5962-89905012A [TI]
High Speed PWM Controller; 高速PWM控制器
| 型号： | 5962-89905012A |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | High Speed PWM Controller |
| 文件： | 总13页 (文件大小：2953K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
5962-89905012A
5962-8990501EA
UC1823J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CDIP
CDIP
LCCC
LCCC
SOIC
FK
J
20
16
16
16
20
20
16
1
1
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
A42
Call TI
Call TI
J
1
N / A for Pkg Type
N / A for Pkg Type
UC1823J883B
UC1823L
J
1
A42
FK
FK
DW
1
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
CU NIPDAU Level-2-260C-1 YEAR
UC1823L883B
UC2823DW
1
40
Green (RoHS
& no Sb/Br)
UC2823DWG4
UC2823DWTR
UC2823DWTRG4
UC2823N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
PDIP
PDIP
PLCC
PLCC
SOIC
SOIC
SOIC
SOIC
PDIP
DW
DW
DW
N
16
16
16
16
16
20
20
16
16
16
16
16
40
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
UC2823NG4
N
25
Green (RoHS
& no Sb/Br)
UC2823QTR
UC2823QTRG3
UC3823DW
FN
FN
DW
DW
DW
DW
N
1000
1000
40
Green (RoHS
& no Sb/Br)
CU SN
CU SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU N / A for Pkg Type
UC3823DWG4
UC3823DWTR
UC3823DWTRG4
UC3823N
40
Green (RoHS
& no Sb/Br)
2000
2000
25
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2011
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
UC3823NG4
UC3823Q
PDIP
PLCC
PLCC
PLCC
PLCC
N
16
20
20
20
20
25
46
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
FN
FN
FN
FN
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
UC3823QG3
UC3823QTR
UC3823QTRG3
46
Green (RoHS
& no Sb/Br)
1000
1000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1823, UC3823 :
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2011
Catalog: UC3823
•
Military: UC1823
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
•
Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
UC2823DWTR
UC2823QTR
UC3823DWTR
UC3823QTR
SOIC
PLCC
SOIC
PLCC
DW
FN
16
20
16
20
2000
1000
2000
1000
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
10.85 10.8
10.3 10.3
10.85 10.8
10.3 10.3
2.7
4.9
2.7
4.9
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
Q1
Q1
Q1
Q1
DW
FN
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
UC2823DWTR
UC2823QTR
UC3823DWTR
UC3823QTR
SOIC
PLCC
SOIC
PLCC
DW
FN
16
20
16
20
2000
1000
2000
1000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
33.0
33.0
33.0
DW
FN
Pack Materials-Page 2
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