74ACT11623DWE4 [TI]
Octal Bus Transceivers With 3-State Outputs 24-SOIC -40 to 85;
| 型号： | 74ACT11623DWE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Octal Bus Transceivers With 3-State Outputs 24-SOIC -40 to 85 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总16页 (文件大小：574K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀ ꢁ ꢂꢃ ꢄꢅꢅꢆ ꢇꢈ
ꢉ ꢃꢄꢂꢊꢋꢌ ꢍꢎꢋ ꢄꢏꢂ ꢐꢎ ꢃ ꢑꢒ ꢓ ꢑꢏ
ꢔ ꢒꢄ ꢕꢋ ꢈ ꢖꢎꢄꢂꢄ ꢑꢋ ꢉ ꢍꢄ ꢗꢍ ꢄꢎ
ꢘ
SCAS059A − D2957, JULY 1987 − REVISED APRIL 1993
DW OR NT PACKAGE
(TOP VIEW)
• Local Bus-Latch Capability
• Inputs Are TTL-Voltage Compatible
• Flow-Through Architecture Optimizes
1
24
23
22
21
20
19
18
17
16
15
14
13
A1
A2
GAB
B1
PCB Layout
2
3
• Center-Pin V
and GND Configurations
Minimize High-Speed Switching Noise
A3
B2
CC
4
A4
B3
5
GND
GND
GND
GND
A5
B4
• EPICt (Enhanced-Performance Implanted
6
V
CMOS) 1-mm Process
CC
7
V
CC
• 500-mA Typical Latch-Up Immunity
at 125°C
• Package Options Include Plastic Small-
Outline Packages and Standard Plastic
300-mil DIPs
8
B5
B6
9
10
11
12
A6
A7
A8
B7
B8
GBA
description
The 74ACT11623 is designed for asynchronous two-way communication between data buses. The control
function implementation allows for maximum flexibility in timing.
The device allows data transmission from the A bus to the B bus or from the B bus to the A bus depending upon
the logic levels at the enable inputs (GBA and GAB). The enable inputs can be used to disable the device so
that the buses are effectively isolated.
The dual-enable configuration gives these devices the capability to store data by simultaneous enabling of GBA
and GAB. Each output reinforces its input in this transceiver configuration. Thus, when both control inputs are
enabled and all other data sources to the two sets of bus lines are at high impedance, both sets of bus lines (16
in all) will remain at their last states. The 8-bit codes appearing on the two sets of buses will be identical for the
74ACT11623.
The 74ACT11623 is characterized for operation from − 40°C to 85°C.
FUNCTION TABLE
ENABLE INPUTS
OPERATION
GBA
L
GAB
L
H
L
B data to A bus
A data to B bus
Isolation
H
H
B data to A bus,
A data to B bus
L
H
EPIC is a trademark of Texas Instruments Incorporated.
ꢗꢏ ꢉ ꢙꢍ ꢃ ꢄꢒ ꢉꢐ ꢙ ꢂꢄꢂ ꢚꢛ ꢜ ꢝꢞ ꢟꢠ ꢡꢚꢝ ꢛ ꢚꢢ ꢣꢤ ꢞ ꢞ ꢥꢛꢡ ꢠꢢ ꢝꢜ ꢦꢤꢧ ꢨꢚꢣ ꢠꢡ ꢚꢝꢛ ꢩꢠ ꢡꢥ ꢪ
ꢗꢞ ꢝ ꢩꢤꢣ ꢡ ꢢ ꢣ ꢝꢛ ꢜꢝ ꢞ ꢟ ꢡ ꢝ ꢢ ꢦꢥ ꢣ ꢚꢜ ꢚꢣꢠ ꢡꢚ ꢝꢛꢢ ꢦꢥ ꢞ ꢡꢫ ꢥ ꢡꢥ ꢞ ꢟꢢ ꢝꢜ ꢄꢥꢬ ꢠꢢ ꢒꢛꢢ ꢡꢞ ꢤꢟ ꢥꢛꢡ ꢢ
ꢢ ꢡ ꢠ ꢛꢩ ꢠ ꢞꢩ ꢭ ꢠ ꢞꢞ ꢠ ꢛ ꢡꢮꢪ ꢗꢞ ꢝ ꢩꢤꢣ ꢡꢚꢝꢛ ꢦꢞ ꢝꢣ ꢥꢢ ꢢꢚ ꢛꢯ ꢩꢝꢥ ꢢ ꢛꢝꢡ ꢛꢥ ꢣꢥ ꢢꢢ ꢠꢞ ꢚꢨ ꢮ ꢚꢛꢣ ꢨꢤꢩ ꢥ
ꢡ ꢥ ꢢ ꢡꢚ ꢛꢯ ꢝꢜ ꢠ ꢨꢨ ꢦꢠ ꢞ ꢠ ꢟ ꢥ ꢡ ꢥ ꢞ ꢢ ꢪ
Copyright 1993, Texas Instruments Incorporated
2−1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄ ꢅꢅ ꢆꢇ ꢈ
ꢉꢃ ꢄꢂ ꢊꢋ ꢌ ꢍꢎ ꢋ ꢄꢏꢂ ꢐꢎ ꢃꢑ ꢒ ꢓꢑ ꢏ
ꢔꢒ ꢄ ꢕ ꢋꢈ ꢖꢎ ꢄꢂꢄꢑ ꢋ ꢉ ꢍꢄ ꢗꢍꢄ ꢎ
ꢘ
SCAS059A − D2957, JULY 1987 − REVISED APRIL 1993
†
logic symbol
logic diagram (positive logic)
13
GBA
GAB
EN1
EN2
GBA
24
1
23
22
21
20
17
16
15
14
GAB
A1
A1
A2
A3
A4
A5
A6
A7
A8
1
B1
B2
B3
B4
B5
B6
B7
B8
2
2
B1
B2
3
4
A2
9
10
11
12
To Six Other Transceivers
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
‡
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
+ 0.5 V
+ 0.5 V
I
CC
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
I
CC
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2−2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄꢅꢅꢆ ꢇꢈ
ꢉ ꢃꢄꢂꢊꢋꢌ ꢍꢎꢋ ꢄꢏꢂ ꢐꢎ ꢃ ꢑꢒ ꢓ ꢑꢏ
ꢔ ꢒꢄ ꢕꢋ ꢈ ꢖꢎꢄꢂꢄ ꢑꢋꢉ ꢍ ꢄꢗ ꢍꢄ ꢎ
ꢘ
SCAS059A − D2957, JULY 1987 − REVISED APRIL 1993
recommended operating conditions
MIN
4.5
2
MAX
UNIT
V
V
V
V
V
V
Supply voltage
5.5
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
V
0.8
V
0
0
V
V
V
I
CC
Output voltage
V
O
CC
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
−24
24
mA
mA
ns/V
°C
OH
OL
I
Dt/Dv
0
10
T
− 40
85
A
electrical characteristics over recommended operating free-air temperature range
T
A
= 25°C
PARAMETER
TEST CONDITIONS
V
MIN
MAX
UNIT
CC
MIN
4.4
TYP
MAX
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
4.4
5.4
I
= − 50 mA
OH
5.4
3.94
4.94
3.8
V
V
OH
OL
I
I
= − 24 mA
= − 75 mA
OH
4.8
†
3.85
OH
0.1
0.1
0.1
0.1
0.44
0.44
1.65
5
I
= 50 mA
OL
0.36
0.36
V
V
I
I
= 24 mA
OL
†
= 75 mA
OL
‡
I
I
I
A or B ports
V
= V or GND
0.5
0.1
4
mA
mA
µA
OZ
O
CC
GBA or GAB
V = V
or GND
or GND,
1
I
I
CC
CC
V = V
I = 0
O
40
CC
I
§
One input at 3.4 V, Other inputs at GND or V
5.5 V
0.9
1
mA
DI
CC
CC
C
C
GBA or GAB
A or B ports
V = V
CC
or GND
or GND
5 V
5 V
4
pF
pF
i
I
V = V
O CC
20
io
†
‡
§
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
For I/O ports, the parameter I includes the input leakage.
This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or V
OZ
.
CC
2−3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄ ꢅꢅ ꢆꢇ ꢈ
ꢉꢃ ꢄꢂ ꢊꢋ ꢌ ꢍꢎ ꢋ ꢄꢏꢂ ꢐꢎ ꢃꢑ ꢒ ꢓꢑ ꢏ
ꢔꢒ ꢄ ꢕ ꢋꢈ ꢖꢎ ꢄꢂꢄꢑ ꢋ ꢉ ꢍꢄ ꢗꢍꢄ ꢎ
ꢘ
SCAS059A − D2957, JULY 1987 − REVISED APRIL 1993
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
6
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
MAX
UNIT
ns
MIN
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
MAX
7.5
7.2
8.6
9
t
t
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
8.5
7.9
PLH
PHL
PZH
A or B
GBA
GBA
GAB
GAB
B or A
5.5
6.9
6.9
8.1
8.5
7.7
7.7
7.1
7.3
t
t
t
t
9.7
A
A
B
B
ns
t
10
PZL
10
10.9
11.5
10.7
10.9
9.5
PHZ
ns
t
10.5
9.3
9.7
8.8
9.2
PLZ
PZH
ns
t
PZL
PHZ
ns
t
10
PLZ
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
= 50 pF, f = 1 MHz
L
TYP
UNIT
Outputs enabled
Outputs disabled
41
8
C
Power dissipation capacitance per transceiver
C
pF
pd
2−4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂꢃ ꢄꢅꢅꢆ ꢇꢈ
ꢉ ꢃꢄꢂꢊꢋꢌ ꢍꢎꢋ ꢄꢏꢂ ꢐꢎ ꢃ ꢑꢒ ꢓ ꢑꢏ
ꢔ ꢒꢄ ꢕꢋ ꢈ ꢖꢎꢄꢂꢄ ꢑꢋꢉ ꢍ ꢄꢗ ꢍꢄ ꢎ
ꢘ
SCAS059A − D2957, JULY 1987 − REVISED APRIL 1993
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
TEST
S1
S1
t
/t
Open
PLH PHL
/t
500 Ω
Open
GND
From Output
Under Test
t
2 × V
CC
GND
PLZ PZL
t
/t
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
LOAD CIRCUIT
Output
Control
(low-level
enabling)
3 V
0 V
1.5 V
1.5 V
t
PZL
3 V
0 V
t
PLZ
Input
(see Note B)
Output
Waveform 1
[ V
CC
1.5 V
1.5 V
50% V
CC
20% V
S1 at 2 × V
(see Note C)
CC
CC
V
OL
t
PLH
t
PHZ
t
PHL
t
PZH
Output
Waveform 2
S1 at GND
V
OH
V
OH
80% V
CC
50% V
CC
50% V
Output
CC
50% V
CC
V
OL
[ 0 V
(see Note C)
VOLTAGE WAVEFORMS
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t = 3 ns, t = 3 ns.
O
r
f
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
2−5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
74ACT11623DW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
24
24
24
24
24
24
24
24
24
24
24
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11623DWE4
74ACT11623DWE4
74ACT11623DWG4
74ACT11623DWG4
74ACT11623DWR
74ACT11623DWR
74ACT11623DWRE4
74ACT11623DWRE4
74ACT11623DWRG4
74ACT11623DWRG4
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
74ACT11623DWR
SOIC
DW
24
2000
330.0
24.4
10.75
15.7
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC DW 24
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 41.0
74ACT11623DWR
2000
Pack Materials-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
74ACT11623DW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
24
24
24
24
24
24
24
24
24
24
24
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ACT11623DWE4
74ACT11623DWE4
74ACT11623DWG4
74ACT11623DWG4
74ACT11623DWR
74ACT11623DWR
74ACT11623DWRE4
74ACT11623DWRE4
74ACT11623DWRG4
74ACT11623DWRG4
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
74ACT11623DWR
SOIC
DW
24
2000
330.0
24.4
10.75
15.7
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC DW 24
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 41.0
74ACT11623DWR
2000
Pack Materials-Page 2
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相关型号：
74ACT11623NT
ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, PDIP24, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-24
ROCHESTER
74ACT11623NTE4
IC ACT SERIES, 8-BIT TRANSCEIVER, TRUE OUTPUT, PDIP24, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-24, Bus Driver/Transceiver
TI
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