AFE7952IABJ [TI]
具有两条反馈路径的四通道宽带宽射频采样收发器 | ABJ | 400 | -40 to 85;型号: | AFE7952IABJ |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有两条反馈路径的四通道宽带宽射频采样收发器 | ABJ | 400 | -40 to 85 射频 |
文件: | 总12页 (文件大小:1152K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AFE7952
ZHCSR81 – NOVEMBER 2022
AFE7952 四通道射频收发器
1 特性
3 说明
•
•
•
•
四通道射频采样 12 GSPS 发送 DAC
高性能、宽带宽、多通道收发器,集成了四个射频采样
发送器链四个射频采样接收器链和两个射频采样数字化
辅助链(反馈路径)。发送器链和接收器链的高动态范
围使器件能够从无线基站生成和接收 3G、4G 和 5G
信号,而 的宽带宽功能专为多频带 4G 和 5G 基站而
设计。
四通道射频采样 3 GSPS 接收 ADC
双通道射频采样 3GSPS 反馈 ADC
最大射频信号带宽:
– TX:2TX 为 2400MHz,4TX 为 1200MHz
– FB:1200 MHz
– RX:1200MHz(无 FB);600MHz(带 FB)
射频频率范围:高达 12GHz
每个接收器链均包含一个 25dB 范围的数字步进衰减
器 (DSA),后跟一个 3GSPS 模数转换器 (ADC)。
每个接收器通道都有一个模拟峰值功率检测器和各种数
字功率检测器,用于支持外部或内部自主自动增益控制
器,另外还具有射频过载检测器,用于提供器件可靠性
保护。单通道或双通道数字下变频器 (DDC) 可提供高
达 600MHz 的组合信号带宽(双通道 DDC 模式)
或 1200MHz 的组合信号带宽(单通道 DDC 模式)。
在 TDD 模式下,接收器通道经过配置可在流量接收器
(TDD RX) 和宽带反馈接收器 (TDD FB) 间动态切换,
能够重复使用同一模拟输入来实现两种用途。
•
•
数字步进衰减器 (DSA):
– TX:40dB 范围、1dB 模拟和 0.125dB 数字步
进
– RX:25 dB 范围,0.5 dB 步进
用于 TX 和 RX 的双频带 DUC/DDC
用于快速频率开关的双通道 NCO
通过在 TX 和 RX 之间快速切换来支持 TDD 操作
用于生成 DAC/ADC 时钟的内部 PLL/VCO
DAC 或 ADC 速率下的可选外部 CLK
串行器/解串器数据接口:
•
•
•
•
•
•
每个发送器链都包含一个单通道或双通道数字上变频
器 (DUC),支持高达 2400MHz(对于 2TX)或
1200MHz(对于 4TX)的组合信号带宽。DUC 的输出
驱动 12GSPS DAC(数模转换器),通过混合模式输
出选项增强在第二或第三奈奎斯特区域的运行。DAC
输出包括一个具有 40dB 范围以及 1dB 模拟和
0.125dB 数字步进的可变增益放大器 (TX DSA)。
– 符合 JESD204B 和 JESD204C 标准
– 8 个高达 29.5Gbps 的串行器/解串器收发器
– 8b/10b 和 64b/66b 编码
– 12 位、16 位、24 位和 32 位分辨率
– 子类 1 多器件同步
封装:17mm × 17mm FCBGA,间距 0.8 mm
•
2 应用
反馈路径包括一个驱动 3GSPS 射频采样 ADC 的
25dB 范围 DSA,后跟一个带宽高达 1200MHz 的
DDC。
•
•
•
•
•
•
宏远程无线电单元 (RRU)
有源天线系统 mMIMO (AAS)
小型蜂窝基站
中继器
5G 毫米波无线电
分布式天线系统 (DAS)
封装信息(1)
器件型号
AFE7952
封装
封装尺寸
FC BGA
17.00mm × 17.00mm
(1) 如需了解详情,请参阅机械、封装和可订购信息。
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SBAS972
AFE7952
ZHCSR81 – NOVEMBER 2022
www.ti.com.cn
4 功能方框图
4.1 AFE7952 Functional Block Diagram
DSA
Buffer
FB
ADC
ADC
1FB+/-
SHA
DDC
DSA
Buffer
RX
1RX+/-
SHA
DDC
1SRX+/-
2SRX+/-
3SRX+/-
4SRX+/-
5SRX+/-
6SRX+/-
7SRX+/-
8SRX+/-
DSA
Buffer
RX
ADC
DAC
2RX+/-
DDC
SHA
DSA
1TX+/-
DUC
DUC
DSA
DAC
2TX+/-
PLL
CLKIN+/-
/2,3,4,6
SYSREF+/-
1STX+/-
2STX+/-
3STX+/-
4STX+/-
5STX+/-
6STX+/-
7STX+/-
8STX+/-
DSA
DUC
DAC
3TX+/-
DSA
4TX+/-
DUC
DAC
ADC
DSA
RX
Buffer
4RX+/-
SHA
DDC
DSA
Buffer
RX
ADC
ADC
3RX+/-
SHA
DDC
DSA
Buffer
FB
2FB+/-
SHA
DDC
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ZHCSR81 – NOVEMBER 2022
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Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 功能方框图.........................................................................2
4.1 AFE7952 Functional Block Diagram...........................2
5 Revision History.............................................................. 3
6 Device and Documentation Support..............................4
6.1 Trademarks.................................................................4
6.2 Electrostatic Discharge Caution..................................4
6.3 术语表......................................................................... 4
7 Mechanical, Packaging, and Orderable Information....4
5 Revision History
注:以前版本的页码可能与当前版本的页码不同
DATE
VERSION
NOTES
November 2022
*
Initial release.
Copyright © 2022 Texas Instruments Incorporated
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ZHCSR81 – NOVEMBER 2022
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6 Device and Documentation Support
6.1 Trademarks
所有商标均为其各自所有者的财产。
6.2 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
6.3 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
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AFE7952
ZHCSR81 – NOVEMBER 2022
www.ti.com.cn
PACKAGE OUTLINE
ABJ0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65 MAX
0.2 C
(2.08)
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4221311/B 04/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
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AFE7952
ZHCSR81 – NOVEMBER 2022
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EXAMPLE BOARD LAYOUT
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
2 3
4
6
7
8
9
10
13
16
18
19 20
17
1
5
11 12
14 15
A
B
C
D
E
F
(0.8) TYP
0.415
0.385
G
H
J
400X
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
( 0.4)
METAL
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221311/B 04/2020
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
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AFE7952
ZHCSR81 – NOVEMBER 2022
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EXAMPLE STENCIL DESIGN
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
2 3
4
6
7
8
9
13
16
18
19 20
17
1
5
11 12
14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4221311/B 04/2020
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
28-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE7952IABJ
ACTIVE
FCBGA
ABJ
400
90
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
AFE7952I
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
ABJ0400A
FCBGA - 2.65 mm max height
SCALE 0.750
BALL GRID ARRAY
17.2
16.8
A
BALL A1 CORNER
17.2
16.8
(
16)
B
2.65
2.29
(1.4)
0.2 C
C
SEATING PLANE
NOTE 4
0.76
0.56
BALL TYP
0.12 C
0.5
0.3
TYP
15.2 TYP
SYMM
(0.9) TYP
0.8 TYP
Y
V
T
W
U
R
N
L
P
M
K
H
F
15.2
TYP
SYMM
J
G
E
C
A
0.55
0.45
400X
D
B
0.15
0.08
C A B
C
NOTE 3
1
3
5
7
9
11 13 15 17 19
10 12 14 16 18 20
0.8 TYP
2
4
6
8
4221311/C 03/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
EXAMPLE BOARD LAYOUT
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
4
5
2 3
6
7
8
10
16
18
19 20
17
1
9
11 12 13 14 15
A
B
C
D
E
F
(0.8) TYP
G
H
J
400X ( 0.4)
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
(
0.4)
0.025 MAX
0.025 MIN
METAL
UNDER
MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4221311/C 03/2022
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
ABJ0400A
FCBGA - 2.65 mm max height
BALL GRID ARRAY
(0.8) TYP
(
0.4) TYP
10
4
5
2 3
6
7
8
16
18
19 20
17
1
9
11 12 13 14 15
A
B
(0.8)
TYP
C
D
E
F
G
H
J
SYMM
K
L
M
N
P
R
T
U
V
W
Y
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:6X
4221311/C 03/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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Copyright © 2022,德州仪器 (TI) 公司
相关型号:
AFE8000IABJ
具有 12GSPS DAC 和 4GSPS ADC 的 8 发射 (TX) 10 接收 (RX) 7GHz 射频采样 AFE | ABJ | 400 | -40 to 85
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