C1005C0G1H681J050BE [TDK]
Multilayer Ceramic Chip Capacitors;![C1005C0G1H681J050BE](http://pdffile.icpdf.com/pdf2/p00348/img/icpdf/C1005C0G1H68_2142244_icpdf.jpg)
型号: | C1005C0G1H681J050BE |
厂家: | ![]() |
描述: | Multilayer Ceramic Chip Capacitors |
文件: | 总3页 (文件大小:168K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Creation Date : November 22, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1005C0G1H681J050BE
TDK item description C1005C0G1H681JT***S
Commercial Grade
Applications
Please refer to Part No. CGA2B2C0G1H681J050BE for Automotive use.
Soft Soft Termination
Feature
Series
Status
C1005 [EIA 0402]
Production
Size
1.00mm +0.15,-0.05mm
Length(L)
Width(W)
0.50mm +0.10,-0.05mm
0.50mm +0.10,-0.05mm
0.10mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
0.30mm to 0.50mm
0.35mm to 0.45mm
0.40mm to 0.60mm
Electrical Characteristics
Capacitance
680pF ±5%
50VDC
Rated Voltage
Temperature Characteristic
Q (Min.)
C0G(0±30ppm/°C)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Soldering Method
AEC-Q200
Reflow
No
Packing
Punched (Paper)Taping [180mm Reel]
10000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : November 22, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1005C0G1H681J050BE
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
Capacitance
C1005C0G1H681J050BE
C1005C0G1H681J050BE
DC Bias Characteristic
Temperature Characteristic
C1005C0G1H681J050BE(DC Bias =
25V)
C1005C0G1H681J050BE
C1005C0G1H681J050BE(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : November 22, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1005C0G1H681J050BE
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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