54F163AFM [TI]
F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, CDFP16, CERAMIC, FP-16;
| 型号： | 54F163AFM |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, CDFP16, CERAMIC, FP-16 CD 逻辑集成电路 触发器 |
| 文件： | 总12页 (文件大小：425K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
54F161A,54F163A
54F161A/54F163A Synchronous Presettable Binary Counter
Literature Number: SNOS159A
November 1994
54F/74F161A 54F/74F163A
#
Synchronous Presettable Binary Counter
General Description
Features
Y
Synchronous counting and loading
The ’F161A and ’F163A are high-speed synchronous modu-
lo-16 binary counters. They are synchronously presettable
for application in programmable dividers and have two types
of Count Enable inputs plus a Terminal Count output for
versatility in forming synchronous multi-stage counters. The
’F161A has an asynchronous Master-Reset input that over-
rides all other inputs and forces the outputs LOW. The
Y
High-speed synchronous expansion
Y
Typical count frequency of 120 MHz
Y
Guaranteed 4000V minimum ESD protection
’F163A has
a Synchronous Reset input that overrides
counting and parallel loading and allows the outputs to be
simultaneously reset on the rising edge of the clock. The
’F161A and ’F163A are high-speed versions of the ’F161
and ’F163.
Package
Number
Commercial
74F161APC
Military
Package Description
N16E
J16A
16-Lead (0.300 Wide) Molded Dual-In-Line
×
54F161ADM (Note 2)
16-Lead Ceramic Dual-In-Line
74F161ASC (Note 1)
74F161ASJ (Note 1)
M16A
M16D
W16A
E20A
N16E
J16A
16-Lead (0.150 Wide) Molded Small Outline, JEDEC
×
16-Lead (0.300 Wide) Molded Small Outline, EIAJ
×
54F161AFM (Note 2)
54F161ALM (Note 2)
16-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier, Type C
74F163APC
16-Lead (0.300 Wide) Molded Dual-In-Line
×
54F163ADM (Note 2)
16-Lead Ceramic Dual-In-Line
74F163ASC (Note 1)
74F163ASJ (Note 1)
M16A
M16D
W16A
E20A
16-Lead (0.150 Wide) Molded Small Outline, JEDEC
×
16-Lead (0.300 Wide) Molded Small Outline, EIAJ
×
54F163AFM (Note 2)
54F163ALM (Note 2)
16-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier, Type C
e
Note 2: Military grade device with environmental and burn-in processing. Use suffix
Note 1: Devices also available in 13 reel. Use suffix
SCX and SJX.
×
e
DMQB, FMQB and LMQB.
Connection Diagrams
Pin Assignment
for DIP, SOIC and Flatpak
’F161A
Pin Assignment
for LCC
’F161A
Pin Assignment
for DIP, SOIC and Flatpak
’F163A
Pin Assignment
for LCC
’F163A
Obsolete
TL/F/9486–7
TL/F/9486–1
TL/F/9486–8
TL/F/9486–2
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/F/9486
RRD-B30M75/Printed in U. S. A.
Logic Symbols
’F161A
’F163A
TL/F/9486–3
TL/F/9486–9
IEEE/IEC
’F161A
IEEE/IEC
’F163A
TL/F/9486–6
TL/F/9486–10
Unit Loading/Fan Out
54F/74F
Pin Names
Description
U.L.
Input I /I
IH IL
HIGH/LOW
Output I /I
OH OL
b
20 mA/ 0.6 mA
b
20 mA/ 1.2 mA
b
20 mA/ 0.6 mA
b
20 mA/ 0.6 mA
CEP
Count Enable Parallel Input
1.0/1.0
1.0/2.0
1.0/1.0
1.0/1.0
1.0/2.0
1.0/1.0
1.0/2.0
50/33.3
50/33.3
CET
Count Enable Trickle Input
CP
Clock Pulse Input (Active Rising Edge)
Asynchronous Master Reset Input (Active LOW)
Synchronous Reset Input (Active LOW)
Parallel Data Inputs
MR (’F161A)
SR (’F163A)
b
20 mA/ 1.2 mA
b
20 mA/ 0.6 mA
b
20 mA/ 1.2 mA
P –P
0
3
PE
Parallel Enable Input (Active LOW)
Flip-Flop Outputs
b
b
Q –Q
0
1 mA/20 mA
1 mA/20 mA
3
TC
Terminal Count Output
Obsolete
2
Functional Description
The ’F161A and ’F163A count in modulo-16 binary se-
quence. From state 15 (HHHH) they increment to state 0
(LLLL). The clock inputs of all flip-flops are driven in parallel
through a clock buffer. Thus all changes of the Q outputs
(except due to Master Reset of the ’F161A) occur as a re-
sult of, and synchronous with, the LOW-to-HIGH transition
of the CP input signal. The circuits have four fundamental
modes of operation, in order of precedence: asynchronous
reset (’F161A), synchronous reset (’F163A), parallel load,
count-up and hold. Five control inputsÐMaster Reset (MR,
’F161A), Synchronous Reset (SR, ’F163A), Parallel Enable
(PE), Count Enable Parallel (CEP) and Count Enable Trickle
(CET)Ðdetermine the mode of operation, as shown in the
Mode Select Table. A LOW signal on MR overrides all other
inputs and asynchronously forces all outputs LOW. A LOW
signal on SR overrides counting and parallel loading and
allows all outputs to go LOW on the next rising edge of CP.
A LOW signal on PE overrides counting and allows informa-
flip-flops on the next rising edge of CP. With PE and MR
(’F161A) or SR (’F163A) HIGH, CEP and CET permit count-
ing when both are HIGH. Conversely, a LOW signal on ei-
ther CEP or CET inhibits counting.
The ’F161A and ’F163A use D-type edge triggered flip-flops
and changing the SR, PE, CEP and CET inputs when the CP
is in either state does not cause errors, provided that the
recommended setup and hold times, with respect to the ris-
ing edge of CP, are observed.
The Terminal Count (TC) output is HIGH when CET is HIGH
and the counter is in state 15. To implement synchronous
multi-stage counters, the TC outputs can be used with the
CEP and CET inputs in two different ways. Please refer to
the ’F568 data sheet. The TC output is subject to decoding
spikes due to internal race conditions and is therefore not
recommended for use as a clock or asynchronous reset for
flip-flops, counters or registers.
e
Logic Equations: Count Enable
CEP CET PE
#
#
CET
tion on the Parallel Data (P ) inputs to be loaded into the
n
e
TC
Q
Q
Q
Q
#
#
#
#
3
0
1
2
State Diagram
Mode Select Table
Action on the Rising
*SR
PE
CET
CEP
Clock Edge (L)
L
H
H
H
H
X
L
X
X
H
L
X
X
H
X
L
Reset (Clear)
Load (PnxQ )
n
H
H
H
Count (Increment)
No Change (Hold)
No Change (Hold)
X
*For ’F163A only
e
e
e
H
HIGH Voltage Level
L
LOW Voltage Level
Immaterial
X
TL/F/9486–5
Obsolete
3
Block Diagram
Obsolete
4
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
b
a
55 C to 125 C
§
0 C to 70 C
§
§
b
b
b
a
65 C to 150 C
Storage Temperature
§
§
§
§
§
a
§
a
55 C to 125 C
Ambient Temperature under Bias
§
Supply Voltage
Military
Commercial
a
a a
4.5V to 5.5V
a a
4.5V to 5.5V
Junction Temperature under Bias
Plastic
55 C to 175 C
§
b
a
55 C to 150 C
§
V
Pin Potential to
CC
Ground Pin
b
a
0.5V to 7.0V
b
a
0.5V to 7.0V
Input Voltage (Note 2)
Input Current (Note 2)
Voltage Applied to Output
b
a
30 mA to 5.0 mA
e
in HIGH State (with V
Standard Output
0V)
CC
b
0.5V to 5.5V
0.5V to V
CC
b
a
TRI-STATE Output
É
Current Applied to Output
in LOW State (Max)
twice the rated I (mA)
OL
ESD Last Passing Voltage (Min)
4000V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
54F/74F
Typ
Symbol
Parameter
Units
Max
V
CC
Conditions
Min
V
V
V
V
Input HIGH Voltage
2.0
V
Recognized as a HIGH Signal
Recognized as a LOW Signal
IH
Input LOW Voltage
0.8
V
V
IL
b
e b
18 mA
Input Clamp Diode Voltage
1.2
Min
Min
I
I
CD
OH
IN
e b
Output HIGH
Voltage
54F 10% V
2.5
2.5
2.7
1 mA
CC
OH
74F 10% V
74F 5% V
V
CC
CC
e
e
e
V
Output LOW
Voltage
54F 10% V
74F 10% V
0.5
0.5
I
20 mA
2.7V
OL
CC
OL
V
Min
Max
Max
Max
0.0
CC
I
I
I
Input HIGH
Current
54F
74F
20.0
5.0
V
V
V
IH
IN
IN
mA
mA
mA
V
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
7.0V
BVI
e
V
CC
Output HIGH
54F
74F
250
50
CEX
OUT
Leakage Current
e
All Other Pins Grounded
V
Input Leakage
Test
I
1.9 mA
ID
OD
IL
ID
74F
4.75
e
All Other Pins Grounded
I
I
Output Leakage
Circuit Current
V
150 mV
IOD
74F
3.75
mA
0.0
b
e
0.5V (CEP, CP, MR, P –P )
Input LOW Current
0.6
mA
Max
V
Obsolete
IN
0
3
b
e
1.2
mA
mA
mA
Max
Max
Max
V
0.5V (CET, PE, SR)
IN
b
b
e
0V
I
I
Output Short-Circuit Current
Power Supply Current
60
150
V
OS
CC
OUT
37
55
5
AC Electrical Characteristics
74F
54F
74F
e a
T
25 C
§
5.0V
A
e
50 pF
e
50 pF
T
, V
CC
e
Mil
T
, V
A CC
Com
A
e a
Symbol
Parameter
V
Units
CC
e
C
C
L
L
e
C
50 pF
L
Min
Typ
Max
Min
Max
Min
Max
f
Maximum Count Frequency
Propagation Delay
100
120
75
90
MHz
ns
max
t
t
3.5
3.5
5.5
7.5
7.5
3.5
3.5
9.0
3.5
3.5
8.5
PLH
CP to Q (PE Input HIGH)
n
10.0
11.5
11.0
PHL
t
t
Propagation Delay
4.0
4.0
6.0
6.0
8.5
8.5
4.0
4.0
10.0
10.0
4.0
4.0
9.5
9.5
PLH
CP to Q (PE Input LOW)
n
PHL
t
t
Propagation Delay
CP to TC
5.0
5.0
10.0
10.0
14.0
14.0
5.0
5.0
16.5
15.5
5.0
5.0
15.0
15.0
PLH
ns
ns
ns
ns
PHL
t
t
Propagation Delay
CET to TC
2.5
2.5
4.5
4.5
7.5
7.5
2.5
2.5
9.0
9.0
2.5
2.5
8.5
8.5
PLH
PHL
t
Propagation Delay
PHL
5.5
4.5
9.0
8.0
12.0
10.5
5.5
4.5
14.0
12.5
5.5
4.5
13.0
11.5
MR to Q (’F161A)
n
t
Propagation Delay
MR to TC (’F161A)
PHL
AC Operating Requirements
74F
54F
74F
e a
T
25 C
§
5.0V
A
e
e
Symbol
Parameter
T
, V
CC
Mil
Max
T
, V
A CC
Com
Max
Units
A
e a
V
CC
Min
Max
Min
Min
t (H)
s
Setup Time, HIGH or LOW
5.0
5.0
5.5
5.5
5.0
5.0
t (L)
s
P to CP
n
ns
t (H)
h
Hold Time, HIGH or LOW
P to CP
n
2.0
2.0
2.5
2.5
2.0
2.0
t (L)
h
t (H)
s
Setup Time, HIGH or LOW
PE or SR to CP
11.0
8.5
13.5
10.5
11.5
9.5
t (L)
s
ns
t (H)
h
Hold Time, HIGH or LOW
PE or SR to CP
2.0
0
3.6
0
2.0
0
t (L)
h
t (H)
s
Setup Time, HIGH or LOW
CEP or CET to CP
11.0
5.0
13.0
6.0
11.5
5.0
t (L)
s
ns
t (H)
h
Hold Time, HIGH or LOW
CEP or CET to CP
0
0
0
0
0
0
t (L)
h
t
t
(H)
(L)
Clock Pulse Width (Load)
HIGH or LOW
5.0
5.0
5.0
5.0
5.0
5.0
w
ns
ns
w
t
t
(H)
(L)
Clock Pulse Width (Count)
HIGH or LOW
4.0
6.0
5.0
8.0
4.0
7.0
w
w
Obsolete
t
(L)
MR Pulse Width, LOW
(’F161A)
w
5.0
5.0
5.0
ns
t
Recovery Time
rec
6.0
6.0
6.0
ns
MR to CP (’F161A)
6
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F 161A/163A
S
C
X
Temperature Range Family
e
e
54F Military
Special Variations
e
74F Commercial
QR
Commercial grade device
with burn-in
e
QB
Military grade device with
environmental and burn-in
processing
Device Type
Package Code
e
X
Devices shipped in 13 reel
×
e
e
e
e
e
e
P
D
F
L
S
SJ
Plastic DIP
Ceramic DIP
Flatpak
Leadless Chip Carrier (LCC)
Small Outline Package SOIC JEDEC
Small Outline Package SOIC EIAJ
Temperature Range
e
a
C
M
Commercial (0 C to 70 C)
§
§
e
b a
Military ( 55 C to 125 C)
§
§
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
Obsolete
7
Physical Dimensions inches (millimeters) (Continued)
16-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J16A
Obsolete
16-Lead (0.150 Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M16A
×
8
Physical Dimensions inches (millimeters) (Continued)
16-Lead (0.300 Wide) Molded Small Outline Package, EIAJ (SJ)
×
NS Package Number M16D
Obsolete
16-Lead (0.300 Wide) Molded Dual-In-Line Package (P)
×
NS Package Number N16E
9
Physical Dimensions inches (millimeters) (Continued)
16-Lead Ceramic Flatpak (F)
NS Package Number W16A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
Obsolete
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
National Semiconductor
Corporation
National Semiconductor
GmbH
National Semiconductor National Semiconductor
Japan Ltd.
National Semiconductores
Do Brazil Ltda.
Rue Deputado Lacorda Franco
120-3A
Sao Paulo-SP
Brazil 05418-000
Tel: (55-11) 212-5066
Telex: 391-1131931 NSBR BR
Fax: (55-11) 212-1181
National Semiconductor
(Australia) Pty, Ltd.
Building 16
Business Park Drive
Monash Business Park
Nottinghill, Melbourne
Victoria 3168 Australia
Tel: (3) 558-9999
Hong Kong Ltd.
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
Tel: 1(800) 272-9959
TWX: (910) 339-9240
Livry-Gargan-Str. 10
D-82256 Furstenfeldbruck
Germany
Tel: (81-41) 35-0
Telex: 527649
Sumitomo Chemical
Engineering Center
Bldg. 7F
1-7-1, Nakase, Mihama-Ku Hong Kong
Chiba-City,
13th Floor, Straight Block,
Ocean Centre, 5 Canton Rd.
Tsimshatsui, Kowloon
Tel: (852) 2737-1600
Fax: (852) 2736-9960
Fax: (81-41) 35-1
Ciba Prefecture 261
Tel: (043) 299-2300
Fax: (043) 299-2500
Fax: (3) 558-9998
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Medical
Security
Logic
Space, Avionics and Defense www.ti.com/space-avionics-defense
Transportation and Automotive www.ti.com/automotive
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
相关型号：
54F163AFMQB
IC F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, CDFP16, CERAMIC, FP-16, Counter
NSC
54F163AFMQB
IC F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, CDFP16, CERAMIC, FP-16, Counter
TI
54F163AFMQB
Binary Counter, F/FAST Series, Synchronous, Positive Edge Triggered, 4-Bit, Up Direction, TTL, CDFP16, CERPACK-16
FAIRCHILD
54F163AFMX
F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, CDFP16, CERAMIC, FP-16
TI
54F163ALM
F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, CQCC20, CERAMIC, LCC-20
TI
54F163ALMQB
Binary Counter, F/FAST Series, Synchronous, Positive Edge Triggered, 4-Bit, Up Direction, TTL, CQCC20, CERAMIC, LCC-20
FAIRCHILD
54F163ALMQB
F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, CQCC20, CERAMIC, LCC-20
TI
54F163ALMX
F/FAST SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, CQCC20, CERAMIC, LCC-20
TI
©2020 ICPDF网 联系我们和版权申明