5962-8956703XA [TEMIC]
FIFO, 2KX9, 65ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28;
| 型号： | 5962-8956703XA |
| 厂家： | 
TEMIC SEMICONDUCTORS |
| 描述： | FIFO, 2KX9, 65ns, Asynchronous, CMOS, 0.300 INCH, THIN, CERAMIC, DIP-28 先进先出芯片 |
| 文件： | 总19页 (文件大小：146K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE
APPROVED
Updated boilerplate to reflect current requirements and made
corrections to table I and waveforms. Separated source bulletin from
the body of the drawing. - glg
01-01-30
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
A
A
A
A
REV
SHEET
15
16
17
18
A
1
A
2
A
3
A
4
A
5
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9
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REV STATUS
OF SHEETS
REV
SHEET
10
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13
14
PMIC N/A
PREPARED BY
Kenneth Rice
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Charles Reusing
THIS DRAWING IS AVAILABLE
FOR USE BY All DEPARTMENTS
APPROVED BY
Monica L. Poelking
MICROCIRCUIT, MEMORY, DIGITAL, CMOS,
2K X 9 FIFO, MONOLITHIC SILICON
AND AGENCIES OF THE
DRAWING APPROVAL DATE
27 March 1990
DEPARTMENT OF DEFENSE
AMSC N/A
REVISION LEVEL
SIZE
CAGE CODE
5962-89567
A
A
67268
SHEET
1
OF
18
DSCC FORM 2233
APR 97
5962-E180-01
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-89567
01
|
X
|
|
|
X
|
|
|
|
|
|
|
|
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit
Access time
01
02
03
04
05
7203
7203
7203
7203
7203
2K X 9-bit parallel FIFO
2K X 9-bit parallel FIFO
2K X 9-bit parallel FIFO
2K X 9-bit parallel FIFO
2K X 9-bit parallel FIFO
120 ns
80 ns
65 ns
50 ns
40 ns
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
Outline letter
Descriptive designator
Terminals
Package style
X
Y
Z
GDIP1-T28 or CDIP2-T28
GDFP2-F28
28
28
32
dual-in-line package
flat package
rectangular chip carrier
CQCC1-N32
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Terminal voltage with respect to ground............................... -0.5 V dc to +7.0 V dc
DC output current................................................................. 50 mA
Storage temperature range .................................................. -65 C to +150 C
Maximum power dissipation (PD):......................................... 1.0 W
Lead temperature (soldering, 10 seconds)........................... +260 C
Thermal resistance, junction-to-case (
JC) .......................... See MIL-STD-1835
Junction temperature (TJ)..................................................... +150 C 1/
1.4 Recommended operating conditions.
Supply voltage range (VCC)................................................... +4.5 V dc to +5.5 V dc
Minimum high level input voltage (VIH) ................................. 2.2 V dc
Maximum low level input voltage (VIL) ................................. +0.8 V dc 2/
Case operating temperature range (TC) ............................... -55 C to +125 C
1/ Maximum junction temperature may be increased to +175 C during burn-in and steady state life.
2/ 1.5 V undershoots are allowed for 10 ns once per cycle.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
A
2
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto,
cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"
certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection
provided that each coated microcircuit inspection lot (see MIL-PRF-38535, appendix A) shall be subjected to and pass the
Internal Water-Vapor Content test (test method 1018 of MIL-STD-883). The frequency of the internal water vapor testing may
not be decreased unless approved by the preparing activity.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
3
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
|
|
Conditions
-55 C < TC < +125 C
VSS = 0 V
|
|
|
|
Test
|Symbol |
|
|
|
|Group A |Device |
|subgroups |types |
|
|
|
Limits
|
|
| Unit
|
|
|
|
|
|
4.5 V < VCC < 5.5 V
unless otherwise specified
|
|
|
|
| Min | Max |
|
|
|
|
Input leakage current
|ILI
|
|0.0 V < VIN < VCC
|
|1, 2, 3
|
| All
|
|-10
|
| 10
|
| A
|
|
|
|
|
|
|
|
Output leakage current |ILO
|0.0 V < VOUT < VCC, R > VIH
|
|VCC = 4.5 V, IOL = 8.0 mA
|VIL = 0.8 V, VIH = 2.2 V
|1, 2, 3
|
|
|1, 2, 3
|
|
|1, 2, 3
|
|
| All
|
|
| All
|
|
| All
|
|
|-10
| 10
|
|
| 0.4 | V
|
|
| A
|
|
|
|
|
|
|
|
|
Output low voltage
Output high voltage
|VOL
|
|
|VOH
|
|
|
| V
|
|
|VCC = 4.5 V, IOH = -2.0 mA
|VIL = 0.8 V, VIH = 2.2 V
|
|
| 2.4 |
|
|
|
|
|
|
Operating supply
current
|ICC1
|
|
|
|
|
|ICC2
|
|
|
|ICC3
|
|
|
|CI N
|
|f = fs, outputs open
|VCC = 5.5 V
|
|VCC = 5.5 V,
|f = 15.3 MHz, outputs open
|
|R = W = RS = FL/RT = VIH,
|outputs open
|
|
|All inputs = VCC - 0.2 V,
|outputs open
|
|
|VI = 0 V , f = 1.0 MHz
|TA = +25 C, See 4.3.1c
|
|
|VO = 0 V , f = 1.0 MHz
|TA = +25 C, See 4.3.1c
|
|
|1, 2, 3
|
|
|
|
|
|1, 2, 3
|
|
|
|1, 2, 3
|
|
|
| 4
|
|
|
| 4
|
| 01-04 |
|150 |mA
|
|
|
|
|
|
|
|
|
|
|
|
05 |
|150 |
|
|
|
|
|
|
|
Standby power supply
current
|
|mA
| All
|
|
| All
|
|
|
| All
|
|
|
| All
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 25
|
|
|
|
|
Power down current
Input capacitance
Output capacitance
| 4.0 |mA
|
|
|
|
|
|
| 8
|
|pF
|
|
|
|
|
|
|
|COUT
| 12
|pF
|
|
|
|
with output deselected |
|
|
|
|
|
|
|
|
|
|
|
Functional tests
|See 4.3.1d.
|
|7, 8A, 8B | All
|
|
|
See footnotes at end of table.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
|
|
Conditions
-55 C < TC < +125 C
VSS = 0 V
|
|
|
|
Test
|Symbol |
|
|
|
|
|fS
|
|
|Group A |Device |
|subgroups |types |
|
|
|
Limits
|
|
| Unit
|
|
|
|
|
|
|
|
|
|
|
4.5 V < VCC < 5.5 V
unless otherwise specified
|
|
|
| Min | Max |
| 01
|
|
|
|
|
| 7.0 |
|MHz
| 12.5 |
Shift frequency
Read cycle time
Access time
|9, 10, 11 | 02
| 10
|
|
|
|
| 03
| 04
| 05
| 01
| 15
| 20
|
|
|
|ns
|
|
|tRC
|140 |
|100 |
|CL = 30 pF
|9, 10, 11 | 02
|
|
|
|
|tA
|
|
|
|
|tRR
|
|
|tRPW
|
|
|
|See figures 4 and 5
|
|
|
|
| 03
| 04
| 05
| 01
| 80
| 65
| 50
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|120 |
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|
|ns
|
|
|
|
|ns
|
|
|ns
|
|
|
|
|ns
|
|
|
|ns
|
|
|
|ns
|
|
|ns
|
|
|
|ns
|
|
|
|
|
| 03
| 04
| 05
| 01,02 | 20
Read recovery time
Read pulse width
|9, 10, 11 | 03,04 | 15
|
|
|
|
|
05 | 10
| 01
|120 |
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|
|
|
|
|
|
|
|
|
|
|
|
| 03
| 04
| 05
|
|
Read pulse low to data |tRLZ
bus at low-Z
|9, 10, 11 | 01-04 | 10
|
|
|
1/ |
|
|
|
|
|
|
|
|
|
|
05 | 5.0 |
|
|
|
|
Write pulse low to data |tWLZ
bus at low-Z
|9, 10, 11 | 01-04 | 10
|1/ 2/ |
|
|
|tDV
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
05 | 5.0 |
|
|
Data valid from read
pulse high
|9, 10, 11 | All
|
|
| 5.0 |
|
|
|
|
| 01
| 35
| 30
|
Read pulse high to data |tRHZ
bus high-Z
|9, 10, 11 | 02,03, |
|
|
|
|tWC
|
1/ |
|
|
|
| 04
| 05
| 01
|
|
|
|
|
|
|
|
| 25
|140 |
|100 |
| 80
| 65
| 50
Write cycle time
|9, 10, 11 | 02
|
|
|
| 03
| 04
| 05
|
|
|
|
|
|
|
See footnotes at end of table.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
|
|
Conditions
-55 C < TC < +125 C
VSS = 0 V
|
|
|
|
Test
|Symbol |
|
|
|
|Group A |Device |
|subgroups |types |
|
|
|
Limits
|
|
| Unit
|
|
|
|
|
|
4.5 V < VCC < 5.5 V
unless otherwise specified
|
|
|
| Min | Max |
|120 |
|
| 01
|
Write pulse width
|tWPW
|
|
|
|
|tWR
|
|
|tDS
|
|
|tDH
|
|
|tRSC
|
|
|
|
|tRS
|
|
|
|
|tRSR
|
|
|tRSS
|
|
|
|
|CL = 30 pF
|See figures 4 and 5
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|
|
|
|
|
|
|
|
|
|
|ns
|
|
|
|
|ns
|
|
|ns
|
|
|ns
|
|
|ns
|
|
|
|
|ns
|
|
|
|
|ns
|
|
|ns
|
|
|
|
|ns
|
|
|
|
|ns
|
|
|
|
|
|
|
| 03
| 04
| 05
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 01,02 | 20
Write recovery time
Data setup time
Data hold time
|9, 10, 11 | 03,04 | 15
|
|
|
05 | 10
| 01,02 | 40
|9, 10, 11 | 03,04 | 30
|
|
|
05 | 20
| 01-03 | 10 |
|9, 10, 11 | 04 | 5.0 |
|
|
|
05 | 0.0 |
| 01
|140 |
|100 |
| 80
| 65
| 50
Reset cycle time
|9, 10, 11 | 02
|
|
|
|
| 03
| 04
| 05
| 01
|
|
|
|120 |
Reset pulse width
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|
|
|
|
|
|
|
|
|
|
|
| 03
| 04
| 05
| 01,02 | 20
Reset recovery time
Reset setup time
|9, 10, 11 | 03,04 | 15
|
|
|
05 | 10
| 01
|120 |
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|140 |
|100 |
| 80
| 65
| 50
|
|
|
|
|
|
|
|
| 03
| 04
| 05
| 01
Retransmit cycle time
|tRTC
|9, 10, 11 | 02
|
|
|
|
|
|
|
|
| 03
| 04
| 05
| 01
|
|
|
|120 |
Retransmit pulse width |tRT
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|
|
|
|
|
|
|
|
|
|
| 03
| 04
| 05
See footnotes at end of table.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
|
|
Conditions
-55 C < TC < +125 C
VSS = 0 V
|
|
|
|
Test
|Symbol |
|
|
|
|
|tRTR
|
|Group A |Device |
|subgroups |types |
Limits
|
|
| Unit
|
|
|
|
|
|
4.5 V < VCC < 5.5 V
unless otherwise specified
|
|
|
|
|
|
| Min | Max |
| 01,02 | 20
|
|
|
|
|ns
|
Retransmit recovery
time
|CL = 30 pF,
|See figures 3 and 4.
|9, 10, 11 | 03,04 | 15
|
| 05
| 10
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 01
|
|
|
|
|
|140 |
|100 |ns
Reset to empty flag low |tEFL
|9, 10, 11 | 02
|
|
|
|
|
|
|
|
| 03
| 04
| 05
| 80
| 65
| 50
| 60
| 45
| 35
| 60
| 45
| 35
| 60
| 45
| 35
| 60
| 45
| 35
|
|
|
|ns
|
|
|ns
|
|
|ns
|
| 01-03 |
Read low to empty flag |tREF
|9, 10, 11 | 04
|
|
|9, 10, 11 | 04
|
|
|9, 10, 11 | 04
|
|
|9, 10, 11 | 04
|
|
|
|
low
|
|
|tRFF
|
|
|tWEF
|
|
|tWFF
|
|
|tHFH
|tFFH
|
|
|
|tXOL
|
|
|
|
|tXOH
|
|
|
|
|tXI
|
|
|
|
|tXIR
| 05
| 01-03 |
Read high to full flag
high
|
|
| 05
| 01-03 |
Write high to empty
flag high
|
|
| 05
| 01-03 |
|
|ns
|
Write low to full flag
low
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 05
| 01
|
|140 |
|100 |ns
Reset to half-full and
full flag high
|9, 10, 11 | 02
|
|
|
|
| 03
| 04
| 05
| 01
| 80
| 65
| 50
|
|
|
|120 |
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|ns
Read/write to XO low
|
|
|
|
| 03
| 04
| 05
| 01
|
|
|
|120 |
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|ns
|
|
|
Read/write to XO high
XI pulse width
|
|
|
|
| 03
| 04
| 05
| 01
|120 |
|
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|
| 10
|
|
|
|
|
|
|
|
|ns
|
|
|
|
|ns
|
|
|
|
|
| 03
| 04
| 05
|
XI recovery time
|9, 10, 11 | All
|
|
|
See footnotes at end of table.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
|
|
Conditions
-55 C < TC < +125 C
VSS = 0 V
|
|
|
|
Test
|Symbol |
|
|
|
|
|tXIS
|
|
|Group A |Device |
|subgroups |types |
|
|
|
|9, 10, 11 | All
|
|
Limits
|
|
| Unit
|
|
|
|
|
|
4.5 V < VCC < 5.5 V
unless otherwise specified
|
|
|
|
| Min | Max |
|
| 15
|
|
|
|
|
|ns
|
XI set-up time
|CL = 30 pF,
|See figures 3 and 4.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 01
|120 |
|
Retransmit setup time
|tRTS
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|120 |
| 80
| 65
| 50
| 40
|
|
|
|
|
|
|
|
|
|
|
|
|
|ns
|
|
|
|
|ns
|
|
|
|
|
|
|
|
|
|
|
| 03
| 04
| 05
| 01
Read pulse width after |tRPE
EF high
|9, 10, 11 | 02
|
|
|
|
|
|
|
|
|
|
|
|
| 03
| 04
| 05
| 01
|140 |
|100 |ns
| 80
| 65
| 50
|140 |
|100 |ns
| 80
| 65
| 50
Write low to half-full
flag low
|tWHF
|
|
|
|
|tRHF
|
|
|
|
|9, 10, 11 | 02
|
|
|
|
| 03
| 04
| 05
| 01
|
|
|
Read high to half-full
flag high
|9, 10, 11 | 02
|
|
|
|
| 03
| 04
| 05
| 01
|
|
|
|
|ns
|
|
|
|
|120 |
Write pulse width after |tWPF
|9, 10, 11 | 02
| 80
| 65
| 50
| 40
|
|
|
|
FF high
|
|
|
|
|
|
| 03
| 04
| 05
1/ If not tested, shall be guaranteed to the limits specified in table I.
2/ Only applies to read data flow-through mode.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
8
DSCC FORM 2234
APR 97
|Device types
|
|Case outlines | X and Y |
|
|Terminal number | Terminal symbol
|
|
|
|
All
|
|
|
|
|
|
|
Z
|
|
|
|
|
|
|
|
|
|
|
|
1
|W
|D8
|D3
|D2
|D1
|D0
|
|NC
|
2
3
4
5
6
|W
|
|D8
|D3
|D2
|D1
|
|
|
|
|
|
|
|
7
|XI
|
|D0
|
|
|
|
8
|FF
|XI
|
|
|
|
|
|
|
|
9
10
11
|Q0
|Q1
|Q2
|
|Q3
|Q8
|GND
|FF
|Q0
|Q1
|
|NC
|Q2
|Q3
|
|
|
|
|
|
|
12
13
14
|
|
|
15
16
17
|R
|Q4
|Q5
|Q8
|GND
|NC
|
|
|
|
|
|
18
19
|Q6
|Q7
|
|R
|Q4
|
|
|
|
|
|
20
21
22
|XO /HF
|EF
|Q5
|Q6
|
|
|
|
|RS
|
|Q7
|
|
|
|
|
|
23
24
25
|FL /RT
|D7
|XO /HF |
|EF
|RS
|
|
|D6
|
|
|
|
|
|
26
27
28
29
30
31
32
|D5
|D4
|VCC
|---
|---
|---
|FL /RT |
|NC
|D7
|D6
|D5
|D4
|
|
|
|
|
|
|---
|VCC
|
|
|
|
|
NC = no connection
FIGURE 1. Terminal connections.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
9
DSCC FORM 2234
APR 97
Reset and retransmit
Single device configuration/width expansion mode
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Mode
Inputs
Internal status
Outputs
|
|
|
|
|
|
| RS | RT | XI |Read pointer |Write pointer
| EF | FF | HF |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|Reset
|0 |X |0 |Location zero |Location zero |0 |1 |1 |
|Retransmit
|Read/write
|
|1 |0 |0 |Location zero |Unchanged
|1 |1 |0 |Increment 1/ |Increment 1/
|X |X |X |
|X |X |X |
|
|
|
|
|
|
|
|
|
1/ Pointer will increment if flag is high.
Reset and first load
Depth expansion/compound expansion mode
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Inputs
Internal status
|Outputs |
|
|
|
|
|
|
|
|
|Mode
| RS | FL | XI |Read pointer |Write pointer
| EF | FF |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|Reset first device
|Reset all other devices
|Read/write
|0 |0 |1/ |Location zero |Location zero |0 |1 |
|0 |1 |1/ |Location zero |Location zero |0 |1 |
|1 |X |1/ |
X
|
|
X
|X |X |
|
|
|
|
|
|
|
|
1/ XI is connected to XO of previous device.
NOTES: RS = Reset input, FL /RT = First load/retransmit, EF = Empty flag output,
FF = Full flag output, XI = Expansion input, and HF = Half-full flag output
0 = Low level voltage
1 = High level voltage
X = Don't care
FIGURE 2. Truth tables.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
10
DSCC FORM 2234
APR 97
NOTE: CL includes scope and jig capacitance.
AC test conditions
|
|
|
|Input pulse levels
|Input rise and fall times
|Input timing reference levels
|Output reference levels
|
|GND to 3.0 V |
|
|
|
|
<5 ns
1.5 V
1.5 V
|
|
|
|
FIGURE 3. Output load circuit and ac test conditions.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
11
DSCC FORM 2234
APR 97
Notes:
1. EF, FF, and HF may change status during RESET but flags will be valid at tRSC
2. W and R = VIH around the rising edge of RS.
.
FIGURE 4. Timing waveforms.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
12
DSCC FORM 2234
APR 97
FIGURE 4. Timing waveforms - continued.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
13
DSCC FORM 2234
APR 97
Note 3: EF, FF, and HF may change status during RETRANSMIT but flags will be valid to tRTC
.
FIGURE 4. Timing waveforms - continued.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
14
DSCC FORM 2234
APR 97
FIGURE 4. Timing waveforms - continued.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
15
DSCC FORM 2234
APR 97
FIGURE 4. Timing waveforms - continued.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
16
DSCC FORM 2234
APR 97
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not
marking the "5962-" on the device.
3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
Appendix A.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test (method 1015 of MIL-STD-883).
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or procuring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
(2) TA = +125 C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (CIN and COUT measurement) shall be measured only for the initial test and after any design or process
changes which may affect capacitance. Sample size is 15 devices with no failures, and all input and output terminals
tested.
d. Subgroups 7 and 8 tests shall include verification of the truth table.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
17
DSCC FORM 2234
APR 97
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or procuring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1005 of MIL-STD-883.
(2) TA = +125 C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
Subgroups (per method 5005, table I)
- - -
Interim electrical parameters (method 5004)
Final electrical test parameters
(method 5004)
1*, 2, 3, 7*, 8A, 8B, 9, 10, 11
1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11
Group A test requirements (method 5005)
Groups C and D end-point electrical
parameters (method 5005)
2, 3, 7, 8A, 8B
* Indicates PDA applies to subgroups 1 and 7.
** See 4.3.1c.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application
requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list
will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices
(FSC 5962) should contact DSCC-VA, telephone (614) 692-0525.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone 614-
692-0674.
6.6 Approved source of supply. An approved source of supply is listed herein. Additional sources will be added as they
become available. The vendor listed herein has agreed to this drawing and a certificate of compliance (see 3.6 herein ) has
been submitted to DSCC-VA.
SIZE
STANDARD
5962-89567
A
MICROCIRCUIT DRAWING
REVISION LEVEL
A
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
18
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 01-01-30
Approved sources of supply for SMD 5962-89536 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535.
Standard microcircuit 1/
drawing PIN
Vendor
CAGE number
Vendor
similar PIN 2/
5962-8953601XA
5962-8953601YA
5962-8953601ZA
61772 4/
3/
IDT7203L120DB
IDT7203L120XEB
IDT7203L120LB
61772 4/
5962-8953602XA
5962-8953602YA
5962-8953602ZA
61772 4/
3/
IDT7203L80DB
IDT7203L80XEB
IDT7203L80LB
61772 4/
5962-8953603XA
5962-8953603YA
5962-8953603ZA
61772 4/
3/
IDT7203L65DB
IDT7203L65XEB
IDT7203L65LB
61772 4/
5962-8953604XA
5962-8953604YA
5962-8953604ZA
61772 4/
3/
IDT7203L50DB
IDT7203L50XEB
IDT7203L50LB
61772 4/
5962-8953605XA
5962-8953605YA
5962-8953605ZA
61772
3/
IDT7203L40DB
IDT7203L40XEB
IDT7203L40LB
61772
1/ The lead finish shown for each PIN representing a hermetic package is the most
readily available from the manufacturer listed for that part. If the desired lead finish
is not listed contact the Vendor to determine its availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this
number may not satisfy the performance requirements of this drawing.
3/ No longer available from an approved source.
4/ Vendor has announced an end of life date of 10/29/2001 for these devices.
Vendor CAGE
number
Vendor name
and address
61772
Integrated Device Technology, Incorporated
2975 Stender Way
Santa Clara, CA 95054
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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