AM26C32CNSRG4 [TI]
QUADRUPLE DIFFERENTIAL LINE RECEIVER; 四路差动线路接收器
| 型号： | AM26C32CNSRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUADRUPLE DIFFERENTIAL LINE RECEIVER |
| 文件： | 总19页 (文件大小：692K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀ ꢁꢂ ꢃꢄ ꢅꢂ
ꢆ ꢇꢀꢈꢉ ꢇꢊꢋ ꢌ ꢈꢍ ꢎꢎ ꢌꢉ ꢌꢏꢐ ꢍꢀ ꢋ ꢋ ꢍꢏꢌ ꢉ ꢌꢄ ꢌꢍ ꢑ ꢌ ꢉ
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
AM26C32C . . . D, N, OR NS PACKAGE
D
Meets or Exceeds the Requirements of
ANSI TIA/EIA-422-B, TIA/EIA-423-B, and ITU
Recommendation V.10 and V.11
AM26C32I . . . D, N, NS, OR PW PACKAGE
AM26C32Q . . . D PACKAGE
AM26C32M . . . J OR W PACKAGE
(TOP VIEW)
D
D
Low Power, I
= 10 mA Typ
CC
7-V Common-Mode Range With 200-mV
Sensitivity
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1B
1A
1Y
G
2Y
2A
2B
GND
V
CC
4B
4A
4Y
G
3Y
3A
3B
D
D
D
D
D
D
D
Input Hysteresis . . . 60 mV Typ
t
= 17 ns Typ
pd
Operates From a Single 5-V Supply
3-State Outputs
Input Fail-Safe Circuitry
Improved Replacements for AM26LS32
Available in Q-Temp Automotive
AM26C32M . . . FK PACKAGE
(TOP VIEW)
− High Reliability Automotive Applications
− Configuration Control/Print Support
− Qualification to Automotive Standards
3
2
1
20 19
18
description/ordering information
4A
4Y
NC
G
1Y
G
4
5
6
7
8
17
16
15
14
The AM26C32 is a quadruple differential line
receiver for balanced or unbalanced digital data
transmission. The enable function is common to
all four receivers and offers a choice of active-high
or active-low input. The 3-state outputs permit
connection directly to a bus-organized system.
Fail-safe design specifies that if the inputs are
open, the outputs always are high.
NC
2Y
2A
3Y
9 10 11 12 13
NC − No internal connection
The AM26C32 devices are manufactured using a BiCMOS process, which is a combination of bipolar and
CMOS transistors. This process provides the high voltage and current of bipolar with the low power of CMOS
to reduce the power consumption to about one-fifth that of the standard AM26LS32, while maintaining ac and
dc performance.
The AM26C32C is characterized for operation from 0°C to 70°C. The AM26C32I is characterized for operation
from −40°C to 85°C. The AM26C32Q is characterized for operation from −40°C to 125°C. The AM26C32M is
characterized for operation over the full military temperature range of −55°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄꢅ ꢂ
ꢆꢇ ꢀ ꢈꢉ ꢇ ꢊꢋ ꢌ ꢈ ꢍ ꢎꢎ ꢌꢉ ꢌꢏ ꢐꢍ ꢀ ꢋ ꢋꢍ ꢏ ꢌ ꢉꢌ ꢄ ꢌꢍꢑ ꢌꢉ
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
description/ordering information (continued)
ORDERING INFORMATION
ORDERABLE
TOP-SIDE
MARKING
†
PACKAGE
T
A
PART NUMBER
AM26C32CN
AM26C32CD
AM26C32CDR
AM26C32CNSR
AM26C32IN
PDIP (N)
SOIC (D)
Tube of 25
Tube of 40
Reel of 2500
Reel of 2000
Tube of 25
Tube of 40
Reel of 2500
Reel of 2000
Tube of 90
Tube of 40
Tube of 25
Tube of 150
Tube of 55
AM26C32CN
0°C to 70°C
AM26C32C
SOP (NS)
PDIP (N)
26C32
AM26C32IN
AM26C32ID
SOIC (D)
AM26C32I
AM26C32IDR
AM26C32INSR
AM26C32IPW
AM26C32QD
AM26C32MJ
−40°C to 85°C
SOP (NS)
TSSOP (PW)
SOIC (D)
26C32I
26C32I
−40°C to 125°C
−55°C to 125°C
AM26C32QD
AM26C32MJ
AM26C32MW
AM26C32MFK
CDIP (J)
CFP (W)
AM26C32MW
AM26C32MFK
LCCC (FK)
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each receiver)
ENABLES
DIFFERENTIAL
INPUT
OUTPUT
Y
G
H
X
H
X
H
X
L
G
X
L
H
H
?
?
L
L
Z
V
ID
≥ V
IT+
X
L
V
IT−
< V < V
ID IT+
X
L
V
ID
≤ V
IT−
X
H
H = high level, L = low level, X = irrelevant
Z = high impedance (off), ? = indeterminate
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅꢂ
ꢆ ꢇꢀꢈꢉ ꢇꢊꢋ ꢌ ꢈꢍ ꢎꢎ ꢌꢉ ꢌꢏꢐ ꢍꢀ ꢋ ꢋ ꢍꢏꢌ ꢉꢌ ꢄꢌ ꢍ ꢑꢌ ꢉ
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
logic diagram (positive logic)
4
G
G
12
2
1
1A
1B
3
1Y
6
7
2A
2B
5
2Y
10
9
3A
3B
11
3Y
14
15
4A
4B
13
4Y
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
schematics
EQUIVALENT OF A OR B INPUT
EQUIVALENT OF G OR G INPUT
TYPICAL OF ALL OUTPUTS
V
CC
V
CC
V
CC
1.7 kΩ
NOM
17 kΩ
NOM
Input
288 kΩ
NOM
Input
GND
Output
1.7 kΩ
NOM
V
CC
(A inputs)
or
GND (B inputs)
GND
GND
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄꢅ ꢂ
ꢆꢇ ꢀ ꢈꢉ ꢇ ꢊꢋ ꢌ ꢈ ꢍ ꢎꢎ ꢌꢉ ꢌꢏ ꢐꢍ ꢀ ꢋ ꢋꢍ ꢏ ꢌ ꢉꢌ ꢄ ꢌꢍꢑ ꢌꢉ
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
CC
Input voltage range, V : A or B inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −11 V to 14 V
I
G or G inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
+ 0.5 V
CC
Differential input voltage range, V
Output voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −14 V to 14 V
ID
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
+ 0.5 V
O
CC
Output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
O
Package thermal impedance, θ (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential output voltage, V , are with respect to network GND. Currents into the device are positive
OD
and currents out of the device are negative.
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
JA
J
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN NOM
MAX
UNIT
V
V
V
V
V
Supply voltage
4.5
2
5
5.5
CC
High-level input voltage
Low-level input voltage
Common-mode input voltage
High-level output current
Low-level output current
V
IH
0.8
7
V
IL
V
IC
I
I
−6
6
mA
mA
OH
OL
AM26C32C
AM26C32I
AM26C32Q
AM26C32M
0
−40
−40
−55
70
85
125
125
T
A
Operating free-air temperature
°C
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅꢂ
ꢆ ꢇꢀꢈꢉ ꢇꢊꢋ ꢌ ꢈꢍ ꢎꢎ ꢌꢉ ꢌꢏꢐ ꢍꢀ ꢋ ꢋ ꢍꢏꢌ ꢉꢌ ꢄꢌ ꢍ ꢑꢌ ꢉ
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of V , V , and operating free-air
CC
IC
temperature (unless otherwise noted)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
0.2
UNIT
V
IC
V
IC
V
IC
V
IC
= −7 V to 7 V
= 0 to 5.5 V
= −7 V to 7 V
= 0 to 5.5 V
V
I
= V
(min),
= −440 µA
O
OH
V
IT+
Differential input high-threshold voltage
Differential input low-threshold voltage
V
0.1
OH
‡
−0.2
V
I
= 0.45 V,
= 8 mA
O
V
V
V
IT−
‡
−0.1
OL
Hysteresis voltage (V
IT+
− V
)
60
mV
V
hys
IT−
V
V
V
Enable input clamp voltage
High-level output voltage
Low-level output voltage
V
V
V
V
= 4.5 V,
I = −18 mA
−1.5
IK
CC
I
= 200 mV,
I
= −6 mA
= 6 mA
3.8
V
OH
OL
ID
ID
O
OH
OL
= −200 mV,
I
0.2
0.5
0.3
5
V
I
Off-state (high-impedance state) output current
= V
CC
or GND
µA
OZ
V = 10 V,
Other input at 0 V
Other input at 0 V
1.5
I
I
Line input current
mA
I
V = −10 V,
I
−2.5
20
I
I
High-level enable current
Low-level enable current
Input resistance
V = 2.7 V
I
µA
µA
kΩ
mA
IH
V = 0.4 V
I
−100
IL
r
One input to ground
= 5.5 V
12
17
10
i
I
Supply current
V
CC
15
CC
†
‡
All typical values are at V
CC
= 5 V, V = 0, and T = 25°C.
IC
A
The algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet for common-mode
input voltage.
switching characteristics over recommended ranges of operation conditions, C = 50 pF (unless
L
otherwise noted)
AM26C32C
AM26C32I
AM26C32Q
AM26C32M
TEST
CONDITIONS
PARAMETER
UNIT
†
†
MIN TYP
MAX
27
27
9
MIN TYP
MAX
27
27
10
9
t
t
t
t
t
t
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Output transition time, low- to high-level output
Output transition time, high- to low-level output
Output enable time to high level
9
9
17
17
4
9
9
17
17
4
ns
ns
ns
ns
ns
ns
PLH
PHL
TLH
THL
PZH
PZL
See Figure 1
See Figure 1
See Figure 2
4
9
4
13
13
22
22
13
13
22
22
Output enable time to low level
t
Output disable time from high level
Output disable time from low level
13
13
22
22
13
13
26
25
ns
ns
PHZ
PLZ
See Figure 2
t
†
All typical values are at V
CC
= 5 V, T = 25°C.
A
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄꢅ ꢂ
ꢆꢇ ꢀ ꢈꢉ ꢇ ꢊꢋ ꢌ ꢈ ꢍ ꢎꢎ ꢌꢉ ꢌꢏ ꢐꢍ ꢀ ꢋ ꢋꢍ ꢏ ꢌ ꢉꢌ ꢄ ꢌꢍꢑ ꢌꢉ
SLLS104I − DECEMBER 1990 − REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
t
t
THL
V
CC
TLH
V
OH
50%
90%
90%
Output
10%
10%
A
B
V
OL
Device
Under
Test
t
t
PHL
PLH
C
= 50 pF
L
2.5 V
Input
(see Note A)
0 V
−2.5 V
Input
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTE A: C includes probe and jig capacitance.
L
Figure 1. Switching Test Circuit and Voltage Waveforms
V
CC
S1
R
= 1 kΩ
G Input
G Input
A Input
L
Device
Under
Test
t
t
, t
Measurement: S1 to V
CC
Measurement: S1 to GND
PZL PLZ
V
ID
= 2.5 V
, t
PZH PHZ
B Input
C
= 50 pF
L
(see Note A)
TEST CIRCUIT
3 V
0 V
G
1.3 V
3 V
0 V
G
1.3 V
(see Note B)
t
t
t
t
PHZ
PZH
PHZ
PZH
V
V
OH
Output
(with V = 2.5 V)
ID
V
OH
−0.5 V
V
OH
−0.5 V
50%
OL
t
t
t
t
PLZ
PZL
PLZ
PZL
V
V
OH
Output
(with V = −2.5 V)
ID
50%
V
OL
+ 0.5 V
V
OL
+ 0.5 V
OL
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, duty cycle ≤ 50%, t = t = 6 ns.
r
f
Figure 2. Enable/Disable Time Test Circuit and Output Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CFP
Drawing
5962-9164001Q2A
5962-9164001QEA
5962-9164001QFA
AM26C32CD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
J
20
16
16
16
1
1
1
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
W
D
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C32CDBLE
AM26C32CDE4
OBSOLETE
ACTIVE
SSOP
SOIC
DB
D
16
16
TBD
Call TI
Call TI
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C32CDG4
AM26C32CDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
D
D
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C32CDRE4
AM26C32CDRG4
AM26C32CN
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26C32CNE4
AM26C32CNSR
AM26C32CNSRE4
AM26C32CNSRG4
AM26C32ID
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
NS
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C32IDBLE
AM26C32IDE4
OBSOLETE
ACTIVE
SSOP
SOIC
DB
D
16
16
TBD
Call TI
Call TI
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C32IDG4
AM26C32IDR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
D
D
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C32IDRE4
AM26C32IDRG4
AM26C32IN
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
AM26C32INE4
AM26C32INSR
AM26C32INSRE4
AM26C32INSRG4
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NS
NS
NS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
AM26C32IPW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
16
16
16
16
16
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C32IPWE4
AM26C32IPWG4
AM26C32IPWR
AM26C32IPWRG4
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
AM26C32MFKB
AM26C32MJB
AM26C32MWB
AM26C32QD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
FK
J
20
16
16
16
16
1
1
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
W
D
1
SOIC
SOIC
40
CU NIPDAU Level-1-220C-UNLIM
AM26C32QDG4
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
(mm)
16
AM26C32CDR
AM26C32CNSR
AM26C32IDR
D
NS
D
16
16
16
16
16
SITE 27
SITE 41
SITE 27
SITE 41
SITE 41
6.5
8.2
6.5
8.2
7.0
10.3
10.5
10.3
10.5
5.6
2.1
2.5
2.1
2.5
1.6
8
12
8
16
16
16
16
12
Q1
Q1
Q1
Q1
Q1
16
16
AM26C32INSR
AM26C32IPWR
NS
PW
16
12
8
12
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
AM26C32CDR
AM26C32CNSR
AM26C32IDR
D
NS
D
16
16
16
16
16
SITE 27
SITE 41
SITE 27
SITE 41
SITE 41
342.9
346.0
342.9
346.0
346.0
336.6
346.0
336.6
346.0
346.0
28.58
33.0
28.58
33.0
AM26C32INSR
AM26C32IPWR
NS
PW
29.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Wireless
www.ti.com/wireless
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