B82477P2682M000 [TDK]
SMD/SMT 电感器(线圈);型号: | B82477P2682M000 |
厂家: | TDK ELECTRONICS |
描述: | SMD/SMT 电感器(线圈) 电感器 |
文件: | 总8页 (文件大小:551K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SMT power inductors
Size 12.5 x 12.5 x 6 (mm)
Series/Type:
B82477P2
Ordering code:
Date:
June 2012
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Identification/Classification 1
(header 1 + top left bar):
SMT power inductors
Identification/Classification 2
Size 12.5 x 12.5 x 6 (mm)
(header 2 + bottom left header bar):
Ordering code: (top right header bar)
Series/Type: (bottom right header bar)
B82477P2
Preliminary data (optional):
(if necessary)
Preliminary data
Department:
EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
Date:
June 2012
contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
SMT power inductors
Size 12.5 x 12.5 x 6 (mm)
B82477P2
Preliminary data
Rated inductance 1 ... 1000 µH
Rated current 0.53 ... 9.25 A
Construction
■ Ferrite core
■ Magnetically shielded
■ Winding: enamel copper wire
■ Winding soldered to terminals
■ Injection molded base
Features
■ High mechanical stability
■ Temperature range up to +150 °C
■ High rated current
■ Low DC resistance
■ Suitable for lead-free reflow soldering
as referenced in JEDEC J-STD 020D
■ Qualification to AEC-Q200
■ RoHS-compatible
Applications
■ Filtering of supply voltages
■ Coupling, decoupling
■ DC/DC converters
■ Automotive electronics
Terminals
■ Base material
Cu (L ≤ 10µH) CuSn6P (L ≥ 15µH)
■ Layer composition Ni, Sn (lead-free)
■ Electro-plated
Marking
■ Marking on component:
Manufacturer, L value (µH, coded),
manufacturing date (YWWD)
■ Minimum data on reel:
Manufacturer, ordering code, L value,
quantity, date of packing
Delivery mode and packing unit
■ 24-mm blister tape, wound on 330-mm reel
■ Packing unit: 600 pcs./reel
June 2012
Please read Cautions and warnings and
Page 2 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 6 (mm)
B82477P2
Preliminary data
Dimensional drawing and layout recommendation
Dimensions in mm
Taping and packing
Blister tape and Reel
Dimensions in mm
June 2012
Please read Cautions and warnings and
Page 3 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 6 (mm)
B82477P2
Preliminary data
Technical data and measuring conditions
Measured with LCR meter Agilent 4284A at frequency fL,
0.1 V, +20 °C
Rated inductance LR
Rated temperature TR
Rated current IR
+85 °C
Max. permissible DC with temperature increase of ≤40 K
at rated temperature
Max. permissible DC with inductance decrease ∆L/L0 of
approx. 10%,
Saturation current ISat
DC resistance Rtyp
Measured at +20 °C
Dip and look method Sn95.5Ag3.8Cu0.7:
+(245 5) °C, (3 0.3) s
Wetting of soldering area 90%
(based on IEC 60068-2-58)
Solderability (lead-free)
Resistance to soldering heat
Climatic category
+260 °C, 40 s (as referenced in JEDEC J-STD 020D)
55/150/56 (to IEC 60068-1)
Mounted: –55 °C … +150 °C
Packaged: –25 °C … +40 °C, ≤75% RH
Storage conditions
Weight
Approx. 3.3 g
June 2012
Please read Cautions and warnings and
Page 4 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 6 (mm)
B82477P2
Preliminary data
Characteristics and ordering codes
LR
µH
1.0
Tolerance fL
MHz
20% = M
IR
A
9.25
Isat
A
10.0
Rmax
Ω
0,008
Ordering code
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
B82477P2102M000
B82477P2152M000
B82477P2222M000
B82477P2332M000
B82477P2472M000
B82477P2682M000
B82477P2103M000
B82477P2153M000
B82477P2223M000
B82477P2333M000
B82477P2473M000
B82477P2683M000
B82477P2104M000
B82477P2154M000
B82477P2224M000
B82477P2334M000
B82477P2474M000
B82477P2684M000
B82477P2105M000
1.5
2.2
3.3
4.7
6.8
10
8.70
7.20
6.70
5.40
4.80
4.30
3.70
3.40
2.70
2.40
1.85
1.65
1.35
1.15
0.95
0.80
0.62
0.53
8.70
8.00
7.20
5.70
4.80
4.00
3.30
2.80
2.20
1.90
1.50
1.30
1.00
0.80
0.68
0.58
0.48
0.40
0,010
0,012
0,014
0,016
0,020
0,025
0,030
0,036
0,055
0,070
0,110
0,140
0,210
0,300
0,460
0,550
1,050
1,300
15
22
33
47
68
100
150
220
330
470
680
1000
June 2012
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 8
SMT power inductors
Size 12.5 x 12.5 x 6 (mm)
B82477P2
Preliminary data
Impedance versus frequency (typical curve)
1000000.0
Z/Ohm
10000.0
1000µH
100.0
100µH
10µH
1.0
0.0
1µH
0.0
0.1
1.0
10.0
100.0
f/MHz
Inductance derating
Current derating Iop/IR
versus load current (typical curve)
versus ambient temperature TA
(rated temperature TR = +85 °C)
June 2012
Please read Cautions and warnings and
Page 6 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 6 (mm)
B82477P2
Preliminary data
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
June 2012
Please read Cautions and warnings and
Page 7 of 8
Important notes at the end of this document.
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for certain areas
of application. These statements are based on our knowledge of typical requirements that are often placed
on our products in the areas of application concerned. We nevertheless expressly point out that such
statements cannot be regarded as binding statements about the suitability of our products for a
particular customer application. As a rule we are either unfamiliar with individual customer applications or
less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent
on the customer to check and decide whether a product with the properties described in the product
specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure before
the end of their usual service life cannot be completely ruled out in the current state of the art, even
if they are operated as specified. In customer applications requiring a very high level of operational safety
and especially in customer applications in which the malfunction or failure of an electronic component could
endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be
ensured by means of suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the
event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet
(www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our
sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this publication
may change from time to time. The same is true of the corresponding product specifications. Please
check therefore to what extent product descriptions and specifications contained in this publication are still
applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The aforementioned
does not apply in the case of individual agreements deviating from the foregoing for customer-specific
products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and
Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF
certifications confirm our compliance with requirements regarding the quality management system in the
automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK
always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949
may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only
requirements mutually agreed upon can and will be implemented in our Quality Management
System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become
legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered
or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-
electronics.tdk.com/trademarks.
Release 2018-10
Page 8 of 8
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