CGA2B2X5R1H682M050BA_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | CGA2B2X5R1H682M050BA_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：232K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : June 13, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA2B3X5R1H103M050BB
TDK item description CGA2B3X5R1H103MT****
Applications
Feature
Automotive Grade
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
Status
CGA2(1005) [EIA 0402]
Production
Size
1.00mm ±0.05mm
Length(L)
Width(W)
0.50mm ±0.05mm
0.50mm ±0.05mm
0.10mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
0.30mm to 0.50mm
0.35mm to 0.45mm
0.40mm to 0.60mm
Electrical Characteristics
Capacitance
10nF ±20%
50VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
X5R(±15%)
5%
10000MΩ
Other
Soldering Method
AEC-Q200
Reflow
Yes
Packing
Punched (Paper)Taping [180mm Reel]
10000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : June 13, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA2B3X5R1H103M050BB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
CGA2B3X5R1H103M050BB
CGA2B3X5R1H103M050BB
Capacitance
DC Bias Characteristic
CGA2B3X5R1H103M050BB
CGA2B3X5R1H103M050BB
Temperature Characteristic
Ripple Temperature Rising
CGA2B3X5R1H103M050BB(100kHz) CGA2B3X5R1H103M050BB(500kHz) CGA2B3X5R1H103M050BB(1MHz)
CGA2B3X5R1H103M050BB(No
Bias)
CGA2B3X5R1H103M050BB(DC Bias
= 25V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : June 13, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA2B3X5R1H103M050BB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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