MAGX-S10035-045000 [TE]

Broadband Class AB Operation;
MAGX-S10035-045000
型号: MAGX-S10035-045000
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Broadband Class AB Operation

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MAGX-000035-045000  
GaN on SiC HEMT Pulsed Power Transistor  
45 W Peak, DC-3500 MHz, 1 ms Pulse, 10% Duty  
Rev. V2  
Features  
MAGX-000035-045000  
GaN on SiC Depletion Mode Transistor  
Common-Source Configuration  
Broadband Class AB Operation  
Thermally Enhanced Cu/Mo/Cu Package  
RoHS* Compliant  
+50V Typical Operation  
MTTF = 600 years (TJ < 200°C)  
Application  
Civilian and Military Pulsed Radar  
Description  
The MAGX-000035-045000 is a gold metalized  
unmatched Gallium Nitride (GaN) on Silicon Carbide  
(SiC) RF power transistor optimized for civilian and  
military radar pulsed applications between DC -  
3500 MHz. Using state of the art wafer fabrication  
processes, these high performance transistors  
provide high gain, efficiency, bandwidth and  
ruggedness over a wide bandwidth for today’s  
demanding application needs. The MAGX-000035-  
045000 is constructed using a thermally enhanced  
Cu/Mo/Cu flanged ceramic package which provides  
excellent thermal performance. High breakdown  
voltages allow for reliable and stable operation in  
extreme mismatched load conditions unparalleled  
with older semiconductor technologies.  
Ordering Information  
Part Number  
Description  
MAGX-000035-045000  
Bulk Packaging  
MAGX-S10035-045000 Sample Board (2.7 - 3.5 GHz)  
1
1
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.  
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MAGX-000035-045000  
GaN on SiC HEMT Pulsed Power Transistor  
45 W Peak, DC-3500 MHz, 1 ms Pulse, 10% Duty  
Rev. V2  
Electrical Specifications1: Freq. = 2700-3500 MHz, TA = 25°C  
Parameter  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Units  
RF Functional Tests: VDD = 50 V, IDQ = 100 mA, 1 ms Pulse, 10% Duty  
Output Power  
Power Gain  
PIN= 4 W  
PIN= 4 W  
PIN= 4 W  
PIN= 4 W  
PIN= 4 W  
PIN= 4 W  
POUT  
GP  
45  
54  
11.3  
55  
-
-
-
-
-
-
W
dB  
%
dB  
-
10.5  
Drain Efficiency  
ηD  
48  
-
Input Return Loss  
Load Mismatch Stability  
Load Mismatch Tolerance  
IRL  
-8  
VSWR-S  
VSWR-T  
-
5:1  
10:1  
-
-
Electrical Specifications1: Freq. = 1030-1090 MHz, TA = 25°C  
Parameter  
Test Conditions  
Symbol  
Min.  
Typ.  
Max.  
Units  
RF Functional Tests: VDD = 50 V, IDQ = 100 mA, 1 ms Pulse, 10% Duty  
Output Power  
Power Gain  
PIN= 0.9 W  
PIN= 0.9 W  
PIN= 0.9 W  
PIN= 0.9 W  
PIN= 0.9 W  
PIN= 0.9 W  
POUT  
GP  
-
-
-
-
-
-
60  
18  
-
-
-
-
-
-
W
dB  
%
dB  
-
Drain Efficiency  
ηD  
64  
Input Return Loss  
Load Mismatch Stability  
Load Mismatch Tolerance  
IRL  
-8  
VSWR-S  
VSWR-T  
5:1  
10:1  
-
Electrical Characteristics: TA = 25°C  
Parameter  
DC Characteristics  
Test Conditions  
Symbol Min.  
Typ.  
Max.  
Units  
Drain-Source Leakage Current  
Gate Threshold Voltage  
Forward Transconductance  
Dynamic Characteristics  
Input Capacitance  
VGS = -8 V, VDS = 175 V  
VDS = 5 V, ID = 6 mA  
IDS  
VGS (TH)  
GM  
-
-
-3  
-
3.0  
-2  
-
mA  
V
-5  
VDS = 5 V, ID = 1500 mA  
1.1  
S
VDS = 0 V, VGS = -8 V, F = 1 MHz  
VDS = 50 V, VGS = -8 V, F = 1 MHz  
VDS = 50 V, VGS = -8 V, F = 1 MHz  
CISS  
COSS  
CRSS  
-
-
-
13.2  
5.6  
-
-
-
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
0.5  
2
2
1. Electrical Specifications measured in MACOM RF evaluation board.  
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MAGX-000035-045000  
GaN on SiC HEMT Pulsed Power Transistor  
45 W Peak, DC-3500 MHz, 1 ms Pulse, 10% Duty  
Rev. V2  
Absolute Maximum Ratings2,3,4  
Parameter  
Limit  
+65 V  
Supply Voltage (VDD) (Pulsed)  
Supply Voltage (VGg  
)
-8 to 0 V  
3 A  
Supply Current (IDMAX) for pulsed operation at VDD = 50 V  
Input Power (PIN) for pulsed operation at VDD = 50 V  
Absolute Max. Junction/Channel Temperature  
PIN (nominal) + 3 dB  
200ºC  
Power Dissipation at 85 ºC for pulsed operation at VDD = 50 V  
48 W  
MTTF (TJ<200°C)  
600 years  
Thermal Resistance, (TJ= 200 ºC)  
VDD = 50 V, IDQ = 100 mA, Pulsed 1 ms, 10% Duty Cycle  
2.3 ºC/W  
Operating Temperature  
-40 to +95ºC  
-65 to +150ºC  
See solder reflow profile  
200 V  
Storage Temperature  
Mounting Temperature  
ESD Min. - Charged Device Model (CDM)  
ESD Min. - Human Body Model (HBM)  
2. Operation of this device above any one of these parameters may cause permanent damage.  
550 V  
3. Channel temperature directly affects a device's MTTF. Channel temperature should be kept as low as possible to maximize lifetime.  
4. For saturated performance it is recommended that the sum of (3*VDD + abs(VGG)) <175 V.  
3
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MAGX-000035-045000  
GaN on SiC HEMT Pulsed Power Transistor  
45 W Peak, DC-3500 MHz, 1 ms Pulse, 10% Duty  
Rev. V2  
Test Fixture Assembly (2700-3500 MHz)  
Test Fixture Impedances  
Correct Device Sequencing  
Turning the device ON  
F (MHz)  
ZIF (Ω)  
ZOF (Ω)  
2700  
2900  
3100  
3300  
3500  
7.7 - j3.9  
8.0 - j5.2  
7.2 - j6.8  
5.2 - j7.7  
3.1 - j7.1  
7.5 + j3.0  
7.9 + j1.8  
7.5 + j8.3  
6.8 + j3.9  
6.0 + j7.1  
1. Set VGS to the pinch-off (VP), typically -5 V.  
2. Turn on VDS to nominal voltage (+50V).  
3. Increase VGS until the IDS current is reached.  
4. Apply RF power to desired level.  
Turning the device OFF  
1. Turn the RF power off.  
2. Decrease VGS down to VP.  
3. Decrease VDS down to 0 V.  
4. Turn off VGS.  
Zif  
INPUT  
NETWORK  
OUTPUT  
NETWORK  
Zof  
4
4
Contact factory for Gerber file or additional circuit information.  
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MAGX-000035-045000  
GaN on SiC HEMT Pulsed Power Transistor  
45 W Peak, DC-3500 MHz, 1 ms Pulse, 10% Duty  
Rev. V2  
Application Section  
Typical Performance Curves  
2700 - 3500 MHz, 1 ms Pulse, 10% Duty, VDD = 50 V, Idq = 100 mA, TA = 25°C  
Output Power Vs. Input Power  
Drain Efficiency Vs. Output Power  
5
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MAGX-000035-045000  
GaN on SiC HEMT Pulsed Power Transistor  
45 W Peak, DC-3500 MHz, 1 ms Pulse, 10% Duty  
Rev. V2  
Application Section  
Typical Performance Curves  
2700 - 3500 MHz, 1 ms Pulse, 10% Duty, VDD = 50 V, Idq = 100 mA, TA = 25°C  
Gain vs. Frequency  
Input Return Loss vs. Frequency  
6
6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MAGX-000035-045000  
GaN on SiC HEMT Pulsed Power Transistor  
45 W Peak, DC-3500 MHz, 1 ms Pulse, 10% Duty  
Rev. V2  
Application Section  
Typical Performance Curves  
1030 - 1090 MHz, 1 ms Pulse, 10% Duty, VDD = 50 V, Idq = 100 mA, TA = 25°C  
Output Power vs. Input Power  
Drain Efficiency Vs. Output Power  
Gain vs. Output Power  
Input Return Loss vs. Frequency  
7
7
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
MAGX-000035-045000  
GaN on SiC HEMT Pulsed Power Transistor  
45 W Peak, DC-3500 MHz, 1 ms Pulse, 10% Duty  
Rev. V2  
Outline Drawing MAGX-000035-045000  
8
8
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  

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