TMPC1002H-8R2MG-D [TAI-TECH]
SMD Power Inductor;型号: | TMPC1002H-8R2MG-D |
厂家: | TAI-TECH |
描述: | SMD Power Inductor |
文件: | 总2页 (文件大小:298K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
P2
TAI-TECH
TMPC1002H-Series(G)-D
SMD Power Inductor
1. Features
1. Carbonyl Powder.
2. Compact design.
Halogen
3. High current,low DCR,high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
Halogen-free
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
2. Applications
Note PC power system,incl. IMVP-6
DC/DC converter .
Recommend PC Board Pattern
3. Dimensions
C
L
A
D
4R7
1932
G
L(mm)
G(mm)
H(mm)
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
12.5
5.4
3.5
2.3±0.3
3.0±0.3
TMPC1002H 11.0±0.5 10.0±0.3 1.8±0.2
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
4. Part Numbering
TMPC
1002
H
-
4R7
MG
-
D
F
A
B
C
D
E
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
BxC
Carbonyl Powder.
4R7=4.70uH
M=±20%
Marking: Black.4R7 and 1932(19 YY, 32 WW,follow production date).
5. Specification
DCR
(mΩ) Typ.
@25℃
DCR
(mΩ) Max.
@25℃
Inductance
L0 (uH)±20%
I rms ( A )
Typ
I rms ( A )
Max
I sat ( A )
Typ
I sat ( A )
Max
Part Number
TMPC1002H-1R0MG-D
TMPC1002H-1R5MG-D
TMPC1002H-2R2MG-D
TMPC1002H-3R3MG-D
TMPC1002H-4R7MG-D
TMPC1002H-6R7MG-D
1.00
1.50
2.20
3.30
4.70
6.70
8.20
8.5
8.0
7.0
5.5
5.0
4.0
3.2
7.5
7.0
6.0
4.5
4.0
3.5
2.7
26.0
23.0
19.0
16.0
14.0
11.0
9.0
20.0
18.0
16.0
14.0
12.0
9.0
15
21
27
44
54
63
90
18
25
32
52
64
73
TMPC1002H-8R2MG-D
Note:
7.0
105
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
P7
TAI-TECH
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