P0602Z [TECCOR]
solid state crowbar devices; 固态撬棍设备![P0602Z](http://pdffile.icpdf.com/pdf1/p00045/img/icpdf/P0602Z_237066_icpdf.jpg)
型号: | P0602Z |
厂家: | ![]() |
描述: | solid state crowbar devices |
文件: | 总212页 (文件大小:1854K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Book
and Design Guide
TECCOR ELECTRONICS
1800 Hurd Drive
Irving, Texas 75038
United States of America
Phone: +1 972-580-7777
Fax: +1 972-550-1309
Web site: http://www.teccor.com
E-mail: sidactor.techsales@teccor.com
An Invensys company
Teccor Electronics is the proprietor of the SIDACtor®, Battrax®, and TeleLink®
trademarks. All other brand names may be trademarks of their respective companies.
Teccor Electronics SIDACtor products are covered by these and other U.S. Patents:
4,685,120
4,827,497
4,905,119
5,479,031
5,516,705
All SIDACtor products are recognized and listed under UL file E133083 as a UL 497B
compliant device. All TeleLink fuses are recognized under UL file E191008 and are also
listed for CSA marking by certificate LR 702828.
9
T
E
S
C
I
C
C
O
N
O
R
L
EC
T
R
E
Teccor Electronics reserves the right to make changes at any time in order to improve
designs and to supply the best products possible. The information in this catalog has
been carefully checked and is believed to be accurate and reliable; however, no liability
of any type shall be incurred by Teccor for the use of the circuits or devices described in
this publication. Furthermore, no license of any patent rights is implied or given to any
purchaser.
NOTES
1 Product Selection
Guide
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Product Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Part Number Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Description of Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Quality and Reliability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11
Standard Terms and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
© 2002 Teccor Electronics
1-1
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Product Description
Product Description
SIDACtor components are solid state crowbar devices designed to protect telecom
equipment during hazardous transient conditions. Capitalizing on the latest in thyristor
advancements, Teccor makes SIDACtor devices with a patented ion implant technology.
This technology ensures effective protection within nanoseconds, up to 5000 A surge
current ratings, and simple solutions for regulatory requirements such as GR 1089,
TIA-968 (formerly known as FCC Part 68), ITU-T K.20, ITU-T K.21, and UL 60950.
Operation
In the standby mode, SIDACtor devices exhibit a high off-state impedance, eliminating
excessive leakage currents and appearing transparent to the circuits they protect. Upon
application of a voltage exceeding the switching voltage (VS), SIDACtor devices crowbar
and simulate a short circuit condition until the current flowing through the device is either
interrupted or drops below the SIDACtor device’s holding current (IH). Once this occurs,
SIDACtor devices reset and return to their high off-state impedance.
+I
IT
IS
IH
IDRM
-V
+V
VDRM
VT
VS
-I
V-I Characteristics
Advantages
Compared to surge suppression using other technologies, SIDACtor devices offer absolute
surge protection regardless of the surge current available and the rate of applied voltage
(dv/dt). SIDACtor devices:
•
•
•
•
•
•
Cannot be damaged by voltage
Eliminate hysteresis and heat dissipation typically found with clamping devices
Eliminate voltage overshoot caused by fast-rising transients
Are non-degenerative
Will not fatigue
Have low capacitance, making them ideal for high-speed transmission equipment
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+1 972-580-7777
1 - 2
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Product Description
Applications
When protecting telecommunication circuits, SIDACtor devices are connected across Tip
and Ring for metallic protection and across Tip and Ground and Ring and Ground for
longitudinal protection. They typically are placed behind some type of current-limiting
device, such as Teccor’s F1250T Telelink slow blow fuse. Common applications include:
•
•
•
Central office line cards (SLICs)
T-1/E-1, ISDN, and xDSL transmission equipment
Customer Premises Equipment (CPE) such as phones, modems, and caller ID adjunct
boxes
•
•
PBXs, KSUs, and other switches
Primary protection including main distribution frames, five-pin modules, building
entrance equipment, and station protection modules
Data lines and security systems
•
•
•
CATV line amplifiers and power inserters
Sprinkler systems
For more information regarding specific applications, design requirements, or surge
suppression, please contact Teccor Electronics directly at +1 972-580-7777 or through our
local area representative. Access Teccor’s web site at http://www.teccor.com or
e-mail us at sidactor.techsales@teccor.com.
© 2002 Teccor Electronics
1 - 3
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Product Packages
Product Packages
Surface Mount Packages
Modified
Modified
Surface Mount
(Fuse)
DO-214AA
DO-214AA
MS-013 Six-pin
Balanced SIDACtor Device
Battrax Dual Negative SLIC Protector
✓
✓
✓
Battrax Dual Positive/Negative SLIC
Protector
Battrax Quad Negative SLIC Protector
Battrax SLIC Protector
✓
✓
✓
CATV/HFC SIDACtor Device
CATV Line Amplifiers/Power Inserters
SIDACtor Device
Fixed Voltage SLIC Protector
Four-port Metallic Line Protector
High Surge (D-rated) SIDACtor Device
LCAS Asymmetrical Device
Longitudinal Protector
MC Balanced SIDACtor Device
MC SIDACtor Device
Multiport Balanced SIDACtor Device
Multiport Quad SLIC Protector
Multiport SIDACtor Device
SIDACtor Device
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
TeleLink Fuse
Twin SLIC Protector
✓
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1 - 4
© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
Product Packages
Through-hole Packages
Modified
TO-92
TO-220
TO-218
Hybrid SIP
✓
✓
Balanced SIDACtor Device
Battrax Dual Negative SLIC Protector
Battrax Dual Positive/Negative SLIC
Protector
Battrax Quad Negative SLIC Protector
Battrax SLIC Protector
✓
✓
✓
✓
CATV/HFC SIDACtor Device
CATV Line Amplifiers/Power Inserters
SIDACtor Device
✓
Fixed Voltage SLIC Protector
Four-port Metallic Line Protector
High Surge (D-rated) SIDACtor Device
LCAS Asymmetrical Device
Longitudinal Protector
MC Balanced SIDACtor Device
MC SIDACtor Device
Multiport Balanced SIDACtor Device
Multiport Quad SLIC Protector
Multiport SIDACtor Device
SIDACtor Device
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
TeleLink Fuse
Twin SLIC Protector
© 2002 Teccor Electronics
1 - 5
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Part Number Index
Part Number Index
Note: For explanation of part numbers, see "Description of Part Number" on page 1-8.
Part Number
P0602A_
P0602AC MC
P0602Z_
P0640E_
P0640EC MC
P0640S_
P0640SC MC
P0640SD
P0640Z_
P0641CA2
P0641S_
P0641U_
P0642S_
P0644U_
P0720E_
Page
2-28
Part Number
P1101S_
P1101U_
P1102S_
P1104U_
P1200S_
P1300E_
P1300S_
P1300SC MC
P1300SD
P1300Z_
P1304U_
P1400AD
P1402A_
P1402AC MC
P1402Z_
P1500E_
P1500EC MC
P1500S_
P1500SC MC
P1500SD
P1500Z_
P1504U_
P1553A_
P1553AC MC
P1553U_
P1553Z_
P1556U_
P1602A_
P1602AC MC
P1602Z_
P1800AD
P1800E_
Page
2-46
Part Number
A1220U_4
A1225U_4
A2106A_
A2106U_
A2106U_6
A2106Z_
A5030A_
A5030U_
A5030U_6
A5030Z_
B1100C_
B1101U_
B1101U_4
B1160C_
B1161U_
B1161U_4
B1200C_
B1201U_
B1201U_4
B2050C_
B3104U_
B3164U_
B3204U_
F0500T
Page
2-36
2-30
2-42
2-16
2-18
2-4
2-50
2-14
2-22
2-38
2-16
2-4
2-36
2-32
2-20
2-24
2-40
2-32
2-20
2-24
2-40
2-52
2-54
2-58
2-52
2-54
2-58
2-52
2-54
2-58
2-52
2-56
2-56
2-56
2-66
2-66
2-66
2-16
2-4
2-6
2-10
2-44
2-48
2-46
2-50
2-14
2-22
2-16
2-4
2-6
2-10
2-44
2-22
2-60
2-28
2-30
2-42
2-16
2-18
2-4
P0720S_
P0720SC MC
P0720SD
P0720Z_
P0721CA2
P0721S_
P0721U_
P0722S_
P0724U_
P0900E_
2-6
2-10
2-44
2-48
2-46
2-50
2-14
2-22
2-16
2-4
2-6
2-10
2-44
2-22
2-32
2-34
2-20
2-40
2-24
2-28
2-30
2-42
2-60
2-16
2-4
F1250T
F1251T
P0900S_
P0900SC MC
P0900SD
P0900Z_
P0901CA2
P0901S_
P0901U_
P0902S_
P0904U_
P1100E_
2-6
P0080E_
P0080S_
P0080SA MC
P0080SC MC
P0080SD
P0080Z_
P0084U_
P0300E_
P0300S_
P0300SA MC
P0300SC MC
P0300SD
P0300Z_
P0304U_
2-10
2-44
2-48
2-46
2-50
2-14
2-22
2-16
2-4
2-8
2-6
2-10
2-44
2-22
2-16
2-4
2-8
2-6
2-10
2-44
2-22
P1800S_
P1800SC MC
P1800SD
P1800Z_
P1803A_
P1803AC MC
P1803U_
2-6
2-10
2-44
2-32
2-34
2-20
2-40
P1100S_
P1100SC MC
P1100SD
P1100Z_
2-6
2-10
2-44
2-48
P1101CA2
P1803Z_
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1 - 6
© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
Part Number Index
Part Number
P1804U_
P1806U_
P1900ME
P2000AA61
P2000S_
P2103A_
P2103AC MC
P2103U_
P2103Z_
P2106U_
P2200AA61
P2202A_
P2202AC MC
P2202Z_
P2300E_
P2300ME
P2300S_
P2300SC MC
P2300SD
P2300Z_
P2304U_
P2353A_
Page
2-22
Part Number
P2703AC MC
P2703U_
P2703Z_
P2706U_
P3000AA61
P3002A_
P3002AC MC
P3002CA
P3002S_
P3002Z_
P3100AD
P3100E_
P3100EC MC
P3100S_
P3100SC MC
P3100SD
P3104U_
P3100Z_
P3203A_
P3203AC MC
P3203U_
P3203Z_
P3206U_
P3300AA61
P3403A_
P3403AC MC
P3403U_
P3403Z_
P3406U_
P3500E_
P3500S_
P3500SC MC
P3500SD
P3500Z_
P3504U_
P3602A_
P3602AC MC
P3602Z_
P4202A_
Page
2-34
Part Number
P4202Z_
P4802A_
P4802AC MC
P4802Z_
P5103A_
P5103AC MC
P5103U_
P5106U_
P6002A_
Page
2-42
2-24
2-64
2-26
2-38
2-32
2-34
2-20
2-40
2-24
2-26
2-28
2-30
2-42
2-16
2-64
2-4
2-20
2-40
2-24
2-26
2-28
2-30
2-12
2-14
2-42
2-62
2-16
2-18
2-4
2-28
2-30
2-42
2-32
2-34
2-20
2-24
2-28
2-30
2-62
2-12
2-42
P6002AC MC
P6002AD
P6002CA
P6002Z_
2-6
2-10
2-22
2-44
2-32
2-34
2-20
2-40
2-24
2-26
2-32
2-34
2-20
2-40
2-24
2-16
2-4
2-6
2-10
2-44
2-22
2-32
2-34
2-20
2-40
2-24
2-26
2-26
2-38
2-16
2-18
2-4
P2353AC MC
P2353U_
P2353Z_
P2356U_
P2400AA61
P2500AA61
P2500S_
P2600E_
P2600EC MC
P2600S_
P2600SC MC
P2600SD
P2600Z_
P2604U_
P2702A_
2-6
2-6
2-10
2-44
2-22
2-28
2-30
2-42
2-28
2-30
2-10
2-44
2-22
2-28
2-30
2-42
2-32
P2702AC MC
P2702Z_
P2703A_
P4202AC MC
© 2002 Teccor Electronics
1-7
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Description of Part Number
Description of Part Number
The following illustration shows a description of a sample SIDACtor device part number.
P
210
2
A
A
61 RP
PACKING OPTIONS
RP1 = TO-92 reel pack (0.100" lead spacing)
RP2 = TO-92 reel pack (0.200" lead spacing)
AP = Ammo pack
DEVICE TYPE
P = SIDACtor
RP = Reel pack
TP = Tube pack
MEDIAN VOLTAGE RATING
210 = 210 V
LEAD FORM OPTIONS
TO-220 modified type 60, 61, or 62
For U type:
CONSTRUCTION VARIABLE
0 = One chip
1 = Unidirectional part
2 = Two chips
3 = 3 chips
4 = 4 chips
6 = 6 chips
3 = Three chips
I
PP RATING
A = 50 A (10x560 µs)
B = 100 A (10x560 µs)
C = 500 A (2x10 µs)
D = 1000 A (8x20 µs)
E = 3000 A (8x20 µs)
0 = One SIDACtor Chip
1
3
2
2 = Two Matched SIDACtor Chips
PACKAGE TYPE
A = TO–220
C = Three-leaded DO-214
E = TO–92
1
3
M = TO-218
S = DO–214
Patented
U = Six-pin SOIC
Z = SIP
2
3 = Three Matched SIDACtor Chips
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© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Description of Part Number
The following illustration shows a description of a sample Battrax device part number.
B 1 10 1
U
A
IPP RATING
DEVICE TYPE
B = Battrax
A = 50 A (10x560 µs)
B = 100 A (10x560 µs)
C = 500 A (2x10 µs)
Battrax TYPE
1 = Negative
2 = Positive
3 = Dual
PACKAGE TYPE
C = Three-leaded DO-214
U = Six-pin SOIC
HOLDING CURRENT
05 = 50 mA
10 = 100 mA
16 = 160 mA
20 = 200 mA
CONSTRUCTION VARIABLE
0 = No diode
1 = Diode
4 = Four Battrax Devives
The following illustration shows a description of a sample asymmetrical SIDACtor device
part number.
A
1806
U
C
4
TP
PACKING OPTIONS
AP = Ammo pack
RP = Reel pack
DEVICE TYPE
A = Asymmetrical SIDACtor
TP = Tube pack
MEDIAN VOLTAGE RATING
1806 = 180 V and 60 V
LEAD FORM OPTIONS
TO-220 modified type 60, 61, or 62
For U type:
3 = 3 chips
4 = 4 chips
6 = 6 chips
1
3
Patented
IPP RATING
A = 50 A (10x560 µs)
B = 100 A (10x560 µs)
C = 500 A (2x10 µs)
D = 1000 A (8x20 µs)
E = 3000 A (8x20 µs)
2
3 = Three Matched SIDACtor chips
PACKAGE TYPE
A = TO-220
M = TO-218
U = Six-pin SOIC
© 2002 Teccor Electronics
1 - 9
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Electrical Parameters
Electrical Parameters
Electrical parameters are based on the following definition of conditions:
•
•
On state (also referred to as the crowbar condition) is the low impedance condition
reached during full conduction and simulates a short circuit.
Off state (also referred to as the blocking condition) is the high impedance condition prior
to beginning conduction and simulates an open circuit.
CO
Off-state Capacitance — typical capacitance measured in off state
di/dt
Rate of Rise of Current — maximum rated value of the acceptable rate of
rise in current over time
dv/dt
IS
Rate of Rise of Voltage — rate of applied voltage over time
Switching Current — maximum current required to switch to on state
Leakage Current — maximum peak off-state current measured at VDRM
Holding Current — minimum current required to maintain on state
Peak Pulse Current — maximum rated peak impulse current
On-state Current — maximum rated continuous on-state current
Peak One-cycle Surge Current — maximum rated one-cycle AC current
Switching Voltage — maximum voltage prior to switching to on state
IDRM
IH
IPP
IT
ITSM
VS
VDRM
Peak Off-state Voltage — maximum voltage that can be applied while
maintaining off state
VF
VT
On-state Forward Voltage — maximum forward voltage measured at rated
on-state current
On-state Voltage — maximum voltage measured at rated on-state current
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© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
Quality and Reliability
Quality and Reliability
It is Teccor’s policy to ship quality products on time. We accomplish this through Total
Quality Management based on the fundamentals of customer focus, continuous
improvement, and people involvement.
In support of this commitment, Teccor applies the following principles:
•
•
Employees shall be respected, involved, informed, and qualified for their job with
appropriate education, training, and experience.
Customer expectations shall be met or exceeded by consistently shipping products that
meet the agreed specifications, quality levels, quantities, schedules, and test and
reliability parameters.
•
•
Suppliers shall be selected by considering quality, service, delivery, and cost of
ownership.
Design of products and processes will be driven by customer needs, reliability, and
manufacturability.
It is the responsibility of management to incorporate these principles into policies and
systems.
It is the responsibility of those in leadership roles to coach their staff and to reinforce these
principles.
It is the responsibility of each individual employee to follow the spirit of this statement to
ensure that we meet the primary policy — to ship quality products on time.
© 2002 Teccor Electronics
1 - 11
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Standard Terms and Conditions
Standard Terms and Conditions
Supplier shall not be bound by any term proposed by Buyer in the absence of written agreement to such term signed by an
authorized officer of Supplier.
(1) PRICE:
(A) Supplier reserves the right to change product prices at any time but, whenever practicable, Supplier will give Buyer at
least thirty (30) days written notice before the effective date of any price change. Unless Supplier has specifically
agreed in writing, signed by an authorized officer of Supplier, that a quoted price shall not be subject to change for a
certain time, all products shipped on or after the effective date of a price change may be billed at the new price level.
(B) Whenever Supplier agrees to a modification of Buyer's order (which modification must be in writing and signed by an
authorized officer of Supplier), Supplier reserves the right to alter its price, whether or not such price was quoted
as “firm”.
(C) Prices do not include federal, state or local taxes, now or hereafter enacted, applicable to the goods sold. Taxes will
be added by Supplier to the sales prices whenever Supplier has legal obligation to collect them and will be paid by
Buyer as invoiced unless Buyer provides Supplier with a proper tax exemption certificate.
(2) PRODUCTION: Supplier may, at its sole discretion and at any time, withdraw any catalog item from further production without
notice or liability to Buyer.
(3) INTEREST:
(A) All late payments shall bear interest thirty (30) days after the due date stated on the invoice until paid at the lower of one
and one-half percent per month or the maximum rate permitted by law. All interest becoming due shall, if not paid when
due, be added to principal and bear interest from the due date. At Supplier's option, any payment shall be applied first
to interest and then to principal.
(B) It is the intention of the parties to comply with the laws of the jurisdiction governing any agreement between the
parties relating to interest. If any construction of the agreement between the parties indicates a different right given
to Supplier to demand or receive any sum greater than that permissible by law as interest, such as a mistake in
calculation or wording, this paragraph shall override. In any contingency which will cause the interest paid or
agreed to be paid to exceed the maximum rate permitted by law, such excess will be applied to the reduction of
any principal amount due, or if there is no principal amount due, shall be refunded.
(4) TITLE AND DELIVERY: Title to goods ordered by Buyer and risk of loss or damage in transit or thereafter shall pass to Buyer
upon Supplier's delivery of the goods at Supplier's plant or to a common carrier for shipment to Buyer.
(5) CONTINGENCIES: Supplier shall not be responsible for any failure to perform due to causes reasonably beyond its control.
These causes shall include, but not be restricted to, fire, storm, flood, earthquake, explosion, accident, acts of public enemy,
war rebellion, insurrection, sabotage, epidemic, quarantine restrictions, labor disputes, labor shortages, labor slow downs
and sit downs, transportation embargoes, failure or delays in transportation, inability to secure raw materials or machinery for
the manufacture of its devices, acts of God, acts of the Federal Government or any agency thereof, acts of any state or local
government or agency thereof, and judicial action. Similar causes shall excuse Buyer for failure to take goods ordered by
Buyer, from the time Supplier receives written notice from Buyer and for as long as the disabling cause continues, other than
for goods already in transit or specially fabricated and not readily saleable to other buyers.
Supplier assumes no responsibility for any tools, dies, and other equipment furnished Supplier by Buyer.
(6) LIMITED WARRANTY AND EXCLUSIVE REMEDY: Supplier warrants all catalog products to be free from defects in materials
and workmanship under normal and proper use and application for a period of twelve (12) months from the date code on the
product in question (or if none, from the date of delivery to Buyer.) With respect to products assembled, prepared, or manu-
factured to Buyer's specifications, Supplier warrants only that such products will meet Buyer's specifications upon delivery.
As the party responsible for the specifications, Buyer shall be responsible for testing and inspecting the products for adher-
ence to specifications, and Supplier shall have no liability in the absence of such testing and inspection or if the product
passes such testing or inspection. THE ABOVE WARRANTY IS THE ONLY WARRANTY EXTENDED BY SUPPLIER, AND
IS IN LIEU OF AND EXCLUDES ALL OTHER WARRANTIES AND CONDITIONS, EXPRESSED OR IMPLIED (EXCEPT AS
PROVIDED HEREIN AS TO TITLE), ON ANY GOODS OR SERVICES SOLD OR RENDERED BY SUPPLIER, INCLUDING
ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. THIS WARRANTY
WILL NOT CREATE WARRANTY COVERAGE FOR ANY ITEM INTO WHICH ANY PRODUCT SOLD BY SUPPLIER MAY
HAVE BEEN INCORPORATED OR ADDED.
SUPPLIER'S ENTIRE LIABILITY AND BUYER'S EXCLUSIVE REMEDY UNDER THIS WARRANTY SHALL BE, AT
SUPPLIER'S OPTION, EITHER THE REPLACEMENT OF, REPAIR OF, OR ISSUANCE OF CREDIT TO BUYER'S
ACCOUNT WITH SUPPLIER FOR ANY PRODUCTS WHICH ARE PROPERLY RETURNED BY BUYER DURING THE
WARRANTY PERIOD. All returns must comply with the following conditions:
© 2002 Teccor Electronics
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®
SIDACtor Data Book and Design Guide
Standard Terms and Conditions
(A) Supplier is to be promptly notified in writing upon discovery of defects by Buyer.
(B) Buyer must obtain a Return Material Authorization (RMA) number from the Supplier prior to returning product.
(C) The defective product is returned to Supplier, transportation charges prepaid by Buyer.
(D) Supplier's examination of such product discloses, to its satisfaction, that such defects have not been caused by
misuse, neglect, improper installation, repair, alteration, or accident.
(E) The product is returned in the form it was delivered with any necessary disassembly carried out by Buyer at Buyer's
expense.
IN NO EVENT SHALL SUPPLIER, OR ANYONE ELSE ASSOCIATED IN THE CREATION OF ANY OF SUPPLIER'S
PRODUCTS OR SERVICES, BE LIABLE TO BUYER FOR INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY
NATURE INCLUDING LOSS OF PROFITS, LOSS OF USE, BUSINESS INTERUPTION, AND THE LIKE. BUYER
ACKNOWLEDGES THAT THE ABOVE WARRANTIES AND LIMITATIONS THEREON ARE APPROPRIATE AND
REASONABLE IN EFFECTUATING SUPPLIER'S AND BUYER'S MUTUAL INTENTION TO CONDUCT AN EFFICIENT
TRANSACTION AT PRICES MORE ADVANTAGEOUS TO BUYER THAN WOULD BE AVAILABLE IN THE PRESENCE
OF OTHER WARRANTIES AND ASSURANCES.
(7) PATENTS: Buyer shall notify Supplier in writing of any claim that any product or any part of use thereof furnished under this
agreement constitutes an infringement of any U.S. patent, copyright, trade secret, or other proprietary rights of a third party.
Notice shall be given within a reasonable period of time which should in most cases be within ten (10) days of receipt by
Buyer of any letter, summons, or complaint pertaining to such a claim. At its option, Supplier may defend at its expense any
action brought against Buyer to the extent that it is based on such a claim. Should Supplier choose to defend any such claim,
Supplier may fully participate in the defense, settlement, or appeal of any action based on such claim.
Should any product become, or in Supplier's opinion be likely to become, the subject of an action based on any such
claim, Supplier may, at its option, as the Buyer's exclusive remedy, either procure for the Buyer the right to continue
using the product, replace the product or modify the product to make it noninfringing. IN NO EVENT SHALL SUPPLIER
BE LIABLE FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES BASED ON ANY CLAIM OF INFRINGEMENT.
Supplier shall have no liability for any claim based on modifications of a product made by any person or entity other than
Supplier, or based on use of a product in conjunction with any other item, unless expressly approved by Supplier.
Supplier does not warrant goods against claims of infringement which are assembled, prepared, or manufactured to
Buyer's specifications.
(8) NON-WAIVER OF DEFAULT: Each shipment made under any order shall be treated as a separate transaction, but in the
event of any default by Buyer, Supplier may decline to make further shipments without in any way affecting its rights under
such order. If, despite any default by Buyer, Supplier elects to continue to make shipments, its action shall not constitute a
waiver of that or any default by Buyer or in any way affect Supplier's legal remedies for any such default. At any time, Sup-
plier's failure to exercise any right to remedy available to it shall not constitute a waiver of that right or remedy.
(9) TERMINATION: If the products to be furnished under this order are to be used in the performance of a Government contract
or subcontract, and the Government terminates such contract in whole or part, this order may be canceled to the extent it
was to be used in the canceled portion of said Government contract and the liability of Buyer for termination allowances shall
be determined by the then applicable regulations of the Government regarding termination of contracts. Supplier may cancel
any unfilled orders unless Buyer shall, upon written notice, immediately pay for all goods delivered or shall pay in advance
for all goods ordered but not delivered, or both, at Supplier's option.
(10) LAW: The validity, performance and construction of these terms and conditions and any sale made hereunder shall be gov-
erned by the laws of the state of Texas.
(11) ASSIGNS: This agreement shall not be assignable by either Supplier or Buyer. However, should either Supplier or Buyer be
sold or transferred in its entirety and as an ongoing business, or should Supplier or Buyer sell or transfer in its entirety and as
an ongoing concern, any division, department, or subsidiary responsible in whole or in part for the performance of this Agree-
ment, this Agreement shall be binding upon and inure to the benefit of those successors and assigns of Supplier, Buyer, or
such division, department, or subsidiary.
(12) MODIFICATION OF STANDARD TERMS AND CONDITIONS: No attempted or suggested modification of or addition to any
of the provisions upon the face or reverse of this form, whether contained or arising in correspondence and/or documents
passing between Supplier and Buyer, in any course of dealing between Supplier or Buyer, or in any customary usage preva-
lent among businesses comparable to those of Supplier and/or Buyer, shall be binding upon Supplier unless made and
agreed to in writing and signed by an officer of Supplier.
(13) QUANTITIES: Any variation in quantities of electronic components, or other goods shipped over or under the quantities
ordered (not to exceed 5%) shall constitute compliance with Buyer's order and the unit price will continue to apply.
© 2002 Teccor Electronics
1 - 13
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+1 972-580-7777
®
SIDACtor Data Book and Design Guide
NOTES
2 Data Sheets
This section presents complete electrical specifications for Teccor’s SIDACtor solid state
overvoltage protection devices.
DO-214AA Package Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
DO-214AA
SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
MicroCapacitance (MC) SC SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
MicroCapacitance (MC) SA SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
High Surge Current (D-rated) SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Compak Two-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12
Ethernet/10BaseT/100BaseT Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
TO-92
SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16
MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18
Modified MS-013 (Six-pin Surface Mount)
Balanced Three-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20
Multiport SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22
Multiport Balanced SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24
Modified TO-220
SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26
Two-chip SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28
Two-chip MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-30
Balanced Three-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . 2-34
LCAS
LCAS Asymmetrical Multiport Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-36
LCAS Asymmetrical Discrete Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-38
SIP Hybrid Overvoltage and Overcurrent Protector
Four-Port Balanced Three-chip Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-40
Four-Port Longitudinal Two-chip Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-42
Four-Port Metallic Line Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-44
SLICs
Fixed Voltage SLIC Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-46
Twin SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-48
Multiport SLIC Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-50
Battrax
Battrax SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-52
Battrax Dual Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-54
Battrax Dual Positive/Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-56
Battrax Quad Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-58
CATVs
CATV and HFC SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-60
High Surge Current SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-62
CATV Line Amplifiers/Power Inserters SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-64
TeleLink Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-66
Acronyms: CATV
Community Antenna TV
Hybrid Fiber Coax
HFC
LCAS
SIP
Line Circuit Access Switch
Single In-line Package
Subscriber Line Interface Circuit
SLIC
© 2002 Teccor Electronics
2-1
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+1 972-580-7777
®
SIDACtor Data Book and Design Guide
DO-214AA Package Symbolization
DO-214AA Package Symbolization
Part Number
Part Number
Part Number
Catalog
P0080SA
Symbolized
P-8A
P-8AM
P-8B
P-8C
P-8D
P-8CM
P03A
P03AM
P03B
Catalog
P0901SC
P1100SA
Symbolized
P91C
P11A
P11B
P11C
P11D
P11CM
P02A
Catalog
P2300SB
P2300SC
P2300SD
P2300SC MC
P2500SA
P2500SB
P2500SC
P2500SD
P2500SC MC
P2600SA
P2600SB
P2600SC
P2600SD
P2600SC MC
P3002CB
P3002SB
P3100SA
P3100SB
P3100SC
P3100SD
P3100SC MC
P3500SA
P3500SB
P3500SC
P3500SD
P3500SC MC
P6002CB
B1100CA
B1100CC
B1160CA
B1160CC
B1200CA
B1200CC
B2050CA
B2050CC
Symbolized
P23B
P23C
P23D
P23CM
P25A
P25B
P25C
P25D
P25CM
P26A
P26B
P26C
P26D
P26CM
P30B
P30B
P31A
P31B
P31C
P31D
P31CM
P35A
P35B
P35C
P35D
P35CM
P60B
B10A
B10C
B16A
B16C
B12A
B12C
B25A
B25C
P0080SA MC
P0080SB
P0080SC
P0080SD
P0080SC MC
P0300SA
P0300SA MC
P0300SB
P0300SC
P0300SD
P0300SC MC
P0640SA
P1100SB
P1100SC
P1100SD
P1100SC MC
P1101CA2
P1101SA
P01A
P01C
P12A
P1101SC
P1200SA
P1200SB
P1200SC
P1200SD
P1200SC MC
P1300SA
P1300SB
P1300SC
P1300SD
P1300SC MC
P1500SA
P1500SB
P1500SC
P1500SD
P1500SC MC
P1800SA
P1800SB
P1800SC
P1800SD
P1800SC MC
P2000SA
P2000SB
P2000SC
P2000SD
P2000SC MC
P2300SA
P03C
P03D
P03CM
P06A
P12B
P12C
P12D
P12CM
P13A
P0640SB
P06B
P0640SC
P0640SD
P0640SC MC
P0641CA2
P0641SA
P0641SC
P0720SA
P0720SB
P0720SC
P0720SD
P0720SC MC
P0721CA2
P0721SA
P0721SC
P0900SA
P0900SB
P06C
P06D
P06CM
P62A
P61A
P61C
P07A
P13B
P13C
P13D
P13CM
P15A
P15B
P07B
P15C
P15D
P15CM
P18A
P07C
P07D
P07CM
P72A
P71A
P71C
P09A
P18B
P18C
P18D
P18CM
P20A
P09B
P0900SC
P0900SD
P0900SC MC
P0901CA2
P0901SA
P09C
P09D
P09CM
P92A
P20B
P20C
P20D
P20CM
P23A
P91A
Note: Date code is located below the symbolized part number.
© 2002 Teccor Electronics
2 - 3
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®
SIDACtor Data Book and Design Guide
SIDACtor Device
SIDACtor Device
DO-214AA SIDACtor solid state protection devices protect telecommunications equipment
such as modems, line cards, fax machines, and other CPE.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
µAmps
mAmps
Amps
mAmps
P0080S_
P0300S_
P0640S_
P0720S_
P0900S_
P1100S_
P1300S_
P1500S_
P1800S_
P2300S_
P2600S_
P3100S_
P3500S_
6
25
58
65
75
90
120
140
170
190
220
275
320
25
40
77
88
98
130
160
180
220
260
300
350
400
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
50
50
100
110
50
50
50
40
40
40
30
30
30
30
30
150
150
150
150
150
150
150
150
150
150
150
* For individual “SA”, “SB”, and “SC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “SA” and “SB” product. “SC” capacitance is
approximately 2x the listed value. The off-state capacitance of the P0080SB is equal to the “SC” device.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
30
500
500
500
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© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
SIDACtor Device
Thermal Considerations
Package
DO-214AA
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 5
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+1 972-580-7777
®
SIDACtor Data Book and Design Guide
MicroCapacitance (MC) SC SIDACtor Device
MicroCapacitance (MC) SC SIDACtor Device
The DO-214AA SC MC SIDACtor series is intended for applications sensitive to load
values. Typically, high speed connections require a lower capacitance. CO values for the
MicroCapacitance device are 40% lower than a standard SC part.
This MC SIDACtor series is used to enable equipment to meet various regulatory
requirements including GR 1089, IEC 60950, UL 60950, and TIA-968 (formerly known as
FCC Part 68). Contact factory regarding ITU K.20, K.21, and K.45.
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
µAmps
mAmps
Amps
mAmps
P0080SC MC **
P0300SC MC **
P0640SC MC
P0720SC MC
P0900SC MC
P1100SC MC
P1300SC MC
P1500SC MC
P1800SC MC
P2300SC MC
P2600SC MC
P3100SC MC
P3500SC MC
6
25
58
65
75
90
120
140
170
190
220
275
320
25
40
77
88
98
130
160
180
220
260
300
350
400
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
50
50
55
35
60
60
60
50
50
50
40
40
40
40
40
150
150
150
150
150
150
150
150
150
150
150
* For surge ratings, see table below.
** Contact factory for release date.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
C
500
400
200
150
100
30
500
http://www.teccor.com
+1 972-580-7777
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© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
MicroCapacitance (MC) SC SIDACtor Device
Thermal Considerations
Package
DO-214AA
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
I
S
I
H
Waveform = tr x td
I
DRM
50
0
-V
+V
Half Value
VDRM
VT
VS
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 7
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+1 972-580-7777
®
SIDACtor Data Book and Design Guide
MicroCapacitance (MC) SA SIDACtor Device
MicroCapacitance (MC) SA SIDACtor Device
The DO-214AA SA MC SIDACtor series is intended for applications sensitive to load
values. Typically, high speed connections require a lower capacitance. CO values for the
MicroCapacitance device are 40% lower than a standard SA part.
This MC SIDACtor series is used to enable equipment to meet various regulatory
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-
968 (formerly known as FCC Part 68).
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
µAmps
mAmps
Amps
mAmps
P0080SA MC
P0300SA MC
6
25
25
40
4
4
5
5
800
800
2.2
2.2
50
50
45
25
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
A
150
150
90
50
45
20
500
http://www.teccor.com
+1 972-580-7777
2 - 8
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
MicroCapacitance (MC) SA SIDACtor Device
Thermal Considerations
Package
DO-214AA
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
I
S
I
H
Waveform = tr x td
I
DRM
50
0
-V
+V
Half Value
VDRM
VT
VS
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 9
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
High Surge Current (D-rated) SIDACtor Device
High Surge Current (D-rated) SIDACtor Device
DO-214AA SIDACtor solid state protection devices with a D surge rating protect
telecommunications equipment such as modems, line cards, fax machines, and other CPE.
These SIDACtor devices withstand simultaneous surges incurred in GR 1089 lightning
tests. (See "First Level Lightning Surge Test" on page 4-5.) Surge ratings are twice that of a
device with a C surge rating. This allows a discrete surface mount version of Teccor’s
patented “Y” configuration. (US Patent 4,905,119)
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
µAmps
mAmps
Amps
mAmps
P0080SD **
P0300SD **
P0640SD **
P0720SD **
P0900SD **
P1100SD
P1300SD
P1500SD
P1800SD
P2300SD
P2600SD
P3100SD
P3500SD
6
25
58
65
75
90
120
140
170
190
220
275
320
25
40
77
88
98
130
160
180
220
260
300
350
400
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
50
50
50
50
50
50
50
50
50
50
50
50
50
200
220
100
100
100
80
80
80
60
60
60
60
60
* For surge ratings, see table below.
** Contact factory for release date.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
D
1000
800
400
300
200
50
1000
http://www.teccor.com
+1 972-580-7777
2 - 10
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
High Surge Current (D-rated) SIDACtor Device
Thermal Considerations
Package
DO-214AA
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 11
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Compak Two-chip SIDACtor Device
Compak Two-chip SIDACtor Device
The modified DO-214AA SIDACtor device provides low-cost, longitudinal protection.
1
(T)
2
(G)
SIDACtor devices are used to enable equipment to meet various regulatory requirements
3
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
(R)
known as FCC Part 68).
Electrical Parameters
VDRM
VS
VDRM
Volts
VS
CO
pF
Volts
Volts
Volts
Part
VT
IDRM
IS
IT
IH
Number
Pins1-2, 2-3
Pins 1-3
Volts
µAmps
mAmps Amps mAmps Pins 1-3
P3002CA
P6002CA
140
275
180
350
280
550
360
700
4
4
5
5
800
800
1
1
120
120
15
15
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 1-3 at 1 MHz with a 2 V bias.
UL 60950 creepage requirements must be considered.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
A
150
150
90
50
45
20
500
http://www.teccor.com
+1 972-580-7777
2 - 12
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Compak Two-chip SIDACtor Device
Thermal Considerations
Package
Modified DO-214AA
Pin 3
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
85
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
Pin 1
Pin 2
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 13
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Ethernet/10BaseT/100BaseT Protector
Ethernet/10BaseT/100BaseT Protector
The DO-214AA SIDACtor Ethernet protection series is intended for applications sensitive to
load values. Typically, high speed connections require a lower capacitance. CO values are
40% lower than standard devices.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
µAmps
mAmps
Amps
mAmps
P0642S_
P0722S_
P0902S_
P1102S_
P3002S_
58
65
75
90
280
77
88
98
130
360
4
4
4
4
4
5
5
5
5
5
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
120
120
120
120
120
25
25
25
20
15
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
A
B**
Amps/µs
150
250
150
250
90
150
50
100
45
80
20
30
500
500
** Contact factory for release date of B-rated devices.
http://www.teccor.com
+1 972-580-7777
2 - 14
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Ethernet/10BaseT/100BaseT Protector
Thermal Considerations
Package
DO-214AA
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 15
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
SIDACtor Device
SIDACtor Device
TO-92 SIDACtor solid state protection devices protect telecommunications equipment such
as modems, line cards, fax machines, and other CPE.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68)
.
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
6
Volts
Volts
µAmps
mAmps
Amps
mAmps
P0080E_
P0300E_
P0640E_
P0720E_
P0900E_
P1100E_
P1300E_
P1500E_
P1800E_
P2300E_
P2600E_
P3100E_
P3500E_
25
40
77
88
98
130
160
180
220
260
300
350
400
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
50
50
100
110
50
50
50
40
40
40
30
30
30
30
30
25
58
65
75
150
150
150
150
150
150
150
150
150
150
150
90
120
140
170
190
220
275
320
* For individual “EA”, “EB”, and “EC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “EA” and “EB” product. “EC” capacitance is
approximately 2x the listed value. The off-state capacitance of the P0080EB is equal to the “EC” device.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 16
© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
TO-92
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 17
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
MicroCapacitance (MC) SIDACtor Device
MicroCapacitance (MC) SIDACtor Device
The TO-92 MC SIDACtor series is intended for applications sensitive to load values.
Typically, high speed connections require a lower capacitance. CO values for MC devices
are 40% lower than a standard EC part.
This MC SIDACtor series is used to enable equipment to meet various regulatory
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-
968 (formerly known as FCC Part 68) without the need of series resistors.
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
µAmps
mAmps
Amps
mAmps
P0640EC MC
P1500EC MC
P2600EC MC
P3100EC MC
58
77
4
4
4
4
5
5
5
5
800
800
800
800
2.2
2.2
2.2
2.2
150
150
150
150
60
50
40
40
140
220
275
180
300
350
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
C
500
400
200
150
100
50
500
http://www.teccor.com
+1 972-580-7777
2 - 18
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
MicroCapacitance (MC) SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
TO-92
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 19
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Balanced Three-chip SIDACtor Device
Balanced Three-chip SIDACtor Device
This balanced protector is a surface mount alternative to the modified TO-220 package.
1
2
3
6
5
4
Based on a six-pin surface mount SOIC package, it uses Teccor’s patented “Y”
(US Patent 4,905,119) configuration. It is available in surge current ratings up to 500 A.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
Electrical Parameters
VDRM
VS
VDRM
Volts
VS
Volts
Volts
Volts
Part
VT
IDRM
IS
IT
IH
CO
pF
Number *
Pins 1-3, 1-4
Pins 3-4
Volts
µAmps mAmps Amps mAmps
P1553U_
P1803U_
P2103U_
P2353U_
P2703U_
P3203U_
P3403U_
P5103U_
A2106U_3 **
A5030U_3 **
130
150
170
200
230
270
300
420
170
400
180
210
250
270
300
350
400
600
250
550
130
150
170
200
230
270
300
420
50
180
210
250
270
300
350
400
600
80
8
8
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
150
150
150
150
150
150
150
150
120
150
40
40
40
40
30
30
30
30
40
30
270
350
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.
** Asymmetrical
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 1-3 and 1-4 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”
and “UC” capacitance is approximately 2x higher.
•
Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 20
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Balanced Three-chip SIDACtor Device
Thermal Considerations
Package
Modified MS-013
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +125
-65 to +150
60
Unit
°C
°C
6
5
4
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
1
2
3
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 21
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Multiport SIDACtor Device
Multiport SIDACtor Device
The multiport line protector is an integrated multichip solution for protecting multiple
twisted pair from overvoltage conditions. Based on a six-pin surface mount SOIC
package, it is equivalent to four discrete DO-214AA or two TO-220 packages. Available
in surge current ratings up to 500 A, the multiport line protector is ideal for densely
populated, high-speed line cards that cannot afford PCB inefficiencies or the use of
series power resistors.
1
(R )
6
(T )
1
2
5
(G )
2
(G )
2
1
3
(T )
4
(R )
1
2
SIDACtor devices are used to enable equipment to meet various regulatory
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and
TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
VDRM
VS
VDRM
Volts
Pins 1-3, 4-6
12
50
116
130
150
180
240
280
340
380
440
550
640
VS
Volts
Part
Volts
Volts
VT
IDRM
IS
IT
IH
CO
pF
Number *
P0084U_
P0304U_
P0644U_
P0724U_
P0904U_
P1104U_
P1304U_
P1504U_
P1804U_
P2304U_
P2604U_
P3104U_
P3504U_
Pins 1-2, 3-2, 4-5, 6-5
6
25
58
65
75
90
120
140
170
190
220
275
320
Volts
µAmps
mAmps Amps mAmps
25
40
77
88
98
130
160
180
220
260
300
350
400
50
80
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
50
50
100
110
50
50
50
40
40
40
30
30
30
30
30
154
176
196
260
320
360
440
520
600
700
800
150
150
150
150
150
150
150
150
150
150
150
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.
General Notes:
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
IPP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
VDRM is measured at IDRM, and VS is measured at 100 V/µs.
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”
and “UC” capacitance is approximately 2x higher.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 22
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Multiport SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
60
Unit
°C
°C
Modified MS-013
6
5
4
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
1
2
3
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 23
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Multiport Balanced SIDACtor Device
Multiport Balanced SIDACtor Device
This multiport balanced protector is a surface mount alternative to the modified TO-220
1
2
3
6
5
4
package. It is based on a six-pin surface mount SOIC package and uses Teccor’s
patented “Y” (US Patent 4,905,119) configuration. It is available in surge current ratings up
to 500 A.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
Electrical Parameters — Symmetrical
VDRM
VS
VDRM
VS
CO
pF
Volts
Volts
Volt
Volts
Part
VT
IDRM
IS
IT
IH
Number *
Pins 1-2, 2-3, 1-3 Pins 4-5, 5-6, 4-6
Volts
µAmps
mAmps Amps mAmps Pins 3-2, 6-5, 1-2, 4-5
P1556U_
P1806U_
P2106U_
P2356U_
P2706U_
P3206U_
P3406U_
P5106U_
130
150
170
200
230
270
300
420
180
210
250
270
300
350
400
600
130
150
170
200
230
270
300
420
180
210
250
270
300
350
400
600
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
150
150
150
150
150
150
150
150
50
50
40
40
40
40
40
40
Electrical Parameters — Asymmetrical
VDRM
VS
VDRM
Volt
VS
Volts
Volts
Volts
Part
Pins 1-2, 2-3, 4-5,
VT
IDRM
IS
IT
IH
CO
pF
Number *
5-6
Pins 4-6, 1-3
Volts
µAmps
mAmps Amps mAmps
A2106U_6
A5030U_6
170
400
250
550
50
270
80
350
3.5
3.5
5
5
800
800
2.2
2.2
120
150
40
30
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”
and “UC” capacitance is approximately 10 pF higher.
•
Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 24
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Multiport Balanced SIDACtor Device
Thermal Considerations
Package
Modified MS-013
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +125
-65 to +150
60
Unit
°C
°C
6
5
4
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
1
2
3
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 25
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
SIDACtor Device
SIDACtor Device
The modified TO-220 Type 61 SIDACtor solid state protection device can be used in
telecommunication protection applications that do not reference earth ground.
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
Electrical Parameters
Part
VDRM
Volts
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
µAmps
mAmps
Amps
mAmps
P2000AA61
P2200AA61
P2400AA61
P2500AA61
P3000AA61
P3300AA61
180
200
220
240
270
300
220
240
260
290
330
360
4
4
4
4
4
4
5
5
5
5
5
5
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
150
150
150
150
150
150
30
30
30
30
30
30
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
0.2x310 µs
2x10 µs
8x20 µs
10x160 µs
10x560 µs
5x320 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps
Amps
Amps/µs
A
20
150
150
90
50
75
45
20
500
http://www.teccor.com
+1 972-580-7777
2 - 26
© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
50
Unit
°C
°C
Modified
TO-220
Type 61
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 27
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Two-chip SIDACtor Device
Two-chip SIDACtor Device
The two-chip modified TO-220 SIDACtor solid state device protects telecommunication
equipment in applications that reference Tip and Ring to earth ground but do not require
balanced protection.
1
(T)
2
(G)
3
(R)
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
Electrical Parameters
VDRM
VS
VDRM
Volts
VS
Volts
Part
Volts
Volts
VT
IDRM
IS
IT
IH
CO
pF
Number *
P0602A_
P1402A_
P1602A_
P2202A_
P2702A_
P3002A_
P3602A_
P4202A_
P4802A_
P6002A_
Pins 1-2, 3-2
25
58
65
90
120
140
170
190
220
275
Pins 1-3
Volts
µAmps
mAmps
Amps
mAmps
40
77
95
130
160
180
220
250
300
350
50
80
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
50
110
50
50
40
40
40
40
30
30
30
116
130
180
240
280
340
380
440
550
154
190
260
320
360
440
500
600
700
150
150
150
150
150
150
150
150
150
* For individual “AA”, “AB”, and “AC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “AA” and “AB”
product. “AC” capacitance is approximately 2x the listed value.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 28
© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
Two-chip SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
50
Unit
°C
°C
Modified
TO-220
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
PIN 1
PIN 3
PIN 2
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 29
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Two-chip MicroCapacitance (MC) SIDACtor Device
Two-chip MicroCapacitance (MC)
SIDACtor Device
The two-chip modified TO-220 MC SIDACtor solid state device protects telecommunication
1
equipment in applications that reference Tip and Ring to earth ground but do not require
(T)
2
(G)
balanced protection.
3
(R)
SIDACtor devices are used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
Electrical Parameters
VDRM
VS
VDRM
Volts
VS
Volts
Volts
Volts
Part
VT
IDRM
IS
IT
IH
CO
pF
Number *
Pins 1-2, 3-2
Pins 1-3
Volts
µAmps
mAmps
Amps
mAmps
P0602AC MC
P1402AC MC
P1602AC MC
P2202AC MC
P2702AC MC
P3002AC MC
P3602AC MC
P4202AC MC
P4802AC MC
P6002AC MC
25
58
65
40
77
95
130
160
180
220
250
300
350
50
80
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
50
60
60
60
50
50
50
40
40
40
40
116
130
180
240
280
340
380
440
550
154
190
260
320
360
440
500
600
700
150
150
150
150
150
150
150
150
150
90
120
140
170
190
220
275
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
C
500
400
200
150
100
50
500
http://www.teccor.com
+1 972-580-7777
2 - 30
© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
Two-chip MicroCapacitance (MC) SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
50
Unit
°C
°C
Modified
TO-220
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
PIN 1
PIN 3
PIN 2
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 31
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Balanced Three-chip SIDACtor Device
Balanced Three-chip SIDACtor Device
The three-chip modified TO-220 SIDACtor balanced solid state device is designed for
1
3
telecommunication protection systems that reference Tip and Ring to earth ground.
Applications include any piece of transmission equipment that requires balanced protection.
This device is built using Teccor’s patented “Y” (US Patent 4,905,119) configuration.
2
The SIDACtor device is used to enable equipment to meet various regulatory requirements
including GR 1089, ITU K.20,K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly
known as FCC Part 68).
Electrical Parameters
VDRM
VS
VDRM
Volts
VS
Volts
Volts
Volts
Part
VT
IDRM
IS
IT
IH
CO
pF
Number *
Pins 1-2, 2-3
Pins 1-3
Volts
µAmps
mAmps
Amps
mAmps
P1553A_
P1803A_
P2103A_
P2353A_
P2703A_
P3203A_
P3403A_
P5103A_
A2106A_3 **
A5030A_3 **
130
150
170
200
230
270
300
420
170
400
180
210
250
270
300
350
400
600
250
550
130
150
170
200
230
270
300
420
50
180
210
250
270
300
350
400
600
80
8
8
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
150
150
150
150
150
150
150
150
120
150
40
40
40
40
30
30
30
30
40
30
270
350
* For individual “AA”, “AB”, and “AC” surge ratings, see table below.
** Asymmetrical
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “AA” product. “AB”
and “AC” capacitance is approximately 2x the listed value.
•
Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 32
© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
Balanced Three-chip SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
50
Unit
°C
°C
Modified
TO-220
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
PIN 1
PIN 3
PIN 2
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 33
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device
Balanced Three-chip MicroCapacitance (MC)
SIDACtor Device
The balanced three-chip TO-220 MC SIDACtor solid state device protects telecommunica-
tion equipment in high-speed applications that are sensitive to load values and that require
a lower capacitance. CO values for the MC are 40% lower than a standard AC part.
1
3
2
This MC SIDACtor series is used to enable equipment to meet various regulatory
requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and
TIA-968 (formerly known as FCC Part 68) without the need of series resistors.
Electrical Parameters
VDRM
VS
VDRM
Volts
VS
Volts
Volts
Volts
Part
VT
IDRM
IS
IT
IH
CO
pF
Number *
Pins 1-2, 2-3
Pins 1-3
Volts
µAmps
mAmps
Amps
mAmps
P1553AC MC
P1803AC MC
P2103AC MC
P2353AC MC
P2703AC MC
P3203AC MC
P3403AC MC
P5103AC MC
130
150
170
200
230
270
300
420
180
210
250
270
300
350
400
600
130
150
170
200
230
270
300
420
180
210
250
270
300
350
400
600
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
150
150
150
150
150
150
150
150
40
40
40
40
30
30
30
30
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias.
Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
C
500
400
200
150
100
50
500
http://www.teccor.com
+1 972-580-7777
2 - 34
© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
50
Unit
°C
°C
Modified
TO-220
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
PIN 1
PIN 3
PIN 2
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 35
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
LCAS Asymmetrical Multiport Device
LCAS Asymmetrical Multiport Device
This is an integrated multichip solution for protecting multiple twisted pair from
1
(R )
6
(T )
overvoltage conditions. Based on a six-pin surface mount SOIC package, it is
equivalent to four discrete DO-214AA or two TO-220 packages. Available in surge
current ratings up to 500 A, the multiport line protector is ideal for densely populated
line cards that cannot afford PCB inefficiencies or the use of series power resistors.
1
2
5
(G )
2
(G )
2
1
3
(T )
4
(R )
For a diagram of an LCAS (Line Circuit Access Switch) application, see Figure 3.21.
1
2
Electrical Parameters
VDRM
VS
VDRM
Volts
Pins 1-2, 4-5
180
230
VS
CO
pF
Volts
Part
Volts
Volts
VT
IDRM
IS
IT
IH
Number *
A1220U_4
A1225U_4
Pins 3-2, 6-5
100
100
Volts
µAmps
mAmps Amps mAmps
Pins 3-2, 6-5, 1-2, 4-5
130
130
220
290
4
4
5
5
800
800
2.2
2.2
120
120
30
30
* For individual “UA”, “UB”, and “UC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “UA” product. “UB”
and “UC” capacitance is approximately 2x higher.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 36
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
LCAS Asymmetrical Multiport Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +125
-65 to +150
60
Unit
°C
°C
Modified MS-013
6
5
4
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
1
2
3
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 37
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
LCAS Asymmetrical Discrete Device
LCAS Asymmetrical Discrete Device
These DO-214AA SIDACtor devices are intended for LCAS (Line Circuit Access Switch)
applications that require asymmetrical protection in discrete (individual) packages. They
enable the protected equipment to meet various regulatory requirements including
GR 1089, ITU K.20, K.21, K.45, IEG 60950, UL 60950, and TIA-968.
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
µAmps
mAmps
Amps
mAmps
P1200S_
P2000S_
P2500S_
100
180
230
130
220
290
4
4
4
5
5
5
800
800
800
2.2
2.2
2.2
120
120
120
40
30
30
* For individual “SA”, “SB”, and “SC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for “SA” and “SB”
product. “SC” capacitance is approximately 10 pF higher.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 38
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
LCAS Asymmetrical Discrete Device
Thermal Considerations
Package
DO-214AA
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +125
-65 to +150
60
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
I
S
I
H
Waveform = tr x td
I
DRM
-V
+V
Half Value
VDRM
VT
VS
0
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 39
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Four-Port Balanced Three-chip Protector
Four-Port Balanced Three-chip Protector
This hybrid Single In-line Package (SIP) protects four twisted pairs from overcurrent and
overvoltage conditions. Comprised of twelve discrete DO-214AA SIDACtor devices and
eight TeleLink surface mount fuses, it is ideal for densely populated line cards that cannot
afford PCB inefficiencies or the use of series power resistors. Surge current ratings up to
500 A are available.
F2
Z3
F4
Z6
F6
Z9
F8
Tip
Gnd
Ring
2
3
4
5
Tip
Gnd
Ring
7
8
9
10
Tip
12
15
Tip
17
20
Z12
Z11
Z2
Z5
Z8
Gnd 13
Ring 14
Gnd 18
Ring 19
Z10
F7
Z7
F5
Z1
F1
Z4
F3
1
6
11
16
Electrical Parameters
VDRM
VS
Volts
VDRM
Volts
VS
Volts
CO
pF
Volts
Part
Pins 2-3, 4-3, 7-8, 9-8,
Pins 2-4, 7-9,
VT
IDRM
IS
IT
IH
Number *
12-13, 14-13, 17-18, 19-18
12-14, 17-19
Volts
µAmps mAmps
Amps
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
mAmps Pins 1-3
P1553Z_
P1803Z_
P2103Z_
P2353Z_
P2703Z_
P3203Z_
P3403Z_
A2106Z_ **
A5030Z_ **
130
150
170
200
230
270
300
170
400
180
210
250
270
300
350
400
250
550
130
150
170
200
230
270
300
50
180
210
250
270
300
350
400
80
8
8
8
8
8
8
8
8
8
5
5
5
5
5
5
5
5
5
800
800
800
800
800
800
800
800
800
150
150
150
150
150
150
150
120
150
40
40
40
40
30
30
30
40
30
270
350
* For individual “ZA,” “ZB,” and “ZC” surge ratings, see table below.
** Asymmetrical
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 4-3 and Pins 2-3 at 1 MHz with a 2 V bias and is a typical value for “ZA” product.
“ZB” and “ZC” capacitance is approximately 10 pF higher.
•
Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 40
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Four-Port Balanced Three-chip Protector
Thermal Considerations
Package
SIP
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
IS
I
Waveform = tr x td
H
I
DRM
-V
50
0
+V
Half Value
VDRM
VT
VS
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Waveform
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
0.4
-40 -20
0
20 40 60 80 100 120 140 160
-8
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 41
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Four-Port Longitudinal Two-chip Protector
Four-Port Longitudinal Two-chip Protector
This hybrid Single In-line Package (SIP) protects four twisted pairs from overcurrent and
overvoltage conditions. Comprised of eight discrete DO-214AA SIDACtor devices and eight
TeleLink surface mount fuses, it is ideal for densely populated line cards that cannot afford
PCB inefficiencies or the use of series power resistors. Surge current ratings up to 500 A
are available.
F2
F4
Z4
F6
Z6
F8
Tip
Gnd
Ring
2
3
4
5
Tip
Gnd
Ring
7
8
9
10
Tip
12
15
Tip 17
Gnd 18
Ring 19
20
Z2
Z8
Gnd 13
Ring 14
Z1
Z3
Z5
Z7
1
6
11
16
F1
F3
F5
F7
Electrical Parameters
VDRM
VS
VDRM
Volts
VS
CO
pF
Volts
Volts
Volts
Part
Pins 2-3, 4-3, 7-8, 9-8,
Pins 2-4, 7-9,
VT
IDRM
IS
IT
IH
Pins
Number * 12-13, 14-13, 17-18, 19-18
12-14, 17-19
Volts
µAmps
mAmps
800
Amps
mAmps 2-3, 3-4
P0602Z_
P1402Z_
P1602Z_
P2202Z_
P2702Z_
P3002Z_
P3602Z_
P4202Z_
P4802Z_
P6002Z_
25
58
40
77
50
80
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
50
110
50
50
40
40
40
40
30
30
30
116
130
180
240
280
320
380
440
550
154
190
260
320
360
440
500
600
700
800
800
800
800
800
800
800
800
150
150
150
150
150
150
150
150
150
65
95
90
130
160
180
220
250
300
350
120
140
160
190
220
275
800
* For individual “ZA,” “ZB,” and “ZC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured between Pins 4-3 and Pins 2-3 at 1 MHz with a 2 V bias and is a typical value for “ZA” product.
“ZB” and “ZC” capacitance is approximately 2x higher.
•
•
Device is designed to meet balance requirements of GTS 8700 and GR 974.
Lower capacitance MC versions may be available. Contact factory for further information.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 42
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Four-Port Longitudinal Two-chip Protector
Thermal Considerations
Package
SIP
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
IS
I
Waveform = tr x td
H
I
DRM
-V
50
0
+V
Half Value
VDRM
VT
VS
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Waveform
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
0.4
-40 -20
0
20 40 60 80 100 120 140 160
-8
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 43
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Four-Port Metallic Line Protector
Four-Port Metallic Line Protector
The four-port hybrid Single In-line Package (SIP) line protector protects multiple twisted pair
from overcurrent and overvoltage conditions. Based on a SIP, it is equivalent to four
discrete DO-214AA SIDACtor devices and four surface mount fuses. Available in surge
current ratings up to 500 A, this four-port SIP line protector is ideal for densely populated
line cards that cannot afford PCB inefficiencies or the use of series power resistors.
F2
F3
F4
F1
5
7
8
10
11
Tip
1
2
Tip
4
Tip
Tip
Z1
Z2
Z3
Z4
Ring
3
Ring
6
Ring
9
Ring 12
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
µAmps
mAmps
800
800
800
800
800
800
800
800
800
800
800
800
800
Amps
mAmps
P0080Z_
P0300Z_
P0640Z_
P0720Z_
P0900Z_
P1100Z_
P1300Z_
P1500Z_
P1800Z_
P2300Z_
P2600Z_
P3100Z_
P3500Z_
6
25
58
65
75
90
120
140
170
190
220
275
320
25
40
77
88
98
130
160
180
220
260
300
350
400
4
4
4
4
4
4
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
50
50
100
110
50
50
50
40
40
40
30
30
30
30
30
150
150
150
150
150
150
150
150
150
150
150
* For individual “ZA,” “ZB,” and “ZC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
V
DRM is measured at IDRM
.
S is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “ZA” and “ZB” product. “ZC” capacitance is
approximately 2x the listed value.
•
Lower capacitance MC versions may be available. Contact factory for further information.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
A
B
C
150
250
500
150
250
400
90
150
200
50
100
150
45
80
100
20
30
50
500
500
500
http://www.teccor.com
+1 972-580-7777
2 - 44
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Four-Port Metallic Line Protector
Thermal Considerations
Package
SIP
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
IS
I
Waveform = tr x td
H
I
DRM
-V
50
0
+V
Half Value
VDRM
VT
VS
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Waveform
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
0.4
-40 -20
0
20 40 60 80 100 120 140 160
-8
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 45
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Fixed Voltage SLIC Protector
Fixed Voltage SLIC Protector
These DO-214AA unidirectional protectors are constructed with a SIDACtor device and an
(T/R)
integrated diode. They protect SLICs (Subscriber Line Interface Circuits) from damage
during transient voltage activity and enable line cards to meet various regulatory
requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-
968 (formerly known as FCC Part 68).
(G)
For specific design criteria, see details in Figure 3.21.
Cathode
Electrical Parameters
Part
VDRM
VS
VT
VF
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
Volts
µAmps
mAmps
Amps
mAmps
P0641S_
P0721S_
P0901S_
P1101S_
58
65
75
95
77
88
98
4
4
4
4
5
5
5
5
5
5
5
5
800
800
800
800
1
1
1
1
120
120
120
120
70
70
70
70
130
* For individual “SA” and “SC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
V
DRM is measured at IDRM.
VS and VF are measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for “SA” and “SB” product. “SC” capacitance is
approximately 2x the listed value.
•
Parallel capacitive loads may affect electrical parameters.
Surge Ratings (Preliminary Data)
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
C
150
500
150
400
90
200
50
120
45
100
20
50
500
500
http://www.teccor.com
+1 972-580-7777
2 - 46
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Fixed Voltage SLIC Protector
Thermal Considerations
Package
DO-214AA
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
90
Unit
°C
°C
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
+I
tr = rise time to peak value
td = decay time to half value
VF
Peak
Value
100
Waveform = tr x td
VDRM
VS
VT
-V
50
0
+V
Half Value
IDRM
IH
IS
tr
td
IT
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 47
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Twin SLIC Protector
Twin SLIC Protector
Subscriber Line Interface Circuits (SLIC) are highly susceptible to transient voltages, such
as lightning and power cross conditions. To minimize this threat, Teccor provides this dual-
chip, fixed-voltage SLIC protector device.
1
(T)
2
(G)
3
For specific design criteria, see details in Figure 3.23.
(R)
Electrical Parameters
VDRM
VS
VDRM
Volts
VS
Volts
Volts
Volts
Part
VT
VF
IDRM
IS
IT
IH
CO
pF
Number *
Pins 1-2, 2-3
Pins 1-3
Volts
Volts
µAmps mAmps Amps mAmps
P0641CA2
P0721CA2
P0901CA2
P1101CA2
58
65
75
95
77
88
98
58
65
75
95
77
88
98
4
4
4
4
5
5
5
5
5
5
5
5
800
800
800
800
1
1
1
1
120
120
120
120
60
60
60
60
130
130
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
V
DRM is measured at IDRM.
VS and VF are measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured across pins 1-2 or 2-3 at 1 MHz with a 2 V bias. Capacitance across pins 1-3 is approximately
half.
•
•
Parallel capacitive loads may affect electrical parameters.
Compliance with GR 1089 or UL 60950 power cross tests may require special design considerations. Contact the factory for further
information.
Surge Ratings (Preliminary Data)
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
150
150
90
50
45
20
500
http://www.teccor.com
+1 972-580-7777
2 - 48
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Twin SLIC Protector
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
Unit
°C
°C
Modified DO-214AA
-40 to +150
-65 to +150
85
Pin 3
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
Pin 1
Pin 2
+I
tr = rise time to peak value
td = decay time to half value
VF
Peak
Value
100
Waveform = tr x td
VDRM
VS
VT
-V
+V
50
0
Half Value
IDRM
IH
IS
tr
td
IT
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-8
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 49
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Multiport SLIC Protector
Multiport SLIC Protector
This multiport line protector is designed as a single-package solution for protecting
1
(T1)
6
(T2)
multiple twisted pair from overvoltage conditions. Based on a six-pin SOIC package, it
is equivalent to four discrete DO-214AA packages. Available in surge current ratings
up to 500 A for a 2x10 µs event, the multiport line protector is ideal for densely
populated line cards that cannot afford PCB inefficiencies or the use of series power
resistors.
2
(G1)
5
(G2)
3
(R1)
4
(R2)
For specific design criteria, see details in Figure 3.24.
Electrical Parameters
VDRM
VS
VDRM
Volts
VS
Volts
Volts
Volts
Pins
Part
1-2, 2-3,
Pins
1-3, 4-6
VT
VF
IDRM
IS
IT
IH
CO
pF
Number *
4-5, 5-6
Volts
Volts
µAmps mAmps Amps mAmps
P0641U_
P0721U_
P0901U_
P1101U_
58
77
88
98
58
65
75
95
77
88
98
4
4
4
4
5
5
5
5
5
5
5
5
800
800
800
800
1
1
1
1
120
120
120
120
70
70
70
70
65
75
95
130
130
* For individual “UA” and “UC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
V
DRM is measured at IDRM.
VS and VF are measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured across pins 1-2, 2-3, 4-5, or 5-6 at 1 MHz with a 2 V bias and is a typical value. Capacitance
across pins 1-3 or 4-6 is approximately half. “UC” capacitance is approximately 2x the listed value for “UA” product.
•
Parallel capacitive loads may affect electrical parameters.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
C
150
500
150
400
90
200
50
120
45
100
20
50
500
500
http://www.teccor.com
+1 972-580-7777
2 - 50
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Multiport SLIC Protector
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
60
Unit
°C
°C
Modified MS-013
6
5
4
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
1
2
3
+I
tr = rise time to peak value
td = decay time to half value
VF
Peak
Value
100
Waveform = tr x td
VDRM
VS
VT
-V
+V
50
0
Half Value
IDRM
IH
IS
tr
td
IT
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-8
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 51
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Battrax SLIC Protector
Battrax SLIC Protector
This solid state protection device can be referenced to either a positive or negative voltage
source. The B1xx0C_ is for a -VREF and the B2050C_ is for a +VREF. Designed using an
SCR and a gate diode, the B1xx0C_ Battrax begins to conduct at |-VREF| + |-1.2 V| while the
B2050C_ Battrax begins to conduct at |+VREF| + |1.2 V|.
For a diagram of a Battrax application, see Figure 3.29.
Pin 3
(+V
Pin 2
(Ground)
)
Pin 1
REF
(Line)
Pin 3
(-V
)
REF
Gate
Pin 1
Pin 2
(Ground)
(Line)
-Battrax
B1xx0C_
+Battrax
B2050C_
Electrical Parameters
Part
VDRM
Volts
VS
VT
IDRM
IGT
IT
IH
CO
pF
Number *
Volts
Volts
µAmps
mAmps
Amps
mAmps
B1100C_
B1160C_
B1200C_
B2050C_
|-VREF| + |-1.2 V|
|-VREF| + |-1.2 V|
|-VREF| + |-1.2 V|
|+VREF| + |1.2 V|
|-VREF| + |-10 V|
|-VREF| + |-10 V|
|-VREF| + |-10 V|
|+VREF| + |10 V|
4
4
4
4
5
5
5
5
100
100
100
50
1
1
1
1
100
160
200
5
50
50
50
50
* For individual “CA” and “CC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
PP ratings assume VREF = ±48 V.
I
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “CC” product is approximately 2x the listed value.
Positive Battrax information is preliminary data.
V
V
REF maximum value for the negative Battrax is -200 V.
REF maximum value for the positive Battrax is 110 V.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
Amps/µs
A
C
150
500
150
400
90
200
60
150
50
100
40
50
500
500
http://www.teccor.com
+1 972-580-7777
2 - 52
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Battrax SLIC Protector
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
Unit
°C
°C
Modified DO-214AA
-40 to +150
-65 to +150
85
Pin 3
(VREF
)
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
Pin 1
(Line)
Pin 2
(Ground)
+I
+I
IT
IS
IH
VDRM
VS
VT
IDRM
-V
-V
+V
+V
IDRM
VS
VDRM
VT
IH
IS
IT
-I
-I
V-I Characteristics for Negative Battrax
V-I Characteristics for Positive Battrax
14
12
10
8
2.0
1.8
1.6
1.4
6
25 ˚C
25 ˚C
1.2
4
1.0
0.8
0.6
0.4
2
0
-4
-6
-8
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 53
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Battrax Dual Negative SLIC Protector
Battrax Dual Negative SLIC Protector
This solid state Battrax protection device is referenced to a negative voltage source. Its
dual-chip package also includes internal diodes for transient protection from positive
surge events.
(G)
5
For a diagram of a Battrax application, see Figure 3.27.
1
2
3
(R)
(T) (-VREF
)
Electrical Parameters
Part
VDRM
VS
VT
VF
IDRM
IGT
IT
IH
CO
pF
Number *
Volts
Volts
Volts
Volts
µAmps
mAmps
Amps
mAmps
B1101U_
B1161U_
B1201U_
|-VREF| + |-1.2V|
|-VREF| + |-1.2V|
|-VREF| + |-1.2V|
|-VREF| + |-10V|
|-VREF| + |-10V|
|-VREF| + |-10V|
4
4
4
5
5
5
5
5
5
100
100
100
1
1
1
100
160
200
50
50
50
* For individual “UA” and “UC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
PP ratings assume a VREF = -48 V.
I
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “UC” product is approximately 2x the listed value.
REF maximum value for the B1101, B1161, and/or B1201 is -200 V.
V
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
A
C**
Amps/µs
150
500
150
400
90
200
50
120
45
100
20
50
500
500
** Call factory for release date.
http://www.teccor.com
+1 972-580-7777
2 - 54
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Battrax Dual Negative SLIC Protector
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +125
-65 to +150
60
Unit
°C
°C
Modified MS-013
6
5
4
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
1
2
3
+I
tr = rise time to peak value
td = decay time to half value
VF
Peak
Value
100
Waveform = tr x td
VDRM
VS
VT
-V
+V
50
0
Half Value
IDRM
IH
IS
tr
td
IT
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-8
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 55
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Battrax Dual Positive/Negative SLIC Protector
Battrax Dual Positive/Negative SLIC Protector
(+VREF
)
This Battrax device protects Subscriber Line Interface Circuits (SLIC) that use both a
5
positive and negative Ring voltage. It limits transient voltages with rise times of 100 V/
µs to V
±10 V.
REF
Ground
4, 6
Teccor’s six-pin Battrax devices are constructed using four SCRs and four gate diodes.
The SCRs conduct when a voltage that is more negative than -V (and/or more
REF
positive than +V
) is applied to the cathode (Pins 1 and 3) of the SCR. During
REF
conduction, the SCRs appear as a low-resistive path which forces all transients to be
shorted to ground.
2
3
(R)
1
(T)
(-VREF
)
For a diagram of a Battrax application, see Figure 3.30.
Electrical Parameters
Part
VDRM
Volts
VS
VT
IDRM
IGT
IT
IH
CO
pF
Number *
Volts
Volts
µAmps
mAmps
Amps
mAmps
B3104U_
B3164U_
B3204U_
|-VREF| + |±1.2V|
|-VREF| + |±1.2V|
|-VREF| + |±1.2V|
|-VREF| + |±10V|
|-VREF| + |±10V|
|-VREF| + |±10V|
4
4
4
5
5
5
100
100
100
1
1
1
100
160
200
50
50
50
* For individual “UA” and “UC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
PP ratings assume a VREF = ±48 V.
I
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “UC” product is approximately 2x the listed value.
Positive Battrax information is preliminary data.
V
V
REF maximum value for the negative Battrax is -200 V.
REF maximum value for the positive Battrax is 110 V.
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
Amps
8x20 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
di/dt
Series
A
C**
Amps/µs
150
500
150
400
90
200
50
120
45
100
20
50
500
500
** Call factory for release date.
http://www.teccor.com
+1 972-580-7777
2 - 56
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Battrax Dual Positive/Negative SLIC Protector
Thermal Considerations
Package
Modified MS-013
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +125
-65 to +150
60
Unit
°C
°C
6
5
4
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
1
2
3
+I
tr = rise time to peak value
td = decay time to half value
Positive Battrax
Characteristics
IT
Peak
Value
100
IS
I
H
Waveform = tr x td
I
DRM
-V
+V
50
0
Half Value
V
DRM
V
T
V
S
Negative Battrax
Characteristics
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 57
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
Battrax Quad Negative SLIC Protector
Battrax Quad Negative SLIC Protector
This Battrax device is an integrated overvoltage protection solution for SLIC-based
(Subscriber Line Interface Circuit) line cards. This six-pin device is constructed using
four SCRs and four gate diodes.
(T)
6
Ground
5
(R)
4
The device is referenced to V
and conducts when a voltage that is more negative
BAT
than -V
is applied to the cathode (pins 1, 3, 4, or 6) of the SCR. During conduction,
REF
all negative transients are shorted to Ground. All positive transients are passed to
Ground by steering diodes.
1
2
3
(T)
(-VREF
)
(R)
For specific diagrams showing these Battrax applications, see Figure 3.28.
Electrical Parameters
Part
VDRM
Volts
VS
VT
IDRM
IGT
IT
IH
CO
pF
Number *
Volts
Volts
µAmps
mAmps
Amps
mAmps
B1101U_4
B1161U_4
B1201U_4
|-VREF| + |-1.2V|
|-VREF| + |-1.2V|
|-VREF| + |-1.2V|
|-VREF| + |-10V|
|-VREF| + |-10V|
|-VREF| + |-10V|
4
4
4
5
5
5
100
100
100
1
1
1
100
160
200
50
50
50
* For individual “UA” and “UC” surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
PP ratings assume a VREF = ±48 V.
I
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. “UC” product is approximately 2x the listed value.
REF maximum value for the negative Battrax is -200 V.
V
Surge Ratings
IPP
IPP
IPP
IPP
IPP
ITSM
60 Hz
Amps
2x10 µs
8x20 µs
10x160 µs
10x560 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps
Amps
Amps
Amps/µs
A
C
150
500
150
400
90
200
50
120
45
100
20
50
500
500
http://www.teccor.com
+1 972-580-7777
2 - 58
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
Battrax Quad Negative SLIC Protector
Thermal Considerations
Package
Modified MS-013
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +125
-65 to +150
60
Unit
°C
°C
6
5
4
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
1
2
3
+I
tr = rise time to peak value
td = decay time to half value
Positive Battrax
Characteristics
IT
Peak
Value
100
IS
I
H
Waveform = tr x td
I
DRM
-V
+V
50
0
Half Value
V
DRM
V
T
V
S
Negative Battrax
Characteristics
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 59
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
CATV and HFC SIDACtor Device
CATV and HFC SIDACtor Device
This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package.
It protects equipment located in the severe surge environment of Community Antenna TV
(CATV) applications.
1
3
Used in Hybrid Fiber Coax (HFC) applications, this device replaces the gas tube
traditionally used for station protection, because a SIDACtor device has a much tighter
voltage tolerance.
Electrical Parameters
CO
pF
Pins 1-3
200
Part
VDRM
Volts
120
170
VS
VT
IDRM
IS
IT
IH
Number *
Volts
Volts
µAmps
mAmps
Amps
mAmps
P1400AD
P1800AD
160
220
3
5.5
5
5
800
800
2.2
2.2
50
50
150
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP
IPP
ITSM
60 Hz
Amps
8x20 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps/µs
D
1000
250
120
500
http://www.teccor.com
+1 972-580-7777
2 - 60
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
CATV and HFC SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
60
Unit
°C
°C
Modified
TO-220
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
3
1
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
IS
IH
Waveform = tr x td
IDRM
-V
50
0
+V
Half Value
VDRM
VT
VS
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
25 ˚C
25 ˚C
4
2
0
-4
-6
-8
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 61
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
High Surge Current SIDACtor Device
High Surge Current SIDACtor Device
This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package.
1
(T)
It protects equipment located in the severe surge environment of Community Antenna TV
2
(G)
(CATV) applications.
3
(R)
This device can replace the gas tubes traditionally used for station protection because
SIDACtor devices have much tighter voltage tolerances.
Electrical Parameters
CO
pF
Pins 1-3
Part
VDRM
Volts
VS
VT
IDRM
IS
IT
IH
Number *
Volts
Volts
µAmps
mAmps
Amps
mAmps
P6002AD
550
700
5.5
5
800
2.2
50
60
* For surge ratings, see table below.
Electrical Parameters
CO
pF
Pins 1-3
Part
VDRM
Volts
VS
VT
IDRM
IS
IT
IH
Number *
Volts
Volts
µAmps
mAmps
Amps
mAmps
P3100AD
280
360
5.5
5
800
2.2
120
115
* For surge ratings, see table below.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP
IPP
ITSM
60 Hz
Amps
8x20 µs
10x1000 µs
di/dt
Series
Amps
Amps
Amps/µs
D
1000
250
120
1000
http://www.teccor.com
+1 972-580-7777
2 - 62
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
High Surge Current SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
60
Unit
°C
°C
Modified
TO-220
R
Thermal Resistance: Junction to Ambient
°C/W
ꢀJA
PIN 1
PIN 3
PIN 2
Note: P6002AD is shown. P3100AD has no center lead.
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
0
IS
IH
Waveform = tr x td
IDRM
-V
+V
Half Value
VDRM
VT
VS
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-8
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
© 2002 Teccor Electronics
2 - 63
http://www.teccor.com
+1 972-580-7777
®
SIDACtor Data Book and Design Guide
CATV Line Amplifiers/Power Inserters SIDACtor Device
CATV Line Amplifiers/Power Inserters
SIDACtor Device
This SIDACtor device is a 5000 A solid state protection device offered in a non-isolated
TO-218 package. It protects equipment located in the severe surge environment of CATV
(Community Antenna TV) applications.
1
2
In CATV line amplifiers and power inserters, this device can replace the gas tubes
traditionally used for station protection because SIDACtor devices have much tighter
voltage tolerances.
Electrical Parameters
Part
VDRM
VS
VT
IDRM
IS
IT
IH
CO
pF
Number *
Volts
Volts
Volts
µAmps
mAmps
Amps **
mAmps
P1900ME
P2300ME
140
180
220
260
4
4
5
5
800
800
2.2/25
2.2/25
50
50
750
750
* For surge ratings, see table below.
** IT is a free air rating; heat sink IT rating is 25 A.
General Notes:
•
•
•
•
•
•
•
All measurements are made at an ambient temperature of 25 °C. IPP applies to -40 °C through +85 °C temperature range.
I
PP is a repetitive surge rating and is guaranteed for the life of the product.
Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities.
V
DRM is measured at IDRM.
VS is measured at 100 V/µs.
Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request.
Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP
ITSM
60 Hz
Amps
8x20 µs
di/dt
Series
Amps
Amps/µs
E
5000
400
500
http://www.teccor.com
+1 972-580-7777
2 - 64
© 2002 Teccor Electronics
®
SIDACtor Data Book and Design Guide
CATV Line Amplifiers/Power Inserters SIDACtor Device
Thermal Considerations
Package
Symbol
TJ
TS
Parameter
Operating Junction Temperature Range
Storage Temperature Range
Value
-40 to +150
-65 to +150
100
Unit
°C
°C
2
TO-218
TC
Maximum Case Temperature
°C
R
R
Thermal Resistance: Junction to Case
Thermal Resistance: Junction to Ambient
1.7
56
°C/W
°C/W
ꢀJC *
ꢀJA
3
(No
2
1
Connection)
* RꢀJC rating assumes the use of a heat sink and on state mode for extended time at 25 A, with average power dissipation of 29.125 W.
+I
tr = rise time to peak value
td = decay time to half value
IT
Peak
Value
100
50
0
IS
IH
Waveform = tr x td
IDRM
-V
+V
Half Value
VDRM
VT
VS
tr
td
0
t – Time (µs)
-I
V-I Characteristics
tr x td Pulse Wave-form
14
12
10
8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
6
4
25 ˚C
25 ˚C
2
0
-4
-6
0.4
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-8
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
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SIDACtor Data Book and Design Guide
TeleLink Fuse
TeleLink Fuse
The TeleLink Surface Mount (SM) surge resistant fuse offers circuit protection without
requiring a series resistor. When used in conjunction with the SIDACtor Transient Voltage
Suppressor (TVS), the TeleLink SM fuse and the SIDACtor TVS provide a complete
regulatory-compliant solution for standards such as GR 1089, TIA-968 (formerly known as
FCC Part 68), UL 60950, and ITU K.20 and K.21. No series resistor is required for the
F1250T and F1251T to comply with these standards.
Contact factory for enhanced K.20 and K.21 details.
Surge Ratings
IPP
IPP
IPP
IPP
2x10 µs
Amps
10x160 µs
Amps
10x560 µs
Amps
10x1000 µs
Amps
TeleLink SM Fuse
F0500T
F1250T
F1251T
not rated
500
500
75
160
160
45
115
115
35
100
100
Interrupting Values
I2t Measured
Interrupting Rating
TeleLink SM
Voltage
Rating
250 V
250 V
250 V
Current
Rating
500 mA
1.25 A
2 A
at DC Rated
Voltage
Fuse
Voltage, Current
600 V, 40 A
600 V, 60 A *
600 V, 60 A *
MIN
1 ms
1 ms
1 ms
TYP
MAX
60 ms
60 ms
60 ms
F0500T
F1250T
F1251T
1.3 A2s
22.2 A2s
30 A2s
2 ms
2 ms
2 ms
* Interrupt test characterized at 50° to 70° phase angle. Phase angles approximating 90° may result in damage to the body of the fuse.
Notes:
•
The TeleLink SM fuse is designed to carry 100% of its rated current for four hours and 250% of its rated current for one second
minimum and 120 seconds maximum. Typical time is four to 10 seconds. For optimal performance, an operating current of 80% or
less is recommended.
•
I2t is a non-repetitive RMS surge current rating for a period of 16.7 ms.
Resistance Ratings
DC Cold Resistance
Typical Voltage Drop
@ Rated Current
TeleLink SM Fuse
F0500T
MIN
MAX
0.471 V
0.205 V
0.110 V
0.420 ꢁ
0.107 ꢁ
0.050 ꢁ
0.640 ꢁ
0.150 ꢁ
0.100 ꢁ
F1250T
F1251T
Notes:
•
•
•
Typical inductance ꢀ 4 µH up to 500 MHz.
Resistance changes 0.5% for every °C.
Resistance is measured at 10% rated current.
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TeleLink Fuse
Qualification Data
The F1250T and F1251T meet the following test conditions per GR 1089 without additional series resistance.
However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the
Second Level AC Power Fault Test.
First Level Lightning Surge Test
Surge Voltage
Wave-form
µs
Surge Current
Amps
Repetitions Each
Polarity
Test
Volts
1
2
3
4
5
±600
±1000
±1000
±2500
±1000
10x1000
10x360
10x1000
2x10
100
100
100
500
25
25
25
25
10
5
10x360
Second Level Lightning Surge Test
Surge Voltage
Wave-form
µs
Surge Current
Amps
Repetitions Each
Polarity
Test
Volts
1
±5000
2x10
500
1
First Level AC Power Fault Test
Applied Voltage, 60 Hz
VRMS
Short Circuit Current
Test
1
Amps
Duration
15 min
50
0.33
2
100
0.17
15 min
3
4
5
6
7
8
9
200, 400, 600
1 at 600 V
60 applications, 1 s each
60 applications, 1 s each
60 applications, 5 s each
30 s each
1000
*
600
600
600
1000
1
*
0.5
2.2
3
2 s each
1 s each
0.5 s each
5
* Test 5 simulates a high impedance induction fault. For specific information, please contact Teccor Electronics.
Second Level AC Power Fault Test for Non-Customer Premises Equipment
Applied Voltage, 60 Hz
Short Circuit Current
Test
VRMS
Amps
Duration
30 min
5 s
5 s
30 min
1
2
3
4
120, 277
600
600
30
60
7
100-600
2.2 at 600 V
Notes:
•
•
•
Power fault tests equal or exceed the requirements of UL 60950 3rd edition.
Test 4 is intended to produce a maximum heating effect. Temperature readings can exceed 150 °C.
Test 2 may be dependent on the closing angle of the voltage source. Fuse is characterized at 50° to 70°. Closing angles
approximating 90° may result in damage to the body of the fuse.
Use caution when routing internal traces adjacent to the F1250T and F1251T.
•
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SIDACtor Data Book and Design Guide
TeleLink Fuse
1000
800
700
600
500
400
300
200
100
90
80
70
60
50
40
30
20
F0500T
F1250T
F1251T
10
9
8
7
6
5
4
3
2
1
.9
.8
.7
.6
.5
.4
.3
.2
.1
.09
.08
.07
.06
.05
.04
.03
.02
.01
.1
.2
.4
.5
.7 .8 .9
1
5
10
20
30
50 60 70 80 90100
Current in Amperes
Time Current Curve
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TeleLink Fuse
Temperature Derating Curve
Operating temperature is -55 °C to +125 °C with proper correction factor applied.
150
140
130
120
110
100
90
80
70
60
Effect on
Current Rating
50
40
30
-55 -60 -40 -20
0
20 40 60 80 100 125
Ambient ˚C
Chart of Correction Factor
Maximum Temperature Rise
TeleLink Fuse
F0500T
Temperature Reading
?75 °C (167 °F) *
?75 °C (167 °F) *
?75 °C (167 °F) *
F1250T
F1251T
* Higher currents and PCB layout designs can affect this parameter.
Notes:
•
•
Readings are measured at rated current after temperature stabilizes
The F1250T meets the requirements of UL 248-14. However, board layout, board trace widths, and ambient
temperature values can cause higher than expected rises in temperature. During UL testing, the typical
recorded heat rise for the F1250T at 2.2 A was 120 °C.
Package Symbolization
Manufactured in
USA
Manufactured in
Taiwan
Marking
FU
FT
JU
JT
F0500T
F
F
F1250T
F1251T
U
U
U
T
T
T
J
J
NU
NT
N
N
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SIDACtor Data Book and Design Guide
NOTES
3 Reference Designs
This section offers specific examples of how SIDACtor devices can be used to ensure long-
term operability of protected equipment and uninterrupted service during transient electrical
activity. For additional line interface protection circuits, see "Regulatory Compliant
Solutions" on page 4-34.
Customer Premises Equipment (CPE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
High Speed Transmission Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
ADSL Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
HDSL Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
ISDN Circuit Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Pair Gain Circuit Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11
T1/E1 Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
Additional T1 Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
T3 Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
Analog Line Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17
PBX Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25
CATV Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26
Primary Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29
Secondary Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-31
Triac Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33
Data Line Protectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34
LAN / WAN Protectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35
10Base-T Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35
100Base-T Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36
Note: The circuits referenced in this section represent typical interfaces used in
telecommunications equipment. SIDACtor devices are not the sole components
required to pass applicable regulatory requirements such as UL 60950, GR 1089, or
TIA-968 (formerly known as FCC Part 68), nor are these requirements specifically
directed at SIDACtor devices.
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SIDACtor Data Book and Design Guide
Customer Premises Equipment (CPE)
Customer Premises Equipment (CPE)
CPE is defined as any telephone terminal equipment which resides at the customer’s site
and is connected to the Public Switched Telephone Network (PSTN). Telephones, modems,
caller ID adjunct boxes, PBXs, and answering machines are all considered CPE.
Protection Requirements
CPE should be protected against overvoltages that can exceed 800 V and against surge
currents up to 100 A. In Figure 3.1 through Figure 3.6, SIDACtor devices were chosen
because their associated peak pulse current (IPP) rating is sufficient to withstand the
lightning immunity test of TIA-968 (formerly known as FCC Part 68) without the additional
use of series line impedance. Likewise, the fuse shown in Figure 3.1 through Figure 3.6
was chosen because the amps2time (I2t) rating is sufficient to withstand the lightning
immunity tests of TIA-968 without opening, but low enough to pass UL power cross
conditions.
The following regulatory requirements apply:
•
•
TIA-968 (formerly known as FCC Part 68)
UL 60950
All CPE intended for connection to the PSTN must be registered in compliance with
TIA-968. Also, because the National Electric Code mandates that equipment intended for
connection to the telephone network be listed for that purpose, consideration should be
given to certifying equipment with an approved safety lab such as Underwriters
Laboratories.
CPE Reference Circuits
Figure 3.1 through Figure 3.6 show examples of interface circuits which meet all applicable
regulatory requirements for CPE. The P3100SB and P3100EB are used in these circuits
because the peak off-state voltage (VDRM) is greater than the potential of a Type B ringer
superimposed on a POTS (plain old telephone service) battery.
150 VRMSꢀꢁ2 + 56.6 VPK = 268.8 VPK
Note that the circuits shown in Figure 3.1 through Figure 3.6 provide an operational solution
for TIA-968 (formerly known as FCC Part 68). However TIA-968 allows CPE designs to
pass non-operationally as well.
For a non-operational solution, coordinate the IPP rating of the SIDACtor device and the I2t
rating of the fuse so that (1) both will withstand the Type B surge, and (2) during the Type A
surge, the fuse will open. (See Table 5.1, Surge Rating Correlation to Fuse Rating on page
5-8.)
Note: For alternative line interface protection circuits, see "Regulatory Compliant Solutions"
on page 4-34.
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SIDACtor Data Book and Design Guide
Customer Premises Equipment (CPE)
F1250T
Tip
P3100SB
or
P3100EB
To Protected
Components
Ring
Figure 3.1 Basic CPE Interface
Transmit / Receive
F1250T
Tip
+
-
P3100SB
or
P3100EB
Ring
-
+
Ring
Detect
Figure 3.2 Transformer Coupled Tip and Ring Interface
F1250T
Tip
Relay
Transmit/
Receive
Circuitry
P3100SB
or
P3100EB
Ring
Ring
Detect
Figure 3.3 Modem Interface
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SIDACtor Data Book and Design Guide
Customer Premises Equipment (CPE)
Transistor
Network
Interface
Hook Switch
F1250T
Tip
Ring
Ringer
Option 1
P3100SB
or
P3100EB
Speech
Handset
Dialer
IC
Network
DTMF
Figure 3.4 CPE Transistor Network Interface — Option 1
Transistor
Network
Interface
Hook Switch
F1250T
Tip
Ring
Option 2
P1800SB
or
Ringer
P1800EB
Dialer
IC
Speech
Network
Handset
DTMF
Figure 3.5 CPE Transistor Network Interface — Option 2
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SIDACtor Data Book and Design Guide
Customer Premises Equipment (CPE)
F1250T
Tip
Transistor
Network
Interface
P3100SB
or
P3100EB
Ring
Ring
Detect
Note: Different Ground References Shown.
F1250T
Tip
Transistor
Network
Interface
P3100SB
or
P3100EB
Ring
Ring
Detect
Figure 3.6 Two-line CPE Interface
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SIDACtor Data Book and Design Guide
High Speed Transmission Equipment
High Speed Transmission Equipment
High speed transmission equipment encompasses a broad range of transmission protocols
such as T1/E1, xDSL, and ISDN. Transmission equipment is located at the central office,
customer premises, and remote locations.
Protection Requirements
Transmission equipment should be protected against overvoltages that can exceed 2500 V
and surge currents up to 500 A. In Figure 3.7 through Figure 3.17, SIDACtor devices were
chosen because their associated peak pulse current (IPP) rating is sufficient to withstand the
lightning immunity tests of GR 1089 without the additional use of series line impedance.
Likewise, the fuse shown in Figure 3.7 through Figure 3.17 was chosen because the
amps2time (I2t) rating is sufficient to withstand the lightning immunity tests of GR 1089, but
low enough to pass GR 1089 current limiting protector test and power cross conditions
(both first and second levels).
The following regulatory requirements apply:
•
•
•
•
TIA-968 (formerly known as FCC Part 68)
GR 1089-CORE
ITU-T K.20/K.21
UL 60950
Most transmission equipment sold in the US must adhere to GR 1089. For Europe and
other regions, ITU-T K.20/K.21 is typically the recognized standard.
ADSL Circuit Protection
Asymmetric Digital Subscriber Lines (ADSLs) employ transmission rates up to 6.144 Mbps
from the Central Office Terminal (COT) to the Remote Terminal (RT) and up to 640 kbps
from the RT to the COT at distances up to 12,000 feet. (Figure 3.7)
Central Office Site
Local Loop
Remote Site
ADSL
transceiver
unit
ADSL transceiver unit
ATU-C
video
voice
Digital
Network
ATU-R
data
Splitter
PSTN
POTS
up to 12 kft
Figure 3.7 ADSL Overview
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SIDACtor Data Book and Design Guide
High Speed Transmission Equipment
Protection Circuitry
Longitudinal protection was not used at either the ADSL Transceiver Unit – Central Office
(ATU-C) interface or the ADSL Transceiver Unit – Remote (ATU-R) interface due to the
absence of earth ground connections. (Figure 3.8) In both instances, the P3500SC MC
SIDACtor device and the F1250T TeleLink fuse provide metallic protection. For ATUs not
isolated from earth ground, reference the HDSL protection topology.
F1250T
TIP
ADSL
chip set
P3500SC MC
RING
Figure 3.8 ADSL Protection
Component Selection
The P3500SC MC SIDACtor device and F1250T TeleLink fuse were chosen to protect the
ATUs because both components meet GR 1089 surge immunity requirements without the
use of additional series resistance. Although the P3100 series SIDACtor device may be
used to meet current ANSI specifications, Teccor recommends the P3500 series to avoid
interference with the 20 VP-P x DSL signal on a 150 V rms ringing signal superimposed on a
56.5 V battery.
HDSL Circuit Protection
HDSL (High-bit Digital Subscriber Line) is a digital line technology that uses a 1.544 Mbps
(T1 equivalent) transmission rate for distances up to 12,000 feet, eliminating the need for
repeaters. The signaling levels are a maximum of ±2.5 V while loop powering is typically
under 190 V. (Figure 3.9)
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© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
High Speed Transmission Equipment
Central Office Site
Remote Site
HDSL transceiver unit
HDSL transceiver unit
DS-1 Rate
DS-1 Rate
Interface
(1.544 Mbps)
Interface
(1.544 Mbps)
784 kbps Full-Duplex loop
HTU-C
HTU-R
784 kbps Full-Duplex loop
< 12,000 ft, 200 kHz BW
+2.5 V signal level
2B1Q, ZO=135 W
Figure 3.9 HDSL Overview
Protection Circuitry
Longitudinal protection is required at both the HDSL Transceiver Unit – Central Office
(HTU-C) and HDSL Transceiver Unit – Remote (HTU-R) interfaces because of the ground
connection used with loop powering. Two P2300SC MC SIDACtor devices provide
overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on Ring) provide
overcurrent protection. (Figure 3.10) For the transceiver side of the coupling transformer,
additional overvoltage protection is provided by the P0080SA SIDACtor device. The
longitudinal protection on the primary coil of the transformer is an additional design
consideration for prevention of EMI coupling and ground loop issues.
HTU-C/HTU-R Interface Protection
F1250T
Tip
P2300SC MC
P0080SA MC
TX
P2300SC MC
Ring
F1250T
Power
Sink
HDSL
Transceiver
F1250T
F1250T
Tip
P2300SC MC
P2300SC MC
P0080SA MC
RX
Ring
Figure 3.10 HDSL Protection
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SIDACtor Data Book and Design Guide
High Speed Transmission Equipment
Component Selection
The P2300SC MC SIDACtor device and the F1250T TeleLink fuse were chosen because
both components meet GR 1089 surge immunity requirements without the use of additional
series resistance. The P2300SC MC voltage rating was selected to ensure loop powering
up to 190 V. For loop powering greater than 190 V, consider the P2600SC MC. The
P0080SA MC SIDACtor device was chosen to eliminate any sneak voltages that may
appear below the voltage rating of the P2300SC MC.
ISDN Circuit Protection
Integrated Services Digital Network (ISDN) circuits require protection at the Network
Termination Layer 1 (NT1) U-interface and at the Terminating Equipment (TE) or
Terminating Adapter (TA) S/T interface. Signal levels at the U-interface are typically ±2.5 V;
however, with sealing currents and maintenance loop test (MLT) procedures, voltages
approaching 150 V rms can occur. (Figure 3.11)
Terminal
Adapter
Terminal
Non-ISDN
T
ISDN Compliant
Central Office Switching
System
Network
Termination
Layer 1
POTS
TA
Terminal Equipment
(ISDN
NT1
CO
Compliant)
B1
T
T
B2
U
TE
ISDN DSL
2-Wire,
160 kbps
2B1Q 2.5 V
Reference
D
B1
S
B2
TE
TA
D
NT2
PBX
ISDN Terminal
S
T Reference
4-Wire
S Reference, 4-Wire
Figure 3.11 ISDN Overview
Protection Circuitry
Longitudinal protection was not used at either the U- or the TA/TE-interface due to the
absence of an earth-to-ground connection. (Figure 3.12) At the U-interface, the
P2600SC MC SIDACtor device and F1250T TeleLink fuse provide metallic protection, while
the TA/TE-interface uses the P0640SC MC SIDACtor device and F1250T TeleLink fuse.
Figure 3.12 also shows interfaces not isolated from earth ground.
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High Speed Transmission Equipment
ISDN U-Interface
F1250T
ISDN S/T Interface
F1250T
Tip
RX
P0640SC MC
TX
ISDN
Transceiver
ISDN
Transceiver
P2600SC MC
F1250T
Ring
RX
P0640SC MC
TX
Power
Sink
Power
Source
Figure 3.12 ISDN Protection
Component Selection
The “SC MC” SIDACtor devices and F1250T TeleLink fuse were chosen because these
components meet GR 1089 surge immunity requirements without the use of additional
series resistance. An MC is chosen to reduce degradation of data rates. The P2600SC MC
voltage rating was selected to ensure coordination with MLT voltages that can approach
150 V rms. The voltage rating of the P0640SC MC was selected to ensure coordination with
varying signal voltages.
Pair Gain Circuit Protection
A digital pair gain system differs from an ISDN circuit in that ring detection, ring trip, ring
forward, and off-hook detection are carried within the 64 kbps bit stream for each channel
rather than using a separate D channel. The pair gain system also uses loop powering from
10 V up to 145 V with a typical maximum current of 75 mA. (Figure 3.13)
Remote Terminal (RT)
building or pedestal
mounted
Customer
Premises
(CP)
Central Office (CO)
Remote
Terminal
MDF
Central Office
Terminal (COT)
Switching
System
VF
1
HF
VF
2
VF
1
POTS
POTS
Line 1
Line 2
HF
VF
2
Line powered
DSL 2-Wire,
160 kbps
2B1Q
Figure 3.13 Pair Gain Overview
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SIDACtor Data Book and Design Guide
High Speed Transmission Equipment
Protection Circuitry
Longitudinal protection is required at the Central Office Terminal (COT) interface because of
the ground connection used with loop powering. (Figure 3.14) Two P1800SC MC SIDACtor
devices provide overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on
Ring) provide overcurrent protection. For the U-interface side of the coupling transformer,
the illustration shows the P0080SA MC SIDACtor device used for additional overvoltage
protection.
Central Office Terminal (COT) Interface
F1250T
Tip
Tip1
P1800SC MC
Ring1
Tip2
U-Interface
P0080SA
P1800SC MC
Ring2
Ring
F1250T
Power
Source
Figure 3.14 Pair Gain COT Protection
For Customer Premises (CP) and Remote Terminal (RT) interfaces where an earth ground
connection is not used, only metallic protection is required. Figure 3.15 shows metallic
protection satisfied using a single P3100SC MC across Tip and Ring and a single F1250T
on either Tip or Ring to satisfy metallic protection.
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SIDACtor Data Book and Design Guide
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High Speed Transmission Equipment
CPE Interface
Remote Terminal Interface
F1250T
Tip
U-Interface
P3100SC MC
Ring
CPE
F1250T
P3100SC MC
Power
Sink
Line 1
Ring Detect
Ring Trip
Ring Forward
Off-Hook
F1250T
P3100SC MC
Line 2
Detection
Figure 3.15 Pair Gain RT Protection
Component Selection
The “SC MC” SIDACtor device and F1250T TeleLink fuse were chosen because both
components meet GR 1089 surge immunity requirements without the use of additional
series resistance. An MC is chosen to reduce degradation of data rates. The voltage rating
of the P1800SC MC was selected to ensure coordination with loop powering up to 150 V.
The voltage rating of the P3100SC MC was selected to ensure coordination with POTS
ringing and battery voltages.
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High Speed Transmission Equipment
T1/E1 Circuit Protection
T1/E1 networks offer data rates up to 1.544 Mbps (2.058 for E1) on four-wire systems.
Signal levels on the transmit (TX) pair are typically between 2.4 V and 3.6 V while the
receive (RX) pair could go as high as 12 V. Loop powering is typically ±130 V at 60 mA,
although some systems can go as high as 150 V. (Figure 3.16)
Central Office
T1 Transceiver
Line Regenerator
Line Regenerator
3000 ft
6000 ft
TX Pair
RX Pair
Line powered DLC Four-wire,1.544 Mbps/2.048 Mbps
Figure 3.16 T1/E1 Overview
Protection Circuitry
Longitudinal protection is required at the Central Office Terminal (COT) interface because of
the ground connection used with loop powering. (Figure 3.17) Two P1800SC MC SIDACtor
devices provide overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on
Ring) provide overcurrent protection. The P1800SC MC device is chosen because its VDRM
is compliant with TIA-968 regulations, Section 4.4.5.2, “Connections with protection paths
to ground.” These regulations state:
Approved terminal equipment and protective circuitry having an
intentional dc conducting path to earth ground for protection purposes at
the leakage current test voltage that was removed during the leakage
current test of section 4.3 shall, upon its replacement, have a 50 Hz or
60 Hz voltage source applied between the following points:
a. Simplexed telephone connections, including Tip and Ring, Tip-1
and Ring-1, E&M leads and auxiliary leads
b. Earth grounding connections
The voltage shall be gradually increased from zero to 120 V rms for
approved terminal equipment, or 300 V rms for protective circuitry, then
maintained for one minute. The current between (a) and (b) shall not
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High Speed Transmission Equipment
exceed 10 mAPK at any time. As an alternative to carrying out this test
on the complete equipment or device, the test may be carried out
separately on components, subassemblies, and simulated circuits,
outside the unit, provided that the test results would be representative of
the results of testing the complete unit.
Regenerator
COT
F1250T
P1800SC MC
P1800SC MC
F1250T
F1250T
RX
TX
P0300SA
P0640SC MC
T1
Transceiver
T1
Transceiver
Power
Source
F1250T
P1800SC MC
P1800SC MC
F1250T
F1250T
P0640SC MC
RX
TX
P0300SA
Figure 3.17 T1/E1 Protection
The peak voltage for 120 V rms is 169.7 V. The minimum stand-off voltage for the P1800 is
170 V, therefore, the P1800SC MC will pass the test in Section 4.4.5.2 by not allowing
10 mA of current to flow during the application of this test voltage.
For the transceiver side of the coupling transformer, additional overvoltage protection is
shown in Figure 3.17 using the P0300SA SIDACtor device. When an earth ground
connection is not used, only metallic protection is required. Metallic protection is satisfied
using a single P0640SC MC SIDACtor device across Tip and Ring and a single F1250T
TeleLink fuse on either Tip or Ring.
Component Selection
The “SC MC” SIDACtor device and F1250T TeleLink fuse were chosen because these
components meet GR 1089 surge immunity requirements without the use of additional
series resistance. An MC is chosen to reduce degradation of data rates. The voltage rating
of the P1800SC MC was selected to ensure loop powering up to 150 V. The voltage rating
of the P0640SC MC was selected to ensure coordination with varying voltage signals.
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High Speed Transmission Equipment
Additional T1 Design Considerations
A T1 application can be TIA-968 approved as two different possible device types. An XD
device means an external CSU is used and the unit does not have to meet the
TIA-968 environmental test conditions, but it must connect only behind a separately
registered DE device. This XD equipment does not have to meet the T1 pulse template
requirements. If not classified as an XD device, then typically the application must adhere to
TIA-968 environmental test conditions.
T3 Protection
The capacitance across the pair of wires = (D1 || D2) + P0640EC/SC. The diode
capacitance is approximately (10 pF || 10 pF) 20 pF. Then adding the capacitive effect of
the P0640EC/SCMC, which is typically 60 pF, the total capacitance across the pair of wires
is approximately 15 pF. The MUR 1100E diodes are fast-switching diodes that will exhibit
this level of capacitance. MURS160T3 is a surface mount equivalent. (Figure 3.18)
F1250T
D1
D2
P0640EC/SC MC or
P0720EC/SC MC
Figure 3.18 T3 Protection
Alternately, the advanced P0642SA exhibits very low capacitance and can be used as a
stand-alone device.
P0642SA
Figure 3.19 Alternate T3 Protection
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Analog Line Cards
Analog Line Cards
Given that line cards are highly susceptible to transient voltages, network hazards such as
lightning and power cross conditions pose a serious threat to equipment deployed at the
central office and in remote switching locations. To minimize this threat, adequate levels of
protection must be incorporated to ensure reliable operation and regulatory compliance.
Protection Requirements
When designing overvoltage protection for analog line cards, it is often necessary to
provide both on-hook (relay) and off-hook (SLIC) protection. This can be accomplished in
two stages, as shown in Figure 3.20.
F1250T
R
E
L
A
Y
S
L
I
Off Hook
Protection
On Hook
Protection
C
F1250T
Figure 3.20 SLIC Overview
The following regulatory requirements may apply:
•
•
•
•
GR 1089-CORE
ITU-T K.20/K.21
UL 60950
TIA-968 (formerly known as FCC Part 68)
On-Hook (Relay) Protection
On-hook protection is accomplished by choosing a SIDACtor device that meets the
following criteria to ensure proper coordination between the ring voltage and the maximum
voltage rating of the relay to be protected.
V
DRM > VBATT + VRING
VSꢀ?ꢀVRelay Breakdown
This criterion is typically accomplished using two P2600S_ SIDACtor devices (where _
denotes the surge current rating) connected from Tip to Ground and Ring to Ground.
However, for applications using relays such as an LCAS (Line Card Access Switch),
consider the P1200S_ from Tip to Ground and the P2000S_ from Ring to Ground.
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SIDACtor Data Book and Design Guide
Analog Line Cards
Off-Hook (SLIC) Protection
Off-hook protection is accomplished by choosing a SIDACtor device that meets the
following criteria to ensure proper coordination between the supply voltage (VREF) and the
maximum voltage rating of the SLIC to be protected.
V
DRM > VREF
VSꢀ?ꢀVSLIC Breakdown
This criterion can be accomplished in a variety of different ways. For applications using an
external ring generator and a fixed battery voltage, two P0641S_ SIDACtor devices
(P0721S_, P0901S_, or P1101S_ depending on the value of VREF) are used — one Tip to
Ground, one Ring to Ground. For applications using a ring-generating SLIC such as AMD’s
Am79R79, the B1XX0C_ or B1XX1U_ can be used.
IPP Selection
The I of the SIDACtor device must be greater than or equal to the maximum available
PP
surge current (IPK(available)) of the applicable regulatory requirements. Calculate the maximum
available surge current by dividing the peak surge voltage supplied by the voltage generator
(VPK) by the total circuit resistance (RTOTAL). The total circuit resistance is determined by
adding the source resistance (RS) of the surge generator to the series resistance in front of
the SIDACtor device on Tip and Ring (RTIP and RRING).
IPPꢀOꢀIPK(available)
IPK(available) = VPK / RTOTAL
For metallic surges:
R
TOTAL = RS + RTIP + RRING
For longitudinal surges:
TOTAL = RS + RTIP
R
RTOTAL = RS + RRING
Reference Diagrams
Figure 3.21 shows the use of Teccor’s “SC” rated SIDACtor devices and the F1250T
TeleLink fuse to meet the surge immunity requirements of GR 1089. Teccor’s P1200SC and
P2000SC, specifically designed to protect Agere Systems (formerly Lucent
Microelectronics) Line Card Access Switch (LCAS), provide on-hook protection. Two
P0641SCs provide off-hook protection. Any additional series resistance is absent because
the “C” series SIDACtor device and F1250T TeleLink fuse are designed to withstand
GR 1089 surges without the aid of additional components such as line feed resistors and
PTCs.
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Analog Line Cards
F1250T
Tip
P1200SC
P0641SC
P0641SC
L
C
A
S
S
L
I
C
P2000SC
Ring
F1250T
Figure 3.21 SLIC Protection for LCAS
Figure 3.22 illustrates uses of asymmetrical SIDACtor protection for overvoltage conditions
and the F1250T for overcurrent conditions.
F1250T
Tip
P1200SC
P2500SC
A
G
E
R
E
S
L
I
P2500SC
C
Ring
F1250T
with internal
protection
Figure 3.22 SLIC Asymmetrical Protection
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SIDACtor Data Book and Design Guide
Analog Line Cards
Figure 3.23 illustrates the use of the P2600SA and P0721CA2 for overvoltage protection
and the F0500T for overcurrent protection in addition to 20 ꢂ of series resistance on both
Tip and Ring. The series resistance is required to limit the transient surge currents to within
the surge current rating of the “A” series SIDACtor devices and the F0500T TeleLink fuse.
F0500T
20 Ω
P0721CA2
Tip
P2600SA
R
E
L
A
S
L
I
C
Y
P2600SA
Ring
20 Ω
F0500T
Figure 3.23 SLIC Protection with Fixed Voltage SIDACtor Devices
The illustration of SLIC protection in Figure 3.24 shows Teccor’s Battrax device protecting
Legerity’s (formerly AMD’s) Am79R79 from overvoltages and uses a F1250T to protect
against sustained power cross conditions. The Battrax product was designed specifically to
protect SLICs that cannot withstand potential differences greater than VREF ± 10 V.
-V
REF
0.1 µF
F1250T
Tip
1N4935/
MUR120
B1XX0CC
Legerity
Am79R79
B1XX0CC
1N4935/
MUR120
Ring
F1250T
0.1µF
-V
REF
Figure 3.24 SLIC Protection with Programmable Voltage SIDACtor Devices
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Analog Line Cards
Figure 3.25 shows protection of a SLIC using 20 ꢂ series resistors on both Tip and Ring in
addition to Teccor’s Battrax (B1100CC) and a diode bridge (General Semiconductor part
number EDF1BS). However, the overshoot caused by the diode bridge must be considered.
The series resistance (a minimum of 20 ꢂ on Tip and 20 ꢂ on Ring) limits the simultaneous
surge currents of 100 A from Tip to Ground and 100 A from Ring to Ground (200 A total) to
within the surge current rating of the SA-rated SIDACtor device and Battrax. The diode
bridge shunts all positive voltages to Ground, and the B1100CC shunts all negative
voltages greater than |-VREF -1.2 V| to Ground.
-V
REF
0.1 µF
F0500T
20 Ω
Tip
P3100SA
R
E
L
S
L
I
EDF1BS
A
Y
B1100CC
C
P3100SA
Ring
20 Ω
F0500T
Figure 3.25 SLIC Protection with a Single Battrax Device
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SIDACtor Data Book and Design Guide
Analog Line Cards
In Figure 3.26 an application that requires 50 ꢂ Line Feed Resistors (LFR) uses one
B1160CC and two EDF1BS diode bridges in place of multiple SLIC protectors. The
overshoot caused by the diode bridge must be considered; however, with this approach it is
imperative that the sum of the loop currents does not exceed the Battrax’s holding current.
In the application shown in Figure 3.26, each loop current would have to be limited to
80 mA. For applications requiring the protection of four twisted pair with one Battrax, use
the B1200CC and limit each individual loop current to 50 mA.
50 Ω LFR
Tip
P3100SA
R
S
L
I
C
E
L
A
EDF1BS
Y
P3100SA
Ring
B1160CC
50 Ω LFR
50 Ω LFR
-V
REF
0.1 µF
Tip
P3100SA
P3100SA
R
E
L
A
Y
S
L
I
EDF1BS
C
Ring
50 Ω LFR
Figure 3.26 SLIC Protection with a Single Battrax Device
Figure 3.27 and Figure 3.28 show circuits that use negative Battrax devices containing an
internal diode for positive surge protection. This obviates using the discrete diodes shown in
Figure 3.24.
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Analog Line Cards
-V
REF
T
F1250T
B1xx1U_
Am79R79
0.1 µF
F1250T
R
Figure 3.27 SLIC Protection with a Dual Battrax Device
-V
REF
T
1
4
F1250T
5
2
Am79R79
0.1 µF
6
R
1
F1250T
F1250T
B1XX1U_
T
2
1
Am79R79
3
R
2
F1250T
Figure 3.28 SLIC Protection with a Single Battrax Quad Negative Device
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Analog Line Cards
Figure 3.29 shows two negative Battrax discrete parts and two positive Battrax discrete
parts. This arrangement is required for SLIC applications using both the positive and
negative ringing signals. Figure 3.30 shows a similar application but with the two negative
Battrax discrete parts and two positive Battrax discrete parts integrated into a single surface
mount package.
+V
-V
REF
REF
0.1 µF
0.1 µF
F1250T
Tip
B2050C_
B2050C_
B1xx0C_
B1xx0C_
SLIC
Ring
F1250T
-V
+V
REF
REF
Figure 3.29 SLIC Protection with discrete positive and negative Battrax Devices
+V
-V
REF
REF
0.1 µF
0.1 µF
F1250T
Tip
SLIC
B3104UC
Ring
F1250T
-V
+V
REF
REF
Figure 3.30 SLIC Protection with a Battrax Dual Positive/Negative device
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SIDACtor Data Book and Design Guide
PBX Systems
PBX Systems
Branch Exchange Switches
PBXs, KSUs, and PABXs contain line cards that support various transmission protocols
such as ISDN, T1/E1, HDSL, and ADSL (Figure 3.31). PBXs also have features such as a
POTS (plain old telephone service) pull-through which allows stations to have outside line
access in the event of power failure. All incoming lines to the PBX are subject to
environmental hazards such as lightning and power cross.
To Network
Station Primary
Protection
Logic
POTS
T1/E1
ADSL
HDSL
ISDN
PBX
Stations
Figure 3.31 PBX Overview
Protection Requirements
Branch exchange switches should be protected against overvoltages that can exceed
800 V and surge currents up to 100 A.
The following regulatory requirements apply:
•
•
TIA-968 (formerly known as FCC Part 68)
UL 60950
Branch Exchange Reference Circuit
See the following sections of this data book for interface circuits used to protect of PBX line
cards:
•
•
•
•
•
•
For POTS protection, see "Customer Premises Equipment (CPE)" on page 3-3.
For ADSL protection, see "ADSL Circuit Protection" on page 3-7.
For HDSL protection, see "HDSL Circuit Protection" on page 3-8.
For ISDN protection, see "ISDN Circuit Protection" on page 3-10.
For T1/E1 protection, see "T1/E1 Circuit Protection" on page 3-14.
For Station Protection, see "Analog Line Cards" on page 3-17.
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SIDACtor Data Book and Design Guide
CATV Equipment
CATV Equipment
As cable providers enter the local exchange market, protection of CATV (Community
Antenna TV) equipment becomes even more critical in order to ensure reliable operation of
equipment and uninterrupted service.
Protection Requirements
CATV line equipment should be able to withstand overvoltages that exceed 6000 V and
surge currents up to 5000 A. CATV station protectors should be able to withstand
overvoltages that exceed 5000 V and surge currents up to 1000 A. The SIDACtor devices
illustrated in Figure 3.32 through Figure 3.35 meet these requirements.
The following regulatory requirements may apply:
•
•
•
•
UL 497C
SCTE IPS-SP-204
SCTE Practices
NEC Article 830
Power Inserter and Line Amplifier Reference Circuit
Figure 3.32 and Figure 3.33 show how the P1900ME SIDACtor device is used to protect
line amplifiers and power supplies versus using two SCRs and one SIDACtor device
(Figure 3.34). The P1900ME is used because the peak off-state voltage (VDRM) is well
above the peak voltage of the CATV power supply (90 VRMS ꢁ2), and the peak pulse current
rating (IPP) is 3000 A.
CATV
Amplifiers
90 VAC
Power
Supply
P1900ME
Figure 3.32 CATV Amplifier Diagram
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CATV Equipment
90 VAC RF
To Line
Amplifiers
P1900ME
Power
Port
Figure 3.33 CATV Amplifier Protection (incorporated into a power inserter module)
90 VAC RF
To Line
Amplifiers
A
K
G
P1800EC
G
A
K
Figure 3.34 CATV Amplifier Protection
Station Protection Reference Circuit
Figure 3.35 shows a P1400AD SIDACtor device used in a CATV station protection
application. Note that a compensation inductor may be required to meet insertion and
reflection loss requirements for CATV networks. If so, the inductor should be designed to
saturate quickly and withstand surges up to 200 V and 1000 A. An inductor with a core
permeability of approximately 900 Wb/A·m and wound with 24-gauge wire to an inductance
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SIDACtor Data Book and Design Guide
CATV Equipment
of 20 µH to 30 µH is an example of a suitable starting point, but the actual value depends on
the design and must be verified through laboratory testing.
To Protected
UL Approved
Compensating
Inductor
Equipment
Coaxial Fuse Line
P1400AD
Figure 3.35 CATV Station Protection
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SIDACtor Data Book and Design Guide
Primary Protection
Primary Protection
Primary telecommunications protectors must be deployed at points where exposed twisted
pairs enter an office building or residence. This requirement is mandated in North America
by the National Electric Code (NEC) to protect end users from the hazards associated with
lightning and power cross conditions.
Primary protection is provided by the local exchange carrier and can be segregated into
three distinct categories:
•
•
Station protection — typically associated with a single twisted pair
Building entrance protection — typically associated with multiple (25 or more) twisted
pair
•
Central office protection — typically associated with numerous twisted pair feeding into a
switch
Station protectors provide primary protection for a single-dwelling residence or office. The
station protector is located at the Network Interface Unit (NIU), which acts as the point of
demarcation, separating the operating company’s lines from the customer’s.
Building entrance protection is accomplished by installing a multi-line distribution panel with
integrated overvoltage protection. These panels are normally located where multiple twisted
pairs enter a building.
A five-pin protection module plugged into a Main Distribution Frame (MDF) provides Central
and Remote Office protection. Like station and building entrance protection, the MDF is
located where exposed cables enter the switching office.
Teccor also offers a full line of five-pin protectors. For further details, contact factory at
protectionsystems@teccor.com or +1 972-580-7777.
Protection Requirements
Station protectors must be able to withstand 300 A 10x1000 surge events. The building
entrance protectors and CO protectors must be able to withstand 100 A 10x1000 surge
events. Figure 3.36 shows building entrance protector and CO protector asymmetrical
solutions. Figure 3.37 shows building entrance protector and CO protector balanced
solutions.
The following regulatory requirements apply:
•
•
•
UL 497
GR 974-CORE
ITU K.28
Primary Protection Reference Circuit
Figure 3.36 and Figure 3.37 show different configurations used in primary protection. Note
that the peak off-state voltage (VDRM) of any device intended for use in primary protection
applications should be greater than the potential of a Type B ringer superimposed on a
POTS (plain old telephone service) battery.
150 VRMS ꢁ2 + 56.6 VPK = 268.8 VPK
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Primary Protection
Thermal
Overload
P6002AC
or
P6002AD
Voltage-only
Protection
P6002AC
or
P6002AD
Voltage and
Sneak Current
Protection
4 W Heat Coil
Figure 3.36 Primary Protection
Thermal
Overload
Voltage-only
Protection
P3203AC
Voltage and
Sneak Current
Protection
P3203AC
4 W Heat Coil
Figure 3.37 Balanced Primary Protection
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Secondary Protection
Secondary Protection
Secondary protectors (stand alone units or integrated into strip protectors and UPSs) are
adjunct devices used to enhance the protection level of customer premise equipment
(CPE). Due to the inadequate level of protection designed into CPE, secondary protectors
often are required to prevent premature failure of equipment exposed to environmental
hazards (Figure 3.38).
Customer
Premise Equipment
Primary
Protector
Line
Impedance
Phone
Tip
P
S
Ring
Fax/Modem
Network
Interface
Secondary
Protector
Figure 3.38 CPE Secondary Protection
Protection Requirements
Secondary protectors should be able to withstand overvoltages that can exceed 800 V and
surge currents up to 100 A. Figure 3.39 illustrates a SIDACtor device selected because the
associated peak pulse current (IPP) is sufficient to withstand the lightning immunity tests of
TIA-968 (formerly known as FCC Part 68) without the additional use of series line
impedance. Likewise, Figure 3.39 illustrates a fuse selected because the amps2time (I2t)
rating is sufficient to withstand the lightning immunity tests of TIA-968, but low enough to
pass UL power cross conditions.
F1250T
Tip
P3203AB
To CPE
or
Equipment
P3203AC
Ring
F1250T
Figure 3.39 CPE Protection
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Secondary Protection
Secondary Protection Reference Circuit
Figure 3.38 also shows an example of an interface design for a secondary protector. The
P3203AB SIDACtor device is used because the peak off-state voltage (VDRM) is greater
than the potential of a Type B ringer signal superimposed on the POTS (plain old telephone
service) battery.
150 VRMSꢀꢁ2 + 56.6 VPK = 268.8 VPK
Coordination between the station protector and the secondary protector occurs due to the
line impedance between the two devices. The line impedance helps ensure that the primary
protector will begin to conduct while the secondary protector limits any of the let-through
voltage to within the VS rating of the SIDACtor device.
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Triac Protection
Triac Protection
Thyristors
Damage can occur to a thyristor if the thyristor’s repetitive peak off-state voltage is
exceeded. A thyristor’s repetitive peak off-state voltage may be exceeded due to dirty AC
power mains, inductive spikes, motor latch up, and so on.
Thyristor Reference Circuit
Figure 3.40 and Figure 3.41 show two different methods of protecting a triac. In Figure 3.40,
a SIDACtor device is connected from MT2 to the gate of the triac. When the voltage applied
to the triac exceeds the SIDACtor device’s VDRM, the SIDACtor device turns on, producing a
gate current which turns the triac on.
Hot
Load
47 Ω
MT2
MT1
Triac
SIDACtor
To
Gating
Circuitry
Neutral
Figure 3.40 TRIAC Protection
The circuit in Figure 3.41 places a SIDACtor device across MT2 and MT1 of the triac. In this
instance the SIDACtor device protects the triac by turning on and shunting the transient
before it exceeds the VDRM rating of the triac.
Hot
Load
MT2
MT1
Triac
SIDACtor
To
Gating
Circuitry
Neutral
Figure 3.41 TRIAC Protection
With both methods, consider the following designs when using a SIDACtor device to protect
a thyristor:
•
•
•
VDRM of the SIDACtor device < VDRM of Triac
SIDACtor device VDRM > 120% VPK(power supply)
SIDACtor device must be placed behind the load
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SIDACtor Data Book and Design Guide
Data Line Protectors
Data Line Protectors
In many office and industrial locations, data lines (such as RS-232 and ethernet) and AC
power lines run in close proximity to each other, which often results in voltage spikes being
induced onto the data line, causing damage to sensitive equipment.
Protection Requirements
Data lines should be protected against overvoltages that can exceed 1500 V and surge
currents up to 50 A.
Data Line Reference Circuit
Figure 3.42 shows how a SIDACtor device is used to protect low voltage data line circuits.
TXD
P0080SA
or
P0300SA
RXD
P0080SA
or
RS-232
I.C.
P0300SA
CTS
P0080SA
or
P0300SA
Figure 3.42 Data Line Protection
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SIDACtor Data Book and Design Guide
LAN / WAN Protectors
LAN / WAN Protectors
10Base-T Protection
Capacitance across the pair of wires = (D1 || D2) + P0640EA/SA
The MUR 1100E diodes capacitance is approximately (10 pF || 10 pF) 20 pF. Then, adding
the capacitive effect of the SIDACtor (typically 50 pF), the total capacitance across the pair
of wires is approximately 14 pF. This provides a GR 1089 intra-building compliant design.
(Figure 3.43)
Note: MURS160T3 is an SMT equivalent of the MUR 1100E.
F0500T
D1
D2
Figure 3.43 10Base-T Metallic-only Protection
Figure 3.44 shows an application requiring longitudinal protection.
F0500T
D1
D2
F0500T
D3
D4
Figure 3.44 10Base-T Metallic and Longitudinal Protection
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LAN / WAN Protectors
100Base-T Protection
Capacitance across the pair of wires = (D1 || D2) + P0640EA/SA + (D3 || D4)
The MUR 1100E pair of diodes capacitance is approximately (10 pF || 10 pF) 20 pF. Then,
adding the capacitive effect of the P0640EA/SA (typically 50pF), the total capacitance
across the pair of wires is approximately 8 pF. This will provide a GR 1089 intra-building
compliant design. (Figure 3.45)
Note: MURS160T3 is a SMT equivalent of the MUR 1100E.
D1
D2
P0640EA/SA
D3
D4
Figure 3.45 100 Base-T Protection
The P0642SA is a very low capacitance device that requires no compensating diodes.
(Figure 3.46)
P0642SA
Figure 3.46 100 Base-T Protection Without External Compensation
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4 Regulatory
Requirements
Due to the enormous cost of interrupted service and failed network equipment, telephony
service providers have adopted various specifications to help regulate the reliability and
performance of the telecommunications products that they purchase. In Europe and much
of the Far East, the most common standards are ITU-T K.20 and K.21. In North America,
most operating companies base their requirements on GR 1089, TIA-968 (formerly known
as FCC Part 68), and UL 60950.
Note: This section is a paraphrase of existing documents and does not cover the listed
regulatory requirements in their entirety. This information is intended to be used only
as a reference. For exact specifications, obtain the referenced document from the
appropriate source.
GR 1089–Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
ITU-T K.20 and K.21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
TIA/EIA-IS-968 (formerly known as FCC Part 68) . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
UL 60950 3rd Edition (formerly UL 1950, 3rd edition) . . . . . . . . . . . . . . . . . . . . . . 4-16
UL 497 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24
UL 497A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27
UL 497B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-30
UL 497C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32
Regulatory Compliant Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34
Surge Waveforms for Various Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-37
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GR 1089–Core
GR 1089–Core
In the United States, the telecommunication network is primarily operated by the Regional
Bell Operating Companies (RBOC) who follow the standards set by GR 1089 or a derivative
thereof. GR 1089–Core (often referred to as GR 1089), “Electromagnetic Compatibility and
Electrical Safety Generic Criteria for Network Telecommunications Equipment,” covers the
requirements for telecommunications equipment connected to the outside world through
twisted pair. It also addresses the criteria for protection from lightning and AC power cross
disturbances.
Because twisted pair are metallic conductors exposed to lightning and AC power faults,
GR 1089 documents the requirements to be met by manufacturers of public switched
telephone network (PSTN) equipment to ensure safe and reliable operation.
The criteria for these standards are based on transient conditions at exposed sites, such as
remote facilities, central offices, and customers’ premises where operating companies
provide some type of primary voltage protection to limit transient voltages to 1000 V peak
for surge conditions and 600 V rms for power cross conditions.
All network equipment shall be listed by a Nationally Recognized Testing Laboratory
(NRTL) if the equipment is directly powered by Commercial AC. Network equipment located
on customer premises shall be listed by NRTL.
In conjunction with primary voltage protectors, operating companies also may incorporate
fuse links if there is the possibility of exposing the twisted pair to outside power lines. These
fuse links are equivalent to 24- or 26-gauge copper wire and are coordinated with the
current-carrying capacity of the voltage protector.
The last element of protection that may be provided by the operating company are current
limiters which, if provided, are found on the line side of the network equipment after the
primary voltage protection device. These current limiters typically come in the form of heat
coils and have a continuous rating of 350 mA.
Requirements
Equipment required to meet GR 1089 must be designed to pass:
•
•
•
Both First and Second Level Lightning Surge and AC Power Fault Tests
Current Limiter Test
Short Circuit Test
A minimum of three units are tested for each of the operating states in which the Equipment
Under Test (EUT) may be expected to function — idle, transmit, receive, on-hook, off-hook,
talking, dialing, ringing, and testing. Table 4.1 and Table 4.2 show test connections, and
Figure 4.1 shows the connection appearances.
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GR 1089–Core
Table 4.1 Test Conditions
Test
Two-wire Interface
Four-wire Interface
A
1. Tip to Generator, Ring to Ground
2. Ring to Generator, Tip to Ground
3. Tip and Ring to Generator simultaneously
1. Each lead (T, R, T1, R1) to the Generator with the other three
leads grounded
2. Tip and Ring to Generator, simultaneously; T1 and R1 to
Ground
3. T1 and R1 to Generator, simultaneously; Tip and Ring to
Ground
B
Tip and Ring to Generator simultaneously
T, R, T1, R1 to Generator simultaneously
Notes:
•
•
When performing longitudinal tests, the test generator will have a dual output.
Refer to Table 4.2 for switch positions for each test condition.
Table 4.2 Connections to Test Generator
Condition
Condition A-1 of Table 4.1
Condition A-2 of Table 4.1
Condition A-3 of Table 4.1
S1
Closed
Open
S2
S3
Open
Closed
Closed
S4
Open
Closed
Open
Closed
Open
Open
Closed
Note: Other outside plant leads associated with the unit should be grounded during the test and the test repeated with these leads
terminated as in service. Leads that do not connect to outside plant should be terminated as appropriate for the operating
mode(s) of the unit.
S1
S3
T
Tip
E
R
M
Limiting
Resistance
(If Specified)
S2
S4
Switch Unit
Under Test
Ring
T
E
R
M
Voltage
Source
Associated
Outside
Plant
Leads
Test Generator
Figure 4.1 Connection Appearances
Passing Criteria
Passing criteria for the First Level Lightning Surge Test and the First Level AC Power Fault
Test is that the EUT will not be damaged and that it will operate as intended after the stress
is removed. Passing criteria for the Second Level Lightning Surge Test and Second Level
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AC Power Fault Test is that the EUT may be damaged, but it may not become a fire,
fragmentation, or electrical safety hazard. Passing criteria for the Current Limiter Test is that
the EUT may be damaged but it may not exceed the acceptable time/current criteria (that is,
cannot cause the wiring simulator as shown in Figure 4.2 to open) nor become a fire,
fragmentation, or electrical safety hazard.
The indicator used in measuring fire, fragmentation, and electrical safety hazards is a
bleached, untreated cotton cheesecloth wrapped around the EUT. Compliance with testing
is determined by the absence of ignition, charring, and the ejection of molten material or
fragments.
First Level Lightning Surge Test
To pass the First Level Lightning Surge Test, the EUT must be undamaged and continue to
operate properly after the stress is applied. This is referred to as passing “operationally.”
Table 4.3 presents the conditions for the First Level inter-building criteria. Applicants have
the option to submit their equipment to meet surges 1, 2, 4, and 5 or surges 3, 4, and 5.
Table 4.4 presents the conditions for the intra-building criteria.
Table 4.3 First Level Lightning Surge Test
Surge Current
per Conductor
(A)
Test
Test
Surge Voltage
(VPK
Waveform
(µs)
Repetitions
Connections
(Notes 1 & 2)
)
Each Polarity
(Table 4.1, Figure 4.1)
1
±600
±1000
±1000
±2500
±1000
10x1000
10x360
10x1000
2x10
100
100
100
500
25
25
25
25
10
5
A
A
A
B
B
2 (Note 3)
3 (Note 3)
4 (Note 4)
5 (Note 5)
10x360
Notes:
1. Primary protectors are removed for all tests.
2. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
3. Test 1 and 2 can be replaced with Test 3 or vice versa.
4. Alternatively, a surge generator of 1.2x50 µs open-circuit voltage waveform (8x20 µs short-circuit current waveform) per
IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 3 ꢁ resistor placed externally to the surge
generator.
5. This test is to be performed on up to 12 Tip and Ring pairs simultaneously.
Table 4.4 Intra-Building Lightning Surge Test
Surge Current
Surge Voltage
Wave-form
per Conductor
Repetitions Each
Polarity
Test Connections
Test
(VPK
)
(µs)
(A)
(Table 4.1, Figure 4.1)
1
2
±800
±1500
2x10
2x10
100
100
1
1
A1, A2
B
Notes:
•
For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
•
Alternatively, a surge generator of 1.2x50 µs open-circuit voltage waveform (8x20 µs short-circuit current waveform) per
IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 6 ꢁ resistor for Test 1 and a 12 ꢁ resistor for
Test 2, placed externally to the surge generator.
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GR 1089–Core
Second Level Lightning Surge Test
The Second Level Lightning Surge Test, presented in Table 4.5, does not require the EUT
to pass operationally, but GR 1089 does require that the EUT not become a fire,
fragmentation, or electrical safety hazard. This is referred to as passing “non-operationally.”
Table 4.5 Second Level Lightning Surge Test
Surge
Voltage
(VPK
Waveform
(µs)
Surge Current
(A)
Repetitions Each
Polarity
Test Connections
Test
)
(Table 4.1, Figure 4.1)
1
±5000
2x10
500
1
B
Notes:
•
•
Primary protectors are removed.
For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
•
Alternatively, a surge generator of 1.2x50 µs open-circuit voltage waveform (8x20 µs short-circuit current waveform) per
IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 8 ꢁ resistor placed externally to the surge
generator.
AC Power Fault Tests
Power companies and telephone operating companies often share telephone poles and
trenches; therefore, network equipment is often subjected to the voltages seen on power
lines. If direct contact between the telephone line and the primary power line occurs, the
operating company’s network equipment may see as much as 600 V rms for five seconds,
by which time the power company’s power system should clear itself. If direct contact
occurs with the secondary power line, voltages will be limited to 277 V rms; however, these
voltages may be seen indefinitely because the resultant current may be within the operating
range of the power system, and the power system will not reset itself.
Another risk involved with power lines is indirect contact. Because of the large magnetic
fields created by the currents in the power lines, large voltages may be induced upon phone
lines via electro-magnetic coupling. In this instance voltages should be limited to
1000 V peak and 600 V rms using primary protectors, while the current will be limited by the
current-carrying capacity of the 24-gauge wire.
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GR 1089–Core
First Level AC Power Fault Criteria
Table 4.6 presents test conditions for the First Level AC Power Fault Test. The EUT is
required to pass operationally.
Table 4.6 First Level AC Power Fault Test
Short Circuit
Current per
Conductor
(A)
0.33
0.17
1A at 600 V
Applied Voltage,
60 Hz
Primary
Test Connections
Test
1 (Note 1)
2 (Note 1)
3 (Note 1)
(VRMS
)
Duration
15 min
15 min
Protectors
(Table 4.1, Figure 4.1)
50
100
200, 400, 600
Removed
Removed
Removed
A
A
A
60 applications,
1 s each
4 (Note 4)
5 (Note 2)
1000
1
60 applications,
1 s each
In place
B
N/A
N/A
60 applications,
Removed
N/A
5 s each
6 (Note 3)
7 (Note 3)
8 (Note 3)
9 (Note 3)
600
600
600
0.5
2.2
3
30 s
2 s
1 s
Removed
Removed
Removed
In place
A
A
A
B
1000
5
0.5 s
Notes:
1. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
2. Test 5 simulates a high impedance induction fault. For specific information, please contact Teccor Electronics.
3. Test conditions 6 through 9 are objective, not mandatory, requirements.
4. Sufficient time may be allowed between applications to preclude thermal accumulation.
Second Level AC Power Fault Criteria
Test conditions for the Second Level AC Power Fault Test are dependent on whether the
EUT is intended for customer premises equipment or non-customer premises equipment. In
both instances, although the EUT is not required to pass operationally, it may not become a
fire, fragmentation, or electrical safety hazard.
Second Level AC Power Fault Criteria for Non-customer Premises
Equipment
Table 4.7 presents test conditions for non-customer premises equipment. (Note that test
conditions 1, 3, and 4 may be omitted if the EUT has previously met UL 60950.) See
Figure 4.1 for test connection appearances.
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GR 1089–Core
Table 4.7 Second Level AC Power Fault Test for Non-Customer Premises Equipment
Short Circuit Current
per Conductor
Test
Applied Voltage, 60 Hz
(VRMS
(A)
Test Connections
(Notes 1, 2)
)
(Note 5)
25
60
Duration
15 min
5 s
(Table 4.1, Figure 4.1)
1
2
120, 277
600
A
A
3
600
7
5 s
A
4 (Note 3)
5 (Note 4)
100-600
N/A
2.2A at 600 V
N/A
15 min
15 min
A
N/A
Notes:
1. Primary protectors are removed for all tests.
2. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s)
and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors.
3. This test is to be performed between the ranges of 100 V to 600 V and is intended to produce the greatest heating affect.
4. Test 5 simulates a high impedance induction fault. Specific information regarding this test is available upon request.
5. These tests are repeated using a short-circuit value just below the operating threshold of the current limiting device, or, if the EUT
uses a fuse as current limiting protection, the fuse may be bypassed and the short circuit current available adjusted to 135% of the
fuse rating.
6. Intra-building, second level lower fault test uses test condition 1 only. The applied voltage is at 120 V rms only.
Second Level AC Power Fault for Customer Premises Equipment
For customer premises equipment, the EUT is tested to the conditions presented in
Table 4.8 and connected to a circuit equivalent to that shown in Figure 4.2. During this test,
the wiring simulator cannot open. For equipment that uses premises type of wiring, the
wiring simulator is a 1.6 A Type MDQ fuse from Bussman. For equipment that is connected
by cable, the wiring simulator is a piece of 26-gauge copper wire.
Table 4.8 Second Level AC Power Fault for Customer Premises Equipment
Applied Voltage, 60 Hz
(VRMS
)
Source Impedance
Test Connections
Test
1
2
(Notes 2, 3)
300
ꢁ
(Table 4.1, Figure 4.2)
20
20
(Note 1)
A
600
Notes:
1. Applied between exposed surfaces and Ground
2. The 60 Hz signal is applied with an initial amplitude of 30 V rms and increased by 20% every 15 minutes until one of the following
occurs:
— Voltage reaches the maximum specified
— Current reaches 20 A or the wiring simulator opens
— EUT fails open circuit
3. If the EUT fails open circuit, the test continues for an additional 15 minutes to ensure that another component of the EUT does not
create a fire, fragmentation, or electrical safety hazard.
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GR 1089–Core
Wiring
Wiring
Simulator
Simulator
20
20
20
Tip
Tip
Equipment
Equipment
Ring
Ring
Variable
60 Hz ac
Voltage
Wiring
Simulator
Chassis
Ground
Variable
60 Hz ac
Voltage
Chassis
Ground
Source 0-600 V
Source 0-600 V
AC Equipment Ground
(Green Wire Ground)
(A) Metallic
AC Equipment Ground
(Green Wire Ground)
(B) Longitudinal
Figure 4.2 Second Level AC Power Fault and Current Limiter Connection
Current Limiting Protector Test
The purpose of the Current Limiting Protector Test, presented in Table 4.9, is to determine if
the EUT allows an excessive amount of current flow under power fault conditions. During
this test, the EUT is connected to a circuit equivalent to that shown in Figure 4.2 with a
1.6 A Type MDQ fuse from Bussman used as the wiring simulator. If the EUT draws enough
current to open the fuse, then the acceptable time/current criteria have not been met, and
external current limiting protectors must be specified for use with that equipment in the
manufacturer’s documentation.
Table 4.9 Current Limiting Protector Test
Applied Voltage, 60 Hz
Source Impedance
Test Connections
Test
1
(VRMS
)
ꢁ
Duration
15 min
(Table 4.1, Figure 4.2
600
2
A
Short-circuit Test
In addition to the AC Power Fault and Current Limiter Tests, equipment must also pass a
Short-circuit Test to comply with GR 1089. During this test, a short-circuit condition is
applied to the following Tip and Ring appearances for 30 minutes while the EUT is powered
and under operating conditions:
•
•
•
Tip-to-Ring, Tip-to-Ground with Ring open circuit
Ring-to-Ground with Tip open circuit
Tip- and Ring-to-Ground simultaneously for 30 minutes
At no time will the short circuit exceed 1 ꢂ. For equipment with more than one twisted pair,
the short circuit is applied to all twisted pair simultaneously. To comply with the short circuit
test, the EUT must function normally after the short-circuit condition is removed, and a fire
hazard may not be present. The equipment shall not require manual intervention to restore
service.
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ITU-T K.20 and K.21
ITU-T K.20 and K.21
Although the International Telecommunication Union (ITU) does not have the authority to
legislate that organizations follow their recommendations, their standards are recognized
throughout Europe and the Far East.
ITU-T, the Telecommunication Standardization Sector of the ITU, developed fundamental
testing methods that cover various environmental conditions to help predict the survivability
of network and customer-based switching equipment. The testing methods cover the
following conditions:
•
Surges due to lightning strikes on or near twisted pair and plant equipment (excluding a
direct strike)
Short-term induction of AC voltage from adjacent power lines or railway systems
Direct contact between telecommunication lines and power lines (often referred to as
AC power cross)
•
•
Two ITU-T standards apply for most telecommunications equipment connected to the
network:
•
•
ITU-T K.20
ITU-T K.21
ITU-T K.20 is primarily for switching equipment powered by the central office; however, for
complex subscriber equipment, test administrators may choose either K.20 or K.21,
depending on which is deemed most appropriate.
Note: Both standards are intended to address equipment reliability versus equipment
safety. For specific concerns regarding equipment safety, research and follow
national standards for each country in which the equipment is intended for use.
K.21 covers telecommunication equipment installed in customer premises. Equipment
submitted under these requirements must meet one of two levels: basic or enhanced.
Guidelines for determining under which level the equipment under test (EUT) falls can be
found in ITU-T K.11, but note that the final authority rests with the test administrator.
ITU-T K.44 describes the test conditions used in K.20 and K.21.
ITU-T defines the following acceptance criteria:
•
Criterion A states that equipment shall withstand the test without damage and shall
operate properly after the test. It is not required to operate correctly during the test.
Criterion B states that a fire hazard shall not occur as a result of the tests. Any damage
shall be confined to a small part of the equipment.
•
Table 4.10 shows the lightning surge test conditions for ITU K.20. Figure 4.3 shows the
connection schematic for the lightning surge tests. Table 4.11 shows the power cross test
conditions for ITU K.20. Figure 4.4 shows the connection schematic for the power cross
tests. Table 4.12 and Table 4.13 show the same test conditions respectively for ITU K.21.
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ITU-T K.20 and K.21
Table 4.10 K.20 Lightning Test Conditions for Telecom Equipment in Central Office/Remote Terminal
Voltage (10x700 µs)
Single Port
Metallic and
Longitudinal
Multiple Ports
Longitudinal Only
Basic/Enhanced
Current (5x310 µs)
Basic/Enhanced
(A)
Acceptance
Criteria
Basic/Enhanced
Repetitions *
Primary Protection
None **
Installed if used
None
1 kV/1.5 kV
4 kV/4 kV
25/37.5
100/100
37.5/37.5
100/150
±5
±5
±5
±5
A
A
A
A
1.5 kV/1.5 kV
4 kV/6 kV
Installed if used
* One-minute rest between repetitions
** This test is not conducted if primary protection is used.
Equipment Under Test
A
25 Ω
Decoupling
Elements
Surge
Generator
E
B
a) Transversal test
Equipment Under Test
A
25 Ω
Decoupling
Elements
Surge
Generator
E
B
R3 = 25 Ω
b) Longitudinal test
Figure 4.3 Connection Appearances
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ITU-T K.20 and K.21
Equipment
Under Test
R
R
A
U
a.c.
E
B
Timing Circuit
Generator
Figure 4.4 Connection Appearances (R = 10 ꢀ, 20 ꢀ, 40 ꢀ, 80 ꢀ, 160 ꢀ, 300 ꢀ, 600 ꢀ, and 1000 ꢀ
for the various power cross tests)
Table 4.11 K.20 Power Cross Test Conditions for Telecom Type Ports, Metallic, and Longitudinal
Current (5x310 µs)
Voltage
Basic/Enhanced
Duration
Primary
Acceptance Criteria
Basic/Enhanced
(A)
Basic/Enhanced
Repetitions *
Protection
Basic/Enhanced
600 V/600 V
1/1
0.2 s
1 s/2 s
15 min
5
None
None
None
A/A
A/A
50 Hz or 60 Hz
600/1.5 kV
1/7.5
5
1
50 Hz or 60 Hz
230/230 V
23/23
11.5/11.5
5.75/5.75
2.875/2.875
1.44/1.44
0.77/0.77
0.38/0.38
0.23/0.23
B/B
B/B
B/B
B/B
B/A
B/A
B/A
B/B
50 Hz or 60 Hz
* One-minute rest between repetitions
Table 4.12 K.21 Lightning Test Conditions for Telecom Equipment on Customer Premises
Voltage (10x700 µs)
Single Port
Multiple Ports
Longitudinal
Metallic
Longitudinal Only Current (5x310 µs)
(kV)
(kV)
(kV)
Basic/Enhanced
(A)
Primary
Acceptance
Criteria
Basic/Enhanced Basic/Enhanced Basic/Enhanced
Repetitions *
Protection
None
1.5/6 **
4/6
37.5/150
100/150
37.5/37.5
100/150
±5
±5
±5
±5
A ***
A
A ***
A
Installed if used
None
Installed if used
1.5/1.5
4/6
1.5/1.5
4/6
* One-minute rest between repetitions
** Reduce to 1.5 kV if SPD connects to GRD.
*** Does not apply if primary protectors are used.
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ITU-T K.20 and K.21
Table 4.13 K.21 Power Cross Test Conditions for Telecom Type Ports, Metallic, and Longitudinal
Current
Basic/Enhanced
(A)
Voltage
Duration
Primary
Acceptance Criteria
Basic/Enhanced
Basic/Enhanced
Basic/Enhanced
Repetitions *
Protection
600 V / 600 V
1/1
0.2 s
1 s/2 s
15 min
5
None
A/A
50 Hz or 60 Hz
600 V / 1.5 kV
50 Hz or 60 Hz
1/7.5
5
1
Installed if
used
None
A/A
230 V / 230 V
23/23
11.5/11.5
5.75/5.75
2.875/2.875
1.44/1.44
0.77/0.77
0.38/0.38
0.23/0.23
B/B
B/B
B/B
B/B
B/A
B/A
B/A
B/B
50 Hz or 60 Hz
* One-minute rest between repetitions
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SIDACtor Data Book and Design Guide
TIA-968 (formerly known as FCC Part 68)
TIA-968 (formerly known as FCC Part 68)
TIA-968 applies to all terminal equipment connected to the Public Switched Telephone
Network (PSTN) and holds the “rule of law” by congressional order.
The purpose of TIA-968 is to provide a set of uniform standards to protect the telephone
network from any damage or interference caused by the connection of terminal equipment.
This standard includes environmental simulations such as vibration tests, temperature and
humidity cycling, drop tests and tests for hazardous voltages and currents, as well as tests
for signal power levels, line balance, on-hook impedance, and billing protection. All these
standards must be met before and after the environmental tests are applied.
Overvoltage Test
TIA-968 compliant equipment must undergo an overvoltage test that includes a Type A and
Type B Metallic Voltage Surge and a Type A and Type B Longitudinal Voltage Surge. These
surges are part of the environmental simulation, and although a provision does allow the
EUT to reach an open circuit failure mode during the Type A tests, failures must:
1. Arise from an intentional design that will cause the phone to be either disconnected from
the public network or repaired rapidly
2. Be designed so that it is substantially apparent to the end user that the terminal
equipment is not operable
A common example of an acceptable failure would be an open circuit due to an open
connection on either Tip or Ring.
For Type B surges, equipment protection circuitry is not allowed to fail. The EUT must be
designed to withstand Type B surges and continue to function in all operational states.
Metallic Voltage Surge
The Type A and Type B Metallic Voltage Surges are applied in both the positive and
negative polarity across Tip and Ring during all operational states (on-hook, off-hook,
ringing, and so on). The Type A surge is an 800 V, 100 A peak surge while the Type B
surge is a 1000 V, 25 A peak surge, as presented in Table 4.14.
Table 4.14 TIA-968 Voltage Surge
Peak
Rise &
Peak
Current
(A)
Rise &
Surge
Type
Voltage
Decay Time
Decay Time
Repetitions
(VPK
)
(Voltage Waveform)
(Current Waveform)
Each Polarity
Metallic A
Longitudinal A
Metallic B
±800
±1500
±1000
±1500
10x560 µs
10x160 µs
9x720 µs
9x720 µs
100
200
25
10x560µs
10x160µs
5x320µs
5x320µs
1
1
1
1
Longitudinal B
37.5
Notes:
•
•
•
•
For Type A surges, the EUT may pass either “operationally” or “non-operationally.”
For Type B surges, the EUT must pass “operationally.”
The peak current for the Type A longitudinal surge is the total available current from the surge generator.
The peak current for the Type B longitudinal surge is the current supplied to each conductor.
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TIA-968 (formerly known as FCC Part 68)
Longitudinal Voltage Surge
The Type A and Type B Longitudinal Voltage Surges are applied in both positive and
negative polarity during all operational states. The Type A surge is a 1500 V, 200 A peak
surge applied to the EUT with Tip and Ring tied together with respect to Ground. The
Type B Longitudinal Voltage Surge is a simultaneous surge in which 1500 V and 37.5 A are
applied concurrently to Tip with respect to Ground and Ring with respect to Ground, as
presented in Table 4.14.
Note: Type B surge requirements guarantee only a minimum level of surge protection. For
long term reliability of terminal equipment, consideration should be given to
complying with Type A surges operationally.
On-hook Impedance Limitations
Another important aspect of TIA-968 is on-hook impedance, which is affected by transient
protection. On-hook impedance is analogous to the leakage current between Tip and Ring,
and Tip, Ring, and Ground conductors during various on-hook conditions. "On-hook
Impedance Measurements" (next paragraph) outlines criteria for on-hook impedance and is
listed as part of the Ringer Equivalent Number (REN). The REN is the largest of the unitless
quotients not greater than five; the rating is specified as the actual quotient followed by the
letter of the ringer classification (for example, 2B).
On-hook Impedance Measurements
On-hook impedance measurements are made between Tip and Ring and between Tip and
Ground and Ring and Ground. For all DC voltages up to and including 100 V, the DC
resistance measured must be greater than 5 Mꢂ. For all DC voltages between 100 V and
200 V, the DC resistance must be greater than 30 kꢂ. The REN values are then determined
by dividing 25 Mꢂ by the minimum measured resistance up to 100 V and by dividing
150 kꢂ by the minimum measured resistance between 100 V and 200 V.
On-hook impedance is also measured during the application of a simulated ringing signal.
This consists of a 40 V rms through 150 V rms ringer signal at frequencies ranging from
15.3 Hz to 68 Hz superimposed on a 56.5 V dc for a class “B” ringer. During this test, the
total DC current may not exceed 3 mA. In addition, the minimum DC resistance measured
between Tip and Ring must be greater than 1600 ꢂ, while the DC resistance measured
between the Tip and Ring conductors and Ground must be greater than 100 kꢂ. The REN
values for the simulated ringing test are determined by dividing the maximum DC current
flowing between Tip and Ring by 0.6 mA, and by dividing 8000 ꢂ by the minimum
impedance value measured.
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SIDACtor Data Book and Design Guide
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
UL 60950 3rd Edition
(formerly UL 1950, 3rd edition)
After the divestiture of the AT&T/Bell system, the National Electric Code (NEC)
implemented Article 800-4, which mandates that “all equipment intended for connection to
the public telephone network be listed for that purpose” in order to ensure electrical safety.
A manufacturer can meet this requirement by listing their product with Underwriters
Laboratories under UL 60950 (based on IEC 60950, 3rd edition).
NEC requires all telecommunication wiring that enters a building to pass through a primary
protector, which is designed to limit AC transients in excess of 600 V rms. These transients
are due to the fact that telephone lines run in close proximity to AC power lines. Most
telecommunication equipment uses a secondary overvoltage protector such as the
SIDACtor device. The secondary devices typically limit transients in excess of 350 V rms.
Therefore, a potentially dangerous condition exists because of the voltage threshold
difference of the primary protector and the secondary protector. To minimize this danger,
compliance with UL 60950 overvoltage tests is required.
UL 60950 covers equipment with a rated voltage (primary power voltage) not exceeding
600 V and equipment designed to be installed in accordance with NEC NFPA 70. This
standard does not apply to air-conditioning equipment, fire detection equipment, power
supply systems, or transformers.
The effective date of UL 60950 allows new products submitted through April 1, 2003 to be
evaluated using the requirements of either UL 60950 or UL 1950, 3rd edition. After April 1,
2003, all new product submittals must be evaluated using only UL 60950.
Products certified by UL to requirements of UL 1459 prior to April 1, 2000 may continue to
be certified without further reinvestigation until April 1, 2005, provided no significant
changes or revisions are made to the products. Products certified by UL to requirements of
UL 1950 3rd edition prior to April 1, 2003 may continue to be certified without further
reinvestigation until April 1, 2005.
In order to have the UL Mark applied after April 1, 2005, all products, including those
previously certified by UL, must comply with UL 60950.
UL 69050 is intended to prevent injury or harm due to electrical shock, energy hazards, fire,
heat hazards, mechanical hazards, radiation hazards, and chemical hazards.
It defines three classes of equipment:
•
•
•
Class 1 — protection achieved by basic insulation
Class 2 — protection achieved by double or reinforced insulation
Class 3 — protection relying upon supply from SELV circuits (voltages up to 40 V peak
or 60 V dc)
UL 60950 also defines five categories of insulation:
•
•
•
•
•
Functional
Basic
Supplementary
Reinforced
Double
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UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
UL 60950 Terminology
The following definitions assist in understanding UL 60950:
SELV
Secondary circuit whose voltage values do not exceed a safe value
(voltage less than hazardous levels of 42.4 V peak or 60 V dc)
TNV
Telecommunication Network Voltage (a secondary circuit)
O SELV but with exposure to surges
TNV3
TNV2
TNV1
O SELV but without exposure to surges
? SELV with exposure to surges
Creepage distance is the shortest distance between two conductors, measured along the
surface of the insulation. DC voltages shall be included in determining the working voltage
for creepage distances. (The peak value of any superimposed ripple or short disturbances,
such as cadenced ringing signals, shall be ignored.)
Clearance distance is the shortest distance between two conductive parts or between a
conductive part and the outer surface of the enclosure measured through air. DC voltages
and the peak value of any superimposed ripple shall be included in determining the working
voltage for clearance distances.
Creepage and clearance distances are also subject to the pollution degree of the
equipment:
•
Pollution degree 1 — components and assemblies that are sealed to prevent ingress of
dust and moisture
Pollution degree 2 — generally applicable to equipment covered by UL 60950
Pollution degree 3 — equipment is subject to conductive pollution or to dry non-
conductive pollution, which could become conductive due to expected condensation.
•
•
To ensure safe operating conditions of the equipment, UL 60950 focuses on the insulation
rating of the circuit(s) under consideration. Table 4.15 and Table 4.16 indicate the required
creepage and clearance distances depending on material group, pollution degree, working
voltage, and maximum transient voltage in the secondary circuit. For a typical
telecommunication application with a working voltage of 200 V, pollution degree 2, material
group IIIb, the creepage distance is 2 mm. The clearance distance is 2 mm for reinforced
insulation.
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SIDACtor Data Book and Design Guide
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Table 4.15 Minimum Clearances in Secondary Circuits (millimeters)
Nominal AC
Mains Supply
voltage
Working
Voltage up
to and
Nominal AC Mains Supply voltage
?ꢂ150 V
Nominal AC Mains Supply voltage
> 150 V ? 300 V
> 300 V ? 600 V
(transient rating
for Secondary
Circuit 2500 V)
Circuit Not
Subject to
(transient rating for Secondary
Circuit 800 V)
(transient rating for Secondary
Circuit 1500 V)
Transient
including
Overvoltages
Pollution
Pollution
Degrees 1 and 2
only
Pollution
Pollution
Degree 3
Pollution
Pollution
Degree 3
Degrees
Degrees 1 and 2
Degrees 1 and 2
1, 2, and 3
V * V **
F
0.4
B/S
0.7
0.7
0.9
R
F
1
1
1
B/S
1.3
1.3
1.3
R
F
B/S
1
1
R
2
2
2
F
1
1
1
B/S
1.3
1.3
1.3
R
F
B/S
2
2
2
2
R
4
4
4
4
4
F
B/S
0.4
0.7
0.7
1.1
1.4
R
71
50
1.4
1.4
1.8
2.6
2.6
2.6
0.7
0.7
0.7
2.6
2.6
2.6
1.7
1.7
1.7
1.7
1.7
0.4
0.6
0.6
1.1
1.4
0.8
1.4
1.4
2.2
2.8
140 100 0.6
210 150 0.6
280 200
1
F 1.1; B/S 1.4; R 2.8
F 1.6; B/S 1.94; R 3.8
420 300
2
* Voltage peak or DC
** Voltage rms (sinusoidal)
Note: F = Functional
B/S = Basic/Supplementary
R = Reinforced
Table 4.16 Minimum Creepage Distances (millimeters)
Functional, Basic, and Supplementary Insulation
Pollution Degree 2
Working
Voltage
Pollution Degree 1
Material Group
I, II, IIIa, or IIIb
Pollution Degree 3
Material Group
Material Group
V
RMS or DC
I
II
0.9
1
IIIa or IIIb
I
1.5
1.8
1.9
2
2.5
3.2
4
5
8
10
12.5
II
1.7
2
IIIa or IIIb
1.9
2.2
2.4
2.5
3.2
4
? 50
100
125
150
200
250
300
400
600
800
1000
Use the Clearance from the
0.6
0.7
0.8
0.8
1
1.3
1.6
2
1.2
1.4
1.5
1.6
2
2.5
3.2
4
appropriate table
1.1
1.1
1.4
1.8
2.2
2.8
4.5
5.6
7.1
2.1
2.2
2.8
3.6
4.5
5.6
9.6
11
5
6.3
10
12.5
16
3.2
4
5
6.3
8
10
14
Note: Linear interpolation is permitted between the nearest two points, the calculated spacing being rounded to the next higher 0.1 mm
increment.
The following separations require the specified insulation grade:
•
•
•
•
TNV3 from TNV3 — functional insulation
TNV3 from SELV — basic insulation
TNV3 from TNV1 — basic insulation
TNV3 from TNV2 — basic insulation
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UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
The application must meet the creepage and clearance distances and electric strength of
Section 5.3.2 of UL 60950 for functional insulation. The electric strength test (Table 5B of
UL 60950) lists 1 kV to 1.5 kV as the test voltages for functional and supplementary grade
of insulation and 2 kV to 3 kV for reinforced grade of insulation.
Separation requirements are tested (Section 6.2.2.1 of UL 60950) by applying an impulse
test and an electric strength test:
•
Impulse test allows for the SIDACtor device to turn on (either a 10x700 2.5 kV 62.5 A or
1 kV 37.5 A 10 times with 60-second rest period).
Electric strength test allows the SIDACtor device to be removed (60 Hz at rated voltage
for 60 seconds).
•
These are applied between Ground and all Tip and Rings connected together, and/or
between Ground and all conductors intended to be connected to other equipment
connected together.
Basic insulation is not required if all the following conditions are met:
•
•
SELV, TNV1 circuit is connected to the protective earth.
Installation procedures specify that protective earth terminal shall have a permanent
connection to earth.
•
Any TNV2 or TNV3 circuit with an external port connection intended to receive signals in
excess of SELV (60 V dc or 50 V peak) will have the maximum normal expected
operating voltage applied to it for up to 30 minutes without deterioration. (If no maximum
normal specification exists then 120 V 100 mA 60 Hz is applied.)
(In other words, if a permanent Ground connection is made, then creepage distances may
not be required.)
Any surge suppressor that bridges the insulation (connects to Ground) shall have a
minimum DC turn on voltage of 1.6 times the rated voltage UNLESS one of the following
occurs (Section 6.1.2.2 of UL 60950):
•
•
•
Equipment is permanently connected or uses an industrial plug and socket-outlet.
Equipment is installed by service personnel.
Equipment has provision for a permanently connected protective earth.
ANNEX C of UL 60950 covers transformers.
The secondary side is loaded for maximum heating effect. The maximum working voltage is
applied to the primary. The DC peak value of any superimposed ripple shall be included.
The permitted temperature limits for the windings depend on the classification:
•
•
•
•
•
Class A limit is 150 °C.
Class B limit is 175 °C.
Class E limit is 165 °C.
Class F limit is 190 °C.
Class H limit is 210 °C.
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SIDACtor Data Book and Design Guide
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Overvoltage Flowchart
The overvoltage flowchart in Figure 4.5 shows specific guidelines for determining
overvoltage requirements applicable to specific designs.
Connects to Outside Cable
Yes
No
No Overvoltage Testing
100 A2-S
Limiting1
26 AWG
No
No
Pass 1
Yes
No
Line Cord3
Yes
Yes
No
1.3 A
Limiting2
Pass 6.1.24
Yes
No
No
Pass 5
Yes
Yes
Fire
Enclosure
No
Pass 26
No
Fire Enclosure
and Spacings5
Yes
No
Pass 3, 47
Yes
Yes
Not
Acceptable
Acceptable
Notes:
1. Current Limiting — Equipment that has a method for limiting current to an I2t rating of 100A2s
2. Current Limiting — Equipment that has a method for limiting current to 1.3 A max steady state
3. 26 AWG Line Cord — Minimum 26 American Wire Gauge (AWG) telecommunications line cord either supplied with the
equipment or described in the safety instructions
4. Clause 6.3.3 — The telephone line must be adequately isolated from earth for the operating mode being considered and
at a voltage of 120 V rms. Refer to Section 6.1.2 of UL 60950.
5. Fire Enclosure and Spacing — Fire enclosures minimize fire hazards by containing any emission of flame, molten metal,
flaming drops, or glowing particles that could be emitted by the equipment under fault conditions. Fire enclosure
construction is covered in Section 4.4.6 of UL 60950. Spacing applies to parts in the TNV circuits that might ignite under
overvoltage conditions. Spacing requirements mandate that parts be separated from internal materials of flammability
class V-2 or lower, by at least 25 mm of air or a barrier material of flammability class V-1 or better. Parts also should be
separated from openings in the top or sides of the enclosure by at least 25 mm of air or a material barrier.
6. Test Condition 2 is not required for equipment with 1.3 A limiting.
7. Test Conditions 3 and 4 are not required for connections limited to outside cable less than 1,000 m.
Figure 4.5 Overvoltage Flowchart
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UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Passes 1, 2, 3, 4, and 5 shown in Figure 4.5 refer respectively to Tests L1 and M1, L2 and
M2, L3 and M3, L4 and M4, and L5 shown in Table 4.17.
Equipment may be subject to the overvoltage tests shown in Table 4.17. The tests are
designed to simulate the following:
•
•
•
•
Contact with primary power
Short-term induction as a result of a primary power fault to a multi-earth neutral
Long duration power fault to Ground
Direct contact between the power mains and a telecommunications cable
Table 4.17 UL 60950 Overvoltage Test
Voltage
Current
(A)
40
7
2.2
2.2
25
40
7
Test
L1
(VRMS
)
Time
1.5 s
5 s
30 min
30 min
30 min
1.5 s
5 s
30 min
30 min
Comments
600 V
600 V
600 V
200 V
120 V
600 V
600 V
600 V
600 V
L2
L3
L4
L5
M1
M2
M3
M4
Reduce to 135% fuse rating
Reduce to 135% fuse rating
2.2
2.2
Reduce to 135% fuse rating
Reduce to 135% fuse rating
Notes:
•
•
•
•
•
•
•
•
ISDN S/T interface only L1, L2, L5, M1, and M2.
Reduce to 135% rated value of fuse if Test 3 resulted in open condition.
L4 and M4 are conducted only if SIDACtor VS O 285 VS and then run at voltage level just below VS.
For test conditions M1, L1, M5, and L5 a wiring simulator (MDL 2 A fuse) is used.
Compliance means no ignition or charring of the cheesecloth, and/or the wiring simulator does not open.
If the secondary protector simulator is used (MDQ 1.6), it is allowed to open.
Tests 2, 3, and 4 are required only if the unit is not a fire enclosure.
Figure 4.6 and Figure 4.7 show the M (metallic) and L (longitudinal) test connections.
Current
Limiting
Resistor
Secondary Protector
Simulator or
Wiring Station
Telecommunication
Network Connection
Points
Equipment
Under Test
Timed
Switch
Variable
Voltage
Source
Equipment
Earth
Figure 4.6 Metallic Connection Appearances
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SIDACtor Data Book and Design Guide
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Current
Limiting
Resistors
Secondary Protector
Simulators or
Wiring Stations
Equipment
Under Test
Timed
Switch
Variable
AC Voltage
Source
Equipment
Earth
Figure 4.7 Longitudinal Connection Appearances
Overvoltage Test Procedures
Use the following criteria when applying the overvoltage tests presented in Table 4.17:
1. Test Set-up — Equipment is to be mounted as it is intended to be used. Tests may be
conducted on either the equipment as an assembly, individual subassemblies, or a
partial assembly containing those components which may be exposed to an overvoltage
condition.
2. Indicators — Before testing, two single pieces of cheesecloth are to be wrapped tightly
around the assembly, subassembly, or partial assembly. The cheesecloth acts as an
indicator for conditions that may result in fire.
3. Line Cords — Equipment with a removable telecommunications line cord is to be
connected to the test circuit with a line cord having 0.4 mm (26 AWG) or larger copper
wire conductors and not more than 1 ꢂ total resistance.
4. Functional Circuitry — UL mandates that functional circuitry must be used for each
overvoltage test conducted. This allows repair or replacement of damaged circuitry
before subsequent testing. Alternatively, separate samples may be used for each test.
5. Wiring Simulators — A wiring simulator is used to indicate whether the maximum I2t
imposed upon telecommunications wiring has been exceeded. For Tests 1 and 5, a
wiring simulator is to be used unless the equipment is specified for use with a suitable
secondary protector or a secondary protector simulator. The wiring simulator can consist
of one of the following:
a. 50mm length of 0.2 mm (32 AWG) bare or enameled solid copper wire (for test
condition 1)
b. Bussman Mfg. Co. Type MDL-2A fuse (for test condition 1)
c. 300 mm length of 0.4 mm (26 AWG) solid copper wire which connects to a
representative installation (includes wiring an connectors)
[This option is used when the manufacturer specifies the complete installation from
the network interface to the equipment.]
d. Current probe used with a 300 mm length of 0.5 mm (24 AWG) copper wire (for test
condition 1)
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UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Note: Test conditions 2, 3, and 4 do not require the use of a wiring simulator or a secondary
protector simulator. Any secondary protection simulators used in Tests 1 and 5
should be similar to the test fuse used in UL 497A, “Standard for Secondary
Protectors for Communications Circuits.”
Overvoltage Test Compliance
Equipment is deemed compliant if each of the following conditions are met during test:
•
Absence of ignition or charring of the cheesecloth indicator
(Charring is deemed to have occurred when the threads are reduced to char by a
glowing or flaming condition.)
Wiring simulator does not open during test condition 1 or 5
For test condition 1, presented in Table 4.17, the integral I2t measured with a current
probe is less than 100 A2s.
•
•
After completion of the overvoltage tests, equipment must comply with either the Dielectric
Voltage-withstand Test requirements with all components in place or the Leakage Current
Test requirements.
Special Considerations Regarding the SIDACtor Device and UL 60950
The epoxy used for SIDACtor devices is UL recognized and the encapsulated body passes
UL 94V-0 requirements for flammability.
The only specific requirements of UL 60950 that pertain to the SIDACtor device itself are
the impulse test and the mandate that components be UL recognized. All other UL 60950
requirements pertain to the equipment being evaluated.
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SIDACtor Data Book and Design Guide
UL 497
UL 497
UL 497 Series of Safety Standards
The UL 497 series is a family of three safety standards that provides requirements for
protection devices used in low-voltage circuits.
•
UL 497 addresses requirements for primary protectors used in paired communications
circuits.
•
UL 497A covers secondary protectors for use in single or multiple pair-type
communications circuits.
•
•
UL 497B addresses protectors used in data communication and fire alarm circuits.
UL 497C addresses protectors for coaxial circuits.
The focus of UL 497 is to ensure that paired communication circuit protectors do not
become a fire or safety hazard. The requirements in UL 497 cover any protector that is
designed for paired communications circuits and is employed in accordance with Article 800
of the National Electric Code. The protectors covered in UL 497 include solid state primary
and station protectors. These circuit protectors are intended to protect equipment, wiring,
and service personnel against the effects of excessive voltage potential and currents in the
telephone lines caused by lightning, power cross, power induction, and rises in Ground
potential.
UL 497 Construction and Performance Requirements
The “Construction” section covers the following requirements:
•
•
•
•
•
•
General
Enclosures
Protection Against Corrosion
Field-wiring Connections
Components
Spacing
The “Performance” section covers the following requirements:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
General
Line Fuse Test
Instrument Fuse Test
Arrestor Test
Polymeric Material Test
Rubber Materials Test
Corrosion Test, Outdoor Use Protector
Jarring Test
Water Spray Test
Drop Test
Cover Replacement Test
Strain Relief Test
Replacement Arrestors Installation Test
Appliqué Assemblies Installation Test
Dielectric Voltage-withstand Test
Manufacturing and Production Tests
Marking
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UL 497
Performance Tests
Key performance tests which concern overvoltage protectors are detailed in the arrestor
test section. Specific requirements are:
•
Breakdown Voltage Measurement — Arrestors are to be tested in the protector blocks or
panels in which they are intended to be employed. Arrestors are required to break down
within ±25% of the manufacturer’s specified breakdown rating. In no case shall the
breakdown voltage exceed 750 V peak when subjected to the strike voltage test shown
in Figure 4.8. At no time during this test will the supply voltage be increased at a rate
greater than 2000 V/µs.
•
•
Impulse Spark-over Voltage Measurement — The arrestor must break down at less than
1000 V peak when subjected to a single impulse potential. Arrestors are to be tested in
each polarity with a rate of voltage rise of 100 V/µs, ±10%.
Abnormal Operation — Single pair fuseless arrestors must be able to simultaneously
carry 30 A rms at 480 V rms for 15 minutes without becoming a fire hazard. A fire hazard
is determined by mounting the arrestor on a vertical soft wood surface and covering the
unit with cheesecloth. Any charring or burning of the cheesecloth results in test failure.
During this test, although the arrestors may short, they must not have an impulse spark-
overvoltage or DC breakdown voltage greater than 1500 V peak.
•
•
Discharge Test — Protectors must comply with the strike voltage requirements after
being subjected to five successive discharges from a 2 µF capacitor charged to
1000 V dc. (Figure 4.9).
Repeated Discharge Test — The arrestor must continue to break down at or below its
maximum rated breakdown voltage after being subjected to 500 discharges from a
0.001 µF capacitor charged to a potential of 10,000 V dc. The interval between pulses is
five seconds. Arrestors are to be tested in each polarity, and it is acceptable for the
protector to short circuit following the discharge testing. (Figure 4.9)
R1
R2
10 Ω
5 W
50,000 Ω
25 W
C1
V
Test
Specimen
Variable DC Supply
0-1000 V
Figure 4.8 UL 497 Breakdown Voltage Measurement
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UL 497
Variable
DC Supply *
0-12,000 V
R2
10 Ω
5 W
R1
5 MΩ
50 W
Spot
Switch
C1
V
Test
Specimen
*Or Voltage Capability Necessary to
Develop 10,000 V Across Capacitor
Figure 4.9 UL 497 Discharge Test
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UL 497A
UL 497A
UL 497A addresses secondary protectors for use in single or multiple pair-type
communication circuits intended to be installed in accordance with Article 800 of the
National Electric Code and to have an operating voltage of less than 150 V rms with respect
to Ground. The purpose of UL 497A is to help reduce the risk of fire, electric shock, or injury
resulting from the deployment and use of these protectors. UL 497A requirements do not
cover telephone equipment or key systems.
UL 497A Construction, Risk of Injury, and Performance Requirements
The “Construction” section covers the following requirements:
•
General
•
•
•
•
•
•
•
•
•
•
•
•
Product Assembly
Enclosures
Internal Material
Accessibility and Electric Shock
Protection Against Corrosion
Cords
Current-carrying Parts
Internal Wiring
Interconnecting Cords and Cables
Insulating Material
Printed Wiring
Spacing
The “Risk of Injury” section covers the following requirements:
•
•
•
•
Modular Jacks
Sharp Edges
Stability
Protection of Service Personnel
The “Performance” section covers the following requirements:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
General
Impulse Voltage Measurement
Overvoltage Test
Endurance Conditioning
Component Temperature Test
Drop Test
Crush Test
Leakage Current Test
Dielectric Voltage-withstand Test
Rain Test
Maximum Moment Measurement Test
Weather-o-meter and Micro Tensile Strength Test
Thermal Aging and Flame Test
Electric Shock Current Test
Manufacturing and Production Line Test
Marking, Installation, and Instructions
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SIDACtor Data Book and Design Guide
UL 497A
Performance Tests
The following key performance tests relate to overvoltage protection of the secondary
protectors:
1. Impulse Voltage Measurement Test — Secondary protectors must break down within
±25% of the manufacturer’s breakdown rating when tested in each polarity with a rate of
voltage rise of 100 V/µs, ±10%. Note that the manufacturer may assign separate
breakdown voltage ratings for the Breakdown Voltage Measurement Test. This
requirement only applies to secondary protectors that connect between Tip and Ring of
the telephone loop.
2. Breakdown Voltage Measurement Test — Secondary protectors must break down within
±25% of the manufacturer’s breakdown rating when tested in each polarity with a rate of
voltage rise no greater than 2000 V/s. The secondary protector is to be mounted in
accordance with the manufacturer’s installation instructions and then subjected to the
test circuit shown in Figure 4.10. This requirement applies only to secondary protectors
connected between Tip and Ring or Tip/Ring and Ground of the telephone loop.
3. Overvoltage Test — Secondary protectors must limit current and extinguish or open the
telephone loop without loss of its overvoltage protector, indication of fire risk, or electric
shock. Upon completion of this test, samples must comply with the Dielectric Voltage-
withstand Test.
The overvoltage test is used to determine the effects on secondary protectors and is shown
in Table 4.18. Test connections are shown in Figure 4.11.
Test Compliance
Compliance with the overvoltage test is determined by meeting the following criteria:
•
•
•
Cheesecloth indicator may not be either charred or ignited
Wiring simulator (1.6 A Type MDQ fuse or 26 AWG line cord) may not be interrupted
Protector meets the applicable dielectric voltage withstand requirements after the
completion of the overvoltage tests
Table 4.18 UL 497A Overvoltage Test
Voltage
Current
(A)
40
Test
L1
(VRMS
)
Time
1.5 s
5 s
Connection
600
(Note 1, Figure 4.11)
(Note 1, Figure 4.11)
(Note 2, Figure 4.11)
L2
600
7
L3
600
2.2, 1, 0.5, 0.25
30 min at each
current level
L4
200 V rms or just below
the breakdown voltage of the
overvoltage protection device
2.2 A or just below the interrupt
value of the current interrupting
device
30 min
30 min
(Note 2, Figure 4.11)
(Note 1, Figure 4.11)
L5
240
24
Notes:
1. Apply Tests L1, L2, and L5 between Tip and Ground or Ring and Ground.
2. Apply Tests L3 and L4 simultaneously from both Tip and Ring to Ground.
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UL 497A
R1
R2
10 Ω
5 W
50,000 Ω
25 W
C1
V
Test
Specimen
Variable DC Supply
0-1000 V
Figure 4.10 UL 497A Breakdown Voltage Measurement Test
Circuit for Common Mode (Longitudinal)
Overvoltage Tests
Circuit for Differential Mode (Metallic)
Overvoltage Tests
Current
Secondary Protector
Simulator or
Limiting
Resistors
Current
Limiting
Resistor
Wiring Station
Secondary Protector
Simulator or
Wiring Station
Equipment
Under Test
Telecommunication
Network Connection
Points
Equipment
Under Test
Timed
Switch
Timed
Switch
Variable
Voltage
Source
Variable
AC Voltage
Source
Equipment
Ground
Equipment
Ground
Equipment
Ground
Figure 4.11 UL 497A Overvoltage Test
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SIDACtor Data Book and Design Guide
UL 497B
UL 497B
UL 497B provides requirements for protectors used in communication and fire alarm
circuits. This standard does not cover devices for primary protection or protection devices
used on telephone lines. SIDACtor devices are components recognized in accordance with
UL 497B under UL file number E133083.
Construction and Performance Requirements
The “Construction” section covers the following requirements:
•
General
•
•
•
•
•
Corrosion Protection
Field-wiring Connections
Components
Spacing
Fuses
The “Performance” section covers the following requirements:
•
•
•
•
•
•
•
•
•
•
•
•
General
Strike Voltage Breakdown
Endurance Conditioning
Temperature Test
Dielectric Voltage-withstand Test
Vibration Conditioning
Jarring Test
Discharge Test
Repeated Discharge Test
Polymeric Materials Test
High Temperature Test
Marking
Performance Requirements Specific to SIDACtor Devices
1. Strike Voltage Breakdown Test — Protectors are required to break down within the
manufacturer’s specified breakdown range or within 10% of a nominal single breakdown
voltage rating. (Figure 4.12)
2. Endurance Conditioning — Protectors are subjected to 50 impulse cycles. Each cycle is
a 1000 V peak, 10 A, 10x1000 µs pulse. Pulses are applied in one polarity at 10-second
intervals and then repeated in the opposite polarity.
3. Variable Ambient Conditioning — Protectors must comply with the strike voltage
requirements after being subjected to an ambient temperature of 0 °C for four hours and
again after being subjected to an ambient temperature of 49 °C for an additional four
hours.
4. Discharge Test — Protectors must comply with strike voltage requirements after being
subjected to five successive discharges from a 2 µF capacitor charged to 1000 V dc.
(Figure 4.13)
5. Repeated Discharge Test — Protectors must not break down at a voltage higher than the
manufacturer’s maximum rated breakdown voltage nor lower than rated stand-off
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UL 497B
voltage after being subjected to 500 discharges from a 0.001 µF capacitor charged to
10,000 V dc. The discharges are applied in five-second intervals between one side of the
protector and Ground. Upon completion of the discharge tests, protectors are once again
required to meet the strike voltage requirement. (Figure 4.13)
Note: The epoxy used to construct a SIDACtor device body meets UL 94V-0 requirements
for flammability.
R1
R2
10 Ω
5 W
50,000 Ω
25 W
C1
V
Test
Specimen
Variable DC Supply
0-1000 V
Figure 4.12 UL 497B Strike Voltage Breakdown Test
Variable
R2
10 Ω
5 W
R1
5 MΩ
50 W
DC Supply *
Spot
Switch
0-12,000 V
C1
V
Test
Specimen
*Or Voltage Capability Necessary to
Develop 10,000 V Across Capacitor
Figure 4.13 UL 497B Discharge Test
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SIDACtor Data Book and Design Guide
UL 497C
UL 497C
UL 497C requirements cover protectors for use on coaxial cable circuits. This standard
covers construction and performance requirements.
UL 497C Construction and Performance Requirements
The “Construction” section covers the following requirements:
•
General
•
•
•
•
•
Corrosion Protection
Field-wiring Connections
Components
Spacing
Enclosures
The “Performance” section covers the following requirements:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
General
I2t Limiting
Abnormal Sustained Current
Component Temperature Test
Breakdown Voltage Measurement
Impulse Spark-over Voltage Measurement
Limited Short-circuit Test
High Current Ground Path Test
Cable Shield Fuse Test
Endurance Conditioning Test
Induced Low Current Test
Distortion Test
Flame Test
Impact Test (Polymeric Enclosures)
Jarring Test
Water Spray Test
Leakage Current Test
Dielectric Voltage-withstand Test
Ultraviolet Light and Water Exposure
Tensile Strength and Elongation Tests
Air Oven Aging
Ozone Exposure
Performance Requirements Specific to SIDACtor Devices
1. Strike Voltage Breakdown Test — Protectors are required to break down within ±25% of
the manufacturer’s specified breakdown range but no higher than 750 V at ? 2 kV/s rise
time.
2. Endurance Conditioning — Protectors are subjected to 500 impulse cycles. Each cycle is
a 1000 V peak, 10 A, 10x1000 µs pulse. Pulses are applied in one polarity at 10-second
intervals and then repeated in the opposite polarity. Then, 100 cycles of 1000 V peak,
100 A, 10x1000 µs pulse are applied to three new protectors. Finally, two cycles of
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UL 497C
1000 V peak, 5000 A, 8x20 µs pulse are applied to three new protectors, with a rest
period of one minute between surges.
3. Variable Ambient Conditioning — Protectors must comply with the strike voltage
requirements after being subjected to an ambient temperature of 25 °C for four hours
and again after being subjected to an ambient temperature of 90 °C for an additional four
hours.
4. Discharge Test — Protectors must comply with strike voltage requirements after being
subjected to a discharge of 1000 V, 100 ± 10 V/µs, 10 A impulse.
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SIDACtor Data Book and Design Guide
Regulatory Compliant Solutions
Regulatory Compliant Solutions
When determining the most appropriate solution to meet the lightning and AC power fault
conditions for regulatory requirements, coordination is essential between the SIDACtor
device, fuse, and any series impedance that may be used.
Figure 4.14 through Figure 4.19 show templates in which this coordination is considered for
the most cost effective and reliable solutions available. For exact design criteria and
information regarding the applicable regulatory requirements, refer to the SIDACtor device
and fuse selection criteria in this Section 4, “Regulatory Requirements”, and in Section 5,
“Technical Notes”.
GR 1089 and ITU-T K.20 and K.21
Figure 4.14 and Figure 4.15 show line interface protection circuits to meet GR 1089 surge
immunity requirements without the additional use of series resistance. Use the “C” series
SIDACtor device and F1250T to meet GR 1089 surge immunity requirements. Use the
“A” series SIDACtor device and F0500T to meet ITU-T K.20 and K.21 basic surge immunity
requirements without the additional use of resistance.
The enhanced surge immunity requirements of ITU K.20 and K.21 require the use of “C”
rated SIDACtor devices if no series resistor is used.
.
F1250T
Tip
To
Protected
Equipment
Ring
F1250T
Figure 4.14 Balanced Line Protection using Teccor’s “AC” or “AA” series
F1250T / F0500T
Tip
To
Protected
Equipment
Ring
Figure 4.15 Metallic-only Solution using Teccor’s “SC” or “SA” series.
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Regulatory Compliant Solutions
TIA-968 (formerly known as FCC Part 68) and UL 60950
Because equipment that is tested to TIA-968 (formerly known as FCC Part 68)
specifications is also generally tested to UL 60950 specifications, it is easiest to look at a
solution that meets both FCC and UL requirements simultaneously.
TIA-968 Operational Solution and UL 60950
Figure 4.16 and Figure 4.17 show line interface protection circuits that meet UL 60950
power cross requirements and pass TIA-968 Type A and Type B lightning immunity tests
operationally.
F1250T
Tip
To
Protected
Equipment
Ring
F1250T
Figure 4.16 Balanced Line Protection using Teccor’s “AC” Series
F1250T
Tip
To
Protected
Equipment
Ring
Figure 4.17 Metallic-only Solution using Teccor’s “SB” or “EB” Series
TIA-968 Non-Operational Solution and UL 60950
Although the circuits shown in Figure 4.16 and Figure 4.17 provide an operational solution
for TIA-968, TIA-968 allows telecommunications equipment to pass Type A surges non-
operationally as well. For non-operational TIA-968 solutions, coordinate the IPP rating of the
SIDACtor device and the I2t rating of the fuse so that both will withstand the TIA-968 Type B
surge, but that during the Type A surge the fuse will open.
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SIDACtor Data Book and Design Guide
Regulatory Compliant Solutions
Figure 4.18 and Figure 4.19 are line interface protection circuits that meet UL power cross
requirements and pass TIA-968 lightning immunity surge A tests “non-operationally”.
F0500T
Tip
To
Protected
Equipment
Ring
F1250T
Figure 4.18 Balanced Line Protection using Teccor’s “AA” Series
F0500T
Tip
To
Protected
Equipment
Ring
Figure 4.19 Metallic-only Solution using Teccor’s “SA” or “EA” Series
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SIDACtor Data Book and Design Guide
Surge Waveforms for Various Standards
Surge Waveforms for Various Standards
TIA-968 now replaces FCC Part 68, except for hearing aid compatibility (HAC), volume
control, and indoor cabling. This has become harmonized with Canadian requirements.
Various countries around the world have adopted this regulation.
GR 1089 is a standard generally supported by the US Regional Bell Operating Companies
(RBOC). It is updated by Telcordia Technology (formerly Bellcore). The RBOC typically
requires compliance with GR 1089 for any of their telecom purchases.
ITU is a specialized agency of the UN devoted to international harmonization. Most
European countries recognize the ITU standards.
CNET is the Centre National d’etudes de Telecommunications, a French organization.
VDE is the Verband Deutsher Elektrotechniker, a Federation of German electrical
engineers. VDE is very similar to the IEEE (Institute of Electrical and Electronics Engineers)
but is national in scope rather than global.
ANSI is the American National Standards Institute, which is a non-government organization.
The British equivalent to this is BSI.
IEC is the International Electrotechnical Commission, a result of Europe’s move toward a
single market structure and its drive to formalize and harmonize member countries’
requirements.
FTZ R12 is a German specification.
Table 4.19 and Table 4.20 show the recommended SIDACtor device surge rating for each
standard.
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SIDACtor Data Book and Design Guide
Surge Waveforms for Various Standards
Table 4.19 Surge Waveforms for Various Standards
Voltage
Voltage
Current
SIDACtor
Waveform
Current
Amps
100
Waveform
Device
Standard
Volts
µs
10x560
µs
10x560
w/o series R
TIA-968 (formerly Surge A Metallic
800
B or C
known
as FCC Part 68)
Surge A Longitudinal
Surge B Metallic
Surge B Longitudinal
Test 1
Test 2
Test 3
Test 4
Test 5
1500
1000
1500
600
10x160
9x720
9x720
200
25
10x160
5x320
5x320
10x1000
10x360
10x1000
2x10
10x360
5x310
0.2x310
0.8x310
5x310
1x20
C
A, B, or C
A, B, or C
C
B or C
C
37.5
100
100
100
500
25
37.5
38
25
50
50
50
100
50
GR 1089
10x1000
10x360
10x1000
2x10
10x360
10x700
0.5x700
0.5x700
10x700
1.2x50
10x700
10x700
10x700
1000
1000
2500
1000
1500
1500
1000
2000
2000
2 kV
4 kV
2000
C
A, B, or C
A, B, or C
A, B, or C
A, B, or C
A, B, or C
A, B, or C
A, B, or C
C
ITU K.17
RLM 88, CNET
CNET 131-24
VDE 0433
VDE 0878
IEC 61000-4-5
5x310
8x20
5x310
FTZ R12
A, B, or C
Table 4.20 Surge Waveforms for Various Standards
Voltage
Voltage
Current
SIDACtor
Waveform
Current
Waveform
Device
Volts
Amps
µs
w/o series R
Basic/
Basic/
Basic/
Basic/
Standard
Basic single port
Enhanced
1 kV/4 kV
1.5 kV/4 kV
1.5 kV/4 kV
1.5 kV/6 kV
600
600/1.5 kV
1.5 kV/4 kV
1.5 kV/6 kV
1.5 kV/4 kV
1.5 kV/6 kV
600
µs
10x700
10x700
10x700
Enhanced
Enhanced
Enhanced
ITU K.20
25/100
37.5/100
37.5/100
37.5/100
1
5x310
5x310
5x310
5x310
0.2 s
0.2 s/2 s
5x310
5x310
5x310
5x310
0.2 s
A, B, C/B, C
A, B, C/B, C
A, B, C/B, C
A, B, C/C
F1250T
Enhanced single
Basic multiple ports
Enhanced multiple
Basic power cross
Enhanced power cross
Basic single port
10x700
50 Hz, 60 Hz
50 Hz, 60 Hz
10x700
10x700
10x700
10x700
50 Hz, 60Hz
50 Hz, 60Hz
1/7.5
F1250T *
ITU K.21
37.5/100
37.5/150
37.5/100
37.5/150
1
A, B, C/B, C
A, B, C/C
A, B, C/B, C
A, B, C/C
F1250T
Enhanced single
Basic multiple ports
Enhanced multiple
Basic power cross
Enhanced power cross
600/1.5 kV
1/7.5
0.2 s/2 s
F1250T *
* At 7.5 A the F1250T will open, which is not allowed for enhanced requirements of ITU K.20 and K.21.
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SIDACtor Data Book and Design Guide
5 Technical Notes
This section is offered to help answer any questions not previously addressed in this data
book regarding the SIDACtor device and its implementation.
Construction and Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
SIDACtor Device Selection Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
Fuse Selection Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
Overvoltage Protection Comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14
PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
SIDACtor Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22
TeleLink Fuse Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25
Telecommunications Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26
Lightning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-27
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SIDACtor Data Book and Design Guide
Construction and Operation
Construction and Operation
SIDACtor devices are thyristor devices used to protect sensitive circuits from electrical
disturbances caused by lightning-induced surges, inductive-coupled spikes, and AC power
cross conditions. The unique structure and characteristics of the thyristor are used to create
an overvoltage protection device with precise and repeatable turn-on characteristics with
low voltage overshoot and high surge current capabilities.
Key Parameters
Key parameters for SIDACtor devices are VDRM, IDRM, VS, IH, and VT, as shown in Figure 5.1.
V
DRM is the repetitive peak off-state voltage rating of the device (also known as stand-off
voltage) and is the continuous peak combination of AC and DC voltage that may be applied
to the SIDACtor device in its off-state condition. IDRM is the maximum value of leakage
current that results from the application of VDRM. Switching voltage (VS) is the maximum
voltage that subsequent components may be subjected to during a fast-rising (100 V/µs)
overvoltage condition. Holding current (IH) is the minimum current required to maintain the
device in the on state. On-state voltage (VT) is the maximum voltage across the device
during full conduction.
+I
IT
IS
IH
IDRM
-V
+V
VDRM
VT
VS
-I
Figure 5.1 V-I Characteristics
Operation
The SIDACtor device operates much like a switch. In the off state, the device exhibits
leakage currents (IDRM) less than 5 µA, making it invisible to the circuit it is protecting. As a
transient voltage exceeds the SIDACtor device’s VDRM, the device begins to enter its
protective mode with characteristics similar to an avalanche diode. When supplied with
enough current (IS), the SIDACtor device switches to an on state, shunting the surge from
the circuit it is protecting. While in the on state, the SIDACtor device is able to sink large
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SIDACtor Data Book and Design Guide
Construction and Operation
amounts of current because of the low voltage drop (VT) across the device. Once the
current flowing through the device is either interrupted or falls below a minimum holding
current (IH), the SIDACtor resets, returning to its off state. If the IPP rating is exceeded, the
SIDACtor device typically becomes a permanent short circuit.
Physics
The SIDACtor device is a semiconductor device which is characterized as having four
layers of alternating conductivity: PNPN. (Figure 5.2) The four layers include an emitter
layer, an upper base layer, a mid-region layer, and a lower base layer. The emitter is
sometimes referred to as a cathode region, with the lower base layer being referred to as
an anode region.
As the voltage across the SIDACtor device increases and exceeds the device’s VDRM, the
electric field across the center junction reaches a value sufficient to cause avalanche
multiplication. As avalanche multiplication occurs, the impedance of the device begins to
decrease, and current flow begins to increase until the SIDACtor device’s current gain
exceeds unity. Once unity is exceeded, the SIDACtor device switches from a high
impedance (measured at VS) to a low impedance (measured at VT) until the current flowing
through the device is reduced below its holding current (IH).
N
P
N
P
N
Figure 5.2 Geometric Structure of Bidirectional SIDACtor devices
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SIDACtor Device Selection Criteria
SIDACtor Device Selection Criteria
When selecting a SIDACtor device, the following criteria should be used:
Off-state Voltage (VDRM
)
The V
of the SIDACtor device must be greater than the maximum operating voltage of
DRM
the circuit that the SIDACtor device is protecting.
Example 1:
For a POTS (Plain Old Telephone Service) application, convert the maximum operating
Ring voltage (150 V rms) to a peak voltage, and add the maximum DC bias of the central
office battery:
150 VRMS ꢁ2 + 56.6 VPK = 268.8 VPK
ꢃꢀVDRM > 268.8 V
Example 2:
For an ISDN application, add the maximum voltage of the DC power supply to the
maximum voltage of the transmission signal (for U.S. applications, the U-interface will not
have a DC voltage, but European ISDN applications may):
150 VPK + 3 VPK = 153 VPK
ꢃꢀVDRM > 153 V
Switching Voltage (VS)
The V of the SIDACtor device should be equal to or less than the instantaneous peak
S
voltage rating of the component it is protecting.
Example 1:
VS ? VRelay Breakdown
Example 2:
VS ? SLIC VPK
Peak Pulse Current (IPP)
For circuits that do not require additional series resistance, the surge current rating (IPP) of
the SIDACtor device should be greater than or equal to the surge currents associated with
the lightning immunity tests of the applicable regulatory requirement (IPK):
IPP O IPK
For circuits that use additional series resistance, the surge current rating (IPP) of the
SIDACtor device should be greater than or equal to the available surge currents associated
with the lightning immunity tests of the applicable regulatory requirement (IPK(available)):
IPP O IPK(available)
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SIDACtor Device Selection Criteria
The maximum available surge current is calculated by dividing the peak surge voltage (VPK
by the total circuit resistance (RTOTAL):
)
IPK(available) = VPK/RTOTAL
For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and
Ring:
R
SOURCE = VPK/IPK
RTOTAL = RTIP + RSOURCE
RTOTAL = RRING + RSOURCE
For metallic surges (Tip-Ring):
RSOURCE = VPK/IPK
RTOTAL = RTIP + RRING + RSOURCE
Example 1:
A modem manufacturer must pass the Type A surge requirement of TIA-968 (formerly
known as FCC Part 68) without any series resistance.
I
PK = 100 A, 10x560 µs
IPP O 100 A, 10x560 µs
Therefore, either a “B” rated or “C” rated SIDACtor device would be selected.
Example 2:
A line card manufacturer must pass the surge requirements of GR 1089 with 30 ꢂ on Tip
and 30 ꢂ on Ring.
I
PK = 100 A, 10x1000 µs
PK = 1000 V
SOURCE = VPK/IPK = 10 ꢂ
V
R
RTOTAL = RSOURCE RTIP = 40 ꢂ
+
IPK (available) = VPK/RTOTAL = 1000 V/40 ꢂ
ꢃ IPP O 25 A
Holding Current (IH)
Because TIA-968 4.4.1.7.3 specifies that registered terminal equipment not exceed
140 mA dc per conductor under short-circuit conditions, the holding current of the SIDACtor
device is set at 150 mA.
For specific design criteria, the holding current (IH) of the SIDACtor device must be greater
than the DC current that can be supplied during an operational and short circuit condition.
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SIDACtor Device Selection Criteria
Off-State Capacitance (CO)
Assuming that the critical point of insertion loss is 70% of the original signal value, the
SIDACtor device can be used in most applications with transmission speeds up to 30 MHz.
For transmission speeds greater than 30 MHz, the new MC series is highly recommended.
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SIDACtor Data Book and Design Guide
Fuse Selection Criteria
Fuse Selection Criteria
A fuse can be relied upon to operate safely at its rated current, at or below its rated voltage.
This voltage rating is covered by the National Electric Code (NEC) regulations and is a
requirement of UL as protection against fire risk. The standard voltage ratings used by fuse
manufacturers for most small dimension fuses are 32 V, 63 V, 125 V, 250 V, and 600 V.
Fuses are not sensitive to changes in voltage; however, they are sensitive to changes in
current. The fuse will maintain “steady-state” operation from zero volts to the maximum
voltage rating. It is not until the fuse element melts and internal arcing occurs, that circuit
voltage and available power become an issue. The interrupt rating of the fuse addresses
this issue. Specifically, the voltage rating determines the ability of the fuse to suppress
internal arcing that occurs after the fuse link melts.
For telecommunication applications, a voltage rating of 250 V is chosen because of the
possibility of power line crosses. A three-phase voltage line will have voltage values up to
220 V. It is desirable for the voltage rating of the fuse to exceed this possible power cross
event.
UL 60950 has a power cross test condition that requires a fuse to have an interrupt rating of
40 A at 600 V. GR 1089 contains a power cross test condition that requires a fuse to have
an interrupt rating of 60 A at 600 V. A 125 V-rated part will not meet this requirement.
A 250 V part with special design consideration, such as Teccor’s F1250T TeleLink
fuse, does meet this requirement.
Because fuses are rated in terms of continuous voltage and current-carrying capacity, it is
often difficult to translate this information in terms of peak pulse current ratings. To simplify
this process, Table 5.1 shows the surge rating correlation to fuse rating.
Table 5.1 Surge Rating Correlation to Fuse Rating
Equivalent IPP Rating
Fuse Rating
(mA)
10x160 µs
(A)
10x560 µs
10x1000 µs
(A)
(A)
250
350
400
500
600
750
1000
1250
30
45
50
65
75
90
130
160
15
25
30
35
45
65
85
115
10
20
25
30
35
50
65
100
Notes:
•
•
The IPP ratings apply to a 2AG (glass body) slow blow fuse only.
Because there is a high degree of variance in the fusing characteristics, the IPP ratings listed should only be used as approximations.
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Fuse Selection Criteria
Peak Pulse Current (IPP)
For circuits that do not require additional series resistance, the surge current rating (I ) of
PP
the fuse should be greater than or equal to the surge currents associated with the lightning
immunity tests of the applicable regulatory requirement (IPK):
IPP O IPK
For circuits that use additional series resistance, the surge current rating (IPP) of the fuse
should be greater than or equal to the available surge currents associated with the lightning
immunity tests of the applicable regulatory requirement (IPK(available)):
IPP O IPK(available)
The maximum available surge current is calculated by dividing the peak surge voltage (VPK
by the total circuit resistance (RTOTAL):
)
I
PK(available) = VPK/RTOTAL
For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and
Ring:
R
SOURCE = VPK/IPK
RTOTAL = RTIP + RSOURCE
RTOTAL = RRING + RSOURCE
For metallic surges (Tip-Ring):
R
SOURCE = VPK/IPK
RTOTAL = RTIP + RRING + RSOURCE
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SIDACtor Data Book and Design Guide
Overvoltage Protection Comparison
Overvoltage Protection Comparison
The four most commonly used technologies for overvoltage protection are:
•
•
•
•
SIDACtor devices
Gas Discharge Tubes (GDTs)
Metal Oxide Varistors (MOVs)
TVS diodes
All four technologies are connected in parallel with the circuit being protected, and all exhibit
a high off-state impedance when biased with a voltage less than their respective blocking
voltages.
SIDACtor devices
A SIDACtor device is a PNPN device that can be thought of as a TVS diode with a gate.
Upon exceeding its peak off-state voltage (VDRM), a SIDACtor device will clamp a transient
voltage to within the device’s switching voltage (VS) rating. Then, once the current flowing
through the SIDACtor device exceeds its switching current, the device will crowbar and
simulate a short-circuit condition. When the current flowing through the SIDACtor device is
less than the device’s holding current (IH), the SIDACtor device will reset and return to its
high off-state impedance.
Advantages
Advantages of the SIDACtor device include its fast response time (Figure 5.3), stable
electrical characteristics, long term reliability, and low capacitance. Also, because the
SIDACtor device is a crowbar device, it cannot be damaged by voltage and it has extremely
high surge current ratings.
Restrictions
Because the SIDACtor device is a crowbar device, it cannot be used directly across the
AC line; it must be placed behind a load. Failing to do so will result in exceeding the
SIDACtor device’s surge current rating, which may cause the device to enter a permanent
short-circuit condition.
Applications
Although found in other applications, SIDACtor devices are primarily used as the principle
overvoltage protector in telecommunications and data communications circuits. For
applications outside this realm, follow the design criteria in "SIDACtor Device Selection
Criteria" on page 5-5.
Gas Discharge Tubes
Gas tubes are either glass or ceramic packages filled with an inert gas and capped on each
end with an electrode. When a transient voltage exceeds the DC breakdown rating of the
device, the voltage differential causes the electrodes of the gas tube to fire, resulting in an
arc, which in turn ionizes the gas within the tube and provides a low impedance path for the
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Overvoltage Protection Comparison
transient to follow. Once the transient drops below the DC holdover voltage and current, the
gas tube returns to its off state.
Advantages
Gas tubes have high surge current and low capacitance ratings. Current ratings can be as
high as 500 A for 200 impulses, and capacitance ratings can be as low as 1 pF with a zero-
volt bias.
Restrictions
Gas tubes have a limited shelf life and their performance degrades with usage. Out of the
four devices discussed, gas tubes exhibit the slowest response time and highest peak
voltage measurement. (Figure 5.3)
Applications
Because gas tubes are large and require a substantial amount of time to reach full
conduction, they are rarely used as board-level components. Consequently, gas tubes are
not normally used in telecommunications applications other than station protection
modules.
Metal Oxide Varistors
Metal Oxide Varistors (MOVs) are two-leaded, through-hole components typically shaped in
the form of discs. Manufactured from sintered oxides and schematically equivalent to two
back-to-back PN junctions, MOVs shunt transients by decreasing their resistance as
voltage is applied.
Advantages
Since MOVs surge capabilities are determined by their physical dimensions, high surge
current ratings are available. Also, because MOVs are clamping devices, they can be used
as transient protectors in secondary AC power line applications.
Restrictions
Like gas tubes, MOVs have slow response times resulting in peak clamping voltages which
can be greater than twice the device’s voltage rating. (Figure 5.3) MOVs also have long-
term reliability and performance issues due to their tendency to fatigue, high capacitance,
and limited packaging options.
Applications
Although MOVs are restricted from use in many telecom applications (other than disposable
equipment), they are useful in AC applications where a clamping device is required and
tight voltage tolerances are not.
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Overvoltage Protection Comparison
TVS Diodes
Transient Voltage Suppressor (TVS) diodes are clamping voltage suppressors that are
constructed with back-to-back PN junctions. During conduction, TVS diodes create a low
impedance path by varying their resistance as voltage is applied across their terminals.
Once the voltage is removed, the diode will turn off and return to its high off-state
impedance.
Advantages
Because TVS diodes are solid state devices, they do not fatigue nor do their electrical
parameters change as long as they are operated within their specified limits. TVS diodes
effectively clamp fast-rising transients and are well suited for low-voltage applications that
do not require large amounts of energy to be shunted.
Restrictions
Because TVS diodes are clamping devices, they have two inherent weaknesses. First, TVS
diodes are both voltage- and current-limited, so careful consideration should be given to
using these in applications that require large amounts of energy to be shunted. Secondly,
as the amount of current flowing through the device increases, so does its maximum
clamping voltage.
Applications
Due to their low power ratings, TVS diodes are not used as primary interface protectors
across Tip and Ring; they are used as secondary protectors that are embedded within a
circuit.
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Overvoltage Protection Comparison
dv/dt Chart
Figure 5.3 shows a peak voltage comparison between SIDACtor devices, gas discharge
tubes, MOVs, and TVS diodes, all with a nominal stand-off voltage rating of 230 V. The
X axis represents the dv/dt (rise in voltage with respect to time) applied to each protector,
and the Y axis represents the maximum voltage drop across each protector.
1000
900
800
700
600
230 V Devices
Gas Tube
MOV
500
400
300
200
Avalanche Diode
SIDACtor
100
1000
0.001
0.01
0.1
1
10
dv/dt – Volts/µs
Figure 5.3 Overshoot Levels versus dv/dt
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Overcurrent Protection
Overcurrent Protection
In addition to protecting against overvoltage conditions, equipment should also be protected
from overcurrent conditions using either PTCs, fuses, power/line feed resistors, or
flameproof resistors. In all instances the overcurrent protector is a series element placed in
front of the overvoltage protector on either Tip or Ring for metallic (closed loop)
applications and on both Tip and Ring for longitudinal (grounded) applications.
PTCs
PTCs are positive temperature coefficient thermistors used to limit current. During a fault
condition, heat is generated at a rate equal to I2R. When this heat becomes sufficient, the
PTC increases its resistance asymptotically until the device simulates an open circuit,
limiting the current flow to the rest of the circuit. As the fault condition drops below the
PTC’s holding current, the device begins to reset, approximating its original off-state value
of impedance.
Advantages
Because PTCs are resettable devices, they work well in a variety of industrial applications
where electrical components cannot withstand multiple, low-current faults.
Restrictions
Although PTCs are well suited for the industrial environment and in many telecom
applications, they exhibit some limitations that have prevented them from being endorsed
by the entire telecommunications industry. Limitations include low surge current ratings,
unstable resistance, and poor packaging options.
Applications
PTCs are used in a variety of applications. In addition to protecting telecommunications
equipment, PTCs are also used to prevent damage to rechargeable battery packs, to
interrupt the current flow during a motor lock condition, and to limit the sneak currents that
may cause damage to a five-pin module.
Fuses
Due to their stability, fuses are one of the most popular solutions for meeting AC power
cross requirements for telecommunications equipment. Similar to PTCs, fuses function by
reacting to the heat generated due to excessive current flow. Once the fuses I2t rating is
exceeded, the center conductor opens.
Advantages
Fuses are available in both surface mount and through-hole packages and are able to
withstand the applicable regulatory requirements without the use of any additional series
impedance. Chosen correctly, fuses only interrupt a circuit when extreme fault conditions
exist and, when coordinated properly with an overvoltage protector, offer a very competitive
and effective solution for transient immunity needs.
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Overcurrent Protection
Advantages include:
•
•
•
•
•
•
Elimination of series line resistance enabling longer loop lengths
Precise longitudinal balance allowing better transmission quality
Robust surge performance which eliminates costly down time due to nuisance blows
Greater surge ratings than resettable devices, ensuring regulatory compliance
Non-degenerative performance
Available in surface mount packaging which uses less Printed Circuit Board (PCB) real
estate, eliminates mixed technologies, and reduces manufacturing costs
Weaknesses
Because a fuse does not reset, consideration should be given to its use in applications
where multiple fault occurrences are likely. For example, AC strip protectors and ground
fault interrupting circuits (GFIC) are applications in which an alternative solution might be
more prudent.
Applications
Telecommunications equipment best suited for a fuse is equipment that requires surface
mount technology, accurate longitudinal balance, and regulatory compliance without the
use of additional series line impedance.
Selection Criteria
For circuits that do not require additional series resistance, the surge current rating (IPP) of
the TeleLink SM fuse should be greater than or equal to the surge currents associated with
the lightning immunity tests of the applicable regulatory requirement (IPK).
IPP OꢀIPK
For circuits that use additional series resistance, the surge current rating (IPP) of the
TeleLink SM fuse should be greater than or equal to the available surge currents associated
with the lightning immunity tests of the applicable regulatory requirement (IPK (available)).
IPP OꢀIPK (available)
The maximum available surge current is calculated by dividing the peak surge voltage (VPK
by the total circuit resistance (RTOTAL).
)
IPP OꢀIPK (available) = VPK/RTOTAL
For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and
Ring.
R
TOTAL = RTIP + RSOURCE
RTOTAL = RRING + RSOURCE
For metallic surges (Tip-Ring):
R
TOTAL = RTIP + RRING + RSOURCE
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Overcurrent Protection
To select the most appropriate combination of TeleLink SM fuse and SIDACtor device,
decide the regulatory requirement your equipment must meet:
Regulatory Requirement
GR 1089
TeleLink SM Fuse
F1250T
SIDACtor Device
C Series
B Series
A Series
A Series
A Series
All
TIA-968, Type A
TIA-968, Type B
ITU K.20
F1250T
F0500T
F1250T
F1250T
ITU K.21 Basic/Enhanced
UL 60950
All
For applications that do not require agency approval or multiple listings, contact the factory.
Power/Line Feed Resistors
Typically manufactured with a ceramic case or substrate, power and line feed resistors
have the ability to sink a great deal of energy and are capable of withstanding both lightning
and power cross conditions.
Advantages
Power and line feed resistors are available with very tight resistive tolerances, making them
appropriate for applications that require precise longitudinal balance.
Restrictions
Because power and line feed resistors are typically very large and are not available in a
surface mount configuration, these devices are less than desirable from a manufacturing
point of view. Also, because a thermal link is typically not provided, power and line feed
resistors may require either a fuse or a PTC to act as the fusing element during a power
cross condition.
Applications
Power and line feed resistors are typically found on line cards that use overvoltage
protectors that cannot withstand the surge currents associated with applicable regulatory
requirements.
Flameproof Resistors
For cost-sensitive designs, small (1/8 W - 1/4 W), flameproof metal film resistors are often
used in lieu of PTCs, fuses, and power or line feed resistors. During a transient condition,
flameproof resistors open when the resultant energy is great enough to melt the metal used
in the device.
Advantages
Flameproof resistors are inexpensive and plentiful.
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Overcurrent Protection
Restrictions
Flameproof resistors are not resistive to transient conditions and are susceptible to
nuisance blows.
Applications
Outside of very inexpensive customer premise equipment, small resistors are rarely used
as a means to protect telecommunications equipment during power fault conditions.
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PCB Layout
PCB Layout
Because the interface portion of a Printed Circuit Board (PCB) is subjected to high voltages
and surge currents, consideration should be given to the trace widths, trace separation, and
grounding.
Trace Widths
Based on the Institute for Interconnecting and Packaging Electronic Currents, IPC D 275
specifies the trace widths required for various current-carrying capacities. This is very
important for grounding conditions to ensure the integrity of the trace during a surge event.
The required width is dependent on the amount of copper used for the trace and the
acceptable temperature rise which can be tolerated. Teccor recommends a 0.025 inch trace
width with 1 ounce copper. (For example, a 38-AWG wire is approximately equal to 8 mils to
10 mils. Therefore, the minimum trace width should be greater than 10 mils.)
Allowable
75 ˚C
60 ˚C Temperature
45 ˚C
30 ˚C
20 ˚C
35
30
25
Rise
20
15
10 ˚C
12
10
8
7
6
5
4
3
2
1.5
1
.75
.50
.25
.125
0
30
200
250 300
0
10 20
600 700
500
1
5
50
150
70 100
400
Conductor Cross-Section Area (sq mils)
Figure 5.4 Current versus Area
The minimum width and thickness of conductors on a PCB is determined primarily by the
current-carrying capacity required. This current-carrying capacity is limited by the allowable
temperature rise of the etched copper conductor. An adjacent ground or power layer can
significantly reduce this temperature rise. A single ground plane can generally raise the
allowed current by 50%. An easy approximation can be generated by starting with the
information in Figure 5.4 to calculate the conductor cross-sectional area required. Once this
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PCB Layout
has been done, Figure 5.5 shows the conversion of the cross-sectional area to the required
conductor width, dependent on the copper foil thickness of the trace.
0
.001
.005
.010
.020
.030
.050
.070
.100
.150
.200
.250
.300
.350
0
1
5
10
20 30 50 70 100 150 200 250 300 400
Conductor Cross-Section Area (sq mils)
500 600 700
Figure 5.5 Conductor Width versus Area
Trace Separation
Tip and Ring traces are subjected to various transient and overvoltage conditions. To
prevent arcing between traces, minimum trace separation should be maintained. UL 60950
will provide additional information regarding creepage and clearance requirements, which
are dependent on the Comparative Tracking Index (CTI) rating of the PCB, working voltage,
and the expected operating environment. See "UL 60950 3rd Edition (formerly UL 1950, 3rd
edition)" on page 4-16 of this data book.
A good rule of thumb for outside layers is to maintain a minimum of 18 mils for 1kV isolation.
Route the Tip and Ring traces towards the edge of the PCB away from areas containing
static sensitive devices.
Grounding
Although often overlooked, grounding is a very important design consideration when laying
out a protection interface circuit. To optimize its effectiveness, several things should be
considered in sequence:
1. Provide a large copper plane with a grid pattern for the Ground reference point.
2. Decide if a single-point or a multi-point grounding scheme is to be used. A single-point
(also called centralized) grounding scheme is used for circuit dimensions smaller than
one-tenth of a wavelength (ꢄ = 300,000/frequency) and a multi-point (distributed)
grounding scheme is used for circuit trace lengths greater than one-fourth of a
wavelength.
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PCB Layout
3. Because traces exhibit a certain level of inductance, keep the length of the ground trace
on the PCB as short as possible in order to minimize its voltage contribution during a
transient condition. In order to determine the actual voltage contributed to trace
inductance, use the following equations:
V = L (di/dt)
L = 0.0051 ꢅꢀ[loge 2 ꢅ/(t+w) +½ - logeG] in µH
where ꢅꢀ= length of trace
G = function of thickness and width as provided in Table 5.3
t = trace thickness
w = trace width
For example, assume circuit A is protected by a P3100SC with a VS equal to 300 V and a
ground trace one inch in length and a self-inductance equal to 2.4 µH/inch. Assume
circuit B has the identical characteristics as Circuit A, except the ground trace is five inches
in length instead of one inch in length. If both circuits are surged with a 100 A, 10x1000 µs
wave-form, the results would be as shown in Table 5.2:
Table 5.2 Overshoot Caused by Trace Inductance
Total protection level
VL = L (di/dt)
VL = 2.4 µH (100 A/10 µs) = 24 V
VL = 12 µH (100 A/10 µs) = 120 V
SIDACtor device VS
(VL + VS)
324 V
420 V
Circuit A
Circuit B
300 V
300 V
Other practices to ensure sound grounding techniques are:
1. Cross signal grounds and earth grounds perpendicularly in order to minimize the field
effects of “noisy” power supplies.
2. Make sure that the ground fingers on any edge connector extend farther out than any
power or signal leads in order to guarantee that the ground connection invariably is
connected first.
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PCB Layout
Table 5.3 Values of Constants for the Geometric Mean Distance of a Rectangle
t/w or w/t
0.000
0.025
0.050
0.100
0.150
0.200
0.250
0.300
0.350
0.400
0.450
0.500
0.500
0.550
0.600
0.650
0.700
0.750
0.800
0.850
0.900
0.950
1.000
0.000
K
LogeG
0.0
0.22313
0.22333
0.22346
0.22360
0.22366
0.22369
0.22369
0.22368
0.22366
0.22364
0.22362
0.22360
0.22360
0.22358
0.22357
0.22356
0.22355
0.22354
0.22353
0.22353
0.22353
0.223525
0.223525
0.0
0.00089
0.00146
0.00210
0.00239
0.00249
0.00249
0.00244
0.00236
0.00228
0.00219
0.00211
0.00211
0.00203
0.00197
0.00192
0.00187
0.00184
0.00181
0.00179
0.00178
0.00177
0.00177
0.0
Note: Sides of the rectangle are t and w. The geometric mean distance R is given by:
logeR = loge(t+w) - 1.5 + logeG. R = K(t+w), logeK = -1.5 + logeG.
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SIDACtor Soldering Recommendations
SIDACtor Soldering Recommendations
When placing surface mount components, a good solder bond is critical because:
•
The solder provides a thermal path in which heat is dissipated from the packaged silicon
to the rest of the board.
•
A good bond is less subject to thermal fatiguing and results in improved component
reliability.
Reflow Soldering
The preferred technique for mounting the DO-214AA package is to reflow-solder the device
onto a PCB-printed circuit board, as shown in Figure 5.6.
1. Screen print solder paste
(or flux)
2. Place component
(allow flux to dry)
3. Reflow solder
Figure 5.6 Reflow Soldering Procedure
For reliable connections, the PCB should first be screen printed with a solder paste or
fluxed with an easily removable, reliable solution, such as Alpha 5003 diluted with benzyl
alcohol. If using a flux, the PCB should be allowed to dry to touch at room temperature (or in
a 70 °C oven) prior to placing the components on the solder pads.
Relying on the adhesive nature of the solder paste or flux to prevent the devices from
moving prior to reflow, components should be placed with either a vacuum pencil or
automated pick and place machine.
With the components in place, the PCB should be heated to a point where the solder on the
pads begins to flow. This is typically done on a conveyor belt which first transports the PCB
through a pre-heating zone. The pre-heating zone is necessary in order to reduce thermal
shock and prevent damage to the devices being soldered, and should be limited to a
maximum temperature of 165 °C for 10 seconds.
After pre-heating, the PCB goes to a vapor zone, as shown in Figure 5.7. The vapor zone is
obtained by heating an inactive fluid to its boiling point while using a vapor lock to regulate
the chamber temperature. This temperature is typically 215 °C, but for temperatures in
excess of 215 °C, care should be taken so that the maximum temperature of the leads does
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®
SIDACtor Soldering Recommendations
not exceed 275 °C and the maximum temperature of the plastic body does not exceed
250 °C. (Figure 5.8)
Transport
Vapor lock
(secondary
medium)
Cooling pipes
PC board
Vapor phase
zone
Heating
elements
Boiling liquid (primary medium)
Figure 5.7 Principle of Vapor Phase Soldering
Pre-heat
Soak
Reflow
Cool
Down
260
240
220
Peak Temperature
220 C - 245
C
˚
˚
200
180
160
140
120
100
80
1.3 - 1.6 C/s
˚
<2.5 C/s
˚
0.5 - 0.6 C/s
˚
Soaking Zone
Reflow Zone
60 - 90 s typical
( 2 min. MAX )
30 - 60 s typical
( 2 min. MAX )
<2.5 C/s
˚
Pre-heating Zone
( 2-4 min MAX )
60
40
20
0
0
30
60
90
120
150
180
210
240
270
300
Time (Seconds)
Figure 5.8 Reflow Soldering Profile
During reflow, the surface tension of the liquid solder draws the leads of the device towards
the center of the soldering area, correcting any misalignment that may have occurred
during placement and allowing the device to set flush on the pad. If the footprints of the pad
are not concentrically aligned, the same effect can result in undesirable shifts as well.
Therefore, it is important to use a standard contact pattern which leaves sufficient room for
self-positioning.
After the solder cools, connections should be visually inspected and remnants of the flux
removed using a vapor degreaser with an azeotrope solvent or equivalent.
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SIDACtor Data Book and Design Guide
SIDACtor Soldering Recommendations
Wave Soldering
Another common method for soldering components to a PCB is wave soldering. After
fluxing the PCB, an adhesive is applied to the respective footprints so that components can
be glued in place. Once the adhesive has cured, the board is pre-heated and then placed in
contact with a molten wave of solder which has a temperature between 240 °C and 260 °C
and permanently affixes the component to the PCB. (Figure 5.8 and Figure 5.10)
Although a popular method of soldering, wave soldering does have drawbacks:
•
•
•
A double pass is often required to remove excess solder.
Solder bridging and shadows begin to occur as board density increases.
Wave soldering uses the sharpest thermal gradient.
Apply glue
Place component
Cure glue
Wave solder
Screen print glue
Figure 5.9 Wave Soldering Surface Mount Components Only
PC board
Insert
leaded
components
Turn over the
PC board
Apply
glue
Place
SMDs
Cure
glue
Turn over the
PC board
Wave solder
Figure 5.10 Wave Soldering Surface Mount and Leaded Components
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© 2002 Teccor Electronics
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SIDACtor Data Book and Design Guide
TeleLink Fuse Soldering
TeleLink Fuse Soldering
For wave soldering a TeleLink fuse, the following temperature and time are recommended:
•
•
Reservoir temperature of 260 °C (500 °F)
Time in reservoir — three seconds maximum
For infrared, the following temperature and time are recommended:
•
•
Temperature of 240 °C (464 °F)
Time — 30 seconds maximum
Hand soldering is not recommended for this fuse because excessive heat can affect the
fuse performance. Hand soldering should be used only for rework and low volume samples.
Note the following recommendations for hand soldering:
•
•
Maximum tip temperature of 240 °C (464 °F)
Minimize the soldering time at temperature to achieve the solder joint. Measure the fuse
resistance before and after soldering. Any fuse that shifts more than ±3% should be
replaced. An increase in resistance above this amount increases the possibility of a
surge failure, and a decrease in resistance may cause low overloads to exceed the
maximum opening times.
•
Inspect the solder joint to ensure an adequate solder fillet has been produced without
any cracks or visible defects.
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SIDACtor Data Book and Design Guide
Telecommunications Protection
Telecommunications Protection
Because early telecommunications equipment was constructed with components such as
mechanical relays, coils, and vacuum tubes, it was somewhat immune to lightning and
power cross conditions. But as cross bar and step-by-step switches have given way to more
modern equipment such as digital loop carriers, repeater amplifiers, and multiplexers, an
emphasis has been put on protecting this equipment against system transients caused by
lightning and power cross conditions.
Lightning
During an electrical storm, transient voltages are induced onto the telecommunications
system by lightning currents which enter the conductive shield of suspended cable or
through buried cables via ground currents.
As this occurs, the current traveling through the conductive shield of the cable produces an
equal voltage on both the Tip and Ring conductors at the terminating ends. Known as a
longitudinal voltage surge, the peak value and wave-form associated with this condition is
dependent upon the distance the transient travels down the cable and the materials with
which the cable is constructed.
Although lightning-induced surges are always longitudinal in nature, imbalances resulting
from terminating equipment and asymmetric operation of primary protectors can result in
metallic transients as well. A Tip-to-Ring surge is normally seen in terminating equipment
and is the primary reason most regulatory agencies require telecom equipment to have
both longitudinal and metallic surge protection.
Power Cross
Another system transient that is a common occurrence for telecommunications cables is
exposure to the AC power system. The common use of poles, trenches, and ground wires
results in varying levels of exposure which can be categorized as direct power cross, power
induction, and ground potential rise.
Direct power cross occurs when a power line makes direct contact to telecommunications
cables. Direct contact is commonly caused by falling trees, winter icing, severe
thunderstorms, and vehicle accidents. Direct power cross can result in large currents being
present on the line.
Power induction is common where power cables and telecommunications cables are run in
close proximity to one another. Electromagnetic coupling between the cables results in
system transients being induced onto the telecommunications cables, which in turn can
cause excessive heating and fires in terminal equipment located at the cable ends.
Ground potential rise is a result of large fault currents flowing to Ground. Due to the varying
soil resistivity and multiple grounding points, system potential differences may result.
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®
Lightning
Lightning
Lightning is one of nature’s most common and dangerous phenomena. At any one time,
approximately 2,000 thunderstorms are in progress around the globe, with lightning striking
the earth over 100 times per second. According to IEEE C.62, during a single year in the
United States lightning strikes an average of 52 times per square mile, resulting in 100
deaths, 250 injuries, and over 100 million dollars in damage to equipment property.
The Lightning Phenomenon
Lightning is caused by the complex interaction of rain, ice, up drafts, and down drafts that
occur during a typical thunderstorm. The movement of rain droplets and ice within the cloud
results in a large build up of electrical charges at the top and bottom of the thunder cloud.
Normally, positive charges are concentrated at the top of the thunderhead while negative
charges accumulate near the bottom. Lightning itself does not occur until the potential
difference between two charges is great enough to overcome the insulating resistance of air
between them.
Formation of Lightning
Cloud-to-ground lightning begins forming as the level of negative charge contained in the
lower cloud levels begins to increase and attract the positive charge located at Ground.
When the formation of negative charge reaches its peak level, a surge of electrons called a
stepped leader begins to head towards the earth. Moving in 50-meter increments, the
stepped leader initiates the electrical path (channel) for the lightning strike. As the stepped
leader moves closer to the ground, the mutual attraction between positive and negative
charges results in a positive stream of electrons being pulled up from the ground to the
stepped leader. The positively charged stream is known as a streamer. When the streamer
and stepped leader make contact, it completes the electrical circuit between the cloud and
ground. At that instant, an explosive flow of electrons travels to ground at half the speed of
light and completes the formation of the lightning bolt.
Lightning Bolt
The initial flash of a lightning bolt results when the stepped leader and the streamer make
connection resulting in the conduction of current to Ground. Subsequent strokes (3-4) occur
as large amounts of negative charge move farther up the stepped leader. Known as return
strokes, these subsequent bolts heat the air to temperatures in excess of 50,000 °F and
cause the flickering flash that is associated with lightning. The total duration of most
lightning bolts lasts between 500 ms and one second.
During a lightning strike, the associated voltages range from 20,000 V to 1,000,000 V while
currents average around 35,000 A. However, maximum currents associated with lightning
have been measured as high as 300,000 A.
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SIDACtor Data Book and Design Guide
NOTES
6 Mechanical Data
The following section describes the mechanical specifications of SIDACtor products.
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
DO-214AA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Modified DO-214AA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
TO-92 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
MS-013 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
Modified TO-220 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
TO-218 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
TeleLink Surface Mount Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9
Single In-line Protector (SIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10
Summary of Packing Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12
Packing Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
DO-214AA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
TO-92 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
Modified MS-013 Six-pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16
Modified TO-220 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
TeleLink Surface Mount Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
Lead Form Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Modified TO-220 Type 60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Modified TO-220 Type 61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21
Modified TO-220 Type 62 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21
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SIDACtor Data Book and Design Guide
Package Dimensions
Package Dimensions
DO-214AA
The DO-214AA package is designed to meet mechanical standards as set forth in JEDEC
publication number 95.
CASE
TEMPERATURE
MEASUREMENT
B
D
POINT
A
C
H
F
L
E
J
K
G
.079
(2.0)
.110
(2.8)
.079
(2.0)
PAD OUTLINE
(MM)
Note: A stripe is marked on some parts, to indicate the cathode. IPC-SM-782 recommends 2.4 instead of 2.0.
Inches Millimeters
Dimension
MIN
MAX
0.155
0.220
0.083
0.180
0.056
0.083
0.008
0.086
0.053
0.012
0.049
MIN
3.56
5.21
1.96
4.22
0.91
1.85
0.10
1.95
1.09
0.20
0.99
MAX
3.94
5.59
2.11
4.57
1.42
2.11
0.20
2.18
1.35
0.30
1.24
A
B
C
D
E
F
G
H
J
0.140
0.205
0.077
0.166
0.036
0.073
0.004
0.077
0.043
0.008
0.039
K
L
Notes:
•
•
•
•
Dimensions and tolerances per ASME Y14.5M-1994
Mold flash shall not exceed 0.13 mm per side.
Dimensions B and C apply to plated leads.
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
•
Dimension “C” is measured on the flat section of the lead.
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SIDACtor Data Book and Design Guide
Package Dimensions
Modified DO-214AA
The Modified DO-214AA package is a three-leaded surface mount (SM) package.
TEMPERATURE
MEASUREMENT
POINT
PIN 3
P
B
D
M
N
A
C
PIN 1
PIN 2
H
F
L
E
J
K
G
.079
(2.0)
.079
(2.0)
.079
(2.0)
.040
(1.0)
.110
(2.8)
.030
(.76)
PAD OUTLINE
(MM)
Note: A stripe is marked on some parts, to indicate the cathode. IPC-SM-782 recommends 2.4 instead of 2.0.
Inches Millimeters
Dimension
MIN
MAX
0.155
0.220
0.083
0.180
0.056
0.083
0.008
0.086
0.053
0.012
0.049
0.028
0.033
0.058
MIN
3.56
5.21
1.96
4.22
0.91
1.85
0.10
1.95
1.09
0.20
0.99
0.56
0.69
1.32
MAX
3.94
5.59
2.11
4.57
1.42
2.11
0.20
2.18
1.35
0.30
1.24
0.71
0.84
1.47
A
B
C
D
E
F
G
H
J
K
L
M
N
P
0.140
0.205
0.077
0.166
0.036
0.073
0.004
0.077
0.043
0.008
0.039
0.022
0.027
0.052
Notes:
•
•
•
•
Dimensions and tolerancing per ASME Y14.5M-1994
Mold flash shall not exceed 0.13 mm per side.
Dimensions B and C apply to plated leads.
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
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®
Package Dimensions
TO-92
The TO-92 is designed to meet mechanical standards as set forth in JEDEC publication
number 95.
TEMPERATURE
MEASUREMENT POINT
A
N
B
MT1/PIN 1
MT2/PIN 3
E
G
H
M
F
L
D
K
J
Inches
Millimeters
Dimension
MIN
MAX
0.196
MIN
4.47
12.70
2.41
3.81
1.16
3.43
2.23
4.47
2.23
0.33
0.33
MAX
4.98
A
B
D
E
F
G
H
J
K
L
M
N
0.176
0.500
0.095
0.150
0.046
0.135
0.088
0.176
0.088
0.013
0.013
0.105
2.67
0.054
0.145
0.096
0.186
0.096
0.019
0.017
0.060
1.37
3.68
2.44
4.73
2.44
0.48
0.43
1.52
Notes:
•
•
Type 70 lead form as shown is standard for the E package.
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
Mold flash shall not exceed 0.13 mm per side.
•
© 2002 Teccor Electronics
6 - 5
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SIDACtor Data Book and Design Guide
Package Dimensions
MS-013
The MS-013 is designed to meet mechanical standards as set forth in JEDEC publication
number 95.
[.065]
1.65
J
K
PAD OUTLINE
[.460]
11.68
E
X
[.138]
3.50
W
[.059]
1.50
BURR SIDE
4 ˚
96 ˚
FH
1
R
F
7 ˚ TYP
G
P
7 ˚ TYP
MIN LENGTH
OF FLAT
U
0.08
A
B
DETAIL A
SCALE 20:1
M
L
N
T
A
MOLD SPLIT LINE
D
A
7 ˚ TYP
7 ˚ TYP
C
Inches
Millimeters
Dimension
MIN
MAX
MIN
9.14
8.84
8.94
3.51
10.16
MAX
A
B
C
D
E
F
G
H
J
0.360
0.348
0.352
0.138
0.400
0.364
0.352
0.356
0.138
0.412
0.051
0.043
0.051
0.118
0.089
0.293
0.293
0.093
0.045
0.036
0.008
0.036
9.25
8.94
9.04
3.51
10.46
1.30
1.09
1.30
3.00
2.26
7.44
7.44
2.36
1.14
0.91
0.20
0.91
K
L
0.293
0.289
0.089
0.045
0.034
0.008
0.036
0.020
0.010
0.023
0.30
7.34
2.26
1.14
0.86
0.20
0.91
0.51
0.25
0.58
M
N
P
R
S
T
U
W
X
0.010
0.023
0.25
0.58
Notes:
•
•
•
Dimensions and tolerances per ASME Y14.5M-1982
Mold flash shall not exceed 0.13 mm per side.
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
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Package Dimensions
Modified TO-220
The Modified TO-220 package is designed to meet mechanical standards as set forth in
JEDEC publication number 95.
A
O
D
G
TEMPERATURE
MEASUREMENT
POINT
F
P
PIN 3
PIN 2
PIN 1
L
M
K
H
N
J
Inches
Millimeters
Dimension
MIN
MAX
0.410
0.375
0.130
0.575
0.035
0.205
0.105
0.085
0.085
0.024
0.188
0.310
MIN
MAX
10.42
9.53
3.30
14.61
0.89
5.21
2.67
2.16
2.16
0.61
4.78
7.87
A
D
F
G
H
J
K
L
M
N
O
P
0.400
0.360
0.110
0.540
0.025
0.195
0.095
0.075
0.070
0.018
0.178
0.290
10.16
9.14
2.80
13.71
0.63
4.95
2.41
1.90
1.78
0.46
4.52
7.37
Notes:
•
All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one
minute from leads to case over the operating temperature range)
Mold flash shall not exceed 0.13 mm per side.
•
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SIDACtor Data Book and Design Guide
Package Dimensions
TO-218
The TO-218 package is designed to meet mechanical standards as set forth in JEDEC
publication number 95.
T
C Measurement Point
U DIA.
Tab is
C
B
D
connected to
PIN 2
A
F
E
W
PIN 3
J
P
PIN 1
H
M
Q
PIN 2
R
G
N 3 Times
Note: Maximum torque
to be applied to mounting
tab is 8 in-lbs. (0.904 Nm).
K
L
Inches
Millimeters
Dimension
MIN
MAX
MIN
20.57
15.49
4.52
1.40
12.37
16.13
0.56
1.91
14.61
5.36
10.72
2.54
1.14
2.41
0.20
0.97
0.64
4.04
2.29
MAX
21.21
16.00
4.78
1.78
12.62
16.64
0.74
2.41
15.88
5.56
11.10
2.79
1.40
2.92
0.41
1.22
0.81
4.14
2.54
A
B
C
D
E
F
G
H
J
0.810
0.610
0.178
0.055
0.487
0.635
0.022
0.075
0.575
0.211
0.422
0.100
0.045
0.095
0.008
0.038
0.025
0.159
0.090
0.835
0.630
0.188
0.070
0.497
0.655
0.029
0.095
0.625
0.219
0.437
0.110
0.055
0.115
0.016
0.048
0.032
0.163
0.100
K
L
M
N
P
R
S
T
U
V
Notes:
•
•
•
•
Mold flash shall not exceed 0.13 mm per side.
Maximum torque to be applied to mounting tab is 8 in-lbs. (0.904 Nm).
Pin 3 has no connection.
Tab is non-isolated (connects to middle pin).
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®
Package Dimensions
TeleLink Surface Mount Fuse
The following illustration shows the end view dimensions of a TeleLink fuse:
.109 .006
(2.77 0.15)
.109 .006
(2.77 0.15)
Dimensions are in inches
(and millimeters)
The following illustration shows the top view or side view dimensions of a TeleLink fuse:
.055 .010
.055 .010
(1.40 0.25)
(1.40 0.25)
.109 .006
(2.77 0.15)
.405 .008
(10.29 0.20)
Dimensions are in inches
(and millimeters)
The following illustration shows the footprint dimensions of a TeleLink fuse:
.204
(5.2)
.145
3.7
.157
(4.0)
.496
(12.6)
Dimensions are in inches
(and millimeters)
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SIDACtor Data Book and Design Guide
Package Dimensions
Single In-line Protector (SIP)
The following illustration shows a balanced three-chip SIP protector:
0.040 0.004
(1.016 0.102)
0.450 +0.010 / -0.002
(11.430 +0.254 -0.051)
0.010
(0.025)
2.250 +0.010 / -0.002
(57.150 +0.254 -0.051)
typ
0.260
(6.604)
max
0.500 (12.70) max
Dimensions are in
inches (millimeters).
0.110 0.010
(2.794 0.254)
0.100 0.010 non-cumulative
(2.540 0.254)
The following illustration shows a longitudinal two-chip SIP protector:
0.040 0.004
(1.016 0.102)
0.450 +0.010 / -0.002
(11.430 +0.254 -0.051)
0.010
(0.025)
2.250 +0.010 / -0.002
(57.150 +0.254 -0.051)
typ
0.260
(6.604)
max
0.500 (12.70) max
Dimensions are in
inches (millimeters).
0.075 0.010
0.020 (0.508) typ
(1.905 0.254)
0.110 0.010
(2.794 0.254)
0.100 0.010 non-cumulative
(2.540 0.254)
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SIDACtor Data Book and Design Guide
®
Package Dimensions
The following illustration shows a four-port metallic line SIP protector:
0.040 0.004
(1.02 0.10)
Front
0.500
(12.70)
0.450 +0.010 / -0.002
(11.43 +0.25 / -0.05)
max
Front
typ
Back
0.010
(0.025)
1.300 +0.010 / -0.002
(33.02 +0.25 / -0/05)
0.120 0.015
(3.05 0.38)
Back
0.260
(6.60)
max
Dimensions are in
inches (millimeters).
0.020
(0.05)
typ
0.100 0.010
(2.54 0.25)
0.100 0.008
(2.54 0.20)
non-cumulative
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SIDACtor Data Book and Design Guide
Summary of Packing Options
Summary of Packing Options
Packing
Quantity
2500
1000
Added
Suffix
RP
BP
Industry
Standard
EIA-481-1
N/A
Package Type
Description
Embossed Carrier Reel Pack
Bulk Pack
DO-214AA
SA, SB, SC, SD, including MC
3-lead
TO-92
Bulk Pack
Tape and Reel Pack
Ammo Pack
2000
2000
2000
N/A
EIA-468-B
EIA-468-B
EA, EB, EC, including MC
RP1, RP2
AP
Note: Standard lead spacing for TO-92
reel pack is 0.200”.
Modified MS-013
Tape and Reel Pack
Bulk Pack
Tube Pack
1500
500
RP
BP
TP
EIA-481-1
EIA-481-1
50 per tube,
50 tubes per container
TO-220
Bulk Pack
Tape and Reel Pack
500
700
700
N/A
EIA-468-B
EIA-468-B
AA, AB, AC, AD
RP
RP
Tape and Reel Pack for
Type 61 lead form
Tube Pack
Bulk Pack
50 per tube,
TP
EIA-468-B
10 tubes per container
Type 61
TO-218
ME
250
N/A
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© 2002 Teccor Electronics
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SIDACtor Data Book and Design Guide
Summary of Packing Options
Packing
Quantity
2500
5000
Added
Suffix
RP
BP
Industry
Standard
EIA-481-B
N/A
Package Type
Description
Embossed Carrier Reel Pack
Bulk Pack
TeleLink Surface Mount Fuse
Plastic trays
Plastic trays
150/tray
300/tray
None
None
None
None
Balanced Longitudinal SIP
Metallic SIP
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SIDACtor Data Book and Design Guide
Packing Options
Packing Options
DO-214AA
Tape and reel packing options meet all specifications as set forth in EIA-481-1. Standard reel
pack quantity is 2500. Bulk pack quantity is 500.
0.157
(4.0)
3-lead
0.472
(12.0)
0.36
(9.2)
0.315
(8.0)
0.059
(1.5)
DIA
Cover tape
12.99
(330.0)
0.512 (13.0) Arbor
Hole Dia.
Dimensions
are in inches
(and millimeters).
0.49
(12.4)
Direction of Feed
The following illustration shows the DO-214AA component orientation for P0641S, P0721S,
P0901S, and P1101S:
CATHODE
The following illustration shows the modified DO-214 tape and reel:
Pin 2
0.157
Anode
(4.0)
0.472
0.374
(12.0)
(9.5)
0.315
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© 2002 Teccor Electronics
SIDACtor Data Book and Design Guide
®
Packing Options
TO-92
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel
pack quantity is 2000.
0.25
0.50
(6.35)
(12.7)
0.02
(0.5)
0.236
(6.0)
0.125 (3.2) MAX
1.27
(32.2)
1.62
(41.2)
0.708
(18.0)
0.354
(9.0)
0.50
0.20
(12.7)
(5.08)
0.157
(4.0)
DIA
14.17
(360.0)
Flat Down
Dimensions
are in inches
(and millimeters).
1.97
(50.0)
Notes:
•
•
Part number suffix RP2 denotes 0.200” (5 mm) lead spacing and is Teccor’s default value.
Part number suffix RP1 denotes 0.100” (2.54 mm) lead spacing and is available upon request.
The following figure shows the TO-92 Ammo Pack option:
0.25
(6.35)
0.50
(12.7)
0.02 (0.5)
0.236
(6.0)
0.125 (3.2) MAX
1.62
(41.2)
MAX
1.27
(32.2)
0.708
(18.0)
0.354
(9.0)
0.50
(12.7)
0.157
(4.0)
DIA
0.20 (5.08)
Flat down
d
f Fee
irection o
D
25 Devices per fold
1.85
(47.0)
12.2
(310.0)
Dimensions
are in inches
(and millimeters).
1.85
(47.0)
13.3
(338.0)
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SIDACtor Data Book and Design Guide
Packing Options
6
5
4
Modified MS-013 Six-pin
1
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel
pack quantity is 1500.
2
3
.157
(4.0)
.630
(16.0)
.472
(12.0)
Component/Tape Layout
1,500 Devices per Reel
14.173
(360)
.512 (13.0) Arbor
Hole Dia.
Dimensions are in inches
(and millimeters)
.646
(16.4)
Direction of Feed
The following illustration shows the tube pack:
Message Location
.020
(0.51 0.13)
WALL TYP.
.045
(1.14)
20.000 .030
(508.00 0.76)
.310
(7.87)
.108
90
.005
A
.110
(2.79)
6
.165
(4.19)
Interior of the Tube
A
.150
(3.81)
.225
(5.72)
.525
Dimensions are in inches
(and millimeters)
(13.34)
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SIDACtor Data Book and Design Guide
Packing Options
Modified TO-220
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel
pack quantity is 700.
0.240
(6.10)
0.019
(0.5)
1.626
(41.15)
0.750 0.010
(19.05 0.25)
0.720
(18.29)
0.360
(9.14)
Type 61
0.100
(2.54)
0.500
(12.7)
Component/Tape Layout
Standard Reel Pack (RP)
0.100
(2.54)
14.173
(360.0)
1.968
(50.0)
Dimensions are in inches
(and millimeters).
Direction of Feed
The following illustration shows the tube pack:
22.0 .2
(559 5)
.220
(5.58)
.160
(4.06)
1.250 .015
(31.75)
1.300
REF
(136.25)
.630 .015
(16.00 0.38)
.025 .005
(0.64 0.13)
TYP. WALL
Dimensions are in inches
(and millimeters)
.140
(3.56)
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SIDACtor Data Book and Design Guide
Packing Options
TeleLink Surface Mount Fuse
The following illustration shows the TeleLink embossed carrier tape:
.157 .004
(4.00 .10)
.436 .004
(3.15 .10)
.059 .004
(1.50 .10)
Dia.
.079 .004
(2.00 .10)
.124 .004
'A'
(1.75 .10)
.453 .004
(11.50 .10)
'B'
'B'
.436 .004
(11.07 .10)
+.012
.945 -.004
(24.00) +.30
-.10
4˚ Max.
.059 .010
.0135 .0005
(.343 .013)
.315 .004
(8.00 .10)
Dia.
'A'
(1.50 .25)
.129 .004
(3.28 .10)
24 mm Black
Section 'A'-'A'
Anti-static Carrier Tape
Dimensions are in inches
(and millimeters)
8˚ Max.
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© 2002 Teccor Electronics
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SIDACtor Data Book and Design Guide
Packing Options
The following illustration shows the TeleLink 13-inch (330 mm), injection-molded, high-
impact, anti-static, white, plastic reel. Material conforms to EIA-481-1. Surface resistivity is
1011 ꢂ/square. Materials comply with ASTM D-257.
1.00 .069
(25.65 1.75)
Measured at
outer edge
.197 .020
(5.00 .51)
Tape starter slot
Access hole
greater than
40.00 at slot
1.575 location
1.19
(30.40)
Measured
at hub
2.00
.079
(Drive Spokes)
min.
2.362 .039
(60.00 1.00)
Hub dia.
.512 .008
(13.00 .20)
Arbor hole
.795
(20.20)
min.
Tape slot depth
greater than .394 (10.00)
+.079
-.00
+2.00
-.00
.960
(24.40)
12.992
(330.00)
Max dia.
Measured
at hub
Dimensions are in inches
(and millimeters)
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SIDACtor Data Book and Design Guide
Lead Form Options
Lead Form Options
Modified TO-220 Type 60
.645 .025
(16.38 0.64)
0.047
(1.19)
Dia. ref.
A
0.324
(8.23)
30˚
C
0.177
(4.50)
B
Dimensions are in inches
(and millimeters)
Inches
Millimeters
Dimension
Min
Max
Min
12.32
4.11
Max
A
B
C
0.485
0.162
0.162
0.192
0.192
4.88
4.88
4.11
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© 2002 Teccor Electronics
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SIDACtor Data Book and Design Guide
Lead Form Options
Modified TO-220 Type 61
A
PIN 3
PIN 1
Inches
Millimeters
Dimension
Min
Max
Min
Max
A
0.030
0.060
0.762
1.52
Modified TO-220 Type 62
A
B
C
5˚ TYP.
Inches
Millimeters
Dimension
Min
Max
0.202
0.460
0.130
Min
4.37
11.18
3.05
Max
5.13
11.68
3.30
A
B
C
0.172
0.440
0.120
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SIDACtor Data Book and Design Guide
NOTES
相关型号:
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