CGA3EAC0G2A472J080AC [TDK]
积层贴片陶瓷片式电容器;
| 型号： | CGA3EAC0G2A472J080AC |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | 积层贴片陶瓷片式电容器 电容器 |
| 文件： | 总31页 (文件大小：971K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AC110F0005
SPEC. No. A-ESD-f
DELIVERY SPECIFICATION
D A T E : March, 2021
To
Upon
the
acceptance
of
this
spec
Non-Controlled Copy
. previous spec. (C2012-0629) shall be abolished.
CUSTOMER’S PRODUCT NAME
TDK PRODUCT NAME
MULTILAYER CERAMIC CHIP CAPACITORS
Bulk and Tape packaging 【RoHS compliant】
CGA3EA ESD Protection Series
Please return this specification to TDK representatives with your signature.
If orders are placed without returned specification, please allow us to judge that specification is
accepted by your side.
RECEIPT CONFIRMATION
DATE:
YEAR
MONTH
DAY
Test conditions in this specification based on AEC-Q200 for automotive application.
TDK Corporation
Sales
Engineering
Electronic Components Business Company
Ceramic Capacitors Business Group
Electronic Components
Sales & Marketing Group
APPROVED
Person in charge
APPROVED
CHECKED
Person in charge
AC110F0005
■CATALOG NUMBER CONSTRUCTION
CGA 3
E
A NP0 2A 103
J
080 A
C
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(1) Series
(7) Nominal capacitance (pF)
The capacitance is expressed in three digit
codes and in units of pico Farads (pF). The first
and second digits identify the first and second
significant figures of the capacitance. The third
digit identifies the multiplier. R designates a
decimal point.
(2) Dimensions L x W (mm)
Terminal
width
0.20
Code
3
EIA
Length Width
1.60 0.80
CC0603
(3) Thickness code
Code
E
Thickness
0.80mm
(Example) 0R5 = 0.5pF
101 = 100pF
225 = 2,200,000pF = 2.2μF
(4) Voltage condition for life test
Symbol
Condition
(8) Capacitance tolerance
A
ESD protection
Code
Tolerance
J
±5%
(5) Temperature characteristics
Temperature Temperature
characteristics coefficient
(9) Thickness
Code
080
Temperature
range
Thickness
0.80mm
C0G
NP0
0±30 ppm/℃ -55 to +125℃
0±30 ppm/℃ -55 to +150℃
(10) Packaging style
(6) Rated voltage (DC)
Code
A
Style
Code
2A
Voltage (DC)
100V
178mm reel, 4mm pitch
(11) Special reserved code
Code
A,C
Description
TDK inttermal code
— 1 —
AC110F0005
SCOPE
This delivery specification shall be applied to Multilayer ceramic chip capacitors to be delivered to
.
PRODUCTION PLACES
Production places defined in this specification shall be TDK Corporation, TDK(Suzhou)Co.,Ltd
and TDK Components U.S.A.,Inc.
PRODUCT NAME
The name of the product to be defined in this specifications shall be CGA3EA○○○2A□□□×.
REFERENCE STANDARD
JIS C 5101－1：2010
Fixed capacitors for use in electronic equipment-Part 1: Generic specification
C 5101－21：2014 Fixed capacitors for use in electronic equipment-Part21 : Sectional specification
: Fixed surface mount multilayer capacitors of ceramic dielectric,Class1
C 0806－3：2014
Packaging of components for automatic handling - Part 3: Packaging of
surface mount components on continuous tapes
JEITA RCR－2335 C 2014 Safety application guide for fixed ceramic capacitors for use in electronic
equipment
CONTENTS
1. CODE CONSTRUCTION
2. OPERATING TEMPERATURE RANGE
3. STORING CONDITION AND TERM
4. INDUSTRIAL WASTE DISPOSAL
5. PERFORMANCE
6. INSIDE STRUCTURE AND MATERIAL
7. PACKAGING
8. SETTING UP FOR ESD TEST
9. CAUTION
10. TAPE PACKAGING SPECIFICATION
<EXPLANATORY NOTE>
When the mistrust in the spec arises, this specification is given priority. And it will be confirmed by written
spec change after conference of both posts involved.
This specification warrants the quality of the ceramic chip capacitor. Capacitors should be evaluated or
confirmed a state of mounted on your product.
If the use of the capacitors goes beyond the bounds of this specification, we can not afford to guarantee.
Division
Date
SPEC. No.
A-ESD-f
Ceramic Capacitors Business Group
March, 2021
— 2 —
AC110F0005
1. CODE CONSTRUCTION
(Example) CGA
(1)
3
E
A
(4)
C0G
(5)
2 A
(6)
103
(7)
J
(8)
T
(9)
〇〇〇〇
(10)
(2) (3)
(1) Series
Symbol
CGA
Series
Ceramic chip capacitor for
automotive application
Terminal electrode
(2) Case size
B
L
G
B
T
Internal electrode
Ceramic dielectric
Case size
Dimensions (Unit : mm)
Symbol
TDK(EIA style)
L
W
T
B
G
3
CGA3(CC0603)
1.60±0.10
0.80±0.10
0.80±0.10
0.20 min. 0.30 min.
(3) Thickness
Symbol
Dimension(mm)
0.80
E
(4) Identification for ESD capacitor
Symbol
A
Identification
* Details are shown in Table 1 No.16 at 5.PERFORMANCE.
ESD capacitor
※ As for applied ESD level, please refer to detail page on TDK
web.
(5) Temperature Characteristics
* Details are shown in Table 1 No.6 at 5.PERFORMANCE.
Symbol
2 A
Rated Voltage
DC 100 V
(6) Rated Voltage
(Example)
Rated
Capacitance
(7) Rated Capacitance
Symbol
103
Stated in three digits and in units of pico farads (pF).
The first and Second digits identify the first and
second significant figures of the capacitance,
the third digit identifies the multiplier.
10,000 pF
(8) Capacitance tolerance
Symbol
J
Tolerance
±
5 %
Symbol
Packaging
Bulk
(9) Packaging
B
T
Taping
(10) TDK internal code
― 3 ―
AC110F0005
2. OPERATING TEMPERATURE RANGE
Min. operating
Temperature
Max. operating
Temperature
Reference
Temperature
T.C.
125°C
25°C
25°C
C0G
NP0
-55°C
-55°C
150°C
3. STORING CONDITION AND TERM
Storing temperature
5~40°C
Storing humidity
20~70%RH
Storing term
Within 6 months
upon receipt.
4. INDUSTRIAL WASTE DISPOSAL
Dispose this product as industrial waste in accordance with the Industrial Waste Law.
― 4 ―
AC110F0005
5. PERFORMANCE
Table 1
Performance
No.
1
Item
Test or inspection method
External Appearance
No defects which may affect
performance.
Inspect with magnifying glass(3×)
2
3
Insulation Resistance
Voltage Proof
10,000MΩ min.
Measuring voltage：Rated voltage
Voltage application time：60s.
Apply voltage : 3 × rated voltage
Voltage application time : 1s.
Charge/discharge current : 50mA or
lower
Withstand test voltage without
insulation breakdown or other
damage.
4
Capacitance
Within the specified tolerance.
Rated
Capacitance
Measuring
frequency
Measuring
voltage
1000pF 1MHz±10%
0.5 ~ 5V
rms.
Over
1kHz±10%
1000pF
5
6
Q
See No.4 in this table for measuring
condition.
Please refer to detail page on
TDK web.
Temperature
Characteristics
of Capacitance
Temperature coefficient shall be
calculated based on values at 25°C and
85°C temperature.
Temperature Coefficient
T.C.
(ppm/°C)
C0G
NP0
0 ± 30
0 ± 30
Measuring temperature below 25°C
shall be -10°C and -25°C.
Within ± 0.2% or
± 0.05pF,
whichever larger.
Capacitance
drift
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2.
Apply a pushing force gradually at the
center of a specimen in a horizontal
direction of P.C.board.
7
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other
abnormal signs.
Pushing force : 17.7N
Holding time : 10±1s.
17.7N
P.C.Board
Capacitor
― 5 ―
AC110F0005
(continued)
No.
Item
Performance
Test or inspection method
8
Bending
No mechanical damage.
Reflow solder the capacitor on a
P.C.Board shown in Appendix1.
20
50
F
R230
2
45
45
（Unit：mm）
Sn-3.0Ag-0.5Cu
9
Solderability
New solder to cover over 75% of
termination.
25% may have pin holes or
rough spots but not concentrated
in one spot.
Solder :
Flux :
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
Ceramic surface of A sections
shall not be exposed due to
melting or shifting of termination
material.
Solder temp. : 245±5°C
Dwell time : 3±0.3s.
Solder
Until both terminations
position :
are completely soaked.
A section
10 Resistance
to solder
No cracks are allowed and
terminations shall be covered
at least 60% with new solder.
Solder :
Flux :
Sn-3.0Ag-0.5Cu
External
appearance
heat
Isopropyl alcohol (JIS K
8839) Rosin (JIS K 5902)
25% solid solution.
Capacitance
Change from the
Characteristics
value before test
Solder temp. : 260±5°C
Dwell time : 10±1s.
C0G
±2.5%
NP0
Solder
position :
Until both terminations
are completely soaked.
Meet the initial spec.
Meet the initial spec.
Q
Pre-heating : Temp. ― 110~140°C
Time ― 30～60s.
Insulation
Resistance
Leave the capacitors in ambient condition
for 6~24h before measurement.
Voltage
proof
No insulation breakdown or
other damage.
11
Vibration
No mechanical damage.
External
Applied force : 5G max.
appearance
Frequency : 10~2,000Hz
Capacitance
Reciprocating sweep time : 20 min.
Cycle : 12 cycles in each 3 mutually
perpendicular directions.
Change from the
Characteristics
value before test
C0G
±2.5%
NP0
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2 before
testing.
Meet the initial spec.
Q
― 6 ―
AC110F0005
(continued)
No.
Item
Performance
Test or inspection method
12 Temperature
cycle
No mechanical damage.
Expose the capacitors in the condition
step1 through step 4 listed in the
following table.
External
appearance
Capacitance
Temp. cycle：1,000 cycles
Change from the
value before test
Characteristics
Step Temperature(°C) Time (min.)
Min. operating
Please contact
with our sales
representative.
C0G
NP0
1
2
3
4
30 ± 3
temp. ±3
Ambient Temp.
2 ~ 5
Meet the initial spec.
Q
Max. operating
temp. ±2
30 ± 2
2 ~ 5
Ambient Temp.
Insulation
Resistance
Meet the initial spec.
As for Min./ Max. operating temp., please
refer to "2.OPERATING TEMPERATURE
RANGE".
Voltage
proof
No insulation breakdown or other
damage.
Leave the capacitors in ambient condition for
6~24h before measurement.
Reflow solder the capacitors on a
P.C.Board shown in Appendix 2 before
testing.
13 Moisture
Resistance
(Steady
No mechanical damage.
External
appearance
Test temp.：40±2°C
Test humidity：90~95%RH
Test time：500 +24,0h
Capacitance
Change from the
Characteristics
State)
value before test
Leave the capacitors in ambient condition for
6~24h before measurement.
Please contact
C0G
with our sales
NP0
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
representative.
350 min.
Q
Insulation
1,000MΩ min.
Resistance
14 Moisture
Resistance
No mechanical damage.
External
appearance
Test temp.：85±2°C
Test humidity：85%RH
Applied voltage：Rated voltage
Test time：1,000 +48,0h
Capacitance
Change from the
Characteristics
value before test
Charge/discharge current：50mA or lower
Please contact
C0G
with our sales
NP0
Leave the capacitors in ambient condition for
6~24h before measurement.
representative.
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
Q
200 min.
500MΩ min.
Insulation
Resistance
― 7 ―
AC110F0005
(continued)
No.
Item
External
Performance
Test or inspection method
15 Life
No mechanical damage.
Test temp.：Maximum operating
appearance
temperature±2°C
Applied voltage：Please contact with
our sales representative.
Capacitance
Change from the value
Characteristics
before test
Test time：1,000 +48,0h
Please contact
with our sales
representative.
Charge/discharge current：50mA or
lower
C0G
NP0
Leave the capacitors in ambient condition
for 6~24h before measurement.
350 min.
Q
Reflow solder the capacitors on a
P.C.Board shown in Appendix2 before
testing.
1,000MΩ min.
Insulation
Resistance
16
ESD
Withstand ESD voltage without insulation
breakdown.
Reflow Solder the capacitors on a
P.C.Board shown in Appendix3 before
testing.
Rc
Rd
Circuit condition：IEC 61000-4-2
(Cs：150pF / Rd：330Ω)
Test method：Direct contact
Number of ESD pulse：±10 times
Voltage
Source
Test
specimen
Cs
As for applied ESD level, please refer to
detail page on TDK web.
Rc：Charge current limit resistor
Rd：Discharge resistor
Cs：Energy storage capacitor
After each ESD pulse, dissipation of
residual charge shall be done with
applying 1MΩ resistance for 1 sec min.
ESD gun
― 8 ―
AC110F0005
Appendix1
Appendix2
P.C.Board for bending test
P.C. Board for reliability test
100
100
b
c
b
40
a
40
Solder resist
Copper
a
Solder resist
1.0
c
Copper
Appendix3
P.C. Board for ESD test
b
a
100.5
c
36
Copper
Solder resist
30.5
Copper
Appendix 1, 2
Case size
(Unit : mm)
1. Material : Glass Epoxy
(As per JIS C6484 GE4)
a
b
c
TDK(EIA style)
CGA3(CC0603)
1.0
3.0
1.2
2. Thickness：1.6mm
Copper(Thickness:0.035mm)
Solder resist
Appendix 3 (ESD TEST)
(Unit : mm)
c
Case size
a
b
TDK(EIA style)
CGA3(CC0603)
1.0
3.0
0.75
― 9 ―
AC110F0005
6. INSIDE STRUCTURE AND MATERIAL
3
4
5
2
1
No.
1
NAME
MATERIAL
CaZrO3
Dielectric
Electrode
2
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
3
4
Termination
5
7. PACKAGING
Packaging shall be done to protect the components from the damage during transportation and
storing, and a label which has the following information shall be attached.
7.1 Each plastic bag for bulk packaging contains 1000pcs. And the minimum quantity for
Bulk packaging is 1000pcs.
7.2 Tape packaging is as per 10. TAPE PACKAGING SPECIFICATION.
1) Inspection No.
2) TDK P/N
3) Customer's P/N
4) Quantity
*Composition of Inspection No.
Example
F
1
A
–
2 3
(d)
–
0 0 1
(e)
(a) (b) (c)
(a) Line code
(b) Last digit of the year
(c) Month and A for January and B for February and so on. (Skip I)
(d) Inspection Date of the month.
(e) Serial No. of the day
*Composition of new Inspection No.
(Implemented on and after May 1, 2019 in sequence)
Example
I
F
1
E
2 3 A 0 0 1
(a) (b) (c) (d) (e) (f) (g)
(a) Prefix
(b) Line code
(c) Last digit of the year
(d) Month and A for January and B for February and so on. (Skip I)
(e) Inspection Date of the month.
(f) Serial No. of the day(00 ~ ZZ)
(g) Suffix(00 ~ ZZ)
* It was shifted to the new inspection No. on and after May 2019, but the implementation timing may
be different depending on shipment bases.
Until the shift is completed, either current or new composition of inspection No. will be applied.
― 10 ―
AC110F0005
8. SETTING UP FOR ESD TEST
ESD Gun
(150pF/ 330Ω)
Horizontal coupling plane
(HCP)
Non-conductive table
(Wooden)
Cable for dissipation of
residual charge (1MΩ)
Test board
470kΩ
470kΩ
Power supply
Resistor
Ground reference plane
(GRP)
― 11 ―
AC110F0005
9. CAUTION
No.
Process
Condition
Operating
1-1. Storage, Use
The capacitors must be stored in an ambient temperature of 5 to 40°C with a
1
Condition
(Storage, Use,
Transportation)
relative humidity of 20 to 70%RH. JIS C 60721-3-1 Class 1K2 should be followed for
the other climatic conditions.
1) High temperature and humidity environment may affect a capacitor's solder ability
because it accelerates terminal oxidization. They also deteriorate performance of
taping and packaging. Therefore, SMD capacitors shall be used within 6 months.
For capacitors with terminal electrodes consisting of silver or silver-palladium
which tend to become oxidized or sulfurized, use as soon as possible, such as
within one month after opening the bag.
2) When capacitors are stored for a longer time period than 6 months, confirm the
solderability of the capacitors prior to use.
During storage, keep the minimum packaging unit in its original packaging without
opening it.
Do not deviate from the above temperature and humidity conditions even for a
short term.
3) Corrosive gasses in the air or atmosphere may result in deterioration of the
reliability, such as poor solderability of the terminal electrodes. Do not store
capacitors where they will be exposed to corrosive gas (e.g., hydrogen sulfide,
sulfur dioxide, chlorine ammonia etc.)
4) Solderability and electrical performance may deteriorate due to photochemical
change in the terminal electrode if stored in direct sunlight, or due to condensation
from rapid changes in humidity.
The capacitors especially which use resin material must be operated and stored in
an environment free of dew condensation, as moisture absorption due to
condensation may affect the performance.
5) Refer to JIS C 60721-3-1, class 1K2 for other climate conditions.
1-2. Handling in transportation
In case of the transportation of the capacitors, the performance of the capacitors
may be deteriorated depending on the transportation condition.
(Refer to JEITA RCR-2335C 9.2 Handling in transportation)
2-1. Operating temperature
2
Circuit design
1) Upper category temperature (maximum operating temperature) is specified.
It is necessary to select a capacitor whose rated temperature us higher than the
operating temperature. Also, it is necessary to consider the temperature
distribution in the equipment and seasonal temperature variation.
! Caution
△
2) Do not use capacitors above the maximum allowable operating temperature.
Surface temperature including self heating should be below maximum operating
temperature.
(Due to dielectric loss, capacitors will heat itself when AC is applied. Especially for
high frequency circuit, the heat might be so extreme that it may damage itself or the
product mounted on. Please design the circuit so that the maximum temperature of
the capacitors including the self heating to be below the maximum allowable
operating temperature. Temperature rise at capacitor surface shall be below 20°C)
3) The electrical characteristics of the capacitors will vary depending on the
temperature. The capacitors should be selected and designed in taking the
temperature into consideration.
2-2. When overvoltage is applied
Applying overvoltage to a capacitor may cause dielectric breakdown and result in
a short circuit. The duration until dielectric breakdown depends on the applied
voltage and the ambient temperature.
— 12 —
AC110F0005
No.
2
Process
Condition
2-3. Operating voltage
1) Operating voltage across the terminals should be below the rated voltage.
When AC and DC are super imposed, V0-P must be below the rated voltage.
— (1) and (2)
Circuit design
! Caution
△
R
R
AC or pulse with overshooting, VP-P
R
R
must be below the rated voltage.
— (3), (4) and (5)
When the voltage is started to apply to the circuit or it is stopped applying, the
irregular voltage may be generated for a transit period because of resonance or
switching. Be sure to use the capacitors within rated voltage containing these
Irregular voltage.
Voltage
(1) DC voltage
(2) DC+AC voltage
(3) AC voltage
Positional
Measurement
(Rated voltage)
V0-P
R
V0-P
R
VP-P
R
0
0
0
Voltage
(4) Pulse voltage (A) (5) Pulse voltage (B)
Positional
Measurement
(Rated voltage)
VP-P
R
VP-P
R
0
0
2) Even below the rated voltage, if repetitive high frequency AC or pulse is applied,
the reliability of the capacitors may be reduced.
3) The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
4) Abnormal voltage (surge voltage, static electricity, pulse voltage, etc.) shall not
exceed the rated voltage.
5) When capacitors are used in a series connection, it is necessary to add a balancing
circuit such as voltage dividing resistors in order to avoid an imbalance in the voltage
applied to each capacitor.
2-4. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
— 13 —
AC110F0005
No.
3
Process
Condition
Designing
P.C.board
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1) The greater the amount of solder, the higher the stress on the chip capacitors,
and the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
2) Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
3) Size and recommended land dimensions.
Chip capacitors
Solder land
C
Solder resist
A
B
Reflow soldering
(mm)
Case size
CGA3 (CC0603)
Symbol
A
B
C
0.6 ~ 0.8
0.6 ~ 0.8
0.6 ~ 0.8
Flow soldering (Unrecommend)
Case size
Symbol
(mm)
CGA3 (CC0603)
A
B
C
0.7 ~ 1.0
0.8 ~ 1.0
0.6 ~ 0.8
— 14 —
AC110F0005
No.
3
Process
Condition
Designing
P.C.board
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Perforation or slit
Perforation or slit
Mounting
face
Break P.C.board with
mounted side up.
Break P.C.board with
mounted side down.
Mount perpendicularly to
perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Perforation or slit
Chip
arrangement
(Direction)
Closer to slit is higher stress
Away from slit is less stress
ℓ 2
ℓ R1
R
Distance
from slit
( ℓ1
R
R
<
R
R
ℓ2
R
R
)
( ℓ1
R
R
<
R
R
ℓ2 )
R
R
— 15 —
AC110F0005
No.
3
Process
Condition
Designing
P.C.board
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
E
D
Perforation
C
B
A
Stress force
Slit
A＞B＞E
A＞D＞E
A＞C
When dividing printed wiring boards, the intensities of mechanical stress applied to
capacitors are different according to each dividing method in the order of :
Push-back < Slit < V-groove < Perforation. Therefore consider not only position of
capacitors, but also the way of the dividing the printed wiring boards.
6) Layout recommendation
Use of common
solder land with
other SMD
Use of common
solder land
Soldering with
chassis
Example
Lead wire
Chassis
Solder
land
Excessive solder
Chip
Solder
Need to
avoid
Excessive solder
Missing
PCB
Adhesive
ℓ1
Solder land
Solder land
solder
Lead wire
Solder resist
Solder resist
Recommen-
dation
Solder resist
ℓ2
ℓ2 >ℓ1
— 16 —
AC110F0005
No.
4
Process
Condition
Mounting
4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1) Adjust the bottom dead center of the mounting head to reach on the P.C.board
surface and not press it.
2) Adjust the mounting head pressure to be 1 to 3N of static weight.
3) To minimize the impact energy from mounting head, it is important to provide
support from the bottom side of the P.C.board.
See following examples.
Not recommended
Recommended
Crack
Single sided
mounting
A support pin
is not to be
underneath
the capacitor.
Support pin
Double-sides
mounting
Solder
peeling
Crack
Support pin
When the centering jaw is worn out, it may give mechanical impact on the capacitors
to cause crack. Please control the close up dimension of the centering jaw and
provide sufficient preventive maintenance and replacement of it.
— 17 —
AC110F0005
No.
5
Process
Condition
5-1. Flux selection
Soldering
Flux can seriously affect the performance of capacitors. Confirm the following to
select the appropriate flux.
1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile : Reflow method
Refer to the following temperature profile at Reflow soldering.
Reflow soldering
Soldering
Preheating
Natural cooling
Peak
Temp
∆T
0
Over 60 sec.
Peak Temp time
5-3. Recommended soldering peak temp and peak temp duration for Reflow soldering
Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.
Temp./Duration
Reflow soldering
Peak temp(°C)
260 max.
Duration(sec.)
10 max.
Solder
Lead Free Solder
Sn-Pb Solder
230 max.
20 max.
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
— 18 —
AC110F0005
No.
5
Process
Condition
5-4. Soldering profile : Flow method (Unrecommend)
Soldering
Refer to the following temperature profile at Flow soldering.
Flow soldering
Soldering
Preheating
Natural cooling
Peak
Temp
△T
0
Over 60 sec.
Over 60 sec.
Peak Temp time
Reflow soldering is recommended.
5-5. Recommended soldering peak temp and peak temp duration for Flow soldering
Pb free solder is recommended, but if Sn-37Pb must be used, refer to below.
Temp./Duration
Flow soldering
Peak temp(°C)
260 max.
Duration(sec.)
5 max.
Solder
Lead Free Solder
Sn-Pb Solder
250 max.
3 max.
Recommended solder compositions
Lead Free Solder : Sn-3.0Ag-0.5Cu
5-6. Avoiding thermal shock
1)
Preheating condition
Soldering
Temp. (°C)
∆T ≦ 150
∆T ≦ 150
Reflow soldering
Flow soldering
2) Cooling condition
Natural cooling using air is recommended. If the chips are dipped into a solvent for
cleaning, the temperature difference (∆T) must be less than 100°C.
— 19 —
AC110F0005
No.
5
Process
Condition
Soldering
5-7. Amount of solder
Excessive solder will induce higher tensile force in chip capacitors when
temperature changes and it may result in chip cracking. In sufficient solder may
detach the capacitors from the P.C.board.
Higher tensile force in
chip capacitors to cause
crack
Excessive
solder
Maximum amount
Minimum amount
Adequate
Low robustness may
Insufficient
solder
cause contact failure or
chip capacitors come off
the P.C.board.
5-8. Sn-Zn solder
Sn-Zn solder affects product reliability.
Please contact TDK in advance when utilize Sn-Zn solder.
5-9. Countermeasure for tombstone
The misalignment between the mounted positions of the capacitors and the land
patterns should be minimized. The tombstone phenomenon may occur especially
the capacitors are mounted (in longitudinal direction) in the same direction of the
reflow soldering.
(Refer to JEITA RCR-2335C Annex A (Informative), Recommendations to prevent
the tombstone phenomenon.)
— 20 —
AC110F0005
No.
6
Process
Condition
Solder repairing is unavoidable, refer to below.
Solder repairing
6-1.Soldering rework using spot heater
Heat stress during rework may possibly be reduced by using a spot heater
(also called a “blower”) rather than a soldering iron.
It is applied only to adding solder in the case of insufficient solder amount.
1) Reworking using a spot heater may suppress the occurrence of cracks in the
capacitor compared to using a soldering iron. A spot heater can heat up a capacitor
uniformly with a small heat gradient which leads to lower thermal
stress caused by quick heating and cooling or localized heating.
Moreover, where ultra-small capacitors are mounted close together on a printed
circuit board, reworking with a spot heater can eliminate the risk of direct contact
between the tip of a soldering iron and a capacitor.
2) Rework condition
If the blower nozzle of a spot heater is too close to a capacitor, a crack in the
capacitor may occur due to heat stress. Below are recommendations for avoiding
such an occurrence.
Keep more than 5mm between a capacitor and a spot heater nozzle.
The blower temperature of the spot heater shall be lower than 400°C.
The airflow shall be set as weak as possible.
The diameter of the nozzle is recommended to be 2mm(one-outlet type).The size is
standard and common.
Duration of blowing hot air is recommended to be 10s or less, considering surface
area of the capacitor and melting temperature of solder.
The angle between the nozzle and the capacitor is recommended to be 45degrees
in order to work easily and to avoid partial area heating.
As is the case when using a soldering iron, preheating reduces thermal stress on
capacitors and improves operating efficiency.
・Recommended rework condition（Consult the component manufactures for details.）
Distance from nozzle
Nozzle angle
5mm and over
45degrees
Nozzle temp.
400°C and less
Set as weak as possible
Airflow
(The airflow shall be the minimum value necessary for
solder to melt in the conditions mentioned above.)
Nozzle diameter
Blowing duration
φ2mm（one-outlet type）
10s and less
・Example of recommended spot heater use
One-outlet type nozzle
Angle : 45degrees
3) Amount of solder should be suitable to from a proper fillet shape.
Excess solder causes mechanical and thermal stress on a capacitor and
results in cracks. Insufficient solder causes weak adherence of the capacitor to
the substrate and may result in detachment of a capacitor and deteriorate
reliability of the printed wiring board.
See the example of appropriate solder fillet shape for 5-5.Amount of solder.
— 21 —
AC110F0005
No.
6
Process
Condition
Solder repairing 6-2. Solder repair by solder iron
1) Selection of the soldering iron tip
Tip temperature of solder iron varies by its type, P.C.board material and solder
land size. The higher the tip temperature, the quicker the operation. However,
heat shock may cause a crack in the chip capacitors.
Please make sure the tip temp. before soldering and keep the peak temp and
time in accordance with following recommended condition.
Manual soldering
(Solder iron)
Peak
Temp
∆T
Preheating
0
3sec. (As short as possible)
Recommended solder iron condition (Sn-Pb Solder and Lead Free Solder)
Temp. (°C)
Duration (sec.)
Wattage (W)
Shape (mm)
350 max.
3 max.
20 max.
Ø 3.0 max.
* Please preheat the chip capacitors with the condition in 6-3 to avoid the thermal shock.
2) Direct contact of the soldering iron with ceramic dielectric of chip capacitors
may cause crack. Do not touch the ceramic dielectric and the terminations by
solder iron.
6-3. Avoiding thermal shock
Preheating condition
Soldering
Temp. (°C)
Manual soldering
∆T ≦ 150
— 22 —
AC110F0005
No.
7
Process
Cleaning
Condition
1) If an unsuitable cleaning fluid is used, flux residue or some foreign articles may
stick to chip capacitors surface to deteriorate especially the insulation resistance.
2) If cleaning condition is not suitable, it may damage the chip capacitors.
2)-1. Insufficient washing
(1) Terminal electrodes may corrode by Halogen in the flux.
(2) Halogen in the flux may adhere on the surface of capacitors, and lower the
insulation resistance.
(3) Water soluble flux has higher tendency to have above mentioned problems (1)
and (2).
2)-2. Excessive washing
When ultrasonic cleaning is used, excessively high ultrasonic energy output
can affect the connection between the ceramic chip capacitor's body and the
terminal electrode. To avoid this, following is the recommended condition.
Power : 20W/ ℓ max.
Frequency : 40kHz max.
Washing time : 5 minutes max.
2)-3. If the cleaning fluid is contaminated, density of Halogen increases, and it may
bring the same result as insufficient cleaning.
1) When the P.C.board is coated, please verify the quality influence on the product.
8
9
Coating and
molding of the
P.C.board
2) Please verify carefully that there is no harmful decomposing or reaction gas
emission during curing which may damage the chip capacitors.
3) Please verify the curing temperature.
Handling after
chip mounted
1) Please pay attention not to bend or distort the P.C.board after soldering in handling
otherwise the chip capacitors may crack.
! Caution
△
Bend
Twist
— 23 —
AC110F0005
No.
9
Process
Condition
Printed circuit board cropping should not be carried out by hand, but by using the
proper tooling. Printed circuit board cropping should be carried out using a board
cropping jig as shown in the following figure or a board cropping apparatus to
prevent inducing mechanical stress on the board.
Handling after
chip mounted
2)
! Caution
△
(1)Example of a board cropping jig
Recommended example: The board should be pushed from the back side,
close to the cropping jig so that the board is not bent and the stress applied to
the capacitor is compressive.
Unrecommended example: If the pushing point is far from the cropping jig and
the pushing direction is from the front side of the board, large tensile stress is
applied to the capacitor, which may cause cracks.
Outline of jig
Recommended
Unrecommended
Direction of
load
Direction
of load
V-groove
Printed
circuit
board
Printed
circuit
board
Load point
Components
Printed
circuit
board
Components
Load point
V-groove
V-groove
Slot
Slot
Board
cropping jig
Slot
(2)Example of a board cropping machine
An outline of a printed circuit board cropping machine is shown below. The
top and bottom blades are aligned with one another along the lines with the
V-grooves on printed circuit board when cropping the board.
Unrecommended example: Misalignment of blade position between top and
bottom, right and left, or front and rear blades may cause a crack in the
capacitor.
Outline of machine
Principle of operation
Top blade
Top
blade
Printed circuit board
Bottom blade
V-groove
Printed circuit board
Cross-section diagram
Top blade
Printed circuit board
V-groove
Bottom blade
Unrecommended
Left-right
Recommended
Top-bottom
Front-rear
misalignment
misalignment misalignment
Top blade
Top blade Top blade
Top blade
Board
Bottom blade
Bottom blade Bottom blade
Bottom blade
— 24 —
AC110F0005
No.
9
Process
Condition
When functional check of the P.C.board is performed, check pin pressure tends
to be adjusted higher for fear of loose contact. But if the pressure is excessive
and bend the P.C.board, it may crack the chip capacitors or peel the terminations
off. Please adjust the check pins not to bend the P.C.board.
Handling after
chip mounted
3)
! Caution
△
Item
Not recommended
Recommended
Termination
peeling
Support pin
Board
bending
Check pin
Check pin
10 Handling of loose
chip capacitors
1) If dropped the chip capacitors may crack. Once dropped do not use it.
Especially, the large case sized chip capacitors are tendency to have cracks
easily, so please handle with care.
Crack
Floor
2) Piling the P.C.board after mounting for storage or handling, the corner of the P.C.
board may hit the chip capacitors of another board to cause crack.
P.C.board
Crack
The capacitors (Class 2) have aging in the capacitance. They may not be used in
precision time constant circuit. In case of the time constant circuit, the evaluation
should be done well.
11 Capacitance aging
Estimated life and As per the estimated life and the estimated failure rate depend on the temperature
12
estimated failure
rate of capacitors
and the voltage. This can be calculated by the equation described in JEITA
RCR-2335C Annex F(Informative) Calculation of the estimated lifetime and the
estimated failure rate (Voltage acceleration coefficient : 3 multiplication rule,
Temperature acceleration coefficient : 10°C rule)
The failure rate can be decreased by reducing the temperature and the voltage but
they will not be guaranteed.
— 25 —
AC110F0005
No.
Process
Condition
1) A capacitor shall not be touched directly with bare hands during operation in
order to avoid electric shock.
13 Caution during
operation of
Electric energy held by the capacitor may be discharged through the human
body when touched with a bare hand.
equipment
Even when the equipment is off, a capacitor may stay charged. The capacitor
should be handled after being completely discharged using a resistor.
2) The terminals of a capacitor shall not be short-circuited by any accidental
contact with a conductive object. A capacitor shall not be exposed to a
conductive liquid such as an acid or alkali solution. A conductive object or liquid,
such as acid and alkali, between the terminals may lead to the breakdown of a
capacitor due to short circuit
3) Confirm that the environment to which the equipment will be exposed during
transportation and operation meets the specified conditions. Do not to use the
equipment in the following environments.
(1) Environment where a capacitor is spattered with water or oil
(2) Environment where a capacitor is exposed to direct sunlight
(3) Environment where a capacitor is exposed to Ozone, ultraviolet rays or
radiation
(4) Environment where a capacitor exposed to corrosive gas(e.g. hydrogen
sulfide, sulfur dioxide, chlorine. ammonia gas etc.)
(5) Environment where a capacitor exposed to vibration or mechanical shock
exceeding the specified limits.
(6) Atmosphere change with causes condensation
The product listed in this specification is intended for use in automotive applications
under normal operation and usage conditions.
14 Others
!
△
Caution
The product is not designed or warranted to meet the requirements of application
listed below, whose performance and/or quality requires a more stringent level of
safety or reliability, or whose failure, malfunction or defect could cause serious
damage to society, person or property. Please understand that we are not
responsible for any damage or liability caused by use of the products in any of the
applications below or for any other use exceeding the range or conditions set forth in
this specification sheet. If you intend to use the products in the applications listed
below or if you have special requirements exceeding the range or conditions set forth
in this specification, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (electric trains, ships etc.)
(3) Medical equipment (Excepting Pharmaceutical Affairs Law classification Class1, 2)
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose applications
When designing your equipment even for general-purpose applications, you are
kindly requested to take into consideration securing protection circuit/device or
providing backup circuits in your equipment.
In addition, although the products listed in this specification is intended for use in
automotive application as described above, it is not prohibited to use for general
electronic equipment, whose performance and/or quality doesn’t require a more
stringent level of safety or reliability, or whose failure, malfunction or defect could not
cause serious damage to society, person or property.
Therefore, the description of this caution will be applied, when the products are used
in general electronic equipment under a normal operation and usage conditions.
— 26 —
AC110F0005
10. TAPE PACKAGING SPECIFICATION
1. CONSTRUCTION AND DIMENSION OF TAPING
1-1. Dimensions of carrier tape
Dimensions of paper tape shall be according to Appendix 4.
1-2. Bulk part and leader of taping
Trailer(Empty)
160mm min
Chips
Empty
160mm min
Leader
Drawing direction
400mm min
1-3. Dimensions of reel
Dimensions of φ178 reel shall be according to Appendix 5.
Dimensions of φ330 reel shall be according to Appendix 6.
1-4. Structure of taping
Top cover tape
Pitch hole
Cavity (Chip insert)
Paper carrier tape
Bottom cover tape
2. CHIP QUANTITY
Please refer to detail page on TDK web.
― 27 ―
AC110F0005
3. PERFORMANCE SPECIFICATIONS
3-1. Fixing peeling strength (top tape)
0.05N < Peeling strength < 0.7N
Direction of cover tape pulling
Top cover tape
Carrier tape
0～15°
Direction of pulling
Paper tape should not adhere to top
cover tape when pull the cover tape.
3-2. Carrier tape shall be flexible enough to be wound around a minimum radius
of 30mm with components in tape.
3-3. The missing of components shall be less than 0.1%
3-4. Components shall not stick to fixing tape.
3-5. When removing the cover tape, there shall not be difficulties by unfitting clearance gap,
burrs and crushes of cavities. Also the sprocket holes shall not be covered by
absorbing dust into the suction nozzle.
― 28 ―
AC110F0005
Appendix 4
Paper Tape
Cavity (Chip insert)
Pitch hole
J
E
D
A
C
B
T
H
G
F
(Unit：mm)
Symbol
A
B
C
D
E
F
Case size
CGA3
(CC0603)
( 1.10 )
( 1.90 )
H
8.00 ± 0.30 3.50 ± 0.05 1.75 ± 0.10 4.00 ± 0.10
Symbol
Case size
G
J
T
CGA3
(CC0603)
+0.10
0
2.00 ± 0.05 4.00 ± 0.10 φ1.50
1.20 max.
(
) Reference value.
― 29 ―
AC110F0005
Appendix 5
Dimensions of reel (Material : Polystyrene)
W2
E
C
B
D
R
W1
A
(Unit：mm)
Symbol
A
B
C
D
E
W1
Dimension φ178±2.0
φ60±2.0
φ13±0.5
φ21±0.8
2.0±0.5
9.0±0.3
Symbol
W2
R
Dimension
13.0±1.4
1.0
Appendix 6
Dimensions of reel (Material : Polystyrene)
E
C
B
D
R
t
W
A
(Unit：mm)
Symbol
A
B
C
D
E
W
φ382 max.
(Nominalφ330)
Dimension
φ50 min.
φ13±0.5
φ21±0.8
2.0±0.5
10.0±1.5
Symbol
t
R
Dimension
2.0±0.5
1.0
― 30 ―
相关型号：
CGA4C2C0G1H102J060AA
Ceramic Capacitor, Multilayer, Ceramic, 50V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.001uF, Surface Mount, 0805, CHIP, HALOGEN FREE, ROHS AND REACH COMPLIANT
TDK
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