MLF2012A3R3MB000 [TDK]
General Purpose Inductor, 3.3uH, 20%, 1 Element, SMD, 2012, CHIP, 2012, LEAD FREE;
| 型号： | MLF2012A3R3MB000 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | General Purpose Inductor, 3.3uH, 20%, 1 Element, SMD, 2012, CHIP, 2012, LEAD FREE 测试 射频感应器 电感器 |
| 文件： | 总2页 (文件大小：42K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Page 1 of 2
Product Name
Series
Type
Multilayer Inductor for Signal Line
MLF Series
2012 Type
Model
Part Number
t=1.25mm
MLF2012A3R3MB000
Product Lifecycle Stage PROD
Specification
Summary/Applications/Feature
Mounting Method Flag
Processing
Yes
This is a multilayer inductor with magnetic
shielding by Ferrite material.
Summary
MULTI-LAYER
SMD
Applications PC,HDD,etc
High-reliability monolithic structure.
Shape
Size Code
2012
Feature
The products contain no lead and also support
lead-free soldering.
Body Length(L)
Body Breadth(W)
Body Height(T)
Rated Inductance
Nom
2 m m
Nom
Nom
Nom
Min
1.25 m m
1.25 m m
3.3 micro H
-20 %
Packaging
Packing
Blister (Plastic)Taping
[180mm Reel]
Minumum Package Qty Nom
Minimum Order Qty Nom
2000 Pcs
2000 Pcs
Inductance Tolerance (%)
Max
20 %
Test Frequency of
Inductance
Nom
10 M Hz
Min
Typ
Nom
Min
Typ
Max
Nom
Max
45
Q
70
Test Frequency of Q
Self Resonant Frequency
10 M Hz
60 M Hz
90 M Hz
DC Resistance
0.6 Ohm
DC Resistance
0.28 Ohm
50 m A
Rated Current
Terminal Material
Polarity Marking
Magnetic Shielding
Soldering Method
Ag(100%)/Sn plating
No
Yes
Reflow,Iron Soldering
Measuring Equipment(L, Q, Rdc) LQ:4294A,RDC:7561
Min
Max
Min
Max
Nom
-25 Cel
85 Cel
-40 Cel
85 Cel
Category Temperature
Range
Storage Temperature Range
Weight
0.014 g
[ Caution ]
http://roots.tdk.co.jp/rootsme.asp?ID=TJA024&NO=MLF2012A3R3MB00021... 3/27/2009
Page 2 of 2
Specifications which provide more details for the proper
and safe use of the described product are available upon request.
[ Notice of Revision and Improve ]
All specifications are subject to change without notice.
Copyright(c) 1996-2008 All rights reserved.
http://roots.tdk.co.jp/rootsme.asp?ID=TJA024&NO=MLF2012A3R3MB00021... 3/27/2009
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