CGJ5F2C0G1H333J085AA_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | CGJ5F2C0G1H333J085AA_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : December 12, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ5F2C0G1H333J085AA
TDK item description CGJ5F2C0G1H333JT****
Applications
Feature
High Reliability Grade
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
Status
CGJ5(3216) [EIA 1206]
Production
Size
3.20mm ±0.20mm
Length(L)
Width(W)
1.60mm ±0.20mm
0.85mm ±0.15mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
Capacitance
33nF ±5%
50VDC
Rated Voltage
Temperature Characteristic
Q (Min.)
C0G(0±30ppm/°C)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
Yes
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : December 12, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ5F2C0G1H333J085AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
CGJ5F2C0G1H333J085AA
CGJ5F2C0G1H333J085AA
Capacitance
DC Bias Characteristic
CGJ5F2C0G1H333J085AA
CGJ5F2C0G1H333J085AA
Temperature Characteristic
CGJ5F2C0G1H333J085AA(DC Bias =
25V )
CGJ5F2C0G1H333J085AA(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : December 12, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ5F2C0G1H333J085AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
相关型号：
©2020 ICPDF网 联系我们和版权申明