C1608C0G1H121J080AA_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | C1608C0G1H121J080AA_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：182K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : April 20, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1608C0G1H121J080AA
TDK item description C1608C0G1H121JT****
Commercial Grade
Applications
Please refer to Part No. CGA3E2C0G1H121J080AA for Automotive use.
General General (Up to 50V)
C1608 [EIA 0603]
Production (Not Recommended for New Design)
Feature
Series
Status
Size
1.60mm ±0.10mm
Length(L)
Width(W)
0.80mm ±0.10mm
0.80mm ±0.10mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance
120pF ±5%
50VDC
Rated Voltage
Temperature Characteristic
Q (Min.)
C0G(0±30ppm/°C)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
4000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : April 20, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1608C0G1H121J080AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
C1608C0G1H121J080AA
C1608C0G1H121J080AA
Capacitance
DC Bias Characteristic
C1608C0G1H121J080AA
C1608C0G1H121J080AA
Temperature Characteristic
C1608C0G1H121J080AA(DC Bias =
25V )
C1608C0G1H121J080AA(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : April 20, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1608C0G1H121J080AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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