C0-2N2S-10 [SUPERWORLD]
CERAMIC CHIP INDUCTORS;
| 型号： | C0-2N2S-10 |
| 厂家： | 
SUPERWORLD ELECTRONICS |
| 描述： | CERAMIC CHIP INDUCTORS |
| 文件： | 总7页 (文件大小：373K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CERAMIC CHIP INDUCTORS
C0 SERIES
1. PART NO. EXPRESSION :
C 0 - 1 N 0 S - □□
(c) Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10%
(d) 10: Standard
(a) Series code
(c)
(a)
(b)
(d)
(b) Inductance code : 1N0 = 1.0nH
11 ~ 99 : Internal control number
2. C0NFIGURATION & DIMENSIONS :
A
B
D
L
G
Recommended PC Board Pattern
Unit:m/m
A
B
C
D
G
H
L
0.60± 0.03 0.30± 0.03 0.30± 0.03 0.15± 0.05 0.20~0.30 0.25~0.40
0.80
3. SCHEMATIC :
4. MATERIALS :
a
b
Ag(100%)
(a) Body : ceramic ( Pb Free )
(b) Termination : ( Pb Free )
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 1
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C0 SERIES
6. ELECTRICAL CHARACTERISTICS :
SRF
DC Resistance
Rated Current
(mA) Max
Inductance
(nH)
Test Frequency
( MHz )
Q
Q(Typ.) Frequency(MHz)
( Ω )
( MHz )
Part Number
Min
100 300 500 800 1000
Max.
0.11
Typ.
>13000
Typ.
0.088
0.089
0.11
0.12
0.13
0.14
0.15
0.16
0.18
0.19
0.20
0.20
0.22
0.24
0.26
0.27
0.29
0.30
0.34
0.34
0.40
0.41
0.45
0.50
0.57
0.71
1.11
1.33
1.51
1.74
1.85
2.30
2.60
3.00
Min
10000
470
450
430
390
380
360
350
340
330
320
310
300
280
C0-1N0S-10
C0-1N2S-10
C0-1N5S-10
C0-1N8S-10
C0-2N0S-10
C0-2N2S-10
C0-2N4S-10
C0-2N7S-10
C0-3N0S-10
C0-3N3S-10
C0-3N6S-10
C0-3N9S-10
C0-4N3S-10
C0-4N7S-10
C0-5N1S-10
C0-5N6S-10
C0-6N2S-10
C0-6N8J-10
C0-7N5J-10
C0-8N2J-10
C0-9N1J-10
C0-10NJ-10
C0-12NJ-10
C0-15NJ-10
C0-18NJ-10
C0-22NJ-10
C0-27NJ-10
C0-33NJ-10
C0-39NJ-10
C0-47NJ-10
C0-56NJ-10
C0-68NJ-10
C0-82NJ-10
C0-R10J-10
1.0
1.2
1.5
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
4
4
4
4
4
4
4
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
6
6
7
7
7
7
7
7
7
7
7
7
7
7
7
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
11
11
11
11
17
16
15
15
15
15
15
15
15
15
15
15
15
15
15
15
14
14
14
14
22
21
20
20
20
20
20
20
20
20
20
20
19
19
19
19
18
18
18
18
27
25
23
23
22
22
22
22
22
22
22
22
21
21
21
21
20
20
19
19
18
18
18
17
17
16
15
14
12
11
10
10
8
>13000 10000
>13000 10000
>13000 10000
>13000 10000
0.12
0.13
0.16
0.17
0.19
0.20
0.21
0.22
0.23
0.25
0.27
0.30
0.30
0.33
0.36
0.38
0.39
0.41
0.45
0.48
0.51
0.68
0.71
0.81
1.00
1.35
1.47
1.72
1.90
2.27
2.66
3.37
3.74
12500
11700
11000
11000
9600
8800
8300
7700
7200
6700
6400
6000
5700
5300
9100
8600
8100
7600
280
270
7100
6600
6100
5000
4600
4200
260
250
250
240
230
220
220
190
180
170
150
120
110
100
100
80
5600
5300
4900
4600
4200
3800
3300
3000
2600
2600
2400
2100
1800
1600
1500
1400
1200
3900
3600
3400
3200
2900
2700
2300
2100
1800
1800
1700
1500
1300
1100
1100
1000
900
5
5
5
5
5
5
4
4
4
4
4
4
4
4
7
7
7
7
7
7
6
6
6
6
6
6
6
6
11
11
11
11
11
11
10
10
10
10
10
10
10
9
14
14
14
13
13
13
12
12
12
11
11
11
11
10
17
17
17
16
16
15
14
14
13
12
11
11
10
9
12
15
18
22
27
33
39
47
56
80
68
70
82
60
6
100
Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10%
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 2
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C0 SERIES
7. CHARACTERISTICS CURVES :
Impedance v.s. Frequency Characteristics
10000
1000
10 0
100n
47n
22n
10
10n
1
6.8n
2.2n
0.1
1
10
100
1000
10000
FREQUENCY(MHz)
Inductance v.s. Frequency Characteristics
1000
100n
47n
100
10
1
22n
10n
6.8n
2.2n
1
10
100
1000
10000
FREQUENCY(MHz)
Q v.s. Frequency Characteristics
100
10
1
2.2n
6.8n
10n
22n
47n
100n
1
10
100
1000
10000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
CERAMIC CHIP INDUCTORS
C0 SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
Unit:m/m
H
L
G
L
G
0.80
0.20~0.30
0.25~0.40
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)
8-2.2 Soldering Iron :
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a
soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150° C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4-5 secs.
b) 350° C tip temperature for Ferrite chip bead (max)
c) Never contact the ceramic with the iron tip
Preheating
Soldering
20~40s
Natural
cooling
Preheating
Soldering
Natural
cooling
350
150
TP(260° C/40s max.)
217
200
150
60~150s
60~180s
480s max.
25
Gradual
Cooling
Time(sec.)
Over 60s.
Figure 1. Re-flow Soldering:3 times max
Within4~5s
Figure 2. Wave Soldering:1 times max
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 4
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C0 SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
ReC0mmendable
Figure 3
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 5
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C0 SERIES
9. PACKAGING INFORMATION :
9-1. Reel Dimension
A
2± 0.5
R1.9
120°
13.5± 0.5
R10.5
R0.5
7" x 8mm
Type
A(mm)
B(mm)
60± 2
C(mm)
D(mm)
7" x 8mm
9.0± 0.5
13.5± 0.5 178.0± 2.0
9-2 Tape Dimension / 8mm
Material : Paper
D:1.5+0.1-0.0
Po:4± 0.1
t
Size
C0
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
0.70± 0.06 0.40± 0.06 0.45 max
2.0± 0.05
0.45 max
Ao
Ko
P
9-3. Packaging Quantity
C0
Chip Size
Chip / Reel
Inner Box
Middle Box
Carton
15000
75000
375000
750000
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 6
SUPERWORLD ELECTRONICS (S) PTE LTD
CERAMIC CHIP INDUCTORS
C0 SERIES
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° C to 180° C
Room Temp.
(° C)
Room Humidity
(%)
Room atm Tearing Speed
Top cover tape
(hPa)
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our websitefor latestinformation.
26.01.2015
PG. 7
SUPERWORLD ELECTRONICS (S) PTE LTD
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