MCZ1210AH900L2T [TDK]
Common Mode Filters For high-speed differential signal line; 共模滤波器，用于高速差分信号线
| 型号： | MCZ1210AH900L2T |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Common Mode Filters For high-speed differential signal line |
| 文件： | 总5页 (文件大小：89K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Common Mode Filters
For high-speed differential signal line
(USB2.0, LVDS, etc.)
MCZ series
Type:
MCZ1210AH
MCZ2010AH
[0504 inch]*
[0804 inch]
* Dimensions Code [EIA]
Issue date:
September 2012
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/4)
Conformity to RoHS Directive
Common Mode Filters
For High-speed Differential Signal Line
(USB2.0, LVDS, etc.)
MCZ Series MCZ1210AH
FEATURES
SHAPES AND DIMENSIONS/
RECOMMENDED PC BOARD PATTERNS
• Compact sized multilayer common mode filter.
• By providing wide bandwidth for differential mode, this product
has almost no effect for high-speed differential signals and can
suppress the radiated emission.
0.3
3
1.0 0.15
0.55 0.1
4
1
4
3
APPLICATIONS
• High speed interface(LVDS and USB2.0) in electronics devices.
• Digital cellular phones, PCs, DSCs, portable game machines,
etc.
1
2
2
0.25
Weight: 3mg
0.3 0.1
Dimensions in mm
PRODUCT IDENTIFICATION
MCZ 1210 AH 360 L2
(1) (2) (3) (4) (5) (6)
T
CIRCUIT DIAGRAMS
4
3
(1) Series name
(2) Dimensions LW
(3) Product identification number
(4) Impedance[at 100MHz]
360: 36
1
2
・No polarity
(5) Number of line
L2: 2-line
TEMPERATURE RANGE
Operating
–40 to +85°C
–40 to +85°C
(6) Packaging style
T: Taping
Storage(After mount)
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Packaging style
Taping
Quantity
4000 pieces/reel
HANDLING AND PRECAUTIONS
10s max.
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
001-03 / 20120906 / e9712_mcz_ah
(2/4)
ELECTRICAL CHARACTERISTICS
Common mode impedance
() [100MHz]
36 25%
90 25%
200 25%
300 25%
DC resistance
()max.[1 line]
1.00
1.75
4.00
Rated current
Idc(mA)max.
200
100
100
Rated voltage
Edc(V)max.
5
5
5
5
Insulation resistance
(M)min.
10
10
10
10
Part No.
MCZ1210AH360L2T
MCZ1210AH900L2T
MCZ1210AH201L2T
MCZ1210AH301L2T
4.50
100
TYPICAL ELECTRICAL CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
10000
10000
301 Common mode
201 Common mode
1000
100
10
1000
900 Common mode
360 Common mode
100
301 Differential mode
10
201 Differential mode
900 Differential mode
360 Differential mode
1
1
1
10
100
1000 10000
1
10
100
1000
10000
(
)
Frequency MHz
(
)
Frequency MHz
• All specifications are subject to change without notice.
001-03 / 20120906 / e9712_mcz_ah
(3/4)
Conformity to RoHS Directive
Common Mode Filters
For High-speed Differential Signal Line
(USB2.0, LVDS, etc.)
MCZ Series MCZ2010AH
FEATURES
SHAPES AND DIMENSIONS/
• Compact sized multilayer common mode filter.
• By providing wide bandwidth for differential mode, this product
has almost no effect for high-speed differential signals and can
suppress the radiated emission.
RECOMMENDED PC BOARD PATTERNS
8
7
6
3
5
2.0 0.15
0.5 0.1
8
7
6
5
4
APPLICATIONS
1
2
4
• High speed interface(LVDS and USB2.0) in electronics devices.
• PDP/LCD/DLP/PJ TVs, DVD players, notebook PCs, DVCs,
DSCs, amusement machines, portable audio, digital cellular
phones, etc.
1
2
3
0.5
0.25
Weight: 5.0mg
Dimensions in mm
0.25 0.1
Dimensions in mm
PRODUCT IDENTIFICATION
CIRCUIT DIAGRAMS
MCZ 2010 AH 900 L4
T
8
7
6
5
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions LW
(3) Product identification number
(4) Impedance[at 100MHz]
900: 90
(5) Number of line
L4: 4line
1
2
3
4
・No polarity
TEMPERATURE RANGE
Operating
Storage(After mount)
–40 to +85°C
–40 to +85°C
(6) Packaging style
T: Taping
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
5000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
10s max.
250 to 260˚C
230˚C
Natural
cooling
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
180˚C
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
001-03 / 20120906 / e9712_mcz_ah
(4/4)
ELECTRICAL CHARACTERISTICS
Common mode impedance
() [100MHz]
90 25%
120 25%
200 25%
DC resistance
()max.[1 line]
1.50
2.00
3.50
Rated current
Idc(mA)max.
100
100
100
Rated voltage
Edc(V)max.
5
5
5
Insulation resistance
(M)min.
10
10
10
Part No.
MCZ2010AH900L4T
MCZ2010AH121L4T
MCZ2010AH201L4T
TYPICAL ELECTRICAL CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
10000
10000
1000
1000
100
10
121 Common mode
201 Common mode
900 Common mode
100
10
121 Differential mode
201 Differential mode
900 Differential mode
1
1
1
10
100
1000
10000
1
10
100
1000
10000
(
)
(
)
Frequency MHz
Frequency MHz
• All specifications are subject to change without notice.
001-03 / 20120906 / e9712_mcz_ah
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TDK
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