AFE4960YBGR [TI]
具有集成式呼吸和起搏信号检测功能的双通道 ECG 模拟前端 | YBG | 36 | -40 to 85;
| 型号： | AFE4960YBGR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有集成式呼吸和起搏信号检测功能的双通道 ECG 模拟前端 | YBG | 36 | -40 to 85 |
| 文件： | 总8页 (文件大小：902K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AFE4960
ZHCSOJ7A –OCTOBER 2021 –REVISED MARCH 2022
AFE4960 用于临床可穿戴设备的双通道ECG、呼吸和起搏脉冲检测模拟前端
(AFE)
1 特性
3 说明
• 支持心电图和呼吸阻抗测量；可配置为2 通道ECG
或1 通道ECG + 1 通道呼吸
• 可用于符合IEC 60601-2-47:2012/(R)2016 和IEC
60601-2-27:2011(R)2016 的系统
• 作为2 通道ECG 运行时为222 μA/通道
• 1 个通道上的集成起搏脉冲检测
• 支持3 导联心电图，可通过并行操作两个或更多
AFE 扩展到5 导联或更多
AFE4960 可配置为 2 通道 ECG 接收器或 1 通道 ECG
接收器和一个呼吸阻抗通道。AFE 信号链可以灵活地
连接至最多 4 个电极。右腿驱动 (RLD) 放大器输出可
用于设置人体偏置。AFE 具有用于导联开/关检测的直
流引线偏置和用于测量引线阻抗的交流导联偏置。一个
通道支持起搏器脉冲检测。
所有信号链输出都由单个 ADC 在明确定义的时隙中转
换，并作为 24 位字存储在 128 样本 FIFO 中，可以使
用SPI 或I2C 界面读出。
• ECG 信号链：
– 高达2.048 kHz 的单通道ECG 采集
– 高达1.36 kHz/通道的2 通道ECG 采集
– RLD 输出通过第三电极设置人体偏置
– INA 增益在2 至12 的范围内可进行编程
– >1 GΩ输入阻抗，CMRR > 100 dB
– 输入噪声（0.5 Hz 至150 Hz）：INA 增益为3
时为13 µVpp；INA 增益为12 时为5 μVpp
– 集成式370 Hz 抗混叠低通滤波器
– 持续导联开/关检测模式
AFE4960 是一种完全集成的解决方案，可实现 3 导联
ECG 系统。两个 AFE 并行的同步操作可用于实现 5
导联ECG。
器件信息
器件型号
封装(1)
封装尺寸（标称值）
AFE4960
DSBGA (YBG 36)
2.6 mm x 2.6 mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
– 导联阻抗测量模式
• Bio-Z 信号链：
ECG CHANNEL 1
INA
LPF
LEAD-OFF DET
Timing
Engine
OSC
– 在30kHz 至100kHz 的激励频率范围内测量生
物阻抗
– 正弦波激励或方波激励
– 呼吸阻抗测量：2 kΩ 基线阻抗上的45 mΩ-pp
噪声
SPI, I2C
ECG_RLD
CLK_I,CLK_Q
RESP1
ECG1
ECG CHANNEL 2/
BIO-Z RECEIVE
128-FIFO
ADC
DEMOD
DEMOD
LPF
RESP2
ECG2
INA
LPF
RESP3
ECG3
HPF1
Pace
Detect
Analog signal conditioning for
Pace detect
RESP4
ECG4
PACE DETECT PACE DETECT
• 双通道ECG 通道：
LEAD-
ON DET
CLK_I,CLK_Q
– Bio-Z 接收器，可配置为第2 个ECG 通道
• 外部时钟和内部振荡器模式
7b
DAC
Attenuator
DDS
BIO-Z TRANSMIT
PLL
• 采样深度为128 的FIFO，24 位字
• SPITM，I2C 接口：可通过引脚进行选择
• 2.6mm × 2.6mm DSBGA 封装，0.4mm 间距
• 电源：Rx：1.7V - 1.9V，IO：1.7V - 1.9V
方框图
2 应用
• 用于住院和门诊监测的无线贴片
• 用于心律失常检测的事件监视器
• 手持式ECG 监护仪
• 便携式多导联ECG
• 病人生命体征监控：动态心电图、事件、压力和远
程医疗
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SBASAE1
AFE4960
www.ti.com.cn
ZHCSOJ7A –OCTOBER 2021 –REVISED MARCH 2022
4 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
4.1 Documentation Support
4.1.1 Related Documentation
For related documentation, see the following:
• AFE4960 EVM User's Guide, SBAU385
• Analog Front End for 3-Lead and 5-Lead ECG, SBAA536
• 5-Lead ECG Application Report, SBAA523
These documents are available upon request.
4.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
4.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
4.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
4.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
4.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
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Product Folder Links: AFE4960
PACKAGE OPTION ADDENDUM
www.ti.com
13-Jun-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
AFE4960YBGR
AFE4960YBGT
ACTIVE
ACTIVE
DSBGA
DSBGA
YBG
YBG
36
36
3000 RoHS & Green
250 RoHS & Green
SAC396
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
AFE4960
AFE4960
Samples
Samples
SAC396
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Jun-2022
Addendum-Page 2
PACKAGE OUTLINE
YBG0036
DSBGA - 0.5 mm max height
SCALE 6.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.05 C
0.20
0.14
BALL TYP
2 TYP
SYMM
F
E
D
C
2
TYP
SYMM
D: Max = 2.59 mm, Min = 2.53 mm
E: Max = 2.59 mm, Min = 2.53 mm
B
A
0.4 TYP
0.27
2
1
4
5
6
3
36X
0.23
0.015
C A B
0.4 TYP
4224846/A 03/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.23)
2
1
4
5
6
A
(0.4) TYP
B
C
SYMM
D
E
F
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
(
0.23)
METAL
(
0.23)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4224846/A 03/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YBG0036
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
36X ( 0.25)
(0.4) TYP
(R0.05) TYP
6
2
1
4
5
A
B
C
SYMM
METAL
TYP
D
E
F
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 30X
4224846/A 03/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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