AM26LV31CNSRG4 [TI]

LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS; 低电压高速四路差动线路驱动器
AM26LV31CNSRG4
型号: AM26LV31CNSRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS
低电压高速四路差动线路驱动器

驱动器
文件: 总14页 (文件大小:394K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AM26LV31C, AM26LV31I  
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS  
www.ti.com  
SLLS201GMAY 1995REVISED MAY 2005  
FEATURES  
D OR NS PACKAGE  
Switching Rates up to 32 MHz  
(TOP VIEW)  
Operate From a Single 3.3-V Supply  
Propagation Delay Time . . . 8 ns Typ  
Pulse Skew Time . . . 500 ps Typ  
1A  
1Y  
1Z  
V
CC  
1
2
3
4
5
6
7
8
16  
15 4A  
14 4Y  
13 4Z  
High Output-Drive Current . . . ±30 mA  
Controlled Rise and Fall Times . . . 3 ns Typ  
G
2Z  
12  
11  
10  
9
G
Differential Output Voltage With 100-Ω  
Load . . . 1.5 V Typ  
2Y  
3Z  
3Y  
3A  
2A  
GND  
Ultra-Low Power Dissipation  
– dc, 0.3 mW Max  
– 32 MHz All Channels (No Load), 385 mW Typ  
Accept 5-V Logic Inputs With 3.3-V Supply  
Low-Voltage Pin-to-Pin Compatible  
Replacement for AM26C31, AM26LS31, MB571  
High Output Impedance in Power-Off  
Condition  
Driver Output Short-Protection Circuit  
Package Options Include Plastic  
Small-Outline (D, NS) Packages  
DESCRIPTION/ORDERING INFORMATION  
The AM26LV31C and AM26LV31I are BiCMOS quadruple differential line drivers with 3-state outputs. They are  
designed to be similar to TIA/EIA-422-B and ITU Recommendation V.11 drivers with reduced supply-voltage  
range.  
The devices are optimized for balanced-bus transmission at switching rates up to 32 MHz. The outputs have very  
high current capability for driving balanced lines such as twisted-pair transmission lines and provide a high  
impedance in the power-off condition. The enable function is common to all four drivers and offers the choice of  
active-high or active-low enable inputs. The AM26LV31C and AM26LV31I are designed using Texas Instruments  
proprietary LinIMPACT-C60™ technology, facilitating ultra-low power consumption without sacrificing speed.  
These devices offer optimum performance when used with the AM26LV32 quadruple line receivers.  
The AM26LV31C is characterized for operation from 0°C to 70°C. The AM26LV31I is characterized for operation  
from –45°C to 85°C  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
AM26LV31CD  
TOP-SIDE MARKING  
AM26LV31C  
SOIC – D  
SOIC – NS  
SOIC – D  
SOIC – NS  
Tape and reel  
AM26LV31CDR  
AM26LV31CNS  
AM26LV31CNSR  
AM26LV31ID  
0°C to 70°C  
Tape and reel  
Tape and reel  
Tape and reel  
26LV31  
AM26LV31I  
26LV31I  
AM26LV31IDR  
AM26LV31INS  
AM26LV31INSR  
–45°C to 85°C  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
LinIMPACT-C60 is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1995–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
AM26LV31C, AM26LV31I  
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS  
www.ti.com  
SLLS201GMAY 1995REVISED MAY 2005  
FUNCTION TABLE(1)  
ENABLES  
OUTPUTS  
INPUT  
A
G
H
H
X
X
L
G
X
X
L
Y
H
L
Z
L
H
L
H
L
H
L
H
L
L
H
Z
X
H
Z
(1) H = high level, L = low level, X = irrelevant,  
Z = high impedance (off)  
LOGIC DIAGRAM (POSITIVE LOGIC)  
4
G
12  
G
2
3
1
1Y  
1Z  
1A  
6
5
7
2Y  
2Z  
2A  
3A  
4A  
10  
11  
9
3Y  
3Z  
14  
13  
15  
4Y  
4Z  
SCHEMATIC (EACH DRIVER)  
EQUIVALENT OF EACH INPUT (A, G, OR G)  
TYPICAL OF ALL OUTPUTS (Y AND Z)  
V
CC  
V
CC  
100  
6 Ω  
40 kΩ  
Input  
Output  
GND  
GND  
All resistor values are nominal.  
2
AM26LV31C, AM26LV31I  
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS  
www.ti.com  
SLLS201GMAY 1995REVISED MAY 2005  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.3  
–0.3  
–0.3  
MAX  
6
UNIT  
VCC  
VI  
Supply voltage range(2)  
Input voltage range  
V
V
V
6
VO  
Output voltage range  
6
D package  
73  
64  
260  
150  
θJA  
Package thermal impedance(3)  
°C/W  
NS package  
Lead temperature  
1,6 mm (1/16 in) from case for 10 s  
°C  
°C  
Tstg  
Storage temperature range  
–65  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to GND.  
(3) The package thermal impedance is calculated in accordance with JESD 51-7.  
Recommended Operating Conditions  
MIN  
3
NOM  
MAX UNIT  
VCC Supply voltage  
3.3  
3.6  
V
V
VIH  
VIL  
IOH  
IOL  
High-level input voltage  
2
Low-level input voltage  
High-level output current  
Low-level output current  
0.8  
–30  
30  
V
mA  
mA  
AM26LV31C  
AM26LV31I  
0
70  
TA  
Operating free-air temperature  
°C  
–45  
85  
Electrical Characteristics  
over recommended operating supply-voltage and free-air temperature ranges (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP(1)  
MAX UNIT  
VIK  
Input clamp voltage  
II = 18 mA  
VIH = 2 V,  
VIL = 0.8 V,  
–1.5  
V
V
V
V
V
VOH  
VOL  
|VOD  
VOC  
High-level output voltage  
Low-level output voltage  
Differential output voltage(2)  
Common-mode output voltage  
IOH = –12 mA  
1.85  
2.3  
0.8  
IOH = 12 mA  
1.05  
|
0.95  
1.3  
1.5  
1.55  
1.8  
±0.2  
RL = 100 Ω  
Change in magnitude of  
|VOC  
|
V
common-mode output voltage(2)  
IO  
Output current with power off  
VO = –0.25 V or 6 V,  
VO = –0.25 V or 6 V,  
VCC = 0  
±100  
±100  
µA  
µA  
Off-state (high-impedance state)  
output current  
IOZ  
G = 0.8 V or G = 2 V  
IH  
High-level input current  
Low-level input current  
Short-circuit output current  
Supply current (all drivers)  
VCC = 0 or 3 V,  
VCC = 3.6 V,  
VI = 5.5 V  
VI = 0  
10  
–10  
µA  
µA  
mA  
µA  
IL  
IOS  
ICC  
VCC = 3.6 V,  
VO = 0  
–200  
100  
VI = VCC or GND,  
No load  
Power-dissipation capacitance  
(all drivers)(3)  
Cpd  
No load  
160  
pF  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
(2) |VOD| and |VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to  
a low level.  
(3) Cpd determines the no-load dynamic current consumption. IS = Cpd × VCC × f + ICC  
3
AM26LV31C, AM26LV31I  
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS  
www.ti.com  
SLLS201GMAY 1995REVISED MAY 2005  
Switching Characteristics  
VCC = 3.3 V, TA = 25°C  
PARAMETER  
Propagation delay time, low- to high-level output  
Propagation delay time, high- to low-level output  
Transition time (tr or tf)  
TEST CONDITIONS  
See Figure 2  
MIN TYP(1)  
MAX  
12  
UNIT  
ns  
tPLH  
tPHL  
tt  
4
4
8
8
12  
ns  
ns  
3
SR  
Slew rate, single-ended output voltage  
Output-enable time to high level  
Output-enable time to low level  
Output-disable time from high level  
Output-disable time from low level  
Pulse skew  
See Note (2) and Figure 2  
See Figure 3  
0.3  
10  
10  
10  
10  
0.5  
1
20  
20  
20  
20  
1.5  
1.5  
3
V/ns  
ns  
tPZH  
tPZL  
tPHZ  
tPLZ  
tsk(p)  
tsk(o)  
tsk(lim)  
See Figure 4  
ns  
See Figure 3  
ns  
See Figure 4  
ns  
(3)  
(4)  
f = 32 MHz,  
f = 32 MHz  
f = 32 MHz,  
See Note  
See Note  
ns  
Skew limit  
ns  
Skew limit (device to device)  
ns  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
(2) Slew rate is defined by:  
ǒ
Ǔ
ǒ
Ǔ
90% VOH * VOL * 10% VOH * VOL  
SR +  
, the differential slew rate of VOD is 2   SR.  
tr  
(3) Pulse skew is defined as the |tPLH - tPHL| of each channel of the same device.  
(4) Skew limit (device to device) is the maximum difference in propagation delay times between any two channels of any two devices.  
4
AM26LV31C, AM26LV31I  
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS  
www.ti.com  
SLLS201GMAY 1995REVISED MAY 2005  
PARAMETER MEASUREMENT INFORMATION  
R /2  
L
Y
Z
A
V
OD2  
G
G
V
OC  
R /2  
L
Figure 1. Differential and Common-Mode Output Voltages  
Y
C
= 15 pF  
L
V
A
O
O
R
L
= 100  
V
OD  
Z
(see Note A)  
Generator  
(see Note B)  
50 Ω  
V
G
V
CC  
G
TEST CIRCUIT  
50%  
V
CC  
Input  
50%  
A
0 V  
t
t
PHL  
PLH  
Z
Y
Output, V  
O
PROPAGATION DELAY TIMES  
V
V
OH  
90%  
90%  
10%  
90%  
10%  
OL  
Y
Z
t
t
r
f
Output, V  
O
t
t
f
r
V
V
OH  
90%  
10%  
10%  
OL  
RISE AND FALL TIMES  
NOTES: A. C includes probe and jig capacitance.  
L
B. The input pulse is supplied by a generator having the following characteristics: PRR = 32 MHz, Z 50 , 50% duty cycle,  
O
t and t 2 ns.  
r
f
Figure 2. Test Circuit and Voltage Waveforms, tPHL and tPLH  
5
AM26LV31C, AM26LV31I  
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS  
www.ti.com  
SLLS201GMAY 1995REVISED MAY 2005  
PARAMETER MEASUREMENT INFORMATION  
S1  
Y
A
V
CC  
Z
Output  
R
L
= 110  
C
L
= 15 pF  
(see Note A)  
G
G
Generator  
(see Note B)  
50 Ω  
V
CC  
(see Note C)  
TEST CIRCUIT  
V
CC  
50%  
50%  
Input  
0 V  
t
PHZ  
t
PZH  
0.3 V  
V
OH  
Output  
50%  
VOLTAGE WAVEFORMS  
V
off  
0  
NOTES: A. C includes probe and jig capacitance.  
L
B. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, Z = 50 , 50% duty cycle,  
O
t and t (10% to 90%) 2 ns.  
r
f
C. To test the active-low enable G, ground G and apply an inverted waveform to G.  
Figure 3. Test Circuit and Voltage Waveforms, tPZH and tPHZ  
6
AM26LV31C, AM26LV31I  
LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS  
www.ti.com  
SLLS201GMAY 1995REVISED MAY 2005  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
R
L
= 110  
S1  
Y
Z
A
V
CC  
Output  
C
L
= 15 pF  
(see Note A)  
G
G
Generator  
(see Note B)  
50 Ω  
V
CC  
(see Note C)  
TEST CIRCUIT  
V
CC  
Input  
50%  
50%  
0 V  
t
PLZ  
t
PZL  
V
off  
V  
CC  
50%  
Output  
V
OL  
0.3 V  
VOLTAGE WAVEFORMS  
NOTES: A. C includes probe and jig capacitance.  
L
B. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, Z = 50 , 50% duty cycle,  
O
t and t (10% to 90%) 2 ns.  
r
f
C. To test the active-low enable G, ground G and apply an inverted waveform to G.  
Figure 4. Test Circuit and Voltage Waveforms, tPZL and tPLZ  
7
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
AM26LV31CD  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
AM26LV31CDE4  
AM26LV31CDG4  
AM26LV31CDR  
AM26LV31CDRE4  
AM26LV31CDRG4  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
AM26LV31CNSLE  
AM26LV31CNSR  
OBSOLETE  
ACTIVE  
SO  
SO  
NS  
NS  
16  
16  
TBD  
Call TI  
Call TI  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
AM26LV31CNSRE4  
AM26LV31CNSRG4  
AM26LV31ID  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
SO  
NS  
NS  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
AM26LV31IDE4  
AM26LV31IDG4  
AM26LV31IDR  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
AM26LV31IDRE4  
AM26LV31IDRG4  
AM26LV31INSR  
AM26LV31INSRE4  
AM26LV31INSRG4  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
TAPE AND REEL BOX INFORMATION  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
330  
330  
330  
330  
(mm)  
16  
AM26LV31CDR  
AM26LV31CNSR  
AM26LV31IDR  
AM26LV31INSR  
D
NS  
D
16  
16  
16  
16  
SITE 27  
SITE 41  
SITE 27  
SITE 41  
6.5  
8.2  
6.5  
8.2  
10.3  
10.5  
10.3  
10.5  
2.1  
2.5  
2.1  
2.5  
8
12  
8
16  
16  
16  
16  
Q1  
Q1  
Q1  
Q1  
16  
16  
NS  
16  
12  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
AM26LV31CDR  
AM26LV31CNSR  
AM26LV31IDR  
AM26LV31INSR  
D
NS  
D
16  
16  
16  
16  
SITE 27  
SITE 41  
SITE 27  
SITE 41  
342.9  
346.0  
342.9  
346.0  
336.6  
346.0  
336.6  
346.0  
28.58  
33.0  
28.58  
33.0  
NS  
Pack Materials-Page 2  
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Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

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