NPT2010_15 [TE]

DC-2.2 GHz HEMT;
NPT2010_15
型号: NPT2010_15
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

DC-2.2 GHz HEMT

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NPT2010  
Gallium Nitride 48V, 100W, DC-2.2 GHz HEMT  
Built using the SIGANTIC® process - A proprietary GaN-on-Silicon technology  
Features  
Suitable for linear and saturated applications  
Tunable from DC-2.2 GHz  
48V Operation  
Industry Standard Package  
High Drain Efficiency (>60%)  
Applications  
Defense Communications  
Land Mobile Radio  
Avionics  
DC-2.2 GHz  
100W  
GaN HEMT  
Wireless Infrastructure  
ISM Applications  
VHF/UHF/L-Band Radar  
Product Description  
The NPT2010 GaN HEMT is a wideband transistor optimized for DC-2.2 GHz operation. This  
device has been designed for CW, pulsed, and linear operation with output power levels to 100W  
(50 dBm) in an industry standard metal-ceramic package with a bolt down flange.  
RF Specifications (CW, 2.15 GHz): VDS = 48V, IDQ = 600mA, TC= 25°C  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
GSS  
Small-signal Gain  
-
17  
-
dB  
PSAT  
SAT  
GP  
Saturated Output Power  
-
-
50.5  
64  
-
-
-
-
-
dBm  
%
Efficiency at Saturated Output Power  
Gain at POUT = 95W  
13.5  
52.5  
-
15  
dB  
%
Drain Efficiency at POUT = 95W  
Drain Voltage  
61  
VDS  
48  
V
Ruggedness: Output Mismatch, all phase angles  
VSWR = 10:1, No Device Damage  
NDS-034 Rev. 1, 052413  
Page 1  
NPT2010  
DC Specifications: TC = 25°C  
Symbol  
Off Characteristics  
IDLK Drain-Source Leakage Current  
Parameter  
Min  
Typ  
Max  
Units  
-
-
-
-
24  
12  
mA  
mA  
(VGS=-8V, VDS=160V)  
IGLK  
Gate-Source Leakage Current  
(VGS=-8V, VDS=0V)  
On Characteristics  
VT  
Gate Threshold Voltage  
(VDS=48V, ID=24mA)  
-2.5  
-1.5  
-1.2  
0.2  
14  
-0.5  
V
V
VGSQ  
RON  
Gate Quiescent Voltage  
(VDS=48V, ID=600mA)  
-2.1  
-0.3  
On Resistance  
(VDS=2V, ID=180mA)  
-
-
-
-
ID, MAX  
Maximum Drain Current  
(VDS=7V pulsed, 300µS pulse width,  
0.2% Duty Cycle)  
A
Thermal Resistance Specification:  
Symbol  
Parameter  
Typ  
Units  
Thermal Resistance (Junction-to-Case),  
TJ = 200 °C  
1.75  
°C/W  
RJC  
Junction Temperature (TJ) measured using IR Microscopy, Case Temperature (TC) measured using a thermocouple embedded in  
heatsink.  
Absolute Maximum Ratings: Not simultaneous, TC = 25°C unless otherwise noted  
Symbol  
Parameter  
Max  
Units  
VDS  
VGS  
IG  
Drain-Source Voltage  
160  
-10 to 3  
48  
V
V
Gate-Source Voltage  
Gate Current  
mA  
W
PT  
Total Device Power Dissipation (Derated above 25°C)  
Storage Temperature Range  
114  
TSTG  
TJ  
-65 to 150  
225  
°C  
°C  
Operating Junction Temperature  
Human Body Model ESD Rating (per JESD22-A114)  
HBM  
Class 1A  
NDS-034 Rev. 1, 052413  
Page 2  
NPT2010  
Load-Pull Data, Reference Plane at Device Leads  
VDS=48V, IDQ=600mA, TC=25C unless otherwise noted  
Optimum Source and Load Impedances:  
(CW Drain Efficiency and Output Power Tradeoff Impedance)  
Frequency  
(MHz)  
PSAT (W)  
GSS (dB)  
Drain Efficiency  
@ PSAT (%)  
ZS ()  
ZL ()  
500  
900  
1.1 + j0.8  
1.3 - j1.7  
2.0 - j6.5  
5.9 + j2.0  
5.7 + j3.2  
2.7 - j1.9  
144  
125  
115  
26.1  
21.9  
16.6  
66.8  
71.4  
66.6  
2200  
Figure 1: CW Power/Drain Efficiency  
Tradeoff Impedances, ZO=10  
Figure 3: Efficiency vs. POUT  
Figure 2: Gain vs. POUT  
NDS-034 Rev. 1, 052413  
Page 3  
NPT2010  
2.15 GHz Narrowband Circuit  
(CW, VDS=48V, IDQ=600mA, TC=25C, unless otherwise noted)  
Figure 4: Component Placement of 2.15 GHz Narrowband Circuit for NPT2010  
Reference  
C1, C5  
C2, C6  
C3, C7  
C4, C8  
C9  
Value  
1uF  
Manufacturer  
AVX  
Part Number  
1210C105KAT2A  
C1206C104K1RACTU  
1206C103KAT2A  
C0805C102K1RACTU  
ATC600F241B  
ATC800B100B  
ATC800B1R0B  
ATC600F0R8B  
ATC600F0R9B  
ATC600F100B  
ATC800B1R5B  
ATC800B150B  
A04TJL  
0.1uF  
Kemet  
AVX  
0.01uF  
1000pF  
240pF  
Kemet  
ATC  
C10  
10pF  
ATC  
C11  
1pF  
ATC  
C12  
0.8pF  
ATC  
C13  
0.9pF  
ATC  
C14  
10pF  
ATC  
C15  
1.5pF  
ATC  
C16  
15pF  
ATC  
L1  
12.5nH  
19.4nH  
8.0nH  
CoilCraft  
CoilCraft  
CoilCraft  
Panasonic  
Rogers  
L2  
0806SQ-19NJL  
A03TJL  
L3  
R1  
15Ω  
ERJ-2RKF15R0X  
Nitronex NBD-139r1  
PCB  
RO4350, r=3.5, 0.020”  
NDS-034 Rev. 1, 052413  
Page 4  
NPT2010  
Typical Performance in 2.15 GHz Narrowband Circuit  
(CW, VDS=48V, IDQ=600mA, f=2.15GHz, TC=25C, unless otherwise noted)  
Figure 5. Electrical Schematic of 2.15 GHz Narrowband Circuit for NPT2010  
(For RF Tuning details see Component Placement Diagram Figure 4)  
Figure 6: Gain vs. POUT  
Figure 7: Drain Efficiency vs. POUT  
Figure 8: Quiescent VGS vs. Temperature  
Figure 9: Power De-rating Curve  
(TJ = 225°C, TC > 25°C)  
NDS-034 Rev. 1, 052413  
Page 5  
NPT2010  
Typical Performance in 2.15 GHz Narrowband Circuit  
(CW, VDS=48V, IDQ=600mA, f=2.15GHz, TC=25C, unless otherwise noted)  
Figure 10: 2-Tone IMD3 vs. POUT vs. IDQ  
(1MHz Tone Spacing)  
Figure 11: 2-Tone Gain vs. POUT vs. IDQ  
(1MHz Tone Spacing)  
Figure 12: 2-Tone IMD vs. POUT  
(1MHz Tone Spacing)  
NDS-034 Rev. 1, 052413  
Page 6  
NPT2010  
100-700 MHz Broadband Circuit  
(CW, VDS=48V, IDQ=600mA, TC=25C, unless otherwise noted)  
Figure 13: Component Placement of 100-700 MHz Broadband Circuit for NPT2010  
Reference  
C1  
Value  
150uF  
Manufacturer  
Nichicon  
AVX  
Part Number  
UPW1C151MED  
1210C105KAT2A  
C1206C104K1RACTU  
12061C103KAT2A  
ELXY 630ELL271MK25S  
ATC100B180  
C2, C7  
C3, C6  
C4, C5  
C8  
1uF  
0.1uF  
Kemet  
0.01uF  
270uF  
AVX  
United Chemi-Con  
ATC  
C9  
18pF  
C10, C19  
C11  
2.4pF  
ATC  
ATC100B2R4  
5.6pF  
ATC  
ATC100B5R6  
C12  
15pF  
ATC  
ATC100B150  
C13  
220pF  
ATC  
600F221FT  
C14  
12pF  
ATC  
600F120FT  
C15, C16  
C17  
82pF  
ATC  
ATC100B820  
4.7pF  
ATC  
ATC100B4R7  
C18  
2pF  
ATC  
ATC100B2R0  
R1  
49.9Ω  
Panasonic  
Panasonic  
Panasonic  
Fair-Rite  
Anaren  
Coilcraft  
16 AWG Cu Wire  
Coilcraft  
Coilcraft  
Rogers  
ERJ-6ENF49R9V  
ERJ-6RQFR33V  
ERJ-1TNF24R9U  
2673000801  
R2  
0.33Ω  
R3, R4  
F1  
24.9Ω  
Material 73  
4:1 Transformer  
1.8µH  
F2, F3  
L1  
XMT031B5012  
0805LS-182XJLC  
5 turn, 0.2"ID  
L2  
~50nH  
5nH  
L3  
A02TJL  
L4, L5  
PCB  
8nH  
A03TJL  
Nitronex NBD-120r1  
RO4350, er=3.5, 0.020”  
NDS-034 Rev. 1, 052413  
Page 7  
NPT2010  
Typical Performance in 100-700 MHz Broadband Circuit  
(CW, VDS=48V, IDQ=600mA, TC=25C, unless otherwise noted)  
Figure 14. Electrical Schematic of 100-700 MHz Broadband Circuit for NPT2010  
(For RF Tuning details see Component Placement Diagram Figure 13)  
Figure 16: Performance vs. Frequency  
Figure 15: Performance vs. Frequency  
(POUT = PSAT  
(POUT = 49dBm)  
)
Figure 17: Gain/Drain Efficiency vs. POUT  
Figure 18: Small Signal s-parameters vs. Frequency  
(f = 500MHz)  
NDS-034 Rev. 1, 052413  
Page 8  
NPT2010  
Figure 19 - AC360B-2 Metal-Ceramic Package Dimensions (all dimensions in inches [millimeters])  
Function  
Gate — RF Input  
Drain — RF Output (Cut lead)  
Source — Ground (Flange)  
NDS-034 Rev. 1, 052413  
Page 9  
NPT2010  
Nitronex, LLC  
2305 Presidential Drive  
Durham, NC 27703 USA  
+1.919.807.9100 (telephone)  
+1.919.807.9200 (fax)  
info@nitronex.com  
www.nitronex.com  
Additional Information  
This part is lead-free and is compliant with the RoHS directive  
(Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment).  
Important Notice  
Nitronex, LLC reserves the right to make corrections, modifications, enhancements, improvements and other changes to its products and  
services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information  
before placing orders and should verify that such information is current and complete. All products are sold subject to Nitronex terms and  
conditions of sale supplied at the time of order acknowledgment. The latest information from Nitronex can be found either by calling  
Nitronex at 1-919-807-9100 or visiting our website at www.nitronex.com.  
Nitronex warrants performance of its packaged semiconductor or die to the specifications applicable at the time of sale in accordance  
with Nitronex standard warranty. Testing and other quality control techniques are used to the extent Nitronex deems necessary to sup-  
port the warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
Nitronex assumes no liability for applications assistance or customer product design. Customers are responsible for their product and  
applications using Nitronex semiconductor products or services. To minimize the risks associated with customer products and applica-  
tions, customers should provide adequate design and operating safeguards.  
Nitronex does not warrant or represent that any license, either express or implied, is granted under any Nitronex patent right, copyright,  
mask work right, or other Nitronex intellectual property right relating to any combination, machine or process in which Nitronex products  
or services are used.  
Reproduction of information in Nitronex data sheets is permitted if and only if said reproduction does not alter any of the information  
and is accompanied by all associated warranties, conditions, limitations and notices. Any alteration of the contained information  
invalidates all warranties and Nitronex is not responsible or liable for any such statements.  
Nitronex products are not intended or authorized for use in life support systems, including but not limited to surgical implants into the  
body or any other application intended to support or sustain life. Should Buyer purchase or use Nitronex, LLC products for any such  
unintended or unauthorized application, Buyer shall indemnify and hold Nitronex, LLC, its officers, employees, subsidiaries, affiliates,  
distributors, and its successors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out  
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, notwithstanding if  
such claim alleges that Nitronex was negligent regarding the design or manufacture of said products.  
Nitronex and the Nitronex logo are registered trademarks of Nitronex, LLC.  
All other product or service names are the property of their respective owners.  
©Nitronex, LLC 2013 All rights reserved.  
NDS-034 Rev. 1, 052413  
Page 10  

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