CGA6P4C0G2J333J250AE [TDK]

Multilayer Ceramic Chip Capacitors;
CGA6P4C0G2J333J250AE
型号: CGA6P4C0G2J333J250AE
厂家: TDK ELECTRONICS    TDK ELECTRONICS
描述:

Multilayer Ceramic Chip Capacitors

文件: 总3页 (文件大小:169K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
1 of 3  
Creation Date : November 22, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA6P4C0G2J333J250AE  
TDK item description CGA6P4C0G2J333JT***S  
Applications  
Automotive Grade  
Mid Mid Voltage (100 to 630V)  
Soft Soft Termination  
Feature  
AEC-Q200 AEC-Q200  
Series  
Status  
CGA6(3225) [EIA 1210]  
Production  
Size  
3.20mm +0.50,-0.40mm  
Length(L)  
Width(W)  
2.50mm ±0.30mm  
2.50mm ±0.30mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
2.00mm to 2.40mm  
1.00mm to 1.20mm  
1.90mm to 2.50mm  
Electrical Characteristics  
Capacitance  
33nF ±5%  
630VDC  
Rated Voltage  
Temperature Characteristic  
Q (Min.)  
C0G(0±30ppm/°C)  
1000  
Insulation Resistance (Min.)  
10000MΩ  
Other  
Soldering Method  
AEC-Q200  
Reflow  
Yes  
Packing  
Blister (Plastic)Taping [180mm Reel]  
1000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
2 of 3  
Creation Date : November 22, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA6P4C0G2J333J250AE  
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)  
Impedance  
Capacitance  
CGA6P4C0G2J333J250AE  
CGA6P4C0G2J333J250AE  
DC Bias Characteristic  
Temperature Characteristic  
CGA6P4C0G2J333J250AE  
CGA6P4C0G2J333J250AE(DC Bias =  
315V)  
CGA6P4C0G2J333J250AE(No Bias)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  
3 of 3  
Creation Date : November 22, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
CGA6P4C0G2J333J250AE  
Associated Images  
Land Pattern (Terminal Connection)  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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