C1-2N7S-10 概述
CERAMIC CHIP INDUCTORS 陶瓷片式电感器
C1-2N7S-10 数据手册
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PDF下载CERAMIC CHIP INDUCTORS
C1 SERIES
1. PART NO. EXPRESSION :
(a) Series code
(d) 10 : Lead Free
C 1 - 1 N 0 S - 1 0
(b) Inductance code : 1N0 = 1.0nH
(c) Tolerance code : S = ±0.3nH, J = ±5%
(a)
(b) (c) (d)
2. CONFIGURATION & DIMENSIONS :
A
D
B
Unit:m/m
D
A
B
C
1.0±0.05 0.5±0.05 0.5±0.05 0.1 ~ 0.3
3. GENERAL SPECIFICATION :
a) Operating temp. : -40°C to +85°C
b) Storage temp. : -10°C to +40°C
c) Humdity range : 70% RH Max.
d) Resistance to solder heat : 265°C.6secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
CERAMIC CHIP INDUCTORS
C1 SERIES
6. ELECTRICAL CHARACTERISTICS :
Test
Frequency
( MHz )
SRF
( GHz )
Min.
DCR
( ȍ )
Max.
Rated Current
( mA )
EIA
Size
Inductance
( nH )
Q
Min.
Part Number
Max.
C1-1N0S-10
C1-1N2S-10
C1-1N5S-10
C1-1N8S-10
C1-2N0S-10
C1-2N2S-10
C1-2N4S-10
C1-2N7S-10
C1-3N0S-10
C1-3N3S-10
C1-3N9S-10
C1-4N7S-10
C1-5N6S-10
C1-6N8J-10
C1-8N2J-10
C1-10NJ-10
C1-12NJ-10
C1-15NJ-10
C1-18NJ-10
C1-22NJ-10
C1-27NJ-10
C1-33NJ-10
C1-39NJ-10
C1-47NJ-10
C1-56NJ-10
C1-68NJ-10
C1-82NJ-10
C1-R10J-10
C1-R12J-10
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
1.0
1.2
1.5
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.9
4.7
5.6
6.8
8.2
10
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
10
10
6
0.08
0.09
0.10
0.12
0.12
0.13
0.13
0.13
0.16
0.16
0.21
0.21
0.23
0.25
0.28
0.31
0.40
0.46
0.55
0.60
0.70
0.80
0.90
1.00
1.00
1.20
1.30
1.50
1.60
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
200
200
200
200
180
150
150
150
6
6
6
6
6
6
6
4
4
4
3.9
3.6
3.2
2.7
2.3
2.1
1.9
1.6
1.3
1.2
1.0
0.75
0.75
0.60
0.60
0.60
12
15
18
22
27
33
39
47
56
68
82
100
120
Tolerance code :
S : ±0.3nH
J : ±5%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
CERAMIC CHIP INDUCTORS
C1 SERIES
7. CHARACTERISTICS CURVES :
Inductance vs. Frequency
Q vs. Frequency
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
CERAMIC CHIP INDUCTORS
C1 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Preheat : 100~150°C, 60sec.
Solder Heat Resistance
Appearance : Cracks should not be allowed.
More than 75% of the terminal electrode
should be covered with new solder.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 265±3°C
Flux : Rosin
Preheating Dipping Natural
cooling
Dip Time : 6±1sec.
265°C
150°C
60
6±1
seconds
seconds
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 240±5°C
Flux : Rosin
Solderability
More than 90% of the terminal electrode
should be covered with new solder.
Preheating Dipping Natural
cooling
Dip Time : 3±1sec.
240°C
150°C
60
seconds
3±1.0
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For C Series :
Size
1
Force (Kfg)
0.2
Time (sec)
2
0.5
3
0.6
W
4
1.0
> 25
5
1.0
6
1.0
7
1.5
W
8
2.0
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Solder a chip on a test substrate, bend the substrate
by 3mm (0.118in) for 10secs and return.
20(.787)
Bending
45(1.772) 45(1.772)
100(3.937)
40(1.575)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
CERAMIC CHIP INDUCTORS
C1 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Bending Strength
The ferrite should not be damaged by forces
applied on the right condition.
1.0(0.039)
R0.5(0.02)
Chip
A
High Temperature Resistance Appearance : No damage.
Temperature : 85±5°C
Applied Current : rated current
Duration : 1008±12hrs
Inductance : Within ±20% of initial value.
Measurement : After placing for at least 24hrs.
Humidity Resistance
Thermal Shock
Humidity : 90~95% RH.
Temperature : 60±2°C
Applied Current : rated current (max.)
Duration : 1008±12hrs
Measurement : After placing for at least 24hrs.
For C Series :
Appearance : Cracking, chipping or any other
defects that are harmful to the characteristics
shall not be allowed.
Condition for 1 cycle
Step1 : -40±2°C 30 min.
Step2 : +85±5°C 30 min.
Number of cycles : 100
Inductance : Within ±20% of initial value.
Phase
1
2
Temperature (°C)
-40±2°C
Times (min.)
Measurement : After placing for at least 24hrs.
30
30
+85±5°C
Low temperature storage test
Temperature : -40±2°C
Duration : 1008±12hrs
Measurement : After placing for at least 24hrs.
Measured : 100 times
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
CERAMIC CHIP INDUCTORS
C1 SERIES
9. SOLDERING :
9-1. Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max.
Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions
may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.
A
B
Slope of temp. rise
Heat time
1 to 5
50 to 150
120 to 180
1 to 5
°C/sec
sec
main heating
230°C
E
Heat temperature
Slope of temp. rise
Time over 230°C
Peak temperature
°C
180°C
120°C
C
D
°C/sec
sec
pre-heating
90 ~ 120
255 ~ 260
normal
temperature
°C
E
A
B
C
D
Peak hold time
No. of mounting
10 max.
3
sec
times
TIME(sec.)
(Melting area of solder)
9-2. Soldering Iron
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 3.0mm tip diameter (max)
e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm
f) Limit soldering time to 3 secs.
Upper limit
9-3. Solder Volume :
Recommendable
Accordingly increasing the solder volume, the mechanical stress to product is also
increased. Exceeding solder volume may cause the failure of mechanical or electrical
performance. Solder shall be used not to be exceed as shown in right side.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
CERAMIC CHIP INDUCTORS
C1 SERIES
10. PACKAGING INFORMATION :
10-1. Carrier Tape Packaging
P2
P0
D0
t
P1
A
Ko
Unreeling direction
A(mm)
B(mm)
W(mm)
8±0.2
F(mm)
E(mm)
P1(mm)
4±0.1
P2(mm)
2±0.05
P0(mm)
4±0.1
D0(mm)
Ko(mm)
t(mm)
0.65±0.1 1.15±0.1
3.5±0.05 1.75±0.1
1.5 +0.1
0.8±0.05 0.2±0.05
-0
10-2. Leader And Trailer Tape
500 to 560mm
Leader
Blank
Blank
Components
10 to 20 pitches
440mm Min.
End
110mm or more
Unreeling direction
10-3. Configuration
W
t
2±0.5
A(mm)
178±2.0
N(mm)
Ø60±2
W(mm)
10±1.5
t(mm)
2±0.5
Qty (pcs)
10000/Reel
R1.0
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
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