PINDIODESCHIP [TE]
Silicon PIN Chips;
| 型号： | PINDIODESCHIP |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Silicon PIN Chips |
| 文件： | 总7页 (文件大小：381K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Silicon PIN Chips
V20
Features
Anode
♦ Switch & Attenuator Die
♦ Extensive Selection of I-Region Lengths
♦ Hermetic
♦ Glass Passivated CERMACHIP®
♦ Oxide Passivated Planar Chips
♦ Voltage Ratings to 3000V
♦ Fast Switching Speed
♦ Low Loss
♦ High Isolation
♦ RoHS Compliant
Description
M/A-COM Technology Solutions offers a comprehensive
line of low capacitance, planar and mesa, silicon PIN
diode chips which use ceramic glass and silicon nitride
passivation technology. The Silicon PIN Chip series of
devices cover
a
broad spectrum of performance
Full Area Cathode
requirements for control circuit applications. They are
available in several choices of I-region lengths and have
been optimally designed to minimize parametric trade offs
when considering low capacitance, low series resistance,
and high breakdown voltages. Their small size and low
parasitics, make them an ideal choice for broadband, high
frequency, micro-strip hybrid assemblies.
Absolute Maximum Ratings1
TAMB = +25°C (Unless otherwise specified)
The attenuator line of PIN diode chips are a planar or
mesa construction and because of their thicker I-regions
Parameter
Absolute Maximum
and predictable Rs vs. I characteristics, they are well
suited for low distortion attenuator and switch circuits.
Incorporated in the chip’s construction is M/A-COM
Tech’s, time proven, hard glass, CERMACHIP® . The
hard glass passivation completely encapsulates the entire
PIN junction area resulting in a hermetically sealed chip
which has been qualified in many military applications.
These CERMACHIP® diodes are available in a wide
range of voltages, up to 3,000 volts, which are capable of
controlling kilowatts of RF power.
Forward Current (IF)
Reverse Voltage (VR)
Per P/N Rs vs. I Graph
Per Specification Table
175°C – Tambient°C
Theta
Power Dissipation (W)
Operating Temperature
Storage Temperature
Junction Temperature
Mounting Temperature
-55°C to +175°C
-55°C to +200°C
+175°C
Many of M/A-COM Tech’s silicon PIN diode chips are also
available in several different package styles. Please refer to
the “Packaged PIN Diode Datasheet” for case style availability
and electrical specifications located on the M/A-COM Tech
website at :
macomtech.com/datasheets/packagedpindiodes
+320°C for 10 seconds
and for high voltage, high power devices at :
1. Exceeding these limits may cause permanent damage
to the chip
macomtech.com/datasheets/MA4PK2000_3000_Series
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V20
Low Capacitance PIN Specification @ TAMB = +25°C
Nominal Characteristics
Max.
Max.
Reverse
Recovery
Time 2
TRR
Max. Rev.
Voltage3 1 MHz
VR <10 µA Cj @ -10 V RS @ 10 mA
Cap. Series Res. Carrier
Anode
Diameter Size
± 0.5
mils
Chip
Chip
I Region
Length
500 MHz
Lifetime1
TL
Thk.
± 0.5
mils
Theta
Part Number
± 0.5
mils
VDC
pF
Ω
ηS
ηS
μm
°C/W
MA4P161-134
MA4P203-134
100
0.10
1.50
150
150
80
15
25
8
13
65
3.5
3.1
3.8
1.8
3.1
13X13
13X13
13X13
13X13
13x13
6
6
100
150
200
200
0.15
0.05
0.06
0.15
1.50
1.80
2.50
1.20
13
19
19
19
75
60
30
30
MA4P7493-134
6.5
7
MADP-000165-01340W
MADP-000135-01340W
200
440
20
44
10
Notes:
1. Nominal carrier life time (TL ) specified at IF = + 10mA , IREV = - 6mA.
2. Nominal reverse recovery time specified at IF = + 20mA , IREV = - 200mA.
3. Reverse Voltage (VR) is sourced and the resultant reverse leakage current (IR) is measured to be <10μA.
Attenuator PIN Specification @ TAMB = +25°C
Nominal Characteristics
Max.
Cap. Series Res. Carrier
1MHz
Max.
Series
Res.
Series
Res.
Max. Rev.
Voltage2
Anode
Diameter Size
± 0.5
mils
Chip
Chip
Thk.
± 1
I Region
Length Theta
100MHz Lifetime1 100MHz 100MHz
Part Number
VR <10 µA Cj @ -100 V RS @ 10 mA
TL
RS @ 10 μA RS @ 1 mA
± 2
mils
VDC
pF
Ω
μS
Ω
Ω
mils
°C/W
mils
7.5 X7.53
MA47416-132
MA47418-134
200
0.15
6
2
2000
30
4
30
19X19
7
200
0.15
3
1
500
15
2
25
7.5
13X13
7
Notes:
1. Nominal carrier life time (TL) specified at IF = + 10mA, IREV = - 6mA.
2. Reverse Voltage (VR) is sourced and the resultant reverse leakage current (IR) is measured to be <10μA.
3. Anode top contact is square.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V20
CERMACHIP® PIN Chips Specification @ TAMB = +25°C
Unless
Unless
Nominal Characteristics
otherwise noted otherwise noted
Carrier I Region
Lifetime4 Length Theta
Anode
Dia.
± 0.5
Chip
Chip
Thk.
± 1.0
mils
Max. Rev.
Volt.5
VR < 10 µA
VDC
Max. Cap.
1 MHz
CJ @ -100 V
pF
Max. Series Res.
100 MHz
RS @ 100 mA
Ω
size
± 2.0
mils
Part Number
μS
μm
°C/W mils
MA4P303-134
MA4P404-132
MA4P504-132
200
250
500
0.15 @ 10 V
0.20 @ 50 V
0.20
1.5 @ 10 mA2
0.70 @ 50 mA2
0.60
0.3
20
30
20
20
3.0
6.8
13X13
20X20
20X20
27X27
27X27
23X23
27X27
32X32
62X62
10.0
10.0
10.0
0.6
1
30
50
6.8
MA4P505-131
MA4P506-131
500
500
0.35
0.70
0.45
0.30
2
3
50
50
14
11
45
10
8
13.0
15.8
12.2
17.0
21.0
37.0
11.0
12.0
13.5
13.5
14.0
18.5
21.0
28.0
MADP-000488-13740W
MA4P604-131
900
0.16 @ 50V
0.30
1.6 @ 50 mA
1.00
4
140
90
1000
1000
1000
2000
3000
3
MA4P606-131
0.60
0.70
4
90
MA4P607-212
1.30
0.40
12
30
60
127
230
350
4
MA4PK2000-2231
MA4PK3000-12521
2.40
0.20 @ 500 mA3
0.25 @ 500 mA3
2
72.0 111X111
85.0 172X172
2.90
1.5
Notes:
1. Upon completion of circuit installation, the chip must be covered with a dielectric conformal coating
such as SYLGARD 539® to prevent voltage arcing.
2. Test Frequency = 500 MHz
3. Test Frequency = 4 MHz
4. Nominal carrier lifetime (TL) specified at IF = +10 mA , IREV = - 6 mA.
5. Minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current (IREV) is
measured to be <10 μA.
Anode
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V20
Typical Series Resistance vs. Forward Current Performance
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V20
MA4PK2000 & MA4PK3000 (2kV & 3kV) Chips
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V20
Package Availability Table
Package Parasitic Capacitance
Base Part Number
MA4P161
Available ODS Package Styles
None. Use MA4P203 as alternative
None
Package Style
30
Cap. (pF)
0.18
0.18
0.30
0.18
0.75
0.15
0.27
0.13
0.42
0.15
0.30
0.18
0.13
0.35
0.80
0.80
0.20
0.16
0.90
MADP-000165
MADP-000135
MA47416
31
None
32
None
36
MA47418
None
43
MA4P203
30, 32, 94, 111, 1056
32, 36, 94, 120, 186, 255, 1088
30, 31, 36, 111, 258,1072T*
30, 120, 144, 186, 255,1072T*
36, 255, 1072T*
30, 31, 36, 255, 258, 1072T*
30, 43, 255, 258
30, 36, 258
94
MA4P303
111
MA4P404
120
MA4P504
144
MA4P505
186
MA4P506
255
258
MA4P604
MA4P606
276
MA4P607
43, 296
296
MA4P709
150
1027
1048
1056
1072
1073
MA4P7493
MA4PK2000
MA4PK3000
None
1027, 1048,1082,
1073,1074,1084,
*Note: “T” after the package style number indicates tape and reel.
1072T = 1500pcs/reel
1074
1082
1084
1088
0.90
0.80
0.90
0.12
Datasheets for electrical specifications of packaged devices
can be found at :
macomtech.com/datasheets/packagedpindiodes
and for high voltage, high power devices
macomtech.com/datasheets/MA4PK2000_3000_Series
For package outlines refer to web page:
macomtech.com/Content/outlinedrawings
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Silicon PIN Chips
V20
Die Handling and Bonding Information
Handling: All semiconductor chips should be handled with care to avoid damage or contamination
from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickup is
strongly recommended for the handling and placing of individual components. Bulk handling should
ensure that abrasion and mechanical shock are minimized.
Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS
compliant solders or electrically conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is
recommended. When hot forming gas (95%N/5%H) is applied, the work area temperature should be
approximately 290oC. The chip should not be exposed to temperatures greater than 320oC for more
than 10 seconds.
Eutectic Die Attachment Using Reflow Oven: For recommended reflow profile refer to pages 5-7
of Application Note 538 “Surface Mounting Instructions”,
Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive,
silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal
resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to
ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C for
1 hour.
Wire and Ribbon Bonding: The die anode bond pads have a Ti-Pt-Au metallization scheme, with a
final gold thickness of 1.0 micron. Thermo-compression or thermo-sonic wedge bonding of either
gold wire or ribbon is recommended. A bonder heat stage temperature setting of 200oC, tool tip
temperature of 150°C and a force of 18 to 50 grams is suggested. Ultrasonic energy may also be
used but should be adjusted to the minimum amplitude required to achieve an acceptable bond.
Excessive energy may cause the anode metallization to separate from the chip. Automatic ball or
wedge bonding may also be used.
For more detailed handling and assembly instructions, see Application Note M541, “Bonding
and Handling Procedures for Chip Diode Devices”.
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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