of PCB
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A8(A)
CACLMY
CACLMX
A8(A)
A8(A)
Rtt
A2
A3
AT
Vtt
=
A. It is very likely that the longest CK/ADDR_CTRL Manhattan distance will be for Address Input 8 (A8) on the DDR3
memories. CACLM is based on the longest Manhattan distance due to the device placement. Verify the net class that
satisfies this criteria and use as the baseline for CK/ADDR_CTRL skew matching and length control.
The length of shorter CK/ADDR_CTRL stubs as well as the length of the terminator stub are not included in this
length caculation. Non-included lengths are grayed out in the figure.
Assuming A8 is the longest, CALM = CACLMY + CACLMX + 300 mils.
The extra 300 mils allows for routing down lower than the DDR3 memories and returning up to reach A8.
Figure 8-38. CACLM for Two Address Loads on One Side of PCB
Table 8-24. CK and ADDR_CTRL Routing Specification(1)(2)
NO.
1
PARAMETER
MIN
TYP
MAX
2500
25
UNIT
mils
mils
mils
mils
mils
mils
mils
mils
mils
mils
mils
mils
mils
mils
mils
A1+A2 length
A1+A2 skew
A3 length
A3 skew(3)
A3 skew(4)
A4 length
A4 skew
2
3
660
25
4
5
125
660
25
6
7
8
AS length
AS skew
100
100
70
9
10 AS+/AS- length
11 AS+/AS- skew
12 AT length(5)
13 AT skew(6)
14 AT skew(7)
15 CK/ADDR_CTRL nominal trace length(8)
5
500
100
5
CACLM-50
CACLM
CACLM+50
(1) The use of vias should be minimized.
(2) Additional bypass capacitors are required when using the DDR_1V5 plane as the reference plane to allow the return current to jump
between the DDR_1V5 plane and the ground plane when the net class swtiches layers at a via.
(3) Non-mirrored configuration (all DDR3 memories on same side of PCB).
(4) Mirrored configuration (one DDR3 device on top of the board and one DDR3 device on the bottom).
(5) While this length can be increased for convienience, its length should be minimized.
(6) ADDR_CTRL net class only (not CK net class). Minimizing this skew is recommended, but not required.
(7) CK net class only.
(8) CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes + 300 mils. For definition, see Section 8.3.2.16.1,
Figure 8-37, and Figure 8-38.
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UNIT
Table 8-24. CK and ADDR_CTRL Routing Specification(1)(2) (continued)
NO.
PARAMETER
MIN
4w
TYP
MAX
16 Center-to-center CK to other DDR3 trace spacing(9)
17 Center-to-center ADDR_CTRL to other DDR3 trace spacing(9)(10)
18 Center-to-center ADDR_CTRL to other ADDR_CTRL trace spacing(9)
19 CK center-to-center spacing(11)
4w
3w
20 CK spacing to other net(9)
21 Rcp(12)
22 Rtt(12)(13)
4w
Zo-1
Zo-5
Zo
Zo
Zo+
Ω
Ω
Zo+5
(9) Center-to-center spacing is allowed to fall to minimum (w) for up to 1250 mils of routed length.
(10) The ADDR_CTRL net class of the other DDR EMIF is considered other DDR3 trace spacing.
(11) CK spacing set to ensure proper differential impedance.
(12) Source termination (series resistor at driver) is specifically not allowed.
(13) Termination values should be uniform across the net class.
8.3.2.16.2 DQS and DQ Routing Specification
Skew within the DQS and DQ/DM net classes directly reduces setup and hold margin and thus this skew
must be controlled. The only way to practically match lengths on a PCB is to lengthen the shorter traces
up to the length of the longest net in the net class and its associated clock. As with CK and ADDR_CTRL,
a reasonable trace route length is to within a percentage of its Manhattan distance. DQLMn is defined as
DQ Longest Manhattan distance n, where n is the byte number. For a 32-bit interface, there are four
DQLMs, DQLM0-DQLM3. Likewise, for a 16-bit interface, there are two DQLMs, DQLM0-DQLM1.
NOTE
It is not required, nor is it recommended, to match the lengths across all bytes. Length
matching is only required within each byte.
Given the DQS and DQ/DM pin locations on the processor and the DDR3 memories, the maximum
possible Manhattan distance can be determined given the placement. Figure 8-39 shows this distance for
four loads. It is from this distance that the specifications on the lengths of the transmission lines for the
data bus are determined. For DQS and DQ/DM routing, these specifications are contained in Table 8-25.
DQLMX0
DQ[0:7]/DM0/DQS0
DB0
DQ[8:15]/DM1/DQS1
DB1
DQLMX1
DQ[16:23]/DM2/DQS2
DB2
DQLMY0
DQLMX2
DQLMY1
DQLMY3 DQLMY2
DQ[23:31]/DM3/DQS3
DB3
DQLMX3
3
2
1
0
DB0 - DB3 represent data bytes 0 - 3.
There are four DQLMs, one for each byte (32-bit interface). Each DQLM is the longest Manhattan distance of the
byte; therefore:
DQLM0 = DQLMX0 + DQLMY0
DQLM1 = DQLMX1 + DQLMY1
DQLM2 = DQLMX2 + DQLMY2
DQLM3 = DQLMX3 + DQLMY3
Figure 8-39. DQLM for Any Number of Allowed DDR3 Devices
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Table 8-25. Data Routing Specification(1)
PARAMETER
MIN
TYP
MAX
DQLM0
DQLM1
DQLM2
DQLM3
25
UNIT
mils
mils
mils
mils
mils
mils
mils
1
2
3
4
5
6
7
8
9
DB0 nominal length(2)(3)
DB1 nominal length(2)(4)
DB2 nominal length(2)(5)
DB3 nominal length(2)(6)
DBn skew(7)
DQSn+ to DQSn- skew
DQSn to DBn skew(7)(8)
Center-to-center DBn to other DDR3 trace spacing(9)(10)
Center-to-center DBn to other DBn trace spacing(9)(11)
5
25
4w
3w
10 DQSn center-to-center spacing(12)
11 DQSn center-to-center spacing to other net(9)
4w
(1) External termination disallowed. Data termination should use built-in ODT functionality.
(2) DQLMn is the longest Manhattan distance of a byte. For definition, see Section 8.3.2.16.2 and Figure 8-39.
(3) DQLM0 is the longest Manhattan length for the net classes of Byte 0.
(4) DQLM1 is the longest Manhattan length for the net classes of Byte 1.
(5) DQLM2 is the longest Manhattan length for the net classes of Byte 2.
(6) DQLM3 is the longest Manhattan length for the net slasses of Byte 3.
(7) Length matching is only done within a byte. Length matching across bytes is neither required nor recommended.
(8) Each DQS pair is length matched to its associated byte.
(9) Center-to-center spacing is allowed to fall to minimum (w) for up to 1250 mils of routed length.
(10) Other DDR3 trace spacing means other DDR3 net classes not within the byte.
(11) This applies to spacing within the net classes of a byte.
(12) DQS pair spacing is set to ensure proper differential impedance.
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8.3.3 DDR2/3 Memory Controller Register Descriptions
Table 8-26. DDR2/3 Memory Controller Registers
DDR0 HEX ADDRESS
0x4C00 0004
0x4C00 0008
0x4C00 000C
0x4C00 0010
0x4C00 0014
0x4C00 0018
0x4C00 001C
0x4C00 0020
0x4C00 0024
0x4C00 0028
0x4C00 002C
0x4C00 0038
0x4C00 003C
0x4C00 0054
0x4C00 00A0
0x4C00 00A4
0x4C00 00AC
0x4C00 00B4
0x4C00 00BC
0x4C00 00C8
0x4C00 00DC
0x4C00 00E4
0x4C00 00E8
DDR1 HEX ADDRESS
0x4D00 0004
0x4D00 0008
0x4D00 000C
0x4D00 0010
0x4D00 0014
0x4D00 0018
0x4D00 001C
0x4D00 0020
0x4D00 0024
0x4D00 0028
0x4D00 002C
0x4D00 0038
0x4D00 003C
0x4D00 0054
0x4D00 00A0
0x4D00 00A4
0x4D00 00AC
0x4D00 00B4
0x4D00 00BC
0x4D00 00C8
0x4D00 00DC
0x4D00 00E4
0x4D00 00E8
ACRONYM
SDRSTAT
SDRCR
REGISTER NAME
SDRAM Status
SDRAM Config
SDRCR2
SDRRCR
SDRRCSR
SDRTIM1
SDRTIM1SR
SDRTIM2
SDRTIM2SR
SDRTIM3
SDRTIM3SR
PMCR
SDRAM Config 2
SDRAM Refresh Control
SDRAM Refresh Control Shadow
SDRAM Timing 1
SDRAM Timing 1 Shadow
SDRAM Timing 2
SDRAM Timing 2 Shadow
SDRAM Timing 3
SDRAM Timing 3 Shadow
Power Management Control
Power Management Control Shadow
Peripheral Bus Burst Priority
End of Interrupt
PMCSR
PBBPR
EOI
SOIRSR
System OCP Interrupt Raw Status
System OCP Interrupt Status
System OCP Interrupt Enable Set
System OCP Interrupt Enable Clear
SOISR
SOIESR
SOIECR
ZQCR
SDRAM output Impedance Calibration Config
Read-Write Leveling Control
DDR PHY Control
RWLCR
DDRPHYCR
DDRPHYCSR
DDR PHY Control Shadow
8.3.4 DDR2/3 PHY Register Descriptions
Table 8-27. DDR2/3 PHY Registers
DDR0 HEX
ADDRESS
DDR1 HEX
ADDRESS
ACRONYM
REGISTER NAME
0x4819 800C
0x4819 A00C
CMD0_IO_CONFIG_I_0
Command 0 Address/Command Pad
Configuration
0x4819 8010
0x4819 8014
0x4819 A010
0x4819 A014
CMD0_IO_CONFIG_I_CLK_0
CMD0_IO_CONFIG_SR_0
Command 0 Clock Pad Configuration
Command 0 Address/Command Slew Rate
Configuration
0x4819 8018
0x4819 A018
CMD0_IO_CONFIG_SR_CLK_0
Command 0 Clock Pad Slew Rate
Configuration
0x4819 801C
0x4819 802C
0x4819 8040
0x4819 A01C
0x4819 A02C
0x4819 A040
CMD0_REG_PHY_CTRL_SLAVE_RATIO_0
CMD0_REG_PHY_INVERT_CLKOUT_0
CMD1_IO_CONFIG_I_0
Command 0 Address/Command Slave Ratio
Command 0 Invert Clockout Selection
Command 1 Address/Command Pad
Configuration
0x4819 8044
0x4819 8048
0x4819 A044
0x4819 A048
CMD1_IO_CONFIG_I_CLK_0
CMD1_IO_CONFIG_SR_0
Command 1 Clock Pad Configuration
Command 1 Address/Command Slew Rate
Configuration
0x4819 804C
0x4819 A04C
CMD1_IO_CONFIG_SR_CLK_0
Command 1 Clock Pad Slew Rate
Configuration
0x4819 8050
0x4819 8060
0x4819 A050
0x4819 A060
CMD1_REG_PHY_CTRL_SLAVE_RATIO_0
CMD1_REG_PHY_INVERT_CLKOUT_0
Command 1 Address/Command Slave Ratio
Command 1 Invert Clockout Selection
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Table 8-27. DDR2/3 PHY Registers (continued)
DDR0 HEX
ADDRESS
DDR1 HEX
ADDRESS
ACRONYM
REGISTER NAME
0x4819 8074
0x4819 A074
CMD2_IO_CONFIG_I_0
Command 2 Address/Command Pad
Configuration
0x4819 8078
0x4819 807C
0x4819 A078
0x4819 A07C
CMD2_IO_CONFIG_I_CLK_0
CMD2_IO_CONFIG_SR_0
Command 2 Clock Pad Configuration
Command 2 Address/Command Slew Rate
Configuration
0x4819 8080
0x4819 A080
CMD2_IO_CONFIG_SR_CLK_0
Command 2 Clock Pad Slew Rate
Configuration
0x4819 8084
0x4819 8094
0x4819 80A8
0x4819 80AC
0x4819 80B0
0x4819 80B4
0x4819 A084
0x4819 A094
0x4819 A0A8
0x4819 A0AC
0x4819 A0B0
0x4819 A0B4
CMD2_REG_PHY_CTRL_SLAVE_RATIO_0
CMD2_REG_PHY_INVERT_CLKOUT_0
DATA0_IO_CONFIG_I_0
Command 2 Address/Command Slave Ratio
Command 2 Invert Clockout Selection
Data Macro 0 Data Pad Configuration
DATA0_IO_CONFIG_I_CLK_0
DATA0_IO_CONFIG_SR_0
Data Macro 0 Data Strobe Pad Configuration
Data Macro 0 Data Slew Rate Configuration
DATA0_IO_CONFIG_SR_CLK_0
Data Macro 0 Data Strobe Slew Rate
Configuration
0x4819 80C8
0x4819 80DC
0x4819 80F0
0x4819 80F8
0x4819 A0C8
0x4819 A0DC
0x4819 A0F0
0x4819 A0F8
DATA0_REG_PHY_RD_DQS_SLAVE_RATIO_0
Data Macro 0 Read DQS Slave Ratio
DATA0_REG_PHY_WR_DQS_SLAVE_RATIO_0 Data Macro 0 Write DQS Slave Ratio
DATA0_REG_PHY_WRLVL_INIT_RATIO_0
DATA0_REG_PHY_WRLVL_INIT_MODE_0
Data Macro 0 Write Leveling Init Ratio
Data Macro 0 Write Leveling Init Mode Ratio
Selection
0x4819 80FC
0x4819 8104
0x4819 A0FC
0x4819 A104
DATA0_REG_PHY_GATELVL_INIT_RATIO_0
DATA0_REG_PHY_GATELVL_INIT_MODE_0
Data Macro 0 DQS Gate Training Init Ratio
Data Macro 0 DQS Gate Training Init Mode
Ratio Selection
0x4819 8108
0x4819 8120
0x4819 8134
0x4819 814C
0x4819 8150
0x4819 8154
0x4819 8158
0x4819 A108
0x4819 A120
0x4819 A134
0x4819 A14C
0x4819 A150
0x4819 A154
0x4819 A158
DATA0_REG_PHY_FIFO_WE_SLAVE_RATIO_0 Data Macro 0 DQS Gate Slave Ratio
DATA0_REG_PHY_WR_DATA_SLAVE_RATIO_0 Data Macro 0 Write Data Slave Ratio
DATA0_REG_PHY_USE_RANK0_DELAYS
DATA1_IO_CONFIG_I_0
Data Macro 0 Delay Selection
Data Macro 1 Data Pad Configuration
Data Macro 1 Data Strobe Pad Configuration
Data Macro 1 Data Slew Rate Configuration
DATA1_IO_CONFIG_I_CLK_0
DATA1_IO_CONFIG_SR_0
DATA1_IO_CONFIG_SR_CLK_0
Data Macro 1 Data Strobe Slew Rate
Configuration
0x4819 816C
0x4819 8180
0x4819 8194
0x4819 819C
0x4819 A16C
0x4819 A180
0x4819 A194
0x4819 A19C
DATA1_REG_PHY_RD_DQS_SLAVE_RATIO_0
Data Macro 1 Read DQS Slave Ratio
DATA1_REG_PHY_WR_DQS_SLAVE_RATIO_0 Data Macro 1 Write DQS Slave Ratio
DATA1_REG_PHY_WRLVL_INIT_RATIO_0
DATA1_REG_PHY_WRLVL_INIT_MODE_0
Data Macro 1 Write Leveling Init Ratio
Data Macro 1 Write Leveling Init Mode Ratio
Selection
0x4819 81A0
0x4819 81A8
0x4819 A1A0
0x4819 A1A8
DATA1_REG_PHY_GATELVL_INIT_RATIO_0
DATA1_REG_PHY_GATELVL_INIT_MODE_0
Data Macro 1 DQS Gate Training Init Ratio
Data Macro 1 DQS Gate Training Init Mode
Ratio Selection
0x4819 81AC
0x4819 81C4
0x4819 81D8
0x4819 81F0
0x4819 81F4
0x4819 81F8
0x4819 81FC
0x4819 A1AC
0x4819 A1C4
0x4819 A1D8
0x4819 A1F0
0x4819 A1F4
0x4819 A1F8
0x4819 A1FC
DATA1_REG_PHY_FIFO_WE_SLAVE_RATIO_0 Data Macro 1 DQS Gate Slave Ratio
DATA1_REG_PHY_WR_DATA_SLAVE_RATIO_0 Data Macro 1 Write Data Slave Ratio
DATA1_REG_PHY_USE_RANK0_DELAYS
DATA2_IO_CONFIG_I_0
Data Macro 1 Delay Selection
Data Macro 2 Data Pad Configuration
Data Macro 2 Data Strobe Pad Configuration
Data Macro 2 Data Slew Rate Configuration
DATA2_IO_CONFIG_I_CLK_0
DATA2_IO_CONFIG_SR_0
DATA2_IO_CONFIG_SR_CLK_0
Data Macro 2 Data Strobe Slew Rate
Configuration
0x4819 8210
0x4819 8224
0x4819 8238
0x4819 A210
0x4819 A224
0x4819 A238
DATA2_REG_PHY_RD_DQS_SLAVE_RATIO_0
Data Macro 2 Read DQS Slave Ratio
DATA2_REG_PHY_WR_DQS_SLAVE_RATIO_0 Data Macro 2 Write DQS Slave Ratio
DATA2_REG_PHY_WRLVL_INIT_RATIO_0
Data Macro 2 Write Leveling Init Ratio
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Table 8-27. DDR2/3 PHY Registers (continued)
DDR0 HEX
ADDRESS
DDR1 HEX
ADDRESS
ACRONYM
REGISTER NAME
0x4819 8240
0x4819 A240
DATA2_REG_PHY_WRLVL_INIT_MODE_0
Data Macro 2 Write Leveling Init Mode Ratio
Selection
0x4819 8244
0x4819 824C
0x4819 A244
0x4819 A24C
DATA2_REG_PHY_GATELVL_INIT_RATIO_0
DATA2_REG_PHY_GATELVL_INIT_MODE_0
Data Macro 2 DQS Gate Training Init Ratio
Data Macro 2 DQS Gate Training Init Mode
Ratio Selection
0x4819 8250
0x4819 8268
0x4819 827C
0x4819 8294
0x4819 8298
0x4819 829C
0x4819 82A0
0x4819 A250
0x4819 A268
0x4819 A27C
0x4819 A294
0x4819 A298
0x4819 A29C
0x4819 A2A0
DATA2_REG_PHY_FIFO_WE_SLAVE_RATIO_0 Data Macro 2 DQS Gate Slave Ratio
DATA2_REG_PHY_WR_DATA_SLAVE_RATIO_0 Data Macro 2 Write Data Slave Ratio
DATA2_REG_PHY_USE_RANK0_DELAYS
DATA3_IO_CONFIG_I_0
Data Macro 2 Delay Selection
Data Macro 3 Data Pad Configuration
Data Macro 3 Data Strobe Pad Configuration
Data Macro 3 Data Slew Rate Configuration
DATA3_IO_CONFIG_I_CLK_0
DATA3_IO_CONFIG_SR_0
DATA3_IO_CONFIG_SR_CLK_0
Data Macro 3 Data Strobe Slew Rate
Configuration
0x4819 82B4
0x4819 82C8
0x4819 82DC
0x4819 82E4
0x4819 A2B4
0x4819 A2C8
0x4819 A2DC
0x4819 A2E4
DATA3_REG_PHY_RD_DQS_SLAVE_RATIO_0
Data Macro 3 Read DQS Slave Ratio
DATA3_REG_PHY_WR_DQS_SLAVE_RATIO_0 Data Macro 3 Write DQS Slave Ratio
DATA3_REG_PHY_WRLVL_INIT_RATIO_0
DATA3_REG_PHY_WRLVL_INIT_MODE_0
Data Macro 3 Write Leveling Init Ratio
Data Macro 3 Write Leveling Init Mode Ratio
Selection
0x4819 82E8
0x4819 82F0
0x4819 A2E8
0x4819 A2F0
DATA3_REG_PHY_GATELVL_INIT_RATIO_0
DATA3_REG_PHY_GATELVL_INIT_MODE_0
Data Macro 3 DQS Gate Training Init Ratio
Data Macro 3 DQS Gate Training Init Mode
Ratio Selection
0x4819 82F4
0x4819 830C
0x4819 8320
0x4819 8358
0x4819 A2F4
0x4819 A30C
0x4819 A320
0x4819 A358
DATA3_REG_PHY_FIFO_WE_SLAVE_RATIO_0 Data Macro 3 DQS Gate Slave Ratio
DATA3_REG_PHY_WR_DATA_SLAVE_RATIO_0 Data Macro 3 Write Data Slave Ratio
DATA3_REG_PHY_USE_RANK0_DELAYS
DDR_VTP_CTRL_0
Data Macro 3 Delay Selection
DDR VTP Control
8.3.5 DDR2/3 Memory Controller Electrical Data/Timing
Section 8.3.1, DDR2 Routing Specifications and Section 8.3.2, DDR3 Routing Specifications specify a
complete DDR2/3 interface solution for the device. TI has performed the simulation and system
characterization to ensure all DDR2/3 interface timings in this solution are met.
TI only supports board designs that follow the specifications outlined in the DDR2 Routing Specifications
and DDR3 Routing Specifications sections of this data sheet.
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8.4 Emulation Features and Capability
8.4.1 Advanced Event Triggering (AET)
The device supports Advanced Event Triggering (AET). This capability can be used to debug complex
problems as well as understand performance characteristics of user applications. AET provides the
following capabilities:
•
Hardware Program Breakpoints: specify addresses or address ranges that can generate events such
as halting the processor or triggering the trace capture.
•
Data Watchpoints: specify data variable addresses, address ranges, or data values that can generate
events such as halting the processor or triggering the trace capture.
•
•
Counters: count the occurrence of an event or cycles for performance monitoring.
State Sequencing: allows combinations of hardware program breakpoints and data watchpoints to
precisely generate events for complex sequences.
For more information on AET, see the following documents:
•
Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs application report
(literature number SPRA753)
•
Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded
Microprocessor Systems application report (literature number SPRA387)
8.4.2 Trace
The device supports Trace at the Cortex™-A8 and System levels. Trace is a debug technology that
provides a detailed, historical account of application code execution, timing, and data accesses. Trace
collects, compresses, and exports debug information for analysis. The debug information can be exported
to the Embedded Trace Buffer (ETB), or to the 5-pin Trace Interface (system trace only). Trace works in
real-time and does not impact the execution of the system.
For more information on board design guidelines for Trace Advanced Emulation, see the Emulation and
Trace Headers Technical Reference Manual (literature number SPRU655).
8.4.3 IEEE 1149.1 JTAG
The JTAG (IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture)
interface is used for BSDL testing and emulation of the device. The TRST pin only needs to be released
when it is necessary to use a JTAG controller to debug the device or exercise the device's boundary scan
functionality. For maximum reliability, the device includes an internal pulldown (IPD) on the TRST pin to
ensure that TRST is always asserted upon power up and the device's internal emulation logic is always
properly initialized. JTAG controllers from Texas Instruments actively drive TRST high. However, some
third-party JTAG controllers may not drive TRST high but expect the use of a pullup resistor on TRST.
When using this type of JTAG controller, assert TRST to initialize the device after powerup and externally
drive TRST high before attempting any emulation or boundary-scan operations.
The main JTAG features include:
•
•
•
•
•
32KB embedded trace buffer (ETB)
5-pin system trace interface for debug
Supports Advanced Event Triggering (AET)
All processors can be emulated via JTAG ports
All functions on EMU pins of the device:
–
–
–
EMU[1:0] - cross-triggering, boot mode (WIR), STM trace
EMU[4:2] - STM trace only (single direction)
EMU[2] - only valid pin to use as clock
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8.4.3.1 JTAG ID (JTAGID) Register Description
Table 8-28. JTAG ID Register(1)
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4814 0600
JTAGID
JTAG Identification Register(2)
(1) IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
(2) Read-only. Provides the device 32-bit JTAG ID.
The JTAG ID register is a read-only register that identifies to the customer the JTAG/device ID. For this
device, the JTAG ID register resides at address location 0x4814 0600. The register hex value for the
device depends on the silicon revision being used. For more information, see the AM389x Sitara ARM
Processors Silicon Errata (literature number SPRZ327). For the actual register bit names and their
associated bit field descriptions, see Figure 8-40 and Table 8-29.
31
28 27
12 11
1
0
VARIANT (4-
PART NUMBER (16-bit)
R-1011 1000 0001 1110
MANUFACTURER (11-bit)
R-0000 0010 111
LSB
R-1
bit)
R-x
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 8-40. JTAG ID Register Description - 0x4814 0600
Table 8-29. JTAG ID Register Selection Bit Descriptions
Bit
Field
Description
31:28
VARIANT
Variant (4-bit) value. Device value: The value of this field depends on the silicon revision being used. For
more information, see the AM389x Sitara ARM Processors Silicon Errata (literature number SPRZ327).
27:12
11:1
0
PART NUMBER
Part Number (16-bit) value. Device value: 0xB81E
MANUFACTURER Manufacturer (11-bit) value. Device value: 0x017
LSB LSB. This bit is read as a 1 for this device.
8.4.3.2 JTAG Electrical Data/Timing
Table 8-30. Timing Requirements for IEEE 1149.1 JTAG
(see Figure 8-41)
NO.
MIN
51.15
20.46
20.46
5.115
5.115
10
MAX UNIT
1
tc(TCK)
1a tw(TCKH)
1b tw(TCKL)
Cycle time, TCK
ns
ns
ns
ns
ns
ns
ns
Pulse duration, TCK high (40% of tc)
Pulse duration, TCK low (40% of tc)
3
3
tsu(TDI-TCK)
Input setup time, TDI valid to TCK high (20% of (tc * 0.5))
Input setup time, TMS valid to TCK high (20% of (tc * 0.5))
Input hold time, TDI valid from TCK high
Input hold time, TMS valid from TCK high
tsu(TMS-TCK)
th(TCK-TDI)
th(TCK-TMS)
4
10
Table 8-31. Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
(see Figure 8-41)
NO.
PARAMETER
MIN
MAX UNIT
23.575(1)
ns
2
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
0
(1) (0.5 * tc) - 2
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1
1a
1b
TCK
TDO
2
3
4
TDI/TMS
Figure 8-41. JTAG Timing
Table 8-32. Timing Requirements for IEEE 1149.1 JTAG With RTCK
(see Figure 8-41)
NO.
MIN
51.15
MAX UNIT
1
tc(TCK)
1a tw(TCKH)
1b tw(TCKL)
Cycle time, TCK
ns
ns
ns
ns
ns
ns
ns
Pulse duration, TCK high (40% of tc)
20.46
20.46
5.115
5.115
10
Pulse duration, TCK low (40% of tc)
3
3
tsu(TDI-TCK)
Input setup time, TDI valid to TCK high (20% of (tc * 0.5))
Input setup time, TMS valid to TCK high (20% of (tc * 0.5))
Input hold time, TDI valid from TCK high
Input hold time, TMS valid from TCK high
tsu(TMS-TCK)
th(TCK-TDI)
th(TCK-TMS)
4
10
Table 8-33. Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
With RTCK
(see Figure 8-42)
NO.
PARAMETER
MIN
MAX UNIT
Delay time, TCK to RTCK with no selected subpaths (that is,
ICEPick module is the only tap selected - when the ARM is in the
scan chain, the delay time is a function of the ARM functional
clock.)
5
td(TCK-RTCK)
0
21
ns
6
7
8
tc(RTCK)
Cycle time, RTCK
51.15
20.46
20.46
ns
ns
ns
tw(RTCKH)
tw(RTCKL)
Pulse duration, RTCK high (40% of tc)
Pulse duration, RTCK low (40% of tc)
5
TCK
6
7
8
RTCK
Figure 8-42. JTAG With RTCK Timing
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8.4.4 IEEE 1149.7 cJTAG
Besides the standard (legacy) JTAG mode of operation, the target debug interface can also be switched to
a compressed JTAG (cJTAG) mode of operation, commonly referred to as IEEE1149.7 standard. An
IEEE1149.7 adapter module runs a 2-pin communication protocol on top of an IEEE1149.1 JTAG TAP.
The debug-IP logic serializes the IEEE1149.1 transactions, using a variety of compression formats, to
reduce the number of pins needed to implement a JTAG debug port. This device implements only a
subset of the IEEE1149.7 protocol; it supports Class 0/1 operation. On this device the cJTAG ID[7:0] is
tied to 0x00.
NOTE
The default setting of the scan port is IEEE 1149.1. A cJTAG emulator connected only to
TCLK and TMS can re-configure the port to cJTAG by scanning in a special command
sequence. For the scan sequence required to switch modes, see the IEEE1149.7
specification.
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8.5 Enhanced Direct Memory Access (EDMA) Controller
The EDMA controller handles all data transfers between memories and the device slave peripherals on
the device. These data transfers include cache servicing, non-cacheable memory accesses, user-
programmed data transfers, and host accesses.
8.5.1 EDMA Channel Synchronization Events
The EDMA channel controller supports up to 64 channels that service peripherals and memory. Each
EDMA channel is mapped to a default EDMA synchronization event as shown in Table 8-34. By default,
each event uses the parameter entry that matches its event number. However, because the device
includes a channel mapping feature, each event may be mapped to any of 512 parameter table entries.
For more detailed information on the EDMA module and how EDMA events are enabled, captured,
processed, linked, chained, and cleared, etc., see the EDMA chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
Table 8-34. EDMA Default Synchronization Events
EVENT NUMBER
DEFAULT EVENT NAME
-
DEFAULT EVENT DESCRIPTION
Unused
0 - 7
8
AXEVT0
AREVT0
AXEVT1
AREVT1
AXEVT2
AREVT2
BXEVT
McASP0 Transmit
McASP0 Receive
McASP1 Transmit
McASP1 Receive
McASP2 Transmit
McASP2 Receive
McBSP Transmit
McBSP Receive
SPI0 Transmit 0
SPI0 Receive 0
SPI0 Transmit 1
SPI0 Receive 1
SPI0 Transmit 2
SPI0 Receive 2
SPI0 Transmit 3
SPI0 Receive 3
SD0 Transmit
SD0 Receive
9
10
11
12
13
14
15
BREVT
16
SPIXEVT0
SPIREVT0
SPIXEVT1
SPIREVT1
SPIXEVT2
SPIREVT2
SPIXEVT3
SPIREVT3
SDTXEVT
SDRXEVT
UTXEVT0
URXEVT0
UTXEVT1
URXEVT1
UTXEVT2
URXEVT2
-
17
18
19
20
21
22
23
24
25
26
UART0 Transmit
UART0 Receive
UART1 Transmit
UART1 Receive
UART2 Transmit
UART2 Receive
Unused
27
28
29
30
31
32 - 47
48
TINT4
TIMER4
49
TINT5
TIMER5
50
TINT6
TIMER6
51
TINT7
TIMER7
52
GPMCEVT
HDMIEVT
-
GPMC
53
HDMI
54 - 57
58
Unused
I2CTXEVT0
I2C0 Transmit
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Table 8-34. EDMA Default Synchronization Events (continued)
EVENT NUMBER
DEFAULT EVENT NAME
I2CRXEVT0
I2CTXEVT1
I2CRXEVT1
-
DEFAULT EVENT DESCRIPTION
I2C0 Receive
59
60
I2C1 Transmit
61
I2C1 Receive
62 - 63
Unused
8.5.2 EDMA Peripheral Register Descriptions
Table 8-35. EDMA Channel Controller (EDMA TPCC) Control Registers
HEX ADDRESS
0x4900 0000
0x4900 0004
0x4900 0100 - 0x4900 01FC
0x4900 0200
0x4900 0204
0x4900 0208
0x4900 020C
0x4900 0210
0x4900 0214
0x4900 0218
0x4900 021C
0x4900 0240
0x4900 0244
0x4900 0248
0x4900 024C
0x4900 0250
0x4900 0254
0x4900 0258
0x4900 025C
0x4900 0260
0x4900 0284
0x4900 0300
0x4900 0304
0x4900 0308
0x4900 030C
0x4900 0310
0x4900 0314
0x4900 0318
0x4900 031C
0x4900 0320
0x4900 0340
0x4900 0344
0x4900 0348
0x4900 034C
0x4900 0350
0x4900 0354
0x4900 0358
0x4900 035C
ACRONYM
PID
REGISTER NAME
Peripheral Identification
CCCFG
EDMA3CC Configuration
DMA Channel 0-63 Mappings
QDMA Channel 0 Mapping
QDMA Channel 1 Mapping
QDMA Channel 2 Mapping
QDMA Channel 3 Mapping
QDMA Channel 4 Mapping
QDMA Channel 5 Mapping
QDMA Channel 6 Mapping
QDMA Channel 7 Mapping
DMA Queue Number 0
DCHMAP0-63
QCHMAP0
QCHMAP1
QCHMAP2
QCHMAP3
QCHMAP4
QCHMAP5
QCHMAP6
QCHMAP7
DMAQNUM0
DMAQNUM1
DMAQNUM2
DMAQNUM3
DMAQNUM4
DMAQNUM5
DMAQNUM6
DMAQNUM7
QDMAQNUM
QUEPRI
DMA Queue Number 1
DMA Queue Number 2
DMA Queue Number 3
DMA Queue Number 4
DMA Queue Number 5
DMA Queue Number 6
DMA Queue Number 7
QDMA Queue Number
Queue Priority
EMR
Event Missed
EMRH
Event Missed High
EMCR
Event Missed Clear
EMCRH
Event Missed Clear High
QDMA Event Missed
QEMR
QEMCR
QDMA Event Missed Clear
EDMA3CC Error
CCERR
CCERRCLR
EEVAL
EDMA3CC Error Clear
Error Evaluate
DRAE0
DMA Region Access Enable for Region 0
DMA Region Access Enable High for Region 0
DMA Region Access Enable for Region 1
DMA Region Access Enable High for Region 1
DMA Region Access Enable for Region 2
DMA Region Access Enable High for Region 2
DMA Region Access Enable for Region 3
DMA Region Access Enable High for Region 3
DRAEH0
DRAE1
DRAEH1
DRAE2
DRAEH2
DRAE3
DRAEH3
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Table 8-35. EDMA Channel Controller (EDMA TPCC) Control Registers (continued)
HEX ADDRESS
0x4900 0360
0x4900 0364
0x4900 0368
0x4900 036C
0x4900 0370
0x4900 0374
0x4900 0378
0x4900 037C
ACRONYM
DRAE4
DRAEH4
DRAE5
DRAEH5
DRAE6
DRAEH6
DRAE7
DRAEH7
QRAE0-7
Q0E0-Q3E15
QSTAT0-3
QWMTHRA
CCSTAT
MPFAR
MPFSR
MPFCR
MPPAG
MPPA0-7
ER
REGISTER NAME
DMA Region Access Enable for Region 4
DMA Region Access Enable High for Region 4
DMA Region Access Enable for Region 5
DMA Region Access Enable High for Region 5
DMA Region Access Enable for Region 6
DMA Region Access Enable High for Region 6
DMA Region Access Enable for Region 7
DMA Region Access Enable High for Region 7
QDMA Region Access Enable for Region 0-7
Event Queue Entry Q0E0-Q3E15
Queue Status 0-3
0x4900 0380 - 0x4900 039C
0x4900 0400 - 0x4900 04FC
0x4900 0600 - 0x4900 060C
0x4900 0620
Queue Watermark Threshold A
EDMA3CC Status
0x4900 0640
0x4900 0800
Memory Protection Fault Address
Memory Protection Fault Status
Memory Protection Fault Command
Memory Protection Page Attribute Global
Memory Protection Page Attribute 0-7
Event
0x4900 0804
0x4900 0808
0x4900 080C
0x4900 0810 - 0x4900 082C
0x4900 1000
0x4900 1004
ERH
Event High
0x4900 1008
ECR
Event Clear
0x4900 100C
0x4900 1010
ECRH
Event Clear High
ESR
Event Set
0x4900 1014
ESRH
Event Set High
0x4900 1018
CER
Chained Event
0x4900 101C
0x4900 1020
CERH
Chained Event High
EER
Event Enable
0x4900 1024
EERH
Event Enable High
0x4900 1028
EECR
Event Enable Clear
0x4900 102C
0x4900 1030
EECRH
EESR
Event Enable Clear High
Event Enable Set
0x4900 1034
EESRH
SER
Event Enable Set High
0x4900 1038
Secondary Event
0x4900 103C
0x4900 1040
SERH
Secondary Event High
SECR
Secondary Event Clear
0x4900 1044
SECRH
IER
Secondary Event Clear High
Interrupt Enable
0x4900 1050
0x4900 1054
IERH
Interrupt Enable High
0x4900 1058
IECR
Interrupt Enable Clear
0x4900 105C
0x4900 1060
IECRH
IESR
Interrupt Enable Clear High
Interrupt Enable Set
0x4900 1064
IESRH
IPR
Interrupt Enable Set High
Interrupt Pending
0x4900 1068
0x4900 106C
0x4900 1070
IPRH
Interrupt Pending High
ICR
Interrupt Clear
0x4900 1074
ICRH
Interrupt Clear High
0x4900 1078
IEVAL
Interrupt Evaluate
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Table 8-35. EDMA Channel Controller (EDMA TPCC) Control Registers (continued)
HEX ADDRESS
0x4900 1080
0x4900 1084
0x4900 1088
0x4900 108C
0x4900 1090
0x4900 1094
ACRONYM
QER
REGISTER NAME
QDMA Event
QEER
QDMA Event Enable
QDMA Event Enable Clear
QDMA Event Enable Set
QDMA Secondary Event
QDMA Secondary Event Clear
QEECR
QEESR
QSER
QSECR
Shadow Region 0 Channel Registers
0x4900 2000
0x4900 2004
0x4900 2008
0x4900 200C
0x4900 2010
0x4900 2014
0x4900 2018
0x4900 201C
0x4900 2020
0x4900 2024
0x4900 2028
0x4900 202C
0x4900 2030
0x4900 2034
0x4900 2038
0x4900 203C
0x4900 2040
0x4900 2044
0x4900 2050
0x4900 2054
0x4900 2058
0x4900 205C
0x4900 2060
0x4900 2064
0x4900 2068
0x4900 206C
0x4900 2070
0x4900 2074
0x4900 2078
0x4900 2080
0x4900 2084
0x4900 2088
0x4900 208C
0x4900 2090
0x4900 2094
0x4900 2200 - 0x4900 2294
0x4900 2400 - 0x4900 2494
...
ER
ERH
Event
Event High
ECR
Event Clear
ECRH
ESR
Event Clear High
Event Set
ESRH
CER
Event Set High
Chained Event
CERH
EER
Chained Event High
Event Enable
EERH
EECR
EECRH
EESR
EESRH
SER
Event Enable High
Event Enable Clear
Event Enable Clear High
Event Enable Set
Event Enable Set High
Secondary Event
SERH
SECR
SECRH
IER
Secondary Event High
Secondary Event Clear
Secondary Event Clear High
Interrupt Enable
IERH
IECR
IECRH
IESR
IESRH
IPR
Interrupt Enable High
Interrupt Enable Clear
Interrupt Enable Clear High
Interrupt Enable Set
Interrupt Enable Set High
Interrupt Pending
IPRH
ICR
Interrupt Pending High
Interrupt Clear
ICRH
IEVAL
QER
Interrupt Clear High
Interrupt Evaluate
QDMA Event
QEER
QEECR
QEESR
QSER
QSECR
-
QDMA Event Enable
QDMA Event Enable Clear
QDMA Event Enable Set
QDMA Secondary Event
QDMA Secondary Event Clear
Shadow Region 1 Channels
Shadow Region 2 Channels
...
-
0x4900 2E00 - 0x4900 2E94
-
Shadow Channels for MP Space 7
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Table 8-36. EDMA Transfer Controller (EDMA TPTC) Control Registers
TPTC0 HEX
TPTC1 HEX
ADDRESS
TPTC2 HEX
ADDRESS
TPTC3 HEX
ADDRESS
ACRONYM
REGISTER NAME
ADDRESS
0x4980 0000
0x4980 0004
0x4980 0100
0x4980 0120
0x4980 0124
0x4980 0128
0x4980 012C
0x4980 0130
0x4980 0140
0x4980 0240
0x4980 0244
0x4980 0248
0x4980 024C
0x4990 0000
0x4990 0004
0x4990 0100
0x4990 0120
0x4990 0124
0x4990 0128
0x4990 012C
0x4990 0130
0x4990 0140
0x4990 0240
0x4990 0244
0x4990 0248
0x4990 024C
0x49A0 0000
0x49A0 0004
0x49A0 0100
0x49A0 0120
0x49A0 0124
0x49A0 0128
0x49A0 012C
0x49A0 0130
0x49A0 0140
0x49A0 0240
0x49A0 0244
0x49A0 0248
0x49A0 024C
0x49B0 0000
0x49B0 0004
0x49B0 0100
0x49B0 0120
0x49B0 0124
0x49B0 0128
0x49B0 012C
0x49B0 0130
0x49B0 0140
0x49B0 0240
0x49B0 0244
0x49B0 0248
0x49B0 024C
PID
Peripheral Identification
EDMA3TC Configuration
EDMA3TC Channel Status
Error Status
TCCFG
TCSTAT
ERRSTAT
ERREN
ERRCLR
ERRDET
ERRCMD
RDRATE
SAOPT
Error Enable
Error Clear
Error Details
Error Interrupt Command
Read Rate Register
Source Active Options
Source Active Source Address
Source Active Count
SASRC
SACNT
SADST
Source Active Destination
Address
0x4980 0250
0x4980 0254
0x4990 0250
0x4990 0254
0x49A0 0250
0x49A0 0254
0x49B0 0250
0x49B0 0254
SABIDX
Source Active Source B-Index
SAMPPRXY
Source Active Memory
Protection Proxy
0x4980 0258
0x4980 025C
0x4990 0258
0x4990 025C
0x49A0 0258
0x49A0 025C
0x49B0 0258
0x49B0 025C
SACNTRLD
Source Active Count Reload
SASRCBREF
Source Active Source Address
B-Reference
0x4980 0260
0x4980 0280
0x4980 0284
0x4990 0260
0x4990 0280
0x4990 0284
0x49A0 0260
0x49A0 0280
0x49A0 0284
0x49B0 0260
0x49B0 0280
0x49B0 0284
SADSTBREF
DFCNTRLD
DFSRCBREF
Source Active Destination
Address B-Reference
Destination FIFO Set Count
Reload
Destination FIFO Set
Destination Address B
Reference
0x4980 0288
0x4990 0288
0x49A0 0288
0x49B0 0288
DFDSTBREF
Destination FIFO Set
Destination Address B
Reference
0x4980 0300
0x4980 0304
0x4990 0300
0x4990 0304
0x49A0 0300
0x49A0 0304
0x49B0 0300
0x49B0 0304
DFOPT0
DFSRC0
Destination FIFO Options 0
Destination FIFO Source
Address 0
0x4980 0308
0x4980 030C
0x4990 0308
0x4990 030C
0x49A0 0308
0x49A0 030C
0x49B0 0308
0x49B0 030C
DFCNT0
DFDST0
Destination FIFO Count 0
Destination FIFO Destination
Address 0
0x4980 0310
0x4980 0314
0x4990 0310
0x4990 0314
0x49A0 0310
0x49A0 0314
0x49B0 0310
0x49B0 0314
DFBIDX0
Destination FIFO BIDX 0
DFMPPRXY0
Destination FIFO Memory
Protection Proxy 0
0x4980 0340
0x4980 0344
0x4990 0340
0x4990 0344
0x49A0 0340
0x49A0 0344
0x49B0 0340
0x49B0 0344
DFOPT1
DFSRC1
Destination FIFO Options 1
Destination FIFO Source
Address 1
0x4980 0348
0x4980 034C
0x4990 0348
0x4990 034C
0x49A0 0348
0x49A0 034C
0x49B0 0348
0x49B0 034C
DFCNT1
DFDST1
Destination FIFO Count 1
Destination FIFO Destination
Address 1
0x4980 0350
0x4980 0354
0x4990 0350
0x4990 0354
0x49A0 0350
0x49A0 0354
0x49B0 0350
0x49B0 0354
DFBIDX1
Destination FIFO BIDX 1
DFMPPRXY1
Destination FIFO Memory
Protection Proxy 1
0x4980 0380
0x4980 0384
0x4990 0380
0x4990 0384
0x49A0 0380
0x49A0 0384
0x49B0 0380
0x49B0 0384
DFOPT2
DFSRC2
Destination FIFO Options 2
Destination FIFO Source
Address 2
0x4980 0388
0x4990 0388
0x49A0 0388
0x49B0 0388
DFCNT2
Destination FIFO Count 2
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Table 8-36. EDMA Transfer Controller (EDMA TPTC) Control Registers (continued)
TPTC0 HEX
ADDRESS
TPTC1 HEX
ADDRESS
TPTC2 HEX
ADDRESS
TPTC3 HEX
ADDRESS
ACRONYM
REGISTER NAME
0x4980 038C
0x4990 038C
0x49A0 038C
0x49B0 038C
DFDST2
Destination FIFO Destination
Address 2
0x4980 0390
0x4980 0394
0x4990 0390
0x4990 0394
0x49A0 0390
0x49A0 0394
0x49B0 0390
0x49B0 0394
DFBIDX2
Destination FIFO BIDX 2
DFMPPRXY2
Destination FIFO Memory
Protection Proxy 2
0x4980 03C0
0x4980 03C4
0x4990 03C0
0x4990 03C4
0x49A0 03C0
0x49A0 03C4
0x49B0 03C0
0x49B0 03C4
DFOPT3
DFSRC3
Destination FIFO Options 3
Destination FIFO Source
Address 3
0x4980 03C8
0x4980 03CC
0x4990 03C8
0x4990 03CC
0x49A0 03C8
0x49A0 03CC
0x49B0 03C8
0x49B0 03CC
DFCNT3
DFDST3
Destination FIFO Count 3
Destination FIFO Destination
Address 3
0x4980 03D0
0x4980 03D4
0x4990 03D0
0x4990 03D4
0x49A0 03D0
0x49A0 03D4
0x49B0 03D0
0x49B0 03D4
DFBIDX3
Destination FIFO BIDX 3
DFMPPRXY3
Destination FIFO Memory
Protection Proxy 3
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8.6 Ethernet Media Access Controller (EMAC)
The device includes two Ethernet Media Access Controller (EMAC) modules which provide an efficient
interface between the device and the networked community. The EMAC supports 10Base-T (10
Mbits/second [Mbps]) and 100Base-TX (100 Mbps) in either half- or full-duplex mode, and 1000Base-T
(1000 Mbps) in full-duplex mode, with hardware flow control and quality-of-service (QOS) support. The
EMAC controls the flow of packet data from the device to an external PHY. A single MDIO interface is
pinned out to control the PHY configuration and status monitoring. Multiple external PHYs can be
controlled by the MDIO interface.
The EMAC module conforms to the IEEE 802.3-2002 standard, describing the Carrier Sense Multiple
Access with Collision Detection (CSMA/CD) Access Method and Physical Layer specifications. The IEEE
802.3 standard has also been adopted by ISO/IEC and re-designated as ISO/IEC 8802-3:2000(E).
Deviating from this standard, the EMAC module does not use the transmit coding error signal, MTXER.
Instead of driving the error pin when an underflow condition occurs on a transmitted frame, the EMAC
intentionally generates an incorrect checksum by inverting the frame CRC so that the transmitted frame is
detected as an error by the network. In addition, the EMAC I/Os operate at 3.3 V and are not compatible
with 2.5-V I/O signaling; therefore, only Ethernet PHYs with 3.3-V I/O interface should be used. The
EMAC module incorporates 8K bytes of internal RAM to hold EMAC buffer descriptors and contains the
necessary components to enable the EMAC to make efficient use of device memory and control device
interrupts.
The EMAC module on the device supports two interface modes: Media Independent Interface (MII) and
Gigabit Media Independent Interface (GMII). The MII and GMII interface modes are defined in the IEEE
802.3-2002 standard. The EMAC uses the same pins for the MII and GMII modes of operation. Only one
mode can be used at a time.
The MII and GMII modes-of-operation pins are as follows:
•
MII:
EMAC[1:0]_TXCLK,
EMAC[1:0]_RXCLK,
EMAC[1:0]_TXD[3:0],
EMAC[1:0]_RXD[3:0],
EMAC[1:0]_TXEN, EMAC[1:0]_RXDV, EMAC[1:0]_RXER, EMAC[1:0]_COL, EMAC[1:0]_CRS,
MDIO_MCLK, and MDIO_MDIO.
•
GMII:
EMAC[1:0]_GMTCLK,
EMAC[1:0]_TXCLK,
EMAC[1:0]_RXCLK,
EMAC[1:0]_TXD[7:0],
EMAC[1:0]_RXD[7:0], EMAC[1:0]_TXEN, EMAC[1:0]_RXDV, EMAC[1:0]_RXER, EMAC[1:0]_COL,
EMAC[1:0]_CRS, MDIO_MCLK, and MDIO_MDIO.
For more detailed information on the EMAC module, see the EMAC/MDIO chapter in the AM389x Sitara
ARM Processors Technical Reference Manual (literature number SPRUGX7).
8.6.1 EMAC Peripheral Register Descriptions
Table 8-37. EMAC Control Registers
EMAC0 HEX ADDRESS
0x4A10 0000
0x4A10 0004
0x4A10 0008
0x4A10 0010
0x4A10 0014
0x4A10 0018
0x4A10 0080
0x4A10 0084
0x4A10 0088
0x4A10 008C
0x4A10 0090
0x4A10 0094
0x4A10 00A0
EMAC1 HEX ADDRESS
0x4A12 0000
0x4A12 0004
0x4A12 0008
0x4A12 0010
0x4A12 0014
0x4A12 0018
0x4A12 0080
0x4A12 0084
0x4A12 0088
0x4A12 008C
0x4A12 0090
0x4A12 0094
0x4A12 00A0
ACRONYM
TXIDVER
REGISTER NAME
Transmit Identification and Version
Transmit Control
TXCONTROL
TXTEARDOWN
RXIDVER
Transmit Teardown
Receive Identification and Version
Receive Control
RXCONTROL
RXTEARDOWN
TXINTSTATRAW
TXINTSTATMASKED
TXINTMASKSET
TXINTMASKCLEAR
MACINVECTOR
MACEOIVECTOR
RXINTSTATRAW
Receive Teardown
Transmit Interrupt Status (Unmasked)
Transmit Interrupt Status (Masked)
Transmit Interrupt Mask Set
Transmit Interrupt Clear
MAC Input Vector
MAC End of Interrupt Vector
Receive Interrupt Status (Unmasked)
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Table 8-37. EMAC Control Registers (continued)
EMAC0 HEX ADDRESS
0x4A10 00A4
0x4A10 00A8
0x4A10 00AC
0x4A10 00B0
0x4A10 00B4
0x4A10 00B8
0x4A10 00BC
0x4A10 0100
EMAC1 HEX ADDRESS
0x4A12 00A4
0x4A12 00A8
0x4A12 00AC
0x4A12 00B0
0x4A12 00B4
0x4A12 00B8
0x4A12 00BC
0x4A12 0100
ACRONYM
REGISTER NAME
RXINTSTATMASKED
RXINTMASKSET
Receive Interrupt Status (Masked)
Receive Interrupt Mask Set
Receive Interrupt Mask Clear
MAC Interrupt Status (Unmasked)
MAC Interrupt Status (Masked)
MAC Interrupt Mask Set
RXINTMASKCLEAR
MACINTSTATRAW
MACINTSTATMASKED
MACINTMASKSET
MACINTMASKCLEAR
RXMBPENABLE
MAC Interrupt Mask Clear
Receive
Multicast/Broadcast/Promiscuous
Channel Enable
0x4A10 0104
0x4A10 0108
0x4A10 010C
0x4A10 0110
0x4A10 0114
0x4A12 0104
0x4A12 0108
0x4A12 010C
0x4A12 0110
0x4A12 0114
RXUNICASTSET
RXUNICASTCLEAR
RXMAXLEN
Receive Unicast Enable Set
Receive Unicast Clear
Receive Maximum Length
Receive Buffer Offset
RXBUFFEROFFSET
RXFILTERLOWTHRESH Receive Filter Low Priority Frame
Threshold
0x4A10 0120
0x4A10 0124
0x4A10 0128
0x4A10 012C
0x4A10 0130
0x4A10 0134
0x4A10 0138
0x4A10 013C
0x4A12 0120
0x4A12 0124
0x4A12 0128
0x4A12 012C
0x4A12 0130
0x4A12 0134
0x4A12 0138
0x4A12 013C
RX0FLOWTHRESH
RX1FLOWTHRESH
RX2FLOWTHRESH
RX3FLOWTHRESH
RX4FLOWTHRESH
RX5FLOWTHRESH
RX6FLOWTHRESH
RX7FLOWTHRESH
Receive Channel 0 Flow Control
Threshold
Receive Channel 1 Flow Control
Threshold
Receive Channel 2 Flow Control
Threshold
Receive Channel 3 Flow Control
Threshold
Receive Channel 4 Flow Control
Threshold
Receive Channel 5 Flow Control
Threshold
Receive Channel 6 Flow Control
Threshold
Receive Channel 7 Flow Control
Threshold
0x4A10 0140
0x4A10 0144
0x4A10 0148
0x4A10 014C
0x4A10 0150
0x4A10 0154
0x4A10 0158
0x4A10 015C
0x4A10 0160
0x4A10 0164
0x4A10 0168
0x4A10 016C
0x4A10 0170
0x4A10 0174
0x4A10 01D0
0x4A10 01D4
0x4A10 01D8
0x4A10 01DC
0x4A10 01E0
0x4A12 0140
0x4A12 0144
0x4A12 0148
0x4A12 014C
0x4A12 0150
0x4A12 0154
0x4A12 0158
0x4A12 015C
0x4A12 0160
0x4A12 0164
0x4A12 0168
0x4A12 016C
0x4A12 0170
0x4A12 0174
0x4A12 01D0
0x4A12 01D4
0x4A12 01D8
0x4A12 01DC
0x4A12 01E0
RX0FREEBUFFER
RX1FREEBUFFER
RX2FREEBUFFER
RX3FREEBUFFER
RX4FREEBUFFER
RX5FREEBUFFER
RX6FREEBUFFER
RX7FREEBUFFER
MACCONTROL
MACSTATUS
Receive Channel 0 Free Buffer Count
Receive Channel 1 Free Buffer Count
Receive Channel 2 Free Buffer Count
Receive Channel 3 Free Buffer Count
Receive Channel 4 Free Buffer Count
Receive Channel 5 Free Buffer Count
Receive Channel 6 Free Buffer Count
Receive Channel 7 Free Buffer Count
MAC Control
MAC Status
EMCONTROL
Emulation Control
FIFOCONTROL
MACCONFIG
FIFO Control
MAC Configuration
SOFTRESET
Soft Reset
MACSRCADDRLO
MACSRCADDRHI
MACHASH1
MAC Source Address Low Bytes
MAC Source Address High Bytes
MAC Hash Address 1
MACHASH2
MAC Hash Address 2
BOFFTEST
Back Off Test
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Table 8-37. EMAC Control Registers (continued)
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
0x4A12 01E4
ACRONYM
TPACETEST
RXPAUSE
REGISTER NAME
0x4A10 01E4
0x4A10 01E8
Transmit Pacing Algorithm Test
Receive Pause Timer
0x4A12 01E8
0x4A10 01EC
0x4A12 01EC
TXPAUSE
Transmit Pause Timer
0x4A10 0200 - 0x4A10 02FC
0x4A10 0500
0x4A12 0200 - 0x4A12 02FC
0x4A12 0500
(see Table 8-38)
MACADDRLO
EMAC Network Statistics Registers
MAC Address Low Bytes, Used in
Receive Address Matching
0x4A10 0504
0x4A12 0504
MACADDRHI
MAC Address High Bytes, Used in
Receive Address Matching
0x4A10 0508
0x4A10 0600
0x4A12 0508
0x4A12 0600
MACINDEX
TX0HDP
MAC Index
Transmit Channel 0 DMA Head
Descriptor Pointer
0x4A10 0604
0x4A10 0608
0x4A10 060C
0x4A10 0610
0x4A10 0614
0x4A10 0618
0x4A10 061C
0x4A10 0620
0x4A10 0624
0x4A10 0628
0x4A10 062C
0x4A10 0630
0x4A10 0634
0x4A10 0638
0x4A10 063C
0x4A10 0640
0x4A10 0644
0x4A10 0648
0x4A10 064C
0x4A10 0650
0x4A10 0654
0x4A10 0658
0x4A12 0604
0x4A12 0608
0x4A12 060C
0x4A12 0610
0x4A12 0614
0x4A12 0618
0x4A12 061C
0x4A12 0620
0x4A12 0624
0x4A12 0628
0x4A12 062C
0x4A12 0630
0x4A12 0634
0x4A12 0638
0x4A12 063C
0x4A12 0640
0x4A12 0644
0x4A12 0648
0x4A12 064C
0x4A12 0650
0x4A12 0654
0x4A12 0658
TX1HDP
TX2HDP
TX3HDP
TX4HDP
TX5HDP
TX6HDP
TX7HDP
RX0HDP
RX1HDP
RX2HDP
RX3HDP
RX4HDP
RX5HDP
RX6HDP
RX7HDP
TX0CP
Transmit Channel 1 DMA Head
Descriptor Pointer
Transmit Channel 2 DMA Head
Descriptor Pointer
Transmit Channel 3 DMA Head
Descriptor Pointer
Transmit Channel 4 DMA Head
Descriptor Pointer
Transmit Channel 5 DMA Head
Descriptor Pointer
Transmit Channel 6 DMA Head
Descriptor Pointer
Transmit Channel 7 DMA Head
Descriptor Pointer
Receive Channel 0 DMA Head
Descriptor Pointer
Receive Channel 1 DMA Head
Descriptor Pointer
Receive Channel 2 DMA Head
Descriptor Pointer
Receive Channel 3 DMA Head
Descriptor Pointer
Receive Channel 4 DMA Head
Descriptor Pointer
Receive Channel 5 DMA Head
Descriptor Pointer
Receive Channel 6 DMA Head
Descriptor Pointer
Receive Channel 7 DMA Head
Descriptor Pointer
Transmit Channel 0 Completion
Pointer
TX1CP
Transmit Channel 1 Completion
Pointer
TX2CP
Transmit Channel 2 Completion
Pointer
TX3CP
Transmit Channel 3 Completion
Pointer
TX4CP
Transmit Channel 4 Completion
Pointer
TX5CP
Transmit Channel 5 Completion
Pointer
TX6CP
Transmit Channel 6 Completion
Pointer
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Table 8-37. EMAC Control Registers (continued)
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
ACRONYM
REGISTER NAME
0x4A10 065C
0x4A12 065C
TX7CP
Transmit Channel 7 Completion
Pointer
0x4A10 0660
0x4A10 0664
0x4A10 0668
0x4A10 066C
0x4A10 0670
0x4A10 0674
0x4A10 0678
0x4A10 067C
0x4A12 0660
0x4A12 0664
0x4A12 0668
0x4A12 066C
0x4A12 0670
0x4A12 0674
0x4A12 0678
0x4A12 067C
RX0CP
RX1CP
RX2CP
RX3CP
RX4CP
RX5CP
RX6CP
RX7CP
Receive Channel 0 Completion Pointer
Receive Channel 1 Completion Pointer
Receive Channel 2 Completion Pointer
Receive Channel 3 Completion Pointer
Receive Channel 4 Completion Pointer
Receive Channel 5 Completion Pointer
Receive Channel 6 Completion Pointer
Receive Channel 7 Completion Pointer
Table 8-38. EMAC Network Statistics Registers
EMAC0 HEX ADDRESS
0x4A10 0200
0x4A10 0204
0x4A10 0208
0x4A10 020C
0x4A10 0210
0x4A10 0214
0x4A10 0218
0x4A10 021C
0x4A10 0220
0x4A10 0224
0x4A10 0228
0x4A10 022C
0x4A10 0230
0x4A10 0234
0x4A10 0238
0x4A10 023C
0x4A10 0240
0x4A10 0244
0x4A10 0248
0x4A10 024C
0x4A10 0250
0x4A10 0254
0x4A10 0258
0x4A10 025C
0x4A10 0260
0x4A10 0264
0x4A10 0268
0x4A10 026C
0x4A10 0270
0x4A10 0274
0x4A10 0278
0x4A10 027C
EMAC1 HEX ADDRESS
0x4A12 0200
0x4A12 0204
0x4A12 0208
0x4A12 020C
0x4A12 0210
0x4A12 0214
0x4A12 0218
0x4A12 021C
0x4A12 0220
0x4A12 0224
0x4A12 0228
0x4A12 022C
0x4A12 0230
0x4A12 0234
0x4A12 0238
0x4A12 023C
0x4A12 0240
0x4A12 0244
0x4A12 0248
0x4A12 024C
0x4A12 0250
0x4A12 0254
0x4A12 0258
0x4A12 025C
0x4A12 0260
0x4A12 0264
0x4A12 0268
0x4A12 026C
0x4A12 0270
0x4A12 0274
0x4A12 0278
0x4A12 027C
ACRONYM
REGISTER NAME
RXGOODFRAMES
RXBCASTFRAMES
RXMCASTFRAMES
RXPAUSEFRAMES
RXCRCERRORS
Good Receive Frames
Broadcast Receive Frames
Multicast Receive Frames
Pause Receive Frames
Receive CRC Errors
RXALIGNCODEERRORS Receive Alignment/Code Errors
RXOVERSIZED
RXJABBER
Receive Oversized Frames
Receive Jabber Frames
RXUNDERSIZED
RXFRAGMENTS
RXFILTERED
Receive Undersized Frames
Receive Frame Fragments
Filtered Receive Frames
RXQOSFILTERED
RXOCTETS
Receive QOS Filtered Frames
Receive Octet Frames
TXGOODFRAMES
TXBCASTFRAMES
TXMCASTFRAMES
TXPAUSEFRAMES
TXDEFERRED
TXCOLLISION
Good Transmit Frames
Broadcast Transmit Frames
Multicast Transmit Frames
Pause Transmit Frames
Deferred Transmit Frames
Transmit Collision Frames
TXSINGLECOLL
TXMULTICOLL
TXEXCESSIVECOLL
TXLATECOLL
Transmit Single Collision Frames
Transmit Multiple Collision Frames
Transmit Excessive Collision Frames
Transmit Late Collision Frames
Transmit Underrun Error
TXUNDERRUN
TXCARRIERSENSE
TXOCTETS
Transmit Carrier Sense Errors
Transmit Octet Frames
FRAME64
Transmit and Receive 64 Octet Frames
Transmit and Receive 65 to 127 Octet Frames
Transmit and Receive 128 to 255 Octet Frames
Transmit and Receive 256 to 511 Octet Frames
Transmit and Receive 512 to 1023 Octet Frames
FRAME65T127
FRAME128T255
FRAME256T511
FRAME512T1023
FRAME1024TUP
Transmit and Receive 1024 to RXMAXLEN Octet
Frames
0x4A10 0280
0x4A10 0284
0x4A12 0280
0x4A12 0284
NETOCTETS
Network Octet Frames
RXSOFOVERRUNS
Receive FIFO or DMA Start of Frame Overruns
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Table 8-38. EMAC Network Statistics Registers (continued)
EMAC0 HEX ADDRESS
0x4A10 0288
EMAC1 HEX ADDRESS
0x4A12 0288
ACRONYM
REGISTER NAME
RXMOFOVERRUNS
RXDMAOVERRUNS
Receive FIFO or DMA Middle of Frame Overruns
Receive DMA Overruns
0x4A10 028C
0x4A12 028C
Table 8-39. EMAC Control Module Registers
EMAC0 HEX ADDRESS
0x4A10 0900
0x4A10 0904
0x4A10 0908
0x4A10 090C
0x4A10 0910
0x4A10 0914
0x4A10 0918
0x4A10 091C
0x4A10 0940
0x4A10 0944
0x4A10 0948
0x4A10 094C
0x4A10 0970
0x4A10 0974
EMAC1 HEX ADDRESS
0x4A12 0900
0x4A12 0904
0x4A12 0908
0x4A12 090C
0x4A12 0910
0x4A12 0914
0x4A12 0918
0x4A12 091C
0x4A12 0940
0x4A12 0944
0x4A12 0948
0x4A12 094C
0x4A12 0970
0x4A12 0974
ACRONYM
CMIDVER
REGISTER NAME
Identification and Version
Software Reset
CMSOFTRESET
CMEMCONTROL
CMINTCTRL
Emulation Control
Interrupt Control
CMRXTHRESHINTEN
CMRXINTEN
Receive Threshold Interrupt Enable
Receive Interrupt Enable
Transmit Interrupt Enable
Miscellaneous Interrupt Enable
CMTXINTEN
CMMISCINTEN
CMRXTHRESHINTSTAT Receive Threshold Interrupt Status
CMRXINTSTAT
CMTXINTSTAT
CMMISCINTSTAT
CMRXINTMAX
CMTXINTMAX
Receive Interrupt Status
Transmit Interrupt Status
Miscellaneous Interrupt Status
Receive Interrupts Per Millisecond
Transmit Interrupts Per Millisecond
Table 8-40. EMAC Descriptor Memory RAM
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
DESCRIPTION
0x4A10 2000 - 0x4A10 3FFF
0x4A12 2000 - 0x4A12 3FFF
EMAC Control Module Descriptor Memory
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8.6.2 EMAC Electrical Data/Timing
Table 8-41. Timing Requirements for EMAC[1:0]_RXCLK - [G]MII Operation
(see Figure 8-43)
1000 Mbps (1 Gbps)
(GMII Only)
100 Mbps
10 Mbps
NO.
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
Cycle time,
EMAC[1:0]_RXCLK
1
2
3
4
tc(RXCLK)
tw(RXCLKH)
tw(RXCLKL)
tt(RXCLK)
8
40
400
ns
ns
ns
ns
Pulse duration,
EMAC1:0]_RXCLK high
2.8
2.8
14
14
140
140
Pulse duration,
EMAC[1:0]_RXCLK low
Transition time,
EMAC[1:0]_RXCLK
1
3
3
1
4
2
3
EMAC[1:0]_RXCLK
4
Figure 8-43. EMAC[1:0]_RXCLK Timing
Table 8-42. Timing Requirements for EMAC[1:0]_TXCLK - [G]MII Operation
(see Figure 8-44)
1000 Mbps (1 Gbps)
(GMII Only)
100 Mbps
10 Mbps
NO.
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
Cycle time,
EMAC[1:0]_TXCLK
1
2
3
4
tc(TXCLK)
tw(TXCLKH)
tw(TXCLKL)
tt(TXCLK)
8
40
400
ns
ns
ns
ns
Pulse duration,
EMAC[1:0]_TXCLK high
2.8
2.8
14
14
140
140
Pulse duration,
EMAC[1:0]_TXCLK low
Transition time,
EMAC[1:0]_TXCLK
1
3
3
1
4
2
3
EMAC[1:0]_TXCLK
4
Figure 8-44. EMAC[1:0]_TXCLK Timing
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Table 8-43. Timing Requirements for EMAC [G]MII Receive 10/100/1000 Mbit/s
(see Figure 8-45)
1000 Mbps (1
Gbps)
100/10 Mbps
NO.
UNIT
MIN
MAX
MIN
MAX
tsu(RXD-RXCLK)
Setup time, receive selected signals valid before
EMAC[1:0]_RXCLK
1
2
tsu(RXDV-RXCLK)
tsu(RXER-RXCLK)
th(RXCLK-RXD)
th(RXCLK-RXDV)
th(RXCLK-RXER)
2
8
ns
Hold time, receive selected signals valid after
EMAC[1:0]_RXCLK
0
8
ns
1
2
EMAC[1:0]_RXCLK (input)
EMAC[1:0]_RXD7−EMAC[1:0]_RXD0,
EMAC[1:0]_RXDV, EMAC[1:0]_RXER (inputs)
Figure 8-45. EMAC Receive Timing
Table 8-44. Switching Characteristics Over Recommended Operating Conditions for EMAC [G]MII
Transmit 10/100 Mbits/s
(see Figure 8-46)
100/10 Mbps
MIN
NO.
PARAMETER
UNIT
MAX
td(TXCLK-TXD)
td(TXCLK-TXEN)
1
Delay time, EMAC[1:0]_TXCLK to transmit selected signals valid
5
25
ns
Table 8-45. Switching Characteristics Over Recommended Operating Conditions for EMAC [G]MII
Transmit 1000 Mbits/s
(see Figure 8-46)
1000 Mbps (1 Gbps)
NO.
PARAMETER
UNIT
MIN
MAX
td(GMTCLK-TXD)
1
Delay time, EMAC[1:0]_GMTCLK to transmit selected signals valid
0.5
5
ns
td(GMTCLK-TXEN)
1
EMAC[1:0]_TXCLK (input)
EMAC[1:0]_TXD7−EMAC[1:0]_TXD0,
EMAC[1:0]_TXEN (outputs)
Figure 8-46. EMAC Transmit Timing
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8.6.3 Management Data Input/Output (MDIO)
The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to
enumerate all PHY devices in the system.
The MDIO module implements the 802.3 serial management interface to interrogate and control Ethernet
PHY(s) using a shared two-wire bus. Host software uses the MDIO module to configure the auto-
negotiation parameters of each PHY attached to the EMAC, retrieve the negotiation results, and configure
required parameters in the EMAC module for correct operation. The module is designed to allow almost
transparent operation of the MDIO interface, with very little maintenance from the core processor. A single
MDIO interface is pinned out to control the PHY configuration and status monitoring. Multiple external
PHYs can be controlled by the MDIO interface.
For more detailed information on the MDIO peripheral, see the EMAC/MDIO chapter in the AM389x Sitara
ARM Processors Technical Reference Manual (literature number SPRUGX7).
8.6.3.1 MDIO Peripheral Register Descriptions
Table 8-46. MDIO Registers
HEX ADDRESS
0x4A10 0800
ACRONYM
VERSION
REGISTER NAME
MDIO Version
0x4A10 0804
CONTROL
MDIO Control
0x4A10 0808
ALIVE
PHY Alive Status
0x4A10 080C
0x4A10 0810
LINK
PHY Link Status
LINKINTRAW
LINKINTMASKED
-
MDIO Link Status Change Interrupt (Unmasked)
MDIO Link Status Change Interrupt (Masked)
Reserved
0x4A10 0814
0x4A10 0818
0x4A10 081C
0x4A10 0820
USERINTRAW
USERINTMASKED
USERINTMASKSET
USERINTMASKCLEAR
-
MDIO User Command Complete Interrupt (Unmasked)
MDIO User Command Complete Interrupt (Masked)
MDIO User Command Complete Interrupt Mask Set
MDIO User Command Complete Interrupt Mask Clear
Reserved
0x4A10 0824
0x4A10 0828
0x4A10 082C
0x4A10 0830 - 0x4A10 087C
0x4A10 0880
USERACCESS0
USERPHYSEL0
USERACCESS1
USERPHYSEL1
MDIO User Access 0
MDIO User PHY Select 0
0x4A10 0884
MDIO User Access 1
0x4A10 0888
MDIO User PHY Select 1
8.6.3.2 MDIO Electrical Data/Timing
Table 8-47. Timing Requirements for MDIO Input
(see Figure 8-47)
NO.
MIN
400
180
20
MAX UNIT
1
tc(MCLK)
Cycle time, MDIO_MCLK
ns
ns
ns
ns
tw(MCLK)
Pulse duration, MDIO_MCLK high or low
4
5
tsu(MDIO-MCLKH)
th(MCLKH-MDIO)
Setup time, MDIO_MDIO data input valid before MDIO_MCLK high
Hold time, MDIO_MDIO data input valid after MDIO_MCLK high
0
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1
MDIO_MCLK
4
5
MDIO_MDIO
(input)
Figure 8-47. MDIO Input Timing
Table 8-48. Switching Characteristics Over Recommended Operating Conditions for MDIO Output
(see Figure 8-48)
NO.
PARAMETER
MIN
MAX UNIT
100 ns
7
td(MCLKL-MDIO)
Delay time, MDIO_MCLK low to MDIO_MDIO data output valid
1
MDIO_MCLK
7
MDIO_MDIO
(output)
Figure 8-48. MDIO Output Timing
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8.7 General-Purpose Input/Output (GPIO)
The GPIO peripheral provides general-purpose pins that can be configured as either inputs or outputs.
When configured as an output, a write to an internal register controls the state driven on the output pin.
When configured as an input, the state of the input is detectable by reading the state of an internal
register. In addition, the GPIO peripheral can produce CPU interrupts in different interrupt generation
modes. The GPIO peripheral provides generic connections to external devices.
The device contains two GPIO modules and each GPIO module is made up of 32 identical channels.
The device GPIO peripheral supports the following:
•
Up to 64 3.3-V GPIO pins, GP0[31:0] and GP1[31:0] (the exact number available varies as a function
of the device configuration). Each channel can be configured to be used in the following applications:
–
–
–
Data input/output
Keyboard interface with a de-bouncing cell
Synchronous interrupt generation (in active mode) upon the detection of external events (signal
transition(s) and/or signal level(s)).
•
•
Synchronous interrupt requests from each channel are processed by two identical interrupt generation
sub-modules to be used independently by the ARM. Interrupts can be triggered by rising and/or falling
edge, specified for each interrupt-capable GPIO signal.
Shared registers can be accessed through "Set & Clear" protocol. Software writes 1 to corresponding
bit position(s) to set or to clear GPIO signal(s). This allows multiple software processes to toggle GPIO
output signals without critical section protection (disable interrupts, program GPIO, re-enable interrupts,
to prevent context switching to another process during GPIO programming).
•
•
Separate input/output registers.
Output register in addition to set/clear so that, if preferred by software, some GPIO output signals can
be toggled by direct write to the output register(s).
•
Output register, when read, reflects output drive status. This, in addition to the input register reflecting
pin status and open-drain I/O cell, allows wired logic to be implemented.
For more detailed information on GPIOs, see the GPIO chapter in the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
8.7.1 GPIO Peripheral Register Descriptions
Table 8-49. GPIO Registers
GPIO0 HEX ADDRESS
0x4803 2000
0x4803 2010
0x4803 2020
0x4803 2024
0x4803 2028
0x4803 202C
0x4803 2030
0x4803 2034
0x4803 2038
0x4803 203C
0x4803 2040
0x4803 2044
0x4803 2048
0x4803 2114
0x4803 2130
0x4803 2134
GPIO1 HEX ADDRESS
0x4804 C000
0x4804 C010
0x4804 C020
0x4804 C024
0x4804 C028
0x4804 C02C
0x4804 C030
0x4804 C034
0x4804 C038
0x4804 C03C
0x4804 C040
0x4804 C044
0x4804 C048
0x4804 C114
0x4804 C130
0x4804 C134
ACRONYM
GPIO_REVISION
REGISTER NAME
GPIO Revision
GPIO_SYSCONFIG
GPIO_EOI
System Configuration
End of Interrupt
GPIO_IRQSTATUS_RAW_0
GPIO_IRQSTATUS_RAW_1
GPIO_IRQSTATUS_0
GPIO_IRQSTATUS_1
GPIO_IRQSTATUS_SET_0
GPIO_IRQSTATUS_SET_1
GPIO_IRQSTATUS_CLR_0
GPIO_IRQSTATUS_CLR_1
GPIO_IRQWAKEN_0
GPIO_IRQWAKEN_1
GPIO_SYSSTATUS
GPIO_CTRL
Status Raw for Interrupt 1
Status Raw for Interrupt 2
Status for Interrupt 1
Status for Interrupt 2
Enable Set for Interrupt 1
Enable Set for Interrupt 2
Enable Clear for Interrupt 1
Enable Clear for Interrupt 2
Wakeup Enable for Interrupt 1
Wakeup Enable for Interrupt 2
System Status
Module Control
GPIO_OE
Output Enable
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Table 8-49. GPIO Registers (continued)
GPIO0 HEX ADDRESS
0x4803 2138
0x4803 213C
0x4803 2140
0x4803 2144
0x4803 2148
0x4803 214C
0x4803 2150
0x4803 2154
0x4803 2190
0x4803 2194
GPIO1 HEX ADDRESS
0x4804 C138
0x4804 C13C
0x4804 C140
0x4804 C144
0x4804 C148
0x4804 C14C
0x4804 C150
0x4804 C154
0x4804 C190
0x4804 C194
ACRONYM
REGISTER NAME
Data Input
GPIO_DATAIN
GPIO_DATAOUT
Data Output
GPIO_LEVELDETECT0
GPIO_LEVELDETECT1
GPIO_RISINGDETECT
GPIO_FALLINGDETECT
GPIO_DEBOUNCENABLE
GPIO_DEBOUNCINGTIME
GPIO_CLEARDATAOUT
GPIO_SETDATAOUT
Detect Low Level
Detect High Level
Detect Rising Edge
Detect Falling Edge
Debouncing Enable
Debouncing Value
Clear Data Output
Set Data Output
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8.7.2 GPIO Electrical Data/Timing
Table 8-50. Timing Requirements for GPIO Inputs
(see Figure 8-49)
NO.
MIN
12P(1)
12P(1)
MAX UNIT
1
2
tw(GPIH)
tw(GPIL)
Pulse duration, GP[x] input high
Pulse duration, GP[x] input low
ns
ns
(1) P = Module clock.
Table 8-51. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs
(see Figure 8-49)
NO.
3
PARAMETER
MIN
36P-8(1)
36P-8(1)
MAX UNIT
tw(GPOH)
tw(GPOL)
Pulse duration, GP[x] output high
Pulse duration, GP[x] output low
ns
ns
4
(1) P = Module clock.
2
1
GP[1:0][x]
input
4
3
GP[1:0][x]
output
Figure 8-49. GPIO Port Timing
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
8.8 General-Purpose Memory Controller (GPMC) and Error Locator Module (ELM)
The GPMC is a device memory controller used to provide a glueless interface to external memory devices
such as NOR Flash, NAND Flash (with BCH and Hamming Error Code Detection for 8-bit or 16-bit NAND
Flash), SRAM, and Pseudo-SRAM. It includes flexible asynchronous protocol control for interface to
SRAM-like memories and custom logic (FPGA, CPLD, ASICs, etc.).
The first section of GPMC memory (0x0 - 0x00FF_FFFF) is reserved for BOOTROM. Accessible memory
starts at location 0x0100_0000.
Other supported features include:
•
•
•
•
8-/16-bit wide multiplexed address/data bus
Up to 6 chip selects with up to 256M-byte address space per chip select pin
Non-multiplexed address/data mode
Pre-fetch and write posting engine associated with system DMA to get full performance from NAND
device with minimum impact on NOR/SRAM concurrent access.
The device also contains an Error Locator Module (ELM) which is used to extract error addresses from
syndrome polynomials generated using a BCH algorithm. Each of these polynomials gives a status of the
read operations for a 512 bytes block from a NAND flash and its associated BCH parity bits, plus
optionally spare area information. The ELM has the following features:
•
•
•
•
4-bit, 8-bit, and 16-bit per 512-byte block error location based on BCH algorithms
Eight simultaneous processing contexts
Page-based and continuous modes
Interrupt generation on error location process completion
–
–
When the full page has been processed in page mode
For each syndrome polynomial in continuous mode.
For more detailed information on the GPMC, see the GPMC chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
8.8.1 GPMC and ELM Peripheral Register Descriptions
Table 8-52. GPMC Registers(1)(2)
HEX ADDRESS
0x5000 0000
ACRONYM
GPMC_REVISION
REGISTER NAME
GPIO Revision
0x5000 0010
GPMC_SYSCONFIG
GPMC_SYSSTATUS
GPMC_IRQSTATUS
GPMC_IRQENABLE
GPMC_TIMEOUT_CONTROL
GPMC_ERR_ADDRESS
GPMC_ERR_TYPE
GPMC_CONFIG
System Configuration
System Status
0x5000 0014
0x5000 0018
Status for Interrupt
Interrupt Enable
0x5000 001C
0x5000 0040
Timeout Counter Start Value
Error Address
0x5000 0044
0x5000 0048
Error Type
0x5000 0050
GPMC Global Configuration
GPMC Global Status
Parameter Configuration 1_0-5
0x5000 0054
GPMC_STATUS
0x5000 0060 + (0x0000 0030 * i)
GPMC_CONFIG1_0 -
GPMC_CONFIG1_5
0x5000 0064 + (0x0000 0030 * i)
0x5000 0068 + (0x0000 0030 * i)
0x5000 006C + (0x0000 0030 * i)
GPMC_CONFIG2_0 -
GPMC_CONFIG2_5
Parameter Configuration 2_0-5
Parameter Configuration 3_0-5
Parameter Configuration 4_0-5
GPMC_CONFIG3_0 -
GPMC_CONFIG3_5
GPMC_CONFIG4_0 -
GPMC_CONFIG4_5
(1) i = 0 to 5.
(2) j = 0 to 8.
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Table 8-52. GPMC Registers(1)(2) (continued)
HEX ADDRESS
ACRONYM
REGISTER NAME
0x5000 0070 + (0x0000 0030 * i)
GPMC_CONFIG5_0 -
GPMC_CONFIG5_5
Parameter Configuration 5_0-5
0x5000 0074 + (0x0000 0030 * i)
0x5000 0078 + (0x0000 0030 * i)
0x5000 007C + (0x0000 0030 * i)
0x5000 0080 + (0x0000 0030 * i)
0x5000 0084 + (0x0000 0030 * i)
GPMC_CONFIG6_0 -
GPMC_CONFIG6_5
Parameter Configuration 6_0-5
Parameter Configuration 7_0-5
NAND Command 0-5
GPMC_CONFIG7_0 -
GPMC_CONFIG7_5
GPMC_NAND_COMMAND_0 -
GPMC_NAND_COMMAND_5
GPMC_NAND_ADDRESS_0 -
GPMC_NAND_ADDRESS_5
NAND Address 0-5
GPMC_NAND_DATA_0 -
GPMC_NAND_DATA_5
NAND Data 0-5
0x5000 01E0
0x5000 01E4
GPMC_PREFETCH_CONFIG1
GPMC_PREFETCH_CONFIG2
GPMC_PREFETCH_CONTROL
GPMC_PREFETCH_STATUS
GPMC_ECC_CONFIG
Prefetch Configuration 1
Prefetch Configuration 2
Prefetch Control
0x5000 01EC
0x5000 01F0
Prefetch Status
0x5000 01F4
ECC Configuration
ECC Control
0x5000 01F8
GPMC_ECC_CONTROL
0x5000 01FC
GPMC_ECC_SIZE_CONFIG
ECC Size Configuration
ECC0-8 Result
0x5000 0200 + (0x0000 0004 * j)
GPMC_ECC0_RESULT -
GPMC_ECC8_RESULT
0x5000 0240 + (0x0000 0010 * i)
0x5000 0244 + (0x0000 0010 * i)
0x5000 0248 + (0x0000 0010 * i)
0x5000 024C + (0x0000 0010 * i)
0x5000 0300 + (0x0000 0010 * i)
0x5000 0304 + (0x0000 0010 * i)
0x5000 0308 + (0x0000 0010 * i)
0x5000 02D0
GPMC_BCH_RESULT0_0 -
GPMC_BCH_RESULT0_5
BCH Result 0_0-5
BCH Result 1_0-5
BCH Result 2_0-5
BCH Result 3_0-5
BCH Result 4_0-5
BCH Result 5_0-5
BCH Result 6_0-5
BCH Data
GPMC_BCH_RESULT1_0 -
GPMC_BCH_RESULT1_5
GPMC_BCH_RESULT2_0 -
GPMC_BCH_RESULT2_5
GPMC_BCH_RESULT3_0 -
GPMC_BCH_RESULT3_5
GPMC_BCH_RESULT4_0 -
GPMC_BCH_RESULT4_5
GPMC_BCH_RESULT5_0 -
GPMC_BCH_RESULT5_5
GPMC_BCH_RESULT6_0 -
GPMC_BCH_RESULT6_5
GPMC_BCH_SWDATA
Table 8-53. ELM Registers(1)
HEX ADDRESS
0x4808 0000
ACRONYM
REGISTER NAME
ELM_REVISION
Revision
0x4808 0010
ELM_SYSCONFIG
Configuration
0x4808 0014
ELM_SYSSTATUS
Status
0x4808 0018
ELM_IRQSTATUS
Interrupt status
0x4808 001C
ELM_IRQENABLE
Interrupt enable
0x4808 0020
ELM_LOCATION_CONFIG
ELM_PAGE_CTRL
ECC algorithm parameters
Page definition
0x4808 0080
0x4808 0400 + (0x40 * i)
0x4808 0404 + (0x40 * i)
0x4808 0408 + (0x40 * i)
0x4808 040C + (0x40 * i)
0x4808 0410 + (0x40 * i)
ELM_SYNDROME_FRAGMENT_0_i
ELM_SYNDROME_FRAGMENT_1_i
ELM_SYNDROME_FRAGMENT_2_i
ELM_SYNDROME_FRAGMENT_3_i
ELM_SYNDROME_FRAGMENT_4_i
Input syndrome polynomial bits 0 to 31
Input syndrome polynomial bits 32 to 63
Input syndrome polynomial bits 64 to 95
Input syndrome polynomial bits 96 to 127
Input syndrome polynomial bits 128 to 159
(1) i = 0 to 7.
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Table 8-53. ELM Registers(1) (continued)
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4808 0414 + (0x40 * i)
0x4808 0418 + (0x40 * i)
0x4808 0800 + (0x100 * i)
0x4808 0880 + (0x100 * i)
0x4808 0884 + (0x100 * i)
0x4808 0888 + (0x100 * i)
0x4808 088C + (0x100 * i)
0x4808 0890 + (0x100 * i)
0x4808 0894 + (0x100 * i)
0x4808 0898 + (0x100 * i)
0x4808 089C + (0x100 * i)
0x4808 08A0 + (0x100 * i)
0x4808 08A4 + (0x100 * i)
0x4808 08A8 + (0x100 * i)
0x4808 08AC + (0x100 * i)
0x4808 08B0 + (0x100 * i)
0x4808 08B4 + (0x100 * i)
0x4808 08B8 + (0x100 * i)
0x4808 08BC + (0x100 * i)
ELM_SYNDROME_FRAGMENT_5_i
ELM_SYNDROME_FRAGMENT_6_i
ELM_LOCATION_STATUS_i
ELM_ERROR_LOCATION_0_i
ELM_ERROR_LOCATION_1_i
ELM_ERROR_LOCATION_2_i
ELM_ERROR_LOCATION_3_i
ELM_ERROR_LOCATION_4_i
ELM_ERROR_LOCATION_5_i
ELM_ERROR_LOCATION_6_i
ELM_ERROR_LOCATION_7_i
ELM_ERROR_LOCATION_8_i
ELM_ERROR_LOCATION_9_i
ELM_ERROR_LOCATION_10_i
ELM_ERROR_LOCATION_11_i
ELM_ERROR_LOCATION_12_i
ELM_ERROR_LOCATION_13_i
ELM_ERROR_LOCATION_14_i
ELM_ERROR_LOCATION_15_i
Input syndrome polynomial bits 160 to 191
Input syndrome polynomial bits 192 to 207
Exit status
Error location
Error location
Error location
Error location
Error location
Error location
Error location
Error location
Error location
Error location
Error location
Error location
Error location
Error location
Error location
Error location
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8.8.2 GPMC Electrical Data/Timing
8.8.2.1 GPMC/NOR Flash Interface Synchronous Mode Timing
Table 8-54. Timing Requirements for GPMC/NOR Flash Interface - Synchronous Mode
(see Figure 8-50, Figure 8-51, Figure 8-52, Figure 8-53, Figure 8-54, Figure 8-55)
NO.
MIN
3.2
2.5
3.2
2.5
MAX
UNIT
ns
13 tsu(DV-CLKH)
14 th(CLKH-DV)
22 tsu(WAITV-CLKH)
23 th(CLKH-WAITV)
Setup time, read GPMC_D[15:0] valid before GPMC_CLK high
Hold time, read GPMC_D[15:0] valid after GPMC_CLK high
Setup time, GPMC_WAIT valid before GPMC_CLK high
Hold time, GPMC_WAIT valid after GPMC_CLK high
ns
ns
ns
Table 8-55. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Synchronous Mode
(see Figure 8-50, Figure 8-51, Figure 8-52, Figure 8-53, Figure 8-54, Figure 8-55)
NO.
PARAMETER
MIN
16(1)
0.5P(2)
0.5P(2)
F - 2.2(3)
E - 2.2(4)
MAX
UNIT
1
tc(CLK)
Cycle time, output clock GPMC_CLK period
Pulse duration, output clock GPMC_CLK high
Pulse duration, output clock GPMC_CLK low
Delay time, GPMC_CLK rising edge to GPMC_CS[x] transition
Delay time, GPMC_CLK rising edge to GPMC_CS[x] invalid
ns
tw(CLKH)
2
ns
tw(CLKL)
3
4
td(CLKH-nCSV)
td(CLKH-nCSIV)
F + 4.5(3)
E + 4.5(4)
ns
ns
Delay time, GPMC_A[27:0] address bus valid to GPMC_CLK first
edge
5
6
7
8
td(ADDV-CLK)
td(CLKH-ADDIV)
td(nBEV-CLK)
td(CLKH-nBEIV)
B - 4.5(5)
B + 2.3(5)
ns
ns
ns
ns
Delay time, GPMC_CLK rising edge to GPMC_A[27:0] GPMC
address bus invalid
-2.3
Delay time, GPMC_BE0_CLE, GPMC_BE1 valid to GPMC_CLK
first edge
B - 1.9(5)
D - 2.3(6)
B + 2.3(5)
D + 1.9(6)
Delay time, GPMC_CLK rising edge to GPMC_BE0_CLE,
GPMC_BE1 invalid
(1) Sync mode = 62.5 MHz; Async mode = 125 MHz.
(2) P = GPMC_CLK period.
(3) For nCS falling edge (CS activated):
•
For GpmcFCLKDivider = 0:
F = 0.5 * CSExtraDelay * GPMC_FCLK
For GpmcFCLKDivider = 1:
•
F = 0.5 * CSExtraDelay * GPMC_FCLK if (ClkActivationTime and CSOnTime are odd) or (ClkActivationTime and CSOnTime are
even)
F = (1 + 0.5 * CSExtraDelay) * GPMC_FCLK otherwise
•
For GpmcFCLKDivider = 2:
F = 0.5 * CSExtraDelay * GPMC_FCLK if ((CSOnTime - ClkActivationTime) is a multiple of 3)
F = (1 + 0.5 * CSExtraDelay) * GPMC_FCLK if ((CSOnTime - ClkActivationTime - 1) is a multiple of 3)
F = (2 + 0.5 * CSExtraDelay) * GPMC_FCLK if ((CSOnTime - ClkActivationTime - 2) is a multiple of 3)
(4) For single read: E = (CSRdOffTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: E = (CSRdOffTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst write: E = (CSWrOffTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
(5) B = ClkActivationTime * GPMC_FCLK
(6) For single read: D = (RdCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: D = (RdCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst write: D = (WrCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
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Table 8-55. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Synchronous Mode (continued)
(see Figure 8-50, Figure 8-51, Figure 8-52, Figure 8-53, Figure 8-54, Figure 8-55)
NO.
PARAMETER
MIN
G - 2.3(7)
D - 2.3(6)
H - 2.3(8)
E - 2.3(4)
MAX
G + 4.5(7)
D + 4.5(6)
H + 3.5(8)
E + 3.5(4)
UNIT
ns
9
td(CLKH-nADV)
Delay time, GPMC_CLK rising edge to GPMC_ADV_ALE transition
Delay time, GPMC_CLK rising edge to GPMC_ADV_ALE invalid
Delay time, GPMC_CLK rising edge to GPMC_OE_RE transition
Delay time, GPMC_CLK rising edge to GPMC_OE_RE invalid
10 td(CLKH-nADVIV)
11 td(CLKH-nOE)
12 td(CLKH-nOEIV)
ns
ns
ns
(7) For ADV falling edge (ADV activated):
•
Case GpmcFCLKDivider = 0:
G = 0.5 * ADVExtraDelay * GPMC_FCLK
Case GpmcFCLKDivider = 1:
•
G = 0.5 * ADVExtraDelay * GPMC_FCLK if (ClkActivationTime and ADVOnTime are odd) or (ClkActivationTime and ADVOnTime are
even)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK otherwise
•
Case GpmcFCLKDivider = 2:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if ((ADVOnTime - ClkActivationTime) is a multiple of 3)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVOnTime - ClkActivationTime - 1) is a multiple of 3)
G = (2 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVOnTime - ClkActivationTime - 2) is a multiple of 3)
For ADV rising edge (ADV deactivated) in Reading mode:
•
Case GpmcFCLKDivider = 0:
G = 0.5 * ADVExtraDelay * GPMC_FCLK
•
Case GpmcFCLKDivider = 1:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if (ClkActivationTime and ADVRdOffTime are odd) or (ClkActivationTime and
ADVRdOffTime are even)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK otherwise
•
Case GpmcFCLKDivider = 2:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if ((ADVRdOffTime - ClkActivationTime) is a multiple of 3)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVRdOffTime - ClkActivationTime - 1) is a multiple of 3)
G = (2 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVRdOffTime - ClkActivationTime - 2) is a multiple of 3)
For ADV rising edge (ADV deactivated) in Writing mode:
•
Case GpmcFCLKDivider = 0:
G = 0.5 * ADVExtraDelay * GPMC_FCLK
•
Case GpmcFCLKDivider = 1:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if (ClkActivationTime and ADVWrOffTime are odd) or (ClkActivationTime and
ADVWrOffTime are even)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK otherwise
•
Case GpmcFCLKDivider = 2:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if ((ADVWrOffTime - ClkActivationTime) is a multiple of 3)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVWrOffTime - ClkActivationTime - 1) is a multiple of 3)
G = (2 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVWrOffTime - ClkActivationTime - 2) is a multiple of 3)
(8) For OE falling edge (OE activated) / IO DIR rising edge (IN direction) :
•
Case GpmcFCLKDivider = 0:
H = 0.5 * OEExtraDelay * GPMC_FCLK
•
Case GpmcFCLKDivider = 1:
H = 0.5 * OEExtraDelay * GPMC_FCLK if (ClkActivationTime and OEOnTime are odd) or (ClkActivationTime and OEOnTime are
even)
H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK otherwise
•
Case GpmcFCLKDivider = 2:
H = 0.5 * OEExtraDelay * GPMC_FCLK if ((OEOnTime - ClkActivationTime) is a multiple of 3)
H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOnTime - ClkActivationTime - 1) is a multiple of 3)
H = (2 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOnTime - ClkActivationTime - 2) is a multiple of 3)
For OE rising edge (OE deactivated):
•
Case GpmcFCLKDivider = 0:
H = 0.5 * OEExtraDelay * GPMC_FCLK
•
Case GpmcFCLKDivider = 1:
H = 0.5 * OEExtraDelay * GPMC_FCLK if (ClkActivationTime and OEOffTime are odd) or (ClkActivationTime and OEOffTime are
even)
H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK otherwise
•
Case GpmcFCLKDivider = 2:
H = 0.5 * OEExtraDelay * GPMC_FCLK if ((OEOffTime - ClkActivationTime) is a multiple of 3)
H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOffTime - ClkActivationTime - 1) is a multiple of 3)
H = (2 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOffTime - ClkActivationTime - 2) is a multiple of 3)
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Table 8-55. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Synchronous Mode (continued)
(see Figure 8-50, Figure 8-51, Figure 8-52, Figure 8-53, Figure 8-54, Figure 8-55)
NO.
PARAMETER
MIN
MAX
UNIT
15 td(CLKH-nWE)
Delay time, GPMC_CLK rising edge to GPMC_WE transition
I - 2.3(9)
I + 4.5(9)
ns
Delay time, GPMC_CLK rising edge to GPMC_D[15:0] data bus
transition
16 td(CLKH-Data)
18 td(CLKH-nBE)
J - 2.3(10)
J - 2.3(10)
J + 1.9(10)
J + 1.9(10)
ns
ns
Delay time, GPMC_CLK rising edge to GPMC_BE0_CLE,
GPMC_BE1 transition
19 tw(nCSV)
20 tw(nBEV)
21 tw(nADVV)
Pulse duration, GPMC_CS[x] low
A(11)
C(12)
K(13)
ns
ns
ns
Pulse duration, GPMC_BE0_CLE, GPMC_BE1 low
Pulse duration, GPMC_ADV_ALE low
Delay time, GPMC_CLK rising edge to GPMC_DIR high (IN
direction)
24 td(CLKH-DIR)
25 td(CLKH-DIRIV)
H - 2.3(8)
H + 4.5(8)
ns
ns
Delay time, GPCM_CLK rising edge to GPMC_DIR low (OUT
direction)
M - 2.3(14)
M + 4.5(14)
(9) For WE falling edge (WE activated):
•
Case GpmcFCLKDivider = 0:
I = 0.5 * WEExtraDelay * GPMC_FCLK
Case GpmcFCLKDivider = 1:
•
I = 0.5 * WEExtraDelay * GPMC_FCLK if (ClkActivationTime and WEOnTime are odd) or (ClkActivationTime and WEOnTime are
even)
I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK otherwise
•
Case GpmcFCLKDivider = 2:
I = 0.5 * WEExtraDelay * GPMC_FCLK if ((WEOnTime - ClkActivationTime) is a multiple of 3)
I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOnTime - ClkActivationTime - 1) is a multiple of 3)
I = (2 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOnTime - ClkActivationTime - 2) is a multiple of 3)
For WE rising edge (WE deactivated):
•
Case GpmcFCLKDivider = 0:
I = 0.5 * WEExtraDelay * GPMC_FCLK
•
Case GpmcFCLKDivider = 1:
I = 0.5 * WEExtraDelay * GPMC_FCLK if (ClkActivationTime and WEOffTime are odd) or (ClkActivationTime and WEOffTime are
even)
I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK otherwise
•
Case GpmcFCLKDivider = 2:
I = 0.5 * WEExtraDelay * GPMC_FCLK if ((WEOffTime - ClkActivationTime) is a multiple of 3)
I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOffTime - ClkActivationTime - 1) is a multiple of 3)
I = (2 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOffTime - ClkActivationTime - 2) is a multiple of 3)
(10) J = GPMC_FCLK period.
(11) For single read: A = (CSRdOffTime - CSOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK period
For burst read: A = (CSRdOffTime - CSOnTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK period [n
= page burst access number]
For burst write: A = (CSWrOffTime - CSOnTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK period [n
= page burst access number]
(12) For single read: C = RdCycleTime * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: C = (RdCycleTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK [n = page burst access
number]
For Burst write: C = (WrCycleTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK [n = page burst
access number]
(13) For read: K = (ADVRdOffTime - ADVOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For write: K = (ADVWrOffTime - ADVOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
(14) M = ( RdCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK.
Parameter M expression is given as one example of GPMC programming. The IO DIR signal goes from IN to OUT after both
RdCycleTime and BusTurnAround completion. Behavior of the IO direction signal depends on the kind of successive read/write
accesses performed to the memory and multiplexed or non-multiplexed memory addressing scheme, whether the bus keeping feature is
enabled or not. The IO DIR behavior is automatically handled by the GPMC controller.
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2
1
2
GPMC_CLK
3
4
19
GPMC_CS[x]
5
7
GPMC_A[27:0]
Address
8
8
20
GPMC_BE1
7
20
GPMC_BE0_CLE
9
9
21
10
GPMC_ADV_ALE
GPMC_OE
11
12
14
13
GPMC_D[15:0]
GPMC_WAIT
GPMC_DIR
D0
23
22
24
25
OUT
IN
OUT
Figure 8-50. GPMC Non-Multiplexed NOR Flash - Synchronous Single Read (GPMCFCLKDIVIDER = 0)
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2
1
2
GPMC_CLK
GPMC_CS[x]
3
4
19
5
GPMC_A[27:0]
Address
20
8
7
Valid
GPMC_BE1
8
7
20
Valid
GPMC_BE0_CLE
9
9
10
12
21
GPMC_ADV_ALE
GPMC_OE
11
13
14
13
GPMC_D[15:0]
GPMC_WAIT
D0
D1
D2
D3
23
22
24
25
OUT
OUT
IN
GPMC_DIR
Figure 8-51. GPMC Non-Multiplexed NOR Flash - 4x16-bit Synchronous Burst Read
(GPMCFCLKDIVIDER = 0)
2
2
1
GPMC_CLK
GPMC_CS[x]
3
4
19
5
7
GPMC_A[27:0]
GPMC_BE1
Address
18
18
18
18
18
18
7
GPMC_BE0_CLE
9
9
10
21
GPMC_ADV_ALE
15
15
GPMC_WE
GPMC_D[15:0]
GPMC_WAIT
16
16
16
D0
23
D1
D2
D3
22
OUT
GPMC_DIR
Figure 8-52. GPMC Non-Multiplexed NOR Flash - Synchronous Burst Write (GPMCFCLKDIVIDER = 0)
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2
1
2
GPMC_CLK
4
3
19
GPMC_CS[x]
5
7
GPMC_A[27:16]
Address (MSB)
20
8
8
GPMC_BE1
7
20
GPMC_BE0_CLE
9
9
10
12
21
GPMC_ADV_ALE
GPMC_OE
11
14
6
5
13
D0
Address (LSB)
GPMC_D[15:0]
GPMC_WAIT
GPMC_DIR
23
22
24
25
OUT
IN
OUT
Figure 8-53. GPMC Multiplexed NOR Flash - Synchronous Single Read (GPMCFCLKDIVIDER = 0)
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2
1
2
GPMC_CLK
GPMC_CS[x]
3
4
19
5
GPMC_A[27:16]
Address (MSB)
8
7
20
Valid
GPMC_BE1
8
7
20
Valid
GPMC_BE0_CLE
9
9
10
12
21
GPMC_ADV_ALE
GPMC_OE
11
6
13
14
13
5
GPMC_D[15:0]
Address (LSB)
D0
D1
D2
D3
23
22
GPMC_WAIT
24
25
OUT
OUT
IN
GPMC_DIR
Figure 8-54. GPMC Multiplexed NOR Flash - 4x16-bit Synchronous Burst Read (GPMCFCLKDIVIDER = 0)
2
2
1
GPMC_CLK
GPMC_CS[x]
3
4
19
5
7
Address (MSB)
GPMC_A[27:16]
GPMC_BE1
18
18
18
18
18
18
7
GPMC_BE0_CLE
9
9
10
21
GPMC_ADV_ALE
15
15
GPMC_WE
GPMC_D[15:0]
GPMC_WAIT
16
16
16
Address (LSB)
D0
D1
D2
D3
23
22
OUT
GPMC_DIR
Figure 8-55. GPMC Multiplexed NOR Flash - Synchronous Burst Write (GPMCFCLKDIVIDER = 0)
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8.8.2.2 GPMC/NOR Flash Interface Asynchronous Mode Timing
Table 8-56. GPMC/NOR Flash Interface Asynchronous Mode Timing - Internal Parameters
NO.
1
MIN
MAX UNIT
Max. output data generation delay from internal functional clock
Max. input data capture delay by internal functional clock
Max. chip select generation delay from internal functional clock
Max. address generation delay from internal functional clock
Max. address valid generation delay from internal functional clock
Max. byte enable generation delay from internal functional clock
Max. output enable generation delay from internal functional clock
Max. write enable generation delay from internal functional clock
Max. functional clock skew
6.5
4
ns
ns
ns
ns
ns
ns
ns
ns
ps
2
3
6.5
6.5
6.5
6.5
6.5
6.5
100
4
5
6
7
8
9
Table 8-57. Timing Requirements for GPMC/NOR Flash Interface - Asynchronous Mode
(see Figure 8-56, Figure 8-57, Figure 8-58, Figure 8-60)
NO.
MIN
MAX
UNIT
6
tacc(DAT)
21 tacc1-pgmode(DAT)
22 tacc2-pgmode(DAT)
Data maximum access time (GPMC_FCLK cycles)
H(1) cycles
Page mode successive data maximum access time (GPMC_FCLK
cycles)
P(2)
H(1)
cycles
cycles
Page mode first data maximum access time (GPMC_FCLK cycles)
(1) H = AccessTime * (TimeParaGranularity + 1)
(2) P = PageBurstAccessTime * (TimeParaGranularity + 1).
Table 8-58. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Asynchronous Mode
(see Figure 8-56, Figure 8-57, Figure 8-58, Figure 8-59, Figure 8-60, Figure 8-61)
NO.
1
PARAMETER
MIN
MAX
N(1)
A(2)
UNIT
ns
tw(nBEV)
Pulse duration, GPMC_BE0_CLE, GPMC_BE1 valid time
Pulse duration, GPMC_CS[x] low
2
tw(nCSV)
ns
4
td(nCSV-nADVIV)
Delay time, GPMC_CS[x] valid to GPMC_NADV_ALE invalid
B - 0.2(3)
C - 0.2(4)
J - 0.2(5)
J - 0.2(5)
B + 2.0(3)
ns
Delay time, GPMC_CS[x] valid to GPMC_OE_RE invalid (single
read)
5
td(nCSV-nOEIV)
C + 2.0(4)
J + 2.0(5)
J + 2.0(5)
ns
ns
ns
10 td(AV-nCSV)
Delay time, address bus valid to GPMC_CS[x] valid
Delay time, GPMC_BE0_CLE, GPMC_BE1 valid to GPMC_CS[x]
valid
11 td(nBEV-nCSV)
13 td(nCSV-nADVV)
14 td(nCSV-nOEV)
Delay time, GPMC_CS[x] valid to GPMC_ADV_ALE valid
Delay time, GPMC_CS[x] valid to GPMC_OE_RE valid
K - 0.2(6)
L - 0.2(7)
K + 2.0(6)
L + 2.0(7)
ns
ns
(1) For single read: N = RdCycleTime * (TimeParaGranularity + 1) * GPMC_FCLK
For single write: N = WrCycleTime * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: N = (RdCycleTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst write: N = (WrCycleTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
(2) For single read: A = (CSRdOffTime - CSOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For single write: A = (CSWrOffTime - CSOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: A = (CSRdOffTime - CSOnTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst write: A = (CSWrOffTime - CSOnTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
(3) = B - nCS Max Delay + nADV Min Delay
For reading: B = ((ADVRdOffTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay - CSExtraDelay)) * GPMC_FCLK
For writing: B = ((ADVWrOffTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay - CSExtraDelay)) * GPMC_FCLK
(4) = C - nCS Max Delay + nOE Min Delay
C = ((OEOffTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay - CSExtraDelay)) * GPMC_FCLK
(5) = J - Address Max Delay + nCS Min Delay
J = (CSOnTime * (TimeParaGranularity + 1) + 0.5 * CSExtraDelay) * GPMC_FCLK
(6) = K - nCS Max Delay + nADV Min Delay
K = ((ADVOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay - CSExtraDelay)) * GPMC_FCLK
(7) = L - nCS Max Delay + nOE Min Delay
L = ((OEOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay - CSExtraDelay)) * GPMC_FCLK
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Table 8-58. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Asynchronous Mode (continued)
(see Figure 8-56, Figure 8-57, Figure 8-58, Figure 8-59, Figure 8-60, Figure 8-61)
NO.
PARAMETER
MIN
L - 0.2(7)
M - 0.2(8)
G(9)
MAX
L + 2.0(7)
M + 2.0(8)
UNIT
ns
15 td(nCSV-DIR)
16 td(nCSV-DIR)
17 tw(AIV)
Delay time, GPMC_CS[x] valid to GPMC_DIR high
Delay time, GPMC_CS[x] valid to GPMC_DIR low
Address invalid duration between 2 successive R/W accesses
ns
ns
Delay time, GPMC_CS[x] valid to GPMC_OE_RE invalid (burst
read)
19 td(nCSV-nOEIV)
I - 0.2(10)
I + 2.0(10)
ns
21 tw(AV)
Pulse duration, address valid: second, third and fourth accesses
Delay time, GPMC_CS[x] valid to GPMC_WE valid
Delay time, GPMC_CS[x] valid to GPMC_WE invalid
Delay time, GPMC_WE valid to data bus valid
D(11)
E - 0.2(12)
F - 0.2(13)
ns
ns
ns
ns
ns
26 td(nCSV-nWEV)
28 td(nCSV-nWEIV)
29 td(nWEV-DV)
30 td(DV-nCSV)
E + 2.0(12)
F + 2.0(13)
2.0
Delay time, data bus valid to GPMC_CS[x] valid
J - 0.2(5)
J + 2.0(5)
Delay time, GPMC_OE_RE valid to GPMC_A[16:1]_D[15:0]
address phase end
38 td(nOEV-AIV)
2.0
ns
(8) = M - nCS Max Delay + nOE Min Delay
M = ((RdCycleTime - CSOnTime) * (TimeParaGranularity + 1) - 0.5 * CSExtraDelay) * GPMC_FCLK.
Parameter M expression is given as one example of GPMC programming. The IO DIR signal goes from IN to OUT after both
RdCycleTime and BusTurnAround completion. Behavior of the IO direction signal depends on the kind of successive read/write
accesses performed to the memory and multiplexed or non-multiplexed memory addressing scheme, whether the bus keeping feature is
enabled or not. The IO DIR behavior is automatically handled by the GPMC controller.
(9) G = Cycle2CycleDelay * GPMC_FCLK
(10) = I - nCS Max Delay + nOE Min Delay
I = ((OEOffTime + (n - 1) * PageBurstAccessTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay - CSExtraDelay)) *
GPMC_FCLK
(11) D = PageBurstAccessTime * (TimeParaGranularity + 1) * GPMC_FCLK
(12) = E - nCS Max Delay + nWE Min Delay
E = ((WEOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay - CSExtraDelay)) * GPMC_FCLK
(13) = F - nCS Max Delay + nWE Min Delay
F = ((WEOffTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay - CSExtraDelay)) * GPMC_FCLK
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GPMC_FCLK
GPMC_CLK
6
2
GPMC_CS[x]
10
11
GPMC_A[27:0]
Valid Address
1
GPMC_BE1
GPMC_BE0_CLE
GPMC_ADV_ALE
11
1
4
13
5
14
GPMC_OE
GPMC_D[15:0]
Data In 0
Data In 0
GPMC_WAIT
16
15
GPMC_DIR
OUT
IN
OUT
Figure 8-56. GPMC Non-Multiplexed NOR Flash - Asynchronous Read - Single Word Timing
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GPMC_FCLK
GPMC_CLK
6
6
2
2
GPMC_CS[x]
17
10
10
11
GPMC_A[27:0]
11
Address 2
1
Address 1
1
GPMC_BE1
11
11
1
1
GPMC_BE0_CLE
4
4
13
13
GPMC_ADV_ALE
5
5
14
14
GPMC_OE
GPMC_D[15:0]
Data Upper
GPMC_WAIT
16
16
15
15
GPMC_DIR
OUT
IN
OUT
IN
OUT
Figure 8-57. GPMC Non-Multiplexed NOR Flash - Asynchronous Read - 32-Bit Timing
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GPMC_FCLK
GPMC_CLK
22
21
21
21
2
GPMC_CS[x]
10
11
GPMC_A[27:0]
Add0
Add1
Add2
Add3
Add4
1
1
GPMC_BE1
11
GPMC_BE0_CLE
GPMC_ADV_ALE
13
19
14
GPMC_OE
GPMC_D[15:0]
D0
D1
D2
D3
D3
GPMC_WAIT
16
15
GPMC_DIR
OUT
IN
OUT
Figure 8-58. GPMC Non-Multiplexed Only NOR Flash - Asynchronous Read - Page Mode 4x16-Bit Timing
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GPMC_FCLK
GPMC_CLK
2
GPMC_CS[x]
10
GPMC_A[27:0]
Valid Address
1
11
GPMC_BE1
11
1
GPMC_BE0_CLE
4
13
GPMC_ADV_ALE
28
26
GPMC_WE
30
GPMC_D[15:0]
Data OUT
GPMC_WAIT
GPMC_DIR
OUT
Figure 8-59. GPMC Non-Multiplexed NOR Flash - Asynchronous Write - Single Word Timing
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GPMC_FCLK
SPRS681E –OCTOBER 2010–REVISED JULY 2012
GPMC_CLK
2
6
GPMC_CS[x]
10
11
Address (MSB)
1
GPMC_A[26:17]
GPMC_BE1
11
1
GPMC_BE0_CLE
13
4
GPMC_ADV_ALE
GPMC_OE
5
14
30
GPMC_A[16:1]
GPMC_D[15:0]
Address (LSB)
Data IN
Data IN
GPMC_WAIT
16
15
GPMC_DIR
OUT
IN
OUT
Figure 8-60. GPMC Multiplexed NOR Flash - Asynchronous Read - Single Word Timing
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GPMC_FCLK
GPMC_CLK
2
GPMC_CS[x]
10
Address (MSB)
1
GPMC_A[26:17]
11
GPMC_BE1
11
1
GPMC_BE0_CLE
13
4
GPMC_ADV_ALE
GPMC_WE
28
26
30
29
GPMCA[16:1]
GPMC_D[15:0]
Valid Address (LSB)
Data OUT
GPMC_WAIT
GPMC_DIR
OUT
Figure 8-61. GPMC Multiplexed NOR Flash - Asynchronous Write - Single Word Timing
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8.8.2.3 GPMC/NAND Flash Interface Asynchronous Mode Timing
Table 8-59. GPMC/NAND Flash Interface Asynchronous Mode Timing - Internal Parameters
NO.
1
MIN
MAX
6.5
UNIT
ns
Max. output data generation delay from internal functional clock
Max. input data capture delay by internal functional clock
Max. chip select generation delay from internal functional clock
Max. address latch enable generation delay from internal functional clock
Max. command latch enable generation delay from internal functional clock
Max. output enable generation delay from internal functional clock
Max. write enable generation delay from internal functional clock
Max. functional clock skew
2
4.0
ns
3
6.5
ns
4
6.5
ns
5
6.5
ns
6
6.5
ns
7
6.5
ns
8
100.0
ps
Table 8-60. Timing Requirements for GPMC/NAND Flash Interface
(see Figure 8-64)
NO.
MIN
MAX
J(1)
UNIT
cycles
13 tacc(DAT)
Data maximum access time (GPMC_FCLK cycles)
(1) J = AccessTime * (TimeParaGranularity + 1)
Table 8-61. Switching Characteristics Over Recommended Operating Conditions for GPMC/NAND Flash
Interface
(see Figure 8-62, Figure 8-63, Figure 8-64, Figure 8-65)
NO.
1
PARAMETER
MIN
MAX
A(1)
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tw(nWEV)
Pulse duration, GPMC_WE valid time
2
td(nCSV-nWEV)
td(CLEH-nWEV)
td(nWEV-DV)
Delay time, GPMC_CS[x] valid to GPMC_WE valid
Delay time, GPMC_BE0_CLE high to GPMC_WE valid
Delay time, GPMC_D[15:0] valid to GPMC_WE valid
Delay time, GPMC_WE invalid to GPMC_D[15:0] invalid
Delay time, GPMC_WE invalid to GPMC_BE0_CLE invalid
Delay time, GPMC_WE invalid to GPMC_CS[x] invalid
Delay time, GPMC_ADV_ALE High to GPMC_WE valid
Delay time, GPMC_WE invalid to GPMC_ADV_ALE invalid
Cycle time, write cycle time
B - 0.2(2)
C - 0.2(3)
D - 0.2(4)
E - 0.2(5)
F - 0.2(6)
G - 0.2(7)
C - 0.2(3)
F - 0.2(6)
B + 2.0(2)
C + 2.0(3)
D + 2.0(4)
E + 2.0(5)
F + 2.0(6)
G + 2.0(7)
C + 2.0(3)
F + 2.0(6)
H(8)
3
4
5
td(nWEIV-DIV)
td(nWEIV-CLEIV)
td(nWEIV-nCSIV)
td(ALEH-nWEV)
td(nWEIV-ALEIV)
6
7
8
9
10 tc(nWE)
11 td(nCSV-nOEV)
12 tw(nOEV)
13 tc(nOE)
Delay time, GPMC_CS[x] valid to GPMC_OE_RE valid
Pulse duration, GPMC_OE_RE valid time
I - 0.2(9)
I + 2.0(9)
K(10)
Cycle time, read cycle time
L(11)
(1) A = (WEOffTime - WEOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
(2) = B + nWE Min Delay - nCS Max Delay
B = ((WEOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay - CSExtraDelay)) * GPMC_FCLK
(3) = C + nWE Min Delay - CLE Max Delay
C = ((WEOnTime - ADVOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay - ADVExtraDelay)) * GPMC_FCLK
(4) = D + nWE Min Delay - Data Max Delay
D = (WEOnTime * (TimeParaGranularity + 1) + 0.5 * WEExtraDelay ) * GPMC_FCLK
(5) =E + Data Min Delay - nWE Max Delay
E = ((WrCycleTime - WEOffTime) * (TimeParaGranularity + 1) - 0.5 * WEExtraDelay ) * GPMC_FCLK
(6) = F + CLE Min Delay - nWE Max Delay
F = ((ADVWrOffTime - WEOffTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay - WEExtraDelay )) * GPMC_FCLK
(7) =G + nCS Min Delay - nWE Max Delay
G = ((CSWrOffTime - WEOffTime) * (TimeParaGranularity + 1) + 0.5 * (CSExtraDelay - WEExtraDelay )) * GPMC_FCLK
(8) H = WrCycleTime * (1 + TimeParaGranularity) * GPMC_FCLK
(9) = I + nOE Min Delay - nCS Max Delay
I = ((OEOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay - CSExtraDelay)) * GPMC_FCLK
(10) K = (OEOffTime - OEOnTime) * (1 + TimeParaGranularity) * GPMC_FCLK
(11) L = RdCycleTime * (1 + TimeParaGranularity) * GPMC_FCLK
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Table 8-61. Switching Characteristics Over Recommended Operating Conditions for GPMC/NAND Flash
Interface (continued)
(see Figure 8-62, Figure 8-63, Figure 8-64, Figure 8-65)
NO.
PARAMETER
MIN
MAX
UNIT
14 td(nOEIV-nCSIV)
Delay time, GPMC_OE_RE invalid to GPMC_CS[x] invalid
M - 0.2(12)
M + 2.0(12)
ns
(12) =M + nCS Min Delay - nOE Max Delay
M = ((CSRdOffTime - OEOffTime) * (TimeParaGranularity + 1) + 0.5 * (CSExtraDelay - OEExtraDelay ))* GPMC_FCLK
GPMC_FCLK
2
7
GPMC_CS[x]
3
6
GPMC_BE0_CLE
GPMC_ADV_ALE
GPMC_OE
1
GPMC_WE
4
5
GPMC_A[16:1]
GPMC_D[15:0]
Command
Figure 8-62. GPMC/NAND Flash - Command Latch Cycle Timing
GPMC_FCLK
GPMC_CS[x]
2
7
GPMC_BE0_CLE
8
9
GPMC_ADV_ALE
GPMC_OE
10
1
GPMC_WE
5
4
GPMC_A[16:1]
GPMC_D[15:0]
Address
Figure 8-63. GPMC/NAND Flash - Address Latch Cycle Timing
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GPMC_FCLK
SPRS681E –OCTOBER 2010–REVISED JULY 2012
13
11
16
GPMC_CS[x]
GPMC_BE0_CLE
GPMC_ADV_ALE
GPMC_OE
15
14
GPMC_A[16:1]
GPMC_D[15:0]
Data
GPMC_WAIT
Figure 8-64. GPMC/NAND Flash - Data Read Cycle Timing
GPMC_FCLK
2
7
GPMC_CS[x]
GPMC_BE0_CLE
GPMC_ADV_ALE
GPMC_OE
10
1
GPMC_WE
4
5
GPMC_A[16:1]
GPMC_D[15:0]
Data
Figure 8-65. GPMC/NAND Flash - Data Write Cycle Timing
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8.9 High-Definition Multimedia Interface (HDMI)
The device includes an HDMI 1.3a-compliant transmitter for digital video and audio data to display
devices. The HDMI interface consists of a digital HDMI transmitter core with TMDS encoder, a core
wrapper with interface logic and control registers, and a transmit PHY, with the following features:
•
•
•
•
•
Hot-plug detection
Consumer electronics control (CEC) messages
DVI 1.0 compliant (only RGB pixel format)
CEA 861-D and VESA DMT formats
Supports up to 165-MHz pixel clock:
–
–
1920 x 1080p @75 Hz with 8-bit/component color depth
1600 x 1200 @60 Hz with 8-bit/component color depth
•
Support for deep-color mode:
–
–
10-bit/component color depth up to 1080p @60 Hz (maximum pixel clock = 148.5 MHz)
12-bit/component color depth at 720p/1080i @60 Hz (maximum pixel clock = 123.75 MHz)
•
•
•
•
Uncompressed multichannel (up to eight channels) audio (L-PCM) support
Master I2C interface for display data channel (DDC) connection
TMDS clock to the HDMI-PHY is up to 185.625 MHz
Maximum supported pixel clock:
–
–
–
165 MHz for 8-bit color depth
148.5 MHz for 10-bit color depth
123.75 MHz for 12-bit color depth
•
Options available to support HDCP encryption engine for transmitting protected audio and video
(contact local TI sales representative for information).
For more details on the HDMI, see the HDMI chapter in the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7).
8.9.1 HDMI Interface Design Specifications
This section provides PCB design and layout specifications for the HDMI interface. The design rules
constrain PCB trace length, PCB trace skew, signal integrity, cross-talk, and signal timing. Simulation and
system design work has been done to ensure the HDMI interface requirements are met.
8.9.1.1 HDMI Interface Schematic
The HDMI bus is separated into three main sections:
1. Transition Minimized Differential Signaling (TMDS) high-speed digital video interface
2. Display Data Channel (I2C bus for configuration and status exchange between two devices)
3. Consumer Electronics Control (optional) for remote control of connected devices.
The DDC and CEC are low-speed interfaces, so nothing special is required for PCB layout of these
signals. Their connection is shown in Figure 8-66.
The TMDS channels are high-speed differential pairs and, therefore, require the most care in layout.
Specifications for TMDS layout are below.
Figure 8-66 shows the HDMI interface schematic. The specific pin numbers can be obtained from Table 3-
7, HDMI Terminal Functions.
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Device
HDMI Connector
TD0
HDMI_TMDSDP0
HDMI_TMDSDN0
TD0+
Shld
TD0-
TD1
HDMI_TMDSDP1
HDMI_TMDSDN1
TD1+
Shld
TD1-
TPD12S521
or other
ESD Protection
w/I2C-Level
Translation
TD2
Shld
HDMI_TMDSDP2
HDMI_TMDSDN2
TD2+
TD2-
HDMI_TMDSCLKP
HDMI_TMDSCLKN
TCLK
TCLK
Shld
TCLK+
HDMI_CEC
CEC
DDC
Gnd
DVDD_3P3
Rpullup(A)
HDMI_SDA
HDMI_SCL
SDA
SCL
HDMI_HPDET
HPDET
A. 5K-10K Ω pullup resistors are required if not integrated in the ESD protection chip.
Figure 8-66. HDMI Interface High-Level Schematic
8.9.1.2 TMDS Routing
The TMDS signals are high-speed differential pairs. Care must be taken in the PCB layout of these signals
to ensure good signal integrity.
The TMDS differential signal traces must be routed to achieve 100 Ω (±10%) differential impedance and
60 Ω (±10%) single-ended impedance. Single-ended impedance control is required because differential
signals are extremely difficult to closely couple on PCBs and, therefore, single-ended impedance becomes
important.
These impedances are impacted by trace width, trace spacing, distance to reference planes, and dielectric
material. Verify with a PCB design tool that the trace geometry for both data signal pairs results in as
close to 60 Ω impedance traces as possible. For best accuracy, work with your PCB fabricator to ensure
this impedance is met.
In general, closely coupled differential signal traces are not an advantage on PCBs. When differential
signals are closely coupled, tight spacing and width control is necessary. Very small width and spacing
variations affect impedance dramatically, so tight impedance control can be more problematic to maintain
in production.
Loosely coupled PCB differential signals make impedance control much easier. Wider traces and spacing
make obstacle avoidance easier, and trace width variations do not affect impedance as much; therefore, it
is easier to maintain an accurate impedance over the length of the signal. The wider traces also show
reduced skin effect and, therefore, often result in better signal integrity.
Table 8-62 shows the routing specifications for the TMDS signals.
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Table 8-62. TMDS Routing Specifications
PARAMETER
MIN
TYP
MAX
7000
0
UNIT
Mils
Stubs
Ω
Processor-to-HDMI header trace length
Number of stubs allowed on TMDS traces
TX/RX pair differential impedance
90
54
100
60
110
66
TX/RX single ended impedance
Ω
Number of vias on each TMDS trace
TMDS differential pair to any other trace spacing
2
Vias(1)
2*DS(2)
(1) Vias must be used in pairs with their distance minimized.
(2) DS = differential spacing of the HDMI traces.
8.9.1.3 DDC Signals
As shown in Figure 8-66, the DDC connects just like a standard I2C bus. As such, resistor pullups must
be used to pull up the open drain buffer signals unless they are integrated into the ESD protection chip
used. If used, these pullup resistors should be connected to a 3.3-V supply.
8.9.1.4 HDMI ESD Protection Device (Required)
Interfaces that connect to a cable such as HDMI generally require more ESD protection than can be built
into the processor's outputs. Therefore, this HDMI interface requires the use of an ESD protection chip to
provide adequate ESD protection and to translate I2C voltage levels from the 3.3 V supplied by the device
to the 5 volts required by the HDMI specification.
When selecting an ESD protection chip, choose the lowest capacitance ESD protection available to
minimize signal degradation. In no case should the ESD protection circuit capacitance be more than 5 pF.
TI manufactures devices that provide ESD protection for HDMI signals such as the TPD12S521. For more
information see the www.ti.com website.
8.9.1.5 PCB Stackup Specifications
Table 8-63 shows the stackup and feature sizes required for HDMI.
Table 8-63. HDMI PCB Stackup Specifications
PARAMETER
MIN
TYP
6
MAX
UNIT
Layers
Layers
Cuts
PCB routing/plane layers
Signal routing layers
4
2
-
-
-
3
Number of ground plane cuts allowed within HDMI routing region
Number of layers between HDMI routing region and reference ground plane
PCB trace width
-
0
0
-
-
-
Layers
Mils
-
4
PCB BGA escape via pad size
-
20
10
0.3
-
Mils
PCB BGA escape via hole size
Processor device BGA pad size(1)(2)
-
Mils
mm
(1) Non-solder mask defined pad.
(2) Per IPC-7351A BGA pad size guideline.
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8.9.1.6 Grounding
Each TMDS channel has its own shield pin which should be grounded to provide a return current path for
the TMDS signal.
8.9.2 HDMI Peripheral Register Descriptions
Table 8-64. HDMI Wrapper Registers
HEX ADDRESS
0x46C0 0000
0x46C0 0010
0x46C0 0024
0x46C0 0028
0x46C0 002C
0x46C0 0030
0x46C0 0034
0x46C0 0050
0x46C0 0070
0x46C0 0080
0x46C0 0084
0x46C0 0088
0x46C0 008C
ACRONYM
REGISTER NAME
HDMI_WP_REVISION
HDMI_WP_SYSCONFIG
IP Revision Identifier
Clock Management Configuration
HDMI_WP_IRQSTATUS_RAW Raw Interrupt Status
HDMI_WP_IRQSTATUS
Interrupt Status
Interrupt Enable
HDMI_WP_IRQENABLE_SET
HDMI_WP_IRQENABLE_CLR Interrupt Disable
HDMI_WP_IRQWAKEEN
HDMI_WP_VIDEO_CFG
HDMI_WP_CLK
IRQ Wakeup
Configuration of HDMI Wrapper Video
Configuration of Clocks
Audio Configuration in FIFO
Audio Configuration of DMA
Audio FIFO Control
HDMI_WP_AUDIO_CFG
HDMI_WP_AUDIO_CFG2
HDMI_WP_AUDIO_CTRL
HDMI_WP_AUDIO_DATA
TX Data of FIFO
Table 8-65. HDMI Core System Registers
HEX ADDRESS
ACRONYM
VND_IDL
VND_IDH
DEV_IDL
DEV_IDH
DEV_REV
SRST
REGISTER NAME
Vendor ID
0x46C0 0400
0x46C0 0404
0x46C0 0408
0x46C0 040C
0x46C0 0410
0x46C0 0414
0x46C0 0420
0x46C0 0424
0x46C0 0428
0x46C0 0434
0x46C0 043C - 0x46C0 0494
0x46C0 0498
0x46C0 049C
0x46C0 04A0
0x46C0 04A4
0x46C0 04A8
0x46C0 04AC
0x46C0 04C8
0x46C0 04C8
0x46C0 04CC
0x46C0 04D0
0x46C0 04D8
0x46C0 04DC
0x46C0 04E0
Vendor ID
Device ID
Device ID
Device Revision
Software Reset
System Control 1
System Status
Legacy
SYS_CTRL1
SYS_STAT
SYS_CTRL3
DCTL
Data Control
Reserved
-
RI_STAT
RI_CMD
RI_START
RI_RX_L
RI_RX_H
RI_DEBUG
DE_DLY
DE_DLY
DE_CTRL
DE_TOP
DE_CNTL
DE_CNTH
DE_LINL
Ri Status
Ri Command
Ri Line Start
Ri From RX
Ri From RX
Ri Debug
VIDEO DE Delay
VIDEO DE Delay
VIDEO DE Control
VIDEO DE Top
VIDEO DE Count
VIDEO DE Count
VIDEO DE Line
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Table 8-65. HDMI Core System Registers (continued)
HEX ADDRESS
0x46C0 04E4
0x46C0 04E8
0x46C0 04EC
0x46C0 04F0
0x46C0 04F4
0x46C0 04F8
0x46C0 04FC
0x46C0 0500
0x46C0 0504
0x46C0 0508
0x46C0 050C
0x46C0 0510
0x46C0 0514
0x46C0 0518
0x46C0 051C
0x46C0 0520
0x46C0 0524
0x46C0 0528
0x46C0 052C
0x46C0 0530
0x46C0 0534
0x46C0 0538
0x46C0 053C
0x46C0 0540
0x46C0 0544
0x46C0 0548
0x46C0 054C
0x46C0 0550
0x46C0 0554
0x46C0 0558
0x46C0 055C
0x46C0 0560
0x46C0 0564
0x46C0 0568
0x46C0 056C
0x46C0 0570
0x46C0 0574
0x46C0 0578
0x46C0 057C
0x46C0 0580
0x46C0 0584
0x46C0 0588
0x46C0 058C
0x46C0 0590
0x46C0 0594
0x46C0 0598
0x46C0 059C
ACRONYM
DE_LINH_1
REGISTER NAME
VIDEO DE Line
HRES_L
Video H Resolution
HRES_H
Video H Resolution
VRES_L
Video V Resolution
VRES_H
Video V Resolution
IADJUST
Video Interlace Adjustment
Video SYNC Polarity Detection
Video Hbit to HSYNC
POL_DETECT
HBIT_2HSYNC1
HBIT_2HSYNC2
FLD2_HS_OFSTL
FLD2_HS_OFSTH
HWIDTH1
Video Hbit to HSYNC
Video Field2 HSYNC Offset
Video Field2 HSYNC Offset
Video HSYNC Length
HWIDTH2
Video HSYNC Length
VBIT_TO_VSYNC
VWIDTH
Video Vbit to VSYNC
Video VSYNC Length
VID_CTRL
Video Control
VID_ACEN
Video Action Enable
VID_MODE
Video Mode1
VID_BLANK1
Video Blanking
VID_BLANK2
Video Blanking
VID_BLANK3
Video Blanking
DC_HEADER
Deep Color Header
VID_DITHER
Video Mode2
RGB2XVYCC_CT
R2Y_COEFF_LOW
R2Y_COEFF_UP
G2Y_COEFF_LOW
G2Y_COEFF_UP
B2Y_COEFF_LOW
B2Y_COEFF_UP
R2CB_COEFF_LOW
R2CB_COEFF_UP
G2CB_COEFF_LOW
G2CB_COEFF_UP
B2CB_COEFF_LOW
B2CB_COEFF_UP
R2CR_COEFF_LOW
R2CR_COEFF_UP
G2CR_COEFF_LOW
G2CR_COEFF_UP
B2CR_COEFF_LOW
B2CR_COEFF_UP
RGB_OFFSET_LOW
RGB_OFFSET_UP
Y_OFFSET_LOW
Y_OFFSET_UP
CBCR_OFFSET_LOW
RGB_2_xvYCC control
RGB_2_xvYCC Conversion R_2_Y
RGB_2_xvYCC Conversion R_2_Y
RGB_2_xvYCC Conversion G_2_Y
RGB_2_xvYCC Conversion G_2_Y
RGB_2_xvYCC Conversion B_2_Y
RGB_2_xvYCC Conversion B_2_Y
RGB_2_xvYCC Conversion R_2_Cb
RGB_2_xvYCC Conversion R_2_Cb
RGB_2_xvYCC Conversion G_2_Cb
RGB_2_xvYCC Conversion G_2_Cb
RGB_2_xvYCC Conversion B_2_Cb
RGB_2_xvYCC Conversion B_2_Cb
RGB_2_xvYCC Conversion R_2_Cr
RGB_2_xvYCC Conversion R_2_Cr
RGB_2_xvYCC Conversion G_2_Cr
RGB_2_xvYCC Conversion G_2_Cr
RGB_2_xvYCC Conversion B_2_Cr
RGB_2_xvYCC Conversion B_2_Cr
RGB_2_xvYCC RGB Input Offset
RGB_2_xvYCC RGB Input Offset
RGB_2_xvYCC Conversion Y Output Offset
RGB_2_xvYCC Conversion Y Output Offset
RGB_2_xvYCC Conversion CbCr Output Offset
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Table 8-65. HDMI Core System Registers (continued)
HEX ADDRESS
0x46C0 05A0
0x46C0 05C0
0x46C0 05C4
0x46C0 05C8
0x46C0 05CC
0x46C0 05D0
0x46C0 05D4
0x46C0 05D8
0x46C0 05DC
0x46C0 05E0
0x46C0 05E4
0x46C0 0640
0x46C0 0644
0x46C0 0648
0x46C0 064C
0x46C0 0650
0x46C0 0654
0x46C0 0658
0x46C0 065C
0x46C0 0660
0x46C0 0664
0x46C0 0668
0x46C0 066C
0x46C0 0670
0x46C0 0674
0x46C0 0678
0x46C0 067C
0x46C0 0680
0x46C0 0684
0x46C0 0688
0x46C0 068C
0x46C0 07B0
0x46C0 07B4
0x46C0 07B8
0x46C0 07BC
0x46C0 07C0
0x46C0 07C4
0x46C0 07C8
0x46C0 07CC
0x46C0 07D0
0x46C0 07D4
0x46C0 07E4
0x46C0 07E8
ACRONYM
CBCR_OFFSET_UP
INTR_STATE
INTR1
REGISTER NAME
RGB_2_xvYCC Conversion CbCr Output Offset
Interrupt State
Interrupt Source
INTR2
Interrupt Source
INTR3
Interrupt Source
INTR4
Interrupt Source
INT_UNMASK1
INT_UNMASK2
INT_UNMASK3
INT_UNMASK4
INT_CTRL
Interrupt Unmask
Interrupt Unmask
Interrupt Unmask
Interrupt Unmask
Interrupt Control
XVYCC2RGB_CTL
Y2R_COEFF_LOW
Y2R_COEFF_UP
CR2R_COEFF_LOW
CR2R_COEFF_UP
CB2B_COEFF_LOW
CB2B_COEFF_UP
CR2G_COEFF_LOW
CR2G_COEFF_UP
CB2G_COEFF_LOW
CB2G_COEFF_UP
YOFFSET1_LOW
YOFFSET1_UP
OFFSET1_LOW
OFFSET1_MID
OFFSET1_UP
OFFSET2_LOW
OFFSET2_UP
DCLEVEL_LOW
DCLEVEL_UP
DDC_MAN
xvYCC_2_RGB Control
xvYCC_2_RGB Conversion Y_2_R
xvYCC_2_RGB Conversion Y_2_R
xvYCC_2_RGB Conversion Cr_2_R
xvYCC_2_RGB Conversion Cr_2_R
xvYCC_2_RGB Conversion Cb_2_B
xvYCC_2_RGB Conversion Cb_2_B
xvYCC_2_RGB Conversion Cr_2_G
xvYCC_2_RGB Conversion Cr_2_G
xvYCC_2_RGB Conversion Cb_2_G
xvYCC_2_RGB Conversion Cb_2_G
xvYCC_2_RGB Conversion Y Offset
xvYCC_2_RGB Conversion Y Offset
xvYCC_2_RGB Conversion Offset1
xvYCC_2_RGB Conversion Offset1
xvYCC_2_RGB Conversion Offset1
xvYCC_2_RGB Conversion Offset2
xvYCC_2_RGB Conversion Offset2
xvYCC_2_RGB Conversion DC Level
xvYCC_2_RGB Conversion DC Level
DDC I2C Manual
DDC_ADDR
DDC I2C Target Slave Address
DDC I2C Target Segment Address
DDC I2C Target Offset Address
DDC I2C Data Count
DDC_SEGM
DDC_OFFSET
DDC_COUNT1
DDC_COUNT2
DDC_STATUS
DDC_CMD
DDC I2C Data Count
DDC I2C Status
DDC I2C Command
DDC_DATA
DDC I2C Data
DDC_FIFOCNT
EPST
DDC I2C FIFO Count
ROM Status
EPCM
ROM Command
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Table 8-66. HDMI IP Core Gamut Registers
HEX ADDRESS
0x46C0 0800
0x46C0 0804
0x46C0 0808
ACRONYM
REGISTER NAME
Gamut Metadata
Gamut Metadata
Gamut Metadata
Gamut Metadata
GAMUT_HEADER1
GAMUT_HEADER2
GAMUT_HEADER3
0x46C0 080C - 0x46C0 0878
(0x4 byte increments)
GAMUT_DBYTE__0 -
GAMUT_DBYTE__27
Table 8-67. HDMI IP Core Audio Video Registers
HEX ADDRESS
0x46C0 0904
0x46C0 0908
0x46C0 090C
0x46C0 0910
0x46C0 0914
0x46C0 0918
0x46C0 091C
0x46C0 0920
0x46C0 0924
0x46C0 0928
0x46C0 092C
0x46C0 0950
0x46C0 0954
0x46C0 0960
0x46C0 0964
0x46C0 096C
0x46C0 0970
0x46C0 0974
0x46C0 0978
0x46C0 097C
0x46C0 0980
0x46C0 0984
0x46C0 0988
0x46C0 098C
0x46C0 0990
0x46C0 09BC
0x46C0 09C0
0x46C0 09CC
0x46C0 09D0
0x46C0 09D4
0x46C0 09F0
0x46C0 09F4
0x46C0 09F8
0x46C0 09FC
0x46C0 0A00
0x46C0 0A04
0x46C0 0A08
0x46C0 0A0C
ACRONYM
ACR_CTRL
FREQ_SVAL
N_SVAL1
REGISTER NAME
ACR Control
ACR Audio Frequency
ACR N Software Value
ACR N Software Value
ACR N Software Value
ACR CTS Software Value
ACR CTS Software Value
ACR CTS Software Value
ACR CTS Hardware Value
ACR CTS Hardware Value
ACR CTS Hardware Value
Audio In Mode
N_SVAL2
N_SVAL3
CTS_SVAL1
CTS_SVAL2
CTS_SVAL3
CTS_HVAL1
CTS_HVAL2
CTS_HVAL3
AUD_MODE
SPDIF_CTRL
HW_SPDIF_FS
SWAP_I2S
Audio In S/PDIF Control
Audio In S/PDIF Extracted Fs and Length
Audio In I2S Channel Swap
Audio Error Threshold
Audio In I2S Data In Map
Audio In I2S Control
SPDIF_ERTH
I2S_IN_MAP
I2S_IN_CTRL
I2S_CHST0
I2S_CHST1
I2S_CHST2
I2S_CHST4
I2S_CHST5
ASRC
Audio In I2S Channel Status
Audio In I2S Channel Status
Audio In I2S Channel Status
Audio In I2S Channel Status
Audio In I2S Channel Status
Audio Sample Rate Conversion
Audio I2S Input Length
HDMI Control
I2S_IN_LEN
HDMI_CTRL
AUDO_TXSTAT
AUD_PAR_BUSCLK_1
AUD_PAR_BUSCLK_2
AUD_PAR_BUSCLK_3
TEST_TXCTRL
DPD
Audio Path Status
Audio Input Data Rate Adjustment
Audio Input Data Rate Adjustment
Audio Input Data Rate Adjustment
Test Control
Diagnostic Power Down
Packet Buffer Control 1
Packet Buffer Control 2
Packet
PB_CTRL1
PB_CTRL2
AVI_TYPE
AVI_VERS
Packet
AVI_LEN
Packet
AVI_CHSUM
Packet
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Table 8-67. HDMI IP Core Audio Video Registers (continued)
HEX ADDRESS
ACRONYM
REGISTER NAME
0x46C0 0A10 - 0x46C0 0A48
(0x4 byte increments)
AVI_DBYTE__0 -
AVI_DBYTE__14
Packet
0x46C0 0A80
0x46C0 0A84
0x46C0 0A88
0x46C0 0A8C
SPD_TYPE
SPD_VERS
SPD_LEN
SPD InfoFrame
SPD InfoFrame
SPD InfoFrame
SPD InfoFrame
SPD InfoFrame
SPD_CHSUM
0x46C0 0A90 - 0x46C0 0AF8
(0x4 byte increments)
SPD_DBYTE__0 -
SPD_DBYTE__26
0x46C0 0B00
0x46C0 0B04
0x46C0 0B08
0x46C0 0B0C
AUDIO_TYPE
AUDIO_VERS
AUDIO_LEN
Audio InfoFrame
Audio InfoFrame
Audio InfoFrame
Audio InfoFrame
Audio InfoFrame
AUDIO_CHSUM
0x46C0 0B10 - 0x46C0 0B34
(0x4 byte increments)
AUDIO_DBYTE__0 -
AUDIO_DBYTE__9
0x46C0 0B80
0x46C0 0B84
0x46C0 0B88
0x46C0 0B8C
MPEG_TYPE
MPEG_VERS
MPEG_LEN
MPEG InfoFrame
MPEG InfoFrame
MPEG InfoFrame
MPEG InfoFrame
MPEG InfoFrame
MPEG_CHSUM
0x46C0 0B90 - 0x46C0 0BF8
(0x4 byte increments)
MPEG_DBYTE__0 -
MPEG_DBYTE__26
0x46C0 0C00 - 0x46C0 0C78
(0x4 byte increments)
GEN_DBYTE__0 -
GEN_DBYTE__30
Generic Packet
0x46C0 0C7C
CP_BYTE1
General Control Packet
Generic Packet 2
0x46C0 0C80 - 0x46C0 0CF8
(0x4 byte increments)
GEN2_DBYTE__0 -
GEN2_DBYTE__30
0x46C0 0CFC
CEC_ADDR_ID
CEC Slave ID
Table 8-68. HDMI IP Core CEC Registers
HEX ADDRESS
0x46C0 0D00
0x46C0 0D04
0x46C0 0D08
0x46C0 0D0C
0x46C0 0D10
0x46C0 0D14
0x46C0 0D18
0x46C0 0D1C
0x46C0 0D20
0x46C0 0D24
0x46C0 0D38
0x46C0 0D3C
ACRONYM
CEC_DEV_ID
CEC_SPEC
REGISTER NAME
CEC Device ID
CEC Specification
CEC Specification Suffix
CEC Firmware Revision
CEC Debug 0
CEC_SUFF
CEC_FW
CEC_DBG_0
CEC_DBG_1
CEC_DBG_2
CEC_DBG_3
CEC_TX_INIT
CEC_TX_DEST
CEC_SETUP
CEC_TX_COMMAND
CEC Debug 1
CEC Debug 2
CEC Debug 3
CEC Tx Initialization
CEC Tx Destination
CEC Set Up
CEC Tx Command
CEC Tx Operand
0x46C0 0D40 - 0x46C0 0D78
(0x4 byte increments)
CEC_TX_OPERAND__0 -
CEC_TX_OPERAND__14
0x46C0 0D7C
0x46C0 0D88
0x46C0 0D8C
0x46C0 0D90
0x46C0 0D94
0x46C0 0D98
CEC_TRANSMIT_DATA
CEC_CA_7_0
CEC Transmit Data
CEC Capture ID0
CEC_CA_15_8
CEC Capture ID0
CEC_INT_ENABLE_0
CEC_INT_ENABLE_1
CEC_INT_STATUS_0
CEC Interrupt Enable 0
CEC Interrupt Enable 1
CEC Interrupt Status 0
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Table 8-68. HDMI IP Core CEC Registers (continued)
HEX ADDRESS
0x46C0 0D9C
0x46C0 0DB0
0x46C0 0DB4
0x46C0 0DB8
0x46C0 0DBC
ACRONYM
REGISTER NAME
CEC Interrupt Status 1
CEC RX Control
CEC_INT_STATUS_1
CEC_RX_CONTROL
CEC_RX_COUNT
CEC Rx Count
CEC_RX_CMD_HEADER
CEC_RX_COMMAND
CEC Rx Command Header
CEC Rx Command
0x46C0 0DC0 - 0x46C0 0DF8
(0x4 byte increments)
CEC_RX_OPERAND__0 - CEC Rx Operand
CEC_RX_OPERAND__14
Table 8-69. HDMI PHY Registers
HEX ADDRESS
0x4812 2004
0x4812 2008
0x4812 200C
0x4812 2020
ACRONYM
TMDS_CNTL2
TMDS_CNTL3
BIST_CNTL
REGISTER NAME
TMDS Control
TMDS Control
BIST Control
TMDS_CNTL9
TMDS Control
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8.10 High-Definition Video Processing Subsystem (HDVPSS)
The device High-Definition Video Processing Subsystem (HDVPSS) provides a video input interface for
external imaging peripherals (that is, image sensors, video decoders, etc.) and a video output interface for
display devices, such as analog SDTV displays, analog/digital HDTV displays, digital LCD panels, etc. It
includes HD and SD video encoders, and an HDMI transmitter interface.
The device HDVPSS features include:
•
High quality (HD) and medium quality (SD) display processing pipelines with de-interlacing, scaling,
noise reduction, alpha blending, chroma keying, color space conversion, flicker filtering, and pixel
format conversion.
•
•
HD/SD compositor features for PIP support.
Format conversions (up to 1080p 60 Hz) include scan format conversion, scan rate conversion, aspect-
ratio conversion, and frame size conversion.
•
•
Supports additional video processing capabilities by using the subsystem's memory-to-memory feature.
Two parallel video processing pipelines support HD (up to 1080p60) and SD (NTSC/PAL)
simultaneous outputs.
–
HD analog component output with OSD and embedded timing codes (BT.1120)
•
•
3-channel HD-DAC with 12-bit resolution.
External HSYNC and VSYNC signals available on silicon revision 2.x devices. For more details,
see below.
–
SD analog output with OSD with embedded timing codes (BT.656)
•
•
•
Simultaneous component, S-video and composite
4-channel SD-DAC with 10-bit resolution
Options available to support MacroVision and CGMS-A (contact local TI Sales rep for
information).
–
Digital HDMI 1.3a compliant transmitter (for details, see Section 8.9, High-Definition Multimedia
Interface (HDMI)).
•
•
Up to two (one 16/24/30-bit and one 16-bit) digital video outputs (up to 165 MHz).
–
–
VOUT[0] can output up to 30-bit video and supports RGB, YUV444, Y/C and BT.656 modes.
VOUT[1] can output up to 16-bit video and supports Y/C and BT.656 modes.
Two (one 16/24-bit and one 16-bit) independently configurable external video input capture ports (up to
165 MHz).
–
16/24-bitHD digital video input or dual clock independent 8-bit SD inputs on each capture port.
•
VIN[0] can accept single-channel 16/24-bit (YCbCr/RGB) video or dual-channel 8-bit (YCbCr)
video.
•
VIN[1] can accept single-channel 16-bit (YCbCr) video or dual-channel 8-bit (YCbCr) video.
–
–
Embedded sync and external sync modes are supported for all input configurations.
De-multiplexing of both pixel-to-pixel and line-to-line multiplexed streams, effectively supporting up
to 16 simultaneous SD inputs with a glueless interface to an external multiplexer such as the
TVP5158.
–
Additional features include: programmable color space conversion, scaler and chroma
downsampler, ancillary VANC/VBI data capture (decoded by software), noise reduction.
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•
Availability of a combination of these digital video input/output port configurations, control signals for
multiple 8-bit ports, as well as separate synchronization signals is limited by the device pin multiplexing
(for details, see Section 4.4). The following video inputs/outputs are not multiplexed and are always
available:
–
–
–
–
–
SD DAC composite, S-video, component out
HD DAC component out
HDMI output (same as VOUT[1])
16-bit VOUT[0] (embedded sync)
Single 16-bit/dual 8-bit VIN[0] (embedded sync).
•
•
Graphics features:
–
–
–
–
Three independently-generated graphics layers.
Each supports full-screen resolution graphics in HD, SD or both.
Up/down scaler optimized for graphics.
Global and pixel-level alpha blending supported.
Discrete external HSYNC and VSYNC signals for the HD-DAC are available on silicon revision 2.x
devices. These signals are mapped to the following pins (for details, see Section 3.2.20):
–
–
HSYNC - AR5/AT9/AR8
VSYNC - AL5/AP9/AL9
The functionality of these pins is set using the SPARE_CTRL0 register (address: 0x4814 0724).
Figure 8-67 and Table 8-70 describe the SPARE_CTRL0 register.
Note: When changing this register, read original value and write back same value in Reserved
fields.
For example, these are the steps required to use the pins AR8 and AL9 as the
DAC_HSYNC/VSYNC signals:
1. Set the PINCTRLx registers for AR8 and AL9 as follows:
•
•
0x4814 0894 = 0x00000001
0x4814 0898 = 0x00000001
2. Select analog VENC sync out option as follows:
•
0x4814 0724 = 0x00000004
31
3
2
1
0
Reserved
SPR_CTL0_2
SPR_CTL0_1
Rsvd
Figure 8-67. SPARE_CTRL0 Register
Table 8-70. SPARE_CTRL0 Register Field Descriptions
Bit
Field
Value Description
31:3
2
Reserved
0
Reserved
To Select DAC or VOUT[0] Source Signals
Selects VOUT[0]_AVID/FLD
Selects DAC_HSYNC/VSYNC
To Select DAC or VOUT[1] Source Signals
Selects VOUT[1]_HSYNC/VSYNC
Selects DAC_HSYNC/VSYNC
Reserved
0
1
1
0
0
1
0
Reserved
For more detailed information on specific features, see the HDVPSS chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
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8.10.1 HDVPSS Electrical Data/Timing
Table 8-71. Timing Requirements for HDVPSS Input
(see Figure 8-68 and Figure 8-69)
NO.
MIN
MAX UNIT
VIN[x]A_CLK
1
2
3
7
tc(CLK)
Cycle time, VIN[x]A_CLK
6.06(1)
2.73
ns
ns
ns
tw(CLKH)
Pulse duration, VIN[x]A_CLK high (45% of tc)
Pulse duration, VIN[x]A_CLK low (45% of tc)
Transition time, VIN[x]A_CLK (10%-90%)
tw(CLKH)
2.73
tt(CLK)
2.64
ns
tsu(DE-CLK)
tsu(VSYNC-CLK)
tsu(FLD-CLK)
tsu(HSYNC-CLK)
tsu(D-CLK)
Input setup time, control valid to VIN[x]A_CLK high
Input setup time, data valid to VIN[x]A_CLK high
Input hold time, control valid from VIN[x]A_CLK high
3.75
3.75
4
5
ns
th(CLK-DE)
th(CLK-VSYNC)
th(CLK-FLD)
th(CLK-HSYNC)
th(CLK-D)
(2)
0
ns
(2)
Input hold time, data valid from VIN[x]A_CLK high
VIN[x]B_CLK
0
1
2
3
7
tc(CLK)
Cycle time, VIN[x]B_CLK
6.06(1)
2.73
ns
ns
ns
ns
tw(CLKH)
Pulse duration, VIN[x]B_CLK high (45% of tc)
Pulse duration, VIN[x]B_CLK low (45% of tc)
Transition time, VIN[x]B_CLK (10%-90%)
tw(CLKH)
2.73
tt(CLK)
2.64
tsu(DE-CLK)
tsu(VSYNC-CLK)
tsu(FLD-CLK)
tsu(HSYNC-CLK)
tsu(D-CLK)
Input setup time, control valid to VIN[x]B_CLK high
Input setup time, data valid to VIN[x]B_CLK high
Input hold time, control valid from VIN[x]B_CLK high
Input hold time, data valid from VIN[x]B_CLK high
3.75
3.75
4
5
ns
ns
th(CLK-DE)
th(CLK-VSYNC)
th(CLK-FLD)
th(CLK-HSYNC)
th(CLK-D)
(2)
0
(2)
0
(1) For maximum frequency of 165 MHz.
(2) When interfacing to a device with a minimum delay time of 0 ns, propagation delay of the data traces must be bigger than that of the
clock traces.
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Table 8-72. Switching Characteristics Over Recommended Operating Conditions for HDVPSS Output
(see Figure 8-68 and Figure 8-70)
NO.
1
PARAMETER
MIN
6.06(1)
2.73
MAX UNIT
tc(CLK)
Cycle time, VOUT[x]_CLK
ns
ns
ns
2
tw(CLKH)
Pulse duration, VOUT[x]_CLK high (45% of tc)
Pulse duration, VOUT[x]_CLK low (45% of tc)
Transition time, VOUT[x]_CLK (10%-90%)
3
tw(CLKL)
2.73
7
tt(CLK)
2.64
ns
td(CLK-AVID)
td(CLK-FLD)
td(CLK-VSYNC)
td(CLK-HSYNC)
td(CLK-RCR)
td(CLK-GYYC)
td(CLK-BCBC)
td(CLK-YYC)
td(CLK-C)
Delay time, VOUT[x]_CLK to control valid
1.64(2)
4.85(3)
ns
6
Delay time, VOUT[0]_CLK to data valid
Delay time, VOUT[1]_CLK to data valid
1.64(2)
4.85(3)
ns
(1) For maximum frequency of 165 MHz.
(2) Min Delay Time = Tc * 0.27, where Tc is the clock cycle time. Note: When interfacing to devices where setup/hold margins are minimal,
care must be taken to match board trace length delay for clock and data signals.
(3) Max Delay Time = Tc * 0.80, where Tc is the clock cycle time. Note: When interfacing to devices where setup/hold margins are minimal,
care must be taken to match board trace length delay for clock and data signals.
3
2
1
VIN[x]A_CLK/
VIN[x]B_CLK/
VOUT[x]_CLK
7
7
Figure 8-68. HDVPSS Clock Timing
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VIN[x]A_CLK/
VIN[x]B_CLK
(positive-edge clocking)
VIN[x]A_CLK/
VIN[x]B_CLK
(negative-edge clocking)
5
4
VIN[x]A/
VIN[x]B
Figure 8-69. HDVPSS Input Timing
VOUT[x]_CLK
VOUT[x]
6
Figure 8-70. HDVPSS Output Timing
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8.10.2 Video DAC Guidelines and Electrical Data/Timing
The device's analog video DAC outputs are designed to drive a 37.5-Ω load. Figure 8-71 describes a
typical circuit that permits connecting the analog video output from the device to standard 75-Ω impedance
video systems. The device requires the use of a buffer to drive the actual video outputs, so one solution is
to use a video amplifier with integrated buffer and internal filter, such as the Texas Instruments THS7360,
which provides a complete solution for the typical output circuit shown in Figure 8-71.
75 W
Amplifier
Reconstruction
Filter
IOUTx
SD: 5.6 V/V
HD: 4.5 V/V
SD:
9.5 MHZ
18 MHZ
36 MHz
ED:
HD:
RLOAD
1080p: 72 MHz
Figure 8-71. Typical Output Circuits for Analog Video from DACs
During board design, the onboard traces and parasitics must be matched for the channel. The video DAC
output pin (IOUTx) is a very high-frequency analog signal and must be routed with extreme care. As a
result, the path of this signal must be as short as possible, and as isolated as possible from other
interfering signals. The load resistor and amplifier/buffer should be placed close together and as close as
possible to the device pins. Other layout guidelines include:
•
•
•
Take special care to bypass the DAC power supply pin with a capacitor.
Place the 75-Ω resistor as close as possible (<0.5") to the amplifier/buffer (THS7360) output pin.
To maintain a high quality video signal, 75-Ω (±10%) characteristic impedance traces should be used
after the 75-Ω series resistor.
•
•
•
Minimize input trace lengths to the device to reduce parasitic capacitance.
Include solid ground return paths.
Match trace lengths as close as possible within a video format group (that is, Y, Pb, and Pr for
component output, and Y and C for s-video output should match each other).
For additional video DAC design guidelines, see the HDVPSS chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
Table 8-73. DAC Specifications
PARAMETER
CONDITIONS
HD DACs
MIN
TYP
12
MAX
UNIT
Bits
Resolution
SD DACs
10
Bits
DC Accuracy - HD DACs
Integral Non-Linearity (INL), best fit
HD DACs
SD DACs
HD DACs
SD DACs
1.5
1.0
1.0
0.5
LSB
LSB
LSB
LSB
Differential Non-Linearity (DNL)
Analog Output
Output Resistor (RLOAD
)
HD and SD DACs
-1%
0
37.5
13.3
+1%
Vref
Ω
Full-Scale Output Current (IFS)
HD and SD DACs
RLOAD
mA
Output Compliance Range
HD and SD DACs
IFS = 13.3 mA,
RLOAD = 37.5 Ω
V
Zero Scale Offset Error (ZSET)
Gain Error
HD and SD DACs
HD and SD DACs
0.5
LSB
%
-10
10
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Table 8-73. DAC Specifications (continued)
PARAMETER
Channel matching
Recommended External Amplification
CONDITIONS
HD and SD DACs
HD DACs
MIN
TYP
MAX
UNIT
%
2
4.5
5.6
V/V
V/V
SD DACs
Reference
Reference Voltage Range (VREF)
Input with External
Reference
-5%
-1%
0.5
1.2
+5%
+1%
V
Full-Scale Current Adjust Resistors
Dynamic Specifications
RBIAS_HD and RBIAS_SD
kΩ
Output Update Rate (FCLK)
HD DACs at 1080i60
HD DACs at 1080p60
SD DACs
74.25
148.5
27
MHz
MHz
MHz
MHz
MHz
MHz
dB
54
Signal Bandwidth
HD DACs at 1080i60
HD DACs at 1080p60
SD DACs
30
60
6
Spurious - Free Dynamic Range (SFDR)
HD DACs at 1080i60
FCLK = 74.25 MHz,
FOUT = 30 MHz
60
HD DACs at 1080p60
FCLK = 148.5 MHz,
FOUT = 60 MHz
60
60
dB
dB
SD DACs
FCLK = 27 MHz / 54 MHz,
FOUT = 6 MHz
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8.11 Inter-Integrated Circuit (I2C)
The device includes two inter-integrated circuit (I2C) modules which provide an interface to other devices
compliant with Philips Semiconductors Inter-IC bus (I2C-bus™) specification version 2.1. External
components attached to this 2-wire serial bus can transmit/receive 8-bit data to/from the device through
the I2C module. The I2C port does not support CBUS compatible devices.
The I2C port supports the following features:
•
•
•
•
•
•
•
•
•
Compatible with Philips I2C Specification Revision 2.1 (January 2000)
Standard and fast modes from 10 - 400 Kbps (no fail-safe I/O buffers)
Noise filter to remove noise 50 ns or less
Seven- and ten-bit device addressing modes
Multimaster transmitter/slave receiver mode
Multimaster receiver/slave transmitter mode
Combined master transmit/receive and receive/transmit modes
Two DMA channels, one interrupt line
Built-in FIFO (32 byte) for buffered read or write.
For more detailed information on the I2C peripheral, see the I2C chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
8.11.1 I2C Peripheral Register Descriptions
Table 8-74. I2C Registers
I2C0 HEX ADDRESS
0x4802 8000
0x4802 8004
0x4802 8010
0x4802 8020
0x4802 8024
0x4802 8028
0x4802 802C
0x4802 8030
0x4802 8034
0x4802 8038
0x4802 803C
0x4802 8040
0x4802 8044
0x4802 8048
0x4802 804C
0x4802 8090
0x4802 8094
0x4802 8098
0x4802 809C
0x4802 80A4
0x4802 80A8
0x4802 80AC
0x4802 80B0
0x4802 80B4
0x4802 80B8
0x4802 80BC
I2C1 HEX ADDRESS
0x4802 A000
0x4802 A004
0x4802 A010
0x4802 A020
0x4802 A024
0x4802 A028
0x4802 A02C
0x4802 A030
0x4802 A034
0x4802 A038
0x4802 A03C
0x4802 A040
0x4802 A044
0x4802 A048
0x4802 A04C
0x4802 A090
0x4802 A094
0x4802 A098
0x4802 A09C
0x4802 A0A4
0x4802 A0A8
0x4802 A0AC
0x4802 A0B0
0x4802 A0B4
0x4802 A0B8
0x4802 A0BC
ACRONYM
I2C_REVNB_LO
I2C_REVNB_HI
I2C_SYSC
REGISTER NAME
Module Revision (LOW BYTES)
Module Revision (HIGH BYTES)
System configuration
I2C End of Interrupt
I2C Status Raw
I2C_EOI
I2C_IRQSTATUS_RAW
I2C_IRQSTATUS
I2C_IRQENABLE_SET
I2C_IRQENABLE_CLR
I2C_WE
I2C Status
I2C Interrupt Enable Set
I2C Interrupt Enable Clear
I2C Wakeup Enable
Receive DMA Enable Set
Transmit DMA Enable Set
Receive DMA Enable Clear
Transmit DMA Enable Clear
Receive DMA Wakeup
Transmit DMA Wakeup
System Status
I2C_DMARXENABLE_SET
I2C_DMATXENABLE_SET
I2C_DMARXENABLE_CLR
I2C_DMATXENABLE_CLR
I2C_DMARXWAKE_EN
I2C_DMATXWAKE_EN
I2C_SYSS
I2C_BUF
Buffer Configuration
Data Counter
I2C_CNT
I2C_DATA
Data Access
I2C_CON
I2C Configuration
I2C_OA
I2C Own Address
I2C_SA
I2C Slave Address
I2C_PSC
I2C Clock Prescaler
I2C SCL Low Time
I2C SCL High Time
System Test
I2C_SCLL
I2C_SCLH
I2C_SYSTEST
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Table 8-74. I2C Registers (continued)
I2C0 HEX ADDRESS
I2C1 HEX ADDRESS
0x4802 A0C0
0x4802 A0C4
0x4802 A0C8
0x4802 A0CC
0x4802 A0D0
0x4802 A0D4
ACRONYM
I2C_BUFSTAT
I2C_OA1
REGISTER NAME
I2C Buffer Status
0x4802 80C0
0x4802 80C4
0x4802 80C8
0x4802 80CC
0x4802 80D0
0x4802 80D4
I2C Own Address 1
I2C Own Address 2
I2C Own Address 3
Active Own Address
I2C Clock Blocking Enable
I2C_OA2
I2C_OA3
I2C_ACTOA
I2C_SBLOCK
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8.11.2 I2C Electrical Data/Timing
Table 8-75. Timing Requirements for I2C Input
(see Figure 8-72)
NO.
MIN
10
2.5
4.7
0.6
4
MAX UNIT
Standard_IC
Fast_IC
1
2
3
4
5
6
7
8
tc(SCL)
Cycle time, SCL
µs
Standard_IC
Fast_IC
Setup time, SCL high before SDA low (for a
repeated Start condition)
tsu(SCLH-SDAL)
th(SDAL-SCLL)
tw(SCLL)
µs
µs
µs
µs
ns
Standard_IC
Fast_IC
Hold time, SCL low after SDA low (for a Start
and a repeated Start condition)
0.6
4.7
1.3
4
Standard_IC
Fast_IC
Pulse duration, SCL low
Standard_IC
Fast_IC
tw(SCLH)
Pulse duration, SCL high
0.6
250
100
0
Standard_IC
Fast_IC
tsu(SDAV-SCLH)
th(SCLL-SDA)
tw(SDAH)
Setup time, SDA valid before SCL high
Standard_IC
Fast_IC
3.45
µs
Hold time, SDA valid after SCL low (for I2C
bus devices)
0
0.9
Standard_IC
Fast_IC
4.7
1.3
4
Pulse duration, SDA high between Stop and
Start conditions
µs
µs
Standard_IC
Fast_IC
Setup time, high before SDA high (for Stop
condition)
13 tsu(SCLH-SDAH)
0.6
0
tw(SDA)
Fast_IC
50
ns
50
14
Pulse duration, spike (must be suppressed)
tw(SCL)
Fast_IC
0
9
11
I2C[x]_SDA
I2C[x]_SCL
6
8
14
4
13
5
10
1
12
3
7
2
3
Stop
Start
Repeated
Start
Stop
Figure 8-72. I2C Receive Timing
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Table 8-76. Switching Characteristics Over Recommended Operating Conditions for I2C Output
(see Figure 8-73)
NO.
PARAMETER
Cycle time, SCL
MIN
10
2.5
4.7
0.6
4
MAX UNIT
Standard_OC
Fast_OC
16 tc(SCL)
µs
Standard_OC
Fast_OC
Setup Time, SCL high before SDA low (for a
repeated START condition)
17 tsu(SCLH-SDAL)
18 th(SDAL-SCLL)
19 tw(SCLL)
µs
µs
µs
µs
ns
Standard_OC
Fast_OC
Hold time, SCL low after SDA low (for a
START and a repeated START condition
0.6
4.7
1.3
4
Standard_OC
Fast_OC
Pulse duration, SCL low
Standard_OC
Fast_OC
20 tw(SCLH)
Pulse duration, SCL high
0.6
250
100
0
Standard_OC
Fast_OC
21 tsu(SDAV-SCLH)
22 th(SCLL-SDA)
23 tw(SDAH)
Setup time, SDA valid before SCL high
Standard_OC
Fast_OC
3.45
µs
Hold time, SDA valid after SCL low (For IIC
bus devices)
0
0.9
Standard_OC
Fast_OC
4.7
1.3
4
Pulse duration, SDA high between STOP and
START conditions
µs
µs
Standard_OC
Fast_OC
Setup time, high before SDA high (for STOP
condition)
28 tsu(SCLH-SDAH)
0.6
26
24
I2C[x]_SDA
I2C[x]_SCL
21
23
19
28
20
25
27
16
18
22
17
18
Stop
Start
Repeated
Start
Stop
Figure 8-73. I2C Transmit Timing
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8.12 Multichannel Audio Serial Port (McASP)
The multichannel audio serial port (McASP) functions as a general-purpose audio serial port optimized for
the needs of multichannel audio applications. The McASP is useful for time-division multiplexed (TDM)
stream, Inter-Integrated Sound (I2S) protocols, and intercomponent digital audio interface transmission
(DIT).
8.12.1 McASP Device-Specific Information
The device includes three multichannel audio serial port (McASP) interface peripherals (McASP0,
McASP1, and McASP2). The McASP module consists of a transmit and receive section. These sections
can operate completely independently with different data formats, separate master clocks, bit clocks, and
frame syncs or, alternatively, the transmit and receive sections may be synchronized. The McASP module
also includes shift registers that may be configured to operate as either transmit data or receive data. The
transmit section of the McASP can transmit data in either a time-division-multiplexed (TDM) synchronous
serial format or in a digital audio interface (DIT) format where the bit stream is encoded for S/PDIF, AES-
3, IEC-60958, CP-430 transmission. The receive section of the McASP peripheral supports the TDM
synchronous serial format.
The McASP module can support one transmit data format (either a TDM format or DIT format) and one
receive format at a time. All transmit shift registers use the same format and all receive shift registers use
the same format; however, the transmit and receive formats need not be the same. Both the transmit and
receive sections of the McASP also support burst mode, which is useful for non-audio data (for example,
passing control information between two devices).
The McASP peripheral has additional capability for flexible clock generation and error detection/handling,
as well as error management.
The device McASP0 module has six serial data pins, while McASP1 and McASP2 are limited to two serial
data pins each.
The McASP FIFO size is 256 bytes and two DMA and two interrupt requests are supported. Buffers are
used transparently to better manage DMA, which can be leveraged to manage data flow more efficiently.
For more detailed information on and the functionality of the McASP peripheral, see the McASP chapter in
the AM389x Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
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8.12.2 McASP0, McASP1, and McASP2 Peripheral Register Descriptions
Table 8-77. McASP0/1/2 Registers
MCASP0 ADDRESS
0x4803 8000
MCASP1 ADDRESS
0x4803 C000
MCASP2 ADDRESS
0x4805 0000
ACRONYM
REGISTER NAME
Peripheral ID
PID
0x4803 8004
0x4803 C004
0x4805 0004
PWRIDLE
Power Idle SYSCONFIG
SYSCONFIG
0x4803 8010
0x4803 8014
0x4803 8018
0x4803 C010
0x4803 C014
0x4803 C018
0x4805 0010
0x4805 0014
0x4805 0018
PFUNC
PDIR
Pin Function
Pin Direction
Pin Data Out
PDOUT
PDIN
Pin Data Input (Read)
Read returns pin data input
PDSET
Pin Data Set (Write)
Writes effect pin data set
(alternate write address
PDOUT)
0x4803 801C
0x4803 C01C
0x4805 001C
0x4803 8020
0x4803 8044
0x4803 8048
0x4803 804C
0x4803 8050
0x4803 8060
0x4803 C020
0x4803 C044
0x4803 C048
0x4803 C04C
0x4803 C050
0x4803 C060
0x4805 0020
0x4805 0044
0x4805 0048
0x4805 004C
0x4805 0050
0x4805 0060
PDCLR
GBLCTL
AMUTE
Pin Data Clear
Global Control
Mute Control
LBCTL
Loop-Back Test Control
Transmit DIT Mode Control
TXDITCTL
GBLCTLR
Alias of GBLCTL containing
only receiver reset bits;
allows transmit to be reset
independently from receive
0x4803 8064
0x4803 8068
0x4803 806C
0x4803 C064
0x4803 C068
0x4803 C06C
0x4805 0064
0x4805 0068
0x4805 006C
RXMASK
RXFMT
Receiver Bit Mask
Receive Bitstream Format
RXFMCTL
Receive Frame Sync
Control
0x4803 8070
0x4803 8074
0x4803 C070
0x4803 C074
0x4805 0070
0x4805 0074
ACLKRCTL
Receive Clock Control
AHCLKRCTL
High Frequency Receive
Clock Control
0x4803 8078
0x4803 807C
0x4803 8080
0x4803 8084
0x4803 8088
0x4803 C078
0x4803 C07C
0x4803 C080
0x4803 C084
0x4803 C088
0x4805 0078
0x4805 007C
0x4805 0080
0x4805 0084
0x4805 0088
RXTDM
EVTCTLR
RXSTAT
Receive TDM Slot 0-31
Receiver Interrupt Control
Status Receiver
RXTDMSLOT
RXCLKCHK
Current Receive TDM Slot
Receiver Clock Check
Control
0x4803 808C
0x4803 80A0
0x4803 C08C
0x4803 C0A0
0x4805 008C
0x4805 00A0
REVTCTL
GBLCTLX
Receiver DMA Event
Control
Alias of GBLCTL containing
only transmit reset bits;
allows transmit to be reset
independently from receive
0x4803 80A4
0x4803 C0A4
0x4805 00A4
TXMASK
Transmit Format Unit Bit
Mask
0x4803 80A8
0x4803 80AC
0x4803 C0A8
0x4803 C0AC
0x4805 00A8
0x4805 00AC
TXFMT
Transmit Bitstream Format
TXFMCTL
Transmit Frame Sync
Control
0x4803 80B0
0x4803 80B4
0x4803 C0B0
0x4803 C0B4
0x4805 00B0
0x4805 00B4
ACLKXCTL
Transmit Clock Control
AHCLKXCTL
High Frequency Transmit
Clock Control
0x4803 80B8
0x4803 80BC
0x4803 80C0
0x4803 C0B8
0x4803 C0BC
0x4803 C0C0
0x4805 00B8
0x4805 00BC
0x4805 00C0
TXTDM
EVTCTLX
TXSTAT
Transmit TDM Slot 0-31
Transmitter Interrupt Control
Status Transmitter
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Table 8-77. McASP0/1/2 Registers (continued)
MCASP0 ADDRESS
0x4803 80C4
MCASP1 ADDRESS
0x4803 C0C4
MCASP2 ADDRESS
0x4805 00C4
ACRONYM
TXTDMSLOT
TXCLKCHK
REGISTER NAME
Current Transmit TDM Slot
0x4803 80C8
0x4803 C0C8
0x4805 00C8
Transmit Clock Check
Control
0x4803 80CC
0x4803 80D0
0x4803 C0CC
0x4803 C0D0
0x4805 00CC
0x4805 00D0
XEVTCTL
Transmitter DMA Control
CLKADJEN
One-shot Clock Adjust
Enable
0x4803 8100
0x4803 8104
0x4803 8108
0x4803 810C
0x4803 8110
0x4803 8114
0x4803 8118
0x4803 811C
0x4803 8120
0x4803 8124
0x4803 8128
0x4803 812C
0x4803 C100
0x4803 C104
0x4803 C108
0x4803 C10C
0x4803 C110
0x4803 C114
0x4803 C118
0x4803 C11C
0x4803 C120
0x4803 C124
0x4803 C128
0x4803 C12C
0x4805 0100
0x4805 0104
0x4805 0108
0x4805 010C
0x4805 0110
0x4805 0114
0x4805 0118
0x4805 011C
0x4805 0120
0x4805 0124
0x4805 0128
0x4805 012C
DITCSRA0
DITCSRA1
DITCSRA2
DITCSRA3
DITCSRA4
DITCSRA5
DITCSRB0
DITCSRB1
DITCSRB2
DITCSRB3
DITCSRB4
DITCSRB5
Left (Even TDM Slot)
Channel Status Register
File
Left (Even TDM Slot)
Channel Status Register
File
Left (Even TDM Slot)
Channel Status Register
File
Left (Even TDM Slot)
Channel Status Register
File
Left (Even TDM Slot)
Channel Status Register
File
Left (Even TDM Slot)
Channel Status Register
File
Right (Odd TDM Slot)
Channel Status Register
File
Right (Odd TDM Slot)
Channel Status Register
File
Right (Odd TDM Slot)
Channel Status Register
File
Right (Odd TDM Slot)
Channel Status Register
File
Right (Odd TDM Slot)
Channel Status Register
File
Right (Odd TDM Slot)
Channel Status Register
File
0x4803 8130
0x4803 8134
0x4803 8138
0x4803 813C
0x4803 8140
0x4803 8144
0x4803 8148
0x4803 814C
0x4803 C130
0x4803 C134
0x4803 C138
0x4803 C13C
0x4803 C140
0x4803 C144
0x4803 C148
0x4803 C14C
0x4805 0130
0x4805 0134
0x4805 0138
0x4805 013C
0x4805 0140
0x4805 0144
0x4805 0148
0x4805 014C
DITUDRA0
DITUDRA1
DITUDRA2
DITUDRA3
DITUDRA4
DITUDRA5
DITUDRB0
DITUDRB1
Left (Even TDM Slot) User
Data Register File
Left (Even TDM Slot) User
Data Register File
Left (Even TDM Slot) User
Data Register File
Left (Even TDM Slot) User
Data Register File
Left (Even TDM Slot) User
Data Register File
Left (Even TDM Slot) User
Data Register File
Right (Odd TDM Slot) User
Data Register File
Right (Odd TDM Slot) User
Data Register File
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Table 8-77. McASP0/1/2 Registers (continued)
MCASP0 ADDRESS
MCASP1 ADDRESS
MCASP2 ADDRESS
ACRONYM
REGISTER NAME
0x4803 8150
0x4803 8154
0x4803 8158
0x4803 815C
0x4803 C150
0x4805 0150
DITUDRB2
Right (Odd TDM Slot) User
Data Register File
0x4803 C154
0x4803 C158
0x4803 C15C
0x4805 0154
0x4805 0158
0x4805 015C
DITUDRB3
DITUDRB4
DITUDRB5
Right (Odd TDM Slot) User
Data Register File
Right (Odd TDM Slot) User
Data Register File
Right (Odd TDM Slot) User
Data Register File
0x4803 8180 -
0x4803 81BC
0x4803 C180 -
0x4803 C1BC
0x4805 0180 - 0x4805
01BC
XRSRCTL0 -
XRSRCTL15
Serializer 0 Control -
Serializer 15 Control
0x4803 8200 -
0x4803 8 23C
0x4803 C200 -
0x4803 C23C
0x4805 0200 - 0x4805 023C
TXBUF0 -
TXBUF15
Transmit Buffer for
Serializer 0 - Transmit
Buffer for Serializer 15
0x4803 8280 -
0x4803 82BC
0x4803 C280 -
0x4803 C2BC
0x4805 0280 - 0x4805
02BC
RXBUF0 -
RXBUF15
Receive Buffer for Serializer
0 - Receive Buffer for
Serializer 15
0x4803 9000
0x4803 9004
0x4803 9008
0x4803 900C
0x4803 D000
0x4803 D004
0x4803 D008
0x4803 D00C
0x4805 1000
0x4805 1004
0x4805 1008
0x4805 100C
BUFFER_CFGRD Write FIFO Control
_WFIFOCTL
BUFFER_CFGRD Write FIFO Status
_WFIFOSTS
BUFFER_CFGRD Read FIFO Control
_RFIFOCTL
BUFFER_CFGRD Read FIFO Status
_RFIFOSTS
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8.12.3 McASP Electrical Data/Timing
Table 8-78. Timing Requirements for McASP(1)
(see Figure 8-74)
NO.
MIN
20
10
20
10
11.5
4
MAX UNIT
1
2
3
4
tc(AHCLKRX)
tw(AHCLKRX)
tc(ACLKRX)
tw(ACLKRX)
Cycle time, MCA[x]_AHCLKR/X
ns
ns
ns
ns
Pulse duration, MCA[x]_AHCLKR/X high or low
Cycle time, MCA[x]_ACLKR/X
Pulse duration, MCA[x]_ACLKR/X high or low
ACLKR/X int
Setup time, MCA[x]_AFSR/X input valid before
MCA[x]_ACLKR/X
5
6
7
8
tsu(AFSRX-ACLKRX)
th(ACLKRX-AFSRX)
tsu(AXR-ACLKRX)
th(ACLKRX-AXR)
ACLKR/X ext in
ACLKR/X ext out
ACLKR/X int
ns
ns
ns
ns
4
-1
Hold time, MCA[x]_AFSR/X input valid after
MCA[x]_ACLKR/X
ACLKR/X ext in
ACLKR/X ext out
ACLKR/X int
0.5
0.5
11.5
4
Setup time, MCA[x]_AXR input valid before
MCA[x]_ACLKR/X
ACLKR/X ext in
ACLKR/X ext out
ACLKR/X int
4
-1
Hold time, MCA[x]_AXR input valid after
MCA[x]_ACLKR/X
ACLKR/X ext in
ACLKR/X ext out
0.5
0.5
(1) ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
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2
1
2
MCA[x]_ACLKR/X (Falling Edge Polarity)
MCA[x]_AHCLKR/X (Rising Edge Polarity)
4
4
3
MCA[x]_ACLKR/X (CLKRP = CLKXP = 0)(A)
MCA[x]_ACLKR/X (CLKRP = CLKXP = 1)(B)
6
5
MCA[x]_AFSR/X (Bit Width, 0 Bit Delay)
MCA[x]_AFSR/X (Bit Width, 1 Bit Delay)
MCA[x]_AFSR/X (Bit Width, 2 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 0 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 1 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 2 Bit Delay)
8
7
MCA[x]_AXR[x] (Data In/Receive)
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
C31
A. For CLKRP = CLKXP = 0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
receiver is configured for falling edge (to shift data in).
B. For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
receiver is configured for rising edge (to shift data in).
Figure 8-74. McASP Input Timing
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Table 8-79. Switching Characteristics Over Recommended Operating Conditions for McASP(1)
(see Figure 8-75)
NO.
PARAMETER
MIN
MAX UNIT
9
tc(AHCLKRX)
Cycle time, MCA[x]_AHCLKR/X
20(2)
ns
0.5P -
2.5(3)
10 tw(AHCLKRX)
11 tc(ACLKRX)
12 tw(ACLKRX)
Pulse duration, MCA[x]_AHCLKR/X high or low
Cycle time, MCA[x]_ACLKR/X
ns
20
ns
0.5P -
2.5(3)
Pulse duration, MCA[x]_ACLKR/X high or low
ns
ACLKR/X int
0
2
6
Delay time, MCA[x]_ACLKR/X transmit edge to
MCA[x]_AFSR/X output valid
ACLKR/X ext in
13.5
ns
13 td(ACLKRX-AFSRX)
Delay time, MCA[x]_ACLKR/X transmit edge to
MCA[x]_AFSR/X output valid with Pad Loopback
ACLKR/X ext out
2
13.5
ACLKX int
-1
2
5
Delay time, MCA[x]_ACLKX transmit edge to
MCA[x]_AXR output valid
ACLKX ext in
13.5
ns
14 td(ACLKX-AXR)
Delay time, MCA[x]_ACLKX transmit edge to
MCA[x]_AXR output valid with Pad Loopback
ACLKX ext out
2
13.5
ACLKX int
-1
2
5
Disable time, MCA[x]_ACLKX transmit edge to
MCA[x]_AXR output high impedance
ACLKX ext in
13.5
ns
15 tdis(ACLKX-AXR)
Disable time, MCA[x]_ACLKX transmit edge to
MCA[x]_AXR output high impedance with Pad
Loopback
ACLKX ext out
2
13.5
(1) ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
(2) 50 MHz
(3) P = AHCLKR/X period.
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10
10
9
MCA[x]_ACLKR/X (Falling Edge Polarity)
MCA[x]_AHCLKR/X (Rising Edge Polarity)
12
11
12
MCA[x]_ACLKR/X (CLKRP = CLKXP = 1)(A)
MCA[x]_ACLKR/X (CLKRP = CLKXP = 0)(B)
13
13
13
13
MCA[x]_AFSR/X (Bit Width, 0 Bit Delay)
MCA[x]_AFSR/X (Bit Width, 1 Bit Delay)
MCA[x]_AFSR/X (Bit Width, 2 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 0 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 1 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 2 Bit Delay)
13
13
13
MCA[x]_AXR[x] (Data Out/Transmit)
14
15
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
C31
A. For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
receiver is configured for rising edge (to shift data in).
B. For CLKRP = CLKXP = 0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
receiver is configured for falling edge (to shift data in).
Figure 8-75. McASP Output Timing
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8.13 Multichannel Buffered Serial Port (McBSP)
The McBSP provides these functions:
•
•
•
•
Full-duplex communication
Double-buffered data registers, which allow a continuous data stream
Independent framing and clocking for receive and transmit
Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially
connected analog-to-digital (A/D) and digital-to-analog (D/A) devices
•
•
•
•
Supports TDM, I2S, and similar formats
External shift clock or an internal, programmable frequency shift clock for data transfer
5KB Tx and Rx buffer
Supports three interrupt and two DMA requests.
The McBSP module may support two types of data transfer at the system level:
•
The full-cycle mode, for which one clock period is used to transfer the data, generated on one edge
and captured on the same edge (one clock period later).
•
The half-cycle mode, for which one half clock period is used to transfer the data, generated on one
edge and captured on the opposite edge (one half clock period later). Note that a new data is
generated only every clock period, which secures the required hold time. The interface clock
(CLKX/CLKR) activation edge (data/frame sync capture and generation) has to be configured
accordingly with the external peripheral (activation edge capability) and the type of data transfer
required at the system level.
For more detailed information on the McBSP peripheral, see the McBSP chapter in the AM389x Sitara
ARM Processors Technical Reference Manual (literature number SPRUGX7).
The following sections describe the timing characteristics for applications in normal mode (that is, the
McBSP connected to one peripheral) and TDM applications in multipoint mode.
8.13.1 McBSP Peripheral Register Descriptions
Table 8-80. McBSP Registers(1)
HEX ADDRESS
0x4700 0000
0x4700 0008
0x4700 0010
0x4700 0014
0x4700 0018
0x4700 001C
0x4700 0020
0x4700 0024
0x4700 0028
0x4700 002C
0x4700 0030
0x4700 0034
0x4700 0038
0x4700 003C
0x4700 0040
0x4700 0044
0x4700 0048
0x4700 004C
ACRONYM
DRR_REG
REGISTER NAME
McBSP data receive
DXR_REG
McBSP data transmit
SPCR2_REG
SPCR1_REG
RCR2_REG
RCR1_REG
XCR2_REG
XCR1_REG
SRGR2_REG
SRGR1_REG
MCR2_REG
MCR1_REG
RCERA_REG
RCERB_REG
XCERA_REG
XCERB_REG
PCR_REG
McBSP serial port control 2
McBSP serial port control 1
McBSP receive control 2
McBSP receive control 1
McBSP transmit control 2
McBSP transmit control 1
McBSP sample rate generator 2
McBSP sample rate generator 1
McBSP multichannel 2
McBSP multichannel 1
McBSP receive channel enable partition A
McBSP receive channel enable partition B
McBSP transmit channel enable partition A
McBSP transmit channel enable partition B
McBSP pin control
RCERC_REG
McBSP receive channel enable partition C
(1) Note that the McBSP registers are 32-bit aligned.
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Table 8-80. McBSP Registers(1) (continued)
HEX ADDRESS
ACRONYM
RCERD_REG
XCERC_REG
XCERD_REG
RCERE_REG
RCERF_REG
XCERE_REG
XCERF_REG
RCERG_REG
RCERH_REG
XCERG_REG
XCERH_REG
REV_REG
REGISTER NAME
0x4700 0050
0x4700 0054
0x4700 0058
0x4700 005C
0x4700 0060
0x4700 0064
0x4700 0068
0x4700 006C
0x4700 0070
0x4700 0074
0x4700 0078
0x4700 007C
0x4700 0080
0x4700 0084
0x4700 0088
0x4700 008C
0x4700 0090
0x4700 0094
0x4700 00A0
0x4700 00A4
0x4700 00A8
0x4700 00AC
0x4700 00B0
0x4700 00B4
0x4700 00B8
0x4700 00C0
McBSP receive channel enable partition D
McBSP transmit channel enable partition C
McBSP transmit channel enable partition D
McBSP receive channel enable partition E
McBSP receive channel enable partition F
McBSP transmit channel enable partition E
McBSP transmit channel enable partition F
McBSP receive channel enable partition G
McBSP receive channel enable partition H
McBSP transmit channel enable partition G
McBSP transmit channel enable partition H
McBSP revision number
RINTCLR_REG
XINTCLR_REG
ROVFLCLR_REG
SYSCONFIG_REG
THRSH2_REG
THRSH1_REG
IRQSTATATUS
IRQENABLE
McBSP receive interrupt clear
McBSP transmit interrupt clear
McBSP receive overflow interrupt clear
McBSP system configuration
McBSP transmit buffer threshold (DMA or IRQ trigger)
McBSP receive buffer threshold (DMA or IRQ trigger)
McBSP interrupt status (OCP compliant IRQ line)
McBSP interrupt enable (OCP compliant IRQ line)
McBSP wakeup enable
WAKEUPEN
XCCR_REG
McBSP transmit configuration control
McBSP receive configuration control
McBSP transmit buffer status
RCCR_REG
XBUFFSTAT_REG
RBUFFSTAT_REG
STATUS_REG
McBSP receive buffer status
McBSP status
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8.13.2 McBSP Electrical Data/Timing
Table 8-81. Timing Requirements for McBSP - Master Mode(1)
(see Figure 8-76)
NO.
MIN
3.5
MAX UNIT
6
7
tsu(DRV-CLKAE)
th(CLKAE-DRV)
Setup time, MCB_DR valid before MCB_CLK active edge(2)
Hold time, MCB_DR valid after MCB_CLK active edge(2)
ns
ns
0.1
(1) The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive output data and capture
input data.
(2) MCB_CLK corresponds to either MCB_CLKX or MCB_CLKR.
Table 8-82. Switching Characteristics Over Recommended Operating Conditions for McBSP - Master
Mode(1)
(see Figure 8-76)
NO.
1
PARAMETER
MIN
20.83
0.5*P - 1(3)
0.5*P - 1(3)
MAX UNIT
tc(CLK)
Cycle time, output MCB_CLK period(2)
Pulse duration, output MCB_CLK low(2)
Pulse duration, output MCB_CLK high(2)
ns
ns
ns
2
tw(CLKL)
tw(CLKH)
3
Delay time, output MCB_CLK active edge to output MCB_FS
valid(2)(4)
4
5
td(CLKAE-FSV)
0.7
0.7
9.4
9.4
ns
ns
Delay time, output MCB_CLKX active edge to output MCB_DX
valid
td(CLKXAE-DXV)
(1) The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive output data and capture
input data.
(2) MCB_CLK corresponds to either MCB_CLKX or MCB_CLKR.
(3) P = MCB_CLKX/MCB_CLKR output CLK period, in ns; use whichever value is greater. This parameter applies to the maximum McBSP
frequency. Operate serial clocks (CLKX/R) in the reasonable range of 40/60 duty cycle.
(4) MCB_FS corresponds to either MCB_FSX or MCB_FSR.
2
1
3
MCB_CLK
4
4
MCB_FS
MCB_DX
5
5
5
MCB_DX7
MCB_DX6
MCB_DX0
MCB_DR0
7
6
MCB_DR
MCB_DR7
MCB_DR6
A. The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive
output data and capture input data.
B. MCBSP_CLK corresponds to either MCBSP_CLKX or MCBSP_CLKR; MCBSP_FS corresponds to either
MCBSP_FSX
or
MCBSP_FSR.
McBSP in 6-pin mode: DX and DR as data pins; CLKX, CLKR, FSX and FSR as control pins.
McBSP in 4-pin mode: DX and DR as data pins; CLKX and FSX pins as control pins. The CLKX and FSX pins are
internally looped back via software configuration, respectively to the CLKR and FSR internal signals for data receive.
C. The polarity of McBSP frame synchronization is software configurable.
D. The active clock edge selection of MCBSP_CLK (rising or falling) on which MCBSP_DX data is latched and
MCBSP_DR data is sampled is software configurable.
E. Timing diagrams are for data delay set to 1.
F. For further details about the registers used to configure McBSP, see the McBSP chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
Figure 8-76. McBSP Master Mode Timing
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Table 8-83. Timing Requirements for McBSP - Slave Mode(1)
(see Figure 8-77)
NO.
MIN
MAX UNIT
1
2
3
4
5
7
8
tc(CLK)
Cycle time, MCB_CLK period(2)
Pulse duration, MCB_CLK low(2)
Pulse duration, MCB_CLK high(2)
Setup time, MCB_FS valid before MCB_CLK active edge(2)(4)
Hold time, MCB_FS valid after MCB_CLK active edge(2)(4)
Setup time, MCB_DR valid before MCB_CLK active edge(2)
Hold time, MCB_DR valid after MCB_CLK active edge(2)
20.83
0.5*P - 1(3)
0.5*P - 1(3)
ns
ns
ns
ns
ns
ns
ns
tw(CLKL)
tw(CLKH)
tsu(FSV-CLKAE)
th(CLKAE-FSV)
tsu(DRV-CLKAE)
th(CLKAE-DRV)
3.8
0
3.8
0
(1) The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive output data and capture
input data.
(2) MCB_CLK corresponds to either MCB_CLKX or MCB_CLKR.
(3) P = MCB_CLKX/MCB_CLKR output CLK period, in ns; use whichever value is greater. This parameter applies to the maximum McBSP
frequency. Operate serial clocks (CLKX/R) in the reasonable range of 40/60 duty cycle.
(4) MCB_FS corresponds to either MCB_FSX or MCB_FSR.
Table 8-84. Switching Characteristics Over Recommended Operating Conditions for McBSP - Slave
Mode(1)
(see Figure 8-77)
NO.
PARAMETER
MIN
MAX UNIT
12.5 ns
6
td(CLKXAE-DXV)
Delay time, input MCB_CLKx active edge to output MCB_DX valid
0.5
(1) The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive output data and capture
input data.
2
1
3
MCB_CLK
4
5
MCB_FS
6
6
8
6
MCB_DX
MCB_DR
MCB_DX7
MCB_DX6
MCB_DX0
MCB_DR0
7
MCB_DR7
MCB_DR6
A. The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive
output data and capture input data.
B. MCBSP_CLK corresponds to either MCBSP_CLKX or MCBSP_CLKR; MCBSP_FS corresponds to either
MCBSP_FSX
or
MCBSP_FSR.
McBSP in 6-pin mode: DX and DR as data pins; CLKX, CLKR, FSX and FSR as control pins.
McBSP in 4-pin mode: DX and DR as data pins; CLKX and FSX pins as control pins. The CLKX and FSX pins are
internally looped back via software configuration, respectively to the CLKR and FSR internal signals for data receive.
C. The polarity of McBSP frame synchronization is software configurable.
D. The active clock edge selection of MCBSP_CLK (rising or falling) on which MCBSP_DX data is latched and
MCBSP_DR data is sampled is software configurable.
E. Timing diagrams are for data delay set to 1.
F. For further details about the registers used to configure McBSP, see the McBSP chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
Figure 8-77. McBSP Slave Mode Timing
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8.14 Peripheral Component Interconnect Express (PCIe)
The device supports connections to PCIe-compliant devices via the integrated PCIe master/slave bus
interface. The PCIe module is comprised of a dual-mode PCIe core and a SerDes PHY. The device
implements a single two-lane PCIe 2.0 (5.0 GT/s) endpoint/root complex port.
The device PCIe supports the following features:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Supports Gen1/Gen2 in x1 or x2 mode
One port with up to 2 x 5 GT/s lanes
Single virtual channel (VC), single traffic class (TC)
Single function in end-point mode
Automatic width and speed negotiation and lane reversal
Max payload: 128 byte outbound, 256 byte inbound
Automatic credit management
ECRC generation and checking
Configurable BAR filtering
Supports PCIe messages
Legacy interrupt reception (RC) and generation (EP)
MSI generation and reception
PCI device power management, except D3 cold with vaux
Active state power management state L0 and L1.
For more detailed information on the PCIe port peripheral module, see the PCIe chapter in the AM389x
Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
The PCIe peripheral on the device conforms to the PCI Express Base 2.0 Specification.
8.14.1 PCIe Design and Layout Specifications
8.14.1.1 Clock Source
A standard 100-MHz PCIe differential clock source must be used for PCIe operation (for details, see
Section 7.3.2).
8.14.1.2 PCIe Connections and Interface Compliance
The PCIe interface on the device is compliant with the PCI Express Base 2.0 Specification. Refer to the
PCIe specifications for all connections that are described in it. For coupling capacitor selection, see
Section 8.14.1.2.1.
The use of PCIe-compatible bridges and switches is allowed for interfacing with more than one other
processor or PCIe device.
8.14.1.2.1 Coupling Capacitors
AC coupling capacitors are required on the transmit data pair. Table 8-85 shows the requirements for
these capacitors.
Table 8-85. AC Coupling Capacitors Requirements
PARAMETER
MIN
TYP
MAX
200
UNIT
nF
EIA(2)
PCIe AC coupling capacitor value
PCIe AC coupling capacitor package size(1)
75
0402
0603
(1) The physical size of the capacitor should be as small as practical. Use the same size on both lines in each pair, placed side by side.
(2) EIA LxW units; for example, a 0402 is a 40x20 mil (thousandths of an inch) surface-mount capacitor.
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8.14.1.2.2 Polarity Inversion
The PCIe specification requires polarity inversion support. This means, for layout purposes, polarity is
unimportant since each signal can change its polarity on-die inside the chip. This means polarity within a
lane is unimportant for layout.
8.14.1.2.3 Lane Reversal
The device supports lane reversal. Since there are two lanes, this means the lanes can be switched in
layout for better PCB routing.
8.14.1.3 Non-Standard PCIe Connections
The following sections contain suggestions for any PCIe connection that is not described in the official
PCIe specification, such as an on-board device-to-device connection, or device-to-other PCIe-compliant
processor connection.
8.14.1.3.1 PCB Stackup Specifications
Table 8-86 shows the stackup and feature sizes required for these types of PCIe connections.
Table 8-86. PCIe PCB Stackup Specifications
PARAMETER
MIN
TYP
6
MAX
UNIT
Layers
Layers
Cuts
Layers
Mils
PCB Routing/Plane Layers
Signal Routing Layers
4
2
-
-
-
3
Number of ground plane cuts allowed within PCIe routing region
Number of layers between PCIe routing area and reference plane(1)
PCB Routing clearance
-
0
0
-
-
-
-
4
PCB Trace width(2)
-
4
-
Mils
PCB BGA escape via pad size
-
20
10
0.3
-
Mils
PCB BGA escape via hole size
Processor BGA pad size(3)(4)
-
Mils
mm
(1) A reference plane may be a ground plane or the power plane referencing the PCIe signals.
(2) In breakout area.
(3) Non-solder mask defined pad.
(4) Per IPC-7351A BGA pad size guideline.
8.14.1.3.2 Routing Specifications
The PCIe data signal traces must be routed to achieve 100 Ω (±20%) differential impedance and 60 Ω
(±15%) single-ended impedance. The single-ended impedance is required because differential signals are
extremely difficult to closely couple on PCBs and, therefore, single-ended impedance becomes important.
These requirements are the same as those recommended in the PCIe Motherboard Checklist 1.0
document, available from PCI-SIG.
These impedances are impacted by trace width, trace spacing, distance between signals and referencing
planes, and dielectric material. Verify with a PCB design tool that the trace geometry for both data signal
pairs result in as close to 100 Ω differential impedance and 60 Ω single-ended impedance as possible. For
best accuracy, work with your PCB fabricator to ensure this impedance is met.
In general, closely coupled differential signal traces are not an advantage on PCBs. When differential
signals are closely coupled, tight spacing and width control is necessary. Very small width and spacing
variations affect impedance dramatically, so tight impedance control can be more problematic to maintain
in production.
Loosely coupled PCB differential signals make impedance control much easier. Wider traces and spacing
make obstacle avoidance easier, and trace width variations do not affect impedance as much; therefore, it
is easier to maintain an accurate impedance over the length of the signal. The wider traces also show
reduced skin effect and, therefore, often result in better signal integrity.
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Table 8-87 shows the routing specifications for the PCIe data signals.
Table 8-87. PCIe Routing Specifications
PARAMETER
MIN
TYP
MAX
UNIT
PCIe signal trace length
10(1) Inches
Differential pair trace matching
10(2)
0
Mils
Stubs
Ω
Number of stubs allowed on PCIe traces(3)
TX/RX pair differential impedance
TX/RX single ended impedance
80
51
100
60
120
69
Ω
Pad size of vias on PCIe trace
25(4)
Mils
Mils
Vias(5)
Hole size of vias on PCIe trace
14
Number of vias on each PCIe trace
PCIe differential pair to any other trace spacing
3
2*DS(6)
(1) Beyond this, signal integrity may suffer.
(2) For example, RXP0 within 10 Mils of RXN0.
(3) In-line pads may be used for probing.
(4) 35-Mil antipad max recommended.
(5) Vias must be used in pairs with their distance minimized.
(6) DS = differential spacing of the PCIe traces.
8.14.2 PCIe Peripheral Register Descriptions
Table 8-88. PCIe Registers
HEX ADDRESS
0x5100 0000
0x5100 0004
0x5100 0008
0x5100 000C
0x5100 0010
0x5100 0014
0x5100 0020
0x5100 0024
0x5100 0028
0x5100 0030
0x5100 0034
0x5100 0038
0x5100 003C
0x5100 0050
0x5100 0054
0x5100 0064
0x5100 0068
0x5100 006C
0x5100 0070
0x5100 0074
0x5100 0078
0x5100 007C
0x5100 0100
0x5100 0104
0x5100 0108
0x5100 010C
0x5100 0180
ACRONYM
PID
REGISTER NAME
Peripheral Version and ID
Command Status
CMD_STATUS
CFG_SETUP
IOBASE
Config Transaction Setup
IO TLP Base
TLPCFG
TLP Attribute Configuration
Reset Command and Status
Power Management Command
Power Management Configuration
Activity Status
RSTCMD
PMCMD
PMCFG
ACT_STATUS
OB_SIZE
Outbound Size
DIAG_CTRL
ENDIAN
Diagnostic Control
Endian Mode
PRIORITY
CBA Transaction Priority
End of Interrupt
IRQ_EOI
MSI_IRQ
MSI Interrupt IRQ
EP_IRQ_SET
EP_IRQ_CLR
EP_IRQ_STATUS
GPRO
Endpoint Interrupt Request Set
Endpoint Interrupt Request Clear
Endpoint Interrupt Status
General Purpose 0
GPR1
General Purpose 1
GPR2
General Purpose 2
GPR3
General Purpose 3
MSI0_IRQ_STATUS_RAW
MSI0_IRQ_STATUS
MSI0_IRQ_ENABLE_SET
MSI0_IRQ_ENABLE_CLR
IRQ_STATUS_RAW
MSI 0 Interrupt Raw Status
MSI 0 Interrupt Enabled Status
MSI 0 Interrupt Enable Set
MSI 0 Interrupt Enable Clear
Raw Interrupt Status
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Table 8-88. PCIe Registers (continued)
HEX ADDRESS
ACRONYM
IRQ_STATUS
REGISTER NAME
0x5100 0184
0x5100 0188
0x5100 018C
0x5100 01C0
0x5100 01C4
0x5100 01C8
0x5100 01CC
0x5100 01D0
0x5100 01D4
0x5100 01D8
0x5100 01DC
0x5100 0200
0x5100 0204
0x5100 0300
0x5100 0304
0x5100 0308
0x5100 030C
0x5100 0310
0x5100 0314
0x5100 0318
0x5100 031C
0x5100 0320
0x5100 0324
0x5100 0328
0x5100 032C
0x5100 0330
0x5100 0334
0x5100 0338
0x5100 033C
0x5100 0380
0x5100 0384
0x5100 0388
0x5100 0390
0x5100 0394
Interrupt Enabled Status
IRQ_ENABLE_SET
IRQ_ENABLE_CLR
ERR_IRQ_STATUS_RAW
ERR_IRQ_STATUS
ERR_IRQ_ENABLE_SET
ERR_IRQ_ENABLE_CLR
PMRST_IRQ_STATUS_RAW
PMRST_IRQ_STATUS
PMRST_ENABLE_SET
PMRST_ENABLE_CLR
OB_OFFSET_INDEXn
OB_OFFSETn_HI
IB_BAR0
Interrupt Enable Set
Interrupt Enable Clear
Raw ERR Interrupt Status
ERR Interrupt Enabled Status
ERR Interrupt Enable Set
ERR Interrupt Enable Clear
Power Management and Reset Interrupt Status
Power Management and Reset Interrupt Enabled Status
Power Management and Reset Interrupt Enable Set
Power Management and Reset Interrupt Enable Clear
Outbound Translation Region N Offset Low and Index
Outbound Translation Region N Offset High
Inbound Translation Bar Match 0
Inbound Translation 0 Start Address Low
Inbound Translation 0 Start Address High
Inbound Translation 0 Address Offset
Inbound Translation Bar Match 1
Inbound Translation 1 Start Address Low
Inbound Translation 1 Start Address High
Inbound Translation 1 Address Offset
Inbound Translation Bar Match 2
Inbound Translation 2 Start Address Low
Inbound Translation 2 Start Address High
Inbound Translation 2 Address Offset
Inbound Translation Bar Match 3
Inbound Translation 3 Start Address Low
Inbound Translation 3 Start Address High
Inbound Translation 3 Address Offset
PCS Configuration 0
IB_START0_LO
IB_START0_HI
IB_OFFSET0
IB_BAR1
IB_START1_LO
IB_START1_HI
IB_OFFSET1
IB_BAR2
IB_START2_LO
IB_START2_HI
IB_OFFSET2
IB_BAR3
IB_START3_LO
IB_START3_HI
IB_OFFSET3
PCS_CFG0
PCS_CFG1
PCS Configuration 1
PCS_STATUS
PCS Status
SERDES_CFG0
SERDES_CFG1
SerDes Configuration for Lane 0
SerDes Configuration for Lane 1
8.14.3 PCIe Electrical Data/Timing
Texas Instruments (TI) has performed the simulation and system characterization to ensure that the PCIe
peripheral meets all AC timing specifications as required by the PCI Express Base 2.0 Specification.
Therefore, the AC timing specifications are not reproduced here. For more information on the AC timing
specifications, see Sections 4.3.3.5 and 4.3.4.4 of the PCI Express Base 2.0 Specification.
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8.15 Real-Time Clock (RTC)
The real-time clock is a precise timer that can generate interrupts on intervals specified by the user.
Interrupts can occur every second, minute, hour, or day. The clock, itself, can track the passage of real
time for durations of several years, provided it has a sufficient power source the whole time.
The basic purpose for the RTC is to keep time of day. The other equally important purpose of the RTC is
for Digital Rights management. Some degree of tamper-proofing is needed to ensure that simply stopping,
resetting, or corrupting the RTC does not go unnoticed; so, if this occurs, the application can re-acquire
the time of day from a trusted source. The final purpose of RTC is to wake up the rest of the device from a
power-down state. The RTC features include:
•
•
•
•
•
•
•
Time information (hours/minutes/seconds) directly in binary coded decimal (BCD), for easy decoding.
Calendar information (day/month/year/day of week) directly in BCD code up to year 2099.
Shadow time and calendar access; ease of reading time.
Interrupt generation, periodically (1d/1h/1m/1s) or at a precise time of day and/or date.
30-second time correction (crystal frequency compensation).
OCP slave port for register access.
Supports power idle protocol with SWakeUp capable on alarm or timer events.
The RTC is driven by SYSCLK18 (32.768 kHz) or an optional 32.768-kHz clock can be input on the
CLKIN32 clock input pin for RTC reference.
Figure 8-78 shows the major components of the RTC.
32.768 kHz
Counter
32 kHz
Compensation
Week Days
Control
Years
Minutes
Hours
Days
Month
Seconds
IRQ_ALARM
NIRQ_TIMER
Interrupt
Alarm
Figure 8-78. Real-Time Clock Block Diagram
8.15.1 RTC Register Descriptions
Table 8-89. RTC Registers
HEX ADDRESS
0x480C 0000
0x480C 0004
0x480C 0008
0x480C 000C
0x480C 0010
0x480C 0014
ACRONYM
SECONDS_REG
REGISTER NAME
Seconds
Minutes
Hours
MINUTES_REG
HOURS_REG
DAYS_REG
Day of the Month
Month
MONTHS_REG
YEARS_REG
Year
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Table 8-89. RTC Registers (continued)
HEX ADDRESS
ACRONYM
WEEK_REG
REGISTER NAME
Day of the Week
Alarm Seconds
Alarm Minutes
Alarm Hours
0x480C 0018
0x480C 0020
0x480C 0024
0x480C 0028
0x480C 002C
0x480C 0030
0x480C 0034
0x480C 0040
0x480C 0044
0x480C 0048
0x480C 004C
0x480C 0050
0x480C 0054
0x480C 0060
0x480C 0064
0x480C 0068
0x480C 006C
0x480C 0070
0x480C 0074
0x480C 0078
0x480C 007A
ALARM_SECONDS_REG
ALARM_MINUTES_REG
ALARM_HOURS_REG
ALARM_DAYS_REG
ALARM_MONTHS_REG
ALARM_YEARS_REG
RTC_CTRL_REG
Alarm Days
Alarm Months
Alarm Years
Control
RTC_STATUS_REG
RTC_INTERRUPTS_REG
RTC_COMP_LSB_REG
RTC_COMP_MSB_REG
RTC_OSC_REG
Status
Interrupt Enable
Compensation (LSB)
Compensation (MSB)
Oscillator
RTC_SCRATCH0_REG
RTC_SCRATCH1_REG
RTC_SCRATCH2_REG
KICK0
Scratch 0 (general-purpose)
Scratch 1 (general-purpose)
Scratch 2 (general-purpose)
Kick 0 (write protect)
KICK1
Kick 1 (write protect)
RTC_REVISION
Revision
RTC_SYSCONFIG
RTC_IRQWAKEEN_0
Clock Management Configuration
Wakeup Generation
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8.16 Secure Digital/Secure Digital Input Output (SD/SDIO)
The device SD/SDIO Controller has following features:
•
•
•
•
•
•
•
Secure Digital (SD) memory card with Secure Data I/O (SDIO)
Supports SDHC (SD high capacity)
SD/SDIO protocol support
Programmable clock frequency
1024 byte read/write FIFO to lower system overhead
Slave DMA transfer capability
Full compliance with SD command/response sets, as defined in the SD physical layer specification
v2.00
•
•
Full compliance with SDIO command/response sets and interrupt/read-wait suspend-resume
operations, as defined in the SD part E1 specification v 2 .00
Full compliance with SD host controller standard specification sets as defined in the SD card
specification part A2 v2.00.
For more detailed information on SD/SDIO, see the SD/SDIO chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
8.16.1 SD/SDIO Peripheral Register Descriptions
Table 8-90. SD/SDIO Registers(1)
HEX ADDRESS
0x4806 0000
0x4806 0004
0x4806 0010
0x4806 0110
0x4806 0114
0x4806 0124
0x4806 0128
0x4806 012C
0x4806 0130
0x4806 0200
0x4806 0204
0x4806 0208
0x4806 020C
0x4806 0210
0x4806 0214
0x4806 0218
0x4806 021C
0x4806 0220
0x4806 0224
0x4806 0228
0x4806 022C
0x4806 0230
0x4806 0234
0x4806 0238
0x4806 023C
0x4806 0240
0x4806 0248
ACRONYM
SD_HL_REV
SD_HL_HWINFO
SD_HL_SYSCONFIG
SD_SYSCONFIG
SD_SYSSTATUS
SD_CSRE
REGISTER NAME
IP Revision Identifier
Hardware Configuration
Clock Management Configuration
System Configuration
System Status
Card status response error
System Test
SD_SYSTEST
SD_CON
Configuration
SD_PWCNT
SD_SDMASA
SD_BLK
Power counter
SDMA System address:
Transfer Length Configuration
Command argument
Command and transfer mode
Command Response 0 and 1
Command Response 2 and 3
Command Response 4 and 5
Command Response 6 and 7
Data
SD_ARG
SD_CMD
SD_RSP10
SD_RSP32
SD_RSP54
SD_RSP76
SD_DATA
SD_PSTATE
SD_HCTL
Present state
Host Control
SD_SYSCTL
SD_STAT
SD system control
Interrupt status
SD_IE
Interrupt SD enable
SD_ISE
SD_AC12
Auto CMD12 Error Status
Capabilities
SD_CAPA
SD_CUR_CAPA
Maximum current capabilities
(1) SD/SDIO registers are limited to 32-bit data accesses; 16-bit and 8-bit accesses are not allowed and can corrupt register content.
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Table 8-90. SD/SDIO Registers(1) (continued)
HEX ADDRESS
ACRONYM
SD_FE
REGISTER NAME
Force Event
0x4806 0250
0x4806 0254
0x4806 0258
0x4806 025C
0x4806 02FC
SD_ADMAES
SD_ADMASAL
SD_ADMASAH
SD_REV
ADMA Error Status
ADMA System address Low bits
ADMA System address High bits
Versions
8.16.2 SD/SDIO Electrical Data/Timing
Table 8-91. Timing Requirements for SD/SDIO
(see Figure 8-80, Figure 8-82)
NO.
MIN
4.1
1.9
4.1
1.9
MAX UNIT
1
2
3
4
tsu(CMDV-CLKH)
th(CLKH-CMDV)
tsu(DATV-CLKH)
th(CLKH-DATV)
Setup time, SD_CMD valid before SD_CLK rising clock edge
Hold time, SD_CMD valid after SD_CLK rising clock edge
Setup time, SD_DATx valid before SD_CLK rising clock edge
Hold time, SD_DATx valid after SD_CLK rising clock edge
ns
ns
ns
ns
Table 8-92. Switching Characteristics Over Recommended Operating Conditions for SD/SDIO
(see Figure 8-79, Figure 8-80, Figure 8-81, Figure 8-82)
NO.
PARAMETER
MIN
MAX UNIT
fop(CLK)
tc(CLK)
Operating frequency, SD_CLK
48
MHz
ns
7
Operating period: SD_CLK
20.8
fop(CLKID)
tc(CLKID)
tw(CLKL)
Identification mode frequency, SD_CLK
Identification mode period: SD_CLK
Pulse duration, SD_CLK low
400
kHz
ns
8
9
2500.0
0.5*P(1)
0.5*P(1)
ns
10 tw(CLKH)
11 tr(CLK)
Pulse duration, SD_CLK high
ns
Rise time, All Signals (10% to 90%)
Fall time, All Signals (10% to 90%)
Delay time, SD_CLK rising clock edge to SD_CMD transition
Delay time, SD_CLK rising clock edge to SD_DATx transition
2.2
2.2
ns
12 tf(CLK)
ns
13 td(CLKL-CMD)
14 td(CLKL-DAT)
2.5
2.5
13.9
13.9
ns
ns
(1) P = SD_CLK period.
10
7
9
SD_CLK
SD_CMD
13
13
13
Valid
13
START
XMIT
Valid
Valid
END
Figure 8-79. SD Host Command Timing
9
10
7
SD_CLK
1
2
Valid
START
XMIT
SD_CMD
Valid
Valid
END
Figure 8-80. SD Card Response Timing
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10
9
7
SD_CLK
14
14
D0
14
14
START
D1
Dx
END
SD_DATx
Figure 8-81. SD Host Write Timing
9
10
7
SD_CLK
4
4
3
3
Start
SD_DATx
D0
D1
Dx
End
Figure 8-82. SD Host Read and Card CRC Status Timing
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8.17 Serial ATA Controller (SATA)
The Serial ATA (SATA) peripheral provides a direct interface for up to two hard disk drives (SATA) and
supports the following features:
•
•
•
•
•
•
•
Serial ATA 1.5 Gbps and 3 Gbps speeds
Integrated PHY
Integrated Rx and Tx data buffers
Supports all SATA power management features
Hardware-assisted native command queuing (NCQ) for up to 32 entries
Supports port multiplier with command-based switching for connection to multiple hard disk drives
Activity LED support.
For more detailed information on the SATA, see the SATA chapter in the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
8.17.1 SATA Interface Design Specifications
This section provides PCB design and layout specifications for the SATA interface. The design rules
constrain PCB trace length, PCB trace skew, signal integrity, cross-talk, and signal timing. Simulation and
system design work has been done to ensure the SATA interface requirements are met.
A standard 100-MHz differential clock source must be used for SATA operation (for details, see
Section 7.3.2).
8.17.1.1 SATA Interface Schematic
Figure 8-83 shows the data portion of the SATA interface schematic. The specific pin numbers can be
obtained from Table 3-17, Serial ATA Terminal Functions.
SATA Interface (Processor)
SATA Connector
10 nF
SATA_TXN
TX-
SATA_TXP
TX+
10 nF
10 nF
SATA_RXN
SATA_RXP
RX-
RX+
10 nF
Figure 8-83. SATA Interface High-Level Schematic
8.17.1.2 Compatible SATA Components and Modes
Table 8-93 shows the compatible SATA components and supported modes. Note that the only supported
configuration is an internal cable from the processor host to the SATA device.
Table 8-93. SATA Supported Modes
PARAMETER
MIN
MAX
UNIT
SUPPORTED
Transfer Rates
eSATA
1.5
3.0
Gbps
-
-
-
-
-
-
-
-
-
-
-
-
No
No
xSATA
Backplane
Internal Cable
No
Yes
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8.17.1.3 PCB Stackup Specifications
Table 8-94 shows the PCB stackup and feature sizes required for SATA.
Table 8-94. SATA PCB Stackup Specifications
PARAMETER
MIN
TYP
6
MAX
UNIT
Layers
Layers
Cuts
PCB routing/plane layers
Signal routing layers
4
2
-
-
-
3
Number of ground plane cuts allowed within SATA routing region
Number of layers between SATA routing region and reference ground plane
PCB trace width, w
-
0
0
-
-
-
Layers
Mils
-
4
PCB BGA escape via pad size
-
20
10
0.3
-
Mils
PCB BGA escape via hole size
Processor BGA pad size(1)
-
Mils
mm
(1) NSMD pad, per IPC-7351A BGA pad size guideline.
8.17.1.4 Routing Specifications
The SATA data signal traces must be routed to achieve 100 Ω (±20%) differential impedance and 60 Ω
(±15%) single-ended impedance. The single-ended impedance is required because differential signals are
extremely difficult to closely couple on PCBs and, therefore, single-ended impedance becomes important.
60 Ω is chosen for the single-ended impedance to minimize problems caused by too low an impedance.
These impedances are impacted by trace width, trace spacing, distance to reference planes, and dielectric
material. Verify with a PCB design tool that the trace geometry for both data signal pairs results in as
close to 100 Ω differential impedance and 60 Ω single-ended impedance traces as possible. For best
accuracy, work with your PCB fabricator to ensure this impedance is met.
Table 8-95 shows the routing specifications for the SATA data signals.
Table 8-95. SATA Routing Specifications
PARAMETER
Processor-to-SATA header trace length
MIN
TYP
MAX
10(1) Inches
UNIT
Number of stubs allowed on SATA traces(2)
0
120
69
Stubs
Ω
TX/RX pair differential impedance
80
51
100
60
TX/RX single ended impedance
Ω
Number of vias on each SATA trace
SATA differential pair to any other trace spacing
3
Vias(3)
2*DS(4)
(1) Beyond this, signal integrity may suffer.
(2) In-line pads may be used for probing.
(3) Vias must be used in pairs with their distance minimized.
(4) DS = differential spacing of the SATA traces.
8.17.1.5 Coupling Capacitors
AC coupling capacitors are required on the receive data pair. Table 8-96 shows the requirements for these
capacitors.
Table 8-96. SATA AC Coupling Capacitors Requirements
PARAMETER
MIN
TYP
10
MAX
12
UNIT
nF
EIA(2)
SATA AC coupling capacitor value
SATA AC coupling capacitor package size(1)
1
0402
0603
(1) The physical size of the capacitor should be as small as practical. Use the same size on both lines in each pair, placed side by side.
(2) EIA LxW units; for example, a 0402 is a 40x20 mil surface-mount capacitor.
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8.17.2 SATA Peripheral Register Descriptions
Table 8-97. SATA Registers
HEX ADDRESS
0x4A14 0000
ACRONYM
REGISTER NAME
HBA Capabilities
CAP
GHC
0x4A14 0004
Global HBA Control
Interrupt Status
0x4A14 0008
IS
0x4A14 000C
0x4A14 0010
PI
Ports Implemented
AHCI Version
VS
0x4A14 0014
CCC_CTL
CCC_PORTS
-
Command Completion Coalescing Control
Command Completion Coalescing Ports
Reserved
0x4A14 0018
0x4A14 001C - 0x4A14 009C
0x4A14 00A0
0x4A14 00A4
0x4A14 00A8
0x4A14 00AC
0x4A14 00B0
0x4A14 00B4 - 0x4A14 00DF
0x4A14 00E0
0x4A14 00E4
0x4A14 00E8
0x4A14 00EC
0x4A14 00F0
0x4A14 00F4
0x4A14 00F8
0x4A14 00FC
0x4A14 0100
BISTAFR
BISTCR
BISTFCTR
BISTSR
BISTDECR
-
BIST Active FIS
BIST Control
BIST FIS Count
BIST Status
BIST DWORD Error Count
Reserved
TIMER1MS
-
BIST DWORD Error Count
Reserved
GPARAM1R
GPARAM2R
PPARAMR
TESTR
VERSIONR
IDR (PID)
P0CLB
-
Global Parameter 1
Global Parameter 2
Port Parameter
Test
Version
ID
Port 0 Command List Base Address
Reserved
0x4A14 0104
0x4A14 0108
P0FB
Port 0 FIS Base Address
Reserved
0x4A14 010C
0x4A14 0110
-
P0IS
Port 0 Interrupt Status
Port 0 Interrupt Enable
Port 0 Command
0x4A14 0114
P0IE
0x4A14 0118
P0CMD
-
0x4A14 011C
0x4A14 0120
Reserved
P0TFD
P0SIG
P0SSTS
P0SCTL
P0SERR
P0SACT
P0CI
Port 0 Task File Data
Port 0 Signature
0x4A14 0124
0x4A14 0128
Port 0 Serial ATA Status (SStatus)
Port 0 Serial ATA Control (SControl)
Port 0 Serial ATA Error (SError)
Port 0 Serial ATA Active (SActive)
Port 0 Command Issue
Port 0 Serial ATA Notification
Reserved
0x4A14 012C
0x4A14 0130
0x4A14 0134
0x4A14 0138
0x4A14 013C
0x4A14 0140 - 0x4A14 016C
0x4A14 0170
P0SNTF
-
P0DMACR
-
Port 0 DMA Control
Reserved
0x4A14 0174
0x4A14 0178
P0PHYCR
P0PHYSR
P1CLB
-
Port 0 PHY Control
Port 0 PHY Status
Port 1 Command List Base Address
Reserved
0x4A14 017C
0x4A14 0180
0x4A14 0184
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Table 8-97. SATA Registers (continued)
HEX ADDRESS
0x4A14 0188
ACRONYM
P1FB
REGISTER NAME
Port 1 FIS Base Address
Reserved
0x4A14 018C
0x4A14 0190
-
P1IS
Port 1 Interrupt Status
Port 1 Interrupt Enable
Port 1 Command
0x4A14 0194
P1IE
0x4A14 0198
P1CMD
-
0x4A14 019C
0x4A14 01A0
0x4A14 01A4
0x4A14 01A8
0x4A14 01AC
0x4A14 01B0
0x4A14 01B4
0x4A14 01B8
0x4A14 01BC
0x4A14 01C0 - 0x4A14 01EC
0x4A14 01F0
0x4A14 01F4
0x4A14 01F8
0x4A14 01FC
0x4A14 1100
Reserved
P1TFD
P1SIG
P1SSTS
P1SCTL
P1SERR
P1SACT
P1CI
Port 1 Task File Data
Port 1 Signature
Port 1 Serial ATA Status (SStatus)
Port 1 Serial ATA Control (SControl)
Port 1 Serial ATA Error (SError)
Port 1 Serial ATA Active (SActive)
Port 1 Command Issue
Port 1 Serial ATA Notification
Reserved
P1SNTF
-
P1DMACR
-
Port 1 DMA Control
Reserved
P1PHYCR
P1PHYSR
IDLE
Port 1 PHY Control
Port 1 PHY Status
Idle and Standby Modes
PHY Configuration 2
0x4A14 1104
PHYCFGR2
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8.18 Serial Peripheral Interface (SPI)
The SPI is a high-speed synchronous serial input/output port that allows a serial bit stream of programmed
length (4 to 32 bits) to be shifted into and out of the device at a programmed bit-transfer rate. The SPI is
normally used for communication between the device and external peripherals. Typical applications
include an interface-to-external I/O or peripheral expansion via devices such as shift registers, display
drivers, SPI EEPROMs, and analog-to-digital converters (ADCs).
The SPI supports the following features:
•
•
Master/slave operation
Four chip selects for interfacing/control to up to four SPI slave devices and connection to a single
external master
•
•
•
•
32-bit shift register
Buffered receive/transmit data register per channel (1 word deep), FIFO size is 64 bytes
Programmable SPI configuration per channel (clock definition, enable polarity and word width)
Supports one interrupt request and two DMA requests per channel.
For more detailed information on the SPI, see the SPI chapter in the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
8.18.1 SPI Peripheral Register Descriptions
Table 8-98. SPI Registers
HEX ADDRESS
0x4803 0000 - 0x4803 010C
0x4803 0110
0x4803 0114
0x4803 0118
0x4803 011C
0x4803 0120
0x4803 0124
0x4803 0128
0x4803 012C
0x4803 0130
0x4803 0134
0x4803 0138
0x4803 013C
0x4803 0140
0x4803 0144
0x4803 0148
0x4803 014C
0x4803 0150
0x4803 0154
0x4803 0158
0x4803 015C
0x4803 0160
0x4803 0164
0x4803 0168
0x4803 016C
0x4803 0170
0x4803 0174
0x4803 0178
ACRONYM
-
REGISTER NAME
RESERVED
MCSPI_SYSCONFIG
MCSPI_SYSSTATUS
MCSPI_IRQSTATUS
MCSPI_IRQENABLE
-
SYSTEM CONFIGURATION
SYSTEM STATUS
INTERRUPT STATUS
INTERRUPT ENABLE
RESERVED
MCSPI_SYST
SYSTEM TEST
MCSPI_MODULCTRL
MCSPI_CH0CONF
MCSPI_CH0STAT
MCSPI_CH0CTRL
MCSPI_TX0
MODULE CONTROL
CHANNEL 0 CONFIGURATION
CHANNEL 0 STATUS
CHANNEL 0 CONTROL
CHANNEL 0 TRANSMITTER
CHANNEL 0 RECEIVER
CHANNEL 1 CONFIGURATION
CHANNEL 1 STATUS
CHANNEL 1 CONTROL
CHANNEL 1 TRANSMITTER
CHANNEL 1 RECEIVER
CHANNEL 2 CONFIGURATION
CHANNEL 2 STATUS
CHANNEL 2 CONTROL
CHANNEL 2 TRANSMITTER
CHANNEL 2 RECEIVER
CHANNEL 3 CONFIGURATION
CHANNEL 3 STATUS
CHANNEL 3 CONTROL
CHANNEL 3 TRANSMITTER
CHANNEL 3 RECEIVER
MCSPI_RX0
MCSPI_CH1CONF
MCSPI_CH1STAT
MCSPI_CH1CTRL
MCSPI_TX1
MCSPI_RX1
MCSPI_CH2CONF
MCSPI_CH2STAT
MCSPI_CH2CTRL
MCSPI_TX2
MCSPI_RX2
MCSPI_CH3CONF
MCSPI_CH3STAT
MCSPI_CH3CTRL
MCSPI_TX3
MCSPI_RX3
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Table 8-98. SPI Registers (continued)
HEX ADDRESS
0x4803 017C
ACRONYM
REGISTER NAME
TRANSFER LEVELS
RESERVED
MCSPI_XFERLEVEL
-
0x4803 0180 - 0x4803 01FF
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8.18.2 SPI Electrical/Data Timing
Table 8-99. Timing Requirements for SPI - Master Mode
(see Figure 8-84 and Figure 8-85)
NO.
MIN
MAX UNIT
MASTER: 1 LOAD AT A MAXIMUM OF 5 pF
Cycle time, SPI_CLK(1)(2)
Pulse duration, SPI_CLK low(1)
1
2
3
4
5
6
7
tc(SPICLK)
20.8(3)
0.5*P - 1(4)
0.5*P - 1(4)
2.29
ns
ns
ns
ns
ns
tw(SPICLKL)
tw(SPICLKH)
Pulse duration, SPI_CLK high(1)
tsu(MISO-SPICLK)
th(SPICLK-MISO)
td(SPICLK-MOSI)
td(SCS-MOSI)
Setup time, SPI_D[x] valid before SPI_CLK active edge(1)
Hold time, SPI_D[x] valid after SPI_CLK active edge(1)
Delay time, SPI_CLK active edge to SPI_D[x] transition(1)
Delay time, SPI_SCS[x] active edge to SPI_D[x] transition
2.67
-3.57
3.57
3.57
ns
ns
ns
ns
ns
ns
MASTER_PHA0(5)
B-4.2(6)
A-4.2(7)
A-4.2(7)
B-4.2(6)
Delay time, SPI_SCS[x] active to SPI_CLK
first edge(1)
8
9
td(SCS-SPICLK)
MASTER_PHA1(5)
MASTER_PHA0(5)
MASTER_PHA1(5)
Delay time, SPI_CLK last edge to SPI_SCS[x]
inactive(1)
td(SPICLK-SCS)
MASTER: UP TO 4 LOADS AT A MAXIMUM TOTAL OF 25 pF
Cycle time, SPI_CLK(1)(2)
Pulse duration, SPI_CLK low(1)
1
2
3
4
5
6
7
tc(SPICLK)
41.7(8)
0.5*P - 2(4)
0.5*P - 2(4)
3.02
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tw(SPICLKL)
tw(SPICLKH)
Pulse duration, SPI_CLK high(1)
tsu(MISO-SPICLK)
th(SPICLK-MISO)
td(SPICLK-MOSI)
td(SCS-MOSI)
Setup time, SPI_D[x] valid before SPI_CLK active edge(1)
Hold time, SPI_D[x] valid after SPI_CLK active edge(1)
Delay time, SPI_CLK active edge to SPI_D[x] transition(1)
Delay time, SPI_SCS[x] active edge to SPI_D[x] transition
2.76
-4.62
4.62
4.62
MASTER_PHA0(5)
B-2.54(6)
A-2.54(7)
A-2.54(7)
B-2.54(6)
Delay time, SPI_SCS[x] active to SPI_CLK
first edge(1)
8
9
td(SCS-SPICLK)
MASTER_PHA1(5)
MASTER_PHA0(5)
MASTER_PHA1(5)
Delay time, SPI_CLK last edge to SPI_SCS[x]
inactive(1)
td(SPICLK-SCS)
(1) This timing applies to all configurations regardless of SPI_CLK polarity and which clock edges are used to drive output data and capture
input data.
(2) Related to the SPI_CLK maximum frequency.
(3) Maximum frequency = 48 MHz
(4) P = SPICLK period.
(5) SPI_CLK phase is programmable with the PHA bit of the SPI_CH(i)CONF register.
(6) B = (TCS + 0.5) * TSPICLKREF * Fratio, where TCS is a bit field of the SPI_CH(i)CONF register and Fratio = Even ≥2.
(7) When P = 20.8 ns, A = (TCS + 1) * TSPICLKREF, where TCS is a bit field of the SPI_CH(i)CONF register. When P > 20.8 ns, A = (TCS
+ 0.5) * Fratio * TSPICLKREF, where TCS is a bit field of the SPI_CH(i)CONF register.
(8) Maximum frequency = 24 MHz
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PHA=0
EPOL=1
SPI_SCS[x] (Out)
1
1
3
2
8
2
3
9
POL=0
SPI_SCLK (Out)
POL=1
SPI_SCLK (Out)
6
7
6
SPI_D[x] (Out)
Bit n-1
Bit n-2
Bit n-3
Bit n-4
Bit 0
PHA=1
EPOL=1
SPI_SCS[x] (Out)
1
3
2
8
2
3
9
POL=0
SPI_SCLK (Out)
1
POL=1
SPI_SCLK (Out)
6
6
6
6
SPI_D[x] (Out)
Bit n-1
Bit n-2
Bit n-3
Bit 1
Bit 0
Figure 8-84. SPI Master Mode Transmit Timing
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PHA=0
EPOL=1
SPI_SCS[x] (Out)
1
1
3
2
8
2
3
9
POL=0
POL=1
SPI_SCLK (Out)
SPI_SCLK (Out)
SPI_D[x] (In)
4
4
5
5
Bit n-1
Bit n-2
Bit n-3
Bit n-4
Bit 0
PHA=1
EPOL=1
SPI_SCS[x] (Out)
SPI_SCLK (Out)
1
2
1
3
3
2
8
9
POL=0
POL=1
SPI_SCLK (Out)
SPI_D[x] (In)
4
4
5
5
Bit n-1
Bit n-2
Bit n-3
Bit 1
Bit 0
Figure 8-85. SPI Master Mode Receive Timing
Table 8-100. Timing Requirements for SPI - Slave Mode
(see Figure 8-86 and Figure 8-87)
NO.
MIN
62.5(3)
0.5*P - 3(4)
0.5*P - 3(4)
12.92
MAX
UNIT
ns
1
2
3
4
5
6
tc(SPICLK)
Cycle time, SPI_CLK(1)(2)
Pulse duration, SPI_CLK low(1)
Pulse duration, SPI_CLK high(1)
Setup time, SPI_D[x] valid before SPI_CLK active edge(1)
Hold time, SPI_D[x] valid after SPI_CLK active edge(1)
Delay time, SPI_CLK active edge to SPI_D[x] transition(1)
tw(SPICLKL)
ns
tw(SPICLKH)
ns
tsu(MOSI-SPICLK)
th(SPICLK-MOSI)
td(SPICLK-MISO)
ns
12.92
ns
-4.00
17.1
17.1
ns
Delay time, SPI_SCS[x] active edge to SPI_D[x]
transition(5)
7
td(SCS-MISO)
ns
8
9
tsu(SCS-SPICLK)
th(SPICLK-SCS)
Setup time, SPI_SCS[x] valid before SPI_CLK first edge(1)
Hold time, SPI_SCS[x] valid after SPI_CLK last edge(1)
12.92
12.92
ns
ns
(1) This timing applies to all configurations regardless of SPI_CLK polarity and which clock edges are used to drive output data and capture
input data.
(2) Related to the input maximum frequency supported by the SPI module.
(3) Maximum frequency = 16 MHz
(4) P = SPICLK period.
(5) PHA = 0; SPI_CLK phase is programmable with the PHA bit of the SPI_CH(i)CONF register.
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PHA=0
EPOL=1
SPI_SCS[x] (In)
1
1
3
3
8
2
2
9
POL=0
SPI_SCLK (In)
POL=1
SPI_SCLK (In)
6
7
6
SPI_D[x] (Out)
Bit n-1
Bit n-2
Bit n-3
Bit n-4
Bit 0
PHA=1
EPOL=1
SPI_SCS[x] (In)
1
1
3
2
8
2
3
9
POL=0
SPI_SCLK (In)
POL=1
SPI_SCLK (In)
6
6
6
6
SPI_D[x] (Out)
Bit n-1
Bit n-2
Bit n-3
Bit 1
Bit 0
Figure 8-86. SPI Slave Mode Transmit Timing
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PHA=0
EPOL=1
SPI_SCS[x] (In)
1
1
3
3
8
2
2
9
POL=0
POL=1
SPI_SCLK (In)
SPI_SCLK (In)
SPI_D[x] (In)
4
4
5
5
Bit n-1
Bit n-2
Bit n-3
Bit n-4
Bit 0
PHA=1
EPOL=1
SPI_SCS[x] (In)
SPI_SCLK (In)
1
3
2
8
2
3
9
POL=0
POL=1
1
SPI_SCLK (In)
SPI_D[x] (In)
4
4
5
5
Bit n-1
Bit n-2
Bit n-3
Bit 1
Bit 0
Figure 8-87. SPI Slave Mode Receive Timing
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8.19 Timers
The device has seven 32-bit general-purpose (GP) timers that have the following features:
•
•
Timers 1-3 are for software use and do not have an external connection
Dedicated input trigger for capture mode and dedicated output trigger/pulse width modulation (PWM)
signal
•
•
•
Interrupts generated on overflow, compare, and capture
Free-running 32-bit upward counter
Supported modes:
–
–
–
Compare and capture modes
Auto-reload mode
Start-stop mode
•
Timer[7:1] functional clock is sourced from either the 27-MHz system clock, 32.768-kHz RTC clock or
the TCLKIN external timer input clock, as selected within the PRCM
•
•
On-the-fly read/write register (while counting)
Generates interrupts to the ARM CPUs.
The device has one system watchdog timer that has the following features:
•
•
•
•
Free-running 32-bit upward counter
On-the-fly read/write register (while counting)
Reset upon occurrence of a timer overflow condition
Two possible clock sources:
–
–
Internal 32.768-kHz clock derived from 27-MHz system clock.
External clock input on the CLKIN32 input pin.
The watchdog timer is used to provide a recovery mechanism for the device in the event of a fault
condition, such as a non-exiting code loop.
For more detailed information, see the Timers chapter in the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7).
8.19.1 Timer Peripheral Register Descriptions
Table 8-101. Timer1-7 Registers(1)
TIMER1 HEX
ADDRESS
TIMER2 HEX
ADDRESS
TIMER3 HEX
ADDRESS
TIMER4 HEX
ADDRESS
TIMER5 HEX
ADDRESS
TIMER6 HEX
ADDRESS
TIMER7 HEX
ADDRESS
ACRONYM
REGISTER NAME
0x4802 E000
0x4802 E010
0x4804 0000
0x4804 0010
0x4804 2000
0x4804 2010
0x4804 4000
0x4804 4010
0x4804 6000
0x4804 6010
0x4804 8000
0x4804 8010
0x4804 A000
0x4804 A010
TIDR
Identification
TIOCP_CFG Timer OCP
Configuration
0x4802 E020
0x4802 E024
0x4804 0020
0x4804 0024
0x4804 2020
0x4804 2024
0x4804 4020
0x4804 4024
0x4804 6020
0x4804 6024
0x4804 8020
0x4804 8024
0x4804 A020
0x4804 A024
0x4804 A028
IRQ_EOI
Timer IRQ End-Of-
Interrupt
IRQSTATUS_ Timer IRQSTATUS
RAW Raw
0x4802 E028
0x4802 E02C
0x4804 0028
0x4804 002C
0x4804 2028
0x4804 202C
0x4804 4028
0x4804 402C
0x4804 6028
0x4804 602C
0x4804 8028
0x4804 802C
IRQSTATUS Timer IRQSTATUS
0x4804 A02C IRQSTATUS_ Timer IRQENABLE
SET Set
0x4802 E030
0x4802 E034
0x4804 0030
0x4804 0034
0x4804 2030
0x4804 2034
0x4804 4030
0x4804 4034
0x4804 6030
0x4804 6034
0x4804 8030
0x4804 8034
0x4804 A030
IRQSTATUS_ Timer IRQENABLE
CLR Clear
0x4804 A034
IRQWAKEEN Timer IRQ Wakeup
Enable
0x4802 E038
0x4802 E03C
0x4802 E040
0x4802 E044
0x4804 0038
0x4804 003C
0x4804 0040
0x4804 0044
0x4804 2038
0x4804 203C
0x4804 2040
0x4804 2044
0x4804 4038
0x4804 403C
0x4804 4040
0x4804 4044
0x4804 6038
0x4804 603C
0x4804 6040
0x4804 6044
0x4804 8038
0x4804 803C
0x4804 8040
0x4804 8044
0x4804 A038
0x4804 A03C
0x4804 A040
0x4804 A044
TCLR
TCRR
TLDR
TTGR
Timer Control
Timer Counter
Timer Load
Timer Trigger
(1) All Timer registers are: 32-bit register accessible in 16-bit mode and use little-endian addressing.
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Table 8-101. Timer1-7 Registers(1) (continued)
TIMER1 HEX
ADDRESS
TIMER2 HEX
ADDRESS
TIMER3 HEX
ADDRESS
TIMER4 HEX
ADDRESS
TIMER5 HEX
ADDRESS
TIMER6 HEX
ADDRESS
TIMER7 HEX
ADDRESS
ACRONYM
REGISTER NAME
0x4802 E048
0x4804 0048
0x4804 2048
0x4804 4048
0x4804 6048
0x4804 8048
0x4804 A048
TWPS
Timer Write Posted
Status
0x4802 E04C
0x4802 E050
0x4802 E054
0x4804 004C
0x4804 0050
0x4804 0054
0x4804 204C
0x4804 2050
0x4804 2054
0x4804 404C
0x4804 4050
0x4804 4054
0x4804 604C
0x4804 6050
0x4804 6054
0x4804 804C
0x4804 8050
0x4804 8054
0x4804 A04C
0x4804 A050
0x4804 A054
TMAR
TCAR1
TSICR
Timer Match
Timer Capture
Timer Synchronous
Interface Control
0x4802 E058
0x4804 0058
0x4804 2058
0x4804 4058
0x4804 6058
0x4804 8058
0x4804 A058
TCAR2
Timer Capture
Table 8-102. Watchdog Timer Registers
HEX ADDRESS
0x480C 2000
0x480C 2010
0x480C 2014
0x480C 2018
0x480C 201C
0x480C 2020
0x480C 2024
0x480C 2028
0x480C 202C
0x480C 2030
0x480C 2034
0x480C 2044
0x480C 2048
0x480C 2050
0x480C 2054
0x480C 2058
0x480C 205C
0x480C 2060
0x480C 2064
ACRONYM
WIDR
REGISTER NAME
IP Revision Identifier
OCP interface parameters
Status information
WDSC
WDST
WISR
Interrupt events pending
Interrupt events control
Wakeup events control
Counter prescaler control
Internal counter value
Timer load value
WIER
WWER
WCLR
WCRR
WLDR
WTGR
Watchdog counter reload
Write posting bits
WWPS
WDLY
Event detection delay value
Start-stop value
WSPR
WIRQEOI
WIRQSTATRAW
WIRQSTAT
WIRQENSET
WIRQENCLR
WIRQWAKEEN
Software End Of Interrupt
IRQ unmasked status
IRQ masked status
IRQ enable
IRQ enable clear
IRQ wakeup events control
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8.19.2 Timer Electrical/Data Timing
Table 8-103. Timing Requirements for Timer
(see Figure 8-88)
NO.
MIN
4P(1)
4P(1)
MAX UNIT
1
2
tw(EVTIH)
tw(EVTIL)
Pulse duration, high
Pulse duration, low
ns
ns
(1) P = module clock.
Table 8-104. Switching Characteristics Over Recommended Operating Conditions for Timer
(see Figure 8-88)
NO.
3
PARAMETER
Pulse duration, high
MIN
4P-3(1)
4P-3(1)
MAX UNIT
tw(EVTOH)
tw(EVTOL)
ns
ns
4
Pulse duration, low
(1) P = module clock.
1
2
TCLKIN
3
4
TIMx_OUT
Figure 8-88. Timer Timing
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8.20 Universal Asynchronous Receiver/Transmitter (UART)
The UART performs serial-to-parallel conversions on data received from a peripheral device and parallel-
to-serial conversion on data received from the CPU. The device provides up to three UART peripheral
interfaces, depending on the selected pin multiplexing.
Each UART has the following features:
•
•
•
Selectable UART/IrDA (SIR/MIR)/CIR modes
Dual 64-entry FIFOs for received and transmitted data payload
Programmable and selectable transmit and receive FIFO trigger levels for DMA and interrupt
generation
•
•
•
Baud-rate generation based upon programmable divisors N (N=1…16384)
Two DMA requests and one interrupt request to the system
Can connect to any RS-232 compliant device.
UART functions include:
•
•
Baud-rate up to 3.6 Mbit/s
Programmable serial interfaces characteristics
–
–
–
–
5, 6, 7, or 8-bit characters
Even, odd, or no parity-bit generation and detection
1, 1.5, or 2 stop-bit generation
Flow control: hardware (RTS/CTS) or software (XON/XOFF)
•
Additional modem control functions (UART0_DTR, UART0_DSR, UART0_DCD, and UART0_RIN) for
UART0 only; UART1 and UART2 do not support full-flow control signaling.
IR-IrDA functions include:
•
•
•
Support of IrDA 1.4 slow infrared (SIR, baud-rate up to 115.2 Kbits/s), medium infrared (MIR, baud-
rate up to 1.152 Mbits/s) and fast infrared (FIR baud-rate up to 4.0 Mbits/s) communications
Supports framing error, cyclic redundancy check (CRC) error, illegal symbol (FIR), and abort pattern
(SIR, MIR) detection
8-entry status FIFO (with selectable trigger levels) available to monitor frame length and frame errors.
IR-CIR functions include:
•
•
•
Consumer infrared (CIR) remote control mode with programmable data encoding
Free data format (supports any remote control private standards)
Selectable bit rate and configurable carrier frequency.
For more detailed information on the UART peripheral, see the UART chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
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8.20.1 UART Peripheral Register Descriptions
Table 8-105 lists the UART register name summary. Table 8-106 shows the UART registers along with
their configuration requirements.
Table 8-105. UART Register Summary
ACRONYM
RHR
REGISTER NAME
Receive Holding
Transmit Holding
Interrupt Enable
ACRONYM
RXFLH
BLR
REGISTER NAME
Receive Frame Length High
BOF Control
THR
IER
ACREG
SCR
Auxilliary Control
IIR
Interrupt Identification
FIFO Control
Supplementary Control
Supplementary Status
BOF Length
FCR
SSR
LCR
Line Control
EBLR
MVR
MCR
Modem Control
Module Version
LSR
Line Status
SYSC
SYSS
WER
System Configuration
System Status
MSR
Modem Status
SPR
Scratchpad
Wake-up Enable
TCR
Transmission Control
Trigger Level
CFPS
DLL
Carrier Frequency Prescaler
Divisor Latch Low
TLR
MDR1
MDR2
SFLSR
RESUME
SFREGL
SFREGH
TXFLL
TXFLH
RXFLL
Mode Definition 1
Mode Definition 2
Status FIFO Line Status
Resume
DLH
Divisor Latch High
UART Autobauding Status
Enhanced Feature
UART XON1 Character
UART XON2 Character
UART XOFF1 Character
UART XOFF2 Character
IrDA Address 1
UASR
EFR
XON1
XON2
XOFF1
XOFF2
ADDR1
ADDR2
Status FIFO Low
Status FIFO High
Transmit Frame Length Low
Transmit Frame Length High
Receive Frame Length Low
IrDA Address 2
Table 8-106. UART Registers Configuration Requirements(1)(2)(3)
REGISTER
UART0 HEX
ADDRESS
UART1 HEX
ADDRESS
UART2 HEX
ADDRESS
LCR[7] = 1 and LCR[7:0]
LCR[7] = 0
LCR[7:0] = 0xBF
≠ 0xBF
READ
WRITE
THR
IER
READ
DLL
WRITE
DLL
READ
DLL
WRITE
0x4802 0000
0x4802 0004
0x4802 0008
0x4802 000C
0x4802 0010
0x4802 2000
0x4802 2004
0x4802 2008
0x4802 200C
0x4802 2010
0x4802 4000
0x4802 4004
0x4802 4008
0x4802 400C
0x4802 4010
RHR
IER
DLL
DLH
EFR
LCR
DLH
IIR
DLH
DLH
EFR
LCR
IIR
FCR
LCR
FCR
LCR
LCR
MCR
LCR
MCR
MCR
MCR
XON1/
XON1/
ADDR1
ADDR1
0x4802 0014
0x4802 0018
0x4802 001C
0x4802 2014
0x4802 2018
0x4802 201C
0x4802 4014
0x4802 4018
0x4802 401C
LSR
-
LSR
-
XON2/
ADDR2
XON2/
ADDR2
MSR/TCR
SPR/TLR
TCR
MSR/TCR
SPR/TLR
TCR
XOFF1/
TCR
XOFF1/
TCR
SPR/TLR
SPR/TLR
XOFF2/
TLR
XOFF2/
TLR
0x4802 0020
0x4802 0024
0x4802 0028
0x4802 2020
0x4802 2024
0x4802 2028
0x4802 4020
0x4802 4024
0x4802 4028
MDR1
MDR2
SFLSR
MDR1
MDR2
TXFLL
MDR1
MDR2
SFLSR
MDR1
MDR2
TXFLL
MDR1
MDR2
SFLSR
MDR1
MDR2
TXFLL
(1) The transmission control register (TCR) and the trigger level register (TLR) are accessible only when EFR[4]=1 and MCR[6]=1.
(2) MCR[7:5] and FCR[5:4] can only be written when EFR[4]=1.
(3) In UART modes, IER[7:4] can only be written when EFR[4]=1. In IrDA/CIR modes, EFR[4] has no impact on the access to IER[7:4].
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Table 8-106. UART Registers Configuration Requirements(1)(2)(3) (continued)
REGISTER
UART0 HEX
ADDRESS
UART1 HEX
ADDRESS
UART2 HEX
ADDRESS
LCR[7] = 1 and LCR[7:0]
LCR[7] = 0
READ
LCR[7:0] = 0xBF
≠ 0xBF
WRITE
TXFLH
RXFLL
RXFLH
BLR
READ
RESUME
SFREGL
SFREGH
UASR
-
WRITE
READ
RESUME
SFREGL
SFREGH
UASR
-
WRITE
0x4802 002C
0x4802 0030
0x4802 0034
0x4802 0038
0x4802 003C
0x4802 0040
0x4802 0044
0x4802 0048
0x4802 004C
0x4802 0050
0x4802 0054
0x4802 0058
0x4802 005C
0x4802 0060
0x4802 202C
0x4802 2030
0x4802 2034
0x4802 2038
0x4802 203C
0x4802 2040
0x4802 2044
0x4802 2048
0x4802 204C
0x4802 2050
0x4802 2054
0x4802 2058
0x4802 205C
0x4802 2060
0x4802 402C
0x4802 4030
0x4802 4034
0x4802 4038
0x4802 403C
0x4802 4040
0x4802 4044
0x4802 4048
0x4802 404C
0x4802 4050
0x4802 4054
0x4802 4058
0x4802 405C
0x4802 4060
RESUME
SFREGL
SFREGH
BLR
TXFLH
TXFLH
RXFLL
RXFLL
RXFLH
RXFLH
-
-
ACREG
SCR
ACREG
SCR
-
-
SCR
SSR
SCR
SCR
SSR
SCR
SSR
SSR[2]
EBLR
-
SSR[2]
SSR[2]
EBLR
-
-
-
-
-
-
-
-
-
-
-
MVR
-
MVR
SYSC
SYSS
WER
CFPS
-
MVR
SYSC
SYSS
WER
CFPS
-
SYSC
SYSS
WER
CFPS
-
SYSC
SYSC
SYSC
WER
CFPS
-
WER
CFPS
-
WER
CFPS
-
0x4802 0064 -
0x4802 00C4
0x4802 2064 -
0x4802 20C4
0x4802 4064 -
0x4802 40C4
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8.20.2 UART Electrical/Data Timing
Table 8-107. Timing Requirements for UART
(see Figure 8-89)
NO.
MIN
0.96U(1)
0.96U(1)
P(2)
MAX UNIT
4
5
tw(RX)
Pulse width, receive data bit, 15/30/100pF high or low
Pulse width, receive start bit, 15/30/100pF high or low
Delay time, transmit start bit to transmit data
1.05U(1)
1.05U(1)
ns
ns
ns
ns
tw(CTS)
td(RTS-TX)
td(CTS-TX)
Delay time, receive start bit to transmit data
P(2)
(1) U = UART baud time = 1/programmed baud rate
(2) P = clock period of the reference clock (FCLK, usually 48 MHz).
Table 8-108. Switching Characteristics Over Recommended Operating Conditions for UART
(see Figure 8-89)
NO.
PARAMETER
MIN
MAX UNIT
15 pF
30 pF
100 pF
5
f(baud)
Maximum programmable baud rate
0.23
0.115
MHz
2
3
tw(TX)
Pulse width, transmit data bit, 15/30/100 pF high or low
Pulse width, transmit start bit, 15/30/100 pF high or low
U - 2(1)
U - 2(1)
U + 2(1)
U + 2(1)
ns
ns
tw(RTS)
(1) U = UART baud time = 1/programmed baud rate
3
2
Start
Bit
UARTx_TXD
Data Bits
5
4
Start
Bit
UARTx_RXD
Data Bits
Figure 8-89. UART Timing
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SPRS681E –OCTOBER 2010–REVISED JULY 2012
8.21 Universal Serial Bus (USB2.0)
The device includes two USB2.0 modules which support the Universal Serial Bus Specification Revision
2.0. The following are some of the major USB features that are supported:
•
•
•
USB 2.0 peripheral at high speed (HS: 480 Mbps) and full speed (FS: 12 Mbps)
USB 2.0 host at HS, FS, and low speed (LS: 1.5 Mbps)
Each endpoint (other than endpoint 0, control only) can support all transfer modes (control, bulk,
interrupt, and isochronous)
•
•
•
•
•
Supports high-bandwidth ISO mode
Supports 16 Transmit (TX) and 16 Receive (RX) endpoints including endpoint 0
FIFO RAM - 32K endpoint - Programmable size
Includes two integrated PHYs; requires a low-jitter 24-MHz source clock for its PLL
RNDIS-like mode for terminating RNDIS-type protocols without using short-packet termination for
support of MSC applications.
The USB2.0 modules do not support the following features:
•
•
•
On-chip charge pump (VBUS power must be generated external to the device)
RNDIS mode acceleration for USB sizes that are not multiples of 64 bytes
Endpoint max USB packet sizes that do not conform to the USB2.0 spec (for FS/LS: 8, 16, 32, 64, and
1023 are defined; for HS: 64, 128, 512, and 1024 are defined).
For more detailed information on the USB2.0 peripheral, see the USB2.0 chapter in the AM389x Sitara
ARM Processors Technical Reference Manual (literature number SPRUGX7). For detailed information on
USB board design and layout guidelines, see the USB 2.0 Board Design and Layout Guidelines
application report (literature number SPRAAR7)
8.21.1 USB2.0 Peripheral Register Descriptions
Table 8-109. USB2.0 Submodules
SUBMODULE
SUBMODULE NAME
ADDRESS OFFSET
0x0000
0x1000
0x1800
0x2000
0x3000
0x4000
USBSS registers
USB0 controller registers
USB1 controller registers
CPPI DMA controller registers
CPPI DMA scheduler registers
CPPI DMA Queue Manager registers
Table 8-110. USB Subsystem (USBSS) Registers(1)
HEX ADDRESS
0x4740 0000
ACRONYM
REVREG
-
REGISTER NAME
USBSS REVISION
Reserved
0x4740 0004 - 0x4740 000C
0x4740 0010
SYSCONFIG
-
USBSS SYSCONFIG
Reserved
0x4740 0014 - 0x4740 001C
0x4740 0020
EOI
USBSS IRQ_EOI
0x4740 0024
IRQSTATRAW
IRQSTAT
IRQENABLER
IRQCLEARR
USBSS IRQ_STATUS_RAW
USBSS IRQ_STATUS
USBSS IRQ_ENABLE_SET
USBSS IRQ_ENABLE_CLR
0x4740 0028
0x4740 002C
0x4740 0030
(1) USBSS registers contain the registers that are used to control at the global level and apply to all submodules.
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Table 8-110. USB Subsystem (USBSS) Registers(1) (continued)
HEX ADDRESS
0x4740 0034 - 0x4740 00FC
0x4740 0100
ACRONYM
REGISTER NAME
-
Reserved
IRQDMATHOLDTX00
IRQDMATHOLDTX01
IRQDMATHOLDTX02
IRQDMATHOLDTX03
IRQDMATHOLDRX00
IRQDMATHOLDRX01
IRQDMATHOLDRX02
IRQDMATHOLDRX03
IRQDMATHOLDTX10
IRQDMATHOLDTX11
IRQDMATHOLDTX12
IRQDMATHOLDTX13
IRQDMATHOLDRX10
IRQDMATHOLDRX11
IRQDMATHOLDRX12
IRQDMATHOLDRX13
IRQDMAENABLE0
USBSS IRQ_DMA_THRESHOLD_TX0_0
USBSS IRQ_DMA_THRESHOLD_TX0_1
USBSS IRQ_DMA_THRESHOLD_TX0_2
USBSS IRQ_DMA_THRESHOLD_TX0_3
USBSS IRQ_DMA_THRESHOLD_RX0_0
USBSS IRQ_DMA_THRESHOLD_RX0_1
USBSS IRQ_DMA_THRESHOLD_RX0_2
USBSS IRQ_DMA_THRESHOLD_RX0_3
USBSS IRQ_DMA_THRESHOLD_TX1_0
USBSS IRQ_DMA_THRESHOLD_TX1_1
USBSS IRQ_DMA_THRESHOLD_TX1_2
USBSS IRQ_DMA_THRESHOLD_TX1_3
USBSS IRQ_DMA_THRESHOLD_RX1_0
USBSS IRQ_DMA_THRESHOLD_RX1_1
USBSS IRQ_DMA_THRESHOLD_RX1_2
USBSS IRQ_DMA_THRESHOLD_RX1_3
USBSS IRQ_DMA_ENABLE_0
0x4740 0104
0x4740 0108
0x4740 010C
0x4740 0110
0x4740 0114
0x4740 0118
0x4740 011C
0x4740 0120
0x4740 0124
0x4740 0128
0x4740 012C
0x4740 0130
0x4740 0134
0x4740 0138
0x4740 013C
0x4740 0140
0x4740 0144
IRQDMAENABLE1
USBSS IRQ_DMA_ENABLE_1
0x4740 0148 - 0x4740 01FC
0x4740 0200
-
Reserved
IRQFRAMETHOLDTX00
IRQFRAMETHOLDTX01
IRQFRAMETHOLDTX02
IRQFRAMETHOLDTX03
IRQFRAMETHOLDRX00
IRQFRAMETHOLDRX01
IRQFRAMETHOLDRX02
IRQFRAMETHOLDRX03
IRQFRAMETHOLDTX10
IRQFRAMETHOLDTX11
IRQFRAMETHOLDTX12
IRQFRAMETHOLDTX13
IRQFRAMETHOLDRX10
IRQFRAMETHOLDRX11
IRQFRAMETHOLDRX12
IRQFRAMETHOLDRX13
IRQFRAMEENABLE0
IRQFRAMEENABLE1
-
USBSS IRQ_FRAME_THRESHOLD_TX0_0
USBSS IRQ_FRAME_THRESHOLD_TX0_1
USBSS IRQ_FRAME_THRESHOLD_TX0_2
USBSS IRQ_FRAME_THRESHOLD_TX0_3
USBSS IRQ_FRAME_THRESHOLD_RX0_0
USBSS IRQ_FRAME_THRESHOLD_RX0_1
USBSS IRQ_FRAME_THRESHOLD_RX0_2
USBSS IRQ_FRAME_THRESHOLD_RX0_3
USBSS IRQ_FRAME_THRESHOLD_TX1_0
USBSS IRQ_FRAME_THRESHOLD_TX1_1
USBSS IRQ_FRAME_THRESHOLD_TX1_2
USBSS IRQ_FRAME_THRESHOLD_TX1_3
USBSS IRQ_FRAME_THRESHOLD_RX1_0
USBSS IRQ_FRAME_THRESHOLD_RX1_1
USBSS IRQ_FRAME_THRESHOLD_RX1_2
USBSS IRQ_FRAME_THRESHOLD_RX1_3
USBSS IRQ_FRAME_ENABLE_0
0x4740 0204
0x4740 0208
0x4740 020C
0x4740 0210
0x4740 0214
0x4740 0218
0x4740 021C
0x4740 0220
0x4740 0224
0x4740 0228
0x4740 022C
0x4740 0230
0x4740 0234
0x4740 0238
0x4740 023C
0x4740 0240
0x4740 0244
USBSS IRQ_FRAME_ENABLE_1
0x4740 0248 - 0x4740 0FFC
Reserved
Table 8-111. USB0 Controller Registers
HEX ADDRESS
0x4740 1000
ACRONYM
USB0REV
-
REGISTER NAME
USB0 REVISION
Reserved
0x4740 1004 - 0x4740 1010
0x4740 1014
USB0CTRL
USB0STAT
-
USB0 Control
USB0 Status
Reserved
0x4740 1018
0x4740 101C
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Table 8-111. USB0 Controller Registers (continued)
HEX ADDRESS
0x4740 1020
0x4740 1024
0x4740 1028
0x4740 102C
0x4740 1030
0x4740 1034
0x4740 1038
0x4740 103C
0x4740 1040
0x4740 1044
ACRONYM
USB0IRQMSTAT
USB0IRQEOI
REGISTER NAME
USB0 IRQ_MERGED_STATUS
USB0 IRQ_EOI
USB0IRQSTATRAW0
USB0IRQSTATRAW1
USB0IRQSTAT0
USB0IRQSTAT1
USB0IRQENABLESET0
USB0IRQENABLESET1
USB0IRQENABLECLR0
USB0IRQENABLECLR1
-
USB0 IRQ_STATUS_RAW_0
USB0 IRQ_STATUS_RAW_1
USB0 IRQ_STATUS_0
USB0 IRQ_STATUS_1
USB0 IRQ_ENABLE_SET_0
USB0 IRQ_ENABLE_SET_1
USB0 IRQ_ENABLE_CLR_0
USB0 IRQ_ENABLE_CLR_1
Reserved
0x4740 1048 - 0x4740 106C
0x4740 1070
USB0TXMODE
USB0RXMODE
-
USB0 Tx Mode
0x4740 1074
USB0 Rx Mode
0x4740 1078 - 0x4740 107C
0x4740 1080
Reserved
USB0GENRNDISEP1
USB0GENRNDISEP2
USB0GENRNDISEP3
USB0GENRNDISEP4
USB0GENRNDISEP5
USB0GENRNDISEP6
USB0GENRNDISEP7
USB0GENRNDISEP8
USB0GENRNDISEP9
USB0GENRNDISEP10
USB0GENRNDISEP11
USB0GENRNDISEP12
USB0GENRNDISEP13
USB0GENRNDISEP14
USB0GENRNDISEP15
-
USB0 Generic RNDIS Size EP1
USB0 Generic RNDIS Size EP2
USB0 Generic RNDIS Size EP3
USB0 Generic RNDIS Size EP4
USB0 Generic RNDIS Size EP5
USB0 Generic RNDIS Size EP6
USB0 Generic RNDIS Size EP7
USB0 Generic RNDIS Size EP8
USB0 Generic RNDIS Size EP9
USB0 Generic RNDIS Size EP10
USB0 Generic RNDIS Size EP11
USB0 Generic RNDIS Size EP12
USB0 Generic RNDIS Size EP13
USB0 Generic RNDIS Size EP14
USB0 Generic RNDIS Size EP15
Reserved
0x4740 1084
0x4740 1088
0x4740 108C
0x4740 1090
0x4740 1094
0x4740 1098
0x4740 109C
0x4740 10A0
0x4740 10A4
0x4740 10A8
0x4740 10AC
0x4740 10B0
0x4740 10B4
0x4740 10B8
0x4740 10BC - 0x4740 10CC
0x4740 10D0
USB0AUTOREQ
USB0SRPFIXTIME
USB0TDOWN
USB0 Auto Req
0x4740 10D4
USB0 SRP Fix Time
0x4740 10D8
USB0 Teardown
0x4740 10DC
-
Reserved
0x4740 10E0
USB0UTMI
USB0 PHY UTMI
0x4740 10E4
USB0UTMILB
USB0 MGC UTMI Loopback
USB0 Mode
0x4740 10E8
USB0MODE
0x4740 10E8 - 0x4740 13FF
0x4740 1400 - 0x4740 159C
0x4740 15A0 - 0x4740 17FC
-
Reserved
-
USB0 Mentor Core Registers
Reserved
-
Table 8-112. USB1 Controller Registers
HEX ADDRESS
0x4740 1800
ACRONYM
USB1REV
-
REGISTER NAME
USB1 Revision
Reserved
0x4740 1804 - 0x4740 1810
0x4740 1814
USB1CTRL
USB1STAT
USB1 Control
USB1 Status
0x4740 1818
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Table 8-112. USB1 Controller Registers (continued)
HEX ADDRESS
0x4740 181C
ACRONYM
-
REGISTER NAME
Reserved
0x4740 1820
USB1IRQMSTAT
USB1IRQEOI
USB1 IRQ_MERGED_STATUS
USB1 IRQ_EOI
0x4740 1824
0x4740 1828
USB1IRQSTATRAW0
USB1IRQSTATRAW1
USB1IRQSTAT0
USB1IRQSTAT1
USB1IRQENABLESET0
USB1IRQENABLESET1
USB1IRQENABLECLR0
USB1IRQENABLECLR1
-
USB1 IRQ_STATUS_RAW_0
USB1 IRQ_STATUS_RAW_1
USB1 IRQ_STATUS_0
USB1 IRQ_STATUS_1
USB1 IRQ_ENABLE_SET_0
USB1 IRQ_ENABLE_SET_1
USB1 IRQ_ENABLE_CLR_0
USB1 IRQ_ENABLE_CLR_1
Reserved
0x4740 182C
0x4740 1830
0x4740 1834
0x4740 1838
0x4740 183C
0x4740 1840
0x4740 1844
0x4740 1848 - 0x4740 186C
0x4740 1870
USB1TXMODE
USB1RXMODE
-
USB1 Tx Mode
0x4740 1874
USB1 Rx Mode
0x4740 1878 - 0x4740 187C
0x4740 1880
Reserved
USB1GENRNDISEP1
USB1GENRNDISEP2
USB1GENRNDISEP3
USB1GENRNDISEP4
USB1GENRNDISEP5
USB1GENRNDISEP6
USB1GENRNDISEP7
USB1GENRNDISEP8
USB1GENRNDISEP9
USB1GENRNDISEP10
USB1GENRNDISEP11
USB1GENRNDISEP12
USB1GENRNDISEP13
USB1GENRNDISEP14
USB1GENRNDISEP15
-
USB1 Generic RNDIS Size EP1
USB1 Generic RNDIS Size EP2
USB1 Generic RNDIS Size EP3
USB1 Generic RNDIS Size EP4
USB1 Generic RNDIS Size EP5
USB1 Generic RNDIS Size EP6
USB1 Generic RNDIS Size EP7
USB1 Generic RNDIS Size EP8
USB1 Generic RNDIS Size EP9
USB1 Generic RNDIS Size EP10
USB1 Generic RNDIS Size EP11
USB1 Generic RNDIS Size EP12
USB1 Generic RNDIS Size EP13
USB1 Generic RNDIS Size EP14
USB1 Generic RNDIS Size EP15
Reserved
0x4740 1884
0x4740 1888
0x4740 188C
0x4740 1890
0x4740 1894
0x4740 1898
0x4740 189C
0x4740 18A0
0x4740 18A4
0x4740 18A8
0x4740 18AC
0x4740 18B0
0x4740 18B4
0x4740 18B8
0x4740 18BC - 0x4740 18CC
0x4740 18D0
USB1AUTOREQ
USB1SRPFIXTIME
USB1TDOWN
USB1 Auto Req
0x4740 18D4
USB1 SRP Fix Time
0x4740 18D8
USB1 Teardown
0x4740 18DC
-
Reserved
0x4740 18E0
USB1UTMI
USB1 PHY UTMI
0x4740 18E4
USB1UTMILB
USB1 MGC UTMI Loopback
USB1 Mode
0x4740 18E8
USB1MODE
0x4740 18E8 - 0x4740 1BFF
0x4740 1C00 - 0x4740 1D9C
0x4740 1DA0 - 0x4740 1FFC
-
Reserved
-
USB1 Mentor Core Registers
Reserved
-
Table 8-113. CPPI DMA Controller Registers
HEX ADDRESS
0x4740 2000
0x4740 2004
0x4740 2008
ACRONYM
DMAREVID
TDFDQ
REGISTER NAME
Revision
Teardown Free Descriptor Queue Control
Emulation Control
DMAEMU
298
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Table 8-113. CPPI DMA Controller Registers (continued)
HEX ADDRESS
0x4740 2010
0x4740 2014
ACRONYM
REGISTER NAME
DMAMEM1BA
CPPI Mem1 Base Address
CPPI Mem1 Mask Address
Reserved
DMAMEM1MASK
0x4740 200C - 0x4740 27FF
0x4740 2800
-
TXGCR0
Tx Channel 0 Global Configuration
Reserved
0x4740 2804
-
RXGCR0
RXHPCRA0
RXHPCRB0
-
0x4740 2808
Rx Channel 0 Global Configuration
Rx Channel 0 Host Packet Configuration A
Rx Channel 0 Host Packet Configuration B
Reserved
0x4740 280C
0x4740 2810
0x4740 2814 - 0x4740 281C
0x4740 2820
TXGCR1
-
Tx Channel 1 Global Configuration
Reserved
0x4740 2824
0x4740 2828
RXGCR1
RXHPCRA1
RXHPCRB1
-
Rx Channel 1 Global Configuration
Rx Channel 1 Host Packet Configuration A
Rx Channel 1 Host Packet Configuration B
Reserved
0x4740 282C
0x4740 2830
0x4740 2834 - 0x4740 283C
0x4740 2840
TXGCR2
-
Tx Channel 2 Global Configuration
Reserved
0x4740 2844
0x4740 2848
RXGCR2
RXHPCRA2
RXHPCRB2
-
Rx Channel 2 Global Configuration
Rx Channel 2 Host Packet Configuration A
Rx Channel 2 Host Packet Configuration B
Reserved
0x4740 284C
0x4740 2850
0x4740 2854 - 0x4740 285F
0x4740 2860
TXGCR3
-
Tx Channel 3 Global Configuration
Reserved
0x4740 2864
0x4740 2868
RXGCR3
RXHPCRA3
RXHPCRB3
-
Rx Channel 3 Global Configuration
Rx Channel 3 Host Packet Configuration A
Rx Channel 3 Host Packet Configuration B
...
0x4740 286C
0x4740 2870
0x4740 2880 - 0x4740 2B9F
0x4740 2BA0
TXGCR29
-
Tx Channel 29 Global Configuration
Reserved
0x4740 2BA4
0x4740 2BA8
RXGCR29
RXHPCRA29
RXHPCRB29
-
Rx Channel 29 Global Configuration
Rx Channel 29 Host Packet Configuration A
Rx Channel 29 Host Packet Configuration B
Reserved
0x4740 2BAC
0x4740 2BB0
0x4740 2BB4 - 0x4740 2FFF
Table 8-114. CPPI DMA Scheduler Registers
HEX ADDRESS
0x4740 3000
ACRONYM
REGISTER NAME
DMA_SCHED_CTRL
CPPI DMA Scheduler Control Register
Reserved
0x4740 3804 - 0x4740 38FF
0x4740 3800
-
WORD0
WORD1
…
CPPI DMA Scheduler Table Word 0
CPPI DMA Scheduler Table Word 1
…
0x4740 3804
…
0x4740 38F8
WORD62
WORD63
-
CPPI DMA Scheduler Table Word 62
CPPI DMA Scheduler Table Word 63
Reserved
0x4740 38FC
0x4740 38FF - 0x4740 3FFF
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Table 8-115. CPPI DMA Queue Manager Registers
HEX ADDRESS
0x4740 4000
ACRONYM
QMGRREVID
-
REGISTER NAME
Queue Manager Revision
Reserved
0x4740 4004
0x4740 4008
DIVERSION
FDBSC0
FDBSC1
FDBSC2
FDBSC3
FDBSC4
FDBSC5
FDBSC6
FDBSC7
-
Queue Manager Queue Diversion
0x4740 4020
Queue Manager Free Descriptor/Buffer Starvation Count 0
Queue Manager Free Descriptor/Buffer Starvation Count 1
Queue Manager Free Descriptor/Buffer Starvation Count 2
Queue Manager Free Descriptor/Buffer Starvation Count 3
Queue Manager Free Descriptor/Buffer Starvation Count 4
Queue Manager Free Descriptor/Buffer Starvation Count 5
Queue Manager Free Descriptor/Buffer Starvation Count 6
Queue Manager Free Descriptor/Buffer Starvation Count 7
Reserved
0x4740 4024
0x4740 4028
0x4740 402C
0x4740 4030
0x4740 4034
0x4740 4038
0x4740 403C
0x4740 4030 - 0x4740 407C
0x4740 4080
LRAM0BASE
LRAM0SIZE
LRAM1BASE
-
Queue Manager Linking RAM Region 0 Base Address
Queue Manager Linking RAM Region 0 Size
Queue Manager Linking RAM Region 1 Base Address
Reserved
0x4740 4084
0x4740 4088
0x4740 408C
0x4740 4090
PEND0
PEND1
PEND2
PEND3
PEND4
-
Queue Manager Queue Pending 0
0x4740 4094
Queue Manager Queue Pending 1
0x4740 4098
Queue Manager Queue Pending 2
0x4740 409C
Queue Manager Queue Pending 3
0x4740 40A0
Queue Manager Queue Pending 4
0x4740 40A4 - 0x4740 4FFF
0x4740 5000 + 16xR
0x4740 5000 + 16xR + 4
0x4740 50F8 - 0x4740 5FFF
0x4740 6000 + 16xN
0x4740 6004 + 16xN
0x4740 6008 + 16xN
0x4740 600C + 16xN
0x4740 69C0 - 0x4740 6FFF
0x4740 7000 + 16xN
0x4740 7004 + 16xN
0x4740 7008 + 16xN
0x4740 700C + 16xN
0x4740 79C0 - 0x4740 7FFF
Reserved
QMEMRBASEr
QMEMRCTRLr
-
Memory Region R Base Address (R ranges from 0 to 15)
Memory Region R Control (R ranges from 0 to 15)
Reserved
CTRLAn
CTRLBn
CTRLCn
CTRLDn
-
Queue N Register A (N ranges from 0 to 155)
Queue N Register B (N ranges from 0 to 155)
Queue N Register C (N ranges from 0 to 155)
Queue N Register D (N ranges from 0 to 155)
Reserved
QSTATAn
QSTATBn
QSTATCn
-
Queue N Status A (N ranges from 0 to 155)
Queue N Status B (N ranges from 0 to 155)
Queue N Status C (N ranges from 0 to 155)
Reserved
-
Reserved
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8.21.2 USB2.0 Electrical Data/Timing
Table 8-116. Switching Characteristics Over Recommended Operating Conditions for USB2.0
(see Figure 8-90)
LOW SPEED
1.5 Mbps
FULL SPEED
12 Mbps
HIGH SPEED
480 Mbps
NO.
PARAMETER
UNIT
MIN
75
MAX
MIN
4
MAX
MIN
0.5
0.5
–
MAX
1
2
3
4
5
tr(D)
Rise time, USB_DP and USB_DN signals(1)
Fall time, USB_DP and USB_DN signals(1)
Rise/Fall time, matching(2)
Output signal cross-over voltage(1)
Source (Host) Driver jitter, next transition
Function Driver jitter, next transition
Source (Host) Driver jitter, paired transition(4)
Function Driver jitter, paired transition
Pulse duration, EOP transmitter
Pulse duration, EOP receiver
300
300
125
2
20
20
ns
ns
%
tf(D)
75
4
trfM
80
90 111.11
–
VCRS
1.3
1.3
2
2
–
–
(3)
V
tjr(source)NT
tjr(FUNC)NT
tjr(source)PT
tjr(FUNC)PT
tw(EOPT)
tw(EOPR)
t(DRATE)
2
ns
ns
ns
ns
ns
ns
(3)
(3)
(3)
25
2
6
1
1
10
1
7
8
9
1250
670
1500
160
82
175
–
–
–
Data Rate
1.5
–
12
49.5
44.6
480 Mb/s
10 ZDRV
Driver Output Resistance
–
28
40.5
43.8
49.5
44.6
Ω
Ω
11 USB_R1
USB reference resistor
43.8
44.6
43.8
(1) Low Speed: CL = 200 pF, Full Speed: CL = 50 pF, High Speed: CL = 50 pF
(2) tRFM = (tr/tf) x 100. [Excluding the first transaction from the Idle state.]
(3) For more detailed information, see the Universal Serial Bus Specification Revision 2.0, Chapter 7, Electrical.
(4) tjr = tpx(1) - tpx(0)
t
t
per − jr
USB_DN
90% V
OH
V
CRS
10% V
OL
USB_DP
t
f
t
r
Figure 8-90. USB2.0 Integrated Transceiver Interface Timing
USB
USB_VSSREF
USB_R1
44.2-Ω 1ꢀ(A)
A. Place the 44.2-Ω ± 1% as close to the device as possible.
Figure 8-91. USB Reference Resistor Routing
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9 Device and Documentation Support
9.1 Device Support
9.1.1 Development Support
TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules. The tool's support documentation is electronically available within the Code
Composer Studio™ Integrated Development Environment (IDE).
The following products support development of AM389x processor applications:
Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE):
including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target
software needed to support any Sitara ARM Processor application. DSP/BIOS™
Hardware Development Tools: Extended Development System (XDS™) Emulator XDS™
For a complete listing of development-support tools for the AM389x Sitara™ ARM Processor platform, visit
the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the
nearest TI field sales office or authorized distributor.
9.1.2 Device and Development Support-Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
processors and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (e.g.,
AM3894CYG). Texas Instruments recommends two of three possible prefix designators for its support
tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMDX) through fully qualified production devices/tools (TMDS).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully-qualified development-support product.
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality
and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
302
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TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, CYG), the temperature range (for example, blank is the default commercial
operating junction temperature range), and the device speed range (for example, blank is the default [1.0-
GHz ARM]). Figure 9-1 provides a legend for reading the complete device name for any AM389x device.
For device part numbers and further ordering information of AM389x devices in the CYG package type,
see the TI website (www.ti.com) or contact your TI sales representative.
For additional description of the device nomenclature markings on the die, see the AM389x Sitara ARM
Processors Silicon Errata (literature number SPRZ327).
(
)
(
)
(
)
AM3894
B
CYG
PREFIX
DEVICE SPEED RANGE
Blank = 1.0-GHz ARM (default)
120 = 1.2-GHz ARM
X = Experimental device
Blank = Qualified device
135 = 1.35-GHz ARM
DEVICE
TEMPERATURE RANGE
Blank = 0°C to 95°C (default commercial operating junction temperature)
A = -40°C to 105°C (extended operating junction temperature)
ARM Cortex-A8 processor:
AM3894
AM3892
PACKAGE TYPE(A)
CYG = 1031-pin plastic BGA, with Pb-Free solder balls
SILICON REVISION
Blank = silicon revision 1.0
A = silicon revision 1.1
B = silicon revision 2.0
A. BGA = Ball-Grid Array.
Figure 9-1. Device Nomenclature
9.2 Documentation Support
The following documents describe the AM389x Sitara™ ARM Processors. Copies of these documents are
available on the Internet at www.ti.com. Tip: Enter the literature number in the search box.
SPRUGX7 AM389x Sitara ARM Processors Technical Reference Manual.
9.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and
help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
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10 Mechanical Packaging and Orderable Information
Table 10-1 shows the thermal resistance characteristics for the PBGA–CYG mechanical package.
10.1 Thermal Data for CYG
Table 10-1. Thermal Resistance Characteristics (PBGA Package) [CYG]
NO.
1
°C/W(1)
0.21
RΘJC
RΘJB
Junction-to-case
Junction-to-board
2
3.93
(1) For proper device operation, a heatsink is required.
A thermal model can be provided for thermal simulation to estimate the system thermal environment.
Contact your local TI representative for availability.
10.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
AM3892BCYG120
AM3892BCYG150
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 95
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
FCBGA
FCBGA
CYG
1031
1031
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
AM3892BCYG
120
ACTIVE
CYG
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 95
AM3892BCYG
150
AM3892CCYG120
AM3892CCYG135
ACTIVE
ACTIVE
FCBGA
FCBGA
CYG
CYG
1031
1031
44
44
TBD
Call TI
Call TI
0 to 95
0 to 95
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
AM3892CCYG
135
AM3894ACYG120
AM3894BCYG120
AM3894BCYG150
AM3894BCYGA120
AM3894CCYG120
AM3894CCYG135
AM3894CCYGA120
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
FCBGA
CYG
CYG
CYG
CYG
CYG
CYG
CYG
1031
1031
1031
1031
1031
1031
1031
Green (RoHS
& no Sb/Br)
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Level-4-245C-72HR
Level-4-245C-72HR
Level-4-245C-72HR
Level-4-245C-72HR
Level-4-245C-72HR
Level-4-245C-72HR
Level-4-245C-72HR
0 to 95
0 to 95
AM3894ACYG
120
Green (RoHS
& no Sb/Br)
AM3894BCYG
120
Green (RoHS
& no Sb/Br)
0 to 95
AM3894BCYG
150
Green (RoHS
& no Sb/Br)
-40 to 105
0 to 95
AM3894BCYG
A120
44
44
1
Green (RoHS
& no Sb/Br)
AM3894CCYG
120
Green (RoHS
& no Sb/Br)
0 to 95
AM3894CCYG
135
Green (RoHS
& no Sb/Br)
-40 to 105
AM3894CCYG
A120
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
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