TMPC1265HP-130MG-D [TAI-TECH]
SMD Power Inductor;型号: | TMPC1265HP-130MG-D |
厂家: | TAI-TECH |
描述: | SMD Power Inductor |
文件: | 总4页 (文件大小:1063K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
P2
TAI-TECH
SMD Power Inductor
1. Features
1. Carbonyl Powder.
2. Compact design.
Halogen
3. High current,low DCR,high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
Halogen-free
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
2. Applications
Note PC power system,incl. IMVP-6
DC/DC converter .
3. Dimensions
C
A
A`
D
330
1926
leadframe
D
Recommend PC Board Pattern
A
A`
C
L
1R5
1926
E
B
G
non-leadframe
Series
A(mm)
A'(mm)
B(mm)
C(mm)
D(mm)
E(mm)
L(mm) G(mm) H(mm)
14.2
8.0
5.0
2.3±0.3
4.7±0.3
TMPC1265HP 13.5±0.5 12.5±0.3 12.5±0.3 6.2±0.3
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness
at 0.15mm and above.
4. Part Numbering
TMPC
1265
HP
-
330
MG
-
D
F
A
B
C
D
E
A: Series
B: Dimension
C: Type
BxC
HP:H:Carbonyl Powder,P:PAD broaden.
D: Inductance
330=33.0uH
E: Inductance Tolerance
F: Code
M=±20%.
Marking: Black.330 and 1926(19 YY, 26 WW,follow production date).
P3
TAI-TECH
5. Specification
Inductance
L0 (uH)±20%
DCR
(mΩ) Typ.
@25℃
DCR
(mΩ) Max.
@25℃
I rms ( A )
Typ
I sat ( A )
Typ
Part Number
Type
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
leadframe
TMPC1265HP-R15MG-D
TMPC1265HP-R22MG-D
TMPC1265HP-R30MG-D
TMPC1265HP-R33MG-D
TMPC1265HP-R36MG-D
TMPC1265HP-R40MG-D
TMPC1265HP-R47MG-D
TMPC1265HP-R50MG-D
TMPC1265HP-R56MG-D
TMPC1265HP-R68MG-D
TMPC1265HP-R82MG-D
TMPC1265HP-1R0MG-D
TMPC1265HP-1R2MG-D
TMPC1265HP-1R5MG-D
TMPC1265HP-1R8MG-D
TMPC1265HP-2R2MG-D
TMPC1265HP-2R7MG-D
TMPC1265HP-3R3MG-D
TMPC1265HP-4R7MG-D
TMPC1265HP-5R6MG-D
TMPC1265HP-6R8MG-D
TMPC1265HP-8R2MG-D
TMPC1265HP-100MG-D
TMPC1265HP-130MG-D
TMPC1265HP-150MG-D
TMPC1265HP-220MG-D
TMPC1265HP-330MG-D
TMPC1265HP-470MG-D
TMPC1265HP-680MG-D
0.15
0.22
0.30
0.33
0.36
0.40
0.47
0.50
0.56
0.68
0.82
1.00
1.20
1.50
1.80
2.20
2.70
3.30
4.70
5.60
6.80
8.20
10.0
13.0
15.0
22.0
33.0
47.0
68.0
100
55.0
53.0
48.0
46.0
45.0
44.0
41.0
40.0
37.0
35.0
33.0
30.0
28.0
27.0
24.0
22.0
20.0
18.0
13.5
12.5
11.5
10.5
10.0
9.0
118.0
112.0
72.0
68.0
66.0
64.0
63.0
60.0
58.0
55.0
50.0
48.0
47.0
45.0
40.0
37.0
32.0
30.0
28.0
23.0
18.0
16.0
15.5
13.0
13.0
12.0
11.0
9.5
0.49
0.47
0.60
0.65
0.70
0.70
0.90
0.92
1.05
1.25
1.50
1.70
1.90
2.50
3.60
3.80
4.30
5.70
7.00
8.50
9.50
12.0
13.2
21.0
23.2
32.5
48.0
76.0
110.0
145.0
0.60
0.60
0.72
0.80
0.90
1.00
1.20
1.25
1.2
1.5
1.9
2.3
2.4
3.0
4.0
leadframe
4.2
leadframe
5.5
leadframe
6.8
leadframe
8.4
leadframe
10.0
11.5
15.5
16.5
24.0
28.0
37.0
58.0
90.0
130.0
165.0
leadframe
leadframe
leadframe
leadframe
leadframe
9.0
leadframe
9.0
leadframe
8.0
leadframe
6.5
leadframe
4.8
7.8
leadframe
TMPC1265HP-101MG-D
Note:
4.2
5.5
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
P8
TAI-TECH
10. Typical Performance Curves
P9
TAI-TECH
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