SPA252010HFR24M [SUPERWORLD]

Low Profile Power Inductors;


型号：	SPA252010HFR24M
厂家：	SUPERWORLD ELECTRONICS
描述：	Low Profile Power Inductors
文件：	总8页 (文件大小：307K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Low Profile Power Inductors – SPA252010HF Series

1. Part No. Expression:

S P A 2 5 2 0 1 0 H F □ □ □ M

(a)

(b)

a) Series Code

b) Dimension Code

c) Type Code

d) Inductance Code

e) Tolerance Code

2. Configuration & Dimensions:

Recommended PC Board Pattern

Unit: mm

2.9 Ref. 1.0 Ref.

2.4 Ref.

2.5 +0.2/-0.1 2.0 +0.2/-0.1 1.0 Max. 0.75 Ref. 1.0 Ref.

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Proprietary and Confidential

Document of Superworld

03/03/2017

Low Profile Power Inductors – SPA252010HF Series

3. Material List:

(a) Core

(b) Glue

(d) Wire

Appearance of exposed wire tolerance limit :

1. Width direction（dimension a）：Acceptable when a≦w/2

Non-acceptable when a＞w/2

2. Length direction（dimension b）：Dimension b is not specified.

3. The total acceptable area of exposed wire occurring to each

sides is no greater than 50% of coating resin area.

4. General Specification:

(a) Operating Temp. : -40°C to +125°C (including self-temperature rise)

(b) Storage Temp. : -40°C to +125°C (on board)

(d) Heat Rated Current (Irms) will cause the coil temperature rise approximately ∆t of 40°C (keep 1min)

Saturation Current (Isat Typ.) will cause L0 to drop approximately 30%.

Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions.

Storage condition (component in its packaging)

(e)

(f)

(g)

i) Temperature: Less than 40°C

ii)Humidity : 60% RH

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Proprietary and Confidential

Document of Superworld

03/03/2017

Low Profile Power Inductors – SPA252010HF Series

5. Electrical Characteristics:

Test

Frequency

(Hz)

Inductance Tolerance

DCR

(Ω) Max.

I sat

(A) Max.

I rms

(A) Max.

Part Number

(uH)

(%)

5.50 (1)

6.00 (2)

SPA252010HFR16M

SPA252010HFR24M

SPA252010HFR33M

SPA252010HFR47M

SPA252010HFR68M

SPA252010HF1R0M

SPA252010HF1R5M

SPA252010HF2R2M

SPA252010HF4R7M

0.16

0.24

0.33

0.47

0.68

1.0

±20

1V/1M

0.020

0.028

0.029

0.035

0.043

0.053

0.086

0.108

0.264

7.50

6.70

5.50

4.90

3.80

3.10

2.70

2.10

1.40

5.00 (1)

5.50 (2)

4.30 (1)

4.50 (2)

3.90 (1)

4.20 (2)

3.40 (1)

3.60 (2)

3.00 (1)

3.20 (2)

2.20 (1)

2.40 (2)

1.5

2.10 (1)

2.30 (2)

2.2

1.20 (1)

1.40 (2)

4.7

*Tolerance code : M = 20%

*For Irms (A) Max. values with ’(1)’ or ‘(2)’, refer to notes below for board test conditions.

Notes:

1) At all times, the current supplied to the product should not exceed Irms Max. value

2) Irms Max. board test conditions:

Irms (1)

Irms (2)

Material: FR4

Board dimensions: 100 X 50 X 1.6t mm

Pattern dimensions: 45 X 30 mm (Double side board)

Pattern thickness: 50 μm

Board dimensions: 100 X 50 X 1.6t mm

Pattern dimensions: 45 X 45 mm (Double side board)

Pattern thickness: 70 μm

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Proprietary and Confidential

Document of Superworld

03/03/2017

Low Profile Power Inductors – SPA252010HF Series

6. Characteristics Curves:

SPA252010HFR16M

SPA252010HFR24M

SPA252010HFR33M

SPA252010HFR47M

SPA252010HF1R0M

SPA252010HFR68M

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Proprietary and Confidential

Document of Superworld

03/03/2017

Low Profile Power Inductors – SPA252010HF Series

SPA252010HF1R5M

SPA252010HF2R2M

SPA252010HF4R7M

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Proprietary and Confidential

Document of Superworld

03/03/2017

Low Profile Power Inductors – SPA252010HF Series

7. Soldering:

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the

stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our

terminations are suitable for all re-flow soldering systems. If hand soldering cannot be avoided, the preferred

technique is the utilization of hot air.

7-1 Solder Re-flow:

Recommended temperature profiles for re-flow soldering in Figure 1.

7-2 Soldering Iron (Figure 2):

Products attachment with soldering iron is discouraged due to the inherent process control limitations.

In the event that a soldering iron must be employed the following precautions are recommended.

Note :

a) Preheat circuit and products to 150°C.

b) 355°C tip temperature (Max.)

c) Never contact the ceramic with the iron tip

d) 1.0mm tip diameter (Max.)

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 4~5 secs.

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Proprietary and Confidential

Document of Superworld

03/03/2017

Low Profile Power Inductors – SPA252010HF Series

8. Packaging Information:

8-1 Reel Dimension

Type A(mm) B(mm) C(mm) D(mm)

7”x8mm 8.4±1.0 50 min. 13±0.8 178±2

7"x8mm

8-2 Tape Dimension

Series

SPA

Size

Bo(mm) Ao(mm)

Ko(mm)

1.40±0.1

P(mm)

4.0±0.1

t(mm)

2.85±0.1

2.45±0.1

0.23±0.05

252010

8-3 Packaging Quantity

Chip size

252010

2000

Chip / Reel

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Proprietary and Confidential

Document of Superworld

03/03/2017

Low Profile Power Inductors – SPA252010HF Series

8-4 Tearing Off Force

The force for tearing off cover tape is 15 to 80 grams in the

arrow direction under the following conditions

Room

Humidity

(%)

Tearing

Speed

mm/min

Room Temp.

Room atm

(hPa)

(℃)

5~35

45~85

860~1060

300

Application Notice:

1. Storage Conditions:

To maintain the solderabililty of terminal electrodes:

a) Recommended products should be used within 12 months from the time of delivery.

b) The packaging material should be kept where no chlorine or sulfur exists in the air.

2. Transportation:

a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.

b) Vacuum pick up is strongly recommended for individual components.

c) Bulk handling should ensure that abrasion and mechanical shock are minimized.

NOTE: Specifications subject to change without notice. Please check our website for latest information.

Proprietary and Confidential

Document of Superworld

03/03/2017

SPA252010HFR24M [SUPERWORLD]

相关型号：

SPA252010HFR33M

SPA252010HFR47M

SPA252010HFR68M

SPA253

SPA253-F

SPA253-T

SPA254

SPA254-B

SPA254-F

SPA254-T

SPA255

SPA255-B