74ABT16823DGGRG4 [TI]
18-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS; 18位总线接口触发器具有三态输出
| 型号： | 74ABT16823DGGRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 18-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS |
| 文件： | 总17页 (文件大小：389K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54ABT16823, SN74ABT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS217C – JUNE 1992 – REVISED JANUARY 1997
SN54ABT16823 . . . WD PACKAGE
SN74ABT16823 . . . DGG OR DL PACKAGE
(TOP VIEW)
Members of the Texas Instruments
Widebus Family
State-of-the-Art EPIC-ΙΙB BiCMOS Design
Significantly Reduces Power Dissipation
1CLR
1OE
1Q1
GND
1Q2
1Q3
1CLK
1CLKEN
1D1
GND
1D2
1
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
High-Impedance State During Power Up
and Power Down
2
3
4
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
5
1D3
6
V
V
7
CC
CC
Typical V
(Output Ground Bounce) < 1 V
OLP
1Q4
1Q5
1Q6
GND
1Q7
1Q8
1Q9
2Q1
2Q2
2Q3
GND
2Q4
2Q5
2Q6
1D4
1D5
1D6
GND
1D7
1D8
1D9
2D1
2D2
2D3
GND
2D4
2D5
2D6
8
at V
= 5 V, T = 25°C
CC
A
9
Distributed V
Minimizes High-Speed Switching Noise
and GND Pin Configuration
CC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Flow-Through Architecture Optimizes
PCB Layout
High-Drive Outputs (–32-mA I
,
OH
64-mA I
)
OL
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL), Thin Shrink
Small-Outline (DGG) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
description
V
V
CC
CC
2Q7
2Q8
GND
2Q9
2OE
2CLR
2D7
2D8
GND
2D9
2CLKEN
2CLK
These 18-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing wider buffer
registers, I/O ports, bidirectional bus drivers with
parity, and working registers.
The ’ABT16823 can be used as two 9-bit flip-flops
or one 18-bit flip-flop. With the clock-enable
(CLKEN) input low, the D-type flip-flops enter data
on the low-to-high transitions of the clock. Taking
CLKEN high disables the clock buffer, latching the
outputs. Taking the clear (CLR) input low causes
the Q outputs to go low independently of the clock.
A buffered output-enable (OE) input can be used to place the nine outputs in either a normal logic state (high
or low logic level) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
thebuslinessignificantly. Thehigh-impedancestateandincreaseddriveprovidethecapabilitytodrivebuslines
without need for interface or pullup components.
OE does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated.
Copyright 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT16823, SN74ABT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS217C – JUNE 1992 – REVISED JANUARY 1997
description (continued)
When V
is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down.
CC
However, to ensure the high-impedance state above 2.1 V, OE should be tied to V
the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.
through a pullup resistor;
CC
The SN54ABT16823 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABT16823 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each 9-bit flip-flop)
INPUTS
OUTPUT
Q
OE
L
CLK
X
D
X
H
L
CLR CLKEN
L
H
H
H
H
X
X
L
L
H
L
L
↑
L
L
↑
L
L
L
X
X
X
Q
Q
0
0
L
H
X
X
H
X
Z
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT16823, SN74ABT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS217C – JUNE 1992 – REVISED JANUARY 1997
†
logic symbol
2
EN1
R2
1OE
1
1CLR
1CLKEN
1CLK
55
56
27
28
30
29
G3
3C4
EN5
R6
2OE
2CLR
2CLKEN
2CLK
G7
7C8
54
52
51
49
48
47
45
44
43
42
41
40
38
37
36
34
33
31
3
1D1
1D2
1D3
1D4
1D5
1D6
1D7
1D8
1D9
2D1
2D2
2D3
2D4
2D5
2D6
2D7
2D8
2D9
4D
1Q1
5
1, 2
1Q2
6
1Q3
8
1Q4
9
1Q5
10
1Q6
12
1Q7
13
1Q8
14
1Q9
15
8D
2Q1
16
5, 6
2Q2
17
2Q3
19
2Q4
20
2Q5
21
2Q6
23
2Q7
24
2Q8
26
2Q9
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT16823, SN74ABT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS217C – JUNE 1992 – REVISED JANUARY 1997
logic diagram (positive logic)
2
1OE
1
1CLR
55
1CLKEN
CE
R
56
3
1CLK
C1
1Q1
54
1D1
1D
To Eight Other Channels
27
28
2OE
2CLR
30
29
2CLKEN
2CLK
CE
R
15
C1
1D
2Q1
42
2D1
To Eight Other Channels
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT16823, SN74ABT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS217C – JUNE 1992 – REVISED JANUARY 1997
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Voltage range applied to any output in the high or power-off state, V
. . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
O
Current into any output in the low state, I : SN54ABT16823 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
O
SN74ABT16823 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA
IK
OK
I
Output clamp current, I
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
O
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81°C/W
JA
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51.
recommended operating conditions (see Note 3)
SN54ABT16823 SN74ABT16823
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
V
Supply voltage
5.5
5.5
V
V
CC
High-level input voltage
Low-level input voltage
Input voltage
IH
0.8
0.8
V
IL
0
V
0
V
CC
V
I
CC
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Power-up ramp rate
–24
48
–32
64
mA
mA
ns/V
µs/V
°C
OH
OL
∆t/∆v
∆t/∆V
Outputs enabled
10
10
200
–55
200
–40
CC
T
Operating free-air temperature
125
85
A
NOTE 3: Unused inputs must be held high or low to prevent them from floating.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT16823, SN74ABT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS217C – JUNE 1992 – REVISED JANUARY 1997
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54ABT16823 SN74ABT16823
A
PARAMETER
TEST CONDITIONS
UNIT
†
MIN TYP
MAX
MIN
MAX
MIN
MAX
V
V
V
V
V
= 4.5 V,
= 4.5 V,
= 5 V,
I = –18 mA
–1.2
–1.2
–1.2
V
IK
CC
CC
CC
I
I
I
I
I
I
I
= –3 mA
= –3 mA
= –24 mA
= –32 mA
= 48 mA
= 64 mA
2.5
3
2.5
3
2.5
3
OH
OH
OH
OH
OL
OL
V
V
OH
2
2
V
= 4.5 V
= 4.5 V
CC
CC
2*
2
0.55
0.55
V
V
V
OL
0.55*
0.55
100
mV
hys
V
= 0 to 5.5 V,
CC
I
I
I
I
I
±1
±50
±50
±1
±50
±50
50
±1
±50
±50
10
µA
I
V = V
I
or GND
CC
V
V
= 0 to 2.1 V,
= 0.5 V to 2.7 V, OE = X
CC
O
µA
µA
µA
µA
OZPU
OZPD
OZH
V
V
= 2.1 V to 0,
= 0.5 V to 2.7 V, OE = X
CC
O
V
V
= 2.1 V to 5.5 V,
= 2.7 V, OE ≥ 2 V
CC
O
**
10
V
V
= 2.1 V to 5.5 V,
= 0.5 V, OE ≥ 2 V
CC
O
**
–10
–50
–10
OZL
I
I
I
V
V
V
= 0,
V or V ≤ 4.5 V
±100
50
±100
50
µA
µA
off
CC
CC
CC
I
O
Outputs high
= 5.5 V,
= 5.5 V,
V
= 5.5 V
50
–200
0.5
CEX
O
O
‡
V
= 2.5 V
–50
–100
–200
0.5
–50
–50
–200
0.5
mA
O
Outputs high
Outputs low
V
= 5.5 V, I = 0,
O
or GND
CC
CC
I
80
80
80
mA
CC
V = V
I
Outputs disabled
0.5
0.5
0.5
V
= 5.5 V, One input at 3.4 V,
CC
Other inputs at V
§
1.5
1.5
1.5
mA
∆I
CC
or GND
CC
V = 2.5 V or 0.5 V
C
C
3.5
7.5
pF
pF
i
I
V
O
= 2.5 V or 0.5 V
o
* On products compliant to MIL-PRF-38535, this parameter does not apply.
** These limits apply only to the SN74ABT16823.
†
‡
§
All typical values are at V
= 5 V.
CC
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
This is the increase in supply current for each input that is at the specified TTL voltage level rather than V
or GND.
CC
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT16823, SN74ABT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS217C – JUNE 1992 – REVISED JANUARY 1997
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
V
T
= 5 V,
= 25°C
CC
A
SN54ABT16823 SN74ABT16823
UNIT
MIN
0
MAX
MIN
0
MAX
MIN
0
MAX
f
t
Clock frequency
Pulse duration
150
150
150
MHz
ns
clock
CLR low
3.3
3.3
1.6
1.7
2.8
1.2
0.6
3.3
3.3
2
3.3
3.3
1.6
1.7
2.8
1.2
0.6
w
CLK high or low
CLR inactive
Data
t
Setup time before CLK↑
Hold time after CLK↑
1.7
2.8
1.2
0.6
ns
ns
su
h
CLKEN low
Data
t
CLKEN low
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C = 50 pF (unless otherwise noted) (see Figure 1)
L
SN54ABT16823
= 5 V,
FROM
(INPUT)
TO
(OUTPUT)
V
CC
A
PARAMETER
UNIT
T
= 25°C
MIN
MAX
MIN
150
1.6
2.1
1.9
1
TYP
MAX
f
t
t
t
t
t
t
t
150
1.6
2.1
1.9
1
MHz
ns
max
PLH
PHL
PHL
PZH
PZL
PHZ
PLZ
3.9
3.9
4.1
3.1
3.5
4.3
4.3
5.5
5.4
5.3
4.2
4.6
6
7.7
6.4
6.3
5.1
5.7
6.8
9.9
CLK
CLR
OE
Q
Q
Q
ns
ns
1.5
2.2
1.6
1.5
2.2
1.6
Q
ns
OE
6.4
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C = 50 pF (unless otherwise noted) (see Figure 1)
L
SN74ABT16823
= 5 V,
FROM
(INPUT)
TO
(OUTPUT)
V
CC
A
PARAMETER
UNIT
T
= 25°C
MIN
MAX
MIN
150
1.6
2.1
1.9
1
TYP
MAX
f
t
t
t
t
t
t
t
150
1.6
2.1
1.9
1
MHz
ns
max
PLH
PHL
PHL
PZH
PZL
PHZ
PLZ
3.9
3.9
4.1
3.1
3.5
4.3
4.3
5.5
5.4
5.3
4.2
4.6
5.6
6.4
6.8
6
CLK
CLR
OE
Q
Q
Q
6.1
4.9
5.5
6.1
8.7
ns
ns
1.5
2.2
1.6
1.5
2.2
1.6
Q
ns
OE
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT16823, SN74ABT16823
18-BIT BUS-INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCBS217C – JUNE 1992 – REVISED JANUARY 1997
PARAMETER MEASUREMENT INFORMATION
7 V
Open
S1
500 Ω
From Output
Under Test
TEST
S1
GND
t
t
/t
Open
7 V
PLH PHL
/t
C
= 50 pF
L
t
500 Ω
PLZ PZL
/t
(see Note A)
Open
PHZ PZH
LOAD CIRCUIT
3 V
0 V
Timing Input
Data Input
1.5 V
t
w
t
t
h
su
3 V
0 V
3 V
0 V
Input
1.5 V
1.5 V
1.5 V
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3 V
0 V
3 V
0 V
Output
Control
1.5 V
1.5 V
Input
1.5 V
1.5 V
t
PZL
t
t
PHL
PLH
t
PLZ
Output
Waveform 1
S1 at 7 V
V
V
3.5 V
OH
1.5 V
1.5 V
1.5 V
1.5 V
Output
V
V
+ 0.3 V
– 0.3 V
OL
V
OL
OL
(see Note B)
t
PHZ
t
PLH
t
t
PZH
PHL
Output
Waveform 2
S1 at Open
(see Note B)
V
OH
V
V
OH
OH
1.5 V
1.5 V
Output
≈ 0 V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A.
C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
5962-9584201QXA
ACTIVE
ACTIVE
CFP
WD
56
56
1
TBD
A42 SNPB
N / A for Pkg Type
74ABT16823DGGRE4
TSSOP
DGG
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74ABT16823DGGRG4
SN74ABT16823DGGR
SN74ABT16823DGVR
SN74ABT16823DGVRE4
SN74ABT16823DGVRG4
SN74ABT16823DL
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TVSOP
TVSOP
TVSOP
SSOP
SSOP
SSOP
SSOP
CFP
DGG
DGG
DGV
DGV
DGV
DL
56
56
56
56
56
56
56
56
56
56
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ABT16823DLG4
SN74ABT16823DLR
SN74ABT16823DLRG4
SNJ54ABT16823WD
DL
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
WD
1
TBD
A42 SNPB
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
24
SN74ABT16823DGGR
SN74ABT16823DGVR
SN74ABT16823DLR
DGG
DGV
DL
56
56
56
SITE 41
SITE 41
SITE 41
8.6
6.8
15.6
10.1
1.8
1.6
3.1
12
12
16
24
24
32
Q1
Q1
Q1
330
24
330
32
11.35
18.67
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74ABT16823DGGR
SN74ABT16823DGVR
SN74ABT16823DLR
DGG
DGV
DL
56
56
56
SITE 41
SITE 41
SITE 41
346.0
346.0
346.0
346.0
346.0
346.0
41.0
41.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997
WD (R-GDFP-F**)
CERAMIC DUAL FLATPACK
48 LEADS SHOWN
0.120 (3,05)
0.075 (1,91)
0.009 (0,23)
0.004 (0,10)
1.130 (28,70)
0.870 (22,10)
0.370 (9,40)
0.250 (6,35)
0.390 (9,91)
0.370 (9,40)
0.370 (9,40)
0.250 (6,35)
1
48
0.025 (0,635)
A
0.014 (0,36)
0.008 (0,20)
24
25
NO. OF
LEADS**
48
56
0.740
0.640
(16,26) (18,80)
A MAX
A MIN
0.610 0.710
(15,49) (18,03)
4040176/D 10/97
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification only
E. Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO-146AA
GDFP1-F56 and JEDEC MO-146AB
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号：
74ABT16825ADGG-T
IC ABT SERIES, DUAL 9-BIT DRIVER, TRUE OUTPUT, PDSO56, 6.10 MM, PLASTIC, SOT-364-1, TSSOP2-56, Bus Driver/Transceiver
NXP
74ABT16827ADGG,112
74ABT(H)16827A - 20-bit buffer/line driver, non-inverting (3-State) TSSOP 56-Pin
NXP
74ABT16827ADGG,118
74ABT(H)16827A - 20-bit buffer/line driver, non-inverting (3-State) TSSOP 56-Pin
NXP
74ABT16827ADGG-T
IC ABT SERIES, DUAL 10-BIT DRIVER, TRUE OUTPUT, PDSO56, 6.10 MM, PLASTIC, SOT-364-1, TSSOP2-56, Bus Driver/Transceiver
NXP
©2020 ICPDF网 联系我们和版权申明